KR102505638B1 - Tape for glass processing - Google Patents

Abstract

A tape for glass processing capable of sufficiently heat-shrinking in a short time and maintaining a kerf width is provided. The tape 10 for glass processing of the present invention has a base film 11 and an adhesive tape 15 having an adhesive layer 12 formed on at least one side of the base film 11, and the adhesive tape 15 ) is the average value of the differential value of the thermal strain rate per 1 ° C between 40 ° C and 80 ° C measured at the time of temperature increase by the thermomechanical characteristics tester in the MD direction and the thermomechanical characteristics tester in the TD direction The sum of the average values of the differential values of the thermal strain rates per 1 ° C between 40 ° C and 80 ° C measured during temperature rise is a negative value, used for glass processing including the expand process of expanding the adhesive tape 15 characterized by

Description

Tape for glass processing

INDUSTRIAL APPLICABILITY The present invention can be used to fix glass in a dicing process for dividing glass into chip-like elements, and furthermore, a die bonding process for bonding between chips or between chips and a substrate after dicing, It is related with the expandable tape for glass processing which can be used also in the process of parting an adhesive bond layer along a chip|tip by expansion, while being usable also in a mount process.

BACKGROUND OF THE INVENTION [0002] Glass having various characteristic optical characteristics is mounted in a camera or sensor installed in a smartphone or the like. These glasses are generally created by vacuum depositing various materials with respect to the glass used as a matrix. Then, after attaching adhesive and flexible tape for glass processing to these glasses, a dicing process of dividing the glass into chips, an expand process of expanding (expanding) the glass processing tape, and a pick-up of picking up the divided chips. The process, and furthermore, a die bonding process of adhering the picked-up chip to a specific location is performed.

In the above glass dicing process, cutting with a conventional blade has been the mainstream, but defects such as chipping have become a problem due to thinning of the glass itself and the influence of deposition, thereby reducing the yield.

In order to solve such a problem, in recent years, as a glass cutting method, a so-called stealth dicing method capable of cutting glass in a non-contact manner using a laser processing device has been proposed. For example, in Patent Literature 1, as a stealth dicing method, by focusing light on the inside of a semiconductor substrate to which a sheet has been stuck through an adhesive layer (die bond resin layer), and irradiating a laser beam, the inside of the semiconductor substrate A semiconductor substrate cutting method comprising the steps of forming a modified region by multiphoton absorption and making the modified region a portion to be cut, and extending the sheet to cut the semiconductor substrate and the adhesive layer along the portion to be cut. has been initiated.

In addition, as another wafer cutting method using a laser processing device, for example, in Patent Document 2, a step of attaching an adhesive layer (adhesive film) for die bonding to the back surface of the wafer, and an adhesive of the wafer to which the adhesive layer is bonded A step of bonding an extensible adhesive tape to the layer side, a step of irradiating a laser beam along the street from the surface of the wafer to which the protective adhesive tape is bonded, and dividing it into individual chips, expanding the protective adhesive tape to form an adhesive A wafer division method has been proposed which includes a step of applying a tensile force to the layer and breaking the adhesive layer for each chip, and a step of releasing the chip to which the broken adhesive layer is bonded from the protective adhesive tape.

According to the wafer cutting methods disclosed in Patent Literature 1 and Patent Literature 2, since the wafer is cut in a non-contact manner by laser light irradiation and tape expansion, the physical load on the wafer is small, and blade dicing, which is currently the mainstream, is used. Wafer cutting is possible without generating wafer cutting chips as in the case of the case. In addition, since the adhesive layer is divided by expansion, cutting chips of the adhesive layer are not generated. For this reason, it is attracting attention as an excellent technique that can replace blade dicing.

The division techniques described in these documents above are mainly applied to wafers, but can also be applied to glass by changing the laser engine of the device to glass.

However, as described in Patent Literature 2 above, in the method of expanding by expanding and dividing the adhesive layer, when a conventional tape for semiconductor processing is used, it is pushed with an expand ring as the amount of expand expands. There was a problem that the raised portion was elongated, and the portion became loose (dragged) after the expanded state was released, so that the gap between chips (hereinafter referred to as "kerf width") could not be maintained.

Then, after dividing the adhesive layer by expanding and releasing the expanded state, a method of shrinking by heating the slack portion of the tape for semiconductor processing and maintaining the kerf width has been proposed (for example, patent literature 3, 4).

Japanese Unexamined Patent Publication No. 2003-338467 Japanese Unexamined Patent Publication No. 2004-273895 International Publication No. 2016/152957 Japanese Unexamined Patent Publication No. 2015-211081

By the way, as a method of shrinking the slack of the tape for semiconductor processing generated by expansion by heating, generally, by pushing up with an expand ring and rotating a pair of hot air nozzles around the circular annular portion where the slack has occurred, the portion concerned A method of heating and shrinking by applying warm air is used.

In the tape for semiconductor processing described in Patent Literature 3, the thermal contraction rates in both the tape length direction and the width direction when heated at 100°C for 10 seconds are 0% or more and 20% or less. However, when heating by rotating the warm air nozzle, the temperature near the surface of the tape for glass processing gradually rises, so there is a problem that it takes time to remove slack in all the annular areas. Further, if the kerf width is narrow, it becomes difficult to discriminate the boundary line with adjacent chips when the kerf width is dedicated to glass division, and chip misrecognition occurs in image recognition at the time of pick-up, resulting in a decrease in the yield in the glass processing process. There was a problem that got worse.

Further, the tape for semiconductor processing described in Patent Document 4 has a shrinkage rate of 0.1% or more at 130°C to 160°C (see claim 1 of the specification of Patent Document 4), and has a high temperature at which shrinkage occurs. Therefore, when heat shrinkage is performed by warm air, a high temperature and a long heating time are required, and the warm air affects the adhesive layer near the outer periphery of the wafer, so that the divided adhesive layer may melt and re-bond. In addition, if the kerf width is narrow, it is difficult to discriminate the boundary line with adjacent chips when the glass is divided, resulting in misrecognition of chips in image recognition during pick-up, which deteriorates the yield in the glass processing process. There was a problem.

Therefore, the present invention can sufficiently heat-shrink in a short time, make it easy to discriminate the boundary with adjacent chips, and sufficiently maintain the kerf width to the extent that misrecognition of chips in image recognition at the time of pick-up can be suppressed. It is an object of the present invention to provide a tape for glass processing.

In order to solve the above problems, the tape for glass processing according to the present invention has a base film and an adhesive tape having an adhesive layer formed on at least one side of the base film, and the adhesive tape has a thermal mechanical properties in the MD direction. The average value of the differential value of the thermal strain rate per 1 ° C between 40 ° C and 80 ° C measured at the time of temperature increase with a characteristic tester, and the average value of the differential value of the thermal strain rate at 40 ° C. to 80 ° C. It is characterized in that the sum of the average value of the differential values of the thermal strain rate per 1 ° C between the above is a negative value, and is used for glass processing including an expand process of expanding the adhesive tape.

Further, in order to solve the above problems, the tape for glass processing according to the present invention has a base film and an adhesive tape having an adhesive layer formed on at least one side of the base film, and the base film comprises an ionomer resin or The adhesive tape is made of a mixed resin composition of polypropylene and a styrene-butadiene copolymer, and the thermal strain rate of the adhesive tape at every 1°C between 40°C and 80°C as measured by a thermomechanical property tester in the MD direction when the temperature is raised is Characterized in that the sum of the average value of the differential value of and the average value of the differential value of the thermal strain rate per 1 ° C between 40 ° C and 80 ° C measured at the time of temperature increase by a thermomechanical characteristics tester in the TD direction is a negative value do.

Further, the tape for glass processing is preferably used for full-cut blade dicing, full-cut laser dicing, or stealth dicing using a laser.

In the tape for glass processing, an adhesive layer is laminated on the pressure-sensitive adhesive layer side, and the adhesive layer preferably has a light transmittance of 90% or more for light having a wavelength of 550 nm.

According to the tape for glass processing according to the present invention, heat shrinkage can be sufficiently performed in a short time, and the kerf width is sufficient to make it easy to discriminate the boundary with an adjacent chip and suppress misrecognition of a chip in image recognition at the time of pick-up. can be maintained sufficiently.

1 is a cross-sectional view schematically showing the structure of a tape for glass processing according to an embodiment of the present invention.
2 is a cross-sectional view for explaining a step of bonding glass and a ring frame to a tape for glass processing according to an embodiment of the present invention.
3 is a cross-sectional view illustrating a state in which a modified region is formed in glass by laser processing.
Figure 4 (a) is a cross-sectional view showing a state in which the tape for glass processing according to an embodiment of the present invention is mounted in an expander, and (b) is a process of dividing glass into chips by expanding the tape for processing glass according to an embodiment of the present invention. It is a cross-sectional view, and (c) is a cross-sectional view showing the tape for glass processing, the adhesive layer, and the chip after expansion.
5 is a cross-sectional view for explaining a heat shrinkage process.
Fig. 6 is an explanatory view showing measurement points of the kerf width in the evaluation of Examples and Comparative Examples.
7 is an example of a measurement result of thermal strain.

EMBODIMENT OF THE INVENTION Below, embodiment of this invention is described in detail.

1 is a cross-sectional view showing a tape 10 for glass processing according to an embodiment of the present invention. In the tape 10 for glass processing of the present invention, when dividing glass into chips by expanding, the transparent adhesive layer 13 is parted along the chips. This tape 10 for glass processing includes an adhesive tape 15 composed of a base film 11 and an adhesive layer 12 provided on the base film 11, and a transparent adhesive layer 13 provided on the adhesive layer 12. and the back side of the glass is bonded on the transparent adhesive layer 13. In addition, each layer may be cut (precut) into a predetermined shape in advance according to the use process or device. In addition, the tape 10 for glass processing of this invention may be the form cut for every 1 sheet of glass, and the form in which the long sheet|seat in which the thing cut for every 1 glass was formed in multiple numbers was wound up in roll shape may be sufficient as it. Below, the structure of each layer is demonstrated.

<Base film>

If the base film 11 has uniform and isotropic expandability, it is preferable in that the glass can be cut unbiasedly in all directions in the expand process, and the material is not particularly limited. In general, a crosslinked resin has a higher tensile resilience than a non-crosslinked resin, and a high shrinkage stress when heat is applied in a stretched state after the expand process. Therefore, it is excellent in that the slack generated in the tape after the expand process is removed by heat shrinkage, and the individual chip spacing (kerf width) is stably maintained by tensioning the tape. Among the crosslinking resins, thermoplastic crosslinking resins are more preferably used. On the other hand, compared with crosslinked resin, non-crosslinked resin has a smaller restoring force against tension. Therefore, after the expand process in a low temperature range such as -15 ° C to 0 ° C, once relaxed and then returned to normal temperature, the tape is difficult to shrink when facing the pick-up process and the mount process, so that the tape adhered to the chip It is excellent in that it can prevent contact between adhesive layers. Among non-crosslinked resins, olefinic non-crosslinked resins are more preferably used.

As such a thermoplastic cross-linking resin, for example, an ethylene-(meth)acrylic acid binary copolymer or an ethylene-(meth)acrylic acid-(meth)acrylic acid alkyl ester as a main polymer component, a terpolymer is used as a metal ion. A crosslinked ionomer resin is exemplified. These are suitable for the expand process in terms of uniform expandability, and are particularly suitable in that a restoring force acts strongly upon heating due to crosslinking. Although the metal ion contained in the said ionomer resin is not specifically limited, Although zinc, sodium, etc. are mentioned, zinc ion is preferable from the viewpoint of low solubility and low contamination. In the (meth)acrylic acid alkyl ester of the terpolymer, it is preferable that the C1-C4 alkyl group has a high elastic modulus and can propagate strong force to glass. Examples of such alkyl (meth)acrylates include methyl methacrylate, ethyl methacrylate, propyl methacrylate, butyl methacrylate, methyl acrylate, ethyl acrylate, propyl acrylate and butyl acrylate.

In addition, as the above-mentioned thermoplastic crosslinking resin, in addition to the above ionomer resin, low density polyethylene having a specific gravity of 0.910 or more to less than 0.930, or ultra-low density polyethylene having a specific gravity of less than 0.910, and other resins selected from ethylene-vinyl acetate copolymers, electron beam What was bridge|crosslinked by irradiating an energy ray of the etc. is also suitable. Such a thermoplastic crosslinking resin has a certain uniform extensibility because the crosslinked site and the non-crosslinked site coexist in the resin. In addition, since a restoring force is strongly applied during heating, it is suitable for removing the slack of the tape generated in the expanding process, and contains almost no chlorine in the structure of the molecular chain, so even if the tape becomes unnecessary after use, it is incinerated. , Since it does not generate chlorinated aromatic hydrocarbons such as dioxin or its analogues, the environmental load is also small. A resin having sufficient uniform extensibility can be obtained by appropriately adjusting the amount of energy rays irradiated to the polyethylene or ethylene-vinyl acetate copolymer.

Moreover, as a non-crosslinked resin, the mixed resin composition of polypropylene and a styrene-butadiene copolymer is illustrated, for example.

As polypropylene, a homopolymer of propylene or a block type or random type propylene-ethylene copolymer can be used, for example. A random propylene-ethylene copolymer is preferable because of its low rigidity. When the content of the ethylene structural unit in the propylene-ethylene copolymer is 0.1% by weight or more, it is excellent in terms of high stiffness of the tape and high compatibility between the resins in the mixed resin composition. When the rigidity of the tape is moderate, the cutting property of the glass is improved, and when the compatibility of the resins is high, the ejection amount is easily stabilized by extrusion. More preferably, it is 1 weight% or more. Further, when the content of the ethylene structural unit in the propylene-ethylene copolymer is 7% by weight or less, it is excellent in that polypropylene is stable and easily polymerized. More preferably, it is 5 weight% or less.

As the styrene-butadiene copolymer, you may use what was hydrogenated. When the styrene-butadiene copolymer is hydrogenated, it has good compatibility with propylene and can prevent embrittlement and discoloration due to oxidative degradation caused by the double bond in butadiene. In addition, when the content of the styrene structural unit in the styrene-butadiene copolymer is 5% by weight or more, the styrene-butadiene copolymer is stable and easily polymerized. Moreover, at 40% by weight or less, it is flexible and excellent in extensibility. More preferably, it is 25 weight% or less, More preferably, it is 15 weight% or less. As the styrene-butadiene copolymer, either a block type copolymer or a random type copolymer can be used. Random type copolymers are preferable because the styrene phase is uniformly dispersed, the rigidity can be suppressed from being too large, and the extensibility is improved.

It is excellent at the point which the thickness nonuniformity of a base film can be suppressed when the content rate of polypropylene in a mixed resin composition is 30 weight% or more. If the thickness is uniform, the extensibility tends to be isotropic, and the stress relaxation property of the base film becomes too large, so that the inter-chip distance decreases over time and the adhesive layers contact each other to prevent re-fusion. More preferably, it is 50 weight% or more. Moreover, it is easy to adjust the rigidity of a base film suitably as the content rate of polypropylene is 90 weight% or less. If the rigidity of the base film is too large, the force required to expand the base film increases, so the load on the device increases, and it may not be possible to expand enough to divide the glass or adhesive layer 13, so adjust appropriately. It is important to do The lower limit of the content of the styrene-butadiene copolymer in the mixed resin composition is preferably 10% by weight or more, and is easily adjusted to the rigidity of the base film suitable for the device. If the upper limit is 70% by weight or less, it is excellent in that thickness nonuniformity can be suppressed, and 50% by weight or less is more preferable.

In addition, in the example shown in FIG. 1, although the base film 11 is a single layer, it is not limited to this, It may have a multiple-layer structure in which two or more types of resins were laminated, or one type of resin may be laminated in two or more layers. . Two or more types of resins, whether crosslinkable or non-crosslinkable, are preferably unified from the viewpoint that each characteristic is further enhanced and expressed, and when crosslinkable or noncrosslinkable is combined and laminated, each defect is complemented. do. Although the thickness of the base film 11 is not specifically regulated, it is easy to stretch in the expand process of the tape 10 for a glass process, and it just needs to have sufficient intensity|strength so that it will not break. For example, about 50 to 300 μm is preferable, and 70 μm to 200 μm is more preferable.

As a manufacturing method of the multiple-layer base film 11, a conventionally well-known extrusion method, a lamination method, etc. can be used. In the case of using the lamination method, a transparent adhesive may be interposed between the layers.

<Adhesive layer>

The pressure-sensitive adhesive layer 12 can be formed by coating the pressure-sensitive adhesive composition on the base film 11 . The pressure-sensitive adhesive layer 12 constituting the tape 10 for glass processing of the present invention does not cause peeling from the adhesive layer 13 at the time of dicing, and maintainability to the extent that defects such as chip scattering do not occur, , What is necessary is just to have the characteristic that peeling with the adhesive layer 13 becomes easy at the time of pick-up.

In the tape 10 for glass processing of the present invention, the composition of the pressure-sensitive adhesive composition constituting the pressure-sensitive adhesive layer 12 is not particularly limited, but in order to improve the pickup property after dicing, an energy ray curable one is preferable, and after curing It is preferable that it is a material from which peeling with the adhesive layer 13 becomes easy. As one aspect, an energy ray-curable carbon-carbon double layer containing 60 mol% or more of a (meth)acrylate having an alkyl chain of 6 to 12 carbon atoms as a base resin in the pressure-sensitive adhesive composition and containing 5 to 30 iodine. One having a polymer (A) having bonds is exemplified. Incidentally, here, energy rays refer to ionizing radiations such as light rays such as ultraviolet rays or electron beams.

In such a polymer (A), when the amount of iodine introduced in the amount of energy ray-curable carbon-carbon double bonds is 5 or more, it is excellent in that the effect of reducing the adhesive force after energy ray irradiation is enhanced. More preferably, it is 10 or more. In addition, when the iodine content is 30 or less, the holding power of the chip is high until pickup after irradiation with the energy ray, and it is excellent in that it is easy to expand the gap between the chips during expansion immediately before the pickup process. If the gap between the chips can be sufficiently expanded before the pick-up process, image recognition of each chip at the time of pick-up becomes easy or pick-up becomes easy, so it is preferable. In addition, when the amount of iodine introduced in the carbon-carbon double bond is 5 or more and 30 or less, the polymer (A) itself is stable and the production is easy, so it is preferable.

In addition, when the glass transition temperature of the polymer (A) is -70°C or higher, it is excellent in terms of heat resistance to heat accompanying energy ray irradiation, and more preferably -66°C or higher. In addition, if the temperature is 15°C or less, various films are formed on the surface and it is excellent in the effect of preventing chips from scattering after dicing in glass having surface steps, more preferably 0°C or less, still more preferably - below 28°C.

The polymer (A) may be produced by any means, but is obtained by mixing an acrylic copolymer and a compound having an energy ray-curable carbon-carbon double bond, for example, an acrylic copolymer having a functional group or a methacrylic polymer having a functional group. What is obtained by reacting the system copolymer (A1) with the compound (A2) which has a functional group capable of reacting with the functional group and has an energy ray-curable carbon-carbon double bond is used.

Among these, as the methacrylic copolymer (A1) having the functional group, it has a monomer (A1-1) having a carbon-carbon double bond, such as an alkyl acrylate ester or an alkyl methacrylate ester, and a carbon-carbon double bond. Also, those obtained by copolymerizing a monomer (A1-2) having a functional group are exemplified. As the monomer (A1-1), hexyl acrylate, n-octyl acrylate, isooctyl acrylate, 2-ethylhexyl acrylate, dodecyl acrylate, decyl acrylate, and Uryl acrylate or a monomer having 5 or less carbon atoms in an alkyl chain, such as pentyl acrylate, n-butyl acrylate, isobutyl acrylate, ethyl acrylate, methyl acrylate, or methacrylates similar thereto, can be exemplified. there is.

Moreover, since the C6 or more component of an alkyl chain in a monomer (A1-1) can reduce the peeling force of an adhesive layer and an adhesive bond layer, it is excellent at the point of pick-up property. In addition, components of 12 or less have a low modulus of elasticity at room temperature, and are excellent in terms of adhesive force at the interface between the pressure-sensitive adhesive layer and the adhesive layer. When the adhesive strength of the interface between the pressure-sensitive adhesive layer and the adhesive layer is high, when the tape is expanded to cut the glass, the interface displacement between the pressure-sensitive adhesive layer and the adhesive layer can be suppressed, and cutting properties are improved, which is preferable.

Moreover, as a monomer (A1-1), since a glass transition temperature becomes low so that a monomer with a large carbon number of an alkyl chain is used, the adhesive composition which has a desired glass transition temperature can be prepared by selecting suitably. In addition to the glass transition temperature, it is also possible to blend low-molecular weight compounds having carbon-carbon double bonds such as vinyl acetate, styrene, and acrylonitrile for the purpose of improving various performances such as compatibility. In that case, these low molecular weight compounds shall be blended within the range of 5% by mass or less of the total mass of the monomers (A1-1).

On the other hand, examples of the functional group of the monomer (A1-2) include a carboxy group, a hydroxyl group, an amino group, a cyclic acid anhydride group, an epoxy group, and an isocyanate group. Specific examples of the monomer (A1-2) include acrylic acid, methacrylic acid, and Namic acid, itaconic acid, fumaric acid, phthalic acid, 2-hydroxyalkyl acrylates, 2-hydroxyalkyl methacrylates, glycol monoacrylates, glycol monomethacrylates, N-methylolacrylamide, N- Methylol methacrylamide, allyl alcohol, N-alkylaminoethyl acrylates, N-alkylaminoethyl methacrylates, acrylamides, methacrylamides, maleic anhydride, itaconic anhydride, fumaric anhydride, phthalic anhydride , glycidyl acrylate, glycidyl methacrylate, allyl glycidyl ether and the like can be exemplified.

In addition, as a functional group used in the compound (A2), when the functional group of the compound (A1) is a carboxy group or a cyclic acid anhydride group, a hydroxyl group, an epoxy group, an isocyanate group, etc. are given. In the case of a hydroxyl group, a cyclic acid group is used. An acid anhydride group, an isocyanate group, etc. are exemplified. In the case of an amino group, an epoxy group, an isocyanate group, etc. are exemplified, and in the case of an epoxy group, a carboxyl group, a cyclic acid anhydride group, an amino group, etc. are exemplified. Specific examples include monomer (A1 The same things as those listed in the specific example of -2) can be enumerated. As the compound (A2), a polyisocyanate compound obtained by urethanizing a part of the isocyanate groups with a monomer having a hydroxyl group or a carboxyl group and an energy ray-curable carbon-carbon double bond can also be used.

In addition, in the reaction between the compound (A1) and the compound (A2), by leaving an unreacted functional group, a desired product can be produced with respect to properties such as acid value or hydroxyl value. If OH groups are left so that the hydroxyl value of the polymer (A) becomes 5 to 100, the risk of pickup miss can be further reduced by reducing the adhesive force after energy ray irradiation. In addition, if COOH groups are left so that the acid value of the polymer (A) is 0.5 to 30, an improvement effect after restoration of the pressure-sensitive adhesive layer after expansion of the tape for glass processing of the present invention is obtained, and is preferable. If the hydroxyl value of the polymer (A) is 5 or more, it is excellent in terms of the effect of reducing the adhesive force after energy ray irradiation, and if it is 100 or less, it is excellent in the fluidity of the adhesive after energy ray irradiation. Moreover, if the acid value is 0.5 or more, it is excellent in terms of tape recovery properties, and if it is 30 or less, it is excellent in terms of the fluidity of the pressure-sensitive adhesive.

In the synthesis of the polymer (A), as the organic solvent in the case where the reaction is carried out by solution polymerization, a ketone, ester, alcohol, or aromatic solvent can be used. Among them, toluene, ethyl acetate, isopropyl alcohol, Benzene methyl cellosolve, ethyl cellosolve, acetone, methyl ethyl ketone, etc. are generally good solvents for acrylic polymers, and solvents with a boiling point of 60 to 120 ° C are preferable. As a polymerization initiator, α, α'-azobis Radical generators, such as azobis type, such as isobutyl nitrile, and organic peroxide type, such as benzoyl peroxide, are used normally. At this time, the polymer (A) of a desired molecular weight can be obtained by using a catalyst and a polymerization inhibitor together as needed, and adjusting the polymerization temperature and polymerization time. Regarding adjusting the molecular weight, it is preferable to use a mercaptan or carbon tetrachloride solvent. In addition, this reaction is not limited to solution polymerization, Other methods, such as bulk polymerization and suspension polymerization, may be sufficient.

Although the polymer (A) can be obtained as described above, in the present invention, when the molecular weight of the polymer (A) is 300,000 or more, it is excellent in terms of increasing the cohesive force. A high cohesive force is preferable in that it has an effect of suppressing displacement at the interface with the adhesive layer during expansion, and since the propagation of tensile force to the adhesive layer is facilitated, the divisibility of the adhesive layer is improved. When the molecular weight of the polymer (A) is 2,000,000 or less, it is excellent in terms of suppression of gelation at the time of synthesis and application. In addition, the molecular weight in this invention is a mass average molecular weight in terms of polystyrene.

In addition, in the tape 10 for glass processing of the present invention, the resin composition constituting the pressure-sensitive adhesive layer 12 may further have a compound (B) acting as a crosslinking agent in addition to the polymer (A). Examples thereof include polyisocyanates, melamine/formaldehyde resins and epoxy resins, which may be used alone or in combination of two or more. This compound (B) reacts with the polymer (A) or the base film, and the resultant crosslinking structure can improve the cohesive force of the pressure-sensitive adhesive containing the polymers (A) and (B) as main components after application of the pressure-sensitive adhesive composition. there is.

The polyisocyanates are not particularly limited, and examples thereof include 4,4'-diphenylmethane diisocyanate, tolylene diisocyanate, xylylene diisocyanate, 4,4'-diphenyl ether diisocyanate, and 4,4'- (2,2-bis(4-phenoxyphenyl)propane] diisocyanate and other aromatic isocyanates, hexamethylene diisocyanate, 2,2,4-trimethyl-hexamethylene diisocyanate, isophorone diisocyanate, 4,4'- dicyclohexylmethane diisocyanate, 2,4'-dicyclohexylmethane diisocyanate, lysine diisocyanate, lysine triisocyanate and the like, specifically, Coronate L (manufactured by Nippon Polyurethane Co., Ltd., trade name) As the melamine formaldehyde resin, specifically, Nakarack MX-45 (manufactured by Sanwa Chemical Co., Ltd., trade name), melan (manufactured by Hitachi Chemical Co., Ltd., trade name), etc. can be used. As the epoxy resin, TETRAD-X (manufactured by Mitsubishi Chemical Corporation, trade name) can be used, etc. In the present invention, it is particularly preferable to use polyisocyanates.

The adhesive layer which made the addition amount of a compound (B) 0.1 mass part or more with respect to 100 mass parts of polymers (A) is excellent in the point of cohesion force. More preferably, it is 0.5 mass part or more. In addition, the pressure-sensitive adhesive layer, which is 10 parts by mass or less, is excellent in terms of suppressing rapid gelation during coating, and workability such as blending and application of the pressure-sensitive adhesive is improved. More preferably, it is 5 parts by mass or less.

Moreover, in this invention, the photoinitiator (C) may be contained in the adhesive layer 12. The photopolymerization initiator (C) contained in the pressure-sensitive adhesive layer 12 is not particularly limited, and conventionally known ones can be used. For example, benzophenones such as benzophenone, 4,4'-dimethylaminobenzophenone, 4,4'-diethylaminobenzophenone, and 4,4'-dichlorobenzophenone, acetophenone, diethoxyacetophenone, etc. acetophenones, anthraquinones such as 2-ethylanthraquinone and t-butylanthraquinone, 2-chlorothioxanthone, benzoin ethyl ether, benzoin isopropyl ether, benzyl, 2,4,5-triaryl imidazole dimer (lopin dimer), acridine-based compounds, and the like, and these may be used alone or in combination of two or more. As an addition amount of a photoinitiator (C), it is preferable to mix|blend 0.1 mass part or more with respect to 100 mass parts of polymers (A), and 0.5 mass part or more is more preferable. Moreover, 10 mass parts or less of the upper limit is preferable, and 5 mass parts or less are more preferable.

Further, a tackifier, tackifier, surfactant, or the like, or other modifiers may be blended with the energy ray-curable pressure-sensitive adhesive used in the present invention, if necessary. Moreover, you may add an inorganic compound filler suitably.

The pressure-sensitive adhesive layer 12 can be formed using a conventional pressure-sensitive adhesive layer formation method. For example, a method of applying the pressure-sensitive adhesive composition to a predetermined surface of the base film 11 and forming the pressure-sensitive adhesive composition, or applying the pressure-sensitive adhesive composition onto a separator (eg, a plastic film or sheet coated with a release agent) After forming the pressure-sensitive adhesive layer 12, the pressure-sensitive adhesive layer 12 can be formed on the base film 11 by a method of transferring the pressure-sensitive adhesive layer 12 to a predetermined surface of the base material. In addition, the adhesive layer 12 may have the form of a single layer, and may have the form of a laminated layer.

Although there is no restriction|limiting in particular as thickness of the adhesive layer 12, If thickness is 2 micrometers or more, it is excellent in the point of tackiness, and 5 micrometers or more are more preferable. If it is 15 μm or less, pick-up properties are excellent, and 10 μm or less is more preferable.

The adhesive tape 15 is an average value of the differential value of the thermal strain rate per 1 ° C between 40 ° C and 80 ° C measured at the time of temperature increase by a thermomechanical property tester in the MD (Machine Direction) direction, and TD (Transverse Direction) The sum of the average values of the differential values of the thermal strain rates per 1 ° C between 40 ° C and 80 ° C measured at the time of temperature increase by a thermomechanical property tester in the direction is a negative value, that is, less than 0. The MD direction is a flow direction during film formation, and the TD direction is a direction perpendicular to the MD direction.

The average value of the differential value of the thermal strain rate per 1 ° C between 40 ° C and 80 ° C measured at the time of temperature increase with a thermomechanical characteristics tester in the MD direction of the adhesive tape 15, and the thermomechanical characteristics in the TD direction By setting the sum of the average value of the differential values of the thermal strain rates per 1 °C between 40 °C and 80 °C measured at the time of temperature increase with a tester to be a negative value, the tape 10 for glass processing can be shrunk by heating at low temperature and for a short time. can Therefore, even when a method of heating and contracting by rotating a pair of hot air nozzles around the loosened portion of the tape 10 for glass processing is used, the expansion amount is reduced and the expansion is performed in a short time without heating and contracting several times. It is possible to maintain an appropriate kerf width by eliminating slack caused by

The thermal strain rate can be calculated from the following formula (1) by measuring the amount of deformation due to temperature in accordance with JIS K7197:2012.

Thermal strain TMA (%) = (strain amount of sample length / sample length before measurement) × 100 (1)

In addition, the amount of deformation is expressed by taking the expansion direction of the sample as positive and the contraction direction as negative.

The differential value of the thermal strain is like the curve in the MD direction or the curve in the TD direction in FIG. 7, and the sum of the average value of the differential value in the MD direction and the average value of the differential value in the TD direction is a negative value. This means that between 40° C. and 80° C., the adhesive tape usually exhibits shrinkage behavior.

In order to make the sum of the average value of the differential values in the MD direction and the average value of the differential values in the TD direction a negative value, a step of stretching the resin film after film formation is added, and the resin constituting the adhesive tape 15 is added. What is necessary is just to adjust the thickness of the adhesive tape 15, and the stretching amount in MD direction or TD direction according to the kind of. Methods for stretching the adhesive tape in the TD direction include a method using a tenter, a method by blow molding (inflation), a method using an expand roll, and the like. The method of pulling in, the method of pulling in a conveyance roll, etc. are mentioned. Any method may be used as a method of obtaining the adhesive tape 15 of the present invention.

<Adhesive layer>

In the tape 10 for glass processing of the present invention, the adhesive layer 13 peels off from the pressure-sensitive adhesive layer 12 and adheres to the chip when picking up the chip after the glass is bonded and diced. And it is used as an adhesive when fixing a chip to a board|substrate or a lead frame.

The adhesive layer 13 is not particularly limited, but may be a film adhesive generally used for glass, and examples thereof include those containing a thermoplastic resin and a thermopolymerizable component. The thermoplastic resin used in the adhesive layer 13 of the present invention is preferably a resin having thermoplasticity or a resin having thermoplasticity in an uncured state and forming a crosslinked structure after heating, and is not particularly limited, but one As an aspect, the thermoplastic resin whose weight average molecular weight is 5000-200,000 and whose glass transition temperature is 0-150 degreeC is mentioned. As another embodiment, a thermoplastic resin having a weight average molecular weight of 100,000 to 1,000,000 and a glass transition temperature of -50 to 20°C is exemplified.

Examples of the former thermoplastic resin include polyimide resins, polyamide resins, polyetherimide resins, polyamideimide resins, polyester resins, polyesterimide resins, phenoxy resins, polysulfone resins, polyethersulfone resins, and polyamideimide resins. Phenylene sulfide resin, polyether ketone resin, etc. are mentioned, Among them, it is preferable to use a polyimide resin and a phenoxy resin, and it is preferable to use a polymer containing a functional group as the latter thermoplastic resin.

The polyimide resin can be obtained by subjecting tetracarboxylic dianhydride and diamine to a condensation reaction by a known method. That is, in an organic solvent, tetracarboxylic dianhydride and diamine are used in equimolar or nearly equimolar (the order of addition of each component is arbitrary), and an addition reaction is effected at a reaction temperature of 80°C or less, preferably 0 to 60°C. As the reaction proceeds, the viscosity of the reaction solution gradually increases, and polyamic acid, a precursor of polyimide, is produced. The molecular weight of this polyamic acid can also be adjusted by subjecting it to depolymerization by heating at a temperature of 50 to 80°C. The polyimide resin can be obtained by subjecting the reaction product (polyamic acid) to dehydration ring closure. Dehydration ring closure can be performed by a thermal ring closure method in which heat treatment is performed or a chemical ring closure method using a dehydrating agent.

The tetracarboxylic dianhydride used as a raw material of the polyimide resin is not particularly limited, and examples thereof include 1,2-(ethylene)bis(trimellitate anhydride) and 1,3-(trimethylene)bis(trimellitate). tate anhydride), 1,4-(tetramethylene)bis(trimellitate anhydride), 1,5-(pentamethylene)bis(trimellitate anhydride), 1,6-(hexamethylene)bis(trimellitate anhydride) ), 1,7-(heptamethylene)bis(trimellitate anhydride), 1,8-(octamethylene)bis(trimellitate anhydride) 1,9-(nonamethylene)bis(trimellitate anhydride), 1 ,10-(decamethylene)bis(trimellitate anhydride), 1,12-(dodecamethylene)bis(trimellitate anhydride), 1,16-(hexadecamethylene)bis(trimellitate anhydride), 1 ,18-(octadecamethylene)bis(trimellitate anhydride), pyromellitic dianhydride, 3,3',4,4'-biphenyltetracarboxylic dianhydride, 2,2',3,3' -Biphenyltetracarboxylic acid dianhydride, 2,2-bis(3,4-dicarboxyphenyl)propane dianhydride, 2,2-bis(2,3-dicarboxyphenyl)propane dianhydride, 1,1- Bis(2,3-dicarboxyphenyl)ethane dianhydride 1,1-bis(3,4-dicarboxyphenyl)ethane dianhydride, bis(2,3-dicarboxyphenyl)methane dianhydride, bis(3,4 -Dicarboxyphenyl)methane dianhydride, bis(3,4-dicarboxyphenyl)sulfone dianhydride, 3,4,9,10-perylenetetracarboxylic acid dianhydride, bis(3,4-dicarboxyphenyl) Ether dianhydride, benzene-1,2,3,4-tetracarboxylic dianhydride, 3,4,3',4'-benzophenonetetracarboxylic dianhydride, 2,3,2',3'- Benzophenonetetracarboxylic dianhydride, 3,3,3',4'-benzophenonetetracarboxylic dianhydride, 1,2,5,6-naphthalenetetracarboxylic dianhydride, 1,4,5, 8-naphthalenetetracarboxylic dianhydride, 2,3,6,7-naphthalenetetracarboxylic dianhydride, 1,2,4,5-naphthalenetetracarboxylic dianhydride, 2,6-dichloronaphthalene-1 ,4,5,8-tetracarboxylic dianhydride, 2,7-dichloronaphthalene-1,4,5,8-tetracarboxylic dianhydride, 2, 3,6,7-tetrachloronaphthalene-1,4,5,8-tetracarboxylic dianhydride, phenanthrene-1,8,9,10-tetracarboxylic dianhydride, pyrazine-2,3,5 ,6-tetracarboxylic dianhydride, thiophene-2,3,5,6-tetracarboxylic dianhydride, 2,3,3',4'-biphenyltetracarboxylic dianhydride, 3,, 4,3',4'-biphenyltetracarboxylic dianhydride, 2,3,2',3'-biphenyltetracarboxylic dianhydride, bis(3,4-dicarboxyphenyl)dimethylsilane dianhydride , bis(3,4-dicarboxyphenyl)methylphenylsilane dianhydride, bis(3,4-dicarboxyphenyl)diphenylsilane anhydride, 1,4-bis(3,4-dicarboxyphenyldimethylsilyl)benzene dianhydride , 1,3-bis(3,4-dicarboxyphenyl)-1,1,3,3-tetramethyldichlorohexane dianhydride, p-phenylenebis(trimellitate anhydride), ethylenetetracarboxylic dianhydride Water, 1,2,3,4-butanetetracarboxylic dianhydride, decahydronaphthalene-1,4,5,8-tetracarboxylic dianhydride, 4,8-dimethyl-1,2,3,5 ,6,7-hexahydronaphthalene-1,2,5,6-tetracarboxylic dianhydride, cyclopentane-1,2,3,4-tetracarboxylic dianhydride, pyrrolidine-2,3, 4,5-tetracarboxylic dianhydride, 1,2,3,4-cyclobutanetetracarboxylic dianhydride, bis(exubicyclo[2,2,1]heptane-2,3-dicarboxyl Acid dianhydride, bicyclo-[2,2,2]-octo-7-ene-2,3,5,6-tetracarboxylic dianhydride, 2,2-bis(3,4-dicarboxyphenyl) Hexafluoropropane dianhydride, 2,2-bis [4- (3,4-dicarboxyphenyl) phenyl] hexafluoropropane dianhydride, 4,4'-bis (3,4-dicarboxyphenoxy) di Phenylsulfide dianhydride, 1,4-bis(2-hydroxyhexafluoroisopropyl)benzenebis(trimellitic anhydride), 1,3-bis(2-hydroxyhexafluoroisopropyl)benzenebis( trimellitic anhydride), 5-(2,5-dioxotetrahydropril)-3-methyl-3-cyclohexene-1,2-dicarboxylic acid dianhydride, tetrahydrofuran-2,3,4, 5-tetracarboxylic dianhydride, etc. may be used, and one or two or more of these may be used in combination. there is.

In addition, the diamine used as a raw material for polyimide is not particularly limited, and examples include o-phenylenediamine, m-phenylenediamine, p-phenylenediamine, 3,3'-diaminodiphenyl ether, 3, 4'-diaminodiphenyl ether, 4,4'-diaminodiphenyl ether, 3,3'-diaminodiphenylmethane, 3,4'-diaminodiphenylmethane, 4,4'-diaminodi Phenylethemethane, bis(4-amino-3,5-dimethylphenyl)methane, bis(4-amino-3,5-diisopropylphenyl)methane, 3,3'-diaminodiphenyldifluoromethane , 3,4'-diaminodiphenyldifluoromethane, 4,4'-diaminodiphenyldifluoromethane, 3,3'-diaminodiphenylsulfone, 3,4'-diaminodiphenylsulfone , 4,4'-diaminodiphenylsulfone, 3,3'-diaminodiphenylsulfide, 3,4'-diaminodiphenylsulfide, 4,4'-diaminodiphenylsulfide, 3, 3'-diaminodiphenyl ketone, 3,4'-diaminodiphenyl ketone, 4,4'-diaminodiphenyl ketone, 2,2-bis(3-aminophenyl)propane, 2,2'-( 3,4'-diaminodiphenyl)propane, 2,2-bis(4-aminophenyl)propane, 2,2-bis(3-aminophenyl)hexafluoropropane, 2,2-(3,4' -Diaminodiphenyl)hexafluoropropane, 2,2-bis(4-aminophenyl)hexafluoropropane, 1,3-bis(3-aminophenoxy)benzene, 1,4-bis(3-amino) Phenoxy)benzene, 1,4-bis(4-aminophenoxy)benzene, 3,3'-(1,4-phenylenebis(1-methylethylidene))bisaniline, 3,4'-( 1,4-phenylenebis(1-methylethylidene))bisaniline, 4,4'-(1,4-phenylenebis(1-methylethylidene))bisaniline, 2,2-bis( 4-(3-aminophenoxy)phenyl)propane, 2,2-bis(4-(4-aminophenoxy)phenyl)propane, 2,2-bis(4-(3-aminophenoxy)phenyl)hexa Fluoropropane, 2,2-bis(4-(4-aminophenoxy)phenyl)hexafluoropropane, bis(4-(3-aminophenoxy)phenyl)sulfide, bis(4-(4-amino) aromatic diamines such as phenoxy)phenyl)sulfide, bis(4-(3-aminophenoxy)phenyl)sulfone, bis(4-(4-aminophenoxy)phenyl)sulfone, and 3,5-diaminobenzoic acid; 1,2-diaminoethane, 1,3-diaminopropane, 1,4-diaminobutane, 1,5-diaminopentane, 1,6-diaminohexane, 1,7-diaminoheptane, 1,8-diaminooctane, 1,9-diaminononane, 1 ,10-diaminodecane, 1,11-diaminoundecane, 1,12-diaminododecane, 1,2-diaminocyclohexane, diaminopolysiloxane represented by the following general formula (1), 1,3 -Bis(aminomethyl)cyclohexane, Sun Techno Chemical Co., Ltd. Jeffamine D-230, D-400, D-2000, D-4000, ED-600, ED-900, ED-2001, EDR-148, etc. aliphatic diamines such as polyoxyalkylenediamine of , etc. can be used, and 1 type or 2 or more types of these can also be used together. It is preferable that it is 0-200 degreeC as a glass transition temperature of the said polyimide resin, and it is preferable that it is 10,000-200,000 as a weight average molecular weight.

(Wherein, R1 and R2 represent a divalent hydrocarbon group having 1 to 30 carbon atoms, may be the same or different, R3 and R4 represent a monovalent hydrocarbon group, may be the same or different, and m is an integer greater than or equal to 1)

In addition to the above, the phenoxy resin, which is one of the preferred thermoplastic resins, is preferably a resin obtained by a method of reacting various bisphenols with epichlorohydrin or a method of reacting a liquid epoxy resin with bisphenol. Examples of the bisphenol include bisphenol A and bisphenol AF, bisphenol AD, bisphenol F, and bisphenol S are mentioned. Since phenoxy resins are similar in structure to epoxy resins, they have good compatibility with epoxy resins and are suitable for imparting good adhesion to adhesive films.

As a phenoxy resin used by this invention, resin which has a repeating unit represented by the following general formula (2) is mentioned, for example.

In the above general formula (2), X represents a single bond or a divalent linking group. As a divalent coupling group, an alkylene group, a phenylene group, -O-, -S-, -SO-, or -SO2- is mentioned. Here, the alkylene group is preferably an alkylene group having 1 to 10 carbon atoms, and more preferably -C(R1)(R2)-. R1 and R2 represent a hydrogen atom or an alkyl group, and the alkyl group is preferably a straight-chain or branched alkyl group having 1 to 8 carbon atoms, such as methyl, ethyl, n-propyl, isopropyl, isooctyl, 2-ethylhexyl, 1,3,3-trimethylbutyl etc. are mentioned. Moreover, the said alkyl group may be substituted by the halogen atom, and a trifluoromethyl group is mentioned, for example. X is preferably an alkylene group, -O-, -S-, a fluorene group or -SO2-, and more preferably an alkylene group or -SO2-. Especially, -C(CH3)2-, -CH(CH3)-, -CH2-, -SO2- are preferable, and -C(CH3)2-, -CH(CH3)-, -CH2- are more preferable. and -C(CH3)2- is particularly preferred.

As long as the phenoxy resin represented by the general formula (2) has a repeating unit, even if it is a resin having a plurality of repeating units in which X in the general formula (2) is different, X may be composed of only the same repeating unit. In the present invention, a resin composed only of repeating units in which X is the same is preferable.

Further, when the phenoxy resin represented by the general formula (2) contains a polar substituent such as a hydroxyl group or a carboxy group, the compatibility with the thermally polymerizable component is improved, and a uniform appearance and characteristics can be imparted.

If the mass average molecular weight of the phenoxy resin is 5000 or more, it is excellent in terms of film formability. More preferably, it is 10,000 or more, More preferably, it is 30,000 or more. Moreover, if the mass average molecular weight is 150,000 or less, it is preferable from the point of compatibility with fluidity|liquidity at the time of hot-pressing and other resin. More preferably, it is 100,000 or less. In addition, when the glass transition temperature is -50°C or higher, it is excellent in terms of film formability, more preferably 0°C or higher, and still more preferably 50°C or higher. When the glass transition temperature is 150°C, the adhesive strength of the adhesive layer 13 at the time of die bonding is excellent, more preferably 120°C or less, still more preferably 110°C or less.

On the other hand, as a functional group in the polymer containing the said functional group, a glycidyl group, an acryloyl group, a methacryloyl group, a hydroxyl group, a carboxyl group, an isocyanurate group, an amino group, an amide group etc. are mentioned, for example, Among them, a glycidyl group is preferable.

As a high molecular weight component containing the said functional group, the (meth)acryl copolymer etc. containing functional groups, such as a glycidyl group, a hydroxyl group, and a carboxyl group, are mentioned, for example.

As said (meth)acrylic copolymer, a (meth)acrylic ester copolymer, an acrylic rubber, etc. can be used, for example, and an acrylic rubber is preferable. Acrylic rubber is a rubber mainly composed of copolymers such as butyl acrylate and acrylonitrile, copolymers such as ethyl acrylate and acrylonitrile, etc., with acrylic acid ester as a main component.

When containing a glycidyl group as a functional group, the amount of the glycidyl group-containing repeating unit is preferably 0.5 to 6.0% by weight, more preferably 0.5 to 5.0% by weight, particularly preferably 0.8 to 5.0% by weight. . The glycidyl group-containing repeating unit is a constituent monomer of a (meth)acrylic copolymer containing a glycidyl group, and is specifically glycidyl acrylate or glycidyl methacrylate. When the amount of the glycidyl group-containing repeating unit is within this range, the adhesive force can be secured and gelation can be prevented.

Examples of constituent monomers of the (meth)acrylic copolymer other than glycidyl acrylate and glycidyl methacrylate include ethyl (meth)acrylate and butyl (meth)lipidate. Alternatively, two or more types may be used in combination. In addition, in this invention, ethyl (meth)acrylate shows ethyl acrylate and/or ethyl methacrylate. What is necessary is just to determine the mixing ratio in the case of using combining functional monomers considering the glass transition temperature of a (meth)acrylic copolymer. When the glass transition temperature is -50°C or higher, it is preferable in terms of excellent film formability and suppression of excessive tacking at room temperature. If the tack force at room temperature is excessive, handling of the adhesive layer becomes difficult. More preferably -20°C or higher, still more preferably 0°C or higher. In addition, when the glass transition temperature is 30°C or less, it is excellent in terms of adhesive strength of the adhesive layer during die bonding, and more preferably 20°C or less.

When the monomer is polymerized to produce a high molecular weight component containing a functional monomer, the polymerization method is not particularly limited, and methods such as pearl polymerization and solution polymerization can be used. Among them, pearl polymerization is desirable.

In the present invention, when the weight average molecular weight of the high molecular weight component containing the functional monomer is 100,000 or more, it is excellent in terms of film formation, more preferably 200,000 or more, still more preferably 500,000 or more. In addition, adjusting the weight average molecular weight to 2,000,000 or less is excellent in that the thermal fluidity of the adhesive layer at the time of die bonding is improved. When the thermal fluidity of the adhesive layer at the time of die bonding is improved, adhesion between the adhesive layer and the adherend becomes good, the adhesive strength can be improved, and voids are easily suppressed by filling in irregularities of the adherend. More preferably, it is 1,000,000 or less, still more preferably 800,000 or less, and when it is 500,000 or less, a greater effect can be obtained.

In addition, the thermally polymerizable component is not particularly limited as long as it is polymerized by heat, and examples include functional groups such as glycidyl, acryloyl, methacryloyl, hydroxyl, carboxy, isocyanurate, amino, and amide groups. and a trigger material, which can be used alone or in combination of two or more, but considering the heat resistance as an adhesive layer, a thermosetting resin that cures by heat and exerts an adhesive action is combined with a curing agent and an accelerator. It is preferable to contain Examples of the thermosetting resin include epoxy resins, acrylic resins, silicone resins, phenol resins, thermosetting polyimide resins, polyurethane resins, melamine resins, and urea resins. It is most preferable to use an epoxy resin in that an adhesive layer is obtained.

The epoxy resin is not particularly limited as long as it is cured and has an adhesive action, and bifunctional epoxy resins such as bisphenol A type epoxy resins, novolac type epoxy resins such as phenol novolak type epoxy resins and cresol novolak type epoxy resins, and the like can be used In addition, generally known epoxy resins such as polyfunctional epoxy resins, glycidyl amine type epoxy resins, heterocyclic-containing epoxy resins, and alicyclic epoxy resins can be used.

As the bisphenol A type epoxy resin, Mitsubishi Chemical Corporation's Epicoat series (Epicoat 807, Epicoat 815, Epicoat 825, Epicoat 827, Epicoat 828, Epicoat 834, Epicoat 1001, Epicoat 1004 , Epicoat 1007, Epicoat 1009), Dow Chemical Co., DER-330, DER-301, DER-361, Nippon Steel Sumikin Chemical Co., Ltd., Y08125, YDF8170, etc. are mentioned. Examples of the phenol novolak type epoxy resin include Epicoat 152 and Epicoat 154 manufactured by Mitsubishi Chemical Corporation, EPPN-201 manufactured by Nippon Kayaku Co., Ltd., and DEN-438 manufactured by Dow Chemical Co., Ltd. - As a cresol novolak type epoxy resin, E0CN-102S, EOCN-103S, EOCN-104S, EOCN-1012, EOCN-1025, EOCN-1027 manufactured by Nippon Kayaku Co., Ltd., and Nippon Kayaku Co., Ltd. Kaisha make, YDCN701, YDCN702, YDCN703, YDCN704 etc. are mentioned. Examples of the polyfunctional epoxy resin include Epon1031S manufactured by Mitsubishi Chemical Corporation, Araldite 0163 manufactured by Chiba Specialty Chemicals, Denacol EX-611, EX-614, and EX-614B manufactured by Nagase ChemteX Co., Ltd.; EX-622, EX-512, EX-521, EX-421, EX-411, EX-321 etc. are mentioned. Examples of the amine type epoxy resin include Epicoat 604 manufactured by Mitsubishi Chemical Corporation, YH-434 manufactured by Toto Chemical Co., Ltd., TETRAD-X and TETRAD-C manufactured by Mitsubishi Gas Chemical Co., Ltd., and Sumitomo Chemical. Kogyo Co., Ltd. ELM-120 etc. are mentioned. As said heterocyclic containing epoxy resin, Araldite PT810 by Ciba Specialty Chemicals, ERL4234, ERL4299, ERL4221, ERL4206 by UCC, etc. are mentioned. These epoxy resins can also be used individually or in combination of 2 or more types.

In order to harden the said thermosetting resin, an additive can be added suitably. Examples of such an additive include a curing agent, a curing accelerator, and a catalyst, and when adding a catalyst, a cocatalyst can be used as necessary.

When using an epoxy resin for the thermosetting resin, it is preferable to use an epoxy resin curing agent or curing accelerator, and it is more preferable to use these in combination. Examples of the curing agent include phenol resins, dicyandiamide, boron trifluoride complex compounds, organic hydrazide compounds, amines, polyamide resins, imidazole compounds, urea or thiourea compounds, polymercaptan compounds, and poly having a mercapto group at the terminal. A sulfide resin, an acid anhydride, and a light/ultraviolet curing agent are mentioned. These can be used individually or in combination of 2 or more types.

Among these, examples of boron trifluoride complex compounds include boron trifluoride-amine complexes with various amine compounds (preferably primary amine compounds), and examples of organic hydrazide compounds include isophthalic acid dihydrazide. .

Examples of the phenolic resin include novolak-type phenolic resins such as phenol novolac resin, phenol aralkyl resin, cresol novolak resin, tert-butylphenol novolac resin, and nonylphenol novolak resin, resol-type phenolic resin, and polypara. Polyoxystyrene, such as oxystyrene, etc. are mentioned. Among them, a phenolic compound having at least two phenolic hydroxyl groups in the molecule is preferable.

Examples of the phenolic compound having at least two phenolic hydroxyl groups in the molecule include phenol novolac resin, cresol novolak resin, t-butylphenol novolac resin, dicyclopentadiene cresol novolak resin, and dicyclopentadiene. Phenol novolak resin, xylylene-modified phenol novolak resin, naphthol novolak resin, trisphenol novolak resin, tetrakisphenol novolak resin, bisphenol A novolak resin, poly-p-vinylphenol resin, phenol aralkyl resin etc. can be mentioned. Among these phenol resins, phenol novolak resins and phenol aralkyl resins are particularly preferred, and connection reliability can be improved.

Examples of amines include chain aliphatic amines (diethylenetriamine, triethylenetetramine, hexamethylenediamine, N,N-dimethylpropylamine, benzyldimethylamine, 2-(dimethylamino)phenol, 2,4,6-tris(dimethyl aminomethyl) phenol, m-xylenediamine, etc.), cyclic aliphatic amines (N-aminoethylpiperazine, bis(3-methyl-4-aminocyclohexyl)methane, bis(4-aminocyclohexyl)methane, mensendiamine, isophoronediamine, 1,3-bis(aminomethyl)cyclohexane, etc.), heterocyclic amines (piperazine, N,N-dimethylpiperazine, triethylenediamine, melamine, guanamine, etc.), aromatic amines (metaphenylene Diamine, 4,4'-diaminodiphenylmethane, diamino, 4,4'-diaminodiphenylsulfone, etc.), polyamide resin (preferably polyamideamine, condensate of dimer acid and polyamine), imidazole Compounds (2-phenyl-4,5-dihydroxymethylimidazole, 2-methylimidazole, 2,4-dimethylimidazole, 2-n-heptadecylimidazole, 1-cyanoethyl- 2-undecylimidazolium trimellitate, epoxy imidazole adducts, etc.), urea or thiourea compounds (N,N-dialkyl urea compounds, N,N-dialkylthiourea compounds, etc.), polymercaptans Compounds, polysulfide resins having a mercapto group at the terminal, acid anhydrides (tetrahydrophthalic anhydride, etc.), light/ultraviolet curing agents ((diphenyliodonium hexafluorophosphate, triphenylsulfonium hexafluorophosphate, etc.) are exemplified. do.

The curing accelerator is not particularly limited as long as it cures a thermosetting resin, and examples thereof include imidazoles, dicyandiamide derivatives, dicarboxylic acid dihydrazide, triphenylphosphine, tetraphenylphosphonium tetraphenylborate, 2- Ethyl-4-methylimidazole tetraphenylborate, 1,8-diazabicyclo[5.4.0]undecene-7-tetraphenylborate, etc. are mentioned.

As imidazoles, imidazole, 2-methylimidazole, 2-ethylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole , 1-benzyl-2-methylimidazole, 1-benzyl-2-ethylimidazole, 1-benzyl-2-ethyl-5-methylimidazole, 2-phenyl-4-methyl-5-hydroxy Dimethylimidazole, 2-phenyl-4,5-dihydroxymethylimidazole, etc. are mentioned.

The content of the curing agent for epoxy resin or the curing accelerator in the adhesive layer is not particularly limited, and the optimum content differs depending on the type of the curing agent or curing accelerator.

The blending ratio of the epoxy resin and the phenol resin is preferably blended so that, for example, the hydroxyl group in the phenol resin is 0.5 to 2.0 equivalent per 1 equivalent of the epoxy group in the above-mentioned epoxy group component. More preferably, it is 0.8-1.2 equivalent. That is, it is because when the mixing ratio of both is out of the above range, a sufficient curing reaction does not proceed and the properties of the adhesive layer tend to deteriorate. In one embodiment, the other thermosetting resin and the curing agent are 0.5 to 20 parts by mass of the curing agent with respect to 100 parts by mass of the thermosetting resin, and in another embodiment, the curing agent is 1 to 10 parts by mass. The content of the curing accelerator is preferably smaller than the content of the curing agent, preferably 0.001 to 1.5 parts by mass, more preferably 0.01 to 0.95 parts by mass of the curing accelerator per 100 parts by mass of the thermosetting resin. Advancing of sufficient hardening reaction can be assisted by adjusting within the said range. The content of the catalyst is preferably 0.001 to 1.5 parts by mass, more preferably 0.01 to 1.0 parts by mass, based on 100 parts by mass of the thermosetting resin.

Moreover, the adhesive layer 13 of this invention can mix|blend a filler suitably according to the use. This improves the dicing properties of the adhesive layer in an uncured state, improves handling, adjusts the melt viscosity, imparts thixotropic properties, and furthermore imparts thermal conductivity to the adhesive layer in a cured state and improves adhesive strength. It is possible to achieve.

As the filler used in the present invention, an inorganic filler is preferable. The inorganic filler is not particularly limited, and examples thereof include aluminum hydroxide, magnesium hydroxide, calcium carbonate, magnesium carbonate, calcium silicate, magnesium silicate, calcium oxide, magnesium oxide, alumina, aluminum nitride, aluminum borate whiskers, boron nitride, and crystalline silica. , amorphous silica, antimony oxide and the like can be used. Moreover, these can also be used individually or in mixture of 2 or more types.

Among the inorganic fillers, from the viewpoint of improving thermal conductivity, it is preferable to use alumina, aluminum nitride, boron nitride, crystalline silica, amorphous silica or the like. In addition, in terms of adjusting the melt viscosity and imparting thixotropic properties, aluminum hydroxide, magnesium hydroxide, calcium carbonate, magnesium carbonate, calcium silicate, magnesium silicate, calcium oxide, magnesium oxide, alumina, crystalline silica, amorphous silica, etc. It is preferable to use Further, from the viewpoint of improving dicing properties, it is preferable to use alumina or silica.

The adhesive layer of the present invention may contain two or more types of fillers having different average particle diameters as the fillers. In this case, compared to the case where a single filler is used, in the raw material mixture before film formation, it is easier to prevent the viscosity increase when the filler content is high or the viscosity decrease when the filler content is low, resulting in a good film. It becomes easy to obtain formability, and while the fluidity|liquidity of an uncured adhesive bond layer can be controlled optimally, it becomes easy to obtain excellent adhesive force after hardening of an adhesive bond layer.

Moreover, it is preferable that the average particle diameter of a filler is 2.0 micrometer or less, and, in the adhesive layer of this invention, it is more preferable that it is 1.0 micrometer or less. If the average particle diameter of a filler is 2.0 micrometers or less, thinning of a film becomes easy. A thin film here implies a thickness of 20 µm or less. Moreover, dispersibility is good when it is 0.01 micrometer or more.

In addition, from the viewpoint of preventing an increase or decrease in the viscosity of the raw material mixture before film formation, optimally controlling the fluidity of the uncured adhesive layer, and improving the adhesive force after curing of the adhesive layer, the average particle diameter is in the range of 0.1 to 1.0 μm. It is preferable to include a first filler in the range of 0.005 to 0.03 μm in the average particle diameter of the primary particle diameter and the primary particle diameter of the first filler in the inside. The first filler having an average particle diameter in the range of 0.1 to 1.0 μm and 99% or more of the particles are distributed in the range of 0.1 to 1.0 μm in particle diameter, and the average particle diameter of the primary particle diameter is in the range of 0.005 to 0.03 μm and 99% It is preferable that the above particles contain a second filler distributed within a range of 0.005 to 0.1 μm in particle diameter.

The average particle diameter in the present invention means the D50 value of the cumulative volume distribution curve in which 50 volume% of the particles have a diameter smaller than this value. In the present invention, the average particle size or D50 value is measured by a laser diffraction method using, for example, Malvern Mastersizer 2000 manufactured by Malvern Instruments. In this technique, the size of particles in a dispersion is measured using the diffraction of a laser beam, based on the application of either Fraunhofer or Mie theory. In the present invention, using the Mine theory or the modified Mie theory for non-spherical particles, the average particle diameter or D50 value relates to scattering measurement at 0.02 to 135° with respect to the incident laser beam.

In the present invention, in one aspect, 10 to 40% by mass of a thermoplastic resin having a weight average molecular weight of 5000 to 200,000 and 10 to 40% by mass of a thermopolymerizable component with respect to the entire pressure-sensitive adhesive composition constituting the adhesive layer 13 And, you may include a 30-75 mass % filler. In this embodiment, 30-60 mass % may be sufficient as content of a filler, and 40-60 mass % may be sufficient as it. In addition, the mass average molecular weight of the thermoplastic resin may be 5000 to 150,000 or 10,000 to 100,000.

In another embodiment, 10 to 20% by mass of a thermoplastic resin having a weight average molecular weight of 200,000 to 2,000,000, 20 to 50% by mass of a thermopolymerizable component, and 30 to 75% by mass of the entire pressure-sensitive adhesive composition constituting the adhesive layer 13 % filler may be included. In this embodiment, 30-60 mass % may be sufficient as content of a filler, and 30-50 mass % may be sufficient as it. In addition, the mass average molecular weight of the thermoplastic resin may be 200,000 to 1,000,000, or 200,000 to 800,000.

By adjusting the compounding ratio, the storage elastic modulus and fluidity of the adhesive layer 13 after curing can be optimized, and heat resistance at high temperatures tends to be sufficiently obtained.

It is preferable that the adhesive layer 13 has a light transmittance of 90% or more to light having a wavelength of 550 nm. In the case of a device having a structure in which glass is laminated on top of the image sensor through an adhesive layer, there is a possibility that the sensor may not function reliably if the light transmittance is less than 90%. The light transmittance can generally be adjusted by the composition of the adhesive layer, and in particular, mounting reliability and high transmittance can be compatible by selecting a base resin and a filler. Adjustment is possible by suppressing scattering of light and improving transmittance by reducing the particle size of the filler. As the high transmittance resin, for example, an epoxy resin or a silicone resin is preferably used, and a bisphenol type epoxy resin is particularly preferably used for compatibility with mounting reliability, but is not limited thereto.

The light transmittance can be obtained by measuring the light quantity of the transmitted light using a spectrophotometer (Spectrophotometer U-4100 type solid sample measuring system manufactured by Hitachi High-Technologies Co., Ltd.). Specifically, an adhesive layer having a thickness of 20 μm is bonded to glass, and light penetrates in a direction normal to the glass surface to determine the light transmittance of 550 nm glass at 25° C. Specifically, it is calculated by the following formula (2).

Light transmittance of adhesive layer I(%)=I1/I0 (2)

I1 (%): Light transmittance of glass including adhesive layer

I0 (%): light transmittance of glass

In the tape 10 for glass processing of the present invention, the adhesive layer 13 may be formed by directly or indirectly laminating a preliminarily filmed one (hereinafter referred to as an adhesive film) on the base film 11 . The temperature during lamination is preferably in the range of 10 to 100°C, and a linear pressure of 0.01 to 1ON/m is applied. In addition, such an adhesive film may be one in which the adhesive layer 13 is formed on the release film, and in that case, the release film may be peeled off after lamination, or used as it is as a cover film for the tape 10 for glass processing, and glass may be peeled off at the time of bonding.

The adhesive film may be laminated on the entire surface of the pressure-sensitive adhesive layer 12, or an adhesive film cut (precut) into a shape corresponding to the glass to be bonded in advance may be laminated on the pressure-sensitive adhesive layer 12. In this way, when the adhesive film along the glass is laminated, as shown in FIG. 3, the adhesive layer 13 is present at the portion where the glass W is bonded, and the adhesive layer 13 is present at the portion where the ring frame 20 is bonded. ), only the pressure-sensitive adhesive layer 12 exists. In general, since the adhesive layer 13 is difficult to peel from the adherend, by using a precut adhesive film, the ring frame 20 can be bonded to the adhesive layer 12, and at the time of tape peeling after use. The effect of making it difficult to generate adhesive residue on the ring frame 20 is obtained.

<Use>

The tape 10 for glass processing of this invention is used for the glass processing method which includes the expand process which divides the adhesive bond layer 13 by expansion at least. Therefore, the order of other steps or steps is not particularly limited. For example, it can be suitably used in the following glass processing methods (A) to (C).

Glass processing method (A)

(a) bonding the adhesive film bonded to the pressure-sensitive adhesive layer of the tape for glass body processing to glass in a state where the glass is heated at 70 to 80 ° C.;

(b) a step of irradiating a laser beam to the portion to be divided of the glass and forming a modified region by multiphoton absorption inside the glass;

(c) a step of dividing the glass and the adhesive film along a parting line by expanding the half-glass processing tape to obtain a plurality of chips with adhesive films;

(d) heat-shrinking a portion of the tape for glass processing that does not overlap with the chip to remove slack generated in the expand process and maintain a gap between the chips;

(e) a step of picking up the chips with the adhesive layer from the adhesive layer of the tape for glass processing

Glass processing method comprising a.

The processing method of this glass is a method using stealth dicing.

Glass processing method (B)

(a) a step of bonding an adhesive film bonded to the pressure-sensitive adhesive layer of the tape for glass processing to glass in a state where the glass is heated at 70 to 80° C.;

(b) a step of radiating a laser beam from the surface of the glass along a dividing line to divide into individual chips;

(c) a step of dividing the adhesive film corresponding to the chips by expanding the glass processing tape to obtain a plurality of chips with adhesive films;

(d) heat-shrinking a portion of the tape for glass processing that does not overlap with the chip to remove slack generated in the expand process and maintain a gap between the chips;

(e) a step of picking up the chips with the adhesive layer from the adhesive layer of the tape for glass processing

Glass processing method comprising a.

This glass processing method is a method using full-cut laser dicing.

Glass processing method (C)

(a) bonding an adhesive film bonded to the pressure-sensitive adhesive layer of the tape for glass processing to glass in a state where the wafer is heated at 70 to 80° C.;

(b) cutting the glass along a cutting line using a dicing blade and dividing the glass into individual chips;

(c) a step of dividing the adhesive film corresponding to the chips by expanding the glass processing tape to obtain a plurality of chips with adhesive films;

(d) heat-shrinking a portion of the tape for glass processing that does not overlap with the chip to remove slack generated in the expand process and maintain a gap between the chips;

(e) a step of picking up the chips with the adhesive layer from the adhesive layer of the tape for glass processing

Glass processing method comprising a.

This glass processing method is a method using full-cut blade dicing.

<How to use>

The usage method of the tape at the time of applying the tape 10 for glass processing of this invention to the processing method (A) of the said glass is demonstrated, referring FIGS. 2-5.

As shown in FIG. 2, after placing the glass W with the surface side down on the heater table 25 of the wafer mounter, the tape 10 for glass processing is bonded to the back surface of the glass W. The tape 10 for glass processing used here is a laminate of adhesive films previously cut (precut) into a shape corresponding to the glass W to be bonded, and the adhesive layer 13 is exposed on the surface to be bonded to the glass W. An adhesive layer 12 is exposed around the region. The part where the adhesive layer 13 of this tape 10 for glass processing was exposed and the back surface of the glass W were bonded together, and the part where the adhesive layer 12 was exposed around the adhesive layer 13 and the ring frame 20 join At this time, the heater table 25 is set to 70 to 80°C, whereby heat bonding is performed. Moreover, in this embodiment, glass which has the adhesive tape 15 which consists of the base film 11 and the adhesive layer 12 provided on the base film 11, and the adhesive layer 13 provided on the adhesive layer 12. Although the tape 10 for a process was used, you may make it use an adhesive tape and a film adhesive, respectively. In this case, first, a film adhesive is bonded to the back surface of glass to form an adhesive layer, and the adhesive layer of the adhesive tape is bonded to this adhesive layer. At this time, the adhesive tape 15 according to the present invention is used as the adhesive tape.

Next, glass W to which the tape 10 for glass processing was bonded is carried out from above the heater table 25, and as shown in FIG. A modified region 32 by multiphoton absorption is formed on

Next, as shown in Fig. 4 (a), the tape 10 for glass processing to which the glass W and the ring frame 20 were bonded was placed with the base film 11 side facing down, and the stage of the expander (21) Load on top.

Next, as shown in (b) of FIG. 4, in the state where the ring frame 20 is fixed, the hollow cylindrical pushing member 22 of the expander is raised, and the tape 10 for glass processing is removed. expand (expand). As expansion conditions, the expand speed is, for example, 5 to 500 mm/sec, and the expand amount (pull-up amount) is, for example, 5 to 25 mm. When the tape 10 for glass processing is stretched in the radial direction of the glass W in this way, the glass W is divided into chips 34 units starting from the modified region 32 . At this time, in the portion where the adhesive layer 13 adheres to the back surface of the glass W, elongation (deformation) due to expansion is suppressed and fracture does not occur, but at the position between the chips 34, tension due to expansion of the tape concentrated and broken Therefore, as shown in FIG.4(c), the adhesive bond layer 13 will also be parted with glass W. Thereby, a plurality of chips 34 with adhesive layer 13 can be obtained.

Next, as shown in Fig. 5, the lifting member 22 is returned to its original position, the slack of the glass processing tape 10 generated in the previous expanding step is removed, and the gap between the chips 34 is removed. A process for stably maintaining is performed. In this step, for example, the warm air nozzle 29 is applied to the annular heating and contraction region 28 between the area where the chips 34 exist in the tape 10 for glass processing and the ring frame 20. 40-120 degreeC warm air is applied using it, the base film 11 is heat-shrinked, and the tape 10 for glass processing is made into the state which stuck to a pin. Thereafter, the pressure-sensitive adhesive layer 12 is subjected to energy ray curing treatment or thermal curing treatment to weaken the adhesive force of the pressure-sensitive adhesive layer 12 to the adhesive layer 13, and then the chip 34 is picked up.

In addition, although the tape 10 for glass processing by this embodiment has the structure provided with the adhesive layer 13 on the adhesive layer 12, you may comprise without forming the adhesive layer 13. In this case, the glass may be bonded on the pressure-sensitive adhesive layer 12 and used to divide only the glass, or when the tape for glass processing is used, the adhesive film produced in the same way as the adhesive layer 13 is combined with the glass to form the pressure-sensitive adhesive layer ( 12) It is bonded on top, and you may make it part the glass and adhesive film.

<Example>

Next, in order to further clarify the effects of the present invention, Examples and Comparative Examples will be described in detail, but the present invention is not limited to these Examples.

[Production of tape for glass processing]

(1) Production of base film

<Base film A>

Zinc ionomer of ethylene-methacrylic acid-ethyl methacrylate copolymer synthesized by radical polymerization (methacrylic acid content 15%, ethyl methacrylate content 5%, softening point 72 ° C, melting point 90 ° C, density 0.96 g / cm 3, Resin beads having a zinc ion content of 5% by mass) were melted at 230°C and molded into a long film with a thickness of 150 µm using an extruder. Then, base film A was produced by stretching this long film in the TD direction so that it might become 90 micrometers in thickness.

<Base film B>

Base film B was produced in the same manner as in base film A except that the thickness of the long film was 180 μm and the long film was stretched in the TD direction so as to be 90 μm thick.

<Base film C>

The base film C was produced in the same manner as in the base film A except that the thickness of the long film was 215 μm and the long film was stretched in the TD direction so as to be 90 μm thick.

<Base film D>

Zinc ionomer of ethylene-methacrylic acid-isobutyl methacrylate copolymer synthesized by radical polymerization (methacrylic acid content 11%, methacrylic acid isobutyl content 9%, softening point 64 ° C, melting point 83 ° C, density 0.95 g / cm 3 , zinc ion content of 4 mass%) resin beads were melted at 230°C and molded into a long film with a thickness of 150 µm using an extruder. After that, base film D was produced by stretching the elongated film in the TD direction so as to have a thickness of 90 µm.

<Base film E>

Resin beads obtained by mixing a hydrogenated styrenic thermoplastic elastomer and homopropylene (PP) at a mixing ratio of 52:48 were melted at 200°C and molded into a long film with a thickness of 150 µm using an extruder. Then, the base film E was produced by stretching this long film in the TD direction so that it might become 90 micrometers in thickness.

<Base film F>

Resin beads obtained by mixing a hydrogenated styrenic thermoplastic elastomer and homopropylene (PP) at a mixing ratio of 64:36 were melted at 200°C and molded into a long film with a thickness of 150 µm using an extruder. Then, base film F was produced by stretching this long film in the TD direction so that it might become 90 micrometers in thickness.

<Base film G>

Base film G was produced in the same manner as in base film A except that the thickness of the long film was 150 µm and the long film was stretched in the MD direction so as to be 90 µm thick.

<Base film H>

Base film H was produced in the same manner as in base film D, except that the thickness of the long film was 150 μm and the long film was stretched in the MD direction so as to be 90 μm thick.

<Base film I>

Base film I was produced in the same manner as in base film A except that the thickness of the long film was 90 µm and the stretching treatment of the long film was not performed.

<Base film J>

The thickness of the long film was 90 μm, and a base film J was produced in the same manner as in the base film D, except that the stretching treatment of the long film was not performed.

<Base film K>

Base film K was produced in the same manner as in base film E, except that the thickness of the long film was 90 μm and the stretching treatment of the long film was not performed.

<Base film L>

The base film L was produced in the same manner as in the base film F, except that the thickness of the long film was 90 µm and the stretching treatment of the long film was not performed.

<Base film M>

Base film M was produced in the same manner as in base film A except that the thickness of the long film was 110 µm and the long film was stretched in the TD direction so as to have a thickness of 90 µm.

<Base film N>

Base film N was produced in the same manner as in base film A except that the thickness of the long film was 120 µm and the long film was stretched in the TD direction so as to be 90 µm thick.

(2) Preparation of acrylic copolymer

As the acrylic copolymer (A1) having a functional group, it consists of 2-ethylhexyl acrylate, 2-hydroxyethyl acrylate and methacrylic acid, the ratio of 2-ethylhexyl acrylate is 60 mol%, and the mass average molecular weight is 70 A copolymer of only was prepared. Next, 2-isocyanatoethyl methacrylate was added so that the iodine value was 25, and an acrylic copolymer having a glass transition temperature of -50 ° C., a hydroxyl value of 10 mgKOH / g and an acid value of 5 mgKOH / g was prepared did

(3-1) Preparation of adhesive composition A

Epoxy resin "1256" (manufactured by Mitsubishi Chemical Corporation, bisphenol A type phenoxy resin, epoxy equivalent 7500) 100 parts by mass, epoxy resin "828" (Mitsubishi Chemical Co., Ltd. trade name, bisphenol A type liquid epoxy resin , Epoxy equivalent 220, specific gravity 1.17) 100 parts by mass, curing agent "DICY7" (manufactured by Mitsubishi Chemical Corporation, dicyandiamide) 4 parts by mass, and "Cure Sol 2PZ" as a curing accelerator (product name manufactured by Shikoku Chemical Co., Ltd. , 2-phenyl-4,5-dihydroxymethylimidazole) 0.4 mass part was added, MEK was added, and it stirred and mixed until it became uniform. Further, the varnish of the adhesive composition was obtained by filtering this with a 100 mesh filter and vacuum defoaming.

(3-2) Preparation of adhesive composition B

Epoxy resin "1002" (Mitsubishi Chemical Co., Ltd., solid bisphenol A type epoxy resin, epoxy equivalent 600) 40 parts by mass, epoxy resin "806" (Mitsubishi Chemical Co., Ltd. trade name, bisphenol F type epoxy resin, Epoxy equivalent 160, specific gravity 1.20) 100 parts by mass, curing agent "Dyhard100SF" (trade name, dicyandiamide, manufactured by Degus) 5 parts by mass, silica filler "SO-C2" (trade name, manufactured by Adomafine Co., Ltd., average particle diameter 0.5 µm) ) MEK was added to a composition consisting of 200 parts by mass and 3 parts by mass of "Aerosil R972" as a silica filler (product name manufactured by Nippon Aerosil Co., Ltd., average primary particle size 0.016 µm), stirred and mixed, and uniform composition was made

To this, 100 parts by mass of phenoxy resin "PKHH" (trade name manufactured by INCHEM, mass average molecular weight 52,000, glass transition temperature 92 ° C.), "KBM-802" (trade name manufactured by Shin-Etsu Silicone Co., Ltd., mercaptopropyl tree) as a coupling agent methoxysilane) 0.6 parts by mass, and "Curesol 2PHZ-PW" as a curing accelerator (trade name manufactured by Shikoku Chemical Co., Ltd., 2-phenyl-4,5-dihydroxymethylimidazole, decomposition temperature: 230°C) 0.5 part by mass was added and stirred and mixed until uniform. Further, the varnish of the adhesive composition was obtained by filtering this with a 100 mesh filter and vacuum defoaming.

<Example 1>

A mixture in which 5 parts by mass of Coronate L (manufactured by Nippon Polyurethane) was added as a polyisocyanate and 3 parts by mass of Esacure KIP 150 (manufactured by Lamberti) as a photopolymerization initiator was added to 100 parts by mass of the acrylic copolymer described above, and acetic acid It was dissolved in ethyl and stirred to prepare an adhesive composition.

Next, this pressure-sensitive adhesive composition was applied to a release liner made of a polyethylene terephthalate film subjected to release treatment so that the thickness after drying was 10 μm, dried at 110° C. for 3 minutes, bonded to a base film, and then bonded to the base film. A pressure-sensitive adhesive sheet having a pressure-sensitive adhesive layer was prepared.

Next, the above-described adhesive composition A was applied to a release liner made of a polyethylene terephthalate film subjected to release treatment so that the thickness after drying was 20 μm, and dried at 110° C. for 5 minutes to form an adhesive layer on the release liner. An adhesive film was produced.

The adhesive sheet was cut into a shape shown in FIG. 3 and the like that could be bonded to the ring frame so as to cover the opening. Moreover, the adhesive film was cut into the shape shown in FIG. 3 etc. which can cover the glass back surface. Then, the pressure-sensitive adhesive layer side of the pressure-sensitive adhesive sheet and the adhesive layer side of the adhesive film were bonded together so as to form a portion where the pressure-sensitive adhesive layer 12 was exposed around the adhesive film, as shown in FIG. 3, to prepare a tape for glass processing. .

<Examples 2 to 8, Comparative Examples 1 to 6>

Tapes for glass processing according to Examples 2 to 8 and Comparative Examples 1 to 6 were produced in the same manner as in Example 1 except for using the base film and adhesive composition described in Table 1.

The adhesive tape for glass processing according to Examples and Comparative Examples was cut so as to have a length of 24 mm (direction for measuring strain amount) and a width of 5 mm (direction orthogonal to the direction for measuring strain amount) to obtain sample pieces. . With respect to the obtained sample piece, using a thermomechanical property tester (manufactured by Rigaku Co., Ltd., trade name: TMA8310), deformation due to temperature in two directions, MD and TD, was measured by the tensile load method under the following measurement conditions. did

(Measuring conditions)

Measurement temperature: -60 to 100°C

Heating rate: 5°C/min

Measured load: 19.6mN

Atmosphere gas: nitrogen atmosphere (100ml/min)

Sampling: 0.5s

Distance between chucks: 20 mm

Then, the thermal strain rate was calculated by the following formula (1), and the integral value calculated as the total of the thermal strain rates per 1 ° C between 40 ° C and 80 ° C in the MD direction and the TD direction, respectively, was calculated, and the sum was calculated. . The results are shown in Tables 1 and 2.

Thermal strain TMA (%) = (displacement of sample length / sample length before measurement) × 100 (1)

[Evaluation of Chip Recognition Miss]

By the method shown below, about each tape for a glass process of the said Example and the said comparative example, the glass was parted into chips, and the chip recognition error was evaluated.

(a) a step of irradiating a laser beam to a portion of the glass to be divided and forming a modified region by multiphoton absorption inside the glass;

(b) bonding the adhesive layer of the glass processing tape to the glass in a state where the glass is heated at 70 to 80° C.;

(c) a step of dividing the glass and the adhesive layer along a parting line by expanding the glass processing tape to obtain a plurality of chips with adhesive films;

(d) Heating and shrinking a portion of the glass processing tape that does not overlap with the chip (the annular area between the area where the chip exists and the ring frame) to remove the slack generated in the expand process of (c), A process of maintaining chip spacing;

(e) The process of picking up the said chip|tip with the said adhesive bond layer from the adhesive layer of the tape for glass processing was performed.

Moreover, at (b) process, glass was bonded to the tape for a glass process so that the parting line of glass might follow MD direction and TD direction of a base film.

(c) In the process, the ring frame for dicing bonded to the tape for glass processing is rolled down by the expand ring of DDS2300 made by Disco Co., Ltd. with DDS2300 manufactured by Disco Co., Ltd., and the outer periphery of the glass bonding site of the tape for glass processing , Expanding was performed by pressing the portion not overlapped with the glass with a circular lifting member. (c) As conditions for the process, the expand amount was adjusted so as to be set to an expand speed of 300 mm/sec and an expand height of 10 mm. Here, the expand amount refers to the amount of change in the relative position of the ring frame and the lifting member before and after being pressed down. The chip size was set to be a rectangle with one side measuring 1×1 mm.

In the step (d), after performing expansion again under the conditions of an expand speed of 1 mm/sec and an expand height of 10 mm at normal temperature, heat shrinkage treatment was performed under the following conditions.

[Condition 1]

Heater set temperature: 220℃

Heat flow rate: 40L/min

Gap between heater and tape for glass processing: 20 mm

Heater rotation speed: 7°/sec

[Condition 2]

Heater set temperature: 220℃

Heat flow rate: 40L/min

Gap between heater and tape for glass processing: 20 mm

Heater rotation speed: 5°/sec

With respect to the tapes for glass processing of Examples 1 to 8 and Comparative Examples 1 to 6, pick-up was performed after the above step (g), and the boundary with the adjacent chip was not determined, so that the chip could not be recognized accurately, and the chip What could not be picked up was regarded as a chip recognition miss, and the occurrence frequency was evaluated. In both conditions 1 and 2 of the above-mentioned step (g), a product with a chip recognition miss frequency of 0% was considered a good product, and a product with a chip recognition miss frequency of less than 1% was designated as a good product under condition 2. "○", those with a chip recognition miss frequency of 1% or more and less than 3% under condition 2 are considered acceptable products, and "△", those with a chip recognition miss frequency of 3% or more under both conditions 1 and 2 are considered defective products. and evaluated as "x". The results are shown in Tables 1 and 2.

Also, at the time of evaluation, as shown in FIG. 6 , around the rightmost chip 50a in FIG. 6 without defects in the MD direction of the adhesive tape, similarly, defects in the MD direction of the adhesive tape 6, 100 chips each around the leftmost chip 50b, the defect-free oppositemost chip 51 in the TD direction of the adhesive tape, and the chip 52 located in the center. was picked up and evaluated.

[Measurement of Transmittance of Adhesive Layer]

The transmittance|permeability was measured with respect to the adhesive layer of the said Example and the said comparative example by the method shown below.

After the adhesive layer having a thickness of 20 μm formed on the release liner was bonded to glass, the release liner was peeled off to obtain a glass sample containing the adhesive layer. With respect to the glass and the glass including the adhesive layer, light penetrates in the normal direction with respect to the glass surface, and the light transmittance of the glass at 550 nm at 25 ° C. system), and the transmittance of the adhesive layer was calculated by the following equation (2). The results are shown in Tables 1 and 2.

Light transmittance of adhesive layer I(%)=I1/I0 (2)

I1 (%): Light transmittance of glass including adhesive layer

I0 (%): light transmittance of glass

As shown in Table 1, the tapes for glass processing according to Examples 1 to 8 showed a heat resistance at every 1°C between 40°C and 80°C as measured by a thermomechanical property tester in the MD direction of the adhesive tape when the temperature was raised. Since the sum of the average value of the differential value of the strain and the average value of the differential value of the differential value of the thermal strain at every 1 ° C between 40 ° C and 80 ° C measured at the time of temperature increase with a thermomechanical characteristics tester in the TD direction is a negative value, It was easy to discriminate the boundary with an adjacent chip, and the occurrence frequency of chip recognition misses in image recognition at the time of pick-up was low, resulting in good results.

On the other hand, as shown in Table 2, the tapes for glass processing according to Comparative Examples 1 to 6 were measured at every 1°C between 40°C and 80°C when the temperature was raised by a thermomechanical property tester in the MD direction of the adhesive tape. The sum of the average value of the differential value of the thermal strain of and the average value of the differential value of the differential value of the thermal strain at every 1 °C between 40 ° C and 80 ° C measured at the time of temperature increase with a thermomechanical property tester in the TD direction is a negative value Since it is not, the occurrence frequency of chip recognition misses is high, resulting in a drop.

10: tape for glass processing
11: base film
12: adhesive layer
13: adhesive layer
22: push-up member
28: heating shrinkage area
29: warm air nozzle

Claims (4)

An adhesive tape having a base film and an adhesive layer formed on at least one side of the base film,
The adhesive tape was obtained by measuring the average value of the differential value of the thermal strain rate per 1 ° C between 40 ° C and 80 ° C measured at the time of temperature increase by the thermomechanical characteristics tester in the MD direction and the thermomechanical characteristics tester in the TD direction. The sum of the average values of the differential values of the thermal strain rates per 1 ° C between 40 ° C and 80 ° C measured at the time of temperature increase is a negative value,
A glass processing tape characterized in that it is used for glass processing including an expand process of expanding the adhesive tape. It has a base film and an adhesive tape having an adhesive layer formed on at least one side of the base film,
The base film is made of an ionomer resin or a mixed resin composition of polypropylene and a styrene-butadiene copolymer,
The adhesive tape was obtained by measuring the average value of the differential value of the thermal strain at every 1 ° C between 40 ° C and 80 ° C measured at the time of temperature increase by the thermomechanical characteristics tester in the MD direction, and the thermomechanical characteristics tester in the TD direction. A tape for glass processing, characterized in that the sum of the average values of the differential values of the thermal strain rates per 1 ° C between 40 ° C and 80 ° C measured at the time of temperature increase is a negative value. According to claim 1 or 2,
A tape for glass processing characterized in that it is used for full-cut blade dicing, laser dicing or laser stealth dicing. According to claim 1 or 2,
An adhesive layer is laminated on the side of the pressure-sensitive adhesive layer,
The tape for glass processing, characterized in that the adhesive layer has a light transmittance of 90% or more for light having a wavelength of 550 nm.

Images