JPWO2023054449A1 - - Google Patents
Info
- Publication number
- JPWO2023054449A1 JPWO2023054449A1 JP2023551586A JP2023551586A JPWO2023054449A1 JP WO2023054449 A1 JPWO2023054449 A1 JP WO2023054449A1 JP 2023551586 A JP2023551586 A JP 2023551586A JP 2023551586 A JP2023551586 A JP 2023551586A JP WO2023054449 A1 JPWO2023054449 A1 JP WO2023054449A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J171/00—Adhesives based on polyethers obtained by reactions forming an ether link in the main chain; Adhesives based on derivatives of such polymers
- C09J171/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
- C09J171/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021157535 | 2021-09-28 | ||
| PCT/JP2022/036115 WO2023054449A1 (en) | 2021-09-28 | 2022-09-28 | Sheet-like curable adhesive and optical member |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023054449A1 true JPWO2023054449A1 (en) | 2023-04-06 |
| JPWO2023054449A5 JPWO2023054449A5 (en) | 2024-04-16 |
Family
ID=85782802
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023551586A Pending JPWO2023054449A1 (en) | 2021-09-28 | 2022-09-28 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JPWO2023054449A1 (en) |
| TW (1) | TW202323490A (en) |
| WO (1) | WO2023054449A1 (en) |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06166852A (en) * | 1992-10-01 | 1994-06-14 | Nitto Denko Corp | Thermosetting adhesive sheet |
| JP4363873B2 (en) * | 2003-03-25 | 2009-11-11 | ソニーケミカル＆インフォメーションデバイス株式会社 | Manufacturing method of electrical device |
| KR101832522B1 (en) * | 2013-11-29 | 2018-04-04 | 주식회사 엘지화학 | Composition for forming adhesive film, adhesive film before light curing for further processing, adhesive film and electronic paper display |
| JP2016060761A (en) * | 2014-09-16 | 2016-04-25 | デクセリアルズ株式会社 | Anisotropic conductive adhesive, and method for producing connection structure |
| JP6690356B2 (en) * | 2016-03-29 | 2020-04-28 | 味の素株式会社 | Thermosetting resin composition |
| TWI799557B (en) * | 2018-03-28 | 2023-04-21 | 日商琳得科股份有限公司 | Resin composition, sealing sheet and sealing body |
| WO2019240260A1 (en) * | 2018-06-15 | 2019-12-19 | リンテック株式会社 | Sealant composition, sealing sheet, and sealed body |
-
2022
- 2022-09-28 JP JP2023551586A patent/JPWO2023054449A1/ja active Pending
- 2022-09-28 WO PCT/JP2022/036115 patent/WO2023054449A1/en active Application Filing
- 2022-09-28 TW TW111136662A patent/TW202323490A/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| TW202323490A (en) | 2023-06-16 |
| WO2023054449A1 (en) | 2023-04-06 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
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| A871 | Explanation of circumstances concerning accelerated examination |
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| A131 | Notification of reasons for refusal |
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