TWI707818B - Substrate transfer method and substrate transfer apparatus - Google Patents

Substrate transfer method and substrate transfer apparatus Download PDF

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TWI707818B
TWI707818B TW106106931A TW106106931A TWI707818B TW I707818 B TWI707818 B TW I707818B TW 106106931 A TW106106931 A TW 106106931A TW 106106931 A TW106106931 A TW 106106931A TW I707818 B TWI707818 B TW I707818B
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adhesive tape
substrate
tape
wafer
cut
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TW201738164A (en
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松下孝夫
山本雅之
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日商日東電工股份有限公司
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/79—Apparatus for Tape Automated Bonding [TAB]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/86—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using tape automated bonding [TAB]

Abstract

以黏著帶T1在下方的方式保持安裝框架MF1，沿著晶圓W的外形切斷黏著帶T1，將被切下的黏著帶T1回收。對晶圓W供給新的環狀框架f2，涵蓋晶圓W與環狀框架的上面貼附新的黏著帶T2。突出晶圓W外側之部分的黏著帶T1係從晶圓W被分離、回收，所以可確實地避免轉印時黏著帶T1與黏著帶T2接著。 Hold the mounting frame MF1 with the adhesive tape T1 below, cut the adhesive tape T1 along the outline of the wafer W, and collect the cut adhesive tape T1. A new ring frame f2 is supplied to the wafer W, covering the wafer W and a new adhesive tape T2 attached to the upper surface of the ring frame. The adhesive tape T1 protruding from the outer side of the wafer W is separated and recovered from the wafer W, so the adhesive tape T1 and the adhesive tape T2 can be reliably prevented from adhering during the transfer.

Description

基板轉印方法及基板轉印裝置 Substrate transfer method and substrate transfer device

本發明係有關對隔介黏著帶接著保持於環狀框架(ring frame)的半導體晶圓、電路基板、LED(Light Emitting Diode)等各種基板實施所期望的處理之後，重新轉印到新的黏著帶之基板轉印方法及基板轉印裝置。 The present invention relates to various substrates such as semiconductor wafers, circuit substrates, LED (Light Emitting Diode), etc., which are then held on a ring frame by an intermediary adhesive tape, and then transferred to a new adhesive after performing desired processing Belt substrate transfer method and substrate transfer device.

採用半導體晶圓為例作為基板，實施如以下的處理。一般的半導體晶圓(以下，簡稱「晶圓」)，係在其表面形成有多數元件的電路圖案後，在其表面貼附保護帶來加以保護。將表面受保護的晶圓在背面研磨工序中從背面進行研削或者研磨加工以作成所期望的厚度。從薄型化的晶圓將保護帶剝離並搬送至切割工序之前，為了補強晶圓，會隔介支持用黏著帶(切割帶)將晶圓接著保持於環狀框架。 Using a semiconductor wafer as an example as a substrate, the following processing is performed. Generally, semiconductor wafers (hereinafter referred to as "wafers") are formed with circuit patterns of many components on the surface, and then a protective tape is attached to the surface for protection. The wafer with the protected surface is ground or polished from the back surface in the back grinding process to have a desired thickness. The protective tape is peeled from the thinned wafer and transported to the dicing process. In order to reinforce the wafer, the wafer is then held on the ring frame via a support adhesive tape (dicing tape).

接著保持於環狀框架的晶圓，其加工工序係依據所製造的半導體晶片而異。例如，在將半導體晶片微細化的情況下，進行雷射切割處理。此時，若從形成有電路圖案的表面進行切割，則電路會受到熱的影響而破損，故在背面研磨處理前必須從背面進行半切(half cut)。在將經半切的晶圓破斷(breaking)後將各晶片安裝於所期望的位置之際，係從表面以吸具(collet)進行吸附來進行搬送，所以要將表面的黏著帶及保護帶剝離。由此黏著帶等已剝離之晶圓的背面側，重新貼附黏著帶，並接著保持於新的環狀框架後，再將晶圓破斷。亦即，在破斷前必須將晶圓重新轉印到新的環狀框架。 The processing steps of the wafers held in the ring frame vary depending on the semiconductor wafers to be manufactured. For example, in the case of miniaturizing a semiconductor wafer, a laser cutting process is performed. At this time, if cutting is made from the surface on which the circuit pattern is formed, the circuit will be damaged by the influence of heat. Therefore, it is necessary to perform a half cut from the back before the back grinding process. cut). When the half-cut wafer is broken and then mounted to the desired position, the wafer is transported by suction from the surface with a collet, so the adhesive tape and protective tape on the surface Peel off. As a result, the back side of the peeled wafer such as the adhesive tape is reattached to the adhesive tape and then held in a new ring frame before the wafer is broken. That is, the wafer must be re-transferred to a new ring frame before breaking.

該轉印時，係以在環狀框架和晶圓之間露出之黏著帶的黏著面與新貼附之黏著帶的黏著面不會接著之方式，使環狀框架和晶圓相對地疏離移動以使黏著帶彈性變形，藉此在厚度方向獲取間隙(gap)(參照專利文獻1、2)。又，作為用以避免兩個黏著帶彼此黏著的其他習知例，亦使用在所露出之黏著帶的黏著面彼此間，插入非黏著性接著防止板之方法(參照專利文獻3)。 During this transfer, the adhesive surface of the adhesive tape exposed between the ring frame and the wafer does not adhere to the adhesive surface of the newly attached adhesive tape, so that the ring frame and the wafer move relatively apart. The adhesive tape is elastically deformed to obtain a gap in the thickness direction (see Patent Documents 1 and 2). In addition, as another conventional example for preventing two adhesive tapes from sticking to each other, a method of inserting a non-adhesive adhesive prevention plate between the adhesive surfaces of the exposed adhesive tapes is also used (refer to Patent Document 3).

專利文獻1 日本特開2011-29434號公報 Patent Document 1 JP 2011-29434 A

專利文獻2 日本特開2007-220693號公報 Patent Document 2 JP 2007-220693 A

專利文獻3 日本特開2012-244013號公報 Patent Document 3 JP 2012-244013 A

然而，上述習知方法會有如次之問題。 However, the above-mentioned conventional methods have the following problems.

亦即，當所使用的黏著帶較柔軟時，可有效地使習知方法發揮功能。然而，在為了使晶圓保持剛性而採用硬質(例如PET)的黏著帶之情況，會難以彈性變形，所以即便想要使環狀框架和晶圓相對地疏離移動，也會無法充分地獲取間隙。亦即，會有無法避免黏著帶彼此的接著之類的問題。 That is, when the adhesive tape used is relatively soft, the conventional method can effectively function. However, when a hard (for example, PET) adhesive tape is used to keep the wafer rigid, it is difficult to elastically deform, so even if the ring frame and the wafer are relatively moved apart, the gap cannot be sufficiently obtained. . In other words, there may be problems such as the unavoidable adhesion of the adhesive tapes to each other.

又，關於將接著防止板插入黏著面彼此間的方法，在使用黏著力強的黏著帶之情況下，使接著防止板和黏著帶解離時需要強的力。因此，在將已接著的狀態的黏著帶分離時過度的張力會作用於晶圓，所以恐有導致晶圓破損之類的問題之虞。 In addition, regarding the method of inserting the adhesion prevention plate between the adhesive surfaces, when an adhesive tape with strong adhesive force is used, a strong force is required to dissociate the adhesion prevention plate and the adhesive tape. Therefore, excessive tension will act on the wafer when separating the adhesive tape in the attached state, which may cause problems such as damage to the wafer.

本發明係有鑑於此種情事而開發者，其主要目的在提供一種可將基板以良好精度轉印到新的黏著帶之基板轉印方法及基板轉印裝置。 The present invention was developed in view of this situation, and its main purpose is to provide a substrate transfer method and substrate transfer device that can transfer a substrate to a new adhesive tape with good accuracy.

本發明為了達成此種目的，採用如下之構成。 In order to achieve this objective, the present invention adopts the following configuration.

亦即，本發明係將隔介支持用第1黏著帶接著保持於環狀框架內之基板轉印到第2黏著帶之基板轉印方法，其特徵為具備：保持工序，從前述第1黏著帶側將前述環狀框架及前述基板以保持構件加以保持；帶切斷工序，沿著被前述保持構件所保持的前述基板的外形，切斷前述第1黏著帶；帶回收工序，將被切下的前述第1黏著帶回收；及轉印工序，在前述帶回收工序後，從前述基板的非保持面側貼附前述第2黏著帶來進行轉印。 That is, the present invention is a substrate transfer method that transfers the first adhesive tape for intermediary support to the second adhesive tape from the substrate held in the ring frame, and is characterized by comprising: a holding step, from the first adhesive tape On the tape side, the annular frame and the substrate are held by a holding member; the tape cutting step is to cut the first adhesive tape along the outer shape of the substrate held by the holding member; the tape recycling step is to be cut The following first adhesive tape recovery; and the transfer process, after the tape recovery process, the second adhesive tape is attached from the non-retaining surface side of the substrate to perform transfer.

(作用、效果)根據此方法，沿著所保持之基板的外形切斷第1黏著帶，將切下的第1黏著帶回收。因此，不論高度或黏著力等黏著帶的特性，第1黏著帶中自基板的外徑突出的黏著面所露出的部分會被回收。因此，從第1黏著帶朝第2黏著帶進行轉印之際，可適 當地避免第1黏著帶與第2黏著帶的黏著面彼此接著，而不會受到黏著帶的特性影響。 (Function and Effect) According to this method, the first adhesive tape is cut along the outer shape of the substrate held, and the cut first adhesive tape is recovered. Therefore, regardless of the characteristics of the adhesive tape such as height or adhesive strength, the portion of the first adhesive tape that is exposed from the adhesive surface protruding from the outer diameter of the substrate is recovered. Therefore, when transferring from the first adhesive tape to the second adhesive tape, Locally avoid the adhesive surfaces of the first adhesive tape and the second adhesive tape from adhering to each other without being affected by the characteristics of the adhesive tape.

此外，上述轉印過程中，關於基板朝新的黏著帶的轉印，可以例如下述方式實施。 In addition, in the above-mentioned transfer process, the transfer of the substrate to the new adhesive tape can be implemented in the following manner, for example.

在前述帶切斷工序中，係以前述第1黏著帶自前述基板的外徑突出之部分的長度會成為前述基板的厚度以下之方式，切斷前述第1黏著帶較佳。根據此方法，即便在自基板的外徑突出外側的部分在晶圓的端部變形之情況下，也能確實地避免第1黏著帶與第2黏著帶接觸。因此，在從第1黏著帶轉印到第2黏著帶之際，由於可更確實地避免第1黏著帶與第2黏著帶的黏著面彼此接著，所以可進一步提升轉印的精度。 In the tape cutting step, it is preferable to cut the first adhesive tape so that the length of the portion of the first adhesive tape protruding from the outer diameter of the substrate becomes less than the thickness of the substrate. According to this method, even when the portion protruding to the outside from the outer diameter of the substrate is deformed at the end of the wafer, it is possible to reliably avoid the contact between the first adhesive tape and the second adhesive tape. Therefore, when transferring from the first adhesive tape to the second adhesive tape, since the adhesion surfaces of the first adhesive tape and the second adhesive tape can be prevented more reliably, the accuracy of the transfer can be further improved.

亦可令前述基板保持在比基板的直徑小的保持構件，將基板轉印到第2黏著帶。根據此方法，在帶切斷工序中能夠以貫通第1黏著帶的方式切斷，所以可更確實地將第1黏著帶沿著基板的外形切斷。因此，在轉印工序中可更確實地避免第1黏著帶與第2黏著帶接著。又，藉由將保持構件小型化，可避免基板轉印裝置大型化。 The substrate may be held by a holding member smaller than the diameter of the substrate, and the substrate may be transferred to the second adhesive tape. According to this method, the first adhesive tape can be cut to penetrate through the first adhesive tape in the tape cutting step, so the first adhesive tape can be cut more reliably along the outer shape of the substrate. Therefore, it is possible to more reliably avoid the adhesion of the first adhesive tape and the second adhesive tape in the transfer process. In addition, by miniaturizing the holding member, it is possible to avoid an increase in the size of the substrate transfer device.

此外，在上述轉印過程中，關於基板朝新的黏著帶的轉印，係可以例如下述方式實施。 In addition, in the above-mentioned transfer process, the transfer of the substrate to the new adhesive tape can be implemented in the following manner, for example.

第一，在帶切斷工序中，亦可使用切斷刃來切斷第1黏著帶。 First, in the tape cutting step, a cutting blade may be used to cut the first adhesive tape.

第二，在帶切斷工序中，亦可使用雷射來切斷第1黏著帶。 Second, in the tape cutting process, a laser can also be used to cut the first adhesive tape.

根據此方法，由於可將第1黏著帶適當地沿著基板的外形切斷，故在轉印工序中可更確實地避免第1黏著帶與第2黏著帶接著。 According to this method, since the first adhesive tape can be appropriately cut along the outer shape of the substrate, it is possible to more reliably avoid the adhesion of the first adhesive tape and the second adhesive tape in the transfer process.

又，在帶回收工序中，較佳為將接著於環狀框架的狀態下之被切下的第1黏著帶連同環狀框架一起回收。 Furthermore, in the tape recovery step, it is preferable to recover the first adhesive tape that has been cut out in a state following the ring frame together with the ring frame.

根據此方法，藉由將更難以變形的環狀框架保持並回收，可將切下的第1黏著帶回收。因此，可更容易且確實地回收被切下的第1黏著帶。 According to this method, by holding and recovering the ring frame which is more difficult to deform, the cut-out first adhesive tape can be recovered. Therefore, it is possible to more easily and reliably recover the cut first adhesive tape.

又，在轉印工序中，較佳為將預先貼附有第2黏著帶的新環狀框架與基板重疊，從基板的非保持面側貼附第2黏著帶以進行轉印。 Furthermore, in the transfer step, it is preferable to overlap the substrate with a new ring frame to which the second adhesive tape is attached in advance, and to attach the second adhesive tape from the non-holding surface side of the substrate to perform transfer.

根據此方法，由於預先在環狀框架貼附有第2黏著帶，故在基板的轉印方面，可縮短工序及時間。因此，可提升基板的轉印效率。 According to this method, since the second adhesive tape is attached to the ring frame in advance, the process and time can be shortened in terms of substrate transfer. Therefore, the transfer efficiency of the substrate can be improved.

又，本發明為了達成此種目的，可採用如次之構成。 Furthermore, in order to achieve such an object, the present invention may adopt the following configurations.

亦即，在隔介支持用第1黏著帶將接著保持於環狀框架內的基板轉印到第2黏著帶之基板轉印裝置中，其特徵為：基板保持部，隔介前述第1黏著帶保持前述基板；框架保持部，用於保持前述環狀框架；帶切斷部，沿著被前述基板保持部所保持的前述基板的外形，切斷前述第1黏著帶； 帶回收部，將被前述帶切斷部切下的前述第1黏著帶回收；及轉印機構，將被切下的前述第1黏著帶回收後，從前述基板的非保持面側貼附前述第2黏著帶以進行轉印。 That is, in the substrate transfer device that transfers the substrate held in the ring frame to the second adhesive tape with the first adhesive tape for intermediary support, it is characterized in that the substrate holding portion intervenes the first adhesive tape. A belt holding the aforementioned substrate; a frame holding portion for holding the aforementioned annular frame; a belt cutting portion for cutting the first adhesive tape along the outer shape of the aforementioned substrate held by the aforementioned substrate holding portion; The tape recovery part recovers the first adhesive tape cut by the tape cutting part; and the transfer mechanism collects the cut first adhesive tape, and then attaches the first adhesive tape from the non-retaining surface side of the substrate The second adhesive tape for transfer.

(作用、效果)根據此構成，可適當地實施上述方法。 (Action and Effect) According to this configuration, the above-mentioned method can be suitably implemented.

根據本發明的基板轉印方法及基板轉印裝置，即便在隔介硬質且難以彈性變形的黏著帶，將基板接著保持於框架的情況下，也能在將基板重新轉印於新的黏著帶時，以良好精度避免兩黏著帶的黏著面彼此接著。 According to the substrate transfer method and substrate transfer device of the present invention, even when the substrate is held in the frame through the adhesive tape that is hard and difficult to elastically deform, the substrate can be retransferred to the new adhesive tape. At the same time, prevent the adhesive surfaces of the two adhesive tapes from adhering to each other with good accuracy.

1:基板轉印裝置 1: Substrate transfer device

3:安裝框架收納部 3: Install the frame storage section

5:第1搬送機構(帶回收部) 5: The first conveying mechanism (with recovery part)

7:保持台 7: hold the stage

9‧‧‧帶切斷機構(帶切斷部) 9‧‧‧Tape cutting mechanism (with cutting part)

11‧‧‧環狀框架供給部 11‧‧‧Ring frame supply part

13‧‧‧帶貼附機構(轉印機構) 13‧‧‧Tape attaching mechanism (transfer mechanism)

15‧‧‧帶切斷機構 15‧‧‧With cutting mechanism

19‧‧‧反轉單元 19‧‧‧Reverse unit

21‧‧‧紫外線照射機構 21‧‧‧Ultraviolet irradiation mechanism

23‧‧‧帶剝離機構 23‧‧‧With stripping mechanism

25‧‧‧安裝框架回收部 25‧‧‧Installation frame recycling department

29‧‧‧框架保持部 29‧‧‧Frame holding part

31‧‧‧晶圓保持部(基板保持部) 31‧‧‧Wafer holding part (substrate holding part)

f1、f2‧‧‧環狀框架 f1, f2‧‧‧ring frame

T1‧‧‧黏著帶(第1黏著帶) T1‧‧‧Adhesive tape (1st adhesive tape)

T2‧‧‧黏著帶(第2黏著帶) T2‧‧‧Adhesive tape (Second adhesive tape)

MF1、MF2‧‧‧安裝框架 MF1、MF2‧‧‧Mounting frame

W‧‧‧半導體晶圓 W‧‧‧Semiconductor Wafer

圖1係顯示基板轉印裝置的基本構成之俯視圖。 Fig. 1 is a plan view showing the basic structure of a substrate transfer device.

圖2係說明安裝框架的構成之圖；圖2(a)係顯示轉印前後之安裝框架的構成之剖視圖，圖2(b)係安裝框架的立體圖。 Fig. 2 is a diagram illustrating the structure of the mounting frame; Fig. 2(a) is a cross-sectional view showing the structure of the mounting frame before and after transfer, and Fig. 2(b) is a perspective view of the mounting frame.

圖3係帶切斷機構的前視圖。 Figure 3 Front view of the lace cutting mechanism.

圖4係帶貼附機構的俯視圖。 Figure 4 is a top view of the strap attaching mechanism.

圖5係帶切斷機構的前視圖。 Figure 5 Front view of the lace cutting mechanism.

圖6係反轉單元的前視圖。 Figure 6 is a front view of the reversing unit.

圖7係說明基板轉印裝置的動作之說明圖；圖7(a)係說明動作的流程圖，圖7(b)係說明各步驟中之安裝框架的構成之示意圖。 Fig. 7 is an explanatory diagram illustrating the operation of the substrate transfer device; Fig. 7(a) is a flowchart illustrating the operation, and Fig. 7(b) is a schematic diagram illustrating the structure of the mounting frame in each step.

圖8係說明步驟S1中之安裝框架的構成之前視圖。 Fig. 8 is a front view illustrating the structure of the mounting frame in step S1.

圖9係說明步驟S2中之安裝框架的構成之前視圖；圖9(a)係顯示切斷黏著帶T1時的構成之圖，圖9(b)係顯示切斷黏著帶T1後的構成之圖。 Fig. 9 is a front view illustrating the structure of the mounting frame in step S2; Fig. 9(a) is a view showing the structure when the adhesive tape T1 is cut, and Fig. 9(b) is a view showing the structure after the adhesive tape T1 is cut .

圖10係說明步驟S3中之安裝框架的構成之前視圖。 Fig. 10 is a front view illustrating the structure of the mounting frame in step S3.

圖11係說明步驟S4中之安裝框架的構成之前視圖。 Fig. 11 is a front view illustrating the structure of the mounting frame in step S4.

圖12係說明步驟S5中之安裝框架的構成之前視圖；圖12(a)係顯示貼附黏著帶T2時的構成之圖，圖12(b)係顯示貼附黏著帶T2後的構成之圖。 Fig. 12 is a front view illustrating the structure of the mounting frame in step S5; Fig. 12(a) is a diagram showing the structure when the adhesive tape T2 is attached, and Fig. 12(b) is a diagram showing the structure after attaching the adhesive tape T2 .

圖13係說明步驟S6中之安裝框架的構成之前視圖。 Fig. 13 is a front view illustrating the structure of the mounting frame in step S6.

圖14係說明習知例之進行轉印的構成之圖；圖14(a)係顯示使黏著帶變形的構成之圖，圖14(b)係顯示插入接著防止材的構成之圖。 Fig. 14 is a diagram illustrating the configuration of transferring the conventional example; Fig. 14(a) is a diagram showing the configuration of deforming the adhesive tape, and Fig. 14(b) is a diagram showing the configuration of inserting the adhesion preventing material.

圖15係說明變形例之帶剝離機構的構成之圖；圖15(a)係說明帶剝離機構的構成之前視圖，圖15(b)係說明剝離黏著帶的狀態之立體圖。 15 is a diagram illustrating the configuration of a tape peeling mechanism of a modification; FIG. 15(a) is a front view illustrating the configuration of the tape peeling mechanism, and FIG. 15(b) is a perspective view illustrating a state in which the adhesive tape is peeled off.

圖16係說明變形例之帶剝離機構的構成之圖；圖16(a)係說明使切斷器接觸晶圓保持部以切斷黏著帶的構成之前視圖，圖16(b)係說明在沒有使切斷器接觸晶圓及晶圓保持部的情況下切斷黏著帶的狀態之前視圖，圖16(c)係說明突出部分比晶圓厚度還短的構成之效果之剖視圖。 16 is a diagram illustrating the structure of a tape peeling mechanism of a modified example; FIG. 16 (a) is a front view illustrating the structure of making a cutter contact the wafer holding portion to cut the adhesive tape, and FIG. 16 (b) is a diagram illustrating the structure without A front view of the state where the adhesive tape is cut when the cutter is brought into contact with the wafer and the wafer holding portion. FIG. 16(c) is a cross-sectional view illustrating the effect of the configuration in which the protruding portion is shorter than the thickness of the wafer.

用以實施發明的形態The form used to implement the invention

以下，參照圖式，說明本發明的實施例。 Hereinafter, embodiments of the present invention will be described with reference to the drawings.

<整體構成的說明> <Explanation of overall composition>

圖1係顯示本發明之基板轉印裝置1的基本構成之俯視圖。 FIG. 1 is a plan view showing the basic structure of the substrate transfer device 1 of the present invention.

此基板轉印裝置1係如圖2(a)所示，將晶圓W從半導體晶圓W(以下，簡稱「晶圓W」)的一面貼附有黏著帶T1的安裝框架MF1，轉印到該晶圓W的另一面貼附有黏著帶T2的安裝框架MF2。 This substrate transfer device 1 is shown in Figure 2(a), the wafer W is attached to the mounting frame MF1 with the adhesive tape T1 from one side of the semiconductor wafer W (hereinafter referred to as "wafer W"), and transfer A mounting frame MF2 with adhesive tape T2 is attached to the other surface of the wafer W.

如圖2(b)所示，安裝框架MF1係在晶圓W的一面與環狀框架f貼附黏著帶T1而製作。安裝框架MF2係在晶圓W的另一面與環狀框架f貼附黏著帶T2而製作。此外，本實施例中，在安裝框架MF1的環狀框架f標註符號f1，在安裝框架MF2的環狀框架f標註符號f2以區別兩者。 As shown in FIG. 2(b), the mounting frame MF1 is produced by attaching an adhesive tape T1 to the ring frame f on one side of the wafer W. The mounting frame MF2 is produced by attaching the adhesive tape T2 to the ring frame f on the other side of the wafer W. In addition, in this embodiment, the symbol f1 is attached to the ring frame f of the mounting frame MF1, and the symbol f2 is attached to the ring frame f of the mounting frame MF2 to distinguish the two.

此外，本實施例所使用的黏著帶T1及黏著帶T2，為了使晶圓W具有剛性，是使用以PET(Polyethylene Terephthalate)為主原料的帶(tape)。然而，黏著帶T1及黏著帶T2的材料，並不限定於PET，亦可使用其他周知的材料。 In addition, the adhesive tape T1 and the adhesive tape T2 used in this embodiment are made of PET (Polyethylene Terephthalate) as the main material in order to make the wafer W rigid. However, the materials of the adhesive tape T1 and the adhesive tape T2 are not limited to PET, and other well-known materials may also be used.

本發明的基板轉印裝置1係如圖1所示，具備有：安裝框架收納部3、第1搬送機構5、保持台7、帶切斷機構9、環狀框架供給部11、帶貼附機構13、帶切斷機構15、反轉單元19、紫外線照射機構21、帶剝離機構23和安裝框架回收部25。此外，在之後的說明中，將圖1中的x方向設為左右方向，將z方向設為上下方向。關於y方向，將圖1的下側設為「前側」，將圖 1的上側設為「裏側」。亦即，安裝框架回收部25係在圖1所示基板轉印裝置1中配置在比安裝框架收納部3還靠裏側。 The substrate transfer device 1 of the present invention is shown in FIG. 1, and includes: a mounting frame storage section 3, a first conveying mechanism 5, a holding table 7, a tape cutting mechanism 9, an annular frame supply section 11, and tape attaching The mechanism 13, the tape cutting mechanism 15, the reversing unit 19, the ultraviolet irradiation mechanism 21, the tape peeling mechanism 23, and the mounting frame recovery part 25. In addition, in the following description, the x direction in FIG. 1 is the left and right direction, and the z direction is the vertical direction. Regarding the y direction, set the lower side of Figure 1 as the "front side" and set the figure The upper side of 1 is set to "inside". That is, the mounting frame recovery part 25 is arranged on the back side of the mounting frame storage part 3 in the substrate transfer device 1 shown in FIG. 1.

安裝框架收納部3係配備有收納安裝框架MF1之未圖示的收納部，該安裝框架MF1係在晶圓W的一面與環狀框架f1貼附黏著帶T1而製作。此收納部具備有：連結固定於裝置框架之縱向軌道；和沿著此縱向軌道藉馬達螺桿進給而升降之升降台。因此，安裝框架收納部3係構成為將安裝框架MF載置於升降台以進行間距進給(pitch feed)升降。又，環狀框架供給部11及安裝框架回收部25亦形成為與安裝框架供給部3同樣的構成。 The mounting frame accommodating portion 3 is equipped with a not-shown accommodating portion for accommodating the mounting frame MF1. The mounting frame MF1 is produced by attaching an adhesive tape T1 to the ring frame f1 on one surface of the wafer W. This storage part is provided with: a longitudinal rail connected and fixed to the device frame; and an elevating platform that is raised and lowered by a motor screw feed along the longitudinal rail. Therefore, the mounting frame accommodating part 3 is comprised so that the mounting frame MF may be placed on a lift table to perform pitch feed (pitch feed) lift. In addition, the ring frame supply part 11 and the attachment frame recovery part 25 are also formed in the same configuration as the attachment frame supply part 3.

第1搬送機構5係將收納於安裝框架收納部3的安裝框架MF1朝配置於切斷位置S的保持台7搬送。又，第1搬送機構5係如後述，亦具有藉由帶切斷機構9切下黏著帶T1，將自晶圓W分離的環狀框架f1搬送到安裝框架收納部3之功能。亦即，自晶圓W分離的環狀框架f1及黏著帶T1，係藉由第1搬送機構5回收到安裝框架收納部3。第1搬送機構5相當於本發明的帶回收部。黏著帶T1相當於本發明的第1黏著帶。 The first transport mechanism 5 transports the mounting frame MF1 housed in the mounting frame accommodating section 3 to the holding table 7 arranged at the cutting position S. In addition, as described later, the first transport mechanism 5 also has a function of cutting off the adhesive tape T1 by the tape cutting mechanism 9 and transporting the ring frame f1 separated from the wafer W to the mounting frame storage section 3. That is, the ring frame f1 and the adhesive tape T1 separated from the wafer W are collected in the mounting frame storage section 3 by the first transport mechanism 5. The first conveying mechanism 5 corresponds to the tape collecting part of the present invention. The adhesive tape T1 corresponds to the first adhesive tape of the present invention.

保持台7係用以載置保持安裝框架MF1，如圖1所示構成為可在切斷位置S和轉印位置R之間往復移動。保持台7係如圖3至圖5所示，具備有：保持環狀框架f的環狀框架保持部29；和保持晶圓W的圓形晶圓保持部31。晶圓保持部31相當於本發明的基板保持部。框架保持部29相當於本發明的框架保持部。 The holding table 7 is for placing and holding the mounting frame MF1, and is configured to be able to reciprocate between the cutting position S and the transfer position R as shown in FIG. 1. As shown in FIGS. 3 to 5, the holding table 7 is provided with an annular frame holding portion 29 that holds the annular frame f, and a circular wafer holding portion 31 that holds the wafer W. The wafer holding portion 31 corresponds to the substrate holding portion of the present invention. The frame holding portion 29 corresponds to the frame holding portion of the present invention.

在框架保持部29的保持面，形成有吸附保持環狀框架f的吸附孔。在晶圓保持部31的保持面，形成有吸附保持晶圓W的吸附孔。從更合適地執行黏著帶T1的切斷之觀點，晶圓保持部31的直徑較佳為晶圓W的直徑以下。 On the holding surface of the frame holding portion 29, suction holes for sucking and holding the ring frame f are formed. On the holding surface of the wafer holding portion 31, suction holes for sucking and holding the wafer W are formed. From the viewpoint of more appropriately performing the cutting of the adhesive tape T1, the diameter of the wafer holding portion 31 is preferably equal to or less than the diameter of the wafer W.

如圖3所示，在保持台7位於切斷位置S的情況下，帶切斷機構9係配置於保持台7的上方，具備有：框架33、可動台35、支持臂37和切斷器單元39。可動台35係可沿著框架33升降移動。支持臂37係設置在從可動台35被懸臂支持之臂的前端下部，構成為在晶圓W的徑向伸縮。 As shown in FIG. 3, when the holding table 7 is located at the cutting position S, the tape cutting mechanism 9 is arranged above the holding table 7 and includes: a frame 33, a movable table 35, a support arm 37, and a cutter Unit 39. The movable table 35 can move up and down along the frame 33. The support arm 37 is provided at the lower part of the front end of the arm supported by the cantilever from the movable table 35, and is configured to expand and contract in the radial direction of the wafer W.

切斷器單元39係隔介支持臂37連接於可動台35。在切斷器單元39，刀尖向下的切斷器41係隔介切斷器保持器(cutter holder)而裝設。切斷器單元(cutter unit)39係以隔介支持臂37可調整迴旋半徑的方式構成。切斷器41係將貼附於安裝框架MF1的黏著帶T1沿著晶圓W的外形切斷。帶切斷機構9相當於本發明的帶切斷部。環狀框架供給部11具備有將新的環狀框架f2朝轉印位置R搬送之框架搬送部F。 The cutter unit 39 is connected to the movable table 35 via a support arm 37. In the cutter unit 39, a cutter 41 with a downward cutting edge is installed via a cutter holder. The cutter unit (cutter unit) 39 is constructed in such a way that the turning radius can be adjusted through the support arm 37. The cutter 41 cuts the adhesive tape T1 attached to the mounting frame MF1 along the outer shape of the wafer W. The tape cutting mechanism 9 corresponds to the tape cutting part of the present invention. The ring frame supply part 11 is provided with the frame conveyance part F which conveys the new ring frame f2 to the transfer position R. As shown in FIG.

如圖4所示，在保持台7位於轉印位置R的情況下，帶貼附機構13係配置於保持台7的上方，具備有：帶供給部43、貼附輥45、剝離輥49和帶回收部51。帶供給部43係裝填捲成滾筒狀之寬幅的黏著帶T2。貼附輥45係涵蓋被搬入轉印位置R的晶圓W、和從環狀框架供給部11新供給之環狀框架f2的上面而貼附黏著帶T2。 As shown in FIG. 4, when the holding table 7 is located at the transfer position R, the tape attaching mechanism 13 is arranged above the holding table 7, and includes a tape supply part 43, an attaching roller 45, a peeling roller 49, and Belt recovery unit 51. The tape supply part 43 is filled with the wide adhesive tape T2 wound in a roll shape. The sticking roller 45 covers the wafer W carried into the transfer position R and the upper surface of the ring frame f2 newly supplied from the ring frame supply unit 11 to stick the sticking tape T2.

藉由帶貼附機構13使晶圓W轉印到黏著帶T2，而製作安裝框架MF2。帶貼附機構13相當於本發明的轉印機構。黏著帶相當於本發明的第2黏著帶。 The tape attaching mechanism 13 transfers the wafer W to the adhesive tape T2 to produce the mounting frame MF2. The tape attaching mechanism 13 corresponds to the transfer mechanism of the present invention. The adhesive tape corresponds to the second adhesive tape of the present invention.

帶切斷機構15係與帶貼附機構13同樣，在保持台7位於轉印位置R的情況下，配置於保持台7的上方。帶切斷機構15係如圖5所示，具備有：框架53、支軸55、支持臂57、切斷器59和按壓輥61。 The tape cutting mechanism 15 is the same as the tape attaching mechanism 13, and when the holding table 7 is located at the transfer position R, it is arranged above the holding table 7. As shown in FIG. 5, the tape cutting mechanism 15 includes a frame 53, a support shaft 55, a support arm 57, a cutter 59, and a pressing roller 61.

支軸55係可沿著框架53升降移動，繞著z方向的軸旋轉。支持臂57係以支軸55為中心在徑向延伸有複數支。切斷器59係設置在支持臂57a的前端，將所貼附的黏著帶T2沿著環狀框架f切斷。按壓輥61係設置於支持臂57b的前端，將環狀框架f2上的帶切斷部位一邊轉動一邊按壓。 The supporting shaft 55 can move up and down along the frame 53, and rotate around the axis in the z direction. The support arm 57 has a plurality of branches extending in the radial direction with the support shaft 55 as the center. The cutter 59 is provided at the front end of the support arm 57a, and cuts the attached adhesive tape T2 along the ring frame f. The pressing roller 61 is provided at the front end of the support arm 57b, and presses the tape cutting part on the ring frame f2 while rotating.

反轉單元19係如圖6所示，在可沿著豎立設置固定的縱向軌道63升降的升降台65，可藉旋轉致動器67繞著水平支軸r轉動的接承框69係裝設成懸臂狀，並且夾盤爪71係以可分別繞著支軸s轉動的方式裝備於接承框69的基部和前端部。 The reversing unit 19 is shown in FIG. 6. The lifting platform 65 that can be raised and lowered along a fixed longitudinal rail 63 is installed, and a support frame 69 that can be rotated around a horizontal axis r by a rotary actuator 67 is installed. It is cantilevered, and the chuck claws 71 are equipped at the base and the front end of the receiving frame 69 so as to be rotatable around the supporting shaft s.

反轉單元19接取安裝框架MF2後，以黏著帶T2成為晶圓W的下側，黏著帶T1成為晶圓W的上側之方式使安裝框架MF2反轉。紫外線照射機構21係對位於晶圓W上側的黏著帶T1照射紫外線。由於黏著帶T1係紫外線硬化性的帶，故藉由紫外線照射可使黏著帶T1的黏著力降低。帶剝離機構23係將黏著帶T1從晶圓W剝離並回收。安裝框架回收部25係將黏著帶T1經剝離後的安裝框架MF2回收、收納。 After receiving the mounting frame MF2, the reversing unit 19 reverses the mounting frame MF2 so that the adhesive tape T2 becomes the lower side of the wafer W and the adhesive tape T1 becomes the upper side of the wafer W. The ultraviolet irradiation mechanism 21 irradiates the adhesive tape T1 located on the upper side of the wafer W with ultraviolet rays. Since the adhesive tape T1 is a UV-curable tape, the adhesive force of the adhesive tape T1 can be reduced by ultraviolet radiation. The tape peeling mechanism 23 peels the adhesive tape T1 from the wafer W and collects it. The mounting frame recovery part 25 recovers and stores the mounting frame MF2 from which the adhesive tape T1 has been peeled off.

又，基板轉印裝置1係如圖1所示，進一步具備有：晶圓收納部91、晶圓搬送機構93和晶圓對準部95。晶圓收納部91係積層收納晶圓W。晶圓搬送機構93係將收納於晶圓收納部91的晶圓W朝晶圓對準部95搬送。晶圓對準部95係進行被搬送之晶圓W的對位。 In addition, as shown in FIG. 1, the substrate transfer device 1 further includes a wafer storage unit 91, a wafer transport mechanism 93, and a wafer alignment unit 95. The wafer storage section 91 stores the wafers W in layers. The wafer transport mechanism 93 transports the wafer W stored in the wafer storage section 91 to the wafer alignment section 95. The wafer alignment unit 95 aligns the wafer W to be transported.

此等構成係為了涵蓋晶圓W和環狀框架的一面貼附黏著帶來製作安裝框架而使用。本實施例中係採用已製作安裝框架MF1並收納於安裝框架收納部3的情況為例作說明，本實施例的基板轉印裝置1亦可作為使用晶圓W來製作安裝框架MF1的晶圓安裝裝置使用。 These structures are used to fabricate an installation frame by attaching an adhesive tape to one side of the wafer W and the ring frame. In this embodiment, the case where the mounting frame MF1 has been fabricated and stored in the mounting frame accommodating portion 3 is taken as an example for description. The substrate transfer device 1 of this embodiment can also be used as a wafer for manufacturing the mounting frame MF1 using the wafer W Install the device to use.

<動作的說明> <Description of Action>

其次，使用實施例的基板轉印裝置1，針對將晶圓W從已實施所期望的處理之安裝框架MF1轉印到新的安裝框架MF2之動作進行說明。圖7(a)係表示基板轉印裝置1的動作之流程圖。圖7(b)係各步驟中之安裝框架MF的示意構成之圖。 Next, using the substrate transfer device 1 of the embodiment, the operation of transferring the wafer W from the mounting frame MF1 on which the desired process has been performed to the new mounting frame MF2 will be described. FIG. 7(a) is a flowchart showing the operation of the substrate transfer device 1. Fig. 7(b) is a diagram showing the schematic structure of the mounting frame MF in each step.

此外，以晶圓W中形成有電路圖案的面作為表面來進行說明。又，本實施例中，安裝框架MF1係在晶圓W的表面貼附有黏著帶T1者。再者，本實施例中，黏著帶T1的黏著層係使用紫外線硬化性黏著劑。 In addition, the description will be made assuming that the surface of the wafer W on which the circuit pattern is formed is the surface. In addition, in this embodiment, the mounting frame MF1 is one having the adhesive tape T1 attached to the surface of the wafer W. Furthermore, in this embodiment, the adhesive layer of the adhesive tape T1 uses an ultraviolet curable adhesive.

步驟S1(安裝框架的保持) Step S1 (holding of mounting frame)

於安裝框架收納部3積層收納有黏著帶T1貼附於晶圓W表面而製作之安裝框架MF1。第1搬送機構5係吸附保持安裝框架MF1的上面，如圖8所示，從點線所示的位置朝實線所示的位置移動。 The mounting frame MF1 produced by attaching the adhesive tape T1 to the surface of the wafer W is laminated and stored in the mounting frame storage portion 3. The first transport mechanism 5 sucks and holds the upper surface of the mounting frame MF1, and moves from the position shown by the dotted line to the position shown by the solid line as shown in FIG. 8.

第1搬送機構5係以貼附有黏著帶T1的面為下側，將安裝框架MF1載置於位於切斷位置S的保持台7。第1搬送機構5係在載置有安裝框架MF1後，移動到待避位置(以一例而言，為點線所示之左側的位置)。在載置有安裝框架MF1後，框架保持部29吸附保持環狀框架f1，晶圓保持部31吸附保持晶圓W。步驟S1中的一連串的工序係相當於本發明的保持工序。 The first conveying mechanism 5 places the mounting frame MF1 on the holding table 7 at the cutting position S with the surface where the adhesive tape T1 is attached as the lower side. After mounting the mounting frame MF1, the first conveying mechanism 5 moves to the waiting position (for example, the position on the left side shown by the dotted line). After the mounting frame MF1 is placed, the frame holding portion 29 sucks and holds the ring frame f1, and the wafer holding portion 31 sucks and holds the wafer W. The series of steps in step S1 corresponds to the holding step of the present invention.

步驟S2(黏著帶T1的切斷) Step S2 (cutting of adhesive tape T1)

在吸附保持有安裝框架MF1後，帶切斷機構9會作動，開始進行黏著帶T1的切斷。亦即，藉由帶切斷機構9作動，如圖9(a)所示，切斷器單元39會下降到既定的高度為止，切斷器41刺入黏著帶T1。於該狀態下，沿著晶圓W的外形切斷黏著帶T1。本實施例中，由於係使切斷器41一邊接觸晶圓W的外徑一邊切斷黏著帶T1，所以黏著帶T1可被切下成與晶圓W相同的大小。 After the mounting frame MF1 is sucked and held, the tape cutting mechanism 9 is activated to start cutting the adhesive tape T1. That is, when the tape cutting mechanism 9 is operated, as shown in FIG. 9(a), the cutter unit 39 is lowered to a predetermined height, and the cutter 41 pierces the adhesive tape T1. In this state, the adhesive tape T1 is cut along the outer shape of the wafer W. In this embodiment, since the cutter 41 cuts the adhesive tape T1 while contacting the outer diameter of the wafer W, the adhesive tape T1 can be cut to the same size as the wafer W.

當黏著帶T1的切斷完成時，切斷器單元39會上升而返回點線所示的待機位置。藉由沿著晶圓W的外形切斷黏著帶T1，如圖9(b)所示，黏著帶T1中黏著面露出的部分(露出部P)從晶圓W被分離。步驟S2中之一連串的工序相當於本發明的帶切斷工序。 When the cutting of the adhesive tape T1 is completed, the cutter unit 39 rises and returns to the standby position shown by the dotted line. By cutting the adhesive tape T1 along the outer shape of the wafer W, as shown in FIG. 9( b ), the exposed part (exposed part P) of the adhesive surface of the adhesive tape T1 is separated from the wafer W. One of the series of steps in step S2 corresponds to the tape cutting step of the present invention.

步驟S3(環狀框架f1的回收) Step S3 (recycling of ring frame f1)

黏著帶T1的切斷完成後，利用第1搬送機構進行框架f1的回收。亦即，第1搬送機構5係如圖10所示，從待避位置朝切斷位置S移動。接著，第1搬送 機構5係在安裝框架MF1的上方，下降到既定的高度以吸附保持環狀框架f1的上面。吸附保持有環狀框架f1的第1搬送機構5再度上升，朝左側移動而使環狀框架f1收納於安裝框架收納部3。 After the cutting of the adhesive tape T1 is completed, the frame f1 is collected by the first transport mechanism. That is, as shown in FIG. 10, the 1st conveyance mechanism 5 is moved to the cutting position S from a waiting position. Next, the first transfer The mechanism 5 is located above the mounting frame MF1, and is lowered to a predetermined height to suck and hold the upper surface of the ring frame f1. The first conveyance mechanism 5 holding the ring frame f1 by suction rises again, moves to the left, and stores the ring frame f1 in the mounting frame storage section 3.

在步驟S2中，由於黏著帶T1係沿著晶圓W的外形切斷，故被切下的黏著帶T1(由晶圓W分離之部分的黏著帶T1)，係與環狀框架f1一起被第1搬送機構5回收。被切下的黏著帶T1含有露出部P。因此，黏著帶T1的露出部P會伴隨環狀框架f1被回收，所以藉由步驟S2及步驟S3的工序，可避免黏著帶T1的黏著面在保持台7上露出。步驟S3中之一連串的工序相當於本發明的帶回收工序。 In step S2, since the adhesive tape T1 is cut along the outer shape of the wafer W, the cut adhesive tape T1 (the adhesive tape T1 of the part separated by the wafer W) is cut together with the ring frame f1 The first transport mechanism 5 collects. The cut adhesive tape T1 includes the exposed portion P. Therefore, the exposed portion P of the adhesive tape T1 is recovered along with the ring frame f1. Therefore, by the processes of step S2 and step S3, the adhesive surface of the adhesive tape T1 can be prevented from being exposed on the holding table 7. One of the series of steps in step S3 corresponds to the tape recovery step of the present invention.

步驟S4(環狀框架f2的供給) Step S4 (supply of ring frame f2)

完成環狀框架f1及被切下的黏著帶T1之回收後，進行新的環狀框架f2的供給。亦即，保持台7係在吸附保持有晶圓W的狀態下，從切斷位置S朝轉印位置R移動。框架搬送部F係對收納於環狀框架供給部11之環狀框架f2的上面進行吸附保持，朝轉印位置R移動。 After the ring frame f1 and the cut adhesive tape T1 are collected, the new ring frame f2 is supplied. That is, the holding table 7 moves from the cutting position S to the transfer position R in a state where the wafer W is sucked and held. The frame conveying part F sucks and holds the upper surface of the ring frame f2 housed in the ring frame supply part 11, and moves to the transfer position R.

接著，框架搬送部F將環狀框架f2載置於位在轉印位置R的環狀框架保持部29。框架搬送部F係在載置了環狀框架f2後，朝待避位置移動。待環狀框架f2已載置後，框架保持部29吸附保持環狀框架f2。藉由環狀框架f2被吸附保持，而完成環狀框架f2的供給。 Next, the frame conveying part F places the ring frame f2 on the ring frame holding part 29 positioned at the transfer position R. After the ring frame f2 is placed, the frame conveying part F moves to the waiting position. After the ring frame f2 has been placed, the frame holding portion 29 sucks and holds the ring frame f2. The ring frame f2 is sucked and held to complete the supply of the ring frame f2.

步驟S5(黏著帶T2的貼附) Step S5 (attachment with adhesive tape T2)

將環狀框架f2供給到晶圓W後，帶貼附機構13會作動，開始進行黏著帶T2的貼附。亦即，藉由帶貼附機構13作動，如圖12(a)所示，貼附輥45下降到既定的高度而從圖的右方朝左方轉動。藉由貼附輥45轉動，裝填於帶供給部43的黏著帶T2會涵蓋晶圓W及環狀框架f2的上面而貼附(圖12(b))。 After the ring frame f2 is supplied to the wafer W, the tape attaching mechanism 13 is activated to start attaching the adhesive tape T2. That is, by the operation of the tape attaching mechanism 13, as shown in FIG. 12(a), the attaching roller 45 descends to a predetermined height and rotates from the right to the left in the figure. By the rotation of the attaching roller 45, the adhesive tape T2 loaded on the tape supply part 43 is attached to cover the upper surface of the wafer W and the ring frame f2 (FIG. 12(b)).

此外，在步驟S5開始的時點，黏著帶T1的露出部P已從晶圓W被分離，而被回收去除。因此，由於黏著帶T1的黏著面沒有突出晶圓W的外側，所以在貼附黏著帶T2時，可確實地避免黏著帶T1的黏著面與黏著帶T2的黏著面之間接著。藉由貼附黏著帶T2，晶圓W從黏著帶T1被轉印到新的黏著帶T2。亦即，藉由轉印，製作新的安裝框架MF2。步驟S5中之一連串的工序相當於本發明的轉印工序。 In addition, at the time when step S5 starts, the exposed portion P of the adhesive tape T1 has been separated from the wafer W, and recovered and removed. Therefore, since the adhesive surface of the adhesive tape T1 does not protrude from the outside of the wafer W, when the adhesive tape T2 is attached, the adhesion between the adhesive surface of the adhesive tape T1 and the adhesive surface of the adhesive tape T2 can be reliably avoided. By attaching the adhesive tape T2, the wafer W is transferred from the adhesive tape T1 to the new adhesive tape T2. That is, by transferring, a new mounting frame MF2 is produced. One of the series of steps in step S5 corresponds to the transfer step of the present invention.

步驟S6(黏著帶T2的切斷) Step S6 (cutting of adhesive tape T2)

將黏著帶T2貼附於晶圓W及環狀框架f2後，帶切斷機構15會作動，開始進行黏著帶T2的切斷。亦即，如圖13所示，藉由帶切斷機構15作動，支軸55下降到既定的高度為止，切斷器59刺入黏著帶T2。在此狀態下使支軸55繞著z方向的軸旋轉，將黏著帶T2沿著環狀框架f2切斷成圓形。 After the adhesive tape T2 is attached to the wafer W and the ring frame f2, the tape cutting mechanism 15 is activated to start cutting the adhesive tape T2. That is, as shown in FIG. 13, when the tape cutting mechanism 15 is operated, the support shaft 55 is lowered to a predetermined height, and the cutter 59 penetrates the adhesive tape T2. In this state, the support shaft 55 is rotated around the axis in the z direction, and the adhesive tape T2 is cut into a circle along the ring frame f2.

環狀框架f2上黏著帶T2已被切斷的部位，係被轉動的按壓輥61按壓。其後，令設置於帶貼附機構13的剝離輥49從圖的右方朝左方轉動，將殘留於切斷 線外側之不要的黏著帶T2從環狀框架f2剝離。被剝離的不要的黏著帶T2，透過帶回收部51捲取並回收。 The cut portion of the adhesive tape T2 on the ring frame f2 is pressed by the rotating pressing roller 61. After that, the peeling roller 49 provided in the tape attaching mechanism 13 is rotated from the right to the left in the figure to remove the remaining parts in the cut The unnecessary adhesive tape T2 outside the thread is peeled off from the ring frame f2. The peeled unnecessary adhesive tape T2 is taken up through the tape collecting part 51 and collected.

步驟S7(安裝框架的反轉) Step S7 (reversal of mounting frame)

黏著帶T2的貼附及切斷完成後，安裝框架MF2係藉由未圖示的第2搬送機構，搬送到反轉單元19。反轉單元19係以設置於接承框69的夾盤爪71保持安裝框架MF2，使接承框69繞著水平支軸r轉動。藉由接承框69的轉動，安裝框架MF2係從以黏著帶T2為上側的狀態反轉至以黏著帶T1為上側的狀態。 After the attachment and cutting of the adhesive tape T2 are completed, the mounting frame MF2 is transported to the reversing unit 19 by a second transport mechanism (not shown). The reversing unit 19 holds the mounting frame MF2 with the chuck claw 71 provided on the receiving frame 69, so that the receiving frame 69 rotates around the horizontal support shaft r. By the rotation of the receiving frame 69, the mounting frame MF2 is reversed from the state with the adhesive tape T2 on the upper side to the state with the adhesive tape T1 on the upper side.

步驟S8(黏著帶T1的剝離) Step S8 (Peeling of adhesive tape T1)

使安裝框架MF2反轉後，開始進行貼附於晶圓W表面之黏著帶T1的剝離。紫外線照射機構21係對安裝框架MF2的黏著帶T1照射紫外線。黏著帶T1的接著層係以紫外線硬化性的黏著劑構成，所以藉由紫外線的照射會使黏著帶T1的黏著力降低。 After the mounting frame MF2 is reversed, the peeling of the adhesive tape T1 attached to the surface of the wafer W starts. The ultraviolet irradiation mechanism 21 irradiates ultraviolet rays to the adhesive tape T1 of the mounting frame MF2. The adhesive layer of the adhesive tape T1 is composed of an ultraviolet curable adhesive, so the adhesive force of the adhesive tape T1 will be reduced by ultraviolet radiation.

經紫外線照射後的安裝框架MF2係藉由未圖示的第3搬送機構搬送到帶剝離機構23。帶剝離機構23係將位於晶圓W上面側的黏著帶T1從晶圓W剝離並回收(參照圖7(b)、S8)。黏著帶T1已被剝離後的安裝框架MF2係藉由未圖示的第4搬送機構朝安裝框架回收部25搬送。 The mounting frame MF2 irradiated with ultraviolet rays is conveyed to the tape peeling mechanism 23 by a third conveying mechanism (not shown). The tape peeling mechanism 23 peels the adhesive tape T1 located on the upper surface side of the wafer W from the wafer W and collects it (see FIGS. 7(b) and S8). The mounting frame MF2 from which the adhesive tape T1 has been peeled is conveyed to the mounting frame collection part 25 by a fourth conveying mechanism (not shown).

安裝框架回收部25將黏著帶T1已被剝離後的安裝框架MF2加以回收、收納。藉由以上一連串的動作，從晶圓W表面貼附黏著帶T1而構成的安裝框架MF1，朝向晶圓W背面貼附黏著帶T2而構成的安裝框架MF2轉印之工序係全部完成。 The mounting frame recovery part 25 recovers and stores the mounting frame MF2 from which the adhesive tape T1 has been peeled off. Through the above series of operations, the process of transferring the mounting frame MF1 formed by attaching the adhesive tape T1 from the surface of the wafer W to the mounting frame MF2 formed by attaching the adhesive tape T2 toward the back of the wafer W is all completed.

以上，結束一個循環的基本動作，之後，重複相同動作。 Above, the basic action of ending a cycle, after that, repeat the same action.

<依據實施例之構成的功效> <Effects of the composition according to the embodiment>

實施例的基板轉印裝置1具備有帶切斷機構9和第1搬送機構5。帶切斷機構9係將保持於保持台7之安裝框架MF1的黏著帶T1沿著晶圓W的外形切斷。藉由沿著晶圓W的外形切斷黏著帶T1，而使從晶圓W的一面突出外側的黏著帶T1即露出部P從晶圓W分離。然後，被分離的露出部P係與環狀框架f1一起被第1搬送機構5回收，而收納至安裝框架收納部3。 The substrate transfer device 1 of the embodiment includes a tape cutting mechanism 9 and a first conveying mechanism 5. The tape cutting mechanism 9 cuts the adhesive tape T1 held by the mounting frame MF1 of the holding table 7 along the outer shape of the wafer W. By cutting the adhesive tape T1 along the outer shape of the wafer W, the exposed portion P of the adhesive tape T1 protruding from one surface of the wafer W to the outside is separated from the wafer W. Then, the separated exposed portion P is collected by the first transport mechanism 5 together with the ring frame f1, and is stored in the mounting frame storage portion 3.

由於黏著帶T1的露出部P係從晶圓W分離，所以將黏著帶T2貼附於晶圓的另一面時，黏著帶T1的黏著面不會突出晶圓W的外側。因此，將黏著帶T2貼附於環狀框架f2及晶圓W之際，可確實地避免黏著帶T1的黏著面與黏著帶T2的黏著面接觸。因此，能以更高精度進行使晶圓轉印到新的黏著帶之操作。 Since the exposed portion P of the adhesive tape T1 is separated from the wafer W, when the adhesive tape T2 is attached to the other side of the wafer, the adhesive surface of the adhesive tape T1 does not protrude from the outside of the wafer W. Therefore, when the adhesive tape T2 is attached to the ring frame f2 and the wafer W, the adhesive surface of the adhesive tape T1 and the adhesive surface of the adhesive tape T2 can be reliably prevented from contacting. Therefore, the operation of transferring the wafer to the new adhesive tape can be performed with higher accuracy.

習知的基板轉印方法中，係採用：如圖14(a)所示，使黏著帶T1變形以從黏著帶T2疏離之方法；和如圖14(b)所示，將非黏著性接著防止材B插入黏著帶T1的露出部P之方法。 In the conventional substrate transfer method, as shown in Figure 14(a), the adhesive tape T1 is deformed to separate from the adhesive tape T2; and as shown in Figure 14(b), the non-adhesive adhesive A method to prevent the material B from being inserted into the exposed part P of the adhesive tape T1.

然而，在圖14(a)所示習知方法中必須使黏著帶T1變形。因此，在使用硬質且難以彈性變形的材料，例如PET(Polyethylene Terephthalate)作為黏著帶T1的情況下，難以適用該習知方法。又，即便加長露出部P與黏著帶T2的距離，露出部P仍處於從晶圓W的外 側突出之狀態，所以難以確實地避免露出部P與黏著帶T2的接著。 However, in the conventional method shown in FIG. 14(a), the adhesive tape T1 must be deformed. Therefore, it is difficult to apply this conventional method when a hard and difficult to elastically deform material, such as PET (Polyethylene Terephthalate), is used as the adhesive tape T1. Moreover, even if the distance between the exposed part P and the adhesive tape T2 is increased, the exposed part P is still located outside the wafer W. The side protruding state makes it difficult to reliably avoid the adhesion of the exposed portion P and the adhesive tape T2.

且，在圖14(b)所示習知方法中，藉由黏著帶T1或黏著帶T2的黏著力，使接著防止材與該黏著帶解離時需要強的力。因此，由於在剝離已接著狀態的黏著帶時過度的拉伸力會作用於晶圓W，所以會有晶圓W破損的可能性。又，在環狀框架f與晶圓W的大小之差小的情況，將接著防止材插入露出部P時要求高的精度對準。如此，在習知方法中，避免黏著帶T1和黏著帶T2接著的確實性係受黏著帶的特性所影響。 In addition, in the conventional method shown in FIG. 14(b), the adhesive force of the adhesive tape T1 or the adhesive tape T2 requires a strong force to dissociate the adhesive tape from the adhesive tape. Therefore, since excessive tensile force acts on the wafer W when peeling off the adhesive tape in the bonded state, there is a possibility that the wafer W may be damaged. In addition, when the size difference between the ring frame f and the wafer W is small, high precision alignment is required when inserting the next preventive material into the exposed portion P. In this way, in the conventional method, it is avoided that the reliability of the adhesive tape T1 and the adhesive tape T2 is affected by the characteristics of the adhesive tape.

另一方面，在實施例的基板轉印裝置1中，藉由沿著晶圓W的外形切斷黏著帶T1，可避免黏著帶彼此的接著。亦即，在實施例的構成中，不需在晶圓W轉印時使黏著帶變形。因此，即便黏著帶是硬質且難以彈性變形的材料，也可確實地避免黏著帶T1與黏著帶T2的接著。 On the other hand, in the substrate transfer device 1 of the embodiment, by cutting the adhesive tape T1 along the outer shape of the wafer W, the adhesion of the adhesive tapes to each other can be avoided. That is, in the configuration of the embodiment, it is not necessary to deform the adhesive tape when the wafer W is transferred. Therefore, even if the adhesive tape is a material that is hard and difficult to elastically deform, the adhesion of the adhesive tape T1 and the adhesive tape T2 can be reliably avoided.

再者，在實施例的基板轉印裝置1中，也不需要新使用接著防止材。因此，即便在黏著帶的黏著力強的情況，也可一邊避免晶圓W的損傷，一邊確實地避免黏著帶T1與黏著帶T2的接著。因此，在實施例的基板轉印裝置1中，不會受到硬度和黏著力等黏著帶特性所影響，可確實地避免黏著帶T1與黏著帶T2的接著。又，在實施例的保持台7中，可使晶圓保持部31的直徑小於晶圓W的直徑，所以可避免基板轉印裝置1的大型化。 Furthermore, in the substrate transfer device 1 of the embodiment, there is no need to newly use an adhesion prevention material. Therefore, even when the adhesive force of the adhesive tape is strong, it is possible to prevent the wafer W from being damaged while reliably avoiding the adhesion of the adhesive tape T1 and the adhesive tape T2. Therefore, in the substrate transfer device 1 of the embodiment, the adhesive tape characteristics such as hardness and adhesive force are not affected, and the adhesion of the adhesive tape T1 and the adhesive tape T2 can be reliably avoided. In addition, in the holding table 7 of the embodiment, the diameter of the wafer holding portion 31 can be made smaller than the diameter of the wafer W, so that the substrate transfer device 1 can be prevented from increasing in size.

本發明不侷限於上述實施形態，可如下述變形實施。 The present invention is not limited to the above-mentioned embodiment, and can be implemented in the following modifications.

(1)上述實施例中，步驟S8的工序不限於使用紫外線照射機構21的構成。亦即，亦可不對安裝框架MF2照射紫外線，而是藉由使用剝離用黏著帶及剝離構件的方式，將黏著帶T1剝離。在此種變形例(1)的構成中，帶剝離機構23係如圖15(a)所示，具備有：保持安裝框架MF2的可動台81；引導捲成滾筒狀的剝離帶Q之引導輥83；刀口(knife edge)狀的剝離構件85；和回收剝離帶Q的捲取軸87。 (1) In the above embodiment, the process of step S8 is not limited to the configuration using the ultraviolet irradiation mechanism 21. That is, instead of irradiating the mounting frame MF2 with ultraviolet rays, the adhesive tape T1 may be peeled off by using an adhesive tape for peeling and a peeling member. In the configuration of this modification (1), the tape peeling mechanism 23 is shown in FIG. 15(a), and includes: a movable table 81 that holds the mounting frame MF2; and a guide roller that guides the peeling tape Q wound in a roll shape 83; a peeling member 85 in the shape of a knife edge; and a take-up shaft 87 for recovering the peeling tape Q.

剝離帶Q係藉由引導輥83引導到剝離構件85，在剝離構件85中折返且反轉後，藉由捲取軸87捲取並回收。亦即，對保持於可動台81的安裝框架MF2，在貼附於晶圓W表面的黏著帶T1上貼附剝離帶Q。接著，在剝離帶Q貼附於黏著帶T1的狀態下，使可動台81朝圖15(a)的中右方移動。 The peeling tape Q is guided to the peeling member 85 by the guide roller 83, and after being folded and reversed in the peeling member 85, it is wound up by the winding shaft 87 and collected. That is, to the mounting frame MF2 held by the movable table 81, the peeling tape Q is attached to the adhesive tape T1 attached to the surface of the wafer W. Next, in a state where the peeling tape Q is attached to the adhesive tape T1, the movable table 81 is moved to the center right in FIG. 15(a).

藉由使可動台81移動，如圖15(b)所示，剝離帶Q在剝離構件85的前端折返且移動，所以黏著帶T1係與剝離帶Q成為一體而自晶圓W的表面被剝離。此外，亦可將使用如圖15(a)所示之剝離帶Q的方式、和使用紫外線照射機構21的方式併用。 By moving the movable table 81, as shown in FIG. 15(b), the peeling tape Q is folded and moved at the tip of the peeling member 85, so the adhesive tape T1 and the peeling tape Q are integrated and peeled from the surface of the wafer W . In addition, the method using the peeling tape Q as shown in FIG. 15(a) and the method using the ultraviolet irradiation mechanism 21 may be used together.

(2)在上述實施例及變形例中，於步驟S3中構成為將所切下之部分的黏著帶T1與環狀框架f1一起回收，但不限定於此。亦即，亦可構成為將所切下之部分的黏著帶T1自環狀框架f1剝離，並僅回收所切下之部分的黏著帶T1。 (2) In the above-mentioned embodiments and modifications, the cut-off part of the adhesive tape T1 is collected together with the ring frame f1 in step S3, but it is not limited to this. That is, it may be configured to peel off the cut-out part of the adhesive tape T1 from the ring frame f1, and recover only the cut-out part of the adhesive tape T1.

在此種變形例(2)的構成中，不用新使用環狀框架f2，可在步驟S6中涵蓋環狀框架f1與晶圓W的另一面來貼附黏著帶T2。因此，由於可省略環狀框架f2及環狀框架供給部11，所以可避免基板轉印裝置1的大型化，且亦可降低成本。 In the configuration of this modification (2), the ring frame f2 is not newly used, and the adhesive tape T2 can be attached to cover the ring frame f1 and the other surface of the wafer W in step S6. Therefore, since the ring frame f2 and the ring frame supply portion 11 can be omitted, the substrate transfer device 1 can be prevented from increasing in size and the cost can also be reduced.

(3)在上述實施例及變形例中，雖在步驟S5中供給新的環狀框架f2後，在步驟S6中將黏著帶T2貼附於環狀框架f2與晶圓W的上面，但轉印於黏著帶T2的構成並不侷限於此。亦即，亦可構成為對搬入轉印位置R的晶圓W供給預先貼附有黏著帶T2的環狀框架f2，將黏著帶T2貼附於晶圓W的上面。 (3) In the above-mentioned embodiment and modification, although the new ring frame f2 is supplied in step S5, the adhesive tape T2 is attached to the upper surface of the ring frame f2 and the wafer W in step S6, but the transfer The structure printed on the adhesive tape T2 is not limited to this. In other words, the ring frame f2 to which the adhesive tape T2 is attached in advance is supplied to the wafer W carried in the transfer position R, and the adhesive tape T2 is attached to the upper surface of the wafer W.

(4)在上述實施例及變形例中，帶切斷機構9係採用使用切斷器41之構成，但亦可取代切斷刃，而改採用藉由雷射切斷黏著帶之構成。 (4) In the above-mentioned embodiments and modifications, the tape cutting mechanism 9 adopts the structure using the cutter 41, but instead of the cutting blade, the structure of cutting the adhesive tape by laser can be adopted instead.

(5)在上述實施例及變形例中，作為基板，係以半導體晶圓為例來作說明，惟該裝置可適用於LED用基板或電路基板等各種形狀及尺寸的基板。於此情況，在帶切斷工序中被切斷之黏著帶T1的形狀係可因應所適用的基板外形而改變。 (5) In the above-mentioned embodiments and modifications, the semiconductor wafer is used as an example for the substrate, but the device can be applied to substrates of various shapes and sizes such as LED substrates or circuit substrates. In this case, the shape of the adhesive tape T1 cut in the tape cutting process can be changed according to the shape of the substrate to which it is applied.

因此，所使用之基板支持用框架並不限定於晶圓用環狀框架f，亦可利用因應所使用的基板形狀之四角形等的框架。若為四角形框架，可將例如複數個四角形基板藉由黏著帶接著保持，可減少死空間(dead space)。其結果，可提高作業效率。 Therefore, the substrate supporting frame to be used is not limited to the wafer ring frame f, and a quadrangle or the like can also be used according to the shape of the substrate used. If it is a quadrangular frame, for example, a plurality of quadrangular substrates can be held by adhesive tapes, which can reduce dead space. As a result, work efficiency can be improved.

(6)在上述實施例中，轉印源的環狀框架f和轉印目標的新環狀框架f係採用同一形狀之構成，惟亦可組合不同形狀的框架來使用。 (6) In the above embodiment, the ring frame f of the transfer source and the new ring frame f of the transfer target are of the same shape, but frames of different shapes can also be used in combination.

(7)在上述實施例及變形例中，亦可將預先切斷成環狀框架形狀之預切型(pre-cut type)黏著帶T2貼附於環狀框架f2。 (7) In the above-mentioned embodiments and modifications, a pre-cut type adhesive tape T2 that has been cut into a ring frame shape in advance may also be attached to the ring frame f2.

(8)在上述實施例及變形例中，於步驟S2中，在以比晶圓W的直徑還小的晶圓保持部31保持的狀態下，一邊使切斷器41接觸晶圓的外形一邊切斷。然而，步驟S2的帶切斷工序不限於將此種黏著帶T1切下成與晶圓W相同的大小之構成。亦即，亦可如圖16(a)所示，在以比晶圓W的直徑還大的晶圓保持部31保持的狀態下，一邊使切斷器41接觸晶圓保持部31的外形，一邊切斷黏著帶T1。 (8) In the above-mentioned embodiment and modification examples, in step S2, in the state held by the wafer holding portion 31 smaller than the diameter of the wafer W, the cutter 41 is brought into contact with the outer shape of the wafer. Cut off. However, the tape cutting process of step S2 is not limited to the configuration in which such an adhesive tape T1 is cut into the same size as the wafer W. That is, as shown in FIG. 16(a), the cutter 41 may be brought into contact with the outer shape of the wafer holding portion 31 while being held by the wafer holding portion 31 larger than the diameter of the wafer W. Cut off the adhesive tape T1 on one side.

在此種變形例(8)的構成中，於步驟S2，黏著帶T1係被切下成比晶圓W的直徑還寬的大小。被切下之黏著帶T1的大小，係在步驟S5的轉印工序中被調整成可確實地避免黏著帶T1與黏著帶T2的接著之程度的大小。如圖16(a)所示，在帶切斷工序後，被切下的黏著帶T1中之突出晶圓W外側之部分的長度k，係以在晶圓W的厚度G以下較佳。 In the configuration of this modification (8), in step S2, the adhesive tape T1 is cut into a size wider than the diameter of the wafer W. The size of the cut adhesive tape T1 is adjusted in the transfer process of step S5 to a size that can reliably avoid the adhesion of the adhesive tape T1 and the adhesive tape T2. As shown in FIG. 16(a), after the tape cutting process, the length k of the portion of the cut adhesive tape T1 protruding outside the wafer W is preferably less than the thickness G of the wafer W.

(9)又，就變形例(8)的其他構成而言，亦可如圖16(b)所示構成為在不使切斷器41與晶圓W的外徑及晶圓保持部31的外徑之任一者接觸的情況下，將黏著帶T1切下成比晶圓W稍微寬的大小。在此種變形例(9) 中，與變形例(8)同樣地，在帶切斷工序後，被切下成大致圓形的黏著帶T1中突出晶圓W外側之部分的長度k(被切下之黏著帶T1的半徑Tr與晶圓W的半徑Wr之差)，係以在晶圓W的厚度G以下較佳。 (9) In addition, as for the other configuration of the modification (8), as shown in FIG. 16(b), it may be configured such that the cutter 41 is not connected to the outer diameter of the wafer W and the wafer holding portion 31. When any one of the outer diameters is in contact, the adhesive tape T1 is cut into a size slightly wider than the wafer W. In this variant (9) In the same manner as in Modification (8), after the tape cutting process, the length k of the portion of the adhesive tape T1 that is cut into a substantially circular shape protruding outside the wafer W (the radius of the cut adhesive tape T1 The difference between Tr and the radius Wr of the wafer W) is preferably below the thickness G of the wafer W.

當長度k是在厚度G以下時，如圖16(c)所示，即便在轉印工序中黏著帶T1係以在晶圓W的端部從點線所示位置朝實線所示位置彎折的方式變形的情況，也可確實地避免黏著帶T1與黏著帶T2接觸。因此，可更確實地避免轉印工序中之黏著帶彼此的接著，所以可進一步使朝黏著帶T2轉印的精度提升。 When the length k is less than the thickness G, as shown in FIG. 16(c), even in the transfer process, the adhesive tape T1 is bent from the position shown by the dotted line to the position shown by the solid line at the end of the wafer W In the case of deformation by folding, it is possible to surely avoid contact between the adhesive tape T1 and the adhesive tape T2. Therefore, the adhesion of the adhesive tapes in the transfer process can be avoided more reliably, so the accuracy of transfer to the adhesive tape T2 can be further improved.

又，在變形例(9)的構成中，晶圓保持部31的半徑D係以小於被切下之黏著帶T1的半徑Tr較佳。於此情況，切斷器41由於能夠以貫通黏著帶T1的方式切斷，所以可更適宜地切斷黏著帶T1。在本發明的各實施例及變形例中，帶切斷工序中「沿著晶圓的外形切斷黏著帶」係指，不僅是將黏著帶T1切斷成與晶圓W相同大小的情況，亦包含以轉印工序中可確實地避免黏著帶T1與黏著帶T2的接著之程度，將黏著帶T1切斷成比晶圓W的外形還寬的大小之情況。 In the configuration of the modification (9), the radius D of the wafer holding portion 31 is preferably smaller than the radius Tr of the adhesive tape T1 to be cut. In this case, since the cutter 41 can cut so as to penetrate through the adhesive tape T1, the adhesive tape T1 can be cut more appropriately. In each embodiment and modification of the present invention, "cutting the adhesive tape along the outer shape of the wafer" in the tape cutting process refers to not only cutting the adhesive tape T1 to the same size as the wafer W, but also It also includes the case where the adhesive tape T1 and the adhesive tape T2 can be reliably prevented from adhering to the extent during the transfer process, and the adhesive tape T1 is cut into a size wider than the outer shape of the wafer W.

31‧‧‧晶圓保持部 31‧‧‧Wafer holding part

41‧‧‧切斷器 41‧‧‧Cutter

59‧‧‧切斷器 59‧‧‧Cutter

f1、f2‧‧‧環狀框架 f1, f2‧‧‧ring frame

P‧‧‧露出部 P‧‧‧Exposed part

T1‧‧‧黏著帶 T1‧‧‧Adhesive tape

T2‧‧‧黏著帶 T2‧‧‧Adhesive tape

MF1、MF2‧‧‧安裝框架 MF1、MF2‧‧‧Mounting frame

W‧‧‧半導體晶圓 W‧‧‧Semiconductor Wafer

Claims (8)

一種基板轉印方法，係將隔介支持用第1黏著帶接著保持於環狀框架內之基板轉印到第2黏著帶，其特徵為具備：保持工序，以保持構件將前述環狀框架及前述基板從前述第1黏著帶側加以保持；帶切斷工序，沿著被前述保持構件所保持的前述基板的外形，切斷前述第1黏著帶；帶回收工序，將被切下的前述第1黏著帶回收；及轉印工序，在前述帶回收工序後，從前述基板的非保持面側貼附前述第2黏著帶以進行轉印，前述帶切斷工序係以在前述轉印工序中避免前述第1黏著帶與前述第2黏著帶的接著之方式，將前述第1黏著帶切斷成與前述基板大致相同大小。 A substrate transfer method is to transfer a substrate held in a ring frame with a first adhesive tape for intermediary support to a second adhesive tape. The method is characterized by having a holding step in which the ring frame and The substrate is held from the side of the first adhesive tape; the tape cutting step is to cut the first adhesive tape along the outer shape of the substrate held by the holding member; and the tape recovery step is to cut the cut off the first adhesive tape. 1 Adhesive tape recovery; and transfer process. After the tape recovery process, the second adhesive tape is attached from the non-retaining surface side of the substrate for transfer, and the tape cutting process is performed in the transfer process In a way to avoid the adhesion of the first adhesive tape and the second adhesive tape, the first adhesive tape is cut into approximately the same size as the substrate. 如請求項1之基板轉印方法，其中在前述帶切斷工序中，係以前述第1黏著帶從前述基板的外形朝外側突出之部分的長度小於或等於前述基板的厚度之方式，切斷前述第1黏著帶。 The substrate transfer method of claim 1, wherein in the tape cutting step, the first adhesive tape is cut so that the length of the portion of the first adhesive tape protruding outward from the outer shape of the substrate is less than or equal to the thickness of the substrate The aforementioned first adhesive tape. 如請求項1或2之基板轉印方法，其中前述保持構件的直徑係比前述基板的直徑小。 The substrate transfer method of claim 1 or 2, wherein the diameter of the holding member is smaller than the diameter of the substrate. 如請求項1或2之基板轉印方法，其中在前述帶切斷工序中，使用切斷刃切斷前述第1黏著帶。 The substrate transfer method of claim 1 or 2, wherein in the tape cutting step, the first adhesive tape is cut using a cutting blade. 如請求項1或2之基板轉印方法，其中 在前述帶切斷工序中，使用雷射切斷前述第1黏著帶。 Such as the substrate transfer method of claim 1 or 2, wherein In the tape cutting step, the first adhesive tape is cut using a laser. 如請求項1或2之基板轉印方法，其中在前述帶回收工序中，將接著於前述環狀框架的狀態下之被切下的前述第1黏著帶連同前述環狀框架一起回收。 The substrate transfer method of claim 1 or 2, wherein in the tape recovery step, the first adhesive tape that is cut out in a state following the ring frame is recovered together with the ring frame. 如請求項1或2之基板轉印方法，其中在前述轉印工序中，將預先貼附有前述第2黏著帶的新環狀框架與前述基板重疊，從前述基板的非保持面側貼附前述第2黏著帶以進行轉印。 The substrate transfer method of claim 1 or 2, wherein in the transfer step, a new ring frame to which the second adhesive tape is attached in advance is superimposed on the substrate, and attached from the non-holding surface side of the substrate The aforementioned second adhesive tape is used for transfer. 一種基板轉印裝置，係隔著支持用第1黏著帶將接著保持於環狀框架內的基板轉印到第2黏著帶，其特徵為具備：基板保持部，隔介前述第1黏著帶保持前述基板；框架保持部，用於保持前述環狀框架；帶切斷部，沿著被前述基板保持部所保持的前述基板的外形，切斷前述第1黏著帶；帶回收部，將被前述帶切斷部切下的前述第1黏著帶回收；及轉印機構，在被切下的前述第1黏著帶被回收後，從前述基板的非保持面側貼附前述第2黏著帶以進行轉印，前述帶切斷部係以在前述轉印機構中避免前述第1黏著帶與前述第2黏著帶的接著之方式，將前述第1黏著帶切斷成與前述基板大致相同大小。 A substrate transfer device that transfers a substrate held in a ring frame to a second adhesive tape via a first adhesive tape for support, and is characterized by having a substrate holding portion that holds the first adhesive tape interposed The substrate; the frame holding portion for holding the ring frame; the tape cutting portion, which cuts the first adhesive tape along the outer shape of the substrate held by the substrate holding portion; the tape recovery portion, which will be The first adhesive tape cut by the tape cutting part is recovered; and the transfer mechanism, after the cut first adhesive tape is recovered, attach the second adhesive tape from the non-retaining surface side of the substrate to perform In the transfer, the tape cutting section cuts the first adhesive tape to approximately the same size as the substrate in a manner that avoids the adhesion of the first adhesive tape and the second adhesive tape in the transfer mechanism.
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