CN1837311A - Apparatus and method for manufacturing adhesive tape for semiconductor production - Google Patents
Apparatus and method for manufacturing adhesive tape for semiconductor production Download PDFInfo
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- CN1837311A CN1837311A CNA2006100596551A CN200610059655A CN1837311A CN 1837311 A CN1837311 A CN 1837311A CN A2006100596551 A CNA2006100596551 A CN A2006100596551A CN 200610059655 A CN200610059655 A CN 200610059655A CN 1837311 A CN1837311 A CN 1837311A
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- Prior art keywords
- cut
- protective layer
- adhesive tape
- mounting strap
- make
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 65
- 239000004065 semiconductor Substances 0.000 title claims abstract description 64
- 239000002390 adhesive tape Substances 0.000 title claims abstract description 62
- 238000000034 method Methods 0.000 title claims abstract description 36
- 239000011241 protective layer Substances 0.000 claims abstract description 95
- 238000005520 cutting process Methods 0.000 claims abstract description 33
- 238000010030 laminating Methods 0.000 claims abstract description 8
- 239000010410 layer Substances 0.000 claims description 59
- 239000012528 membrane Substances 0.000 claims description 22
- 239000002699 waste material Substances 0.000 claims description 17
- 238000004804 winding Methods 0.000 claims description 4
- 230000008878 coupling Effects 0.000 claims description 2
- 238000010168 coupling process Methods 0.000 claims description 2
- 238000005859 coupling reaction Methods 0.000 claims description 2
- 230000001681 protective effect Effects 0.000 abstract description 10
- 238000011084 recovery Methods 0.000 abstract description 2
- 239000012790 adhesive layer Substances 0.000 abstract 5
- 230000006866 deterioration Effects 0.000 abstract 1
- 235000012431 wafers Nutrition 0.000 description 19
- 239000013078 crystal Substances 0.000 description 11
- 239000000758 substrate Substances 0.000 description 8
- 238000009434 installation Methods 0.000 description 7
- 235000008733 Citrus aurantifolia Nutrition 0.000 description 3
- 240000006909 Tilia x europaea Species 0.000 description 3
- 235000011941 Tilia x europaea Nutrition 0.000 description 3
- 239000004571 lime Substances 0.000 description 3
- 229920000139 polyethylene terephthalate Polymers 0.000 description 3
- 239000005020 polyethylene terephthalate Substances 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- -1 PolyEthylene Terephthalate Polymers 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 230000000295 complement effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000008646 thermal stress Effects 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N Acrylic acid Chemical compound OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 241000196324 Embryophyta Species 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000009998 heat setting Methods 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000004071 soot Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/52—Mounting semiconductor bodies in containers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
- H01L2224/83191—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on the semiconductor or solid-state body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/91—Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L2224/80 - H01L2224/90
- H01L2224/92—Specific sequence of method steps
- H01L2224/922—Connecting different surfaces of the semiconductor or solid-state body with connectors of different types
- H01L2224/9222—Sequential connecting processes
- H01L2224/92242—Sequential connecting processes the first connecting process involving a layer connector
- H01L2224/92247—Sequential connecting processes the first connecting process involving a layer connector the second connecting process involving a wire connector
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The apparatus for manufacturing semiconductor-manufacturing adhesive tape comprises a film feeding mechanism for feeding a film which provides an adhesive layer, the upper and lower protective layers adhered to the upper and lower of the adhesive layer, a cutting member which forms a cutting line corresponding to the shape of a semiconductor wafer in the adhesive layer and the upper protective layer which is fed from the film feeding mechanism, a recovery mechanism for recovering a scrap comprising the upper protective layer of the outer region of the cutting line and the adhesive layer, a removal mechanism for removing the upper protective layer of the inner region of the cutting line, a mount tape feeding mechanism for feeding a mount tape, and a laminator which is used for completing an adhesive tape by laminating a film which remains the adhesive layer of the inner region of the cutting line and the lower protective layer and the mount tape. The present invention provides an apparatus for manufacturing a semiconductor-manufacturing adhesive tape which can reduce the consumption of a protective film, a constitution wherein the whole process is integrated into one line, increasing the production speed, and preventing the deterioration of a tape due to a complex process.
Description
Technical field
The present invention relates to a kind of apparatus and method that are used to make the adhesive tape that uses for semiconductor production, relate in particular to a kind of apparatus and method that are used for making the adhesive tape that is stained with the mounting strap that is used in semiconductor wafer (wafer) stripping and slicing (dicing) operation.
Background technology
Usually, by with Lead-on-Chip (Lead On Chip, LOC) adhesive tape sticking to lead frame, thereby semi-conductor chip is fixed on the substrate, this adhesive tape is made of polyimide film and vinylformic acid or epoxy thermosetting caking agent.Yet the problem that this method presents is, because the thermal stresses that difference produced of the thermal expansivity between chip and the substrate causes the bad routing of lead portion to engage (wirebonding), open circuit or be out of shape.
Thus, in order to solve physics that difference produced and mechanical side effects, adopt a kind of utilization plant elasticity between semiconductor wafer and substrate to bring the method that connects semiconductor wafer and substrate owing to the thermal expansivity between semi-conductor chip and the substrate.
Simultaneously, in order to make semiconductor element, need carry out following operation: be used for mounting strap is attached to adhesive tape sticking operation (taping process) on semiconductor wafer one side, is used for the cleaning process that the cutting of semiconductor wafer subregion is removed with the stripping and slicing operation of making crystal block (die), the silica soot that is used for that the stripping and slicing operation is produced and is used for each crystal block separated and is connected to subsides crystalline substance (die bonding) operation on the substrate with semiconductor wafer.
Usually, to be connected to the adhesive tape on substrate or the lead frame be to make separately and use to the crystal block that is used for fixing the mounting strap of semiconductor wafer and is used for cutting in the stripping and slicing operation in pasting brilliant operation.
Recently, a kind ofly be used for semiconductor fabrication more easily by mounting strap being attached to the belt that is used to paste on the brilliant adhesive tape.
Fig. 1 a to Fig. 1 f shows according to the process of prior art manufacturing for the adhesive tape of semiconductor production use.At first, in the adhesive tape manufacturing processed, by utilizing laminating machine 30, attach protective membrane 11 and 12 in adhesion layer 21 both sides, to make raw films 1 with reference to Fig. 1.After this, shown in Fig. 1 b, raw films 1 is cut into circle by utilizing cutting unit 32 and 33.Subsequently, shown in Fig. 1 c, remove the protective membrane 12 on the lower surface that is positioned at circular membrane 2, attach the operation of mounting strap then.That is to say, the circular membrane 3 of having removed time protective membrane 12 be attached to the circular mark 22 of mounting strap 22 ' on, and subsequently protective membrane 14 is adhered on the upper surface of circular membrane 3.Then, formation has the intermediate film 4 of section shown in Fig. 1 d.After this, shown in Fig. 1 e, carry out the operation that the circular protective membrane 11 that is attached on circular adhesion layer 21 upper surfaces is removed.That is to say,, just can attach another protective layer 15 by removing the circular protective membrane 11 on protective membrane 14 and removal adhesion layer 21 upper surfaces.Subsequently, finish the manufacturing of adhesive tape 5, wherein, protective layer 15, adhesion layer 21 and mounting strap 22 are stacked in regular turn shown in Fig. 1 f.
The problem that this tradition adhesive tape manufacturing processed exists is, because it needs many above-mentioned operations, so produce the waste material of many operation process.In addition, because need to use some protective membranes to prevent that adhesion layer is contaminated, so the material cost that consumes is very big.In addition, because adhesive tape is easy to be polluted in operation repeatedly, so in the semiconductor element manufacturing processed that requires to clean, may produce semiconductor element inferior.
Summary of the invention
The present invention is designed to solve the problems referred to above of prior art; and therefore the object of the present invention is to provide a kind of method that is used to make the device of the adhesive tape that uses for semiconductor production and utilizes this device manufacturing adhesive tape, this device can reduce the consumption of protective membrane in the manufacturing processed and simplify complicated step by all process steps being set on the circuit simultaneously.
To achieve these goals, the invention provides a kind of device that is used to make the adhesive tape that uses for semiconductor production, this device comprises: the membrane supplying device, and it is used to supply with film, and this film has adhesion layer and adheres to last protective layer and lower protective layer on this adhesion layer upper and lower surface respectively; Cutting element, it is used at the adhesion layer of the film of being supplied with by this membrane supplying device and last protective layer forms and the corresponding line of cut of shape of semiconductor wafer; Withdrawer, it is used to reclaim the waste material that last protective layer and adhesion layer constituted by being in outside the described line of cut; Stripper, it is used to remove the last protective layer that is within the described line of cut; The mounting strap feeder, it is used to supply with mounting strap; And laminating machine, it is used for this mounting strap mutually stacked with the film that has kept the adhesion layer that is within the described line of cut and lower protective layer, finishes the adhesive tape manufacturing thus.
Preferably, this mounting strap indicates and the corresponding mark of described line of cut.In this case; the device of manufacturing adhesive tape of the present invention can also comprise non-contact sensor; this non-contact sensor is installed in this mounting strap and has kept the adhesion layer that is within the described line of cut and the contacted position of film of lower protective layer, comes the accurate coupling between the described mark of the described line of cut of sensing and this mounting strap thus.
Preferably, this cutting element forms described line of cut in the part that extends to lower protective layer.In this case, the degree of depth of described line of cut in lower protective layer is no more than 90% of lower protective layer thickness.
The device that is used to make adhesive tape according to the present invention can also comprise: the mounting strap cutting element, it is provided with the rear portion with this laminating machine, with described line of cut be separated by the position of predetermined distance, in this mounting strap, form circular line of cut; And withdrawer, it is used for reclaiming the mounting strap outside the described line of cut that is in this mounting strap.In this case, this mounting strap cutting element is preferably formed in the part that extends to lower protective layer the described line of cut in this mounting strap.The degree of depth of described line of cut in lower protective layer is no more than 90% of lower protective layer thickness.
The device that is used to make adhesive tape according to the present invention can also comprise the winding roller that is used for the cutting unit that the two ends of described stacked adhesive tape are cut and is used for described adhesive tape stacked and that finish is batched.
Preferably this cutting element is Tang Pusen stamping machine or rotary knife cutter.
In another program of the present invention, a kind of method that is used to make the adhesive tape that uses for semiconductor production also is provided, this method comprises: (a) supply with film, this film by adhesion layer and the last protective layer and the lower protective layer that adhere to respectively on this adhesion layer upper and lower surface constitute; (b) in the adhesion layer of this film and last protective layer, form the corresponding line of cut of shape with semiconductor wafer; (c) reclaim by the waste material that last protective layer and adhesion layer constituted that is in outside the described line of cut; (d) remove the last protective layer that is within the described line of cut; (e) supply with mounting strap, so that this mounting strap is faced mutually with the adhesion layer of removing the film of going up protective layer; And it is (f) that this mounting strap is mutually stacked with the film that has kept the adhesion layer that is within the described line of cut and lower protective layer.
Description of drawings
From the explanation of following embodiment in conjunction with the accompanying drawings, other purpose of the present invention and scheme will become clearer.In the accompanying drawings:
Fig. 1 a to Fig. 1 c and Fig. 1 e show according to the process of prior art manufacturing for the adhesive tape of semiconductor production use;
Fig. 1 d is the sectional view of doing along d-d ' line of Fig. 1 c;
Fig. 1 f is the sectional view of being done along the f-f line of Fig. 1 e;
Fig. 2 shows according to the preferred embodiment of the present invention, be used to make the schematic representation of apparatus of the adhesive tape that uses for semiconductor production;
Fig. 3 shows according to the preferred embodiment of the present invention, be used to make the schema of the method for the adhesive tape that uses for semiconductor production;
Fig. 4 is the sectional view of doing along IV-IV ' line of Fig. 2;
Fig. 5 is the sectional view of doing along V-V ' line of Fig. 2;
Fig. 6 is the sectional view of doing along VI-VI ' line of Fig. 2;
Fig. 7 is the sectional view of doing along VII-VII ' line of Fig. 2;
Fig. 8 is the sectional view of doing along VIII-VIII ' line of Fig. 2;
Fig. 9 shows the sectional view of the line of cut that forms on the film of Fig. 8;
Figure 10 show utilization according to the preferred embodiment of the invention, be used to make the orthographic plan of adhesive tape of the device manufacturing of the adhesive tape that uses for semiconductor production, this adhesive tape is attached on the semiconductor wafer;
Figure 11 is the sectional view of doing along X-X ' line of Figure 10; And
Figure 12 to Figure 15 is the stripping and slicing operation that shows the semiconductor wafer that is pasted with adhesive tape respectively, the sectional view that picks up operation, crystal block liner (die padding) operation and routing joint operation.
Embodiment
Hereinafter describe the preferred embodiments of the present invention with reference to the accompanying drawings in detail.Before explanation, be noted that, employed term should not be construed as and is limited to implication general and dictionary in the specification sheets and the claim of enclosing, but should be based on the principle that allows the inventor to be suitable for best interpretations ground to limit term, make an explanation with pairing implication of technical scheme of the present invention and notion.Therefore, the preferred embodiment that only is used for the example intention that is illustrated as given herein is not intended to limit the scope of the invention, so be noted that under the situation that does not break away from the spirit and scope of the present invention, can carry out other to the present invention and be equal to substitutions and modifications.
At first, it should be noted that following embodiment relates to the apparatus and method of making the flexible tie in the adhesive tape that uses for semiconductor production.Yet the present invention is not limited to the adhesive tape of particular type.
Fig. 2 shows the device that is used to make flexible tie according to the preferred embodiment of the present invention.
With reference to Fig. 2, the flexible tie manufacturing installation of this embodiment comprises: membrane supplying device 110, it is used to supply with film 50, this film 50 by elastic layer and the protective layer that adheres to respectively on this elastic layer upper and lower surface constitute; Cutting element 120, it is used for forming line of cut 60 on protective layer and the elastic layer on the film of being supplied with by membrane supplying device 110 50; Withdrawer (retriever) 130, it is used to reclaim the waste material that last protective layer and elastic layer constituted that is in outside the line of cut 60; Stripper (remover) 140, it is used to remove the last protective layer that is within the line of cut 60; Mounting strap feeder 150, it is used to provide mounting strap 54; And laminating machine 160, it is used for mounting strap 54 stacked with the film 64 of having removed last protective layer.
Membrane supplying device 110 has the winding roller shape, and is installed in a side of the flexible tie manufacturing installation of this embodiment.Membrane supplying device 110 batches film 50 and subsequently film 50 is emitted to supply with film 50 continuously.
Fig. 4 is the sectional view of doing along IV-IV ' line of Fig. 2, and as shown in Figure 4, film 50 comprises elastic layer 52 and adheres to last protective layer 51 and lower protective layer 53 on the upper and lower surface of this elastic layer 52 respectively.Elastic layer 52 is made by the epoxy rubber material with low modulus performance, and this can reduce the thermal stresses that difference produced owing to the thermal expansivity between semi-conductor chip and the substrate, and improves the reliability of semiconductor packages thus.Last protective layer 51 and lower protective layer 53 prevent that elastic layer 52 is subjected to the influence of outside atmosphere in the flexible tie manufacturing processed, and described protective layer preferably (PolyEthylene Terephthalate PET) makes by polyethylene terephthalate.Elastic layer 52 can adopt individual layer or a plurality of bonding coat to construct.
Cutting element 120 is installed on the transfer limes of the film 50 of being emitted by membrane supplying device 110, and forms the corresponding line of cut 60 of shape (for example, circular line of cut) with semiconductor wafer in last protective layer 51 and elastic layer 52.Preferably, line of cut 60 forms the lower surface (referring to (a) figure of Fig. 4) that extends to elastic layer 52 from the upper surface of last protective layer 51.More preferably, line of cut 60 forms from the upper surface of last protective layer 51 and extends to (referring to (b) figure of Fig. 4) the lower protective layer 53 via elastic layer 52.Under line of cut 60 was formed up to situation in the lower protective layer 53, the degree of depth of line of cut 60 preferably was no more than 90% of lower protective layer 53 thickness.If line of cut 60 is formed in the part of lower protective layer 53, then be easy to the last protective layer 51 and the elastic layer 52 that are in outside the line of cut 60 are removed.Preferably, cutting element 120 is Tang Pusen stamping machine (Thompson press) or rotary knife cutter.Yet cutting element of the present invention is not limited to this.
It is other that withdrawer 130 is installed in cutting element 120, and retrieve from film 50, by being in the waste material 62 that last protective layer 51 outside the line of cut 60 and elastic layer 52 are constituted.Withdrawer 30 adopts the roller structure, to batch the waste material 62 of emitting from film 50 continuously.
Stripper 140 is removed from the last protective layer 51 that has been reclaimed the zone 61 that will be on the film 63 of waste material 62 within the line of cut 60 by withdrawer 130.Stripper 140 can be selected from the various well known devices that satisfy requirement of the present invention.
Mounting strap feeder 150 is installed in a side of this film transfer limes, to supply with mounting strap 54 continuously.Mounting strap 54 plays the effect of supporting semiconductor wafers in semiconductor wafer stripping and slicing operation.Mounting strap 54 is marked with and line of cut 60 corresponding marks 56.
Laminating machine 160 is mutually stacked with the film 64 of having removed last protective layer 51 with mounting strap 54.At this moment, preferably non-contact sensor 170 is installed, so that be in zone within the line of cut 60 of elastic layer 52 and the mark 56 of mounting strap 54 is complementary in film 64 and mounting strap 54 contacted positions.
This flexible tie manufacturing installation also comprises cutting element 125, and it is used for forming line of cut 66 (referring to Fig. 9) at the profile phase with the elastic layer 52 that is inserted into film 65 every the position of predetermined distance.Preferably, line of cut 66 forms the upper surface from the lower surface of mounting strap 54 to mounting strap 54.More preferably, line of cut 66 forms from the lower surface of mounting strap 54 and extends to the lower protective layer 53 via the upper surface of mounting strap 54.The degree of depth that is formed on the line of cut 66 in the lower protective layer 53 preferably is no more than 90% of lower protective layer 53 thickness.If line of cut 66 extends in the lower protective layer 53, then be easy in waste material removal operation subsequently, remove waste material.Be provided with withdrawer 135 at the rear portion of cutting element 125, this withdrawer 135 is used for the mounting strap 54 that is in outside the line of cut 66 is removed, to remove unwanted waste material continuously.
Preferably, this flexible tie manufacturing installation also comprises the cutting unit 180 of two ends cutting to obtain required width that is used for flexible tie 65.
Preferably, this flexible tie manufacturing installation also comprises the winding roller 190 that is used to batch and store the flexible tie of finishing 65.
Although do not illustrate among these figure, cutting element 120, stripper 140, cutting element 125 and cutting unit 180 can be arranged in parallel along the width of film.In this case, can in an operation, make a plurality of adhesive tapes, thereby boost productivity for the semiconductor production use.
This flexible tie manufacturing installation utilizes simpler operation to make flexible tie, and need not a plurality of operations by production line of configuration, can make issuable minimize contamination in various operations, and can also boost productivity.
Fig. 3 shows the method that is used to make flexible tie according to the present invention, and Fig. 4 to Fig. 9 shows the sectional view of the thin-membrane section in each operation that the device execution flexible tie that adopts Fig. 2 is made.
With reference to Fig. 3 to Fig. 9, flexible tie manufacture method according to the present invention provides film 50, and this film 50 is provided with elastic layer 52 and sticks to protective layer 51 and 53 (step S10) on the upper and lower surface of this elastic layer 52 respectively.
Subsequently, on the film of being supplied with 50, form as shown in Figure 4 line of cut 60 (for example circular line of cut) (step S20) in protective layer 51 and the elastic layer 52.Line of cut 60 is corresponding with the shape of semiconductor wafer.Line of cut 60 more preferably extends in the lower protective layer 51, shown in (b) figure of Fig. 4.
Again, will be by being in the waste recovery (step S30) that last protective layer 51 outside the line of cut 60 and elastic layer 52 are constituted.The section of the waste material 62 that reclaims as shown in Figure 5.
The film 53 of having removed waste material 62 has section as shown in Figure 6, wherein protective layer 53, be formed on the round and elastic layer 52 on the protective layer 53 and circular to go up protective layer 51 mutually stacked.
Then, as shown in Figure 7, will be in line of cut 60 and remove (step S40) with the last protective layer in the interior zone 51.After this operation, the round and elastic layer 52 on film 64 is configured to lower protective layer 53 and is formed on lower protective layer 53 is mutually stacked.
After this, the mounting strap of preparing separately 54 is supplied to the transfer limes (step S50) of film.Then, mounting strap 54 and the film 64 stacked (step S60) of having removed last protective layer, as shown in Figure 8.At this moment, the mark that is marked with of mounting strap 54 should be accurately be complementary with the round and elastic layer 52 of film.In this operation, the cross-section structure of stacked film 65 becomes mounting strap 54, elastic layer 52 and lower protective layer 53 to stack gradually.
After the stacked operation of mounting strap 54 is finished, form line of cut 66 (step S70) in profile spaced positions, as shown in Figure 9 with elastic layer 52.Preferably, line of cut 66 forms the upper surface that extends to mounting strap 54 from the lower surface of mounting strap 54.More preferably, line of cut 66 forms from the lower surface of mounting strap 54 and extends to the lower protective layer 53 via the upper surface of mounting strap 54.
Subsequently, remove the waste material (step S80) that is constituted by the mounting strap 54 that is in outside the line of cut 66.After this, will remove film two ends cutting behind the waste material, batch the manufacturing (step S100) of film after again to finish flexible tie to obtain suitable width (step S90).
Figure 10 to Figure 15 shows the synoptic diagram of operation performed after the flexible tie 65 that utilizes above-mentioned manufacturing is produced semiconductor wafer.
With reference to Figure 10 to Figure 15, the flexible tie of finishing via said process 65 just sticks on the surface of semiconductor wafer 71 after lower protective layer 53 is removed, and (Steel UseStainless, SUS) annular frame 72 is attached at mounting strap 54 with stainless steel subsequently.
By adopting the stripping and slicing operation of stripping and slicing saw 73, cut into crystal block shown in Figure 12 75 as the above-mentioned semiconductor wafer 71 that is connected with flexible tie 65 subsequently.Crystal block 75 and elastic layer 52 are picked up by pickup device 74, as shown in figure 13.Subsequently, as shown in figure 14, crystal block 75 that picks up and elastic layer 52 thermofixations are thus with crystal block 75 and crystal block liner 77 integrators.After this, as shown in figure 15, carry out routing joint 78, before encapsulation, finish semiconductor component thus with respect to semi-conductor crystal block 75 and crystal block liner 77.
The present invention is based on limited embodiment and accompanying drawing has been described in detail.But, be noted that, only provide in the detailed description of the explanation preferred embodiment of the present invention and specific example in the mode of example, because from this describes in detail, under the situation that does not break away from the spirit and scope of the present invention, those skilled in the art is variations and modifications of the present invention apparently.
Industrial applicibility
As mentioned above, the present invention can reduce institute in the process of making the adhesive tape that uses for semiconductor production The consumption of the diaphragm that uses. In addition, the present invention is simple by all process steps being set on the circuit Change complicated operation, and the present invention can also boost productivity and prevent in the complicated procedures of forming issuable Pollute.
Claims (19)
1. device that is used to make the adhesive tape that uses for semiconductor production comprises:
The membrane supplying device, it is used to supply with film, and this film has adhesion layer and adheres to last protective layer and lower protective layer on the upper and lower surface of this adhesion layer respectively;
Cutting element, it is used at the adhesion layer of the film of this membrane supplying device supply and last protective layer forms and the corresponding line of cut of shape of semiconductor wafer;
Withdrawer, it is used to reclaim by being in the waste material that last protective layer outside the described line of cut and adhesion layer constitute;
Stripper, it is used to remove the last protective layer that is within the described line of cut;
The mounting strap feeder, it is used to supply with mounting strap; And
Laminating machine, its be used for this mounting strap and kept the adhesion layer that is within the described line of cut and the film of lower protective layer mutually stacked, finish the manufacturing of adhesive tape thus.
2. the device that is used to make the adhesive tape that uses for semiconductor production according to claim 1, wherein this mounting strap indicates and the corresponding mark of described line of cut; And
Wherein this device also comprises non-contact sensor; this non-contact sensor is installed in this mounting strap and has kept the adhesion layer that is within the described line of cut and the contacted position of film of lower protective layer, comes the accurate coupling between the described mark of the described line of cut of sensing and this mounting strap thus.
3. the device that is used to make the adhesive tape that uses for semiconductor production according to claim 1, wherein this cutting element forms in the part that extends to this lower protective layer described line of cut.
4. the device that is used to make the adhesive tape that uses for semiconductor production according to claim 3, the degree of depth of wherein said line of cut in this lower protective layer is no more than 90% of this lower protective layer thickness.
5. the device that is used to make the adhesive tape that uses for semiconductor production according to claim 1, this device also comprises:
The mounting strap cutting element, it is arranged on the rear portion of this laminating machine, with described line of cut be separated by the position of predetermined distance, in this mounting strap, form circular line of cut; And
Withdrawer, it is used for reclaiming the mounting strap outside the described line of cut that is in this mounting strap.
6. the device that is used to make the adhesive tape that uses for semiconductor production according to claim 5, wherein this mounting strap cutting element forms in the part that extends to this lower protective layer the described line of cut in this mounting strap.
7. the device that is used to make the adhesive tape that uses for semiconductor production according to claim 6, the degree of depth of wherein said line of cut in this lower protective layer is no more than 90% of this lower protective layer thickness.
8. the device that is used to make the adhesive tape that uses for semiconductor production according to claim 1, this device also comprise and are used for cutting unit that the two ends of stacked described adhesive tape are cut.
9. the device that is used to make the adhesive tape that uses for semiconductor production according to claim 1, this device also comprise and are used for winding roller that described adhesive tape stacked and that finish is batched.
10. be used to make the device of the adhesive tape that uses for semiconductor production according to claim 1 or 5, wherein said cutting element is Tang Pusen stamping machine or rotary knife cutter.
11. a method that is used to make the adhesive tape that uses for semiconductor production comprises the steps:
(a) supply with film, this film has adhesion layer and adheres to last protective layer and lower protective layer on the upper and lower surface of this adhesion layer respectively;
(b) in the adhesion layer of this film and last protective layer, form the corresponding line of cut of shape with semiconductor wafer;
(c) reclaim by being in the waste material that last protective layer outside the described line of cut and adhesion layer constitute;
(d) remove the last protective layer that is within the described line of cut;
(e) supply with mounting strap, so that this mounting strap is faced mutually with the adhesion layer of the film of having removed last protective layer; And
(f) this mounting strap is mutually stacked with the film that has kept the adhesion layer that is within the described line of cut and lower protective layer.
12. the method that is used to make the adhesive tape that uses for semiconductor production according to claim 11, wherein this mounting strap indicates and the corresponding mark of described line of cut; And
Wherein, in step (f),, the described mark of described line of cut and this mounting strap is accurately mated by utilizing non-contact sensor.
13. the method that is used to make the adhesive tape that uses for semiconductor production according to claim 11 wherein, in step (b), forms in the part that extends to this lower protective layer described line of cut.
14. the method that is used to make the adhesive tape that uses for semiconductor production according to claim 13, the degree of depth of wherein said line of cut in this lower protective layer is no more than 90% of this lower protective layer thickness.
15. the method that is used to make the adhesive tape that uses for semiconductor production according to claim 11, in step (f) afterwards, this method also comprises the steps:
(g) with the be separated by position of predetermined distance of described line of cut, in this mounting strap, form circular line of cut; And
(h) reclaim mounting strap outside the described line of cut be in this mounting strap;
16. the method that is used to make the adhesive tape that uses for semiconductor production according to claim 15 wherein, in step (g), extends in the part of this lower protective layer the described line of cut that forms in this mounting strap.
17. the method that is used to make the adhesive tape that uses for semiconductor production according to claim 16, the degree of depth of wherein said line of cut in this lower protective layer is no more than 90% of this lower protective layer thickness.
18. the method that is used to make the adhesive tape that uses for semiconductor production according to claim 11, wherein, this method also comprises cuts the two ends of stacked described adhesive tape.
19. the method that is used to make the adhesive tape that uses for semiconductor production according to claim 11, wherein, this method also comprises batches stacked described adhesive tape.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR20050022369 | 2005-03-17 | ||
| KR1020050022369 | 2005-03-17 | ||
| KR1020060015023 | 2006-02-16 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1837311A true CN1837311A (en) | 2006-09-27 |
| CN100410343C CN100410343C (en) | 2008-08-13 |
Family
ID=37014824
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2006100596551A Expired - Fee Related CN100410343C (en) | 2005-03-17 | 2006-03-17 | Apparatus and method for manufacturing adhesive tape for semiconductor production |
Country Status (2)
| Country | Link |
|---|---|
| KR (1) | KR100725289B1 (en) |
| CN (1) | CN100410343C (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103715117A (en) * | 2012-09-28 | 2014-04-09 | 株式会社东芝 | Device and method for manufacturing semiconductor device |
| CN104441023A (en) * | 2014-11-28 | 2015-03-25 | 苏州米达思精密电子有限公司 | Waste discharge device for reinforcing panel carrier plate production |
| CN112020768A (en) * | 2018-04-24 | 2020-12-01 | 迪思科高科技(欧洲)有限公司 | Apparatus and method for attaching protective tape to semiconductor wafer |
| CN113335985A (en) * | 2021-06-10 | 2021-09-03 | 广州彩邦印刷有限公司 | Processing technology of adhesive label paper |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| KR100964653B1 (en) | 2008-02-20 | 2010-06-22 | 주식회사바텍 | Method for fabricating large area x-ray detector using an optical tape |
| KR101147420B1 (en) | 2010-02-24 | 2012-05-22 | 삼성모바일디스플레이주식회사 | Lamination sheet and Method for manufacturing the same |
| JP5423563B2 (en) * | 2010-04-23 | 2014-02-19 | デクセリアルズ株式会社 | Manufacturing method of semiconductor chip |
| KR101277999B1 (en) * | 2011-10-13 | 2013-06-27 | 주식회사 네패스 | Method of fabricating semiconductor chip |
| TWI487896B (en) * | 2013-09-18 | 2015-06-11 | Yeou Feng Trading Co Ltd | Method for inspecting dies on wafer |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5951759B2 (en) * | 1979-02-14 | 1984-12-15 | 株式会社フジクラ | Continuous film lamination device |
| JP3600388B2 (en) * | 1996-11-28 | 2004-12-15 | 株式会社小森コーポレーション | Double-sided adhesive tape application device |
| JP2001089013A (en) * | 1999-09-20 | 2001-04-03 | Canon Inc | Sticking method and sticking device for sheet member |
| JP2002367931A (en) * | 2001-06-07 | 2002-12-20 | Lintec Corp | Apparatus and method for pasting die bonding sheet |
| JP4187065B2 (en) * | 2003-01-17 | 2008-11-26 | 日東電工株式会社 | Adhesive tape application method and apparatus |
| EP1473152A1 (en) * | 2003-04-30 | 2004-11-03 | Kba-Giori S.A. | Machine for applying and cutting strips of laminate |
-
2006
- 2006-02-16 KR KR1020060015023A patent/KR100725289B1/en not_active IP Right Cessation
- 2006-03-17 CN CNB2006100596551A patent/CN100410343C/en not_active Expired - Fee Related
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103715117A (en) * | 2012-09-28 | 2014-04-09 | 株式会社东芝 | Device and method for manufacturing semiconductor device |
| CN103715117B (en) * | 2012-09-28 | 2016-11-16 | 株式会社东芝 | The manufacture device of semiconductor device and the manufacture method of semiconductor device |
| CN104441023A (en) * | 2014-11-28 | 2015-03-25 | 苏州米达思精密电子有限公司 | Waste discharge device for reinforcing panel carrier plate production |
| CN112020768A (en) * | 2018-04-24 | 2020-12-01 | 迪思科高科技(欧洲)有限公司 | Apparatus and method for attaching protective tape to semiconductor wafer |
| US11935768B2 (en) | 2018-04-24 | 2024-03-19 | Disco Hi-Tec Europe Gmbh | Device and method for attaching protective tape on semiconductor wafer |
| CN113335985A (en) * | 2021-06-10 | 2021-09-03 | 广州彩邦印刷有限公司 | Processing technology of adhesive label paper |
| CN113335985B (en) * | 2021-06-10 | 2023-01-06 | 广州彩邦标签有限公司 | Processing technology of adhesive label paper |
Also Published As
| Publication number | Publication date |
|---|---|
| KR100725289B1 (en) | 2007-06-07 |
| CN100410343C (en) | 2008-08-13 |
| KR20060101235A (en) | 2006-09-22 |
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