TW201911398A - Film cutting device and film cutting method thereof - Google Patents

Abstract

A film cutting device is configured to cut a thin film which is adaptive to be adhered to a wafer, wherein the wafer has an outer edge and a notch located on the outer edge. The film cutting device includes a support, a motion module, a notch film cutter and an edge film cutter. The notch film cutter is disposed on the motion module so as to be movable close to or away from the thin film by the motion module. The notch film cutter is configured to cut the thin film to from a through hole on the thin film. The edge film cutter is disposed on the motion module so as to be movable close to or away from the thin film by the motion module. The edge film cutter is rotatable relative to the support by the motion module so as to cut the thin film.

Description

Film cutting device and film cutting method thereof

The invention relates to a film cutting device and a film cutting method thereof, in particular to a film cutting device for cutting a film attached to a surface of a wafer with a cutter and a film cutting method thereof.

In the manufacturing process of semiconductor integrated circuits and various MEMS, one of the steps is to attach a film on the wafer surface or the back side for subsequent related wafer processing. Films for attaching to a wafer include, but are not limited to, a dicing blue film, a dicing white film, a thinning protective film, a UV film, and a DAF (Die Attach Film) conductive film. In general, when the film is attached, the width of the film will be larger than the size of the wafer, so that the wafer can be completely covered. However, after the film is attached to the wafer, if the film is not adhered to the surface of the wafer or the film is too large, there is a gap between the edge of the wafer and the film, so that the subsequent wafer is thinned (thinned). During the process, the waste water with wafer debris will flow into the gap due to the pushing of the lateral force, which will damage the surface of the wafer. Therefore, after the attachment is completed, a portion of the film at the edge of the wafer is removed to cut the film to a width corresponding to the diameter of the wafer, thereby contributing to the film being less likely to fall off the wafer surface.

For the cutting method of the film attached to the wafer, a laser cutting film or a knife cutting film can be used at present. Compared with the cutting film of the tool, the laser light will produce high temperature when the film is cut, which causes the edge of the film to be easily deformed by heat and even has scorch marks. Although the cutter film can avoid high temperature, the 8 inch, 12 inch and 16 inch wafers widely used in the industry have grooves (Notch), and the cutter is difficult to bend when cutting the film to cut the film into corresponding concave. The shape of the groove causes the groove of the wafer to remain covered by the film after cutting. Therefore, in the subsequent wafer processing steps, the positioning accuracy of the wafer edge is affected because the position of the groove cannot be clearly confirmed.

Therefore, how to improve the cutting mode of the cutting film to avoid the groove of the wafer being covered by the incompletely cut film is one of the problems that researchers in the field need to solve.

In view of the above problems, the present invention discloses a film cutting device and a film cutting method, which contribute to solving the problem that a wafer groove can be covered by a film that is incompletely cut.

The slitting device disclosed in the present invention is used for cutting a film suitable for being applied to a wafer, wherein the wafer has an outer edge and a groove at the outer edge. The slitting device comprises a carrier, a movement module, a groove cutter and an outer edge cutter. The motion module is disposed on the carrier. The groove cutter is disposed on the motion module, so that the motion module can drive the groove cutter to move closer to or away from the film than the carrier. The groove cutter cuts the film to form a hole in the film. The outer edge cutter is disposed on the motion module, so that the motion module can drive the outer edge cutter to move closer to or away from the film than the groove cutter. The motion module can also drive the outer edge cutter to rotate relative to the carrier to cut the film.

The slitting method disclosed in the present invention is for cutting a film suitable for being applied to a wafer, wherein the wafer has an outer edge and a groove at the outer edge. The film cutting method comprises the following steps: a hole cutter is used to drive a groove cutter to perform a hole forming process, so that the groove cutter cuts the film to form a hole in the film; and the movement module drives a hole The outer edge cutter performs a positioning process for the outer edge cutter to pass through the hole; and the outer edge cutter is driven by the motion module to perform a film cutting process to cut the outer edge cutter relative to the film. film.

A slitting device according to the present invention is for cutting a film suitable for being applied to a wafer, wherein the wafer has an outer edge and a groove at the outer edge. The slitting device comprises a carrier, a groove cutter and an outer edge cutter. The groove cutter is used to move relative to the carrier to cut the film to form a hole in the film. The outer edge cutter is adapted to move relative to the carrier to pass through the hole and to cut the film relative to the film movement.

According to the film cutting device and the film cutting method disclosed in the present invention, the motion module of the film cutting device can move the groove cutter relative to the carrier to cut the film, and form a hole corresponding to the groove of the wafer in the film. Then, the motion module drives the outer edge cutter to move relative to the carrier to pass through the hole and move relative to the film, and the film can be cut along the outer edge of the wafer. Thereby, the slitting device uses two independent cutters (groove cutter and outer edge cutter) to respectively cut the film, and the groove cutter can cut the film into a hole corresponding to the shape of the groove, thereby preventing the groove The film is covered by an incompletely cut film so that the wafer can be positioned by confirming the position of the groove in subsequent processing steps.

The above description of the disclosure and the following description of the embodiments of the present invention are intended to illustrate and explain the spirit and principles of the invention, and to provide further explanation of the scope of the invention.

The detailed features and advantages of the present invention are set forth in the Detailed Description of the Detailed Description of the <RTIgt; </ RTI> <RTIgt; </ RTI> </ RTI> </ RTI> <RTIgt; The objects and advantages associated with the present invention can be readily understood by those skilled in the art. The following examples are intended to describe the present invention in further detail, but are not intended to limit the scope of the invention.

Please refer to FIG. 1 to FIG. 2 at the same time. 1 is a perspective view of a slit filming apparatus according to an embodiment of the present invention. 2 is an exploded perspective view of the film cutting device of FIG. 1. In the present embodiment, the film cutting device 1 includes a carrier 10, a motion module 20, a groove cutter 30, and an outer edge cutter 40. The film cutting device 1 can be mounted on a film coater (please refer to FIG. 6 first), and the film attached to the wafer can be cut.

The carrier 10 is, for example but not limited to, a metal shell member that can be disposed on a lifting mechanism of the film applicator. The carrier 10 has a metal plate, and the metal plate has a mounting surface 110.

The motion module 20 includes a rotating shaft member 210, a first linear motion element 220, a second linear motion element 230, and a third linear motion element 240. The rotating shaft member 210 is, for example but not limited to, a rotating shaft of a direct current motor, and the first linear moving element 220, the second linear moving element 230, and the third linear moving element 240 are, for example but not limited to, cylinders. The rotating shaft member 210 is disposed on the carrier 10, and the mounting surface 110 of the carrier 10 faces the rotating shaft member 210. The rotating shaft member 210 can rotate relative to the carrier 10 with its own axis as a center of rotation. The first linear motion element 220 is disposed on the mounting surface 110 and movable relative to the carrier 10. The second linear motion element 230 is disposed on the rotating shaft member 210 and is movable relative to the rotating shaft member 210. The third linear motion element 240 is disposed to the second linear motion element 230 and is movable relative to the second linear motion element 230.

In this embodiment, the rotating shaft member 210, the first linear motion element 220, the second linear motion element 230, and the third linear motion element 240 are independent of each other, that is, the elements have different power sources without interlocking Relationship, but the invention is not limited thereto. In other embodiments, the first linear motion element and the second linear motion element may be integrated into the same DC motor to create a linked relationship such that the first linear motion element can move the second linear motion element downward when moving upward. ,vice versa.

Please refer to FIG. 3 and FIG. 4 together. 3 is a perspective view of the groove cutter of the slitting device of FIG. 2. 4 is a perspective view of the outer edge cutter of the slitting device of FIG. 2.

The groove cutter 30 is movably disposed on the first linear motion element 220 of the motion module 20. The groove cutter 30 has a cutting edge 310, and the shape of the cutting edge 310 matches the shape of the groove of the wafer. In the present embodiment, the cutting edge 310 of the groove cutter 30 is approximately U-shaped. The outer edge cutter 40 is disposed on the third linear motion element 240 of the motion module 20, and the outer edge cutter 40 includes an associated two-knife body 410. The second cutter body 410 has all the blades 411, respectively, and the two cutting edges 411 are respectively located on opposite sides of the outer edge cutter 40. The second cutting edges 411 extend to intersect to form a cutting edge 420 of the outer edge cutter 40. The third linear motion element 240 is movable relative to the second linear motion element 230 to adjust the position of the rim cutter 40. In the present embodiment, the two-pole body 410 of the outer edge cutter 40 is integrally formed. In other embodiments, the two bodies 410 are connected together by assembly.

In the present embodiment, the groove cutter 30 is movable relative to the first linear motion element 220 in an adjustment direction D1 to adjust the position of the groove cutter 30, but the invention is not limited thereto. In other embodiments, the groove cutter can be fixed to the first linear motion element and cannot move relative to each other. In addition, in this embodiment, the groove cutter 30 can be manually moved in the adjustment direction D1, but the invention is not limited thereto. In other embodiments, the first linear motion of the groove cutter can be provided. A fourth linear motion element (such as a cylinder) is additionally disposed on the component, and the groove cutter can be moved in the adjustment direction by mechanical motion.

5 is a schematic perspective view of the film cutting device of FIG. 1 mounted on a film laminating machine, wherein the film laminating machine 2 includes an adsorption stage 21 and at least one rolling wheel 22. The adsorption stage 21 is for placing a wafer, and the rolling wheel 22 is for attaching a film. When the film is applied, the wafer is first placed on the adsorption stage 21, and the rolling wheel 22 performs operations such as pressing and attaching the film, thereby completing the process of attaching the film to the surface of the wafer.

6 is a schematic view of the wafer carrier of FIG. 5 carrying a wafer. 7 is a schematic view of the film applicator of FIG. 6 attaching a film to a wafer. In the present embodiment, before the film is cut, a wafer 3 is placed on the adsorption stage 21 of the film laminating machine 2, and the film 4 is attached to the surface of the wafer 3. The wafer 3 has a groove 31 and an outer edge 32 that are contoured to have a substantially U shape. The groove 31 has a side edge 31a, and the size of the groove cutter 30 is slightly smaller than the size of the groove 31. The film 4 has a cutting path 41 corresponding to the groove 31 and a cutting path 42 corresponding to the outer edge 32. It should be noted that the cutting path 41 and the cutting path 42 in this embodiment are all imaginary reference lines for facilitating the subsequent description of the method of cutting the film 4. In addition, the wafer 3 of the present embodiment has a U-shaped groove 31, and the groove cutter 30 has a matching U-shaped cutting edge 310, but the shape of the groove 31 and the cutting edge 310 are not intended to limit the present invention.

A method of cutting a film by the slit film device 1 will be described below. Please refer to FIG. 8 to FIG. 17 as well. FIG. 8 is a schematic flow chart of a film cutting method according to a first embodiment of the present invention. FIG. 9 is a schematic flow chart showing a process of forming a hole in the film cutting method of FIG. 8. FIG. FIG. 10 is a schematic flow chart of a positioning procedure in the slit film method of FIG. 8. FIG. FIG. 11 is a schematic flow chart of a film cutting process in the film cutting method of FIG. 8. FIG. 12 to 17 are schematic views of the film cutting device of Fig. 7 cutting the film.

As shown in FIG. 8, the film cutting method of this embodiment includes steps S1 to S3. First, step S1 is performed, and the groove cutter 30 is driven by the motion module 20 of the slitting device 1 to perform a hole forming process, so that the groove cutter 30 cuts the film 4, and a broken hole 43 is formed in the film 4. . In detail, as shown in FIG. 9, step S1 of the present embodiment includes steps S11 to S12.

Step S11 is that the first linear motion element 220 of the motion module 20 moves relative to the carrier 10 along a groove falling direction D2 to drive the groove cutter 30 to approach the film 4, thereby causing the film cutting device 1 to be in a groove. Cropping status. As shown in FIGS. 12 and 13, in the state in which the groove is cut, the cutting edge 310 of the groove cutter 30 cuts the cutting path 41 of the film 4, and the cutting edge 310 is spaced apart from the side edge 31a of the groove 31. Step S12: After the groove cutter 30 cuts the film 4, the first linear motion element 220 moves in the opposite direction of the groove lower knife direction D2, and drives the groove cutter 30 away from the film 4. As shown in Figs. 13 and 14, by the cutting of the groove cutter 30 in step S11, the film 4 forms a hole 43 which matches the contour of the cutting path 41. In the present embodiment, the groove lower knife direction D2 is parallel to an axis A of the rotating shaft member 210, and the groove lower knife direction D2 is orthogonal to the adjustment direction D1. In other embodiments, the groove lower knife direction is non-orthogonal and also non-parallel to the adjustment direction.

Referring to FIG. 8, after step S1 is completed, step S2 is performed to drive the outer edge cutter 40 to perform a positioning process by the motion module 20 so that the outer edge cutter 40 passes through the hole 43. In detail, as shown in FIG. 10, step S2 of the present embodiment includes steps S21 to S22.

In step S21, the outer edge cutter 40 is moved along the outer edge lower cutting direction D3 to approach the film 4 by the second linear motion element 230 of the motion module 20, so that the blade edge 420 passes through the hole 43. As shown in FIGS. 15 and 16, when the cutting edge 420 of the outer edge cutter 40 passes through the breaking hole 43, the third linear motion member 240 drives the outer edge cutter 40 in a direction away from the side edge 31a of the groove 31. The movement is such that the two cutting edges 411 of the rim cutter 40 are spaced from the outer edge 32 of the wafer 3.

As shown in FIG. 17, step S22 is performed by the third linear motion element 240 of the motion module 20 to move the outer edge cutter 40 along an outer edge bearing direction D4 to approach the outer edge 32 of the wafer 3 to make the outer edge The two cutting edges 411 of the cutter 40 abut against the outer edge 32, thereby causing the slitting device 1 to be in an outer edge cutting state. The cutting edge 411 of the outer edge cutter 40 is located on the cutting path 42 of the film 4 in the outer edge cutting state. In the present embodiment, the outer edge lower cutting direction D3 is not parallel to the outer edge bearing direction D4, and the outer edge lowering direction D3 has a certain inclination angle (referred to as a slitting blade angle) between the surfaces of the wafer 3.

Referring to FIG. 8 again, after step S2 is completed, step S3 is performed, and the outer edge cutter 40 is driven by the motion module 20 to perform a film cutting process to move the outer edge cutter 40 to cut the film 4. In detail, as shown in FIG. 11, step S3 of the present embodiment includes steps S31 to S32. Step S31 is that the rotating shaft member 210 of the motion module 20 drives the outer edge cutter 40, the second linear motion element 230 and the third linear motion element 240 to rotate relative to the carrier 10, and the outer edge cutter 40 is cut along the cutting edge 40. The cutting path 42 cuts the film 4. In step S32, the second linear motion element 230 of the motion module 20 moves in the opposite direction of the outer edge falling direction D3, and drives the outer edge cutter 40 away from the film 4. After completing step S3, the film 4 is cut into a shape that matches the contour of the wafer 3.

According to the slitting apparatus 1 and the slitting method of the present embodiment, the film 4 is cut by the groove cutter 30 and the outer edge cutter 40 which are movable independently of each other. The motion module 20 of the slitting device 1 can move the groove cutter 30 relative to the carrier 10 to cut the film 4, and the film 4 forms a hole 43 corresponding to the groove 31 of the wafer 3. The motion module 20 can also drive the outer edge cutter 40 to move relative to the carrier 10 to pass through the hole 43 and move relative to the film 4, and cut the film 4 along the outer edge 32 of the wafer 3. Thereby, since the groove cutter 30 can cut the film 4 into the hole 43 corresponding to the shape of the groove 31, the groove 31 can be prevented from being covered by the film 4 which is incompletely cut, so that the wafer 3 is subsequently The positioning can be performed by confirming the position of the groove 31 in the process step.

In the existing process of cutting a film with a tool, the tool is excessively close to the wafer and there is a risk of scratching the outer edge of the wafer. In order to avoid the above situation, in the present embodiment, the shape of the groove cutter 30 matches the shape of the groove 31 of the wafer 3, and the size of the groove cutter 30 is smaller than the size of the groove 31. When the slitting device 1 is in the groove cutting state, the cutting edge 310 of the groove cutter 30 is spaced apart from the side edge 31a of the groove 31. Thereby, when the groove cutter 30 cuts the film 4 into the hole 43, the cutting edge 310 can be prevented from contacting the side edge 31a to scratch the wafer 3, and the wafer 3 can be prevented from interfering with the groove cutter. 30 moves. The spacing between the cutting edge 310 and the side edge 31a is a very small distance, which does not cause the cut film 4 to cover the groove 31 and affect the positioning of the subsequent wafer 3.

In addition, in the embodiment, the second linear motion element 230 of the motion module 20 can drive the outer edge cutter 40 and the third linear motion element 240 to move along the outer edge falling direction D3 to approach the film 4, and the third linearity. The moving element 240 can drive the rim cutter 40 to move along the outer edge bearing direction D4 to approach the outer edge 32 of the wafer 3. When the outer edge cutter 40 passes through the hole 43, the third linear motion element 240 causes the outer edge cutter 40 to move in a direction away from the side edge 31a of the groove 31, so that the second edge of the outer edge cutter 40 411 is spaced from the outer edge 32 of the wafer 3. Next, the third linear motion element 240 again drives the outer edge cutter 40 to move so that the cutting edge 411 of the outer edge cutter 40 abuts against the outer edge 32. Thereby, it is helpful to prevent the outer edge cutter 40 from hitting the outer edge 32 when the perforating hole 40 passes through the hole 43 and scratching the wafer 3, and also preventing the wafer 3 from interfering with the movement of the outer edge cutter 40.

In addition, in the present embodiment, the first linear motion element 220 of the motion module 20 and the second linear motion element 230 are independent of each other, so that the motion of the first linear motion element 220 and the movement of the second linear motion element 230 are mutually There is no linkage between them. When the hole forming process of step S1 is performed, the first linear motion element 220 drives the groove cutter 30 to move while the second linear motion element 230 and the outer edge cutter 40 stop moving, and when the positioning procedure of step S2 is performed And in the film cutting process of step S3, the second linear motion element 230 causes the outer edge cutter 40 to move while the first linear motion element 220 and the groove cutter 30 stop moving. Thereby, it is helpful to precisely control the position and the moving path of the groove cutter 30 and the outer edge cutter 40 to improve the yield of the cut film 4.

Furthermore, the groove cutter 30 and the outer edge cutter 40 of the present embodiment are detachably disposed on the first linear motion element 220 and the third linear motion element 240, respectively. Thereby, the design of the detachable cutter helps the user to easily replace the groove cutter 30 and the outer edge cutter 40.

In the present embodiment, after the film 4 is attached to the wafer 3, the film cutting device 1 cuts the film 4, but the invention is not limited thereto. In other embodiments, a visual inspection positioning system (eg, a three-point positioning system) can be used to first detect the size and outer contour of the wafer carried on the adsorption stage, and output detection information to the slitting device. The slitting device drives the groove cutter and the outer edge cutter to cut the film according to the detection information, and then attaches the cut film to the wafer.

In summary, in the slitting device and the slitting method disclosed in the present invention, two independent cutters (groove cutter and outer edge cutter) are used to respectively cut the film. The motion module of the slitting device can drive the groove cutter to move relative to the carrier to cut the film, and form a hole in the film corresponding to the groove of the wafer. Then, the motion module drives the outer edge cutter to move relative to the carrier to pass through the hole and move relative to the film, and the film can be cut along the outer edge of the wafer. Thereby, since the groove cutter can cut the film into the hole corresponding to the shape of the groove, the groove can be prevented from being covered by the film which is incompletely cut, so that the wafer can be confirmed in the subsequent process steps. The position of the groove is positioned.

Although the present invention has been disclosed above in the foregoing embodiments, these embodiments are not intended to limit the invention. It is within the scope of the invention to be modified and modified without departing from the spirit and scope of the invention. Please refer to the attached patent application for the scope of protection defined by the present invention.

1‧‧‧Cutting device

2‧‧‧film machine

3‧‧‧ wafer

4‧‧‧film

21‧‧‧Adsorption platform

22‧‧‧Rolling wheel

31‧‧‧ Groove

31a‧‧‧lateral edge

32‧‧‧ outer edge

41, 42‧‧‧ cutting path

43‧‧‧ hole

10‧‧‧Hosting

110‧‧‧Installation

20‧‧‧Sports module

210‧‧‧Rotary shaft parts

220‧‧‧First linear motion element

230‧‧‧Second linear motion element

240‧‧‧ Third linear motion element

30‧‧‧ Groove cutter

310‧‧‧ cutting edge

40‧‧‧Edge cutter

410‧‧‧Knife body

411‧‧‧ cutting edge

420‧‧‧Tool tip

430‧‧‧ convex side

440‧‧‧ concave side

A‧‧‧Axis

D1‧‧‧Adjustment direction

D2‧‧‧ Groove down direction

D3‧‧‧ outer edge cutting direction

D4‧‧‧ outer edge bearing direction

S1, S2, S3‧‧‧ steps

S11, S12‧‧‧ steps

S21, S22‧‧‧ steps

S31, S32‧‧‧ steps

1 is a perspective view of a slit filming apparatus according to an embodiment of the present invention. 2 is an exploded perspective view of the film cutting device of FIG. 1. 3 is a perspective view of the groove cutter of the slitting device of FIG. 2. 4 is a perspective view of the outer edge cutter of the slitting device of FIG. 2. Fig. 5 is a perspective view showing the film cutting device of Fig. 1 mounted on a film laminator; 6 is a schematic view of the wafer carrier of FIG. 5 carrying a wafer. 7 is a schematic view of the film applicator of FIG. 6 attaching a film to a wafer. FIG. 8 is a schematic flow chart of a film cutting method according to a first embodiment of the present invention. FIG. 9 is a schematic flow chart showing a process of forming a hole in the film cutting method of FIG. 8. FIG. FIG. 10 is a schematic flow chart of a positioning procedure in the slit film method of FIG. 8. FIG. FIG. 11 is a schematic flow chart of a film cutting process in the film cutting method of FIG. 8. FIG. 12 to 17 are schematic views of the film cutting device of Fig. 7 cutting the film.

Claims (15)

A film cutting device for cutting a film suitable for being applied to a wafer, the wafer having an outer edge and a groove at the outer edge, the film cutting device comprising: a carrier; a movement a module disposed on the carrier; a groove cutter disposed on the motion module, the motion module driving the groove cutter to move closer to or away from the film relative to the carrier, and the groove is cut The knife can cut the film to form a hole in the film; and an outer edge cutter is disposed on the motion module, the motion module can drive the outer edge cutter to move closer to or away from the groove cutter In the film, the motion module can drive the outer edge cutter to rotate relative to the carrier, and the outer edge cutter can cut the film. The film cutting device of claim 1, wherein the motion module comprises a first linear motion component, a second linear motion component and a rotating shaft component independent of each other, the first linear motion component And the rotating shaft member is disposed on the bearing seat, the second linear motion element is disposed on the rotating shaft member, the groove cutter is disposed on the first linear motion element, and the outer edge cutter is disposed on the second Linear motion element. The film cutting device of claim 2, wherein the carrier has a mounting surface facing the rotating shaft member, and the first linear motion element is disposed on the mounting surface. The film cutting device of claim 2, wherein the motion module further comprises a third linear motion element disposed on the second linear motion element, the outer edge cutter being disposed on the third linear motion element The second linear motion element can move the outer edge cutter and the third linear motion element to move toward or away from the film in an outer edge lower knife direction, and the third linear motion element can move relative to the second linear motion The element moves in an outer rim bearing direction that is non-parallel to the outer rim. The film cutting device of claim 2, wherein the first linear motion element drives the groove cutter to move in a direction of the lower knife of the groove to approach or away from the film, and the groove cutter The first linear motion element is movable relative to an adjustment direction that is non-parallel to the direction of the lower blade of the groove. The film cutting device of claim 5, wherein the motion module further comprises a fourth linear motion element disposed on the first linear motion element, the groove cutter being disposed on the fourth linear motion And the fourth linear motion element can drive the groove cutter to move in the adjustment direction. The film cutting device of claim 5, wherein the groove lower knife direction is parallel to the axis of the rotating shaft member. The film cutting device of claim 1, wherein the shape of the groove cutter matches the shape of the groove of the wafer, and the size of the groove cutter is smaller than the size of the groove. The film cutting device of claim 8, wherein the film cutting device has a groove cutting state and an outer edge cutting state, and the groove cutter cuts the groove when the groove is cut. The film forms the hole in the film, and when the outer edge is cut, the outer edge cutter passes through the hole and can be cut relative to the film to cut the film, the groove cutter has a matching a cutting edge of the side edge of the groove, the cutting edge being spaced from the side edge of the groove when the groove is cut. A film cutting method for cutting a film suitable for being applied to a wafer, the wafer having an outer edge and a groove at the outer edge, the film cutting method comprising: using a motion module Driving a groove cutter to perform a hole forming process, so that the groove cutter cuts the film to form a hole in the film; and the movement module drives an outer edge cutter to perform a positioning process, The outer edge cutter is passed through the hole; and the outer edge cutter is driven by the motion module to perform a film cutting process to move the outer edge cutter relative to the film to cut the film. The film cutting method of claim 10, wherein the motion module comprises a first linear motion component and a second linear motion component that are independent of each other, and the first linear motion component drives the groove to cut. The knife performs the hole forming process, and the second linear motion element drives the outer edge cutter to perform the positioning process. The film cutting method of claim 11, wherein the motion module further comprises a rotating shaft member, and the rotating shaft member drives the outer edge cutter to perform the film cutting process. The film cutting method according to claim 10, wherein the outer edge cutter stops moving when the hole forming process is performed, and the groove cutter stops moving when the film cutting process is performed. The method of cutting a film according to claim 10, wherein the positioning program comprises: driving a tip of the outer edge cutter through the hole through the motion module, and making the outer edge of the cutter The edge is spaced from the outer edge of the wafer; and the outer edge cutter moves the wafer by the motion module to abut the cutting edge of the outer edge cutter against the outer edge. A film cutting device for cutting a film suitable for being applied to a wafer, the wafer having an outer edge and a groove at the outer edge, the film cutting device comprising: a carrier; a concave a slot cutter for moving relative to the carrier to cut the film to form a hole in the film; and an outer edge cutter for moving relative to the carrier to pass through the hole and move relative to the film And the film is cut.