SG10201804761PA - Dicing tape-combined adhesive sheet - Google Patents
Dicing tape-combined adhesive sheetInfo
- Publication number
- SG10201804761PA SG10201804761PA SG10201804761PA SG10201804761PA SG10201804761PA SG 10201804761P A SG10201804761P A SG 10201804761PA SG 10201804761P A SG10201804761P A SG 10201804761PA SG 10201804761P A SG10201804761P A SG 10201804761PA SG 10201804761P A SG10201804761P A SG 10201804761PA
- Authority
- SG
- Singapore
- Prior art keywords
- film
- dicing tape
- adhesion strength
- adhesive layer
- adhesive sheet
- Prior art date
Links
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Adhesive Tapes (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Physics & Mathematics (AREA)
- Dicing (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Laser Beam Processing (AREA)
Abstract
DICING TAPE-COMBINED ADHESIVE SHEET tape and a film. The dicing tape includes a radiation- curable pressure-sensitive adhesive layer defining its surface. The film is an adhesive sheet and includes a laser mark layer and an adhesive layer. In the film, the surface defined by the adhesive layer has a peel adhesion strength to a silicon wafer of 5 N/10 mm or more in a peel test under specific conditions. The first peel adhesion strength between the pressure-sensitive adhesive layer after curing and the film is 0.15 N/20 mm or less in a peel test under the conditions. The difference between a second peel adhesion strength and the first peel adhesion strength is 0.12 N/20 mm or less, where the second peel adhesion strength is determined, after storage at 50°C for 9 days, between the pressure-sensitive adhesive layer after curing and the film in a peel test under the conditions. The dicing tape-combined adhesive sheet according to the present invention is suitable for actually providing satisfactory pick-up of adhesive film-bearing semiconductor chips from the dicing tape. Fig. 1
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017123152A JP6890050B2 (en) | 2017-06-23 | 2017-06-23 | Adhesive sheet with integrated dicing tape |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG10201804761PA true SG10201804761PA (en) | 2019-01-30 |
Family
ID=64822839
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG10201804761PA SG10201804761PA (en) | 2017-06-23 | 2018-06-05 | Dicing tape-combined adhesive sheet |
| SG10201805129UA SG10201805129UA (en) | 2017-06-23 | 2018-06-14 | Dicing tape-combined adhesive sheet |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG10201805129UA SG10201805129UA (en) | 2017-06-23 | 2018-06-14 | Dicing tape-combined adhesive sheet |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP6890050B2 (en) |
| KR (1) | KR20190000828A (en) |
| CN (1) | CN109111871A (en) |
| SG (2) | SG10201804761PA (en) |
| TW (1) | TW201905135A (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2020150196A (en) * | 2019-03-15 | 2020-09-17 | 日東電工株式会社 | Dicing tape with adhesive film |
| JP7289688B2 (en) * | 2019-03-26 | 2023-06-12 | 日東電工株式会社 | Dicing tape with adhesive film |
| CN111748298B (en) * | 2019-03-26 | 2024-01-23 | 日东电工株式会社 | Transparent adhesive sheet and transparent adhesive sheet with release material |
| CN114425659A (en) * | 2020-10-29 | 2022-05-03 | 大族激光科技产业集团股份有限公司 | Laser stripping method and laser processing equipment |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5501938B2 (en) * | 2009-12-24 | 2014-05-28 | 日東電工株式会社 | Flip chip type film for semiconductor backside |
| JP5249290B2 (en) * | 2010-07-20 | 2013-07-31 | 日東電工株式会社 | Flip chip type semiconductor back film, dicing tape integrated semiconductor back film, semiconductor device manufacturing method, and flip chip type semiconductor device |
-
2017
- 2017-06-23 JP JP2017123152A patent/JP6890050B2/en active Active
-
2018
- 2018-06-05 SG SG10201804761PA patent/SG10201804761PA/en unknown
- 2018-06-14 SG SG10201805129UA patent/SG10201805129UA/en unknown
- 2018-06-21 TW TW107121268A patent/TW201905135A/en unknown
- 2018-06-21 CN CN201810642684.3A patent/CN109111871A/en active Pending
- 2018-06-22 KR KR1020180071872A patent/KR20190000828A/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| JP6890050B2 (en) | 2021-06-18 |
| TW201905135A (en) | 2019-02-01 |
| CN109111871A (en) | 2019-01-01 |
| JP2019009260A (en) | 2019-01-17 |
| SG10201805129UA (en) | 2019-01-30 |
| KR20190000828A (en) | 2019-01-03 |
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