JP4785093B2 - Long wafer processing tape - Google Patents

Description

The present invention relates to a long body of a wafer processing tape, and more particularly to a long body of a wafer processing tape having two functions of a dicing tape and a die bonding film.

Recently, a dicing tape for fixing a semiconductor wafer when the semiconductor wafer is cut and separated into individual chips (dicing) and a semiconductor chip that has been cut are bonded to a lead frame, a package substrate, or the like, or stacked. As a package, a wafer processing tape has been developed that has two functions of a die bonding film (also referred to as a die attach film) for laminating and bonding semiconductor chips.

Such wafer processing tapes have been pre-cut in consideration of workability such as attachment to a wafer and attachment to a ring frame during dicing (for example, see Patent Document 1). ).

An example of a pre-cut wafer processing tape is shown in FIG. FIG. 2 is a schematic view of the wafer processing tape 20. As shown in FIG. 2, the wafer processing tape 20 includes a film 21.
And an adhesive layer 22 and an adhesive film 23. The adhesive layer 22 is processed into a circle corresponding to the shape of the wafer and has a circular shape. The adhesive film 23 is obtained by removing the peripheral area of the circular portion corresponding to the shape of the ring frame for dicing. As shown in the drawing, the adhesive film 23 includes a circular label portion 23a and a peripheral portion 23b surrounding the outside. Have. The adhesive layer 22 and the circular label portion 23a of the adhesive film 23 are laminated with their centers aligned,
Further, the circular label portion 23 a of the adhesive film 23 covers the adhesive layer 22 and is in contact with the film 21 around the adhesive layer 22.

When dicing the wafer, the film 21 is peeled off from the label composed of the adhesive layer 22 and the adhesive film 23 in a laminated state, and the back surface of the semiconductor wafer W is pasted on the adhesive layer 22 as shown in FIG. The dicing ring frame R is adhesively fixed to the outer peripheral portion of the circular label portion 23 a of the adhesive film 23. In this state, the semiconductor wafer W is diced, and then the adhesive film 23 is subjected to a curing process such as ultraviolet irradiation to pick up a semiconductor chip. At this time, since the adhesive force of the adhesive film 23 is reduced by the curing process, the adhesive layer 2
The semiconductor chip is picked up with the adhesive layer 22 attached to the back surface. The adhesive layer 22 attached to the back surface of the semiconductor chip then functions as a die bonding film when the semiconductor chip is bonded to a lead frame, a package substrate, or another semiconductor chip.

JP 2007-2173 A

Incidentally, the wafer processing tape 20 as described above is a long product as a product, as shown in FIG. Therefore, when manufacturing the wafer processing tape 20, a defective label is
For example, when multiple sheets exist continuously, after peeling off the label, cut off the film where the poor quality label existed, and bond the wafer processing tapes divided into multiple pieces using adhesive tape to specify A wafer processing tape 20 having a length and a specified number of labels is prepared.

FIG. 4 is a view showing a joint portion where the label is peeled off and two wafer processing tapes 40 are joined. 4A is a plan view of the wafer processing tape 40, and FIG. 4B is an X-axis of FIG. 4A.
It is an X-ray end view. As shown in FIG. 4, the joint portion in which the wafer processing tapes 40 are joined to each other in the middle of the long body is formed as follows.
(1) The label (the label made up of the adhesive layer 42 and the adhesive film 43 in the laminated state) of the part to be spliced (poor quality) is peeled off.
(2) Cut off the film where the label has been peeled off.
(3) After the cut portions of the film are brought together and face-to-face aligned, the first adhesive tape 44
a is pasted on the film.
(4) The second adhesive tape 44 is also formed on the opposite adhesive film 43 to which the adhesive tape 44a is applied.
Paste b.
(5) The 1st adhesive tape 44a and the 2nd adhesive tape 44 which protruded from the film width direction side
Excise b.

Meanwhile, as shown in FIG. 2, the wafer processing tape 20 as described above has a flexible adhesive layer 22 and a circular label portion 23a of an adhesive film 23 laminated thereon. The portion where the second adhesive tape 44b shown in FIG. 4 is provided on the adhesive layer 42 in the width direction is a circular label of the adhesive layer 42 and the adhesive film 43 when wound as a product in a roll shape. FIG. 5 shows a phenomenon in which the step between the laminated portion of the portion 43a, the peripheral portion 43b of the adhesive film 43, and the laminated portion of the second adhesive tape 44b overlap, and the step is transferred to the surface of the flexible adhesive layer 42. As shown, a transfer mark 45 is generated. The generation of the transfer marks 45 is remarkable particularly when the adhesive layer 42 is formed of a soft resin or has a thickness, and when the number of windings of the wafer processing tape 40 is large. When the transfer mark 45 is generated, there is a risk that a defect may occur during the processing of the wafer due to poor adhesion between the adhesive layer and the semiconductor wafer.

SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide a long wafer processing tape that can suppress the occurrence of transfer marks on an adhesive layer caused by a step of a joint when using a wafer processing tape. There is.

In order to achieve the above-described object, an elongated body of a wafer processing tape according to the present invention includes an elongated film and an adhesive having a predetermined planar shape provided on the first surface of the film. A label portion having a predetermined planar shape so as to cover the adhesive layer and to contact the film around the adhesive layer, and to surround an outer periphery of the label portion. A long wafer processing tape comprising an adhesive film having a peripheral portion, and having a joint portion for connecting a plurality of wafer processing tapes in the longitudinal direction, the joint portion, By bonding the second surfaces opposite to the first surface of the film with a first adhesive tape, and bonding the peripheral portions of the plurality of wafer processing tapes with a second adhesive tape Formed The second adhesive tape is characterized in that is provided only on the end side than the circumscribed line parallel to the longitudinal direction the adhesive layer of the film.

By providing the second pressure-sensitive adhesive tape on the end side with respect to the circumscribing line of the adhesive layer parallel to the longitudinal direction of the film, generation of transfer marks on the adhesive layer caused by the step of the joint portion is suppressed. ,
It is possible to prevent a problem from occurring during processing of the wafer due to poor adhesion between the adhesive layer and the semiconductor wafer.

In the long wafer processing tape described above, it is preferable that the joint portion is formed obliquely with respect to the longitudinal direction.

Since the first and second adhesive tapes join a plurality of wafer processing tapes that are cut obliquely with respect to the longitudinal direction of the wafer processing tape, it is easy and accurate by matching the cut surfaces. Two wafer processing tapes can be aligned.

In the long wafer processing tape described above, the first adhesive tape may be attached to the first surface of the film and the peripheral portion.

In the long wafer processing tape described above, the first adhesive tape may not be attached to the first surface of the film.

When the wafer processing tape is used, since the label portion is peeled off together with the adhesive layer, the film 21 is subjected to a mold release process. Therefore, when the first adhesive tape affixed on the peripheral part protrudes from the long film, the protruding part is easily peeled off, and the adhesive tape is peeled off starting from the peeled part. When 1 adhesive tape does not protrude into a long film, it can prevent that an adhesive tape peels.

In the long wafer processing tape described above, at least one of the first and second adhesive tapes is preferably a colored member.

Since at least one of the first and second adhesive tapes is a colored member, it can be easily confirmed visually or by a color difference meter that there is a joint portion joined to the long body of the wafer processing tape. . Moreover, when only the 1st adhesive tape stuck on the adhesive film of the peripheral part is a coloring member, it can prevent forgetting to stick the 1st adhesive tape in the case of joining of the tape for wafer processing.

According to the elongated wafer processing tape of the present invention, the second pressure-sensitive adhesive tape is provided on the end side with respect to the outer tangent line of the adhesive layer parallel to the longitudinal direction of the film. Generation of a transfer mark on the adhesive layer caused by the step is suppressed, and it is possible to prevent a defect from occurring during processing of the wafer due to poor adhesion between the adhesive layer and the semiconductor wafer.

(A) is a top view of the tape for wafer processing which concerns on embodiment of this invention, (b) is an AA line end view in (a), (c) is L in (b). FIG. It is a schematic diagram of the conventional wafer processing tape. It is sectional drawing which shows the state by which the tape for wafer processing and the ring frame for dicing were bonded together. (A) is a top view of the conventional wafer processing tape, (b) is an XX line end view in (a). It is a schematic diagram for demonstrating the malfunction of the conventional tape for wafer processing.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. FIG. 1 (a) is a wafer processing tape according to an embodiment of the present invention, and is a wafer processing tape in which a wafer processing tape cut obliquely with respect to the longitudinal direction is joined using an adhesive tape. Plan view, FIG.
) Is a cross-sectional view taken along line AA of the joint portion in FIG. 1A, and FIG. 1C is an enlarged view of the L portion in FIG.

As shown in FIGS. 1A and 1B, a wafer processing tape 10 includes a long film 11, a circular adhesive layer 12 provided on the film 11, an adhesive film 13, and the like. Have The pressure-sensitive adhesive film 13 covers the adhesive layer 12 and adheres to the circular label portion 13 a provided so as to contact the film 11 around the adhesive layer 12 and both end portions in the width direction of the film 11. The peripheral part 13b provided continuously along the longitudinal direction of the film 11 so that the outer periphery of the laminated body of the agent layer 12 and the label part 13a may be enclosed.

As shown in FIG. 1A, the wafer processing tape 10 has a splice formed obliquely with respect to the longitudinal direction of the wafer processing tape 10. The joint is formed as follows. When a plurality of quality defects occur continuously on the label of the laminate composed of the adhesive layer 12 and the label portion 13a, the label on the film 11 is laminated after the leading label in which the quality defect has occurred is peeled off from the film 11. The substantial center of the portion that has been formed is cut obliquely with respect to the longitudinal direction. And after peeling off the last label which produced the quality defect from the film 11 similarly, the approximate center of the part where the label of the film 11 was laminated | stacked is cut | disconnected diagonally with respect to a longitudinal direction. At this time, cutting is performed so that a space corresponding to one label is created by joining the cut portions to each other and joining them. And the cut | disconnected tape 10 for wafer processing joins using the 1st adhesive tape 14a and the 2nd adhesive tape 14b. The first pressure-sensitive adhesive tape 14a extends from the opposite surface (second surface in the claims) of the film 11 provided with the adhesive layer 12 along the cutting portion of the wafer processing tape 10 along the entire cutting line. Affix to film 11 so as to cover. Second adhesive tape 14
b is affixed so that the cutting line on the peripheral part 13b of the adhesive film 13 may be covered. Even in the case where there is only one poor quality label, after peeling the label from the film 11, the center of the portion where the label of the film 11 is laminated is cut obliquely with respect to the longitudinal direction, and the cut portion is joined. Then, when the joint portion is formed, the missing portion of the label may be easily understood.

Here, the 2nd adhesive tape 14b is affixed on the area | region H from the edge part of the film 11 to the outer tangent of the adhesive bond layer 12, as shown to Fig.1 (a).

The adhesive tape 14b is attached to the region H from the end of the film 11 to the adhesive layer 12, so that when the wafer processing tape 10 is wound up in a roll shape, the level difference at the joint is adhesive. Since it does not apply to the layer 12 and no transfer mark is generated on the adhesive layer 12, it is possible to prevent a defect from occurring during processing of the wafer due to poor adhesion between the adhesive layer 12 and the semiconductor wafer. .

Moreover, as shown to Fig.1 (a)-FIG.1 (c), the 2nd adhesive tape 14b stuck on the peripheral part 13b of an adhesive film is formed between the label part 13a and the peripheral part 13b. The film 11 and the label portion 13a are pasted so as not to protrude from the surface of the film 11 that appears after the film 11 is peeled off from the film 11.

As a result, when the wafer processing tape 10 is used, the label portion 13a is peeled off together with the adhesive layer 12, so that the film 11 is subjected to a mold release process. Therefore, when the second adhesive tape 14b pasted on the peripheral portion 13b protrudes from the film 11, the protruding portion is easily peeled off, and the second adhesive tape 14b is peeled off starting from the peeled portion. On the other hand, when the 2nd adhesive tape 14b does not protrude into the film 11, it can prevent that the 2nd adhesive tape 14b peels.

Furthermore, when a coloring process is performed on at least one of the adhesive tapes 14a and 14b,
It can be easily confirmed visually or by a color difference meter that the joint portion bonded to the wafer processing tape 10 using the adhesive tapes 14a and 14b exists. In addition, when only the second adhesive tape 14b pasted on the adhesive film 13 in the peripheral portion 13b has been colored, the second adhesive tape 14b is pasted when the wafer processing tape 10 is joined. Forgetting can be prevented.

The wafer processing tapes cut in the longitudinal direction and the oblique direction of the wafer processing tape 10 are joined to each other using the first adhesive tape 14a and the second adhesive tape 14b. Therefore, the two wafer processing tapes can be aligned easily and accurately by matching the cut surfaces.

However, the cutting line may not be formed obliquely and may be cut perpendicular to the longitudinal direction. Furthermore, in this case, the first adhesive tape 14a and the second adhesive tape 14b may be obtained by folding one adhesive tape from the second surface of the film 11 and attaching it to the peripheral portion 13b. Even when the cutting line is formed obliquely, one adhesive tape can be folded back into the first adhesive tape 14a and the second adhesive tape 14b. In this case, the folded portion of the adhesive tape may be folded so as to protrude from the width of the wafer processing tape so that the folded portion is along the cutting line on the surface on the peripheral portion 13b side, and the protruding portion may be excised later.

Moreover, in this Embodiment, although the cut part was provided in the approximate center of the part on which the label of the film 11 was laminated | stacked, as long as the 2nd adhesive tape 14b is not provided in the inner side exceeding the area | region H. As shown in FIG. 4, it may be cut at a portion other than the portion where the label is laminated to form a joint portion. In this case, the second adhesive tape 14b need not be provided in the entire region H, and may be provided in a part thereof.

In the present embodiment, the second adhesive tape 14b is applied so as not to protrude from the surface of the film 11. However, the second adhesive tape 14b is attached to the film 11 in a region other than the label portion 13a and the peripheral 13b portion of the adhesive film. You may make it stick. In this case as well, the second adhesive tape 14b may be composed of one adhesive tape together with the first adhesive tape 14a as described above.

Hereafter, each component of the tape 10 for wafer processing of this embodiment is demonstrated in detail.
(the film)
As the film 11 used for the wafer processing tape 10 of the present invention, a known film such as a polyethylene terephthalate (PET) type, a polyethylene type, or a film subjected to a release treatment can be used. The thickness of the film is not particularly limited and may be appropriately set, but is preferably 25 to 50 μm.

(Adhesive layer)
As described above, the adhesive layer 12 of the present invention is formed on the first surface 11a of the film 11 and has a circular shape corresponding to the shape of the wafer.

The adhesive layer 12 is attached to the back surface of the chip when the chip is picked up after the semiconductor wafer or the like is bonded and diced, and is used as an adhesive for fixing the chip to the substrate or the lead frame. Is. As the adhesive layer 12, an adhesive including at least one selected from an epoxy resin, an acrylic resin, and a phenol resin can be used. In addition, a polyimide resin or a silicone resin can also be used. The thickness may be appropriately set, but is preferably about 5 to 100 μm.

(Adhesive film)
As described above, the adhesive film 13 of the present invention has the circular label portion 13a corresponding to the shape of the ring frame for dicing, and the peripheral portion 13b surrounding the outside. Such an adhesive film is obtained by pre-cut processing from the film-like adhesive to the circular label portion 13a.
It can be formed by removing the peripheral region.

The adhesive film 13 is not particularly limited, and has a sufficient adhesive force so that the wafer does not peel when dicing the wafer, and can be easily peeled from the adhesive layer when picking up the chip after dicing. Any material that exhibits low adhesive strength may be used. For example, what provided the adhesive layer in the base film can be used conveniently.

The base film of the adhesive film 13 can be used without particular limitation as long as it is a conventionally known base film. However, when a radiation curable material is used as the adhesive layer described later, the radiation transparency is used. It is preferable to use one having

For example, as the material, polyethylene, polypropylene, ethylene-propylene copolymer, polybutene-1, poly-4-methylpentene-1, ethylene-vinyl acetate copolymer, ethylene-ethyl acrylate copolymer, ethylene-acrylic Α-olefin homopolymer or copolymer such as acid methyl copolymer, ethylene-acrylic acid copolymer, ionomer or a mixture thereof, polyurethane, styrene-ethylene-butene or pentene copolymer, polyamide-polyol Listed are thermoplastic elastomers such as copolymers, and mixtures thereof. Further, the base film may be a mixture of two or more materials selected from these groups, or may be a single layer or a multilayer.
The thickness of the base film is not particularly limited and may be set as appropriate.
200 μm is preferred.

The resin used for the pressure-sensitive adhesive layer of the pressure-sensitive adhesive film 13 is not particularly limited, and a known chlorinated polypropylene resin, acrylic resin, polyester resin, polyurethane resin, epoxy resin, or the like used for the pressure-sensitive adhesive is used. can do.

It is preferable to prepare a pressure-sensitive adhesive by appropriately mixing an acrylic pressure-sensitive adhesive, a radiation polymerizable compound, a photopolymerization initiator, a curing agent and the like with the resin of the pressure-sensitive adhesive layer. The thickness of the pressure-sensitive adhesive layer is not particularly limited and may be appropriately set, but is preferably 5 to 30 μm.

A radiation-polymerizable compound can be blended in the pressure-sensitive adhesive layer to facilitate peeling from the adhesive layer by radiation curing. As the radiation polymerizable compound, for example, a low molecular weight compound having at least two photopolymerizable carbon-carbon double bonds in a molecule that can be three-dimensionally reticulated by light irradiation is used.

Specifically, trimethylolpropane triacrylate, pentaerythritol triacrylate, pentaerythritol tetraacrylate, dipentaerythritol monohydroxypentaacrylate, dipentaerythritol hexaacrylate, 1,4-butylene glycol diacrylate, 1,6 hexanediol diacrylate Acrylate, polyethylene glycol diacrylate, oligoester acrylate, and the like are applicable.

In addition to the above acrylate compounds, urethane acrylate oligomers can also be used. The urethane acrylate oligomer includes a polyol compound such as a polyester type or a polyether type, and a polyvalent isocyanate compound (for example, 2, 4
Terminal obtained by reacting tolylene diisocyanate, 2,6-tolylene diisocyanate, 1,3-xylylene diisocyanate, 1,4-xylylene diisocyanate, diphenylmethane 4,4-diisocyanate, etc. An acrylate or methacrylate having a hydroxyl group on an isocyanate urethane prepolymer (for example, 2-hydroxyethyl acrylate, 2-hydroxyethyl methacrylate, 2-hydroxypropyl acrylate, 2-hydroxypropyl methacrylate, polyethylene glycol acrylate, polyethylene glycol methacrylate, etc.) It is obtained by reacting.
The pressure-sensitive adhesive layer may be a mixture of two or more selected from the above resins.

When using a photopolymerization initiator, for example, isopropyl benzoin ether, isobutyl benzoin ether, benzophenone, Michler's ketone, chlorothioxanthone, dodecylthioxanthone, dimethylthioxanthone, diethylthioxanthone, benzyldimethyl ketal, α-hydroxycyclohexyl phenyl ketone, 2-hydroxymethylphenyl Propane or the like can be used. The blending amount of these photopolymerization initiators is preferably 0.01 to 5 parts by mass with respect to 100 parts by mass of the acrylic copolymer.

(Adhesive tape)
As the adhesive tape (the first adhesive tape 14a and the second adhesive tape 14b), for example, an adhesive tape obtained by applying an adhesive to a resin film base material can be suitably used. As the base resin for the adhesive tape, polyethylene terephthalate (PET) and polyester are preferable from the viewpoint of heat resistance, smoothness, and availability. The composition and physical properties of the adhesive of the adhesive tape are not particularly limited, and those that do not peel from the film 11 in the winding process and storage process of the wafer processing tape 10 are preferable.

As described above, according to the long wafer processing tape of the present embodiment, when the cut wafer processing tape is joined using the adhesive tape, the adhesive tape 14b is bonded from the end of the film 11 to the adhesive. Affix to region H up to layer 12. As a result, since there is no occurrence of transfer marks to the adhesive layer caused by the step of the joint, due to poor adhesion between the adhesive layer and the semiconductor wafer,
It is possible to prevent problems from occurring during the processing of the wafer.

10, 20, 40: Wafer processing tapes 11, 11a, 21, 41: Films 12, 22, 32, 42: Adhesive layer 13: Adhesive films 13a, 23a, 33a, 43a: Circular label portions 13b, 23b, 43b : Peripheral portions 14a, 44a ,: first adhesive tapes 14b, 44b: second adhesive tape

Claims (5)

An elongated film, and an adhesive layer having a predetermined planar shape provided on the first surface of the film;
A label portion having a predetermined planar shape that covers the adhesive layer and is in contact with the film around the adhesive layer, and a peripheral portion that surrounds the outer periphery of the label portion It is a long body of a wafer processing tape consisting of an adhesive film having
It has a joint that connects a plurality of wafer processing tapes in the longitudinal direction,
The joint portion is bonded to the second surface opposite to the first surface of the film with a first adhesive tape, and the peripheral portions of the plurality of wafer processing tapes are bonded to each other as a second adhesive. It is formed by pasting together with tape,
The long piece of wafer processing tape, wherein the second pressure-sensitive adhesive tape is provided only on the end side of the outer tangent line of the adhesive layer parallel to the longitudinal direction of the film. The long body of a wafer processing tape according to claim 1, wherein the joint portion is formed obliquely with respect to the longitudinal direction. The said 1st adhesive tape is affixed on the 1st surface of the said film, and the said peripheral part, The tape for wafer processing of any one of Claim 1 or Claim 2 characterized by the above-mentioned. Long body. 3. The wafer processing tape long body according to claim 1, wherein the first adhesive tape is not attached to the first surface of the film. 4. The long body of a tape for wafer processing according to any one of claims 1 to 4, wherein at least one of the first and second adhesive tapes is a colored member.

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