TWI799557B - Resin composition, sealing sheet and sealing body - Google Patents

Resin composition, sealing sheet and sealing body Download PDF

Info

Publication number
TWI799557B
TWI799557B TW108110666A TW108110666A TWI799557B TW I799557 B TWI799557 B TW I799557B TW 108110666 A TW108110666 A TW 108110666A TW 108110666 A TW108110666 A TW 108110666A TW I799557 B TWI799557 B TW I799557B
Authority
TW
Taiwan
Prior art keywords
sealing
resin composition
sheet
sealing body
sealing sheet
Prior art date
Application number
TW108110666A
Other languages
Chinese (zh)
Other versions
TW201942236A (en
Inventor
前谷枝保
西嶋健太
樫尾幹広
Original Assignee
日商琳得科股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商琳得科股份有限公司 filed Critical 日商琳得科股份有限公司
Publication of TW201942236A publication Critical patent/TW201942236A/en
Application granted granted Critical
Publication of TWI799557B publication Critical patent/TWI799557B/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/15—Heterocyclic compounds having oxygen in the ring
    • C08K5/151—Heterocyclic compounds having oxygen in the ring having one oxygen atom in the ring
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/15—Heterocyclic compounds having oxygen in the ring
    • C08K5/151—Heterocyclic compounds having oxygen in the ring having one oxygen atom in the ring
    • C08K5/1515—Three-membered rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
    • C08L23/26—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers modified by chemical after-treatment
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
    • C09J123/26—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers modified by chemical after-treatment
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/10—Adhesives in the form of films or foils without carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/24—Plastics; Metallised plastics based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/255—Polyesters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/35—Heat-activated
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/40—Adhesives in the form of films or foils characterised by release liners
    • C09J7/405—Adhesives in the form of films or foils characterised by release liners characterised by the substrate of the release liner
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H05B33/04—Sealing arrangements, e.g. against humidity
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
TW108110666A 2018-03-28 2019-03-27 Resin composition, sealing sheet and sealing body TWI799557B (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2018-061660 2018-03-28
JP2018061660 2018-03-28
JP2018128365 2018-07-05
JP2018-128365 2018-07-05

Publications (2)

Publication Number Publication Date
TW201942236A TW201942236A (en) 2019-11-01
TWI799557B true TWI799557B (en) 2023-04-21

Family

ID=68060182

Family Applications (3)

Application Number Title Priority Date Filing Date
TW108110666A TWI799557B (en) 2018-03-28 2019-03-27 Resin composition, sealing sheet and sealing body
TW108110908A TWI801542B (en) 2018-03-28 2019-03-28 Electronic device sealing body, sheet adhesive, adhesive film for electronic device sealing, and method for manufacturing electronic device sealing body
TW108110910A TWI820103B (en) 2018-03-28 2019-03-28 Resin composition, sealing sheet and sealing body

Family Applications After (2)

Application Number Title Priority Date Filing Date
TW108110908A TWI801542B (en) 2018-03-28 2019-03-28 Electronic device sealing body, sheet adhesive, adhesive film for electronic device sealing, and method for manufacturing electronic device sealing body
TW108110910A TWI820103B (en) 2018-03-28 2019-03-28 Resin composition, sealing sheet and sealing body

Country Status (5)

Country Link
JP (3) JP7348165B2 (en)
KR (3) KR20200136368A (en)
CN (3) CN111955053B (en)
TW (3) TWI799557B (en)
WO (3) WO2019189618A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7368202B2 (en) * 2019-11-29 2023-10-24 リンテック株式会社 Sealing sheet
JP2021102737A (en) * 2019-12-25 2021-07-15 日東電工株式会社 Sealing method
JPWO2023054449A1 (en) * 2021-09-28 2023-04-06

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11140414A (en) * 1997-11-10 1999-05-25 Sekisui Chem Co Ltd Reactive hot-melt adhesive composition and bonding
JP2003238885A (en) * 2002-02-18 2003-08-27 Nippon Paper Industries Co Ltd Ultraviolet-curing coating composition and molded product
CN102161793A (en) * 2011-03-07 2011-08-24 黑龙江省润特科技有限公司 Ultraviolet deep-crosslinked expansion flame-retardant polyolefine cable material, and preparation method of insulating or jacket layer thereof
WO2018047868A1 (en) * 2016-09-07 2018-03-15 リンテック株式会社 Adhesive composition, sealing sheet, and sealed body

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002294196A (en) * 2001-03-30 2002-10-09 Three M Innovative Properties Co Thermosetting adhesive
TW200402456A (en) * 2002-06-17 2004-02-16 Sekisui Chemical Co Ltd Adhesive, tape and a double side adhensive tape for sealing organic electroluminescent element; an organic electroluminescent element and method thereof
JP5000238B2 (en) * 2006-09-01 2012-08-15 株式会社ダイセル Active energy ray-curable sealant and optical semiconductor device using the sealant
CN101816026A (en) 2007-10-22 2010-08-25 夏普株式会社 Display device and method for production thereof
CN102396113B (en) * 2009-04-28 2014-09-24 日立化成株式会社 Circuit connecting material, film-like circuit connecting material using the circuit connecting material, structure for connecting circuit member, and method for connecting circuit member
JP5284880B2 (en) * 2009-06-10 2013-09-11 株式会社カネカ Photocurable composition and insulating thin film and thin film transistor using the same
KR101688057B1 (en) 2010-08-09 2016-12-21 삼성디스플레이 주식회사 Visible ray sensor and light sensor comprising the same
US20130177719A1 (en) * 2010-10-01 2013-07-11 Basf Se Adhesive composition, coating composition, and primer, inkjet ink, adhesion method and laminate using the same composition
JP5651421B2 (en) * 2010-10-07 2015-01-14 三井化学株式会社 Sealing composition and sealing sheet using the same
CN102153802B (en) * 2011-03-07 2013-03-27 沭阳优唯新材料有限公司 Ultraviolet-light deeply cross-linked halogen-free flame-retardant polyolefin cable material and method for preparing ultraviolet-light deeply cross-linked halogen-free flame-retardant polyolefin cable insulating or sheathing layer from same
DE102012202377A1 (en) 2011-10-21 2013-04-25 Tesa Se Adhesive, in particular for encapsulating an electronic device
KR20130106507A (en) * 2012-03-20 2013-09-30 삼성디스플레이 주식회사 Sealing composition and method for manufacturing display panel using the same
US9296925B2 (en) * 2012-08-02 2016-03-29 Lintec Corporation Film-like adhesive, adhesive sheet for semiconductor junction, and method for producing semiconductor device
KR101740186B1 (en) * 2015-03-24 2017-05-25 주식회사 엘지화학 Adhesive composition
JP2017031383A (en) 2015-08-06 2017-02-09 Jsr株式会社 Resin composition for sealing organic electronic device element
TWI751989B (en) * 2015-12-01 2022-01-11 日商琳得科股份有限公司 Adhesive composition, sealing plate and sealing body
TWI729034B (en) * 2015-12-01 2021-06-01 日商琳得科股份有限公司 Adhesive composition, sealing plate and sealing body
KR102556848B1 (en) 2016-02-11 2023-07-18 삼성디스플레이 주식회사 Display device
WO2017168820A1 (en) * 2016-03-31 2017-10-05 古河電気工業株式会社 Electronic device package tape
KR102272537B1 (en) * 2016-09-07 2021-07-02 린텍 가부시키가이샤 Adhesive composition, encapsulation sheet, and encapsulant
KR102047291B1 (en) 2016-09-23 2019-11-21 주식회사 엘지화학 Adhesive composition

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11140414A (en) * 1997-11-10 1999-05-25 Sekisui Chem Co Ltd Reactive hot-melt adhesive composition and bonding
JP2003238885A (en) * 2002-02-18 2003-08-27 Nippon Paper Industries Co Ltd Ultraviolet-curing coating composition and molded product
CN102161793A (en) * 2011-03-07 2011-08-24 黑龙江省润特科技有限公司 Ultraviolet deep-crosslinked expansion flame-retardant polyolefine cable material, and preparation method of insulating or jacket layer thereof
WO2018047868A1 (en) * 2016-09-07 2018-03-15 リンテック株式会社 Adhesive composition, sealing sheet, and sealed body

Also Published As

Publication number Publication date
CN112088185B (en) 2023-09-26
KR102582788B1 (en) 2023-09-25
KR20200138711A (en) 2020-12-10
TWI820103B (en) 2023-11-01
JP7368348B2 (en) 2023-10-24
TW201942304A (en) 2019-11-01
JP7319964B2 (en) 2023-08-02
CN112088185A (en) 2020-12-15
JP7348165B2 (en) 2023-09-20
CN111955053A (en) 2020-11-17
WO2019189616A1 (en) 2019-10-03
TWI801542B (en) 2023-05-11
CN112041389A (en) 2020-12-04
JPWO2019189617A1 (en) 2021-04-22
WO2019189617A1 (en) 2019-10-03
CN111955053B (en) 2023-09-29
WO2019189618A1 (en) 2019-10-03
JPWO2019189616A1 (en) 2021-04-08
KR20200138172A (en) 2020-12-09
TW202003773A (en) 2020-01-16
JPWO2019189618A1 (en) 2021-05-13
TW201942236A (en) 2019-11-01
KR20200136368A (en) 2020-12-07

Similar Documents

Publication Publication Date Title
IL276950A (en) Anti-cd73 antibodies and uses thereof
IL282968A (en) Anti-nkg2a antibodies and uses thereof
EP3511386A4 (en) Adhesive composition, sealing sheet, and sealed body
IL278877A (en) Amino-pyrazinecarboxamide compounds, conjugates, and uses thereof
SG11202105885WA (en) Anti-claudin antibodies and uses thereof
IL275826A (en) Anti-mct1 antibodies and uses thereof
IL281297A (en) Anti-npr1 antibodies and uses thereof
SG11202009772PA (en) Anti-dll3 antibodies and uses thereof
EP3604423A4 (en) Thermoplastic elastomer composition and use thereof
SG11202009625WA (en) Anti-trem-1 antibodies and uses thereof
TWI799557B (en) Resin composition, sealing sheet and sealing body
IL280321A (en) Anti-cxcr2 antibodies and uses thereof
IL277330A (en) Anti-il-27 antibodies and uses thereof
IL283875A (en) Anti-il-27 antibodies and uses thereof
IL277075A (en) Anti-phf-tau antibodies and uses thereof
IL276548A (en) Bcma-binding antibodies and uses thereof
TWI800608B (en) Laminated body and its manufacturing method, molded body and its manufacturing method
IL283926A (en) Anti-alpha-synuclein antibodies and uses thereof
IL281202A (en) Anti-tnfrsf9 antibodies and uses thereof
IL283890A (en) Anti-periostin antibodies and uses thereof
SG11202105849PA (en) Dicyclopentadiene-based resin, dicyclopentadiene-based hydrogenated resin, and adhesive resin composition comprising same
SG11202010601VA (en) Antibody variant combinations and uses thereof
EP3660105A4 (en) Gas-barrier resin composition and use thereof
EP3604429A4 (en) Resin composition, fluorine-containing film, fluorine-containing laminated film and laminated molded body
TWI799645B (en) Resin composition, resin film and stack