JP2016174082A - Sheet peeling device and peeling method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a sheet peeling device which prevents cutting scraps of a cut peeling tape from adhering to an adherend.SOLUTION: A sheet peeling device includes: feeding means which feeds a peeling tape; bonding means which presses the peeling tape to an adhesive sheet to bond the peeling tape; tape cutting means 40 which cuts the peeling tape into a predetermined length; and moving means which moves the peeling tape and an adherend relative to each other to peel the adhesive sheet. The tape cutting means 40 includes: a cutting blade 43; a tape receiving member 44 having a recessed part 44A which guides the cutting blade 43; and cleaning means 45 which cleans the tape receiving member 44.SELECTED DRAWING: Figure 2

Description

  The present invention relates to a sheet peeling apparatus and a peeling method.

  Conventionally, a peeling tape is pulled out and attached to an adhesive sheet attached to a semiconductor wafer (hereinafter, simply referred to as “wafer”) (adhered body), and the adhesive tape is cut with a cutting blade, An apparatus is known that peels an adhesive sheet from an adherend by relatively moving the adherend and the sticking tape (see, for example, Patent Document 1).

JP 2014-150232 A

  However, in the conventional apparatus as described in Patent Document 1, the cutting waste collected on the receiving plate that receives the cutting blade falls on the adherend from which the adhesive sheet has been peeled, and is formed from the adherend. Inconvenience that the quality of a product such as a semiconductor device is degraded.

  The objective of this invention is providing the sheet | seat peeling apparatus and peeling method which can prevent that the cutting | disconnection waste of the cut | disconnecting peeling tape adheres to a to-be-adhered body.

  In order to achieve the object, the sheet peeling apparatus of the present invention applies a peeling tape to an adhesive sheet affixed to an adherend, and peels the adhesive sheet from the adherend through the peeling tape. A sheet peeling device for feeding out the peeling tape, a sticking means for pressing and peeling the peeling tape against the adhesive sheet, and a tape cutting means for cutting the peeling tape into a predetermined length And a moving means for peeling the adhesive sheet by relatively moving the peeling tape and the adherend, the tape cutting means having a cutting blade and a tape receiver having a recess for guiding the cutting blade The structure which is provided with the member and the cleaning means which cleans the said tape receiving member is employ | adopted.

In this case, in the sheet peeling apparatus of the present invention, it is preferable that the cleaning unit includes a nozzle and a suction force application unit that applies a suction force to the nozzle.
Moreover, in the sheet peeling apparatus of this invention, it is preferable that the said cleaning means is equipped with the gas supply means which supplies gas to the said recessed part of the said tape receiving member.

  On the other hand, the sheet peeling method of the present invention is a sheet peeling method in which a peeling tape is affixed to an adhesive sheet affixed to an adherend, and the adhesive sheet is peeled from the adherend via the peeling tape. A step of feeding out the peeling tape, a step of pressing the peeling tape against the adhesive sheet and affixing the tape, and a cutting blade guided by the recess of the tape receiving member to make the peeling tape a predetermined length. A configuration is adopted that includes a step of cutting, a step of relatively moving the peeling tape and the adherend to peel the adhesive sheet, and a step of cleaning the tape receiving member.

  According to the present invention as described above, since the tape receiving member used for cutting the peeling tape is cleaned by the cleaning means, it is possible to prevent the cut pieces of the cut peeling tape from adhering to the adherend. it can.

At this time, if the cleaning unit includes a suction force applying unit that applies a suction force to the nozzle, the tape receiving member can be easily cleaned by the nozzle.
Further, if the cleaning means includes a gas supply means for supplying gas to the recess of the tape receiving member, the cutting waste can be efficiently removed from the recess.

1 is a schematic side view of a sheet peeling apparatus according to an embodiment of the present invention. The side view of the tape cutting means of the said sheet peeling apparatus.

Hereinafter, an embodiment of the present invention will be described with reference to the drawings.
In this embodiment, the X axis, the Y axis, and the Z axis are orthogonal to each other, the X axis and the Y axis are axes in a predetermined plane, and the Z axis is an axis that is orthogonal to the predetermined plane. To do. Further, in this embodiment, when viewed from the front side in FIG. 1 parallel to the Y axis, the direction is indicated by “up” being the arrow direction of the Z axis and “down” being the opposite direction, “ The “left” is the X-axis arrow direction, “right” is the opposite direction, “front” is the Y-axis arrow direction, which is the front direction in FIG. 1, and “rear” is the opposite direction.

  In FIG. 1, a sheet peeling apparatus 10 applies a peeling tape PT to an adhesive sheet AS attached to a wafer WF as an adherend, and peels the adhesive sheet AS from the wafer WF via the peeling tape PT. A sheet peeling device, a feeding means 20 for feeding the peeling tape PT, a sticking means 30 for pressing and peeling the peeling tape PT against the adhesive sheet AS, and a tape cutting for cutting the peeling tape PT into a predetermined length. Means 40 and moving means 50 for peeling the adhesive sheet AS by relatively moving the peeling tape PT and the wafer WF are provided. The peeling tape PT has a heat-sensitive adhesive layer laminated on one surface of the substrate.

  The feeding means 20 includes a support roller 21 that supports the peeling tape PT and a pinch roller 23 that sandwiches the peeling tape PT between a driving roller 22 that is driven by a rotation motor 22A as a driving device.

  The affixing means 30 includes a slide plate 32 supported by a slider 31A of a linear motor 31 serving as a driving device, a pressing roller 34 supported by an output shaft 33A of a linear motion motor 33 serving as a driving device, and a linear motor serving as a driving device. And a pressing head 37 having a heater 36 supported by an output shaft 35A of the dynamic motor 35.

As shown in FIG. 2, the tape cutting means 40 includes a linear motor 41 as a driving device extending in the front-rear direction, a linear motion motor 42 as a driving device supported by a slider 41A of the linear motor 41, A cutting blade 43 supported by the output shaft 42A of the linear motor 42; a tape receiving member 44 having a concave portion 44A that is formed in a substantially U shape in a side view of the upper opening type and guides the cutting blade 43 in the front-rear direction; And a cleaning means 45 for cleaning the tape receiving member 44.
The cleaning unit 45 includes a nozzle 46 supported by the slider 41B of the linear motor 41 via a bracket 41C, and a suction force applying unit 47 such as a vacuum pump or a vacuum ejector that applies a suction force to the nozzle 46 via a pipe 47A. And a gas supply means 48 such as a pressurizing pump and a turbine for supplying gas to the recess 44A via the pipe 48A. The nozzle 46 is formed in a hollow shape of a closed rear opening front portion provided with a hollow accommodating space 46A capable of accommodating the tape receiving member 44 so as to block the entire recess 44A.

  The moving means 50 is supported by a chuck cylinder 51 as a driving device provided with a pair of gripping claws 51A and a slider 52A of a linear motor 52 as a driving device, and a wafer WF by a decompression means (not shown) such as a decompression pump or a vacuum ejector. And a table 53 having a support surface 53A capable of adsorbing and holding.

The operation of the above sheet peeling apparatus 10 will be described.
First, after the operator sets the peeling tape PT as indicated by a solid line in FIG. 1, each member stands by at an initial position. With respect to the sheet peeling apparatus 10 indicated by the solid line in FIGS. A signal for starting automatic operation is input through an input means such as a personal computer. Then, the wafer WF is transferred to a predetermined position on the table 53 with the adhesive sheet AS facing upward by a transfer means (not shown) such as a manual or multi-joint robot or a belt conveyor. Then, the moving means 50 drives a decompression means (not shown), and starts sucking and holding on the support surface 53A. Next, the feeding means 20 and the sticking means 30 drive the rotation motor 22A and the linear motor 31, rotate the drive roller 22, and simultaneously move the slide plate 32 to the left, thereby removing the left end portion of the peeling tape PT. It extends between the pair of gripping claws 51A. Next, the sticking means 30 drives the linear motion motor 33 and the linear motor 31, retracts the presser roller 34 upward, moves the slide plate 32 to the right, and then the moving means 50 drives the chuck cylinder 51. As shown by the two-dot chain line in FIG. 1, the peeling tape PT is gripped by the gripping claws 51A.

  Thereafter, the sticking means 30 drives the linear motion motor 35, lowers the pressing head 37 and presses the peeling tape PT against the end portion of the adhesive sheet AS, as shown by a two-dot chain line in FIG. Is driven, and the lower end of the pressing head 37 is heated to attach the peeling tape PT to the adhesive sheet AS. Next, after the sticking means 30 drives the linear motion motor 33 and lowers the pressing roller 34 to press the peeling tape PT against the slide plate 32, the tape cutting means 40 drives the linear motion motor 42 and the cutting blade 43 Is lowered to form a cut in the peeling tape PT, the linear motor 41 is driven, and the cutting blade 43 is moved in the forward direction to cut the peeling tape PT. And the sticking means 30 and the tape cutting means 40 drive the linear motion motor 35, the linear motor 41, and the linear motion motor 42, and return the pressing head 37 and the cutting blade 43 to the initial positions.

  Thereafter, the moving means 50 drives the linear motor 52 to move the table 53 in the left direction, thereby peeling the adhesive sheet AS from the wafer WF. When all of the adhesive sheet AS is peeled off, the moving unit 50 stops driving the decompression unit (not shown), and the hand or the transfer unit (not shown) transfers the wafer WF to the next process. Next, the moving means 50 drives the chuck cylinder 51, opens the pair of gripping claws 51A, and discards the adhesive sheet AS to which the peeling tape PT is attached in a collection box (not shown).

  Next, after the feeding means 20 drives the rotation motor 22A and pulls the peeling tape PT back to the position indicated by the solid line in FIG. 1, the tape cutting means 40 drives the linear motor 41 and moves the nozzle 46 backward. As shown by a two-dot chain line in FIG. 2, the entire recess 44A is accommodated in the accommodation space 46A. Thereafter, the cleaning unit 45 drives the suction force applying unit 47 to suck the cutting waste in the recess 44 </ b> A and the cutting waste adhering to the outer peripheral surface of the tape receiving member 44 with the nozzle 46. At this time, the cleaning unit 45 drives the gas supply unit 48 to supply the gas into the recess 44 </ b> A toward the suction force applying unit 47. Thereby, the cutting waste can be detached from the recess 44A, and the cutting waste can be efficiently removed from the recess 44A. Next, after the cleaning unit 45 stops driving the suction force applying unit 47 and the gas supply unit 48, the tape cutting unit 40 drives the linear motor 41 to return the nozzle 46 to the initial position. Then, the moving means 50 drives the linear motor 52 to return the table 53 to the initial position, and thereafter the same operation as described above is repeated.

  According to the embodiment as described above, since the tape receiving member 44 used for cutting the peeling tape PT is cleaned by the cleaning means 45, the cut pieces of the cut peeling tape PT are prevented from adhering to the wafer WF. can do.

  As described above, the best configuration, method and the like for carrying out the present invention have been disclosed in the above description, but the present invention is not limited to this. That is, the invention has been illustrated and described with particular reference to certain specific embodiments, but without departing from the spirit and scope of the invention, Various modifications can be made by those skilled in the art in terms of material, quantity, and other detailed configurations. In addition, the description of the shape, material, and the like disclosed above is exemplary for ease of understanding of the present invention, and does not limit the present invention. The description by the name of the member which remove | excluded the limitation of some or all of such restrictions is included in this invention.

  The affixing means 30 can employ a pressing member made of blade material, rubber, resin, sponge, air blowing, or the like, instead of at least one of the pressing roller 34 and the pressing head 37, and the peeling tape PT is pressure-sensitive bonded. In the case of sex, the heater 36 may or may not be present.

The tape cutting means 40 may employ a cutting blade 43 whose length in the front-rear direction is greater than or equal to the width of the peeling tape PT. In this case, a linear motor 41 that supports the cutting blade 43 is supported by the linear motor 41. It does not have to be. The tape cutting means 40 may employ a laser cutter, a heat cutter, an air cutter, or a compressed water cutter.
The linear motor 42 and the nozzle 46 may be supported by separate drive devices.
The nozzle 46 may have a shape smaller than the recess 44A that can be inserted into a part or all of the recess 44A. In this case, the insertion direction of the nozzle 46 may be any direction other than the upward direction.
The nozzle 46 may block only a part of the front side of the recess 44A.
The nozzle 46 may suck cutting chips in the recess 44A from a position away from the tape receiving member 44 without closing the recess 44A or being inserted into the recess 44A. In this case, the suction direction is other than the downward direction. Either direction is acceptable.
The nozzle 46 may have a shape in which no gap is provided between the nozzle receiving member 44 and the nozzle 46.
The cleaning means 45 may employ a removing means such as a brush or a blade material or an adhesive means such as an adhesive roller or an adhesive sheet instead of the nozzle 46 and the suction force applying means 47. In this case, the gas supply means 48 is used. Yes or no.
The opening of the nozzle 46 only needs to be a position where the cutting waste can be sucked, and a part or all of the surface facing the recess 44A may be opened. May be.
When closing the recess 44 </ b> A with the nozzle 46, the nozzle 46 may be stopped and the tape receiving member 44 may be moved, or both the tape receiving member 44 and the nozzle 46 may be moved.
The cleaning of the tape receiving member 44 by the cleaning means 45 may be performed each time one or a plurality of adhesive sheets AS are peeled off, or a predetermined amount of cutting waste by a detection means (not shown) such as an optical sensor or a camera. It may be performed when is detected. Moreover, the table 53 may be performed in a state where it is not positioned below the tape cutting means 40.

The moving means 50 may employ pressure reducing means such as a pressure reducing pump or a vacuum ejector, or holding means for holding the peeling tape PT with an adhesive or the like, instead of the chuck cylinder 51.
When peeling the adhesive sheet AS from the wafer WF with the peeling tape PT, the table 53 may be stopped and the chuck cylinder 51 may be moved, or both the chuck cylinder 51 and the table 53 may be moved.

  In addition, the material, type, shape, and the like of the adhesive sheet AS, the peeling tape PT, and the adherend in the present invention are not particularly limited. For example, the adhesive sheet AS and the peeling tape PT may be circular, elliptical, polygonal, such as a triangle or a quadrangle, or other shapes, or may be adhesive forms such as pressure-sensitive adhesiveness and heat-sensitive adhesiveness. There may be. In addition, such an adhesive sheet AS and a peeling tape PT are, for example, a single layer having only an adhesive layer, an intermediate layer between the base material and the adhesive layer, and a cover layer on the upper surface of the base material. 3 layers or more, such as a so-called double-sided adhesive sheet that can peel the substrate from the adhesive layer, and the double-sided adhesive sheet is a single layer or a multilayer It may have a layer, or may be a single layer or a multilayer having no intermediate layer. Examples of the adherend include, for example, foods, resin containers, semiconductor wafers such as silicon semiconductor wafers and compound semiconductor wafers, circuit board, information recording substrates such as optical disks, glass plates, steel plates, ceramics, wood plates or resin plates, Arbitrary forms of members and articles can also be targeted. In addition, the adhesive sheet AS is replaced with a functional and intended reading, for example, any information label, decorative label, protective sheet, dicing tape, die attach film, die bonding tape, recording layer forming resin sheet, etc. Arbitrary sheets, films, tapes and the like can be attached to any adherend as described above.

The means and steps in the present invention are not limited in any way as long as they can perform the operations, functions, or steps described with respect to those means and steps. The process is not limited at all. For example, as long as the stripping tape can be fed, the feeding means is not limited in any way as long as it is within the technical scope in light of the technical common sense at the time of filing (about other means and processes). Will be omitted).
The drive device in the embodiment includes an electric device such as a rotation motor, a linear motion motor, a linear motor, a single axis robot, an articulated robot, an actuator such as an air cylinder, a hydraulic cylinder, a rodless cylinder, and a rotary cylinder. In addition to these, a combination of them directly or indirectly may be employed (some of them overlap with those exemplified in the embodiment).

DESCRIPTION OF SYMBOLS 10 ... Sheet peeling apparatus 20 ... Feeding means 30 ... Pasting means 40 ... Tape cutting means 43 ... Cutting blade 44 ... Tape receiving member 44A ... Recess 45 ... Cleaning means 46 ... Nozzle 47 ... Suction force provision means 48 ... Gas supply means 50 ... Moving means AS ... Adhesive sheet PT ... Stripping tape WF ... Wafer

Claims (4)

A sheet peeling apparatus that affixes a peeling tape to an adhesive sheet affixed to an adherend, and peels the adhesive sheet from the adherend via the peeling tape,
A feeding means for feeding out the peeling tape;
Affixing means for pressing and adhering the peeling tape to the adhesive sheet;
A tape cutting means for cutting the peeling tape into a predetermined length;
A moving means for peeling the adhesive sheet by relatively moving the peeling tape and the adherend,
The said tape cutting means is provided with the cutting blade, the tape receiving member which has a recessed part which guides the said cutting blade, and the cleaning means which cleans the said tape receiving member, The sheet peeling apparatus characterized by the above-mentioned.   The sheet peeling apparatus according to claim 1, wherein the cleaning unit includes a nozzle and a suction force applying unit that applies a suction force to the nozzle.   The sheet peeling apparatus according to claim 1, wherein the cleaning unit includes a gas supply unit that supplies a gas to the concave portion of the tape receiving member. A sheet peeling method for attaching a peeling tape to an adhesive sheet attached to an adherend, and peeling the adhesive sheet from the adherend via the peeling tape,
A step of feeding out the peeling tape;
A step of pressing and adhering the peeling tape to the adhesive sheet;
Cutting the peeling tape into a predetermined length by guiding the cutting blade through the recess of the tape receiving member; and
A step of separating the adhesive sheet by relatively moving the peeling tape and the adherend,
And a step of cleaning the tape receiving member.

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