JP2023003940A - Tape for processing electronic device and manufacturing method of tape for processing electronic device - Google Patents

Abstract

To provide a tape for processing an electronic device and a manufacturing method of a tape for processing the electronic device.SOLUTION: A tape for processing an electronic device comprises: a release film; and a base tape 13 formed with adhesive layers 12 on a main surface of a base film. The base tape comprises:label portions 21 having a predetermined planar view shape; waste release portions where a waste portion 31 that surrounds a planar view outside 22 of the label portion and has an interval portion 32 forming a predetermined interval is peeled; and a periphery portion 41 in contact with outer edges 34 of the waste release portions in a plan view. A cut line forming an outer edge of the waste portion and a cut line forming an outer edge of the waste portion extended from behind in a transfer direction D do not intersect, in the interval portion of the waste portion, a terminal of the cut line extended from one direction is located in a position on a periphery portion side of a terminal of the cut line extended from the other direction, or the terminal of the cut line extended from the other direction and the terminal of the cut line extended from the other direction are positioned in parallel to a transfer direction.SELECTED DRAWING: Figure 2

Description

TECHNICAL FIELD The present invention relates to an electronic device processing tape, and more particularly to an electronic device processing tape used for dicing and picking up semiconductor wafers and a method for producing the electronic device processing tape.

As a tape for processing semiconductor wafers, a dicing tape in which a plurality of label portions having a predetermined planar view shape are formed at predetermined intervals on a long base tape, or an electronic device processing tape equipped with a die bonding film. is used. A pressure-sensitive adhesive layer is provided at a portion corresponding to the label portion of the base tape. By bonding the semiconductor wafer to the label portion provided with the adhesive layer, the semiconductor wafer is positioned on the label portion. The positioned semiconductor wafer is diced while attached to the label portion, thereby manufacturing semiconductor chips. The manufactured semiconductor chip is picked up from the label portion by reducing the adhesive strength of the adhesive layer by curing treatment with ultraviolet rays or the like.

As a semiconductor wafer processing tape in which a plurality of label portions are formed at predetermined intervals on a base tape, for example, in Patent Document 1, a predetermined precut process is performed on a semiconductor wafer processing tape, and the label portions are formed at predetermined intervals. A tape for processing semiconductor wafers is disclosed in which unnecessary portions between arranged label portions are removed by peeling along cut lines of pre-cut processing.

In this way, the base tape is formed by pre-cutting the label portion to which the semiconductor wafer is attached, the waste portion which is an unnecessary portion surrounding the outer side of the label portion in plan view, and the outer edge of the waste portion in plan view. It is divided into a perimeter and a Pre-cutting is performed on the base film and the pressure-sensitive adhesive layer provided on the surface of the base film using a rotary punching blade arranged opposite to the base tape (Patent Document 2).

In addition, before the semiconductor wafer is diced, the scrap portion of the base tape is wound in advance along the longitudinal direction of the base tape (conveyance direction of the base tape) by a winding means. It is torn off from the electronic device processing tape. Therefore, the electronic device processing tape is set in a semiconductor wafer bonding machine in a state in which the scrap portion of the base tape is removed from the electronic device processing tape.

The material and thickness of the base tape are optimized from the viewpoint of electronic device processing steps such as expandability and pick-up property. Therefore, the following problems may occur when removing the residue of the base tape from the electronic device processing tape.

For example, when the base tape is thin, the tear strength of the base tape decreases. When the tear strength of the base tape decreases, the tension applied to the waste portion of the base tape when the base tape is peeled off from the electronic device processing tape causes the waste portion, particularly between the label portions formed at predetermined intervals. There is a problem that a large tear portion occurs in the scrap portion, and depending on the case, the scrap portion is divided between the label portions, so that the scrap portion cannot be smoothly peeled off from the electronic device processing tape. In addition, when the tear strength of the base tape decreases, when the scrap portion of the base tape is torn off from the electronic device processing tape, it deviates from the pre-cut cut line and a tear portion occurs in the scrap portion, resulting in a tear between the label portions. There was a case where a residue part remained. In addition, depending on the usage conditions of the electronic device processing tape, a material that does not have tear strength sufficient to withstand the tension applied to the scrap portion when the scrap portion is torn off may be used as the material of the base tape. be. Even if the material of the base tape does not have sufficient tear strength, the tension applied to the scrap portion of the base tape when the scrap portion of the base tape is peeled off from the electronic device processing tape causes the scrap portion, particularly the predetermined interval. In some cases, the residue between the label portions formed by the above is torn, and in some cases, the residue is divided between the label portions, making it impossible to peel off the residue smoothly from the electronic device processing tape. . In addition, if the material of the base tape does not have sufficient tear strength, when the waste portion of the base tape is torn off from the electronic device processing tape, it deviates from the pre-cut cut line and a tear occurs in the waste portion. As a result, a waste portion may remain between the label portions.

JP 2011-111530 A JP 2014-017357 A

In view of the above circumstances, the present invention prevents the occurrence of a large tear portion in the waste portion even if the base tape is thinned or the tear strength is reduced depending on the material of the base tape, and the precut cut. An electronic device processing tape and an electronic device which are prevented from being left in the scrap stripped portion by smoothly peeling off the scrap portion by preventing the tear portion from being deviated from the line and generating the tear portion in the scrap portion. An object of the present invention is to provide a method for manufacturing a device processing tape.

The gist and configuration of the present invention are as follows.
[1] a release film;
A base tape having an adhesive layer formed on the main surface of a base film, the tape for electronic device processing comprising the base tape laminated with the release film,
The base tape includes label portions having a predetermined plan view shape formed at predetermined intervals in the conveying direction of the electronic device processing tape, and surrounding the outer side of the label portion in a plan view, and the predetermined The scum portion having a space portion forming a space includes a scum stripped portion and a peripheral portion in contact with the outer edge of the scum stripped portion in a plan view,
a cut line forming an outer edge of the scrap portion extending from the front in the conveying direction and a cut line forming an outer edge of the scrap portion extending from the rear in the conveying direction do not intersect;
In the interval portion of the scrap portion, the end of the cut line extending from one direction is at the same position or the periphery as the end of the cut line extending from the other direction in the direction orthogonal to the conveying direction. Electronic device processing tape located in the direction of the part.
[2] At least one of the cut line extending from one direction and the cut line extending from the other direction is parallel to the conveying direction from the end of the base tape at the interval portion of the scrap portion. The electronic device processing tape according to [1], which has a turn portion extending in the center line direction of the.
[3] The electronic device processing tape according to [2], wherein the turn portion has a curved portion in plan view.
[4] The electronic device processing tape according to [3], wherein the curved portion of the turn portion in plan view has an arc-shaped curved portion with a curvature radius of R1.0 mm or more.
[5] The electronic device processing tape according to [2], wherein the turn portion has a straight portion in a plan view.
[6] A distance between an end of the cut line extending from one direction and an end of the cut line extending from the other direction in a direction parallel to the conveying direction is 0.1 mm or more and 10 mm or less [1] The electronic device processing tape according to any one of [5].
[7] An imaginary line parallel to the conveying direction passing through the terminal end of the cut line extending from one direction and the cut line extending from one direction form an angle θ at the tip of the cut line extending from the one direction at an angle θ of 10° or more and 150° or less. The electronic device processing tape according to any one of [1] to [6].
[8] The end of the cut line extending from one direction is located in the peripheral direction from the end of the cut line extending from the other direction, and extends from the one direction in the direction perpendicular to the conveying direction. The tape for processing an electronic device according to any one of [1] to [7], wherein the distance between the end of the cut line extending from the other direction and the end of the cut line extending from the other direction is 0.1 mm or more and 10 mm or less. .
[9] further comprising an adhesive layer provided on part of the main surface of the release film,
The electronic device processing tape according to any one of [1] to [8], wherein the base tape covers the adhesive layer and is in contact with the release film around the adhesive layer.
[10] A step of applying an adhesive layer on a base film to prepare a base tape;
A step of superimposing the base tape on a release film;
label portions having a predetermined shape in plan view formed on the base tape at predetermined intervals in the conveying direction of the base tape; A cut line that forms a division between a waste portion having a space portion to be formed and a peripheral portion that is in contact with the outer edge of the waste portion in a plan view, and that forms the outer edge of the waste portion extending from the front in the conveying direction. and the cut line forming the outer edge of the scrap portion extending from the rear in the conveying direction do not intersect, and the end of the cut line extending from one direction extends from the other direction at the interval portion of the scrap portion. or the end of the cut line extending from one direction and the end of the cut line extending from the other direction are located parallel to the conveying direction. A step of performing pre-cutting using a rotary punching blade;
a step of performing a scrap removing process on the scrap portion to form a scrap peeling portion on the base tape;
A method for producing an electronic device processing tape having

According to the aspect of the electronic device processing tape of the present invention, the end of the cut line extending from one direction is located at the interval portion of the scrap portion with respect to the end of the cut line extending from the other direction. In the direction perpendicular to the tape transport direction, by being positioned in the same position or in the direction of the peripheral part in contact with the outer edge of the scrap part that becomes the scrap peeling part, when the scrap part of the base tape is peeled off, Tearing between the end of the cut line extending from one direction and the end of the cut line extending from the other direction is smoothed. Therefore, during scrap removal processing, the outer edges of the label portions are reliably connected, and tearing from the outer edges of the scrap portions to the center line direction of the base tape is prevented. It is possible to prevent the tear part from occurring in the part. By preventing the occurrence of tearing in the direction of the center line from the outer edge of the scrap portion, and also preventing the occurrence of tearing in the scrap portion outside the cut line, the thickness of the base tape can be reduced. Even if a material whose tensile strength is lowered is used for the material tape, the scrap can be smoothly peeled off, so that the scrap can be prevented from being left in the scrap removed portion of the electronic device processing tape. be.

According to the aspect of the tape for electronic device processing of the present invention, at least one of the cut line extending from one direction and the cut line extending from the other direction extends from the terminal end of the cut line at the interval between the scrap portions for electronic device processing. By having a turn portion extending in the center line direction of the base tape parallel to the conveying direction of the tape, tearing between the cut line extending from one direction and the cut line extending from the other direction becomes more reliable, It is possible to more reliably and smoothly peel off the residue.

According to the aspect of the electronic device processing tape of the present invention, the end of the cut line extending from one direction and the end of the cut line extending from the other direction in the direction parallel to the conveying direction of the electronic device processing tape When the distance is 0.1 mm or more and 10 mm or less, it is possible to more reliably prevent the occurrence of a tear portion from the outer edge of the scrap portion to the center line direction of the base tape, and to prevent the cut line extending from one direction and the other. Since tearing between the cut lines extending from the direction can be ensured, it is possible to more reliably and smoothly tear off the waste portion.

According to the aspect of the electronic device processing tape of the present invention, at the tip of the imaginary line parallel to the conveying direction passing through the terminal end of the cut line extending from one direction and the cut line extending from one direction Since the angle θ is 10° or more and 150° or less, the scrap portion is torn from the tip of the cut line extending from the other direction, and the scrap portion is reliably torn by the cut line extending from the one direction. When the tip of the cut line extending from the other direction reaches near the tip of the cut line extending from one direction, a large tension acts on the base film and tears at a position that deviates from the assumed tearing position. It is possible to prevent the tip portion of the scrap portion from being left behind due to the generation of the scrap portion, so that the scrap portion can be peeled off more reliably and smoothly.

According to the aspect of the electronic device processing tape of the present invention, the end of the cut line extending from one direction and the end of the cut line extending from the other direction in the direction perpendicular to the conveying direction of the electronic device processing tape When the distance is 0.1 mm or more and 10 mm or less, tearing between the cut line extending from one direction and the cut line extending from the other direction becomes more reliable, and the peeling of the waste part is more reliably and smoothly performed. can be done.

FIG. 2 is a cross-sectional view showing an overview of the laminated structure of the electronic device processing tape according to the first embodiment of the present invention before scrap removal processing; FIG. 2 is an explanatory diagram showing an outline of a planar view of the electronic device processing tape before the scrap removing process according to the first embodiment of the present invention; FIG. 2 is an enlarged view showing an outline of a planar view of the electronic device processing tape before scrap removal processing according to the first embodiment of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is an explanatory view showing an outline of a rotary punching blade that pre-cuts the electronic device processing tape according to the first embodiment of the present invention; FIG. 2 is an enlarged view showing an outline of a planar view of the electronic device processing tape before scrap removal processing according to the first embodiment of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is an explanatory diagram of an example of how to use the electronic device processing tape according to the first embodiment of the present invention; FIG. 10 is a cross-sectional view showing an overview of the laminated structure of the electronic device processing tape before scrap removal processing according to another embodiment of the present invention.

First, the electronic device processing tape according to the first embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a cross-sectional view showing an overview of the laminated structure of the tape for processing electronic devices according to the first embodiment of the present invention before scrap removal processing. FIG. 2 is an explanatory diagram showing an outline of a plan view of the electronic device processing tape before scrap removal processing according to the first embodiment of the present invention. FIG. 3 is an enlarged view showing an outline of a planar view of the electronic device processing tape before scrap removal processing according to the first embodiment of the present invention.

As shown in FIG. 1, the electronic device processing tape 1 according to the first embodiment of the present invention includes a release film 11, an adhesive layer 12 provided on a part of the main surface 61 of the release film 11, It is a laminate in which the base tape 13 covering the adhesive layer 12 and in contact with the release film 11 around the adhesive layer 12 is laminated. The base tape 13 is a laminated structure in which the pressure-sensitive adhesive layer 15 is formed on the main surface 71 of the base film 14, as will be described later.

The shape of the release film 11 is a long rectangular shape, and the length in the longitudinal direction is formed to be sufficiently longer than the length in the direction (width direction) perpendicular to the longitudinal direction. . The release film 11 functions as a support during manufacture and use of the electronic device processing tape 1 . When bonding the semiconductor wafer to the electronic device processing tape 1, the release film 11 is peeled off from the electronic device processing tape 1. FIG. A semiconductor wafer is bonded to the adhesive layer 12 exposed by peeling off the peeling film 11 .

Examples of materials for the release film 11 include polyesters such as polyethylene terephthalate (PET), polybutylene terephthalate (PBT), and polyethylene naphthalate (PEN), and polyolefins such as polyethylene (PE) and polypropylene (PP). be able to. The thickness of the release film 11 is not particularly limited, and can be appropriately selected depending on the usage conditions of the tape 1 for processing electronic devices. In addition, the dimension of the release film 11 in the width direction is not particularly limited, and can be appropriately selected depending on the usage conditions of the electronic device processing tape 1 such as the size of the semiconductor wafer. .

The adhesive layer 12 is provided in a partial region of the main surface 61 of the release film 11, and has a shape in plan view corresponding to the shape in plan view of the semiconductor wafer to be bonded to the adhesive layer 12 and diced. have. In this specification, “planar view” means a state viewed from a position facing main surface 61 of release film 11 and main surface 71 of base film 14 .

Also, the adhesive layer 12 is arranged between the release film 11 and the base tape 13 . The adhesive layer 12 is in contact with the adhesive layer 15 of the base tape 13, and is peeled off from the adhesive layer 15 while adhering to the semiconductor chip when the semiconductor chip is picked up.

Examples of materials for the adhesive layer 12 include epoxy resins, (meth)acrylic resins, phenol resins, polyurethane resins, polyester resins, polyimide resins, and silicone resins. The thickness of the adhesive layer 12 is not particularly limited, and can be appropriately selected depending on the usage conditions of the tape 1 for electronic device processing.

The base tape 13 is a laminated structure of the base film 14 and the pressure-sensitive adhesive layer 15, in which the pressure-sensitive adhesive layer 15 is formed over the entire main surface 71 of the base film 14, and covers the entire adhesive layer 12. , the adhesive layer 12 can come into contact with the release film 11 over the entire area around the adhesive layer 12 . Like the release film 11, the base tape 13 has a long rectangular shape, and the length in the longitudinal direction is sufficiently longer than the length in the direction perpendicular to the longitudinal direction (the width direction). formed. The base tape 13 functions as a fixing means when dicing the semiconductor wafer.

Materials for the base film 14 include, for example, polyethylene, polypropylene, ethylene-propylene copolymer, polybutene-1, poly-4-methylpentene-1, ethylene-vinyl acetate copolymer, ethylene-(meth)acrylic acid. α-olefin homopolymers or copolymers such as ethyl copolymers, ethylene-methyl (meth)acrylate copolymers, ethylene-(meth)acrylic acid copolymers, ionomers, or mixtures thereof, polyethylene terephthalate , polyesters such as polymethyl (meth)acrylate, polycarbonates, polyurethanes, styrene-ethylene-butene or pentene copolymers, and thermoplastic elastomers such as polyamide-polyol copolymers.

The thickness of the base film 14 is not particularly limited, and can be appropriately selected depending on the usage conditions of the tape 1 for processing electronic devices. The dimension in the width direction of the base film 14 is not particularly limited, and can be appropriately selected depending on the usage conditions of the electronic device processing tape 1 such as the size of the semiconductor wafer. The same dimensions as dimensions can be mentioned. A specific example of the dimension of the base film 14 in the width direction is 20 cm to 70 cm.

Examples of materials for the adhesive layer 15 include polypropylene resin, (meth)acrylic resin, polyester resin, polyurethane resin, epoxy resin, and the like. Alternatively, an ultraviolet curable compound may be added to the adhesive layer 15 so that the adhesive layer 15 can be easily peeled off from the adhesive layer 12 by curing the adhesive layer 15 with ultraviolet irradiation. Addition of the UV curable compound improves the pickability of the semiconductor chip.

As the UV-curable compound, for example, a compound having at least two or more photopolymerizable carbon-carbon double bonds in the molecule, which can be three-dimensionally networked by UV irradiation, is used. Specific examples of UV-curable compounds include trimethylolpropane tri(meth)acrylate, pentaerythritol tri(meth)acrylate, pentaerythritol tetra(meth)acrylate, dipentaerythritol monohydroxypenta(meth)acrylate, dipentaerythritol hexa (Meth) acrylate, 1,4-butylene glycol di (meth) acrylate, 1,6 hexanediol di (meth) acrylate, polyethylene glycol di (meth) acrylate, bifunctional or higher such as oligoester (meth) acrylate ( Meth)acrylate monomers may be mentioned.

Specific examples of the UV-curable compound include urethane (meth)acrylate oligomers in addition to the (meth)acrylate monomers. Urethane (meth)acrylate oligomers are polyol compounds such as polyester or polyether types and polyfunctional isocyanate compounds (e.g., 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate, 1,3- xylylene diisocyanate, 1,4-xylylene diisocyanate, diphenylmethane 4,4-diisocyanate, etc.), and a urethane prepolymer having an isocyanate group at its end, which has a hydroxyl group (meth) It can be obtained by reacting an acrylate compound (eg, 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, polyethylene glycol (meth)acrylate, etc.).

Moreover, when blending an ultraviolet curable compound, a photopolymerization initiator may be blended, if necessary, in order to facilitate curing of the ultraviolet curable compound. Specific examples of photopolymerization initiators include isopropylbenzoin ether, isobutylbenzoin ether, benzophenone, Michler's ketone, chlorothioxanthone, dodecylthioxanthone, dimethylthioxanthone, diethylthioxanthone, benzyl dimethyl ketal, α-hydroxycyclohexylphenyl ketone, 2 -hydroxymethylphenylpropane and the like.

As shown in FIG. 2, the base tape 13 of the electronic device processing tape 1 has a label portion 21 to which the semiconductor wafer is attached and a label portion 21 in plan view before the scrap portion 31 is peeled off. and a peripheral portion 41 that is in contact with the outer edge 34 of the scrap portion 31 in plan view and is positioned at the edge in the width direction of the base tape 13. It is The electronic device processing according to the first embodiment of the present invention is performed by subjecting the base tape 13 to a scrap removing process in which the scrap portion 31 is peeled off, and using the area that was the scrap portion 31 as the scrap peeling portion. A tape 1 is formed. In the electronic device processing tape 1, the peripheral portion 41 is in contact with the outer edge of the scum removed portion in plan view. In addition, in the drawings for explaining the electronic device processing tape 1 according to the first embodiment of the present invention, for convenience of explanation, the scrap portion 31 is left without being peeled off. A portion of the base tape 13 that overlaps the adhesive layer 12 in plan view and, if necessary, the vicinity of the overlapping portion correspond to the label portion 21 . Therefore, the label portion 21 has a structure in which the release film 11, the adhesive layer 12, the adhesive layer 15, and the base film 14 are laminated in the above order. On the other hand, the adhesive layer 12 is not provided on the scrap portion 31 and the peripheral portion 41 . Therefore, the residue portion 31 and the peripheral portion 41 have a structure in which the release film 11, the adhesive layer 15, and the base film 14 are laminated in the above order.

In FIG. 2, the electronic device processing tape 1 before the scrap portion 31 is peeled off is in the form of being wound into a roll body.

A plurality of label portions 21 are formed at predetermined intervals in the conveying direction D of the electronic device processing tape 1 . The shape and area of the label portion 21 in plan view are not particularly limited, and, for example, the shape and area substantially correspond to the shape and area of a semiconductor wafer to be bonded and diced in plan view. In the electronic device processing tape 1, the shape of the label portion 21 in plan view is circular.

The scrap portion 31 has an outer peripheral portion 33 that surrounds the outer edge 22 of each label portion 21 in plan view, and a spacing portion 32 that forms a predetermined interval between adjacent label portions 21 . An outer edge 34 of the outer peripheral portion 33 is a portion extending along the outer edge 22 of the label portion 21 in plan view. Further, the outer peripheral portion 33 and the interval portion 32 are formed continuously. From the above, the outer peripheral portion 33 surrounding the planar view outer edge 22 of each label portion 21 surrounds the planar view outer edge 22 of the other label portion 21-2 adjacent to the predetermined label portion 21-1 via the spacing portion 32. It is continuous with the outer peripheral portion 33 .

As shown in FIG. 3, the spacing portion 32 of the scrap portion 31 extends from the outer peripheral portion 33 surrounding the predetermined label portion 21-1 toward the other label portion 21-2 adjacent to the predetermined label portion 21-1. and an outer edge 34 surrounding another label portion 21-2 adjacent to the predetermined label portion 21-1 (hereinafter sometimes simply referred to as "another label portion 21-2"). The width direction is partitioned by an outer edge 34 extending in the direction of the label portion 21-1. A tip 63 of the outer edge 34 extending in the direction of the predetermined label portion 21-1 from the outer peripheral portion 33 surrounding the other label portion 21-2 reaches the outer edge 34 of the outer peripheral portion 33 surrounding the predetermined label portion 21-1. Absent. That is, the terminal end of the outer edge 34 extending in the direction of the predetermined label portion 21-1 from the outer peripheral portion 33 surrounding the other label portion 21-2 extends to the outer edge 34 of the outer peripheral portion 33 surrounding the predetermined label portion 21-1. not. Further, the tip 53 of the outer edge 34 extending from the outer peripheral portion 33 surrounding the predetermined label portion 21-1 toward the other label portion 21-2 does not reach the outer edge 34 of the outer peripheral portion 33 surrounding the other label portion 21-2. not reached. That is, the end of the outer edge 34 extending from the outer peripheral portion 33 surrounding the predetermined label portion 21-1 toward the other label portion 21-2 extends to the outer edge 34 of the outer peripheral portion 33 surrounding the other label portion 21-2. not.

Further, the outer edge 34 of the outer peripheral portion 33 of the scrap portion 31 surrounding the predetermined label portion 21-1 and the outer edge 34 of the outer peripheral portion 33 of the scrap portion 31 surrounding the other label portion 21-2 do not intersect. That is, the outer edge 34 of the outer peripheral portion 33 of the scrap portion 31 extending from the front in the conveying direction D of the electronic device processing tape 1 and the outer edge 34 of the outer peripheral portion 33 of the scrap portion 31 extending from the rear in the conveying direction D intersect. Absent.

Further, as shown in FIG. 3, at the spacing portion 32 of the scrap portion 31, the tip 53 of the outer edge 34 extending from the outer peripheral portion 33 surrounding the predetermined label portion 21-1 toward the other label portion 21-2 is It is located in the direction of the peripheral portion 41 from the tip 63 of the outer edge 34 extending in the direction of the predetermined label portion 21-1 from the outer peripheral portion 33 surrounding the other label portion 21-2. That is, the terminal end of the outer edge 34 extending from the outer peripheral portion 33 surrounding the predetermined label portion 21-1 toward the other label portion 21-2 (that is, extending from one direction) surrounds the other label portion 21-2. With respect to the end of the outer edge 34 extending from the outer peripheral portion 33 in the predetermined label portion 21-1 direction (that is, extending from the other direction), the peripheral portion 41 direction. As described above, the tip 53 is located outside the tip 63 in the width direction of the base tape 13 .

In FIG. 3, in order to form the electronic device processing tape 1, the scrap removing process in which the scrap portion 31 is peeled off from the base tape 13 is performed by removing the outer edge 34 of the outer peripheral portion 33 surrounding the other label portion 21-2. from the tip 63 of the label portion 21-1 toward the tip 53 of the outer edge 34 of the outer peripheral portion 33 surrounding the predetermined label portion 21-1.

At the spacing portion 32 of the waste portion 31, the outer edge 34 extending from the outer peripheral portion 33 surrounding the predetermined label portion 21-1 toward the other label portion 21-2 extends in the conveying direction D from the tip 53, which is the terminal end. It has a turn portion 50 extending in the center line C direction of the parallel base tape 13 . The turn portion 50 of the outer edge 34 is a portion extending in a direction different from that of the outer edge 34 surrounding the predetermined label portion 21-1. The turn portion 50 is formed in the interval portion 32 of the scrap portion 31 . The turn portion 50 of the outer edge 34 extends from the tip 53 of the outer edge 34 in the predetermined label portion 21 - 1 direction and the center line C direction of the base tape 13 . As will be described later, the outer edge 34 extending from the outer peripheral portion 33 surrounding the predetermined label portion 21-1 including the turn portion 50 toward the other label portion 21-2 is formed through the base tape 13. It is a cut line for pre-cut processing, and the cut line for pre-cut processing may not be formed on the release film 11 and the adhesive layer 12 .

An outer edge 34 extending from an outer peripheral portion 33 surrounding a predetermined label portion 21-1 including the turn portion 50 in the direction of the other label portion 21-2 has a base parallel to the conveying direction D of the electronic device processing tape 1. It is formed only at a portion outside the center line C of the material tape 13 . That is, the outer edge 34 extending from the outer peripheral portion 33 surrounding the predetermined label portion 21-1 including the turn portion 50 toward the other label portion 21-2 is the center of the base tape 13 parallel to the conveying direction D. There is no distraction across line C. Also, two turn portions 50 are formed for each space portion 32, and are arranged substantially symmetrically with respect to the center line C in the present embodiment. The arrangement of the turn portions 50 does not have to be symmetrical with respect to the center line C as a boundary.

A plan view shape of the turn portion 50 is a shape having a curved portion 51 . Also, the curved portion 51 of the turn portion 50 has an outward portion 52 extending from a base point 56 of the curved portion 51 (a portion closest to the center line C) toward the peripheral portion 41 . The outward portion 52 of the curved portion 51 extends from the center line C toward the outside in the width direction of the base tape 13 at the interval portion 32, that is, from the center line C of the base tape 13 in a direction orthogonal to the conveying direction D. It is the part that extends toward the edge of the

Further, at the spacing portion 32 of the waste portion 31, the outer edge 34 extending from the outer peripheral portion 33 surrounding the other label portion 21-2 toward the predetermined label portion 21-1 extends in the conveying direction D from the tip 63, which is the terminal end. It has a turn portion 60 extending in the direction of the center line C of the base tape 13 parallel to it. The turn portion 60 of the outer edge 34 is a portion extending in a direction different from that of the outer edge 34 surrounding the other label portion 21-2. The turn portion 60 is formed in the interval portion 32 of the scrap portion 31 . The turn portion 60 of the outer edge 34 extends from the tip 63 of the outer edge 34 in the direction of the other label portion 21-2 and in the direction of the center line C of the base tape 13. As shown in FIG. As will be described later, the outer edge 34 extending from the outer peripheral portion 33 surrounding the other label portion 21-2 including the turn portion 60 toward the predetermined label portion 21-1 is formed through the base tape 13. It is a cut line for pre-cut processing, and the cut line for pre-cut processing may not be formed on the release film 11 and the adhesive layer 12 .

The outer edge 34 extending in the direction of the predetermined label portion 21-1 from the outer peripheral portion 33 surrounding the other label portion 21-2 including the turn portion 60 has a base parallel to the conveying direction D of the electronic device processing tape 1. It is formed only at a portion outside the center line C of the material tape 13 . That is, the outer edge 34 extending in the direction of the predetermined label portion 21-1 from the outer peripheral portion 33 surrounding the other label portion 21-2 including the turn portion 60 is the center of the base tape 13 parallel to the conveying direction D. There is no distraction across line C. Two turn portions 60 are formed for each space portion 32, and are arranged substantially symmetrically with respect to the center line C as a boundary. The arrangement of the turn portions 60 does not have to be symmetrical with respect to the center line C as a boundary.

The planar view shape of the turn portion 60 is a shape having a curved portion 61 . Further, the curved portion 61 of the turn portion 60 has an outward portion 62 extending from a base point (portion closest to the center line C) 66 of the curved portion 61 toward the peripheral portion 41 . The outward portion 62 of the curved portion 61 extends from the center line C of the base tape 13 toward the outside in the width direction of the base tape 13 at the interval portion 32, that is, from the center line C of the base tape 13 in a direction orthogonal to the conveying direction D. It is the part that extends toward the edge of the

A tip 63 of the outer edge 34 extending in the direction of the predetermined label portion 21-1 from the outer peripheral portion 33 surrounding the other label portion 21-2 does not reach the outer edge 34 of the outer peripheral portion 33 surrounding the predetermined label portion 21-1. The tip 53 of the outer edge 34 extending from the outer peripheral portion 33 surrounding the predetermined label portion 21-1 toward the other label portion 21-2 is at the outer edge 34 of the outer peripheral portion 33 surrounding the other label portion 21-2. is not reached, the tensile strength and the breaking strength of the interval portion 32 of the scrap portion 31 are improved. At the spacing portion 32 of the scrap portion 31, the tip 53 of the outer edge 34 extending from the outer peripheral portion 33 surrounding the predetermined label portion 21-1 toward the other label portion 21-2 surrounds the other label portion 21-2. It is positioned closer to the peripheral portion 41 than the tip 63 of the outer edge 34 extending from the outer peripheral portion 33 toward the predetermined label portion 21-1. Since a tensile force acts on the base tape 13 in the longitudinal direction during the scrap removal process, tension acts in the direction parallel to the scrap removal direction and in the direction toward the center line C near the outer edge 34 of the base tape 13. do. Therefore, when the scrap-lifting position reaches the tip 63, the tearing of the base tape 13 progresses in a direction parallel to the scrap-lifting direction or slightly toward the center line C. Since the tip 53 is located farther from the center line C than the tip 63 and the outward portion 52 is located closer to the center line C than the tip 63, the tear progressing from the tip 63 is prevented. It reliably reaches the outer edge 34 of the outer peripheral portion 33 surrounding the predetermined label portion 21-1. This facilitates tearing from tip 63 to tip 53 . On the other hand, if the tip 53 is positioned closer to the center line C than the tip 63, the tear developed from the tip 63 cannot reach the outer edge 34 of the outer peripheral portion 33 surrounding the predetermined label portion 21-1. A case arises and hinders tearing from tip 63 to tip 53 . Therefore, the outer edges 34 between the label portions 21 are reliably connected during the scrap removing process, and tearing from the outer edges 34 of the scrap portions 31 in the direction of the center line C of the base tape 13 is prevented. It is possible to prevent the generation of a tearing portion in the waste portion 31 by deviating from the outer edge 34.例文帳に追加The occurrence of tearing in the direction of the center line C from the outer edge 34 of the scrap portion 31 is prevented, and the occurrence of a tear portion in the scrap portion 31 away from the outer edge 34 is prevented, so that the base tape 13 is thin. Even if the base tape 13 is made of a material whose tensile strength is lowered, the scrap portion 31 can be smoothly peeled off. is prevented from being left behind.

Further, the outer edge 34 extending from the outer peripheral portion 33 surrounding the predetermined label portion 21-1 toward the other label portion 21-2 has a turn portion 50. As shown in FIG. By having the turn portion 50 , it is possible to form the outward portion 52 while forming the outer edge 34 in a shape along the label portion 21 . Therefore, regardless of the shape of the label portions 21, the outer edges 34 between the label portions 34 can be reliably connected.

A curved portion 51 of the turn portion 50 is an arc-shaped curved portion in plan view. That is, the outward portion 52 extending from the base point 56 of the curved portion 51 toward the peripheral portion 41 is an arc-shaped curved portion in plan view. The radius of curvature of the arc-shaped curved portion in plan view is not particularly limited, but the lower limit is set so that tearing from the outer edge 34 in the direction of the center line C of the base tape 13 in the interval portion 32 of the scrap portion 31 is more likely to occur. R1.0 mm is preferable, and R2.0 mm is particularly preferable, from the point of reliably preventing it. On the other hand, the upper limit of the curvature radius of the curved portion 51 can be appropriately selected according to the dimensions of the tape 1 for processing electronic devices. preferable.

A curved portion 61 of the turn portion 60 is an arc-shaped curved portion in plan view. That is, the outward portion 62 extending from the base point 66 of the curved portion 61 toward the peripheral portion 41 is a curved portion having an arc shape in plan view. The radius of curvature of the arc-shaped curved portion in plan view is not particularly limited, but the lower limit is set so that tearing from the outer edge 34 in the direction of the center line C of the base tape 13 in the interval portion 32 of the scrap portion 31 is more likely to occur. R1.0 mm is preferable, and R2.0 mm is particularly preferable, from the point of reliably preventing it. On the other hand, the upper limit of the radius of curvature of the curved portion 61 can be appropriately selected according to the dimensions of the tape 1 for processing electronic devices. preferable.

The leading edge 53 of the outer edge 34 extending from the outer peripheral portion 33 surrounding the predetermined label portion 21-1 toward the other label portion 21-2 and the outer periphery surrounding the other label portion 21-2 in the direction parallel to the conveying direction D The distance L1 from the portion 33 to the tip 63 of the outer edge 34 extending in the direction of the predetermined label portion 21-1 is not particularly limited, but the lower limit value is the distance from the outer edge 34 of the scrap portion 31 to the center line C of the base tape 13. 0.1 mm is preferable, 0.2 mm is more preferable, and 0.5 mm is particularly preferable from the viewpoint of more reliably preventing generation of a tear portion in the direction. On the other hand, the upper limit of the distance L1 between the tip 53 and the tip 63 is the outer edge 34 extending from the outer peripheral portion 33 surrounding the predetermined label portion 21-1 toward the other label portion 21-2 and the other label portion 21-2. 10 mm is preferable, 7.0 mm is more preferable, and 5.0 mm is particularly preferable in that tearing between the outer edge 34 extending in the direction of the predetermined label portion 21-1 from the outer peripheral portion 33 surrounding the label portion 21-1 is more reliable.

An imaginary line D1 in a direction parallel to the conveying direction D passing through the tip 53 of the outer edge 34 extending from the outer peripheral portion 33 surrounding the predetermined label portion 21-1 toward the other label portion 21-2 and the outward portion 52. The angle θ formed by the tip 53 is not particularly limited, but its lower limit value is determined by tearing from the tip 63 of the outer edge 34 extending in the direction of the predetermined label portion 21-1 from the outer peripheral portion 33 surrounding the other label portion 21-2. 10° is preferable, 20° is more preferable, and 30° is particularly preferable from the point that the angle reaches the outward portion 52 more reliably. On the other hand, the upper limit of the above-mentioned angle θ is such that, when scrap lifting approaches from the tip 63 to the vicinity of the tip 53, a large tension acts on the base film 14 and the base film 14 is torn at a position deviated from the assumed tearing position. 150° is preferable, and 130° is particularly preferable, in order to prevent the tip portion of the scrap portion 31 from being left behind and to more reliably facilitate the scrap removing process.

The tip 53 of the outer edge 34 extending from the outer peripheral portion 33 surrounding the predetermined label portion 21-1 toward the other label portion 21-2 and the outer periphery surrounding the other label portion 21-2 in the direction orthogonal to the conveying direction D Although the distance from the portion 33 to the tip 63 of the outer edge 34 extending in the direction of the predetermined label portion 21-1 is not particularly limited, the distance from the outer peripheral portion 33 surrounding the predetermined label portion 21-1 to the other label portion 21-2 direction is not particularly limited. The outer edge 34 extending toward the label portion 21-2 and the outer edge 34 extending in the predetermined label portion 21-1 direction from the outer peripheral portion 33 surrounding the other label portion 21-2 are more reliably torn, and the scrap portion 31 is more reliably peeled off. From the point of smoothing, it is preferably 0.1 mm or more and 10 mm or less, more preferably 0.2 mm or more and 7.0 mm or less, and particularly preferably 0.5 mm or more and 5.0 mm or less.

Next, a method for forming sections of the label portion 21, the scrap portion 31, and the peripheral portion 41 on the base tape 13 will be described. A label portion 21 to which a semiconductor wafer is bonded to the base tape 13 , a scrap portion 31 surrounding the outer edge 22 of the label portion 21 in a plan view, and an outer edge 34 of the scrap portion 31 . As a method of forming a partition with the peripheral portion 41 located at the part, for example, a method of pre-cutting the base tape 13 using a rotary punching blade can be mentioned. In this case, the division between the label portion 21 , the scrap portion 31 and the peripheral portion 41 is formed by a cut line provided on the base tape 13 .

The electronic device processing tape having the scrap portion 31 for forming the electronic device processing tape 1 is obtained by pre-cutting the base tape 13 using a rotary punching blade 100 having a blade pattern shown in FIG. Thus, the label portion 21 , the scrap portion 31 and the peripheral portion 41 can be separated, and the turn portions 50 and 60 can be formed in the interval portion 32 of the scrap portion 31 . The rotary punching blade 100 is wound around the outer surface of a cylindrical roll (not shown), and the cylindrical roll is rotated while the base tape 13 is pressed against the rotary punching blade 100. Pre-cut processing can be applied. One pre-cut label portion 21 is formed by one rotation of the cylindrical roll.

As shown in FIG. 4, the rotary punching blade 100 includes a label portion forming blade 110 for forming the outer edge 22 of the label portion 21 in plan view, and a waste portion provided on the outer peripheral portion of the label portion forming blade 110. and a scrap portion forming blade 120 for forming the outer edge 34 of 31 . In the electronic device processing tape 1, the label portion forming blade 110 has a circular shape corresponding to the circular shape of the label portion 21 in plan view.

The waste portion forming blade 120 includes a turn portion forming blade 121 for forming the turn portion 50 , a turn portion forming blade 122 for forming the turn portion 60 , and an outer peripheral portion 33 surrounding the label portion 21 . and an outer edge forming blade 123 for forming the outer edge 34 . The turn portion forming blade 121 is formed at a position facing the turn portion forming blade 122 . In addition, the outer peripheral edge forming blade 123 is connected to the turn portion forming blade 121 and the turn portion forming blade 122 . Further, the turn portion forming blade 121 is connected to the turn portion forming blade 122 via an outer peripheral portion forming blade 123 .

A tip 53 of the outer edge 34 extending from the outer peripheral portion 33 surrounding the predetermined label portion 21-1 toward the other label portion 21-2 extends from the outer peripheral portion 33 surrounding the other label portion 21-2 to the predetermined label portion 21-1. The interval S1 between the turn portion forming blades 121 is wider than the interval S2 between the turn portion forming blades 122 corresponding to the fact that the outer edge 34 extending in the direction is located in the direction of the peripheral portion 41 from the tip 63 thereof. is set.

In addition, corresponding to the curved portion 51 formed in the turn portion 50 , the turn portion forming blade 121 is provided with a bent portion 124 in the extending direction of the turn portion forming blade 121 . The radius of curvature of the bent portion 124 corresponds to the radius of curvature of the curved portion 51 of the turn portion 50 . Further, in correspondence with the formation of the outward portion 52 in the curved portion 51 of the turn portion 50, the bent portion 124 of the turn portion forming blade 121 is provided with an outward portion 125 extending outward. It is

In addition, corresponding to the curved portion 61 formed in the turn portion 60 , the turn portion forming blade 122 is provided with a bent portion 224 in the extending direction of the turn portion forming blade 122 . The radius of curvature of the bent portion 224 corresponds to the radius of curvature of the curved portion 61 of the turn portion 60 . Further, in correspondence with the formation of the outward portion 62 in the curved portion 61 of the turn portion 60, the bent portion 224 of the turn portion forming blade 122 is provided with an outward portion 225 extending outward. It is

In the first rotation of the rotary punching blade 100, the predetermined label portion 21-1 is formed by the label portion forming blade 110, and the outer edge of the outer peripheral portion 33 surrounding the predetermined label portion 21-1 by the outer peripheral portion outer edge forming blade 123. 34 is formed, and the turn portion 50 is formed by the turn portion forming blade 121 . Then, in the second rotation of the rotary punching blade 100, the turn portion forming blade 122 forms the turn portion 60 in the vicinity of the portion where the turn portion 50 is formed, and the label portion forming blade 110 forms a predetermined label. Another label portion 21-2 adjacent to the portion 21-1 is formed, and the outer edge 34 of the outer peripheral portion 33 surrounding the other label portion 21-2 is formed by the outer edge forming blade 123. FIG. By repeating the above-described pre-cutting operation, the sections of the label portion 21 , the scrap portion 31 and the peripheral portion 41 can be continuously formed on the base tape 13 .

In the tape 1 for processing electronic devices according to the first embodiment shown in FIGS. The tip 53 of the outer edge 34 extending in the 21-2 direction is located in the direction of the peripheral portion 41 from the outer peripheral portion 33 surrounding the other label portion 21-2 than the tip 63 of the outer edge 34 extending in the predetermined label portion 21-1 direction. However, as shown in FIG. 5, an outer edge 34 extending from an outer peripheral portion 33 surrounding a predetermined label portion 21-1 toward the other label portion 21-2 at an interval portion 32 of the waste portion 31. and the tip 63 of the outer edge 34 extending in the direction of the predetermined label portion 21-1 from the outer peripheral portion 33 surrounding the other label portion 21-2 is positioned parallel to the conveying direction D. tape 2 may be used.

5 is different from FIGS. 2 and 3 in that the tip 53 and the tip 63 are positioned parallel to the conveying direction D. FIG. It is an enlarged view which shows the outline|summary of planar view before waste removal processing.

That is, in the electronic device processing tape 2 according to the first embodiment shown in FIG. ) and the end of the outer edge 34 extending from the outer peripheral portion 33 surrounding the other label portion 21-2 in the direction of the predetermined label portion 21-1 (that is, extending from the other direction) Situated parallel to D. From the above, the tip 53 and the tip 63 are at the same position in the width direction of the base tape 13 .

In the electronic device processing tape 2, the interval S1 between the turn portion forming blades 121 of the rotary punching blade 100 and the interval S2 between the turn portion forming blades 122 are set to be the same, so that the tip 53 and the tip 63 are formed into the base tape. 13 can be set at the same position in the width direction.

At the spacing portion 32 of the scrap portion 31, the tip 53 of the outer edge 34 extending from the outer peripheral portion 33 surrounding the predetermined label portion 21-1 toward the other label portion 21-2 and the outer periphery surrounding the other label portion 21-2 Since the tip 63 of the outer edge 34 extending from the portion 33 in the direction of the predetermined label portion 21-1 is positioned parallel to the conveying direction D, the base tape 13 The tearing from the leading end 63 to the leading end 53 is facilitated during the scrap removing process in which the dregs 31 are torn off by a winding means or the like. Therefore, even if a tension is applied to the scrap portion 31, a tear portion is prevented from being generated from the outer edge 34 of the scrap portion 31 in the direction of the center line C of the base tape 13. It is prevented that a tear part occurs in the

As described above, in the electronic device processing tape of the present invention, the tip of the outer edge 34 extending in the direction of the predetermined label portion 21-1 from the outer peripheral portion 33 surrounding the other label portion 21-2 located upstream of the scrap removing process. 63 is positioned in the direction of the peripheral portion 41 from the tip 53 of the outer edge 34 extending from the outer peripheral portion 33 surrounding the predetermined label portion 21-1 to the direction of the other label portion 21-2, located downstream of the scrap removing process. It is acceptable as long as it is not installed.

Next, an example of a method for manufacturing the electronic device processing tape 1 will be described.

First, a primary pre-cut is performed on the laminate in which the adhesive layer 12 is applied on the main surface 61 of the release film 11 by using a rotary punching blade to form a pre-cut on the adhesive layer 12 . After the primary pre-cutting, unnecessary portions of the adhesive layer 12 (portions other than the portion corresponding to the label portion 21) are removed. Separately from this, the base tape 13, which is a laminated structure in which the pressure-sensitive adhesive layer 15 is applied on the main surface 71 of the base film 14, is prepared. Next, the adhesive layer 15 is opposed to the adhesive layer 12 from which unnecessary portions have been removed, and the base tape 13 is laminated on the release film 11 and the adhesive layer 12 to bond the base tape 13 to the release film 11 . superimposed with

Next, using a rotary punching blade 100 arranged to face the base tape 13, a label portion 21 to which a semiconductor wafer is bonded to the base tape 13, and an outer edge 22 of the label portion 21 in plan view are surrounded. A secondary precut is performed to form a division (cut line) between the scrap portion 31 and the peripheral portion 41 that is in contact with the outer edge 34 of the scrap portion 31 and positioned at the edge of the base tape 13 . In the secondary pre-cutting, turn portions 50 and 60, which are cut lines, are also formed in the interval portion 32 of the scrap portion 31. As shown in FIG. Further, in the secondary pre-cutting, the tip 53 of the outer edge 34, which is a cut line extending from the outer peripheral portion 33 surrounding the predetermined label portion 21-1 toward the other label portion 21-2, at the interval portion 32 of the waste portion 31. and a tip 63 of the outer edge 34, which is a cutting line extending from the outer peripheral portion 33 surrounding the other label portion 21-2 toward the predetermined label portion 21-1, is formed at a predetermined position. In the secondary pre-cutting, the outer edge 34, which is the cut line of the outer peripheral portion 33 of the scrap portion 31 surrounding the predetermined label portion 21-1, and the cut line of the outer peripheral portion 33 of the scrap portion 31 surrounding the other label portion 21-2. , do not intersect.

Next, a scrap removal process is performed to peel off the scrap portion 31 of the base tape 13 by a winding means or the like to form a scrap peeling portion. Thereby, the electronic device processing tape 1 can be manufactured.

Next, an example of how to use the electronic device processing tape of the present invention will be described. Here, an example of how to use the electronic device processing tape of the present invention will be described using the electronic device processing tape 1 according to the first embodiment. FIG. 6 is an explanatory diagram of an example of how to use the electronic device processing tape according to the first embodiment of the present invention.

As shown in FIG. 6 , first, the electronic device processing tape 1 wound in a roll shape is pulled out from the roll body of the electronic device processing tape 1 by the release film winding roller 200 . A peeling means 201 is provided in the path of drawing out the electronic device processing tape 1, and only the peeling film 11 is peeled off from the electronic device processing tape 1 with the tip of the peeling means 201 as a turning point. The peeled release film 11 is taken up by a release film take-up roller 200 having a function of pulling out from the roll body of the electronic device processing tape 1 .

A bonding portion 202 is provided at the tip of the peeling means 201 . A semiconductor wafer W and a ring frame 205 surrounding the semiconductor wafer W are placed on the upper surface of the bonding portion 202 . The laminate of the adhesive layer 12 and the base tape 13 from which the release film 11 has been peeled off is guided onto the semiconductor wafer W facing the adhesive layer 12 , and is attached to the adhesive layer 12 by the bonding roller 203 . Laminate W.

Next, the semiconductor wafer W is diced into semiconductor chips (not shown) while the laminate of the adhesive layer 12 and the base tape 13 is attached to the semiconductor wafer W and the ring frame 205 . After dicing into semiconductor chips, the base tape 13 is subjected to a curing treatment such as ultraviolet irradiation to cure the adhesive component constituting the adhesive layer 15 of the base tape 13, thereby increasing the adhesive strength of the adhesive component. lower the When the adhesive strength of the adhesive layer 15 decreases, the adhesive layer 12 is smoothly separated from the adhesive layer 15, and the semiconductor chip is picked up with the adhesive layer 12 adhered to the back surface of the semiconductor chip. The adhesive layer 12 adhered to the back surface of the semiconductor chip functions as a die bonding film when bonding the semiconductor chip to a lead frame, package substrate, or other semiconductor chip.

Next, another embodiment of the electronic device processing tape of the present invention will be described. In the electronic device processing tapes 1 and 2 according to the first embodiment, the turn portions 50 and 60 had curved portions 51 and 61 in plan view. , 60 may have straight portions.

Further, in the electronic device processing tapes 1 and 2 according to the first embodiment, the outer edge 34 extending from the outer peripheral portion 33 surrounding the predetermined label portion 21-1 toward the other label portion 21-2 is Although there was a turn portion 50 extending in the direction of the center line C of the base tape 13 parallel to the conveying direction D from a certain tip 53, instead of this, the turn portion 50 extends from the tip 53 to the center line C of the base tape 13. It is not necessary to have the turn portion 50 extending in the direction. In the absence of the turn portion 50, the outer edge 34 extending from the outer peripheral portion 33 surrounding the predetermined label portion 21-1 toward the other label portion 21-2 extends from the leading end 53 in the conveying direction D at the interval portion 32. It has a shape extending in parallel to the predetermined label portion 21-1 direction.

Further, in the electronic device processing tapes 1 and 2 according to the first embodiment, the adhesive layer 12 was provided between the peeling tape 11 and the base tape 13, but instead of this, the tape shown in FIG. As shown, the electronic device processing tape 3 may have no adhesive layer 12 between the release tape 11 and the base tape 13 . In the electronic device processing tape 3 , the adhesive layer 15 of the base tape 13 is in direct contact with the release tape 11 also in the label portion 21 .

In the electronic device processing tape of the present invention, even if the thickness of the base tape is reduced or a material that lowers the tensile strength is used for the base tape, the scrap part can be smoothly peeled off. , High utility value in the field of dicing bonding integrated film.

Reference Signs List 1, 2, 3 Electronic device processing tape 11 Release film 12 Adhesive layer 13 Base tape 14 Base film 15 Adhesive layer 50, 60 Turn part 53, 63 Tip

Claims (10)

a release film;
A base tape having an adhesive layer formed on the main surface of a base film, the tape for electronic device processing comprising the base tape laminated with the release film,
The base tape includes label portions having a predetermined plan view shape formed at predetermined intervals in the conveying direction of the electronic device processing tape, and surrounding the outer side of the label portion in a plan view, and the predetermined The scum portion having a space portion forming a space includes a scum stripped portion and a peripheral portion in contact with the outer edge of the scum stripped portion in a plan view,
a cut line forming an outer edge of the scrap portion extending from the front in the conveying direction and a cut line forming an outer edge of the scrap portion extending from the rear in the conveying direction do not intersect;
In the interval portion of the scrap portion, the end of the cut line extending from one direction is at the same position or the periphery as the end of the cut line extending from the other direction in the direction orthogonal to the conveying direction. Electronic device processing tape located in the direction of the part. At least one of the cut line extending from one direction and the cut line extending from the other direction is a center line of the base tape parallel to the conveying direction from the end at the interval portion of the scrap portion. 2. The electronic device processing tape according to claim 1, which has a turn portion extending in a direction. 3. The tape for processing electronic devices according to claim 2, wherein the turn portion has a curved portion in plan view. 4. The tape for processing an electronic device according to claim 3, wherein the curved portion of the turn portion in plan view has an arc-shaped curved portion with a curvature radius of R1.0 mm or more. 3. The tape for processing electronic devices according to claim 2, wherein the turn portion has a straight portion in plan view. 6. The distance between the end of the cut line extending from one direction and the end of the cut line extending from the other direction in a direction parallel to the conveying direction is 0.1 mm or more and 10 mm or less. The electronic device processing tape according to any one of the above items. An angle θ between an imaginary line parallel to the conveying direction passing through the end of the cut line extending from one direction and the tip of the cut line extending from the one direction is 10° or more and 150° or less. Item 7. The electronic device processing tape according to any one of Items 1 to 6. The end of the cut line extending from one direction is located in the peripheral direction from the end of the cut line extending from the other direction, and the cut extends from one direction in a direction orthogonal to the conveying direction. 8. The electronic device processing tape according to claim 1, wherein the distance between the end of the line and the end of the cut line extending from the other direction is 0.1 mm or more and 10 mm or less. further comprising an adhesive layer provided on part of the main surface of the release film,
9. The electronic device processing tape according to any one of claims 1 to 8, wherein the base tape covers the adhesive layer and is in contact with the release film around the adhesive layer. A step of applying an adhesive layer on a base film to produce a base tape;
A step of superimposing the base tape on a release film;
label portions having a predetermined shape in plan view formed on the base tape at predetermined intervals in the conveying direction of the base tape; A cut line that forms a division between a waste portion having a space portion to be formed and a peripheral portion that is in contact with the outer edge of the waste portion in a plan view, and that forms the outer edge of the waste portion extending from the front in the conveying direction. and the cut line forming the outer edge of the scrap portion extending from the rear in the conveying direction do not intersect, and the end of the cut line extending from one direction extends from the other direction at the interval portion of the scrap portion. or the end of the cut line extending from one direction and the end of the cut line extending from the other direction are located parallel to the conveying direction. A step of performing pre-cutting using a rotary punching blade;
a step of performing a scrap removing process on the scrap portion to form a scrap peeling portion on the base tape;
A method for producing an electronic device processing tape having

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