KR20210015893A - Glass processing tape - Google Patents

Abstract

Provided is a tape for glass processing that can be sufficiently heat-shrunk in a short time and can maintain a cuff width. The glass processing tape 10 of the present invention has an adhesive tape 15 having a base film 11 and an adhesive layer 12 formed on at least one side of the base film 11, and the adhesive tape 15 ) Is the average value of the differential value of the thermal strain for each 1° C. between 40° C. and 80° C. measured at the time of heating by the thermomechanical property tester in the MD direction, and the thermomechanical property tester in the TD direction. The sum of the average value of the differential values of the thermal strain for each 1° C. between 40° C. and 80° C. measured at the time of heating is a negative value, and is used in the processing of glass including the expansion process of expanding the adhesive tape 15 It features.

Description

Glass processing tape

The present invention can be used to fix the glass in a dicing step of dividing glass into chip-shaped elements, and further, a die bonding step of bonding between a chip and a chip after dicing or between a chip and a substrate, or The present invention relates to an expandable glass processing tape that can be used in a mounting step as well as in a step of dividing an adhesive layer along a chip by expanding.

In a camera or sensor mounted on a smartphone or the like, glass having various characteristic optical properties is mounted. These glasses are generally produced by vacuum evaporating various materials with respect to the glass serving as the parent body. After that, after affixing adhesive and stretchable glass processing tapes to these glasses, a dicing process that divides the glass into chips, an expand process that expands (expands) the glass processing tape, and a pickup that picks up the divided chips. A process and further a die bonding process of adhering the picked up chip to a specific location is performed.

In the above glass dicing process, cutting with a blade has been mainstream in the past, but due to the influence of thin film or vapor deposition of the glass itself, a defect called chipping has become a problem, and there is a problem in that the yield decreases.

In order to solve such a problem, in recent years, as a method of cutting glass, a so-called stealth dicing method has been proposed in which glass can be cut without contact using a laser processing device. For example, in Patent Document 1, as a stealth dicing method, by interposing an adhesive layer (die-bonding resin layer), focusing light on the inside of the semiconductor substrate on which the sheet is affixed, and irradiating the laser light, the interior of the semiconductor substrate A method of cutting a semiconductor substrate comprising a step of forming a modified region by multiphoton absorption and using the modified region as a cutting scheduled part, and a step of cutting the semiconductor substrate and the adhesive layer along the cutting scheduled part by expanding the sheet. It is disclosed.

In addition, as a method of cutting another wafer using a laser processing device, for example, in Patent Document 2, a step of attaching a die bonding adhesive layer (adhesive film) to the back surface of the wafer, and the adhesive of the wafer to which the adhesive layer is bonded. On the layer side, a step of bonding an extendable protective adhesive tape, a step of irradiating a laser beam along a street from the surface of the wafer to which the protective adhesive tape was bonded, and dividing it into individual chips, and a step of extending the protective adhesive tape to an adhesive A method of dividing a wafer including a step of imparting a tensile force to a layer, breaking the adhesive layer for each chip, and removing the chip to which the broken adhesive layer is bonded from the protective adhesive tape has been proposed.

According to the wafer cutting methods described in Patent Literature 1 and Patent Literature 2, since the wafer is cut in a non-contact manner by irradiation of laser light and expansion of the tape, the physical load on the wafer is small, and currently mainstream blade dicing is performed. The wafer can be cut without generating chips as in the case. Further, since the adhesive layer is divided by expansion, cutting chips of the adhesive layer are not generated. For this reason, it is attracting attention as an excellent technology that can replace blade dicing.

The dividing techniques described in these documents described above are mainly intended for wafers, but can also be applied to glass by changing the laser engine of the apparatus for glass.

However, as described in Patent Literature Year 2, in the method of expanding by expansion and dividing the adhesive layer, when a conventional semiconductor processing tape is used, it is pushed into the expand ring as the amount of expand increases. After the raised portion is elongated and the expanded state is released, the portion is loosened (stretched), and there is a problem that the gap between chips (hereinafter, "cuff width") cannot be maintained.

Therefore, after dividing the adhesive layer by expand and releasing the expanded state, a method of shrinking the semiconductor processing tape by heating the loosened portion and maintaining the cuff width has been proposed (for example, Patent Document 3, 4).

Japanese Patent Application Publication No. 2003-338467 Japanese Patent Publication No. 2004-273895 International Publication No. 2016/152957 Japanese Patent Publication No. 2015-211081

By the way, as a method of shrinking the loosening of the semiconductor processing tape caused by the expansion by heating, generally, the part is pushed up by an expand ring and a pair of warm air nozzles are rotated around the annular part where the loosening occurs. A method of shrinking by heating by heating with warm air is used.

In the tape for semiconductor processing described in Patent Document 3, the thermal contraction rate in both the tape length direction and the width direction when heated at 100°C for 10 seconds is 0% or more and 20% or less. However, in the case of heating by rotating the warm air nozzle, the temperature near the surface of the glass processing tape gradually rises, so there is a problem that it takes time to eliminate loosening of all the annular locations. In addition, if the cuff width is narrow, it becomes difficult to determine the boundary line with the adjacent chip when it is used for dividing glass, and misrecognition of the chip occurs in image recognition at the time of pickup, and the yield of the glass processing process is reduced. There was a problem of getting worse.

Further, the tape for semiconductor processing described in Patent Document 4 has a shrinkage ratio of 0.1% or more at 130°C to 160°C (refer to claim 1 of the Patent Document 4 specification), and the temperature at which the shrinkage occurs is high. Therefore, in the case of heating and shrinking with warm air, a high temperature and a long heating time are required, and the warm air may affect the adhesive layer near the outer circumference of the wafer, and the divided adhesive layer may be melted and re-fused. In addition, if the cuff width is narrow, it becomes difficult to determine the boundary line with the adjacent chip when it is used for dividing the glass, and misrecognition of the chip occurs in image recognition at the time of pickup, and the yield of the glass processing process is deteriorated. There was a problem.

Therefore, the present invention can sufficiently heat and contract in a short time, make it easy to determine the boundary with adjacent chips, and maintain the cuff width sufficiently to suppress misrecognition of chips in image recognition during pickup. It is an object of the present invention to provide a tape for processing glass.

In order to solve the above problems, the tape for glass processing according to the present invention has an adhesive tape having a base film and an adhesive layer formed on at least one side of the base film, and the adhesive tape is a thermal machine in the MD direction. The average value of the differential value of the thermal strain for each 1° C. between 40° C. and 80° C. measured at the time of heating by a characteristic tester, and 40° C. to 80° C. measured at the time of heating by a thermomechanical property tester in the TD direction. It is characterized in that the sum of the average values of the differential values of the thermal strain for each 1° C. between them is a negative value, and is used for processing of glass including an expanding process of expanding the adhesive tape.

In addition, in order to solve the above problems, the tape for glass processing according to the present invention has a base film and an adhesive tape having an adhesive layer formed on at least one side of the base film, and the base film is an ionomer resin, or Consisting of a mixed resin composition of a polypropylene and a styrene-butadiene copolymer, the adhesive tape is a thermal deformation rate of each 1°C between 40°C and 80°C as measured at the time of heating by a thermomechanical property tester in the MD direction It is characterized in that the sum of the average value of the differential value of and the average value of the differential value of the thermal strain for each 1° C. between 40° C. and 80° C. measured at the time of heating with a thermomechanical property tester in the TD direction is a negative value. do.

In addition, the glass processing tape is preferably used for full-cut blade dicing, full-cut laser dicing, or laser stealth dicing.

Further, in the glass processing tape, an adhesive layer is laminated on the side of the pressure-sensitive adhesive layer, and the adhesive layer preferably has a light transmittance of 90% or more for light having a wavelength of 550 nm.

According to the glass processing tape according to the present invention, it is possible to sufficiently heat and shrink in a short time, thereby making it easier to determine the boundary between adjacent chips and suppressing misrecognition of chips in image recognition during pickup. Can keep enough.

1 is a cross-sectional view schematically showing a structure of a tape for processing glass according to an embodiment of the present invention.
Fig. 2 is a cross-sectional view for explaining a step of bonding glass and a ring frame to the glass processing tape according to the embodiment of the present invention.
3 is a cross-sectional view showing a state in which a modified region is formed in glass by laser processing.
4A is a cross-sectional view showing a state in which the glass processing tape according to the embodiment of the present invention is mounted on the expander, and (b) is a process of dividing the glass into chips by expanding the glass processing tape. It is a sectional view shown, and (c) is a sectional view showing the tape for glass processing, an adhesive layer, and a chip after expansion.
5 is a cross-sectional view for explaining a heat shrinking process.
6 is an explanatory diagram showing measurement points of a cuff width in evaluation of Examples and Comparative Examples.
7 is an example of the measurement result of the thermal strain.

Hereinafter, an embodiment of the present invention will be described in detail.

1 is a cross-sectional view showing a tape 10 for processing glass according to an embodiment of the present invention. In the glass processing tape 10 of the present invention, the transparent adhesive layer 13 is divided along the chips when the glass is divided into chips by an expander. This glass processing tape 10 includes an adhesive tape 15 comprising a base film 11 and an adhesive layer 12 provided on the base film 11, and a transparent adhesive layer 13 provided on the adhesive layer 12. And the back surface of the glass is bonded on the transparent adhesive layer 13. In addition, each layer may be cut (pre-cut) into a predetermined shape in advance according to the process and apparatus used. Moreover, the tape 10 for glass processing of this invention may be the form which cut|disconnected for every glass piece, and may be the form which wound up the long sheet|seat in which plural pieces were cut|disconnected for every glass part was wound up in a roll shape. Hereinafter, the configuration of each layer will be described.

<Base film>

If the base film 11 has uniform and isotropic expandability, it is preferable in that the glass can be cut without being biased in all directions in the expansion process, and the material is not particularly limited. In general, a crosslinked resin has a greater resilience against tension than a non-crosslinked resin, and has a large shrinkage stress when heat is applied in a stretched state after the expansion process. Therefore, it is excellent in that the slack generated in the tape after the expanding process is removed by heat shrinkage, and the tape is tensioned to stably maintain the individual chip spacing (cuff width). Among the crosslinked resins, thermoplastic crosslinked resins are more preferably used. On the other hand, the non-crosslinked resin has less resilience to tensile strength compared to the crosslinked resin. Therefore, after the expand process in a low temperature region such as -15°C to 0°C, it is relaxed once and then returned to room temperature, so that the tape when facing the pickup process and the mounting process is difficult to shrink, so that the tape adhered to the chip It is excellent in that it can prevent contact between the adhesive layers. Among non-crosslinked resins, olefin-based non-crosslinked resins are more preferably used.

As such a thermoplastic crosslinking resin, for example, an ethylene-(meth)acrylic acid binary copolymer or an ethylene-(meth)acrylic acid-(meth)acrylic acid alkyl ester as a main polymer constituent component may be used as a metal ion. Crosslinked ionomer resin is illustrated. These are particularly suitable in that they are suitable for an expand process in terms of uniform expandability, and a restoring force strongly acts upon heating by crosslinking. The metal ions contained in the ionomer resin are not particularly limited, and include zinc, sodium, and the like, but zinc ions are preferred from the viewpoint of low dissolution property and low fouling property. In the (meth)acrylic acid alkyl ester of the ternary copolymer, it is preferable that the alkyl group having 1 to 4 carbon atoms has a high elastic modulus and can propagate a strong force against the glass. Examples of such alkyl (meth)acrylates include methyl methacrylate, ethyl methacrylate, propyl methacrylate, butyl methacrylate, methyl acrylate, ethyl acrylate, propyl acrylate, and butyl acrylate.

In addition, as the above-described thermoplastic crosslinked resin, in addition to the ionomer resin, for a resin selected from a low density polyethylene having a specific gravity of 0.910 to less than 0.930, or an ultra low density polyethylene having a specific gravity of less than 0.910, and other ethylene-vinyl acetate copolymers, electron beams It is also suitable to crosslink by irradiating energy rays such as the like. Such a thermoplastic crosslinked resin has a certain uniform expandability because a crosslinked portion and a non-crosslinked portion coexist in the resin. In addition, since the restoring force acts strongly during heating, it is suitable for removing the loosening of the tape generated in the expansion process, and it contains almost no chlorine in the composition of the molecular chain, so even if the tape that has become unnecessary after use is incinerated. , Since it does not generate chlorinated aromatic hydrocarbons such as dioxins or their analogs, the environmental load is also small. By appropriately adjusting the amount of energy rays irradiated to the polyethylene or ethylene-vinyl acetate copolymer, a resin having sufficient uniform expandability can be obtained.

In addition, as a non-crosslinked resin, a mixed resin composition of polypropylene and a styrene-butadiene copolymer is illustrated, for example.

As polypropylene, for example, a propylene homopolymer or a block or random propylene-ethylene copolymer can be used. The random propylene-ethylene copolymer is preferable because of its low rigidity. When the content rate of the ethylene structural unit in the propylene-ethylene copolymer is 0.1% by weight or more, it is excellent in that the rigidity of the tape and the compatibility between the resins in the mixed resin composition are high. If the tape has adequate rigidity, the cutability of the glass is improved, and when the compatibility between resins is high, it is easily extruded to stabilize the discharge amount. More preferably, it is 1 weight% or more. In addition, when the content rate of the ethylene structural unit in the propylene-ethylene copolymer is 7% by weight or less, it is excellent in that polypropylene is stable and easy to polymerize. More preferably, it is 5 weight% or less.

As the styrene-butadiene copolymer, hydrogenated ones may be used. When the styrene-butadiene copolymer is hydrogenated, it has good compatibility with propylene and can prevent embrittlement and discoloration due to oxidative deterioration caused by double bonds in butadiene. Further, if the content of the styrene structural unit in the styrene-butadiene copolymer is 5% by weight or more, the styrene-butadiene copolymer is stabilized and is preferably polymerized easily. Moreover, when it is 40 weight% or less, it is flexible and is excellent in the point of expandability. It is more preferably 25% by weight or less, and still more preferably 15% by weight or less. As the styrene-butadiene copolymer, either a block copolymer or a random copolymer can be used. The random copolymer is preferable because the styrene phase is uniformly dispersed, the rigidity can be suppressed from becoming too large, and the expandability is improved.

When the content rate of polypropylene in the mixed resin composition is 30% by weight or more, it is excellent in that it is possible to suppress uneven thickness of the base film. When the thickness is uniform, the expandability tends to be isotropic, and the stress relaxation property of the base film becomes too large, the distance between chips becomes small over time, and it is easy to prevent the adhesive layers from contacting each other and being re-fused. It is more preferably 50% by weight or more. In addition, when the content rate of polypropylene is 90% by weight or less, it is easy to appropriately adjust the rigidity of the base film. If the stiffness of the base film is too large, the force required to expand the base film increases, and the load on the device increases, so that sufficient expansion may not be possible for the division of the glass or adhesive layer 13, so adjust appropriately. It is important to do. The lower limit of the content rate of the styrene-butadiene copolymer in the mixed resin composition is preferably 10% by weight or more, and it is easy to adjust to the rigidity of the base film suitable for the device. When the upper limit is 70% by weight or less, it is excellent in that it is possible to suppress the thickness unevenness, and 50% by weight or less is more preferable.

In addition, in the example shown in FIG. 1, although the base film 11 is a single layer, it is not limited to this, and it may be a multilayer structure in which two or more types of resins are laminated, or one type of resin may be laminated in two or more layers. . Two or more types of resins, whether crosslinkable or non-crosslinkable, are preferable from the viewpoint of enhancing and expressing each characteristic, and when crosslinking or non-crosslinking are combined and laminated, each defect is compensated. Do. Although the thickness of the base film 11 is not particularly defined, it is easy to stretch in the expanding step of the tape 10 for glass processing, and may have sufficient strength so as not to break. For example, about 50 to 300 µm is good, and 70 to 200 µm is more preferable.

As a manufacturing method of the multilayer base film 11, a conventionally known extrusion method, a lamination method, or the like can be used. In the case of using the lamination method, a transparent adhesive may be interposed between the layers.

<Adhesive layer>

The pressure-sensitive adhesive layer 12 can be formed by applying a pressure-sensitive adhesive composition to the base film 11. The pressure-sensitive adhesive layer 12 constituting the glass processing tape 10 of the present invention does not cause peeling from the adhesive layer 13 at the time of dicing, and has a degree of retention that does not cause defects such as chip scattering. , What is necessary is just to have a property which makes peeling from the adhesive layer 13 easy at the time of pickup.

In the glass processing tape 10 of the present invention, the configuration of the pressure-sensitive adhesive composition constituting the pressure-sensitive adhesive layer 12 is not particularly limited, but in order to improve the pick-up property after dicing, an energy ray curing property is preferable, and after curing It is preferably a material that facilitates peeling from the adhesive layer 13. In one embodiment, in the pressure-sensitive adhesive composition, as a base resin, 60 mol% or more of (meth)acrylate having an alkyl chain having 6 to 12 carbon atoms is included, and an energy ray-curable carbon-carbon double having iodine of 5 to 30 It is exemplified that having a polymer (A) having a bond. In addition, the term "energy rays" here refers to light rays such as ultraviolet rays or ionizing radiation such as electron rays.

In such a polymer (A), when the amount of iodine introduced in the amount of the energy ray-curable carbon-carbon double bond is 5 or more, it is excellent in that the effect of reducing the adhesive force after irradiation with the energy ray increases. More preferably, it is 10 or more. Further, when iodine is 30 or less, it is excellent in that the holding power of the chip until it is picked up after irradiation with energy rays is high, and it is easy to expand the gap of the chip at the time of expansion immediately before the pickup process. If the gap between the chips can be sufficiently expanded before the pick-up step, it is preferable because the image recognition of each chip during pick-up becomes easy or pick-up becomes easy. In addition, if the amount of the carbon-carbon double bond introduced is 5 or more and 30 or less iodine, the polymer (A) itself has stability, and thus production becomes easy, which is preferable.

In addition, the polymer (A) is excellent in terms of heat resistance to heat accompanying energy ray irradiation when the glass transition temperature is -70°C or higher, and more preferably -66°C or higher. In addition, if it is 15°C or less, various films are formed in the surface state, and it is excellent in terms of the effect of preventing scattering of chips after dicing in glass with surface steps, more preferably 0°C or less, and still more preferably- It is 28℃ or less.

The polymer (A) may be prepared by any method, but is obtained by mixing an acrylic copolymer and a compound having an energy ray-curable carbon-carbon double bond, or an acrylic copolymer having a functional group or methacrylic having a functional group. What is obtained by reacting the system copolymer (A1) with the compound (A2) having a functional group capable of reacting with the functional group and having an energy ray-curable carbon-carbon double bond is used.

Among these, as the methacrylic copolymer (A1) having a functional group, a monomer having a carbon-carbon double bond (A1-1) such as an acrylic acid alkyl ester or a methacrylic acid alkyl ester, and a carbon-carbon double bond Moreover, what is obtained by copolymerizing a monomer (A1-2) having a functional group is illustrated. As the monomer (A1-1), hexyl acrylate, n-octyl acrylate, isooctyl acrylate, 2-ethylhexyl acrylate, dodecyl acrylate, decyl acrylate, and D having an alkyl chain having 6 to 12 carbon atoms Uryl acrylate or a monomer having 5 or less carbon atoms in the alkyl chain, pentyl acrylate, n-butyl acrylate, isobutyl acrylate, ethyl acrylate, methyl acrylate, or methacrylates similar to these can be listed. have.

In addition, the component having 6 or more carbon atoms in the alkyl chain in the monomer (A1-1) is excellent in pick-up properties because the peel force between the pressure-sensitive adhesive layer and the adhesive layer can be reduced. In addition, a component of 12 or less has a low elastic modulus at room temperature and is excellent in terms of adhesive strength at the interface between the pressure-sensitive adhesive layer and the adhesive layer. When the adhesive strength of the interface between the pressure-sensitive adhesive layer and the adhesive layer is high, when cutting the glass by extending the tape, it is possible to suppress an interface deviation between the pressure-sensitive adhesive layer and the adhesive layer, and thus the cutability is improved, which is preferable.

Further, as the monomer (A1-1), the glass transition temperature is lowered so that the monomer having a large carbon number of the alkyl chain is used. Therefore, by appropriate selection, a pressure-sensitive adhesive composition having a desired glass transition temperature can be prepared. In addition to the glass transition temperature, it is also possible to blend a low molecular weight compound having a carbon-carbon double bond such as vinyl acetate, styrene, and acrylonitrile for the purpose of improving various properties such as compatibility. In that case, these low molecular weight compounds are blended within a range of 5% by mass or less of the total mass of the monomer (A1-1).

On the other hand, as a functional group which the monomer (A1-2) has, a carboxy group, a hydroxyl group, an amino group, a cyclic acid anhydride group, an epoxy group, an isocyanate group, etc. can be mentioned. As a specific example of the monomer (A1-2), acrylic acid, methacrylic acid, and new Namic acid, itaconic acid, fumaric acid, phthalic acid, 2-hydroxyalkyl acrylates, 2-hydroxyalkyl methacrylates, glycol monoacrylates, glycol monomethacrylates, N-methylolacrylamide, N- Methylol methacrylamide, allyl alcohol, N-alkylaminoethyl acrylate, N-alkylaminoethyl methacrylate, acrylamides, methacrylamides, maleic anhydride, itaconic anhydride, fumaric anhydride, phthalic anhydride , Glycidyl acrylate, glycidyl methacrylate, allyl glycidyl ether, and the like.

In addition, as the functional group used in the compound (A2), when the functional group of the compound (A1) is a carboxyl group or a cyclic acid anhydride, a hydroxyl group, an epoxy group, an isocyanate group, etc. can be mentioned, and in the case of a hydroxyl group, a cyclic An acid anhydride group, an isocyanate group, etc. can be mentioned. In the case of an amino group, an epoxy group, an isocyanate group, etc. can be given, and in the case of an epoxy group, a carboxyl group, a cyclic acid anhydride group, an amino group, etc. can be mentioned. As a specific example, a monomer (A1 Those similar to those listed in the specific example of -2) can be enumerated. Further, as the compound (A2), one obtained by urethanizing a part of the isocyanate group of the polyisocyanate compound with a monomer having a hydroxyl group or a carboxyl group and an energy ray-curable carbon-carbon double bond may be used.

In addition, in the reaction of the compound (A1) and the compound (A2), by leaving an unreacted functional group, a desired product can be prepared with respect to properties such as an acid value or a hydroxyl value. If OH groups are left so that the hydroxyl value of the polymer (A) is 5 to 100, the risk of pick-up miss can be further reduced by reducing the adhesive force after irradiation with energy rays. In addition, if the COOH group is left so that the polymer (A) has an acid value of 0.5 to 30, an improvement effect after restoration of the pressure-sensitive adhesive layer after expanding the glass processing tape of the present invention is obtained, which is preferable. When the hydroxyl value of the polymer (A) is 5 or more, it is excellent in terms of the effect of reducing the adhesive force after irradiation with energy rays, and when it is 100 or less, it is excellent in terms of fluidity of the adhesive after irradiation with energy rays. Further, when the acid value is 0.5 or more, it is excellent in terms of tape resilience, and when it is 30 or less, it is excellent in terms of the fluidity of the pressure-sensitive adhesive.

In the synthesis of the polymer (A), when the reaction is carried out by solution polymerization, as an organic solvent, ketone-based, ester-based, alcohol-based, or aromatic-based ones can be used. Among them, toluene, ethyl acetate, isopropyl alcohol, Benzene methyl cellosolve, ethyl cellosolve, acetone, methyl ethyl ketone, and the like, are generally good solvents for acrylic polymers, and a solvent having a boiling point of 60 to 120°C is preferable. As a polymerization initiator, α,α'-azobis Radical generators such as azobis-based, such as isobutylnitrile, and organic peroxide-based, such as benzoyl peroxide, are usually used. At this time, if necessary, a catalyst and a polymerization inhibitor can be used in combination, and a polymer (A) having a desired molecular weight can be obtained by adjusting the polymerization temperature and polymerization time. In addition, in terms of controlling the molecular weight, it is preferable to use a mercaptan or a carbon tetrachloride solvent. In addition, this reaction is not limited to solution polymerization, and other methods such as bulk polymerization and suspension polymerization may be used.

Although the polymer (A) can be obtained as described above, in the present invention, when the molecular weight of the polymer (A) is 300,000 or more, it is excellent in terms of enhancing cohesive strength. When the cohesive force is high, there is an effect of suppressing the deviation at the interface with the adhesive layer during expansion, and since it is easy to propagate the tensile force to the adhesive layer, it is preferable that the splitting property of the adhesive layer is improved. When the molecular weight of the polymer (A) is 2 million or less, it is excellent in terms of suppression of gelation during synthesis and application. In addition, the molecular weight in this invention is a mass average molecular weight in polystyrene conversion.

In addition, in the tape 10 for glass processing of the present invention, the resin composition constituting the pressure-sensitive adhesive layer 12 may further have a compound (B) acting as a crosslinking agent in addition to the polymer (A). For example, polyisocyanates, melamine-formaldehyde resins, and epoxy resins are mentioned, and these can be used alone or in combination of two or more. This compound (B) reacts with the polymer (A) or the base film and, due to the resulting crosslinked structure, can improve the cohesiveness of the pressure-sensitive adhesive containing polymers (A) and (B) as main components after application of the pressure-sensitive adhesive composition. have.

Polyisocyanates are not particularly limited, and for example, 4,4'-diphenylmethane diisocyanate, tolylene diisocyanate, xylylene diisocyanate, 4,4'-diphenylether diisocyanate, 4,4'- (2,2-bis(4-phenoxyphenyl)propane) aromatic isocyanates such as diisocyanate, hexamethylene diisocyanate, 2,2,4-trimethyl-hexamethylene diisocyanate, isophorone diisocyanate, 4,4'- Dicyclohexylmethane diisocyanate, 2,4'-dicyclohexylmethane diisocyanate, lysine diisocyanate, lysine triisocyanate, and the like, and specifically, Coronate L (manufactured by Nippon Polyurethane Co., Ltd., brand name) As the melamine formaldehyde resin, specifically, Nakarack MX-45 (manufactured by Sanwa Chemical Co., Ltd., brand name), Melan (manufactured by Hitachi Kasei Kogyo Co., Ltd., brand name), etc. can be used. As the epoxy resin, TETRAD-X (manufactured by Mitsubishi Chemical Co., Ltd., brand name) can be used, etc. In the present invention, it is particularly preferable to use polyisocyanates.

The pressure-sensitive adhesive layer in which the addition amount of the compound (B) is 0.1 parts by mass or more with respect to 100 parts by mass of the polymer (A) is excellent in terms of cohesive strength. More preferably, it is 0.5 mass parts or more. Further, the pressure-sensitive adhesive layer made into 10 parts by mass or less is excellent in suppressing rapid gelation at the time of application, and workability such as blending and application of the pressure-sensitive adhesive becomes good. More preferably, it is 5 parts by mass or less.

Moreover, in this invention, the photoinitiator (C) may be contained in the adhesive layer 12. The photopolymerization initiator (C) contained in the pressure-sensitive adhesive layer 12 is not particularly limited, and a conventionally known one can be used. For example, benzophenones such as benzophenone, 4,4'-dimethylaminobenzophenone, 4,4'-diethylaminobenzophenone, 4,4'-dichlorobenzophenone, acetophenone, diethoxyacetophenone, etc. Acetophenones, anthraquinones such as 2-ethylanthraquinone and t-butylanthraquinone, 2-chlorothioxanthone, benzoin ethyl ether, benzoin isopropyl ether, benzyl, 2,4,5-triaryl Imidazole dimers (lopin dimers), acridine compounds, and the like, and these may be used alone or in combination of two or more. The amount of the photoinitiator (C) added is preferably 0.1 parts by mass or more, and more preferably 0.5 parts by mass or more with respect to 100 parts by mass of the polymer (A). Moreover, 10 mass parts or less of the upper limit is preferable, and 5 mass parts or less is more preferable.

In addition, the energy ray-curable pressure-sensitive adhesive used in the present invention may be blended with a tackifier, a pressure-sensitive adhesive auxiliary agent, a surfactant, or the like, or other modifiers, if necessary. Moreover, you may add an inorganic compound filler suitably.

The pressure-sensitive adhesive layer 12 can be formed using a conventional method of forming a pressure-sensitive adhesive layer. For example, a method of forming by applying the pressure-sensitive adhesive composition to a predetermined surface of the base film 11, or applying the pressure-sensitive adhesive composition on a separator (eg, a plastic film or sheet coated with a releasing agent) After the pressure-sensitive adhesive layer 12 is formed, the pressure-sensitive adhesive layer 12 can be formed on the substrate film 11 by a method of transferring the pressure-sensitive adhesive layer 12 to a predetermined surface of the substrate. Further, the pressure-sensitive adhesive layer 12 may have a single-layered form or a laminated form.

The thickness of the pressure-sensitive adhesive layer 12 is not particularly limited, but when the thickness is 2 µm or more, it is excellent in terms of tack force, and 5 µm or more is more preferable. If it is 15 micrometers or less, pick-up property is excellent, and 10 micrometers or less are more preferable.

The adhesive tape 15 is an average value of the differential value of the thermal strain for each 1° C. between 40° C. and 80° C. measured at the time of heating by a thermomechanical property tester in the MD (Machine Direction) direction, and TD (Transverse Direction) The sum of the average values of the differential values of the thermal strain for each 1° C. between 40° C. and 80° C. measured at the time of temperature increase by a thermomechanical property tester in the direction is a negative value, that is, less than zero. The MD direction is a flow direction at the time of film formation, and the TD direction is a direction perpendicular to the MD direction.

The average value of the differential value of the thermal strain for each 1° C. between 40° C. and 80° C. measured at the time of heating by a thermomechanical property tester in the MD direction of the adhesive tape 15, and the thermo-mechanical properties in the TD direction By making the sum of the average value of the differential value of the thermal strain for each 1° C. between 40° C. and 80° C. measured at the time of heating by the tester as a negative value, the tape 10 for glass processing can be shrunk by heating at a low temperature for a short time. I can. Therefore, even in the case of using a method of heat-shrinkage by rotating a pair of warm air nozzles in the portion where the slackening of the glass processing tape 10 has occurred, the expansion is expanded in a short time without heating and shrinking many times while reducing the amount of expansion. By removing the loosening caused by this, it is possible to maintain an appropriate cuff width.

The thermal strain can be calculated from the following equation (1) by measuring the amount of strain due to temperature in accordance with JIS K7197:2012.

Thermal strain TMA (%) = (deformation amount of sample length/sample length before measurement) × 100 (One)

In addition, the amount of deformation is indicated by making the expansion direction of the sample positive and the contraction direction negative.

The differential value of the thermal strain is the same as the curve in the MD direction or the curve in the TD direction in FIG. 7, and the sum of the average value of the differential values in the MD direction and the average value of the differential values in the TD direction is a negative value. """ means that the adhesive tape usually exhibits the behavior of shrinkage between 40°C and 80°C.

In order to make the sum of the average value of the differential values in the MD direction and the average value of the differential values in the TD direction to be negative, a step of pulling and stretching the resin film after film formation is added, and the resin constituting the adhesive tape 15 The thickness of the adhesive tape 15 or the amount of stretching in the MD direction or the TD direction may be adjusted according to the type of the adhesive tape 15. As a method of stretching the adhesive tape in the TD direction, a method of using a tenter, a method of blow molding (inflation), a method of using an expand roll, etc. are exemplified. As a method of stretching it in the MD direction, when ejecting the mold And a method of pulling in to, a method of pulling in a conveyance roll, and the like. Any method may be used as a method of obtaining the adhesive tape 15 of the present invention.

<Adhesive layer>

In the tape 10 for glass processing of the present invention, the adhesive layer 13 is peeled from the adhesive layer 12 and adhered to the chip when picking up the chip after the glass is bonded and diced. And, it is used as an adhesive when fixing the chip to a substrate or a lead frame.

The adhesive layer 13 is not particularly limited, but may be a film adhesive generally used for glass, and examples thereof include a thermoplastic resin and a thermopolymerizable component. The thermoplastic resin used for the adhesive layer 13 of the present invention is preferably a resin having thermoplasticity, or a resin having thermoplasticity in an uncured state and forming a crosslinked structure after heating, and is not particularly limited. As an aspect, a thermoplastic resin having a weight average molecular weight of 5000 to 200,000 and a glass transition temperature of 0 to 150°C is mentioned. Further, as another aspect, a thermoplastic resin having a weight average molecular weight of 100,000 to 1,000,000 and a glass transition temperature of -50 to 20°C can be mentioned.

As the former thermoplastic resin, for example, polyimide resin, polyamide resin, polyetherimide resin, polyamideimide resin, polyester resin, polyesterimide resin, phenoxy resin, polysulfone resin, polyethersulfone resin, poly Phenylene sulfide resin, polyether ketone resin, etc. are mentioned. Among them, it is preferable to use a polyimide resin and a phenoxy resin, and as the latter thermoplastic resin, it is preferable to use a polymer containing a functional group.

The polyimide resin can be obtained by condensing a tetracarboxylic dianhydride and a diamine by a known method. That is, in an organic solvent, tetracarboxylic dianhydride and diamine are used in an equimolar or almost equimolar amount (the order of addition of each component is arbitrary), and an addition reaction is carried out at a reaction temperature of 80°C or less, preferably 0 to 60°C. As the reaction proceeds, the viscosity of the reaction solution gradually increases, and polyamic acid, a precursor of polyimide, is produced. The molecular weight of this polyamic acid can also be adjusted by heating at a temperature of 50-80 degreeC and depolymerization. The polyimide resin can be obtained by dehydrating and cyclizing the reactant (polyamic acid). The dehydration ring closure can be performed by a heat ring closure method in which heat treatment is performed and a chemical ring closure method using a dehydrating agent.

The tetracarboxylic dianhydride used as a raw material for the polyimide resin is not particularly limited, and examples include 1,2-(ethylene)bis(trimelitate anhydride), 1,3-(trimethylene)bis(trimelli Tate anhydride), 1,4-(tetramethylene)bis(trimelitate anhydride), 1,5-(pentamethylene)bis(trimelitate anhydride), 1,6-(hexamethylene)bis(trimelitate anhydride) ), 1,7-(heptamethylene)bis(trimelitate anhydride), 1,8-(octamethylene)bis(trimelitate anhydride) 1,9-(nonamethylene)bis(trimelitate anhydride), 1 ,10-(decamethylene)bis(trimelitate anhydride), 1,12-(dodecamethylene)bis(trimelitate anhydride), 1,16-(hexadecamethylene)bis(trimelitate anhydride), 1 ,18-(octadecamethylene)bis(trimellitate anhydride), pyromellitic dianhydride, 3,3',4,4'-biphenyltetracarboxylic dianhydride, 2,2',3,3' -Biphenyltetracarboxylic dianhydride, 2,2-bis(3,4-dicarboxyphenyl)propane dianhydride, 2,2-bis(2,3-dicarboxyphenyl)propane dianhydride, 1,1- Bis(2,3-dicarboxyphenyl)ethane dianhydride 1,1-bis(3,4-dicarboxyphenyl)ethane dianhydride, bis(2,3-dicarboxyphenyl)methane dianhydride, bis(3,4) -Dicarboxyphenyl)methane dianhydride, bis(3,4-dicarboxyphenyl)sulfone dianhydride, 3,4,9,10-perylenetetracarboxylic dianhydride, bis(3,4-dicarboxyphenyl) Ether dianhydride, benzene-1,2,3,4-tetracarboxylic dianhydride, 3,4,3',4'-benzophenonetetracarboxylic dianhydride, 2,3,2',3'- Benzophenonetetracarboxylic dianhydride, 3,3,3',4'-benzophenonetetracarboxylic dianhydride, 1,2,5,6-naphthalenetetracarboxylic dianhydride, 1,4,5, 8-naphthalenetetracarboxylic dianhydride, 2,3,6,7-naphthalenetetracarboxylic dianhydride, 1,2,4,5-naphthalenetetracarboxylic dianhydride, 2,6-dichloronaphthalene-1 ,4,5,8-tetracarboxylic dianhydride, 2,7-dichloronaphthalene-1,4,5,8-tetracarboxylic dianhydride, 2, 3,6,7-tetrachloronaphthalene-1,4,5,8-tetracarboxylic dianhydride, phenanthrene-1,8,9,10-tetracarboxylic dianhydride, pyrazine-2,3,5 ,6-tetracarboxylic dianhydride, thiophene-2,3,5,6-tetracarboxylic dianhydride, 2,3,3',4'-biphenyltetracarboxylic dianhydride, 3,, 4,3',4'-biphenyltetracarboxylic dianhydride, 2,3,2',3'-biphenyltetracarboxylic dianhydride, bis(3,4-dicarboxyphenyl)dimethylsilane dianhydride , Bis(3,4-dicarboxyphenyl)methylphenylsilane dianhydride, bis(3,4-dicarboxyphenyl)diphenylsilane anhydride, 1,4-bis(3,4-dicarboxyphenyldimethylsilyl)benzene dianhydride , 1,3-bis(3,4-dicarboxyphenyl)-1,1,3,3-tetramethyldicyclohexane dianhydride, p-phenylenebis (trimellitate anhydride), ethylenetetracarboxylic dianhydride Water, 1,2,3,4-butanetetracarboxylic dianhydride, decahydronaphthalene-1,4,5,8-tetracarboxylic dianhydride, 4,8-dimethyl-1,2,3,5 ,6,7-hexahydronaphthalene-1,2,5,6-tetracarboxylic dianhydride, cyclopentane-1,2,3,4-tetracarboxylic dianhydride, pyrrolidine-2,3, 4,5-tetracarboxylic dianhydride, 1,2,3,4-cyclobutanetetracarboxylic dianhydride, bis(exobicyclo[2,2,1]heptane-2,3-dicarboxyl Acid dianhydride, bicyclo-[2,2,2]-octo-7-ene-2,3,5,6-tetracarboxylic dianhydride, 2,2-bis(3,4-dicarboxyphenyl) Hexafluoropropane dianhydride, 2,2-bis[4-(3,4-dicarboxyphenyl)phenyl]hexafluoropropane dianhydride, 4,4'-bis(3,4-dicarboxyphenoxy)di Phenylsulfide dianhydride, 1,4-bis(2-hydroxyhexafluoroisopropyl)benzenebis(trimellitic anhydride), 1,3-bis(2-hydroxyhexafluoroisopropyl)benzenebis( Trimellitic anhydride), 5-(2,5-dioxotetrahydropryl)-3-methyl-3-cyclohexene-1,2-dicarboxylic dianhydride, tetrahydrofuran-2,3,4, 5-tetracarboxylic dianhydride, etc. may be used, and one or two or more of them may be used in combination. have.

In addition, the diamine used as the raw material of the polyimide is not particularly limited, and for example, o-phenylenediamine, m-phenylenediamine, p-phenylenediamine, 3,3'-diaminodiphenyl ether, 3, 4'-diaminodiphenylether, 4,4'-diaminodiphenylether, 3,3'-diaminodiphenylmethane, 3,4'-diaminodiphenylmethane, 4,4'-diaminodi Phenylethermethane, bis(4-amino-3,5-dimethylphenyl)methane, bis(4-amino-3,5-diisopropylphenyl)methane, 3,3'-diaminodiphenyldifluoromethane , 3,4'-diaminodiphenyldifluoromethane, 4,4'-diaminodiphenyldifluoromethane, 3,3'-diaminodiphenylsulfone, 3,4'-diaminodiphenylsulfone , 4,4'-diaminodiphenylsulfone, 3,3'-diaminodiphenylsulfide, 3,4'-diaminodiphenylsulfide, 4,4'-diaminodiphenylsulfide, 3, 3'-diaminodiphenylketone, 3,4'-diaminodiphenylketone, 4,4'-diaminodiphenylketone, 2,2-bis(3-aminophenyl)propane, 2,2'-( 3,4'-diaminodiphenyl)propane, 2,2-bis(4-aminophenyl)propane, 2,2-bis(3-aminophenyl)hexafluoropropane, 2,2-(3,4' -Diaminodiphenyl)hexafluoropropane, 2,2-bis(4-aminophenyl)hexafluoropropane, 1,3-bis(3-aminophenoxy)benzene, 1,4-bis(3-amino Phenoxy)benzene, 1,4-bis(4-aminophenoxy)benzene, 3,3'-(1,4-phenylenebis(1-methylethylidene))bisaniline, 3,4'-( 1,4-phenylenebis(1-methylethylidene))bisaniline, 4,4'-(1,4-phenylenebis(1-methylethylidene))bisaniline, 2,2-bis( 4-(3-aminophenoxy)phenyl)propane, 2,2-bis(4-(4-aminophenoxy)phenyl)propane, 2,2-bis(4-(3-aminophenoxy)phenyl)hexa Fluoropropane, 2,2-bis(4-(4-aminophenoxy)phenyl)hexafluoropropane, bis(4-(3-aminophenoxy)phenyl)sulfide, bis(4-(4-amino) Aromatic diamines such as phenoxy) phenyl) sulfide, bis (4- (3-aminophenoxy) phenyl) sulfone, bis (4- (4-aminophenoxy) phenyl) sulfone, 3,5-diaminobenzoic acid, 1,2-diaminoethane, 1,3-diaminopropane, 1,4-diaminobutane, 1,5-diaminopentane, 1,6-diaminohexane, 1,7-diaminoheptane, 1,8-diaminooctane, 1,9-diaminononane, 1 ,10-diaminodecane, 1,11-diaminoundecane, 1,12-diaminododecane, 1,2-diaminocyclohexane, diaminopolysiloxane represented by the following general formula (1), 1,3 -Bis(aminomethyl)cyclohexane, Jeffamine D-230, D-400, D-2000, D-4000, ED-600, ED-900, ED-2001, EDR-148 manufactured by Sun Techno Chemicals, etc. Aliphatic diamines such as polyoxyalkylenediamine of can be used, and one or two or more of them can also be used in combination. As a glass transition temperature of the said polyimide resin, it is preferable that it is 0-200 degreeC, and as a weight average molecular weight, it is preferable that it is 10,000-200,000.

(In the formula, R1 and R2 represent a divalent hydrocarbon group having 1 to 30 carbon atoms, each may be the same or different, and R3 and R4 represent a monovalent hydrocarbon group, and each may be the same or different, and m is an integer of 1 or more)

In addition to the above, the phenoxy resin, which is one of the preferred thermoplastic resins, is preferably a resin obtained by reacting various bisphenols with epichlorohydrin, or by reacting a liquid epoxy resin with bisphenol. As bisphenol, bisphenol A, bisphenol AF, bisphenol AD, bisphenol F, and bisphenol S are mentioned. Since the phenoxy resin is similar in structure to the epoxy resin, it has good compatibility with the epoxy resin and is suitable for imparting good adhesion to the adhesive film.

As the phenoxy resin used in the present invention, for example, a resin having a repeating unit represented by the following general formula (2) is mentioned.

In the general formula (2), X represents a single bond or a divalent linking group. As a divalent linking group, an alkylene group, a phenylene group, -O-, -S-, -SO-, or -SO2- is mentioned. Here, the alkylene group is preferably an alkylene group having 1 to 10 carbon atoms, and more preferably -C(R1)(R2)-. R1 and R2 represent a hydrogen atom or an alkyl group, and the alkyl group is preferably a linear or branched alkyl group having 1 to 8 carbon atoms. For example, methyl, ethyl, n-propyl, isopropyl, isooctyl, 2-ethylhexyl, 1,3,3-trimethylputyl, etc. are mentioned. In addition, the alkyl group may be substituted with a halogen atom, and examples include a trifluoromethyl group. X is preferably an alkylene group, -O-, -S-, fluorene group or -SO2-, more preferably an alkylene group and -SO2-. Especially, -C(CH3)2-, -CH(CH3)-, -CH2-, -SO2- are preferable, and -C(CH3)2-, -CH(CH3)-, -CH2- are more preferable. And -C(CH3)2- is particularly preferred.

As long as the phenoxy resin represented by the general formula (2) has a repeating unit, X in the general formula (2) may be a resin having a plurality of different repeating units, or may be composed of only repeating units having the same X. In the present invention, a resin in which X is composed only of the same repeating unit is preferable.

In addition, when a polar substituent such as a hydroxyl group or a carboxyl group is contained in the phenoxy resin represented by the general formula (2), compatibility with the thermally polymerizable component is improved, and a uniform appearance and properties can be provided.

When the mass average molecular weight of the phenoxy resin is 5000 or more, it is excellent in terms of film formation. It is more preferably 10,000 or more, and still more preferably 30,000 or more. Moreover, when the mass average molecular weight is 150,000 or less, it is preferable from the point of fluidity|liquidity at the time of heat compression bonding and compatibility with another resin. More preferably, it is 100,000 or less. In addition, when the glass transition temperature is -50°C or higher, it is excellent in terms of film-formability, more preferably 0°C or higher, and still more preferably 50°C or higher. When the glass transition temperature is 150°C, the adhesive strength of the adhesive layer 13 during die bonding is excellent, more preferably 120°C or less, and still more preferably 110°C or less.

On the other hand, as the functional group in the polymer containing the functional group, for example, a glycidyl group, an acryloyl group, a methacryloyl group, a hydroxyl group, a carboxyl group, an isocyanurate group, an amino group, an amide group, and the like, Among them, a glycidyl group is preferable.

As a high molecular weight component containing the said functional group, a (meth)acrylic copolymer containing functional groups, such as a glycidyl group, a hydroxyl group, and a carboxyl group, etc. are mentioned, for example.

As the (meth)acrylic copolymer, for example, a (meth)acrylic ester copolymer, acrylic rubber, or the like can be used, and acrylic rubber is preferable. The acrylic rubber is a rubber mainly composed of a copolymer such as butyl acrylate and acrylonitrile, or a copolymer such as ethyl acrylate and acrylonitrile, with acrylic acid ester as a main component.

When a glycidyl group is contained as the functional group, the amount of the glycidyl group-containing repeating unit is preferably 0.5 to 6.0% by weight, more preferably 0.5 to 5.0% by weight, and particularly preferably 0.8 to 5.0% by weight. . The glycidyl group-containing repeating unit is a constituent monomer of the (meth)acrylic copolymer containing a glycidyl group, and specifically glycidyl acrylate or glycidyl methacrylate. When the amount of the glycidyl group-containing repeating unit is in this range, the adhesive strength can be ensured and gelation can be prevented.

As constituent monomers of the (meth)acrylic copolymer other than glycidyl acrylate and glycidyl methacrylate, for example, ethyl (meth) acrylate, butyl (meth) nitrate, etc. may be mentioned. Alternatively, it may be used in combination of two or more. In addition, in this invention, ethyl (meth)acrylate represents ethyl acrylate and/or ethyl methacrylate. When a functional monomer is used in combination, the mixing ratio may be determined in consideration of the glass transition temperature of the (meth)acrylic copolymer. When the glass transition temperature is -50°C or higher, it is preferable in that it is excellent in film formability and excessive tack at room temperature can be suppressed. If the tack force at room temperature is excessive, handling of the adhesive layer becomes difficult. More preferably, it is -20 degreeC or more, More preferably, it is 0 degreeC or more. Further, when the glass transition temperature is 30°C or less, it is excellent in terms of the adhesive strength of the adhesive layer during die bonding, more preferably 20°C or less.

When the above monomer is polymerized to produce a high molecular weight component containing a functional monomer, the polymerization method is not particularly limited, and for example, pearl polymerization, solution polymerization, etc. can be used, among which pearl polymerization is desirable.

In the present invention, if the weight average molecular weight of the high molecular weight component containing the functional monomer is 100,000 or more, it is excellent in terms of film formation, more preferably 200,000 or more, and still more preferably 500,000 or more. Further, when the weight average molecular weight is adjusted to 2,000,000 or less, it is excellent in that the heat flowability of the adhesive layer during die bonding is improved. When the heating fluidity of the adhesive layer during die bonding is improved, the adhesion between the adhesive layer and the adherend becomes good, so that the adhesive strength can be improved, and it becomes easier to suppress voids by filling the irregularities of the adherend. More preferably, it is 1,000,000 or less, even more preferably it is 800,000 or less, and when it is 500,000 or less, even greater effects can be obtained.

In addition, the thermally polymerizable component is not particularly limited as long as it is polymerized by heat, and functional groups such as glycidyl group, acryloyl group, methacryloyl group, hydroxyl group, carboxy group, isocyanurate group, amino group, amide group, etc. And a trigger material, and these may be used alone or in combination of two or more. However, considering the heat resistance as an adhesive layer, a thermosetting resin that is cured by heat to exert an adhesive action is used together with a curing agent and an accelerator. It is preferable to contain. Examples of thermosetting resins include epoxy resins, acrylic resins, silicone resins, phenolic resins, thermosetting polyimide resins, polyurethane resins, melamine resins, urea resins, etc., and in particular, excellent heat resistance, workability, and reliability It is most preferable to use an epoxy resin in that an adhesive layer is obtained.

The epoxy resin is not particularly limited as long as it has an adhesive function by curing, and a bifunctional epoxy resin such as bisphenol A epoxy, a novolak epoxy resin such as a phenol novolak epoxy resin or a cresol novolak epoxy resin, etc. Can be used. Moreover, what is generally known, such as a polyfunctional epoxy resin, a glycidyl amine type epoxy resin, a heterocyclic-containing epoxy resin, or an alicyclic epoxy resin, can be applied.

As said bisphenol A type epoxy resin, Mitsubishi Chemical Co., Ltd. Epicoat series (Epic Coat 807, Epic Coat 815, Epic Coat 825, Epic Coat 827, Epic Coat 828, Epic Coat 834, Epic Coat 1001, Epic Coat 1004) , Epicoat 1007, Epicoat 1009), Dow Chemical Co., Ltd., DER-330, DER-301, DER-361, and Shinnittetsu Sumikin Chemical Co., Ltd. make, Y08125, YDF8170, etc. are mentioned. As the phenol novolak type epoxy resin, Mitsubishi Chemical Co., Ltd. Epicoat 152, Epicoat 154, Nippon Kayaku Co., Ltd. EPPN-201, Dow Chemical Co., Ltd. DEN-438, etc. -As a cresol novolac type epoxy resin, Nippon Kayaku Co., Ltd. E0CN-102S, EOCN-103S, EOCN-104S, EOCN-1012, EOCN-1025, EOCN-1027, Shinnittetsu Sumikin Chemical Co., Ltd. A company made, YDCN701, YDCN702, YDCN703, YDCN704, etc. are mentioned. Examples of the multifunctional epoxy resin include Epon1031S manufactured by Mitsubishi Chemical Corporation, Araldite 0163 manufactured by Chiba Specialty Chemicals, Denacol EX-611, EX-614, EX-614B manufactured by Nagase Chemtex, Inc., EX-622, EX-512, EX-521, EX-421, EX-411, EX-321, etc. are mentioned. As the amine-type epoxy resin, Mitsubishi Chemical Co., Ltd. Epicoat 604, Toto Chemical Co., Ltd. YH-434, Mitsubishi Gas Chemical Co., Ltd. TETRAD-X and TETRAD-C, Sumitomo Chemical Co., Ltd. ELM-120 manufactured by High School Corporation, etc. are mentioned. Examples of the heterocycle-containing epoxy resin include Araldite PT810, manufactured by Chiba Specialty Chemicals, and ERL4234, ERL4299, ERL4221, ERL4206 manufactured by UCC, and the like. These epoxy resins can be used alone or in combination of two or more.

In order to cure the thermosetting resin, an additive may be appropriately added. Examples of such additives include a curing agent, a curing accelerator, and a catalyst, and when adding a catalyst, a cocatalyst can be used as necessary.

When an epoxy resin is used for the thermosetting resin, it is preferable to use an epoxy resin curing agent or a curing accelerator, and it is more preferable to use them together. Examples of the curing agent include phenol resins, dicyandiamides, boron trifluoride complexes, organic hydrazide compounds, amines, polyamide resins, imidazole compounds, urea or thiourea compounds, polymercaptan compounds, and poly(s) having a mercapto group at the terminal. Sulfide resins, acid anhydrides, and light-ultraviolet curing agents. These can be used alone or in combination of two or more.

Among these, examples of the boron trifluoride complex compound include boron trifluoride-amine complexes with various amine compounds (preferably primary amine compounds), and examples of the organic hydrazide compound include isophthalate dihydrazide. .

As a phenolic resin, for example, a phenol novolak resin, a phenol aralkyl resin, a cresol novolac resin, a tert-butylphenol novolak resin, a novolac-type phenol resin such as a nonylphenol novolak resin, a resol-type phenol resin, and polypara. Polyoxystyrene, such as oxystyrene, etc. are mentioned. Among them, a phenolic compound having at least two phenolic hydroxyl groups in the molecule is preferable.

As a phenolic compound having at least two phenolic hydroxyl groups in the molecule, for example, phenol novolac resin, cresol novolac resin, t-butylphenol novolac resin, dicyclopentadienecresol novolac resin, dicyclopentadiene Phenol novolac resin, xylylene-modified phenol novolac resin, naphthol novolac resin, trisphenol novolac resin, tetrakisphenol novolac resin, bisphenol A novolac resin, poly-p-vinylphenol resin, phenol aralkyl resin And the like. In addition, among these phenol resins, phenol novolak resins and phenol aralkyl resins are particularly preferred, and connection reliability can be improved.

As amines, chain aliphatic amines (diethylenetriamine, triethylenetetramine, hexamethylenediamine, N,N-dimethylpropylamine, benzyldimethylamine, 2-(dimethylamino)phenol, 2,4,6-tris(dimethyl Aminomethyl) phenol, m-xylenediamine, etc.), cyclic aliphatic amines (N-aminoethylpiperazine, bis(3-methyl-4-aminocyclohexyl)methane, bis(4-aminocyclohexyl)methane, mensenediamine, Isophoronediamine, 1,3-bis(aminomethyl)cyclohexane, etc.), heterocyclic amines (piperazine, N,N-dimethylpiperazine, triethylenediamine, melamine, guanamine, etc.), aromatic amines (metaphenylene) Diamine, 4,4'-diaminodiphenylmethane, diamino, 4,4'-diaminodiphenylsulfone, etc.), polyamide resin (preferably polyamideamine, condensate of dimer acid and polyamine), imidazole Compound (2-phenyl-4,5-dihydroxymethylimidazole, 2-methylimidazole, 2,4-dimethylimidazole, 2-n-heptadecylimidazole, 1-cyanoethyl- 2-undecylimidazolium trimellitate, epoxy imidazole adduct, etc.), urea or thiourea compound (N,N-dialkylurea compound, N,N-dialkylthiourea compound, etc.), polymercaptan Compounds, polysulfide resins having a mercapto group at the terminal, acid anhydrides (tetrahydrophthalic anhydride, etc.), light-ultraviolet curing agents ((diphenyliodonium hexafluorophosphate, triphenylsulfonium hexafluorophosphate, etc.) are examples. do.

The curing accelerator is not particularly limited as long as it cures the thermosetting resin, and for example, imidazoles, dicyandiamide derivatives, dicarboxylic acid dihydrazide, triphenylphosphine, tetraphenylphosphonium tetraphenylborate, 2- Ethyl-4-methylimidazole tetraphenyl borate, 1,8-diazabicyclo[5.4.0]undecene-7-tetraphenyl borate, and the like.

Examples of imidazoles include imidazole, 2-methylimidazole, 2-ethylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole, and 2-phenyl-4-methylimidazole , 1-benzyl-2-methylimidazole, 1-benzyl-2-ethylimidazole, 1-benzyl-2-ethyl-5-methylimidazole, 2-phenyl-4-methyl-5-hydroxy Dimethylimidazole, 2-phenyl-4,5-dihydroxymethylimidazole, etc. are mentioned.

The content of the curing agent for epoxy resin or the curing accelerator in the adhesive layer is not particularly limited, and the optimum content varies depending on the type of curing agent or curing accelerator.

It is preferable that the blending ratio of the epoxy resin and the phenol resin is, for example, 0.5 to 2.0 equivalents of hydroxyl groups in the phenol resin per equivalent of epoxy groups in the number of epoxy components. More preferably, it is 0.8 to 1.2 equivalents. That is, if the blending ratio of both is outside the above range, sufficient curing reaction does not proceed, and the properties of the adhesive layer tend to deteriorate. Other thermosetting resins and curing agents are, in one embodiment, 0.5 to 20 parts by mass of the curing agent per 100 parts by mass of the thermosetting resin, and in another embodiment, the curing agent is 1 to 10 parts by mass. The content of the curing accelerator is preferably less than the content of the curing agent, and 0.001 to 1.5 parts by mass of the curing accelerator is preferable, and more preferably 0.01 to 0.95 parts by mass per 100 parts by mass of the thermosetting resin. By adjusting within the above range, it is possible to assist in the progress of a sufficient curing reaction. The content of the catalyst is preferably 0.001 to 1.5 parts by mass, and more preferably 0.01 to 1.0 parts by mass, based on 100 parts by mass of the thermosetting resin.

In addition, the adhesive layer 13 of the present invention can be appropriately blended with a filler depending on its application. Thereby, improvement of dicing properties of the adhesive layer in an uncured state, improvement of handling properties, adjustment of melt viscosity, provision of thixotropic properties, and further provision of thermal conductivity in the cured adhesive layer, and improvement of adhesive strength. It becomes possible to plan.

As the filler used in the present invention, an inorganic filler is preferable. The inorganic filler is not particularly limited, and for example, aluminum hydroxide, magnesium hydroxide, calcium carbonate, magnesium carbonate, calcium silicate, magnesium silicate, calcium oxide, magnesium oxide, alumina, aluminum nitride, aluminum borate whisker, boron nitride, crystalline silica , Amorphous silica, antimony oxide, etc. may be used. In addition, these may be used alone or in combination of two or more.

In addition, among the above inorganic fillers, it is preferable to use alumina, aluminum nitride, boron nitride, crystalline silica, amorphous silica, or the like from the viewpoint of improving thermal conductivity. In addition, in terms of adjusting the melt viscosity and imparting thixotropic properties, aluminum hydroxide, magnesium hydroxide, calcium carbonate, magnesium carbonate, calcium silicate, magnesium silicate, calcium oxide, magnesium oxide, alumina, crystalline silica, amorphous silica, etc. It is preferable to use. Further, from the viewpoint of improving dicing properties, it is preferable to use alumina and silica.

The adhesive layer of the present invention may include two or more fillers having different average particle diameters as the filler. In this case, compared to the case of using a single filler, it becomes easier to prevent an increase in viscosity when the content ratio of the filler is high or a decrease in viscosity when the content ratio of the filler is low in the raw material mixture before film formation. Formability becomes easy to be obtained, the fluidity of an uncured adhesive layer can be optimally controlled, and excellent adhesive strength can be easily obtained after curing of the adhesive layer.

Moreover, it is preferable that the average particle diameter of a filler is 2.0 micrometers or less, and, as for the adhesive layer of this invention, it is more preferable that it is 1.0 micrometer or less. When the average particle diameter of the filler is 2.0 µm or less, thin film formation becomes easy. Here, the thin film suggests a thickness of 20 μm or less. Moreover, if it is 0.01 micrometers or more, dispersibility is good.

In addition, from the viewpoint of improving the adhesive strength after curing of the adhesive layer, which optimally controls the fluidity of the uncured adhesive layer, which prevents the increase or decrease of the viscosity of the raw material mixture before film formation, the average particle diameter is in the range of 0.1 to 1.0 μm. It is preferable to include a first filler in the range and a second filler having an average particle diameter of the primary particle diameter in the range of 0.005 to 0.03 µm. The first filler having an average particle diameter in the range of 0.1 to 1.0 µm and 99% or more of the particles distributed in the range of 0.1 to 1.0 µm, and the average particle diameter of the primary particle diameter in the range of 0.005 to 0.03 µm and 99% It is preferable that the above particles contain a second filler distributed within a range of 0.005 to 0.1 µm in particle diameter.

The average particle diameter in the present invention means the D50 value of the cumulative volume distribution curve in which 50% by volume of particles have a diameter smaller than this value. In the present invention, the average particle diameter or D50 value is measured by a laser diffraction method, for example, using Malvern Mastersizer 2000 manufactured by Malvern Instruments. In this technique, the size of the particles in the dispersion is measured using diffraction of a laser beam, based on the application of either Fraunhofer or Mie theory. In the present invention, the untheory or the modified untheory for non-spherical particles is used, and the average particle diameter or D50 value relates to scattering measurement at 0.02 to 135° with respect to the incident laser beam.

In the present invention, in one aspect, a thermoplastic resin having a weight average molecular weight of 5000 to 200,000 and a thermally polymerizable component of 10 to 40% by mass relative to the entire pressure-sensitive adhesive composition constituting the adhesive layer 13 And, you may contain 30-75 mass% of fillers. In this embodiment, the content of the filler may be 30 to 60% by mass, or 40 to 60% by mass. Further, the mass average molecular weight of the thermoplastic resin may be 5000 to 150,000, or may be 10,000 to 100,000.

In another aspect, a thermoplastic resin having a weight average molecular weight of 200,000 to 2,000,000 with a weight average molecular weight of 200,000 to 2,000,000 with respect to the entire pressure-sensitive adhesive composition constituting the adhesive layer 13, a thermally polymerizable component of 20 to 50% by mass, and 30 to 75 mass% You may contain% filler. In this embodiment, the content of the filler may be 30 to 60 mass%, or 30 to 50 mass%. In addition, the mass average molecular weight of the thermoplastic resin may be 200,000 to 1,000,000, or 200,000 to 800,000.

By adjusting the blending ratio, the storage modulus and fluidity of the adhesive layer 13 after curing can be optimized, and heat resistance at high temperatures tends to be sufficiently obtained.

The adhesive layer 13 preferably has a light transmittance of 90% or more for light having a wavelength of 550 nm. In the case of a device having a structure in which glass is laminated through an adhesive layer on the image sensor, if the light transmittance is less than 90%, there is a possibility that the sensor may not function reliably. In general, the light transmittance can be adjusted by the compounding composition of the adhesive layer. In particular, by selecting the base resin and the filler, mounting reliability and high transmittance can be compatible. By reducing the filler particle diameter, it is possible to control light scattering and improve transmittance. As a high-permeability resin, for example, an epoxy resin or a silicone resin is preferably used, and a bisphenol type epoxy resin is particularly preferably used for compatibility with mounting reliability, but is not limited thereto.

The light transmittance can be determined by measuring the amount of transmitted light using a spectrophotometer (manufactured by Hitachi High Technologies, Spectrophotometer U-4100 type solid sample measurement system). Specifically, an adhesive layer having a thickness of 20 μm is bonded to the glass, and the light transmittance to the glass of 550 nm is obtained at 25° C. by allowing light to enter the glass surface in the normal direction. Specifically, it is calculated by the following formula (2).

Light transmittance of the adhesive layer I (%) = I1/I0 (2)

I1 (%): light transmittance of glass including adhesive layer

I0 (%): light transmittance of glass

In the tape 10 for glass processing of the present invention, the adhesive layer 13 may be formed by directly or indirectly laminating a film formed in advance (hereinafter, referred to as an adhesive film) on the base film 11. The temperature at the time of lamination is in the range of 10 to 100°C, and a linear pressure of 0.01 to 1ON/m is preferably applied. In addition, such an adhesive film may be one in which the adhesive layer 13 is formed on a release film, and in that case, the release film may be peeled after lamination, or as it is used as a cover film of the tape 10 for glass processing, and glass You may peel when bonding them.

The adhesive film may be laminated on the entire surface of the pressure-sensitive adhesive layer 12, but an adhesive film cut (pre-cut) into a shape corresponding to glass to be bonded in advance may be laminated on the pressure-sensitive adhesive layer 12. In this way, when the adhesive film according to the glass is laminated, as shown in FIG. 3, the adhesive layer 13 is formed at the portion where the glass W is bonded, and the adhesive layer 13 is at the portion where the ring frame 20 is bonded. ), only the adhesive layer 12 is present. In general, since the adhesive layer 13 is difficult to peel from the adherend, by using a pre-cut adhesive film, the ring frame 20 can be bonded to the pressure-sensitive adhesive layer 12, so that the tape is peeled off after use. The effect that it is difficult to generate adhesive residue on the ring frame 20 is obtained.

<use>

The glass processing tape 10 of the present invention is used in a glass processing method including an expanding step of dividing the adhesive layer 13 by at least expansion. Therefore, other processes, order of processes, etc. are not specifically limited. For example, it can be suitably used in the following glass processing methods (A)-(C).

Glass processing method (A)

(a) bonding the adhesive film bonded to the pressure-sensitive adhesive layer of the glass solution processing tape to glass while heating the glass at 70 to 80°C, and

(b) irradiating a laser light to a portion of the glass to be divided, and forming a modified region in the glass by multiphoton absorption;

(c) a step of dividing the glass and the adhesive film along a dividing line by expanding the semi-glass processing tape to obtain a plurality of adhesive film-attached chips; and

(d) heating and shrinking a portion of the glass processing tape that does not overlap with the chips to remove loosening generated in the expanding process to maintain the gap between the chips; and

(e) Step of picking up the chip with the adhesive layer from the adhesive layer of the glass processing tape

Glass processing method comprising a.

The processing method of this glass is a method using stealth dicing.

Glass processing method (B)

(a) a step of bonding the adhesive film bonded to the pressure-sensitive adhesive layer of the glass processing tape to the glass while heating the glass at 70 to 80°C, and

(b) a step of irradiating a laser light from the surface of the glass along the dividing line and dividing it into individual chips,

(c) a step of dividing the adhesive film corresponding to the chip by expanding the glass processing tape to obtain a plurality of chips with adhesive film, and

(d) heating and shrinking a portion of the glass processing tape that does not overlap with the chips to remove loosening generated in the expanding process to maintain the gap between the chips; and

(e) Step of picking up the chip with the adhesive layer from the adhesive layer of the glass processing tape

Glass processing method comprising a.

This glass processing method is a method using full-cut laser dicing.

Glass processing method (C)

(a) bonding the adhesive film bonded to the pressure-sensitive adhesive layer of the glass processing tape to glass while the wafer is heated at 70 to 80°C, and

(b) cutting the glass along the dividing line using a dicing blade and dividing it into individual chips,

(c) a step of dividing the adhesive film corresponding to the chip by expanding the glass processing tape to obtain a plurality of chips with adhesive film, and

(d) heating and shrinking a portion of the glass processing tape that does not overlap with the chips to remove loosening generated in the expanding process to maintain the gap between the chips; and

(e) Step of picking up the chip with the adhesive layer from the adhesive layer of the glass processing tape

Glass processing method comprising a.

This glass processing method is a method using full-cut blade dicing.

<How to use>

A method of using the tape when the tape 10 for processing glass of the present invention is applied to the processing method (A) of the glass will be described with reference to FIGS. 2 to 5.

As shown in FIG. 2, after placing the glass W on the heater table 25 of the wafer mounter with the front side down, the tape 10 for glass processing is bonded to the back surface of the glass W. The glass processing tape 10 used here is a laminated adhesive film that has been cut (precut) in advance into a shape corresponding to the glass W to be bonded, and on the side to be bonded to the glass W, the adhesive layer 13 is exposed. The pressure-sensitive adhesive layer 12 is exposed around the area. The part where the adhesive layer 13 of this glass processing tape 10 is exposed and the back surface of the glass W are bonded together, and the part where the peripheral adhesive layer 12 of the adhesive layer 13 is exposed and the ring frame 20 Join. At this time, the heater table 25 is set to 70 to 80°C, whereby heat bonding is performed. In addition, in this embodiment, the glass which has the adhesive tape 15 which consists of the adhesive layer 12 provided on the base film 11 and the base film 11, and the adhesive layer 13 provided on the adhesive layer 12 Although the tape 10 for processing was used, an adhesive tape and a film adhesive may be used respectively. In this case, first, a film adhesive is bonded to the back surface of the glass to form an adhesive layer, and the adhesive layer of the adhesive tape is bonded to the adhesive layer. At this time, the adhesive tape 15 according to the present invention is used as the adhesive tape.

Next, the glass W to which the glass processing tape 10 is laminated is taken out from the top of the heater table 25, and as shown in Fig. 3, a laser beam is irradiated to the portion to be divided of the glass W, and the inside of the glass W A modified region 32 is formed by multiphoton absorption.

Next, as shown in (a) of Fig. 4, the glass W and the ring frame 20 are bonded to each other, the glass processing tape 10, the base film 11 side down, and the stage of the expander (21) Load on top.

Next, as shown in Fig. 4(b), in the state where the ring frame 20 is fixed, the hollow cylindrical push-up member 22 of the expander is raised, and the tape 10 for glass processing Expand (expand) As the expansion condition, the expand speed is, for example, 5 to 500 mm/sec, and the expand amount (lifting amount) is, for example, 5 to 25 mm. In this way, when the glass processing tape 10 is stretched in the radial direction of the glass W, the glass W is divided into chips 34 with the modified region 32 as a starting point. At this time, the adhesive layer 13 suppresses elongation (deformation) due to expansion at the portion adhered to the back surface of the glass W, and breakage does not occur, but at the position between the chips 34, the tension due to expansion of the tape is reduced. It concentrates and breaks. Therefore, as shown in Fig. 4(c), the adhesive layer 13 is also divided together with the glass W. Thereby, a plurality of chips 34 with the adhesive layer 13 attached can be obtained.

Next, as shown in Fig. 5, the push-up member 22 is returned to its original position, and the slack of the glass processing tape 10 generated in the preceding expansion process is removed, and the gap between the chips 34 A process for stably holding is performed. In this step, for example, a hot air nozzle 29 is provided in the region where the chip 34 exists in the glass processing tape 10 and the annular heat-shrink region 28 between the ring frame 20. The base film 11 is heat-shrunk by using warm air of 40 to 120°C, and the glass processing tape 10 is attached with a pin. After that, the pressure-sensitive adhesive layer 12 is subjected to an energy ray curing treatment or a thermal curing treatment, and the adhesive force of the pressure-sensitive adhesive layer 12 to the adhesive layer 13 is weakened, and then the chip 34 is picked up.

In addition, the tape 10 for glass processing according to the present embodiment has a configuration including an adhesive layer 13 on the adhesive layer 12, but may be configured without forming the adhesive layer 13. In this case, the glass may be bonded onto the pressure-sensitive adhesive layer 12 and used to divide only glass. In the use of the glass processing tape, an adhesive film produced in the same manner as the adhesive layer 13 is combined with glass to form a pressure-sensitive adhesive layer ( 12) You may make it bond on top and make it divide glass and an adhesive film.

<Example>

Next, in order to further clarify the effect of the present invention, examples and comparative examples will be described in detail, but the present invention is not limited to these examples.

[Production of glass processing tape]

(1) Preparation of base film

<Base film A>

Zinc ionomer of ethylene-methacrylic acid-ethyl methacrylate copolymer synthesized by radical polymerization (methacrylic acid content 15%, ethyl methacrylate content 5%, softening point 72°C, melting point 90°C, density 0.96 g/cm 3, The resin beads having a zinc ion content of 5% by mass) were melted at 230° C., and formed into a 150 μm thick long film using an extruder. Then, the base film A was produced by stretching the said long film in the TD direction so that the thickness might become 90 micrometers.

<Base film B>

The base film B was produced in the same manner as the base film A, except that the thickness of the long film was 180 µm, and the long film was stretched in the TD direction so that the thickness was 90 µm.

<Base film C>

The base film C was produced in the same manner as the base film A, except that the thickness of the long film was 215 µm, and the long film was stretched in the TD direction so that the thickness was 90 µm.

<Base film D>

Zinc ionomer of ethylene-methacrylic acid-isobutyl methacrylate copolymer synthesized by radical polymerization (methacrylic acid content 11%, methacrylic acid isobutyl content 9%, softening point 64°C, melting point 83°C, density 0.95 g/ Cm3, zinc ion content 4% by mass) of the resin beads was melted at 230°C and formed into a 150 μm thick long film using an extruder. Then, the base film D was produced by stretching the said long film in the TD direction so that the thickness might become 90 micrometers.

<Base film E>

Resin beads obtained by mixing a hydrogenated styrene-based thermoplastic elastomer and homopropylene (PP) at a mixing ratio of 52:48 were melted at 200° C., and formed into a 150 μm thick long film using an extruder. Then, the base film E was produced by stretching the said long film in the TD direction so that it might become 90 micrometers in thickness.

<Base film F>

Resin beads obtained by mixing a hydrogenated styrene-based thermoplastic elastomer and homopropylene (PP) at a mixing ratio of 64:36 were melted at 200° C., and molded into a long film having a thickness of 150 μm using an extruder. Then, the base film F was produced by stretching the said long film in the TD direction so that it might become 90 micrometers in thickness.

<Base film G>

The base film G was produced in the same manner as the base film A except that the thickness of the long film was set to 150 µm, and the long film was stretched in the MD direction so that the thickness was 90 µm.

<Base film H>

The base film H was produced in the same manner as the base film D, except that the thickness of the long film was set to 150 µm, and the long film was stretched in the MD direction so that the thickness was 90 µm.

<Base film I>

The base film I was produced in the same manner as the base film A, except that the thickness of the long film was set to 90 µm, and the stretch treatment of the long film was not performed.

<Base film J>

The base film J was produced in the same manner as the base film D, except that the thickness of the long film was set to 90 µm, and the stretching treatment of the long film was not performed.

<Base film K>

A base film K was produced in the same manner as in the base film E, except that the thickness of the long film was set to 90 µm, and the stretch treatment of the long film was not performed.

<Base film L>

The base film L was produced in the same manner as the base film F, except that the thickness of the long film was set to 90 µm, and the stretch treatment of the long film was not performed.

<Base film M>

The base film M was produced in the same manner as the base film A, except that the thickness of the long film was set to 110 µm and the long film was stretched in the TD direction so that the thickness was 90 µm.

<Base film N>

The base film N was produced in the same manner as the base film A, except that the thickness of the long film was set to 120 µm and the long film was stretched in the TD direction so that the thickness was 90 µm.

(2) Preparation of acrylic copolymer

As an acrylic copolymer (A1) having a functional group, consisting of 2-ethylhexyl acrylate, 2-hydroxyethyl acrylate and methacrylic acid, the ratio of 2-ethylhexyl acrylate is 60 mol%, and the mass average molecular weight is 70 A copolymer of Mann was prepared. Next, 2-isocyanatoethyl methacrylate was added so that the iodine value was 25 to prepare an acrylic copolymer having a glass transition temperature of -50°C, a hydroxyl value of 10 mgKOH/g, and an acid value of 5 mgKOH/g. I did.

(3-1) Preparation of adhesive composition A

Epoxy resin "1256" (Mitsubishi Chemical Co., Ltd. make, bisphenol A type phenoxy resin, epoxy equivalent 7500) 100 parts by mass, epoxy resin "828" (Mitsubishi Chemical Co., Ltd. product name, bisphenol A liquid epoxy resin , Epoxy equivalent 220, specific gravity 1.17) 100 parts by mass, curing agent "DICY7" (manufactured by Mitsubishi Chemical Co., Ltd., dicyandiamide) 4 parts by mass, and "Curesol 2PZ" as a curing accelerator (manufactured by Shikoku Chemical Co., Ltd. , 2-phenyl-4,5-dihydroxymethylimidazole) 0.4 parts by mass was added, MEK was added, and the mixture was stirred and mixed until uniform. Further, this was filtered with a 100 mesh filter and vacuum degassed to obtain a varnish of the adhesive composition.

(3-2) Preparation of adhesive composition B

Epoxy resin ``1002'' (Mitsubishi Chemical Co., Ltd., solid bisphenol A type epoxy resin, epoxy equivalent 600) 40 parts by mass, epoxy resin ``806'' (Mitsubishi Chemical Co., Ltd. brand name, bisphenol F type epoxy resin, Epoxy equivalent 160, specific gravity 1.20) 100 parts by mass, 5 parts by mass of curing agent "Dyhard100SF" (trade name manufactured by Degu, dicyandiamide), silica filler "SO-C2" (trade name manufactured by Adomapine Corporation, average particle diameter 0.5 μm) ) 200 parts by mass and 3 parts by mass of silica filler "Aerosil R972" (brand name manufactured by Nippon Aerosil Co., Ltd., average particle diameter of primary particle diameter of 0.016 µm), MEK was added to the composition, stirred and mixed, and uniform composition Was made into.

To this, 100 parts by mass of a phenoxy resin "PKHH" (INCHEM brand name, mass average molecular weight 52,000, glass transition temperature 92°C), “KBM-802” as a coupling agent (Shin-Etsu Silicone Co., Ltd. brand name, Mercaptopropyl Tree) Methoxysilane) 0.6 parts by mass, and "Curesol 2PHZ-PW" as a curing accelerator (Shikoku Kasei Co., Ltd. brand name, 2-phenyl-4,5-dihydroxymethylimidazole, decomposition temperature 230°C) 0.5 parts by mass was added and stirred and mixed until uniform. Further, this was filtered with a 100 mesh filter and vacuum degassed to obtain a varnish of the adhesive composition.

<Example 1>

A mixture in which 5 parts by mass of coronate L (manufactured by Nippon Polyurethane) was added as a polyisocyanate, and 3 parts by mass of Esacure KIP 150 (manufactured by Lamberti) as a photopolymerization initiator was added to 100 parts by mass of the acrylic copolymer described above, acetic acid. It dissolved in ethyl and stirred to prepare a pressure-sensitive adhesive composition.

Next, this pressure-sensitive adhesive composition was applied to a release liner made of a release-treated polyethylene terephthalate film so that the thickness after drying became 10 μm, dried at 110° C. for 3 minutes, and bonded to the base film, An adhesive sheet with an adhesive layer was prepared.

Next, the above-described adhesive composition A was applied to a release liner made of a release-treated polyethylene terephthalate film so that the thickness after drying became 20 µm, dried at 110° C. for 5 minutes, and an adhesive layer was formed on the release liner. An adhesive film was produced.

The adhesive sheet was cut into a shape shown in FIG. 3 and the like that can be bonded to the ring frame to cover the opening. In addition, the adhesive film was cut into a shape shown in FIG. 3 or the like that can cover the back surface of the glass. Then, the adhesive layer side of the pressure-sensitive adhesive sheet and the adhesive layer side of the adhesive film were bonded to form a portion where the pressure-sensitive adhesive layer 12 is exposed around the adhesive film as shown in FIG. 3, and a tape for glass processing was prepared. .

<Examples 2 to 8, Comparative Examples 1 to 6>

Except having used the base film and adhesive composition described in Table 1, by the method similar to Example 1, the tapes for glass processing concerning Examples 2-8 and Comparative Examples 1-6 were produced.

The adhesive tape of the glass processing tape according to the Examples and Comparative Examples was cut to a length of 24 mm (a direction for measuring the amount of deformation) and a width of 5 mm (a direction orthogonal to the direction in which the amount of deformation is measured) to obtain a sample piece. . With respect to the obtained sample piece, a thermomechanical property tester (manufactured by Rigaku Corporation, brand name: TMA8310) was used to measure the deformation by temperature in two directions of MD and TD under the following measurement conditions by a tensile load method. I did.

(Measuring conditions)

Measurement temperature: -60 to 100°C

Heating rate: 5℃/min

Measured load: 19.6mN

Atmospheric gas: nitrogen atmosphere (100ml/min)

Sampling: 0.5s

Chuck distance: 20㎜

Then, the thermal strain was calculated by the following equation (1), the integral value calculated as the total sum of the thermal strain for each 1°C between 40°C and 80°C in the MD direction and the TD direction was calculated, and the sum was calculated. . The results are shown in Tables 1 and 2.

Thermal strain TMA (%) = (displacement of sample length/sample length before measurement) × 100 (One)

[Evaluation of chip recognition error]

By the method shown below, for each glass processing tape of the said Example and the said comparative example, glass was divided into chips, and chip recognition error was evaluated.

(a) irradiating a laser light to a portion of the glass to be divided, and forming a modified region in the glass by multiphoton absorption;

(b) bonding the adhesive layer of the glass processing tape to the glass while the glass is heated at 70 to 80°C,

(c) a step of dividing the glass and the adhesive layer along a division line by expanding the glass processing tape to obtain a plurality of adhesive film-attached chips; and

(d) By heating and contracting the portion of the glass processing tape that does not overlap with the chip (the area where the chip exists and the annular area between the ring frame), the loosening caused in the expansion process of (c) is removed, and the corresponding The process of maintaining the gap between the chips,

(e) A step of picking up the chip with the adhesive layer from the adhesive layer of the glass processing tape was performed.

In addition, in step (b), the glass was bonded to the glass processing tape so that the division line of the glass was along the MD direction and the TD direction of the base film.

(c) In step (c), the dicing ring frame bonded to the glass processing tape with DDS2300 manufactured by Disco Corporation is pressed down by the expand ring of DDS2300 manufactured by Disco Corporation, and the outer periphery of the glass bonding portion of the glass processing tape Then, expansion was performed by pressing the portion not overlapping with the glass with a circular push-up member. As conditions of the step (c), the amount of expand was adjusted so that the expand speed was 300 mm/sec and the expanded height was 10 mm. Here, the expanded amount refers to the amount of change in the relative position of the ring frame and the pushing member before and after the reduction. The chip size was set to be a square with one side of 1×1 mm.

In the step (d), after expanding again under the conditions of an expand speed of 1 mm/sec and an expand height of 10 mm at room temperature, heat shrink treatment was performed under the following conditions.

[Condition 1]

Heater setting temperature: 220℃

Hot air volume: 40L/min

Distance between heater and glass processing tape: 20mm

Heater rotation speed: 7°/sec

[Condition 2]

Heater setting temperature: 220℃

Hot air volume: 40L/min

Distance between heater and glass processing tape: 20mm

Heater rotation speed: 5°/sec

For the glass processing tapes of Examples 1 to 8 and Comparative Examples 1 to 6, after the step (g), pickup was performed, and the boundary with the adjacent chip was not determined, so that the chip could not be accurately recognized, and the chip was What could not be picked up was regarded as a chip recognition error, and the frequency of occurrence was evaluated. In both conditions 1 and 2 of the above-described step (g), if the frequency of occurrence of a chip recognition error is 0%, as a good product, "◎", and in condition 2, a product with a frequency of occurrence of a chip recognition error less than 1% is used as a good product. If "○", condition 2, the occurrence frequency of chip recognition error is 1% or more and less than 3%, as an acceptable product, "△", condition 1, condition 2, the occurrence frequency of chip recognition error is 3% or more as defective product. And evaluated as "x". The results are shown in Tables 1 and 2.

In addition, at the time of evaluation, as shown in FIG. 6, defects in the MD direction of the adhesive tape around the right shortest chip 50a in FIG. 6 without defects in the MD direction of the adhesive tape In Fig. 6, 100 chips each around the leftmost chip 50b, around the most both ends of the chip 51 without defects in the TD direction of the adhesive tape, and around the chip 52 located in the center. Was picked up and evaluated.

[Measurement of transmittance of adhesive layer]

The transmittance was measured for the adhesive layers of the Examples and Comparative Examples by the method shown below.

After bonding the 20 µm-thick adhesive layer formed on the release liner to glass, the release liner was peeled off, and a sample of glass containing the adhesive layer was obtained. For glass including glass and adhesive layer, light penetrates in the normal direction to the glass surface, and the light transmittance of 550 nm glass at 25°C is measured with a spectrophotometer (manufactured by Hitachi High Technologies, Spectrophotometer U-4100 type solid sample) System), and the transmittance of the adhesive layer was calculated by the following equation (2). The results are shown in Tables 1 and 2.

Light transmittance of the adhesive layer I (%) = I1/I0 (2)

I1 (%): light transmittance of glass including adhesive layer

I0 (%): light transmittance of glass

As shown in Table 1, the tapes for glass processing according to Examples 1 to 8 were measured at the time of heating by a thermo-mechanical property tester in the MD direction of the adhesive tape, and each 1° C. between 40° C. and 80° C. Since the sum of the average value of the differential value of the strain and the average value of the differential value of the thermal strain for each 1°C between 40°C and 80°C measured at the time of heating by a thermomechanical property tester in the TD direction is a negative value, It is easy to determine the boundary with adjacent chips, and the frequency of occurrence of chip recognition errors in image recognition at the time of pickup is low, resulting in good results.

On the other hand, the tapes for glass processing according to Comparative Examples 1 to 6, as shown in Table 2, measured at the time of heating by a thermo-mechanical property tester in the MD direction of the adhesive tape every 1°C between 40°C and 80°C. The sum of the average value of the differential value of the thermal deformation rate in TD and the average value of the differential value of the thermal deformation rate at each 1° C. between 40° C. and 80° C. measured at the time of heating by a thermomechanical property tester in the TD direction is a negative value. Because it is not, the frequency of occurrence of chip recognition errors was high and decreased.

10: glass processing tape
11: base film
12: adhesive layer
13: adhesive layer
22: push-up member
28: heating shrinkage zone
29: warm air nozzle

Claims (4)

It has a base film and an adhesive tape having an adhesive layer formed on at least one side of the base film,
The adhesive tape includes an average value of the differential value of the thermal strain for each 1° C. between 40° C. and 80° C. measured at the time of heating by a thermomechanical property tester in the MD direction, and a thermomechanical property tester in the TD direction. The sum of the average values of the differential values of the thermal strain for each 1° C. between 40° C. and 80° C. measured at the time of heating by is a negative value,
A tape for processing glass, characterized in that it is used for processing glass including an expanding process of expanding the adhesive tape. It has a base film and an adhesive tape having an adhesive layer formed on at least one side of the base film,
The base film is made of an ionomer resin or a mixed resin composition of a polypropylene and a styrene butadiene copolymer,
The adhesive tape includes an average value of the differential value of the thermal strain for each 1° C. between 40° C. and 80° C. measured at the time of heating by a thermo-mechanical property tester in the MD direction, and a thermo-mechanical property tester in the TD direction. A tape for glass processing, characterized in that the sum of the average values of the differential values of the thermal strain for each 1° C. between 40° C. and 80° C. measured at the time of temperature increase by is negative. The method according to claim 1 or 2,
Glass processing tape, characterized in that used for full-cut blade dicing, laser dicing or stealth dicing by laser. The method according to any one of claims 1 to 3,
An adhesive layer is laminated on the adhesive layer side,
The adhesive layer is a tape for glass processing, characterized in that the light transmittance for light having a wavelength of 550nm is 90% or more.

Images