CN203141994U - Wafer laminating equipment and film-drawing cutting mechanism thereof - Google Patents
Wafer laminating equipment and film-drawing cutting mechanism thereof Download PDFInfo
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- CN203141994U CN203141994U CN 201320111937 CN201320111937U CN203141994U CN 203141994 U CN203141994 U CN 203141994U CN 201320111937 CN201320111937 CN 201320111937 CN 201320111937 U CN201320111937 U CN 201320111937U CN 203141994 U CN203141994 U CN 203141994U
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- cutting mechanism
- adsorption zone
- membrane
- mucous membrane
- film sticking
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Abstract
The utility model provides wafer laminating equipment and a film-drawing cutting mechanism thereof. The wafer laminating equipment is used for an adhesive film, and the film-drawing cutting mechanism comprises an adsorption area and a movable tool, wherein the adsorption area comprises a fixed adsorption area and a movable adsorption area which reciprocates relative to one side of the fixed adsorption area; the movable tool is arranged corresponding to the adsorption area; the adhesive film is adsorbed in the adsorption area; the movable adsorption area moves towards the direction which is far away from the fixed adsorption area; the movable tool can cut and separate the adhesive film, so that the separated adhesive film is adsorbed in the adsorption area. Therefore, the movable adsorption area moves towards the direction which is far away from the fixed adsorption area, so that a tension is given to the adhesive film, and the adhesive film is flattened; and moreover, the subsequent wafer is attached to the adhesive film, and the manufacture procedure or detection of the wafer is stable.
Description
Technical field
The utility model refers to a kind of wafer film sticking equipment and membrane cutting mechanism thereof especially about a kind of film sticking equipment.
Background technology
Cut at present the board of glued membrane on the market, all can utilize one or more cutter will place glued membrane on the support plate and cut and be a plurality of separation glued membranes, and the follow-up framework gluing of confession.
Yet, place glued membrane on the support plate if out-of-flatness, follow-up during with the framework gluing, the glued membrane that sticks on framework also can produce out-of-flatness, and influence the situation of pasting of subsequent wafer, and severe patient causes processing procedure or the detection generation problem of wafer.
The utility model content
The purpose of this utility model is to provide a kind of wafer film sticking equipment and membrane cutting mechanism thereof, it utilizes the mobile adsorption zone can be towards moving away from the fixing direction of adsorption zone, to give mucous membrane one pulling force, make mucous membrane smooth, and convenient subsequent wafer sticks in mucous membrane, makes the processing procedure of wafer or detection more stable.
The utility model provides a kind of membrane cutting mechanism of wafer film sticking equipment, is used for a mucous membrane, and this membrane cutting mechanism comprises:
One adsorption zone comprises a fixing adsorption zone and move adsorption zone to what fixing adsorption zone one side moved back and forth; And
One moves cutter, to should the adsorption zone setting.
Further, fixedly adsorption zone has an orthogonal first side and a second side, the draw direction of this first side and described mucous membrane is vertical setting, this moves cutter to arranging and can move back and forth along a direction in the first side, and this moves adsorption zone to arranging the second side.
Further, this membrane cutting mechanism also comprises an additional circuit boards, an arm-tie and connection and drives the arm-tie driver that relative this additional circuit boards of this arm-tie moves back and forth, be formed with this fixedly adsorption zone on this additional circuit boards, be formed with this on this arm-tie and move adsorption zone.
Further, this additional circuit boards is provided with a groove inwardly from side, and this arm-tie is placed in this groove.
Further, this additional circuit boards both sides of this groove relatively forms two edges, and each edge strip increases thickness outwardly gradually from the inside of this additional circuit boards.
Further, this additional circuit boards is provided with a recess inwardly from side.
Further, this membrane cutting mechanism also comprises a movable press mold assembly, and this activity press mold assembly comprises a press mold spare and connection and drives this press mold spare and is active in this fixedly press mold mobilizer of adsorption zone.
Further, this additional circuit boards has a slide rail, and this moves the set of knives that cutter comprises a slider and is fixed on this slider, and this slider is slidably connected to this slide rail.
The utility model provides a kind of wafer film sticking equipment, comprising:
One cuts transmission device, comprises the membrane cutting mechanism of a continuous tape loop actuation mechanism and described wafer film sticking equipment, and this continuous tape loop actuation mechanism connects and drives this membrane cutting mechanism along path circulation movement;
One film rolling device, to arranging by the membrane cutting mechanism, this film rolling device comprises for the sheathed fixed axis of mucous membrane, and the direction towards adsorption zone stretches described mucous membrane from this fixed axis; And
One framework, the corresponding described mucous membrane gluing that separates.
Further, comprise that also lower frame zone and moves mechanism, be adsorbed with this adsorption zone that separates described mucous membrane and be arranged in this lower frame zone, this moves the top that mechanism is arranged on this lower frame zone, and this is moved mechanism and can be displaced in this lower frame zone, this moves the adsorption piece that mechanism comprises a shifter and connects this shifter, and this adsorption piece can adsorb this framework and suppress this framework and the mutual gluing of described mucous membrane that separates.
The utlity model has following advantage:
When the first, mucous membrane is adsorbed on adsorption zone, mobile adsorption zone can be towards moving away from the fixing direction of adsorption zone, giving mucous membrane one pulling force, and then draws leveling to put in order mucous membrane, making pasting of follow-up framework and wafer mucous membrane more smooth closely, and make the processing procedure of wafer or detect more stable.
The second, each fixedly adsorption zone have orthogonal first side and second side, the draw direction of first side and mucous membrane is vertical and sets, the corresponding second side configuration of mobile adsorption zone, when making each membrane cutting mechanism mobile along path circulation, fixedly adsorption zone gives mucous membrane always to pulling force, and mobile adsorption zone gives mucous membrane one lateral pull again towards moving away from the fixing direction of adsorption zone simultaneously, allow mucous membrane be subjected to vertical two to pulling force flatten, and then strengthen the planarization of the mucous membrane on the adsorption zone.
Three, the both sides of the relative groove of each additional circuit boards form edge strip, each edge strip increases thickness outwardly gradually from the inside of additional circuit boards, and then the structural strength of lifting edge strip, make when moving mechanism's press frame with the mutual gluing of mucous membrane that separates, edge strip is difficult for stress deformation, reaches the membrane cutting mechanism and has structural stability well.
Four, each additional circuit boards is provided with recess inwardly from side, thereby can wear recess for the mobile cutter of adjacent membrane cutting mechanism, reducing the spacing between each membrane cutting mechanism, and then allows the volume-diminished of wafer film sticking equipment.
Five, the membrane cutting mechanism also comprises movable press mold assembly, movable press mold assembly comprises press mold spare and connection and drive press mold spare and is active in the fixedly press mold mobilizer of adsorption zone, when making mucous membrane be adsorbed adsorption zone, press mold spare can be suppressed mucous membrane, avoid mucous membrane to affect perk because being subjected to mobile cutter, make pasting of follow-up framework and wafer mucous membrane more smooth closely.
Six, mobile cutter moves back and forth along a direction, and the displacement of mobile cutter is greater than the width of mucous membrane, make the directly disconnected mucous membrane of single solution for diverse problems of mobile cutter, this disconnected direction of imposing uniformity without examining individual cases is not limited with present embodiment, and visual actual conditions are adjusted, allow the rectangular shape of external form or the square shape of the mucous membrane cooperation itself that separates, but not form via mobile cutter following process, so there is not the generation of waste material, to reach efficent use of resources and cost-effective characteristics.
Description of drawings
Fig. 1: the schematic perspective view of the utility model film sticking equipment.
Fig. 2: the vertical view of the utility model film sticking equipment.
Fig. 3: the utility model cuts the schematic perspective view of transmission device.
Fig. 4: the utility model cuts the vertical view of transmission device.
Fig. 5: first of the utility model film sticking equipment uses view.
Fig. 6: second of the utility model film sticking equipment uses view.
Fig. 7: the 3rd of the utility model film sticking equipment uses view.
Fig. 8: the utility model cuts first of transmission device and uses view.
Fig. 9: the utility model cuts second of transmission device and uses view.
Figure 10: the utility model cuts the 3rd of transmission device and uses view.
Figure 11: the utility model cuts the 4th of transmission device and uses view.
Figure 12: the 4th of the utility model film sticking equipment uses view.
Among the figure:
100 ... mucous membrane;
10 ... film sticking equipment;
1 ... cut transmission device;
11 ... continuous tape loop actuation mechanism;
12 ... the membrane cutting mechanism;
13 ... adsorption zone;
131 ... fixing adsorption zone;
1311 ... the first side;
1312 ... the second side;
132 ... mobile adsorption zone;
14 ... mobile cutter;
141 ... slider;
142 ... set of knives;
15 ... additional circuit boards;
151 ... groove;
152 ... edge strip;
153 ... recess;
154 ... slide rail;
16 ... arm-tie;
17 ... the arm-tie driver;
18 ... movable press mold assembly;
181 ... press mold spare;
182 ... the press mold mobilizer;
2 ... film rolling device;
21 ... fixed axis;
3 ... framework;
4 ... the lower frame zone;
5 ... move mechanism;
51 ... shifter;
52 ... adsorption piece.
The specific embodiment
The utility model is described in further detail below in conjunction with the drawings and specific embodiments, do and can be implemented so that those skilled in the art can better understand the utility model, but illustrated embodiment is not as the restriction that the utility model is done.
Please extremely shown in Figure 12 as Fig. 1, the utility model provides a kind of wafer film sticking equipment and membrane cutting mechanism thereof, is used for a mucous membrane 100, and this wafer film sticking equipment 10 comprises that mainly one cuts transmission device 1, a film rolling device 2 and a framework 3; Membrane cutting mechanism 12 comprises that an adsorption zone 13 and moves cutter 14.
Cut transmission device 1 and comprise continuous tape loop actuation mechanism 11 and at least two membrane cutting mechanisms 12, tape loop actuation mechanism 11 connects and drives each membrane cutting mechanism 12 along path circulation movement continuously, each membrane cutting mechanism 12 comprises one of an adsorption zone 13 and corresponding adsorption zone 13 configurations and moves cutter 14, adsorption zone 13 comprise one fixedly adsorption zone 131 and correspondence fixedly adsorption zone 131 1 sides move back and forth one move adsorption zone 132.
Further specify as follows, each fixedly adsorption zone 131 have an orthogonal first side 1311 and a second side 1312, the draw direction of first side 1311 and mucous membrane 100 is vertical and sets, each moves cutter 15 corresponding first side 1311 configurations and moves back and forth along a direction, mobile adsorption zone 132 corresponding second side 1312 configurations; Wherein, this adsorption zone 13 can be ceramic material and constitutes, and is provided with a plurality of holes that supplied gas circulates in ceramic material, makes adsorption zone 13 can pass through the hole intake-gas, to reach the adsorption function of adsorption zone 13.
Each membrane cutting mechanism 12 also comprises an additional circuit boards 15, an arm-tie 16 and connection and drives the arm-tie driver 17 that arm-tie 16 relative additional circuit boards 15 move back and forth, be formed with fixedly adsorption zone 131 on the additional circuit boards 15, be formed with mobile adsorption zone 132 on the arm-tie 16; In addition, each additional circuit boards 15 is provided with a groove 151 inwardly from side, and arm-tie 16 is placed in groove 151; Moreover the both sides of each additional circuit boards 15 relative groove 151 form two edges 152, and each edge strip 152 increases thickness outwardly gradually from the inside of additional circuit boards 15.In addition, each additional circuit boards 15 is provided with a recess 153 inwardly from side, thereby can wear recess 153 for the mobile cutter 14 of adjacent membrane cutting mechanism 12.Wherein, each additional circuit boards 15 has a slide rail 154; The most preferred embodiment of arm-tie driver 17 is a cylinder, but not as limit.
In addition, membrane cutting mechanism 12 also comprises a movable press mold assembly 18, movable press mold assembly 18 comprises a press mold spare 181 and connection and drive press mold spare 181 and is active in a fixedly press mold mobilizer 182 of adsorption zone 131, and the most preferred embodiment of press mold mobilizer 182 is a cylinder, but not as limit.
Each moves the set of knives 142 that cutter 14 comprises a slider 141 and is fixed on slider 141, and slider 141 is slidably connected to slide rail 154, thereby makes a side shift reciprocately of set of knives 141 corresponding additional circuit boards 15.
Corresponding each membrane cutting mechanisms 12 configuration of film rolling device 2, film rolling device 2 comprise for the sheathed fixed axis 21 of mucous membrane 100, and the direction towards each adsorption zone 13 stretches mucous membrane 100 from fixed axis 21.
Wherein, when mucous membrane 100 is adsorbed the adsorption zone 13 of two membrane cutting mechanisms 12 in office, mobile adsorption zone 132 can be towards moving away from fixing adsorption zone 131 directions, the mobile cutter 14 of one membrane cutting mechanism 12 can cut and separate mucous membrane 100, thereby make the mucous membrane 100 of separation be adsorbed on adsorption zone 13, framework 3 corresponding mucous membrane 100 gluings that separate.
Wafer film sticking equipment 10 of the present utility model comprises that also lower frame zone 4 and moves mechanism 5, be adsorbed with separate mucous membrane 100 adsorption zone 13 positions in lower frame zone 3, move the top that mechanism 5 is configured in lower frame zone 4.And move mechanism 5 and can be displaced in the lower frame zone 4, move the adsorption piece 52 that mechanism 5 comprises a shifter 51 and connects shifter 51, adsorption piece 52 can adsorb framework 3 and press frame 3 and the mucous membrane 100 mutual gluings that separate.
The combination of wafer film sticking equipment 10 of the present utility model, its utilization cuts transmission device 1 and comprises continuous tape loop actuation mechanism 11 and each membrane cutting mechanism 12, tape loop actuation mechanism 11 connects and drives each membrane cutting mechanism 12 along path circulation movement continuously, each membrane cutting mechanism 12 comprises the mobile cutter 14 of adsorption zone 13 and corresponding adsorption zone 13 configurations, and adsorption zone 13 comprises the fixedly mobile adsorption zone 132 that moves back and forth of adsorption zone 131 1 sides of fixedly adsorption zone 131 and correspondence; Corresponding each membrane cutting mechanisms 12 configuration of film rolling device 2, film rolling device 2 comprise for the sheathed fixed axis 21 of mucous membrane 100, and the direction towards each adsorption zone 13 stretches mucous membrane 100 from fixed axis 21; Wherein, when mucous membrane 100 is adsorbed the adsorption zone 13 of two membrane cutting mechanisms 12 in office, mobile adsorption zone 132 can be towards moving away from fixing adsorption zone 131 directions, the mobile cutter 14 of one membrane cutting mechanism 12 can cut and separate mucous membrane 100, thereby make the mucous membrane 100 of separation be adsorbed on adsorption zone 13, framework 3 corresponding mucous membrane 100 gluings that separate.
The combination of membrane cutting mechanism 12 of the present utility model, it utilizes adsorption zone 13 to comprise the mobile adsorption zone 132 that fixing adsorption zone 131 and corresponding fixedly adsorption zone 131 1 sides move back and forth; Mobile cutter 14 corresponding adsorption zone 13 configurations; Wherein, when mucous membrane 100 was attracted to adsorption zone 13, mobile adsorption zone 132 can be towards moving away from fixing adsorption zone 131 directions, and mobile cutter 14 can cut and separate mucous membrane 100, thereby makes the mucous membrane 100 of separation be adsorbed on adsorption zone 13.
The use of the utility model wafer film sticking equipment 10 and membrane cutting mechanism 12 thereof, extremely shown in Figure 12 as Fig. 5, each membrane cutting mechanism 12 is mobile along path circulation, make mucous membrane 100 continue to be adsorbed the adsorption zone 13 of two film cutting machine structures 12 in office, each moves adsorption zone 132 can be towards moving away from fixing adsorption zone 131 directions, and then even up the mucous membrane 100 on the adsorption zone 13 whole, the mobile cutter 14 of one membrane cutting mechanism 12 can cut and separate mucous membrane 100 afterwards, thereby make the mucous membrane 100 of separation be adsorbed on adsorption zone 13, and by moving mechanism 5 with framework 3 corresponding mucous membrane 100 gluings that separate.
Whereby, when mucous membrane 100 is adsorbed adsorption zone 13, mobile adsorption zone 132 can be towards moving away from the fixing direction of adsorption zone 131, to give mucous membrane 100 1 pulling force, and then draw leveling whole the mucous membrane 100, making pasting of follow-up framework 3 and wafer mucous membrane 100 more smooth closely, and make the processing procedure of wafer or detect more stable.
In addition, each fixedly adsorption zone 131 have orthogonal first side 1311 and second side 1312, the draw direction of first side 1311 and mucous membrane 100 is vertical and sets, mobile adsorption zone 132 corresponding second side 1312 configurations, when making each membrane cutting mechanism 12 mobile along path circulation, fixedly adsorption zone 131 gives mucous membrane 100 always to pulling force, mobile adsorption zone 132 is towards moving away from the fixing direction of adsorption zone 131 simultaneously, give mucous membrane 100 1 lateral pulls again, allow mucous membrane 100 be subjected to vertical two to pulling force flatten, and then strengthen the planarization of the mucous membrane 100 on the adsorption zone 13.
And, the both sides of each additional circuit boards 15 relative groove 151 form edge strip 152, each edge strip 152 increases thickness outwardly gradually from the inside of additional circuit boards 15, and then the structural strength of lifting edge strip 152, make when moving the mutual gluing of mechanism's 5 press frames 3 and the mucous membrane that separates 100, edge strip 152 is difficult for stress deformation, reaches membrane cutting mechanism 12 and has structural stability well.
Each additional circuit boards 15 is provided with recess 153 inwardly from side, thereby can wear recess 153 for the mobile cutter 14 of adjacent membrane cutting mechanism 12, reducing the spacing between each membrane cutting mechanism 12, and then allows the volume-diminished of wafer film sticking equipment 10.
Moreover, membrane cutting mechanism 12 also comprises movable press mold assembly 18, movable press mold assembly 18 comprises press mold spare 181 and connection and drive press mold spare 181 and is active in the fixedly press mold mobilizer 182 of adsorption zone 131, when making mucous membrane 100 be adsorbed adsorption zone 13, press mold spare 181 can be suppressed mucous membrane 100, avoid mucous membrane 100 to affect perk because being subjected to mobile cutter 14, make pasting of follow-up framework 3 and wafer mucous membrane 100 more smooth closely.
In addition, mobile cutter 14 moves back and forth along a direction, and the displacement of mobile cutter 14 makes the directly disconnected mucous membrane 100 of single solution for diverse problems of mobile cutter 14, this disconnected direction of imposing uniformity without examining individual cases greater than the width of mucous membrane 100, be not limited with present embodiment, visual actual conditions are adjusted, and allow the rectangular shape of external form or the square shape of mucous membrane 100 cooperations itself that separate, but not via mobile cutter 14 following process formation, so do not have the generation of waste material, to reach efficent use of resources and cost-effective characteristics.
In sum, wafer film sticking equipment of the present utility model and membrane cutting mechanism thereof really can reach the application target of expection, and solve the problems of the prior art.
The above embodiment is the preferred embodiment that proves absolutely that the utility model is lifted, and protection domain of the present utility model is not limited thereto.Being equal to that those skilled in the art do on the utility model basis substitutes or conversion, all within protection domain of the present utility model.Protection domain of the present utility model is as the criterion with claims.
Claims (10)
1. the membrane cutting mechanism of a wafer film sticking equipment is used for a mucous membrane, it is characterized in that this membrane cutting mechanism comprises:
One adsorption zone comprises a fixing adsorption zone and move adsorption zone to what fixing adsorption zone one side moved back and forth; And
One moves cutter, to should the adsorption zone setting.
2. the membrane cutting mechanism of wafer film sticking equipment according to claim 1, it is characterized in that, fixedly adsorption zone has an orthogonal first side and a second side, the draw direction of this first side and described mucous membrane is vertical setting, this moves cutter to arranging and can move back and forth along a direction in the first side, and this moves adsorption zone to arranging the second side.
3. the membrane cutting mechanism of wafer film sticking equipment according to claim 2, it is characterized in that, this membrane cutting mechanism also comprises an additional circuit boards, an arm-tie and connection and drives the arm-tie driver that relative this additional circuit boards of this arm-tie moves back and forth, be formed with this fixedly adsorption zone on this additional circuit boards, be formed with this on this arm-tie and move adsorption zone.
4. the membrane cutting mechanism of wafer film sticking equipment according to claim 3 is characterized in that, this additional circuit boards is provided with a groove inwardly from side, and this arm-tie is placed in this groove.
5. the membrane cutting mechanism of wafer film sticking equipment according to claim 4 is characterized in that, this additional circuit boards both sides of this groove relatively forms two edges, and each edge strip increases thickness outwardly gradually from the inside of this additional circuit boards.
6. the membrane cutting mechanism of wafer film sticking equipment according to claim 3 is characterized in that, this additional circuit boards is provided with a recess inwardly from side.
7. the membrane cutting mechanism of wafer film sticking equipment according to claim 1, it is characterized in that, this membrane cutting mechanism also comprises a movable press mold assembly, and this activity press mold assembly comprises a press mold spare and connection and drives this press mold spare and is active in this fixedly press mold mobilizer of adsorption zone.
8. the membrane cutting mechanism of wafer film sticking equipment according to claim 3 is characterized in that, this additional circuit boards has a slide rail, and this moves the set of knives that cutter comprises a slider and is fixed on this slider, and this slider is slidably connected to this slide rail.
9. a wafer film sticking equipment is characterized in that, comprising:
One cuts transmission device, comprises a continuous tape loop actuation mechanism and according to the membrane cutting mechanism of each described wafer film sticking equipment in the claim 1 to 8, and this continuous tape loop actuation mechanism connects that also to drive this membrane cutting mechanism mobile along path circulation;
One film rolling device, to arranging by the membrane cutting mechanism, this film rolling device comprises for the sheathed fixed axis of mucous membrane, and the direction towards adsorption zone stretches described mucous membrane from this fixed axis; And
One framework, the corresponding described mucous membrane gluing that separates.
10. wafer film sticking equipment according to claim 9, it is characterized in that, comprise that also lower frame zone and moves mechanism, be adsorbed with this adsorption zone that separates described mucous membrane and be arranged in this lower frame zone, this moves the top that mechanism is arranged on this lower frame zone, and this is moved mechanism and can be displaced in this lower frame zone, and this moves the adsorption piece that mechanism comprises a shifter and connects this shifter, and this adsorption piece can adsorb this framework and suppress this framework and the mutual gluing of described mucous membrane that separates.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320111937 CN203141994U (en) | 2013-03-12 | 2013-03-12 | Wafer laminating equipment and film-drawing cutting mechanism thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320111937 CN203141994U (en) | 2013-03-12 | 2013-03-12 | Wafer laminating equipment and film-drawing cutting mechanism thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203141994U true CN203141994U (en) | 2013-08-21 |
Family
ID=48969546
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201320111937 Expired - Lifetime CN203141994U (en) | 2013-03-12 | 2013-03-12 | Wafer laminating equipment and film-drawing cutting mechanism thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203141994U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI631607B (en) * | 2017-08-09 | 2018-08-01 | 志聖工業股份有限公司 | Film cutting device and film cutting method thereof |
| CN114473822A (en) * | 2022-04-15 | 2022-05-13 | 四川明泰微电子科技股份有限公司 | Wafer thinning and polishing device |
-
2013
- 2013-03-12 CN CN 201320111937 patent/CN203141994U/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI631607B (en) * | 2017-08-09 | 2018-08-01 | 志聖工業股份有限公司 | Film cutting device and film cutting method thereof |
| CN114473822A (en) * | 2022-04-15 | 2022-05-13 | 四川明泰微电子科技股份有限公司 | Wafer thinning and polishing device |
| CN114473822B (en) * | 2022-04-15 | 2022-07-05 | 四川明泰微电子科技股份有限公司 | Wafer thinning and polishing device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20130821 |
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| CX01 | Expiry of patent term |