MY184452A - Tape for electronic device packaging - Google Patents

Tape for electronic device packaging

Info

Publication number
MY184452A
MY184452A MYPI2018702993A MYPI2018702993A MY184452A MY 184452 A MY184452 A MY 184452A MY PI2018702993 A MYPI2018702993 A MY PI2018702993A MY PI2018702993 A MYPI2018702993 A MY PI2018702993A MY 184452 A MY184452 A MY 184452A
Authority
MY
Malaysia
Prior art keywords
adhesive layer
tape
pressure
sensitive adhesive
electronic device
Prior art date
Application number
MYPI2018702993A
Inventor
Masami Aoyama
Toru Sano
Jirou Sugiyama
Original Assignee
Furukawa Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Furukawa Electric Co Ltd filed Critical Furukawa Electric Co Ltd
Publication of MY184452A publication Critical patent/MY184452A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/08—Homopolymers or copolymers of acrylic acid esters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J171/00—Adhesives based on polyethers obtained by reactions forming an ether link in the main chain; Adhesives based on derivatives of such polymers
    • C09J171/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C09J171/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature

Abstract

Provided is a tape for electronic device packaging, with which, when an adhesive layer attached metal layer is picked up from a pressure-sensitive adhesive tape, individually divided pieces of the adhesive layer-attached metal layer that are intended to be picked up can be satisfactorily recognized by a pickup apparatus. The tape for electronic device packaging 1 of the invention includes a pressure-sensitive adhesive tape 5 having a base film 51 and a pressure-sensitive adhesive layer 52; an adhesive layer 4 provided by lamination on a surface of the pressure-sensitive adhesive layer 52, the surface being on the opposite side of the base film 51; and a metal layer 3 provided by lamination on a surface of the adhesive layer 4, the surface being on the opposite side of the pressure-sensitive adhesive layer 52, in which the metal layer 3 has a surface roughness RzJIS based on the 10-point average roughness of less than 5.0 ?m.
MYPI2018702993A 2016-03-31 2016-11-25 Tape for electronic device packaging MY184452A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016072253 2016-03-31
PCT/JP2016/084928 WO2017168829A1 (en) 2016-03-31 2016-11-25 Tape for electronic device package

Publications (1)

Publication Number Publication Date
MY184452A true MY184452A (en) 2021-04-01

Family

ID=59963848

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2018702993A MY184452A (en) 2016-03-31 2016-11-25 Tape for electronic device packaging

Country Status (7)

Country Link
JP (1) JP6877404B2 (en)
KR (1) KR102466267B1 (en)
CN (1) CN108779374A (en)
MY (1) MY184452A (en)
SG (1) SG11201807411VA (en)
TW (1) TWI643931B (en)
WO (1) WO2017168829A1 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7111562B2 (en) * 2018-08-31 2022-08-02 株式会社ディスコ Processing method
JP6852030B2 (en) * 2018-09-25 2021-03-31 古河電気工業株式会社 Electronic device packaging tape
JP6935379B2 (en) * 2018-09-25 2021-09-15 古河電気工業株式会社 Electronic device packaging tape
JP7060483B2 (en) * 2018-09-25 2022-04-26 古河電気工業株式会社 Tape for electronic device packaging
JP7112997B2 (en) * 2019-10-30 2022-08-04 古河電気工業株式会社 Electronic device package tape
KR20220072634A (en) * 2020-11-25 2022-06-02 (주)이녹스첨단소재 Multi-layered film for spacer and method of forming spacer using the same
WO2022208966A1 (en) * 2021-03-31 2022-10-06 株式会社ユポ・コーポレーション Recording paper

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5319970A (en) 1976-08-10 1978-02-23 Mitsubishi Heavy Ind Ltd Treating method of exhaust gas
JP4055614B2 (en) * 2003-03-18 2008-03-05 東レ株式会社 Laminated film with metal foil and semiconductor device using the same
JP4954569B2 (en) 2006-02-16 2012-06-20 日東電工株式会社 Manufacturing method of semiconductor device
JP2007235022A (en) 2006-03-03 2007-09-13 Mitsui Chemicals Inc Adhesive film
CN100559563C (en) * 2007-06-29 2009-11-11 上海蓝光科技有限公司 The identification of led chip surface roughness and sorting technique
JP5486831B2 (en) * 2009-03-19 2014-05-07 積水化学工業株式会社 Dicing tape and semiconductor chip manufacturing method
JP5487847B2 (en) 2009-09-25 2014-05-14 日本電気株式会社 Electronic device package, manufacturing method thereof, and electronic apparatus
JP2011151362A (en) * 2009-12-24 2011-08-04 Nitto Denko Corp Dicing tape-integrated film for semiconductor back surface
JP5419226B2 (en) * 2010-07-29 2014-02-19 日東電工株式会社 Flip chip type film for semiconductor back surface and use thereof

Also Published As

Publication number Publication date
JP6877404B2 (en) 2021-05-26
KR20180127366A (en) 2018-11-28
SG11201807411VA (en) 2018-09-27
CN108779374A (en) 2018-11-09
WO2017168829A1 (en) 2017-10-05
KR102466267B1 (en) 2022-11-14
TWI643931B (en) 2018-12-11
JPWO2017168829A1 (en) 2019-02-14
TW201736548A (en) 2017-10-16

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