JP2012082285A - Adhesive sheet - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an adhesive sheet, which is capable of sufficiently suppressing generation of transfer to a film adhesive when the adhesive sheet having the film adhesive formed in a predetermined planar shape by pre-cut processing is rolled up into a roll and is also capable of sufficiently suppressing void generation due to air inclusion when adhering a sheet-like adhesive to a semiconductor wafer.SOLUTION: The adhesive sheet includes: a support member 600; a releasable substrate 210; an adhesive layer 240 which is distributed in the longitudinal direction on the releasable substrate; and a pressure sensitive adhesive film 220 which covers the adhesive layer and is formed so as to contact the releasable substrate around the adhesive layer. The adhesive sheet has a roll form obtained by rolling the adhesive sheet which has been processed into a predetermined shape by pre-cut processing or blanking. The support member is provided by folding both ends in the lateral direction of the releasable substrate.

Description

  The present invention relates to an adhesive sheet.

  In recent years, as a semiconductor element and a supporting member for mounting the semiconductor element, a dicing tape that is used for fixing a semiconductor wafer into individual pieces, and a film shape for bonding the semiconductor element to a lead frame or an organic substrate A dicing die bonding material combined with an adhesive has been developed. Conventionally, silver paste is mainly used as an adhesive for semiconductors. However, with the recent miniaturization and high performance of semiconductor elements, the support members used are required to be small and fine. In response to these requirements, silver paste causes problems during wire bonding due to protrusions and inclination of semiconductor elements, difficulty in controlling the thickness of the adhesive layer made of silver paste, and generation of voids in the adhesive layer. As a result, it has become impossible to meet the above requirements.

  Some of these dicing die bonding materials have been pre-cut for easy attachment to a wafer and wafer ring. The film adhesive is cut into an arbitrary size by cutting or punching in a state of being wound in a roll (reel) to obtain individual pieces of the film adhesive. This piece is attached to a support member for mounting a semiconductor element to obtain a support member with a film adhesive. Then, the semiconductor element separated by the dicing process is joined (die-bonded) to the support member with a film adhesive to produce a support member with a semiconductor element. Furthermore, a semiconductor device is manufactured through a wire bonding process, a sealing process, and the like as necessary.

  A conventional dicing die bonding material subjected to pre-cutting has, for example, the structure shown in FIGS. The dicing die bonding material 100 has a structure in which an adhesive film is laminated on an upper portion of a peeling substrate 110 so as to surround a film adhesive 140, an adhesive film 120, and an outer peripheral portion thereof.

  When such pre-cut processing is performed, the adhesive sheet is generally pre-cut in a film adhesive so that the adhesive layer matches the shape of the wafer, and is bonded to the dicing tape, and then the wafer ring is attached to the dicing tape. It is produced by applying a pre-cut process according to the shape, or pasting a dicing tape pre-cut into a wafer ring shape with a pre-cut film adhesive.

JP 7-45557 A Japanese Utility Model Publication No. 6-18383 JP 2007-2173 A

  The dicing die bonding material 100 as described above has a structure in which a film-like adhesive 140 and an adhesive film 120 are laminated as shown in FIGS. 1 and 2, and each part has a different thickness. Have. For this reason, as shown in FIG. 5, when wound as a product in a roll shape (reel shape), the film adhesive 140, the adhesive film 120 and the laminated portion 130 of the adhesive film around it, or each part , A phenomenon in which the level difference is transferred to the surface or back surface of the flexible film-like adhesive 140 located at the upper part or the lower part thereof, that is, transfer as shown in FIG. 6 (also referred to as label marks, wrinkles, or winding marks). ) Occurs. Such transfer is particularly noticeable when the film-like adhesive is formed of a soft resin or has a thickness, and when the number of windings of the tape is large or when the tape is wound around the core. It is a phenomenon that occurs. Then, the transfer causes a bonding failure as shown in FIG. 7 between the film adhesive and the semiconductor wafer, and there is a possibility that a defect occurs during the wafer processing.

  In order to suppress the above transfer, it is conceivable to weaken the winding force of the tape. However, this method causes a product winding deviation, which makes it difficult to set the tape on the tape mounter and hinders actual use of the tape. May come.

  Further, in Patent Document 1, in order to suppress the occurrence of the transfer as described above, the film-like adhesive on the peeling substrate is continuously applied in the longitudinal direction to both ends of the back surface of the adhesive film in the short direction, or A technique is adopted in which a support layer is provided intermittently to disperse the winding stress. In addition, Patent Document 2 reports a method of adhering a support member to both ends in the short direction of the surface opposite to the peeling surface of the peeling substrate so as not to contact the film adhesive. In addition to requiring a member, there is a problem that the product price is high because secondary processing is involved. In addition, the adhesive film is used to bond the support member and the release substrate in the environment where the adhesive film is returned to the operating temperature from the low temperature state during storage and transportation, or in an environment where the adhesive film is exposed to a high temperature by being attached to the wafer. When the linear expansion coefficients of the support member are different, there is a concern that peeling or the like may occur due to a difference in dimensional change of each material.

  The present invention has been made in view of the above-described problems of the prior art, and in the case where an adhesive sheet having a film-like adhesive formed into a predetermined planar shape by pre-cut processing is wound into a roll, An object of the present invention is to provide an adhesive sheet capable of sufficiently suppressing occurrence of transfer in an adhesive and sufficiently suppressing generation of voids due to air entrainment when a semiconductor wafer and a sheet-like adhesive are attached. And

The present invention is as follows.
(1) A supporting member, a release substrate, an adhesive layer dispersed in the longitudinal direction on the release substrate, and the release group covering the adhesive layer and surrounding the adhesive layer An adhesive sheet having a pressure-sensitive adhesive film formed in contact with the material, the adhesive sheet processed by pre-cutting or punching into a predetermined shape in a roll shape, and the support member is a release group An adhesive sheet, which is provided by bending both ends of a material in a short direction.
(2) The adhesive sheet according to (1), wherein both ends of the release base material are bent on the surface side having no adhesive layer in the support member.
(3) The adhesive sheet according to (1) or (2), wherein the support member is continuously provided in the longitudinal direction of the release substrate.

  According to the present invention, when an adhesive sheet having an adhesive layer formed in a predetermined planar shape by pre-cut processing or the like is wound up in a roll shape, it is sufficiently suppressed that the trace is transferred to the adhesive layer. And the adhesive sheet which can fully suppress generation | occurrence | production of the void by entrainment of air when sticking an adhesive bond layer to a to-be-adhered body can be provided.

It is a top view which shows the dicing die-bonding material by which the conventional precut was given. It is sectional drawing at the time of cut | disconnecting along the AA of FIG. 1 which shows the dicing die-bonding material in which the conventional precut was given. It is a schematic diagram which shows embodiment of the adhesive sheet of this invention, (a) is a top view which shows 1st Embodiment of the adhesive sheet of this invention, (b) is 2nd of the adhesive sheet of this invention. It is a top view which shows embodiment, (c) is a top view which shows 3rd Embodiment of the adhesive sheet of this invention. It is a schematic diagram which shows embodiment of the adhesive sheet of this invention, (a) is a schematic end view which shows 1st Embodiment of the adhesive sheet of this invention, (b) is the 1st of the adhesive sheet of this invention. It is a schematic end view which shows 2 embodiment, (c) is a schematic end view which shows 3rd Embodiment of the adhesive sheet of this invention. It is a schematic diagram which shows the dicing die bonding material wound by roll shape (reel shape). It is a schematic diagram which shows the transcription | transfer (it is also called a label trace, a wrinkle, or a winding trace) generate | occur | produced on the dicing die bonding material. It is a schematic diagram which shows the adhesion defect generate | occur | produced between the film adhesive and the semiconductor wafer. It is a schematic diagram which shows the supporting member of the adhesive sheet of this invention. It is a series of process diagrams showing a method for manufacturing an adhesive sheet of the present invention. It is a schematic diagram which shows the adhesive sheet of a shape which does not have a supporting member, (a) is a top view, (b) is an end elevation at the time of cut | disconnecting along a dd line.

The adhesive sheet of the present invention covers a support member, a release substrate, an adhesive layer dispersed in the length direction on the release substrate, and covers the adhesive layer and is in contact with the release substrate. It is an adhesive sheet having an adhesive film formed as described above. Further, the adhesive sheet processed by pre-cutting or punching into a predetermined shape is wound into a roll shape, and the support member is preferably continuous or intermittent at both ends in the short direction of the peeling substrate. Is provided. The support member is provided by bending both ends of the peeling substrate in the short direction.
Moreover, it is preferable that a support member and a peeling base material are the same materials. When providing the support member, it is possible to mechanically bend the release substrate, but when pre-cutting or punching the film adhesive or adhesive film, a process such as cutting a predetermined bent portion is performed. By applying, the dimensional accuracy of the support member can be improved. The adhesive layer is also referred to as a film adhesive. The amount of cut into the release substrate at this time is not particularly limited, but the amount of cut when using a release substrate of 25 to 50 μm is preferably 3 to 30 μm, more preferably 5 to 5 μm. It is 20 μm, particularly preferably 7 to 15 μm. When the depth of cut into the release substrate is less than 3 μm, the accuracy of bending of the support member tends to be low, and when the depth of cut exceeds 30 μm, the release substrate may be torn during bending. is there.

  As the release substrate, for example, polyethylene terephthalate, polyethylene, polypropylene, polyimide, and other films subjected to a release treatment can be used. The thickness of the release substrate is not particularly limited and may be appropriately set, but is preferably 25 to 50 μm.

Moreover, as for the supporting member of the adhesive sheet of this invention, the both ends of a peeling base material are bend | folded to the surface side which does not have a film adhesive, and a peeling base material and a supporting member are comprised with the same material. preferable.
The length for bending the support member is not particularly limited, but if the bending length is short, a sufficient transfer preventing effect cannot be obtained, and if the length is too long, the support member covers the film adhesive. Transfer occurs due to covering. From this, the bending length of the support member is not particularly limited. For example, when the dimension of the adhesive sheet is FIG. 8, it is preferably 5 to 45 mm, more preferably 10 to 40 mm, and particularly preferably 36. ~ 40 mm.
When the bending length of the support member is less than 5 mm, it is difficult to process and a sufficient transfer prevention effect cannot be obtained. Further, when the thickness is more than 45 mm, the film-like adhesive is transferred because it overlaps with the wafer attaching position. Therefore, when attached to the wafer, a void may be generated due to air entrainment.

  Moreover, about the thickness of a supporting member, when the dimension of an adhesive sheet is FIG. 8, for example, when the bending amount of a supporting member is 5 to 10 mm, the thickness equal to or more than the total thickness of the film adhesive 240 and the adhesive film 220 It is preferable to have a thickness equal to or greater than that of the film adhesive 240 when the bending amount of the support member is 11 to 35 mm. When the bending amount of the support member is 36 to 40 mm, the thickness of the support member Although there is no restriction | limiting, 25-50 micrometers is preferable.

  Moreover, it is preferable that the supporting member of the adhesive sheet of this invention is continuously provided in the longitudinal direction at the both ends of the peeling base material of the transversal direction. The support member can be provided intermittently, but it is preferable to provide the support member continuously because a higher effect can be obtained.

  Moreover, the adhesive sheet of this invention WHEREIN: It is preferable that the said adhesive bond layer contains a thermoplastic resin and a thermopolymerizable component.

  Thus, the semiconductor element can be sufficiently fixed to the semiconductor element mounting support member or another semiconductor element via the film adhesive.

  Here, the thermoplastic resin is preferably a high molecular weight component having a functional monomer and a weight average molecular weight of 100,000 or more. Thereby, it can be set as the adhesive sheet which maintains a film shape in the working environment in semiconductor device manufacture, and is easy to handle. In addition, by using a high molecular weight component having a weight average molecular weight of 100,000 or more, the hardness of the adhesive layer at room temperature (25 ° C.) can be increased, and the adhesive is applied by the pressure when the adhesive sheet is wound up. It is possible to prevent the winding marks from being transferred to the layer. Furthermore, even when the transfer of the winding mark occurs in the adhesive layer for some reason, the use of the above thermoplastic resin makes it easy to deform due to heat when the adhesive layer is attached to the semiconductor wafer. Can be reduced.

  The high molecular weight component is preferably an epoxy group-containing (meth) acrylic acid ester copolymer. As a result, the semiconductor element can be sufficiently fixed to the supporting member for mounting the semiconductor element or another semiconductor element through the adhesive layer in the process of manufacturing the semiconductor device, thereby reducing manufacturing problems. can do.

  Moreover, it is preferable that the said thermopolymerizable component contains an epoxy resin and an epoxy resin hardening | curing agent. Accordingly, after the semiconductor device is manufactured through the adhesive layer, the semiconductor element can be sufficiently fixed to the semiconductor element mounting support member or another semiconductor element, and the semiconductor device can be used in an environment where the semiconductor device is used. Damage or failure of the device can be prevented.

  In the adhesive sheet of the present invention, the adhesive layer has a storage elastic modulus before curing at 25 ° C. of 10 to 10,000 MPa, and a storage elastic modulus after curing at 260 ° C. of 0.5 to 30 MPa. It is preferable that

  Here, the storage elastic modulus in this invention can be calculated | required by the tension test by a forced vibration non-resonance method.

  In the adhesive sheet of the present invention, the adhesive layer has a storage elastic modulus in the above range, so that the stress between the semiconductor element and the supporting member for mounting the semiconductor element is relieved, and sufficient adhesive force is obtained in a wide temperature range. It can be secured. As a result, the semiconductor device can be prevented from being damaged or broken during the manufacturing process of the semiconductor device or in an environment where the semiconductor device is used.

  Furthermore, the adhesive sheet of the present invention preferably has a characteristic that the adhesive force between the adhesive layer and the adhesive film is reduced by irradiation with high energy rays, but is not limited thereto. A pressure sensitive adhesive sheet can also be used.

  Moreover, as a method for manufacturing the adhesive sheet of the present invention, for example, a first lamination step of laminating the adhesive layer on the release substrate, and the release substrate from the surface of the adhesive layer, for example. The first cutting step in which a predetermined planar shape adhesive layer is intermittently disposed, and the predetermined planar shape adhesive layer and the release substrate are covered so as to cover the release substrate. A second laminating step for laminating the pressure-sensitive adhesive film, and cutting from the pressure-sensitive adhesive film surface until reaching the release substrate, covering the adhesive layer having the predetermined planar shape, and surrounding the adhesive layer The above-mentioned pressure-sensitive adhesive film in contact with the release substrate, and a support that is continuously or intermittently arranged by making a cut to bend using the release substrate layer as a support member, or after being bent with respect to the surface that does not have the pressure-sensitive adhesive film Parts A second cutting step of forming, and the like manufacturing method comprising the.

  According to these methods for producing an adhesive sheet, the adhesive according to the present invention can sufficiently suppress the transfer of the trace of the other adhesive layer to the adhesive layer when wound into a roll. A sheet can be manufactured efficiently.

  Moreover, in the adhesive sheet of the present invention, the laminate comprising the adhesive layer and the pressure-sensitive adhesive film is peeled off from the release substrate, and the laminate is attached to a semiconductor wafer from the surface on the adhesive layer side. Bonding step for obtaining a semiconductor wafer with a laminate, and dicing the semiconductor wafer with a laminate to the interface between the adhesive layer and the adhesive film, and cutting the semiconductor wafer into semiconductor elements of a predetermined size And, if necessary, reducing the adhesive force of the adhesive film to the adhesive layer by irradiating the laminate with high energy rays, and then picking up the semiconductor element from the adhesive film together with the adhesive layer. Picking up the semiconductor element with the adhesive layer, and the semiconductor element in the semiconductor element with the adhesive layer through the adhesive layer Te may be a semiconductor adhesive sheet that can be used in adhering step of adhering to the adherend.

  According to such a manufacturing method, since the adhesive sheet of the present invention is used in the manufacturing process, it is possible to sufficiently suppress the occurrence of voids due to the entrainment of air when the adhesive layer is attached to the semiconductor wafer, A semiconductor device can be manufactured efficiently.

(Adhesive sheet)
Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the drawings. The positional relationship such as up, down, left and right is based on the positional relationship shown in the drawings unless otherwise specified. Further, the dimensional ratios in the drawings are not limited to the illustrated ratios.

3 and 4 are a plan view and an end view of the adhesive sheets (dicing die bonding material) 200, 300, and 400, respectively. The adhesive sheets (dicing die bonding material) 200, 300, and 400 have both ends of the peeling substrate 210 folded, and a film adhesive 240 and an adhesive film 220 are laminated on the peeling substrate 210. Have a structure. The film adhesive 240 has a circular shape in consideration of adhesion with the wafer. Moreover, since the adhesive film 220 corresponds to the shape of the wafer ring frame, the peripheral portion thereof is removed and has a circular shape.
3 and 4 are schematic views showing first to third embodiments of the adhesive sheet of the present invention, respectively. Here, Fig.3 (a) is a top view which shows 1st Embodiment of the adhesive sheet of this invention, Fig.4 (a) shows the adhesive sheet 200 shown to Fig.3 (a) in Fig.3 (a). It is a model end elevation at the time of cut | disconnecting along line aa. FIG. 3B is a plan view showing a second embodiment of the adhesive sheet of the present invention, and FIG. 4B shows the adhesive sheet 300 shown in FIG. It is a model end view at the time of cut | disconnecting along b line. FIG. 3C is a plan view showing a third embodiment of the adhesive sheet of the present invention, and FIG. 4C shows the adhesive sheet 400 shown in FIG. It is a model end elevation at the time of cut | disconnecting along c line | wire.

  3-4, the adhesive sheet has the structure by which the laminated body which consists of the adhesive bond layer 240 and the adhesion film 220 was formed on the elongate peeling base material 210. As shown in FIG. The adhesive layer 240 has a predetermined planar shape and is partially laminated on the release substrate 210, and the adhesive film 220 covers the adhesive layer 240 and is in contact with the release substrate 210. Are stacked. Each laminate is provided with a support member. In FIG. 4A, the support member is not limited in the film thickness of the peeling substrate. 4B, it is preferable to have a thickness equal to or greater than that of the film adhesive 240, and in FIG. 4C, the thickness is equal to or greater than the total thickness of the film adhesive 240 and the adhesive film 220. It is preferable. When the support member is applied to the wafer attachment position on the film adhesive 240, transfer occurs, and a void may be generated between the film adhesive 240 and the wafer, which may cause a problem.

Hereinafter, each component of the adhesive sheet of the present invention will be described in detail.
The support member is provided by bending the release substrate, and is bent to the back surface of the laminate. Furthermore, when the length of the support member is less than 5 mm, transfer is generated because a sufficient stress relaxation effect cannot be obtained. Further, in the case of FIG. 8, if it is 46 mm or more, since it is applied to the wafer attaching position on the film adhesive, the transfer of the support member occurs, and there is a possibility that a defect due to the void occurs.

  For example, in the case of FIG. 8, the dimension of the support member is preferably 5 mm to 10 mm, and preferably has a thickness equal to or greater than the total thickness of the film adhesive 240 and the adhesive film 220. When the folding amount is 11 to 35 mm, the thickness is preferably equal to or greater than that of the film adhesive 240. When the bending amount of the support member is 36 to 45 mm, the thickness of the support member is not limited, but is 25 to 50 mm. preferable. Therefore, if the bending length of the support member is 5 mm or more, it is not particularly specified, but it is necessary not to be applied to the wafer attaching position on the film adhesive.

  Moreover, the support member of the adhesive sheet of the present invention is characterized in that it is continuously provided in the longitudinal direction at both ends of the peeling substrate in the short direction. The support member can be provided intermittently, but it is preferable to provide the support member continuously because a higher effect can be obtained.

  In the adhesive sheet of the present invention, from the viewpoint of reducing the influence of the step at the end of the laminate, these support members have the thickness of the release substrate according to the bending length of the support member as described above. And having the same material as the peeling substrate.

In the adhesive sheet of the present invention, the laminated state of the film-like adhesive and the pressure-sensitive adhesive film may be a structure in which the respective layers are laminated so as to have the same size, but the relationship between the size of the wafer ring and the semiconductor element In addition, it is preferable that 50% or more, preferably 70% or more, more preferably 90% or more of the outer peripheral portion of the adhesive film 220 is outside the outer periphery of the film adhesive. The part preferably has a shape in which the peeling substrate 210 and the adhesive film 220 are provided in this order. Furthermore, in the adhesive sheet of the present invention, the laminated state of the film-like adhesive 240 and the pressure-sensitive adhesive film 220 is such that the pressure-sensitive adhesive film 220 covers the film-like adhesive 240 and the release substrate 210 around the film-like adhesive 240. It is preferable to be formed so as to be in contact with. That is, the area of the planar shape of the pressure-sensitive adhesive film 220 is larger than the area of the planar shape of the film-like adhesive 240, and the film-like adhesive 240 is wrapped. It is preferable that the film 220 is in direct contact. Note that the film adhesive 240 may have a protruding portion on a part of the outer periphery as a peeling start point, and the protruding portion may not be covered with the adhesive film 220.
About a support member, it is the same material as the peeling base material 210 normally, and it bends in the back surface direction of a laminated body. At this time, the bending method is not particularly defined, but it is preferably sufficiently bent by a metal or rubber-like roller, but is not limited thereto, and is provided intermittently or continuously. However, it is preferably provided continuously in order to obtain a sufficient effect.

  The shape of the film adhesive 240 is not particularly limited as long as it is a shape capable of attaching a semiconductor wafer. For example, the planar shape is a circle or a wafer shape (a shape in which a part of the outer circumference of the circle is a straight line). , Quadrangle, pentagon, hexagon, octagon and the like. In the film-like adhesive 240, since portions other than the portion to which the semiconductor wafer is attached are wasted, the film-like adhesive is used when attaching to a general semiconductor wafer having a circular planar shape from the viewpoint of the manufacturing process. The agent 240 preferably has a circular planar shape or a planar shape (semiconductor wafer shape) that matches the planar shape of the semiconductor wafer. Further, in order to make a part of the outer periphery of the film adhesive 240 be in the vicinity of a part of the outer periphery of the pressure-sensitive adhesive film 220, a part of the outer periphery may have a convex portion.

  The shape of the adhesive film 220 is not particularly limited as long as it can be brought into close contact with the wafer ring. For example, the planar shape may be a circle, a rectangle, a pentagon, a hexagon, an octagon, a rhombus, a star, or the like. Is mentioned. In consideration of the current shape of the wafer ring and the shape of the semiconductor element, the planar shape of the adhesive film 220 is preferably a circular shape or a shape that conforms to a circular shape. Furthermore, in consideration of pasting with a semiconductor element, a planar shape similar to the planar shape of the film adhesive 240 is preferable.

  The film adhesive 240 is not particularly limited, and is constituted by, for example, a thermosetting adhesive, a photocurable adhesive, a thermoplastic adhesive, an oxygen reactive adhesive, or the like. These can be used singly or in combination of two or more, but considering that they are used as an adhesive for fixing semiconductor elements, the film adhesive 240 is composed of a thermosetting adhesive. It is preferable.

  The thermosetting adhesive is not particularly limited as long as it is cured by heat, and has a functional group such as a glycidyl group, an acryloyl group, a methacryloyl group, a hydroxyl group, a carboxyl group, an isocyanurate group, an amino group or an amide group. The thing containing a thermopolymerizable component is mentioned. These can be used singly or in combination of two or more types, and in consideration of heat resistance as an adhesive sheet and adhesive force due to thermosetting, the above-mentioned thermopolymerizable component and thermoplastic resin are contained. It is preferable to use a thermosetting adhesive.

  Here, the thermoplastic resin is not particularly limited as long as it is a thermoplastic resin, or at least a resin that has thermoplasticity in an uncured state and forms a crosslinked structure after heating. However, (A) Tg (glass transition (Temperature) is 10 to 100 ° C. and the weight average molecular weight is 5000 to 200000, or (B) Tg is −50 ° C. to 10 ° C. and the weight average molecular weight is 100,000 or more, Is preferred.

  As the former thermoplastic resin (A), for example, polyimide resin, polyamide resin, polyetherimide resin, polyamideimide resin, polyester resin, polyesterimide resin, phenoxy resin, polysulfone resin, polyethersulfone resin, polyphenylene sulfide resin, Examples include polyether ketone resins. Among these, it is preferable to use a polyimide resin.

  As the latter thermoplastic resin (B), it is preferable to use a polymer containing a functional monomer. The functional group of the functional monomer of this polymer is glycidyl group, acryloyl group, methacryloyl group, hydroxyl group, carboxyl group. , An isocyanurate group, an amino group, an amide group, etc. Among them, a glycidyl group is preferable. More specifically, a glycidyl group-containing (meth) acrylic copolymer containing a functional group monomer such as glycidyl acrylate or glycidyl methacrylate is preferable, and is more preferably incompatible with a thermosetting resin such as an epoxy resin. .

  Examples of the high molecular weight component having a weight average molecular weight of 100,000 or more including the functional monomer include a glycidyl group containing a functional monomer such as glycidyl acrylate or glycidyl methacrylate and having a weight average molecular weight of 100,000 or more. Examples include (meth) acrylic copolymers, and among them, those that are incompatible with the epoxy resin are preferable. Specific examples of the glycidyl group-containing (meth) acrylic copolymer include HTR-860P-3 (trade name) manufactured by Nagase ChemteX Corporation.

  As the glycidyl group-containing (meth) acrylic copolymer, for example, (meth) acrylic ester copolymer, acrylic rubber and the like can be used, and acrylic rubber is more preferable. The acrylic rubber is a rubber mainly composed of an acrylate ester and mainly composed of a copolymer such as butyl acrylate and acrylonitrile, a copolymer such as ethyl acrylate and acrylonitrile, or the like.

  The amount of the epoxy resin-containing monomer unit such as glycidyl acrylate or glycidyl methacrylate in the glycidyl group-containing (meth) acrylic copolymer is preferably 0.5 to 6.0% by mass based on the total amount of the monomers, 0.5 -5.0 mass% is more preferable, and 0.8-5.0 mass% is especially preferable. When the amount of the glycidyl group-containing monomer unit is within this range, sufficient adhesive force can be ensured and gelation can be prevented.

  Examples of the functional monomer other than glycidyl acrylate and glycidyl methacrylate include ethyl (meth) acrylate and butyl (meth) acrylate, and these can be used alone or in combination of two or more. In the present invention, ethyl (meth) acrylate refers to both ethyl acrylate and ethyl methacrylate. In the case of using a combination of functional monomers, the mixing ratio is determined in consideration of Tg of the glycidyl group-containing (meth) acrylic copolymer, and it is preferable that Tg is −10 ° C. or higher. When Tg is −10 ° C. or higher, the tackiness of the adhesive layer in the B-stage state is appropriate, and the handleability tends to be good.

  When the above monomer is polymerized to produce a high molecular weight component having a functional monomer-containing weight average molecular weight of 100,000 or more, the polymerization method is not particularly limited, and examples thereof include methods such as pearl polymerization and solution polymerization. Can be used.

  The weight average molecular weight of the high molecular weight component containing the functional monomer is 100,000 or more, preferably 300,000 to 3,000,000, and more preferably 500,000 to 2,000,000. When the weight average molecular weight is within this range, the strength, flexibility, and tackiness of a sheet or film are appropriate, and the flowability is appropriate, so the circuit fillability of wiring is ensured. Tend to be. In the present invention, the weight average molecular weight means a value measured by gel permeation chromatography and converted using a standard polystyrene calibration curve.

  Moreover, the usage-amount of the high molecular weight component whose weight average molecular weight containing a functional monomer is 100,000 or more has preferable 10-400 mass parts with respect to 100 mass parts of thermopolymerizable components. When it is in this range, storage elastic modulus and flowability during molding can be ensured, and handling properties at high temperatures tend to be good. Moreover, 15-350 mass parts is more preferable, and 20-300 mass parts is especially preferable with respect to 100 mass parts of thermopolymerizable components.

  The thermopolymerizable component is not particularly limited as long as it is polymerized by heat. For example, functional groups such as glycidyl group, acryloyl group, methacryloyl group, hydroxyl group, carboxyl group, isocyanurate group, amino group, amide group, etc. These compounds can be used alone or in combination of two or more, but considering the heat resistance as an adhesive sheet, they are cured by heat and have an adhesive action. It is preferable to use a resin. Examples of the thermosetting resin include an epoxy resin, an acrylic resin, a silicone resin, a phenol resin, a thermosetting polyimide resin, a polyurethane resin, a melamine resin, and a urea resin, and in particular, heat resistance, workability, and reliability. It is most preferable to use an epoxy resin in terms of obtaining a die bond dicing sheet that is excellent in resistance. When using an epoxy resin as the thermosetting resin, it is preferable to use an epoxy resin curing agent together.

  The epoxy resin is not particularly limited as long as it is cured and has an adhesive action. For example, a bifunctional epoxy resin such as a bisphenol A type epoxy resin, a novolak such as a phenol novolac type epoxy resin or a cresol novolac type epoxy resin. A type epoxy resin or the like can be used. Moreover, what is generally known, such as a polyfunctional epoxy resin, a glycidyl amine type epoxy resin, a heterocyclic ring-containing epoxy resin, or an alicyclic epoxy resin, can be used. These can be used alone or in combination of two or more.

  As the above-mentioned epoxy resin, for example, as bisphenol A type epoxy resin, Epicoat series manufactured by Japan Epoxy Resin Co., Ltd. (Epicoat 807, Epicoat 815, Epicoat 825, Epicoat 827, Epicoat 828, Epicoat 834, Epicoat 1001, Epicoat 1004, Epicoat 1004) 1007, Epicoat 1009), DER-330, DER-301, DER-361 manufactured by Dow Chemical Company, YD8125, YDF8170 manufactured by Tohto Kasei Co., Ltd., and the like. Examples of the phenol novolac type epoxy resin include Epicoat 152 and Epicoat 154 manufactured by Japan Epoxy Resin Co., Ltd., EPPN-201 manufactured by Nippon Kayaku Co., Ltd., DEN-438 manufactured by Dow Chemical Company, and the like. Furthermore, as an o-cresol novolak type epoxy resin, Nippon Kayaku Co., Ltd. EOCN-102S, EOCN-103S, EOCN-104S, EOCN-1012, EOCN-1025, EOCN-1027, YDCN701 made by Tohto Kasei Co., Ltd. , YDCN702, YDCN703, and YDCN704.

  As the polyfunctional epoxy resin, Epon 1031S manufactured by Japan Epoxy Resin Co., Ltd., Araldite 0163 manufactured by Ciba Specialty Chemicals Co., Ltd., Denacol EX-611, EX-614, EX-614B, EX-622 manufactured by Nagase ChemteX Corporation. , EX-512, EX-521, EX-421, EX-411, EX-321, and the like.

  As an amine type epoxy resin, Epicoat 604 manufactured by Japan Epoxy Resin Co., Ltd., YH-434 manufactured by Toto Kasei Co., Ltd., TETRAD-X and TETRAD-C manufactured by Mitsubishi Gas Chemical Co., Ltd., ELM- manufactured by Sumitomo Chemical Co., Ltd. 120 etc. are mentioned. Examples of the heterocyclic ring-containing epoxy resin include Araldite PT810 manufactured by Ciba Specialty Chemicals, ERL4234, ERL4299, ERL4221, and ERL4206 manufactured by UCC. These epoxy resins can be used alone or in combination of two or more.

  When using an epoxy resin, it is preferable to use an epoxy resin curing agent. As the epoxy resin curing agent, known curing agents that are usually used can be used, for example, amines, polyamides, acid anhydrides, polysulfides, boron trifluoride, dicyandiamide, bisphenol A, bisphenol F, bisphenol. Examples thereof include bisphenols having two or more phenolic hydroxyl groups such as S, phenol resins such as phenol novolac resins, bisphenol A novolac resins, and cresol novolac resins. Among these, phenol resins such as phenol novolak resin, bisphenol A novolak resin, and cresol novolak resin are preferable in terms of excellent electric corrosion resistance at the time of moisture absorption. These epoxy resin curing agents can be used alone or in combination of two or more.

  Among the above-mentioned phenol resin curing agents, for example, Dainippon Ink & Chemicals, Inc., trade names: Phenolite LF2882, Phenolite LF2822, Phenolite TD-2090, Phenolite TD-2149, Phenolite VH -4150, Phenolite VH4170, manufactured by Meiwa Kasei Co., Ltd., trade name: H-1, Japan Epoxy Resin Co., Ltd., trade name: EpiCure MP402FPY, EpiCure YL6065, EpiCure YLH129B65, and Mitsui Chemicals, Inc., trade name: Examples include Milex XL, Milex XLC, Milex RN, Milex RS, and Milex VR.

  The film adhesive 240 preferably has a storage elastic modulus before curing at 25 ° C. of 10 to 10,000 MPa, and a storage elastic modulus after curing at 260 ° C. of 0.5 to 30 MPa. Here, as a method of increasing the storage elastic modulus of the film-like adhesive 240, for example, a method of increasing the amount of epoxy resin used, using an epoxy resin having a high glycidyl group concentration or a phenol resin having a high hydroxyl group concentration, etc. Examples thereof include a method for increasing the overall crosslinking density and a method for adding a filler.

  When the film adhesive 240 includes a thermopolymerizable component, a curing accelerator may be further added to the film adhesive 240. There is no restriction | limiting in particular as a hardening accelerator, For example, imidazole etc. are mentioned. Specific examples include 2-methylimidazole, 2-ethyl-4-methylimidazole, 1-cyanoethyl-2-phenylimidazole, 1-cyanoethyl-2-phenylimidazolium trimellitate, and the like. Or in combination of two or more.

  5 mass parts or less are preferable with respect to 100 mass parts of total amounts of a thermopolymerizable component, and, as for the addition amount of this hardening accelerator, 3 mass parts or less are more preferable. When this addition amount exceeds 5 parts by mass, the storage stability tends to decrease.

  For the purpose of improving flexibility and reflow crack resistance, a high molecular weight resin compatible with the thermopolymerizable component can be added to the film adhesive 240. Such a high molecular weight resin is not particularly limited, and examples thereof include a phenoxy resin, a high molecular weight thermopolymerizable component, and an ultrahigh molecular weight thermopolymerizable component. These may be used alone or in combination of two or more.

  The amount of the high molecular weight resin that is compatible with the thermopolymerizable component may be 40 parts by mass or less with respect to 100 parts by mass of the total amount of the thermopolymerizable component when the adhesive layer includes the thermopolymerizable component. preferable. Within this range, the Tg of the adhesive layer can be secured.

  Moreover, an inorganic filler can also be added to the film adhesive 240 for the purpose of improving its handleability, improving thermal conductivity, adjusting melt viscosity, and imparting thixotropic properties. The inorganic filler is not particularly limited. For example, aluminum hydroxide, magnesium hydroxide, calcium carbonate, magnesium carbonate, calcium silicate, magnesium silicate, calcium oxide, magnesium oxide, aluminum oxide, aluminum nitride, aluminum borate whisker, Examples thereof include boron nitride, crystalline silica, and amorphous silica. Further, the shape of the filler is not particularly limited. These fillers can be used alone or in combination of two or more. Among these, aluminum oxide, aluminum nitride, boron nitride, crystalline silica, and amorphous silica are preferable from the viewpoint of improving thermal conductivity. From the viewpoint of adjusting melt viscosity and imparting thixotropic properties, aluminum hydroxide, magnesium hydroxide, calcium carbonate, magnesium carbonate, calcium silicate, magnesium silicate, calcium oxide, magnesium oxide, aluminum oxide, crystallinity Silica and amorphous silica are preferred.

  The added amount of the inorganic filler is preferably 1 to 50% by mass based on the total amount of the adhesive layer. If the addition amount is less than 1% by mass, the effect of addition tends not to be obtained sufficiently. If the addition amount exceeds 50% by mass, the adhesive layer has poor adhesive properties and the electrical characteristics are deteriorated due to residual voids. There is a tendency to cause.

  In addition, various coupling agents can be added to the film adhesive 240 in order to improve interfacial bonding between different kinds of materials. Examples of the coupling agent include silane-based, titanium-based, and aluminum-based, and among them, a silane-based coupling agent is preferable because it is highly effective.

  The amount of the coupling agent used is preferably 0.01 to 10% by mass on the basis of the total amount of the adhesive layer from the viewpoint of its effect, heat resistance and cost.

  Furthermore, an ion scavenger can be added to the film adhesive 240 in order to adsorb ionic impurities and improve insulation reliability during moisture absorption. Such an ion scavenger is not particularly limited. For example, a triazine thiol compound, a bisphenol-based reducing agent, etc., a compound known as a copper damage inhibitor to prevent copper from being ionized and dissolved, a zirconium-based compound, Examples include inorganic ion adsorbents such as antimony bismuth-based magnesium aluminum compounds.

  The amount of the ion scavenger used is preferably from 0.1 to 10% by mass on the basis of the total amount of the adhesive layer from the viewpoint of the effect of addition, heat resistance, cost, and the like.

  The thickness of the film adhesive is preferably 0.1 to 100 μm, more preferably 1 to 50 μm, and particularly preferably 5 to 40 μm. If the thickness is less than 0.1 μm, there is a tendency that sufficient adhesive force as an adhesive cannot be secured. If the thickness exceeds 100 μm, the semiconductor device becomes thick, and the use of the semiconductor device tends to be limited. is there.

  The adhesive film 220 is preferably a base film provided with an adhesive layer. In this case, the layer on the side in contact with the film adhesive 240 in the pressure-sensitive adhesive film 220 is the adhesive layer.

  As the base film used for the adhesive film 220, for example, a polyester film such as a polyethylene terephthalate film, a polytetrafluoroethylene film, a polyethylene film, a polypropylene film, a polymethylpentene film, a polyolefin film such as a polyvinyl acetate film, Examples thereof include plastic films such as a polyvinyl chloride film and a polyimide film.

  The base film may be a laminate of two or more different films. In this case, the film on the side on which the pressure-sensitive adhesive layer is formed preferably has a tensile elastic modulus at 25 ° C. of 2000 MPa or more, more preferably 2200 MPa or more in terms of improving the pick-up workability of the semiconductor element. Preferably, it is particularly preferably 2400 MPa or more.

  Further, the film on the side opposite to the side on which the pressure-sensitive adhesive layer is formed preferably has a tensile modulus of elasticity of 1000 MPa or less at 25 ° C. in terms of large film elongation and good workability in the expanding step. More preferably, it is 800 MPa or less, and particularly preferably 600 MPa or less. This tensile elastic modulus is measured according to JIS K7113.

  When the base film is a laminate of two or more films, the lamination method is a method of extruding and laminating one film, a method of laminating two or more types of films while extruding and coating, A known method such as a method in which a raw material polymer is dissolved or dispersed in a solvent to form a varnish, applied to the other film, heated to remove the solvent, and a method of bonding two or more films using an adhesive. The method can be used.

  The pressure-sensitive adhesive layer constituting the pressure-sensitive adhesive film 220 is preferably one that is cured by high energy rays or heat (that is, the adhesive force can be controlled), more preferably one that is cured by high energy rays, and one that is cured by ultraviolet rays. Is particularly preferred, but is not particularly limited.

  Various types of pressure-sensitive adhesives constituting such a pressure-sensitive adhesive layer are conventionally known. Among them, it is preferable to appropriately select and use those whose adhesive strength to the film adhesive 240 is reduced by irradiation with high energy rays.

  Although it does not restrict | limit especially as said adhesive, For example, the high energy ray polymerization which has an ethylenically unsaturated group in the side chain, the compound which has a diol group, an isocyanate compound, a urethane (meth) acrylate compound, a diamine compound, a urea methacrylate compound, etc. For example, a functional copolymer. These can be used alone or in combination of two or more.

  Moreover, when the adhesive film 220 contains the thermopolymerizable component which hardens | cures with heat, you may add a hardening accelerator to an adhesive film further. There is no restriction | limiting in particular as a hardening accelerator, For example, imidazole etc. are mentioned. Specific examples include 2-methylimidazole, 2-ethyl-4-methylimidazole, 1-cyanoethyl-2-phenylimidazole, 1-cyanoethyl-2-phenylimidazolium trimellitate, and the like. Or in combination of two or more.

  5 mass parts or less are preferable with respect to 100 mass parts of total amounts of a thermopolymerizable component, and, as for the addition amount of a hardening accelerator, 3 mass parts or less are more preferable. When this addition amount exceeds 5 parts by mass, the storage stability tends to decrease.

  When the pressure-sensitive adhesive layer contains a high-energy ray polymerizable component that is cured by irradiation with high-energy rays, a photopolymerization initiator that generates free radicals upon irradiation with actinic rays can be added to the pressure-sensitive adhesive layer. . Examples of such a photopolymerization initiator include benzophenone, N, N′-tetramethyl-4,4′-diaminobenzophenone (Michler ketone), N, N′-tetraethyl-4,4′-diaminobenzophenone, 4- Methoxy-4′-dimethylaminobenzophenone, 2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) -butanone-1,2,2-dimethoxy-1,2-diphenylethane-1-one, 1- Aromatic ketones such as hydroxy-cyclohexyl-phenyl-ketone, 2-methyl-1- (4- (methylthio) phenyl) -2-morpholinopropanone-1,2,4-diethylthioxanthone, 2-ethylanthraquinone, phenanthrenequinone , Benzoin methyl ether, benzoin ethyl ether, benzoin Benzoin ether such as nyl ether, benzoin such as methyl benzoin and ethyl benzoin, benzyl derivatives such as benzyl dimethyl ketal, 2- (o-chlorophenyl) -4,5-diphenylimidazole dimer, 2- (o-chlorophenyl) -4 , 5-di (m-methoxyphenyl) imidazole dimer, 2- (o-fluorophenyl) -4,5-phenylimidazole dimer, 2- (o-methoxyphenyl) -4,5-diphenylimidazole dimer 2-mer, 2- (p-methoxyphenyl) -4,5-diphenylimidazole dimer, 2,4-di (p-methoxyphenyl) -5-phenylimidazole dimer, 2- (2,4-dimethoxy) 2,4,5-triarylimidazole dimer such as phenyl) -4,5-diphenylimidazole dimer , 9-phenyl acridine, 1,7-bis (9,9'-acridinyl) including acridine derivatives heptane, and the like. These can be used alone or in combination of two or more.

  Although there is no restriction | limiting in particular as the usage-amount of the said photoinitiator, Usually, it is 0.01-30 mass parts with respect to 100 mass parts of total amounts of a high energy ray polymeric component.

  In the pressure-sensitive adhesive film 220, the thickness of the pressure-sensitive adhesive layer is preferably 0.1 to 20 μm. If this thickness is less than 0.1 μm, it tends to be difficult to ensure sufficient adhesive force, and the semiconductor chip may be scattered during dicing, and if it exceeds 20 μm, it is not economical. There is no particular advantage in terms of characteristics.

  The peeling substrate 210 serves as a support member and also serves as a carrier film when the film adhesive is used. Examples of the release substrate 210 include polyester films such as polyethylene terephthalate films, polytetrafluoroethylene films, polyethylene films, polypropylene films, polymethylpentene films, polyolefin films such as polyvinyl acetate films, polyvinyl chloride films, A plastic film such as a polyimide film can be used. Moreover, paper, a nonwoven fabric, metal foil, etc. can also be used.

  Further, the surface of the release substrate 210 that is in contact with the adhesive layer may be surface-treated with a release agent such as a silicone release agent, a fluorine release agent, or a long-chain alkyl acrylate release agent.

  Although the thickness of the peeling base material 210 can be suitably selected in the range which does not impair the workability | operativity at the time of use, it is preferable that it is 10-500 micrometers, It is more preferable that it is 25-100 micrometers, It is 30-50 micrometers. Although it is particularly preferable, in order to obtain a sufficient effect as a support member, it is necessary to design in consideration of the total thickness of the laminate composed of the film adhesive 240 and the adhesive film 220 and the bending amount of the support member. Yes, for example, in the case of FIG. 8, when the folding amount is 5 to 10 mm, it is preferable to have a thickness equal to or greater than the total thickness of the film adhesive 240 and the pressure-sensitive adhesive film 220, and the folding amount of the support member is 11 to 11. At 35 mm, it is preferable to have a thickness equal to or greater than that of the film adhesive 240, and when the bending amount of the support member is 36 to 45 mm, Not limited to the thickness of the member is, 25 to 50 m is preferable.

  The adhesive sheet of the present invention described above can be obtained by dissolving or dispersing the composition forming each layer in a solvent to form a varnish, applying the varnish on the peeling substrate 210, and removing the solvent by heating.

(Adhesive sheet manufacturing method)
Next, a method for producing the adhesive sheet of the present invention will be described.
The adhesive sheet of the present invention can be formed by, for example, a method in which a support member portion of the peeling substrate 210 is cut in advance before the film adhesive 240 is applied to the peeling substrate 210, or the film adhesive 240 is peeled off. After the film adhesive 240 is processed into a predetermined shape after being applied to the substrate 210, a method of cutting the support member portion of the release substrate 210, or after the film adhesive 240 is applied to the release substrate 210 When the film adhesive 240 is processed into a predetermined shape, the film adhesive 240 is covered with the adhesive film 220, and the adhesive film 220 is processed into a predetermined shape, the film adhesive 240 is cut into the support member portion of the peeling substrate 210. The method of putting in is mentioned. Considering the simplicity of work, in the final processing step of the adhesive film, the support member portion of the peeling substrate 210 is cut or punched into the support member portion so that bending accuracy can be obtained, and then the support member portion is bent and returned. A method of applying pressure with a roller or the like is preferable so as not to occur. At this time, it is preferable to remove the film-like adhesive and the adhesive film which are no longer necessary.

  Here, FIGS. 9A to 9D are a series of process diagrams showing the method for manufacturing the adhesive sheet of the present invention. In FIG. 9, the upper stage is a plan view and the lower stage is a cross-sectional view. In the method for producing an adhesive sheet of the present invention, first, a film adhesive 240 is laminated on the entire surface of the peeling substrate 210 as shown in FIG. Next, the film-like adhesive 240 is punched with an annular cutting blade, and then, as shown in FIG. 9 (b), the remaining portion is peeled and removed, leaving a circle cut by the cutting blade. Further, as shown in FIG. 9 (c), the adhesive film 220 is laminated, a cutting blade having a diameter larger than that of the annular film adhesive 240 is used to punch out the adhesive film 220, and support on the release substrate. Make a cut in the part. Further, as shown in FIG. 9 (d), the adhesive film that is no longer needed is removed, and the supporting member portion is folded to the opposite side of the laminate of the film adhesive 240 and the adhesive film 220, thereby providing a predetermined adhesive sheet. A structure can be formed.

  In these adhesive sheet manufacturing methods, the lamination of the film adhesive 240 in the laminating step (a) is performed by, for example, a film adhesive layer formed by dissolving or dispersing a material constituting the film adhesive 240 in a solvent. The forming varnish can be applied to the peeling substrate 210 and the solvent can be removed by heating.

  Moreover, the adhesive film 220 in the laminating step (c) is, for example, by dissolving or dispersing a material constituting the adhesive layer in a solvent to form an adhesive layer forming varnish, which is the base film of the adhesive film 220. After coating, the solvent is removed by heating to form an adhesive film 220 composed of a base film and an adhesive layer. And the obtained adhesive film 220 can be performed by laminating | stacking so that the whole film adhesive 240 and the peeling base material 210 which may be exposed may be covered.

  Here, as a method for applying the varnish to the substrate film of the peeling substrate 210 and the adhesive film 220, a known method can be used, for example, a knife coating method, a roll coating method, a spray coating method, a gravure coating method. A bar coating method, a curtain coating method, or the like can be used.

  Moreover, lamination | stacking of the adhesion film 220 can be performed by a conventionally well-known method, for example, can be performed using a laminator etc. FIG.

  Here, with respect to the cutting process of the film adhesive 240, the adhesive film 220, and the peeling substrate 210 into the bent portion of the support member, a known method can be used, for example, a method using a punching device, a precut device, or the like. be able to.

  EXAMPLES Hereinafter, although this invention is demonstrated more concretely based on an Example and a comparative example, this invention is not limited to a following example.

(Preparation of adhesive layer forming varnish)
First, 60 parts by mass of a cresol novolac type epoxy resin (trade name: YDCN-703, manufactured by Tohto Kasei Co., Ltd.) as an epoxy resin, and a low water absorption phenol resin (trade name: XLC-LL, Mitsui Chemicals, Inc.) as a curing agent. (Product made from phenol xylene glycol dimethyl ether condensate) 40 parts by mass, 1500 parts by mass of cyclohexanone was added and mixed by stirring to prepare a first varnish. Next, 1.5 parts by mass of γ-glycidoxypropyltrimethoxysilane (trade name: NUC A-189, manufactured by Nihon Unicar Co., Ltd.) as a coupling agent and γ-ureidopropyl were used as the coupling agent. Add 3 parts by mass of triethoxysilane (trade name: NCU A-1160, manufactured by Nihon Unicar Co., Ltd.), and add 32 parts by mass of silica filler (trade name: R972V, manufactured by Nippon Aerosil Co., Ltd.) as an inorganic filler and stir and mix. After that, the second varnish was prepared by performing a dispersion treatment with a bead mill. Next, 200 parts by mass of an epoxy group-containing acrylic copolymer (trade name: HTR-860P-3, manufactured by Teikoku Chemical Industry Co., Ltd.) and 1-cyanoethyl-2 as a curing accelerator are added to the second varnish. -0.5 part by mass of phenylimidazole (trade name: Curesol 2PZ-CN, manufactured by Shikoku Kasei Kogyo Co., Ltd.) was added and mixed by stirring to prepare an adhesive layer forming varnish.

(Preparation of adhesive layer)
The adhesive layer forming varnish is applied onto a release substrate polyethylene terephthalate film (trade name: Teijin Purex, Teijin DuPont Films Co., Ltd.), heat-dried at 140 ° C. for 7 minutes, and a film thickness of 40 μm. A film-like adhesive in a stage state was formed.

(First cutting process)
The obtained film adhesive was subjected to circular precut processing with a diameter of 320 mm by adjusting the depth of cut into the release substrate to 10 μm.

(Second cutting step)
Thereafter, unnecessary portions of the film adhesive are removed, and the pressure-sensitive adhesive film (110 μm) is in contact with the film adhesive at room temperature (25 ° C.), linear pressure 1 to 3 kg / cm, speed 0.5 m / min. Pasted with conditions. Then, the adhesive film is adjusted so that the depth of cut into the peeling substrate is 10 μm and is subjected to circular precut processing with a diameter of 370 mm concentrically with the adhesive layer, and the supporting member portion on the peeling substrate After adjusting the depth of cut to 10 μm to continuously cut and removing unnecessary portions of the adhesive film, the support member was bent to the opposite side of the laminate and molded with a roller. Thereby, the adhesive sheet which has a structure shown to Fig.3 (a)-(c) and Fig.4 (a)-(c) was obtained.

Example 1
An adhesive sheet having the shape shown in FIGS. 3A and 4A was obtained. The bending amount of the support member was 45 mm, and the peeling base material thickness was 38 μm.

(Example 2)
An adhesive sheet having the shape shown in FIGS. 3B and 4B was obtained. The bending amount of the support member was 20 mm, and the thickness of the peeling substrate was 50 μm.

(Example 3)
An adhesive sheet having the shape shown in FIGS. 3C and 4C was obtained. The bending amount of the support member was 5 mm, and the thickness of the peeling substrate was 150 μm.

(Comparative Example 1)
An adhesive sheet having a shape not having the support member shown in FIG. 10 was obtained. The thickness of the peeling substrate was 50 μm.

(Comparative Example 2)
An adhesive sheet having a shape not having the support member of FIGS. 1 and 2 was obtained. The thickness of the peeling substrate was 50 μm.

[Evaluation test of transcriptional inhibition of winding marks]
The adhesive sheets of Examples 1 to 3 and Comparative Examples 1 and 2 were wound into a roll with a winding tension of 1 kg or 3 kg so that the number of circular adhesive films was 300, and an adhesive sheet roll was produced. did. The obtained adhesive sheet roll was stored in a refrigerator (5 ° C.) for 4 weeks. Thereafter, the adhesive sheet roll was returned to room temperature (25 ° C.), and then the roll was unwound. The presence or absence of voids when the 300th film was attached to a semiconductor wafer was visually evaluated.
According to the following evaluation criteria, the transfer inhibition property of the winding marks of the adhesive sheet was evaluated in three stages of ◯, Δ, and ×. The results are shown in Table 1.
○: No voids can be confirmed.
Δ: Although not continuous, voids were confirmed.
X: Conspicuous boy is confirmed.

  As is clear from the above results, according to the adhesive sheets (Examples 1 to 3) of the present invention, compared to the comparative adhesive sheets (Comparative Examples 1 and 2), It was confirmed that it was possible to sufficiently suppress the transfer of the winding marks to the adhesive layer, thereby sufficiently suppressing the generation of voids when the adhesive layer was attached to the semiconductor wafer. .

100, 200, 300, 400, 500; adhesive sheet (dicing die bonding material)
110, 210; peeling substrate 120, 220; pressure-sensitive adhesive film 130; pressure-sensitive adhesive film laminated portion 140, 240; film adhesive (adhesive layer)
600; support member

Claims (3)

  A support member, a release substrate, an adhesive layer dispersed in the longitudinal direction on the release substrate, and the adhesive layer is covered and is in contact with the release substrate around the adhesive layer The adhesive sheet has a pressure-sensitive adhesive film formed in a roll shape, and is formed by rolling an adhesive sheet processed into a predetermined shape by precutting or punching. An adhesive sheet, which is provided by bending both ends in a hand direction.   2. The adhesive sheet according to claim 1, wherein in the support member, both end portions of the release substrate are bent to a surface side having no adhesive layer.   The adhesive sheet according to claim 1, wherein the support member is continuously provided in the longitudinal direction of the release substrate.

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