TW201738164A - Substrate transfer method and substrate transfer apparatus - Google Patents

Substrate transfer method and substrate transfer apparatus Download PDF

Info

Publication number
TW201738164A
TW201738164A TW106106931A TW106106931A TW201738164A TW 201738164 A TW201738164 A TW 201738164A TW 106106931 A TW106106931 A TW 106106931A TW 106106931 A TW106106931 A TW 106106931A TW 201738164 A TW201738164 A TW 201738164A
Authority
TW
Taiwan
Prior art keywords
adhesive tape
substrate
wafer
tape
frame
Prior art date
Application number
TW106106931A
Other languages
Chinese (zh)
Other versions
TWI707818B (en
Inventor
松下孝夫
山本雅之
Original Assignee
日東電工股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日東電工股份有限公司 filed Critical 日東電工股份有限公司
Publication of TW201738164A publication Critical patent/TW201738164A/en
Application granted granted Critical
Publication of TWI707818B publication Critical patent/TWI707818B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/79—Apparatus for Tape Automated Bonding [TAB]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/86—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using tape automated bonding [TAB]

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Laser Beam Processing (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Dicing (AREA)

Abstract

In this invention, a mounting frame MF1 is held with an adhesive tape T1 placed thereunder, the adhesive tape T1 is cut away by following the external shape of a wafer W, and the cut-away adhesive tape T1 is recovered. The wafer W is supplied with a new ring frame f2, and a new adhesive tape T2 is adhered over the upper surfaces of the wafer W and the ring frame. Since the adhesive tape T1 in the excess portion on the outer side of the wafer W has been separated from the wafer W and recovered, adhesion between the adhesive tape T1 and the adhesive tape T2 during transfer can be avoided with certainty.

Description

基板轉印方法及基板轉印裝置 Substrate transfer method and substrate transfer device

本發明係有關對隔介黏著帶接著保持於環狀框架(ring frame)的半導體晶圓、電路基板、LED(Light Emitting Diode)等各種基板實施所期望的處理之後，重新轉印到新的黏著帶之基板轉印方法及基板轉印裝置。 The present invention relates to performing a desired process on various substrates such as a semiconductor wafer, a circuit board, and an LED (Light Emitting Diode), which are then held in a ring frame, and then re-transferred to a new adhesive. A substrate transfer method and a substrate transfer device.

採用半導體晶圓為例作為基板，實施如以下的處理。一般的半導體晶圓(以下，簡稱「晶圓」)，係在其表面形成有多數元件的電路圖案後，在其表面貼附保護帶來加以保護。將表面受保護的晶圓在背面研磨工序中從背面進行研削或者研磨加工以作成所期望的厚度。從薄型化的晶圓將保護帶剝離並搬送至切割工序之前，為了補強晶圓，會隔介支持用黏著帶(切割帶)將晶圓接著保持於環狀框架。 The following processing is performed using a semiconductor wafer as an example of a substrate. A general semiconductor wafer (hereinafter referred to as "wafer") is formed by attaching a protective layer to a surface of a circuit pattern having a plurality of elements formed on its surface. The surface-protected wafer is ground or polished from the back side in a back grinding process to have a desired thickness. Before the protective tape is peeled off from the thinned wafer and transported to the dicing process, in order to reinforce the wafer, the adhesive tape (cut tape) is supported to hold the wafer in the annular frame.

接著保持於環狀框架的晶圓，其加工工序係依據所製造的半導體晶片而異。例如，在將半導體晶片微細化的情況下，進行雷射切割處理。此時，若從形成有電路圖案的表面進行切割，則電路會受到熱的影響而破損，故在背面研磨處理前必須從背面進行半切(half cut)。在將經半切的晶圓破斷(breaking)後將各晶片安裝於所期望的位置之際，係從表面以吸具(collet)進行吸附來進行搬送，所以要將表面的黏著帶及保護帶剝離。由此黏著帶等已剝離之晶圓的背面側，重新貼附黏著帶，並接著保持於新的環狀框架後，再將晶圓破斷。亦即，在破斷前必須將晶圓重新轉印到新的環狀框架。 The wafer is then held in a ring frame, and the processing steps vary depending on the semiconductor wafer to be fabricated. For example, in the case of refining a semiconductor wafer, a laser cutting process is performed. At this time, if the surface is cut from the surface on which the circuit pattern is formed, the circuit is damaged by heat and must be half-cut from the back side before the back grinding process (half Cut). After the half-cut wafer is broken and the wafers are mounted at a desired position, they are adsorbed by a suction from the surface, so the adhesive tape and the protective tape on the surface are required. Stripped. The adhesive tape is reattached to the back side of the peeled wafer such as the adhesive tape, and then held in a new annular frame, and the wafer is broken. That is, the wafer must be retransferred to a new annular frame before breaking.

該轉印時，係以在環狀框架和晶圓之間露出之黏著帶的黏著面與新貼附之黏著帶的黏著面不會接著之方式，使環狀框架和晶圓相對地疏離移動以使黏著帶彈性變形，藉此在厚度方向獲取間隙(gap)(參照專利文獻1、2)。又，作為用以避免兩個黏著帶彼此黏著的其他習知例，亦使用在所露出之黏著帶的黏著面彼此間，插入非黏著性接著防止板之方法(參照專利文獻3)。 In the transfer, the adhesive surface of the adhesive tape exposed between the annular frame and the wafer and the adhesive surface of the newly attached adhesive tape are not adjacent to each other, so that the annular frame and the wafer are relatively separated and moved. A gap is obtained in the thickness direction by elastically deforming the adhesive tape (see Patent Documents 1 and 2). Further, as another conventional example in which the two adhesive tapes are adhered to each other, a method of inserting a non-adhesive adhesion preventing sheet between the adhesive faces of the exposed adhesive tapes is also used (see Patent Document 3).

專利文獻1 日本特開2011-29434號公報 Patent Document 1 Japanese Patent Laid-Open Publication No. 2011-29434

專利文獻2 日本特開2007-220693號公報 Patent Document 2 Japanese Patent Laid-Open Publication No. 2007-220693

專利文獻3 日本特開2012-244013號公報 Patent Document 3 Japanese Patent Laid-Open Publication No. 2012-244013

然而，上述習知方法會有如次之問題。 However, the above conventional methods have secondary problems.

亦即，當所使用的黏著帶較柔軟時，可有效地使習知方法發揮功能。然而，在為了使晶圓保持剛性而採用硬質(例如PET)的黏著帶之情況，會難以彈性變形，所以即便想要使環狀框架和晶圓相對地疏離移動，也會無法充分地獲取間隙。亦即，會有無法避免黏著帶彼此的接著之類的問題。 That is, when the adhesive tape used is soft, the conventional method can be effectively utilized. However, in the case where a rigid (for example, PET) adhesive tape is used to keep the wafer rigid, it is difficult to elastically deform, so even if the annular frame and the wafer are to be relatively separated from each other, the gap cannot be sufficiently obtained. . That is, there is a problem that the adhesion of the adhesive tapes cannot be avoided.

又，關於將接著防止板插入黏著面彼此間的方法，在使用黏著力強的黏著帶之情況下，使接著防止板和黏著帶解離時需要強的力。因此，在將已接著的狀態的黏著帶分離時過度的張力會作用於晶圓，所以恐有導致晶圓破損之類的問題之虞。 Further, in the method of inserting the prevention sheet between the adhesive faces, in the case of using an adhesive tape having a strong adhesive force, a strong force is required to prevent the plate from being detached from the adhesive tape. Therefore, excessive tension acts on the wafer when the adhesive tape in the subsequent state is separated, so that there is a fear that the wafer is damaged.

本發明係有鑑於此種情事而開發者，其主要目的在提供一種可將基板以良好精度轉印到新的黏著帶之基板轉印方法及基板轉印裝置。 The present invention has been made in view of such circumstances, and its main object is to provide a substrate transfer method and a substrate transfer device which can transfer a substrate to a new adhesive tape with good precision.

本發明為了達成此種目的，採用如下之構成。 In order to achieve such a purpose, the present invention adopts the following constitution.

亦即，本發明係將隔介支持用第1黏著帶接著保持於環狀框架內之基板轉印到第2黏著帶之基板轉印方法，其特徵為具備：保持工序，從前述第1黏著帶側將前述環狀框架及前述基板以保持構件加以保持；帶切斷工序，沿著被前述保持構件所保持的前述基板的外形，切斷前述第1黏著帶；帶回收工序，將被切下的前述第1黏著帶回收；及轉印工序，在前述帶回收工序後，從前述基板的非保持面側貼附前述第2黏著帶來進行轉印。 In other words, the present invention relates to a substrate transfer method for transferring a substrate having a first adhesive tape and a substrate held in a ring-shaped frame to a second adhesive tape, and is characterized in that: a holding step is performed from the first adhesive The tape frame holds the annular frame and the substrate as a holding member, and the tape cutting step cuts the first adhesive tape along the outer shape of the substrate held by the holding member; the tape collecting step is to be cut. The first adhesive tape is collected, and the transfer process is performed by attaching the second adhesive tape to the non-retaining surface side of the substrate after the tape collection step.

(作用、效果)根據此方法，沿著所保持之基板的外形切斷第1黏著帶，將切下的第1黏著帶回收。因此，不論高度或黏著力等黏著帶的特性，第1黏著帶中自基板的外徑超出的黏著面所露出的部分會被回收。因此，從第1黏著帶朝第2黏著帶進行轉印之際，可適 當地避免第1黏著帶與第2黏著帶的黏著面彼此接著，而不會受到黏著帶的特性影響。 (Operation, Effect) According to this method, the first adhesive tape is cut along the outer shape of the substrate to be held, and the cut first adhesive tape is collected. Therefore, regardless of the characteristics of the adhesive tape such as the height or the adhesive force, the portion of the first adhesive tape exposed from the adhesive surface beyond the outer diameter of the substrate is recovered. Therefore, it is possible to transfer from the first adhesive tape to the second adhesive tape. The local adhesion of the first adhesive tape to the second adhesive tape is prevented from coming to each other without being affected by the characteristics of the adhesive tape.

此外，上述轉印過程中，關於基板朝新的黏著帶的轉印，可以例如下述方式實施。 Further, in the above transfer process, the transfer of the substrate toward a new adhesive tape can be carried out, for example, in the following manner.

在前述帶切斷工序中，係以前述第1黏著帶自前述基板的外徑超出之部分的長度會成為前述基板的厚度以下之方式，切斷前述第1黏著帶較佳。根據此方法，即便在自基板的外徑超出外側的部分在晶圓的端部變形之情況下，也能確實地避免第1黏著帶與第2黏著帶接觸。因此，在從第1黏著帶轉印到第2黏著帶之際，由於可更確實地避免第1黏著帶與第2黏著帶的黏著面彼此接著，所以可進一步提升轉印的精度。 In the tape cutting step, the first adhesive tape is preferably cut so that the length of the first adhesive tape from the outer diameter of the substrate is less than or equal to the thickness of the substrate. According to this method, even when the portion outside the outer diameter of the substrate is deformed at the end portion of the wafer, the first adhesive tape can be surely prevented from coming into contact with the second adhesive tape. Therefore, when the first adhesive tape is transferred to the second adhesive tape, the adhesion faces of the first adhesive tape and the second adhesive tape can be more reliably prevented from coming to each other, so that the accuracy of transfer can be further improved.

亦可令前述基板保持在比基板的直徑小的保持構件，將基板轉印到第2黏著帶。根據此方法，在帶切斷工序中能夠以貫通第1黏著帶的方式切斷，所以可更確實地將第1黏著帶沿著基板的外形切斷。因此，在轉印工序中可更確實地避免第1黏著帶與第2黏著帶接著。又，藉由將保持構件小型化，可避免基板轉印裝置大型化。 The substrate may be held in a holding member having a smaller diameter than the substrate, and the substrate may be transferred to the second adhesive tape. According to this method, since the first adhesive tape can be cut through the tape cutting step, the first adhesive tape can be more reliably cut along the outer shape of the substrate. Therefore, it is possible to more reliably avoid the adhesion of the first adhesive tape and the second adhesive tape in the transfer process. Moreover, by miniaturizing the holding member, it is possible to avoid an increase in size of the substrate transfer device.

此外，在上述轉印過程中，關於基板朝新的黏著帶的轉印，係可以例如下述方式實施。 Further, in the above transfer process, the transfer of the substrate toward the new adhesive tape can be carried out, for example, in the following manner.

第一，在帶切斷工序中，亦可使用切斷刃來切斷第1黏著帶。 First, in the tape cutting step, the first adhesive tape may be cut by using a cutting blade.

第二，在帶切斷工序中，亦可使用雷射來切斷第1黏著帶。 Second, in the tape cutting step, the first adhesive tape can be cut by using a laser.

根據此方法，由於可將第1黏著帶適當地沿著基板的外形切斷，故在轉印工序中可更確實地避免第1黏著帶與第2黏著帶接著。 According to this method, since the first adhesive tape can be appropriately cut along the outer shape of the substrate, the first adhesive tape and the second adhesive tape can be more reliably prevented from being transferred in the transfer process.

又，在帶回收工序中，較佳為將接著於環狀框架的狀態下之被切下的第1黏著帶連同環狀框架一起回收。 Further, in the belt collecting step, it is preferable that the first adhesive tape which is cut in the state of the endless frame is collected together with the annular frame.

根據此方法，藉由將更難以變形的環狀框架保持並回收，可將切下的第1黏著帶回收。因此，可更容易且確實地回收被切下的第1黏著帶。 According to this method, the cut first adhesive tape can be recovered by holding and recovering the annular frame which is more difficult to deform. Therefore, the cut first adhesive tape can be recovered more easily and surely.

又，在轉印工序中，較佳為將預先貼附有第2黏著帶的新環狀框架與基板重疊，從基板的非保持面側貼附第2黏著帶以進行轉印。 Further, in the transfer step, it is preferable that the new annular frame to which the second adhesive tape is attached in advance is overlapped with the substrate, and the second adhesive tape is attached from the non-retaining surface side of the substrate to be transferred.

根據此方法，由於預先在環狀框架貼附有第2黏著帶，故在基板的轉印方面，可縮短工序及時間。因此，可提升基板的轉印效率。 According to this method, since the second adhesive tape is attached to the annular frame in advance, the process and time can be shortened in terms of transfer of the substrate. Therefore, the transfer efficiency of the substrate can be improved.

又，本發明為了達成此種目的，可採用如次之構成。 Further, in order to achieve such a purpose, the present invention can be constructed as follows.

亦即，在隔介支持用第1黏著帶將接著保持於環狀框架內的基板轉印到第2黏著帶之基板轉印裝置中，其特徵為：基板保持部，隔介前述第1黏著帶保持前述基板；框架保持部，用於保持前述環狀框架；帶切斷部，沿著被前述基板保持部所保持的前述基板的外形，切斷前述第1黏著帶； 帶回收部，將被前述帶切斷部切下的前述第1黏著帶回收；及轉印機構，將被切下的前述第1黏著帶回收後，從前述基板的非保持面側貼附前述第2黏著帶以進行轉印。 In other words, the substrate transfer device that transfers the substrate held in the annular frame to the second adhesive tape in the first adhesive tape for spacer support is characterized in that the substrate holding portion is interposed with the first adhesive. a tape holding the substrate; a frame holding portion for holding the annular frame; and a tape cutting portion that cuts the first adhesive tape along an outer shape of the substrate held by the substrate holding portion; The belt-receiving portion collects the first adhesive tape cut by the tape cutting portion; and the transfer mechanism collects the cut first adhesive tape, and then attaches the aforementioned non-retaining surface side of the substrate The second adhesive tape is used for transfer.

(作用、效果)根據此構成，可適當地實施上述方法。 (Operation and Effect) According to this configuration, the above method can be suitably carried out.

根據本發明的基板轉印方法及基板轉印裝置，即便在隔介硬質且難以彈性變形的黏著帶，將基板接著保持於框架的情況下，也能在將基板重新轉印於新的黏著帶時，以良好精度避免兩黏著帶的黏著面彼此接著。 According to the substrate transfer method and the substrate transfer device of the present invention, even in the case where the adhesive tape which is hard and hard to be elastically deformed, and the substrate is subsequently held by the frame, the substrate can be re-transferred to the new adhesive tape. At the same time, the adhesive faces of the two adhesive tapes are prevented from coming to each other with good precision.

1‧‧‧基板轉印裝置 1‧‧‧Substrate transfer device

3‧‧‧安裝框架收納部 3‧‧‧Installation frame storage

5‧‧‧第1搬送機構(帶回收部) 5‧‧‧1st transport unit (with recycling department)

7‧‧‧保持台 7‧‧‧ Keeping the table

9‧‧‧帶切斷機構(帶切斷部) 9‧‧‧With cutting mechanism (with cutting section)

11‧‧‧環狀框架供給部 11‧‧‧Ring Frame Supply Department

13‧‧‧帶貼附機構(轉印機構) 13‧‧‧With attachment mechanism (transfer mechanism)

15‧‧‧帶切斷機構 15‧‧‧With cutting mechanism

19‧‧‧反轉單元 19‧‧‧Reversal unit

21‧‧‧紫外線照射機構 21‧‧‧UV irradiation mechanism

23‧‧‧帶剝離機構 23‧‧‧With stripping mechanism

25‧‧‧安裝框架回收部 25‧‧‧Installation Frame Recycling Department

29‧‧‧框架保持部 29‧‧‧Framekeeping Department

31‧‧‧晶圓保持部(基板保持部) 31‧‧‧ wafer holding unit (substrate holding unit)

f1、f2‧‧‧環狀框架 F1, f2‧‧‧ ring frame

T1‧‧‧黏著帶(第1黏著帶) T1‧‧‧ adhesive tape (1st adhesive tape)

T2‧‧‧黏著帶(第2黏著帶) T2‧‧‧ adhesive tape (2nd adhesive tape)

MF1、MF2‧‧‧安裝框架 MF1, MF2‧‧‧ installation framework

W‧‧‧半導體晶圓 W‧‧‧Semiconductor Wafer

圖1係顯示基板轉印裝置的基本構成之俯視圖。 Fig. 1 is a plan view showing a basic configuration of a substrate transfer device.

圖2係說明安裝框架的構成之圖；圖2(a)係顯示轉印前後之安裝框架的構成之剖視圖，圖2(b)係安裝框架的立體圖。 Fig. 2 is a view showing a configuration of a mounting frame; Fig. 2(a) is a cross-sectional view showing a configuration of a mounting frame before and after transfer, and Fig. 2(b) is a perspective view showing a mounting frame.

圖3係帶切斷機構的前視圖。 Figure 3 is a front elevational view of the strap cutting mechanism.

圖4係帶貼附機構的俯視圖。 Figure 4 is a plan view of the strap attachment mechanism.

圖5係帶切斷機構的前視圖。 Figure 5 is a front elevational view of the strap cutting mechanism.

圖6係反轉單元的前視圖。 Figure 6 is a front view of the reversing unit.

圖7係說明基板轉印裝置的動作之說明圖；圖7(a)係說明動作的流程圖，圖7(b)係說明各步驟中之安裝框架的構成之示意圖。 Fig. 7 is an explanatory view for explaining the operation of the substrate transfer device; Fig. 7(a) is a flow chart for explaining the operation, and Fig. 7(b) is a view showing the configuration of the mounting frame in each step.

圖8係說明步驟S1中之安裝框架的構成之前視圖。 Fig. 8 is a front view showing the configuration of the mounting frame in the step S1.

圖9係說明步驟S2中之安裝框架的構成之前視圖；圖9(a)係顯示切斷黏著帶T1時的構成之圖，圖9(b)係顯示切斷黏著帶T1後的構成之圖。 Fig. 9 is a front view showing the configuration of the mounting frame in the step S2; Fig. 9(a) is a view showing the configuration when the adhesive tape T1 is cut, and Fig. 9(b) is a view showing the configuration after the adhesive tape T1 is cut. .

圖10係說明步驟S3中之安裝框架的構成之前視圖。 Fig. 10 is a front view showing the configuration of the mounting frame in the step S3.

圖11係說明步驟S4中之安裝框架的構成之前視圖。 Figure 11 is a front view showing the configuration of the mounting frame in the step S4.

圖12係說明步驟S5中之安裝框架的構成之前視圖；圖12(a)係顯示貼附黏著帶T2時的構成之圖，圖12(b)係顯示貼附黏著帶T2後的構成之圖。 Fig. 12 is a front view showing the configuration of the mounting frame in the step S5; Fig. 12(a) is a view showing a configuration when the adhesive tape T2 is attached, and Fig. 12(b) is a view showing a configuration after attaching the adhesive tape T2. .

圖13係說明步驟S6中之安裝框架的構成之前視圖。 Figure 13 is a front view showing the configuration of the mounting frame in the step S6.

圖14係說明習知例之進行轉印的構成之圖；圖14(a)係顯示使黏著帶變形的構成之圖，圖14(b)係顯示插入接著防止材的構成之圖。 Fig. 14 is a view showing a configuration for performing transfer in a conventional example; Fig. 14(a) is a view showing a configuration in which an adhesive tape is deformed, and Fig. 14(b) is a view showing a configuration in which an adhesive material is inserted.

圖15係說明變形例之帶剝離機構的構成之圖；圖15(a)係說明帶剝離機構的構成之前視圖，圖15(b)係說明剝離黏著帶的狀態之立體圖。 Fig. 15 is a view showing a configuration of a tape peeling mechanism according to a modification; Fig. 15 (a) is a front view showing a configuration of a tape peeling mechanism, and Fig. 15 (b) is a perspective view showing a state in which an adhesive tape is peeled off.

圖16係說明變形例之帶剝離機構的構成之圖；圖16(a)係說明使切斷器接觸晶圓保持部以切斷黏著帶的構成之前視圖，圖16(b)係說明在沒有使切斷器接觸晶圓及晶圓保持部的情況下切斷黏著帶的狀態之前視圖，圖16(c)係說明超出部分比晶圓厚度還短的構成之效果之剖視圖。 Fig. 16 is a view showing a configuration of a tape peeling mechanism according to a modification; Fig. 16 (a) is a front view showing a configuration in which a cutter is brought into contact with a wafer holding portion to cut an adhesive tape, and Fig. 16 (b) shows that there is no FIG. 16(c) is a cross-sectional view showing the effect of a configuration in which the excess portion is shorter than the thickness of the wafer, before the cutter is brought into contact with the wafer and the wafer holding portion.

用以實施發明的形態Form for implementing the invention

以下，參照圖式，說明本發明的實施例。 Hereinafter, embodiments of the present invention will be described with reference to the drawings.

<整體構成的說明> <Description of the overall composition>

圖1係顯示本發明之基板轉印裝置1的基本構成之俯視圖。 Fig. 1 is a plan view showing a basic configuration of a substrate transfer device 1 of the present invention.

此基板轉印裝置1係如圖2(a)所示，將晶圓W從半導體晶圓W(以下，簡稱「晶圓W」)的一面貼附有黏著帶T1的安裝框架MF1，轉印到該晶圓W的另一面貼附有黏著帶T2的安裝框架MF2。 As shown in FIG. 2(a), the substrate transfer device 1 is attached to the mounting frame MF1 of the adhesive tape T1 from one side of the semiconductor wafer W (hereinafter referred to as "wafer W"). A mounting frame MF2 to which the adhesive tape T2 is attached is attached to the other surface of the wafer W.

如圖2(b)所示，安裝框架MF1係在晶圓W的一面與環狀框架f貼附黏著帶T1而製作。安裝框架MF2係在晶圓W的另一面與環狀框架f貼附黏著帶T2而製作。此外，本實施例中，在安裝框架MF1的環狀框架f標註符號f1，在安裝框架MF2的環狀框架f標註符號f2以區別兩者。 As shown in FIG. 2(b), the mounting frame MF1 is produced by attaching an adhesive tape T1 to one side of the wafer W and the annular frame f. The mounting frame MF2 is produced by attaching an adhesive tape T2 to the annular frame f on the other surface of the wafer W. Further, in the present embodiment, the symbol f1 is attached to the annular frame f of the mounting frame MF1, and the symbol f2 is attached to the annular frame f of the mounting frame MF2 to distinguish the two.

此外，本實施例所使用的黏著帶T1及黏著帶T2，為了使晶圓W具有剛性，是使用以PET(Polyethylene Terephthalate)為主原料的帶(tape)。然而，黏著帶T1及黏著帶T2的材料，並不限定於PET，亦可使用其他周知的材料。 Further, in the adhesive tape T1 and the adhesive tape T2 used in the present embodiment, in order to make the wafer W rigid, a tape made of PET (Polyethylene Terephthalate) as a main raw material is used. However, the material of the adhesive tape T1 and the adhesive tape T2 is not limited to PET, and other well-known materials may be used.

本發明的基板轉印裝置1係如圖1所示，具備有：安裝框架收納部3、第1搬送機構5、保持台7、帶切斷機構9、環狀框架供給部11、帶貼附機構13、帶切斷機構15、反轉單元19、紫外線照射機構21、帶剝離機構23和安裝框架回收部25。此外，在之後的說明中，將圖1中的x方向設為左右方向，將z方向設為上下方向。關於y方向，將圖1的下側設為「前側」，將圖 1的上側設為「裏側」。亦即，安裝框架回收部25係在圖1所示基板轉印裝置1中配置在比安裝框架收納部3還靠裏側。 As shown in FIG. 1, the substrate transfer device 1 of the present invention includes a mounting frame housing portion 3, a first conveying mechanism 5, a holding table 7, a tape cutting mechanism 9, an annular frame supply portion 11, and a tape attachment. The mechanism 13, the tape cutting mechanism 15, the reversing unit 19, the ultraviolet irradiation mechanism 21, the tape peeling mechanism 23, and the mounting frame collecting portion 25. In addition, in the following description, the x direction in FIG. 1 is set to the left-right direction, and the z direction is set to the up-down direction. Regarding the y direction, the lower side of Fig. 1 is set to "front side", and the figure will be shown. The upper side of 1 is set to "back side". In other words, the mounting frame collecting portion 25 is disposed on the back side of the mounting frame housing portion 3 in the substrate transfer device 1 shown in FIG.

安裝框架收納部3係配備有收納安裝框架MF1之未圖示的收納部，該安裝框架MF1係在晶圓W的一面與環狀框架f1貼附黏著帶T1而製作。此收納部具備有：連結固定於裝置框架之縱向軌道；和沿著此縱向軌道藉馬達螺桿進給而升降之升降台。因此，安裝框架收納部3係構成為將安裝框架MF載置於升降台以進行間距進給(pitch feed)升降。又，環狀框架供給部11及安裝框架回收部25亦形成為與安裝框架供給部3同樣的構成。 The mounting frame accommodating portion 3 is provided with a housing portion (not shown) that houses the mounting frame MF1, and the mounting frame MF1 is produced by attaching the adhesive tape T1 to one side of the wafer W and the annular frame f1. The accommodating portion is provided with a longitudinal rail that is coupled and fixed to the apparatus frame, and a lifting platform that is lifted and lowered by the motor screw along the longitudinal rail. Therefore, the mounting frame accommodating portion 3 is configured to mount the mounting frame MF on the elevating table to perform pitch feed lifting. Further, the annular frame supply unit 11 and the attachment frame collecting unit 25 are also formed in the same configuration as the mounting frame supply unit 3.

第1搬送機構5係將收納於安裝框架收納部3的安裝框架MF1朝配置於切斷位置S的保持台7搬送。又，第1搬送機構5係如後述，亦具有藉由帶切斷機構9切下黏著帶T1，將自晶圓W分離的環狀框架f1搬送到安裝框架收納部3之功能。亦即，自晶圓W分離的環狀框架f1及黏著帶T1，係藉由第1搬送機構5回收到安裝框架收納部3。第1搬送機構5相當於本發明的帶回收部。黏著帶T1相當於本發明的第1黏著帶。 The first transport mechanism 5 transports the mounting frame MF1 accommodated in the mounting frame accommodating portion 3 to the holding table 7 disposed at the cutting position S. In addition, as will be described later, the first transport mechanism 5 also has a function of cutting the adhesive tape T1 by the tape cutting mechanism 9 and transporting the annular frame f1 separated from the wafer W to the mounting frame accommodating portion 3. In other words, the annular frame f1 and the adhesive tape T1 separated from the wafer W are recovered by the first transfer mechanism 5 to the mounting frame housing portion 3. The first conveying mechanism 5 corresponds to the belt collecting unit of the present invention. The adhesive tape T1 corresponds to the first adhesive tape of the present invention.

保持台7係用以載置保持安裝框架MF1，如圖1所示構成為可在切斷位置S和轉印位置R之間往復移動。保持台7係如圖3至圖5所示，具備有：保持環狀框架f的環狀框架保持部29；和保持晶圓W的圓形晶圓保持部31。晶圓保持部31相當於本發明的基板保持部。框架保持部29相當於本發明的框架保持部。 The holding table 7 is for placing the holding frame MF1, and is configured to reciprocate between the cutting position S and the transfer position R as shown in FIG. As shown in FIGS. 3 to 5, the holding table 7 includes an annular frame holding portion 29 that holds the annular frame f, and a circular wafer holding portion 31 that holds the wafer W. The wafer holding portion 31 corresponds to the substrate holding portion of the present invention. The frame holding portion 29 corresponds to the frame holding portion of the present invention.

在框架保持部29的保持面，形成有吸附保持環狀框架f的吸附孔。在晶圓保持部31的保持面，形成有吸附保持晶圓W的吸附孔。從更合適地執行黏著帶T1的切斷之觀點，晶圓保持部31的直徑較佳為晶圓W的直徑以下。 An adsorption hole that sucks and holds the annular frame f is formed on the holding surface of the frame holding portion 29. An adsorption hole that adsorbs and holds the wafer W is formed on the holding surface of the wafer holding portion 31. From the viewpoint of more appropriately performing the cutting of the adhesive tape T1, the diameter of the wafer holding portion 31 is preferably equal to or smaller than the diameter of the wafer W.

如圖3所示，在保持台7位於切斷位置S的情況下，帶切斷機構9係配置於保持台7的上方，具備有：框架33、可動台35、支持臂37和切斷器單元39。可動台35係可沿著框架33升降移動。支持臂37係設置在從可動台35被懸臂支持之臂的前端下部，構成為在晶圓W的徑向伸縮。 As shown in FIG. 3, when the holding table 7 is located at the cutting position S, the tape cutting mechanism 9 is disposed above the holding table 7, and includes a frame 33, a movable table 35, a support arm 37, and a cutter. Unit 39. The movable table 35 is movable up and down along the frame 33. The support arm 37 is provided at a lower end portion of the arm that is cantilevered from the movable table 35, and is configured to expand and contract in the radial direction of the wafer W.

切斷器單元39係隔介支持臂37連接於可動台35。在切斷器單元39，刀尖向下的切斷器41係隔介切斷器保持器(cutter holder)而裝設。切斷器單元(cutter unit)39係以隔介支持臂37可調整迴旋半徑的方式構成。切斷器41係將貼附於安裝框架MF1的黏著帶T1沿著晶圓W的外形切斷。帶切斷機構9相當於本發明的帶切斷部。環狀框架供給部11具備有將新的環狀框架f2朝轉印位置R搬送之框架搬送部F。 The cutter unit 39 is connected to the movable table 35 by the spacer support arm 37. In the cutter unit 39, the cutter 41 having the blade tip downward is attached to the cutter holder. The cutter unit 39 is configured such that the spacer support arm 37 can adjust the radius of gyration. The cutter 41 cuts the adhesive tape T1 attached to the mounting frame MF1 along the outer shape of the wafer W. The tape cutting mechanism 9 corresponds to the tape cutting portion of the present invention. The annular frame supply unit 11 includes a frame transport unit F that transports the new annular frame f2 to the transfer position R.

如圖4所示，在保持台7位於轉印位置R的情況下，帶貼附機構13係配置於保持台7的上方，具備有：帶供給部43、貼附輥45、剝離輥49和帶回收部51。帶供給部43係裝填捲成滾筒狀之寬幅的黏著帶T2。貼附輥45係涵蓋被搬入轉印位置R的晶圓W、和從環狀框架供給部11新供給之環狀框架f2的上面而貼附黏著帶T2。 As shown in FIG. 4, when the holding table 7 is located at the transfer position R, the tape attaching mechanism 13 is disposed above the holding table 7, and includes a tape supply unit 43, an attaching roller 45, a peeling roller 49, and The collection unit 51 is provided. The tape supply portion 43 is provided with a wide adhesive tape T2 that is wound into a roll shape. The attaching roller 45 covers the wafer W carried in the transfer position R and the upper surface of the annular frame f2 newly supplied from the annular frame supply unit 11 to adhere the adhesive tape T2.

藉由帶貼附機構13使晶圓W轉印到黏著帶T2，而製作安裝框架MF2。帶貼附機構13相當於本發明的轉印機構。黏著帶相當於本發明的第2黏著帶。 The wafer W is transferred to the adhesive tape T2 by the tape attaching mechanism 13, and the mounting frame MF2 is produced. The tape attaching mechanism 13 corresponds to the transfer mechanism of the present invention. The adhesive tape corresponds to the second adhesive tape of the present invention.

帶切斷機構15係與帶貼附機構13同樣，在保持台7位於轉印位置R的情況下，配置於保持台7的上方。帶切斷機構15係如圖5所示，具備有：框架53、支軸55、支持臂57、切斷器59和按壓輥61。 Similarly to the tape attachment mechanism 13, the tape cutting mechanism 15 is disposed above the holding table 7 when the holding table 7 is positioned at the transfer position R. As shown in FIG. 5, the tape cutting mechanism 15 includes a frame 53, a support shaft 55, a support arm 57, a cutter 59, and a pressing roller 61.

支軸55係可沿著框架53升降移動，繞著z方向的軸旋轉。支持臂57係以支軸55為中心在徑向延伸有複數支。切斷器59係設置在支持臂57a的前端，將所貼附的黏著帶T2沿著環狀框架f切斷。按壓輥61係設置於支持臂57b的前端，將環狀框架f2上的帶切斷部位一邊轉動一邊按壓。 The support shaft 55 is movable up and down along the frame 53 to rotate about the axis in the z direction. The support arm 57 has a plurality of branches extending in the radial direction around the support shaft 55. The cutter 59 is provided at the front end of the support arm 57a, and cuts the attached adhesive tape T2 along the annular frame f. The pressing roller 61 is provided at the front end of the support arm 57b, and presses the belt-cut portion on the annular frame f2 while rotating.

反轉單元19係如圖6所示，在可沿著豎立設置固定的縱向軌道63升降的升降台65，可藉旋轉致動器67繞著水平支軸r轉動的接承框69係裝設成懸臂狀，並且夾盤爪71係以可分別繞著支軸s轉動的方式裝備於接承框69的基部和前端部。 As shown in FIG. 6, the reversing unit 19 is mounted on the elevating frame 65 which is movable up and down along the vertical rail 63 which is erected and fixed, and can be attached to the connecting frame 69 which is rotated about the horizontal fulcrum r by the rotary actuator 67. The cantilever shape is formed, and the chuck claws 71 are provided to the base portion and the front end portion of the socket frame 69 so as to be rotatable about the support shafts s, respectively.

反轉單元19接取安裝框架MF2後，以黏著帶T2成為晶圓W的下側，黏著帶T1成為晶圓W的上側之方式使安裝框架MF2反轉。紫外線照射機構21係對位於晶圓W上側的黏著帶T1照射紫外線。由於黏著帶T1係紫外線硬化性的帶，故藉由紫外線照射可使黏著帶T1的黏著力降低。帶剝離機構23係將黏著帶T1從晶圓W剝離並回收。安裝框架回收部25係將黏著帶T1經剝離後的安裝框架MF2回收、收納。 After the reversing unit 19 picks up the mounting frame MF2, the mounting frame MF2 is reversed so that the adhesive tape T2 becomes the lower side of the wafer W and the adhesive tape T1 becomes the upper side of the wafer W. The ultraviolet irradiation unit 21 irradiates the adhesive tape T1 located on the upper side of the wafer W with ultraviolet rays. Since the adhesive tape T1 is an ultraviolet curable tape, the adhesive force of the adhesive tape T1 can be lowered by ultraviolet irradiation. The tape peeling mechanism 23 peels and collects the adhesive tape T1 from the wafer W. The mounting frame collecting portion 25 collects and stores the adhesive tape T1 after the peeling of the mounting frame MF2.

又，基板轉印裝置1係如圖1所示，進一步具備有：晶圓收納部91、晶圓搬送機構93和晶圓對準部95。晶圓收納部91係積層收納晶圓W。晶圓搬送機構93係將收納於晶圓收納部91的晶圓W朝晶圓對準部95搬送。晶圓對準部95係進行被搬送之晶圓W的對位。 Further, as shown in FIG. 1, the substrate transfer device 1 further includes a wafer storage unit 91, a wafer transfer mechanism 93, and a wafer alignment portion 95. The wafer storage unit 91 stores the wafer W in a layer. The wafer transfer mechanism 93 transports the wafer W stored in the wafer storage unit 91 toward the wafer alignment unit 95. The wafer alignment portion 95 performs alignment of the wafer W to be transferred.

此等構成係為了涵蓋晶圓W和環狀框架的一面貼附黏著帶來製作安裝框架而使用。本實施例中係採用已製作安裝框架MF1並收納於安裝框架收納部3的情況為例作說明，本實施例的基板轉印裝置1亦可作為使用晶圓W來製作安裝框架MF1的晶圓安裝裝置使用。 These configurations are used to form a mounting frame in order to cover the wafer W and the one side of the annular frame. In the present embodiment, the case where the mounting frame MF1 has been prepared and stored in the mounting frame accommodating portion 3 is taken as an example. The substrate transfer device 1 of the present embodiment can also be used as a wafer for mounting the mounting frame MF1 using the wafer W. Use the mounting device.

<動作的說明> <Description of action>

其次，使用實施例的基板轉印裝置1，針對將晶圓W從已實施所期望的處理之安裝框架MF1轉印到新的安裝框架MF2之動作進行說明。圖7(a)係表示基板轉印裝置1的動作之流程圖。圖7(b)係各步驟中之安裝框架MF的示意構成之圖。 Next, an operation of transferring the wafer W from the mounting frame MF1 on which the desired processing has been performed to the new mounting frame MF2 will be described using the substrate transfer device 1 of the embodiment. FIG. 7(a) is a flowchart showing the operation of the substrate transfer device 1. Fig. 7(b) is a diagram showing the schematic configuration of the mounting frame MF in each step.

此外，以晶圓W中形成有電路圖案的面作為表面來進行說明。又，本實施例中，安裝框架MF1係在晶圓W的表面貼附有黏著帶T1者。再者，本實施例中，黏著帶T1的黏著層係使用紫外線硬化性黏著劑。 In addition, the surface on which the circuit pattern is formed in the wafer W will be described as a surface. Further, in the present embodiment, the mounting frame MF1 is attached to the surface of the wafer W with the adhesive tape T1 attached thereto. Further, in the present embodiment, the adhesive layer of the adhesive tape T1 is an ultraviolet curable adhesive.

步驟S1(安裝框架的保持) Step S1 (maintenance of the mounting frame)

於安裝框架收納部3積層收納有黏著帶T1貼附於晶圓W表面而製作之安裝框架MF1。第1搬送機構5係吸附保持安裝框架MF1的上面，如圖8所示，從點線所示的位置朝實線所示的位置移動。 The mounting frame accommodating portion 3 is provided with a mounting frame MF1 which is formed by laminating the adhesive tape T1 on the surface of the wafer W. The first conveying mechanism 5 sucks and holds the upper surface of the mounting frame MF1, and as shown in FIG. 8, moves from the position indicated by the dotted line to the position indicated by the solid line.

第1搬送機構5係以貼附有黏著帶T1的面為下側，將安裝框架MF1載置於位於切斷位置S的保持台7。第1搬送機構5係在載置有安裝框架MF1後，移動到待避位置(以一例而言，為點線所示之左側的位置)。在載置有安裝框架MF1後，框架保持部29吸附保持環狀框架f1，晶圓保持部31吸附保持晶圓W。步驟S1中的一連串的工序係相當於本發明的保持工序。 The first conveying mechanism 5 has the mounting frame MF1 placed on the holding table 7 at the cutting position S, with the surface on which the adhesive tape T1 is attached as the lower side. After the mounting frame MF1 is placed, the first conveying mechanism 5 moves to a position to be avoided (for example, a position on the left side indicated by a dotted line). After the mounting frame MF1 is placed, the frame holding portion 29 sucks and holds the annular frame f1, and the wafer holding portion 31 sucks and holds the wafer W. The series of steps in step S1 corresponds to the holding step of the present invention.

步驟S2(黏著帶T1的切斷) Step S2 (cutting of the adhesive tape T1)

在吸附保持有安裝框架MF1後，帶切斷機構9會作動，開始進行黏著帶T1的切斷。亦即，藉由帶切斷機構9作動，如圖9(a)所示，切斷器單元39會下降到既定的高度為止，切斷器41刺入黏著帶T1。於該狀態下，沿著晶圓W的外形切斷黏著帶T1。本實施例中，由於係使切斷器41一邊接觸晶圓W的外徑一邊切斷黏著帶T1，所以黏著帶T1可被切下成與晶圓W相同的大小。 After the mounting frame MF1 is adsorbed and held, the tape cutting mechanism 9 is actuated to start cutting the adhesive tape T1. That is, the belt cutting mechanism 9 is actuated, and as shown in Fig. 9(a), the cutter unit 39 is lowered to a predetermined height, and the cutter 41 is inserted into the adhesive tape T1. In this state, the adhesive tape T1 is cut along the outer shape of the wafer W. In the present embodiment, since the cutter 41 cuts the adhesive tape T1 while contacting the outer diameter of the wafer W, the adhesive tape T1 can be cut to the same size as the wafer W.

當黏著帶T1的切斷完成時，切斷器單元39會上升而返回點線所示的待機位置。藉由沿著晶圓W的外形切斷黏著帶T1，如圖9(b)所示，黏著帶T1中黏著面露出的部分(露出部P)從晶圓W被分離。步驟S2中之一連串的工序相當於本發明的帶切斷工序。 When the cutting of the adhesive tape T1 is completed, the cutter unit 39 rises and returns to the standby position indicated by the dotted line. By cutting the adhesive tape T1 along the outer shape of the wafer W, as shown in FIG. 9(b), the exposed portion (exposed portion P) of the adhesive tape T1 is separated from the wafer W. One of the series of steps in step S2 corresponds to the tape cutting step of the present invention.

步驟S3(環狀框架f1的回收) Step S3 (recycling of the annular frame f1)

黏著帶T1的切斷完成後，利用第1搬送機構進行框架f1的回收。亦即，第1搬送機構5係如圖10所示，從待避位置朝切斷位置S移動。接著，第1搬送 機構5係在安裝框架MF1的上方，下降到既定的高度以吸附保持環狀框架f1的上面。吸附保持有環狀框架f1的第1搬送機構5再度上升，朝左側移動而使環狀框架f1收納於安裝框架收納部3。 After the cutting of the adhesive tape T1 is completed, the frame f1 is collected by the first conveying mechanism. In other words, as shown in FIG. 10, the first conveying mechanism 5 moves from the position to be avoided to the cutting position S. Then, the first transfer The mechanism 5 is lowered above the mounting frame MF1 to a predetermined height to adsorb and hold the upper surface of the annular frame f1. The first conveying mechanism 5 that adsorbs and holds the annular frame f1 is again raised, moves to the left side, and the annular frame f1 is housed in the mounting frame housing portion 3.

在步驟S2中，由於黏著帶T1係沿著晶圓W的外形切斷，故被切下的黏著帶T1(由晶圓W分離之部分的黏著帶T1)，係與環狀框架f1一起被第1搬送機構5回收。被切下的黏著帶T1含有露出部P。因此，黏著帶T1的露出部P會伴隨環狀框架f1被回收，所以藉由步驟S2及步驟S3的工序，可避免黏著帶T1的黏著面在保持台7上露出。步驟S3中之一連串的工序相當於本發明的帶回收工序。 In step S2, since the adhesive tape T1 is cut along the outer shape of the wafer W, the cut adhesive tape T1 (the adhesive tape T1 separated by the wafer W) is attached together with the annular frame f1. The first transport mechanism 5 collects. The cut adhesive tape T1 contains the exposed portion P. Therefore, since the exposed portion P of the adhesive tape T1 is recovered along with the annular frame f1, the steps of the steps S2 and S3 prevent the adhesive surface of the adhesive tape T1 from being exposed on the holding table 7. One of the series of steps in step S3 corresponds to the belt recovery step of the present invention.

步驟S4(環狀框架f2的供給) Step S4 (supply of the annular frame f2)

完成環狀框架f1及被切下的黏著帶T1之回收後，進行新的環狀框架f2的供給。亦即，保持台7係在吸附保持有晶圓W的狀態下，從切斷位置S朝轉印位置R移動。框架搬送部F係對收納於環狀框架供給部11之環狀框架f2的上面進行吸附保持，朝轉印位置R移動。 After the completion of the recovery of the annular frame f1 and the cut adhesive tape T1, the supply of the new annular frame f2 is performed. In other words, the holding table 7 is moved from the cutting position S toward the transfer position R while the wafer W is being adsorbed and held. The frame transport unit F sucks and holds the upper surface of the annular frame f2 housed in the annular frame supply unit 11 and moves toward the transfer position R.

接著，框架搬送部F將環狀框架f2載置於位在轉印位置R的環狀框架保持部29。框架搬送部F係在載置了環狀框架f2後，朝待避位置移動。待環狀框架f2已載置後，框架保持部29吸附保持環狀框架f2。藉由環狀框架f2被吸附保持，而完成環狀框架f2的供給。 Next, the frame transport unit F mounts the annular frame f2 on the annular frame holding portion 29 positioned at the transfer position R. The frame transport unit F moves toward the to-be-avoided position after the annular frame f2 is placed. After the annular frame f2 has been placed, the frame holding portion 29 sucks and holds the annular frame f2. The supply of the annular frame f2 is completed by the annular frame f2 being adsorbed and held.

步驟S5(黏著帶T2的貼附) Step S5 (attachment of adhesive tape T2)

將環狀框架f2供給到晶圓W後，帶貼附機構13會作動，開始進行黏著帶T2的貼附。亦即，藉由帶貼附機構13作動，如圖12(a)所示，貼附輥45下降到既定的高度而從圖的右方朝左方轉動。藉由貼附輥45轉動，裝填於帶供給部43的黏著帶T2會涵蓋晶圓W及環狀框架f2的上面而貼附(圖12(b))。 After the annular frame f2 is supplied to the wafer W, the tape attaching mechanism 13 is actuated to start the attaching of the adhesive tape T2. That is, by the tape attaching mechanism 13, as shown in Fig. 12 (a), the attaching roller 45 is lowered to a predetermined height and rotated from the right side to the left side of the drawing. By the rotation of the attaching roller 45, the adhesive tape T2 loaded in the tape supply portion 43 covers the wafer W and the upper surface of the annular frame f2 and is attached (Fig. 12(b)).

此外，在步驟S5開始的時點，黏著帶T1的露出部P已從晶圓W被分離，而被回收去除。因此，由於黏著帶T1的黏著面沒有超出晶圓W的外側，所以在貼附黏著帶T2時，可確實地避免黏著帶T1的黏著面與黏著帶T2的黏著面之間接著。藉由貼附黏著帶T2，晶圓W從黏著帶T1被轉印到新的黏著帶T2。亦即，藉由轉印，製作新的安裝框架MF2。步驟S5中之一連串的工序相當於本發明的轉印工序。 Further, at the time point of the start of step S5, the exposed portion P of the adhesive tape T1 is separated from the wafer W and is recovered and removed. Therefore, since the adhesive surface of the adhesive tape T1 does not extend beyond the outer side of the wafer W, it is possible to surely avoid the adhesion between the adhesive surface of the adhesive tape T1 and the adhesive surface of the adhesive tape T2 when the adhesive tape T2 is attached. The wafer W is transferred from the adhesive tape T1 to the new adhesive tape T2 by attaching the adhesive tape T2. That is, a new mounting frame MF2 is produced by transfer. One of the series of steps in step S5 corresponds to the transfer step of the present invention.

步驟S6(黏著帶T2的切斷) Step S6 (cutting of the adhesive tape T2)

將黏著帶T2貼附於晶圓W及環狀框架f2後，帶切斷機構15會作動，開始進行黏著帶T2的切斷。亦即，如圖13所示，藉由帶切斷機構15作動，支軸55下降到既定的高度為止，切斷器59刺入黏著帶T2。在此狀態下使支軸55繞著z方向的軸旋轉，將黏著帶T2沿著環狀框架f2切斷成圓形。 After the adhesive tape T2 is attached to the wafer W and the annular frame f2, the tape cutting mechanism 15 is actuated to start cutting the adhesive tape T2. That is, as shown in Fig. 13, the belt cutting mechanism 15 is actuated, the support shaft 55 is lowered to a predetermined height, and the cutter 59 is inserted into the adhesive tape T2. In this state, the support shaft 55 is rotated about the axis in the z direction, and the adhesive tape T2 is cut into a circular shape along the annular frame f2.

環狀框架f2上黏著帶T2已被切斷的部位，係被轉動的按壓輥61按壓。其後，令設置於帶貼附機構13的剝離輥49從圖的右方朝左方轉動，將殘留於切斷 線外側之不要的黏著帶T2從環狀框架f2剝離。被剝離的不要的黏著帶T2，透過帶回收部51捲取並回收。 The portion of the annular frame f2 where the adhesive tape T2 has been cut is pressed by the rotating pressing roller 61. Thereafter, the peeling roller 49 provided on the tape attaching mechanism 13 is rotated from the right side of the drawing to the left side, and remains in the cut. The unnecessary adhesive tape T2 on the outer side of the line is peeled off from the annular frame f2. The peeled unnecessary adhesive tape T2 is taken up and recovered by the tape collecting portion 51.

步驟S7(安裝框架的反轉) Step S7 (reverse of the mounting frame)

黏著帶T2的貼附及切斷完成後，安裝框架MF2係藉由未圖示的第2搬送機構，搬送到反轉單元19。反轉單元19係以設置於接承框69的夾盤爪71保持安裝框架MF2，使接承框69繞著水平支軸r轉動。藉由接承框69的轉動，安裝框架MF2係從以黏著帶T2為上側的狀態反轉至以黏著帶T1為上側的狀態。 After the attachment and cutting of the adhesive tape T2 is completed, the attachment frame MF2 is conveyed to the reversing unit 19 by a second conveyance mechanism (not shown). The reversing unit 19 holds the mounting frame MF2 with the chuck claws 71 provided on the receiving frame 69, and rotates the receiving frame 69 about the horizontal support shaft r. By the rotation of the receiving frame 69, the mounting frame MF2 is reversed from the state in which the adhesive tape T2 is on the upper side to the upper side in the adhesive tape T1.

步驟S8(黏著帶T1的剝離) Step S8 (peeling of the adhesive tape T1)

使安裝框架MF2反轉後，開始進行貼附於晶圓W表面之黏著帶T1的剝離。紫外線照射機構21係對安裝框架MF2的黏著帶T1照射紫外線。黏著帶T1的接著層係以紫外線硬化性的黏著劑構成，所以藉由紫外線的照射會使黏著帶T1的黏著力降低。 After the mounting frame MF2 is reversed, peeling of the adhesive tape T1 attached to the surface of the wafer W is started. The ultraviolet irradiation unit 21 irradiates the adhesive tape T1 of the mounting frame MF2 with ultraviolet rays. The adhesive layer of the adhesive tape T1 is composed of an ultraviolet curable adhesive, so that the adhesion of the adhesive tape T1 is lowered by the irradiation of ultraviolet rays.

經紫外線照射後的安裝框架MF2係藉由未圖示的第3搬送機構搬送到帶剝離機構23。帶剝離機構23係將位於晶圓W上面側的黏著帶T1從晶圓W剝離並回收(參照圖7(b)、S8)。黏著帶T1已被剝離後的安裝框架MF2係藉由未圖示的第4搬送機構朝安裝框架回收部25搬送。 The mounting frame MF2 after being irradiated with ultraviolet rays is transported to the tape peeling mechanism 23 by a third transfer mechanism (not shown). The tape peeling mechanism 23 peels and collects the adhesive tape T1 located on the upper surface side of the wafer W from the wafer W (see FIGS. 7(b) and 7). The mounting frame MF2 in which the adhesive tape T1 has been peeled off is transported to the mounting frame collecting portion 25 by a fourth transfer mechanism (not shown).

安裝框架回收部25將黏著帶T1已被剝離後的安裝框架MF2加以回收、收納。藉由以上一連串的動作，從晶圓W表面貼附黏著帶T1而構成的安裝框架MF1，朝向晶圓W背面貼附黏著帶T2而構成的安裝框架MF2轉印之工序係全部完成。 The mounting frame collecting portion 25 collects and stores the mounting frame MF2 from which the adhesive tape T1 has been peeled off. The mounting frame MF1 in which the adhesive tape T1 is attached from the surface of the wafer W by the above-described series of operations, and the transfer of the mounting frame MF2 formed by attaching the adhesive tape T2 to the back surface of the wafer W are all completed.

以上，結束一個循環的基本動作，之後，重複相同動作。 Above, the basic action of one cycle is ended, and then the same action is repeated.

<依據實施例之構成的功效> <Effect of constitution according to embodiment>

實施例的基板轉印裝置1具備有帶切斷機構9和第1搬送機構5。帶切斷機構9係將保持於保持台7之安裝框架MF1的黏著帶T1沿著晶圓W的外形切斷。藉由沿著晶圓W的外形切斷黏著帶T1，而使從晶圓W的一面超出外側的黏著帶T1即露出部P從晶圓W分離。然後，被分離的露出部P係與環狀框架f1一起被第1搬送機構5回收，而收納至安裝框架收納部3。 The substrate transfer device 1 of the embodiment includes a tape cutting mechanism 9 and a first conveying mechanism 5. The tape cutting mechanism 9 cuts the adhesive tape T1 held by the mounting frame MF1 of the holding table 7 along the outer shape of the wafer W. The adhesive tape T1 is cut along the outer shape of the wafer W, and the adhesive portion T1 which is outside the one side of the wafer W, that is, the exposed portion P, is separated from the wafer W. Then, the separated exposed portion P is collected by the first conveying mechanism 5 together with the annular frame f1, and is stored in the mounting frame housing portion 3.

由於黏著帶T1的露出部P係從晶圓W分離，所以將黏著帶T2貼附於晶圓的另一面時，黏著帶T1的黏著面不會超出晶圓W的外側。因此，將黏著帶T2貼附於環狀框架f2及晶圓W之際，可確實地避免黏著帶T1的黏著面與黏著帶T2的黏著面接觸。因此，能以更高精度進行使晶圓轉印到新的黏著帶之操作。 Since the exposed portion P of the adhesive tape T1 is separated from the wafer W, when the adhesive tape T2 is attached to the other surface of the wafer, the adhesive surface of the adhesive tape T1 does not extend beyond the wafer W. Therefore, when the adhesive tape T2 is attached to the annular frame f2 and the wafer W, it is possible to surely prevent the adhesive surface of the adhesive tape T1 from coming into contact with the adhesive surface of the adhesive tape T2. Therefore, the operation of transferring the wafer to a new adhesive tape can be performed with higher precision.

習知的基板轉印方法中，係採用：如圖14(a)所示，使黏著帶T1變形以從黏著帶T2疏離之方法；和如圖14(b)所示，將非黏著性接著防止材B插入黏著帶T1的露出部P之方法。 In the conventional substrate transfer method, as shown in FIG. 14(a), the adhesive tape T1 is deformed to be separated from the adhesive tape T2; and as shown in FIG. 14(b), the non-adhesive property is followed. A method of preventing the material B from being inserted into the exposed portion P of the adhesive tape T1.

然而，在圖14(a)所示習知方法中必須使黏著帶T1變形。因此，在使用硬質且難以彈性變形的材料，例如PET(Polyethylene Terephthalate)作為黏著帶T1的情況下，難以適用該習知方法。又，即便加長露出部P與黏著帶T2的距離，露出部P仍處於從晶圓W的外 側超出之狀態，所以難以確實地避免露出部P與黏著帶T2的接著。 However, in the conventional method shown in Fig. 14 (a), the adhesive tape T1 must be deformed. Therefore, in the case where a hard and elastically deformable material such as PET (Polyethylene Terephthalate) is used as the adhesive tape T1, it is difficult to apply the conventional method. Further, even if the distance between the exposed portion P and the adhesive tape T2 is lengthened, the exposed portion P is still outside the wafer W. Since the side is out of the state, it is difficult to surely avoid the adhesion of the exposed portion P and the adhesive tape T2.

且，在圖14(b)所示習知方法中，藉由黏著帶T1或黏著帶T2的黏著力，使接著防止材與該黏著帶解離時需要強的力。因此，由於在剝離已接著狀態的黏著帶時過度的拉伸力會作用於晶圓W，所以會有晶圓W破損的可能性。又，在環狀框架f與晶圓W的大小之差小的情況，將接著防止材插入露出部P時要求高的精度對準。如此，在習知方法中，避免黏著帶T1和黏著帶T2接著的確實性係受黏著帶的特性所影響。 Further, in the conventional method shown in Fig. 14 (b), a strong force is required to prevent the material from being dissociated from the adhesive tape by the adhesive force of the adhesive tape T1 or the adhesive tape T2. Therefore, since excessive tensile force acts on the wafer W when the adhesive tape in the adhered state is peeled off, there is a possibility that the wafer W is broken. Moreover, when the difference between the size of the annular frame f and the wafer W is small, the high precision alignment is required when the material is prevented from being inserted into the exposed portion P. Thus, in the conventional method, the subsequent reliability of the adhesive tape T1 and the adhesive tape T2 is affected by the characteristics of the adhesive tape.

另一方面，在實施例的基板轉印裝置1中，藉由沿著晶圓W的外形切斷黏著帶T1，可避免黏著帶彼此的接著。亦即，在實施例的構成中，不需在晶圓W轉印時使黏著帶變形。因此，即便黏著帶是硬質且難以彈性變形的材料，也可確實地避免黏著帶T1與黏著帶T2的接著。 On the other hand, in the substrate transfer device 1 of the embodiment, the adhesive tape T1 is cut along the outer shape of the wafer W, so that the adhesion of the adhesive tapes can be avoided. That is, in the configuration of the embodiment, it is not necessary to deform the adhesive tape at the time of transfer of the wafer W. Therefore, even if the adhesive tape is a material which is hard and hard to be elastically deformed, the adhesion of the adhesive tape T1 and the adhesive tape T2 can be surely avoided.

再者，在實施例的基板轉印裝置1中，也不需要新使用接著防止材。因此，即便在黏著帶的黏著力強的情況，也可一邊避免晶圓W的損傷，一邊確實地避免黏著帶T1與黏著帶T2的接著。因此，在實施例的基板轉印裝置1中，不會受到硬度和黏著力等黏著帶特性所影響，可確實地避免黏著帶T1與黏著帶T2的接著。又，在實施例的保持台7中，可使晶圓保持部31的直徑小於晶圓W的直徑，所以可避免基板轉印裝置1的大型化。 Further, in the substrate transfer device 1 of the embodiment, it is not necessary to newly use the subsequent material. Therefore, even when the adhesive force of the adhesive tape is strong, it is possible to surely avoid the adhesion of the adhesive tape T1 and the adhesive tape T2 while avoiding the damage of the wafer W. Therefore, in the substrate transfer device 1 of the embodiment, it is possible to surely avoid the adhesion of the adhesive tape T1 and the adhesive tape T2 without being affected by the adhesive tape characteristics such as hardness and adhesive force. Further, in the holding table 7 of the embodiment, the diameter of the wafer holding portion 31 can be made smaller than the diameter of the wafer W, so that the size of the substrate transfer device 1 can be prevented from increasing.

本發明不侷限於上述實施形態，可如下述變形實施。 The present invention is not limited to the above embodiment, and can be implemented as described below.

(1)上述實施例中，步驟S8的工序不限於使用紫外線照射機構21的構成。亦即，亦可不對安裝框架MF2照射紫外線，而是藉由使用剝離用黏著帶及剝離構件的方式，將黏著帶T1剝離。在此種變形例(1)的構成中，帶剝離機構23係如圖15(a)所示，具備有：保持安裝框架MF2的可動台81；引導捲成滾筒狀的剝離帶Q之引導輥83；刀口(knife edge)狀的剝離構件85；和回收剝離帶Q的捲取軸87。 (1) In the above embodiment, the step of step S8 is not limited to the configuration using the ultraviolet irradiation mechanism 21. In other words, the adhesive tape T1 may be peeled off by using the adhesive tape for peeling and the peeling member without irradiating the mounting frame MF2 with ultraviolet rays. In the configuration of the modification (1), the tape peeling mechanism 23 is provided with a movable table 81 that holds the attachment frame MF2 and a guide roller that guides the release tape Q that is wound into a roll shape, as shown in Fig. 15 (a). 83; a knife edge-shaped peeling member 85; and a take-up shaft 87 for recovering the peeling tape Q.

剝離帶Q係藉由引導輥83引導到剝離構件85，在剝離構件85中折返且反轉後，藉由捲取軸87捲取並回收。亦即，對保持於可動台81的安裝框架MF2，在貼附於晶圓W表面的黏著帶T1上貼附剝離帶Q。接著，在剝離帶Q貼附於黏著帶T1的狀態下，使可動台81朝圖15(a)的中右方移動。 The peeling tape Q is guided to the peeling member 85 by the guide roller 83, is folded back in the peeling member 85, and is reversed, and is taken up by the take-up shaft 87 and collected. That is, the peeling tape Q is attached to the adhesive tape T1 attached to the surface of the wafer W to the mounting frame MF2 held by the movable table 81. Next, in a state in which the peeling tape Q is attached to the adhesive tape T1, the movable table 81 is moved to the right in the middle of FIG. 15(a).

藉由使可動台81移動，如圖15(b)所示，剝離帶Q在剝離構件85的前端折返且移動，所以黏著帶T1係與剝離帶Q成為一體而自晶圓W的表面被剝離。此外，亦可將使用如圖15(a)所示之剝離帶Q的方式、和使用紫外線照射機構21的方式併用。 By moving the movable table 81, as shown in FIG. 15(b), the peeling tape Q is folded back and moved at the tip end of the peeling member 85. Therefore, the adhesive tape T1 is integrated with the peeling tape Q and peeled off from the surface of the wafer W. . Further, a method in which the peeling tape Q shown in Fig. 15 (a) is used and a method in which the ultraviolet irradiation mechanism 21 is used may be used in combination.

(2)在上述實施例及變形例中，於步驟S3中構成為將所切下之部分的黏著帶T1與環狀框架f1一起回收，但不限定於此。亦即，亦可構成為將所切下之部分的黏著帶T1自環狀框架f1剝離，並僅回收所切下之部分的黏著帶T1。 (2) In the above-described embodiment and modification, in step S3, the cut portion of the adhesive tape T1 is collected together with the annular frame f1, but the invention is not limited thereto. In other words, the cut portion of the adhesive tape T1 may be peeled off from the annular frame f1, and only the cut portion of the adhesive tape T1 may be recovered.

在此種變形例(2)的構成中，不用新使用環狀框架f2，可在步驟S6中涵蓋環狀框架f1與晶圓W的另一面來貼附黏著帶T2。因此，由於可省略環狀框架f2及環狀框架供給部11，所以可避免基板轉印裝置1的大型化，且亦可降低成本。 In the configuration of the modification (2), the adhesive tape T2 can be attached to the other surface of the annular frame f1 and the wafer W in step S6 without newly using the annular frame f2. Therefore, since the annular frame f2 and the annular frame supply unit 11 can be omitted, the size of the substrate transfer device 1 can be prevented from being increased, and the cost can be reduced.

(3)在上述實施例及變形例中，雖在步驟S5中供給新的環狀框架f2後，在步驟S6中將黏著帶T2貼附於環狀框架f2與晶圓W的上面，但轉印於黏著帶T2的構成並不侷限於此。亦即，亦可構成為對搬入轉印位置R的晶圓W供給預先貼附有黏著帶T2的環狀框架f2，將黏著帶T2貼附於晶圓W的上面。 (3) In the above-described embodiment and modification, after the new annular frame f2 is supplied in step S5, the adhesive tape T2 is attached to the upper surface of the annular frame f2 and the wafer W in step S6. The composition printed on the adhesive tape T2 is not limited to this. In other words, the wafer W loaded in the transfer position R may be supplied with the annular frame f2 to which the adhesive tape T2 is attached in advance, and the adhesive tape T2 may be attached to the upper surface of the wafer W.

(4)在上述實施例及變形例中，帶切斷機構9係採用使用切斷器41之構成，但亦可取代切斷刃，而改採用藉由雷射切斷黏著帶之構成。 (4) In the above-described embodiments and modifications, the tape cutting mechanism 9 is configured by using the cutter 41. However, instead of the cutting blade, the adhesive tape may be cut by laser.

(5)在上述實施例及變形例中，作為基板，係以半導體晶圓為例來作說明，惟該裝置可適用於LED用基板或電路基板等各種形狀及尺寸的基板。於此情況，在帶切斷工序中被切斷之黏著帶T1的形狀係可因應所適用的基板外形而改變。 (5) In the above-described embodiments and modifications, a semiconductor wafer is exemplified as a substrate, but the device can be applied to substrates of various shapes and sizes such as an LED substrate or a circuit substrate. In this case, the shape of the adhesive tape T1 cut in the tape cutting step can be changed in accordance with the shape of the substrate to which it is applied.

因此，所使用之基板支持用框架並不限定於晶圓用環狀框架f，亦可利用因應所使用的基板形狀之四角形等的框架。若為四角形框架，可將例如複數個四角形基板藉由黏著帶接著保持，可減少死空間(dead space)。其結果，可提高作業效率。 Therefore, the substrate supporting frame to be used is not limited to the annular frame f for wafers, and a frame such as a square shape in accordance with the shape of the substrate to be used may be used. In the case of a quadrangular frame, for example, a plurality of quadrangular substrates can be held by an adhesive tape to reduce dead space. As a result, work efficiency can be improved.

(6)在上述實施例中，轉印源的環狀框架f和轉印目標的新環狀框架f係採用同一形狀之構成，惟亦可組合不同形狀的框架來使用。 (6) In the above embodiment, the annular frame f of the transfer source and the new annular frame f of the transfer target are configured in the same shape, but they may be used in combination with frames of different shapes.

(7)在上述實施例及變形例中，亦可將預先切斷成環狀框架形狀之預切型(pre-cut type)黏著帶T2貼附於環狀框架f2。 (7) In the above-described embodiments and modifications, a pre-cut type adhesive tape T2 that has been previously cut into a ring-shaped frame shape may be attached to the annular frame f2.

(8)在上述實施例及變形例中，於步驟S2中，在以比晶圓W的直徑還小的晶圓保持部31保持的狀態下，一邊使切斷器41接觸晶圓的外形一邊切斷。然而，步驟S2的帶切斷工序不限於將此種黏著帶T1切下成與晶圓W相同的大小之構成。亦即，亦可如圖16(a)所示，在以比晶圓W的直徑還大的晶圓保持部31保持的狀態下，一邊使切斷器41接觸晶圓保持部31的外形，一邊切斷黏著帶T1。 (8) In the above-described embodiment and the modification, the cutter 41 is brought into contact with the outer shape of the wafer while being held by the wafer holding portion 31 having a smaller diameter than the wafer W in the step S2. Cut off. However, the tape cutting step of the step S2 is not limited to the configuration in which the adhesive tape T1 is cut into the same size as the wafer W. In other words, as shown in FIG. 16(a), the cutter 41 may be brought into contact with the outer shape of the wafer holding portion 31 while being held by the wafer holding portion 31 having a larger diameter than the wafer W. Cut the adhesive tape T1 while cutting.

在此種變形例(8)的構成中，於步驟S2，黏著帶T1係被切下成比晶圓W的直徑還寬的大小。被切下之黏著帶T1的大小，係在步驟S5的轉印工序中被調整成可確實地避免黏著帶T1與黏著帶T2的接著之程度的大小。如圖16(a)所示，在帶切斷工序後，被切下的黏著帶T1中之超出晶圓W外側之部分的長度k，係以在晶圓W的厚度G以下較佳。 In the configuration of the modification (8), in step S2, the adhesive tape T1 is cut to a size larger than the diameter of the wafer W. The size of the cut adhesive tape T1 is adjusted so as to surely avoid the adhesion of the adhesive tape T1 and the adhesive tape T2 in the transfer process of step S5. As shown in Fig. 16 (a), after the tape cutting step, the length k of the portion of the adhesive tape T1 that has been cut beyond the outer side of the wafer W is preferably equal to or less than the thickness G of the wafer W.

(9)又，就變形例(8)的其他構成而言，亦可如圖16(b)所示構成為在不使切斷器41與晶圓W的外徑及晶圓保持部31的外徑之任一者接觸的情況下，將黏著帶T1切下成比晶圓W稍微寬的大小。在此種變形例(9) 中，與變形例(8)同樣地，在帶切斷工序後，被切下成大致圓形的黏著帶T1中超出晶圓W外側之部分的長度k(被切下之黏著帶T1的半徑Tr與晶圓W的半徑Wr之差)，係以在晶圓W的厚度G以下較佳。 (9) Further, the other configuration of the modification (8) may be configured such that the outer diameter of the cutter 41 and the wafer W and the wafer holding portion 31 are not formed as shown in FIG. 16(b). When either of the outer diameters is in contact, the adhesive tape T1 is cut to a size slightly larger than the wafer W. In this modification (9) In the same manner as in the modification (8), after the tape cutting step, the length k of the portion of the adhesive tape T1 which is cut into a substantially circular shape beyond the outer side of the wafer W (the radius of the adhesive tape T1 which is cut) The difference between the Tr and the radius Wr of the wafer W is preferably equal to or less than the thickness G of the wafer W.

當長度k是在厚度G以下時，如圖16(c)所示，即便在轉印工序中黏著帶T1係以在晶圓W的端部從點線所示位置朝實線所示位置彎折的方式變形的情況，也可確實地避免黏著帶T1與黏著帶T2接觸。因此，可更確實地避免轉印工序中之黏著帶彼此的接著，所以可進一步使朝黏著帶T2轉印的精度提升。 When the length k is equal to or less than the thickness G, as shown in FIG. 16(c), the adhesive tape T1 is bent at a position indicated by a dotted line from a position indicated by a dotted line at an end portion of the wafer W in the transfer process. In the case where the folding method is deformed, it is also possible to surely prevent the adhesive tape T1 from coming into contact with the adhesive tape T2. Therefore, the adhesion of the adhesive tapes in the transfer process can be more reliably prevented, so that the accuracy of transfer to the adhesive tape T2 can be further improved.

又，在變形例(9)的構成中，晶圓保持部31的半徑D係以小於被切下之黏著帶T1的半徑Tr較佳。於此情況，切斷器41由於能夠以貫通黏著帶T1的方式切斷，所以可更適宜地切斷黏著帶T1。在本發明的各實施例及變形例中，帶切斷工序中「沿著晶圓的外形切斷黏著帶」係指，不僅是將黏著帶T1切斷成與晶圓W相同大小的情況，亦包含以轉印工序中可確實地避免黏著帶T1與黏著帶T2的接著之程度，將黏著帶T1切斷成比晶圓W的外形還寬的大小之情況。 Further, in the configuration of the modification (9), the radius D of the wafer holding portion 31 is preferably smaller than the radius Tr of the cut adhesive tape T1. In this case, since the cutter 41 can be cut so as to penetrate the adhesive tape T1, the adhesive tape T1 can be cut more suitably. In each of the embodiments and the modifications of the present invention, the "cutting of the adhesive tape along the outer shape of the wafer" in the tape cutting step means that the adhesive tape T1 is not cut to the same size as the wafer W. It is also possible to cut the adhesive tape T1 to a size larger than the outer shape of the wafer W so as to surely avoid the adhesion of the adhesive tape T1 and the adhesive tape T2 in the transfer process.

31‧‧‧晶圓保持部 31‧‧‧ Wafer Holder

41‧‧‧切斷器 41‧‧‧Cut cutter

59‧‧‧切斷器 59‧‧‧Cut cutter

f1、f2‧‧‧環狀框架 F1, f2‧‧‧ ring frame

P‧‧‧露出部 P‧‧‧Exposed Department

T1‧‧‧黏著帶 T1‧‧‧ adhesive tape

T2‧‧‧黏著帶 T2‧‧‧ adhesive tape

MF1、MF2‧‧‧安裝框架 MF1, MF2‧‧‧ installation framework

W‧‧‧半導體晶圓 W‧‧‧Semiconductor Wafer

Claims (8)

一種基板轉印方法，係將隔介支持用第1黏著帶接著保持於環狀框架內之基板轉印到第2黏著帶之基板轉印方法，其特徵為具備：保持工序，以保持構件將前述環狀框架及前述基板從前述第1黏著帶側加以保持；帶切斷工序，沿著被前述保持構件所保持的前述基板的外形，切斷前述第1黏著帶；帶回收工序，將被切下的前述第1黏著帶回收；及轉印工序，在前述帶回收工序後，從前述基板的非保持面側貼附前述第2黏著帶以進行轉印。 A substrate transfer method is a substrate transfer method in which a substrate for holding a first adhesive tape and then holding the substrate in a ring-shaped frame is transferred to a second adhesive tape, and is characterized in that: a holding step is performed to hold the member The annular frame and the substrate are held from the first adhesive tape side; the tape cutting step cuts the first adhesive tape along the outer shape of the substrate held by the holding member; and the tape collecting step is performed The first adhesive tape is removed, and the transfer process is performed by attaching the second adhesive tape to the non-retaining surface side of the substrate after the tape collection step. 如請求項1之基板轉印方法，其中在前述帶切斷工序中，係以前述第1黏著帶從前述基板的外形超出外側之部分的長度會成為前述基板的厚度以下之方式，切斷前述第1黏著帶。 The substrate transfer method according to claim 1, wherein in the tape cutting step, the length of the portion of the first adhesive tape that is outside the outer shape of the substrate is equal to or less than the thickness of the substrate, and the cutting is performed. The first adhesive tape. 如請求項1或2之基板轉印方法，其中前述保持構件係比前述基板的直徑小。 The substrate transfer method of claim 1 or 2, wherein the holding member is smaller than a diameter of the substrate. 如請求項1或2之基板轉印方法，其中在前述帶切斷工序中，使用切斷刃切斷前述第1黏著帶。 The substrate transfer method according to claim 1 or 2, wherein in the tape cutting step, the first adhesive tape is cut using a cutting blade. 如請求項1或2之基板轉印方法，其中在前述帶切斷工序中，使用雷射切斷前述第1黏著帶。 The substrate transfer method according to claim 1 or 2, wherein in the tape cutting step, the first adhesive tape is cut by using a laser. 如請求項1或2之基板轉印方法，其中 在前述帶回收工序中，將接著於前述環狀框架的狀態下之被切下的前述第1黏著帶連同前述環狀框架一起回收。 The substrate transfer method of claim 1 or 2, wherein In the belt recovery step, the first adhesive tape that has been cut in the state of the annular frame is collected together with the annular frame. 如請求項1或2之基板轉印方法，其中在前述轉印工序中，將預先貼附有前述第2黏著帶的新環狀框架與前述基板重疊，從前述基板的非保持面側貼附前述第2黏著帶以進行轉印。 The substrate transfer method according to claim 1 or 2, wherein in the transfer step, a new annular frame to which the second adhesive tape is attached in advance is superposed on the substrate, and attached from a non-retaining surface side of the substrate The second adhesive tape is used for transfer. 一種基板轉印裝置，係隔著支持用第1黏著帶將接著保持於環狀框架內的基板轉印到第2黏著帶之基板轉印裝置，其特徵為具備：基板保持部，隔介前述第1黏著帶保持前述基板；框架保持部，用於保持前述環狀框架；帶切斷部，沿著被前述基板保持部所保持的前述基板的外形，切斷前述第1黏著帶；帶回收部，將被前述帶切斷部切下的前述第1黏著帶回收；及轉印機構，將被切下的前述第1黏著帶回收後，從前述基板的非保持面側貼附前述第2黏著帶以進行轉印。 A substrate transfer device which is a substrate transfer device that transfers a substrate held in an annular frame to a second adhesive tape via a first adhesive tape for support, and is provided with a substrate holding portion that is partitioned a first adhesive tape holding the substrate; a frame holding portion for holding the annular frame; and a tape cutting portion for cutting the first adhesive tape along an outer shape of the substrate held by the substrate holding portion; The first adhesive tape that has been cut by the tape cutting portion is collected; and the transfer mechanism collects the first adhesive tape that has been cut, and attaches the second from the non-retaining surface side of the substrate Adhesive tape for transfer.
TW106106931A 2016-03-07 2017-03-03 Substrate transfer method and substrate transfer apparatus TWI707818B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016043385A JP6695173B2 (en) 2016-03-07 2016-03-07 Substrate transfer method and substrate transfer apparatus
JP2016-043385 2016-03-07

Publications (2)

Publication Number Publication Date
TW201738164A true TW201738164A (en) 2017-11-01
TWI707818B TWI707818B (en) 2020-10-21

Family

ID=59789121

Family Applications (1)

Application Number Title Priority Date Filing Date
TW106106931A TWI707818B (en) 2016-03-07 2017-03-03 Substrate transfer method and substrate transfer apparatus

Country Status (5)

Country Link
JP (1) JP6695173B2 (en)
KR (1) KR20180123018A (en)
CN (1) CN108713247B (en)
TW (1) TWI707818B (en)
WO (1) WO2017154304A1 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11609336B1 (en) 2018-08-21 2023-03-21 Innovusion, Inc. Refraction compensation for use in LiDAR systems
JP7458245B2 (en) 2020-06-05 2024-03-29 リンテック株式会社 Transfer device and transfer method
JP2023037700A (en) 2021-09-06 2023-03-16 株式会社ディスコ Wafer transfer method
JP2023038724A (en) 2021-09-07 2023-03-17 株式会社ディスコ Wafer transfer method
JP2023120503A (en) 2022-02-18 2023-08-30 株式会社ディスコ Wafer transfer method, and wafer transfer device

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005045023A (en) * 2003-07-22 2005-02-17 Toshiba Corp Manufacturing method of semiconductor device and manufacturing device for semiconductor
JP4505789B2 (en) * 2004-02-10 2010-07-21 株式会社東京精密 Chip manufacturing method
JP4324788B2 (en) * 2004-05-19 2009-09-02 株式会社東京精密 Wafer mounter
JP2012216606A (en) * 2011-03-31 2012-11-08 Nitto Denko Corp Substrate transfer method and substrate transfer device
US8450188B1 (en) * 2011-08-02 2013-05-28 Micro Processing Technology, Inc. Method of removing back metal from an etched semiconductor scribe street
JP6476027B2 (en) * 2015-03-20 2019-02-27 リンテック株式会社 Sheet peeling apparatus, peeling method, and sheet transfer apparatus
JP6473359B2 (en) * 2015-03-20 2019-02-20 リンテック株式会社 Sheet peeling device

Also Published As

Publication number Publication date
JP6695173B2 (en) 2020-05-20
CN108713247B (en) 2023-07-07
TWI707818B (en) 2020-10-21
KR20180123018A (en) 2018-11-14
JP2017162870A (en) 2017-09-14
WO2017154304A1 (en) 2017-09-14
CN108713247A (en) 2018-10-26

Similar Documents

Publication Publication Date Title
TW201738164A (en) Substrate transfer method and substrate transfer apparatus
JP4401322B2 (en) Support plate separation apparatus and support plate separation method using the same
JP4698517B2 (en) Protective tape peeling method and apparatus using the same
JP5431053B2 (en) Adhesive tape application method and adhesive tape application device
JP4326519B2 (en) Protective tape peeling method and apparatus using the same
KR100868142B1 (en) Protective tape applying method and apparatus, and protective tape separating method
JP4851415B2 (en) Ultraviolet irradiation method and apparatus using the same
JP2005175384A (en) Sticking method and peeling method of masking tape
JP4953738B2 (en) Adhesive tape cutting method and adhesive tape attaching apparatus using the same
KR19990028523A (en) Method for peeling protective adhesive tape of semiconductor wafer and its device
JP2009070837A (en) Protective tape separation method, and protective tape separation apparatus
JP2010278065A (en) Method and device for mounting of wafer
JP2012216606A (en) Substrate transfer method and substrate transfer device
JP2005317711A (en) Peeling device and peeling method
JP2001085360A (en) Pasting method for electronic part and formation method for ditching on adhesive tape
KR101497639B1 (en) Apparatus and method for attaching sheet
CN110892519A (en) Transport apparatus, substrate processing system, transport method, and substrate processing method
JP7154860B2 (en) Wafer processing method
JP2000331963A (en) Method and device for mounting wafer to wafer frame and facing device incorporating mounting device
TW201133921A (en) Fabrication method of optical components
JP6749118B2 (en) Substrate transfer method and substrate transfer apparatus
JP5784298B2 (en) Processing method and processing apparatus
JP2007088038A (en) Re-sticking device and method therefor
JP2011086755A (en) Sheet peeling device and peeling method