JP2009224628A - Tape for processing wafer - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a tape for processing wafer for clearly identifying the kind of the tape 10 for processing wafer or a dicing/die-bonding tape 50 when the tape for processing wafer having an adhesive layer and an adhesive film is rolled on a mold release film so as to have the shape of a roll. <P>SOLUTION: The tape for processing wafer includes a continuous mold releasing film 11, an adhesive layer 12 provided on the first surface 11a of the mold releasing film 11 so as to have a predetermined plane configuration, a label unit 13a having a predetermined planer configuration and provided so as to cover the adhesive layer 12 and come into contact with the mold releasing film 11 on the circumference of the adhesive layer 12, an adhesive film 13 having a peripheral part 13b which surrounds the outside of the label unit 13a and colored supporting members 14 provided at both terminals in the short-length direction of the continuous mold releasing film 11. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a wafer processing tape, and more particularly to a wafer processing tape having two functions of a dicing tape and a die bonding film.

  Recently, a dicing tape for fixing a semiconductor wafer when the semiconductor wafer is cut and separated into individual chips (dicing) and a semiconductor chip that has been cut are bonded to a lead frame, a package substrate, or the like, or stacked. As a package, a dicing die bonding tape having two functions of a die bonding film (also referred to as a die attach film) for laminating and adhering semiconductor chips has been developed.

  As such a dicing die bonding tape, there is a tape that has been precut in consideration of workability such as attachment to a wafer and attachment to a ring frame during dicing (for example, Patent Documents) 1).

  Examples of the pre-cut processed dicing die bonding tape are shown in FIGS. 4 is a view showing a state where the dicing die bonding tape is wound up in a roll shape, FIG. 5A is a plan view of the dicing die bonding tape, and FIG. 5B is a view showing FIG. It is sectional drawing by line BB of (a). The dicing die bonding tape 50 includes a release film 51, an adhesive layer 52, and an adhesive film 53. The adhesive layer 52 is processed into a circle corresponding to the shape of the wafer, and has a circular label shape. The adhesive film 53 is obtained by removing the peripheral area of the circular portion corresponding to the shape of the ring frame for dicing. As shown in the drawing, the adhesive film 53 includes a circular label portion 53a and a peripheral portion 53b surrounding the outside. Have. The adhesive layer 52 and the circular label portion 53a of the pressure-sensitive adhesive film 53 are laminated with their centers aligned, and the circular label portion 53a of the pressure-sensitive adhesive film 53 covers the adhesive layer 52 and is released from the periphery thereof. It is in contact with the film 51.

When dicing the wafer, the release film 51 is peeled from the laminated adhesive layer 52 and the adhesive film 53, and the back surface of the semiconductor wafer W is pasted on the adhesive layer 52, as shown in FIG. The dicing ring frame R is adhesively fixed to the outer peripheral portion of the circular label portion 53 a of the adhesive film 53. In this state, the semiconductor wafer W is diced, and then the adhesive film 53 is subjected to a curing process such as ultraviolet irradiation to pick up a semiconductor chip. At this time, since the adhesive film 53 has a reduced adhesive force due to the curing process, the adhesive film 53 is easily peeled off from the adhesive layer 52, and the semiconductor chip is picked up with the adhesive layer 52 attached to the back surface. The adhesive layer 52 attached to the back surface of the semiconductor chip then functions as a die bonding film when the semiconductor chip is bonded to a lead frame, a package substrate, or another semiconductor chip.
JP 2007-2173 A

  By the way, the dicing die bonding tape 50 as described above has a problem that it becomes difficult to identify the type of product when it is wound as a product on a roll as shown in FIG. In order to solve this, there is a method of printing the name of the product on the circular label portion 53a, but in order not to affect the dicing process, printing was performed in a range where the adhesive layer 52 of the circular label portion 53a is not present. Since this is preferable, the printable space is limited, and the size and number of characters are limited. For this reason, there is a possibility that an artificial error such as a mistake in the dicing die bonding tape 50 occurs. Further, with this method alone, it is not possible to determine the type of product in a state of being wound in a roll shape and only when viewed from the side of the roll (when viewed from the top and bottom when viewing FIG. 4 on the paper). In order to solve this problem, a method such as changing the color of the roll core (core) for each product type is conceivable. However, the colored core is expensive and leads to an increase in cost, and also has a large inventory of cores. There is a problem that needs to be kept.

  An object of the present invention is to provide a wafer processing tape that can clearly identify the type of tape when a wafer processing tape having an adhesive layer and an adhesive film is wound on a release film in a roll shape. It is to provide.

  The wafer processing tape according to claim 1 of the present invention is a long release film, an adhesive layer having a predetermined planar shape provided on a first surface of the release film, and the adhesive. A pressure-sensitive adhesive having a label portion having a predetermined planar shape provided to cover the layer and in contact with the release film around the adhesive layer, and a peripheral portion surrounding the outside of the label portion A colored support member is provided at both ends in the short direction of the film and the long release film.

  The colored support member may be provided on either the first surface of the release film on which the adhesive layer and the pressure-sensitive adhesive film are provided, or the second surface opposite to the first surface. However, it is preferably provided on the second surface.

The colored support member is provided in a region corresponding to the outside of the adhesive layer provided on the first surface on the second surface of the release film, It is preferable that it is provided continuously along the longitudinal direction and has a thickness equal to or greater than the thickness of the adhesive layer.
The colored support member may have a laminated structure of two or more layers.
As the colored support member, an adhesive tape obtained by applying an adhesive to a polyethylene terephthalate or polyester film base material can be suitably used.

  The colored support member preferably has a different color depending on the type and thickness of the wafer processing tape.

  According to the present invention, the type of the dicing die bonding tape can be clearly identified by providing the colored support members at both ends in the short direction of the release film.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. FIG. 1A is a plan view of a wafer processing tape (dicing die bonding tape) according to an embodiment of the present invention, and FIG. 1B is a cross-sectional view taken along line AA in FIG. is there.

  As shown in FIGS. 1A and 1B, the wafer processing tape 10 includes a long release film 11, an adhesive layer 12, an adhesive film 13, and a colored support member 14. .

  The adhesive layer 12 is provided on the first surface of the release film and has a circular label shape corresponding to the shape of the wafer. The pressure-sensitive adhesive film 13 covers the adhesive layer 12 and has a circular label portion 13a provided so as to come into contact with the release film around the adhesive layer 12, and a periphery surrounding the outside of the circular label portion 13a. Part 13b. The peripheral portion 13b includes a form that completely surrounds the outer side of the circular label portion 13a and a form that is not completely surrounded as illustrated. The circular label portion 13a has a shape corresponding to a ring frame for dicing. The colored support member 14 is a second surface 11b of the release film 11 opposite to the first surface 11a on which the adhesive 12 and the pressure-sensitive adhesive film 13 are provided. It is provided at both ends in the short direction.

  Hereafter, each component of the tape 10 for wafer processing of this embodiment is demonstrated in detail.

(Release film)
As the release film 11 used for the wafer processing tape 10 of the present invention, a polyethylene terephthalate (PET) series, a polyethylene series, or other known films such as a release-processed film can be used.
The thickness of the release film is not particularly limited and may be appropriately set, but is preferably 25 to 50 μm.

(Adhesive layer)
As described above, the adhesive layer 12 of the present invention is formed on the first surface 11a of the release film 11 and has a circular label shape corresponding to the shape of the wafer.

  The adhesive layer 12 is attached to the back surface of the chip when the chip is picked up after the semiconductor wafer or the like is bonded and diced, and is used as an adhesive for fixing the chip to the substrate or the lead frame. Is. As the adhesive layer 12, an adhesive or the like containing at least one selected from an epoxy resin, an acrylic resin, and a phenol resin can be preferably used. In addition, a polyimide resin or a silicone resin can also be used. The thickness may be appropriately set, but is preferably about 5 to 100 μm.

(Adhesive film)
As described above, the adhesive film 13 has the circular label portion 13a corresponding to the shape of the ring frame for dicing, and the peripheral portion 13b surrounding the outside. Such an adhesive film can be formed by removing the peripheral region of the circular label portion 13a from the film-like adhesive by precut processing.

  The adhesive film 13 is not particularly limited, and has a sufficient adhesive force so that the wafer does not peel when dicing the wafer, and can be easily peeled from the adhesive layer when picking up the chip after dicing. Any material that exhibits low adhesive strength may be used. For example, what provided the adhesive layer in the base film can be used conveniently.

  The base film of the adhesive film 13 can be used without particular limitation as long as it is a conventionally known base film. However, when a radiation curable material is used as the adhesive layer described later, the radiation transparency is used. It is preferable to use one having

For example, as the material, polyethylene, polypropylene, ethylene-propylene copolymer, polybutene-1, poly-4-methylpentene-1, ethylene-vinyl acetate copolymer, ethylene-ethyl acrylate copolymer, ethylene-acrylic Α-olefin homopolymer or copolymer such as acid methyl copolymer, ethylene-acrylic acid copolymer, ionomer or a mixture thereof, polyurethane, styrene-ethylene-butene or pentene copolymer, polyamide-polyol Listed are thermoplastic elastomers such as copolymers, and mixtures thereof. Further, the base film may be a mixture of two or more materials selected from these groups, or may be a single layer or a multilayer.
The thickness of the base film is not particularly limited and may be set as appropriate, but is preferably 50 to 200 μm.

The resin used for the pressure-sensitive adhesive layer of the pressure-sensitive adhesive film 13 is not particularly limited, and a known chlorinated polypropylene resin, acrylic resin, polyester resin, polyurethane resin, epoxy resin, or the like used for the pressure-sensitive adhesive is used. can do.
It is preferable to prepare an adhesive by appropriately blending an acrylic adhesive, a radiation polymerizable compound, a photopolymerization initiator, a curing agent and the like into the resin of the adhesive layer 13. The thickness of the pressure-sensitive adhesive layer 13 is not particularly limited and may be appropriately set, but is preferably 5 to 30 μm.

  A radiation-polymerizable compound can be blended in the pressure-sensitive adhesive layer to facilitate peeling from the adhesive layer by radiation curing. As the radiation polymerizable compound, for example, a low molecular weight compound having at least two photopolymerizable carbon-carbon double bonds in a molecule that can be three-dimensionally reticulated by light irradiation is used.

  Specifically, trimethylolpropane triacrylate, pentaerythritol triacrylate, pentaerythritol tetraacrylate, dipentaerythritol monohydroxypentaacrylate, dipentaerythritol hexaacrylate, 1,4-butylene glycol diacrylate, 1,6 hexanediol diacrylate Acrylate, polyethylene glycol diacrylate, oligoester acrylate, and the like are applicable.

In addition to the above acrylate compounds, urethane acrylate oligomers can also be used. The urethane acrylate oligomer includes a polyol compound such as a polyester type or a polyether type, and a polyvalent isocyanate compound (for example, 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate, 1,3-xylylene diene). A terminal isocyanate urethane prepolymer obtained by reacting isocyanate, 1,4-xylylene diisocyanate, diphenylmethane 4,4-diisocyanate, etc.) with an acrylate or methacrylate having a hydroxyl group (for example, 2-hydroxyethyl) Acrylate, 2-hydroxyethyl methacrylate, 2-hydroxypropyl acrylate, 2-hydroxypropyl methacrylate, polyethylene glycol acrylate, polyethylene glycol methacrylate, etc.) Obtained by the reaction.
The pressure-sensitive adhesive layer may be a mixture of two or more selected from the above resins.

  When using a photopolymerization initiator, for example, isopropyl benzoin ether, isobutyl benzoin ether, benzophenone, Michler's ketone, chlorothioxanthone, dodecylthioxanthone, dimethylthioxanthone, diethylthioxanthone, benzyldimethyl ketal, α-hydroxycyclohexyl phenyl ketone, 2-hydroxymethylphenyl Propane or the like can be used. The blending amount of these photopolymerization initiators is preferably 0.01 to 5 parts by mass with respect to 100 parts by mass of the acrylic copolymer.

(Coloring support member)
By providing the colored support members 14 at both lateral ends of the release film 11, the type of tape can be clearly identified when the wafer processing tape 10 is wound into a roll. For example, by changing the color of the colored support member 14 depending on the type and thickness of the wafer processing tape, the type and thickness of the tape can be easily identified, and the occurrence of human error is suppressed and prevented. can do.

The wafer processing tape 10 is wound into a roll with a length requested by the user and shipped, or is wound into a roll with an amount corresponding to the number of dicing / die bonding tapes requested by the user. Although shipped, the length of the product is different from the length of the original film such as the release film 11, the adhesive layer 12, and the pressure-sensitive adhesive film used for the product. May decrease. Yield can be improved by connecting the products, but if the color of the product connected to the connected product is slightly different, see the roll from the side (see Fig. 4 from the top and bottom). The color difference on the side surface may appear prominently, which impairs the appearance of the product, and depending on the user, it may cause a situation where the roll is returned, which is a problem.
With respect to such a problem, by providing the colored support member 14, a subtle color difference on the side surface of the roll can be absorbed by the color of the colored tape, and the appearance can be improved.

  Further, as shown in FIG. 1B, the portion where the adhesive layer 12 and the circular label portion 13 a of the adhesive film 13 are laminated is thicker than the peripheral portion 13 b of the adhesive film 13. For this reason, when the product is wound into a roll, the step between the laminated portion of the adhesive layer 12 and the circular label portion 13a of the adhesive film 13 and the peripheral portion 13b of the adhesive film 13 overlaps, and a flexible adhesive A phenomenon in which a step is transferred to the surface of the layer 12, that is, a transfer mark (also referred to as a label mark, wrinkle, or winding mark) as shown in FIG. 7 occurs. Such transfer marks are particularly noticeable when the adhesive layer 12 is formed of a soft resin, has a thickness, or has a large number of windings of the tape 10. When the transfer mark is generated, there is a risk that a defect may occur during processing of the wafer due to poor adhesion between the adhesive layer and the semiconductor wafer.

  Such a problem can also be achieved by dispersing the winding pressure applied to the tape when the wafer processing tape 10 is wound on a roll or collecting the colored support member 14 on the colored support member 14 by providing the colored support member 14. It is possible to suppress the formation of transfer marks on the adhesive layer 12.

  In the example of FIG. 1, the case where the colored support member 14 is provided on the second surface 11 b side of the release film is shown. However, from the viewpoint of improving the recognizability of the type of tape, the colored support member 14 is released. You may provide in the 1st surface 11a side of a film. In this case, for example, a configuration in which a colored support member is provided on the adhesive film peripheral portion 13b can be employed.

  On the other hand, from the viewpoint of suppressing the generation of transfer marks on the adhesive layer 12 as described above, the colored support member 14 is preferably provided on the second surface 11 b side of the release film 11. This is because when the colored support member 14 is formed on the first surface 11a provided with the adhesive layer 12 and the pressure-sensitive adhesive film 13, the width of the support layer is limited, whereas the release film 11 If the second surface 11b is opposite to the first surface 11a on which the adhesive 12 and the pressure-sensitive adhesive film 13 are provided and is provided at both ends in the short direction of the release film 11, the colored support member 14 This is because a wide width can be secured, so that generation of transfer marks can be more effectively suppressed. Furthermore, by providing the colored support member 14 on the second surface 11b of the release film 11, an effect of increasing the tolerance for the positional shift of the colored support member 14 can be obtained.

  When the colored support member 14 is provided on the second surface 11b side of the release film, the colored support member 14 is an adhesive layer provided on the first surface 11a on the second surface 11b of the release film 11. It is preferable to provide in the area | region R from the edge part of the release film 11 to the adhesive bond layer 12 as shown to Fig.1 (a) on the area | region corresponding to the outer side of 12, ie, the 2nd surface 11b. With such a structure, when the tape 10 is wound, the circular label portion 13a of the adhesive film 13 provided on the first surface 13a of the release film 11 and the second surface 11b of the release film 11 are wound. Since the provided colored support member 14 does not overlap, the colored support member 14 is prevented from being marked on the adhesive layer 12 via the circular label portion 13a of the adhesive film 13.

  The colored support member 14 can be provided intermittently or continuously along the longitudinal direction of the release film 11, but from the viewpoint of more effectively suppressing the generation of transfer marks, the longitudinal direction of the base film 11. It is preferable to provide it continuously along the direction.

  As the thickness of the colored support member 14, a thickness corresponding to a step between the laminated portion of the adhesive layer 12 and the circular label portion 13 a of the adhesive film 13 and the peripheral portion 13 b of the adhesive film 13 on the release film 11. That is, it should just be the same as that of the adhesive bond layer 12, or more. FIG. 2 is a cross-sectional view showing an example of the colored support member 14 ′ thicker than the adhesive agent layer 12.

  When the colored support member has such a thickness, when the tape 10 is wound up, the adhesive film 13 and the second surface 11b of the release film 11 that overlaps the surface of the adhesive film 13 are in contact with each other. Since a space is formed between them, the second surface 11 b of the release film 11 is not strongly pressed against the flexible adhesive layer 12 via the adhesive film 13. Therefore, generation of transfer marks can be more effectively suppressed.

The colored support member 14 preferably has a linear expansion coefficient of 1 × 10 ⁻⁴ / ° C. or less at a room temperature level. When the linear expansion coefficient is larger than 1 × 10 ⁻⁴ / ° C., the temperature is returned to the room temperature at the time of use from the low temperature state (for example, −20 ° C. to 5 ° C.) during heating in the subsequent process or during storage and transportation When the temperature is changed, the dimensional change is increased.

  The colored support member 14 is preferably made of a material having a certain coefficient of friction with respect to the pressure-sensitive adhesive film 13 from the viewpoint of preventing winding deviation of the wafer processing tape 10. Thereby, the winding shift of the wafer processing tape 10 can be prevented, and the effect that high-speed winding and the number of windings can be increased can be obtained.

  As the colored support member 14, for example, an adhesive tape obtained by applying an adhesive to a colored resin film substrate can be suitably used. Such an adhesive tape is placed at predetermined positions on both ends of the second surface 11b of the release film 11 or at predetermined positions on the adhesive film peripheral portion 13b on the first surface 11a of the release film. By sticking, the wafer processing tape 10 of this embodiment can be formed. Only one layer of the adhesive tape may be attached, or a thin tape may be laminated as shown in FIG.

The colored base resin of the adhesive tape is not particularly limited as long as it has a certain coefficient of friction with respect to the pressure-sensitive adhesive film 13 as described above and can withstand the winding pressure. From the viewpoint of smoothness and availability, polyethylene terephthalate (PET) and polyester are preferred.
There is no limitation in particular about the composition and physical property of the adhesive of an adhesive tape, and what is necessary is just what does not peel from the release film 11 in the winding-up process and storage process of the tape 10. FIG.

(A) is a top view of the tape for wafer processing which concerns on embodiment of this invention, (b) is sectional drawing by line AA of (a). It is sectional drawing of the tape for wafer processing which concerns on other embodiment of this invention. It is sectional drawing of the tape for wafer processing which concerns on further another embodiment of this invention. It is a perspective view of the conventional wafer processing tape. (A) is a top view of the conventional tape for wafer processing, (b) is sectional drawing by line BB of (a). It is sectional drawing which shows the state by which the tape for wafer processing and the ring frame for dicing were bonded together. It is a schematic diagram for demonstrating the malfunction of the conventional tape for wafer processing.

Explanation of symbols

10: Wafer processing tape 11: Release film 12: Adhesive layer 13: Adhesive film 13a: Circular label part 13b: Peripheral parts 14, 14 ', 14 ": Colored support member

Claims (9)

A long release film,
An adhesive layer having a predetermined planar shape provided on the first surface of the release film;
A label portion having a predetermined planar shape so as to cover the adhesive layer and contact the release film around the adhesive layer; and a peripheral portion surrounding the outside of the label portion; An adhesive film having
A wafer processing tape, comprising: colored support members provided at both ends in the short direction of the long release film.   The said coloring support member is provided in the 2nd surface opposite to the 1st surface in which the said adhesive bond layer and the adhesion film of the said release film were provided. Wafer processing tape.   The colored support member is provided in a region corresponding to the outside of the adhesive layer provided on the first surface, on the second surface of the release film. 2. The wafer processing tape according to 2.   4. The wafer processing tape according to claim 1, wherein the colored support member is continuously provided along a longitudinal direction of the release film. 5.   5. The wafer processing tape according to claim 1, wherein the colored support member has a thickness equal to or greater than a thickness of the adhesive layer. 6.   The tape for wafer processing according to any one of claims 1 to 5, wherein the colored support member has a laminated structure of two or more layers.   The wafer processing according to any one of claims 1 to 6, wherein the colored support member is an adhesive tape obtained by applying an adhesive to a polyethylene terephthalate or polyester film base material. Tape.   8. The wafer processing tape according to claim 1, wherein the colored support member has a different color depending on a type of the wafer processing tape. 9.   9. The wafer processing tape according to claim 1, wherein the colored support member has a different color depending on a thickness of the wafer processing tape. 10.

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