TW201327630A - A film peeling apparatus, a method thereof, and a wafer laminating equipment - Google Patents

Abstract

The present invention relates to a wafer laminating equipment which comprises a platform, a film peeling apparatus mounted on the platform, a supporting unit and a laminating mechanism provided on the platform. The film peeling apparatus is configured to peel a covering film from a coating layer. The supporting unit supports the covering film and the coating layer which is attached to the covering film. The laminating mechanism includes an upper chamber having an electrical heating laminating surface. The film peeling apparatus comprises a cutting unit and a covering film peeling mechanism. The cutting unit includes a cutting tool, which is driven to move along a surface of the coating layer and to cut an incision in the covering film. The covering film peeling mechanism includes a sticking component, which is driven to stick the covering film and to move so as to peel the covering film from the coating layer. The effect of the present invention is: to form an incision in the covering film, before peeling the covering film, so as to prevent the negative pressure from occurring when peeling the covering film and so as to facilitate the peeling process.

Description

Tear film device, tear film method and wafer lamination device

The invention relates to a wafer laminating device, in particular to a wafer laminating device capable of smoothly tearing off a protective film.

Generally, in the wafer process, the photoresist coating can be performed by a wet photoresist coating process and a dry photoresist film process. In the dry photoresist film process, since the dry film needs to be attached to a protective film (Mylar), in the lamination process, the protective film and the dry film attached to each other are bonded to the wafer by thermocompression. On the top, the protective film is peeled off to achieve the effect of photoresist coating.

The method of tearing off the protective film is generally carried out by tape adhesion and then removed for automation. However, due to various factors such as the material of the dry film, the dry film may be sealed after being subjected to hot pressing, so that the periphery of the protective film is closed, and a negative pressure is generated when the film is removed, and cannot be peeled off by the tape.

Therefore, a wafer lamination apparatus capable of smoothly peeling off a protective film has become a subject of further improvement of the present invention.

Accordingly, it is an object of the present invention to provide a wafer lamination apparatus capable of smoothly tearing off a protective film.

Another object of the present invention is to provide a tear film device for a wafer lamination apparatus capable of smoothly peeling off a protective film.

Therefore, the wafer laminating apparatus of the present invention comprises a machine table, a film pressing mechanism, a supporting unit and a tear film device.

The laminating mechanism is disposed on the machine and includes an upper cavity having an electrothermal pressing surface.

The support unit is disposed on the machine and supports a covering layer and a film attached to each other.

The tear film device is disposed on the machine, and the film is peeled off from the coating layer, and comprises a cutting unit and a film removing mechanism.

The cutting unit includes a cutter that is driven to move along the plane of the cladding layer to cut all seams in the coating.

The film removal mechanism includes an adhesive attachment. The adhesive attachment is driven to adhere to the coating and is displaced to tear the coating away from the coating.

The object of the present invention and solving the prior art problems can be further achieved by the following technical means.

Preferably, the cutting unit of the tear film device further comprises a stopper for assisting the cutter to cut the coating to a predetermined depth, the stopper being interlocked with the cutter, whereby the cutter is driven to cut the coating The stopper abuts against the coating to cut the cutter to a predetermined depth.

Preferably, the stopping member is a roller.

Preferably, the cutter of the wafer laminating apparatus has a predetermined depth of cutting of the cutter: the cutter passes through the coating and reaches the coating layer, but does not penetrate the coating layer.

Still another object of the present invention is to provide a tear film removing method capable of smoothly peeling off a protective film. Thus, the present invention provides a method of tearing a film from a coating layer, comprising: cutting the film with a cutter and displacing a distance relative to the coating layer to form a seam and destroy the film. The negative pressure generated when the film is peeled off; and the adhesive film is adhered by an adhesive attachment and the film is peeled off the coating layer.

Preferably, the tear film method is suitable for a wafer process, the cutter cutting a predetermined depth: the cutter passes through the film and reaches the cover layer, but does not penetrate the cover layer.

Still another object of the present invention is to provide a tear film removing method capable of smoothly peeling off a protective film. Thus, the present invention provides a method of tearing a film from a coating layer, comprising: cutting the film with a cutter and displacing a distance relative to the coating layer to form a seam and destroy the film. The negative pressure generated when the film is peeled off; and the adhesive film is adhered by an adhesive attachment and the film is peeled off the coating layer.

Preferably, the tear film method is suitable for a wafer process, the cutter cutting a predetermined depth: the cutter passes through the film and reaches the cover layer, but does not penetrate the cover layer.

The effect of the invention is that the film is cut by a cutter and displaced by a distance from the coating layer, so that the film forms all the seams, the negative pressure generated when the film is broken, and the action of tearing off the film is performed. The process of tearing film can be operated smoothly.

The foregoing and other objects, features, and advantages of the invention will be apparent from

Referring to FIG. 1, FIG. 2 and FIG. 3, a preferred embodiment of the wafer lamination apparatus of the present invention is applied to a wafer process for laminating and laminating a film 5 from a cladding layer 61 after lamination and lamination. In addition, the film 5 is, for example, a protective film (Mylar), which is, for example, a dry film used in a dry photoresist film process.

Hereinafter, "the film 5 and the coating layer 61 have been applied to the die 62 and the carrier 63 by heat pressing in the film forming process before the tear film process" are exemplified. The pre-coated adhesive 7 of the coating layer 61 adjacent to one side of the die 62 causes the periphery of the film 5 to be closed during the hot pressing process, and the peeling of the film 5 at this time generates a negative pressure and is not easy to succeed. It should be noted that, since the wafer laminating apparatus of the present invention is suitable for various processes, in particular, a three-dimensional integrated circuit (3D IC) lamination process is included, and the three-dimensional integrated circuit is to superimpose a plurality of integrated circuits. Made. Therefore, the present invention can be applied to whether the coating layer 61 directly presses the adhesive wafer, or the die layer 61 and the carrier 63 sandwich the die 62, and the carrier 63 can be of various materials, for example, Stainless steel, glass or wafer. In addition to being used as photoresist etching, the cladding layer 61 can also be used to adhere another layered circuit, the die 62 or the wafer, or it can be simply cured to have a closed function.

The wafer laminating apparatus of the present embodiment comprises a machine table 1, a tear film device 10 disposed on the machine table 1, a support unit 2 and a lamination mechanism 7, and the support unit 2 supports the coating layer 61. And the film 5.

The present invention is not limited to the specific lamination technique. Hereinafter, only the portion related to the technical features of the present invention will be described with respect to the lamination mechanism 7, and mainly, the coating film 5 and the coating layer 61 are applied to the support by hot pressing. The die 62 supported by the unit 2 and the carrier 63, the lamination mechanism 7 includes an upper cavity 71 having an electrothermal pressing surface 711, so that the coating 5 and the coating 61 are thermally pressed and attached to the die 62. surface.

The tear film device 10 tears a film 5 from a coating layer 61 and includes a cutting unit 3 and a film removing mechanism 4.

The cutting unit 3 includes a cutter 31 and a stopper 32. In the embodiment, the stopper 32 is a roller.

The film removing mechanism 4 includes an adhesive attachment 41 and a plurality of rotating shafts 42. The adhesive attachment 41 is attached to the rotating shaft 42 and controlled by the rotation and movement of the rotating shaft 42 to be close to and away from the supporting unit 2 for adhering to the coating 5 located on the supporting unit 2.

A method of tearing the film by the above-described wafer laminating apparatus will be described below.

As shown in FIG. 1, before the start of the tear film process, the height of the lower edge of the cutter 31 is adjusted to be comparable to the lower edge of the stopper 32. When the cutter 31 is driven to cut the film 5, as shown in FIG. 3 and FIG. 4, the stopper 32 abuts against the film 5 and the contact portions thereof are slightly compressed, so that the cutter 31 is cut into one. The predetermined depth to be controlled - the cutter 31 passes through the film 5 and reaches the cladding layer 61, but does not reach the die 62.

Referring to FIGS. 5 and 6, when the cutting unit 3 of the wafer laminating apparatus starts to operate, the cutter 31 is driven to move a distance along the plane of the cladding layer 61, and the slit 51 is cut in the coating 5. Thereby, the negative pressure generated when the tear film is broken is broken.

Referring to FIG. 7, the supporting unit 2 transports the cut film 5, and the covering layer 61, the die 62 and the carrier 63 to the film removing mechanism 4, wherein a rotating shaft 42 is driven to be displaced downward, so that The adhesive attachment 41 adheres to the coating 5.

Referring to FIG. 8, the rotating shaft 42 is moved upward, and the adhesive attachment 41 is displaced relative to the supporting unit 2 to tear the coating film 5 away from the coating layer 61.

Referring to FIG. 9, the adhesive attachment 41 completely removes the coating 5 from the cladding layer 61.

Referring to FIG. 10, the support unit 2 transports the cladding layer 61 away from the film removal mechanism 4 for subsequent processing.

In summary, the film 5 is cut by a cutter 31 and displaced by a distance relative to the coating layer 61, so that the film 5 forms a slit 51, which destroys the negative pressure generated when the film is peeled off, and then tears off. The action of the film 5 enables the process of the tear film to operate smoothly, so that the object of the present invention can be achieved.

The above is only the preferred embodiment of the present invention, and the scope of the invention is not limited thereto, that is, the simple equivalent changes and modifications made by the scope of the invention and the description of the invention are All remain within the scope of the invention patent.

1. . . Machine

10. . . Tear film device

2. . . Support unit

3. . . Cutting unit

31. . . Tool

32. . . Stopper

4. . . Film removal mechanism

41. . . Adhesive attachment

42. . . Rotating shaft

5. . . Laminating

51. . . Slit

61. . . Cladding layer

62. . . Grain

63. . . Carrier

7. . . Laminating mechanism

71. . . Upper cavity

711. . . Electric heating surface

1 is a front elevational view showing a preferred embodiment of the wafer lamination apparatus of the present invention;

Figure 2 is a perspective view showing a part of the components of the preferred embodiment;

Figure 3 is a cross-sectional view showing the state in which a cutting unit cuts a film in the preferred embodiment;

Figure 4 is a side view showing the cutting unit cutting the film in the preferred embodiment;

Figure 5 is a partial enlarged view of Figure 4;

Figure 6 is a perspective view corresponding to Figure 5; and

7 to 10 are respectively side views showing the state of each stage of the film removing mechanism of the preferred embodiment.

1. . . Machine

10. . . Tear film device

2. . . Support unit

3. . . Cutting unit

31. . . Tool

32. . . Stopper

4. . . Film removal mechanism

41. . . Adhesive attachment

42. . . Rotating shaft

5. . . Laminating

61. . . Cladding layer

62. . . Grain

63. . . Carrier

7. . . Laminating mechanism

71. . . Upper cavity

711. . . Electric heating surface

Claims (10)

A tear film device is disposed on a machine table to tear a film from a coating layer, the coating layer and the film are supported by a supporting unit, the tear film device comprising: a cutting unit, including a a cutter that is driven to move along a plane of the cladding layer to cut all seams in the coating; and a film removal mechanism including an adhesive attachment that is driven to adhere to the coating and displaced The film is peeled off the coating. The tear film device of claim 1, wherein the cutting unit further comprises a stopper for assisting the cutter to cut the coating to a predetermined depth, the stopper being interlocked with the cutter, whereby the cutter is When the film is driven to be cut, the stopper abuts against the film to cut the cutter to a predetermined depth. The tear film device of claim 2, wherein the stopper is a roller. The tear film device according to claim 1 is applicable to a wafer process, wherein the cutter is cut to a predetermined depth: the cutter passes through the film and reaches the cover layer, but does not penetrate the cover layer. Floor. A tear film method for tearing a film from a coating layer, comprising: cutting the film with a cutter and displacing a distance from the coating layer to form a seam in the film; and using an adhesive attachment The film is adhered and the film is peeled off the coating layer. The tear film method according to claim 5, which is applicable to a wafer process, wherein the cutter is cut to a predetermined depth: the cutter passes through the film and reaches the cover layer, but does not penetrate the cover layer. Floor. A wafer laminating apparatus comprising: a machine table; a film pressing mechanism disposed on the machine base, comprising an upper cavity body having an electric heating pressing surface; a support unit disposed on the machine table, supported a coating layer and a film attached to each other; and a tear film device disposed on the machine, the film is torn from the coating layer, and comprises a cutting unit, including a cutter, the tool is Driving along the plane of the coating layer, cutting all the seams in the coating, and a film removing mechanism, including an adhesive attachment, the adhesive attachment is driven to adhere to the coating and is displaced to tear the coating away The cover layer. The wafer laminating apparatus according to claim 7, wherein the cutting unit of the tear film device further comprises a stopper for assisting the cutter to cut the coating to a predetermined depth, the stopper being interlocked with the cutter Thereby, when the cutter is driven to cut the film, the stopper abuts against the film to cut the cutter to a predetermined depth. The wafer laminating apparatus according to Item 8 of the patent application, wherein the stopper is a roller. The wafer laminating apparatus according to claim 7, wherein the cutting unit of the tearing film device cuts a predetermined depth of the cutter: the cutter passes through the coating and reaches the coating layer, but does not penetrate the Covered layer.