JP2011111530A - Adhesive sheet and method for producing the same and method for producing semiconductor device and semiconductor device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an adhesive sheet that enables easy position recognition of an adhesive layer by a sensor upon pre-cut processing of a dicing tape and also enables suppression of position sift between the adhesive layer and the dicing tape. <P>SOLUTION: The adhesive sheet includes a release substrate 1 and a laminate 4 with a predetermined shape. The laminate 4 includes: an adhesive layer 2 with a predetermined planar shape disposed on the release substrate 1; and an adhesive film 3 formed to cover the adhesive layer 2 and to contact the release substrate 1 at the periphery of the adhesive layer 2. A plurality of the laminates 4 are distributed on the release substrate 1 in the longitudinal direction of the release substrate 1. In the adhesive layer 2, the light transmittance at 200-800 nm wavelengths is 10-90% and spectral transmittance in the 200-400 nm wavelength region is 85% or less. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to an adhesive sheet, a manufacturing method thereof, a manufacturing method of a semiconductor device, and a semiconductor device.

  In recent years, there has been a rapid increase in demands for multifunctional and lightweight and compact mobile related devices. Along with this, the need for high-density mounting of semiconductor elements is increasing year by year, and the development of a stacked multichip package (hereinafter referred to as “stacked MCP”) in which semiconductor elements are stacked plays a central role.

  The technical development of stacked MCP is to achieve both conflicting goals of package miniaturization and multi-stage loading. For this reason, the thickness of silicon wafers used for semiconductor elements has been rapidly reduced, and wafers with a thickness of 100 μm or less are being actively used and studied. In addition, since the multi-stage stacking causes the complexity of the package manufacturing process, there is a need for a manufacturing process and material proposals corresponding to the simplification of the package manufacturing process and the increase in the number of thermal histories of wire bonding due to multi-stage stacking. .

  Under such circumstances, a paste material has been conventionally used as an adhesive member of the stacked MCP. However, the paste material has a problem that the resin protrudes in the bonding process of the semiconductor element and the film thickness accuracy is low. Since these problems cause problems during wire bonding, voids in the paste, and the like, when the paste material is used, it has become impossible to cope with the above requirements.

  In recent years, in order to improve such a problem, a film-like adhesive has been used instead of the paste material. Compared to paste materials, film adhesives can control the amount of protrusion in the bonding process of semiconductor elements, and increase film thickness accuracy to reduce film thickness variation. Therefore, application to a stacked MCP is being actively studied.

  This film-like adhesive usually has a configuration in which an adhesive layer is formed on a release substrate, and one of typical usage methods is a wafer back surface application method. The wafer back surface attaching method is a method of directly attaching a film adhesive to the back surface of a silicon wafer used for manufacturing a semiconductor element. In this method, after a film adhesive is applied to a semiconductor wafer, the release substrate is removed, and a dicing tape is applied on the adhesive layer. Thereafter, the wafer is mounted on the wafer ring, and the wafer is cut into a desired semiconductor element size together with the adhesive layer. The semiconductor element after dicing has a structure having an adhesive layer cut out to the same size on the back surface. The semiconductor element with the adhesive layer is picked up and attached to a substrate to be mounted by a method such as thermocompression bonding. wear.

  The dicing tape used for this back surface application method usually has a configuration in which an adhesive layer is formed on a base film, and is roughly divided into two types, a pressure-sensitive dicing tape and a UV dicing tape. . As a function required for the dicing tape, at the time of dicing, a sufficient adhesive force is required so that the semiconductor element does not scatter due to a load accompanying cutting of the wafer, and when picking up each diced semiconductor element, an adhesive to each element It is required that there is no residue and that a semiconductor element with an adhesive layer can be easily picked up by a die bonder facility.

  In addition, there is a growing demand for process improvement due to the desire to shorten the package manufacturing process. In the conventional wafer back surface pasting method, two steps of pasting the dicing tape after pasting the film adhesive on the wafer are necessary. In order to simplify this process, the film adhesive and An adhesive sheet (die-bonded dicing sheet) having both functions of a dicing tape has been developed. As this adhesive sheet, a laminated type having a structure in which a film adhesive and a dicing tape are bonded together (for example, see Patent Documents 1 to 3), or both a pressure-sensitive adhesive layer and an adhesive layer with a single resin layer. There is a single layer type (see, for example, Patent Document 4) having the above functions.

  Further, there is known a method (so-called precut processing) in which such an adhesive sheet is processed in advance into the shape of a wafer constituting a semiconductor element (see, for example, Patent Documents 5 and 6). Such pre-cut processing is a method in which a resin layer is punched in accordance with the shape of the wafer to be used, and the resin layer other than the portion to which the wafer is attached is peeled off.

  When such pre-cut processing is performed, generally, a laminated type adhesive sheet is pre-cut in a film adhesive so that the adhesive layer is matched to the wafer shape and bonded to the dicing tape. It is manufactured by applying pre-cut processing that matches the wafer ring shape. In addition, a single-layer type adhesive sheet generally forms a resin layer (hereinafter referred to as “adhesive layer”) having both functions of an adhesive layer and an adhesive layer on a release substrate. The adhesive layer is prepared by a method such as pre-cut processing, removing unnecessary portions of the resin layer, and bonding to the base film.

Japanese Patent No. 3348923 JP 10-335271 A Japanese Patent No. 2678655 Japanese Patent Publication No. 7-15087 Japanese Utility Model Publication No. 6-18383 Registered Utility Model No. 3021645

  In the pre-cut processing for producing the laminated type adhesive sheet described above, when pre-cut processing is performed on the dicing tape, the position of the edge of the adhesive layer is recognized by a sensor or the like, and the adhesive layer and the dicing tape are attached. A mechanism that does not cause a shift in position is widely used. On the other hand, thinning of the adhesive layer is progressing, and when the position of the adhesive layer is recognized, the sensor malfunctions, and the position of the adhesive layer and the dicing tape is shifted by the pre-cut processing of the dicing tape. There's a problem.

  The present invention has been made in view of the above-described problems of the prior art, and can easily recognize the position of the adhesive layer by the sensor during the precut processing of the dicing tape. It is an object of the present invention to provide an adhesive sheet capable of suppressing misalignment, a method for manufacturing the same, a method for manufacturing a semiconductor device using the adhesive sheet, and a semiconductor device.

  In order to achieve the above object, the present invention provides a release substrate, an adhesive layer having a predetermined planar shape disposed on the release substrate, and covering the adhesive layer and of the adhesive layer. A laminate having a predetermined shape made of an adhesive film formed so as to be in contact with the release substrate at the periphery, and a plurality of the laminates on the release substrate in the longitudinal direction of the release substrate The adhesive sheet is dispersed and arranged, wherein the adhesive layer has a light transmittance of 10 to 90% at a wavelength of 200 to 800 nm and a spectral transmittance of 85% or less in a region of a wavelength of 200 to 400 nm. An adhesive sheet is provided.

  Such an adhesive sheet can reduce the transmittance of light emitted from a sensor that detects the end of the adhesive layer, and can easily recognize the position of the end of the adhesive layer. Therefore, even when the adhesive layer is thinned, the sensor malfunction in the position recognition of the adhesive layer is prevented during the precut processing of the adhesive film that is a dicing tape, and the adhesive layer and the adhesive film Misalignment is sufficiently suppressed.

  In the adhesive sheet of the present invention, the adhesive layer includes (A) at least one light transmittance adjusting component selected from the group consisting of a polyether compound, a pigment, a dye, and a light absorber, and (B). It is preferable to contain a heat-polymerizable component and (C) a high molecular weight component having a weight average molecular weight of 100,000 or more containing a functional monomer as a structural unit. Thereby, the malfunction of the sensor in the position recognition of the adhesive layer is more sufficiently prevented during the precut processing of the pressure-sensitive adhesive film, and the adhesive layer has excellent adhesive strength.

  In the adhesive sheet of the present invention, the polyether compound is preferably at least one selected from the group consisting of an aromatic polyetherimide, an aromatic polyetheramideimide, and an aromatic polyetheramide. Thereby, the adhesive strength of an adhesive bond layer can be improved more.

  In the adhesive sheet of the present invention, the (C) high molecular weight component may be a glycidyl group-containing (meth) acrylic copolymer having an epoxy group-containing monomer unit content of 0.5 to 50% by mass. preferable. Thereby, the adhesive strength of an adhesive bond layer can be improved more.

  In the adhesive sheet of the present invention, the adhesive layer has a storage elastic modulus at 25 ° C. of 10 to 10,000 MPa, and a storage elastic modulus after curing at 260 ° C. of 0.5 to 1000 MPa. Is preferred. Thereby, the processability of the precut is sufficiently ensured, and the reliability of the semiconductor device manufactured using the adhesive sheet can be improved.

  Furthermore, in the adhesive sheet of the present invention, the adhesive layer preferably has a thickness of 15 μm or less. According to the adhesive sheet of the present invention, even when the thickness of the adhesive layer is reduced to 15 μm or less, the sensor malfunction due to the position recognition of the adhesive layer is prevented during the precut processing of the adhesive film. Thus, the positional deviation between the adhesive layer and the pressure-sensitive adhesive film is sufficiently suppressed.

  The present invention is also a method for producing the adhesive sheet of the present invention, wherein the first lamination step of laminating the adhesive layer on the release substrate and the side of the adhesive layer that contacts the release substrate are opposite. A first notch is formed in the adhesive layer from the side surface until reaching the release substrate, and the adhesive layer in the outer peripheral portion thus cut is removed to form an adhesive layer having a predetermined planar shape. Cutting step, a second laminating step of laminating the pressure-sensitive adhesive film so as to cover the adhesive layer having the predetermined planar shape and the peeling substrate, and a side opposite to the peeling substrate side of the pressure-sensitive adhesive film Cut the adhesive film from the surface until reaching the release substrate, remove the adhesive film on the outer peripheral portion that was cut, cover the adhesive layer of the predetermined planar shape, and the adhesive layer and Viscosity in contact with the release substrate around the adhesive layer Consisting of a film, to provide a production method of the adhesive sheet comprising a second cutting step of forming a laminate having a predetermined shape, a.

  According to this method for manufacturing an adhesive sheet, in the second cutting step, the transmittance of light emitted from a sensor that detects the end of the adhesive layer is reduced, and the position of the end of the adhesive layer is easily recognized. Is possible. Therefore, even when the adhesive layer is thinned, the sensor malfunction in the position recognition of the adhesive layer is prevented during the precut processing of the adhesive film that is a dicing tape, and the adhesive layer and the adhesive film An adhesive sheet in which the displacement is sufficiently suppressed can be obtained.

  The present invention also peels off the laminate in the adhesive sheet of the invention from the release substrate, and attaches the laminate to a semiconductor wafer from the surface on the adhesive layer side to obtain a semiconductor wafer with a laminate. A dicing step of cutting the semiconductor wafer with the laminated body with a cutting member to at least an interface between the adhesive layer and the adhesive film, and cutting the semiconductor wafer into a semiconductor element of a predetermined size; The semiconductor element is picked up from the pressure-sensitive adhesive film together with the adhesive layer to obtain a semiconductor element with an adhesive layer, and the semiconductor element in the semiconductor element with the adhesive layer is attached via the adhesive layer A method for manufacturing a semiconductor device is provided that includes a bonding step of bonding to a body. Here, the adherend is preferably a support member for mounting a semiconductor element or another semiconductor element.

  The present invention further provides a semiconductor device manufactured by the semiconductor device manufacturing method of the present invention.

  According to the present invention, it is possible to easily recognize the position of the adhesive layer by the sensor at the time of precut processing of the dicing tape, and the adhesive sheet capable of suppressing the positional deviation between the adhesive layer and the dicing tape, and the manufacturing method thereof, And the manufacturing method and semiconductor device of a semiconductor device using the said adhesive sheet can be provided.

It is a top view which shows suitable one Embodiment of the adhesive sheet of this invention. It is sectional drawing at the time of cut | disconnecting the adhesive sheet shown in FIG. 1 along the X-X 'line | wire of FIG. (A)-(d) is a series of process figures which show suitable one Embodiment of the manufacturing method of the adhesive sheet of this invention. (E)-(h) is a series of process figures which show suitable one Embodiment of the manufacturing method of the adhesive sheet of this invention. It is sectional drawing which shows the state which crimped | bonded the laminated body in the adhesive sheet of this invention to the semiconductor wafer and the wafer ring.

  Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the drawings. In the drawings, the same or corresponding parts are denoted by the same reference numerals, and redundant description is omitted. Further, the dimensional ratios in the drawings are not limited to the illustrated ratios.

<Adhesive sheet>
The adhesive sheet of the present invention includes a release substrate, an adhesive layer having a predetermined planar shape disposed on the release substrate, and the release group covering the adhesive layer and around the adhesive layer. A laminate having a predetermined shape made of an adhesive film formed so as to be in contact with the material, and a plurality of the laminates are dispersedly arranged in the longitudinal direction of the release substrate on the release substrate. An adhesive sheet, wherein the adhesive layer has a light transmittance of 10 to 90% at a wavelength of 200 to 800 nm, and a spectral transmittance in a region of a wavelength of 200 to 400 nm is 85% or less. To do.

  The adhesive sheet of the present invention is an adhesive sheet subjected to the above-described precut processing. And in the adhesive sheet of this invention, when the light transmittance of the wavelength 200-800 nm and the spectral transmittance in the 200-400 nm area | region of the adhesive layer part are in the said range, of the adhesive film as a dicing tape During pre-cut processing, it is possible to reduce the transmittance of the light emitted from the sensor in the adhesive layer, making it easy to detect the edge of the adhesive layer, and defects such as misalignment between the adhesive layer and the adhesive film Can be sufficiently suppressed.

  FIG. 1 is a plan view showing a preferred embodiment of the adhesive sheet of the present invention, and FIG. 2 is a cross-sectional view of the adhesive sheet shown in FIG. 1 taken along the line XX ′ of FIG. It is. As shown in FIGS. 1 and 2, the adhesive sheet 10 includes a release substrate 1, an adhesive layer 2 having a predetermined planar shape disposed on the release substrate 1, and the adhesive layer 2. And a laminated body 4 having a predetermined shape, which is made of an adhesive film 3 formed so as to be in contact with the peeling substrate 1 around the adhesive layer 2. The laminate 4 has a structure in which the laminate 4 is dispersedly arranged in the longitudinal direction of the release substrate 1. Further, the adhesive film 3 remains around the laminate 4. Further, the pressure-sensitive adhesive film 3 has a base film 8 provided with a pressure-sensitive adhesive layer 7.

  In the adhesive sheet 10, the adhesive layer 2 and the pressure-sensitive adhesive film 3 are pre-cut so as to have a predetermined planar shape. When the adhesive film 3 is precut, the position of the end 6 of the adhesive layer 2 is detected by the sensor, and the adhesive film 3 is precut based on the detection result. At this time, when the adhesive layer 2 is thinned by the light transmittance of the adhesive layer 2 having a wavelength of 200 to 800 nm and the spectral transmittance in the region of 200 to 400 nm satisfying the specific conditions of the present application. Even if it exists, the position recognition of the adhesive bond layer 2 by a sensor can be made easy, and the position shift of the adhesive bond layer 2 and the dicing tape 3 will fully be suppressed.

  In the adhesive sheet 10, the adhesive layer 2 preferably has a predetermined planar shape that matches the planar shape of the adherend to which the laminate 4 is to be attached after the release substrate 1 is peeled off. .

  Examples of the adherend include a semiconductor wafer, and the adhesive layer 2 having a planar shape that matches the planar shape of the semiconductor wafer tends to facilitate the process of dicing the semiconductor wafer. There is. In addition, the planar shape of the adhesive layer 2 does not need to completely match the planar shape of the semiconductor wafer. For example, the planar shape of the semiconductor wafer may be similar to the planar shape of the semiconductor wafer. It may be slightly larger.

  In the adhesive sheet 10, the pressure-sensitive adhesive film 3 has a structure in which the pressure-sensitive adhesive layer 7 is formed on the base film 8. The pressure-sensitive adhesive layer 7 preferably has adhesiveness at room temperature (25 ° C.) with respect to the adherend to which the adhesive layer 2 is to be attached and the adhesive layer 2 after the release substrate 1 is peeled off. . Thereby, when dicing a semiconductor wafer, a semiconductor wafer is fully fixed and dicing becomes easy. Further, when a wafer ring is used when dicing a semiconductor wafer, and the laminate 4 is attached so that the adhesive layer 7 is in close contact with the wafer ring, sufficient adhesion to the wafer ring is obtained. Dicing becomes easy.

  Further, when the adhesive layer 2 is directly attached to the wafer ring, the adhesive force of the adhesive layer 2 needs to be adjusted to a low adhesive force that can be easily peeled off from the wafer ring. By sticking 7 to the wafer ring, such adjustment of the adhesive force becomes unnecessary. Accordingly, the adhesive layer 2 has a sufficiently high adhesive strength, and the adhesive layer 7 has a sufficiently low adhesive strength that allows the wafer ring to be easily peeled off, thereby dicing the semiconductor wafer. The subsequent wafer ring peeling operation can be performed more efficiently. Furthermore, since the adhesive force of the pressure-sensitive adhesive layer 7 can be adjusted to be sufficiently low, it becomes easy to create a peeling start point between the peeling substrate 1 and the pressure-sensitive adhesive layer 7, and the adhesive layer 2 from the peeling substrate 1. In addition, the adhesive layer 7 can be easily peeled off, and the occurrence of poor peeling can be more sufficiently suppressed.

  Furthermore, the pressure-sensitive adhesive layer 7 is preferably reduced in adhesive strength to the adhesive layer 2 by irradiation with high energy rays. As a result, when the adhesive layer 2 is peeled from the pressure-sensitive adhesive layer 7, the peeling can be easily performed by irradiating with high energy rays such as ultraviolet rays, electron beams, and radiation.

  In the adhesive sheet 10, the adhesive layer 2 preferably has a storage elastic modulus at 25 ° C of 10 to 10,000 MPa and a storage elastic modulus after curing at 260 ° C of 0.5 to 1000 MPa. When the storage elastic modulus of the adhesive layer 2 before curing at 25 ° C. is in the above range, it becomes easy to ensure the precut processability. Moreover, when the storage elastic modulus of the adhesive layer 2 completely cured at 260 ° C. is in the above range, the reliability of the semiconductor device is excellent. This storage elastic modulus is, for example, using a dynamic viscoelasticity measuring device (manufactured by Rheology, trade name: DVE-V4), applying a tensile load to the cured product of the adhesive layer 2, a frequency of 10 Hz, and a heating rate. It can be measured by a temperature dependence measurement mode in which measurement is performed from −70 ° C. to 300 ° C. under a condition of 5 to 10 ° C./min.

  As described above, the adhesive sheet 10 according to the present embodiment includes the release substrate 1, the adhesive layer 2 disposed on the release substrate 1 and having a predetermined planar shape, and the adhesive layer 2. It has a configuration in which an adhesive film 3 formed so as to be in contact with the peeling substrate 1 around the periphery is sequentially laminated. In this embodiment, what laminated | stacked the adhesive bond layer 2 and the adhesion film 3 is called the laminated body 4. FIG. The laminate 4 composed of the adhesive layer 2 and the pressure-sensitive adhesive film 3 is cut into a predetermined shape and partially laminated on the release substrate 1, and the laminate 4 includes a plurality of release substrates 1. Are distributed in the length direction. Further, the release substrate 1 has a cut portion (hereinafter also referred to as “cut portion A”) in the thickness direction of the release substrate 1 from the surface on the adhesive layer 2 side along the periphery of the shape of the laminate 4. Pre-cut to match the wafer ring shape.

  Here, the predetermined shape of the laminated body 4 is a state in which the laminated body 4 is partially laminated on the peeling substrate 1, and the predetermined planar shape of the adhesive layer 2 is applied to a semiconductor wafer or the like. The shape is not particularly limited as long as it is larger than the planar shape of the body, but for example, circular, substantially circular, quadrangular, pentagonal, hexagonal, octagonal, wafer shape (a shape in which a part of the outer periphery of the circle is a straight line) It is preferable that the shape be easy to be attached to a semiconductor wafer. Among these, in order to reduce useless parts other than the semiconductor wafer mounting portion, a circular shape or a wafer shape is preferable.

  When dicing a semiconductor wafer, a wafer ring is usually used for handling with a dicing apparatus. In this case, the peeling base material 1 is peeled from the adhesive sheet 10, a wafer ring is attached to the adhesive film 3, and a semiconductor wafer is attached to the inside thereof. Here, the wafer ring has an annular or square frame, and the adhesive film 3 of the laminate 4 in the adhesive sheet 10 preferably has a planar shape that matches the wafer ring. .

  The pressure-sensitive adhesive film 3 is composed of a base film 8 and a pressure-sensitive adhesive layer 7 formed on the base film 8. The pressure-sensitive adhesive layer 7 can sufficiently fix an adherend such as a semiconductor wafer or a wafer ring at room temperature (25 ° C.), and can be peeled off after dicing to a wafer ring or the like. It is preferable to have the property. The pressure-sensitive adhesive strength of the pressure-sensitive adhesive layer 7 before irradiation with high energy rays is preferably 3.0 to 150 N / m, and more preferably 30 to 100 N / m. When it exceeds 150 N / m, it is difficult to peel off from the wafer ring, and workability is deteriorated. If it is less than 3.0 N / m, the holding force with respect to the wafer ring is insufficient, which may cause trouble in the manufacturing process of the semiconductor device.

  Hereinafter, each layer constituting the adhesive sheet 10 will be described in detail.

  The peeling substrate 1 in this embodiment plays a role as a carrier film when the adhesive sheet 10 is used. Examples of the release substrate 1 include polyester films such as polyethylene terephthalate films, polytetrafluoroethylene films, polyethylene films, polypropylene films, polymethylpentene films, polyolefin films such as polyvinyl acetate films, polyvinyl chloride films, A plastic film such as a polyimide film can be used. Moreover, paper, a nonwoven fabric, metal foil, etc. can also be used.

  The surface of the release substrate 1 on the adhesive layer 2 side is preferably surface-treated with a release agent such as a silicone release agent, a fluorine release agent, or a long-chain alkyl acrylate release agent.

  Although the thickness of the peeling base material 1 can be suitably selected in the range which does not impair the workability | operativity at the time of use, it is preferable that it is 10-500 micrometers, It is more preferable that it is 20-100 micrometers, It is 25-50 micrometers. It is particularly preferred.

  The adhesive layer 2 in the present embodiment needs to have a light transmittance of 10 to 90% at a wavelength of 200 to 800 nm and a spectral transmittance of 85% or less in a region of a wavelength of 200 to 400 nm. . Here, the light transmittance at a wavelength of 200 to 800 nm of the adhesive layer 2 is 10 to 90%, more preferably 20 to 80%, and particularly preferably 30 to 60%. If the light transmittance is less than 10%, the lower detection limit of the position recognition sensor is exceeded, and if it exceeds 90%, malfunction of the sensor in the position recognition of the adhesive layer is likely to occur. The spectral transmittance of the adhesive layer 2 in the wavelength range of 200 to 500 nm is 85% or less, more preferably 70% or less, and particularly preferably 60% or less. If this spectral transmittance exceeds 85%, the sensor is likely to malfunction during position recognition of the adhesive layer.

  The adhesive layer 2 includes (A) at least one light transmittance adjusting component selected from the group consisting of polyether compounds, pigments, dyes and light absorbers, (B) a thermopolymerizable component, and (C). A layer containing a high molecular weight component having a weight average molecular weight of 100,000 or more and containing a functional monomer as a constituent unit is preferable.

The polyether compound which is a kind of the light transmittance adjusting component (A) is an amide group (—NHCO—), an ester group (—CO—O—), an imide group (—NR ₂ , where R is —CO. A thermoplastic resin having an ether group (—O—) or a sulfone group (—SO ₂ —). In particular, a thermoplastic resin having an amide group, an ester group, an imide group or an ether group is more preferable. Specific examples of such polyether compounds include aromatic polyamides, aromatic polyesters, aromatic polyimides, aromatic polyamideimides, aromatic polyethers, aromatic polyetheramide imides, aromatic polyetheramides, aromatics Examples include polyesterimide and aromatic polyetherimide.

  Among these, aromatic polyether amide imide, aromatic polyether imide and aromatic polyether amide are preferable from the viewpoint of adhesiveness.

  All of the above resins are produced by polycondensing an aromatic component such as aromatic diamine or bisphenol and an acid component such as dicarboxylic acid, tricarboxylic acid, tetracarboxylic acid or aromatic chloride or a reactive derivative thereof. can do. That is, it can be produced by a known method used for the reaction between an amine and an acid, and there are no particular restrictions on various conditions. A known method is used for the polycondensation reaction of aromatic dicarboxylic acid, aromatic tricarboxylic acid or a reactive derivative thereof with diamine.

  The base component used for the synthesis of aromatic polyetherimide, aromatic polyetheramideimide or aromatic polyetheramide is not particularly limited, but for example, 2,2-bis [4- (4-aminophenoxy) Phenyl] propane, bis [4- (4-aminophenoxy) phenyl] sulfone, 4,4′-diaminodiphenyl ether, bis [4- (4-aminophenoxy) phenyl] ether, 2,2-bis [4- (4 -Aminophenoxy)] aromatic diamine having an ether group such as hexafluoropropane; aromatic diamine having no ether group such as 4,4′-methylenebis (2,6-diisopropylamine); 1,3-bis (3 -Aminopropyl) -siloxane diamines such as tetramethyldisiloxane; and 1,12-diaminododecane α such as 1,6-diaminohexane, .omega. diamino alkane is preferably used.

  Examples of the acid component used for the synthesis of aromatic polyetherimide, aromatic polyetheramideimide or aromatic polyetheramide include (a) trimellitic anhydride such as trimellitic anhydride and trimellitic anhydride chloride. Reactive derivatives, mononuclear aromatic tricarboxylic anhydrides such as pyromellitic dianhydride or mononuclear aromatic tetracarboxylic dianhydrides, (b) bisphenol A bis trimellitate dianhydride, oxydiphthalic anhydride, etc. Examples include polynuclear aromatic tetracarboxylic dianhydrides, (c) aromatic dicarboxylic acids such as reactive derivatives of phthalic acid such as terephthalic acid, isophthalic acid, terephthalic acid chloride, and isophthalic acid chloride.

  In the present embodiment, the temperature at which the polyether compound is reduced by 5% by mass is preferably 300 ° C. or higher, more preferably 350 ° C. or higher, and further preferably 400 ° C. or higher. When the temperature at which the polyether compound is reduced by 5% by mass is less than 300 ° C., outgas tends to occur due to heat generated when the adhesive layer 2 is bonded to the adherend or heat generated in the semiconductor element manufacturing process. The temperature at which the polyether compound is reduced by 5% by mass is obtained by measuring with a differential thermal balance (trade name: TG / DTA220, manufactured by Seiko Denshi Kogyo Co., Ltd.) at a heating rate of 10 ° C./min.

  (A) When using a polyether-type compound as a light transmittance adjustment component, it is preferable that the usage-amount is 0.1-50 mass parts with respect to 100 mass parts of (B) thermopolymerizable components. More preferably, it is -30 mass parts, and it is especially preferable that it is 2-10 mass parts. When the amount used is within this range, the storage elastic modulus of the adhesive layer 2 can be secured, and the solder reflow resistance at high temperatures tends to be good, and the wavelength of the adhesive layer 2 is 200 to 400 nm. The spectral transmittance of the region can be more reliably reduced to 85% or less.

  (A) The pigment and dye which are light transmittance adjusting components are not particularly limited as long as they have the property of absorbing light emitted from the sensor during precut processing. For example, pigments are azo-based and phthalocyanine-based pigments. And anthraquinone, lake, perylene, perinone, quinacridone, thioindigo, dioxazine, isoindolinone, and quinophthalone pigments. Examples of the dye include azo, phthalocyanine, anthraquinone, carbonyl, indigo, quinoneimine, methine, quinoline, and nitro dyes.

  (A) When using a pigment and / or dye as the light transmittance adjusting component, the amount used is preferably 0.1 to 20 parts by mass with respect to 100 parts by mass of the (B) thermopolymerizable component, It is more preferably 0.3 to 10 parts by mass, and particularly preferably 0.5 to 5 parts by mass. When the amount used is within this range, the storage elastic modulus of the adhesive layer 2 can be secured, and the spectral transmittance in the region of the wavelength 200 to 400 nm in the adhesive layer 2 can be more reliably reduced to 85% or less. it can.

  (A) The light absorber that is a light transmittance adjusting component is not particularly limited as long as it has a property of absorbing light emitted from the sensor during precut processing. For example, 2-methoxyhexyl paramethoxycinnamate (octyl) ), Paradimethylaminobenzoic acid 2-ethylhexyl (octyl), oxybenzone, salicylic acid 2-ethylhexyl (octyl), 4-tert-butyl-4-methoxy-benzoylmethane, salicylic acid phenylcinoxalate, paraaminobenzoic acid ester 2- (2-hydroxy-) Benzene compounds and phenolic compounds such as 5-methylphenyl) benzotriazole and guaiazulene are exemplified.

  (A) When a light absorber is used as the light transmittance adjusting component, the amount used is preferably 0.01 to 20 parts by mass with respect to 100 parts by mass of (B) the thermopolymerizable component. It is more preferably 1 to 10 parts by mass, and particularly preferably 0.3 to 5 parts by mass. When the usage amount is within this range, the spectral transmittance in the region of the wavelength 200 to 400 nm in the adhesive layer 2 can be more reliably lowered to 85% or less.

  These polyether compounds, pigments, dyes and light absorbers can be used singly or in combination of two or more.

  The (B) thermopolymerizable component used for the adhesive layer 2 is not particularly limited as long as it is polymerized by heat. For example, glycidyl group, acryloyl group, methacryloyl group, hydroxyl group, carboxyl group, isocyanurate group, Examples thereof include compounds having a functional group such as an amino group and an amide group. These can be used individually by 1 type or in combination of 2 or more types. In consideration of the heat resistance of the adhesive sheet 10, it is preferable to use a thermosetting resin that is cured by heat and exerts an adhesive action.

  Examples of the thermosetting resin include an epoxy resin, an acrylic resin, a silicone resin, a phenol resin, a thermosetting polyimide resin, a polyurethane resin, a melamine resin, and a urea resin. Among these, it is preferable to use an epoxy resin in that the adhesive sheet 10 having excellent heat resistance, workability, and reliability can be obtained.

  The epoxy resin is not particularly limited as long as it is cured and has an adhesive action. As such an epoxy resin, for example, a bifunctional epoxy resin such as a bisphenol A type epoxy, a novolac type epoxy resin such as a phenol novolac type epoxy resin or a cresol novolac type epoxy resin, or the like can be used. Moreover, what is generally known, such as a polyfunctional epoxy resin, a glycidyl amine type epoxy resin, a heterocyclic ring-containing epoxy resin, or an alicyclic epoxy resin, can be used.

  As the bisphenol A type epoxy resin, Epicoat series (Epicoat 807, Epicoat 815, Epicoat 825, Epicoat 827, Epicoat 828, Epicoat 834, Epicoat 1001, Epicoat 1004, Epicoat 1007, Epicoat 1009) manufactured by Japan Epoxy Resin Co., Ltd., Dow Examples thereof include DER-330, DER-301, and DER-361 manufactured by Chemical Corporation, and YD8125 and YDF8170 manufactured by Toto Kasei Co., Ltd.

  Examples of the phenol novolac type epoxy resin include Epicoat 152 and Epicoat 154 manufactured by Japan Epoxy Resin Co., Ltd., EPPN-201 manufactured by Nippon Kayaku Co., Ltd., DEN-438 manufactured by Dow Chemical Company, and the like.

  Examples of the cresol novolac type epoxy resin include EOCN-102S, EOCN-103S, EOCN-104S, EOCN-1012, EOCN-1025, EOCN-1027, and o-cresol novolac type epoxy resin manufactured by Nippon Kayaku Co., Ltd. -YDCN700-10 made by Toto Kasei Co., Ltd., which is a cresol novolac type epoxy resin, and the like.

  As the polyfunctional epoxy resin, Epon 1031S manufactured by Japan Epoxy Resin Co., Ltd., Araldite 0163 manufactured by Ciba Specialty Chemicals Co., Ltd., Denacol EX-611, EX-614, EX-614B, EX-622 manufactured by Nagase ChemteX Corporation. , EX-512, EX-521, EX-421, EX-411, EX-321, and the like.

  As glycidylamine type epoxy resins, Epicoat 604 manufactured by Japan Epoxy Resin Co., Ltd., YH-434 manufactured by Toto Kasei Co., Ltd., TETRAD-X and TETRAD-C manufactured by Mitsubishi Gas Chemical Co., Ltd., ELM manufactured by Sumitomo Chemical Co. -120 etc. are mentioned.

  Examples of the heterocyclic ring-containing epoxy resin include Araldite PT810 manufactured by Ciba Specialty Chemicals, ERL4234, ERL4299, ERL4221, and ERL4206 manufactured by UCC.

  Examples of the alicyclic epoxy resin include Epolide series and Celoxide series manufactured by Daicel Chemical Industries.

  These epoxy resins can be used individually by 1 type or in combination of 2 or more types.

  When using an epoxy resin, it is preferable to use an epoxy resin curing agent. As the epoxy resin curing agent, known curing agents that are usually used can be used, for example, amines, polyamides, acid anhydrides, polysulfides, boron trifluoride, dicyandiamide, bisphenol A, bisphenol F, bisphenol. Examples thereof include bisphenols having two or more phenolic hydroxyl groups per molecule such as S, phenol resins such as phenol novolac resin, bisphenol A novolac resin and cresol novolac resin. Among these, phenol resins such as phenol novolak resin, bisphenol A novolak resin, and cresol novolak resin are preferable in terms of excellent electric corrosion resistance when absorbing moisture. In the present invention, the epoxy resin curing agent includes what is called a curing accelerator that acts catalytically on an epoxy group to promote crosslinking.

  Among the phenol resins as the epoxy resin curing agent, for example, trade names of Dainippon Ink & Chemicals, Inc .: Phenolite LF4871, Phenolite LF2822, Phenolite TD-2090, Phenolite TD-2149 , Phenolite VH-4150, Phenolite VH4170, product name manufactured by Meiwa Kasei Co., Ltd .: H-1, product name manufactured by Japan Epoxy Resin Co., Ltd .: Epicure MP402FPY, Epicure YL6065, Epicure YLH129B65, and Mitsui Chemicals, Inc. Product names: Mirex XL, Mirex XLC, Mirex RN, Mirex RS, Mirex VR and the like.

  (C) Among the high molecular weight components having a functional monomer as a structural unit and having a weight average molecular weight of 100,000 or more, a polymer containing a functional monomer as a structural unit can be mentioned. Examples of the functional group in such a polymer include a glycidyl group, an acryloyl group, a methacryloyl group, a hydroxyl group, a carboxyl group, an isocyanurate group, an amino group, and an amide group, and among them, a glycidyl group is preferable. More specifically, a glycidyl group-containing (meth) acrylic copolymer containing a functional monomer such as glycidyl acrylate or glycidyl methacrylate as a constituent unit is preferable, and these are used as a constituent raw material of the adhesive layer 2. It is preferably incompatible with a thermosetting resin such as an epoxy resin before curing.

  The polymer containing the functional monomer as a structural unit, and the high molecular weight component having a weight average molecular weight of 100,000 or more contains, for example, a functional monomer such as glycidyl acrylate or glycidyl methacrylate as a structural unit, and Examples thereof include glycidyl group-containing (meth) acrylic copolymers having a weight average molecular weight of 100,000 or more, and among them, those that are incompatible with thermosetting resins such as epoxy resins before curing are preferred.

  As said glycidyl group containing (meth) acrylic copolymer, a glycidyl group containing (meth) acrylic ester copolymer, a glycidyl group containing acrylic rubber, etc. can be used, for example, and a glycidyl group containing acrylic rubber is more preferable. The glycidyl group-containing acrylic rubber as used in the present invention is a copolymer containing a glycidyl group mainly composed of an acrylate ester and mainly composed of butyl acrylate and acrylonitrile, or ethyl acrylate and acrylonitrile. .

  The functional monomer means a monomer having a functional group, and it is preferable to use glycidyl acrylate or glycidyl methacrylate as such a monomer. Specific examples of the glycidyl group-containing (meth) acrylic copolymer having a weight average molecular weight of 100,000 or more include HTR-860P-3 (trade name) manufactured by Nagase ChemteX Corporation.

  (C) In the high molecular weight component, the amount of the epoxy group-containing monomer unit such as glycidyl acrylate or glycidyl methacrylate is from 0.5 to 0.5 on the basis of the total amount of monomer from the viewpoint of curing by heating and effectively forming a network structure. It is preferable that it is 50 mass%. Further, from the viewpoint that sufficient adhesive force can be secured and gelation can be prevented, it is more preferably 0.5 to 6.0% by mass, and 0.8 to 5.0% by mass. More preferably, it is 1.0 to 4.0% by mass.

  (C) The high molecular weight component may be obtained by copolymerizing an epoxy group-containing monomer such as glycidyl acrylate or glycidyl methacrylate with a functional monomer other than the epoxy group-containing monomer. Examples of the functional monomer other than the epoxy group-containing monomer include ethyl (meth) acrylate and butyl (meth) acrylate, and these can be used alone or in combination of two or more. . In the present invention, ethyl (meth) acrylate means ethyl acrylate or ethyl methacrylate. The mixing ratio in the case of using a combination of functional monomers other than the epoxy group-containing monomer is determined in consideration of the Tg of the glycidyl group-containing (meth) acrylic copolymer and adjusted so that the Tg is -10 ° C or higher. It is preferable to do. When Tg is −10 ° C. or higher, the tackiness of the adhesive layer 2 in an uncured state is appropriate, and the handleability tends to be good.

  When a high molecular weight component having a weight average molecular weight of 100,000 or more containing the functional monomer as a constituent unit is produced by polymerizing the functional monomer, the polymerization method is not particularly limited. For example, pearl polymerization, solution Methods such as polymerization can be used. The weight average molecular weight of the high molecular weight component containing a functional monomer as a constituent unit is 100,000 or more, preferably 300,000 to 3,000,000, and more preferably 500,000 to 2,000,000. When the weight average molecular weight is within this range, the strength, flexibility, and tackiness of a sheet or film are appropriate, and the flowability is appropriate, so the circuit fillability of wiring is ensured. It tends to be possible.

  In the present invention, the weight average molecular weight is a value measured by gel permeation chromatography and converted using a standard polystyrene calibration curve.

  Moreover, the usage-amount of the high molecular weight component whose weight average molecular weight which contains a functional monomer as a structural unit is 100,000 or more is 10-400 mass parts with respect to 100 mass parts of (B) thermopolymerizable components. preferable. When the amount used is within this range, storage elastic modulus and flowability during molding can be ensured, and handling properties at high temperatures tend to be good. Further, the amount of the (C) high molecular weight component used is more preferably 15 to 350 parts by mass, and particularly preferably 20 to 300 parts by mass with respect to 100 parts by mass of the (B) thermopolymerizable component. .

  Moreover, in order to increase the storage elastic modulus of the adhesive layer 2 that is cured by heat, for example, the amount of the (B) thermopolymerizable component such as an epoxy resin is increased, the epoxy resin having a high glycidyl group concentration, or the hydroxyl group concentration A method of increasing the cross-linking density of the whole polymer by using a high phenol resin or adding an inorganic filler can be used. The inorganic filler for increasing the storage elastic modulus of the adhesive layer 2 will be described later.

  In addition, an inorganic filler may be added to the adhesive layer 2 for the purpose of improving its handleability, improving thermal conductivity, adjusting melt viscosity, imparting thixotropic properties, and improving the storage elastic modulus described above. it can. The inorganic filler is not particularly limited. For example, aluminum hydroxide, magnesium hydroxide, calcium carbonate, magnesium carbonate, calcium silicate, magnesium silicate, calcium oxide, magnesium oxide, aluminum oxide, aluminum nitride, aluminum borate whisker , Boron nitride, crystalline silica, amorphous silica and the like. The shape of the inorganic filler is not particularly limited. Among these, aluminum oxide, aluminum nitride, boron nitride, crystalline silica, and amorphous silica are preferable for improving thermal conductivity. For the purpose of adjusting melt viscosity and imparting thixotropic properties, aluminum hydroxide, magnesium hydroxide, calcium carbonate, magnesium carbonate, calcium silicate, magnesium silicate, calcium oxide, magnesium oxide, aluminum oxide, crystallinity Silica, amorphous silica and the like are preferable. These inorganic fillers can be used alone or in combination of two or more.

  Moreover, it is preferable that the average particle diameter of an inorganic filler is 0.005 micrometer-1.0 micrometer, and adhesiveness may fall even if it is smaller or larger than this.

  When the inorganic filler is used, the blending amount is preferably 1 to 20% by mass based on the total solid content of the adhesive layer 2. If the blending amount is less than 1% by mass, the effect of adding the inorganic filler tends to be not obtained. If the blending amount exceeds 20% by mass, the storage elastic modulus of the adhesive layer 2 is excessively increased, the adhesiveness is decreased, and voids remain. There is a tendency to cause problems such as deterioration of electrical characteristics.

  The thickness of the adhesive layer 2 has an effect on the bonding operation to the semiconductor wafer and the dicing operation after the bonding while ensuring sufficient adhesion to the adherend such as a support member for mounting the semiconductor element. It is desirable that there is no range. From this viewpoint, the thickness of the adhesive layer 2 is preferably 1 to 300 μm, more preferably 1 to 75 μm, and particularly preferably 1 to 20 μm. When the thickness is less than 1 μm, it tends to be difficult to ensure a sufficient die-bonding adhesive force, and when it exceeds 300 μm, there is a tendency that problems such as an influence on the pasting work and the dicing work occur.

  Further, from the viewpoint of reducing the weight and size of the semiconductor device, the thickness of the adhesive layer 2 is preferably 15 μm or less, more preferably 1 to 15 μm, and particularly preferably 3 to 15 μm. In the conventional adhesive layer, when the thickness is 15 μm or less, there is a tendency that the position recognition of the adhesive layer by the sensor at the time of precut processing tends to be difficult, but according to the present invention, the thickness of the adhesive layer 2 Even when the thickness is reduced to 15 μm or less, the position of the adhesive layer can be easily recognized by the sensor.

  As the pressure-sensitive adhesive film 3 constituting the adhesive sheet 10 of the present embodiment, a film composed of the base film 8 and the pressure-sensitive adhesive layer 7 can be used.

  As the base film 8, the same film or sheet as that used for the release base 1 can be used. For example, polyester film such as polyethylene terephthalate film, polytetrafluoroethylene film, polyethylene film, polypropylene film, polymethylpentene film, polyolefin film such as polyvinyl acetate film, plastic film such as polyvinyl chloride film, polyimide film, etc. Can be mentioned. Furthermore, the base film 8 may be one in which these films are laminated in two or more layers.

  The pressure-sensitive adhesive layer 7 preferably contains a high energy ray polymerizable component that is polymerized by irradiation with high energy rays. As a result, after adhering the adhesive layer 2 to an adherend such as a semiconductor wafer, before applying dicing, high energy rays such as radiation are irradiated to improve the adhesive force during dicing, or conversely dicing. Picking up can be facilitated by irradiating a high energy ray such as radiation and lowering the adhesive strength after carrying out. In the present invention, as such a high energy ray polymerizable component, a compound used in a conventional high energy ray polymerizable dicing sheet can be used without particular limitation.

  Examples of the high energy ray polymerizable component used in the pressure-sensitive adhesive layer 7 include a radiation polymerizable component. Although it does not restrict | limit especially as a radiation polymerizable component, For example, methyl acrylate, methyl methacrylate, ethyl acrylate, ethyl methacrylate, butyl acrylate, butyl methacrylate, 2-ethylhexyl acrylate, methacrylic acid-2- Ethylhexyl, pentenyl acrylate, tetrahydrofurfuryl acrylate, tetrahydrofurfuryl methacrylate, diethylene glycol diacrylate, triethylene glycol diacrylate, tetraethylene glycol diacrylate, diethylene glycol dimethacrylate, triethylene glycol dimethacrylate, tetraethylene glycol dimethacrylate, trimethylolpropane Diacrylate, trimethylolpropane triacrylate, trimethylolpropane Methacrylate, trimethylolpropane trimethacrylate, 1,4-butanediol diacrylate, 1,6-hexanediol diacrylate, 1,4-butanediol dimethacrylate, 1,6-hexanediol dimethacrylate, pentaerythritol triacrylate, penta Erythritol tetraacrylate, pentaerythritol trimethacrylate, pentaerythritol tetramethacrylate, dipentaerythritol hexaacrylate, dipentaerythritol hexamethacrylate, styrene, divinylbenzene, 4-vinyltoluene, 4-vinylpyridine, N-vinylpyrrolidone, 2-hydroxyethyl Acrylate, 2-hydroxyethyl methacrylate, 1,3-acryloyloxy-2-hydroxy Propane, 1,2-methacryloyloxy-2-hydroxypropane, methylenebisacrylamide, N, N- dimethyl acrylamide, N- methylol acrylamide, tris (beta-hydroxyethyl) can be used triacrylate isocyanurate.

  In addition, a photopolymerization initiator (for example, one that generates free radicals by irradiation with high energy rays such as radiation) can be added to the pressure-sensitive adhesive layer 7. Examples of the photopolymerization initiator include benzophenone, N, N′-tetramethyl-4,4′-diaminobenzophenone (Michler ketone), N, N′-tetraethyl-4,4′-diaminobenzophenone, 4-methoxy- 4′-dimethylaminobenzophenone, 2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) -butanone-1,2,2-dimethoxy-1,2-diphenylethane-1-one, 1-hydroxy- Aromatic ketones such as cyclohexyl-phenyl-ketone, 2-methyl-1- (4- (methylthio) phenyl) -2-morpholinopropanone-1,2,4-diethylthioxanthone, 2-ethylanthraquinone, phenanthrenequinone, benzoin Methyl ether, benzoin ethyl ether, benzoin pheny Benzoin ethers such as ether, benzoins such as methylbenzoin and ethylbenzoin, benzyl derivatives such as benzyldimethyl ketal, 2- (o-chlorophenyl) -4,5-diphenylimidazole dimer, 2- (o-chlorophenyl) -4 , 5-di (m-methoxyphenyl) imidazole dimer, 2- (o-fluorophenyl) -4,5-phenylimidazole dimer, 2- (o-methoxyphenyl) -4,5-diphenylimidazole dimer 2-mer, 2- (p-methoxyphenyl) -4,5-diphenylimidazole dimer, 2,4-di (p-methoxyphenyl) -5-phenylimidazole dimer, 2- (2,4-dimethoxy) 2,4,5-triarylimidazole dimer such as phenyl) -4,5-diphenylimidazole dimer, - phenyl acridine, 1,7-bis (9,9'-acridinyl) like acridine derivatives heptane, and the like.

  The thickness of the pressure-sensitive adhesive layer 7 is preferably 10 to 500 μm, more preferably 25 to 200 μm, and particularly preferably 50 to 150 μm.

  The adhesive sheet 10 of the present embodiment includes the release substrate 1, the adhesive layer 2, and the pressure-sensitive adhesive film 3 as described above. In the adhesive sheet 10 of this embodiment, the release substrate 1 has a surface on the adhesive layer 2 side of the release substrate 1 along the planar peripheral edge of the layered body composed of the adhesive layer 2 and the pressure-sensitive adhesive film 3. From the surface of the peeling substrate 1 in the thickness direction of the peeling substrate 1 and the cutting portion B in the thickness direction of the peeling substrate 1 from the surface of the peeling substrate 1 on the adhesive film 3 side.

<Method for producing adhesive sheet>
The manufacturing method of the said adhesive sheet is demonstrated. The method for producing an adhesive sheet of the present invention includes a first lamination step of laminating an adhesive layer on a release substrate, and the release substrate from a surface opposite to the side in contact with the release substrate of the adhesive layer. A first cutting step of cutting the adhesive layer until reaching the point, removing the adhesive layer on the cut outer peripheral portion, and forming an adhesive layer having a predetermined planar shape; A second laminating step of laminating an adhesive film so as to cover the adhesive layer having a planar shape and the release substrate, and the release substrate is reached from a surface opposite to the release substrate side of the adhesive film. Cut the adhesive film up to the above, remove the adhesive film of the cut outer peripheral portion, cover the adhesive layer of the predetermined planar shape, and the adhesive layer around the adhesive layer Consisting of an adhesive film in contact with the release substrate A second cutting step of forming a laminate having a shape, the method comprising.

  FIGS. 3A to 3D and FIGS. 4E to 4H are a series of process diagrams showing a preferred embodiment of the method for producing an adhesive sheet of the present invention. In the method for manufacturing an adhesive sheet of the present embodiment, first, as shown in FIG. 3A, a long adhesive layer 2 is laminated on the entire surface of a long release substrate 1 (first lamination). Process). Next, as shown in FIG.3 (b), it reaches the peeling base material 1 from the surface F1 on the opposite side to the peeling base material 1 side of the adhesive bond layer 2 using the precut blade 15 or a member corresponding to it. A cut is made until the cut portion A is formed in an annular shape and pre-cut into a predetermined shape. Then, as shown in FIG.3 (c), the unnecessary part of the adhesive bond layer 2 which gave the precut process is peeled and removed. As a result, as shown in FIGS. 3C and 3D, an adhesive layer having a predetermined planar shape dispersed and arranged in an island shape in the longitudinal direction of the release substrate 1 on the release substrate 1. 2 is formed (first cutting step).

  Next, as shown in FIG.4 (e), the adhesion film 3 is laminated | stacked so that the whole adhesive layer 2 and the peeling base material 1 which has been exposed may be covered (2nd lamination process). Next, as shown in FIG. 4 (f), the adhesive film 3 is cut using the precut blade 15 or the like until it reaches the peeling substrate 1, and the cut portion B is formed in an annular shape to perform precut processing. At this time, by detecting the position of the end portion of the adhesive layer 2 with a sensor, the circular pre-cut processing of the adhesive film 3 is performed concentrically with the adhesive layer 2. Then, as shown in FIG.4 (g), the unnecessary part of the adhesive film 3 which gave the precut process is peeled and removed. Thereby, as shown in FIG.4 (h), the laminated body 4 which consists of the adhesive bond layer 2 and the adhesion film 3 is formed on the peeling base material 1 (2nd cutting process). As described above, the adhesive sheet 10 having the same structure as that shown in FIGS. 1 and 2 is produced.

  In the first laminating step, first, the material constituting the adhesive layer 2 is dissolved or dispersed in a solvent to form an adhesive layer forming varnish, which is applied onto the release substrate 1 and then the solvent is removed by heating. To do.

  On the other hand, the pressure-sensitive adhesive film 3 to be laminated in the second lamination step is prepared by first dissolving or dispersing the material constituting the pressure-sensitive adhesive layer 7 in a solvent to form a pressure-sensitive adhesive layer-forming varnish, and applying this onto the base film 8. It is obtained by removing the solvent by heating. In addition, after forming the adhesive layer 7 on a base film (support film), another base film may be bonded on the adhesive layer 7. In that case, when laminating the adhesive film 3 in the second laminating step, lamination is performed by peeling off one base film (support film).

  Here, the solvent used for the preparation of the adhesive layer forming varnish and the pressure sensitive adhesive layer forming varnish is not particularly limited as long as it can dissolve or disperse each constituent material. Taking into account the volatility of the solvent, for example, a solvent having a relatively low boiling point such as methanol, ethanol, 2-methoxyethanol, 2-ethoxyethanol, 2-butoxyethanol, methyl ethyl ketone, acetone, methyl isobutyl ketone, toluene, xylene is used. It is preferable to do this. In addition, for the purpose of improving the coating properties, for example, a solvent having a relatively high boiling point such as dimethylacetamide, dimethylformamide, N-methylpyrrolidone, cyclohexanone can be used. These solvents can be used alone or in combination of two or more. In addition, after preparing a varnish, the bubble in a varnish can also be removed by vacuum deaeration.

  As a method for applying the adhesive layer forming varnish to the release substrate 1 in the first lamination step and a method for applying the pressure sensitive adhesive layer forming varnish to the substrate film 8 in the second lamination step, known methods are known. For example, a knife coating method, a roll coating method, a spray coating method, a gravure coating method, a bar coating method, a curtain coating method, a die coating method, or the like can be used.

  Further, the bonding of the adhesive layer 2 and the pressure-sensitive adhesive film 3 can be performed by a conventionally known method, for example, using a laminator or the like.

  As mentioned above, although preferred embodiment of the adhesive sheet of this invention and the manufacturing method of an adhesive sheet was described in detail, this invention is not limited to these embodiment.

<Method for Manufacturing Semiconductor Device>
A method for manufacturing a semiconductor device using the adhesive sheet of the present invention will be described. The method for producing a semiconductor device of the present invention includes the step of peeling the laminate in the adhesive sheet of the invention from the release substrate, and attaching the laminate to a semiconductor wafer from the surface on the adhesive layer side. An attaching step for obtaining a semiconductor wafer with a laminate, and cutting the semiconductor wafer with a laminate with a cutting member to at least an interface between the adhesive layer and the adhesive film, and cutting the semiconductor wafer into semiconductor elements of a predetermined size A dicing step of picking up the semiconductor element from the pressure-sensitive adhesive film together with the adhesive layer to obtain a semiconductor element with an adhesive layer; and the semiconductor element in the semiconductor element with the adhesive layer, the adhesive layer And an adhesion step of adhering to the adherend via the substrate. Here, examples of the adherend include a support member for mounting a semiconductor element and another semiconductor element.

  The adhesive sheet 10 of the present invention is wound in a state where the release substrate 1 serves as a carrier film and is supported by two rolls and a wedge-shaped member while one end thereof is connected to a cylindrical core. The first roll is formed, and the second roll is formed by being wound with the other end connected to the cylindrical core. And the core drive motor for rotating the said core is connected to the core of the 2nd roll, and the peeling base material 1 after the laminated body 4 in the adhesive sheet 10 peeled is predetermined. It is designed to be wound at a speed of.

  First, when the winding core driving motor rotates, the winding core of the second roll rotates, and the adhesive sheet 10 wound around the winding core of the first roll is pulled out of the first roll. The drawn adhesive sheet 10 is guided onto a disk-shaped semiconductor wafer disposed on a movable stage and a wafer ring disposed so as to surround the disk-shaped semiconductor wafer.

  Next, the laminate 4 composed of the adhesive layer 2 and the pressure-sensitive adhesive film 3 is peeled from the peeling substrate 1. At this time, a wedge-shaped member is applied from the peeling substrate 1 side of the adhesive sheet 10, the peeling substrate 1 is bent at an acute angle toward the member side, and the peeling starting point is between the peeling substrate 1 and the laminate 4. Will be created. Furthermore, air is blown to the boundary surface between the peeling substrate 1 and the laminate 4 so that the peeling starting point is more efficiently created.

  After the peeling starting point is created between the peeling substrate 1 and the laminate 4 in this way, the pressure-sensitive adhesive layer 7 of the pressure-sensitive adhesive film 3 is in close contact with the wafer ring, and the adhesive layer 2 is in close contact with the semiconductor wafer. The laminated body 4 is attached to the substrate. At this time, the laminated body 4 is pressed against the semiconductor wafer 11 and the wafer ring 12 as shown in FIG. Then, the stacking of the stacked body 4 on the semiconductor wafer 11 and the wafer ring 12 is completed.

  By the procedure as described above, the laminate 4 can be attached to the semiconductor wafer 11 continuously in an automated process. As an apparatus for performing the operation of attaching the laminate 4 to the semiconductor wafer 11, for example, RAD-2500 (trade name) manufactured by Lintec Corporation can be given.

  And when bonding the laminated body 4 to the semiconductor wafer 11 by such a process, by using the adhesive sheet 10, the peeling origin (peeling base material 1 and adhesive layer) between the peeling base material 1 and the laminated body 4 is used. 7 can be easily created, and the occurrence of defective peeling can be sufficiently suppressed.

  Next, the semiconductor wafer 11 to which the laminate 4 has been attached by the above-described process is diced to a required size by a cutting member, for example, a dicing blade, to obtain a semiconductor element to which the adhesive layer 2 is adhered. Here, steps such as washing and drying may be further performed. At this time, since the semiconductor wafer 11 is sufficiently adhered and held on the base film 8 by the adhesive layer 2 and the pressure-sensitive adhesive layer 7, the semiconductor wafer 11 and the semiconductor element after dicing may fall off during each of the above steps. Sufficiently suppressed.

  Next, the adhesive layer 7 is irradiated with high energy rays such as radiation to polymerize and cure the adhesive layer 7. At this time, heating may be further performed for the purpose of accelerating the curing reaction simultaneously with or after irradiation with the high energy beam. Irradiation of the high-energy rays to the pressure-sensitive adhesive layer 7 is performed from the surface of the pressure-sensitive adhesive layer 7 on which the adhesive layer 2 is not provided.

  After the high energy beam irradiation, the semiconductor element to be picked up is picked up by, for example, a suction collet. At this time, the semiconductor element to be picked up can be pushed up from the lower surface of the pressure-sensitive adhesive layer 7 by, for example, a needle rod. By curing the pressure-sensitive adhesive layer 7, when the semiconductor element is picked up, peeling easily occurs at the interface between the adhesive layer 2 and the pressure-sensitive adhesive layer 7, and the adhesive layer 2 is attached to the lower surface of the semiconductor element. It will be picked up. Then, the semiconductor element to which the adhesive layer 2 is attached is placed on the support member for mounting the semiconductor element via the adhesive layer 2 and heated. The adhesive layer 2 develops an adhesive force by heating, and the bonding between the semiconductor element and the semiconductor element mounting support member is completed. Then, a semiconductor device is manufactured through a wire bonding process, a sealing process, and the like as necessary.

<Semiconductor device>
In the semiconductor device of the present invention, a semiconductor element is laminated via an adhesive layer 2 on an organic substrate serving as a support member for mounting a semiconductor element. Further, a circuit pattern and a terminal are formed on the organic substrate, and the circuit pattern and the semiconductor element are connected to each other by wire bonds. These are sealed with a sealing material to form a semiconductor device. This semiconductor device is manufactured using the adhesive sheet 10 of the present invention by the above-described method for manufacturing a semiconductor device of the present invention.

  As mentioned above, although the manufacturing method of the semiconductor device of this invention and the suitable embodiment of the semiconductor device were demonstrated in detail, this invention is not limited to these embodiment.

  EXAMPLES Hereinafter, although this invention is demonstrated more concretely based on an Example and a comparative example, this invention is not limited to a following example.

(Examples 1-5 and Comparative Example 1)
[Preparation of adhesive sheet for semiconductors]
(A) Polyether compound, pigment, dye and light absorber as light transmittance adjusting component, (B) Epoxy resin and epoxy resin curing agent as thermopolymerizable component, coupling agent Cyclohexanone was added to the composition obtained by blending with the composition shown in 1 (the blending unit is part by mass), stirred and mixed, and then kneaded for 90 minutes using a bead mill. This was mixed with (C) a high molecular weight component to obtain a varnish and vacuum degassed. A polyethylene terephthalate film (made by Teijin DuPont Films, Inc., trade name) obtained by subjecting the varnish after vacuum degassing (nonvolatile content: 15% by mass) to a release substrate having a length of 460 m, a width of 300 mm, and a thickness of 50 μm. Purex A31, PET film) and dried by heating at 140 ° C. for 5 minutes to form an uncured adhesive layer having a thickness of 5 μm (first laminating step).

The details of each component in Table 1 are as follows.
Polyether compound: Polycondensation of 3.2 parts by mass of trimellitic anhydride as an acid component and 3.1 parts by mass of 2,2-bis [4- (4-aminophenoxy) phenyl] propane as a base component Polyether compound obtained by pigment pigment: C.I. I. Pig Black 7 (Mitsubishi Chemical Corporation)
Dye: Phthalocyanine blue dye (manufactured by Dainichi Seika Co., Ltd., trade name: Chromofine phthalocyanine blue)
Light absorber: benzotriazole Epoxy resin: YDCN-700-10 (trade name, manufactured by Toto Kasei Co., Ltd., cresol novolac type epoxy resin)
Epoxy resin curing agent: Millex XLC-LL (trade name, manufactured by Mitsui Chemicals, phenol resin)
High molecular weight component: HTR-860P-3 (trade name, manufactured by Nagase ChemteX Corporation, acrylic rubber having 2 to 6% by mass of a monomer unit derived from glycidyl acrylate or glycidyl methacrylate, weight average molecular weight 800,000)
Coupling agent: NUC A-1160 (trade name, manufactured by GE Toshiba Corporation, γ-ureidopropyltriethoxysilane)

  Next, the obtained adhesive layer was subjected to circular pre-cut processing with a diameter of 210 mm (φ) until the cut reached the peeling substrate, and the unnecessary adhesive layer was removed (first cutting step).

  The adhesive film was produced by the following procedure. First, as a radiation polymerizable component, dipentaerythritol hexaacrylate (manufactured by Nippon Kayaku Co., Ltd., trade name: Kayarad DPHA) 63 mass%, photopolymerization initiator 2-methyl-1- (4- (methylthio) phenyl- 2-Morpholinopropan-1-one (Ciba Specialty Chemicals, trade name: Irgacure 907) 5% by mass and cyclohexanone 32% by mass as a varnish adjusting solvent were mixed and stirred and mixed for 60 minutes or more. An adhesive layer forming varnish was prepared, which was applied on a 38 μm-thick support film (manufactured by Teijin DuPont Films, trade name: Teijin Purex A53) at 110 ° C. for 10 minutes. A pressure-sensitive adhesive layer having a thickness of 10 μm was formed by heating and drying. On the adhesive layer, bonding the polyethylene film (thickness 100 [mu] m) as a base film, to obtain a support film with an adhesive film.

  Thereafter, on the adhesive layer and the release substrate from which unnecessary portions have been removed, the pressure-sensitive adhesive film with a support film is placed at room temperature, linear pressure 1 kg / cm, so that the pressure-sensitive adhesive layer contacts the adhesive layer while peeling the support film. Affixed at a speed of 0.5 m / min (second lamination step).

  Then, the adhesive film was subjected to circular precut processing with a diameter of 290 mm (φ) concentrically with the adhesive layer until the cut reached the peeling substrate, and unnecessary portions of the adhesive film were removed (second cutting step) ). The pre-cut in the second cutting step was performed by recognizing the position of the end of the adhesive layer with a sensor. As a result, an adhesive sheet for a semiconductor having a structure as shown in FIGS. 1 and 2 was obtained.

(Characteristic evaluation of adhesive sheet)
The characteristics of the adhesive sheets for semiconductor produced in Examples 1 to 5 and Comparative Example 1 were evaluated by the following items. The evaluation results are shown in Table 2.

[Light transmittance]
Cut out the adhesive layer in the adhesive sheet to 25mm x 50mm, and paste it on a 0.4mm thick transparent glass plate on a 60 ° C hot plate using a rubber roller so that no wrinkles or bubbles are generated. It was. Using this as a measurement sample, the light transmittance of the adhesive layer at a wavelength of 200 to 800 nm and the spectral transmittance at a wavelength of 200 to 400 nm were measured using a spectrophotometer (manufactured by Shimadzu Corporation, trade name: LC-4000). And measured.

[Elastic modulus (storage modulus)]
The storage elastic modulus of the adhesive layer in a state after being coated on the polyethylene terephthalate film was measured using a dynamic viscoelasticity measuring device (DVE-V4, manufactured by Rheology) (sample size: length 20 mm, width). 4 mm, film thickness 20 μm, temperature range: −60 to 150 ° C., heating rate: 5 ° C./min, tensile mode, 10 Hz, automatic static load).

[Adhesive strength]
In the adhesive sheet, the laminate composed of the adhesive layer and the pressure-sensitive adhesive film was peeled off from the release substrate, and the surface on the adhesive layer side of the laminate was attached to a semiconductor wafer to be diced. Next, the semiconductor wafer is diced, washed and dried, and then a semiconductor element with an adhesive layer is picked up, and the 42 alloy lead frame (Dai Nippon Printing Co., Ltd.), which is an adherend, is attached to the semiconductor element through the adhesive layer. ) To prepare a semiconductor device. The die shear strength (adhesive strength) of the obtained semiconductor device was measured using D-4000 (trade name) manufactured by DAGE.

[Pre-cut product yield]
In the production of the adhesive sheet, the adhesive layer is passed through the first laminating step, the first cutting step, the second laminating step, and the second cutting step described above on a peeling substrate having a length of 460 m and a width of 300 mm. And 300 laminated bodies which consist of adhesive films were formed. About 300 sheets of the laminated body formed, the case where the positional deviation between the adhesive layer and the pressure-sensitive adhesive film is less than 5 mm is a non-defective product, the case where the positional deviation is 10 mm or more or not pre-cut is a defective product, Yield (%) was calculated.
Pre-cut product yield (%) = {number of non-defective products / 300 (total number of laminates)} × 100

DESCRIPTION OF SYMBOLS 1 ... Release base material, 2 ... Adhesive layer, 3 ... Adhesive film, 4 ... Laminated body, 7 ... Adhesive layer, 8 ... Base film, 10 ... Adhesive sheet, 11 ... Semiconductor wafer, 12 ... Wafer ring.

Claims (10)

A release substrate;
An adhesive layer having a predetermined planar shape disposed on the release substrate, and an adhesive film that covers the adhesive layer and is formed so as to contact the release substrate around the adhesive layer A laminate having a predetermined shape;
An adhesive sheet in which a plurality of the laminates are dispersed and arranged in the longitudinal direction of the release substrate on the release substrate,
An adhesive sheet, wherein the adhesive layer has a light transmittance of 10 to 90% at a wavelength of 200 to 800 nm and a spectral transmittance of 85% or less in a region of a wavelength of 200 to 400 nm.   The adhesive layer comprises (A) at least one light transmittance adjusting component selected from the group consisting of polyether compounds, pigments, dyes and light absorbers, (B) a thermopolymerizable component, and (C). The adhesive sheet of Claim 1 containing the high molecular weight component which has a weight average molecular weight which contains a functional monomer as a structural unit and is 100,000 or more.   The adhesive sheet according to claim 2, wherein the polyether-based compound is at least one selected from the group consisting of aromatic polyetherimide, aromatic polyetheramideimide, and aromatic polyetheramide.   The adhesive sheet according to claim 2 or 3, wherein the (C) high molecular weight component is a glycidyl group-containing (meth) acrylic copolymer having an epoxy group-containing monomer unit content of 0.5 to 50 mass%.   The adhesive layer has a storage elastic modulus at 25 ° C of 10 to 10000 MPa and a storage elastic modulus after curing at 260 ° C of 0.5 to 1000 MPa. The adhesive sheet according to item.   The adhesive sheet as described in any one of Claims 1-5 whose thickness of the said adhesive bond layer is 15 micrometers or less. It is a manufacturing method of the adhesive sheet according to any one of claims 1 to 6,
A first laminating step of laminating an adhesive layer on the release substrate;
Cut the adhesive layer until it reaches the release substrate from the surface opposite to the side of the adhesive layer that contacts the release substrate, and remove the adhesive layer at the outer peripheral portion that was cut, A first cutting step of forming an adhesive layer having a predetermined planar shape;
A second laminating step of laminating an adhesive film so as to cover the adhesive layer having the predetermined planar shape and the release substrate;
The adhesive film is cut from the surface opposite to the release substrate side of the adhesive film until reaching the release substrate, the adhesive film on the cut outer peripheral portion is removed, and the predetermined planar shape A second cutting step of forming a laminate having a predetermined shape, and an adhesive layer that covers the adhesive layer and is in contact with the release substrate around the adhesive layer;
The manufacturing method of the adhesive sheet containing this. The said laminated body in the adhesive sheet as described in any one of Claims 1-6 is peeled from the said peeling base material, the said laminated body is affixed on a semiconductor wafer from the surface at the side of the said adhesive bond layer, and a laminated body is attached. An attaching process for obtaining a semiconductor wafer;
A dicing step of cutting the semiconductor wafer with a laminate with a cutting member to at least an interface between the adhesive layer and the adhesive film, and cutting the semiconductor wafer into a semiconductor element of a predetermined size;
Picking up the semiconductor element together with the adhesive layer from the adhesive film to obtain a semiconductor element with an adhesive layer;
Adhering step of adhering the semiconductor element in the semiconductor element with the adhesive layer to an adherend through the adhesive layer;
A method of manufacturing a semiconductor device including:   The method for manufacturing a semiconductor device according to claim 8, wherein the adherend is a support member for mounting a semiconductor element or another semiconductor element. A semiconductor device manufactured by the method for manufacturing a semiconductor device according to claim 8.

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