MY184452A - Tape for electronic device packaging - Google Patents
Tape for electronic device packagingInfo
- Publication number
- MY184452A MY184452A MYPI2018702993A MYPI2018702993A MY184452A MY 184452 A MY184452 A MY 184452A MY PI2018702993 A MYPI2018702993 A MY PI2018702993A MY PI2018702993 A MYPI2018702993 A MY PI2018702993A MY 184452 A MY184452 A MY 184452A
- Authority
- MY
- Malaysia
- Prior art keywords
- adhesive layer
- tape
- pressure
- sensitive adhesive
- electronic device
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C09J133/08—Homopolymers or copolymers of acrylic acid esters
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J171/00—Adhesives based on polyethers obtained by reactions forming an ether link in the main chain; Adhesives based on derivatives of such polymers
- C09J171/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
- C09J171/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Dicing (AREA)
- Laminated Bodies (AREA)
- Wire Bonding (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Packages (AREA)
Abstract
Provided is a tape for electronic device packaging, with which, when an adhesive layer attached metal layer is picked up from a pressure-sensitive adhesive tape, individually divided pieces of the adhesive layer-attached metal layer that are intended to be picked up can be satisfactorily recognized by a pickup apparatus. The tape for electronic device packaging 1 of the invention includes a pressure-sensitive adhesive tape 5 having a base film 51 and a pressure-sensitive adhesive layer 52; an adhesive layer 4 provided by lamination on a surface of the pressure-sensitive adhesive layer 52, the surface being on the opposite side of the base film 51; and a metal layer 3 provided by lamination on a surface of the adhesive layer 4, the surface being on the opposite side of the pressure-sensitive adhesive layer 52, in which the metal layer 3 has a surface roughness RzJIS based on the 10-point average roughness of less than 5.0 ?m.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016072253 | 2016-03-31 | ||
PCT/JP2016/084928 WO2017168829A1 (en) | 2016-03-31 | 2016-11-25 | Tape for electronic device package |
Publications (1)
Publication Number | Publication Date |
---|---|
MY184452A true MY184452A (en) | 2021-04-01 |
Family
ID=59963848
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MYPI2018702993A MY184452A (en) | 2016-03-31 | 2016-11-25 | Tape for electronic device packaging |
Country Status (7)
Country | Link |
---|---|
JP (1) | JP6877404B2 (en) |
KR (1) | KR102466267B1 (en) |
CN (1) | CN108779374A (en) |
MY (1) | MY184452A (en) |
SG (1) | SG11201807411VA (en) |
TW (1) | TWI643931B (en) |
WO (1) | WO2017168829A1 (en) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7111562B2 (en) * | 2018-08-31 | 2022-08-02 | 株式会社ディスコ | Processing method |
JP6852030B2 (en) * | 2018-09-25 | 2021-03-31 | 古河電気工業株式会社 | Electronic device packaging tape |
JP7060483B2 (en) * | 2018-09-25 | 2022-04-26 | 古河電気工業株式会社 | Tape for electronic device packaging |
JP6935379B2 (en) * | 2018-09-25 | 2021-09-15 | 古河電気工業株式会社 | Electronic device packaging tape |
JP7217344B2 (en) * | 2019-04-26 | 2023-02-02 | 三井化学東セロ株式会社 | Self-adhesive film and electronic device manufacturing method |
JP7112997B2 (en) * | 2019-10-30 | 2022-08-04 | 古河電気工業株式会社 | Electronic device package tape |
KR102698630B1 (en) * | 2020-11-25 | 2024-08-26 | (주)이녹스첨단소재 | Multi-layered film for spacer and method of forming spacer using the same |
WO2022208966A1 (en) * | 2021-03-31 | 2022-10-06 | 株式会社ユポ・コーポレーション | Recording paper |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5319970A (en) | 1976-08-10 | 1978-02-23 | Mitsubishi Heavy Ind Ltd | Treating method of exhaust gas |
JP4055614B2 (en) * | 2003-03-18 | 2008-03-05 | 東レ株式会社 | Laminated film with metal foil and semiconductor device using the same |
JP4954569B2 (en) | 2006-02-16 | 2012-06-20 | 日東電工株式会社 | Manufacturing method of semiconductor device |
JP2007235022A (en) * | 2006-03-03 | 2007-09-13 | Mitsui Chemicals Inc | Adhesive film |
CN100559563C (en) * | 2007-06-29 | 2009-11-11 | 上海蓝光科技有限公司 | The identification of led chip surface roughness and sorting technique |
JP5486831B2 (en) * | 2009-03-19 | 2014-05-07 | 積水化学工業株式会社 | Dicing tape and semiconductor chip manufacturing method |
JP5487847B2 (en) | 2009-09-25 | 2014-05-14 | 日本電気株式会社 | Electronic device package, manufacturing method thereof, and electronic apparatus |
JP2011151362A (en) * | 2009-12-24 | 2011-08-04 | Nitto Denko Corp | Dicing tape-integrated film for semiconductor back surface |
JP5419226B2 (en) * | 2010-07-29 | 2014-02-19 | 日東電工株式会社 | Flip chip type film for semiconductor back surface and use thereof |
-
2016
- 2016-11-25 MY MYPI2018702993A patent/MY184452A/en unknown
- 2016-11-25 CN CN201680083856.7A patent/CN108779374A/en active Pending
- 2016-11-25 JP JP2018508371A patent/JP6877404B2/en active Active
- 2016-11-25 KR KR1020187027742A patent/KR102466267B1/en active IP Right Grant
- 2016-11-25 SG SG11201807411VA patent/SG11201807411VA/en unknown
- 2016-11-25 WO PCT/JP2016/084928 patent/WO2017168829A1/en active Application Filing
-
2017
- 2017-03-22 TW TW106109582A patent/TWI643931B/en active
Also Published As
Publication number | Publication date |
---|---|
TWI643931B (en) | 2018-12-11 |
KR102466267B1 (en) | 2022-11-14 |
CN108779374A (en) | 2018-11-09 |
WO2017168829A1 (en) | 2017-10-05 |
SG11201807411VA (en) | 2018-09-27 |
KR20180127366A (en) | 2018-11-28 |
TW201736548A (en) | 2017-10-16 |
JP6877404B2 (en) | 2021-05-26 |
JPWO2017168829A1 (en) | 2019-02-14 |
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