JP2012209304A - Sheet sticking device and sticking method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a sheet sticking device and a sticking method that can improve sticking position precision with a simple structure under simple control.SOLUTION: An adhesive sheet S and a wafer W are prevented from shifting in position and the sticking position precision is thereby improved by detecting a relative position and a relative rotational angle of the adhesive sheet S delivered to peeling means 4 based upon a reference mark SP provided to the peeling means 4 and an individual mark BM provided to the adhesive sheet S, calculating a delivery position (position of virtual center DC) of the adhesive sheet S based thereupon, and delivering the wafer W to support means 2 so that a center W1 is aligned with the delivery position.

Description

  The present invention relates to a sheet sticking apparatus and a sticking method.

  2. Description of the Related Art Conventionally, there is a pasting device that peels a single-piece adhesive sheet (adhesive tape or adhesive film) temporarily attached on a strip-like release sheet from an original fabric and attaches the peeled adhesive sheet to an adherend such as a semiconductor wafer. (For example, refer to Patent Document 1). The sticking device described in Patent Document 1 has a peeling means (guide member) that bends the release sheet from the fed-out original fabric, and feeds the adhesive sheet peeled from the release sheet by the peeling means forward in the feeding direction. The adhesive sheet is affixed to the adherend by pressing the adhesive sheet against the adherend with a pressure roller while moving the adherend synchronously. In addition, this sticking device detects that the adhesive sheet has arrived at a predetermined position of the peeling means and stops feeding of the original fabric, and detects the positional deviation of the adhesive sheet on the peeling means. And a deviation detecting means (CCD camera) for correcting the relative position with respect to the adherend in accordance with the detected positional deviation, and affixing the adhesive sheet.

  On the other hand, the belt-like adhesive sheet peeled off from the release sheet is placed facing the adherend surface of the adherend, and the placed adhesive sheet is applied to the adherend by pressing and adhering along the outer edge of the adherend. A sticking device that cuts the sheet and collects unnecessary portions of the cut adhesive sheet is also used (see, for example, Patent Document 2). In the case of cutting such a belt-like adhesive sheet after being applied, it is not necessary to strictly correct the positional deviation from the adherend as in the case of the single-sheet adhesive sheet described in Patent Document 1 described above. Such a detecting means is not provided.

JP-A-7-195527 JP 2007-227552 A

  By the way, depending on the characteristics and characteristics of the adhesive sheet, the specific part matches the specific part of the adherend even if the adhesive sheet is cut after sticking as in the sticking device described in Patent Document 2. In some cases, it may be required to apply a sticker. In that case, in order to detect a specific part of the adhesive sheet, it is conceivable to use a detection means or a detection means as described in Patent Document 1. However, since the detection means described in Patent Document 1 detects the outer edge of the adhesive sheet before or during the stop of the peeling means, the positional deviation that occurs between resumption of feeding and pasting on the adherend Cannot be detected. For this reason, even if the detection means and detection means described in Patent Document 1 are used in the sticking device described in Patent Document 2, improvement of the sticking position accuracy cannot be expected, and a large number of sensors, cameras, and the like are required. In addition, there is a disadvantage that the structure is complicated and the control is complicated.

  An object of the present invention is to provide a sheet sticking apparatus and a sticking method capable of improving the sticking position accuracy with a simple structure and control.

  In order to achieve the above object, the sheet sticking device of the present invention peels off the adhesive sheet from an original sheet in which an adhesive sheet having an adhesive layer is temporarily attached to a strip-shaped release sheet via the adhesive layer, and peels off the adhesive sheet. A sheet affixing device for affixing the adhesive sheet to an adherend, a support means for supporting the adherend from a non-adhesive surface side, and a payout for paying out the original fabric and placing the adhesive sheet at a payout position Means, a peeling means for peeling the adhesive sheet from the rolled-out original peeling sheet, a detecting means for detecting a relative position of the fed adhesive sheet and the peeling means, and the attachment on the supporting means Adjusting means for adjusting the support position of the body, and pressing means for pressing the adhesive sheet and sticking to the sticking surface of the adherend, wherein the detecting means comprises a reference mark provided on the peeling means and the The relative position is detected based on an individual mark provided on the receiving sheet, the feeding position of the adhesive sheet is calculated from the detected relative position, and the adjusting means is configured to detect the coverage based on the feeding position of the adhesive sheet. The structure of adjusting the support position of the kimono is adopted.

At this time, the sheet sticking device of the present invention further includes a transport unit that transports the adherend to the support unit, and the transport unit positions the adherend based on the adjusted support position. It is preferable to deliver to the support means.
Furthermore, the adhesive sheet is formed in a band shape, and further includes a cutting unit that cuts the adhesive sheet attached to the adherend according to the shape of the adherend, and the cutting unit includes the adjusted support position. It is preferable that the adhesive sheet is provided so as to be cut based on the above.
In the sheet sticking device of the present invention, the reference mark provided on the peeling means includes at least a first reference mark and a second reference mark provided apart from each other in a direction perpendicular to the feeding direction of the original fabric. And the individual signs provided on the adhesive sheet are separated from each other in a direction perpendicular to the feeding direction of the original fabric, and the first and second individual signs, It is preferable to have a third individual mark provided in the middle of the individual mark and shifted in the feeding direction.

  On the other hand, in the sheet sticking method of the present invention, the adhesive sheet having an adhesive layer is peeled off from the original fabric temporarily attached to the strip-like release sheet via the adhesive layer, and the peeled adhesive sheet is removed. A sheet sticking method for sticking to an adherend, wherein the raw sheet is unwound and the adhesive sheet is disposed at a feeding position, and the adhesive sheet is peeled off from the unwound release sheet by a peeling means. A relative position between the fed adhesive sheet and the peeling means is detected based on a reference sign provided on the means and an individual sign provided on the adhesive sheet, and a feeding position of the adhesive sheet is calculated from the detected relative position. The adherend is supported from the non-pasting surface side at the support position adjusted based on the feeding position of the adhesive sheet, and the adhesive sheet is pressed and pasted to the pasting surface of the supported adherend. It is characterized in.

  According to the present invention as described above, the detection means detects the relative position between the peeling means and the adhesive sheet based on the reference mark provided on the peeling means and the individual mark provided on the adhesive sheet, and from this relative position. By calculating the feeding position of the adhesive sheet, there is no re-feeding operation after calculating the feeding position, so that it is possible to prevent misalignment due to re-feeding and to improve the pasting position accuracy. Further, by detecting the reference mark of the peeling means and the individual mark of the adhesive sheet by the detection means, for example, the detection means can be configured by one sensor or imaging means provided in the vicinity of the peeling means. Accordingly, the apparatus can be simplified in structure, and it is not necessary to align or correct the detection position. Therefore, it is possible to simplify the operation control of detection and adjustment and further improve the accuracy of the pasting position. it can.

In addition, if the conveying means is provided and the adherend is delivered to the supporting means while the conveying means is positioned, the position can be adjusted and delivered while conveying, and the position adjustment of the supporting means is completed. The processing speed can be increased compared to the case where the adherend is transferred after the transfer is performed, or the position of the support means is adjusted after the transfer operation of the adherend is completed. Therefore, since it is only necessary to add control for inputting and commanding the support position to the driving means, it is possible to suppress complication and enlargement of the apparatus.
Furthermore, the cutting means for cutting the adhesive sheet attached to the adherend according to the shape of the adherend has such a known support position after the adjustment is input to the transport means as described above. Since it is only necessary to control the cutting position according to the support position, the structure and operation control of the apparatus can be further simplified.
Further, the reference sign of the peeling means is composed of at least two of the first and second reference signs, and the individual sign of the adhesive sheet is composed of the first to third individual signs and is not located on the same straight line. By comprising, it can correct | amend the position shift in the two-dimensional plane (two orthogonal directions and a rotation direction) parallel to an adhesive sheet, and can improve a sticking position precision further.

The side view of the sheet sticking apparatus which concerns on one Embodiment of this invention. Operation | movement explanatory drawing of the sheet sticking apparatus of FIG. The perspective view of the peeling means and detection means in the sheet sticking apparatus of FIG. The figure explaining the position detection procedure of an adhesive sheet. The figure explaining the position detection procedure different from FIG.

Hereinafter, an embodiment of the present invention will be described with reference to the drawings.
For example, when a direction such as up, down, left, right, near side, or back side is shown without referring to a reference figure in this embodiment, FIG. 1 is used as a reference.
In FIG. 1, a sheet sticking device 1 is a sticking device for sticking an adhesive sheet S having an adhesive layer AD on one surface of a base sheet BS to a semiconductor wafer W (hereinafter sometimes simply referred to as wafer W). . The adhesive sheet S is prepared as an original fabric R temporarily attached to the strip-shaped release sheet RL via the adhesive layer AD, and the release sheet RL and the adhesive sheet S are released from the original fabric R, and the adhesive is peeled off. The sheet S is affixed to the wafer W, and after being cut along the outer edge of the wafer W, the unnecessary sheet S ′ outside is collected. On the other hand, as shown in FIG. 2, a wafer W as an adherend has bumps WB such as a plurality of electrodes on the surface (sticking surface) WA to which the adhesive sheet S is stuck, and a flat outer peripheral portion WC on which the bumps WB are not formed. And a bump wafer. The adhesive layer AD of the adhesive sheet S has a circular opening O corresponding to the region where the bump WB is formed, and the adhesive layer AD is not attached to the bump WB portion of the wafer W. The outer peripheral portion WC is attached.

  The sheet sticking apparatus 1 includes a supporting means 2 that supports the wafer W from the back surface WD side, which is a non-sticking surface, and a feeding means 3 that feeds the original fabric R so that the adhesive sheet S faces the surface WA of the wafer W. The peeling means 4 for peeling the adhesive sheet S and the peeling sheet RL from the unrolled raw fabric R, the detection means 5 for detecting the relative position of the fed adhesive sheet S and the peeling means 4, and the adhesive sheet disposed opposite to each other And pressing means 6 for pressing S to the surface WA of the wafer W and attaching it. Further, the sheet sticking apparatus 1 includes a transport means 7 for transporting the wafer W to the support means 2, an alignment device (not shown) for positioning and delivering the wafer W to the transport means 7, and an adhesive attached to the wafer W. A cutting means 9 for cutting the sheet S along the outer edge of the wafer W and a control means (not shown) for controlling the operation of each part are configured.

  The support means 2 sucks and holds the wafer W from the back surface WD side through a suction port (not shown), and has a disk-shaped table 21 having a substantially the same outer shape as the wafer W and a flat support surface, and a circular shape inside. An outer peripheral table 22 having a recess and supporting the table 21 and having a flat surface 22A parallel to the support surface of the table 21, and an output shaft 23A fixed to the lower surface of the table 21 while being fixed to the bottom surface of the recess. And a linear motion motor 23 as a driving device. The flat surface 22A is laminated with a fluororesin or the like so that the attached adhesive sheet S can be peeled off.

  The feeding means 3 is provided between the supply side frame 3A provided on the supply side of the adhesive sheet S on the left side of the support means 2 and between the supply side frame 3A and the support means 2 so that the peeling means 4 can be moved. An intermediate frame 3B to be supported and a collection side frame 3C provided so as to be movable in the left-right direction from the collection side on the right side of the support means 2 to a position overlapping the support means 2 are configured. The intermediate frame 3B is provided with a moving frame 3E that is supported so as to be movable in a slanting vertical direction via a slider 3H of a linear motion motor 3D as a driving device, and the peeling means 4 is fixed to the moving frame 3E. . The collection side frame 3C is supported so as to be movable in the left-right direction via a slider 3G of a direct acting motor 3F as a drive device.

  The supply-side frame 3A includes a support roller 31 that supports the original fabric R wound in a roll shape, a guide roller 31A that guides the original fabric R adjacent to the support roller 31, and a rotation motor as a drive device. A drive roller 32 that is driven by 32A and collects the release sheet RL that is folded back by the release means 4, a pinch roller 32B that sandwiches the release sheet RL between the drive roller 32, and a drive device (not shown) for release. A collection roller 33 that collects the sheet RL is provided.

  The moving frame 3E includes a plurality of guide rollers 34A and 34B for guiding the original fabric R, a plurality of guide rollers 35A and 35B for guiding the release sheet RL folded back by the peeling means 4, and guide rollers 34A and 35B. A linear motion motor 36 is provided as a pair of drive devices that sandwich the raw fabric R or the release sheet RL therebetween and suppress the feeding. The guide roller 34B is supported by the moving frame 3E via tension detection means 34C such as a load cell that measures the tension due to the adhesive sheet S sticking operation.

  In the collection side frame 3C, a drive roller 37 that is driven by a rotation motor 37A as a drive device to collect the unnecessary sheet S ′, a collection roller 38 that winds and collects the unnecessary sheet S ′, and an unnecessary sheet S ′. And a guide roller 39 that guides the drive roller 37 to the drive roller 37. The collection roller 38 is supported by the collection side frame 3C via the support arm 38A, and is urged by a spring 38B connected to the support arm 38A, so that the unnecessary sheet S ′ sandwiched between the collection roller 38 and the drive roller 37 is obtained. Is configured to wind up.

  The peeling means 4 is supported in a posture that cantilevered from the moving frame 3E in the right direction. The right end side of the peeling sheet 42 folds back the peeling sheet RL and the illumination means (not shown) transmits the adhesive sheet from the adhesive layer side. A release plate 41 provided with an opening 43 is provided, and the adhesive sheet S is released from the release sheet RL by folding the release sheet RL from the original fabric R guided on the upper surface of the release plate 41 toward the guide roller 35A. Is configured to do.

  The detection means 5 includes an imaging device 51 such as a CCD camera that is supported by a frame (not shown) or the like and provided above the peeling plate 41. The imaging device 51 is configured to take an image of the peeling plate 41 and the adhesive sheet S from above and output the taken image data to the control means. Then, the detection means 5 and the control means detect the reference mark SP provided on the peeling plate 41 and the individual mark BM provided on the adhesive sheet S, and feed out based on the detected reference mark SP and individual mark BM. The relative position between the adhesive sheet S and the peeling means 4 is detected.

  The pressing means 6 is provided so as to be movable in the left-right direction via a slider (not shown) of the linear motor 3F, and is supported by the frame 61 and can come into contact with the base sheet BS side of the adhesive sheet S. The pressure roller 62 and a linear motor 63 as a drive device that moves the pressure roller 62 up and down are provided. The pressing roller 62 is formed of an elastically deformable member made of rubber or resin.

  The conveying means 7 includes an articulated robot 71 as a driving device and a suction tool 72 that is detachably provided at the tip of the articulated robot 71. The multi-joint robot 71 is a so-called six-axis robot having joints that can rotate at six locations, and is provided so as to be able to support the suction tool 72 by a tool holding chuck 73, and the suction tool is within the working range of the multi-joint robot 71. 72 can be displaced at any position and at any angle. The suction tool 72 includes a suction part 72A provided with a plurality of suction holes (not shown) and a frame part 72C provided with a fitting hole 72B into which the tool holding chuck 73 is fitted. By connecting to a suction means such as a suction pump (not shown) via the robot 71, the wafer W can be sucked.

  The cutting means 9 includes an articulated robot 71 that also serves as the transport means 7 and a cutter tool 91 that is detachably provided on a tool holding chuck 73 of the articulated robot 71. The cutter tool 91 includes a cutter blade 91A and a frame portion 91C provided with a fitting hole 91B into which the tool holding chuck 73 is fitted.

  The control means (not shown) is a control device comprising a computer having a calculation means such as a CPU and a storage means such as a memory, and controls various information relating to the wafer W, the adhesive sheet S, etc. based on the operation of the operator and appropriate detection means. Input means such as a keyboard and an operation panel are provided. Here, as various information, the diameter dimension and thickness dimension of the wafer W, the positional information in the circumferential direction, the thickness dimension of the adhesive sheet S, the positional information and dimension information of the opening O of the adhesive layer AD, and the like can be exemplified. The information may be input to the control device from an appropriate input unit, may be input to the control device from the imaging device 51 of the detection unit 5, other sensors (not shown), or the like. It may be stored in the memory. And a control apparatus outputs the control command according to various information to the drive device of each part, and controls it.

The feeding position calculation method of the adhesive sheet S in the above sheet sticking apparatus 1 will be described with reference to FIGS.
The peeling means 4 is provided with a reference mark SP. As shown in FIG. 3, the reference mark SP is composed of a first reference mark SP1 and a second reference mark SP2 provided in the vicinity of the end of the peeling plate 41 on the folding edge 42 side. These first and second reference marks SP1 and SP2 are configured by holes that vertically penetrate the peeling plate 41, and are provided apart from each other along an orthogonal direction B orthogonal to the feeding direction A of the adhesive sheet S. Yes. Then, the imaging device 51 of the detection means 5 images the peeling plate 41 from above and outputs the imaging data to the control means, so that the control means identifies the first and second reference signs SP1 and SP2 by image processing. The control means stores the intermediate point connecting these as the virtual reference mark SP ′. Further, based on the known distance between the reference marks SP1 and SP2 stored in advance in the control means, the distance between the reference marks SP1 and SP2 of the imaging data is digitized, and a reference for outputting the deviation amount as a numerical value is calculated. . Here, in the sheet sticking apparatus 1 according to the present embodiment, the peeling unit 4 is lowered during the sticking operation, and returns to the original position after the sticking operation is completed. Therefore, when the peeling unit 4 returns to the original position and stops. In addition, since the original fabric R may not necessarily stop at a certain position, the above calculation method is performed for each pasting operation. The first and second reference marks SP1 and SP2 are not limited to through holes, but may be marks such as dents or paints, or light emitting signs in which a light source such as an LED or a laser is embedded in the peeling plate 41. Furthermore, it may be comprised not only in 2 places but 3 places or more.

  On the other hand, the individual sheet BM is provided on the adhesive sheet S. As shown in FIG. 3, the individual mark BM includes a first individual mark BM1, a second individual mark BM2, and a third individual mark BM3 provided between adjacent openings O of the adhesive layer AD. These first to third individual labels BM1, BM2, BM3 are formed by notches provided from the adhesive layer AD to a part of the release sheet RL. Further, the first and second individual signs BM1 and BM2 are provided apart from each other along the orthogonal direction B orthogonal to the feeding direction A, and upstream of the feeding direction A in the middle and the width center of the adhesive sheet S. A third individual mark BM3 is provided on the side shifted by approximately half. Then, the adhesive sheet S in the drawn-out state is imaged from above by the imaging device 51 of the detection means 5 and the imaging data is output to the control means, whereby the control means performs the first to third individual signs BM1, The control means stores BM2 and BM3 as a virtual individual mark BM ′ that identifies the point of contact with the third individual mark BM3 on the straight line connecting the first and second individual marks BM1 and BM2. The third individual mark BM3 is a means for calculating the virtual individual mark BM ′, and is provided so as not to mistakenly identify the individual mark BM formed on the release sheet RL folded at the folding edge 42. When the RL is folded back in the direction opposite to the feeding direction A, the third individual mark BM3 is shifted by approximately half to the downstream side in the feeding direction A of the adhesive sheet S. Also, the feeding operation is controlled so as not to stop. The first to third individual signs BM1, BM2, and BM3 are not limited to the notches formed from the adhesive layer AD to a part of the release sheet RL, but by the coating provided on the base sheet BS or the adhesive layer AD. It may be configured with a mark.

The center of the opening O is a virtual center point DC that is a calculation point of the feeding position of the adhesive sheet S, and the control unit calculates the feeding position (virtual center point DC) of the adhesive sheet S as follows.
First, the control means uses the detection means 5 as described above to detect the first and second of the peeling means 4 every time the adhesive sheet S is attached to one wafer W and before the adhesive sheet S is fed out. The reference signs SP1 and SP2 are identified, and the distance between the reference signs SP1 and SP2 and the virtual reference sign SP ′ are calculated. Next, as shown in FIGS. 4 and 5, when the adhesive sheet S is fed out, the first to third individual marks BM1, BM2, BM3 of the adhesive sheet S are used by using the detecting means 5 as described above. And a virtual individual mark BM ′ is calculated. Based on the deviation amount along the feeding direction A and the orthogonal direction B between the virtual reference sign SP ′ and the virtual individual sign BM ′ calculated in this way, the control means detects the relative position between the peeling means 4 and the adhesive sheet S. To do. At this time, as shown in FIG. 5, when the adhesive sheet S is fed out while being inclined in the feeding direction A, the first and second straight lines connecting the first and second individual marks BM <b> 1 and BM <b> 2 are connected. The inclination θ with respect to the straight line connecting the reference signs SP1 and SP2 is calculated, and the control means detects the relative rotation angle between the peeling means 4 and the adhesive sheet S based on the inclination θ. If the relative position and the relative rotation angle between the peeling means 4 and the adhesive sheet S can be detected as described above, the control means can control the virtual reference mark SP ′ based on the known distance from the virtual individual mark BM ′ to the virtual center point DC. The position of the virtual center point DC with respect to, that is, the feeding position of the adhesive sheet S is calculated.

Hereinafter, the operation of attaching the adhesive sheet S to the wafer W in the sheet attaching apparatus 1 will be described.
First, on the basis of a command from the control means, the feeding means 3 drives the driving rollers 32 and 37 by the rotation motors 32A and 37A to feed the original fabric R by a predetermined amount, and then stops the rotation motors 32A and 37A. At the same time, the movement of the original fabric R and the release sheet RL is restrained by the linear motor 36, and the adhesive sheet S is made to stand by at the sticking standby position shown in FIG. In this standby state, the control means detects the relative position (shift amount) between the adhesive sheet S and the peeling means 4 by executing the above-described feeding position calculation procedure, and the feeding position (virtual center point DC) of the adhesive sheet S. Is calculated in advance.

  Next, the control unit outputs a conveyance command based on the feeding position of the adhesive sheet S calculated in the feeding position calculation procedure and the center W1 of the wafer W in the alignment apparatus (not shown) to the conveyance unit 7. Receiving this transfer command, the transfer means 7 drives the articulated robot 71 to suck and hold the wafer W positioned by an alignment device (not shown) by the suction tool 72 attached to the tool holding chuck 73. Further, the transport unit 7 transports the wafer W held by suction toward the support unit 2, and an appropriate support position on the table 21 so that the center W1 of the wafer W coincides with the virtual center point DC of the adhesive sheet S. And the wafer W is transferred to the support means 2. Specifically, as shown in FIG. 2, when the virtual center point DC of the adhesive sheet S is shifted to the upstream side (left side in the drawing) in the feeding direction A, the shift amount is more than the center TC of the table 21. Also, the wafer W is delivered so that the center W1 of the wafer W is positioned at a support position eccentric to the left side in the drawing. That is, the adjusting means of the present invention is realized by the conveying means 7 and delivers the wafer W to the supporting means 2 so that the virtual center point DC of the adhesive sheet S and the center W1 of the wafer W coincide with each other. The supporting position of the wafer W is adjusted based on the S feeding position. Thereafter, the support means 2 sucks and supports the wafer W by the support surface of the table 21, and the linear motor 23 is set so that the surface WA of the wafer W and the flat surface 22A of the outer peripheral table 22 are located in the same plane. Drive to raise or lower the table 21.

  Next, as shown in FIG. 1, after the linear motion motor 3F moves the pressing means 6 to the right end of the outer peripheral table 22 of the support means 2, the linear motion motor 63 is driven to lower the pressing roller 62, The adhesive layer AD of the adhesive sheet S is pressed against the flat surface 22A. Next, by moving the pressing means 6 to the left and rolling the pressing roller 62 on the adhesive sheet S, an adhesive layer is sequentially formed on the flat surface 22A and the outer peripheral portion WC of the wafer W as shown in FIG. Press and paste the AD surface. At this time, since the tension is applied to the adhesive sheet S to the guide roller 34B, the linear motion motor 3D is driven and moved through the control means while detecting the tension by the tension detector 34C so as to maintain an appropriate tension. The frame 3E and the peeling means 4 are lowered. While the pressing means 6 moves to the left end portion of the outer peripheral table 22 and affixes the adhesive layer AD, the control means outputs a command to the conveying means 7 and causes the suction tool 72 to be replaced with the cutter tool 91. The cutting means 9 is configured. The cutting means 9 drives the articulated robot 71 to pierce the cutter blade 91A into the adhesive sheet S against the outer edge of the wafer W based on the transfer command output from the control means to the transfer means 7, and The cutter sheet 91A is retracted when the cutting is completed. Then, the transfer means 7 drives the articulated robot 71 to replace the cutter tool 91 with the suction tool 72, and sucks and holds the wafer W to which the adhesive sheet S is stuck by the suction tool 72, and then starts the next process from the support means 2. To be taken out.

  Next, the feeding means 3 drives the linear motor 3F to move the collection side frame 3C in the left direction, and drives the drive roller 37 by the rotation motor 37A to wind the unnecessary sheet S ′ around the collection roller 38. The unnecessary sheet S ′ is peeled off from the flat surface 22A of the outer peripheral table 22 and collected. When the collection side frame 3C is moved to the left end of the outer peripheral table 22 and the collection of the unnecessary sheet S ′ is completed, the feeding means 3 stops the rotation motor 37A and the linear motion motor 36 and the raw fabric R and the separation. After releasing the restraint of the sheet RL, the driving rollers 32 and 37 are driven by the rotation motors 32A and 37A to feed the original fabric R, and the linear motion motor 3D is driven to raise the moving frame 3E and the peeling means 4 In addition, the linear motion motor 63 is driven to raise the pressing roller 62. Then, by driving the linear motion motor 3F and moving the pressing means 6 and the collection side frame 3C to the right, the unused portion of the adhesive sheet S to be applied next time is pulled out and disposed above the support means 2, Thereafter, the same operation as described above is repeated.

According to this embodiment, there are the following effects.
That is, based on the reference mark SP provided on the peeling means 4 and the individual mark BM provided on the adhesive sheet S, the relative position and the relative rotation angle of the adhesive sheet S fed out with respect to the peeling means 4 are detected. Based on this, the feeding position of the adhesive sheet S (the position of the virtual center point DC) is calculated, and the wafer W is transferred to the support means 2 so that the center W1 coincides with the feeding position. Can be prevented, and the accuracy of the pasting position can be improved. Further, by detecting the reference mark SP and the individual mark BM by the detection means 5 provided in the vicinity of the peeling means 4, the feeding position of the adhesive sheet S can be calculated without arranging a plurality of sensors or the like in each part. Since the structure of the sheet sticking apparatus 1 can be simplified and the alignment and correction between the detection positions are not required, the operation control of detection and feeding position calculation can be simplified.

  As described above, the best configuration, method, and the like for carrying out the present invention have been disclosed in the above description, but the present invention is not limited to this. That is, the invention has been illustrated and described with particular reference to particular embodiments, but with respect to the embodiments described above, such as shape and the like, without departing from the scope and spirit of the invention. In the detailed configuration, various modifications can be made by those skilled in the art. Moreover, since the description which limited the shape etc. which were disclosed above was illustrated in order to make an understanding of this invention easy, it does not limit this invention, Therefore The description by the name of the member which remove | excluded one part or all part is included in this invention.

  For example, in the sheet sticking apparatus 1 according to the above embodiment, the adhesive sheet S having a belt-like base sheet BS provided with an adhesive layer AD having an opening O is used, and the adhesive sheet S is pasted on the wafer W. However, the adhesive sheet S may be a single sheet. Moreover, although the adhesive sheet illustrated the adhesive sheet S of the two-layer structure which has the adhesive bond layer AD on one side of the base material sheet BS, the adhesive sheet S may be three or more layers, for example, a die attach film The adhesive sheet S having a single layer structure including only the adhesive layer AD may be used. That is, the original fabric R in which the single-piece adhesive sheet S is temporarily attached to the release sheet RL is fed out, and a part of the adhesive sheet S is peeled off from the release sheet RL by the release means 4, and the peeled adhesive sheet S is removed from the release means 4. Alternatively, the adhesive sheet S may be disposed at a feeding position protruding in a cantilevered manner and pressed and adhered to the adherend. Even in this case, similarly to the sheet sticking apparatus 1 of the embodiment, the sticking position accuracy is improved by adjusting the support position of the adherend in the support means so as to match the feed position of the fed adhesive sheet S. be able to.

  Further, the adjusting means for adjusting the support position of the adherend is not limited to the means that is configured by the transport means 7 and is positioned when the adherend is delivered to the support means 2 as in the above-described embodiment. 2 may be provided. Specifically, the table 21 of the above-described embodiment is supported so that the position of the table 21 can be adjusted in two directions (A and B directions) and the rotation direction (θ direction) in a plane, and a command from the control means after the wafer W is placed. Thus, the table 21 may be configured to move in a plane. Further, the adjusting unit may be provided in the alignment apparatus. In this case, the alignment apparatus may adjust the position of the wafer W by a command from the control unit and then transfer it to the transfer unit. Furthermore, as an adjustment means, you may disperse | distribute and provide in each parts, such as the conveyance means 7, the support means 2, and an alignment apparatus.

Further, the detection means 5 is not limited to the imaging device 51 such as a CCD camera, and may be configured to have other optical sensors, or may be configured of a device capable of mechanically detecting the position. The detection means 5 is not limited to being provided apart from the peeling means 4, and may be provided in a part of the peeling means 4. For example, the detection means 5 includes a contact sensor provided integrally with the peeling plate 41. May be. And as a form, material, etc. of a reference | standard label | marker or an individual label | marker, it can select suitably according to the structure of a detection means, and if the detection means can detect, the structure of a label | marker will not be specifically limited.
Further, in the procedure for calculating the feeding position of the adhesive sheet S in the above embodiment, since the peeling means moves during the sticking operation, the first and second of the peeling means 4 each time the adhesive sheet S is stuck to one wafer W. The reference marks SP1 and SP2 are identified. However, if the distance between the peeling means and the detecting means is not changed, a predetermined number of pasted lots may be used, or the first time when a roll of raw material R is set. Alternatively, it may be several degrees, and further, the reference mark may be identified during maintenance of the sheet sticking apparatus 1 or during maintenance of the peeling means 4.
Furthermore, in this embodiment, the individual marker BM provided on the adhesive sheet is detected using transmitted illumination, but the individual marker BM may be detected using epi-illumination. By using the epi-illumination, the opening 43 provided on the peeling plate 41 and the third individual mark BM3 are not required, and the virtual individual mark BM ′ can be calculated by two individual marks in the same manner as the virtual reference mark SP ′. .

  Moreover, in the said embodiment, although the semiconductor wafer W was employ | adopted as a to-be-adhered body and the adhesive sheet S stuck to this was illustrated, the kind, material, etc. of the to-be-adhered body and the adhesive sheet S in this invention are specifically limited. For example, when the adherend is an appropriate article (for example, a cardboard case or a resin container) and the adhesive sheet S may be a label, and the adherend is a semiconductor wafer, the adhesive sheet S may be a protective sheet, a dicing tape, a die attach film, or the like. The semiconductor wafer can be exemplified by a silicon semiconductor wafer, a compound semiconductor wafer, and the like. The adhesive sheet to be attached to such a semiconductor wafer is not limited to a protective sheet, dicing tape, and die attach film, but any other sheet or film. Adhesive sheets with arbitrary uses and shapes, such as tape, can be applied. Further, the adherend may be an optical disk substrate, and the adhesive sheet S may have a resin layer constituting a recording layer. As described above, as the adherend, not only a glass plate, a steel plate, a resin plate, and other plate-like members, but also members and articles in any form can be targeted.

Further, the peeling means 4 is not limited to the one provided with the peeling plate 41 as described above, and may be configured to have a roller that folds the peeling sheet RL at a predetermined radius.
Moreover, in the said embodiment, although the raw fabric R was the structure which cut | disconnected after sticking to the wafer W using the thing with which the strip | belt-shaped adhesive sheet S was temporarily attached to the strip | belt-shaped peeling sheet RL, It may be configured such that the adhesive sheet is cut to an appropriate size and then peeled off and attached to the adherend immediately before being attached to the body.
The drive device in the embodiment includes an electric device such as a rotation motor, a linear motion motor, a linear motor, a single-axis robot, and an articulated robot, an actuator such as an air cylinder, a hydraulic cylinder, a rodless cylinder, and a rotary cylinder. In addition to these, a combination of them directly or indirectly may be employed (some of them overlap with those exemplified in the embodiment).

DESCRIPTION OF SYMBOLS 1 Sheet sticking apparatus 2 Support means 3 Feeding means 4 Peeling means 5 Detection means 6 Pressing means 7 Conveyance means (adjustment means)
9 Cutting means AD Adhesive layer BM Individual label BS Base sheet R Original fabric RL Release sheet S Adhesive sheet SP Reference label W Wafer (Substrate)

Claims (5)

An adhesive sheet having an adhesive layer is a sheet sticking device that peels off the adhesive sheet from an original fabric temporarily attached to a strip-shaped release sheet via the adhesive layer, and affixes the peeled adhesive sheet to an adherend. There,
Support means for supporting the adherend from the non-sticking surface side;
A feeding means for feeding the original fabric and arranging the adhesive sheet at a feeding position;
Peeling means for peeling the adhesive sheet from the unrolled original peel sheet,
Detecting means for detecting a relative position between the fed adhesive sheet and the peeling means;
Adjusting means for adjusting the support position of the adherend in the support means;
Pressing means for pressing the adhesive sheet and sticking to the sticking surface of the adherend,
The detection means detects the relative position based on a reference mark provided on the peeling means and an individual mark provided on the adhesive sheet, and calculates a feeding position of the adhesive sheet from the detected relative position,
The adjustment unit adjusts a supporting position of the adherend based on a feeding position of the adhesive sheet.   The apparatus further comprises conveying means for conveying the adherend to the support means, and the conveying means delivers the adherend to the support means while positioning based on the adjusted support position. Item 2. The sheet sticking device according to Item 1.   The adhesive sheet is formed in a band shape, and further includes cutting means for cutting the adhesive sheet attached to the adherend according to the shape of the adherend, and the cutting means is based on the adjusted support position. The sheet sticking device according to claim 1, wherein the adhesive sheet is provided so as to be cut. The reference mark provided in the peeling means has at least a first reference mark and a second reference mark provided apart from each other in a direction perpendicular to the feeding direction of the original fabric,
The individual markings provided on the adhesive sheet include first and second individual markings that are spaced apart from each other in a direction perpendicular to the feeding direction of the original fabric, and the first and second individual markings. The sheet sticking device according to any one of claims 1 to 3, wherein the sheet sticking device is configured to include a third individual mark provided in the middle so as to be shifted in a feeding direction. A sheet sticking method in which an adhesive sheet having an adhesive layer is peeled off from the original fabric temporarily attached to a strip-like release sheet via the adhesive layer, and the peeled adhesive sheet is attached to an adherend. There,
While unwinding the original fabric and placing the adhesive sheet at the unwinding position, the adhesive sheet is peeled off by a peeling means from the peel-off sheet of the raw fabric that is fed out,
Detecting the relative position between the peeled-off adhesive sheet and the peeled-off means based on the reference mark provided on the peeling means and the individual mark provided on the adhesive sheet;
Calculate the feeding position of the adhesive sheet from the detected relative position,
Supporting the adherend from the non-stick surface side at the support position adjusted based on the feeding position of the adhesive sheet,
A sheet sticking method comprising pressing and adhering the adhesive sheet to a sticking surface of a supported adherend.

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