CN111955053B - Electronic device sealing body, sheet-like adhesive, and adhesive film for sealing electronic device - Google Patents

Electronic device sealing body, sheet-like adhesive, and adhesive film for sealing electronic device Download PDF

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Publication number
CN111955053B
CN111955053B CN201980023189.7A CN201980023189A CN111955053B CN 111955053 B CN111955053 B CN 111955053B CN 201980023189 A CN201980023189 A CN 201980023189A CN 111955053 B CN111955053 B CN 111955053B
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Prior art keywords
adhesive
sheet
electronic device
film
sealing
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CN201980023189.7A
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CN111955053A (en
Inventor
长谷川树
西嶋健太
前谷枝保
樫尾干広
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Lintec Corp
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Lintec Corp
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/15—Heterocyclic compounds having oxygen in the ring
    • C08K5/151—Heterocyclic compounds having oxygen in the ring having one oxygen atom in the ring
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/15—Heterocyclic compounds having oxygen in the ring
    • C08K5/151—Heterocyclic compounds having oxygen in the ring having one oxygen atom in the ring
    • C08K5/1515—Three-membered rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
    • C08L23/26—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers modified by chemical after-treatment
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
    • C09J123/26—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers modified by chemical after-treatment
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/10—Adhesives in the form of films or foils without carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/24—Plastics; Metallised plastics based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/255—Polyesters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/35—Heat-activated
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/40—Adhesives in the form of films or foils characterised by release liners
    • C09J7/405—Adhesives in the form of films or foils characterised by release liners characterised by the substrate of the release liner
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H05B33/04—Sealing arrangements, e.g. against humidity
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy

Abstract

The present invention relates to an electronic device sealing body having an electronic device and an adhesive cured product layer for sealing between an ultraviolet-impermeable functional film and the electronic device, a sheet-like adhesive for forming the adhesive cured product layer, an adhesive film for sealing an electronic device having an adhesive layer containing the functional film and the sheet-like adhesive, and a method for manufacturing the electronic device sealing body.

Description

Electronic device sealing body, sheet-like adhesive, and adhesive film for sealing electronic device
Technical Field
The present invention relates to an electronic device sealing body having an electronic device and an adhesive cured product layer sealing between an ultraviolet-impermeable functional film and the electronic device, a sheet-like adhesive for forming the adhesive cured product layer, an adhesive film for sealing an electronic device having an adhesive layer containing the functional film and the sheet-like adhesive, and a method for manufacturing the electronic device sealing body.
Background
As a sealing adhesive for sealing electronic devices such as organic EL elements, there is a thermosetting adhesive. However, with respect to the thermosetting adhesive, if the device is cured after sealing, there is a concern that the device is damaged by heat. On the other hand, in the case of curing before attaching to an electronic device, there is a problem in that the initial pressure-sensitive adhesive property disappears.
On the other hand, if the adhesive is an active energy ray-curable adhesive such as ultraviolet rays, the damage to the electronic device such as the organic EL element is small even when the adhesive is cured after bonding to the electronic device.
Patent document 1 describes an adhesive for sealing an electronic device, which contains a compound having a cyclic ether group and a photo-cationic polymerization initiator.
Prior art literature
Patent literature
Patent document 1: japanese patent application laid-open No. 2014-534309 (International publication No. 2013/057265).
Disclosure of Invention
Problems to be solved by the invention
Patent document 1 describes that "the pressure-sensitive adhesive is preferably partially or finally crosslinked after application to an electronic device" [ paragraph (0066) ]. The cationic UV curing for such crosslinking is carried out, for example, in a state in which an adhesive for sealing is carried on an ultraviolet-transmitting material such as a PET liner or glass.
The object of the present invention is to provide an electronic device sealing body having an adhesive cured product layer for sealing between the functional film and an electronic device, a sheet-like adhesive as a material for forming the adhesive cured product layer, an adhesive film for electronic device sealing having an adhesive layer containing the functional film and the sheet-like adhesive, and a method for manufacturing the electronic device sealing body, on the premise that a member to which the adhesive for sealing is bonded is an ultraviolet-impermeable functional film.
Means for solving the problems
An adhesive containing a compound having a cyclic ether group and a photo-cationic polymerization initiator remains on the adhesive surface even after irradiation with ultraviolet rays. Therefore, the sheet-like adhesive containing such an adhesive can be attached to an electronic device even after irradiation with ultraviolet rays. The sheet-like adhesive cures with time after irradiation with ultraviolet light, and finally an electronic device sealing body having a layer structure of (ultraviolet-impermeable functional film)/(adhesive cured product layer)/(electronic device) and excellent durability can be obtained with high efficiency.
Thus, according to the present invention, there are provided the following electronic device sealing members [1] to [4], the sheet-like adhesive agent [5], the adhesive film for electronic device sealing [6] to [7], and the method for producing the electronic device sealing members [8] to [9 ].
[1] A sealing body for electronic devices, comprising a functional film having a transmittance of ultraviolet rays of 365nm of 60% or less, an electronic device, and an adhesive cured product layer for sealing between the functional film and the electronic device, wherein the adhesive cured product layer is a cured product of a sheet-like adhesive comprising a component (A) and a component (B),
(A) Compounds having cyclic ether groups
(B) A photo-cationic polymerization initiator.
[2] A sheet-like adhesive comprising the following component (A) and component (B) for producing the sealing body for electronic equipment according to claim 1,
(A) Compounds having cyclic ether groups
(B) A photo-cationic polymerization initiator.
[3] The sheet-like adhesive according to [2], wherein the sheet-like adhesive has a release film on at least one surface, and has an adhesive force to a sodium glass plate of 3N/25mm or more as measured under the following condition (i),
(i) A laminate of a polyethylene terephthalate film having a thickness of 23 μm and formed by vapor deposition of aluminum was produced on the surface of the sheet-like adhesive opposite to the side on which the release film was bonded, and the laminate was irradiated with light from the release film side in a state in which the release film was bonded: 50mW/cm 2 Light amount: 200mJ/cm 2 The laminate was irradiated with ultraviolet light having a wavelength of 365nm, and after 3 minutes, the release film was peeled from the laminate to expose the sheet-like adhesiveThe laminate was attached to glass by one round trip by a 2kg roller, and the laminate was stored at 23℃for 24 hours under an environment of 50% relative humidity, and then subjected to a 180℃peeling test.
[4] The sheet-like adhesive according to [2] or [3], which further comprises one or more selected from the group consisting of a modified polyolefin resin and a phenoxy resin.
[5] An adhesive film for sealing electronic devices, which comprises a functional film having a transmittance of 60% or less of ultraviolet rays having a wavelength of 365nm and an adhesive layer containing a sheet-like adhesive comprising the following components (A) and (B);
(A) Compounds having cyclic ether groups
(B) A photo-cationic polymerization initiator.
[6] The adhesive film for electronic device sealing according to [5], wherein the adhesive film for electronic device sealing has a release film on a surface of the adhesive layer on the side to which the functional film is not attached, and has an adhesive force to a sodium glass plate of 3N/25mm or more measured under the following condition (ii);
(ii) In a state where the release film is attached to the adhesive film for sealing an electronic device, illuminance is given from the release film side: 50mW/cm 2 Light amount: 200mJ/cm 2 After 3 minutes, the release film was peeled off from the adhesive film for electronic device sealing so that the exposed adhesive layer faced the sodium glass plate, and the adhesive film for electronic device sealing was attached to the sodium glass plate by one round trip by a 2kg roller, and was stored at 23℃for 24 hours under an environment of 50% relative humidity, and then subjected to a 180℃release test.
[7] The adhesive film for electronic device sealing according to [5] or [6], wherein the sheet-like adhesive further comprises at least one selected from the group consisting of a modified polyolefin resin and a phenoxy resin.
[8] A method for manufacturing a sealing body for an electronic device, comprising:
a step of irradiating the adhesive film for sealing an electronic device described in any one of [5] to [7] with ultraviolet light from the side of the surface of the adhesive layer closer to the functional film; and
(β1) attaching the adhesive film to an electronic device;
step (α1) is performed before step (β1).
[9] A method for manufacturing a sealing body for an electronic device, comprising:
a step of irradiating a sheet-like adhesive containing the following components (A) and (B) with ultraviolet rays; and
a step (beta 2) in which the sheet-like adhesive is attached to a functional film or an electronic device having a transmittance of 60% or less of ultraviolet light having a wavelength of 365 nm;
proceeding with the (. Alpha.2) step before the (. Beta.2) step;
(A) Compounds having cyclic ether groups
(B) A photo-cationic polymerization initiator.
ADVANTAGEOUS EFFECTS OF INVENTION
According to the present invention, even after irradiation with ultraviolet light, the functional film that is non-transparent to ultraviolet light and the electronic device that is the adherend are firmly bonded, peeling does not occur during or after attachment, and the adhesive layer is cured with time, so that a sealed body of the device having excellent durability can be finally obtained.
Drawings
Fig. 1 is a view showing an example of the electronic device sealing body of the present invention.
Fig. 2 is a schematic step diagram of a method for manufacturing an electronic device sealing body according to the present invention.
Fig. 3 is a schematic step diagram of a method for manufacturing an electronic device sealing body according to the present invention.
Detailed Description
Hereinafter, the present invention is described in detail by way of items of 2) an electronic device sealing body, 2) a sheet-like adhesive, 3) an adhesive film for electronic device sealing, and 4) a method for manufacturing an electronic device sealing body.
1) Electronic equipment sealing body
The electronic device sealing body of the present invention is characterized by comprising a functional film having a transmittance of ultraviolet rays having a wavelength of 365nm of 60% or less, an electronic device, and an adhesive cured product layer for sealing between the functional film and the electronic device, wherein the adhesive cured product layer is a cured product of a sheet-like adhesive comprising a component (A) and a component (B) (hereinafter, sometimes referred to as "sheet-like adhesive of the present invention"),
(A) Compounds having cyclic ether groups
(B) A photo-cationic polymerization initiator.
Fig. 1 shows an example of the layer structure of the electronic device sealing body of the present invention. The electronic device sealing body 10 shown in fig. 1 has the following layer structure: the electronic device 3 and the cured adhesive layer 2 are laminated so as to cover the surface of the electronic device 3, and the functional film 1 having a transmittance of 60% or less of ultraviolet light having a wavelength of 365nm is disposed on the outermost surface.
In the electronic device sealing body of the present invention, as the electronic device that is the object to be sealed, for example, an organic EL element such as an organic EL display or organic EL lighting; liquid crystal elements such as liquid crystal displays; electronic paper; solar cell elements such as organic thin film solar cells; light emitting diodes, etc.
[ functional film ]
The functional film 1 constituting the electronic device sealing body of the present invention is a film having a transmittance of 60% or less of ultraviolet rays having a wavelength of 365 nm. The transmittance of the functional film at 365nm ultraviolet rays is preferably 55% or less, more preferably 50% or less, from the viewpoint of obtaining the effect of the present invention more remarkably.
The transmittance of the functional film at 365nm ultraviolet ray can be measured by the method described in the examples.
The functional film 1 used in the present invention is not particularly limited as long as it has a transmittance of 60% or less of ultraviolet rays having a wavelength of 365nm and has an arbitrary function. Examples thereof include a conductive layer, a gas barrier film, an antireflection film, a retardation film, a viewing angle improving film, a brightness improving film, and the like having a transmittance of 60% or less of ultraviolet rays having a wavelength of 365 nm. Among these, examples of the gas barrier film include a film having a metal or an inorganic compound, and a film having a metal is preferable. Examples of the metal used include aluminum, zinc, and copper, and among these, aluminum is preferable.
The thickness of the functional film used in the present invention is not particularly limited, but is usually 5 to 200. Mu.m, preferably 10 to 100. Mu.m.
In the case of a functional film having a transmittance of 60% or less of ultraviolet rays having a wavelength of 365nm, after the sheet-like adhesive is bonded to an electronic device, even if ultraviolet rays are irradiated from the functional film side, the amount of the ultraviolet rays reaching the sheet-like adhesive is small, and the sheet-like adhesive cannot be cured.
As will be described later, the sheet-like adhesive of the present invention is cured by photo-cationic polymerization. Photo-cationic polymerization has a relatively slow reaction rate compared to radical polymerization and the like. Therefore, even after the irradiation of ultraviolet rays to the sheet-like adhesive, the sheet-like adhesive has sufficient adhesiveness for a period of time during which the curing reaction proceeds, and therefore, the sheet-like adhesive is firmly adhered to the electronic device as an adherend, and peeling at the time of adhesion or after adhesion can be prevented. In addition, the adhesive layer cures with time, and a sealing body of an electronic device excellent in durability can be finally obtained.
[ adhesive cured product layer ]
The adhesive cured product layer 2 of the electronic device sealing body of the present invention contains the cured product of the sheet-like adhesive of the present invention, and seals the electronic device, thereby realizing the function of bonding the electronic device and the functional film.
[ sheet-like adhesive agent ]
The sheet-like adhesive of the present invention is an adhesive sheet and comprises the following components (A) and (B).
(A) Compounds having cyclic ether groups
(B) A photo-cationic polymerization initiator.
The sheet-like adhesive is an adhesive molded into a sheet-like shape which exhibits non-flowability at ordinary temperature (about 25 ℃). In the present invention, the sheet-like adhesive may be in a short strip shape or in a long strip shape (tape shape).
[ (A) component: compounds having cyclic ether groups
The sheet-like adhesive of the present invention contains a compound having a cyclic ether group as the component (A).
By using a compound having a cyclic ether group, a cured product of a sheet-like adhesive excellent in curability and water vapor shielding properties can be obtained.
Examples of the cyclic ether group include an oxirane group (epoxy group), an oxetane group (oxetane group), a tetrahydrofuranyl group, and a tetrahydropyranyl group.
The compound having a cyclic ether group means a compound having at least 1 or more cyclic ether groups in the molecule. Among them, a compound having an oxirane group or an oxetane group is preferable, and a compound having 2 or more oxirane groups or oxetane groups in the molecule is particularly preferable, from the viewpoint that a cured product of an adhesive having more excellent adhesive strength can be obtained.
Examples of the compound having an oxirane group in a molecule include aliphatic epoxy compounds (excluding alicyclic epoxy compounds), aromatic epoxy compounds, alicyclic epoxy compounds, and the like.
Examples of the aliphatic epoxy compound include monofunctional epoxy compounds such as glycidyl etherate of aliphatic alcohol and glycidyl ester of alkyl carboxylic acid;
a polyfunctional epoxy compound such as a polyglycidyl ether of an aliphatic polyol or an alkylene oxide adduct, a polyglycidyl ester of an aliphatic long-chain polybasic acid, or an epoxy compound having a triazine skeleton.
Representative examples of these aliphatic epoxy compounds include allyl glycidyl ether, butyl glycidyl ether, 2-ethylhexyl glycidyl ether, C12 to 13 mixed alkyl glycidyl ether, 1, 4-butanediol diglycidyl ether, neopentyl glycol diglycidyl ether, triglycidyl ether of glycerin, triglycidyl ether of trimethylolpropane, tetraglycidyl ether of sorbitol, hexaglycidyl ether of dipentaerythritol, diglycidyl ether of polyethylene glycol, diglycidyl ether of polypropylene glycol, glycidyl ether of polyhydric alcohol such as dicyclopentadiene dimethanol diglycidyl ether, polyglycidyl etherified compounds of polyether polyol obtained by adding 1 or 2 kinds of alkylene oxides to aliphatic polyhydric alcohol such as propylene glycol, trimethylolpropane, glycerin, and diglycidyl esters of aliphatic long chain dibasic acid; monoglycidyl ethers of aliphatic higher alcohols, glycidyl esters of higher fatty acids, epoxidized soybean oil, octyl epoxystearate, butyl epoxystearate, epoxidized polybutadiene;
2,4, 6-tris (glycidoxy) -1,3, 5-triazine, and the like.
Further, as the aliphatic epoxy compound, a commercially available product can be used. Examples of the commercial products include DENACOL EX-121, DENACOL EX-171, DENACOL EX-192, DENACOL EX-211, DENACOL EX-212, DENACOL EX-313, DENACOL EX-314, DENACOL EX-321, DENACOL EX-411, DENACOL EX-421, DENACOL EX-512, DENACOL EX-521, DENACOL EX-611, DENACOL EX-612, DENACOL EX-614, DENACOL EX-622, DENACOL EX-810, DENACOL EX-811, DENACOL EX-850, DENACOL EX-851, DENACOL EX-821, DENACOL EX-861, DENACOL EX-911, DENACOL EX-941, DENACOL EX-920, DENACOL EX-931 (which is Nagase.E);
EPOLITE M-1230, EPOLITE 40E, EPOLITE 100E, EPOLITE 200E, EPOLITE 400E, EPOLITE 70P, EPOLITE 200P, EPOLITE 400P, EPOLITE 1500NP, EPOLITE 1600, EPOLITE 80MF, EPOLITE 100MF (all of which are manufactured by Kyowa chemical Co., ltd.);
ADEKA GLYCIROL ED-503, ADEKA GLYCIROL ED-503G, ADEKA GLYCIROL ED-506, ADEKA GLYCIROL ED-523T, ADEKA RESIN EP-4088S, ADEKA RESIN EP-4088L, ADEKARESIN EP-4080E (manufactured by ADEKA Co., ltd.);
TEPIC-FL, TEPIC-PAS, TEPIC-UC (the above are manufactured by Nissan chemical Co., ltd.), and the like.
Examples of the aromatic epoxy compound include polyhydric phenols having at least 1 aromatic ring such as phenol, cresol and butylphenol, and mono/polyglycidyl ethers of alkylene oxide adducts thereof.
Representative examples of the aromatic epoxy compounds include glycidyl etherate of bisphenol a, bisphenol F, or a compound obtained by further adding alkylene oxide thereto, and epoxy novolac resin;
mono/polyglycidyl ethers of aromatic compounds having 2 or more phenolic hydroxyl groups such as resorcinol, hydroquinone and catechol;
glycidyl ethers of aromatic compounds having at least 2 alcoholic hydroxyl groups, such as phenyldimethanol, phenyldiethanol and phenyldibutyl alcohol;
glycidyl esters of polybasic acid aromatic compounds having 2 or more carboxylic acids such as phthalic acid, terephthalic acid, and trimellitic acid, glycidyl esters of benzoic acid, and epoxides of styrene oxide or divinylbenzene.
Further, as the aromatic epoxy compound, commercially available ones can be used. Examples of the commercial products include DENACOL EX-146, DENACOL EX-147, DENACOL EX-201, DENACOL EX-203, DENACOL EX-711, DENACOL EX-721, ON-COURT EX-1020, ON-COURT EX-1030, ON-COURT EX-1040, ON-COURT EX-1050, ON-COURT EX-1051, ON-COURT EX-1010, ON-COURT EX-1011, ON-COURT 1012 (the above is made by Nagase ChemteX Co.);
OGSOL PG-100, OGSOL EG-200, OGSOL EG-210, OGSOL EG-250 (manufactured by Ltd. Above as Osaka Gas Chemical Co.);
HP4032 and HP4032D, HP4700 (the above are manufactured by DIC Co.);
ESN-475V (above is made by Nissan gold chemical Co., ltd.);
JER (original EPICOAT) YX8800 (Mitsubishi chemical corporation);
MAPROOF G-0105SA, MAPROOFG-0130 SP (manufactured by Nitro Co., ltd.);
EPICRONN-665 and EPICRONHP-7200 (the above are manufactured by DIC Co.);
EOCN-1020, EOCN-102S, EOCN-103S, EOCN-104S, XD-1000, NC-3000, EPPN-501H, EPPN-501HY, EPPN-502H, NC-7000L (manufactured by Japanese chemical Co., ltd.);
ADEKA RESIN EP-4000, ADEKA RESIN EP-4005, ADEKA RESIN EP-4100, ADEKA RESIN EP-4901 (made by ADEKA Co., ltd.);
TECHMORE VG-3101L (manufactured by Printec Co., ltd.).
Examples of the alicyclic epoxy compound include polyglycidyl ethers of polyhydric alcohols having at least 1 alicyclic structure, and cyclohexene oxide-and cyclopentene oxide-containing compounds obtained by epoxidizing a cyclohexene and cyclopentene ring-containing compound with an oxidizing agent.
Representative examples of these alicyclic epoxy compounds include hydrogenated bisphenol A diglycidyl ether, 3, 4-epoxycyclohexylmethyl-3, 4-epoxycyclohexane carboxylate, 3, 4-epoxy-1-methylcyclohexyl-3, 4-epoxy-1-methylhexane carboxylate, 6-methyl-3, 4-epoxycyclohexylmethyl-6-methyl-3, 4-epoxycyclohexane carboxylate, 3, 4-epoxy-3-methylcyclohexylmethyl-3, 4-epoxy-3-methylcyclohexane carboxylate, 3, 4-epoxy-5-methylcyclohexylmethyl-3, 4-epoxy-5-methylcyclohexane carboxylate, adipic acid bis (3, 4-epoxycyclohexylmethyl) ester, 3, 4-epoxy-6-methylcyclohexane carboxylate, methylenebis (3, 4-epoxycyclohexane), propane-2, 2-diyl-bis (3, 4-epoxycyclohexane), 2-bis (3, 4-epoxycyclohexyl) propane, dicyclopentadiene di-3-epoxycyclohexane epoxide, ethylene-3, 4-epoxycyclohexane, 2-epoxycyclohexane, and 2-epoxycyclohexane phthalate Limonene dioxide, and the like.
Further, as the alicyclic epoxy compound, a commercially available product can be used. Examples of commercially available products include YX8000 (manufactured by Mitsubishi Chemical Corporation), CELOXIDE 2021P, CELOXIDE 2081, CELOXIDE 2000, and CELOXIDE 3000 (manufactured by Daicel Co., ltd.).
Examples of the compound having an oxetanyl group in the molecule include difunctional aliphatic oxetane compounds such as 3, 7-bis (3-oxetanyl) -5-oxa-nonane, 1, 4-bis [ (3-ethyl-3-oxetanylmethoxy) methyl ] benzene, 1, 2-bis [ (3-ethyl-3-oxetanylmethoxy) methyl ] ethane, 1, 3-bis [ (3-ethyl-3-oxetanylmethoxy) methyl ] propane, ethylene glycol bis (3-ethyl-3-oxetanylmethyl) ether, triethylene glycol bis (3-ethyl-3-oxetanylmethyl) ether, tetraethylene glycol bis (3-ethyl-3-oxetanylmethyl) ether, 1, 4-bis (3-ethyl-3-oxetanylmethoxy) butane, 1, 6-bis (3-ethyl-3-oxetanylmethoxy) hexane, 3-ethyl-3- [ (phenoxy) methyl ] oxetane, 3-ethyl-3- (3-ethyl-3-oxetanylmethyl) ether, and 3-hydroxyethyl-3- (3-oxetanylmethyl) ether, and monofunctional oxetane compounds such as 3-ethyl-3- (chloromethyl) oxetane.
As the compound having an oxetanyl group in the molecule, a commercially available product can also be used. Examples of the commercial products include 2-hydroxyethyl vinyl ether, diethylene glycol monovinyl ether, and 4-hydroxybutyl vinyl ether (the above are manufactured by Wash petrochemicals Co., ltd.);
ARON OXETANE OXT-121, OXT-221, EXOH, POX, OXA, OXT-101, OXT-211, OXT-212 (manufactured by east Asia Synthesis Co., ltd.);
ETERNACOLL OXBP, OXTP (the above is manufactured by the company of encyclopedia of the usa) and the like.
Among these, a compound that is liquid at 25 ℃ is preferable from the viewpoint of obtaining an adhesive having more excellent sheet processability (film forming property) and a cured product of the adhesive having more excellent adhesive strength. Further, the cyclic ether group is preferably an ethylene oxide group. Among the compounds (epoxy compounds) in which the cyclic ether group is an oxirane group, alicyclic epoxy compounds are preferable from the viewpoint of adjusting the properties of the cured product of the adhesive and preventing coloration, and oxidized cycloolefin compounds are preferable from the viewpoint of improving the reactivity of photo-cationic polymerization.
Further, a compound having 2 or more cyclic ether groups in the molecule such as a polyfunctional epoxy compound or a difunctional aliphatic oxetane compound is preferable from the viewpoint of improving the curability of the sheet-like adhesive.
The molecular weight of the compound having a cyclic ether group is usually 100 to 5,000, preferably 200 to 4,000.
The cyclic ether equivalent of the compound having a cyclic ether group is preferably 100g/eq or more and 500g/eq or less, more preferably 115g/eq or more and 300g/eq or less.
When the cyclic ether equivalent of the compound having a cyclic ether group contained in the sheet-like adhesive falls within the above range, a sealing material having high adhesive strength and excellent curability can be efficiently obtained.
These compounds having a cyclic ether group may be used singly or in combination of 1 or more than 2.
The cyclic ether equivalent in the present invention means a value obtained by dividing the molecular weight by the number of cyclic ethers.
When the sheet-like adhesive of the present invention contains an adhesive resin described later, the content of the compound having a cyclic ether group is preferably 20 to 180 parts by mass, more preferably 40 to 140 parts by mass, relative to 100 parts by mass of the adhesive resin.
By setting the content of the compound having a cyclic ether group to the above range, a cured product of the adhesive layer having more excellent adhesive strength can be easily obtained.
The content of the component (a) in the sheet-like adhesive of the present invention is preferably 20 to 80% by mass, more preferably 25 to 70% by mass, and particularly preferably 30 to 65% by mass, based on the solid content (non-volatile component, including liquid component; hereinafter the same) of the entire adhesive.
When the content of the component (a) in the sheet-like adhesive of the present invention falls within the above range, the adhesive force of the sheet-like adhesive after ultraviolet irradiation can be easily adjusted.
[ (B) component: photo cationic polymerization initiator ]
The sheet-like adhesive of the present invention contains a photo-cationic polymerization initiator as the component (B). This facilitates adjustment of the adhesive force of the sheet-like adhesive after ultraviolet irradiation.
The photo-cationic polymerization initiator is a compound that initiates a curing reaction of a cationically curable compound by generating a cationic species by irradiation with an active energy ray, and includes a cationic portion that absorbs the active energy ray and an anionic portion that becomes a source of generation of an acid.
Examples of the photo-cation polymerization initiator include sulfonium salt compounds, iodonium salt compounds, phosphonium salt compounds, ammonium salt compounds, antimonate compounds, diazonium salt compounds, selenium salt compounds, oxonium salt compounds, and bromine salt compounds. Among these, the sulfonium salt compound is preferable, and the aromatic sulfonium salt compound having an aromatic group is more preferable, from the viewpoints of excellent compatibility with the component (a) and excellent storage stability of the obtained adhesive.
As the sulfonium salt-based compound, a catalyst, examples thereof include triphenylsulfonium hexafluorophosphate, triphenylsulfonium hexafluoroantimonate, triphenylsulfonium tetrakis (pentafluorophenyl) borate, 4 '-bis [ diphenylsulfonium ] diphenylsulfide-bis hexafluorophosphate, 4' -bis [ bis (. Beta. -hydroxyethoxy) phenylsulfonium ] diphenylsulfide-bis hexafluoroantimonate, 7- [ bis (p-toluoyl) sulfonium ] -2-isopropylthioxanthone hexafluorophosphate, 7- [ bis (p-toluoyl) sulfonium ] -2-isopropylthioxanthone hexafluoroantimonate, 7- [ bis (p-toluoyl) sulfonium ] -2-isopropyltetrakis (pentafluorophenyl) borate, phenylcarbonyl-4 '-diphenylsulfonium-diphenylsulfide-hexafluorophosphate, phenylcarbonyl-4' -diphenylsulfonium-diphenylsulfide-hexafluoroantimonate, 4-t-butylphenylcarbonyl-4 '-diphenylsulfonium-diphenylsulfide-hexafluoroantimonate, 4-t-butylphenylsulfonium-4' -diphenylsulfonium-bis- (p-toluoyl) sulfide-hexafluoroantimonate, and 4-diphenylsulfonium-hexafluoroantimonate, halides of thienyl diphenyl sulfonium hexafluoroantimonate, 4',4 "-tris (. Beta. -hydroxyethoxyphenyl) sulfonium hexafluoroantimonate, 4' -bis [ diphenyl sulfonium ] diphenyl sulfide-bis hexafluoroantimonate, diphenyl [4- (phenylthio) phenyl ] sulfonium trifluorotris (pentafluoroethyl phosphate), tris [4- (4-acetylphenylthio) phenyl ] sulfonium tris [ (trifluoromethyl) sulfonyl ] methanation, and the like.
Examples of the iodonium salt compound include diphenyliodonium tetrakis (pentafluorophenyl) borate, diphenyliodonium hexafluorophosphate, diphenyliodonium hexafluoroantimonate, bis (4-nonylphenyl) iodonium hexafluorophosphate, (triscumyl) iodonium tetrakis (pentafluorophenyl) borate, and the like.
Examples of the phosphonium salt compound include tri-n-butyl (2, 5-dihydroxyphenyl) phosphonium bromide and cetyl tributylphosphonium chloride.
Examples of the ammonium salt compound include benzyltrimethylammonium chloride, phenyltributylammonium chloride, and benzyltrimethylammonium bromide.
Examples of the antimonate compound include triphenylsulfonium hexafluoroantimonate, p- (phenylthio) phenyldiphenylsulfonium hexafluoroantimonate, 4-chlorophenyl diphenylsulfonium hexafluoroantimonate, bis [4- (diphenylsulfonium) phenyl ] sulfide bis hexafluoroantimonate, and diallyl iodonium hexafluoroantimonate.
These photo cation polymerization initiators may be used singly or in combination of 1 or more than 2.
Further, as the photo cation polymerization initiator, commercially available ones can be used. Examples of commercial products include CYRACURE UVI-6970, CYRACURE UVI-6974, CYRACURE UVI-6990, CYRACURE UVI-950 (manufactured by Daicel Co., ltd.), IRGACURE 250, IRGACURE 261, IRGACURE 264 (manufactured by Inc. Ciba Specialty Chemicals, inc.), SP-150, SP-151, SP-170, OPTOMER SP-171 (manufactured by ADEKA Co., ltd.), CG-24-61 (manufactured by Ciba Specialty Chemicals, inc.), DAICAT ii (manufactured by Daicel Co., ltd.), UVAC1590, UVAC1591 (manufactured by Daicel Cytec, inc.), inc. of Inc.), CI-2064, CI-2639, CI-2624, CI-2481, CI-2734, CI-2855, CI-2823, CI-2758, CIT-1682 (manufactured by Nippon Caddy Co., ltd.), PI-2074 (manufactured by Rhodia Co., ltd.), FFC509 (manufactured by 3M Co., ltd.), BBI-102, BBI-101, BBI-103, MPI-103, TPS-103, MDS-103, DTS-103, NAT-103, NDS-103 (manufactured by Midori Chemical Co., ltd.), CD-1010, CD-1011, CD-1012 (manufactured by Sartomer Co., ltd.), CPI-100P, CPI-101A, CPI-200K, CPI-310B (manufactured by San-Apro Co., ltd.).
The content of the photo-cation polymerization initiator is usually 0.1 to 10 parts by mass, preferably 0.3 to 8 parts by mass, more preferably 0.5 to 4.5 parts by mass, relative to 100 parts by mass of the component (A).
By setting the content of the photo-cation polymerization initiator to the above range, the adhesive force of the sheet-like adhesive after ultraviolet irradiation can be easily adjusted.
The sheet-like adhesive of the present invention may contain components other than the component (a) and the component (B). Examples of the components other than the component (a) and the component (B) include an adhesive resin, a tackifier, a silane coupling agent, and the like.
[ adhesive resin ]
When the sheet-like adhesive of the present invention contains an adhesive resin, excellent sheet processability (film formability) is imparted to the composition for forming the sheet-like adhesive, and the sheet-like adhesive of a desired thickness can be efficiently formed.
The binder resin is preferably 1 or 2 or more kinds selected from the group consisting of modified polyolefin resins and phenoxy resins, from the viewpoint of excellent compatibility with the component (a).
In the case of using a modified polyolefin-based resin, polyolefin as a main agent is incorporated into a cured structure while low moisture permeability can be maintained. In addition, in the case of using the phenoxy resin, the elastic modulus of the cured product of the sheet-like adhesive can be kept high, and the reliability in a high-temperature environment of the electronic device sealing body is improved, which is preferable.
When the sheet-like adhesive of the present invention contains the adhesive resin, the content thereof is preferably 30 to 80% by mass, more preferably 40 to 70% by mass, relative to the entire sheet-like adhesive.
By containing the adhesive resin in such a range, excellent sheet processability (film forming property) is imparted to the composition for forming a sheet-like adhesive, and a sheet-like adhesive of a desired thickness can be efficiently formed.
(modified polyolefin resin)
The modified polyolefin resin is a polyolefin resin having functional groups introduced therein, which is obtained by modifying a polyolefin resin as a precursor with a modifier.
The polyolefin resin refers to a polymer comprising repeating units derived from an olefin-based monomer. The polyolefin resin may be a polymer composed of only 1 or 2 or more of repeating units derived from an olefin monomer, or may be a polymer containing repeating units derived from an olefin monomer and repeating units derived from another monomer copolymerizable with the olefin monomer.
The olefin monomer is preferably an α -olefin having 2 to 8 carbon atoms, more preferably ethylene, propylene, 1-butene, isobutylene or 1-hexene, and still more preferably ethylene or propylene.
Examples of the other monomer copolymerizable with the olefin monomer include vinyl acetate, (meth) acrylate, and styrene. Here, "meth) acrylic acid" means acrylic acid or methacrylic acid (hereinafter, the same applies).
Examples of the polyolefin resin include Very Low Density Polyethylene (VLDPE), low Density Polyethylene (LDPE), medium Density Polyethylene (MDPE), high Density Polyethylene (HDPE), linear Low Density Polyethylene (LLDPE), polypropylene (PP), ethylene-propylene copolymer, olefin elastomer (TPO), ethylene-vinyl acetate copolymer (EVA), ethylene- (meth) acrylic acid copolymer, and ethylene- (meth) acrylic acid ester copolymer.
The modifier used in the modification treatment of the polyolefin resin is a compound having a functional group in the molecule.
Examples of the functional group include a carboxyl group, a carboxylic anhydride group, a carboxylic ester group, a hydroxyl group, an epoxy group, an amide group, an ammonium group, a nitrile group, an amino group, an imide group, an isocyanate group, an acetyl group, a thiol group, an ether group, a thioether group, a sulfo group, a phosphono group, a nitro group, a urethane group, an alkoxysilyl group, a silanol group, and a halogen atom. Among these, carboxyl groups, carboxylic anhydride groups, carboxylic ester groups, hydroxyl groups, ammonium groups, amino groups, imide groups, isocyanate groups, alkoxysilyl groups are preferable, carboxylic anhydride groups and alkoxysilyl groups are more preferable, and carboxylic anhydride groups are particularly preferable.
The compound having a functional group may have 2 or more functional groups in the molecule.
Examples of the modified polyolefin resin include an acid-modified polyolefin resin and a silane-modified polyolefin resin, and from the viewpoint of obtaining the more excellent effect of the present invention, the acid-modified polyolefin resin is preferable.
The acid-modified polyolefin resin is a substance obtained by graft-modifying a polyolefin resin with an acid or an acid anhydride. For example, a polyolefin resin is reacted with an unsaturated carboxylic acid or unsaturated carboxylic acid anhydride to introduce a carboxyl group or an acid anhydride group (graft modification).
Examples of the unsaturated carboxylic acid that reacts with the polyolefin resin include maleic acid, fumaric acid, itaconic acid, citraconic acid, glutaconic acid, tetrahydrophthalic acid, aconitic acid, and the like, and examples of the unsaturated carboxylic acid anhydride include maleic anhydride, itaconic anhydride, glutaconic anhydride, citraconic anhydride, aconitic anhydride, norbornene dicarboxylic anhydride, tetrahydrophthalic anhydride, and the like.
They may be used singly or in combination of 1 or more than 2.
Among these, maleic anhydride is preferable from the viewpoint of easy obtaining of an adhesive having more excellent sheet processability (film forming property) and a cured product of a sheet-like adhesive having more excellent adhesive strength.
The amount of the unsaturated carboxylic acid or unsaturated carboxylic acid anhydride to be reacted with the polyolefin resin is preferably 0.1 to 5 parts by mass, more preferably 0.2 to 3 parts by mass, and still more preferably 0.2 to 1 part by mass, relative to 100 parts by mass of the polyolefin resin. The sheet-like adhesive containing the acid-modified polyolefin resin thus obtained can easily give a cured product having more excellent adhesive strength.
As the acid-modified polyolefin resin, commercially available ones can be used. Examples of the commercial products include ADMER (registered trademark) (manufactured by mitsubishi chemical company), UNISTOR (registered trademark) (manufactured by mitsubishi chemical company), BONDYRAM (manufactured by Polyram company), orev ac (registered trademark) (manufactured by arcema company), and MODIC (registered trademark) (manufactured by mitsubishi chemical company).
The silane-modified polyolefin resin is a material obtained by graft-modifying a polyolefin resin with an unsaturated silane compound. The silane-modified polyolefin resin has a structure in which an unsaturated silane compound as a side chain is graft-copolymerized to a polyolefin resin as a main chain. For example, a silane-modified polyethylene resin and a silane-modified ethylene-vinyl acetate copolymer are exemplified, and a silane-modified polyethylene resin such as a silane-modified low density polyethylene, a silane-modified ultra-low density polyethylene, a silane-modified linear low density polyethylene is preferable.
As the unsaturated silane compound that reacts with the polyolefin resin, a vinyl silane compound is preferable. Examples of the vinylsilane compound include vinyltrimethoxysilane, vinyltriethoxysilane, vinyltripropoxysilane, vinyltriisopropoxysilane, vinyltributoxysilane, vinyltripentoxysilane, vinyltriphenoxysilane, vinyltribenzyloxy silane, vinyltrimethylene dioxysilane, vinyltriethylene dioxysilane, vinylpropionyloxy silane, vinyltriacetoxy silane, and vinyltricarboxylailane.
They may be used singly or in combination of 1 or more than 2.
The conditions for graft-polymerizing the unsaturated silane compound and the polyolefin resin as the main chain may be a known conventional method for graft polymerization.
The amount of the unsaturated silane compound to be reacted with the polyolefin resin is preferably 0.1 to 10 parts by mass, more preferably 0.3 to 7 parts by mass, and still more preferably 0.5 to 5 parts by mass, relative to 100 parts by mass of the polyolefin resin. A sheet-like adhesive containing a silane-modified polyolefin resin can easily give a cured product having more excellent adhesive strength.
As the silane-modified polyolefin-based resin, commercially available ones can be used. Examples of the commercial products include LINKLON (registered trademark) (manufactured by mitsubishi chemical company). Among these, low-density polyethylene-based LINKLON, linear low-density polyethylene-based LINKLON, ultra-low-density polyethylene-based LINKLON, and ethylene-vinyl acetate copolymer-based LINKLON can be preferably used.
The modified polyolefin resin may be used alone or in combination of 1 or more than 2.
The modified polyolefin resin preferably has a weight average molecular weight (Mw) of 10,000 ～ 300,000, more preferably 20,000 ～ 150,000.
When the weight average molecular weight (Mw) of the modified polyolefin resin falls within such a range, the composition for forming the sheet-like adhesive is excellent in film forming property and the properties thereof can be easily adjusted.
The weight average molecular weight (Mw) of the modified polyolefin resin can be determined as a standard polystyrene conversion value by Gel Permeation Chromatography (GPC) using Tetrahydrofuran (THF) as a solvent.
(phenoxy resin)
The phenoxy resin is a polymer having a main chain of an addition polymerization structure of an aromatic diol and an aromatic diglycidyl ether.
Examples of the phenoxy resin include bisphenol a-type phenoxy resin, bisphenol F-type phenoxy resin, bisphenol a-bisphenol F-type phenoxy resin, bisphenol E-type phenoxy resin, and the like, depending on the kind of the main chain skeleton.
The phenoxy resin can be obtained by reacting bisphenol or bisphenol compound with epihalohydrin such as epichlorohydrin; bisphenol or bisphenol compound and liquid epoxy resin.
As the phenoxy resin, commercially available ones can be used. The commercial products include trade names: PKHC, PKHH, PKHJ (all manufactured by Balcer chemical Co., ltd.), trade name: EPICOAT 4250, EPICOAT 1255HX30, EPICOAT 5580BPX40 (all manufactured by Japanese chemical Co., ltd.), trade name: YP-50, YP 50-S, YP-55, YP-70 (all manufactured by Tokyo Co., ltd.), trade names: JER 1256, 4250, YX6954BH30, YX7200B35, YL7290BH30 (all manufactured by Mitsubishi Chemical Corporation), and the like.
The weight average molecular weight (Mw) of the phenoxy resin is typically 10,000 ～ 200,000, preferably 20,000 ～ 100,000, more preferably 30,000 ～ 80,000. If the weight average molecular weight of the phenoxy resin is too small, the sheet-like adhesive tends to be weak in support and strong in vulnerability, and if it is too large, the melt viscosity becomes high, and a substance with poor handleability tends to be formed.
In the present specification, when the phenoxy resin has an epoxy group, the component (a) is a substance having a weight average molecular weight (Mw) of 10,000 or less: the compound having a cyclic ether group is a phenoxy resin having a weight average molecular weight (Mw) of more than 10,000.
The weight average molecular weight (Mw) of the phenoxy resin can be obtained as a standard polystyrene conversion value by Gel Permeation Chromatography (GPC) using Tetrahydrofuran (THF) as a solvent.
[ tackifier ]
The sheet-like adhesive of the present invention may contain a tackifier in addition to the above-mentioned component (a) and component (B) and, according to the desired adhesive resin. By containing the tackifier, the storage modulus of the sheet-like adhesive can be easily adjusted.
Examples of the tackifier include rosin resins such as rosin resins, rosin ester resins, rosin-modified phenolic resins, and the like; hydrogenated rosin resins obtained by hydrogenating these rosin resins;
terpene resins such as terpene resins, aromatic modified terpene resins and terpene phenol resins; hydrogenated terpene resins obtained by hydrogenating these terpene resins;
styrene resins such as α -methylstyrene homo-resin, α -methylstyrene/styrene copolymer resin, styrene monomer/aliphatic monomer copolymer resin, styrene monomer/α -methylstyrene/aliphatic monomer copolymer resin, styrene monomer homo-resin, and styrene monomer/aromatic monomer copolymer resin; hydrogenated styrene resins obtained by hydrogenating these styrene resins;
A C5-series petroleum resin obtained by copolymerizing a C5 fraction such as pentene, isoprene, piperine, and 1, 3-pentadiene produced by thermal decomposition of naphtha, and a hydrogenated petroleum resin of the C5-series petroleum resin;
and C9-based petroleum resins obtained by copolymerizing C9 fractions such as indene and vinyl toluene produced by thermal decomposition of naphtha, hydrogenated petroleum resins of the C9-based petroleum resins, and the like. Among these, a styrene-based resin is preferable, and a styrene-based monomer/aliphatic monomer copolymer resin is more preferable.
These tackifiers may be used singly or in combination of 1 or more than 2.
As the tackifier, commercially available ones can be used. Examples of commercially available products include terpene resins such as ysrest P, a series, clear (registered trademark) P series (manufactured by Yasuhara Chemical), picolite a, and C series (manufactured by picova corporation);
aliphatic petroleum resins such as the Quinton (registered trademark) A, B, R, CX series (manufactured by Zeon corporation);
styrene resins such as FTR (registered trademark) series (manufactured by mitsunobu chemical company);
alicyclic petroleum resins such as ALCONP, M series (manufactured by Kunchuan chemical Co., ltd.), ESCOREZ (registered trademark) series (manufactured by ExxonMobil Chemical Company), EASTOTAC (registered trademark) series (manufactured by Eastman Chemical Company), IMARV (registered trademark) series (manufactured by Kunzhong Co., ltd.);
ESTER resins such as FORAL series (manufactured by PINOVA), PENCEL (registered trademark) A series, ESTER GUM, SUPER ESTER, PINE CRYSTAL (registered trademark) (manufactured by Sichuan chemical industry Co., ltd.).
The weight average molecular weight (Mw) of the tackifier is preferably 100 to 10,000, more preferably 500 to 5,000, from the viewpoint of imparting excellent adhesion.
The softening point of the tackifier is preferably 50 to 160 ℃, more preferably 60 to 140 ℃, and even more preferably 70 to 130 ℃ from the viewpoint of imparting excellent adhesion.
When the sheet-like adhesive of the present invention contains a tackifier, the content thereof is preferably 1 to 200 parts by mass, more preferably 10 to 150 parts by mass, relative to 100 parts by mass of the component (a).
[ silane coupling agent ]
The sheet-like adhesive of the present invention may contain a silane coupling agent in addition to the aforementioned components (a) and (B) and, depending on the desired adhesive resin and tackifier.
By containing the silane coupling agent, a cured product of the sheet-like adhesive having more excellent adhesive strength can be easily obtained.
Examples of the silane coupling agent include silane coupling agents having a (meth) acryloyl group such as 3-methacryloxypropyl methyl dimethoxy silane, 3-methacryloxypropyl trimethoxy silane, 3-methacryloxypropyl methyl diethoxy silane, 3-methacryloxypropyl triethoxy silane, and 3-acryloxypropyl trimethoxy silane;
Silane coupling agents having a vinyl group such as vinyltrimethoxysilane, vinyltriethoxysilane, dimethoxymethylvinylsilane, diethoxymethylvinylsilane, trichlorovinylsilane, and vinyltris (2-methoxyethoxy) silane;
silane coupling agents having an epoxy group such as 2- (3, 4-epoxycyclohexyl) ethyltrimethoxysilane, 3-epoxypropoxypropyltrimethoxysilane, 3-epoxypropoxypropylmethyldiethoxysilane, and 3-epoxypropoxypropyltriethoxysilane;
silane coupling agents having a styrene group such as p-styryl trimethoxysilane and p-styryl triethoxysilane;
silane coupling agents having an amino group such as hydrochloride salts of N- (2-aminoethyl) -3-aminopropyl methyldimethoxy silane, N- (2-aminoethyl) -3-aminopropyl trimethoxy silane, N- (2-aminoethyl) -3-aminopropyl triethoxy silane, 3-aminopropyl trimethoxy silane, 3-triethoxysilyl-N- (1, 3-dimethylbutyroninyl) propylamine, N-phenyl-3-aminopropyl trimethoxy silane, N- (vinylbenzyl) -2-aminoethyl-3-aminopropyl trimethoxy silane;
Silane coupling agents having an ureido group such as 3-ureidopropyltrimethoxysilane and 3-ureidopropyltriethoxysilane;
silane coupling agents having halogen atoms such as 3-chloropropyl trimethoxysilane and 3-chloropropyl triethoxysilane;
mercapto silane coupling agents such as 3-mercaptopropyl methyl dimethoxy silane and 3-mercaptopropyl trimethoxy silane;
silane coupling agents having a thioether group, such as bis (trimethoxysilylpropyl) tetrasulfide and bis (triethoxysilylpropyl) tetrasulfide;
silane coupling agents having an isocyanate group such as 3-isocyanatopropyl trimethoxysilane and 3-isocyanatopropyl triethoxysilane;
silane coupling agents having an allyl group, such as allyl trichlorosilane, allyl triethoxysilane, and allyl trimethoxysilane; and silane coupling agents having a hydroxyl group such as 3-hydroxypropyl trimethoxysilane and 3-hydroxypropyl triethoxysilane.
These silane coupling agents may be used singly or in combination of 1 or more than 2.
When the sheet-like adhesive of the present invention contains a silane coupling agent, the content thereof is preferably 0.01 to 5 parts by mass, more preferably 0.02 to 3 parts by mass, relative to 100 parts by mass of the component (a).
When the content of the silane coupling agent is in the above range, a cured product of the sheet-like adhesive having more excellent adhesive strength can be obtained more easily.
The sheet-like adhesive of the present invention may further contain components other than the thickener and the silane coupling agent, as far as the effects of the present invention are not impaired.
Examples of the components other than the thickener and the silane coupling agent include antistatic agents, stabilizers, antioxidants, plasticizers, lubricants, and coloring pigments. These contents may be appropriately determined according to the purpose.
The sheet-like adhesive of the present invention can be formed using an adhesive composition prepared by appropriately mixing and stirring predetermined components according to a conventional method, as will be described later.
(sheet-like adhesive)
The sheet-like adhesive of the present invention preferably has a release film on at least one surface or may have release films on both surfaces from the viewpoint of protecting it from the external environment.
The sheet-like adhesive of the present invention having a release film on at least one surface thereof indicates a state before use, and when the sheet-like adhesive of the present invention is used, the release film is usually peeled off and removed. When the sheet-like adhesive has a release film on both sides, the release film having a low release force is usually removed by first peeling.
As the release film, a resin film is generally used.
Examples of the resin component of the resin film include polyimide, polyamide, polyamideimide, polyphenylene ether, polyether ketone, polyether ether ketone, polyolefin, polyester, polycarbonate, polysulfone, polyether sulfone, polyphenylene sulfide, polyarylate, an acrylic resin, a cycloolefin polymer, an aromatic polymer, and a polyurethane polymer. Among these, polyester resins are preferable, and as the resin film, polyester films are preferable. The polyester film is more preferably a polyethylene terephthalate film having excellent heat resistance and ease of handling, and having a transmittance of ultraviolet rays of up to about 80% at a wavelength of 365 nm.
Examples of the release agent include rubber-based elastomers such as silicone-based resins, olefin-based resins, isoprene-based resins, and butadiene-based resins, long-chain alkyl-based resins, alkyd-based resins, and fluorine-based resins.
The thickness of the release film is preferably 10 to 300 μm, more preferably 10 to 200 μm, and even more preferably 15 to 100 μm from the viewpoint of improving heat resistance and from the viewpoint of preventing the sheet-like adhesive from being disturbed when ultraviolet rays are transmitted through the release film. From the viewpoint of irradiating the sheet-like adhesive of the present invention with ultraviolet light having a wavelength of 365nm through the release film and easily initiating cationic polymerization, the transmittance of the release film for ultraviolet light having a wavelength of 365nm is preferably 65% or more, more preferably 70% or more. In the case where the release film is a polyethylene terephthalate film as a base material, the transmittance is significantly reduced if the wavelength of ultraviolet light is less than 330 nm.
The thickness of the sheet-like adhesive is usually 1 to 50. Mu.m, preferably 5 to 30. Mu.m. A sheet-like adhesive having a thickness within the above range is suitable for use as the sheet-like sealing material.
The thickness of the sheet-like adhesive can be measured according to JIS K7130 (1999) using a known thickness meter. The thickness of the sheet-like adhesive is a thickness obtained by removing the thickness of the release film.
The sheet-like adhesive of the present invention has an adhesive force even after irradiation with ultraviolet rays, and is firmly adhered to electronic devices and functional films, and peeling does not occur during or after attachment. Therefore, the resin composition can be suitably used as a sealing material for electronic device sealing members, particularly for electronic device sealing members having a functional film having ultraviolet-ray impermeability on the surface thereof.
In the case where the sheet-like adhesive of the present invention has a release film on at least one surface, a laminate is produced by bonding a polyethylene terephthalate film having a thickness of 23 μm, on which aluminum is deposited, to the surface opposite to the release film, and the illuminance is given from the release film side in the state where the release film is bonded: 50mW/cm 2 Light amount: 200mJ/cm 2 After the laminate is irradiated with ultraviolet light having a wavelength of 365nm for 3 minutes, the release film is peeled from the laminate, and the exposed sheet-like adhesive layer is opposed to the sodium glass plate, and is attached to the sodium glass plate by one round trip by a 2kg roller on the laminate, and the adhesive strength to the sodium glass plate after storage for 24 hours at 23 ℃ under an environment of 50% relative humidity is preferably 3N/25mm or more, more preferably 5N/25mm or more.
The adhesion to glass was measured by the method described in the examples (180 ° peel test).
(method for producing sheet-like adhesive)
The method for producing the sheet-like adhesive of the present invention is not particularly limited. For example, casting may be used.
The method for producing a sheet-like adhesive by the casting method uses a known method, and the adhesive composition is coated on the release layer surface of the release film subjected to the release treatment, and the obtained coating film is dried, thereby obtaining a sheet-like adhesive with a release film.
The adhesive composition can be prepared by mixing and stirring the component (a) and the component (B) and other components as desired by a known method.
In the case where a solvent is used in the preparation of the adhesive composition, the viscosity of the adhesive composition can be appropriately adjusted by the amount of the solvent used.
Examples of the solvent include aliphatic hydrocarbon solvents such as n-hexane and n-heptane; aromatic hydrocarbon solvents such as toluene and xylene; halogenated hydrocarbon solvents such as methylene chloride, vinyl chloride, chloroform, carbon tetrachloride, 1, 2-dichloroethane, and monochlorobenzene;
alcohol solvents such as methanol, ethanol, propanol, butanol, propylene glycol monomethyl ether, and the like; ketone solvents such as acetone, methyl ethyl ketone, 2-pentanone, isophorone, and cyclohexanone; ester solvents such as ethyl acetate and butyl acetate; cellosolve solvents such as ethyl cellosolve; ether solvents such as 1, 3-dioxolane, and the like.
These solvents may be used singly or in combination of 1 or more than 2.
The content of the solvent may be appropriately determined in consideration of coatability, film thickness, and the like.
The release film used in the production of the sheet-like adhesive functions as a support in the step of producing the sheet-like adhesive, and also functions as a release film of the sheet-like adhesive until the sheet-like adhesive is used.
Examples of the method for applying the adhesive composition include spin coating, spray coating, bar coating, doctor blade coating, roll coating, blade coating, die coating, and gravure roll coating.
As a method for drying the coating film of the adhesive composition, conventionally known drying methods such as hot air drying, hot roll drying, and infrared irradiation can be mentioned.
The conditions for drying the coating film are, for example, 80 to 150℃for 30 seconds to 5 minutes.
[ adhesive film for sealing electronic device ]
The adhesive film for sealing an electronic device comprises a functional film having a transmittance of 60% or less of ultraviolet rays having a wavelength of 365nm, and an adhesive layer containing a sheet-like adhesive containing the component (A) and the component (B).
The adhesive film for sealing electronic devices of the present invention is used for sealing electronic devices via a sheet-like adhesive.
The same substances as described above can be used for the "functional film having a transmittance of ultraviolet rays at 365nm of 60% or less" and the "sheet-like adhesive". The adhesive film for sealing an electronic device of the present invention can be obtained by bonding a functional film and a sheet-like adhesive as described below, for example.
The adhesive film for sealing an electronic device of the present invention may include at least the functional film and an adhesive layer containing a sheet-like adhesive, and may include only 1 adhesive layer, a laminate of a plurality of adhesive layers, or may include other layers in addition to the adhesive.
Examples of the other layer include a primer layer that improves adhesion at the interface between the adhesive layer and the functional film, a functional coating layer provided on the surface of the functional film having no adhesive layer, a protective film, an antistatic layer that can be formed on both surfaces of the functional film, a stress relaxation layer, and the like.
In the case where a plurality of adhesive layers are used in the adhesive film for sealing an electronic device of the present invention, each of the adhesive layers may have the same composition or may have different compositions.
The adhesive film for sealing an electronic device of the present invention preferably has a release film on the surface of the adhesive layer on the side to which the functional film is not attached, and the release film is preferably the same as that used in the sheet-like adhesive.
The thickness of the adhesive film for sealing electronic equipment of the present invention is usually 6 to 270. Mu.m. The thickness of the adhesive film for sealing an electronic device is the thickness of a member from which the release film, the protective film, and the like are removed before use.
The adhesive film for sealing an electronic device of the present invention has an adhesive force even after irradiation with ultraviolet rays, and is firmly adhered to an electronic device, and is free from peeling at the time of adhesion or after adhesion, and can be suitably used as a sealing material for a sealing body of an electronic device having a functional film impermeable to ultraviolet rays on the surface.
In the case where the release film is provided on the surface of the adhesive layer on the side to which the functional film is not attached, the adhesive film for sealing an electronic device of the present invention has an illuminance from the release film side in a state where the release film is attached to the adhesive film for sealing an electronic device: 50mW/cm 2 Light amount: 200mJ/cm 2 Conditions of (2)After the ultraviolet light having a wavelength of 365nm is irradiated for 3 minutes, the release film is peeled off from the adhesive film for sealing electronic devices, and the exposed adhesive layer is opposed to the sodium glass plate, and the adhesive film for sealing electronic devices is attached to the sodium glass plate by one round trip by a 2kg roller, and the adhesive force to the sodium glass plate after storage for 24 hours at 23 ℃ under an environment of 50% relative humidity is preferably 3N/25mm or more, more preferably 5N/25mm or more.
The adhesion to glass was measured by the method described in the examples (180 ° peel test).
[ method for manufacturing electronic device sealing body ]
The electronic device sealing body of the present invention can be manufactured, for example, as follows.
Hereinafter, description will be made with reference to the drawings.
(manufacturing method 1)
The electronic device of the present invention can be manufactured by a method having: (α1) a step of irradiating the adhesive film for sealing an electronic device of the present invention with ultraviolet light from the side of the surface of the adhesive layer that is closer to the functional film; and
(β1) attaching the adhesive film to an electronic device;
step (α1) is performed before step (β1).
More specifically, this is performed as follows.
First, as shown in fig. 2 (a), a sheet-like adhesive 2a is prepared.
In this case, the sheet-like adhesive 2a may be stored as an adhesive film with release films on both sides, in which release films are laminated on both sides.
Next, a functional film 1 having a transmittance of ultraviolet rays of 365nm or less of 60% was laminated on one surface side of the obtained sheet-like adhesive 2a, thereby obtaining a laminate 4a shown in fig. 2 (b).
When the sheet-like adhesive 2a is an adhesive film having a release film on both surfaces, the release film on one surface side is peeled off and bonded to the functional film 1. In this case, a laminate composed of layers of the functional film 1/the sheet-like adhesive/the release film was obtained.
Next, as shown in fig. 2 (c), the sheet-like adhesive is irradiated with ultraviolet light from the side of the laminate 4a opposite to the surface on which the functional film 1 is laminated, and a photo-curing reaction of the sheet-like adhesive 2a is initiated. At this time, the photo-curing reaction starts in the sheet-like adhesive, but the reaction rate of photo-cationic polymerization is slow, and thus the curing reaction does not end, and the sheet-like adhesive has a sufficient adhesive force (the sheet-like adhesive 2b in fig. 2 (c)).
In the case of using a laminate composed of layers including the functional film 1/the sheet-like adhesive/the release film, in the case where the release film is a film having ultraviolet transmittance, it is preferable to irradiate ultraviolet rays from the release film side in the case where the release film on the sheet-like adhesive is not released from the viewpoint of handling.
The term "having ultraviolet transmittance" as used herein means a property of transmitting not less than 65%, preferably not less than 70% of ultraviolet rays having a wavelength of 365nm (hereinafter the same applies).
Specific examples of the ultraviolet source include light sources such as an ultra-high pressure mercury lamp, a low pressure mercury lamp, a carbon arc lamp, a black fluorescent lamp, and a metal halide lamp. The wavelength of the irradiated ultraviolet light may be 190 to 380 nm. When the release film of the laminate composed of the layers of the functional film 1/the sheet-like adhesive/the release film having ultraviolet transmittance is not released and ultraviolet rays are irradiated from the release film side, if the release film is made of a polyethylene terephthalate film as a base material, the ultraviolet transmittance of the release film is significantly reduced in a region where the wavelength of ultraviolet rays is lower than 330 nm. Therefore, it is preferable to irradiate ultraviolet rays in a wavelength region of 330 to 380 nm.
The type, irradiation amount, irradiation time, and the like of the ultraviolet ray can be appropriately determined according to the constituent components of the irradiated sheet-like adhesive, the content of each constituent component, and the like.
The illumination intensity is preferably 20-1000 mW/cm 2 The light quantity is 50-1000 mJ/cm 2 Left and right.
The irradiation time is usually about 0.1 to 1000 seconds, preferably about 1 to 500 seconds.
Thereafter, as shown in fig. 2 (d), the sheet-like adhesive 2b in a state where the curing reaction has not been completed is bonded to the electronic device, whereby the target electronic device sealing body 10 can be obtained.
After the irradiation of ultraviolet rays, the time until the sheet-like adhesive is attached to the electronic device may be a time when the curing reaction of the sheet-like adhesive is not completed and the adhesive has sufficient adhesive strength.
The time after irradiation of ultraviolet light until bonding to an electronic device is not particularly limited, but is usually 1 minute to 5 hours, preferably 5 to 60 minutes.
After the electronic device is attached to the sheet-like adhesive 2b in a state where the curing reaction has not been completed, the photo-curing reaction proceeds in the sheet-like adhesive, and the sheet-like adhesive reaches a fully cured state (adhesive cured product layer 2) with the lapse of time.
As described above, the sheet-like adhesive of the present invention has sufficient adhesion after irradiation with ultraviolet light, if the curing reaction is not sufficiently performed, and therefore, is firmly adhered to an electronic device as an adherend, peeling at the time of adhesion or after adhesion can be prevented, and the sheet-like adhesive cures with time, so that an electronic device sealed body excellent in durability can be finally obtained.
(manufacturing method 2)
The electronic device sealing body of the present invention can be manufactured by a method comprising: a step of irradiating a sheet-like adhesive containing the following components (A) and (B) with ultraviolet rays; and
a step (beta 2) of attaching the sheet-like adhesive to a functional film or an electronic device;
step (. Alpha.2) is performed before step (. Beta.2).
The method is specifically performed as follows.
First, the sheet-like adhesive 2a is prepared. The sheet-like adhesive 2a may be stored as an adhesive film with release films on both sides, in which release films are laminated on both sides.
Next, as shown in fig. 3 (a), the sheet-like adhesive 2a is irradiated with ultraviolet rays, and a photo-curing reaction of the sheet-like adhesive 2a is initiated. In this case, it is preferable to irradiate ultraviolet rays through the release film.
When irradiated with ultraviolet rays, the photo-curing reaction starts in the sheet-like adhesive, but the photo-cationic polymerization reaction proceeds slowly, so that the curing reaction does not end, and the sheet-like adhesive has sufficient adhesive strength.
The kind of ultraviolet rays, the irradiation conditions of ultraviolet rays, and the like are the same as those described in production method 1.
Next, the functional film 1 or the electronic device 3 is bonded to one surface side of the sheet-like adhesive 2b, thereby obtaining a state shown in fig. 3 (b).
Thereafter, as shown in fig. 3 (c), the surface of the sheet-like adhesive 2b in a state where the curing reaction has not been completed, which is opposite to the surface to which the functional film 1 or the electronic device 3 is attached, is overlapped with the electronic device 3 or the functional film 1, whereby the target electronic device sealing body 10 can be obtained. That is, when the functional film 1 is bonded to one surface side of the sheet-like adhesive 2b, the electronic device 3 is bonded to the surface opposite to the surface to which the functional film 1 is bonded, whereby the electronic device sealing body 10 can be obtained. When the electronic device 3 is bonded to one surface side of the sheet-like adhesive 2b, the functional film 1 is bonded to the surface opposite to the surface to which the electronic device 31 is bonded, whereby the electronic device sealed body 10 can be obtained.
After the sheet-like adhesive 2b, which has not been cured, is bonded to the functional film 1 or the electronic device 3, the photo-curing reaction proceeds in the sheet-like adhesive layer, and the sheet-like adhesive layer reaches a fully cured state (adhesive cured product layer 2) with the lapse of time.
As described above, the sheet-like adhesive of the present invention is capable of firmly adhering to an electronic device as an adherend because the adhesive layer has sufficient adhesion after irradiation of ultraviolet rays to the adhesive layer and if the curing reaction is not sufficiently performed, and is capable of preventing peeling at the time of adhesion or after adhesion, and further capable of finally obtaining an electronic device sealing body excellent in durability by curing the adhesive layer with the lapse of time.
Examples
The present invention will be described in further detail with reference to the following examples. However, the present invention is not limited in any way to the following examples.
The parts and% in each example are mass references unless otherwise specified.
[ transmittance of ultraviolet ray having a wavelength of 365nm of a functional film ]
The transmittance of the functional film at 365nm was measured by using an ultraviolet/visible light transmittance measuring device (UV-3600, manufactured by Shimadzu corporation).
[ measurement of adhesive force of adhesive layer after ultraviolet irradiation ]
The release film was cut to a width of 25mm from the adhesive film for sealing electronic devices with release films obtained in examples and comparative examples without peeling the release film, to obtain samples. From the release film side, the film was irradiated with an illuminance of 50mW/cm at 23℃under 50% of ambient conditions 2 The cumulative light quantity is 200mJ/cm 2 Ultraviolet rays with a wavelength of 365nm are irradiated. The irradiation with ultraviolet light was performed using a eye graphics company company high-pressure mercury lamp. The light meter was manufactured by eye graphics company company as "UVPF-A1".
After 3 minutes, the release film was peeled off, and the sheet-like adhesive surface of the exposed adhesive layer was superimposed on a sodium glass plate having a thickness of 1.1mm, and a 2kg roller was reciprocated on the surface of the functional film to press the functional film. After the sealing adhesive film for electronic equipment was pressure-bonded to a sodium glass plate, the film was allowed to stand at a temperature of 23℃and a relative humidity of 50% for 24 hours, and then 180℃peeling test was performed at a peeling rate of 300 mm/min to measure the adhesive force.
In the following examples and comparative examples, the following compounds having a cyclic ether group [ (A) component ], a photo-cationic polymerization initiator [ (B) component ], an adhesive resin [ (C) component ], a tackifier and a silane coupling agent were used.
< Compound having cyclic Ether group [ (A) component ] >
(1) Compounds having cyclic ether groups (A-1)
Hydrogenated bisphenol A type epoxy resin [ Mitsubishi Chemical Corporation product, trade name: YX8000, cyclic ether equivalent: 205g/eq and liquid at 25 DEG C
(2) Compounds having cyclic ether groups (A-2)
3',4' -epoxycyclohexylmethyl 3, 4-epoxycyclohexane carboxylate [ product name of Daicel, co., ltd.: CELOXIDE 2021P, cyclic ether equivalent: 128-145 g/eq and is liquid at normal temperature (23 ℃).
< photo cation polymerization initiator [ (B) component ] >
(1) Photo cation polymerization initiator (B-1)
Triarylsulfonium salt [ San-Apro co., ltd., trade name: CPI-200K, anions: anions with hexafluorophosphate skeleton ]
(2) Photo cation polymerization initiator (B-2)
Triarylsulfonium salt [ San-Apro co., ltd., trade name: CPI-100P ].
Adhesive resin [ (C component) ] >
(1) Adhesive resin (C-1)
Acid-modified alpha-olefin polymer [ trade name of Sanjing chemical Co., ltd.: UNISTORH-200, weight average molecular weight: 52,000]
(2) Adhesive resin (C-2)
Phenoxy resin (trade name: YX7200B35, manufactured by Mitsubishi Chemical Corporation).
Example 1
50 parts by mass of a compound (A-1) having a cyclic ether group, 20 parts by mass of a compound (A-2) having a cyclic ether group, 1 part by mass of a photo-cationic polymerization initiator (B-1), 1.5 parts by mass of a photo-cationic polymerization initiator (B-2), 100 parts by mass of an acid-modified alpha-olefin polymer (A), and 0.1 part by mass of a silane coupling agent were dissolved in methyl ethyl ketone to prepare an adhesive composition having a solid content concentration of 30%.
The adhesive composition (1) was applied to a release treated surface of a silicone release treated polyethylene terephthalate film (trade name: SP-PET752150, thickness 75 μm, manufactured by Lintec Co.), and the resulting coating film was dried at 100℃for 2 minutes to form an adhesive layer having a thickness of 30. Mu.m.
An adhesive FILM for sealing electronic devices was obtained by bonding a polyethylene terephthalate FILM (trade name: METALLIDED FILM, manufactured by Mitsubishi copper-stretching Co., ltd.) on which metallic aluminum was vapor-deposited as a functional FILM to the adhesive layer, the adhesive FILM having a release FILM on the surface side where metallic aluminum was not vapor-deposited. The transmittance of the functional film at 365nm is 0%. Further, the adhesive force after ultraviolet irradiation was 12N/25mm.
Example 2
An adhesive film for sealing an electronic device was obtained in the same manner as in example 1, except that the addition amount of the photo-cationic polymerization initiator (B-2) was changed to 3.0 parts by mass without using the photo-cationic polymerization initiator (B-1). The adhesive force after ultraviolet irradiation was 4N/25mm.
Example 3
An adhesive film for sealing an electronic device was obtained in the same manner as in example 1, except that the addition amount of the photo-cationic polymerization initiator (B-2) was changed to 3.5 parts by mass without using the photo-cationic polymerization initiator (B-1). The adhesive force after ultraviolet irradiation was 1N/25mm.
Example 4
An adhesive film for sealing an electronic device was obtained in the same manner as in example 1, except that 120 parts by mass of the compound (A-2) having a cyclic ether group, 2.5 parts by mass of the photo-cationic polymerization initiator (B-2), 100 parts by mass of the adhesive resin (C-2), and 0.2 part by mass of the silane coupling agent (trade name: KBM6803, manufactured by Xinyue chemical industry Co., ltd.) were used instead of the raw material (solid component) of the adhesive composition used in example 1. The adhesive force after ultraviolet irradiation was 6N/25mm.
Description of the markers
1. Functional film
2 a/sheet-like adhesive
2 b. Curing reaction-incomplete sheet-like adhesive
2 adhesive cured product layer
3. Electronic device
4 a. Laminate
10. Electronic device seal.

Claims (7)

1. A sealing body for electronic devices, which comprises a functional film having a transmittance of ultraviolet rays of 365nm of 60% or less, an electronic device, and an adhesive cured product layer for sealing between the functional film and the electronic device, wherein the adhesive cured product layer is a cured product of a sheet-like adhesive comprising the following components (A), (B) and (C), the content of the component (A) is 20 to 80% by mass in terms of solid content relative to the entire sheet-like adhesive,
(A) Compounds having cyclic ether groups
(B) Photo cation polymerization initiator
(C) And at least one binder resin selected from modified polyolefin resins and phenoxy resins.
2. A sheet-like adhesive comprising the following components (A), (B) and (C), wherein the content of the component (A) is 20 to 80 mass% in terms of solid content relative to the whole sheet-like adhesive, and the sheet-like adhesive is used for manufacturing the sealing body of the electronic device according to claim 1;
(A) Compounds having cyclic ether groups
(B) Photo cation polymerization initiator
(C) And at least one binder resin selected from modified polyolefin resins and phenoxy resins.
3. The sheet-like adhesive according to claim 2, wherein the sheet-like adhesive has a release film on at least one surface thereof, and has an adhesive force to a sodium glass plate of 3N/25mm or more as measured under the following condition (i),
(i) A polyethylene terephthalate film having a thickness of 23 μm and formed by vapor deposition of aluminum was laminated on the surface of the sheet-like adhesive opposite to the side on which the release film was laminated, and a laminate was produced, in which the release film was laminated, from the release film side, at an illuminance: 50mW/cm 2 Light amount: 200mJ/cm 2 The laminate was irradiated with ultraviolet light having a wavelength of 365nm, after 3 minutes, the release film was peeled off from the laminate to allow the exposed sheet-like adhesive layer to face the sodium glass plate, and a 2kg roller was passed over the laminateOne round trip was performed to attach the sheet to a sodium glass plate, and after 24 hours of storage at 23℃under an atmosphere of 50% relative humidity, a 180℃peeling test was performed.
4. An adhesive film for sealing electronic devices, which comprises a functional film having a transmittance of ultraviolet rays having a wavelength of 365nm of 60% or less and an adhesive layer comprising a sheet-like adhesive, wherein the sheet-like adhesive comprises the following components (A), (B) and (C), the content of the component (A) is 20 to 80% by mass in terms of solid content relative to the whole sheet-like adhesive,
(A) Compounds having cyclic ether groups
(B) Photo cation polymerization initiator
(C) And at least one binder resin selected from modified polyolefin resins and phenoxy resins.
5. The adhesive film for electronic device sealing according to claim 4, wherein the adhesive film for electronic device sealing has a release film on a surface of the adhesive layer on the side to which the functional film is not attached, and has an adhesive force to a sodium glass plate of 3N/25mm or more as measured under the following condition (ii),
(ii) In a state where the release film is attached to the adhesive film for sealing an electronic device, illuminance is given from the release film side: 50mW/cm 2 Light amount: 200mJ/cm 2 After 3 minutes, the release film was peeled off from the adhesive film for electronic device sealing so that the exposed adhesive layer faced the sodium glass plate, and the adhesive film for electronic device sealing was attached to the sodium glass plate by one round trip by a 2kg roller, and was stored at 23℃for 24 hours under an environment of 50% relative humidity, and then subjected to a 180℃release test.
6. A method for manufacturing a sealing body for an electronic device, comprising:
(α1) a step of irradiating the adhesive film for sealing an electronic device described in claim 4 or 5 with ultraviolet light from the side of the surface of the adhesive layer that is closer to the functional film; and
(β1) attaching the adhesive film to an electronic device;
step (α1) is performed before step (β1).
7. A method for manufacturing a sealing body for an electronic device, comprising:
a step of irradiating the sheet-like adhesive containing the following components (A), (B) and (C) with ultraviolet rays in an amount of 20 to 80% by mass in terms of solid content relative to the entire sheet-like adhesive; and
a step (beta 2) in which the sheet-like adhesive is attached to a functional film or an electronic device having a transmittance of 60% or less of ultraviolet light having a wavelength of 365 nm;
proceeding with the (. Alpha.2) step before the (. Beta.2) step;
(A) Compounds having cyclic ether groups
(B) Photo cation polymerization initiator
(C) And at least one binder resin selected from modified polyolefin resins and phenoxy resins.
CN201980023189.7A 2018-03-28 2019-03-28 Electronic device sealing body, sheet-like adhesive, and adhesive film for sealing electronic device Active CN111955053B (en)

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