MY187307A - Tape for semiconductor processing - Google Patents
Tape for semiconductor processingInfo
- Publication number
- MY187307A MY187307A MYPI2019003947A MYPI2019003947A MY187307A MY 187307 A MY187307 A MY 187307A MY PI2019003947 A MYPI2019003947 A MY PI2019003947A MY PI2019003947 A MYPI2019003947 A MY PI2019003947A MY 187307 A MY187307 A MY 187307A
- Authority
- MY
- Malaysia
- Prior art keywords
- tape
- semiconductor processing
- temporary adhesive
- measured
- value
- Prior art date
Links
Landscapes
- Adhesive Tapes (AREA)
- Dicing (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
A tape for semiconductor processing that can be caused to shrink by heating sufficiently in a short time period and can retain a kerf width is provided. A tape for semiconductor processing 10 of the invention includes a temporary adhesive tape 15 having a substrate film 11; and a temporary adhesive layer 12 formed on at least one surface side of the substrate film 11, in which regarding the temporary adhesive tape 15, the sum of the average value of the differential value of the thermal deformation rate in the MD direction per 1?C between 40?C and 80?C measured at the time of raising temperature by means of a thermomechanical characteristics testing machine, and the average value of the differential value of the thermal deformation rate in the TD direction per 1?C between 40?C and 80?C measured at the time of raising temperature by means of a thermomechanical characteristics testing machine, is a negative value.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018061062 | 2018-03-28 | ||
| PCT/JP2018/026882 WO2019187186A1 (en) | 2018-03-28 | 2018-07-18 | Tape for semiconductor processing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| MY187307A true MY187307A (en) | 2021-09-21 |
Family
ID=67023746
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| MYPI2019003947A MY187307A (en) | 2018-03-28 | 2018-07-18 | Tape for semiconductor processing |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP6535138B1 (en) |
| MY (1) | MY187307A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7269096B2 (en) * | 2019-05-29 | 2023-05-08 | 古河電気工業株式会社 | glass processing tape |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2521459B2 (en) * | 1987-02-23 | 1996-08-07 | 日東電工株式会社 | Method of manufacturing semiconductor chip |
| JP4757442B2 (en) * | 1997-02-10 | 2011-08-24 | リンテック株式会社 | Chip body adhesive sheet |
| JP2003342393A (en) * | 2002-05-30 | 2003-12-03 | Mitsubishi Polyester Film Copp | Polyester soft film for dicing tape |
| JP5554118B2 (en) * | 2010-03-31 | 2014-07-23 | 古河電気工業株式会社 | Wafer processing tape |
| JP2012174945A (en) * | 2011-02-23 | 2012-09-10 | Furukawa Electric Co Ltd:The | Processing method of semiconductor wafer |
| JP5801584B2 (en) * | 2011-03-29 | 2015-10-28 | リンテック株式会社 | Dicing tape and chip-shaped part manufacturing method |
| US10008405B2 (en) * | 2012-12-26 | 2018-06-26 | Hitachi Chemical Company, Ltd | Expansion method, method for manufacturing semiconductor device, and semiconductor device |
| CN107431002B (en) * | 2015-03-24 | 2020-09-11 | 古河电气工业株式会社 | Semiconductor processing belt |
| JP2017147293A (en) * | 2016-02-16 | 2017-08-24 | 日立化成株式会社 | Method for manufacturing semiconductor device by use of adhesive sheet and dicing tape |
-
2018
- 2018-07-18 JP JP2018538797A patent/JP6535138B1/en active Active
- 2018-07-18 MY MYPI2019003947A patent/MY187307A/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| JPWO2019187186A1 (en) | 2020-04-30 |
| JP6535138B1 (en) | 2019-06-26 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| SG11201906504SA (en) | Tape for semiconductor processing | |
| PH12016501442B1 (en) | Protective film-forming film, sheet for forming protective film, complex sheet for forming protective film, and method of producing manufactured product | |
| PH12017500284A1 (en) | Protective coating-forming sheet and method for manufacturing semiconductor chip provided with protective coating | |
| SG11201902926YA (en) | Adhesive tape for semiconductor processing, and semiconductor device manufacturing method | |
| MY192661A (en) | Semiconductor processing tape | |
| WO2018002035A3 (en) | Method of processing wafer having protrusions on the back side | |
| PH12016500961A1 (en) | Semiconductor-processing pressure-sensitive adhesive tape | |
| PH12016501335A1 (en) | Composite sheet for protective-film formation | |
| MX2017003744A (en) | Interlayer film for laminated glass, roll-shaped body, laminated glass, method for manufacturing interlayer film for laminated glass, and method for manufacturing roll-shaped body. | |
| MY192250A (en) | Tape for semiconductor processing | |
| WO2018110830A3 (en) | Window film, manufacturing method thereof, and display device including same | |
| MY187016A (en) | First protective film-forming sheet, method for forming first protective film, and method for manufacturing semiconductor chip | |
| MY190084A (en) | Rectangular glass substrate and method for preparing the same | |
| PH12018502253B1 (en) | Pressure-sensitive adhesive tape for semiconductor substrate fabrication | |
| MY183013A (en) | Sheet for semiconductor processing | |
| MY184452A (en) | Tape for electronic device packaging | |
| SG10201804761PA (en) | Dicing tape-combined adhesive sheet | |
| MY187307A (en) | Tape for semiconductor processing | |
| SG11201906507PA (en) | Tape for semiconductor processing | |
| MY187833A (en) | Tape for semiconductor processing | |
| MY187308A (en) | Tape for semiconductor processing | |
| SG11201807714QA (en) | Dicing die bonding sheet, method for producing semiconductor chip and method for manufacturing semiconductor device | |
| SG11201806881WA (en) | Protective film formation sheet, manufacturing method for protective film formation sheet, and manufacturing method for semiconductor device | |
| SG11201908493VA (en) | Pressure-sensitive adhesive tape set and pressure-sensitive adhesive tape for semiconductor element transport | |
| PH12021550126A1 (en) | Tape for glass processing |