JP5889026B2 - Wafer processing tape - Google Patents

Description

  The present invention relates to a wafer processing tape, and more particularly to a wafer processing tape having two functions of a dicing tape and a die bonding film.

  Recently, a dicing tape for fixing a semiconductor wafer when the semiconductor wafer is cut and separated into individual chips (dicing) and a semiconductor chip that has been cut are bonded to a lead frame, a package substrate, or the like, or stacked. As a package, a dicing die bonding tape having two functions of a die bonding film (also referred to as a die attach film) for laminating and adhering semiconductor chips has been developed.

  Some dicing / die bonding tapes have been pre-cut in consideration of workability such as attachment to a wafer and attachment to a ring frame during dicing.

  An example of the pre-cut processed dicing die bonding tape is shown in FIGS. FIG. 8 is a view showing a state in which the dicing die bonding tape is wound into a roll shape, FIG. 9A is a plan view of the dicing die bonding tape, and FIG. It is sectional drawing by line BB of (a). The dicing die bonding tape 50 includes a release film 51, an adhesive layer 52, and an adhesive film 53. The adhesive layer 52 is processed into a circle corresponding to the shape of the wafer, and has a circular label shape. The adhesive film 53 is obtained by removing the peripheral area of the circular portion corresponding to the shape of the ring frame for dicing. As shown in the drawing, the adhesive film 53 includes a circular label portion 53a and a peripheral portion 53b surrounding the outside. Have. The adhesive layer 52 and the circular label portion 53a of the pressure-sensitive adhesive film 53 are laminated with their centers aligned, and the circular label portion 53a of the pressure-sensitive adhesive film 53 covers the adhesive layer 52 and is released from the periphery thereof. It is in contact with the film 51.

  When dicing the wafer, the release film 51 is peeled off from the laminated adhesive layer 52 and the adhesive film 53, and the back surface of the semiconductor wafer W is pasted on the adhesive layer 52 as shown in FIG. A dicing ring frame F is adhesively fixed to the outer peripheral portion of the circular label portion 53 a of the adhesive film 53. In this state, the semiconductor wafer W is diced, and then the adhesive film 53 is subjected to a curing process such as ultraviolet irradiation to pick up a semiconductor chip. At this time, since the adhesive film 53 has a reduced adhesive force due to the curing process, the adhesive film 53 is easily peeled off from the adhesive layer 52, and the semiconductor chip is picked up with the adhesive layer 52 attached to the back surface. The adhesive layer 52 attached to the back surface of the semiconductor chip then functions as a die bonding film when the semiconductor chip is bonded to a lead frame, a package substrate, or another semiconductor chip.

  By the way, as shown in FIGS. 8 and 9, the dicing die bonding tape 50 as described above is a peripheral portion of the adhesive film 53 where the adhesive layer 52 and the circular label portion 53 a of the adhesive film 53 are laminated. Thicker than 53b. Therefore, when the product is wound into a roll, the step between the adhesive layer 52 and the circular label portion 53a of the pressure-sensitive adhesive film 53 and the peripheral portion 53a of the pressure-sensitive adhesive film 53 overlap each other, so that the flexible adhesive A phenomenon in which a step is transferred to the surface of the layer 52, that is, a transfer mark (also referred to as a label mark, wrinkle, or winding mark) as shown in FIG. 11 occurs. Such transfer marks are particularly noticeable when the adhesive layer 52 is formed of a soft resin or has a thickness, or when the number of windings of the tape 50 is large. When the transfer mark is generated, there is a risk that a defect may occur during processing of the wafer due to poor adhesion between the adhesive layer and the semiconductor wafer.

  In order to solve such a problem, as shown in FIG. 12, a dicing die bonding tape 50 ′ in which a support member 54 is pasted on a release film 51 so that a transfer mark is not attached even when wound on a roll is provided. It has been proposed (see Patent Document 1).

JP 2009-88480 A

  However, according to this proposal, the support member 54 is prepared as a member different from the dicing die bonding tape 50 ′, and a process is provided separately from the process of manufacturing and manufacturing the dicing die bonding tape 50 ′. There is a problem that it takes a high cost to realize such as incorporating a process of attaching the support member 54 by remodeling the support member 54 significantly. Further, when the alignment is performed, if the support member 54 protrudes into the area where the adhesive layer 52 exists and is bonded, the trace of the support member 54 is left on the adhesive layer 52. There is a problem that it has to be pasted only in the area indicated by, and the manufacturing difficulty level is high and it is difficult to confirm the quality.

  Therefore, the purpose of the present invention is that when a wafer processing tape having an adhesive layer and an adhesive film is rolled up on a release film, no transfer marks are attached to the adhesive layer and the circular label portion. Another object of the present invention is to provide a wafer processing tape that is low in manufacturing cost and easy to manufacture.

  In order to solve the above-described problems, a wafer processing tape according to the present invention includes a long release film, an adhesive layer having a predetermined planar shape provided on the first surface of the release film, and A label portion having a predetermined planar shape so as to cover the adhesive layer and contact the release film around the adhesive layer; and a peripheral portion surrounding the outside of the label portion; A wafer processing tape comprising a pressure-sensitive adhesive film and support members provided at both lateral ends of the wafer processing tape, wherein the support member is the same material as the release film, and the support release film It consists of an adhesive film and a supporting adhesive film of the same material.

  In the wafer processing tape, it is preferable that the support member is formed by folding back both ends in the short direction of the release film and both ends in the short direction of the peripheral portion of the adhesive film.

  Further, in the wafer processing tape, the support member may be configured so that both ends in the short direction of the release film and both ends in the short direction of the periphery of the adhesive film are the first surface of the release film. It is preferably formed by folding back to the opposite second surface side, and at least the adhesive film is cut in the thickness direction along the folding line.

  Moreover, as for the said wafer processing tape, the said release film may be partially cut | disconnected in the thickness direction along the fold line.

  In order to solve the above problems, a wafer processing tape according to the present invention includes a long release film and an adhesive layer having a predetermined planar shape provided on the first surface of the release film. A label portion having a predetermined planar shape that covers the adhesive layer and is in contact with the release film around the adhesive layer, and a periphery surrounding the outside of the label portion A wafer processing tape comprising: an adhesive film having a portion; and support members provided at both ends of the wafer processing tape in a short direction, wherein the support member is a support release film made of the same material as the release film It is characterized by comprising.

  In the wafer processing tape, it is preferable that the support member is formed by folding back both ends of the release film in the short direction.

  Further, in the wafer processing tape, the support member may be configured so that both ends in the width direction of the release film and both ends in the width direction of the periphery of the adhesive film are the first surface of the release film. The pressure-sensitive adhesive film is formed by folding back to the opposite second surface side, the adhesive film is cut in the thickness direction along the folding line, and the release film is along the folding line in the thickness direction. It is preferable that it is partially cut.

  In order to solve the above problems, a wafer processing tape according to the present invention includes a long release film and an adhesive layer having a predetermined planar shape provided on the first surface of the release film. A label portion having a predetermined planar shape that covers the adhesive layer and is in contact with the release film around the adhesive layer, and a periphery surrounding the outside of the label portion A wafer processing tape comprising: an adhesive film having a portion; and support members provided at both ends of the wafer processing tape in a short direction, wherein the support member is made of a support adhesive film made of the same material as the adhesive film. It is characterized by that.

  In the wafer processing tape, it is preferable that the support member is formed by folding back both ends of the peripheral portion of the adhesive film in the lateral direction.

  In the wafer processing tape described above, the support member is provided in a region corresponding to the outside of the adhesive layer provided on the first surface on the second surface of the release film. It is preferable.

  In the wafer processing tape described above, the support member is preferably provided continuously along the longitudinal direction of the release film.

  In the wafer processing tape described above, it is preferable that the support member has a thickness greater than or equal to the thickness of the adhesive layer.

  According to the present invention, since the supporting members made of the same material as the release film and / or the adhesive film are provided at both lateral ends of the wafer processing tape, there is no transfer mark and the manufacturing cost is low. A wafer processing tape that is low and easy to manufacture can be obtained.

(A) is a top view which shows the structure of the tape for wafer processing which concerns on embodiment of this invention, (b) is AA sectional drawing of (a). It is a top view which shows the structure of the modification of the tape for wafer processing which concerns on embodiment of this invention. It is explanatory drawing for demonstrating the manufacturing process of the tape for wafer processing which concerns on embodiment of this invention, (a) is the laminated body which bonded together the adhesive bond layer and adhesive film which were formed in the release film. It is a top view which shows a structure, (b) is AA sectional drawing of (a). It is explanatory drawing for demonstrating the manufacturing process of the tape for wafer processing which concerns on embodiment of this invention, (a) is a top view which shows a mode that the pre-cut process was given to the laminated body of FIG. ) Is an AA cross-sectional view of (a). It is sectional drawing which shows the structure of the tape for wafer processing which concerns on other embodiment of this invention. It is explanatory drawing for demonstrating the manufacturing process of the tape for wafer processing which concerns on other embodiment of this invention, (a) is sectional drawing which shows a mode that the pre-cut process was given to the laminated body of FIG. (B) is sectional drawing which shows the state which peeled the release film of the wide part, (c) is sectional drawing which shows the structure of the tape for wafer processing which concerns on this embodiment. It is sectional drawing which shows the structure of the tape for wafer processing which concerns on the modification of other embodiment shown in FIG. It is a perspective view which shows typically a mode that the conventional tape for wafer processing was wound up in roll shape. (A) is a top view which shows the structure of the tape for wafer processing which concerns on the conventional embodiment, (b) is BB sectional drawing of (a). It is sectional drawing which shows the state by which the conventional tape for wafer processing and the ring frame for dicing were bonded together. It is a schematic diagram for demonstrating the malfunction of the conventional tape for wafer processing. (A) is a top view which shows the structure of the tape for wafer processing which concerns on other conventional embodiment, (b) is AA sectional drawing of (a).

[First Embodiment]
Embodiments of the present invention will be described below in detail with reference to the drawings. FIG. 1A is a plan view of a wafer processing tape (dicing die bonding tape) according to an embodiment of the present invention, and FIG. 1B is a cross-sectional view taken along line AA in FIG. is there.

  As shown in FIGS. 1A and 1B, the wafer processing tape 10 includes a long release film 11, an adhesive layer 12, an adhesive film 13, and a support member 14.

  The adhesive layer 12 is provided on the first surface 11a of the release film 11, and has a circular label shape corresponding to the shape of the wafer. The pressure-sensitive adhesive film 13 covers the adhesive layer 12 and surrounds the outer side of the circular label portion 13a and the circular label portion 13a provided to come into contact with the release film 11 around the adhesive layer 12 And a peripheral portion 13b. The peripheral portion 13b includes a form that completely surrounds the outer side of the circular label portion 13a and a form that is not completely surrounded as illustrated. The circular label portion 13a has a shape corresponding to a ring frame for dicing. The support member 14 is a second surface 11b of the release film 11 opposite to the first surface 11a on which the adhesive 12 and the pressure-sensitive adhesive film 13 are provided. It is provided at both ends in the hand direction.

  Hereafter, each component of the tape 10 for wafer processing of this embodiment is demonstrated in detail.

(Release film)
As the release film 11 used for the wafer processing tape 10 of the present invention, a polyethylene terephthalate (PET) series, a polyethylene series, or other known films such as a release-processed film can be used. The thickness of the release film is not particularly limited and may be appropriately set, but is preferably 25 to 50 μm.

(Adhesive layer)
As described above, the adhesive layer 12 of the present invention is formed on the first surface 11a of the release film 11 and has a circular label shape corresponding to the shape of the wafer.

  The adhesive layer 12 is attached to the back surface of the chip when the chip is picked up after the semiconductor wafer or the like is bonded and diced, and is used as an adhesive for fixing the chip to the substrate or the lead frame. Is. As the adhesive layer 12, an adhesive containing at least one selected from an epoxy resin, an acrylic resin, and a phenol resin can be preferably used. In addition, a polyimide resin or a silicone resin can also be used. The thickness may be appropriately set, but is preferably about 5 to 100 μm.

(Adhesive film)
As described above, the adhesive film 13 of the present invention has the circular label portion 13a corresponding to the shape of the ring frame for dicing, and the peripheral portion 13b surrounding the outside. Such an adhesive film can be formed by removing the peripheral region of the circular label portion 13a from the film-like adhesive by precut processing.

  The adhesive film 13 is not particularly limited, and has a sufficient adhesive force so that the wafer does not peel when dicing the wafer, and can be easily peeled from the adhesive layer when picking up the chip after dicing. Any material that exhibits low adhesive strength may be used. For example, what provided the adhesive layer in the base film can be used conveniently.

  The base film of the adhesive film 13 can be used without particular limitation as long as it is a conventionally known base film. However, when a radiation curable material is used as the adhesive layer described later, the radiation transparency is used. It is preferable to use one having

For example, as the material, polyethylene, polypropylene, ethylene-propylene copolymer, polybutene-1, poly-4-methylpentene-1, ethylene-vinyl acetate copolymer, ethylene-ethyl acrylate copolymer, ethylene-acrylic Α-olefin homopolymer or copolymer such as acid methyl copolymer, ethylene-acrylic acid copolymer, ionomer or a mixture thereof, polyurethane, styrene-ethylene-butene or pentene copolymer, polyamide-polyol Listed are thermoplastic elastomers such as copolymers, and mixtures thereof. Further, the base film may be a mixture of two or more materials selected from these groups, or may be a single layer or a multilayer.
The thickness of the base film is not particularly limited and may be set as appropriate, but is preferably 50 to 200 μm.

  The resin used for the pressure-sensitive adhesive layer of the pressure-sensitive adhesive film 13 is not particularly limited, and a known chlorinated polypropylene resin, acrylic resin, polyester resin, polyurethane resin, epoxy resin, or the like used for the pressure-sensitive adhesive is used. can do. It is preferable to prepare an adhesive by appropriately blending an acrylic adhesive, a radiation polymerizable compound, a photopolymerization initiator, a curing agent and the like into the resin of the adhesive layer 13. The thickness of the pressure-sensitive adhesive layer 13 is not particularly limited and may be appropriately set, but is preferably 5 to 30 μm.

  A radiation-polymerizable compound can be blended in the pressure-sensitive adhesive layer to facilitate peeling from the adhesive layer by radiation curing. As the radiation polymerizable compound, for example, a low molecular weight compound having at least two photopolymerizable carbon-carbon double bonds in a molecule that can be three-dimensionally reticulated by light irradiation is used.

  Specifically, trimethylolpropane triacrylate, pentaerythritol triacrylate, pentaerythritol tetraacrylate, dipentaerythritol monohydroxypentaacrylate, dipentaerythritol hexaacrylate, 1,4-butylene glycol diacrylate, 1,6 hexanediol diacrylate Acrylate, polyethylene glycol diacrylate, oligoester acrylate, and the like are applicable.

  In addition to the above acrylate compounds, urethane acrylate oligomers can also be used. The urethane acrylate oligomer includes a polyol compound such as a polyester type or a polyether type, and a polyvalent isocyanate compound (for example, 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate, 1,3-xylylene diene). A terminal isocyanate urethane prepolymer obtained by reacting isocyanate, 1,4-xylylene diisocyanate, diphenylmethane 4,4-diisocyanate, etc.) with an acrylate or methacrylate having a hydroxyl group (for example, 2-hydroxyethyl) Acrylate, 2-hydroxyethyl methacrylate, 2-hydroxypropyl acrylate, 2-hydroxypropyl methacrylate, polyethylene glycol acrylate, polyethylene glycol methacrylate, etc.) Obtained by the reaction. The pressure-sensitive adhesive layer may be a mixture of two or more selected from the above resins.

  When using a photopolymerization initiator, for example, isopropyl benzoin ether, isobutyl benzoin ether, benzophenone, Michler's ketone, chlorothioxanthone, dodecylthioxanthone, dimethylthioxanthone, diethylthioxanthone, benzyldimethyl ketal, α-hydroxycyclohexyl phenyl ketone, 2-hydroxymethylphenyl Propane or the like can be used. The blending amount of these photopolymerization initiators is preferably 0.01 to 5 parts by mass with respect to 100 parts by mass of the acrylic copolymer.

(Support member)
By providing the support members 14 at both ends in the short direction of the wafer processing tape 10, it is possible to prevent the transfer marks from being attached to the adhesive layer 12 and the circular label portion 13a. As shown in FIG. 1 (b), the portion where the adhesive layer 12 and the circular label portion 13 a of the adhesive film 13 are laminated is thicker than the peripheral portion 13 b of the adhesive film 13. For this reason, when the support member 14 is not provided, when the product is rolled into a roll, the laminated portion of the adhesive layer 12 and the circular label portion 13a of the adhesive film 13 and the peripheral portion 13a of the adhesive film 13 are provided. And the step is transferred to the surface of the flexible adhesive layer 12, that is, a transfer mark (also referred to as label mark, wrinkle, or winding mark) as shown in FIG. 11 occurs. Such transfer marks are particularly noticeable when the adhesive layer 12 is formed of a soft resin or has a thickness, or when the number of windings of the wafer processing tape 10 is large. When the transfer mark is generated, there is a risk that a defect may occur during processing of the wafer due to poor adhesion between the adhesive layer and the semiconductor wafer. Such a problem can also be achieved by providing the support member 14 so that the winding pressure applied to the tape when the wafer processing tape 10 is wound on a roll can be dispersed or collected on the support member 14. It is possible to suppress the formation of transfer marks on the agent layer 12.

  The support member 14 includes a support release film 11c and a support adhesive film 13c. The support release film 11c may be any material as long as it is the same material as the release film 11, and the support adhesive film 13c is any material as long as it is the same material as the adhesive film 13. However, the support release film 11c and the support adhesive film 13c are formed by using both ends in the short direction of the release film 11 and both ends in the short direction of the peripheral portion 13b of the adhesive film 13 to form the support member 14. Good. Thereby, since it is not necessary to prepare the material of the supporting member 14 separately, cost can be reduced.

  In the present embodiment, the support member 14 is formed by folding back both ends in the short direction of the release film 11 and both ends in the short direction of the peripheral portion 13 b of the adhesive film 13. As a method for forming such a support member 14, a release film that is wider than the prescribed product width (in the left-right direction as viewed on the paper surface of FIG. 1A) by approximately the same width as the support member 14 to be formed. 11 and the adhesive film 13 are processed into products, and the wide portion 16 (see FIG. 4), that is, the portion that becomes the support member 14 is folded back to the second surface 11b side of the release film 11 in the final process or an intermediate process. The method of forming by this is mentioned.

  In this way, if both ends of the release film 11 and the adhesive film 13 are folded back by a predetermined width to form the support member 14, the folding film 11 and the adhesive film 13 can be brought into a predetermined position without being aligned by simply folding back. The support member 14 can be formed.

  In addition, the adhesive film is cut in the thickness direction along the folding line, and the release film 11 is partially from the surface on the side where the adhesive film 13 is formed in the thickness direction along the folding line. It is preferable that it is cut | disconnected. Thereby, the part used as the support release film 11c of the release film 11 can be easily folded in the 2nd surface 11b side, and the shape stability after folding back is also good.

  The end portions of the release film 11 and the adhesive film 13 are folded back by a predetermined width, and then the release film 11 and the adhesive film 13 are all cut along the folding line in the thickness direction (the folded portion is cut off). (Including the case), the position of the support member 14 can be aligned because it is folded back by a predetermined width, but wafer processing is performed without cutting all or part of the release film 11. Of the portion 17 (see FIG. 4) corresponding to the prescribed width of the tape for forming the release film 11 and the support release film 11c (the portion corresponding to the wide portion 16 of the release film 11 (see FIG. 4)) When the support member 14 is formed, the portion that becomes the support member 14 does not shift more reliably when the support member 14 is formed. It can be.

  In the region corresponding to the outside of the adhesive layer 12 provided on the first surface 11a on the second surface 11b of the release film 11, that is, on the second surface 11b, the support member 14 is formed as shown in FIG. As shown to (a), providing in the area | region R from the edge part of the release film 11 to the adhesive bond layer 12 is preferable. With such a structure, when the tape 10 is wound up, the adhesive layer 12 and the support member 14 provided on the second surface 11b of the release film 11 do not overlap with each other. However, since the support member 14 can be accommodated in the region R without adjusting the manufacturing position, the position inspection or the like can be omitted.

  Further, as shown in FIG. 2, the release film of the part (corresponding to the wide part 16 (see FIG. 4)) forming the support release film 11c and the part 17 corresponding to the prescribed width of the wafer processing tape. A double-sided tape 19 may be sandwiched between the two and the two may be bonded together. Thereby, when using the wafer processing tape, there is an effect that the support member 14 is not likely to be separated / dropped off.

  In the present embodiment, the support member 14 is provided on the second surface 11b side of the release film 11, but may be provided on the first surface 11a side. In this case, when the product is processed by using the release film 11 and the adhesive film 13 which are wider than the prescribed product width by substantially the same width as the support member 14 to be formed, the wide portion 16 is folded back. Good. Moreover, in this case, all the thickness direction of the release film 11 and part or all of the thickness direction of the pressure-sensitive adhesive film 13 are cut along the fold line (when the whole thickness direction of the pressure-sensitive adhesive film 13 is cut, the turn-back portion (Including the case of cutting off). In this case, the support member 14 is provided in a region corresponding to the outside of the circular label portion 13a.

  The support member 14 can be provided intermittently or continuously along the longitudinal direction of the release film 11, but from the viewpoint of more effectively suppressing the generation of transfer marks, the longitudinal direction of the base film 11. It is preferable to provide continuously along.

  As the thickness of the support member 14, the thickness corresponding to the step between the laminated portion of the adhesive layer 12 and the circular label portion 13 a of the adhesive film 13 and the peripheral portion 13 b of the adhesive film 13 on the release film 11. That is, it may be equal to or more than that of the adhesive layer 12, and this embodiment may be applied particularly when the thickness of the release film 11 is smaller than the thickness of the adhesive layer 12.

  Since the supporting member has such a thickness, when the tape 10 is wound up, the adhesive film 13 and the second surface 11b of the release film 11 that overlaps the surface of the adhesive film 13 are in contact with each other. Since a space is formed between them, the second surface 11 b of the release film 11 is not strongly pressed against the flexible adhesive layer 12 via the adhesive film 13. Therefore, generation of transfer marks can be more effectively suppressed.

  Next, the method for forming the support member 14 will be described more specifically with reference to FIGS. FIG. 3A shows the structure of the laminate 18 in which the adhesive layer 12 and the adhesive film 13 provided on the release film 11 are bonded together, and FIG. 3B shows the structure of FIG. It is AA sectional drawing of). 4A and 4B are diagrams in which the laminated body 18 of FIG. 3 is precut, FIG. 4A is a plan view, and FIG. 4B is a cross-sectional view taken along line AA of FIG.

  As shown in FIG. 3, a long adhesive film 13 is laminated to a long release film 11 provided with an adhesive layer 12 having a circular label shape corresponding to the shape of the wafer. . The widths of the release film 11 and the adhesive film 13 (in the vertical direction when viewing FIG. 3A on the paper surface) are substantially the same as the width of the support member 14 rather than the prescribed width when the wafer processing tape is later used. It is only wide. The adhesive layer 12 having a circular label shape is formed by applying an adhesive varnish to the release film 11 and drying it, punching it into a circular shape, and peeling off unnecessary portions around the circular portion from the release film 11. It is good to form.

  Next, as shown in FIG. 4, the laminated body 18 (see FIG. 3) is cut with a blade shape from the adhesive film 13 side to the middle of the release film 11 in the thickness direction, and the circular label portion 13 a and the peripheral portion are cut. Pre-cut processing is performed by peeling the adhesive film 13 from the release film 11 leaving 13b. In the present embodiment, at the same time as the incision of the precut process, from the both ends in the short direction of the peripheral portion 13b to the inside by substantially the same width as the width of the support member 14, respectively, along the longitudinal direction from the adhesive film 13 side. A cut (half cut) is made with a blade shape halfway along the thickness direction of the release film 11 to form a linear cut portion 15. The incision 15 may be formed before or after the pre-cut process, but using a blade shape provided with straight blades on both sides of the shape of the circular label portion 13a and the shape of the peripheral portion 13b. By performing this simultaneously with the pre-cut process, the number of processes can be omitted, which is preferable in terms of efficiency, and the position of the linear cut portion 15 is inevitably determined, which is also preferable in terms of quality.

  The portion outside the cut portion 15 (the wide portion 16, that is, the portion that becomes the support member 14) is easy in the direction of the second surface 11 b of the release film 11 starting from the cut portion 15 (arrow direction in FIG. 3B). Therefore, the support member 14 shown in FIG. 1B is formed by folding back in the step after the pre-cut process.

  As described above, according to the present embodiment, since the supporting members made of the same material as the release film and the adhesive film are provided at both ends in the short direction of the wafer processing tape, the wafer processing without transfer marks is provided. Can be manufactured at low cost. Further, if both ends of the release film 11 and the adhesive film 13 are folded back by a predetermined width to form the support member 14, the support member can be placed at a predetermined position without being aligned only by folding back. Since 14 can be formed, it can be manufactured easily, and a position inspection or the like can be omitted.

[Second Embodiment]
Next, a second embodiment will be described with reference to FIG. In the first embodiment described above, the support member 14 is composed of the support release film 11c and the adhesive film 13c, whereas in the present embodiment, the support member 14 'is composed only of the release film 11c. The same configuration and manufacturing method as those described in the first embodiment can be applied except that they are different.

  Hereinafter, differences from the first embodiment will be described. As shown in FIG. 5, the support member 14 ′ is formed by folding back both ends of the release film 11 in the short direction. As a method for forming such a support member 14 ′, a release film 11 and a pressure-sensitive adhesive film 13 having a specified product width that are wider than the specified product width by an amount substantially equal to the width of the support member 14 to be formed are used. Then, the product is processed and formed by folding the wide portion 16 toward the second surface 11b of the release film 11 in the final process or an intermediate process.

  In the case where the support member 14 ′ is provided on the first surface 11 a side, after the wide portion 16 is folded, the entire release film 11 is cut along the folding line (the folded portion is cut off). And a double-sided tape 19 between the adhesive film 13 of the portion 17 corresponding to the prescribed width of the wafer processing tape and the portion forming the support release film 11c (the portion corresponding to the wide portion 16). It is good to stick both together. Thus, when using the wafer processing tape 10 ′, it is not necessary to return the folding of the support member 14 ′ and peel off the release film 11, and the support member 14 is separated when using the wafer processing tape.・ There is no risk of falling off.

  This embodiment is effective when the thickness of the adhesive layer 12 is thinner than the thickness of the release film 11 and has an effect of suppressing the material cost of the adhesive film 13.

[Third Embodiment]
Next, a third embodiment will be described with reference to FIGS. In the first embodiment described above, the support member 14 is composed of the support release film 11c and the support adhesive film 13c, whereas in the present embodiment, the support member 14 ″ is composed only of the adhesive film 13c. The same configuration and manufacturing method as those described in the first embodiment can be applied except that they are different.

  Hereinafter, differences from the first embodiment will be described. As shown in FIG. 6C, the support member 14 ″ is formed by folding back both ends in the short side direction of the peripheral portion 13b of the adhesive film 13. As a method for forming such a support member 14 ″, The product is processed by using the release film 11 and the adhesive film 13 which are wider than the width of the support member 14 to be formed by a width substantially equal to the width of the support member 14 to be formed. A cut portion 15 'is formed in the release film 11 (see FIG. 6a), and then the release film 11 of the wide portion 16 is peeled off and the adhesive film 13 of the wide portion 16 is folded back (see FIG. 6 (b)). The method of forming by this is mentioned. In this case, when the adhesive film 13 of the wide portion 16 is folded back to the second surface 11b side of the release film 11, it sticks to the second surface 11b of the release film 11, so that it is supported when the wafer processing tape is used. There is an effect that the member 14 ″ is not likely to be separated and dropped off.

  As a modified example of the support member 14 ″ (see FIG. 7), when forming the support member 14 ″, the release film 11 and the adhesive film 13 of the wide portion 16 are all cut in the thickness direction, and used for wafer processing. The part 17 corresponding to the specified width of the tape and the part forming the support member 14 (the part corresponding to the wide part 16) are separated, and the release film 11 is wound out of the part forming the separated support member 14 After removal by a method such as removing, the adhesive film 13 may be attached to the second surface 11b side of the release film 11 to form the support member 14 ″. In this case, the support member 14 ″ is approximately smaller than the prescribed product width. When the laminated body 18 is formed using the release film 11 and the adhesive film 13 which are wide by the width of the support member 14 ″ to be formed (see FIG. 3), the support member 14 ″ of the release film 11 is formed. On the part forming Then, all of them are cut in the thickness direction, and removed by a method such as winding only the portion of the release film 11 that forms the support member immediately before the adhesive film 13 is attached to the second surface 11b side of the release film 11. In the method, the portion forming the support member 14 ″ is not separated during the manufacturing process, causing a problem such as deformation, and the problem that the adhesive surface of the adhesive film 13 sticks to the manufacturing apparatus. There is an effect that it does not occur.

10: Wafer processing tape 11: Release film 11a: First surface 11b: Second surface 11c: Support release film 12: Adhesive layer 13: Adhesive film 13a: Circular label portion 13b: Peripheral portion 13c: Support Adhesive film 14: support member 15: cut portion 16: wide portion

Claims (9)

A long release film,
An adhesive layer having a predetermined planar shape provided on the first surface of the release film;
A label portion having a predetermined planar shape so as to cover the adhesive layer and contact the release film around the adhesive layer; and a peripheral portion surrounding the outside of the label portion; An adhesive film having
In the wafer processing tape comprising the supporting members provided at both ends in the short direction of the wafer processing tape,
The tape for wafer processing, wherein the support member comprises a support release film made of the same material as the release film and a support adhesive film made of the same material as the adhesive film.   2. The wafer processing tape according to claim 1, wherein the support member is formed by folding back both ends in the short direction of the release film and both ends in the short direction of the peripheral portion of the adhesive film. 3. . The support member has both ends in the short direction of the release film and both ends in the short direction of the periphery of the adhesive film on the second surface side opposite to the first surface of the release film. It is formed by folding
The adhesive film is cut in the thickness direction along the fold line, and the release film is partially cut in the thickness direction along the fold line. The wafer processing tape according to claim 2. A long release film,
An adhesive layer having a predetermined planar shape provided on the first surface of the release film;
A label portion having a predetermined planar shape so as to cover the adhesive layer and contact the release film around the adhesive layer; and a peripheral portion surrounding the outside of the label portion; An adhesive film having
In the wafer processing tape comprising the supporting members provided at both ends in the short direction of the wafer processing tape,
The tape for wafer processing, wherein the support member is made of a support release film made of the same material as the release film.   The wafer processing tape according to claim 4, wherein the support member is formed by folding back both ends of the release film in the short direction. The support member is formed by folding both ends of the release film in the short direction to a second surface side opposite to the first surface of the release film,
6. The wafer processing tape according to claim 4, wherein the release film is partially cut in a thickness direction along a fold line. The said support member is provided in the area | region corresponding to the outer side of the said adhesive bond layer provided in the said 1st surface on the said 2nd surface of the said release film. The wafer processing tape according to claim 6 . 8. The wafer processing tape according to claim 1, wherein the support member is continuously provided along a longitudinal direction of the release film . 9. 9. The wafer processing tape according to claim 1 , wherein the support member has a thickness equal to or greater than a thickness of the adhesive layer . 10.

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