KR101719738B1 - Bonding appraratus for wafer and Bonding Method thereof - Google Patents

Bonding appraratus for wafer and Bonding Method thereof Download PDF

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KR101719738B1
KR101719738B1 KR1020160024209A KR20160024209A KR101719738B1 KR 101719738 B1 KR101719738 B1 KR 101719738B1 KR 1020160024209 A KR1020160024209 A KR 1020160024209A KR 20160024209 A KR20160024209 A KR 20160024209A KR 101719738 B1 KR101719738 B1 KR 101719738B1
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South Korea
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adhesive film
wafer
film
film body
chamber
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KR1020160024209A
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Korean (ko)
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KR20160105353A (en
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심세진
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(주)크렌텍
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/185—Joining of semiconductor bodies for junction formation
    • H01L21/187—Joining of semiconductor bodies for junction formation by direct bonding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/682—Mask-wafer alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The present invention relates to a wafer bonding apparatus and a wafer bonding method using the same, wherein a first adhesive film body having a first protective film and a second protective film attached to both sides of the adhesive film is bonded to a first protective film, A portion of the first adhesive film that is half-cut by the half-cutting device except a portion corresponding to the carrier wafer, and a portion of the first adhesive film that is opposite to the carrier wafer of the first protective film, Removing the first protective film from the second adhesive film body passed through the first film removing device to form a third adhesive film body and removing the third adhesive film body from the second adhesive film body, The step of bonding the adhesive film to the carrier wafer by vacuum bonding is carried out continuously in one line by bonding the carrier wafer in the chamber, And the adhesive film body can be precisely cut to the size of the carrier wafer to be easily adhered to the carrier wafer in an exact coincidence and the protective film can be easily separated to improve the convenience of the bonding process and greatly reduce the defective rate of the bonding process .

Figure R1020160024209

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a wafer bonding apparatus and a wafer bonding method using the same,

The present invention relates to a wafer bonding apparatus and a wafer bonding method using the same, and more particularly, to a wafer bonding apparatus for bonding an adhesive film for bonding a carrier wafer and a device wafer to a carrier wafer in a chamber and a wafer bonding method using the same will be.

Recently, a through silicon via (TSV) using a 3D stacking technique is mainly used for the semiconductor packaging process, and the TSV includes a process of grinding the back surface of the device wafer and bonding the carrier wafer to the carrier wafer by bonding.

The device wafer and the carrier wafer are usually bonded using an adhesive film cut in the chamber in accordance with the size of the carrier wafer.

The adhesive film is cut in accordance with the size of the carrier wafer together with a protective film on both sides with a laser or a cutter in a state where a protective film is attached to both sides of the adhesive film, and the adhesive film is primarily bonded to the carrier wafer in the chamber.

However, since the adhesive film is cut together with the protective film on both sides by a laser or a cutter method, it is difficult to separate one protective film to be bonded to the carrier wafer after cutting.

Particularly, it is more difficult for the adhesive film and the protective film to separate from each other due to heat generated at the cut surface when the laser is cut, and the protective film is separated from the cut surface of the adhesive film, There is a problem in that the welded portions are irregularly formed and are difficult to be bonded accurately with the carrier wafer.

In addition, the process of bonding the carrier wafer and the device wafer at present has a problem that the process of cutting the adhesive film and the protective film and the process of attaching the adhesive film to the carrier wafer are separately performed, resulting in low productivity and high manufacturing cost .

Korean Patent Registration No. 0226027 'Wafer bonding apparatus and wafer bonding method' (published on October 15, 1999)

It is an object of the present invention to improve the efficiency of the adhesion process between a carrier wafer and a device wafer by half cutting an adhesive film having a protective film on both sides and cutting the wafer precisely to the size of a carrier wafer, And a wafer bonding method using the same.

According to another aspect of the present invention, there is provided a wafer bonding apparatus for bonding a first adhesive film body having a first protective film and a second protective film on both sides of an adhesive film, A part of the adhesive film excluding the part corresponding to the carrier wafer and a part of the first protective film excluding the part corresponding to the carrier wafer are cut out from the first adhesive film half cut by the half- Removing the first protective film from the second adhesive film body passed through the first film removing device to form a third adhesive film body; A film removing device, a chamber in which a third adhesive film body having passed through the first protective film removing device is inserted, a carrier wafer into which the third adhesive film body is adhered is inserted, It is provided in the machine chamber, characterized by a carrier bonding device for bonding the adhesive film of the third adhesive film body to the carrier wafer.

According to another aspect of the present invention, there is provided a method for bonding a wafer, comprising the steps of: attaching a first protective film and a second protective film on both sides of the adhesive film, A part of the adhesive film cut out in the half cutting step excluding a part corresponding to the carrier wafer and a part of the first protective film excluding a part corresponding to the carrier wafer are removed A first protective film removing step of removing a remaining portion of the first protective film from the second adhesive film body that has undergone the first film removing step, a third protective film removing step of removing the first protective film, A film carrier and a carrier wafer are inserted into the chamber, and a carrier for positioning the adhesive film of the third adhesive film body and the carrier wafer on the same vertical line in the chamber, After the alignment step, and said carrier alignment step is characterized in that it comprises a film adhesive comprising the adhesive on the carrier wafer to the adhesive film of the third adhesive film body.

The present invention has the effect of improving the productivity by making the process of vacuum bonding the adhesive film body with the protective film on both sides of the adhesive film to the carrier wafer continuously.

The present invention improves the convenience of the bonding process by accurately cutting the adhesive film body having the protective film on both sides of the adhesive film to the size of the carrier wafer, And the defective rate of the bonding process is greatly reduced.

1 is a schematic view showing an embodiment of a wafer bonding apparatus according to the present invention;
2 is a perspective view showing another embodiment of the wafer bonding apparatus according to the present invention.
3 is an enlarged perspective view showing another embodiment of the wafer bonding apparatus according to the present invention.
4 is a perspective view showing an embodiment of a half-cutting device in a wafer bonding apparatus according to the present invention.
5 and 6 are views showing another embodiment of a half cutting device in a wafer bonding apparatus according to the present invention.
7 and 8 are enlarged views of the operation of the apparatus for cutting and moving a film in a wafer bonding apparatus according to the present invention.
9 is a view showing an operation example of a line cutting device in a wafer bonding apparatus according to the present invention.
10 and 11 are views showing an example of a first protective film removing apparatus in a wafer bonding apparatus according to the present invention.
12 and 13 are views showing an example of a chamber insertion waiting receptacle in a wafer bonding apparatus according to the present invention.
Figs. 14 and 15 are views showing an example of inserting a wafer into a chamber in a chamber insertion waiting receptacle in a wafer bonding apparatus according to the present invention; Fig.
16 to 18 are views showing an example in which wafers are firstly aligned in a chamber in a wafer bonding apparatus according to the present invention.
19 to 21 are views showing an example in which a third adhesive film body cut into a chamber insertion waiting receptacle in a wafer bonding apparatus according to the present invention is placed and then inserted into a chamber.
22 is a view showing an example in which a film is adsorbed to an upper film adsorbing portion in which a third adhesive film body in a chamber is adsorbed in a wafer adhering apparatus according to the present invention.
23 is a view showing an example of aligning the carrier wafer and the adhesive film body in the chamber of the wafer bonding apparatus according to the present invention.
24 is a view showing an example of pulling out a carrier wafer to which a third adhesive film body is adhered in a chamber of a wafer bonding apparatus according to the present invention;
25 to 27 are views showing an example of removing a final protective film from a carrier wafer to which a third adhesive film body is adhered with a wafer bonding apparatus according to the present invention.
28 is a process chart showing an embodiment of a wafer bonding method according to the present invention.
29 is a schematic view showing a state change of the adhesive film body in the wafer bonding method according to the present invention.

The present invention will now be described in detail with reference to the accompanying drawings. Hereinafter, a repeated description, a known function that may obscure the gist of the present invention, and a detailed description of the configuration will be omitted. Embodiments of the present invention are provided to more fully describe the present invention to those skilled in the art. Accordingly, the shapes and sizes of the elements in the drawings and the like can be exaggerated for clarity.

1 is a schematic view showing an embodiment of a wafer bonding apparatus according to the present invention. Referring to FIG. 1, a wafer bonding apparatus according to an embodiment of the present invention includes a first protection The first adhesive film body 1 on which the film 1b and the second protective film 1c are adhered is half cut so as to correspond to the shape of the carrier wafer 4 so as to be cut off from the adhesive film 1a, And a half-cutting device 10 for forming a wafer bonding portion to be adhered to the wafer.

The carrier wafer 4 may be a glass wafer or a silicon wafer.

Further, the wafer bonding apparatus according to an embodiment of the present invention includes a film take-up reel member 60 in which the first adhesive film body 1 is wound a plurality of times; And a film transfer guide roll portion 61 disposed between the film take-up reel member 60 and the half-cutting device 10 for guiding the first adhesive film body 1 to the half- .

The wafer bonding apparatus according to an embodiment of the present invention further includes a first film tension adjuster 70 for adjusting the tension of the first adhesive film body 1 fed through the film feed guide roll 61 .

The first film tension adjuster 70 is disposed on the front side and the rear side of the half cutting device 10 and adjusts the tension of the first adhesive film body 1 so that the first film tension adjuster 70 So that the adhesive film body 1 can be half-cut into an accurate position in a shape corresponding exactly to the wafer.

The half cutting device 10 is configured such that only the first protective film 1b and the adhesive film 1a except the second protective film 1c of the first adhesive film body 1 are bonded to the carrier wafer 4, To be cut in correspondence with the shape of the cutter. That is, the second protective film 1c is not cut by the half-cutting device 10. The first protective film 1b and the adhesive film 1a are cut by the half cutting device 10 and separated into a portion corresponding to the carrier wafer 4 and a remaining portion excluding the portion.

The wafer bonding apparatus according to an embodiment of the present invention includes a chamber 40 in which the adhesive film 1a and the carrier wafer 4 are bonded.

The chamber 40 is a vacuum chamber 40 capable of keeping the inside thereof in a vacuum state.

The wafer bonding apparatus according to an embodiment of the present invention is characterized in that the wafer bonding apparatus according to the embodiment of the present invention is arranged next to the half cutting apparatus 10 in the conveying direction of the first adhesive film body 1, A first film removing device 20 (20) for removing a portion of the first protective film 1b excluding a portion corresponding to the carrier wafer 4 and a portion of the adhesive film 1a excluding the portion corresponding to the carrier wafer 4 ).

The first film removing device 20 is configured to remove the portion of the first adhesive film body 1 except the portion corresponding to the carrier wafer 4 from the first protective film 1b, A winder 21 for winding a portion except a portion corresponding to the carrier wafer 4; And a plurality of film removal guide rolls (22) guiding the remaining portion to be wound on the winder (21), wherein a second film tension adjuster (22) for adjusting the tension of the film wound on the winder 23).

The first film removing device 20 is configured such that the tip end portion of the first protective film 1b and the tip end portion of the adhesive film 1a are connected to the winder 21 in the first adhesive film body 1, A part of the adhesive film 1a excluding the part corresponding to the first protective film 1b or the carrier wafer 4 and the part of the adhesive film 1a corresponding to the carrier wafer 4 after half cutting by the half- Is wound on the winder 21 while being separated from the second protective film 1c naturally.

The first adhesive film body 1 passes through the first film removing device 20 and removes a portion of the first protective film 1b excluding a portion corresponding to the carrier wafer 4, The portion except the portion corresponding to the carrier wafer 4 is removed and formed as the second adhesive film body.

The wafer bonding apparatus according to the embodiment of the present invention is configured such that the first protective film 1b and the portion of the adhesive film 1a corresponding to the carrier wafer 4 (80) for transferring the second adhesive film body (2) from which the removed portion has been removed to the cutting position; And a line cutting device (90) for cutting the second adhesive film body (2); And a first protective film removing device (30) for removing the first protective film (1b) protecting the wafer adhered portion from the second adhesive film (2).

The first protective film removing device 30 removes the first protective film 1b from the second adhesive film body 2 through the first film removing device to form a third adhesive film body 3 do.

The line cutting device 90 is cut so that a half-cut portion, that is, a cut portion corresponding to the carrier wafer 4, is positioned at the center by the half-cutting device 10.

The third adhesive film body 3, which is cut off from the second adhesive film body 2 by the line cutting device 90 and from which the first protective film 1b protecting the wafer adhered portion is removed, Is inserted into the chamber (40) through the device.

The film cutting and position shifting device 80 includes a first film clamping shifter 81 for holding and moving the second adhesive film body 2 and reciprocating linearly in correspondence to the conveying direction of the second adhesive film body 2 And a second film clamping and moving unit 82.

In addition, the chamber-moving mobile device can be arranged in a straight line in the first film clamping moving part 81 and the second film clamping moving part 82 in correspondence with the conveying direction of the second adhesive film body 2 A third film clamping moving part 83 movable in the horizontal direction, a third film clamping moving part 83 moving in the third film clamping moving part 83, or a chamber inserting the carrier wafer 4 upward An waiting receptacle 84; And a chamber access movement part 85 for allowing the third adhesive film body 3 or the carrier wafer 4 loaded on the chamber inserting standby part 84 to go into and out of the chamber 40.

A wafer bonding apparatus according to an embodiment of the present invention is provided with a carrier bonding apparatus (not shown) provided in the chamber 40 for bonding the adhesive film 1a of the third adhesive film body 3 to the carrier wafer 4 50).

The carrier adhering device 50 includes a wafer receiving portion 51 in which the carrier wafer 4 is placed in the chamber 40; And an upper film adsorption part 52 on which the third adhesive film body 3 is adsorbed on the lower face of the wafer receiving part 51. The upper film adsorption part 52 and the upper film adsorption part 52 At least one of them is operated to move up and down, and in the present invention, the wafer receiving unit 51 and the upper film adsorption unit 52 are moved up and down, respectively.

The upper film adsorbing part (52) adsorbs the third adhesive film body (3) such that the adhesive surface faces the carrier wafer (4). That is, the upper surface of the second protective film 1c is adhered to the lower surface of the upper film adsorbing portion 52 while adhering thereto.

The wafer receiving portion 51 and the upper film adsorbing portion 52 are operated in ascending and descending order to adhere the third adhesive film body 3 to the upper surface of the carrier wafer 4. [

The wafer bonding apparatus according to an embodiment of the present invention further includes an aligning apparatus 100 for adjusting the position of the adhesive film 1a in the chamber 40 so as to coincide with the carrier wafer 4 .

The wafer adhering apparatus according to an embodiment of the present invention further includes a carrier wafer 4 which is discharged from the chamber 40 to the outside of the chamber 40 and to which the third adhesive film body 3 is adhered, The second protective film removing device 200 removes the second protective film 1c from the second protective film 1c.

That is, the second protective film removing device 200 removes the remaining second protective film 1c from the third adhesive film body 3 adhered to the carrier wafer 4.

FIG. 2 is a perspective view showing another embodiment of the wafer bonding apparatus according to the present invention, and FIG. 3 is an enlarged perspective view showing another embodiment of the wafer bonding apparatus according to the present invention.

2 and 3, the wafer bonding apparatus according to the present invention includes the half-cutting apparatus 10, the film take-up reel member 60, the film transfer guide roll unit 61, the first film tension adjuster 70 ), The chamber 40, the first film removing device 20, the first protective film removing device 30, the film cutting position moving device 80, the line cutting device 90, And the second protective film removing device 200 may be installed in one main body housing 300.

The main body housing 300 is divided into a line partitioning wall 310 dividing the process of bonding the carrier wafer 4 into two straight lines.

The film transfer guide roll portion 61, the first film tension adjuster 70, the first film removing device 20, the second film tension adjusting device 70, The film cutting position moving device 80 and the line cutting device 90 are arranged so as to form one film cutting line 311 and the other side of the line partitioning wall 310 is divided into the chambers 40, The mobile device for entering the chamber, and the second protective film removing device 200 are arranged so as to form one film adhesion line 312.

The two linear lines divided by the line partitioning wall 310 are arranged in a straight line in the lateral direction corresponding to the linear transport direction in which the first adhesive film body 1 is transported by moving in the transverse direction in the chamber- Can be connected to each other by the third film clamping moving part 83, which will be described in more detail below.

3, the first film tension adjuster 70 is disposed on the front and rear sides of the half-cutter, and is structured such that the first adhesive film body 1 can be clamped and moved upward and downward The tension of the first adhesive film body 1 is adjusted by clamping the first adhesive film body 1 and moving it upward and downward.

The first film tension adjuster 70 includes two clamping bars which are narrowed or widened to separate the first adhesive film body 1 between the clamping bars to release the gripped state do.

4 is a perspective view showing one embodiment of the half-cutting device 10 in the wafer bonding apparatus according to the present invention. The half-cutting device 10 includes a cutter (not shown) A cutting roll portion 11 provided with a blade 11a;

And a supporting roll portion 12 disposed so as to be spaced apart from the cutting roll portion 11.

The first adhesive film body 1 passes between the cutting roll portion 11 and the receiving roll portion 12 and passes through the first adhesive film body 1 except for the second protective film 1c, Only the protective film 1b and the adhesive film 1a are cut so as to correspond to the shape of the carrier wafer 4. [

Since the shape of the carrier wafer 4 is generally a disk shape, the shape of the cutter blade 11a is also formed by a ring shape corresponding to the shape of the cutter blade 11a.

5 and 6 illustrate another embodiment of the half-cutting device in the wafer bonding apparatus according to the present invention. The half-cutting device 10 moves upward and downward, and has half cutter blades 13a (Not shown).

The half-cutting device 10 is configured to support the opposite side of the first adhesive film body 1 cut to the cutting press portion 13 so that the first press- And a cutting support portion 14 for half cutting the film body 1.

The cutting receiving portion may include a belt conveyor 14a for conveying the first adhesive film body 1 and may further include a receiving plate 14b for supporting the belt 14a of the belt conveyor.

The first adhesive film body 1 of the present invention is such that the first protective film 1b is formed on the lower side of the adhesive film 1a and the second protective film layer 1c is formed on the upper side of the adhesive film 1a The first protective film 1b and the adhesive film 1a are completely cut to correspond to the shape of the carrier wafer 4 and the second protective film 1b is completely cut in correspondence with the shape of the carrier wafer 4, 2 Half-cutting of the protective film layer 1c will be described below as an example.

The cutting roll portion 11 or the cutting pressing portion 13 is disposed below the first adhesive film body 1 so that the first protective film 1b and the adhesive film 1a are bonded to the carrier wafer 4, And the second protective film layer 1c is half-cut.

7 and 6 are enlarged views of the operation of the film cutting and position shifting device 80 in the wafer bonding apparatus according to the present invention.

 Referring to FIGS. 7 and 8, the first film clamping moving unit 81 includes a film clamping unit that moves the second adhesive film body 2 and moves up and down, The second adhesive film body 2 is clamped and moved to the cutting position, that is, the position where the adhesive film body 2 is cut by the line-cutting device 90.

The second film clamping moving part 82 includes a first upper clamping plate member 82a for covering and pressing a part of the second adhesive film body 2, And a first lower clamping plate member 82b disposed therein.

Clamping protrusions are provided at the front end and the rear end of the upper surface of the first lower clamping plate member 82b so that the second adhesive film body 2 is sandwiched between the first upper clamping plate member 82a and the clamping protrusions, Is clamped, and is unclamped.

The upper clamping plate member is formed to have a size capable of covering an area cut by the line cutting device 90. [

The second film clamping moving part 82 linearly reciprocates to move the second adhesive film body 2 to the cutting position, that is, the position where the second adhesive film body 2 is cut by the line cutting device 90, And then retracts and then clamps the portion cut from the second adhesive film body 2 to the line cutting device 90. [

The third film clamping moving unit 83 covers the portion of the second adhesive film body 2 which is cut by the line cutting device 90 which is movable horizontally and upwardly and downward A second upper clamping plate member 83a which pressurizes the second upper clamping plate member 83a; And a second lower clamping plate member 83b that is movable in the horizontal direction and disposed below the second upper clamping plate member 83a.

Clamping protrusions are provided at the front end and the rear end of the upper surface of the second lower clamping plate member 83b so that the second adhesive film body 2 is sandwiched between the second upper clamping plate member 83a and the clamping protrusions, Is clamped, and is unclamped.

A film suction unit for suctioning the third adhesive film body 3 cut by the line cutting device 90 is provided on the lower surface of the second upper clamping plate member 83a, 2 air is sucked through the plurality of air suction holes formed on the lower surface of the upper clamping plate member 83a and the third adhesive film body 3, that is, the second protective film of the third adhesive film body 3 (1c) to be adsorbed on the lower surface of the second upper clamping plate member (83a).

Referring to FIG. 9, the line cutting device moves in the width direction of the second adhesive film body 2 to cut the second adhesive film body 2 so that the wafer bonding portion is located at the center.

The line cutting device moves in the width direction of the second adhesive film body (2) in a state of being lifted and lowered so as to be movable in the width direction of the second adhesive film body (2) 2 is cut and then lowered again, and the second adhesive film body 2 is repeatedly cut at a constant size by repeatedly moving up and down after moving in a direction opposite to the moving direction at the time of cutting.

The portion cut by the second adhesive film body 2 during the cutting operation of the line cutting device is clamped between the second upper clamping plate member 83a and the second lower clamping plate member 83b, The next cutting portion of the two-adhesive film body 2 is clamped between the first upper clamping plate member 82a and the first lower clamping plate member 82b.

The second adhesive film body 2 is held between the first upper clamping plate member 82a and the first lower clamping plate member 82b and between the first upper clamping plate member 82b and the second upper clamping plate member 82b during cutting operation of the line- 83a and the second lower clamping plate member 83b and the line cutting machine moves between the second film clamping moving part 82 and the third film clamping moving part 83, The adhesive film body 2 is cut so that a stable cutting operation can be performed.

In FIG. 9, the second upper clamping plate member 83a and the second lower clamping plate member 83b are difficult to be shown by fine lines, but they are cut off from the second adhesive film during the cutting operation of the line cutting device Portion is clamped between the second upper clamping plate member 83a and the second lower clamping plate member 83b. The cutting edge of the line cutting device protrudes upward between the first lower clamping plate member 82b and the second lower clamping plate member 83b to move in the lateral direction of the second adhesive film body 2 7 shows a state in which the second upper clamping plate member 83a and the second lower clamping plate member 83b are rotated in order to confirm the cutting edge position of the line- Is shown as a fine line.

The third adhesive film body 3 cut after the cutting operation by the line cutting device is fixed in a state of being adsorbed on the lower surface of the second upper clamping plate member 83a and the second lower clamping plate member 83b, Moves in the lateral direction to expose the lower surface of the third adhesive film body 3, that is, the first protective film 1b protecting the wafer adhesion portion.

The first protective film 1b exposed from the lower portion of the third adhesive film body 3 is adhered and removed by the first protective film removing device 30.

10 and 11 are views showing an example of the first protective film removing device 30 in the wafer bonding apparatus according to the present invention. Referring to FIGS. 10 and 11, the first protective film removing device 30 A tape take-up roll portion 31 on which a film removing tape is wound, a tape take-up roll portion 31 which is spaced apart from the tape take-up roll portion 31 and is moved forward, A tape adhering portion 32 for adhering to the lower surface of the first protective film 1b exposed at the lower portion of the third adhesive film body 3 and the film removing tape unwound from the tape winding roll portion 31 A tape take-up roll portion 33 to be wound; The film removing tape is guided to the tape adhering portion 32 and passes through the tape adhering portion 32 to guide the film removing tape having the first protective film 1b attached thereto to the tape recovering roll portion 33 And a plurality of tape moving guide rollers 34 for moving the tape.

After the first protective film 1b protecting the lower adhesive surface of the third adhesive film body 3, that is, the wafer adhesive portion, is exposed, the tape adhering portion 32 is bonded to the third adhesive film body 3, And moves up and down to attach the film removing tape to the first protective film 1b.

The tape adhering portion 32 with the film removing tape attached to the first protective film 1b descends and moves back toward the tape winding roll 31. [

The film removing adhesive tape is unwound from the tape take-up roll portion 31 and is attached to the first protective film 1b while being moved along the tape movement guide roll portion to remove the first protective film 1b from the third adhesive Removed from the film body (3), and wound and wound around the tape recovery roll section (33).

The third adhesive film body 3 from which the first protective film 1b has been removed has a rectangular second protective film 1c cut by the line cutting device and a second protective film 1c cut on the lower surface of the second protective film 1c The adhesive film 1a is made of only the circularly cut adhesive film 1a corresponding to the carrier wafer 4 and the lower surface of the adhesive film 1a is in a state in which the adhesive surface is exposed while the first protective film 1b is removed .

12 and 13 are views showing an example of a chamber insertion waiting receptacle 84 in the wafer bonding apparatus according to the present invention. Referring to FIGS. 12 and 13, the chamber insertion waiting receptacle 84 includes a waiting- A plate member 84a; The carrier wafer 4 or the third adhesive film body 3 which is moved up and down on the standby plate member 84a to be lifted up on the standby plate member 84a is lifted and lowered, And a lifting and descending portion 84b for gripping in which a hole is formed.

A plurality of adsorption holes for adsorbing the third adhesive film body 3 are formed on the upper surface of the gripping ascending / descending portion 84b so that the third adhesive film body 3 is stably lifted and lowered in a state of adsorbing the third adhesive film body 3 .

The gripping ascending / descending portion 84b lifts up the carrier wafer 4 or the third adhesive film body 3 on the standby plate member 84a and lifts the carrier wafer 4 and the standby plate member 84a, or a gap is formed between the third adhesive film body 3 and the atmosphere receiving plate member 84a.

The chamber access movement portion 85 is formed at a distance between the carrier wafer 4 and the standby plate member 84a or between the third adhesive film body 3 and the standby plate member 84a, Is inserted to allow the carrier wafer 4 or the third adhesive film body 3 to be gripped or adsorbed, which will be described in more detail below.

The wafer bonding apparatus according to the present invention may further include a wafer moving device 86 for placing the carrier wafer 4 on the standby plate member 84a, It will be understood that the present invention is not limited to the above embodiments.

The carrier wafer 4 is inserted into the chamber 40 before the third adhesive film body 3 is inserted into the chamber 40 and the carrier wafer 4 is transferred to the wafer moving device 86 And is raised on the standby plate member.

14 and 15 are views showing an example of inserting the wafer into the chamber 40 in the chamber inserting stand 84 in the wafer bonding apparatus according to the present invention.

The chamber access movement part 85 is provided with a first support fork 85b and a second support fork 85c that are moved upward and downward and back and forth and are spaced apart and adsorb the third adhesive film body 3 A moving fork member 85a; And

The first and second support forks 85b and 85c are mounted on the first support fork 85b and the second support fork 85c, And includes a first wafer holding member 85d and a second wafer holding member 85e for holding the wafer 4.

The first support fork 85b and the second support fork 85c are provided with a plurality of air intake holes for sucking air so as to absorb the third adhesive film body 3, The third adhesive film body 3 is stably positioned by being positioned at a portion corresponding to each corner portion of the third adhesive film body 3.

The chamber entrance movement part 85 is provided with a first support fork 85b for sucking the third adhesive film body 3, a second support fork 85c, and a third support fork 85b by the first support fork 85b. It is possible to stably enter and exit the chamber 40 in a state in which the film body 3 is fixed and the carrier wafer 4 can be stably held in the chamber 40 by the first wafer holding member 85d and the second wafer holding member 85e It is possible to stably enter and exit the chamber 40 in a fixed state.

The carrier wafer 4 placed on the standby plate member is lifted and lowered by the lifting and lowering portion 84b.

The moving fork member 85a is inserted between the elevated carrier wafer 4 and the waiting plate member 84a and the distance between the first wafer holding member 85d and the second wafer holding member 85e The first wafer holding member 85d and the second wafer holding member 85e grip the carrier wafer 4 while being narrowed and narrowed.

The moving fork member 85a is moved upward, downward, backward, and backward to move the carrier wafer 4 held in and out of the chamber 40.

16 to 18 are views showing an example in which the wafer is primarily aligned in the chamber 40 in the wafer bonding apparatus according to the present invention. The wafer 40 is lifted and lowered in the chamber 40, and the carrier wafer 4 And a wafer position aligning portion 42 for adjusting the position of the carrier wafer 4 placed on the wafer receiving portion 51. [

The carrier lifting leg 41 is positioned higher than the wafer lifting unit 51 and the carrier wafer 4 inserted into the chamber 40 by the moving fork member 85a is seated.

The moving fork member 85a is inserted into the chamber 40 to place the carrier wafer 4 on the carrier lifting leg 41 and move to the outside of the chamber 40, Wait.

The carrier ascending / descending support portion 41 descends in a state where the carrier wafer 4 is seated, and seats the carrier wafer 4 on the wafer receiving portion 51.

In addition, the carrier lifting leg 41 may be rotated to be close to or spaced apart from the wafer receiving portion 51.

The wafer receiving portion 51 includes a wafer seating upper plate member portion 51a on which the carrier wafer 4 is seated and a wafer alignment groove 51b is formed on the outer peripheral surface of the wafer seating upper plate member portion 51a Radially spaced apart.

The wafer aligning portion 42 is inserted into one of the plurality of wafer aligning grooves 51b, and the wafer aligning groove 51b is formed on the outer side of the carrier wafer 4 A first positioning roll 42a which is in contact with the first positioning roll 42a and a second positioning roll 42b which is in contact with the first positioning roll 42a and which is rotated to insert the first positioning roll 42a into the wafer alignment groove, , A second alignment roll (42c) inserted into the other of the plurality of wafer alignment grooves (51b) and contacting the outer periphery of the carrier wafer (4), a second alignment roll And a second alignment rotary arm 42d which is provided with a two-position alignment roll 42c and is rotated to insert the second alignment roll 42c into the wafer alignment groove or to separate it from the wafer alignment groove.

The first positioning rollers 42a and the second positioning rollers 42c are respectively provided in plural numbers, and the respective alignment rolls are inserted into the wafer alignment grooves different from each other, Thereby aligning the carrier wafer 4 to the correct position.

The first positioning roll 42a and the second positioning roll 42c are inserted into the wafer alignment grooves by the forward rotation of the first alignment rotation arm 42b and the second alignment rotation arm 42d Aligns the position of the carrier wafer 4 and is released from the wafer alignment groove by the reverse rotation of the first alignment rotation arm 42b and the second alignment rotation arm 42d.

19 to 21 are views showing an example in which the third adhesive film body 3 cut into the chamber insertion waiting receptacle 84 in the wafer bonding apparatus according to the present invention is placed and then inserted into the chamber 40 19 shows a state in which the moving fork member 85a is inserted into the chamber 40 and the carrier wafer 4 is placed on the carrier lifting leg 41 and moved to the outside of the chamber 40, And stands by on the plate member.

The second upper clamping plate member 83a moves the third adhesive film body 3 on the lower surface while the moving fork member 85a is standing on the waiting receiving plate member, The adhesive film body 3 is placed on the moving fork member 85a.

The second upper clamping plate member 83a seats the third adhesive film body 3 on the moving fork member 85a, that is, on the first support fork 85b and the second support fork 85c And then returns to the original position, that is, to the upper portion of the second lower clamping plate member 83b.

The moving fork member 85a is inserted into the chamber 40 in a state in which the third adhesive film body 3 is adsorbed by the first supporting fork 85b and the second supporting fork 85c, 3 adhesive film body 3 is adsorbed on the lower surface of the upper film adsorption unit 52 and then moved to the outside of the chamber 40 so as to be able to transfer the carrier wafer 4. [

22 is a view showing an example in which the film is adsorbed to the upper film adsorption section 52 where the third adhesive film body 3 is adsorbed in the chamber 40 in the wafer adhering apparatus according to the present invention, The upper film adsorption unit 52 may be provided with a plurality of adsorption auxiliary clamping units 53 for clamping the adsorbed third adhesive film body 3.

The suction auxiliary clamping unit 53 includes a clamping operation link member 53a which is raised and lowered on the side surface of the upper film adsorption unit 52; An auxiliary clamping member (53b) rotatably coupled to a lower end of the clamping operation link member (53a) and clamping a lower surface of the third adhesive film body (3); And a clamping operation guide link member 53c one end of which is rotatably connected to the auxiliary clamping member 53b and the other end of which is rotatably connected to the upper film attracting section 52. [

The auxiliary clamping member 53b rotates around the hinge connected to the clamping operation guide link member 53c by the lifting and lowering operation of the clamping operation link member 53a and is guided to the lower surface And then the third adhesive film body 3 is clamped.

The adsorption auxiliary clamping part 53 clamps the outer circumference of the third adhesive film body 3 after the third adhesive film body 3 is adsorbed on the lower surface of the upper film adsorption part 52, The position of the third adhesive film body 3 is fixed more firmly.

23 is a view showing an example of aligning the carrier wafer 4 and the adhesive film body in the chamber 40 of the wafer bonding apparatus according to the present invention. Referring to FIG. 21, And the third adhesive film body (3) is adsorbed on the upper film adsorption unit (52), the carrier wafer (4) Is aligned with the outer circumferential surface of the adhesive film of the base material (3).

The aligning apparatus 100 is rotated to be inserted between the upper film adsorption unit 52 and the wafer receiving unit 51 or between the upper film adsorption unit 52 and the wafer receiving unit 51 A rotation arm 110 for alignment confirmation;

The outer periphery of the adhesive film (1a) of the upper third adhesive film body (3) and the outer periphery of the lower side of the carrier wafer (4) provided on the end side of the alignment confirmation rotary arm And an alignment confirmation unit 120 for confirming that the image is formed.

The alignment confirmation unit 120 is inserted between the third adhesive film body 3 and the carrier wafer 4 by the rotation of the rotary arm 110 for alignment confirmation, It is an example of an early vision device which confirms the position of the outer periphery of the adhesive film 1a of the film body 3 and confirms the position of the outer circumferential position of the carrier wafer 4 in the vertical direction on the lower side to confirm that they match.

If the outer periphery of the adhesive film 1a of the third adhesive film body 3 on the upper side and the outer periphery of the carrier wafer 4 on the lower side are not aligned in the vertical direction by the alignment confirmation unit 120, And the position of the carrier wafer 4 is adjusted by using the alignment part 42. [

That is, the first aligning roll 42a and the second aligning roll 42c are moved to the wafer aligning grooves 42a and 42b, respectively, by forward alignment of the first aligning rotary arm 42b and the second aligning rotary arm 42d, And the carrier wafer 4 is moved in a plane while being brought into contact with the outer periphery of the carrier wafer 4 so that the outer periphery of the adhesive film 1a of the third adhesive film body 3 and the outer periphery of the carrier wafer 4 4) Ensure that the outer perimeter is aligned in the vertical direction.

If it is ascertained that the outer periphery of the adhesive film 1a of the third adhesive film body 3 and the outer periphery of the carrier wafer 4 on the lower side coincide with each other in the vertical direction, The wafer receiving section 51 is raised and lowered to adhere the adhesive film 1a of the third adhesive film body 3 to the upper surface of the carrier wafer 4. [

The adhesive film 1a of the third adhesive film body 3 is pressed between the upper film attracting portion 52 and the wafer receiving portion 51 and firmly adhered to the upper surface of the carrier wafer 4. [

24 is a view showing an example of pulling out the carrier wafer 4 to which the third adhesive film body 3 is adhered in the chamber 40 of the wafer bonding apparatus according to the present invention. Referring to FIG. 22, The carrier wafer 4 to which the adhesive film body 3 is adhered is gripped by the moving fork member 85a and transported to the outside of the chamber 40 and transferred to a position where the final protective film can be removed For example.

At this time, the carrier ascending / descending support portion 41 elevates the carrier wafer 4 to form a gap between the carrier wafer 4 and the wafer receiving portion 51, The moving fork member 85a is inserted between the receiving portions 51 so that the moving fork member 85a can grasp the wafer.

25 to 27 are views showing an example in which the final protective film is removed from the carrier wafer 4 to which the third adhesive film body 3 is adhered by the wafer bonding apparatus according to the present invention, and FIGS. 23 to 25 The wafer is raised by the moving fork member 85a onto the chamber insertion waiting receptacle 84 and the chamber insertion waiting receptacle 84 is moved to the position where the second protective film removing device 200 is operated .

A film folded portion 84c is formed on one side of the chamber insertion wait receiving portion 84 to vertically move the third adhesive film body 3 to partially fold one end side of the second protective film 1c Respectively.

The second protective film removing device 200 may further include a film removing clamping unit 210 for clamping one end side of the second protective film protruded upward from the film folded portion 84c and moving forward and backward, And the clamping portion 210 for removing the film is configured to grip the second protective film through a widening operation.

The film removing clamping portion 210 holds one end side of the second protective film 1c folded by the film folded portion 84c and moves toward the other end side of the second protective film 1c,

When the second protective film 1c is removed, the carrier wafer 4 can be attracted and fixed by the gripping ascending / descending section 84b on the chamber insertion wait receiving section 84, And can be held and fixed by the first wafer holding member 85d and the second wafer holding member 85e on the first wafer holding member 85a.

The second protective film (1c) removed from the carrier wafer (4) is collected by a collection box by the film removal clamping unit (210).

28 is a process diagram showing an embodiment of a wafer bonding method according to the present invention. The wafer bonding method according to the present invention is characterized in that a first protective film 1b and a second protective film 1c A half cutting step S100 of cutting the first adhesive film body 1 with the first protective film 1b and the adhesive film 1a so as to correspond to the shape of the carrier wafer 4, Removing a portion of the adhesive film la cut in step except for a portion corresponding to the carrier wafer 4 and a portion of the first protective film 1b excluding a portion corresponding to the carrier wafer 4, A first protective film removing step (S300) for removing the remaining portion of the first protective film (1b) from the second adhesive film body (2) through the film removing step (S200) and the first film removing step, 1 The third adhesive film body 3 from which the protective film 1b has been removed and the carrier wafer 4 are inserted into the chamber 40, (S500) for positioning the adhesive film (1a) of the third adhesive film body (3) and the carrier wafer (4) on the same vertical line in the first adhesive film body (40) And a film adhering step (S600) for adhering the adhesive film (1a) of the film body (3) onto the carrier wafer (4).

The half cutting step S100 may be performed while the first adhesive film body 1 is being transported and the first protective film 1b excluding the second protective film 1c of the first adhesive film body 1, Only the adhesive film 1a is completely cut corresponding to the shape of the carrier wafer 4 and the second protective film 1c is half cut corresponding to the shape of the carrier wafer 4. [

The wafer adhering method according to an embodiment of the present invention is characterized in that the second adhesive film body 2 is sandwiched between the chamber 40 (40) and the second adhesive film body (S300) for cutting the film into a size that can be inserted into the film-forming step (S300).

The wafer bonding method according to an embodiment of the present invention includes a wafer discharging step (S700) for discharging the carrier wafer (4) to which the third adhesive film body (3) is adhered, in the chamber (40); And

And a second protective film removing step (S800) for removing the second protective film (1c) from the discharged carrier wafer (4).

29 is a schematic view showing a state change of the adhesive film body in the wafer bonding method according to the present invention, in which the first adhesive film body 1 wound on the film take-up reel member 60 is fed, And then cut into the second adhesive film body 2 and the third adhesive film body 3.

The first adhesive film body (1) becomes the second adhesive film body (2) through the first film removing step through the half cutting step, and through the first protective film removing step and the film cutting step The third adhesive film body 3 is obtained.

The second adhesive film body 2 is formed such that the second protective film 1c is kept in the first adhesive film body 1 intact and the adhesive film 1a and the first protective film 1b are held on the wafer 1, And the remaining part is removed.

The third adhesive film body 3 is cut in the film cutting step and the first protective film 1b is removed, that is, the second protective film 1c is kept completely, Only the adhesive film 1a having a shape corresponding to the carrier wafer 4 is left on the lower surface of the protective film 1c.

The present invention improves the productivity by making the step of vacuum bonding the adhesive film body with the protective film on both sides of the adhesive film (1a) to the carrier wafer (4) continuously in one line.

The present invention relates to a method for manufacturing an adhesive film (1a) by precisely cutting an adhesive film body having a protective film on both sides of the adhesive film (1a) to the size of the carrier wafer (4) Thereby improving the convenience of the bonding process and greatly reducing the defective rate of the bonding process.

It should be noted that the configuration of the linear reciprocating and rotating reciprocating operation including the up / down operation, the forward / backward operation, the rotation operation, and the like in the present invention can be variously modified and carried out by any known example will be.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is evident that many alternatives, modifications, and variations will be apparent to those skilled in the art in light of the above teachings. will be.

1: first adhesive film body 1a: adhesive film
1b: first protective film 1c: second protective film
2: second adhesive film body 3: third adhesive film body
4: carrier wafer 10: half-cutting device
20: first film removing device 21: winder
22: Film removal guide roll 23: Second film tension adjuster
30: First protective film removing device 31: Tape winding roll part
32: tape adhering part 33: tape recovering roll part
34: tape moving guide roll 40: chamber
41: carrier lifting / lowering part 42: wafer positioning part
42a: first alignment roll 42b: first alignment rotation arm
42c: second positioning roll 42d: second alignment rotation arm
50: Carrier bonding device 51: Wafer receiving part
51a: Wafer seating upper plate member 51b: Wafer alignment groove
52: upper film adsorption section 53: adsorption auxiliary clamping section
53a: clamping operation link member 53b: auxiliary clamping member
53c: Clamping operation guide link member 60: Film take-up reel member
61: Film transport guide roll 70: First film tension adjuster
80: Film cutting position moving device 81: First film clamping moving part
82: second film clamping moving part 82a: first upper clamping plate member
82b: first lower clamping plate member 83: third film clamping moving part
83a: second upper clamping plate member 83b: second lower clamping plate member
84: chamber insertion waiting receptacle 84a: waiting receptacle plate member
84b: rising and falling portion for gripping 84c:
85: chamber entrance moving part 85a: moving fork member
85b: first support fork 85c: second support fork
85d: first wafer holding member 85e: second wafer holding member
86: Wafer transfer device 90: Line cutting device
100: alignment device 110: rotating arm for alignment confirmation
120: alignment confirmation unit 200: second protective film removing device
210: clamping part for removing film 300: body housing

Claims (21)

A half cutting device for half cutting the first adhesive film body with the first protective film and the second protective film attached on both sides of the adhesive film so as to correspond to the shape of the carrier wafer;
A part of the adhesive film excluding the part corresponding to the carrier wafer and a part of the first protective film excluding the part corresponding to the carrier wafer are removed from the first adhesive film body cut half cut with the half- A first film removing device for forming a sieve;
A first protective film removing device for removing the first protective film from the second adhesive film body passed through the first film removing device to form a third adhesive film body;
A chamber in which a third adhesive film body having passed through the first protective film removing device is inserted therein and into which a carrier wafer to which the third adhesive film body is adhered is inserted; And
And a carrier bonding device provided in the chamber for bonding the adhesive film of the third adhesive film body to the carrier wafer,
Wherein the carrier bonding apparatus comprises:
A wafer receiving portion on which the carrier wafer is placed in the chamber; And
And an upper film adsorption section on the wafer support section where the third adhesive film body is adsorbed on the lower surface,
Wherein at least one of the wafer receiving portion and the upper film adsorbing portion is moved up and down,
A film take-up reel member in which the first adhesive film body is wound a plurality of times;
A film transfer guide roll unit disposed between the film take-up reel unit and the half-cutter unit to guide the first adhesive film unit to the half-cutter unit;
A film cutting position moving device for feeding the second adhesive film body to a cutting position; And a line cutting device for cutting the second adhesive film body to form a third adhesive film body; And
Further comprising: a chamber entrance / exit device for moving the third adhesive film body or the carrier wafer cut by the line cutting device into / out of the chamber. delete delete The method according to claim 1,
A first film tension adjuster for adjusting a tension of the first adhesive film body conveyed through the conveying guide roll; And
Further comprising a second protective film removing device for removing the second protective film from the carrier wafer, which is discharged from the chamber-entering mobile device to the outside of the chamber and to which the third adhesive film body is adhered, Device. The method of claim 4,
The film cutting and position moving device includes a first film clamping moving part and a second film clamping moving part which move the second adhesive film body and reciprocate linearly corresponding to the conveying direction of the second adhesive film body . The method of claim 5,
The chamber access mobile device comprises:
A third film clamping moving unit that can be disposed on the first film clamping moving unit and the second film clamping moving unit so as to be aligned with the transport direction of the second adhesive film body and movable in the lateral direction;
A chamber inserting standby portion for moving the third adhesive film body or the carrier wafer to be moved to the third film clamping moving portion;
And a chamber entrance / exit portion for entering / exiting the third adhesive film body or the carrier wafer put on the chamber insertion wait receiving portion into / from the chamber. The method of claim 4,
The film cutting apparatus according to any one of claims 1 to 3, wherein the half-cutter, the film winding reel, the film transfer guide roll, the first film tension adjuster, the chamber, the first film removing device, A line cutting device, a mobile device for entering the chamber, and the second protective film removing device are installed in one main body housing. The method according to claim 1,
The half-
A cutting roll portion having a cutter blade corresponding to a shape of the carrier wafer on an outer peripheral surface thereof; And
And a supporting roll portion which is disposed so as to be spaced apart from the cutting roll portion. The method according to claim 1,
The half-
A cutting presser moving upward and downward and having a half cutter blade on an upper surface or a lower surface thereof; And
And a cutting support portion for supporting an opposite side surface of the first adhesive film body cut to the cutting pressing portion. The method of claim 6,
Wherein the second film clamping moving unit comprises:
A first upper clamping plate member covering and pressing a part of the second adhesive film body; And a first lower clamping plate member disposed on a lower surface of the first upper clamping plate member,
Wherein the third film clamping moving unit comprises:
A second upper clamping plate member that covers and presses the portion of the second adhesive film body that is cut by the line cutting device that is movable in the horizontal direction and in the horizontal direction; And
And a second lower clamping plate member movable in a lateral direction and disposed below the second upper clamping plate member,
And a film adsorption unit capable of adsorbing the third adhesive film body is provided on a lower surface of the second upper clamping plate member. The method according to claim 1,
Wherein the first protective film removing device comprises:
A tape take-up roll portion on which a film removing tape is wound;
And the film removing tape is moved in front of, behind, up and down so as to be spaced apart from the tape take-up roll portion, so that the film removing tape is adhered to the lower portion of the first protective film exposed at the lower portion of the third adhesive film body A tape adhering portion for adhering to the surface;
A tape recovery roll portion for recovering and winding the film removing tape unwound from the tape winding roll portion;
And a plurality of tape moving guide roll portions for guiding the film removing tape to the tape adhering portion and for guiding the film removing tape having passed through the tape adhering portion and attached with the first protective film to the tape recovering roll portion . The method of claim 6,
The chamber-insert-
An atmospheric support plate member;
And a carrier wafer which is moved up and down on the standby plate member to be lifted up on the standby plate member or a rising and falling portion for purging where a plurality of adsorption holes are formed on the upper surface of the carrier wafer Wherein the wafer bonding apparatus comprises: The method of claim 6,
The chamber entrance /
A first support fork and a second support fork that are moved upward and downward, and are spaced apart from each other, and are spaced apart from each other to absorb the third adhesive film body; And
A first wafer gripping member provided on the first support fork and the second support fork and reciprocating in a lateral direction to grip the carrier wafer which is seated on the first support fork and the second support fork, Wherein the wafer holding member includes a wafer holding member. The method according to claim 1,
And a wafer position aligning unit for adjusting a position of the carrier wafer mounted on the wafer receiving unit and a carrier lifting rigid portion in which the carrier wafer is mounted on an upper portion of the chamber. . 15. The method of claim 14,
Wherein the wafer receiving portion includes a wafer seating upper plate member on which the carrier wafer is seated, and a wafer alignment groove is radially spaced from the outer circumferential surface of the seating upper plate member,
The wafer alignment unit includes:
A first positioning roll inserted into either one of the plurality of wafer alignment grooves and in contact with an outer periphery of the carrier wafer;
A first alignment rotary arm provided with the first alignment roll and rotated to insert the first alignment roll into the wafer alignment groove or to separate the wafer from the wafer alignment groove;
A second positioning roll inserted into the other of the plurality of wafer alignment grooves and in contact with the outer periphery of the carrier wafer; And
And a second alignment rotation arm provided with the second alignment roll and rotated to insert the second alignment roll into the wafer alignment groove or to separate the wafer from the wafer alignment groove. A half cutting device for half cutting the first adhesive film body with the first protective film and the second protective film attached on both sides of the adhesive film so as to correspond to the shape of the carrier wafer;
A part of the adhesive film excluding the part corresponding to the carrier wafer and a part of the first protective film excluding the part corresponding to the carrier wafer are removed from the first adhesive film body cut half cut with the half- A first film removing device for forming a sieve;
A first protective film removing device for removing the first protective film from the second adhesive film body passed through the first film removing device to form a third adhesive film body;
A chamber in which a third adhesive film body having passed through the first protective film removing device is inserted therein and into which a carrier wafer to which the third adhesive film body is adhered is inserted; And
And a carrier bonding device provided in the chamber for bonding the adhesive film of the third adhesive film body to the carrier wafer,
Wherein the carrier bonding apparatus comprises:
A wafer receiving portion on which the carrier wafer is placed in the chamber; And
And an upper film adsorption section on the wafer support section where the third adhesive film body is adsorbed on the lower surface,
Wherein at least one of the wafer receiving portion and the upper film adsorbing portion is moved up and down,
Wherein the upper film adsorption unit is provided with a plurality of adsorption auxiliary clamping units for clamping the adsorbed third adhesive film body,
The adsorption auxiliary clamping unit may include:
A clamping operation link member that is raised and lowered on a side surface of the upper film adsorption unit;
An auxiliary clamping member rotatably coupled to a lower end of the clamping operation link member on one side thereof and clamping a lower surface of the third adhesive film body; And
And a clamping operation guide link member having one end rotatably connected to the auxiliary clamping member and the other end rotatably connected to the upper film adsorption unit. The method of claim 6,
A film folding part for partially folding one end side of the second protective film in the third adhesive film body is provided on one side of the chamber insertion wait receiving part,
Wherein the second protective film removing device comprises a film removing clamping part for clamping one end side of the second protective film folded and protruded from the film folded part and moving forward and backward. delete delete delete delete
KR1020160024209A 2015-02-27 2016-02-29 Bonding appraratus for wafer and Bonding Method thereof KR101719738B1 (en)

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CN112440463A (en) * 2019-09-04 2021-03-05 志圣科技（广州）有限公司 Film cutting device and method, wafer film pasting method and film pasting machine
JP2021053798A (en) * 2019-09-04 2021-04-08 志聖工業股▲ふん▼有限公司 Film cutting device, film cutting method, wafer laminator, and wafer laminating method

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