KR100725289B1 - Apparatus and method for manufacturing adhesive tape used for semiconductor manufacturing - Google Patents

Abstract

The present invention relates to an adhesive tape manufacturing apparatus for semiconductor production and a method of manufacturing the same. An adhesive tape manufacturing apparatus for manufacturing a semiconductor according to the present invention includes a film feeder for supplying a film having an adhesive layer, an upper surface and a lower surface protective layer bonded to the upper and lower protective layers; Cutting members for forming a cutting line corresponding to the shape of the semiconductor wafer on the upper protective layer and the adhesive layer of the film supplied from the film feeder; A recoverer for recovering scrap consisting of an upper surface protective layer and an adhesive layer outside the cut line; A remover for removing an upper protective layer of the cut line inner region; A mounting tape feeder for supplying mounting tapes; And a laminator for laminating the film in which the adhesive layer and the lower surface protective layer of the cut line inner region and the mounting tape are laminated to complete the adhesive tape.

According to the present invention, it is possible to reduce the consumption of the protective film when manufacturing the adhesive tape, all processes can be configured in a single line can increase the production speed, it is possible to prevent tape contamination due to a complex process.

Semiconductor Wafers, Mounting Tapes, Dicing

Description

Apparatus and method for manufacturing adhesive tape used for semiconductor manufacturing

The following drawings attached to this specification are illustrative of preferred embodiments of the present invention, and together with the detailed description of the invention to serve to further understand the technical spirit of the present invention, the present invention is a matter described in such drawings It should not be construed as limited to.

1a to 1c and 1e is a view showing a manufacturing process of the adhesive tape for semiconductor manufacturing according to the prior art.

1d is a cross-sectional view taken along the line d-d 'of FIG. 1c;

1f is a cross-sectional view taken along line f-f 'of FIG. 1e;

2 is a view showing an adhesive tape manufacturing apparatus for manufacturing a semiconductor according to a preferred embodiment of the present invention.

3 is a flowchart illustrating a method of manufacturing an adhesive tape for manufacturing a semiconductor according to a preferred embodiment of the present invention.

4 is a cross-sectional view taken along line IV-IV ′ of FIG. 2.

5 is a cross-sectional view taken along the line VV ′ of FIG. 2.

6 is a cross-sectional view taken along line VI-VI ′ of FIG. 2.

7 is a cross-sectional view taken along the line VII-VII 'of FIG.

8 is a cross-sectional view taken along the line VII-VII 'of FIG.

FIG. 9 is a cross-sectional view illustrating a cutting line formed on the film of FIG. 8. FIG.

FIG. 10 is a plan view illustrating a state in which an adhesive tape manufactured by using an adhesive tape manufacturing apparatus for manufacturing a semiconductor according to an embodiment of the present invention is attached to a semiconductor wafer. FIG.

FIG. 11 is a cross-sectional view taken along the line VII-VII 'of FIG. 10.

12 to 15 are cross-sectional views illustrating a dicing step, a pickup step, a die padding step, and a wire bonding step of a semiconductor wafer with an adhesive tape attached thereto, respectively.

<Explanation of symbols for the main parts of the drawings>

110 ... film feeder 120 ... cutting member

130 ... scrap scraper 140 ... remover

150 ... mounting tape feeder 160 ... laminator

170 ... non-contact sensor 190 ... winding roller

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an adhesive tape manufacturing apparatus for semiconductor manufacturing and a method of manufacturing the same, and more particularly, to an apparatus for manufacturing an adhesive tape with a mounting tape and a method of manufacturing the same, used in a dicing step of a semiconductor wafer.

Conventionally, a LOC (Lead On Chip) tape made of an acrylic or epoxy thermosetting adhesive is taped to a lead frame on a polyimide film to fix a semiconductor chip and a substrate. However, this method has a problem in that the lead portion is broken or deformed and wire bonding is difficult due to thermal stress caused by a difference in coefficient of thermal expansion between the chip and the substrate.

Therefore, in order to eliminate the physical and mechanical side effects caused by different thermal expansion coefficients of the semiconductor chip and the substrate, a method of connecting the semiconductor wafer and the substrate via an elastomeric tape is used.

Meanwhile, in order to manufacture a semiconductor device from a semiconductor wafer, a taping process of attaching a mounting tape to one surface of the semiconductor wafer, a dicing process of dividing the semiconductor wafer to form a die, and a dicing process may be performed. A cleaning process for removing silicon dust and a die bonding process for separating and bonding each die to a substrate are performed.

Conventionally, a mounting tape for fixing a semiconductor wafer in a dicing process and an adhesive tape for attaching a cut die to a substrate or a lead frame in a die bonding process are separately manufactured and used.

In recent years, in order to perform a semiconductor manufacturing process more easily, the tape which attached the mounting tape to the adhesive tape for die bonding is used.

1A to 1F are views illustrating a manufacturing process of an adhesive tape for semiconductor manufacturing according to the prior art. First, referring to FIG. 1A, in the manufacturing process of the adhesive tape, first, the protective films 11 and 12 are attached to both surfaces 21 of the adhesive layer using the laminator 30 to produce the original film 1. Thereafter, the original film 1 is cut in a circular shape using the cutters 32 and 33 as shown in FIG. 1B. Then, as shown in FIG. 1C, the protective film 12 on the lower surface is removed from the circular film 2, and the mounting tape 22 attaching process is performed. That is, when the circular mark 22 ′ of the mounting tape 22 is attached, the circular film 3 from which the protective film 12 is removed is attached and the protective film 14 is adhered to the upper surface again. Then, an intermediate film 4 having a cross section as shown in FIG. 1D is formed. Thereafter, a process of removing the circular protective layer 11 attached to the upper surface of the circular adhesive layer 21 as shown in FIG. 1E is performed. That is, the protective film 14 layer is removed, and another protective layer 15 is attached again while removing the circular protective film 11 on the upper surface of the adhesive layer 21. Then, as illustrated in FIG. 1F, the adhesive tape 5 in which the protective layer 15, the adhesive layer 21, and the mounting tape 22 are sequentially stacked is completed.

This conventional adhesive tape manufacturing process has to go through many processes as described above, there is a problem that a lot of process scrap (scrap) occurs. In addition, there is a problem in that the material cost is excessively consumed because a plurality of protective films are used to prevent the adhesive layer from being contaminated. In addition, there is a fear that the tape may be contaminated during the repeated process, there is a fear that the defects in the semiconductor device manufacturing process that requires clean.

The present invention has been devised to solve the above problems, and reduces the consumption of the protective film in the manufacturing process, the manufacturing apparatus of the adhesive tape for semiconductor manufacturing that can reduce the complex process by configuring all the processes in one line and the same It aims at providing the manufacturing method of the used adhesive tape.

Adhesive tape manufacturing apparatus for manufacturing a semiconductor according to the present invention for achieving the object of the present invention, a film feeder for supplying a film having an adhesive layer, the upper and lower protective layer bonded to the upper and lower surfaces of the adhesive layer; Cutting members for forming a cutting line corresponding to the shape of the semiconductor wafer on the upper protective layer and the adhesive layer of the film supplied from the film feeder; A recoverer for recovering scrap consisting of an upper surface protective layer and an adhesive layer outside the cut line; A remover for removing an upper protective layer of the cut line inner region; A mounting tape feeder for supplying the mounting tape; And a laminator for laminating the film in which the adhesive layer and the lower surface protective layer of the cut line inner region and the mounting tape are laminated to complete the adhesive tape for manufacturing a semiconductor device.

Preferably, the marking tape is marked on the surface of the mounting tape. In this case, the adhesive tape manufacturing apparatus of the present invention is installed at the point where the adhesive layer and the lower surface protective layer of the inner portion of the cutting line meets the remaining film and the mounting tape, so that the marking of the cutting line and the mounting tape is correctly aligned. It further comprises a non-contact sensor.

Preferably, the cutting member forms a cutting line such that the cutting line extends to a part of the lower protective layer. In this case, the cut depth of the lower surface protective layer is within 90% of the thickness of the lower protective layer.

Adhesive tape manufacturing apparatus of the present invention, at the rear end of the laminator, a cutting member for forming a circular cut line in the mounting tape at a point spaced from the cutting line a predetermined distance; And a recovery device for recovering the mounting tape outside the cutting line formed on the mounting tape. In this case, it is preferable that the cutting member forms a cutting line on the mounting tape so that the cutting line extends to a part of the lower protective layer. The cutting depth of the lower surface protective layer is within 90% of the thickness of the lower protective layer.

Adhesive tape manufacturing apparatus of the present invention, a cutting machine for cutting both ends of the laminated adhesive tape; And a winding roller for winding the laminated adhesive finished tape.

Preferably, the cutting member is a Thompson type press or a rotary cutter.

According to an aspect of the present invention, there is provided a method for manufacturing a semiconductor device, the method including: (a) supplying a film having an adhesive layer, an upper surface and a lower surface protective layer bonded to upper and lower surfaces of the adhesive layer; (b) forming a cutting line matching the shape of the semiconductor wafer on the upper protective layer and the adhesive layer of the film; (c) recovering the scrap consisting of an upper protective layer and an adhesive layer outside the cut line; (d) removing the upper protective layer inside the cut line; (e) supplying a mounting tape such that the top protective layer faces the protective layer of the removed film; And (f) laminating the film and the mounting tape in which the adhesive layer and the lower surface protective layer inside the cutting line remain.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. Prior to this, terms or words used in the specification and claims should not be construed as having a conventional or dictionary meaning, and the inventors should properly explain the concept of terms in order to best explain their own invention. Based on the principle that it can be defined, it should be interpreted as a concept and concept corresponding to the technical idea of the present invention. Therefore, the embodiments described in the specification and the drawings shown in the drawings are only the most preferred embodiment of the present invention and do not represent all of the technical idea of the present invention, various modifications that can be replaced at the time of the present application It should be understood that there may be equivalents and variations.

First, the embodiment described below will be found in advance for the manufacturing apparatus and manufacturing method of the elastomeric tape of the adhesive tape for semiconductor device manufacturing. However, the present invention is not limited by the type of adhesive tape.

2 is a view schematically showing an elastomeric tape manufacturing apparatus according to a preferred embodiment of the present invention.

Referring to FIG. 2, the apparatus for manufacturing an elastomer tape according to the present embodiment includes a film feeder 110 and a film feeder 110 supplying a film 50 having an elastomeric layer and a protective layer bonded to upper and lower surfaces of the elastomeric layer. In the film 50 supplied from the cutting member 120 to form a cutting line 60 in the upper protective layer and the elastomer layer, a scrap consisting of the upper protective layer and the elastomer layer outside the cutting line 60 A recovery device 130 for recovering the 62, a remover 140 for removing the upper protective layer 61 inside the cutting line 60, a mounting tape supply 150 for supplying the mounting tape 54, and And a laminator 160 for laminating the film 64 and the mounting tape 54 from which the upper protective layer is removed.

The film feeder 110 is in the form of a winding roll installed on one side in the elastomeric tape manufacturing apparatus according to the present embodiment, the film 50 is wound and sequentially unwound to supply the film 50 continuously.

As shown in FIG. 4, which is a cross-sectional view taken along line IV-IV ′ of FIG. 2, the film 50 has an upper protective layer 51 adhered to the upper and lower surfaces of the elastomer layer 52 and the elastomer layer 52. ) And a lower surface protective layer 53. The elastomer layer 52 is an epoxy-rubber-based material having a low modulus material property that can reduce thermal stress caused by a difference in thermal expansion coefficient between the semiconductor chip and the substrate, thereby improving reliability of semiconductor packaging. The upper and lower protective layers 51 and 53 are for protecting the elastomer layer 52 from the external environment in the process of manufacturing the elastomer tape, and are preferably made of polyethylene terephthalate (PET). The elastomer layer 52 may be composed of one or multiple adhesive layers.

The cutting member 120 is installed on the transfer line of the film 50 unwound from the film feeder 110 to form a cutting line 60 (for example, a circular cutting line) corresponding to the shape of the semiconductor wafer. (51) and the elastomer layer (52). Preferably, the cutting line 60 is formed from the upper surface of the upper protective layer 51 to the lower surface of the elastomer layer 52 (see Fig. 4 (a)). More preferably, the cutting line 60 is formed from the upper surface of the upper protective layer 51 to the lower protective layer 53 via the elastomer layer 52 (see FIG. 4B). When the cutting line 60 is formed to the lower surface protective layer 53, the cutting depth is preferably 90% or less of the thickness of the lower surface protective layer 53. When the cut line 60 is formed to a part of the lower surface protective layer 53, the upper protective layer 51 and the elastomer layer 52 outside the cut line 60 may be more easily removed. Preferably, the cutting member 120 is a Thompson type press or a rotary cutter. However, the cutting member of the present invention is not limited thereto.

The recoverer 130 is installed after the cutting member 120 to recover the scrap 62 including the upper protective layer 51 and the elastomer layer 52 outside the cutting line 60 from the film 50. The recovery device 130 is configured by a roller to continuously wind the scrap 62 to be separated from the film 50.

The remover 140 removes the upper protective layer 51 of the inner region 61 of the cutting line 60 from the film 63 from which the scrap 62 is recovered from the recoverer 130. Eliminator 140 may be variously employed using known techniques within the purpose of the present invention.

The mounting tape feeder 150 is installed at one side of the transfer line of the film to continuously supply the mounting tape 54. The mounting tape 54 serves to support the wafer in the dicing process of the semiconductor wafer. On the mounting tape 54 a mark 56 corresponding to the cut line 60 is indicated.

The mounting tape 54 may be made of one layer or multiple layers, and may also have an adhesive layer on the bonding surface with the elastomer layer 52.

On the mounting tape 54, a protective layer 55 for protecting the tape is provided. Therefore, the protective layer recoverer 151 may be provided to remove the protective layer 55 and supply the mounting tape to the elastomer tape manufacturing apparatus.

The laminator 160 laminates the film 64 and the mounting tape 54 from which the upper protective layer 51 is removed. At this time, the non-contact sensor 170 is connected to the portion where the film 64 and the mounting tape 54 are bonded to align the mark 56 of the cutting line 60 and the marking 56 of the mounting layer 54 of the elastomer layer 52. It is preferable to install.

The elastomeric tape manufacturing apparatus further includes a cutting member 125 that forms a cutting line 66 at a point spaced a predetermined distance from the outside of the elastomer layer 52 inserted into the film 65 (see FIG. 9). . Preferably, the cutting line 66 is formed from the lower surface to the upper surface of the mounting tape 54. More preferably, the cutting line 66 is formed to extend from the lower surface of the mounting tape 54 to the protective layer 53 when passing through the upper surface. The depth of the cut line 66 formed on the lower surface protective layer 53 is preferably within 90% of the thickness of the lower protective layer 53. If the cutting line 66 extends to the lower surface protective layer 53, the scrap may be more easily removed in a subsequent scrap removing process. The rear end of the cutting member 125 is provided with a recovery unit 135 for removing the mounting tape 54 on the outer cutting line 66 to remove unnecessary scrap continuously.

Preferably, the elastomer tape manufacturing apparatus further includes a cutter 180 for cutting both ends of the elastomer tape 65 to a desired width.

Preferably, the elastomer tape manufacturing apparatus further includes a winding roller 190 for winding and storing the finished elastomer tape 65.

Although not shown in the drawings, the cutting member 120, the remover 140, the cutting member 125 and the cutter 180 may be arranged in parallel along the width direction of the film. In such a case, a plurality of adhesive tapes for semiconductor production can be produced in one step, and the productivity is improved.

The elastomer tape manufacturing apparatus can produce an elastomeric tape in a simpler process by forming a single production line instead of several processes, and can minimize contamination that may occur in various processes, and also increase production speed.

3 is a flowchart illustrating a method of manufacturing an elastomeric tape according to the present invention, and FIGS. 4 to 9 are cross-sectional views illustrating a cross section of each film in the manufacturing step of the elastomeric tape which is performed using the apparatus of FIG. 2. .

3 to 9, the method of manufacturing an elastomer tape according to the present invention first includes a film 50 having an elastomer layer 52 and protective layers 51 and 53 adhered to upper and lower surfaces of the elastomer layer 52. Supply (S10).

Subsequently, as illustrated in FIG. 4, a cutting line 60 (eg, a circular cutting line) is formed on the upper protective layer 51 and the elastomer layer 52 of the supplied film 50 (S20). . The cutting line 60 corresponds to the shape of the semiconductor wafer. The cutting line 60 is more preferably extended to the protective layer 51 as shown in FIG.

Then, the scrap consisting of the upper protective layer 51 and the elastomer layer 52 outside the cutting line 60 is recovered (S30). The cross section of the scrap 62 to be recovered is as shown in FIG. 5.

As shown in FIG. 6, the cross-section of the film 53 from which the scrap 62 is removed has a lower protective layer 53, a circular elastomer layer 52 stacked on the upper surface, and a circular upper protective layer 51. It is a laminated structure.

Subsequently, as shown in FIG. 7, the upper protective layer 51 is removed from the inner region of the cutting line 60 (S40). The film 64 advanced to this step has a structure in which a lower protective layer 53 and a circular elastomer layer 52 are laminated thereon.

Then, the mounting tape 54 provided separately is supplied into the transfer line of the film (S50). Then, the mounting tape is laminated with the film 64 from which the upper protective layer is removed as shown in FIG. 8 (S60). At this time, the mark marked on the mounting tape and the circular elastomer layer 52 of the film are correctly bonded. In this step, the laminated film 65 has a structure in which a mounting tape 54, an elastomer layer 52, and a lower surface protective layer 51 are sequentially stacked.

After the laminating process of the mounting tape 54 is performed, a cutting line 66 is formed at a point spaced a predetermined distance from the outside of the elastomer layer 52 as shown in FIG. 9 (S70). Preferably, the cutting line 66 is formed from the lower surface to the upper surface of the mounting tape 54. More preferably, the cutting line 66 is formed to extend from the lower surface of the mounting tape 54 to the protective layer 53 when passing through the upper surface.

Then, the scrap consisting of the mounting tape 54 outside the cutting line 66 is removed (S80). Then, both ends of the film from which the scrip is removed are cut to an appropriate width (S90), and the odor is completed to prepare the elastomer tape (S100).

10 to 15 are views showing a process performed after the manufacture of a semiconductor wafer using the elastomer tape 65 manufactured as described above.

Referring to FIGS. 10 and 11, the elastomer tape 65 completed through the above process is attached to one surface of the semiconductor wafer 71 after removing the lower surface protective layer 53 and having a SUS (steel use stainless) ring frame. 72 is attached to mounting tape 54.

As described above, the semiconductor wafer 71 having the elastomer tape attached thereto is cut into the die 75 after the dicing process using the dicing saw 73 as shown in FIG. 12. Die 75 and elastomer layer 52 are picked up by pip-up device 74 as shown in FIG. Then, the die 75 and the elastomer layer 52 picked up as shown in FIG. 14 are thermally cured to bond the die to the die pad 77. Thereafter, as shown in FIG. 15, the wire bonding 78 is applied to the semiconductor die 75 and the die pad 77 to complete the semiconductor element before packaging.

As described above, although the present invention has been described by way of limited embodiments and drawings, the present invention is not limited thereto and is intended by those skilled in the art to which the present invention pertains. Of course, various modifications and variations are possible within the scope of equivalents of the claims to be described.

As described above, according to the present invention, the consumption amount of the protective film can be reduced in the manufacturing process of the adhesive tape for semiconductor device production. In addition, all processes can be organized in one line to reduce complex processes, increasing production speeds and preventing contamination that can occur in complex processes.

Claims (19)

In the adhesive tape manufacturing apparatus for semiconductor element manufacture, A film feeder supplying a film having an adhesive layer, an upper surface and a lower surface protective layer bonded to upper and lower surfaces of the adhesive layer; Cutting members for forming a cutting line corresponding to the shape of the semiconductor wafer on the upper protective layer and the adhesive layer of the film supplied from the film feeder; A recoverer for recovering scrap consisting of an upper surface protective layer and an adhesive layer outside the cut line; A remover for removing an upper protective layer of the cut line inner region; A mounting tape feeder for supplying mounting tapes; And And a laminator for laminating the film in which the adhesive layer and the lower surface protective layer of the cutting line inner region remain and the mounting tape to complete the adhesive tape. The method of claim 1, The mounting tape is marked with a marking corresponding to the cutting line, And a non-contact sensor installed at a point where the adhesive layer and the lower surface protective layer of the cut line inner region meet the remaining film and the mounting tape, so that the marking of the cut line and the mounting tape is exactly matched. Adhesive tape manufacturing equipment for element manufacturing. The method of claim 1, The cutting member is an adhesive tape manufacturing apparatus for manufacturing a semiconductor device, characterized in that for forming the cutting line so that the cutting line extends to a portion of the protective layer. The method of claim 3, wherein And a cutting depth of the lower protective layer is within 90% of the lower protective layer thickness. The method of claim 1, An additional cutting member formed at a rear end of the laminator, a cutting line having a circular shape on a mounting tape at a point spaced a predetermined distance from the cutting line; And Adhesive tape manufacturing apparatus for semiconductor device manufacturing, characterized in that it further comprises; a recovery device for recovering the mounting tape of the cutting line outer formed on the mounting tape. The method of claim 5, The cutting member is an adhesive tape manufacturing apparatus for manufacturing a semiconductor device, characterized in that for forming a cutting line on the mounting tape so that the cutting line extends to a portion of the protective layer. The method of claim 6, And a cutting depth of the lower protective layer is within 90% of the lower protective layer thickness. The method of claim 1, Adhesive tape manufacturing apparatus for manufacturing a semiconductor device further comprising; a cutter for cutting both ends of the laminated adhesive tape. The method of claim 1, Adhesive tape manufacturing apparatus for manufacturing a semiconductor device further comprises a; winding roller for winding the laminated adhesive tape is completed. The method according to claim 1 or 5, The cutting member is an adhesive tape manufacturing apparatus for manufacturing a semiconductor device, characterized in that the Thompson-type press or rotary cutting machine. (a) supplying a film having an adhesive layer, upper and lower protective layers bonded to upper and lower surfaces of the adhesive layer; (b) forming cutting lines matching the shape of the semiconductor wafer on the upper protective layer and the adhesive layer of the film; (c) recovering the scrap consisting of an upper protective layer and an adhesive layer outside the cut line; (d) removing the upper protective layer inside the cut line; (e) supplying a mounting tape such that the top protective layer faces the adhesive layer of the removed film; And (f) laminating the film with the adhesive layer and the lower surface protective layer remaining inside the cutting line and the mounting tape. The method of claim 11, The mounting tape has a marking corresponding to the cutting line, In the step (f), using a non-contact sensor to accurately match the marking of the cutting line and the mounting tape, characterized in that the adhesive tape manufacturing method for manufacturing a semiconductor device. The method of claim 11, In the step (b), if the cutting line is formed to extend to a portion of the protective layer, the adhesive tape manufacturing method for manufacturing a semiconductor device. The method of claim 13, And a cutting depth of the lower surface protective layer is within 90% of the thickness of the lower surface protective layer. The method of claim 11, wherein after step (f), (g) forming a circular cut line on the mounting tape at a point spaced a predetermined distance from the cut line; And (h) recovering the mounting tape outside the cutting line formed on the mounting tape. The method of claim 15, In the step (g), the cutting line is formed to extend to a portion of the lower protective layer, the adhesive tape manufacturing method for manufacturing a semiconductor device. The method of claim 16, And a cutting depth of the lower surface protective layer is within 90% of the thickness of the lower surface protective layer. The method of claim 11, Cutting both ends of the laminated adhesive tape; Method of manufacturing an adhesive tape for a semiconductor device characterized in that it further comprises. The method of claim 11, The method of claim 1, further comprising winding the laminated adhesive tape.

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