MY192601A - Tape for electronic device packaging - Google Patents

Tape for electronic device packaging

Info

Publication number
MY192601A
MY192601A MYPI2018701080A MYPI2018701080A MY192601A MY 192601 A MY192601 A MY 192601A MY PI2018701080 A MYPI2018701080 A MY PI2018701080A MY PI2018701080 A MYPI2018701080 A MY PI2018701080A MY 192601 A MY192601 A MY 192601A
Authority
MY
Malaysia
Prior art keywords
adhesive layer
tape
electronic device
pressure
sensitive adhesive
Prior art date
Application number
MYPI2018701080A
Inventor
Masami Aoyama
Kunihiko Ishiguro
Toru Sano
Jirou Sugiyama
Original Assignee
Furukawa Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Furukawa Electric Co Ltd filed Critical Furukawa Electric Co Ltd
Publication of MY192601A publication Critical patent/MY192601A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/08—Macromolecular additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Computer Hardware Design (AREA)
  • Inorganic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Engineering & Computer Science (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Packages (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Dicing (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

Provided is a tape for electronic device packaging, which can suppress the occurrence of warpage in a laminate of a semiconductor, an adhesive layer and a semiconductor chip when the adhesive layer is preliminarily cured, and can suppress the generation of voids in the adhesive layer at the time of flip-chip connection. The tape for electronic device packaging of the invention has a pressure-sensitive adhesive tape having a base film and a pressure-sensitive adhesive layer; a metal layer provided by lamination on a surface of the pressure-sensitive adhesive layer, the surface being on the opposite side of the base film; and an adhesive layer provided on a surface of the metal layer, the surface being on the opposite side of the pressure-sensitive adhesive layer, and intended for adhering the metal layer to the back surface of an electronic device, in which the adhesive layer has a storage modulus at 100?C of 10 GPa or less after being heated for 3 hours at 100?C, and has a curing rate of 10% to 100% when heated for 3 hours at 100?C.(Fig. 1)
MYPI2018701080A 2016-03-31 2016-11-14 Tape for electronic device packaging MY192601A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016072255 2016-03-31
PCT/JP2016/083696 WO2017168820A1 (en) 2016-03-31 2016-11-14 Electronic device package tape

Publications (1)

Publication Number Publication Date
MY192601A true MY192601A (en) 2022-08-29

Family

ID=59963849

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2018701080A MY192601A (en) 2016-03-31 2016-11-14 Tape for electronic device packaging

Country Status (7)

Country Link
JP (1) JP6775005B2 (en)
KR (1) KR102056178B1 (en)
CN (1) CN108076669B (en)
MY (1) MY192601A (en)
SG (1) SG11201802282VA (en)
TW (1) TWI643930B (en)
WO (1) WO2017168820A1 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI799557B (en) * 2018-03-28 2023-04-21 日商琳得科股份有限公司 Resin composition, sealing sheet and sealing body
TWI713880B (en) * 2018-08-17 2020-12-21 美屬薩摩亞商茂邦電子有限公司 Chip packaging structure with six-sided protective layer and manufacturing method thereof
WO2020251307A1 (en) * 2019-06-13 2020-12-17 주식회사 엘지화학 Non-conductive film and preparation method for semiconductor laminate
JP2021161274A (en) * 2020-03-31 2021-10-11 株式会社有沢製作所 Adhesive tape
CN113352772B (en) * 2020-06-24 2022-04-08 山东华菱电子股份有限公司 Thermal print head and method of manufacturing the same
CN115461423A (en) * 2020-07-30 2022-12-09 古河电气工业株式会社 Composition for adhesive, film-like adhesive, semiconductor package using film-like adhesive, and method for manufacturing semiconductor package
CN113897163B (en) * 2021-12-09 2022-03-11 武汉市三选科技有限公司 Adhesive, chip bonding film and preparation method thereof

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS599007B2 (en) 1977-07-12 1984-02-28 パロマ工業株式会社 Liquid fuel combustion equipment
JPS5487847A (en) 1977-12-26 1979-07-12 Nissin Electric Co Ltd Oil impregnated capacitor
JP2007235022A (en) 2006-03-03 2007-09-13 Mitsui Chemicals Inc Adhesive film
JP5286084B2 (en) * 2006-07-19 2013-09-11 積水化学工業株式会社 Dicing die bonding tape and semiconductor chip manufacturing method
JP5503342B2 (en) * 2010-03-10 2014-05-28 古河電気工業株式会社 Dicing die bonding tape
JP5528936B2 (en) * 2010-07-28 2014-06-25 日東電工株式会社 Flip chip type film for semiconductor backside
JP5419226B2 (en) * 2010-07-29 2014-02-19 日東電工株式会社 Flip chip type film for semiconductor back surface and use thereof
JP2013030500A (en) * 2011-07-26 2013-02-07 Nitto Denko Corp Adhesive sheet for manufacturing semiconductor device, adhesive sheet for manufacturing semiconductor device integrated with dicing film, and semiconductor device containing adhesive sheet for manufacturing semiconductor device
KR20130075188A (en) * 2011-12-27 2013-07-05 제일모직주식회사 Adhesive composition for semiconductor, adhesive film comprising the same
SG11201406941TA (en) * 2012-04-26 2014-11-27 Furukawa Electric Co Ltd Film adhesive composition, method for producing the same, film adhesive, semiconductor package using the film adhesive, and method for manufacturing the semiconductor package
JP6722584B2 (en) * 2014-06-11 2020-07-15 日本化薬株式会社 Ultraviolet curable resin composition for touch panel, bonding method and article using the same

Also Published As

Publication number Publication date
SG11201802282VA (en) 2018-04-27
JP6775005B2 (en) 2020-10-28
KR20180067522A (en) 2018-06-20
CN108076669A (en) 2018-05-25
TWI643930B (en) 2018-12-11
KR102056178B1 (en) 2019-12-16
WO2017168820A1 (en) 2017-10-05
JPWO2017168820A1 (en) 2019-02-14
TW201739871A (en) 2017-11-16
CN108076669B (en) 2021-01-15

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