JP2011171545A - Tape for wafer processing, and method of manufacturing the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a tape for wafer processing that has superior sensor recognizing properties, even when an adhesive layer is thin (≤10 μm, especially, ≤5 μm), and to provide a method of manufacturing the same. <P>SOLUTION: The tape 10 for wafer processing includes long release films 11, adhesive layers 12 (label-shaped adhesive part 22), pressure-sensitive adhesive films 13 (23a, 23b), and identification parts 14. The identification parts 14 are substantially rectangular and provided on surfaces 24a of label parts 23a (adhesive films 13) on the opposite sides from surfaces coming into contact with two adjacent label-shaped adhesive parts 22 at an X-directional interval (label pitch) L between the two label-shaped adhesive parts 22. Further, the identification parts 14 are each provided such that extensions of long sides of the rectangular shape pass substantially center positions of the label-shaped adhesive parts 22, and the long sides of the rectangular shape are substantially in parallel with a Y direction. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a wafer processing tape and a method for manufacturing the same. In particular, the present invention relates to a wafer processing tape having an adhesive film and an adhesive layer provided on the adhesive film, and a method for producing the same.

  In recent years, in order to fix a semiconductor wafer when the semiconductor wafer is cut and separated (diced) into individual chips, a wafer processing tape in which an adhesive layer is provided on a base film has been developed. In addition, an adhesive layer is further laminated on the adhesive layer in order to bond the cut semiconductor chip to a lead frame, a package substrate, etc., or to stack and bond the semiconductor chips together in a stacked package. A wafer processing tape (dicing die bonding film) having a structure has also been developed (see, for example, Patent Document 1).

  As such a wafer processing tape (dicing die bonding film), a tape that has been pre-cut processed in consideration of workability such as attachment to a semiconductor wafer and attachment to a ring frame during dicing. Yes (see, for example, Patent Document 2).

  The manufacturing process of the wafer processing tape (dicing die bonding film) subjected to the pre-cut processing is a first cut of a predetermined shape (for example, a circle) in the adhesive layer of the adhesive film composed of the release film and the adhesive layer. An unnecessary adhesive layer portion outside the first cut is peeled off from the release film, and an adhesive film having a predetermined shape on the release film, an adhesive layer and a base A primary pre-cut process for bonding an adhesive film made of a material film so that the adhesive layer and the adhesive layer are in contact with each other, and a predetermined shape surrounding the shape of the adhesive layer on the adhesive film (for example, circular) The second notch is cut, and the unnecessary adhesive film portion outside the second notch is peeled off from the adhesive film (release film) and wound up, on the adhesive film (release film) And a, a secondary precut processing step of forming an adhesive film having a predetermined shape.

  In the production of the wafer processing tape as described above, a production method (first method) for producing a wafer processing tape by successively performing the above-described two steps (primary precut processing step and secondary precut processing step). Production method) or by making a first cut of a predetermined shape (for example, a circle) in the adhesive layer, and peeling off the unnecessary adhesive layer portion outside the first cut from the release film. Adhesion with a primary pre-cutting process in which an adhesive film having an adhesive layer of a predetermined shape formed thereon, an adhesive layer and an adhesive film composed of a base film are bonded together so that the adhesive layer and the adhesive layer are in contact with each other A production method for producing a wafer processing tape by winding a film into a roll, and then recognizing and aligning the position of the adhesive layer and performing a secondary pre-cut processing step ( 2 of the manufacturing method) there is.

  In addition, semiconductor devices are becoming finer and thinner in response to higher speed, lower power consumption, and smaller size of semiconductor devices. Accordingly, the number of stacked semiconductor chips has been increased, and a wafer processing tape used for manufacturing a semiconductor device has a thinner (less than 10 μm) adhesive layer than conventional wafer processing tapes. The demand for tape is increasing.

JP 2005-303275 A JP 2006-111727 A

  However, when performing the secondary pre-cut processing, the first manufacturing method described above makes the second cut into the adhesive film at a predetermined interval without recognizing the position of the adhesive layer subjected to the primary pre-cut processing. On the other hand, in the second production method described above, after recognizing the position of the primary precut adhesive layer, the second cut is made in the adhesive film in accordance with the position of the adhesive layer. In the conventional wafer processing tape in which the base film, the pressure-sensitive adhesive layer, and the adhesive layer are laminated in this order as proposed in Document 1 and Patent Document 2, the adhesive layer is made thin (less than 10 μm). In this case, in the above-described second manufacturing method, the outer peripheral portion of the primary precut adhesive layer cannot be recognized by an optical sensor (for example, a reflective sensor). A problem that has occurred. Therefore, when performing pre-cut processing (secondary pre-cut processing) of an adhesive film composed of a base film and an adhesive layer, for example, the productivity may be reduced such that the pre-cut blade does not operate or the adhesive layer There has been a problem in that the accuracy of inspection is reduced such that the presence or absence of the shape and the shape inspection cannot be performed.

  Therefore, the present invention has been made to solve the above-described problems, and the sensor recognizability is good even when the adhesive layer is thin (10 μm or less, particularly 5 μm or less). An object of the present invention is to provide a wafer processing tape having good productivity and inspection accuracy and a method for manufacturing the same.

  As a result of intensive studies on the above problems, the present inventors can specify the position of the pre-cut adhesive layer in the wafer processing tape in which the release film, the adhesive layer and the adhesive film are laminated in this order. On the surface of the wafer processing tape (the surface of the adhesive film opposite to the surface in contact with the adhesive layer), between the adhesive layer and the adhesive film, between the adhesive layer and the release film, The adhesive layer is thin by providing at least one of the adhesive film and the release film on the back surface of the wafer processing tape (the surface of the release film opposite to the surface in contact with the adhesive layer). It was found that the sensor recognizability, productivity, and inspection accuracy were good even in the case of (10 μm or less, particularly 5 μm or less), and the present invention was completed.

  That is, the wafer processing tape according to the first aspect of the present invention includes a long release film, a plurality of adhesive layers having a predetermined planar shape provided on the release film, and the adhesive. A tape for wafer processing comprising: an adhesive film that covers each of the agent layers and has an adhesive film having a plurality of label portions provided so as to contact the release film around the adhesive layer. Between the pressure-sensitive adhesive film and the adhesive layer on the surface of the pressure-sensitive adhesive film opposite to the surface in contact with the adhesive layer so that the distance is substantially the same as the distance between the two adjacent adhesive layers. , Between the adhesive film and the release film, between the adhesive layer and the release film, or on the surface of the release film opposite to the surface in contact with the adhesive layer. It is specially provided in one To.

  The wafer processing tape according to a second aspect of the present invention is characterized in that, in the wafer processing tape according to the first aspect of the present invention, the identification portion has an annular shape matching the outer periphery of the adhesive layer. And

  A wafer processing tape according to a third aspect of the present invention is the wafer processing tape according to the first or second aspect of the present invention, wherein the identification portion is formed by printing. To do.

  The wafer processing tape according to a fourth aspect of the present invention is the wafer processing tape according to any one of the first to third aspects of the present invention, wherein the adhesive film is a label on the release film. A peripheral portion provided so as to surround the outside of the portion is provided.

In the method for producing a wafer processing tape according to the first aspect of the present invention, (a) a plurality of adhesive layers having a predetermined planar shape are provided on a long release film, and the release film and Laminating an adhesive film on the adhesive film in which the adhesive layer is laminated in this order, covering the adhesive layer, and contacting the release film around the adhesive layer; and (B) In the laminate composed of the adhesive film and the pressure-sensitive adhesive film formed by the step (a), the laminate portion composed of the release film and the pressure-sensitive adhesive film is moved from the surface of the pressure-sensitive adhesive film. Forming a plurality of annular cuts surrounding each of the adhesive layers until reaching a release film, and a method for producing a wafer processing tape comprising:
Before the step (a), (c) on the surface of the pressure-sensitive adhesive film opposite to the surface in contact with the adhesive layer, the distance between the two adjacent adhesive layers is identified to be substantially the same. A step of forming a portion, wherein the step (b) recognizes the identification portion, thereby aligning with the adhesive layer and forming an annular cut surrounding the adhesive layer. And

In the method for producing a wafer processing tape according to the second aspect of the present invention, (a) a plurality of adhesive layers having a predetermined planar shape are provided on a long release film, and the release film and Laminating an adhesive film on the adhesive film in which the adhesive layer is laminated in this order, covering the adhesive layer, and contacting the release film around the adhesive layer; and
(B) In the laminate composed of the adhesive film and the pressure-sensitive adhesive film formed by the step (a), the laminate portion composed of the release film and the pressure-sensitive adhesive film is moved from the surface of the pressure-sensitive adhesive film. Forming a plurality of annular cuts surrounding each of the adhesive layers until reaching a release film, and a method for producing a wafer processing tape comprising:
Immediately before the step (a), (d) a step of forming an identification portion on the surface of the pressure-sensitive adhesive film in contact with the adhesive film so as to be substantially the same as the interval between the two adjacent adhesive layers. The step (b) includes recognizing the identification part, thereby aligning with the adhesive layer and forming an annular cut surrounding the adhesive layer.

A method for producing a wafer processing tape according to a third aspect of the present invention includes: (a) a plurality of adhesive layers having a predetermined planar shape are provided on a long release film; Laminating an adhesive film on the adhesive film in which the adhesive layer is laminated in this order, covering the adhesive layer, and contacting the release film around the adhesive layer; and (B) In the laminate composed of the adhesive film and the pressure-sensitive adhesive film formed by the step (a), the laminate portion composed of the release film and the pressure-sensitive adhesive film is moved from the surface of the pressure-sensitive adhesive film. Forming a plurality of annular cuts surrounding each of the adhesive layers until reaching a release film, and a method for producing a wafer processing tape comprising:
A plurality of the adhesive layers having a predetermined planar shape are provided on the release film, which is executed before the step (a), and the release film and the adhesive layer are laminated in this order. In the step of producing the adhesive film, (e) on the surface of the release film opposite to the surface in contact with the adhesive layer, the distance between the two adjacent adhesive layers is approximately the same. Forming a discriminating portion, and the step (b) recognizes the discriminating portion, thereby aligning with the adhesive layer and forming an annular cut surrounding the adhesive layer. It is characterized by.

  A method for manufacturing a wafer processing tape according to a fourth aspect of the present invention is the method for manufacturing a wafer processing tape according to any one of the first to third aspects of the present invention, wherein the identification portion is the adhesive. It is characterized by an annular shape that matches the outer periphery of the agent layer.

A method for producing a wafer processing tape according to a fifth aspect of the present invention includes: (a) a plurality of adhesive layers having a predetermined planar shape are provided on a long release film; Laminating an adhesive film on the adhesive film in which the adhesive layer is laminated in this order, covering the adhesive layer, and contacting the release film around the adhesive layer; and (B) In the laminate composed of the adhesive film and the pressure-sensitive adhesive film formed by the step (a), the laminate portion composed of the release film and the pressure-sensitive adhesive film is moved from the surface of the pressure-sensitive adhesive film. Forming a plurality of annular cuts surrounding each of the adhesive layers until reaching a release film, and a method for producing a wafer processing tape comprising:
A plurality of the adhesive layers having a predetermined planar shape are provided on the release film, which is executed before the step (a), and the release film and the adhesive layer are laminated in this order. In the step of producing the adhesive film, (f) when forming the adhesive layer having a predetermined planar shape, an annular identification portion matched with the outer periphery of the adhesive layer is used as the outer peripheral portion of the adhesive layer. And the step (b) recognizes the identification portion, thereby aligning with the adhesive layer and forming an annular cut surrounding the adhesive layer. .

  A method for manufacturing a wafer processing tape according to a sixth aspect of the present invention is the method for manufacturing a wafer processing tape according to any one of the first to fifth aspects of the present invention, wherein the identification section is formed by printing. It is characterized by being made.

  A wafer processing tape manufacturing method according to a seventh aspect of the present invention is the wafer processing tape manufacturing method according to any one of the first to sixth aspects of the present invention, in place of the step (b). (G) In the laminate composed of the adhesive film and the pressure-sensitive adhesive film formed by the step (a), the pressure-sensitive adhesive film is formed on the laminated portion composed of the release film and the pressure-sensitive adhesive film. The method includes forming a plurality of annular cuts surrounding each of the adhesive layers from the surface to the release film, and forming another cut outside the cuts. .

  According to the wafer processing tape of the present invention, the sensor recognizability can be improved even when the adhesive layer is thin (10 μm or less, particularly 5 μm or less). Therefore, in the semiconductor device manufacturing process, the use of the wafer processing tape of the present invention reduces the productivity of the semiconductor device even when the adhesive layer is thin (less than 10 μm, particularly less than 5 μm). And a decrease in inspection accuracy can be prevented.

(A) is a general | schematic perspective view of the tape 10 for wafer processing which concerns on the 1st Embodiment of this invention, (b) is the same top view, (c) is the same sectional view. It is a general-view figure of the tape for wafer processing 10a which is a modification of the tape for wafer processing which concerns on the 1st Embodiment of this invention. It is a general-view figure of the tape 10b for wafer processing which is a modification of the tape for wafer processing which concerns on the 1st Embodiment of this invention. (A) thru | or (c) are the top views of the tapes 10c thru | or 10e for wafer processing which are the modifications of the tape for wafer processing which concerns on the 1st Embodiment of this invention. (A) thru | or (c) are the top views of the wafer processing tapes 10f thru | or 10h which are the modifications of the tape for wafer processing which concerns on the 1st Embodiment of this invention. (A) thru | or (d) is sectional drawing of the wafer processing tapes 10i thru | or 101 which are the modifications of the wafer processing tape which concerns on the 1st Embodiment of this invention. (A) is a general | schematic perspective view of the tape 30 for wafer processing which is a modification of the tape for wafer processing which concerns on the 1st Embodiment of this invention, (b) is the same top view, (c) FIG. (A) And (b) is a top view of the tapes 30a and 30b for wafer processing which are the modifications of the tape for wafer processing which concerns on the 1st Embodiment of this invention. (A) And (b) is sectional drawing of the tapes 30c and 30d for wafer processing which are the modifications of the tape for wafer processing which concerns on the 1st Embodiment of this invention. (A) is a top view of the tape 40 for wafer processing which concerns on the 2nd Embodiment of this invention, (b) is the same sectional drawing. (A) And (b) is sectional drawing of the tape 40a and 40b for wafer processing which is a modification of the tape for wafer processing which concerns on the 2nd Embodiment of this invention. (A) is a top view of the wafer processing tape 40c which is a modification of the wafer processing tape which concerns on the 2nd Embodiment of this invention, (b) is the same sectional drawing. It is a figure for demonstrating the manufacturing method of the tape 10 for wafer processing of FIG. It is a figure following FIG. 13 for demonstrating the manufacturing method of the tape 10 for wafer processing of FIG. It is a figure for demonstrating the manufacturing method of the tape 10i for wafer processing of Fig.6 (a). FIG. 16 is a diagram subsequent to FIG. 15 for illustrating the method for manufacturing the wafer processing tape 10 i of FIG. It is a figure for demonstrating the manufacturing method of the tape 10j for wafer processing of FIG.6 (b). FIG. 18 is a diagram subsequent to FIG. 17 for illustrating the method of manufacturing the wafer processing tape 10 j of FIG. It is a figure for demonstrating the manufacturing method of the tape 40 for wafer processing of FIG. FIG. 20 is a view subsequent to FIG. 19 for illustrating the method for manufacturing the wafer processing tape 40 of FIG. 10. It is a figure for demonstrating the manufacturing method of the tape 40a for wafer processing of FIG. FIG. 22 is a view subsequent to FIG. 21 for illustrating the method for manufacturing the wafer processing tape 40 a of FIG. 11.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
FIG. 1A is a schematic perspective view of a wafer processing tape 10 according to a first embodiment of the present invention, FIG. 1B is a plan view thereof, and FIG. 1C is a sectional view thereof. .

  As shown in FIGS. 1A, 1B, and 1C, the wafer processing tape 10 includes a long release film 11, an adhesive layer 12 (22), and an adhesive film 13 (23a, 23b). ) And an identification unit 14. The wafer processing tape 10 constitutes a dicing die bonding film 20 composed of an adhesive layer 12 (22) and an adhesive film 13 (23a). In the present specification, the longitudinal direction of the wafer processing tape 10 is described as the X direction, and the short direction is described as the Y direction.

  The adhesive layer 12 is provided on the release film 11 and has a label shape corresponding to the shape of the semiconductor wafer. Here, a circular shape will be described as an example of the label shape, but the label shape is not limited to the circular shape. Hereinafter, the label-shaped adhesive layer 12 is referred to as a label-shaped adhesive portion 22.

  The adhesive film 13 includes a label part 23a and a peripheral part 23b. The label part 23 a covers the label-shaped adhesive part 22 and is provided so as to come into contact with the release film 11 around the label-shaped adhesive part 22. The label portion 23a has a substantially circular shape corresponding to the dicing ring frame. The peripheral portion 23b is provided so that the outer side of the label portion 23a is completely surrounded and the exposed release film 11 surrounding the outer periphery of the label portion 23a is discontinuous.

  In the wafer processing tape 10 shown in FIG. 1, the peripheral portion 23b completely surrounds the outside of the label portion 23a, and the exposed release film 11 surrounding the outer periphery of the label portion 23a is discontinuous. As shown in FIG. 2, the peripheral portion 23b does not completely surround the outside of the label portion 23a, and the exposed release film 11 between the label portion 23a and the peripheral portion 23b is continuous. It may be a wafer processing tape 10a provided on the wafer. Moreover, as shown in FIG. 3, the peripheral part 23b may not exist, and the tape 10b for wafer processing by which the adhesive film 13 was comprised only by the label part 23a may be sufficient.

  The identification part 14 is an interval (label pitch) L in the X direction between two adjacent label-shaped adhesive parts 22 on the surface 24a of the label part 23a (adhesive film 13) opposite to the surface in contact with the label-shaped adhesive part 22 Is a substantially rectangular shape. That is, the distance in the X direction between the identification portions 14 provided on the surfaces 24a of the two adjacent label portions 23a (for example, as shown in FIG. (Interval) is the label pitch L. Further, the identification unit 14 is provided so that the extended line of the long side of the rectangular shape passes through the substantially center position of the label-shaped bonding unit 22 and the long side of the rectangular shape and the Y direction are substantially parallel. . The identification unit 14 is printed and formed by a stamp method, an ink jet method, a laser marking method, or the like. Moreover, the identification part 14 may be formed by the line | wire drawing for a kind identification by oil-based magic. Further, the rectangular shape is preferably a shape close to a line with a shorter short side length.

  As shown in FIGS. 1A and 1B, the wafer processing tape 10 has a surface of the label portion 23a (adhesive film 13) opposite to the surface where the identification portion 14 contacts the label-shaped adhesive portion 22. On 24a, the extended line of the long side of the rectangular shape passes through the substantially center position of the label-shaped adhesive portion 22, and the long side of the rectangular shape and the Y direction are substantially parallel to each other. 4 (a), the identification part 14 passes on the surface 24a of the label part 23a (adhesive film 13) through a position where the long side of the rectangular shape is substantially in contact with the outer peripheral plane position of the label-shaped adhesive part 22. In addition, the wafer processing tape 10c may be provided so that the long side of the rectangular shape and the Y direction are substantially parallel. Here, the outer peripheral plane position of the label-shaped adhesive portion 22 is on the surface 24a of the label portion 23a (adhesive film 13) on the outer periphery of the label-shaped adhesive portion 22 when viewed from above the plane of the wafer processing tape 10c. It is a position.

  Further, as shown in FIG. 4B, the identification unit 14 is configured such that the extended line of the long side of the rectangular shape is located at the substantially center position of the label-shaped adhesive portion 22 on the surface 24 b of the peripheral portion 23 b (adhesive film 13). Further, the wafer processing tape 10d may be provided so that the long side of the rectangular shape and the Y direction are substantially parallel to each other. Further, as shown in FIG. 4C, the identification part 14 has a rectangular extension line on the surface 24 b of the peripheral part 23 b (adhesive film 13) at the outer peripheral plane position of the label-shaped adhesive part 22. It may be a wafer processing tape 10e provided so as to pass through a substantially contacting position and the long side of the rectangular shape is substantially parallel to the Y direction.

  Further, as shown in FIG. 5A, the identification unit 14 is configured such that the extended line of the long side of the rectangular shape is located at the substantially center position of the label-shaped adhesive portion 22 on the surface 24 a of the label portion 23 a (adhesive film 13). Further, the wafer processing tape 10f may be provided so that the long side of the rectangular shape and the X direction are substantially parallel to each other. Further, as shown in FIG. 5B, the identification unit 14 is a position where the long side of the rectangular shape substantially contacts the outer peripheral plane position of the label-shaped adhesive portion 22 on the surface 24 a of the label portion 23 a (adhesive film 13). And 10 g of a wafer processing tape provided so that the long side of the rectangular shape and the X direction are substantially parallel to each other. Moreover, as shown in FIG.5 (c), the identification part 14 is provided on the surface 24b of the peripheral part 23b (adhesive film 13) so that the long side of a rectangular shape and a X direction may become substantially parallel, Further, the wafer processing tape 10h may be such that a straight line connecting a substantially center position of the long side of the rectangular shape and a substantially center position of the label-shaped adhesive portion 22 is substantially parallel to the Y direction.

  Further, as shown in FIG. 1C, the wafer processing tape 10 has the identification part 14 provided on the surface 24a of the label part 23a (adhesive film 13). Thus, the identification part 14 may be the tape 10i for wafer processing provided between the label part 23a (adhesive film 13) and the label-shaped adhesion part 22 (adhesive layer 12). Further, as shown in FIG. 6B, the identification unit 14 is for wafer processing provided on the surface 11b of the release film 11 opposite to the surface in contact with the label-shaped adhesive unit 22 (adhesive layer 12). It may be a tape 10j. Further, as shown in FIG. 6C, the identification unit 14 may be a wafer processing tape 10k provided between the label unit 23a (adhesive film 13) and the release film 11. Further, as shown in FIG. 6D, the identification unit 14 may be a wafer processing tape 101 provided between the peripheral part 23b (adhesive film 13) and the release film 11.

  Note that the identification unit 14 is not limited to the above example, and the sensor or operator used in the pre-cut processing operation on the wafer processing tape 10 recognizes the identification unit 14 and makes contact with the label shape bonding unit 22. It may be provided at a position where alignment is possible.

  Further, as shown in FIGS. 1A and 1B, the wafer processing tape 10 has the identification unit 14 having a substantially rectangular shape. 14, and a shape that can be aligned with the label-shaped adhesive portion 22 to perform the secondary pre-cut operation (for example, a character or a graphic when printed) is acceptable. Moreover, the smaller one is desirable.

  Hereafter, each component of the tape 10 for wafer processing which concerns on the 1st Embodiment of this invention mentioned above is demonstrated in detail. The wafer processing tapes 10a to 10l described above are the same as the wafer processing tape 10.

(Identification part)
The identification unit 14 only needs to be provided at a position where the identification unit 14 can be recognized by a sensor or operator used during pre-cut processing and can be aligned with the label-shaped adhesive unit 22. Any shape that allows the operator to recognize the identification unit 14 and align it with the label shape bonding unit 22 to perform the secondary pre-cut operation (for example, a character or a graphic if printed) is used. It ’s fine. For example, it has a substantially rectangular shape as shown in FIG. Moreover, the smaller one is desirable. Moreover, it is desirable that the identification unit 14 is formed by printing. The forming method may be a stamp method, an ink jet method, a laser marking method, or the like as long as it is a printing method capable of forming the identification portion 14. Alternatively, it may be formed by line drawing for product identification using oily magic.

(Release film)
The release film 11 is used for the purpose of improving the handleability of the adhesive layer 12.

  Examples of the release film 11 include a polyethylene film, a polypropylene film, a polybutene film, a polybutadiene film, a polymethylpentene film, a polychloride chloride film, a vinyl chloride copolymer film, a polyethylene terephthalate film, a polyethylene naphthalate film, and a polybutylene terephthalate film. , Polyurethane film, ethylene / vinyl acetate copolymer film, ionomer resin film, ethylene / (meth) acrylic acid copolymer film, ethylene / (meth) acrylic acid ester copolymer film, polystyrene film, polycarbonate film, polyimide film A fluororesin film or the like is used. These crosslinked films are also used. Furthermore, these laminated films may be sufficient.

The surface tension of the release film 11 is preferably 40 mN / m or less, and more preferably 35 mN / m or less. Such a release film 11 having a low surface tension can be obtained by appropriately selecting the material, and can also be obtained by applying a release treatment by applying a silicone resin or the like to the surface of the film. .
The film thickness of the release film 11 is usually 5 to 300 μm, preferably 10 to 200 μm, and particularly preferably about 20 to 150 μm.

(Adhesive layer)
The adhesive layer 12 is attached to the back surface of the semiconductor chip when the semiconductor chip is picked up after the semiconductor wafer is bonded and diced, and is used as an adhesive for fixing the chip to the substrate or the lead frame. It is what is done.

  As the adhesive layer 12, polyimide resin, polyamide resin, polyetherimide resin, polyamideimide resin, polyester resin, polyester resin, polyesterimide resin, phenoxy resin, polysulfone resin, polyethersulfone resin, polyphenylene sulfide resin, polyetherketone Resins, chlorinated polypropylene resins, acrylic resins, polyurethane resins, epoxy resins, polyacrylamide resins, melamine resins, and the like, and mixtures thereof can be used.

  It is preferable to use an epoxy group-containing acrylic copolymer as the polymer. This epoxy group-containing acrylic copolymer contains 0.5 to 6% by mass of glycidyl acrylate or glycidyl methacrylate having an epoxy group. In order to obtain a high adhesive force with a semiconductor wafer, the content is preferably 0.5% by mass or more, and gelation can be suppressed if it is 6% by mass or less. The glass transition temperature (Tg) of the epoxy group-containing acrylic copolymer is preferably −10 ° C. or higher and 30 ° C. or lower.

  The amount of glycidyl acrylate or glycidyl methacrylate used as the functional group monomer is a copolymer ratio of 0.5 to 6% by mass, but the remainder is an alkyl having 1 to 8 carbon atoms such as methyl acrylate and methyl methacrylate. Mixtures of acrylates, alkyl methacrylates, and styrene and acrylonitrile can be used. Among these, ethyl (meth) acrylate and / or butyl (meth) acrylate are particularly preferable. The mixing ratio is preferably adjusted in consideration of the glass transition temperature (Tg) of the copolymer. There is no restriction | limiting in particular in a polymerization method, For example, pearl polymerization, solution polymerization, etc. are mentioned, A copolymer is obtained by these methods. Examples of such an epoxy group-containing acrylic copolymer include HTR-860P-3 (trade name, manufactured by Nagase ChemteX Corporation).

  The weight average molecular weight of the acrylic copolymer is preferably 50,000 or more, particularly preferably in the range of 200,000 to 1,000,000. If the molecular weight is too low, film formation will be insufficient, and if it is too high, compatibility with other components will deteriorate, resulting in hindering film formation.

  When an epoxy resin is used as the thermosetting component, for example, a phenolic resin can be used as the curing agent. As the phenolic resin, a condensate of phenols such as alkylphenol, polyhydric phenol, naphthol and aldehydes is used without particular limitation. The phenolic hydroxyl group contained in these phenolic resins can easily undergo an addition reaction with the epoxy group of the epoxy resin by heating to form a cured product having high impact resistance.

  Phenol resins include phenol novolak resin, o-cresol novolak resin, p-cresol novolak resin, t-butylphenol novolak resin, dicyclopentadiene cresol resin, polyparavinylphenol resin, bisphenol A type novolak resin, or modifications thereof. A thing etc. are used preferably.

  In addition, a thermally activated latent epoxy resin curing agent can also be used as the curing agent. This curing agent is a type of curing agent that does not react with the epoxy resin at room temperature but is activated by heating at a certain temperature or more and reacts with the epoxy resin.

  As an activation method, a method of generating active species (anions and cations) by a chemical reaction by heating, a dispersion that is stably dispersed in the epoxy resin near room temperature, is compatible with and dissolved in the epoxy resin at a high temperature, and a curing reaction is performed. There are a method for starting, a method for starting a curing reaction by elution at a high temperature with a molecular sieve encapsulated type curing agent, a method using a microcapsule, and the like.

  Examples of the thermally active latent epoxy resin curing agent include various onium salts, high melting point active hydrogen compounds such as dibasic acid dihydrazide compounds, dicyandiamide, amine adduct curing agents, and imidazole compounds.

  When an epoxy resin is used as the thermosetting component, a curing accelerator or the like can be used as an auxiliary agent. There is no restriction | limiting in particular as a hardening accelerator which can be used for this invention, For example, a tertiary amine, imidazoles, a quaternary ammonium salt etc. can be used. Examples of imidazoles preferably used in the present invention include 2-methylimidazole, 2-ethyl-4-methylimidazole, 1-cyanoethyl-2-phenylimidazole, 1-cyanoethyl-2-phenylimidazolium trimellitate, and the like. These may be used alone or in combination of two or more. Imidazoles are commercially available from Shikoku Kasei Kogyo Co., Ltd. under the trade names 2E4MZ, 2PZ-CN, 2PZ-CNS, for example.

  Moreover, you may mix | blend a filler. Examples of the filler include silica such as crystalline silica and synthetic silica, and inorganic filler such as alumina and glass balloon. By adding an inorganic filler to the curable protective film forming layer 2, the hardness of the protective film after curing can be improved. Moreover, the thermal expansion coefficient of the protective film after curing can be brought close to the thermal expansion coefficient of the wafer, thereby reducing the warpage of the semiconductor wafer during processing. Synthetic silica is preferable as the filler, and in particular, synthetic silica of the type from which the α-ray source that causes malfunction of the semiconductor device is removed as much as possible is optimal. As the shape of the filler, any of a spherical shape, a needle shape, and an amorphous type can be used, but a spherical filler capable of closest packing is particularly preferable.

  Furthermore, in order to improve the interfacial bonding between different materials, a coupling agent can be blended. A silane coupling agent is preferable as the coupling agent. As silane coupling agents, γ-glycidoxypropyltrimethoxysilane, γ-mercaptopropyltrimethoxysilane, γ-aminopropyltriethoxysilane, γ-ureidopropyltriethoxysilane, N-β-aminoethyl-γ- Examples include aminopropyltrimethoxysilane. The blending amount of the coupling agent is preferably 0.1 to 10 parts by weight with respect to a total of 100 parts by weight of the composition forming each of the dispersed phase and the continuous phase, from the effects of addition, heat resistance and cost. .

As the varnishing solvent, it is preferable to use methyl ethyl ketone, acetone, methyl isobutyl ketone, 2-ethoxyethanol, toluene, butyl cellosolve, methanol, ethanol, 2-methoxyethanol or the like having a relatively low boiling point. Moreover, you may add a high boiling point solvent for the purpose of improving coating-film property. Examples of the high boiling point solvent include dimethylacetamide, dimethylformamide, methylpyrrolidone, cyclohexanone and the like.
The thickness of the adhesive layer 12 may be appropriately set, but is preferably about 3 to 100 μm.

  In order to increase the breaking strength of the adhesive layer 12, it is effective to increase the polymer, decrease the filler, and decrease the epoxy resin (solid). Further, in order to reduce the peeling force of the adhesive layer 12 from the release film 11, it is effective to reduce the polymer and the epoxy resin (liquid).

(Adhesive film)
The adhesive film 13 is not particularly limited, and has a sufficient adhesive force so that the semiconductor wafer does not peel when dicing the semiconductor wafer. When the chip is picked up after dicing, it can be easily removed from the adhesive layer 12. Any material may be used as long as it exhibits low adhesive strength so that it can be peeled off. For example, what provided the adhesive layer in the base film can be used conveniently.

  The base film of the adhesive film 13 can be used without particular limitation as long as it is a conventionally known base film. However, when a radiation curable material is used as the adhesive layer described later, the radiation transparency is used. It is preferable to use one having

For example, as the material, polyethylene, polypropylene, ethylene-propylene copolymer, polybutene-1, poly-4-methylpentene-1, ethylene-vinyl acetate copolymer, ethylene-ethyl acrylate copolymer, ethylene-acrylic Α-olefin homopolymer or copolymer such as acid methyl copolymer, ethylene-acrylic acid copolymer, ionomer or a mixture thereof, polyurethane, styrene-ethylene-butene or pentene copolymer, polyamide-polyol Listed are thermoplastic elastomers such as copolymers, and mixtures thereof. Further, the base film may be a mixture of two or more materials selected from these groups, or may be a single layer or a multilayer.
The thickness of the base film is not particularly limited and may be set as appropriate, but is preferably 50 to 200 μm.

The resin used for the pressure-sensitive adhesive layer of the pressure-sensitive adhesive film 13 is not particularly limited, and a known chlorinated polypropylene resin, acrylic resin, polyester resin, polyurethane resin, epoxy resin, or the like used for the pressure-sensitive adhesive is used. can do.
It is preferable to prepare a pressure-sensitive adhesive by appropriately mixing an acrylic pressure-sensitive adhesive, a radiation polymerizable compound, a photopolymerization initiator, a curing agent and the like with the resin of the pressure-sensitive adhesive layer. The thickness of the pressure-sensitive adhesive layer is not particularly limited and may be appropriately set, but is preferably 5 to 30 μm.

A radiation-polymerizable compound can be blended in the pressure-sensitive adhesive layer to facilitate peeling from the adhesive layer 12 by radiation curing. As the radiation polymerizable compound, for example, a low molecular weight compound having at least two photopolymerizable carbon-carbon double bonds in a molecule that can be three-dimensionally reticulated by light irradiation is used.
Specifically, trimethylolpropane triacrylate, pentaerythritol triacrylate, pentaerythritol tetraacrylate, dipentaerythritol monohydroxypentaacrylate, dipentaerythritol hexaacrylate, 1,4-butylene glycol diacrylate, 1,6 hexanediol diacrylate Acrylate, polyethylene glycol diacrylate, oligoester acrylate, and the like are applicable.

In addition to the above acrylate compounds, urethane acrylate oligomers can also be used. The urethane acrylate oligomer includes a polyol compound such as a polyester type or a polyether type, and a polyvalent isocyanate compound (for example, 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate, 1,3-xylylene diene). A terminal isocyanate urethane prepolymer obtained by reacting isocyanate, 1,4-xylylene diisocyanate, diphenylmethane 4,4-diisocyanate, etc., with an acrylate or methacrylate having a hydroxyl group (for example, 2-hydroxyethyl) Acrylate, 2-hydroxyethyl methacrylate, 2-hydroxypropyl acrylate, 2-hydroxypropyl methacrylate, polyethylene glycol acrylate, polyethylene glycol methacrylate, etc.) Obtained by the reaction.
The pressure-sensitive adhesive layer may be a mixture of two or more selected from the above resins.

  When using a photopolymerization initiator, for example, isopropyl benzoin ether, isobutyl benzoin ether, benzophenone, Michler's ketone, chlorothioxanthone, dodecylthioxanthone, dimethylthioxanthone, diethylthioxanthone, benzyldimethyl ketal, α-hydroxycyclohexyl phenyl ketone, 2-hydroxymethylphenyl Propane or the like can be used. The blending amount of these photopolymerization initiators is preferably 0.01 to 5 parts by mass with respect to 100 parts by mass of the acrylic copolymer.

  The wafer processing tape 10 according to the above-described embodiment of the present invention includes the identification unit 14 even when the adhesive layer 12 is thin (less than 10 μm, particularly 5 μm or less). And the position of the adhesive layer 12, that is, the position of the label-shaped adhesive portion 22 can be recognized. That is, the wafer processing tape 10 according to an embodiment of the present invention described above can improve the sensor recognizability even when the adhesive layer 12 is thin (less than 10 μm, particularly not more than 5 μm). it can. Therefore, in the manufacturing process of the semiconductor device, even when the adhesive layer 12 is thin (10 μm or less, particularly 5 μm or less) by using the wafer processing tape 10 according to one embodiment of the present invention, When performing the precut processing of the film 13, it is possible to prevent, for example, a decrease in productivity such as a precut blade not working or a decrease in inspection accuracy such that the presence or absence of an adhesive layer and shape inspection cannot be performed.

  Next, a wafer processing tape 30 which is a modification of the wafer processing tape 10 according to the first embodiment of the present invention will be described with reference to FIGS.

FIG. 7A is a schematic perspective view of a wafer processing tape 30 which is a modification of the wafer processing tape 10 according to the first embodiment of the present invention, and FIG. 7B is a plan view thereof. FIG. 7C is a sectional view thereof.
As shown in FIGS. 7A, 7B, and 7C, the wafer processing tape 30 includes a long release film 11, an adhesive layer 12 (22), and an adhesive film 13 (23a, 23b). ) And an identification unit 34 (34a, 34b, 34c). The wafer processing tape 30 constitutes a dicing die bonding film 20 composed of the adhesive layer 12 (22) and the adhesive film 13 (23a).

  The difference between the wafer processing tape 30 and the wafer processing tape 10 described above is that the identification unit 34 has the label pitch L of the two adjacent label-shaped adhesive portions 22 and the wafer processing tape 30 on the adhesive film 13 side. On the surface, the long side of the rectangular shape passes through the substantially center position of the label-shaped adhesive portion 22, the long side of the rectangular shape and the Y direction are substantially parallel, and the length of the long side of the rectangular shape and the wafer processing It is the substantially rectangular shape provided so that the width of the tape 10 for Y might become substantially the same.

In FIG. 7, the identification unit 34 includes an identification unit 34b provided on the surface 24a of the label unit 23a and an identification unit 34a and an identification unit 34c provided on the surface 24a of the peripheral part 23b. It is a discontinuous substantially rectangular shape that is not formed on the surface 11 a of the mold film 11. Then, the interval in the X direction between two adjacent identification units 34 (that is, the interval in the X direction between the identification units 34a, the interval in the X direction between the identification units 34b, and the interval in the X direction between the identification units 34b) is This is the label pitch L between two adjacent label-shaped adhesive portions 22.
Note that the short side 35a of the identification unit 34a and the short side 35b of the identification unit 34c that are closest to the end in the Y direction of the wafer processing tape 10 are the short sides of the rectangular shape of the identification unit 34, and the short side 35a and the short side A straight line connecting the opposite ends of 35b is defined as the long side of the rectangular shape of the identification unit 34. Therefore, the length of the long side of the rectangular shape is the distance between the short side 35a and the short side 35b.

  Further, as shown in FIGS. 7A, 7B and 7C, the wafer processing tape 30 is formed on the identification portion 34b provided on the surface 24a of the label portion 23a and the surface 24a of the peripheral portion 23b. On the surface of the wafer processing tape 30 on the pressure-sensitive adhesive film 13 side, the rectangular long side of the discontinuous rectangular identification unit 34 including the identification unit 34 a and the identification unit 34 c provided is the label-shaped adhesive unit 22. It passes through a substantially central position, the long side of the rectangular shape and the Y direction are substantially parallel, and the length of the long side of the rectangular shape and the width of the wafer processing tape 10 in the Y direction are substantially the same. As shown in FIG. 8 (a), the identification portion 34b provided on the surface 24a of the label portion 23a and the identification portion 34a and the identification portion 34c provided on the surface 24a of the peripheral portion 23b. Discontinuous rectangular identification part 4, on the surface of the wafer processing tape 30 a on the adhesive film 13 side, the long side of the rectangular shape passes through a position that is substantially in contact with the outer peripheral plane position of the label-shaped adhesive portion 22, and the long side of the rectangular shape and the Y direction And the wafer processing tape 30a provided so that the length of the long side of the rectangular shape and the width of the wafer processing tape 10 in the Y direction are substantially the same.

  Further, as shown in FIG. 8 (b), the rectangular identification portion 34 provided on the surface 24a of the peripheral portion 23b is formed on the surface of the wafer processing tape 30b on the adhesive film 13 side (that is, the peripheral portion 23b). On the surface 24a), the long side of the rectangular shape passes through a position substantially in contact with the outer periphery of the peripheral portion 23b, the long side of the rectangular shape is substantially parallel to the Y direction, and the long side of the rectangular shape is long. The wafer processing tape 30b may be provided so that the width in the Y direction of the wafer processing tape 10 is substantially the same.

  That is, the identification unit 34 is not limited to the example described above, and the sensor or operator used in the pre-cut processing operation on the wafer processing tape 30 recognizes the identification unit 34 and makes contact with the label shape bonding unit 22. It may be provided at a position where alignment is possible. Further, the rectangular shape is preferably a shape close to a line with a shorter short side length.

  Further, as shown in FIG. 7C, the wafer processing tape 30 has the identification portion 34 provided on the surface of the wafer processing tape 30 on the adhesive film 13 side. As shown, the identification unit 34 is provided so as to be sandwiched between the label unit 23 a and the peripheral unit 23 b (adhesive film 13), the label-shaped adhesive unit 22 (adhesive layer 12), and the release film 11. The processing tape 30c may be used. Further, as shown in FIG. 9B, the identification unit 34 is for wafer processing provided on the surface 11b of the release film 11 opposite to the surface in contact with the label-shaped adhesive unit 22 (adhesive layer 12). The tape 30d may be used.

  From the above, the above-described wafer processing tapes 30, 30a to 30d can obtain the same effects as the above-described wafer processing tape 10 according to the first embodiment of the present invention.

Next, a wafer processing tape 40 according to a second embodiment of the present invention will be described with reference to FIGS.
FIG. 10A is a plan view of a wafer processing tape 40 according to the second embodiment of the present invention, and FIG. 10B is a cross-sectional view thereof.
As shown in FIGS. 10A and 10B, the wafer processing tape 40 is distinguished from the long release film 11, the adhesive layer 12 (22), and the adhesive film 13 (23a, 23b). Part 44. Further, the wafer processing tape 40 constitutes a dicing die bonding film 20 including the adhesive layer 12 (22) and the adhesive film 13 (23a).

  The difference between the wafer processing tape 40 according to the second embodiment of the present invention and the above-described wafer processing tape 10 according to the first embodiment of the present invention is that the identification unit 44 has An annular shape provided on the surface 24a of the label portion 23a (adhesive film 13) opposite to the surface in contact with the label-shaped adhesive portion 22 according to the outer periphery, for example, a circular ring shape. In addition, the identification part 44 should just be a cyclic | annular shape which can recognize the outer peripheral part of the label-shaped adhesion part 22 with the sensor used at the time of the work of a precut process, or an operator. The shape of the circular ring is preferably narrower.

  Further, as shown in FIG. 10B, in the wafer processing tape 40, the identification part 44 is provided on the surface 24a of the label part 23a (adhesive film 13). Thus, the wafer processing tape 40a provided on the outer peripheral portion of the label-shaped adhesive portion 22 may be used. Here, the outer peripheral portion of the label-shaped adhesive portion 22 is a release film that contacts the label-shaped adhesive portion 22 on the surface 22a of the label-shaped adhesive portion 22 that contacts the label portion 23a, or the side surface 22b of the label-shaped adhesive portion 22. 11 near the outer periphery of at least one label-shaped adhesive portion 22 on the surface 11a. For example, when the label layer adhesive portion 22 is formed by pre-cutting the adhesive layer 12 into a label shape, such an identification portion 44 is simultaneously with the pre-cut operation by ink pre-attached to a pre-cut blade or a mold. Is formed.

  Further, as shown in FIG. 10B, the identification part 44 is provided on the surface 24a of the label part 23a (adhesive film 13). However, as shown in FIG. 11 may be a wafer processing tape 40b provided on the surface 11b opposite to the surface 11a in contact with the 11 label-shaped adhesive portion 22.

  As shown in FIGS. 10A and 10B, in the wafer processing tape 40, the identification portion 44 has a shape (circular ring shape) corresponding to the outer periphery of the label-shaped adhesive portion 22 or the pre-cut shape. However, as shown in FIGS. 12 (a) and 12 (b), the discriminating portion 44 has an annular shape provided on the surface 24a of the label portion 23a (adhesive film 13) in accordance with the outer periphery of the label portion 23a. A certain wafer processing tape 40c may be used. That is, the identification part 44 may have a shape corresponding to the outer periphery of the label part 23a or the precut shape.

  From the above, the wafer processing tapes 40, 40a to 40c according to the second embodiment of the present invention described above have the same effects as the wafer processing tape 10 according to the first embodiment of the present invention described above. can get.

Next, for wafer processing according to one embodiment of the present invention for manufacturing the wafer processing tape 10 according to the first embodiment of the present invention shown in FIGS. 1 (a), (b) and (c). A method for manufacturing a tape will be described. Hereinafter, a case where the identification unit 14 is formed by printing will be described as an example.
FIG. 13 and FIG. 14 are views for explaining a wafer processing tape manufacturing method according to an embodiment of the present invention for manufacturing the wafer processing tape 10 of the present invention.

  As shown in FIG. 13, first, using a printing mechanism (not shown), an interval (label pitch) L in the X direction (label pitch) L (see FIG. 1 (a) )), The identification unit 14 is printed on the surface 13a of the adhesive film 13 (step 1: S1). Here, the substantially rectangular shape is mechanically printed at the label pitch L on the surface 13a of the adhesive film 13 as the identification unit 14 so that the long side of the rectangular shape and the Y direction are substantially parallel. For example, the printing mechanism is composed of a drum provided with a rubber stamp having an outer diameter matched to the interval between the label-shaped adhesive portions 22 to be formed and a stamp stand. It can be printed on the surface 13 a of the adhesive film 13. Further, this step 1 is executed together with a slitting process for performing width reduction and inspection for obtaining a wafer processing tape 10 having a desired width, or by newly providing a printing process.

  Next, the adhesive layer 12 is laminated on the entire surface of the long release film 11 to form a first laminated body (adhesive film) 25 (step 2: S2). Next, the release film 11 is peeled from the surface 12a of the adhesive layer 12 on the first laminate 25 in which the adhesive layer 12 is laminated on the long release film 11 using a precut blade (not shown). An annular cut (hereinafter referred to as a first cut) 26 is made until reaching (step 3: S3). Here, a punching process may be performed so as to form the first cut 26 using a mold instead of the precut blade.

  Next, the unnecessary adhesive layer 12 outside the first notch 26 is peeled off and removed from the release film 11, and only the label-shaped adhesive portion 22 that is the label-shaped adhesive layer 12 is placed on the release film 11. The remaining state is set (step 4: S4). Here, Step 1 is executed before Steps 2 to 4, but it may be executed after Steps 2 to 4 or simultaneously with Steps 2 to 4.

  Next, the 2nd laminated body 27 which laminated | stacked the adhesive film 13 is formed so that the label shape adhesion part 22 and the exposed release film 11 whole surface may be covered (step 5: S5). At this time, as shown in FIGS. 1A and 1B, the label-shaped adhesive portion 22 and the identifying portion 14 are such that the extension line of the rectangular long side of the identifying portion 14 is an abbreviation of the label-shaped adhesive portion 22. The alignment is made by visual observation so as to pass through the center, and the label-shaped adhesive portion 22 and the pressure-sensitive adhesive layer of the pressure-sensitive adhesive film 13 are heated and bonded together. Since the interval between the two adjacent label-shaped adhesive portions 22 and the interval between the two adjacent identification portions 14 are the same label pitch L, the desired one (first) label-shaped adhesive portion 22 and the desired 1 It is only necessary to perform alignment with one (first) identification unit 14, and it is not necessary to align all the identification units 14.

  Next, as shown in FIG. 14, from the surface 13 a of the adhesive film 13, a pre-cut blade (not shown) is used for the laminated portion 27 a composed of the release film 11 and the adhesive film 13 of the second laminate 27. An annular cut (hereinafter referred to as a second cut) 28 surrounding the label-shaped adhesive portion 22 until the release film 11 is reached, and an annular cut completely surrounding the second cut 28 outside the second cut 28 (Hereinafter referred to as the third cut) 29 is entered (step 6: S6).

  Here, the formation of the second cut 28 and the formation of the third cut 29 is caused by the recognition unit 14 being recognized by an optical sensor or the like, and the precut blade is rotated by the recognition of the identification unit 14 by the optical sensor or the like, so that the cut is made. It is formed. The precut blade is set to rotate at a timing such that the center of the label-shaped adhesive portion 22 and the center of the label portion 23a coincide.

  Further, punching may be performed so as to form the second cut 28 and the third cut 29 using a mold instead of the precut blade. In addition, although the formation of the second cut 28 and the formation of the third cut 29 are performed simultaneously, they may be formed separately. At that time, either may be formed first. In the case where the peripheral portion 23b does not completely surround the outside of the label portion 23a as shown in the wafer processing tape 10a (see FIG. 2), the third notch 29 is not surrounded by the second notch 28. And Further, in the case where there is no peripheral portion 23b as shown in the wafer processing tape 10b (see FIG. 3), the third notch 29 is not provided and only the second notch 28 is provided.

  Finally, the unnecessary adhesive film 13 between the second cut 28 and the third cut 29 is removed by peeling from the release film 11 to form a label portion 23a and a peripheral portion 23b made of the adhesive film 13 (step 7). : S7). Thus, the wafer processing tape 10 having the dicing die bonding film 20 including the label-shaped adhesive portion 22 and the label portion 23a, that is, the adhesive layer 12 and the adhesive film 13, is formed. When the wafer processing tape 10b (see FIG. 3) does not have the peripheral portion 23b, the unnecessary adhesive film 13 outside the second cut 28 is peeled off from the release film 11 and removed. Only the label part 23a made of the adhesive film 13 is formed.

  In the method for manufacturing the wafer processing tape 10 described above, the step (step) of forming the second laminate 27 in which the adhesive film 13 is laminated so as to cover the entire surface of the label-shaped adhesive portion 22 and the exposed release film 11. Prior to 5), the step (step 1) of forming the identification portion 14 on the surface 13a of the adhesive film 13 is executed. In FIG. 13 and FIG. In the step of making the first cut 26 for forming the portion 22 (step 3), the identification portion 14 is formed on the surface 13a of the adhesive film 13 corresponding to step 1 in accordance with the timing of making the first cut 26. You may make it perform a process. At this time, for example, a rubber stamp for forming the identification portion 14 is provided on a drum provided with a precut blade for inserting the first cut 26 or on another drum having the same diameter as the drum, and a stamp provided separately. The identification part 14 is printed and formed on the surface 13a of the adhesive film 13 at the same interval as the interval between the label-shaped adhesive portions 22 (label pitch L).

Further, as shown in FIG. 6A, the identification unit 14 is a wafer processing tape 10i provided between the label unit 23a (adhesive film 13) and the label-shaped adhesive unit 22 (adhesive layer 12). In this case, as shown in FIGS. 15 and 16, the step of forming the identification portion 14 on the surface 13b of the adhesive film 13 (step 5a: S5a) and the step of forming the second laminate 27 (step 5). The wafer processing tape 10i is formed by executing each step in the order of Step 2, Step 3, Step 4, Step 5a, Step 5, Step 6, and Step 7. Here, step 5 a is provided between step 4 and step 5, but it may be performed before step 5.
In addition, the identification part 14 is printed and formed on the surface 13b of the adhesive film 13 by the label pitch L of the label shape adhesion part 22 formed by step 2 thru | or step 4. FIG.

Further, as shown in FIG. 6B, the wafer processing in which the identification unit 14 is provided on the surface 11b of the release film 11 opposite to the surface in contact with the label-shaped bonding unit 22 (adhesive layer 12). In the case of the tape 10j, as shown in FIGS. 17 and 18, the step of forming the identification portion 14 on the surface 11b of the release film 11 (step 2a: S2a) is performed by the first laminate (adhesive film) 25. The wafer processing tape 10j is provided by performing each step in the order of Step 2a, Step 2, Step 3, Step 4, Step 5, Step 6, and Step 7. Form. Here, step 2a is performed before step 2, but may be performed simultaneously with step 2 or after step 2.
In addition, the identification part 14 is printed and formed on the surface 11b of the release film 11 with the label pitch L of the label shape adhesion part 22 formed by Step 2 to Step 4.

  In addition, as shown in FIG. 6C, when the identification unit 14 is the wafer processing tape 10k provided between the label unit 23a (adhesive film 13) and the release film 11, FIG. Similar to the manufacturing method shown in FIG. 16, the wafer forming tape 10k is manufactured by executing the step of forming the identification portion 14 on the surface 13b of the adhesive film 13.

  In addition, as shown in FIG. 6D, the identification unit 14 is a wafer processing tape 10l provided between the peripheral portion 23b (adhesive film 13) and the release film 11 as well. Similarly to the manufacturing method shown in FIG. 16, the wafer forming tape 10l is manufactured by executing the step of forming the identification portion 14 on the surface 13b of the adhesive film 13.

  Further, the method for manufacturing the wafer processing tapes 10f to 10h according to the modification of the first embodiment of the present invention shown in FIGS. 5A, 5B and 5C is also the above-mentioned wafer processing tape. This is the same as the manufacturing method 10. The method for manufacturing the wafer processing tapes 30, 30a, 30b according to the modification of the first embodiment of the present invention shown in FIGS. 7 and 8 is the same as the method for manufacturing the wafer processing tape 10 described above. It is. Further, the method of manufacturing the wafer processing tape 30c according to the modification of the first embodiment of the present invention shown in FIG. 9A is the same as the method of manufacturing the wafer processing tape 10i. Also, the method for manufacturing the wafer processing tape 30d according to the modification of the first embodiment of the present invention shown in FIG. 9B is the same as the method for manufacturing the wafer processing tape 10j.

Next, a method for manufacturing a wafer processing tape according to an embodiment of the present invention for manufacturing a wafer processing tape 40 according to the second embodiment of the present invention shown in FIGS. 10 (a) and 10 (b). Will be described. Hereinafter, a case where the identification unit 44 is formed by printing will be described as an example.
19 and 20 are views for explaining a wafer processing tape manufacturing method according to an embodiment of the present invention for manufacturing the wafer processing tape 40 of the present invention.

A wafer processing tape manufacturing method according to an embodiment of the present invention for manufacturing the wafer processing tape 10 of the present invention shown in FIGS. 13 and 14, and the wafer of the present invention shown in FIGS. The difference from the wafer processing tape manufacturing method according to an embodiment of the present invention for manufacturing the processing tape 40 is that the identification unit 44 is replaced with a label in step 1 (S1) instead of the identification unit 14. Printing is formed on the surface 13a of the pressure-sensitive adhesive film 13 with the label pitch L of the shape bonding portion 22 (step 1: S1). This identification part 44 is an annular shape provided on the surface 24a of the label part 23a (adhesive film 13) opposite to the surface in contact with the label shape adhesion part 22 in accordance with the outer periphery of the label shape adhesion part 22. For example, a circular ring shape.
As shown in FIGS. 19 and 20, the wafer processing tape 40 is formed by executing the above-described steps 1 to 7.

  Further, the wafer processing tape 40a as shown in FIG. 11A can form the identification portion 44 simultaneously with the pre-cut operation as shown in FIGS. When the adhesive layer 12 is pre-cut into a label shape to form the label-shaped adhesive portion 22, there is a method of forming simultaneously with the pre-cut operation using ink pre-attached to a pre-cut blade or a mold.

  A wafer processing tape manufacturing method according to an embodiment of the present invention for manufacturing the wafer processing tape 10 of the present invention shown in FIGS. 13 and 14, and the wafer of the present invention shown in FIGS. The difference from the wafer processing tape manufacturing method according to one embodiment of the present invention for manufacturing the processing tape 40a is that, in step 3 (S3), a long length is used by using a precut blade (not shown). An annular first cut 26 extending from the surface 12a of the adhesive layer 12 to the release film 11 is inserted into the first laminated body 25 in which the adhesive layer 12 is laminated on the release film 11, and the label shape That is, the annular identification portion 44 aligned with the outer periphery of the bonding portion 22 is printed and formed (step 3: S3).

  At this time, for example, before making the first cut 26, ink is attached to the precut blade so that the precut blade passes through the stamp table, and the first cut 26 and ink are attached to the first cut 26. As a result, an annular identification portion 44 that matches the outer periphery of the label-shaped adhesive portion 22 is formed on the outer peripheral portion of the label-shaped adhesive portion 22 formed in the subsequent step 2. At this time, since the identification part 44 is provided on the outer peripheral part of the label-shaped adhesive part 22, a part of the identification part 44 is also formed on the surface 11a of the release film 11 in contact with the label-shaped adhesive part 22. The Further, a punching process may be performed so as to form the first cut 26 using a mold instead of the precut blade.

  Then, as shown in FIGS. 21 and 22, the wafer processing tape 40a is formed by executing each step in the order of Step 2, Step 3, Step 4, Step 5, Step 6, Step 7 described above. .

  Further, as shown in FIG. 11B, the wafer processing in which the identification portion 44 is provided on the surface 11b of the release film 11 opposite to the surface in contact with the label-shaped adhesive portion 22 (adhesive layer 12). In the case of the tape 40b, the wafer processing tape 40b is produced by forming the identification part 44 instead of the identification part 14 of FIGS. Before the formation of the first cut 26, simultaneously with the formation of the first cut 26 or after the formation of the first cut 26, the first cut 26 is formed at a position corresponding to the first cut 26 on the surface 11b of the release film 11. The identification part 44 having the same shape as the one cut 26 is printed.

(Example)
Next, examples of the present invention will be described, but the present invention is not limited to the following examples.

(Formation of adhesive layer 12)
50 parts by mass of a cresol novolac type epoxy resin (epoxy equivalent 197, molecular weight 1200, softening point 70 ° C.) as an epoxy resin, 1.5 parts by mass of γ-mercaptopropyltrimethoxysilane as a silane coupling agent, γ-ureidopropyltriethoxysilane Cyclohexanone was added to a composition consisting of 3 parts by mass and 30 parts by mass of silica filler having an average particle size of 16 nm, and the mixture was stirred and mixed, and further kneaded for 90 minutes using a bead mill.

  To this, 100 parts by mass of acrylic resin (mass average molecular weight: 800,000, glass transition temperature -17 ° C), 5 parts by mass of dipentaerythritol hexaacrylate as a hexafunctional acrylate monomer, 0.5 mass of adduct of hexamethylene diisocyanate as a curing agent Part, Curesol 2PZ (trade name, 2-phenylimidazole, manufactured by Shikoku Kasei Co., Ltd.) 2.5 parts by mass, stirred and mixed, vacuum degassed to obtain an adhesive.

  The adhesive is applied on the release film 11 and dried by heating at 110 ° C. for 1 minute to form a B-stage coating film (intermediate curing state of thermosetting resin) with a film thickness of 5 μm. An adhesive layer 12 was formed on the film 11 and stored refrigerated.

(Formation of adhesive film 13)
In 400 g of toluene as a solvent, 128 g of n-butyl acrylate, 307 g of 2-ethylhexyl acrylate, 67 g of methyl methacrylate, 1.5 g of methacrylic acid, and a mixed solution of benzoyl peroxide as a polymerization initiator are appropriately adjusted in a dropping amount, and reacted. The temperature and the reaction time were adjusted to obtain a solution of the compound (1) having a functional group.

  Next, 2.5 g of 2-hydroxyethyl methacrylate synthesized separately from methacrylic acid and ethylene glycol as a compound (2) having a radiation curable carbon-carbon double bond and a functional group was added to this polymer solution, and hydroquinone as a polymerization inhibitor. Was added by appropriately adjusting the dropping amount, and the reaction temperature and reaction time were adjusted to obtain a solution of the compound (A) having a radiation curable carbon-carbon double bond. Subsequently, 100 parts by mass of the compound (A) in the compound (A) solution was added by 1 part by mass of Nippon Polyurethane Co., Ltd .: Coronate L as a polyisocyanate (B), and manufactured by Ciba Geigy of Japan: Iruga as a photopolymerization initiator. A radiation curable pressure-sensitive adhesive composition was prepared by adding 0.5 parts by mass of Cure 184 and 150 parts by mass of ethyl acetate as a solvent to the compound (A) solution and mixing them.

  Subsequently, the prepared pressure-sensitive adhesive layer composition was applied to an ethylene-vinyl acetate copolymer base film having a thickness of 100 μm so that the dry film thickness was 20 μm, and dried at 110 ° C. for 3 minutes. 13 was produced.

(Formation of wafer processing tape used as Example 1)
The release film 11 on which the adhesive layer 12 that had been refrigerated was formed was returned to room temperature, and the cut depth into the release film 11 was adjusted to 10 μm or less, and a circular precut process with a diameter of 220 mm was performed. . Thereafter, unnecessary portions of the adhesive layer 12 were removed, and the adhesive layer 13 was laminated at room temperature. Next, a circular pre-cut having a diameter of 290 mm concentrically with the adhesive layer 12 by adjusting the pressure-sensitive adhesive film 13 outside the bonded adhesive layer 12 so that the depth of cut into the release film 11 is 10 μm or less. I tried processing. At this time, the discriminating portion was recognized using an optical sensor, aligned with the circular pre-cut adhesive layer 12 having a diameter of 220 mm, and the pressure-sensitive adhesive film 13 was precut into a concentric circle having a diameter of 290 mm. Although it does not specifically limit as an optical sensor, For example, a general purpose laser sensor etc. can be used. Thus, production of a wafer processing tape used as Example 1 was attempted.
Further, like the wafer processing tape 10 shown in FIGS. 1A, 1B, and 1C, when the adhesive film 13 is manufactured, it is fixed on the surface 13a of the adhesive film 13 by using a printing mechanism ( A rectangular identification portion having a shape close to a line and having a long side length of about 10 mm was printed and formed at intervals of 278.6 mm).

(Formation of wafer processing tape used as Example 2)
When the adhesive film 13 is manufactured like the wafer processing tape 30 shown in FIGS. 7A, 7B, and 7C, it is fixed on the surface 13a of the adhesive film 13 using a printing mechanism (278. 6 mm) at intervals, the shape was close to a line, and the long-side length and the length of the adhesive film 13 in the Y direction were the same except that the rectangular-shaped identification portion was printed and formed. Same as 1.

(Formation of wafer processing tape used as Example 3)
When the adhesive film 13 is manufactured as in the wafer processing tape 40 shown in FIGS. 10A and 10B, the printing mechanism is used on the surface 13 a of the adhesive film 13 at a constant (278.6 mm) interval. Example 2 is the same as Example 1 except that a circular ring-shaped identification part having a diameter of 220 mm is printed.

(Formation of wafer processing tape used as Example 4)
The mold release film 11 formed with the adhesive layer 12 that had been refrigerated was returned to room temperature and adjusted so that the depth of cut into the mold release film 11 was 10 μm or less, and a circular precut process with a diameter of 220 mm was attempted. . Thereafter, unnecessary portions of the adhesive layer 12 are removed, and the surface 13b of the adhesive film 13 has a shape close to a line at a constant (278.6 mm) interval using a printing mechanism, and the length of the long side is about 10 mm. Was laminated at room temperature with the adhesive film 13 on which the rectangular identification portion was printed. Next, a circular pre-cut having a diameter of 290 mm concentrically with the adhesive layer 12 by adjusting the pressure-sensitive adhesive film 13 outside the bonded adhesive layer 12 so that the depth of cut into the release film 11 is 10 μm or less. I tried processing. Thus, production of a wafer processing tape used as Example 4 was attempted. This wafer processing tape corresponds to the wafer processing tape 10i shown in FIG.

(Formation of wafer processing tape used as Example 5)
The mold release film 11 formed with the adhesive layer 12 that had been refrigerated was returned to room temperature and adjusted so that the depth of cut into the mold release film 11 was 10 μm or less, and a circular precut process with a diameter of 220 mm was attempted. . In that case, the recognition part was provided in the outer peripheral part of the adhesive bond layer 12 by coloring the precut blade. Thereafter, unnecessary portions of the adhesive layer 12 were removed, and the adhesive layer 13 was laminated at room temperature. Next, a circular pre-cut having a diameter of 290 mm concentrically with the adhesive layer 12 by adjusting the pressure-sensitive adhesive film 13 outside the bonded adhesive layer 12 so that the depth of cut into the release film 11 is 10 μm or less. I tried processing. Thus, production of a wafer processing tape used as Example 5 was attempted. This wafer processing tape corresponds to the wafer processing tape 40a shown in FIG.

(Formation of wafer processing tape used as Example 6)
As in the wafer processing tape 10j shown in FIG. 6B, when the adhesive layer 12 is manufactured, a printing mechanism is used on the surface 11b of the release film 11 opposite to the surface in contact with the adhesive layer 12. This is the same as Example 1 except that a rectangular identification portion having a shape close to a line and having a long side length of about 10 mm is printed and formed at constant (278.6 mm) intervals.

(Formation of wafer processing tape used as Example 7)
As in the wafer processing tape 30d shown in FIG. 9B, when the adhesive layer 12 is manufactured, a printing mechanism is used on the surface 11b of the release film 11 opposite to the surface in contact with the adhesive layer 12. In particular, a rectangular identification part provided with a constant (278.6 mm) interval and a shape close to a line and having the long side length and the length in the Y direction of the adhesive film 13 printed is formed. The rest is the same as in the first embodiment.

(Formation of wafer processing tape used as Example 8)
When the adhesive layer 12 is manufactured as in the wafer processing tape 40b shown in FIG. 11B, a printing mechanism is used on the surface 11b of the release film 11 opposite to the surface in contact with the adhesive layer 12. The same as Example 1, except that a circular ring-shaped identification portion having a diameter of 220 mm was printed at regular intervals (278.6 mm).

(Formation of wafer processing tape used as a comparative example)
The release film on which the adhesive layer that had been refrigerated was formed was returned to room temperature and adjusted so that the depth of cut into the release film was 10 μm or less, and a circular precut process with a diameter of 220 mm was attempted. Then, the unnecessary part of the adhesive bond layer was removed, and the adhesive film was laminated at room temperature. Subsequently, the pressure-sensitive adhesive film outside the bonded adhesive layer was adjusted so that the depth of cut into the release film was 10 μm or less, and a circular precut process with a diameter of 290 mm concentrically with the adhesive layer was attempted. . At this time, a circular pre-cut adhesive layer having a diameter of 220 mm was identified using an optical sensor, and the adhesive film was pre-cut into a circular shape having a diameter of 290 mm concentrically by matching the positions. Although it does not specifically limit as an optical sensor, For example, a general purpose laser sensor etc. can be used. Thus, production of a wafer processing tape used as a comparative example was attempted.

  Sensor recognizability was evaluated for the wafer processing tapes of Examples 1 to 8 and Comparative Example, and the results are shown in Table 1.

<Evaluation of sensor recognition>
The operation of recognizing the outer peripheral portion of the circular pre-cut adhesive layer having a diameter of 220 mm using an optical sensor when producing the wafer processing tapes of Examples 1 to 8 and Comparative Example was performed in comparison with Examples 1 to 8 and Comparative Example. Each of the wafer processing tapes of the example was performed 50 times, and the ratio of the number of times that the secondary precut blade was rotated to form the second cut at a predetermined position was examined to evaluate the sensor recognizability. Here, in Table 1, the number of times of recognition indicates the number of times that the secondary precut blade has rotated and the second cut has been formed at a predetermined position, and the sensor recognition success rate is the number of times of recognition during 50 recognition operations. The ratio (%) is shown.

As shown in Table 1, the wafer processing tapes of Examples 1 to 8 were able to form the second cut in the secondary precut processing step in all 50 recognition operations. On the other hand, the wafer processing tape of the comparative example was able to form the second cut in the secondary pre-cut processing step only 5 times during the 50 recognition operations.
From the results in Table 1, it was found that the wafer recognizing tape according to this example has good sensor recognizability even when the thickness of the adhesive layer 12 is 5 μm or less.

10, 30, 40: Wafer processing tape 11: Release film 12: Adhesive layer 13: Adhesive films 14, 34, 44: Identification part 20: Dicing die bonding film 22: Label shape adhesion part 23a: Label part 23b: Peripheral portion 25: first laminated body 26: first cut 27: second laminated body 28: second cut 29: third cut

Claims (11)

A long release film,
A plurality of adhesive layers having a predetermined planar shape provided on the release film;
An adhesive film that covers each of the adhesive layers and has a plurality of label portions provided so as to be in contact with the release film around the adhesive layers;
A wafer processing tape comprising:
The pressure-sensitive adhesive film and the adhesive layer on the surface of the pressure-sensitive adhesive film opposite to the surface in contact with the adhesive layer so that the identification portion has substantially the same distance as the distance between the two adjacent adhesive layers. Between the adhesive film and the release film, between the adhesive layer and the release film, or on the surface of the release film opposite to the surface in contact with the adhesive layer. A wafer processing tape, wherein the tape is provided on at least one of the wafer processing tapes.   2. The wafer processing tape according to claim 1, wherein the identification portion has an annular shape that matches the outer periphery of the adhesive layer.   The tape for wafer processing according to claim 1, wherein the identification unit is formed by printing.   The said adhesive film is provided with the peripheral part provided so that the outer side of the said label part might be enclosed on the said release film, The wafer processing of any one of Claim 1 thru | or 3 characterized by the above-mentioned. tape. (A) A plurality of adhesive layers having a predetermined planar shape are provided on a long release film, and the adhesive film is laminated on the adhesive film in which the release film and the adhesive layer are laminated in this order. A step of laminating an adhesive film so as to cover the agent layer and to contact the release film around the adhesive layer;
(B) In the laminate composed of the adhesive film and the pressure-sensitive adhesive film formed by the step (a), the laminate portion composed of the release film and the pressure-sensitive adhesive film is moved from the surface of the pressure-sensitive adhesive film. Forming a plurality of annular cuts surrounding each of the adhesive layers until reaching the release film;
A method for producing a wafer processing tape comprising:
Before the step (a),
(C) comprising a step of forming an identification portion on the surface of the pressure-sensitive adhesive film opposite to the surface in contact with the adhesive layer so that the distance is substantially the same as the distance between the two adjacent adhesive layers;
The step (b) recognizes the identification part, thereby aligning with the adhesive layer to form an annular cut surrounding the adhesive layer, and manufacturing a wafer processing tape Method. (A) A plurality of adhesive layers having a predetermined planar shape are provided on a long release film, and the adhesive film is laminated on the adhesive film in which the release film and the adhesive layer are laminated in this order. A step of laminating an adhesive film so as to cover the agent layer and to contact the release film around the adhesive layer;
(B) In the laminate composed of the adhesive film and the pressure-sensitive adhesive film formed by the step (a), the laminate portion composed of the release film and the pressure-sensitive adhesive film is moved from the surface of the pressure-sensitive adhesive film. Forming a plurality of annular cuts surrounding each of the adhesive layers until reaching the release film;
A method for producing a wafer processing tape comprising:
Immediately before step (a),
(D) on the surface of the pressure-sensitive adhesive film in contact with the adhesive film, comprising a step of forming an identification portion so as to have substantially the same interval as the interval between the two adjacent adhesive layers;
The step (b) recognizes the identification part, thereby aligning with the adhesive layer to form an annular cut surrounding the adhesive layer, and manufacturing a wafer processing tape Method. (A) A plurality of adhesive layers having a predetermined planar shape are provided on a long release film, and the adhesive film is laminated on the adhesive film in which the release film and the adhesive layer are laminated in this order. A step of laminating an adhesive film so as to cover the agent layer and to contact the release film around the adhesive layer;
(B) In the laminate composed of the adhesive film and the pressure-sensitive adhesive film formed by the step (a), the laminate portion composed of the release film and the pressure-sensitive adhesive film is moved from the surface of the pressure-sensitive adhesive film. Forming a plurality of annular cuts surrounding each of the adhesive layers until reaching the release film;
A method for producing a wafer processing tape comprising:
A plurality of the adhesive layers having a predetermined planar shape are provided on the release film, which is executed before the step (a), and the release film and the adhesive layer are laminated in this order. In the step of producing the adhesive film,
(E) comprising a step of forming an identification portion on the surface of the release film opposite to the surface in contact with the adhesive layer so as to have substantially the same interval as the interval between the two adjacent adhesive layers;
The step (b) recognizes the identification part, thereby aligning with the adhesive layer to form an annular cut surrounding the adhesive layer, and manufacturing a wafer processing tape Method.   8. The wafer processing tape according to claim 5, wherein the identification portion has an annular shape that matches the outer periphery of the adhesive layer. 9. (A) A plurality of adhesive layers having a predetermined planar shape are provided on a long release film, and the adhesive film is laminated on the adhesive film in which the release film and the adhesive layer are laminated in this order. A step of laminating an adhesive film so as to cover the agent layer and to contact the release film around the adhesive layer;
(B) In the laminate composed of the adhesive film and the pressure-sensitive adhesive film formed by the step (a), the laminate portion composed of the release film and the pressure-sensitive adhesive film is moved from the surface of the pressure-sensitive adhesive film. Forming a plurality of annular cuts surrounding each of the adhesive layers until reaching the release film;
A method for producing a wafer processing tape comprising:
A plurality of the adhesive layers having a predetermined planar shape are provided on the release film, which is executed before the step (a), and the release film and the adhesive layer are laminated in this order. In the step of producing the adhesive film,
(F) when forming the adhesive layer of a predetermined planar shape, comprising a step of forming an annular identification portion in accordance with the outer periphery of the adhesive layer on the outer peripheral portion of the adhesive layer;
The step (b) recognizes the identification part, thereby aligning with the adhesive layer to form an annular cut surrounding the adhesive layer, and manufacturing a wafer processing tape Method.   The method for manufacturing a wafer processing tape according to claim 5, wherein the identification portion is formed by printing. Instead of the step (b), (g) in the laminate composed of the adhesive film and the adhesive film formed by the step (a), the laminate comprising the release film and the adhesive film Forming a plurality of annular cuts surrounding each adhesive layer from the surface of the pressure-sensitive adhesive film to the release film, and forming another cut outside the cuts The method for producing a wafer processing tape according to any one of claims 5 to 10, wherein:

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