PH12021550130A1 - Tape for glass processing - Google Patents

Tape for glass processing

Info

Publication number
PH12021550130A1
PH12021550130A1 PH12021550130A PH12021550130A PH12021550130A1 PH 12021550130 A1 PH12021550130 A1 PH 12021550130A1 PH 12021550130 A PH12021550130 A PH 12021550130A PH 12021550130 A PH12021550130 A PH 12021550130A PH 12021550130 A1 PH12021550130 A1 PH 12021550130A1
Authority
PH
Philippines
Prior art keywords
tape
adhesive tape
machining
derivative
measured
Prior art date
Application number
PH12021550130A
Inventor
Yukihiro Matsubara
Hirotoki Yokoi
Original Assignee
Furukawa Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Furukawa Electric Co Ltd filed Critical Furukawa Electric Co Ltd
Publication of PH12021550130A1 publication Critical patent/PH12021550130A1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B23K2103/54—Glass
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature

Landscapes

  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Organic Chemistry (AREA)
  • Adhesive Tapes (AREA)
  • Laser Beam Processing (AREA)
  • Dicing (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

Provided is glass machining tape that can be sufficiently heat-shrunk in a short length of time, and that is capable of maintaining cuff width. Glass machining tape 10 according to the present invention is characterized by comprising adhesive tape 15 having a base film 11 and an adhesive agent layer 12 formed on at least one surface side of the base film 11; the sum of the average value of the derivative of the rate of thermal deformation of the adhesive tape 15 in the machine direction per 1øC in a range from 40øC to 80øC as measured by a thermomechanical properties tester during heating and the average value of the derivative of the rate of thermal deformation thereof in the transverse direction per 1øC in a range from 40øC to 80øC as measured by a thermomechanical properties tester during heating is a negative value; and the machining tape is used in glass machining including an expansion step for expanding the adhesive tape 15.
PH12021550130A 2019-05-29 2021-01-18 Tape for glass processing PH12021550130A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019100128A JP7269096B2 (en) 2019-05-29 2019-05-29 glass processing tape
PCT/JP2020/009036 WO2020240965A1 (en) 2019-05-29 2020-03-04 Glass machining tape

Publications (1)

Publication Number Publication Date
PH12021550130A1 true PH12021550130A1 (en) 2021-09-27

Family

ID=73545921

Family Applications (1)

Application Number Title Priority Date Filing Date
PH12021550130A PH12021550130A1 (en) 2019-05-29 2021-01-18 Tape for glass processing

Country Status (7)

Country Link
JP (1) JP7269096B2 (en)
KR (1) KR102505638B1 (en)
CN (1) CN112368106B (en)
PH (1) PH12021550130A1 (en)
SG (1) SG11202100516XA (en)
TW (1) TWI743811B (en)
WO (1) WO2020240965A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114804647B (en) * 2022-03-25 2024-04-05 吴江南玻华东工程玻璃有限公司 Preparation method of coated glass sample wafer and hollow sandwich glass sample wafer

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS611830A (en) * 1985-05-16 1986-01-07 Yanmar Diesel Engine Co Ltd Speed adjustor for diesel engine
JPH10310749A (en) * 1997-05-13 1998-11-24 Mitsui Chem Inc Adhesive film for semiconductor wafer dicing, and dicing of semiconductor wafer
JP4358502B2 (en) 2002-03-12 2009-11-04 浜松ホトニクス株式会社 Semiconductor substrate cutting method
JP2004273895A (en) 2003-03-11 2004-09-30 Disco Abrasive Syst Ltd Dividing method of semiconductor wafer
WO2004096483A1 (en) * 2003-04-25 2004-11-11 Nitto Denko Corporation Method of producing laser-processed product and adhesive sheet, for laser processing used therefor
JP5151015B2 (en) * 2005-08-25 2013-02-27 東洋紡株式会社 Heat-shrinkable polyester film and label and method for producing the same
US20100130716A1 (en) * 2007-05-08 2010-05-27 Mitsui Chemicals, Inc. Crosslinked material of propylene polymer
JP5290853B2 (en) * 2009-04-28 2013-09-18 三菱樹脂株式会社 Dicing adhesive sheet
JP5554118B2 (en) * 2010-03-31 2014-07-23 古河電気工業株式会社 Wafer processing tape
JP2012174945A (en) 2011-02-23 2012-09-10 Furukawa Electric Co Ltd:The Processing method of semiconductor wafer
JP5801584B2 (en) 2011-03-29 2015-10-28 リンテック株式会社 Dicing tape and chip-shaped part manufacturing method
JP5764519B2 (en) * 2011-03-31 2015-08-19 古河電気工業株式会社 Dicing tape and semiconductor wafer processing method
JP5184685B1 (en) * 2011-09-26 2013-04-17 古河電気工業株式会社 Semiconductor wafer processing tape
JP5294358B2 (en) * 2012-01-06 2013-09-18 古河電気工業株式会社 Wafer processing tape and semiconductor device manufacturing method using the same
JP6295135B2 (en) 2014-04-24 2018-03-14 日東電工株式会社 Dicing die bond film
TWI699420B (en) * 2015-03-24 2020-07-21 日商古河電氣工業股份有限公司 Tape for semiconductor processing
JP6632115B2 (en) * 2015-07-17 2020-01-15 藤森工業株式会社 Adhesive resin layer and adhesive resin film
JP2017147293A (en) 2016-02-16 2017-08-24 日立化成株式会社 Method for manufacturing semiconductor device by use of adhesive sheet and dicing tape
JP2018166148A (en) * 2017-03-28 2018-10-25 リンテック株式会社 Substrate film for dicing sheet and dicing sheet
MY187307A (en) * 2018-03-28 2021-09-21 Furukawa Electric Co Ltd Tape for semiconductor processing

Also Published As

Publication number Publication date
CN112368106B (en) 2022-11-01
SG11202100516XA (en) 2021-02-25
KR20210015893A (en) 2021-02-10
TWI743811B (en) 2021-10-21
JP7269096B2 (en) 2023-05-08
TW202043403A (en) 2020-12-01
WO2020240965A1 (en) 2020-12-03
JP2020194906A (en) 2020-12-03
KR102505638B1 (en) 2023-03-06
CN112368106A (en) 2021-02-12

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