JP2009124127A - Adhesive sheet, method of manufacturing the same, method of manufacturing semiconductor deice, and semiconductor device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an adhesive sheet to which pre-cutting has been applied, and which can fully suppress the transfer of the perimeter pattern of the adhesive sheet to the other adhesive sheet, does not form any recess in the pattern transfer portion, and can fully suppress failures such as the formation of a gap in the pattern transfer portion after a wafer is pasted. <P>SOLUTION: The adhesive sheet includes a peelable base member and a plurality of laminated bodies each composed of an adhesive agent layer arranged on the peelable base member and having a predetermined planar pattern, and a gluing agent layer which covers the adhesive agent layer and contacts with the peelable base member in a circumferential portion of the adhesive layer, wherein the plurality of the laminated bodies are arranged on the peelable base member in the longitudinal direction separated from each other. The adhesive sheet has a notch which is cut at an angle of 90 degrees or smaller with respect to the peeling base member plane at all or a part of the perimeter portion of each adhesive agent layer, and also has a notch which is cut in a non-vertical direction with respect to the peeling base member plane at all or a part of the perimeter portion of each gluing agent layer. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to an adhesive sheet, a manufacturing method thereof, a manufacturing method of a semiconductor device, and a semiconductor device.

  In recent years, there has been a rapid increase in demands for multifunctional and lightweight and compact mobile related devices. Accordingly, the need for high-density mounting of semiconductor elements is increasing year by year, and the development of a stacked multi-chip package (hereinafter referred to as “stacked MCP”) in which semiconductor elements are stacked plays a central role. The technical development of stacked MCP is to achieve both conflicting goals of package miniaturization and multi-stage loading. For this reason, the thickness of silicon wafers used for semiconductor elements has been rapidly reduced, and wafers with a thickness of 100 μm or less are being actively used and studied. In addition, since the multi-stage loading causes the package production process to become complicated, there is a need for a production process and material proposal corresponding to the simplification of the package production process and the increase in the number of wire bonding thermal histories by multi-stage loading.

  Under such circumstances, a paste material has been conventionally used as an adhesive member of the stacked MCP. However, the paste material has a problem that the resin protrudes in the bonding process of the semiconductor element and the film thickness accuracy is low. Since these problems cause problems during wire bonding, voids in the paste, and the like, when the paste material is used, it has become impossible to cope with the above requirements.

  In recent years, in order to improve such a problem, a film-like adhesive has been used instead of the paste material. Compared to paste materials, film adhesives can control the amount of protrusion in the bonding process of semiconductor elements, and increase film thickness accuracy to reduce film thickness variation. Therefore, application to a stacked MCP is being actively studied.

  This film-like adhesive usually has a configuration in which an adhesive layer is formed on a release substrate, and one of typical usage methods is a wafer back surface application method. The wafer back surface attaching method is a method of directly attaching a film adhesive to the back surface of a silicon wafer used for manufacturing a semiconductor element. In this method, after a film adhesive is applied to a semiconductor wafer, the release substrate is removed, and a dicing tape is applied on the adhesive layer. Thereafter, the wafer is mounted on the wafer ring, and the wafer is cut into a desired semiconductor element size together with the adhesive layer. The semiconductor element after dicing has a structure having an adhesive layer cut out to the same size on the back surface. The semiconductor element with the adhesive layer is picked up and attached to a substrate to be mounted by a method such as thermocompression bonding. wear.

  The dicing tape used for this back surface application method usually has a structure in which an adhesive layer is formed on an adhesive layer, and is roughly classified into two types, a pressure-sensitive dicing tape and a UV dicing tape. . As a function required for the dicing tape, at the time of dicing, a sufficient adhesive force is required so that the semiconductor element does not scatter due to a load accompanying cutting of the wafer, and when picking up each diced semiconductor element, an adhesive to each element It is required that there is no residue and that a semiconductor element with an adhesive layer can be easily picked up by a die bonder facility.

  In addition, there is a growing demand for process improvement due to the desire to shorten the package manufacturing process. In order to simplify this process, the conventional wafer backside application method requires two steps of attaching a film adhesive to the wafer and then applying a dicing tape. Adhesive sheets (die-bond dicing sheets) that have both functions of tape have been developed. As this adhesive sheet, a laminated type having a structure in which a film adhesive and a dicing tape are bonded together (for example, see Patent Documents 1 to 3), or both a pressure-sensitive adhesive layer and an adhesive layer with a single resin layer. There is a single layer type (see, for example, Patent Document 4) having the above functions.

  In addition, a method (so-called precut processing) in which such an adhesive sheet is processed in advance into the shape of a wafer constituting a semiconductor element is known (for example, Patent Documents 5 and 6). Such pre-cut processing is a method in which a resin layer is punched in accordance with the shape of the wafer to be used, and the resin layer other than the portion to which the wafer is attached is peeled off.

  When such pre-cut processing is performed, generally, a laminated type adhesive sheet is pre-cut in a film adhesive so that the adhesive layer is matched to the wafer shape and bonded to the dicing tape. It is manufactured by applying pre-cut processing according to the wafer ring shape, or pasting a dicing tape pre-cut into a wafer ring shape with a pre-cut film adhesive. In addition, a single-layer type adhesive sheet generally forms a resin layer (hereinafter referred to as “adhesive layer”) having both functions of an adhesive layer and an adhesive layer on a release substrate. The adhesive layer is prepared by a method such as pre-cut processing, removing unnecessary portions of the resin layer, and then bonding to the pressure-sensitive adhesive layer.

By the way, at the time of this precut processing, the adhesive sheet is wound around a winding core and provided in a roll shape. The sharper the shape of the pressure-sensitive adhesive layer or the cut portion, the more the outer peripheral shape of the adhesive sheet is wound. A problem arises in that the transfer site is recessed by turning and transferring it to other parts in contact.
Therefore, conventionally, in order to avoid such a transfer failure, the shape transfer of the outer peripheral portion of the adhesive sheet is suppressed by changing the shape of the adhesive sheet or reducing the tension at the time of winding the adhesive sheet.

Japanese Patent No. 3348923 JP 10-335271 A Japanese Patent No. 2678655 Japanese Patent Publication No. 7-15087 Japanese Utility Model Publication No. 6-18383 Registered Utility Model No. 3021645

However, the method of suppressing the shape transfer of the outer peripheral portion of the adhesive sheet by lowering the tension at the time of winding the adhesive sheet has a problem that it tends to collapse.
The present invention has been made in view of the above-described problems of the prior art, and has been subjected to precut processing, and the shape of the outer peripheral portion of the adhesive sheet is transferred to another adhesive sheet, and the transfer site is recessed. It is an object of the present invention to provide an adhesive sheet capable of sufficiently suppressing defects, a manufacturing method thereof, a semiconductor device manufacturing method using the adhesive sheet, and a semiconductor device.

The present invention relates to the following.
<1> A release substrate, an adhesive layer disposed on the release substrate, having a predetermined planar shape, and covering the adhesive layer and in contact with the release substrate around the adhesive layer A laminate having a predetermined shape composed of the formed pressure-sensitive adhesive layer, and an adhesive sheet in which a plurality of the laminates are dispersed and arranged in the length direction on the release substrate,
The whole or a part of the outer peripheral part of the adhesive layer has a cut at 90 ° or less with respect to the release substrate plane, and the whole or a part of the outer periphery of the adhesive layer is cut with respect to the release substrate plane. An adhesive sheet characterized by having a cut in a non-vertical direction.

<2> The notch of the pressure-sensitive adhesive layer is characterized in that the angle (A) of the notch when the plane of the peeling substrate is a reference (0 °) satisfies the condition of the following formula (1). The adhesive sheet according to <1> above.
0 <(A) ≦ 70 (1)

<3> The above <1> or <2 wherein the predetermined planar shape of the adhesive layer is larger than the planar shape of the adherend to which the laminate is to be attached after the release substrate is peeled off. > The adhesive sheet described.

<4> The pressure-sensitive adhesive layer has adhesiveness at room temperature (25 ° C.) with respect to an adherend to which the adhesive layer is to be attached and the adhesive layer after peeling the release substrate. The adhesive sheet according to any one of <1> to <3> above.

<5> The above <1> to <1>, wherein the adhesive layer contains an epoxy resin and an epoxy resin curing agent, and a high molecular weight component having a weight average molecular weight including a functional monomer of 100,000 or more. The adhesive sheet according to any one of 4>.

<6> The above <5>, wherein the high molecular weight component is a glycidyl group-containing (meth) acrylic copolymer, and the amount of the epoxy group-containing monomer is 0.5 to 50% by mass. Adhesive sheet.

<7> The above <1>, wherein the adhesive layer has a storage elastic modulus before curing at 25 ° C. of 10 to 10,000 MPa and a storage elastic modulus after curing at 260 ° C. of 0.5 to 1000 MPa. ~ The adhesive sheet according to any one of <6>.

<8> The above <1> to <1>, wherein the pressure-sensitive adhesive layer contains a high-energy ray polymerizable component capable of controlling the adhesive strength between the pressure-sensitive adhesive layer and the pressure-sensitive adhesive layer by irradiating high-energy rays. The adhesive sheet according to any one of 7>.

<9> The method for producing an adhesive sheet according to any one of the above items <1> to <8>, wherein a first laminating step of laminating an adhesive layer on a release substrate, Make a cut at 90 ° or less with respect to the surface of the release substrate from the surface opposite to the side in contact with the release substrate until the release substrate is reached, and remove the adhesive layer on the cut outer periphery. A first cutting step of forming a predetermined planar shape adhesive layer, a second laminating step of laminating the pressure-sensitive adhesive layer so as to cover the predetermined planar shape adhesive layer and the release substrate, In addition, the adhesive layer is cut in a non-perpendicular direction with respect to the plane of the release substrate until it reaches the release substrate from the surface opposite to the release substrate side of the pressure-sensitive adhesive layer. An adhesive layer having a predetermined planar shape, and covering the adhesive layer and the adhesive layer Comprising a pressure-sensitive adhesive layer in contact with the release substrate at ambient method of the adhesive sheet, we characterized in that it comprises a second cutting step of forming a laminated body having a predetermined shape.

<10> In the second cutting step, the angle (A) of the cut portion when the plane of the peeling substrate is a reference (0 °) satisfies the condition of the following formula (1): The manufacturing method of the adhesive sheet as described in said <9>.
0 <(A) ≦ 70 (1)

<11> In the method for producing a semiconductor device using an adhesive sheet, the adhesive sheet is the adhesive sheet according to any one of the above <1> to <8> or the above <9> or <10>. An adhesive sheet manufactured by a manufacturing method,
The laminate is peeled from the release substrate, and the laminate is attached to a semiconductor wafer from the surface on the adhesive layer side to obtain a semiconductor wafer with a laminate, the semiconductor wafer with a laminate, A dicing process in which at least the interface between the adhesive layer and the pressure-sensitive adhesive layer is cut with a cutting member, and the semiconductor wafer is cut into semiconductor elements of a predetermined size. After reducing the adhesive force of the adhesive layer to the adhesive layer, the semiconductor element is picked up from the adhesive layer together with the adhesive layer to obtain a semiconductor element with an adhesive layer, and with the adhesive layer The manufacturing method of the semiconductor device characterized by including the adhesion process which adhere | attaches the said semiconductor element in a semiconductor element to a to-be-adhered body through the said adhesive bond layer.

<12> The method for producing a semiconductor device according to <11>, wherein the adherend is a support member for mounting a semiconductor element or another semiconductor element.

<13> A semiconductor device manufactured by the method for manufacturing a semiconductor device according to <11> or <12>.

  According to the present invention, an adhesive sheet that has been subjected to pre-cut processing and can sufficiently suppress transfer failure of a laminate including an adhesive layer and a pressure-sensitive adhesive layer from a release substrate, and a manufacturing method thereof, and A semiconductor device manufacturing method and a semiconductor device using the adhesive sheet can be provided.

<Adhesive sheet>
The adhesive sheet of the present invention comprises a release substrate, an adhesive layer disposed on the release substrate, having a predetermined planar shape, and covering the adhesive layer and surrounding the adhesive layer. A laminate having a predetermined shape, which is made of a pressure-sensitive adhesive layer formed so as to be in contact with the adhesive sheet, and a plurality of the laminates distributed in the length direction on the release substrate. In addition, all or part of the outer peripheral portion of the adhesive layer has a cut at 90 ° or less with respect to the release substrate plane, and all or part of the outer periphery of the pressure-sensitive adhesive layer has the cut surface of the release substrate. Is characterized by a notch in a non-vertical direction.

  The angle of the cut portion of the pressure-sensitive adhesive layer is preferably larger than 0 ° and not larger than 70 ° when the plane of the peeling substrate is used as a reference (0 °). Further, the angle of the cut portion of the adhesive layer is preferably larger than 0 ° and not larger than 90 ° when the plane of the peeling substrate is used as a reference (0 °). Here, the angle of the notch in the present invention is determined by arbitrarily measuring the depth in the thickness direction of the release substrate at the notch formed on the release substrate by cross-sectional observation using an optical microscope. Mean average value.

  The adhesive sheet of the present invention is an adhesive sheet subjected to the above-described precut processing. And in the adhesive sheet of this invention, when the angle of the notch | incision part of each of the said adhesive bond layer and an adhesive layer when making a peeling base-material plane into a reference | standard (0 degree) is the said range, this adhesive sheet It is possible to sufficiently suppress the shape of the outer peripheral portion from being transferred to other portions that have been wound and contacted. For this reason, there is no dent in the transfer site, and defects such as the generation of voids in the transfer site after wafer pasting can be sufficiently suppressed.

  In the adhesive sheet of the present invention, the adhesive layer may have a predetermined planar shape that matches the planar shape of the adherend to which the laminate is to be attached after the release substrate is peeled off. preferable.

  Examples of the adherend include a semiconductor wafer, and the adhesive layer has a planar shape that matches the planar shape of the semiconductor wafer, which tends to facilitate the process of dicing the semiconductor wafer. is there. Note that the planar shape of the adhesive layer does not have to completely match the planar shape of the semiconductor wafer. For example, it may be similar to the planar shape of the semiconductor wafer, and matches the planar shape of the semiconductor wafer. May be.

  Furthermore, in the adhesive sheet, the pressure-sensitive adhesive layer has adhesiveness at room temperature (25 ° C.) with respect to the adherend to which the adhesive layer is to be attached and the adhesive layer after peeling the release substrate. It is preferable. Thereby, when dicing a semiconductor wafer, a semiconductor wafer is fully fixed and dicing becomes easy. In addition, when a wafer ring is used when dicing a semiconductor wafer, and an adhesive sheet is attached so that the adhesive layer is in close contact with the wafer ring, sufficient adhesion to the wafer ring is obtained and dicing is performed. It becomes easy.

  The pressure-sensitive adhesive layer preferably has a reduced adhesive force to the adhesive layer due to irradiation with high energy rays. Thereby, when peeling an adhesive bond layer from an adhesive layer, peeling becomes possible easily by irradiating with high energy rays, such as an ultraviolet-ray, an electron beam, and a radiation.

The adhesive sheet preferably includes an adhesive layer disposed between at least a part of the peripheral edge of the pressure-sensitive adhesive layer and the release substrate.
By providing this pressure-sensitive adhesive layer, this pressure-sensitive adhesive layer can be attached to the wafer ring used during dicing of the semiconductor wafer, and the adhesive layer can be prevented from being directly attached to the wafer ring. When the adhesive layer is attached directly to the wafer ring, the adhesive strength of the adhesive layer needs to be adjusted to a low adhesive strength that can be easily peeled off from the wafer ring. By sticking, adjustment of such adhesive force becomes unnecessary. Therefore, the adhesive layer has a sufficiently high adhesive strength, and the adhesive layer has a sufficiently low adhesive strength that allows the wafer ring to be easily peeled off. The wafer ring can be peeled off more efficiently. Furthermore, since the adhesive force of the pressure-sensitive adhesive layer can be adjusted sufficiently low, it becomes easier to create a peeling start point between the peeling substrate and the pressure-sensitive adhesive layer, and the adhesive layer and the pressure-sensitive adhesive layer from the peeling substrate Peeling is facilitated and the occurrence of peeling failure can be more sufficiently suppressed. Here, it is preferable that the pressure-sensitive adhesive layer has adhesiveness at room temperature (25 ° C.) with respect to the adherend to which the pressure-sensitive adhesive layer is to be attached and the adhesive layer after peeling the release substrate.

The adhesive sheet of the present invention has an adhesive layer having a storage elastic modulus before curing at 25 ° C. of 10 to 10,000 MPa and a storage elastic modulus after curing at 260 ° C. of 0.5 to 1000 MPa. preferable. When the storage elastic modulus before curing at 25 ° C. is in the above range, the precut processability can be ensured. Moreover, it is excellent in the reliability of a semiconductor device as the storage elastic modulus after hardening at 260 degreeC is the said range.
In the present invention, “before curing” is a state after film formation, and “after curing” is cured by heating after film formation, and the epoxy resin and the epoxy resin curing agent undergo a curing reaction. Indicates the stage completed.
A method for adjusting the storage elastic modulus will be described later.

  As shown in FIGS. 1 and 2, the adhesive sheet of the present invention includes a release substrate 1, an adhesive layer 2 disposed on the release substrate 1 and having a predetermined planar shape, and the adhesive layer. 2 and the pressure-sensitive adhesive layer 3 formed so as to be in contact with the release substrate 1 around the periphery of the substrate 2 are sequentially laminated. In the present invention, the adhesive layer and the pressure-sensitive adhesive layer are referred to as a laminate. The laminate composed of the adhesive layer and the pressure-sensitive adhesive layer is cut into a predetermined shape and partially laminated on the release substrate, and a plurality of the laminates are arranged in the length direction of the release substrate. Distributed. Further, the peeling substrate has a wafer ring shape with a cut portion (hereinafter also referred to as “cut portion D”) in the thickness direction of the peel substrate from the surface on the adhesive layer side along the periphery of the shape of the laminate. Pre-cut into a matching shape.

  Here, the predetermined shape of the laminate is a state in which the laminate is partially laminated on the release substrate, and the predetermined planar shape of the adhesive layer is a planar shape of an adherend such as a semiconductor wafer. For example, a semiconductor such as a circle, a substantially circle, a quadrangle, a pentagon, a hexagon, an octagon, and a wafer shape (a shape in which a part of the outer periphery of the circle is a straight line) is not particularly limited. It is preferable that the shape be easily attached to the wafer. Among these, in order to reduce useless parts other than the semiconductor wafer mounting portion, a circular shape or a wafer shape is preferable.

  When dicing a semiconductor wafer, a wafer ring is usually used for handling with a dicing apparatus. In this case, the peeling substrate is peeled off from the adhesive sheet, a wafer ring is attached to the pressure-sensitive adhesive layer, and a semiconductor wafer is attached to the inside thereof. Here, the wafer ring is a frame such as an annular shape or a square shape, and the pressure-sensitive adhesive layer of the laminate in the adhesive sheet preferably further has a planar shape that matches the wafer ring.

  The pressure-sensitive adhesive layer can sufficiently fix an adherend such as a semiconductor wafer or a wafer ring at room temperature (25 ° C.), and can be peeled off after dicing to a wafer ring or the like. It is preferable to have. The adhesive strength of the adhesive layer before irradiation with high energy rays is preferably 3.0 to 150 N / m, and more preferably 30 to 100 N / m. When it exceeds 150 N / m, it is difficult to peel off from the wafer ring, and workability is deteriorated. If it is less than 3.0 N / m, the holding force with respect to the wafer ring is insufficient, which may cause trouble in the manufacturing process of the semiconductor device.

Hereinafter, each layer which comprises an adhesive sheet is demonstrated in detail.
The release substrate in the present invention plays a role as a carrier film when the adhesive sheet is used. Examples of the release substrate include polyester films such as polyethylene terephthalate films, polytetrafluoroethylene films, and polyethylene films. Polyolefin films such as polypropylene film, polymethylpentene film and polyvinyl acetate film, and plastic films such as polyvinyl chloride film and polyimide film can be used. Moreover, paper, a nonwoven fabric, metal foil, etc. can also be used.

  The surface of the release substrate on the adhesive layer side is preferably surface-treated with a release agent such as a silicone release agent, a fluorine release agent, or a long-chain alkyl acrylate release agent. Although the thickness of a peeling base material can be suitably selected in the range which does not impair the workability | operativity at the time of use, it is preferable that it is 10-500 micrometers, It is more preferable that it is 20-100 micrometers, It is 25-50 micrometers. It is particularly preferred.

In the adhesive layer in the present invention, any one of a thermoplastic component, a thermopolymerizable component, a high energy ray polymerizable component, or a combination thereof can be used.
For example, a thermoplastic component is used for the adhesive layer in the present invention, and a thermal polymerizable component, a high energy ray polymerizable component, or the like can be contained therein. By setting it as the composition containing such a component, an adhesive bond layer can be given the characteristic which hardens | cures with a high energy ray (for example, an electron beam, an ultraviolet-ray, radiation, etc.) or a heat | fever. Moreover, the structure which mainly uses curable components, such as a thermally polymerizable component and a high energy ray polymerizable component, may be sufficient.

  The high molecular weight component used in the adhesive layer is not particularly limited as long as it is a resin having thermoplasticity, or at least a resin that has thermoplasticity in an uncured state and forms a crosslinked structure after heating. 1) Tg (glass transition temperature) is 10 to 100 ° C. and weight average molecular weight is 5000 to 200000, or (2) Tg is −50 to 10 ° C. and weight average molecular weight is Those having 100,000 to 1,000,000 are preferably used.

  Examples of the thermoplastic component (1) include polyimide resin, polyamide resin, polyetherimide resin, polyamideimide resin, polyester resin, polyesterimide resin, phenoxy resin, polysulfone resin, polyethersulfone resin, polyphenylene sulfide resin, Examples thereof include polyetherketone resin, and it is preferable to use polyimide resin among them.

  The polyimide resin as one of the more preferable high molecular weight components of the above (1) can be obtained, for example, by subjecting tetracarboxylic dianhydride and diamine to a condensation reaction by a known method. That is, in an organic solvent, tetracarboxylic dianhydride and diamine are used in an equimolar or almost equimolar amount (the order of addition of each component is arbitrary), and an addition reaction is performed at a reaction temperature of 80 ° C. or lower, preferably 0 to 60 ° C. . As the reaction proceeds, the viscosity of the reaction solution gradually increases, and polyamic acid, which is a polyimide precursor, is generated.

  Moreover, the polymer containing a functional monomer is mentioned as a preferable thing among the high molecular weight components of said (2). Examples of the functional group in such a polymer include a glycidyl group, an acryloyl group, a methacryloyl group, a hydroxyl group, a carboxyl group, an isocyanurate group, an amino group, and an amide group, and among them, a glycidyl group is preferable. More specifically, a glycidyl group-containing (meth) acrylic copolymer containing a functional monomer such as glycidyl acrylate or glycidyl methacrylate is preferable, and these are used as a constituent material of the adhesive layer, before curing. It is preferably incompatible with thermosetting resins such as epoxy resins.

  The polymer containing the functional monomer and having a weight average molecular weight of 100,000 or more includes, for example, a functional monomer such as glycidyl acrylate or glycidyl methacrylate and has a weight average molecular weight of 100,000. Examples thereof include glycidyl group-containing (meth) acrylic copolymers as described above, and among them, those that are incompatible with thermosetting resins such as epoxy resins before curing are preferable.

  As said glycidyl group containing (meth) acrylic copolymer, a glycidyl group containing (meth) acrylic ester copolymer, a glycidyl group containing acrylic rubber, etc. can be used, for example, and a glycidyl group containing acrylic rubber is more preferable. The glycidyl group-containing acrylic rubber as used in the present invention is a copolymer containing a glycidyl group mainly composed of an acrylate ester and mainly composed of butyl acrylate and acrylonitrile, or ethyl acrylate and acrylonitrile. .

  The functional monomer means a monomer having a functional group, and it is preferable to use glycidyl acrylate or glycidyl methacrylate as such a monomer. Specific examples of the glycidyl group-containing (meth) acrylic copolymer having a weight average molecular weight of 100,000 or more include HTR-860P-3 (trade name) manufactured by Nagase ChemteX Corporation.

  The amount of the epoxy group-containing monomer unit such as glycidyl acrylate or glycidyl methacrylate is preferably 0.5 to 50% by mass based on the total amount of the monomer in order to cure by heating and effectively form a network structure. Moreover, from the viewpoint that the adhesive force can be secured and gelation can be prevented, 0.5 to 6.0% by mass is more preferable, 0.8 to 5.0% by mass is further preferable, and 1. 0-4.0 mass% is especially preferable.

  It is also possible to copolymerize with a functional monomer other than an epoxy group-containing monomer such as glycidyl acrylate and glycidyl methacrylate. Examples of the functional monomer other than the epoxy group-containing monomer include ethyl (meth) acrylate and butyl (meta ) Acrylate and the like, and these can be used alone or in combination of two or more. In the present invention, ethyl (meth) acrylate means ethyl acrylate or ethyl methacrylate. The mixing ratio when a functional monomer other than an epoxy group-containing monomer is used in combination is determined in consideration of the Tg of the glycidyl group-containing (meth) acrylic copolymer so that the Tg is -10 ° C or higher. It is preferable. When Tg is −10 ° C. or higher, the tackiness of the adhesive layer in an uncured state is appropriate, and the handleability tends to be good.

When polymerizing the functional monomer to produce a high molecular weight component having a functional monomer-containing weight average molecular weight of 100,000 or more, the polymerization method is not particularly limited. For example, pearl polymerization, solution polymerization, etc. The method can be used. The weight average molecular weight of the high molecular weight component containing the functional monomer is 100,000 or more, preferably 300,000 to 3,000,000, and more preferably 500,000 to 2,000,000. When the weight average molecular weight is within this range, the strength, flexibility, and tackiness of a sheet or film are appropriate, and the flowability is appropriate, so the circuit fillability of wiring is ensured. It tends to be possible.
In the present invention, the weight average molecular weight is a value measured by gel permeation chromatography and converted using a standard polystyrene calibration curve.

  Moreover, the usage-amount of the high molecular weight component whose weight average molecular weight containing a functional monomer is 100,000 or more has preferable 10-400 mass parts with respect to 100 mass parts of thermopolymerizable components. When it is in this range, storage elastic modulus and flowability during molding can be ensured, and handling properties at high temperatures tend to be good. Moreover, 15-350 mass parts is more preferable, and 20-300 mass parts is especially preferable with respect to 100 mass parts of thermopolymerizable components.

  The thermopolymerizable component used in the adhesive layer is not particularly limited as long as it is polymerized by heat. For example, glycidyl group, acryloyl group, methacryloyl group, hydroxyl group, carboxyl group, isocyanurate group, amino group, amide And compounds having a functional group such as a group. These can be used alone or in combination of two or more. In view of heat resistance as an adhesive sheet, it is preferable to use a thermosetting resin that is cured by heat and exerts an adhesive action.

  Examples of the thermosetting resin include an epoxy resin, an acrylic resin, a silicone resin, a phenol resin, a thermosetting polyimide resin, a polyurethane resin, a melamine resin, and a urea resin, and in particular, heat resistance, workability, and reliability. It is preferable to use an epoxy resin in that an adhesive sheet excellent in the above can be obtained.

  The epoxy resin is not particularly limited as long as it is cured and has an adhesive action. As such an epoxy resin, for example, a bifunctional epoxy resin such as a bisphenol A type epoxy, a novolac type epoxy resin such as a phenol novolac type epoxy resin or a cresol novolac type epoxy resin, or the like can be used. Moreover, what is generally known, such as a polyfunctional epoxy resin, a glycidyl amine type epoxy resin, a heterocyclic ring-containing epoxy resin, or an alicyclic epoxy resin, can be used.

  As the bisphenol A type epoxy resin, Epicoat Series (Epicoat 807, Epicoat 815, Epicoat 825, Epicoat 827, Epicoat 828, Epicoat 834, Epicoat 1001, Epicoat 1004, Epicoat 1007, Epicoat 1009) manufactured by Japan Epoxy Resin Co., Ltd., Dow Chemical DER-330, DER-301, DER-361 made by the company, YD8125, YDF8170 made by Toto Kasei Co., Ltd., etc. are mentioned.

  Examples of phenol novolac type epoxy resins include Epicoat 152 and Epicoat 154 manufactured by Japan Epoxy Resin Co., Ltd., EPPN-201 manufactured by Nippon Kayaku Co., Ltd., DEN-438 manufactured by Dow Chemical Co., Ltd., and o-cresol novolak type epoxy resin. Examples of the resin include EOCN-102S, EOCN-103S, EOCN-104S, EOCN-1012, EOCN-1025, EOCN-1027 manufactured by Nippon Kayaku Co., Ltd., YDCN700-10 manufactured by Tohto Kasei Co., Ltd., and the like.

  As the cresol novolac type epoxy resin, EOCN-102S, 103S, 104S, 1012, 1025, 1027 manufactured by Nippon Kayaku Co., Ltd., which is an o-cresol novolak type epoxy resin, YDCN701, 702, 703 manufactured by Toto Kasei Co. 704 and the like.

  As the polyfunctional epoxy resin, Epon 1031S manufactured by Japan Epoxy Resin Co., Ltd., Araldite 0163 manufactured by Ciba Specialty Chemicals Co., Ltd., Denacol EX-611, EX-614, EX-614B, EX-622 manufactured by Nagase ChemteX Corporation. , EX-512, EX-521, EX-421, EX-411, EX-321, and the like.

Examples of the glycidylamine type epoxy resin include Epicoat 604 manufactured by Japan Epoxy Resin Co., Ltd., YH-434 manufactured by Toto Kasei Co., Ltd., TETRAD-X and TETRAD-C manufactured by Mitsubishi Gas Chemical Co., Ltd., and ELM manufactured by Sumitomo Chemical Co., Ltd. -120 etc. are mentioned.
Examples of the heterocyclic ring-containing epoxy resin include Araldite PT810 manufactured by Ciba Specialty Chemicals, ERL4234, ERL4299, ERL4221, and ERL4206 manufactured by UCC.
Examples of the alicyclic epoxy resin include Daimler Chemical Industries' Epolide series and Celoxide series.
These epoxy resins can be used alone or in combination of two or more.

  When using an epoxy resin, it is preferable to use an epoxy resin curing agent. As the epoxy resin curing agent, known curing agents that are usually used can be used, for example, amines, polyamides, acid anhydrides, polysulfides, boron trifluoride, dicyandiamide, bisphenol A, bisphenol F, bisphenol. Examples thereof include bisphenols having two or more phenolic hydroxyl groups per molecule such as S, phenol resins such as phenol novolac resin, bisphenol A novolac resin and cresol novolac resin. Phenol resins such as phenol novolac resin, bisphenol A novolac resin, and cresol novolac resin are particularly preferable in terms of excellent electric corrosion resistance at the time of moisture absorption. In the present invention, the epoxy resin curing agent includes what is called a curing accelerator that acts catalytically on an epoxy group to promote crosslinking.

Among the phenol resins as the epoxy resin curing agent, for example, Dainippon Ink & Chemicals, Inc., trade names: Phenolite LF4871, Phenolite LF2822, Phenolite TD-2090, Phenolite TD-2149 Phenolite VH-4150, Phenolite VH4170, Meiwa Kasei Co., Ltd., trade name: H-1, Japan Epoxy Resin Co., Ltd., trade name: Epicure MP402FPY, Epicure YL6065, Epicure YLH129B65 and Mitsui Chemicals, Inc. Name: Milex XL, Milex XLC, Milex RN, Milex RS, Milex VR and the like.
As a high energy ray polymeric component used for an adhesive bond layer, the high energy ray polymeric component used for the adhesive layer as described below can be used.

  After affixing the adhesive layer to an adherend such as a semiconductor wafer by including, for example, a radiation polymerizable component as a high energy ray polymerizable component used in the pressure-sensitive adhesive layer constituting the adhesive sheet of the present invention Picking up can be facilitated by improving the adhesive strength during dicing by irradiating with radiation before dicing, or reducing the adhesive strength by irradiating with radiation after dicing. In the present invention, as such a radiation polymerizable component, a compound conventionally used in a radiation polymerizable dicing sheet can be used without particular limitation. Further, by including a thermosetting component, the adhesive layer is cured by heat when the semiconductor element is mounted on a support member on which the semiconductor element is to be mounted, heat when passing through the solder reflow, and the like. Reliability can be improved.

  Although it does not restrict | limit especially as a high energy ray polymeric component used for an adhesive layer, For example, methyl acrylate, methyl methacrylate, ethyl acrylate, ethyl methacrylate, butyl acrylate, butyl methacrylate, acrylic acid-2- Ethylhexyl, 2-ethylhexyl methacrylate, pentenyl acrylate, tetrahydrofurfuryl acrylate, tetrahydrofurfuryl methacrylate, diethylene glycol diacrylate, triethylene glycol diacrylate, tetraethylene glycol diacrylate, diethylene glycol dimethacrylate, triethylene glycol dimethacrylate, tetraethylene Glycol dimethacrylate, trimethylolpropane diacrylate, trimethylolpropane triacrylate , Trimethylolpropane dimethacrylate, trimethylolpropane trimethacrylate, 1,4-butanediol diacrylate, 1,6-hexanediol diacrylate, 1,4-butanediol dimethacrylate, 1,6-hexanediol dimethacrylate, penta Erythritol triacrylate, pentaerythritol tetraacrylate, pentaerythritol trimethacrylate, pentaerythritol tetramethacrylate, dipentaerythritol hexaacrylate, dipentaerythritol hexamethacrylate, styrene, divinylbenzene, 4-vinyltoluene, 4-vinylpyridine, N-vinylpyrrolidone 2-hydroxyethyl acrylate, 2-hydroxyethyl methacrylate, 1,3-acrylic Uses yloxy-2-hydroxypropane, 1,2-methacryloyloxy-2-hydroxypropane, methylenebisacrylamide, N, N-dimethylacrylamide, N-methylolacrylamide, tris (β-hydroxyethyl) isocyanurate triacrylate, etc. can do.

  Moreover, a photoinitiator (For example, a thing which produces | generates a free radical by irradiation of high energy rays, such as a radiation) can also be added to an adhesive layer. Examples of the photopolymerization initiator include benzophenone, N, N′-tetramethyl-4,4′-diaminobenzophenone (Michler ketone), N, N′-tetraethyl-4,4′-diaminobenzophenone, 4-methoxy- 4′-dimethylaminobenzophenone, 2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) -butanone-1,2,2-dimethoxy-1,2-diphenylethane-1-one, 1-hydroxy- Aromatic ketones such as cyclohexyl-phenyl-ketone, 2-methyl-1- (4- (methylthio) phenyl) -2-morpholinopropanone-1,2,4-diethylthioxanthone, 2-ethylanthraquinone, phenanthrenequinone, benzoin Methyl ether, benzoin ethyl ether, benzoin pheny Benzoin ethers such as ether, benzoins such as methylbenzoin and ethylbenzoin, benzyl derivatives such as benzyldimethyl ketal, 2- (o-chlorophenyl) -4,5-diphenylimidazole dimer, 2- (o-chlorophenyl) -4 , 5-di (m-methoxyphenyl) imidazole dimer, 2- (o-fluorophenyl) -4,5-phenylimidazole dimer, 2- (o-methoxyphenyl) -4,5-diphenylimidazole dimer 2-mer, 2- (p-methoxyphenyl) -4,5-diphenylimidazole dimer, 2,4-di (p-methoxyphenyl) -5-phenylimidazole dimer, 2- (2,4-dimethoxy) 2,4,5-triarylimidazole dimer such as phenyl) -4,5-diphenylimidazole dimer, - phenyl acridine, 1,7-bis (9,9'-acridinyl) like acridine derivatives heptane, and the like.

Moreover, you may add the photoinitiator which generate | occur | produces a base and a radical with high energy rays, such as radiation irradiation, to an adhesive bond layer. Thereby, radicals are generated by high energy beam irradiation before dicing or after dicing, and the high energy beam polymerizable component is cured, and a base which is a curing agent of the thermosetting resin is generated in the system, and thereafter Since the thermosetting reaction of the adhesive layer by the heat history can be efficiently performed, it is not necessary to add respective initiators for the photoreaction and the thermosetting reaction.
Examples of photoinitiators that generate bases and radicals upon irradiation with high energy rays include, for example, 2-methyl-1 (4- (methylthio) phenyl-2-morpholinopropan-1-one (manufactured by Ciba Specialty Chemicals, Irgacure 907). ), 2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) -butanone-1-one (Ciba Specialty Chemicals, Irgacure 369), hexaarylbisimidazole derivative (halogen, alkoxy group, nitro group) , A substituent such as a cyano group may be substituted with a phenyl group), a benzoisoxazolone derivative, or the like.

In the adhesive layer, the above-mentioned photopolymerization initiator that generates free radicals with high energy rays and the following compound that generates a base with high energy rays may be added separately.
A compound that generates a base upon irradiation is a compound that generates a base upon irradiation, and the generated base increases the curing reaction rate of the thermosetting resin, and is also referred to as a photobase generator. As the base to be generated, a strongly basic compound is preferable in terms of reactivity and curing speed. In general, a pKa value that is a logarithm of an acid dissociation constant is used as a basic index, and a base having a pKa value in an aqueous solution of 7 or more is preferable, and a base of 9 or more is more preferable.

  Moreover, it is preferable to use the compound which generate | occur | produces a base by the light irradiation of wavelength 150-750nm as the compound which generate | occur | produces a base by the said radiation irradiation, In order to generate | occur | produce a base efficiently when using a general light source. A compound that generates a base upon irradiation with light of 250 to 500 nm is more preferable.

  Examples of such compounds that generate a base upon irradiation include imidazole derivatives such as imidazole, 2,4-dimethylimidazole and 1-methylimidazole, piperazine derivatives such as piperazine and 2,5-dimethylpiperazine, piperidine, 1 Piperidine derivatives such as 2-dimethylpiperidine, proline derivatives, trialkylamine derivatives such as trimethylamine, triethylamine, triethanolamine, 4-methylaminopyridine, 4-dimethylaminopyridine and the like, an amino group or an alkylamino group is at the 4-position Substituted pyridine derivatives, pyrrolidine derivatives such as pyrrolidine and n-methylpyrrolidine, alicyclic amine derivatives such as triethylenediamine and 1,8-diazabiscyclo (5,4,0) undecene-1 (DBU), benzylmethyl Min, benzyldimethylamine, and the like benzylamine derivatives such as benzyl diethylamine.

Moreover, in order to increase the storage elastic modulus of the adhesive layer that is cured by radiation or heat, for example, the use amount of an epoxy resin is increased, an epoxy resin having a high glycidyl group concentration, or a phenol resin having a high hydroxyl group concentration is used. Thus, methods such as increasing the crosslinking density of the whole polymer or adding an inorganic filler can be used.
The inorganic filler for increasing the storage elastic modulus of the adhesive layer will be described later.

  Furthermore, a high molecular weight component that is compatible with the thermopolymerizable component can be added to the adhesive layer for the purpose of improving flexibility and reflow crack resistance. Such a high molecular weight component is not particularly limited, and examples thereof include a phenoxy resin, a high molecular weight thermopolymerizable component, and an ultrahigh molecular weight thermopolymerizable component. These can be used alone or in combination of two or more.

  In addition, an inorganic filler may be added to the adhesive layer for the purpose of improving the handleability, improving the thermal conductivity, adjusting the melt viscosity and imparting thixotropic properties. The inorganic filler is not particularly limited. For example, aluminum hydroxide, magnesium hydroxide, calcium carbonate, magnesium carbonate, calcium silicate, magnesium silicate, calcium oxide, magnesium oxide, aluminum oxide, aluminum nitride, aluminum borate whisker , Boron nitride, crystalline silica, amorphous silica and the like, and the shape of the filler is not particularly limited. These fillers can be used alone or in combination of two or more.

Among these, aluminum oxide, aluminum nitride, boron nitride, crystalline silica, and amorphous silica are preferable for improving thermal conductivity. For the purpose of adjusting melt viscosity and imparting thixotropic properties, aluminum hydroxide, magnesium hydroxide, calcium carbonate, magnesium carbonate, calcium silicate, magnesium silicate, calcium oxide, magnesium oxide, aluminum oxide, crystallinity Silica, amorphous silica and the like are preferable.
Further, the average particle size of the inorganic filler is preferably 0.005 μm to 1.0 μm, and the adhesiveness may be lowered even if the average particle size is smaller or larger.
It is preferable that the compounding quantity of an inorganic filler is 1-20 mass% with respect to 100 mass% of adhesive bond layers. If the blending amount is less than 1% by mass, the effect of addition tends not to be obtained. If the blending amount exceeds 20% by mass, the storage elastic modulus of the adhesive layer increases, the adhesiveness decreases, the electrical properties decrease due to residual voids, etc. There is a tendency to cause problems.

  The thickness of the adhesive layer does not affect the bonding operation to the semiconductor wafer and the dicing operation after the bonding while ensuring sufficient adhesion to the adherend such as a support member for mounting the semiconductor element. A range is desirable. From this viewpoint, the thickness of the adhesive layer is preferably 1 to 300 μm, more preferably 5 to 150 μm, and particularly preferably 10 to 100 μm. When the thickness is less than 1 μm, it tends to be difficult to ensure a sufficient die-bonding adhesive force, and when it exceeds 300 μm, there is a tendency that problems such as an influence on the pasting work and the dicing work occur.

  In addition to the above, the pressure-sensitive adhesive layer constituting the adhesive sheet of the present invention can be the same as the film or sheet used for the release substrate. For example, polyester film such as polyethylene terephthalate film, polytetrafluoroethylene film, polyethylene film, polypropylene film, polymethylpentene film, polyolefin film such as polyvinyl acetate film, plastic film such as polyvinyl chloride film, polyimide film, etc. Can be mentioned. Furthermore, the pressure-sensitive adhesive layer may be one in which these films are laminated in two or more layers.

The thickness of the pressure-sensitive adhesive layer is preferably 10 to 500 μm, more preferably 25 to 200 μm, and particularly preferably 50 to 150 μm.
The adhesive sheet of the present invention comprises a release substrate, an adhesive layer and a pressure-sensitive adhesive layer as described above. In the adhesive sheet of the present invention, the release substrate has a thickness of the release substrate from the surface on the adhesive layer side of the release substrate along the planar peripheral edge of the layered body composed of the adhesive layer and the pressure-sensitive adhesive layer. A cut portion E is formed in the thickness direction of the release substrate from the cut portion D in the direction and the surface of the release substrate on the pressure-sensitive adhesive layer side.

  And it is preferable to cut | disconnect so that the angle A of the notch part E with respect to this adhesive layer may be larger than 0 degree and 70 degrees or less when the said peeling base-material plane is made into a reference | standard (0 degree). Here, from the viewpoint of obtaining a better pasting appearance, the angle A of the cut portion E is more preferably 3 to 45 °, further preferably 5 to 30 °, and 7 to 15 °. Is particularly preferred. When the angle A of the cut portion of the cut portion E is in the above range, it is possible to sufficiently suppress the outer peripheral portion shape of the adhesive sheet from being transferred to another portion of the adhesive sheet that has been wound and contacted. it can. For this reason, there is no dent in the transfer site, and defects such as the generation of voids in the transfer site after wafer pasting can be sufficiently suppressed.

However, when the angle of the cut portion is made close to 0 ° with the current precut device, it takes a lot of time to adjust the device and perform the precut process, which tends to reduce the production efficiency. Therefore, the angle A of the cut portion E is preferably 3 to 15 ° in terms of the balance between production efficiency and suppression of defective peeling. Moreover, it is preferable that the angle A of the said notch part E when the said peeling sheet makes the said peeling base-material plane a reference | standard (0 degree) satisfy | fills the conditions of following formula (1).
0 <(A) ≦ 70 (1)

  In addition, the angle A of the said notch part E is the value which measured 10 points arbitrarily by cross-sectional observation with an optical microscope, and averaged this as the depth A of the notch part E formed in the peeling base material was mentioned previously. However, it is preferable that all of the depths of the cut portions E measured arbitrarily at 10 points are within the above range from the viewpoint of sufficiently suppressing the occurrence of peeling failure.

<Method for producing adhesive sheet>
The manufacturing method of the said adhesive sheet is demonstrated.
The manufacturing method of the adhesive sheet of the present invention includes: a first laminating step of laminating an adhesive layer on a release substrate; the surface of the adhesive layer on the side opposite to the side in contact with the release substrate; 1st cutting process which cuts into 0-90 degrees to this exfoliation substrate plane until it reaches, removes the adhesive layer of the cut-out circumference part, and forms the adhesive layer of a predetermined plane shape A second laminating step of laminating the pressure-sensitive adhesive layer so as to cover the predetermined planar shape adhesive layer and the peeling substrate, and a surface of the pressure-sensitive adhesive layer opposite to the peeling substrate side A cut is made in a non-perpendicular direction with respect to the release substrate plane until reaching the release substrate, the adhesive layer on the cut outer peripheral portion is removed, the adhesive layer having the predetermined planar shape, An adhesive layer covering the adhesive layer and contacting the release substrate around the adhesive layer; Characterized in that it comprises a second cutting step of forming a laminate of a constant shape.

  More specifically, an adhesive layer is applied on the release substrate (first lamination step). Next, a pre-cut blade is used to cut from 0 to 90 ° from the surface on the adhesive layer side until reaching the release substrate, and the adhesive layer on the cut outer peripheral portion is removed to adhere to a predetermined planar shape. There exists a 1st cutting process which forms the cut | notch part D cyclically | annularly in the said peeling base material so that an agent layer may be formed. Next, a second lamination step of laminating the pressure-sensitive adhesive layer on the release substrate that has finished the first cutting step, and the release substrate plane until reaching the release substrate from the surface of the pressure-sensitive adhesive layer. Cut in the non-perpendicular direction, remove the adhesive layer on the cut outer peripheral portion, and form a notch E in the release substrate to form a laminate with a predetermined shape (Second cutting step). Thereby, manufacture of an adhesive sheet is completed. Here, in a 1st cutting process, it cuts so that the angle of the notch part D may be 0-90 degrees when the said peeling base-material plane is made into a reference | standard (0 degree). In the second cutting step, a cut is made so that the angle A of the cut portion E is larger than 0 ° and equal to or smaller than 70 ° when the plane of the peeling substrate is the reference (0 °).

Hereinafter, each manufacturing process will be described in more detail.
In the first laminating step, first, the material constituting the adhesive layer is dissolved or dispersed in a solvent to form an adhesive layer forming varnish, which is applied onto a release substrate, and then the solvent is removed by heating. On the other hand, the pressure-sensitive adhesive layer used in the second laminating step is prepared by first dissolving or dispersing the material constituting the pressure-sensitive adhesive layer in a solvent to form a pressure-sensitive adhesive layer-forming varnish, which is applied to the base film, and then heated. After removing the solvent by the step, it is bonded to another base film to obtain an adhesive layer.

  Here, the solvent used in the preparation of the varnish for forming both layers is not particularly limited as long as it can dissolve or disperse each constituent material, but considering the volatility at the time of layer formation, For example, it is preferable to use a solvent having a relatively low boiling point such as methanol, ethanol, 2-methoxyethanol, 2-ethoxyethanol, 2-butoxyethanol, methyl ethyl ketone, acetone, methyl isobutyl ketone, toluene, and xylene. In addition, for the purpose of improving the coating properties, for example, a solvent having a relatively high boiling point such as dimethylacetamide, dimethylformamide, N-methylpyrrolidone, cyclohexanone can be used. These solvents can be used alone or in combination of two or more. In addition, after preparing a varnish, the bubble in a varnish can also be removed by vacuum deaeration.

  As a method for applying the adhesive layer forming varnish to the release substrate in the first laminating step, and a method for applying the adhesive layer forming varnish to the substrate film in the second laminating step, known methods are used. For example, a knife coating method, a roll coating method, a spray coating method, a gravure coating method, a bar coating method, a curtain coating method, a die coating method, or the like can be used.

  In the manufacturing method of the adhesive sheet of the present invention, after the first laminating step, 90 ° until the adhesive layer reaches the release substrate from the surface on the adhesive layer side by a precut blade so that the adhesive layer has a predetermined planar shape. A cut is made below, the adhesive layer on the cut outer peripheral portion is removed, a first cutting step is performed in which a cut portion D is formed in an annular shape on the release substrate, and then the pressure-sensitive adhesive obtained above A second laminating step of laminating a layer so as to cover the adhesive layer of the predetermined planar shape and the release substrate, until the release substrate reaches the release substrate from the surface of the pressure-sensitive adhesive layer. A cut is made in a non-vertical direction, the adhesive layer in the cut outer peripheral portion is removed, and a cut portion E is formed in an annular shape in the release substrate so as to form a laminate having a predetermined shape. Through the second cutting step.

  In addition, bonding of an adhesive bond layer and an adhesive layer can be performed by a conventionally well-known method, for example, can be performed using a laminator etc.

In the first cutting step, the cut portion D is cut so that the angle of the cut portion D is 0 to 90 ° when the plane of the peeling substrate is used as a reference (0 °).
Further, in the second cutting step, the cut A is cut so that the angle A of the cut portion E is larger than 0 ° and equal to or smaller than 70 ° when the plane of the peeling substrate is the reference (0 °). In addition, from the viewpoint of obtaining an adhesive sheet having a better pasting appearance, the angle A of the cut portion E is more preferably 3 to 45 °, further preferably 5 to 30 °, and 7 to 15 °. It is particularly preferred that As described above, however, when the angle of the cut portion is brought close to 0 ° with the current precutting apparatus, it takes a lot of time to adjust the apparatus and perform the precutting process, which tends to reduce the production efficiency. Therefore, the angle d of the cut portion is preferably 3 to 15 ° in terms of the balance between production efficiency and suppression of peeling failure. Thereafter, unnecessary portions of the laminate are peeled and removed as necessary to obtain a target adhesive sheet.

  As mentioned above, although preferred embodiment of the adhesive sheet of this invention and the manufacturing method of an adhesive sheet was described in detail, this invention is not limited to these embodiment.

<Method for Manufacturing Semiconductor Device>
A method for manufacturing a semiconductor device using the adhesive sheet of the present invention will be described.
In the adhesive sheet of the present invention, the release substrate plays the role of a carrier film, and while being supported by two rolls and a wedge-shaped member, one end of the release sheet is wound while being connected to a cylindrical core. 1 roll is formed, and the other end is wound in a state of being connected to a cylindrical core to form a second roll. And the winding core drive motor for rotating the said core is connected to the core of the 2nd roll, and the peeling base material after the 2nd laminated body in an adhesive sheet peeled is predetermined. It is designed to be wound at a speed of.

  First, when the winding core driving motor rotates, the winding core of the second roll rotates, and the adhesive sheet wound around the winding core of the first roll is pulled out of the first roll. The drawn adhesive sheet is guided onto a disk-shaped semiconductor wafer disposed on a movable stage and a wafer ring disposed so as to surround the disk-shaped semiconductor wafer.

  Next, the laminated body which consists of an adhesive bond layer and an adhesive layer is peeled from a peeling base material. At this time, a wedge-shaped member is applied from the peeling substrate side of the adhesive sheet, the peeling substrate is bent at an acute angle toward the member side, and a peeling starting point is created between the peeling substrate and the laminate. . Further, air is blown to the boundary surface between the peeling substrate and the laminate so that the peeling starting point is more efficiently created.

  After the separation starting point is created between the release substrate and the laminate in this way, the laminate is attached so that the adhesive layer is in close contact with the wafer ring and the adhesive layer is in close contact with the semiconductor wafer. Is called. At this time, the laminate is pressed against the semiconductor wafer and the wafer ring by the roll. Then, the attachment of the stacked body on the semiconductor wafer and the wafer ring is completed.

  By the procedure as described above, the second laminated body can be attached to the semiconductor wafer continuously in an automated process. As an apparatus for performing the operation of attaching the laminated body to such a semiconductor wafer, for example, RAD-2500 (trade name) manufactured by Lintec Corporation may be used.

  And when sticking a laminated body to a semiconductor wafer by such a process, by using an adhesive sheet, the peeling origin between a peeling base material and a laminated body (the peeling origin between a peeling base material and an adhesive layer) ) Can be easily produced, and the occurrence of peeling failure can be sufficiently suppressed.

  Next, the semiconductor wafer to which the laminated body is attached by the above-described process is diced to a required size by a cutting member, for example, a dicing blade, to obtain a semiconductor element to which an adhesive layer is attached. Here, steps such as washing and drying may be further performed. At this time, since the semiconductor wafer is sufficiently adhered to the adhesive layer by the adhesive layer, the semiconductor wafer and the semiconductor element after dicing are sufficiently prevented from falling off during each of the above steps.

  Next, the adhesive layer is irradiated with high energy rays such as radiation, and a part of the adhesive layer is polymerized and cured. At this time, heating may be further performed for the purpose of accelerating the curing reaction simultaneously with or after irradiation with the high energy beam. Irradiation of the high energy ray to the pressure-sensitive adhesive layer is performed from the surface of the pressure-sensitive adhesive layer on which the adhesive layer is not provided. Therefore, when ultraviolet rays are used as the high energy rays, the pressure-sensitive adhesive layer needs to be light transmissive. In addition, when using an electron beam as a high energy ray, the adhesive layer does not necessarily need to be light transmissive.

  After the high energy beam irradiation, the semiconductor element to be picked up is picked up by, for example, a suction collet. At this time, the semiconductor element to be picked up can also be pushed up from the lower surface of the pressure-sensitive adhesive layer, for example, with a needle rod or the like. By curing the adhesive layer, when picking up the semiconductor element, it is easy for peeling to occur at the interface between the adhesive layer and the adhesive layer, and the adhesive layer is picked up with the adhesive layer attached to the lower surface of the semiconductor element. It becomes. Then, the semiconductor element to which the adhesive layer is attached is placed on the support member for mounting the semiconductor element via the adhesive layer, and heated. By heating, the adhesive layer exhibits an adhesive force, and the bonding between the semiconductor element and the semiconductor element mounting support member is completed. Then, a semiconductor device is manufactured through a wire bonding process, a sealing process, and the like as necessary.

<Semiconductor device>
In the semiconductor device of the present invention, a semiconductor element is laminated on an organic substrate serving as a support member for mounting a semiconductor element via an adhesive layer. Further, a circuit pattern and a terminal are formed on the organic substrate, and the circuit pattern and the semiconductor element are connected to each other by wire bonds. These are sealed with a sealing material to form a semiconductor device. This semiconductor device is manufactured using the adhesive sheet of the present invention by the above-described method for manufacturing a semiconductor device of the present invention. As mentioned above, although the manufacturing method of the semiconductor device of this invention and the suitable embodiment of the semiconductor device were demonstrated in detail, this invention is not limited to these embodiment.

EXAMPLES Hereinafter, examples and comparative examples will be described more specifically, but the present invention is not limited to the following examples.
<Preparation of adhesive layer forming varnish>
First, a cresol novolac type epoxy resin (manufactured by Toto Kasei Co., Ltd., trade name: YDCN-700-10, epoxy equivalent: 220) 60% by mass as an epoxy resin and a low water-absorbing phenol resin (manufactured by Mitsui Chemicals, Inc.) (Product name: XLC-LL, phenol xylene glycol dimethyl ether condensate) 40% by mass was added with 1500 parts by mass of cyclohexanone as a varnish preparation solvent, and mixed with stirring until completely dissolved.

  Next, γ-glycidoxypropyltrimethoxysilane (manufactured by Nihon Unicar Co., Ltd., trade name: NUC A-189) 1.5 mass% and γ-ureidopropyltriethoxysilane (manufactured by Nihon Unicar Co., Ltd.) as coupling agents (Trade name: NCU A-1160) 3% by mass was added, and further, 32% by mass of silica filler (manufactured by Nippon Aerosil Co., Ltd., trade name: R972V) was added as an inorganic filler, followed by stirring and mixing, followed by dispersion treatment with a bead mill. .

  Furthermore, as a high molecular weight component, an epoxy group-containing acrylic copolymer (manufactured by Teikoku Chemical Industry Co., Ltd., trade name: HTR-860P-3) 200% by mass and as a curing accelerator 1-cyanoethyl-2-phenylimidazole (Shikoku) 0.5% by mass (trade name: Curesol 2PZ-CN) manufactured by Kasei Co., Ltd. was added and mixed by stirring to prepare an adhesive layer forming varnish.

Example 1
The adhesive layer forming varnish is applied onto a 50 μm-thick polyethylene terephthalate film (trade name: Teijin Purex A31, manufactured by Teijin DuPont Films, Ltd.), which is a peeling substrate, and heat-dried at 140 ° C. for 5 minutes. And an uncured adhesive layer having a thickness of 10 μm was formed. (First lamination step)
The obtained adhesive layer was subjected to circular precut processing with a diameter of 210 mm (φ) by adjusting the cut angle to the release substrate to be 90 ° (first cutting step).

  The pressure-sensitive adhesive layer is composed of 63% by mass of dipentaerythritol hexaacrylate (manufactured by Nippon Kayaku Co., Ltd., trade name: Kayarad DPHA) as a radiation-polymerizable component, and 2-methyl-1 (4- (methylthio) as a photopolymerization initiator. Phenyl-2-morpholinopropan-1-one (manufactured by Ciba Specialty Chemicals, trade name: Irgacure 907) 5% by mass, as a varnish adjusting solvent, 32% by mass of cyclohexanone was added and mixed with stirring for 60 minutes or more. A layer forming varnish was prepared, which was coated on a 38 μm-thick base film Teijin DuPont Films Co., Ltd. (trade name: Teijin Purex A53) and dried at 110 ° C. for 10 minutes. And the obtained film was made of polyethylene film (film thickness 100 um) film thickness 110 A pressure-sensitive adhesive layer with a base film was obtained by bonding with μm.

  Then, the unnecessary part of the adhesive bond layer was removed, and it was pasted under the conditions of room temperature, linear pressure of 1 kg / cm, and speed of 0.5 m / min so that the adhesive layer with a base film was in contact with the adhesive layer. (Second laminating step) And, for the pressure-sensitive adhesive layer with a base film, the angle of cut to the release base is adjusted to 9 °, and the diameter is 290 mm (φ) concentrically with the adhesive layer. Circular pre-cut processing was performed to remove unnecessary portions of the pressure-sensitive adhesive layer (second cutting step). Thereby, an adhesive sheet was obtained.

(Example 2)
An adhesive sheet was obtained in the same manner as in Example 1 except that the cutting angle in the second cutting step was 30 °.

(Example 3)
An adhesive sheet was obtained in the same manner as in Example 1 except that the cutting angle in the second cutting step was 50 °.
Example 4
An adhesive sheet was obtained in the same manner as in Example 1 except that the cutting angle in the second cutting step was set to 70 °.
(Example 5)
An adhesive sheet was obtained in the same manner as in Example 1 except that the cutting angle was set to 30 ° in the first cutting step.
(Example 6)
An adhesive sheet was obtained in the same manner as in Example 1 except that the cutting angle was set to 70 ° in the first cutting step.

(Example 7)
An adhesive sheet was obtained in the same manner as in Example 1 except that the thickness of the adhesive layer was 40 μm.

(Example 8)
An adhesive sheet was obtained in the same manner as in Example 4 except that the thickness of the adhesive layer was 40 μm.

Example 9
An adhesive sheet was obtained in the same manner as in Example 5 except that the thickness of the adhesive layer was 40 μm.

(Comparative Example 1)
The adhesive layer forming varnish is applied onto a polyethylene terephthalate film (trade name: Teijin Purex A31, manufactured by Teijin DuPont Film Co., Ltd.) having a film thickness of 50 μm, dried by heating at 140 ° C. for 5 minutes, and a film thickness of 10 μm. The B-stage state adhesive layer was formed.
The resulting adhesive layer was subjected to circular precut processing with a diameter of 210 mm (φ) by adjusting the cut angle to the release substrate to be 110 ° (first cutting step).

  Then, the unnecessary part of the adhesive bond layer was removed, and it was pasted under the conditions of room temperature, linear pressure of 1 kg / cm, and speed of 0.5 m / min so that the adhesive layer with a base film was in contact with the adhesive layer. Then, the adhesive layer with a base film is subjected to circular precut processing with a diameter of 270 mm (φ) concentrically with the adhesive layer by adjusting the cut angle to the peeling base material to be 90 °. Unnecessary portions of the agent layer were removed (second cutting step). Thereby, an adhesive sheet was obtained.

(Comparative Example 2)
An adhesive sheet was obtained in the same manner as in Comparative Example 1 except that the cutting angle in the second cutting step was set to 70 °.

(Comparative Example 3)
An adhesive sheet was obtained in the same manner as in Comparative Example 1 except that the cutting angle in the second cutting step was 30 °.

<Evaluation test for transcriptional inhibition of winding marks>
With the adhesive sheets obtained in Examples 1 to 6 and Comparative Examples 1 to 3 described above, the winding tension was set to 1 kg and 3 kg so that the number of the laminates (with the peeling substrate) having a circular shape was 300 sheets. It wound up in roll shape and produced the adhesive sheet roll. The obtained adhesive sheet roll was left in a refrigerator (5 ° C.) for 2 weeks. Thereafter, the adhesive sheet roll is returned to room temperature, and then the roll is unwound, and the presence or absence of transfer on the outer periphery of the adhesive sheet is visually observed for the 150th film, and in three stages of ○, Δ, and × according to the following evaluation criteria. The transfer inhibition property of the adhesive sheet was evaluated. The results are shown in Tables 1 and 2.

The evaluation criteria are as follows.
○: A dent (transfer of traces) cannot be confirmed even when observed from any angle.
Δ: A dent (transfer of traces) cannot be confirmed from the upper surface of the film, but a dent can be confirmed by changing the angle of the film and observing.
X: Observed from the upper surface of the film, and dents (transfer of traces) can be confirmed on the film.

  In addition, in the adhesive sheet after evaluating the presence or absence of transfer of the outer peripheral portion of the adhesive sheet, the adhesive layer and the pressure-sensitive adhesive layer are peeled off from the peeling substrate, and the appearance when this is attached to the semiconductor wafer from the adhesive layer side, In particular, the presence or absence of voids was visually evaluated. As a result, when the evaluation result of the presence or absence of transfer on the outer peripheral portion of the adhesive sheet was ○, generation of voids was sufficiently suppressed, and when it was Δ, voids were slightly generated, As a result, it was confirmed that many voids were generated.

  As shown in Table 1, according to the adhesive sheets (Examples 1 to 9) according to the present invention, compared to the adhesive sheets (Comparative Examples 1 to 3) of the comparative example, It is clear that the transfer of the trace to the adhesive layer can be sufficiently suppressed. That is, it was confirmed that the adhesive sheets (Examples 1 to 9) according to the present invention can sufficiently suppress the generation of voids when the adhesive layer is attached to a semiconductor wafer.

It is the schematic which shows an example of the adhesive sheet of this invention. It is AA sectional drawing of the adhesive sheet shown in FIG.

Explanation of symbols

1 Peeling substrate 2 Adhesive layer 3 Adhesive layer

Claims (13)

A release substrate, an adhesive layer disposed on the release substrate, having a predetermined planar shape, and covering the adhesive layer and being in contact with the release substrate around the adhesive layer A laminate comprising a pressure-sensitive adhesive layer and having a predetermined shape, and an adhesive sheet in which a plurality of the laminates are dispersed and arranged in the length direction on the release substrate,
The whole or a part of the outer peripheral part of the adhesive layer has a cut at 90 ° or less with respect to the release substrate plane, and the whole or a part of the outer periphery of the adhesive layer is cut with respect to the release substrate plane. An adhesive sheet characterized by having a cut in a non-vertical direction. The angle of cut (A) when the cut of the pressure-sensitive adhesive layer is based on the release substrate plane (0 °) satisfies the condition of the following formula (1). The adhesive sheet as described.
0 <(A) ≦ 70 (1)   The adhesive sheet according to claim 1 or 2, wherein a predetermined planar shape of the adhesive layer is larger than a planar shape of an adherend to which the laminate is to be attached after the release substrate is peeled off.   The pressure-sensitive adhesive layer has adhesiveness at room temperature (25 ° C.) with respect to an adherend to which the adhesive layer is to be attached and the adhesive layer after peeling the release substrate. The adhesive sheet as described in any one of 1-3.   The said adhesive bond layer contains an epoxy resin and an epoxy resin hardening | curing agent, and the high molecular weight component whose weight average molecular weight containing a functional monomer is 100,000 or more, The any one of Claims 1-4 characterized by the above-mentioned. The adhesive sheet according to item.   The adhesive sheet according to claim 5, wherein the high molecular weight component is a glycidyl group-containing (meth) acrylic copolymer, and the amount of the epoxy group-containing monomer is 0.5 to 50% by mass.   The storage adhesive modulus of the adhesive layer before curing at 25 ° C is 10 to 10000 MPa, and the storage elastic modulus after curing at 260 ° C is 0.5 to 1000 MPa. The adhesive sheet according to claim 1.   The pressure-sensitive adhesive layer includes a high-energy ray-polymerizable component capable of controlling an adhesive strength at the interface between the adhesive layer and the pressure-sensitive adhesive layer by irradiating high-energy rays. The adhesive sheet according to item.   It is the manufacturing method of the adhesive sheet as described in any one of Claims 1-8, Comprising: The 1st lamination process which laminates | stacks an adhesive bond layer on a peeling base material, It contacts the said peeling base material of the said adhesive bond layer. A cut is made at 90 ° or less with respect to the surface of the release substrate until the release substrate reaches the release substrate from the surface opposite to the side, and the adhesive layer on the cut outer peripheral portion is removed to obtain a predetermined planar shape. A first cutting step for forming an adhesive layer, a second laminating step for laminating the pressure-sensitive adhesive layer so as to cover the adhesive layer having the predetermined planar shape and the release substrate, and the pressure-sensitive adhesive layer. Cut from the surface opposite to the peeling substrate side until reaching the peeling substrate in a non-perpendicular direction with respect to the peeling substrate plane, and remove the adhesive layer of the cut outer peripheral portion, An adhesive layer having a predetermined planar shape, and covering the adhesive layer and surrounding the adhesive layer; Comprising a pressure-sensitive adhesive layer in contact with the group members, the production method of the adhesive sheet, characterized in that it comprises a second cutting step of forming a laminated body having a predetermined shape. In the second cutting step, the angle (A) of the cut portion when the plane of the peeling substrate is defined as a reference (0 °) satisfies the condition of the following formula (1). The manufacturing method of the adhesive sheet of 9.
0 <(A) ≦ 70 (1) In the method of manufacturing a semiconductor device using an adhesive sheet, the adhesive sheet is an adhesive sheet according to any one of claims 1 to 8, or an adhesive sheet manufactured by the manufacturing method according to claim 9 or 10. There,
The laminate is peeled from the release substrate, and the laminate is attached to a semiconductor wafer from the surface on the adhesive layer side to obtain a semiconductor wafer with a laminate, the semiconductor wafer with a laminate, A dicing process in which at least the interface between the adhesive layer and the pressure-sensitive adhesive layer is cut with a cutting member, and the semiconductor wafer is cut into semiconductor elements of a predetermined size. After reducing the adhesive force of the adhesive layer to the adhesive layer, the semiconductor element is picked up from the adhesive layer together with the adhesive layer to obtain a semiconductor element with an adhesive layer, and with the adhesive layer The manufacturing method of the semiconductor device characterized by including the adhesion process which adhere | attaches the said semiconductor element in a semiconductor element to a to-be-adhered body through the said adhesive bond layer.   The method of manufacturing a semiconductor device according to claim 11, wherein the adherend is a support member for mounting a semiconductor element or another semiconductor element.   A semiconductor device manufactured by the method for manufacturing a semiconductor device according to claim 11.