JP2015056613A - Sheet sticking device and sticking method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a sheet sticking device and a sheet sticking method capable of preventing poor recovery of an unnecessary sheet.SOLUTION: A sheet sticking device 1 includes supply means 3 for supplying an adhesive sheet AS to a position facing the stuck surface WF1 of a stuck body WF, press means 4 for sticking the adhesive sheet AS to the stuck surface WF1 by pressing, and cutting means 5 for cutting out the adhesive sheet AS into a predetermined shape. The supply means 3 includes recovery means 38 for recovering an unnecessary sheet US, produced by forming a cut-out hole in the adhesive sheet AS, and guide means 39 for guiding the unnecessary sheet US to the recovery means 38 while maintaining the surface state thereof.

Description

  The present invention relates to a sheet sticking apparatus and a sticking method.

2. Description of the Related Art Conventionally, a sheet sticking apparatus for sticking an adhesive sheet to a semiconductor wafer (hereinafter sometimes simply referred to as “wafer”) in a semiconductor manufacturing process is known (see, for example, Patent Document 1).
The sheet sticking apparatus described in Patent Document 1 includes a tape supply unit that supplies an adhesive tape (adhesive sheet) to face the wafer, an adhesive unit that attaches the adhesive tape to the wafer, and an adhesive tape along the outer shape of the wafer. A tape cutting mechanism that cuts out, and is configured to wind up an adhesive tape (unnecessary sheet) with a cut-out hole, supply an unused portion of the adhesive tape to the wafer, and attach the adhesive tape to the wafer Yes.

JP 2007-227552 A

  However, in the conventional sheet sticking apparatus as described in Patent Document 1, the portion between the cut-out holes of the unnecessary sheet hangs down or bends, so that the unnecessary sheet is folded or folded into a wrinkle. As a result, an unnecessary sheet collection failure occurs. Such unsatisfactory sheet collection failure results in the winding diameter of the unnecessary sheet being different on both sides orthogonal to the winding direction of the unnecessary sheet. Further, the unnecessary sheet having a smaller winding diameter is loosened and the operation of the apparatus is hindered. Such an inconvenience becomes conspicuous when the cut-out holes are connected, that is, when the unnecessary sheets are wound independently on both sides orthogonal to the winding direction of the unnecessary sheets.

  The objective of this invention is providing the sheet sticking apparatus and sticking method which can prevent the collection | recovery failure of an unnecessary sheet | seat.

  The sheet sticking apparatus of the present invention includes a supply means for supplying an adhesive sheet to a position facing an adherend surface of an adherend, a pressing means for pressing and sticking the adhesive sheet to the adherend surface, and the adhesive sheet. Cutting means for cutting out into a predetermined shape, and the supply means collects the unnecessary sheet in which a cut-out hole is formed in the adhesive sheet, and collects the unnecessary sheet while maintaining the surface state of the unnecessary sheet. And a guiding means for guiding to the means.

  The sheet sticking method of the present invention includes a step of supplying an adhesive sheet to a position facing the adherend surface of an adherend, a step of pressing and sticking the adhesive sheet to the adherend surface, and the adhesive sheet having a predetermined shape. And a step of collecting the unnecessary sheet while maintaining the surface state of the unnecessary sheet in which the cutout hole is formed in the adhesive sheet.

According to the present invention as described above, the surface state of the unnecessary sheet is maintained and the unnecessary sheet is guided to the collecting means, so that the portion between the cut-out holes of the unnecessary sheet is prevented from hanging or bending. It is possible to prevent the collection failure of unnecessary sheets.
Note that “maintaining the surface state of the unnecessary sheet” means maintaining a state in which a part of the unnecessary sheet does not hang down or bend from the predetermined surface as described above. The surface is not limited to a flat surface, and may be a surface that is a combination of concave, convex, and concavo-convex surfaces. In short, the unnecessary sheet is not collected by the collecting means because it is folded or wrinkled. It is to keep the surface state in a predetermined state.

The side view of the sheet sticking apparatus which concerns on one Embodiment of this invention. Operation | movement explanatory drawing of the sheet sticking apparatus of FIG. The partial top view of the sheet sticking apparatus of FIG. The partial top view of the sheet sticking apparatus which concerns on a modification.

Hereinafter, an embodiment of the present invention will be described with reference to the drawings.
In this specification, the X axis, the Y axis, and the Z axis are orthogonal to each other, the X axis and the Y axis are axes in a predetermined plane, and the Z axis is an axis orthogonal to the predetermined plane. To do. Furthermore, in the present embodiment, when viewed from the near side of FIG. 1 parallel to the Y axis, when indicating the direction, “up” is the arrow direction of the Z axis, “down” is the opposite direction, “ “Left” is the arrow direction of the X axis, “Right” is the opposite direction, “Front” is the arrow direction of the Y axis, and “Back” is the opposite direction.

  In FIG. 1, a sheet sticking apparatus 1 includes a support means 2 for supporting a wafer WF as an adherend, a supply means 3 for supplying an adhesive sheet AS to a position facing the adherend surface WF1 of the wafer WF, and an adherend surface. A pressing unit 4 that presses and adheres the adhesive sheet AS to the WF 1 and a cutting unit 5 that cuts the adhesive sheet AS into a predetermined shape are provided, and are arranged in the vicinity of the transfer unit 6 that transfers the wafer WF.

  The support means 2 includes an outer table 21 having a recess 22 recessed from the unnecessary sheet support surface 21A, and an adherend support that is provided in the recess 22 and can be adsorbed and held by a decompression means (not shown) such as a decompression pump or a vacuum ejector. And an inner table 23 having a surface 23A.

The supply means 3 includes a support roller 31 that supports a belt-like adhesive sheet AS having an adhesive AD layer on one surface of the base sheet BS, a guide roller 32 that guides the adhesive sheet AS, and a rotation as a driving device. The pinch roller 34 that sandwiches the adhesive sheet AS between the driving roller 33 driven by the motor 33A, the linear motor 36 as a driving device supported by the slider 35A of the linear motor 35 as the driving device, and the linear motor 36 Driven by a peeling roller 37 as a peeling member supported by the collection side frame 3B supported by the slider 36A and a rotation motor 38A as a driving device supported by the collection side frame 3B, the cutout hole CU is formed in the adhesive sheet AS. The recovery roller 38 as a recovery means for recovering the unnecessary sheet US formed with the surface of the unnecessary sheet US To maintain state and a guide means 39 for guiding the unnecessary sheet US into the collecting roller 38. The rollers 31 to 34 are supported by the supply side frame 3A.
The guiding means 39 is rotatably supported at the left end portion by the collection side frame 3B and is urged in the clockwise direction by an urging means (not shown) such as a spring or a driving device (see FIG. 3). A base roller 39B supported on the left end of the arm 39A, a motor roller 39C supported on the right end of the rotating arm 39A and including a rotation motor as a driving device (not shown), a base roller 39B and a motor roller 39C An endless and porous suction belt 39D stretched over and a suction chamber 39E supported by a rotating arm 39A and connected to a decompression means (not shown) such as a decompression pump and a vacuum ejector, and an unnecessary sheet US as a base sheet The base roller 39B is moved in the middle along with the increase in the number of unnecessary sheets US collected by the collection roller 38. It is provided to be rotated.

  The pressing means 4 is a linear motor 41 as a driving device supported by the slider 35B of the linear motor 35 and a pressing member supported by the slider 41A of the linear motor 41 and driven by a rotation motor 42A as the driving device. And a pressing roller 42.

  The cutting means 5 includes an articulated robot 51 as a drive device and a cutter tool 52 having a cutter blade 53 that is detachably provided on a work arm 51A of the articulated robot 51. The multi-joint robot 51 is a so-called six-axis robot that can displace the one mounted on the work arm 51A within any work range at any position and any angle.

  The conveying means 6 includes an articulated robot 51 and a suction tool 61 that is detachably provided on a work arm 51A of the articulated robot 51 and can communicate with a decompression means (not shown) such as a decompression pump or a vacuum ejector.

In the sheet sticking apparatus 1 described above, a procedure for sticking the adhesive sheet AS to the wafer WF will be described.
First, as shown in FIG. 2A, in the initial state where the collection side frame 3B and the pressing roller 42 are located on the left side, the operator sets the adhesive sheet AS as shown by the solid line in FIG. When an operation start signal is input via an input means such as an operation panel or a personal computer, the supply means 3 drives the linear motor 35 and presses and sandwiches the adhesive sheet AS between the peeling roller 37 and the pressing roller 42, The guide means 39 drives a decompression means (not shown), sucks and holds the unnecessary sheet US in the suction chamber 39E via the suction belt 39D, and the sheet sticking apparatus 1 enters a standby state.

  Thereafter, when the transfer means 6 drives the articulated robot 51 and the decompression means (not shown), the suction tool 61 sucks and holds the wafer WF and places the wafer WF on the adherend support surface 23A, the support means 2 A decompression means (not shown) is driven to hold the wafer WF by suction. At this time, the adherend surface WF1 of the wafer WF and the unnecessary sheet support surface 21A are positioned in the same plane.

  Next, the pressing means 4 suppresses the rotation of the rotating motor 42A, and the supplying means 3 presses the adhesive sheet AS between the peeling roller 37 and the pressing roller 42, and the supplying means 3 rotates the rotating motors 33A, 38A and 38A. The linear motor 35 is driven, the collection side frame 3B and the pressing roller 42 are moved to the position indicated by the two-dot chain line in FIG. 2A, and the unused portion of the adhesive sheet AS is positioned so as to face the adherend surface WF1 of the wafer WF. (Feed out). Next, the supply means 3 and the pressing means 4 drive the linear motors 36 and 41, and the peeling roller 37 and the pressing roller 42 are lowered to the positions indicated by the solid lines in FIG. The AS is pressed against the unnecessary sheet support surface 21A (hereinafter, the feeding of the unused portion of the adhesive sheet AS and the pressing of the adhesive sheet AS to the unnecessary sheet support surface 21A are referred to as “feeding step”).

  Next, the supply unit 3 and the pressing unit 4 drive the linear motor 35 and the rotation motor 42A, and move the pressing roller 42 to a position indicated by a two-dot chain line in FIG. "). Thereafter, the pressure roller 42 is again returned to the position indicated by the solid line in the same manner (hereinafter referred to as “returning step”). Thereby, the adhesive sheet AS is pressed and pasted on the adherend surface WF1 and the unnecessary sheet support surface 21A. Thereafter, the cutting means 5 drives the articulated robot 51, exchanges the tool from the suction tool 61 to the cutter tool 52, and moves the cutter blade 53 along the outer edge WF2 of the wafer WF, whereby the adhesive sheet AS is removed from the wafer WF. Is cut along the outer edge WF2, and a cut-out hole CU is formed in the adhesive sheet AS from which the portion to be attached to the adherend surface WF1 is cut out (hereinafter referred to as “cutting step”).

  Next, after the transfer means 6 drives the articulated robot 51 and exchanges the tool from the cutter tool 52 to the suction tool 61, the decompression means (not shown) is driven, and the wafer WF to which the sticking sheet TS is stuck is taken into the suction tool. Adsorbed and held at 61 and transported to a separate process device (hereinafter referred to as “discharge process”). Next, the supply means 3, the guiding means 39, and the pressing means 4 drive the linear motor 35, a rotating motor and a rotating motor 42A (not shown), and the unnecessary sheet US is pressed and sandwiched between the pressing roller 42 and the peeling roller 37. While the recovery roller 38, the motor roller 39C, and the pressing roller 42 are rotated in the state, the recovery side frame 3B and the pressing roller 42 are moved to the positions indicated by the solid lines in FIG. 2C to support the unnecessary sheet US. While peeling from the surface 21A, the unnecessary sheet US is collected by the collecting roller 38 (hereinafter referred to as “peeling step”). During the peeling process, the unnecessary sheet US is sucked and held by the suction belt 39D and guided to the collection roller 38 while maintaining its surface state. Thereafter, the supply unit 3 and the pressing unit 4 drive the linear motors 36 and 41 to raise the collection side frame 3B and the pressing roller 42 to return to the initial state indicated by the solid line in FIG. The operation similar to that described above is repeated thereafter.

  Here, in the second and subsequent feeding steps, the feeding means 3 feeds the unused portion of the adhesive sheet AS to the position facing the adherend surface WF1 of the wafer WF in the same manner as described above, and then feeds the feeding means 3 and the guiding means. 39 and the pressing means 4 drive the rotation motors 33A and 38A, the rotation motor (not shown) and the rotation motor 42A, and rewind the adhesive sheet AS in the direction of the support roller 31 by a predetermined amount. When the adhesive sheet AS is pasted on the adherend surface WF1 and the unnecessary sheet support surface 21A of the next wafer WF in the next pressing step, as shown in FIG. The cut-out hole CU of the adhesive sheet AS formed by the cut-out of the next wafer is adjacent to the outer edge WF2 of the next wafer WF or, as shown in FIG. Adjustment is made so as to be positioned on the adherend surface WF1. Thereafter, the supply unit 3 and the pressing unit 4 drive the linear motors 36 and 41 to lower the collection side frame 3B and the pressing roller 42 to the positions indicated by the solid lines in FIG. 2B, and thereafter the same operation as described above is repeated. . That is, the unnecessary sheet US is wound up independently at two places before and after the collecting roller 38 in a state where the cutout hole CU is connected.

  According to the present embodiment as described above, since the unnecessary sheet US is maintained to the surface state and the unnecessary sheet US is guided to the collection roller 38, the portion between the cutout holes CU of the unnecessary sheet US hangs down or bends. It is possible to prevent the unnecessary sheet US from being collected poorly.

  As described above, the best configuration, method and the like for carrying out the present invention have been disclosed in the above description, but the present invention is not limited to this. That is, the invention has been illustrated and described with particular reference to certain specific embodiments, but without departing from the spirit and scope of the invention, Various modifications can be made by those skilled in the art in terms of material, quantity, and other detailed configurations. In addition, the description limited to the shape, material, etc. disclosed above is an example for easy understanding of the present invention, and does not limit the present invention. The description by the name of the member which remove | excluded the limitation of one part or all of such is included in this invention.

For example, as shown in FIG. 4, a plurality of suction belts 39D and suction chambers 39E may be provided in accordance with the shape and number of unnecessary sheets US.
Further, the guiding means 39 does not employ the base roller 39B, the motor roller 39C, and the suction belt 39D, and sucks and holds the unnecessary sheet US only by the suction chamber 39E, or the base roller 39B, the motor roller 39C, and the suction Instead of the belt 39D, a first member without a driving device or a suction function or a second member having at least one of a driving device and a suction function is positioned on the base sheet BS side of the unnecessary sheet US, and the unnecessary sheet US Alternatively, the gas may be ejected from the adhesive AD layer side to the first and second member sides.

  In the second and subsequent feeding steps, the feeding means 3, the guiding means 39, and the pressing means 4 feed the adhesive sheet AS until the cutout hole CU is at the position shown in FIG. The rotation motor 42A may be driven to move the collection side frame 3B and the pressing roller 42 to the positions indicated by the two-dot chain line in FIG. 2A without feeding the adhesive sheet AS.

  Furthermore, the process from the feeding process to the return process may be set as follows. That is, pressing process → return process → cutting process → peeling process → discharge process. Also, pressing process → cutting process → discharge process → return process → peeling process. Also, pressing process → cutting process → returning process → discharge process → peeling process. Also, pressing process → cutting process → returning process → peeling process → discharge process.

The collecting means can adopt any configuration that can collect the unnecessary sheet US. For example, the collecting unit randomly collects the unnecessary sheet US without winding it up like a collection box, or shreds it finely with a shredder or the like. You may employ | adopt the structure which collects. In the case of such collecting means, the guiding means 39 may be provided with a guide roller that sandwiches the suction belt 39D and the unnecessary sheet US between the motor roller 39C and guides the unnecessary sheet US to the collecting means.
Further, the unnecessary sheet US may be collected by the collecting means with the cutout hole CU separated.
The adhesive sheet AS may be a single sheet.

The supply means 3 may employ a peeling member made of a blade material, a round bar or the like instead of the peeling roller 37.
The pressing means 4 may employ a pressing member made of a blade material, rubber, resin, sponge or the like instead of the pressing roller 42.

  The cutting means 5 can adopt any configuration capable of cutting the adhesive sheet AS, for example, a laser cutter, a device that can be cut by water pressure or wind pressure, or a rotary cutter that rotates and cuts. Other cutter blades may be employed. Further, the cutting means 5 may have a separate and independent configuration from the conveying means 6.

  Further, the material, type, shape and the like of the adhesive sheet AS and the adherend in the present invention are not particularly limited. For example, the adhesive sheet AS is not limited to adhesive forms such as pressure-sensitive adhesiveness and heat-sensitive adhesiveness. When a heat-sensitive adhesive is used, an appropriate heating means for heating the adhesive sheet AS. May be provided. Such an adhesive sheet AS is, for example, a single layer having only an adhesive layer, an intermediate layer between the base sheet and the adhesive layer, a cover layer on the upper surface of the base sheet, etc. Three or more layers, or a so-called double-sided adhesive sheet that can peel the base sheet from the adhesive layer may be used. The double-sided adhesive sheet comprises a single-layer or multi-layer intermediate layer. It may be a single layer or a multilayer having no intermediate layer. Examples of the adherend include, for example, foods, resin containers, semiconductor wafers such as silicon semiconductor wafers and compound semiconductor wafers, circuit board, information recording substrates such as optical disks, glass plates, steel plates, ceramics, wood plates or resin plates, Arbitrary forms of members, articles, etc. can also be targeted. In addition, the adhesive sheet AS is replaced with a functional and intended reading, for example, any information label, decorative label, protective sheet, dicing tape, die attach film, die bonding tape, recording layer forming resin sheet, etc. Arbitrary sheets, films, tapes and the like can be attached to any adherend as described above.

The means and steps in the present invention are not limited in any way as long as they can perform the operations, functions, or steps described with respect to those means and steps. The process is not limited at all. For example, the supply unit includes a collection unit that collects the unnecessary sheet in which the cutout hole is formed in the adhesive sheet, and a guide unit that maintains the surface state of the unnecessary sheet and guides the unnecessary sheet to the collection unit. As long as the adhesive sheet can be supplied at a position facing the surface to be adhered, it is not limited in any way as long as it is within the technical scope in light of the common general technical knowledge at the time of filing (other means and processes). Will be omitted).
The drive device in the embodiment includes an electric device such as a rotation motor, a linear motion motor, a linear motor, a single axis robot, an articulated robot, an actuator such as an air cylinder, a hydraulic cylinder, a rodless cylinder, and a rotary cylinder. In addition to these, a combination of them directly or indirectly may be employed (some of them overlap with those exemplified in the embodiment).

DESCRIPTION OF SYMBOLS 1 ... Sheet sticking apparatus 3 ... Supply means 4 ... Pressing means 5 ... Cutting means 38 ... Collection | recovery roller (collection means)
39 ... Guiding means AS ... Adhesive sheet CU ... Cut-out hole US ... Unnecessary sheet WF ... Wafer (adhered body)
WF1 ... deposition surface

Claims (2)

Supply means for supplying an adhesive sheet to a position facing the adherend surface of the adherend;
A pressing means for pressing and adhering the adhesive sheet to the adherend surface;
Cutting means for cutting out the adhesive sheet into a predetermined shape,
The supply unit includes a collecting unit that collects an unnecessary sheet in which a cutout hole is formed in the adhesive sheet, and a guide unit that maintains the surface state of the unnecessary sheet and guides the unnecessary sheet to the collecting unit. The sheet sticking apparatus characterized by the above-mentioned. Supplying an adhesive sheet to a position facing the adherend surface of the adherend;
Pressing and sticking the adhesive sheet on the adherend surface;
Cutting the adhesive sheet into a predetermined shape;
And a step of collecting the unnecessary sheet while maintaining the surface state of the unnecessary sheet in which cutout holes are formed in the adhesive sheet.

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