JP7060483B2 - Tape for electronic device packaging - Google Patents

Description

The present invention relates to a tape for an electronic device package, and more particularly to a tape for an electronic device package having a metal layer.

In recent years, electronic devices such as mobile phones and notebook PCs are required to be further thinned and miniaturized. Therefore, in order to make electronic device packages such as semiconductor packages mounted on electronic devices thinner and smaller, the number of electrodes on electronic devices and circuit boards is increased, and the pitch is also narrowed. Such electronic device packages include, for example, flip chip (FC) mounting packages.

In the flip chip mounting package, as described above, the number of electrodes is increased or the pitch is narrowed, so that an increase in the amount of heat generated is a problem. Therefore, as a heat dissipation structure of the flip chip mounting package, it has been proposed to provide a metal layer on the back surface of the electronic device via an adhesive layer (see, for example, Patent Document 1).

Further, in the flip chip mounting package, the coefficient of linear expansion of the electronic device and the coefficient of linear expansion of the circuit board may be significantly different. In this case, in the process of manufacturing the electronic device package, when the intermediate product is heated and cooled, a difference in the amount of expansion and contraction occurs between the electronic device and the circuit board. This difference causes the electronic device package to warp. As a structure for suppressing such warpage, it has been proposed to provide a metal layer on the back surface of the electronic device via an adhesive layer (see, for example, Patent Document 2).

Further, in a flip chip mounting package, it has been proposed to provide a metal layer on the back surface of an electronic device via an adhesive layer and use this metal layer as a protective layer for laser marking (see, for example, Patent Document 3). .. Patent Document 3 discloses an electronic device package in which the size of the plane of the electronic device and the size of the plane of the metal layer and the adhesive layer are the same.

Further, in recent years, there is a case where another semiconductor chip of the same size is further laminated on the semiconductor chip to perform three-dimensional mounting. Here, in order to enable stacking of other semiconductor chips of the same size on the semiconductor chip, it is necessary to stack a spacer between them. This is because other semiconductor chips are laminated on the electrode pad portion of the semiconductor chip. It has been proposed to use a metal layer with an adhesive layer as the spacer (see, for example, Patent Document 4). In Patent Document 4, the spacer is a step of bonding a spacer adhesive sheet having a metal layer having an adhesive layer on at least one surface to a dicing sheet using the adhesive layer as a bonding surface, and a spacer adhesive sheet. The process of forming a chip-shaped spacer with an adhesive layer by dicing, and the pickup used when the spacer is pushed up by a pin and the pushed-up spacer is peeled off from the dicing sheet together with the adhesive layer. It is described that the apparatus is provided by a step of peeling from the dicing sheet together with the adhesive layer and a step of fixing the spacer to the adherend via the adhesive layer.

Japanese Unexamined Patent Publication No. 2007-23502 Japanese Patent No. 5487847 Japanese Patent No. 5419226 Japanese Patent No. 4954569

In Patent Document 4, a spacer adhesive sheet having a metal layer provided with an adhesive layer is attached to a dicing sheet with the adhesive layer as a bonding surface, and the spacer adhesive sheet is died to form an adhesive layer. It is described that after forming the provided chip-shaped spacer, the chip-shaped spacer is peeled off from the dicing sheet together with the adhesive layer, but the adhesive layer and the metal layer are pre-cut and separated. It's convenient.

When the adhesive layer and the metal layer are cut in advance and individualized, it is usually considered to cut using push-cut teeth. When cutting using push-cut teeth, the metal layer may warp. When the metal layer is warped, it is conceivable to use a pressure roller to correct the warp. However, when pressure is applied to the adhesive layer and the metal layer that are individually separated and arranged vertically and horizontally by using a pressure roller, the warp is not forced unless the pressure is uniformly applied to the individual metal layers, and the metal. When the layer is attached to an electronic device such as a semiconductor chip via the adhesive layer and the adhesive layer is cured, there is a problem that the adhesive layer may be peeled off from the electronic device.

Therefore, in the present invention, when the warp of the metal layer is appropriately corrected, the metal layer is bonded to an electronic device such as a semiconductor chip via the adhesive layer, and the adhesive layer is cured, the adhesive layer is formed. It is an object of the present invention to provide a tape for an electronic device package capable of reducing peeling from an electronic device.

In order to solve the above problems, the tape for electronic device packaging according to the present invention is an individual piece composed of a long base material tape and a laminate of an adhesive layer and a metal layer provided on the base material tape. An aggregate composed of a plurality of aggregates, and an adhesive tape having a label portion having a predetermined planar shape provided so as to cover the aggregate and to be in contact with the base material tape around the aggregate. The individual pieces in the aggregate are arranged in a row along the lateral direction of the base tape, and the rows are a plurality in the longitudinal direction of the base tape in the aggregate. It is arranged in a row, and the maximum value of the total length of the individual pieces constituting the row in the lateral direction is within 160% of the minimum value of the total value. ..

The tape for electronic device packaging preferably has a loss tangent of 0.4 or more at 25 ° C. and 50% RH of the adhesive layer.

Further, it is preferable that the metal layer of the tape for electronic device packaging contains copper or aluminum.

Further, in the tape for electronic device packaging, the adhesive layer contains (A) an epoxy resin, (B) a curing agent, (C) an acrylic resin or a phenoxy resin, and (D) a surface-treated inorganic filler. It is preferable to do so.

Further, in the above-mentioned electronic device package tape, the pressure-sensitive adhesive layer is an acrylic acid ester represented by CH ₂ = CHCOOR (in the formula, R is an alkyl group having 4 to 18 carbon atoms) and a hydroxyl group. It is preferable to contain an acrylic polymer composed of a contained monomer and an isocyanate compound having a radically reactive carbon-carbon double bond in the molecule.

According to the present invention, when the warp of the metal layer is appropriately corrected, the metal layer is bonded to an electronic device such as a semiconductor chip via the adhesive layer, and the adhesive layer is cured, the adhesive layer is formed. Can be reduced from peeling from the electronic device.

It is sectional drawing which shows typically the structure of the tape for electronic device package which concerns on embodiment of this invention. (A) is a plan view schematically showing the structure of a tape for an electronic device package according to an embodiment of the present invention, and (b) is a sectional view thereof. It is a perspective view which shows typically the structure of the tape for electronic device package which concerns on embodiment of this invention. It is explanatory drawing which shows typically the manufacturing method of the tape for electronic device package which concerns on embodiment of this invention, (A) is the longitudinal sectional view which shows the bonding process of a metal layer, (B) is an adhesive. It is a longitudinal sectional view which shows the layer bonding process, (C) is a short sectional view which shows a precut process, and (D) is a perspective view which shows an unnecessary part removal process. It is explanatory drawing which shows typically the manufacturing method of the tape for electronic device package which concerns on embodiment of this invention, (A) is the longitudinal sectional view which shows the bonding process of the protective tape 20, (B) pressurization. It is a sectional view in the longitudinal direction which shows the processing process. It is explanatory drawing which shows typically the manufacturing method of the tape for electronic device package which concerns on embodiment of this invention, (A) is the short side sectional view which shows the bonding process of adhesive tape, (B) is precut. It is a short side sectional view which shows the process, and (C) is a short side sectional view which shows the removal process of an unnecessary part. (A) is a plan view schematically showing a modified example of the structure of the tape for electronic device packaging according to the embodiment of the present invention, and (b) is a sectional view thereof. It is sectional drawing which schematically explains the method of using the tape for electronic device package which concerns on embodiment of this invention. It is sectional drawing which schematically explains the method of using the tape for electronic device package which concerns on embodiment of this invention. It is sectional drawing which shows typically the structure of the electronic device package using the tape for electronic device package which concerns on embodiment of this invention.

Hereinafter, embodiments of the present invention will be described in detail.

FIG. 1 is a cross-sectional view showing a tape 1 for an electronic device package according to an embodiment of the present invention. The electronic device package tape 1 has an adhesive tape 5 composed of a base film 51 and an adhesive layer 52 provided on the base film 51, and an adhesive layer is placed on the adhesive layer 52. 4 and a metal layer 3 provided by being laminated on the adhesive layer 4 are provided. The metal layer 3 may be indirectly provided on the adhesive layer 4 via a primer layer or the like for improving the adhesion with the adhesive layer 4.

In the electronic device package tape 1 of the present invention, as shown in FIGS. 2 and 3, the adhesive tape 5 is cut into a shape corresponding to the ring frame R (see FIG. 9), and the metal layer 3 and the adhesive layer are cut. No. 4 is also cut (pre-cut) into a predetermined shape corresponding to this.

As shown in FIGS. 2 and 3, the tape 1 for an electronic device package of the present invention has an adhesive tape 5 (label portion 5a) cut into a shape corresponding to a metal layer 3, an adhesive layer 4, and a ring frame R. It is preferable that the long base material tape 2 on which a plurality of laminated bodies are formed is wound into a roll shape, and in the present embodiment, the long base material tape 2 is wound into a roll shape.

As shown in FIGS. 2 and 3, the electronic device package tape 1 of the present invention has a base material tape 2, and a metal layer 3 and a base material of the metal layer 3 are placed on the base material tape 2. It covers the adhesive layer 4 provided by laminating with the metal layer 3 on the side opposite to the tape 2 side and the adhesive layer 4, and is provided so as to come into contact with the base tape 2 around the adhesive layer 4. An adhesive tape 5 having a predetermined flat-shaped label portion 5a and a peripheral portion 5b that surrounds the outside of the label portion 5a is provided.

The label portion 5a has a shape corresponding to the ring frame R for dicing. The shape corresponding to the shape of the ring frame R for dicing is preferably a similar shape having substantially the same shape as the inside of the ring frame R and larger than the size of the inside of the ring frame R. Further, it does not necessarily have to be circular, but a shape close to circular is preferable, and circular is more preferable. The peripheral portion 5b includes a form that completely surrounds the outside of the label portion 5a and a form that does not completely surround the label portion 5a as shown in the figure. The peripheral portion 5b may not be provided.

The metal layer 3 and the adhesive layer 4 are pre-cut and individualized to a size corresponding to the plane of the electronic device to which the metal layer 3 and the adhesive layer 4 are to be bonded. A plurality of individual pieces made of a laminated body of the cut adhesive layer 4 and the metal layer 3 are aggregated to form an aggregate 30, and the aggregate 30 is a base material tape as shown in FIG. A plurality of them are provided in the longitudinal direction of 2. Further, as shown in FIGS. 1 and 2, one label portion 5a is laminated so as to cover one aggregate 30.

A plurality of individual pieces in the aggregate 30 are arranged along the lateral direction of the base tape to form a row L, and a plurality of rows L are arranged in the aggregate 30 in the longitudinal direction of the base tape 2. There is. The maximum value of the total value of the length l in the lateral direction of the individual base material tapes 2 constituting the row L is within 160% of the minimum value of the total value. In the present embodiment, since the size and the number of pieces in all columns L are the same, the total value of the length l of the pieces in all columns L is 100% with respect to the minimum value. There is.

In the adhesive layer 4 and the metal layer 3, the aggregate 30 in which the individual pieces are arranged has a predetermined label shape, and this label shape has a ring frame R attached to the peripheral edge of the label portion 5a of the adhesive tape 5. In addition, the shape is smaller than the label portion 5a so that it can be pushed up by the push-up member T of the pickup device (see FIG. 9B).

The adhesive layer 4 is laminated on the metal layer 3. In the lamination here, it is sufficient that the main parts are laminated, and the metal layer 3 and the adhesive layer 4 do not necessarily have the same size, but they may have substantially the same shape for the convenience of manufacturing. preferable.

Each component will be described below.

<Base tape 2>
The base material tape 2 may be made of a known separator, but the base material tape used for the precut processing of the tape for electronic device packaging may be used as it is. When the base material tape used for the precut processing of the tape for electronic device packaging is used as it is, the base material tape 2 needs to adhesively hold the metal layer 3 at the time of the precut processing. Therefore, for example, on one side of the resin film and the resin film. A tape having an provided adhesive layer for a base material tape can be preferably used.

A known material can be used as the material of the resin film constituting the base material tape 2, but for example, polyester (PET, PBT, PEN, PBN, PTT) -based, polyolefin (PP, PE). Examples thereof include systems, copolymer (EVA, EEA, EBA) systems, and films in which these materials are partially substituted to further improve adhesiveness and mechanical strength. Further, it may be a laminate of these films. From the viewpoint of heat resistance, smoothness, and availability, it is preferable to select from polyethylene terephthalate, polypropylene, and polyethylene.

The thickness of the resin film constituting the base material tape 2 is not particularly limited and may be appropriately set, but is preferably 10 to 150 μm.

As the resin used for the pressure-sensitive adhesive layer for the base material tape, known chlorinated polypropylene resin, acrylic resin, polyester resin, polyurethane resin, epoxy resin and the like used for the pressure-sensitive adhesive can be used, but acrylic resin is used. Acrylic pressure-sensitive adhesives using a polymer as a base polymer are preferable.

Examples of the acrylic polymer include (meth) acrylic acid alkyl esters (eg, methyl esters, ethyl esters, propyl esters, isopropyl esters, butyl esters, isobutyl esters, s-butyl esters, t-butyl esters, pentyl esters, and iso. Pentyl ester, hexyl ester, heptyl ester, octyl ester, 2-ethylhexyl ester, isooctyl ester, nonyl ester, decyl ester, isodecyl ester, undecyl ester, dodecyl ester, tridecyl ester, tetradecyl ester, hexadecyl ester, Alkyl groups such as octadecyl esters and eicosyl esters have 1 to 30 carbon atoms, especially linear or branched alkyl esters having 4 to 18 carbon atoms) and (meth) acrylic acid cycloalkyl esters (eg, cyclopentyl esters). , Cyclohexyl ester, etc.), or an acrylic polymer using one or more of them as a monomer component. The (meth) acrylic acid ester means an acrylic acid ester and / or a methacrylic acid ester, and all of them have the same meaning as the (meth) of the present invention.

The acrylic polymer contains units corresponding to other monomer components copolymerizable with the (meth) acrylic acid alkyl ester or cycloalkyl ester, if necessary, for the purpose of modifying cohesive force, heat resistance, etc. You may. Examples of such monomer components include carboxyl group-containing monomers such as acrylic acid, methacrylic acid, carboxyethyl (meth) acrylate, carboxypentyl (meth) acrylate, itaconic acid, maleic acid, fumaric acid, and crotonic acid; maleic anhydride. , Acid anhydride monomers such as itaconic acid anhydride; 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate, 6-hydroxyhexyl (meth) acrylate. , (Meta) Acrylic Acid 8-Hydroxyoctyl, (Meta) Acrylic Acid 10-Hydroxydecyl, (Meta) Acrylic Acid 12-Hydroxylauryl, (4-Hydroxymethylcyclohexyl) Methyl (meth) Acrylate and other hydroxyl group-containing monomers; Sulfonic acid groups such as styrene sulfonic acid, allyl sulfonic acid, 2- (meth) acrylamide-2-methylpropane sulfonic acid, (meth) acrylamide propane sulfonic acid, sulfopropyl (meth) acrylate, (meth) acryloyloxynaphthalene sulfonic acid. Containing monomer; Phosphonic acid group-containing monomer such as 2-hydroxyethylacryloyl phosphate; acrylamide, acrylonitrile and the like can be mentioned. One or more of these copolymerizable monomer components can be used. The amount of these copolymerizable monomers used is preferably 40% by weight or less of the total monomer components.

Further, since the acrylic polymer is crosslinked, a polyfunctional monomer or the like can be included as a monomer component for copolymerization, if necessary. Examples of such a polyfunctional monomer include hexanediol di (meth) acrylate, (poly) ethylene glycol di (meth) acrylate, (poly) propylene glycol di (meth) acrylate, and neopentyl glycol di (meth) acrylate. Pentaerythritol di (meth) acrylate, trimethylolpropanthry (meth) acrylate, pentaerythritol tri (meth) acrylate, dipentaerythritol hexa (meth) acrylate, epoxy (meth) acrylate, polyester (meth) acrylate, urethane (meth) Examples include acrylate. One or more of these polyfunctional monomers can also be used. The amount of the polyfunctional monomer used is preferably 30% by weight or less of the total monomer components from the viewpoint of adhesive properties and the like.

The acrylic polymer can be prepared, for example, by applying an appropriate method such as a solution polymerization method, an emulsion polymerization method, a bulk polymerization method, or a suspension polymerization method to a mixture of one or more kinds of component monomers. The pressure-sensitive adhesive layer for the base material tape preferably has a composition in which the content of low molecular weight substances is suppressed, and from this point of view, it is preferable that the pressure-sensitive adhesive layer is mainly composed of an acrylic polymer having a weight average molecular weight of 300,000 or more, particularly 400,000 to 3 million. Therefore, the pressure-sensitive adhesive may be an appropriate cross-linking type by an internal cross-linking method, an external cross-linking method, or the like.

Further, in order to control the crosslink density of the pressure-sensitive adhesive layer for the base material tape and improve the peelability from the pressure-sensitive adhesive tape 5, for example, a polyfunctional isocyanate compound, a polyfunctional epoxy compound, a melamine compound, a metal salt compound, etc. A method of cross-linking with an appropriate external cross-linking agent such as a metal chelate compound, an amino resin compound, or a peroxide, or a method of mixing low molecular weight compounds having two or more carbon-carbon double bonds to generate energy rays. It is possible to adopt an appropriate method such as a method of cross-linking treatment by irradiation with the above. When an external cross-linking agent is used, the amount used thereof is appropriately determined by the balance with the base polymer to be cross-linked and further by the intended use as a pressure-sensitive adhesive. Generally, it is preferably blended in an amount of about 20 parts by weight or less, more preferably 0.1 parts by weight to 20 parts by weight, based on 100 parts by weight of the base polymer.

The thickness of the pressure-sensitive adhesive layer for the base material tape is not particularly limited and can be appropriately determined, but is generally about 5 to 200 μm. Further, the pressure-sensitive adhesive layer for the base material tape may be composed of a single layer or a plurality of layers.

<Adhesive tape 5>
The adhesive tape 5 is not particularly limited, and a conventional dicing tape can be used. As the adhesive tape 5, for example, a base film 51 provided with an adhesive layer 52 can be preferably used.

The base film 51 can be used without particular limitation as long as it is conventionally known, but when a radiation-curable material is used as the pressure-sensitive adhesive layer 52 described later, it has radiation permeability. It is preferable to use one.

For example, the materials thereof include polyethylene, polypropylene, ethylene-propylene copolymer, polybutene-1, poly-4-methylpentene-1, ethylene-vinyl acetate copolymer, ethylene-ethyl acrylate copolymer, and ethylene-acrylic. Polypolymers or copolymers of α-olefins such as methyl acid copolymers, ethylene-acrylic acid copolymers, ionomers or mixtures thereof, polyurethanes, styrene-ethylene-butene or penten-based copolymers, polyamide-polypolymers. Thermoplastic elastomers such as copolymers and mixtures thereof can be listed. Further, the base film may be a mixture of two or more kinds of materials selected from these groups, or may be a single layer or a multi-layered film.

The thickness of the base film 51 is not particularly limited and may be set as appropriate, but is preferably 50 to 200 μm in consideration of the expanding step at the time of picking up.

In order to improve the adhesion between the base film 51 and the pressure-sensitive adhesive layer 52, the surface of the base film 51 is chemically or physically treated with chromic acid, ozone exposure, flame exposure, high piezoelectric impact exposure, ionizing radiation treatment, etc. A target surface treatment may be applied.

Further, in the present embodiment, the pressure-sensitive adhesive layer 52 is provided directly on the base film 51, but a primer layer, an anchor layer, a stress relaxation layer, an antistatic layer, etc. for improving adhesion are provided. It may be provided indirectly via.

The resin used for the pressure-sensitive adhesive layer 52 of the pressure-sensitive adhesive tape 5 is not particularly limited, and known chlorinated polypropylene resin, acrylic resin, polyester resin, polyurethane resin, epoxy resin and the like used for the pressure-sensitive adhesive can be used. Although it can be used, an acrylic pressure-sensitive adhesive using an acrylic polymer as a base polymer is preferable in order to control the adhesive strength suitable for suppressing the formation of pin marks on the metal layer.

Examples of the acrylic polymer include (meth) acrylic acid alkyl esters (eg, methyl esters, ethyl esters, propyl esters, isopropyl esters, butyl esters, isobutyl esters, s-butyl esters, t-butyl esters, pentyl esters, and iso. Pentyl ester, hexyl ester, heptyl ester, octyl ester, 2-ethylhexyl ester, isooctyl ester, nonyl ester, decyl ester, isodecyl ester, undecyl ester, dodecyl ester, tridecyl ester, tetradecyl ester, hexadecyl ester, Alkyl groups such as octadecyl esters and eicosyl esters have 1 to 30 carbon atoms, especially linear or branched alkyl esters having 4 to 18 carbon atoms) and (meth) acrylic acid cycloalkyl esters (eg, cyclopentyl esters). , Cyclohexyl ester, etc.), or an acrylic polymer using one or more of them as a monomer component. The (meth) acrylic acid ester means an acrylic acid ester and / or a methacrylic acid ester, and all of them have the same meaning as the (meth) of the present invention.

The acrylic polymer is a unit corresponding to the above-mentioned (meth) acrylic acid alkyl ester or other monomer component copolymerizable with the cycloalkyl ester, if necessary, for the purpose of modifying the cohesive force, heat resistance, crosslinkability and the like. May include. Examples of such monomer components include carboxyl group-containing monomers such as acrylic acid, methacrylic acid, carboxyethyl (meth) acrylate, carboxypentyl (meth) acrylate, itaconic acid, maleic acid, fumaric acid, and crotonic acid; maleic anhydride. , Acid anhydride monomers such as itaconic acid anhydride; 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate, 6-hydroxyhexyl (meth) acrylate. , (Meta) Acrylic Acid 8-Hydroxyoctyl, (Meta) Acrylic Acid 10-Hydroxydecyl, (Meta) Acrylic Acid 12-Hydroxylauryl, (4-Hydroxymethylcyclohexyl) Methyl (meth) Acrylate and other hydroxyl group-containing monomers; Sulfonic acid groups such as styrene sulfonic acid, allyl sulfonic acid, 2- (meth) acrylamide-2-methylpropane sulfonic acid, (meth) acrylamide propane sulfonic acid, sulfopropyl (meth) acrylate, (meth) acryloyloxynaphthalene sulfonic acid. Containing monomer; Phosphonic acid group-containing monomer such as 2-hydroxyethylacryloyl phosphate; acrylamide, acrylonitrile and the like can be mentioned. One or more of these copolymerizable monomer components can be used. The amount of these copolymerizable monomers used is preferably 40% by weight or less of the total monomer components.

Further, since the acrylic polymer is crosslinked, a polyfunctional monomer or the like can be included as a monomer component for copolymerization, if necessary. Examples of such a polyfunctional monomer include hexanediol di (meth) acrylate, (poly) ethylene glycol di (meth) acrylate, (poly) propylene glycol di (meth) acrylate, and neopentyl glycol di (meth) acrylate. Pentaerythritol di (meth) acrylate, trimethylolpropanthry (meth) acrylate, pentaerythritol tri (meth) acrylate, dipentaerythritol hexa (meth) acrylate, epoxy (meth) acrylate, polyester (meth) acrylate, urethane (meth) Examples include acrylate. One or more of these polyfunctional monomers can also be used. The amount of the polyfunctional monomer used is preferably 30% by weight or less of the total monomer components from the viewpoint of adhesive properties and the like.

The acrylic polymer can be prepared, for example, by applying an appropriate method such as a solution polymerization method, an emulsion polymerization method, a bulk polymerization method, or a suspension polymerization method to a mixture of one or more kinds of component monomers. The pressure-sensitive adhesive layer 52 preferably has a composition in which the content of low molecular weight substances is suppressed, and from this point of view, it is preferable that the pressure-sensitive adhesive layer 52 is mainly composed of an acrylic polymer having a weight average molecular weight of 300,000 or more, particularly 400,000 to 3 million. The agent may be an appropriate cross-linking type by an internal cross-linking method, an external cross-linking method, or the like.

Further, in order to control the crosslink density of the pressure-sensitive adhesive layer 52 and improve the pick-up property, for example, a polyfunctional isocyanate compound, a polyfunctional epoxy compound, a melamine compound, a metal salt compound, a metal chelate compound, and an amino resin compound. A method of cross-linking with a compound or an appropriate external cross-linking agent such as peroxide, or a method of mixing low molecular weight compounds having two or more carbon-carbon double bonds and cross-linking by irradiation with energy rays. It is possible to adopt a suitable method such as. When an external cross-linking agent is used, the amount used thereof is appropriately determined by the balance with the base polymer to be cross-linked and further by the intended use as a pressure-sensitive adhesive. Generally, it is preferably blended in an amount of about 20 parts by weight or less, more preferably 0.1 parts by weight to 20 parts by weight, based on 100 parts by weight of the base polymer. In addition to the above-mentioned components, various tackifiers, antiaging agents, and other additives may be used as the pressure-sensitive adhesive, if necessary, from the viewpoint of preventing deterioration and the like.

As the pressure-sensitive adhesive constituting the pressure-sensitive adhesive layer 52, a radiation-curable pressure-sensitive adhesive is suitable. As the radiation-curable pressure-sensitive adhesive, an additive-type radiation-curable pressure-sensitive adhesive in which a radiation-curable monomer component or a radiation-curable oligomer component is mixed with the above-mentioned pressure-sensitive adhesive can be exemplified.

Examples of the radiation-curable monomer component to be blended include urethane (meth) acrylate, trimethylolpropane tri (meth) acrylate, tetramethylolmethanetetra (meth) acrylate, pentaerythritol tri (meth) acrylate, and pentaeristol tetra (pentaerythritol tetra (meth) acrylate). Examples thereof include meth) acrylate, dipentaellistol monohydroxypenta (meth) acrylate, dipentaerythritol hexa (meth) acrylate, and 1,4-butanediol di (meth) acrylate. These monomer components can be used alone or in combination of two or more.

Further, examples of the radiation-curable oligomer component include various oligomers such as urethane-based, polyether-based, polyester-based, polycarbonate-based, and polybutadiene-based, and those having a molecular weight in the range of about 100 to 30,000 are suitable. The amount of the radiation-curable monomer component or oligomer component to be blended can be appropriately determined according to the type of the pressure-sensitive adhesive layer 52 so that the pressure-sensitive adhesive strength of the pressure-sensitive adhesive layer 52 can be reduced. Generally, it is, for example, about 5 parts by weight to 500 parts by weight, preferably about 70 parts by weight to 150 parts by weight, based on 100 parts by weight of a base polymer such as an acrylic polymer constituting the pressure-sensitive adhesive.

As the radiation-curable pressure-sensitive adhesive, in addition to the additive-type radiation-curable pressure-sensitive adhesive, a base polymer having a carbon-carbon double bond in the side chain or main chain or at the end of the main chain was used. Also included are intrinsic radiation curable adhesives. Since the intrinsic radiation-curable pressure-sensitive adhesive does not need to contain the oligomer component, which is a small molecule component, or does not contain a large amount, the oligomer component, etc. does not move in the pressure-sensitive adhesive over time and is stable. It is preferable because the pressure-sensitive adhesive layer 52 having a layered structure can be formed.

As the base polymer having a carbon-carbon double bond, one having a carbon-carbon double bond and having adhesiveness can be used without particular limitation. As such a base polymer, one having an acrylic polymer as a basic skeleton is preferable. Examples of the basic skeleton of the acrylic polymer include the above-exemplified acrylic polymer.

The method for introducing a carbon-carbon double bond into an acrylic polymer is not particularly limited, and various methods can be adopted, but the carbon-carbon double bond is easy to introduce into the polymer side chain in terms of molecular design. be. For example, after copolymerizing a monomer having a functional group with an acrylic polymer in advance, a compound having a functional group capable of reacting with the functional group and a carbon-carbon double bond is subjected to radiation curability of the carbon-carbon double bond. Examples thereof include a method of condensing or adding reaction while maintaining the above.

Examples of the combination of these functional groups include a carboxylic acid group and an epoxy group, a carboxylic acid group and an aziridyl group, a hydroxyl group and an isocyanate group, and the like. Among these combinations of functional groups, a combination of a hydroxyl group and an isocyanate group is preferable because of the ease of reaction tracking. Further, the functional group may be on either side of the acrylic polymer or the compound as long as the combination of these functional groups produces an acrylic polymer having the carbon-carbon double bond. In the above preferred combination, it is preferable that the acrylic polymer has a hydroxyl group and the compound has an isocyanate group. In this case, examples of the isocyanate compound having a carbon-carbon double bond include methacryloyl isocyanate, 2-methacryloyloxyethyl isocyanate, m-isopropenyl-α, α-dimethylbenzyl isocyanate and the like. Further, as the acrylic polymer, a polymer obtained by copolymerizing the above-exemplified hydroxy group-containing monomer, 2-hydroxyethyl vinyl ether, 4-hydroxybutyl vinyl ether, ether compound of diethylene glucol monovinyl ether and the like is used.

The intrinsic radiation-curable pressure-sensitive adhesive can use the base polymer having a carbon-carbon double bond (particularly an acrylic polymer) alone, but the radiation-curable monomer component to the extent that the properties are not deteriorated. And photopolymerizable compounds such as oligomer components can also be blended. The blending amount of the photopolymerizable compound is usually in the range of 30 parts by weight or less with respect to 100 parts by weight of the base polymer, preferably in the range of 0 to 10 parts by weight.

The radiation-curable pressure-sensitive adhesive preferably contains a photopolymerization initiator when it is cured by ultraviolet rays or the like.

Among the above-mentioned acrylic polymers, in particular, an acrylic acid ester represented by CH ₂ = CHCOOR (in the formula, R is an alkyl group having 4 to 18 carbon atoms), a hydroxyl group-containing monomer, and a hydroxyl group-containing monomer are contained in the molecule. Acrylic polymer A composed of an isocyanate compound having a radically reactive carbon-carbon double bond is preferable.

When the number of carbon atoms of the alkyl group of the acrylic acid alkyl ester is less than 4, the polarity may be high and the peeling force may be too large to reduce the pick-up property. On the other hand, when the number of carbon atoms of the alkyl group of the acrylic acid alkyl ester exceeds 18, the glass transition temperature of the pressure-sensitive adhesive layer 52 becomes too high, and the adhesive properties at room temperature deteriorate, and as a result, the metal layer during dicing. Peeling of 3 may occur.

The acrylic polymer A may contain units corresponding to other monomer components, if necessary.

In the acrylic polymer A, an isocyanate compound having a radically reactive carbon-carbon double bond is used. That is, it is preferable that the acrylic polymer has a structure in which a double bond-containing isocyanate compound is added and reacted with a polymer composed of a monomer composition such as the acrylic acid ester and a hydroxyl group-containing monomer. Therefore, it is preferable that the acrylic polymer has a radical-reactive carbon-carbon double bond in its molecular structure. As a result, the active energy ray-curable pressure-sensitive adhesive layer (ultraviolet-curable pressure-sensitive adhesive layer, etc.) that is cured by irradiation with active energy rays (ultraviolet rays, etc.) can be formed, and the peeling force between the metal layer 3 and the pressure-sensitive adhesive layer 52 can be obtained. Can be reduced.

Examples of the double bond-containing isocyanate compound include methacryloyl isocyanate, acryloyl isocyanate, 2-methacryloyloxyethyl isocyanate, 2-acryloyloxyethyl isocyanate, m-isopropenyl-α, α-dimethylbenzyl isocyanate and the like. The double bond-containing isocyanate compound can be used alone or in combination of two or more.

Further, in the active energy ray-curable pressure-sensitive adhesive, an external cross-linking agent can be appropriately used in order to adjust the adhesive force before irradiation with the active energy ray and the adhesive force after irradiation with the active energy ray. Specific means of the external cross-linking method include a method of adding and reacting a so-called cross-linking agent such as a polyisocyanate compound, an epoxy compound, an aziridine compound and a melamine-based cross-linking agent.

Examples of the polyisocyanate compound include lower aliphatic polyisocyanates such as 1,2-ethylenediisocyanate, 1,4-butylenediocyanate, and 1,6-hexamethylene diisocyanate; cyclopentylene diisocyanate, cyclohexylene diisocyanate, and isophorone. Alicyclic polyisocyanates such as diisocyanate, hydrogenated tolylene diisocyanate, hydrogenated xylene diisocyanate; 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate, 4,4'-diphenylmethane Examples include aromatic polyisocyanates such as diisocyanate and xylylene diisocyanate, as well as trimethylol propane / tolylene diisocyanate trimer adduct [manufactured by Toso Co., Ltd., trade name "Coronate L"], trimethylol propane / hexa. Methylene diisocyanate trimer adduct [manufactured by Toso Co., Ltd., trade name "Coronate HL"] and the like are also used. Examples of the epoxy compound include N, N, N', N'-tetraglycidyl-m-xylenediamine, diglycidylaniline, 1,3-bis (N, N-glycidylaminomethyl) cyclohexane, 1, 6-Hexanediol diglycidyl ether, neopentyl glycol diglycidyl ether, ethylene glycol diglycidyl ether, propylene glycol diglycidyl ether, polyethylene glycol diglycidyl ether, polypropylene glycol diglycidyl ether, sorbitol polyglycidyl ether, glycerol polyglycidyl ether, penta Elythritol polyglycidyl ether, polyglycerol polyglycidyl ether, sorbitan polyglycidyl ether, trimethylolpropane polyglycidyl ether, adipic acid diglycidyl ester, o-phthalic acid diglycidyl ester, triglycidyl-tris (2-hydroxyethyl) isocyanurate, In addition to resorcin diglycidyl ether and bisphenol-S-diglycidyl ether, epoxy-based resins having two or more epoxy groups in the molecule can be mentioned.

When an external cross-linking agent is used, the amount used thereof is appropriately determined by the balance with the base polymer to be cross-linked and further by the intended use as a pressure-sensitive adhesive. The amount of the external cross-linking agent used is generally 20 parts by weight or less (preferably 0.1 parts by weight to 10 parts by weight) with respect to 100 parts by weight of the base polymer. Further, the active energy ray-curable pressure-sensitive adhesive may contain, if necessary, various conventionally known additives such as a pressure-sensitive adhesive, an antiaging agent, and a foaming agent, in addition to the above-mentioned components.

In the present invention, instead of using the cross-linking agent, or while using the cross-linking agent, it is also possible to perform the cross-linking treatment by irradiation with an electron beam, ultraviolet rays, or the like.

The thickness of the pressure-sensitive adhesive layer 52 is not particularly limited and can be appropriately determined, but is generally about 5 to 200 μm. Further, the pressure-sensitive adhesive layer 52 may be composed of a single layer or a plurality of layers.

<Metal layer 3>
The metal constituting the metal layer 3 is not particularly limited, and for example, the electronic device package 8 may contain at least one selected from the group consisting of stainless steel, aluminum, iron, titanium, tin, nickel and copper. It is preferable from the viewpoint of preventing warpage. Among these, copper is particularly preferable from the viewpoint of high thermal conductivity and the effect of heat dissipation. Further, from the viewpoint of preventing warpage of the electronic device package 8, it is particularly preferable to contain aluminum.

The thickness of the metal layer 3 is 5 μm or more and less than 200 μm. By setting the thickness to 5 μm or more, it is possible to prevent the metal layer from being deformed by pushing up the pins of the pickup device and causing pin marks. Further, if it is less than 200 μm, it is easy to process, and when it is necessary to bend it along the core or the bonding roll in winding or bonding, the metal layer is too stiff and creases occur. The phenomenon can be suppressed.

As such a metal layer 3, a metal foil can be used, and the metal foil may be an electrolytic foil or a rolled foil.

<Adhesive layer 4>
The adhesive layer 4 is a film made of an adhesive in advance.

The adhesive layer 4 is formed of at least a thermosetting resin, and is preferably formed of at least a thermosetting resin and a thermoplastic resin.

Examples of the thermoplastic resin include natural rubber, butyl rubber, isoprene rubber, chloroprene rubber, ethylene-vinyl acetate copolymer, ethylene-acrylic acid copolymer, ethylene-acrylic acid ester copolymer, polybutadiene resin, and polycarbonate resin. Thermoplastic polyimide resin, polyamide resin such as 6-nylon and 6,6-nylon, phenoxy resin, acrylic resin, saturated polyester resin such as PET (polyethylene terephthalate) and PBT (polybutylene terephthalate), polyamideimide resin, or fluororesin. And so on. The thermoplastic resin can be used alone or in combination of two or more. Among these thermoplastic resins, acrylic resin has less ionic impurities and excellent stress relaxation property, and phenoxy resin has high toughness while achieving both flexibility and strength. It is particularly preferable because it can easily ensure reliability.

The acrylic resin is not particularly limited, and is one or more of acrylic acid or methacrylic acid esters having a linear or branched alkyl group having 30 or less carbon atoms (preferably 1 to 18 carbon atoms). Examples thereof include a polymer containing. That is, in the present invention, acrylic resin has a broad meaning including methacrylic resin. Examples of the alkyl group include a methyl group, an ethyl group, a propyl group, an isopropyl group, an n-butyl group, a t-butyl group, an isobutyl group, a pentyl group, an isopentyl group, a hexyl group, a heptyl group and a 2-ethylhexyl group. , Octyl group, isooctyl group, nonyl group, isononyl group, decyl group, isodecyl group, undecyl group, dodecyl group (lauryl group), tridecyl group, tetradecyl group, stearyl group, octadecyl group and the like.

Further, the other monomer for forming the acrylic resin (a monomer other than the alkyl ester of acrylic acid or methacrylic acid having an alkyl group having 30 or less carbon atoms) is not particularly limited, and is, for example, acrylic acid. Carboxyl group-containing monomers such as methacrylic acid, carboxyethyl acrylate, carboxypentyl acrylate, itaconic acid, maleic acid, fumaric acid or crotonic acid, acid anhydride monomers such as maleic anhydride or itaconic acid anhydride, (meth). 2-Hydroxyethyl acrylate, 2-hydroxypropyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate, 6-hydroxyhexyl (meth) acrylate, 8-hydroxyoctyl (meth) acrylate, (meth) Hydroxyl group-containing monomers such as 10-hydroxydecyl acrylate, 12-hydroxylauryl (meth) acrylate or (4-hydroxymethylcyclohexyl) -methyl acrylate, styrene sulfonic acid, allyl sulfonic acid, 2- (meth) acrylamide. -Sulfonic acid group-containing monomers such as 2-methylpropanesulfonic acid, (meth) acrylamide propanesulfonic acid, sulfopropyl (meth) acrylate or (meth) acryloyloxynaphthalene sulfonic acid, 2-hydroxyethylacryloyl phosphate and the like. Examples thereof include sulfonic acid group-containing monomers and acrylonitrile. In addition, (meth) acrylic acid means acrylic acid and / or methacrylic acid, and all have the same meaning as (meth) of the present invention.

Examples of the thermosetting resin include an amino resin, an unsaturated polyester resin, a polyurethane resin, a silicone resin, a thermosetting polyimide resin, and the like, in addition to an epoxy resin and a phenol resin. The thermosetting resin can be used alone or in combination of two or more. As the thermosetting resin, an epoxy resin containing less ionic impurities and the like that corrode semiconductor devices is particularly suitable. Further, a phenol resin can be preferably used as the curing agent for the epoxy resin.

The epoxy resin is not particularly limited, and for example, bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, brominated bisphenol A type epoxy resin, hydrogenated bisphenol A type epoxy resin, bisphenol AF type epoxy. Bifunctional epoxy such as resin, biphenyl type epoxy resin, naphthalene type epoxy resin, fluonlen type epoxy resin, phenol novolac type epoxy resin, orthocresol novolac type epoxy resin, trishydroxyphenylmethane type epoxy resin, tetraphenylol ethane type epoxy resin, etc. An epoxy resin such as a resin, a polyfunctional epoxy resin, a hidden-in type epoxy resin, a trisglycidyl isocyanurate type epoxy resin, or a glycidylamine type epoxy resin can be used.

As the epoxy resin, a novolak type epoxy resin, a biphenyl type epoxy resin, a trishydroxyphenylmethane type epoxy resin, and a tetraphenylol ethane type epoxy resin are particularly preferable. This is because these epoxy resins are highly reactive with the phenol resin as a curing agent and are excellent in heat resistance and the like.

Further, the phenol resin acts as a curing agent for the epoxy resin, and is, for example, a novolak-type phenol resin such as a phenol novolac resin, a phenol aralkyl resin, a cresol novolak resin, a tert-butylphenol novolak resin, or a nonylphenol novolak resin, or a resole type. Examples thereof include phenol resin, polyoxystyrene such as polyparaoxystyrene, and the like. The phenolic resin can be used alone or in combination of two or more. Of these phenolic resins, phenol novolac resin and phenol aralkyl resin are particularly preferable. This is because the connection reliability of the semiconductor device can be improved.

The mixing ratio of the epoxy resin and the phenol resin is preferably, for example, such that the hydroxyl group in the phenol resin has 0.5 equivalent to 2.0 equivalents per 1 equivalent of the epoxy group in the epoxy resin component. More preferred are 0.8 equivalents to 1.2 equivalents. That is, if the blending ratio of both is out of the above range, the sufficient curing reaction does not proceed and the characteristics of the cured epoxy resin are likely to deteriorate.

Further, a thermosetting catalyst of epoxy resin and phenol resin may be used. The thermosetting accelerating catalyst is not particularly limited, and can be appropriately selected and used from known thermosetting accelerating catalysts. The thermosetting catalyst can be used alone or in combination of two or more. As the thermal curing accelerator, for example, an amine-based curing accelerator, a phosphorus-based curing accelerator, an imidazole-based curing accelerator, a boron-based curing accelerator, a phosphorus-boron-based curing accelerator, or the like can be used.

As the curing agent for the epoxy resin, it is preferable to use a phenol resin as described above, but known curing agents such as imidazoles, amines and acid anhydrides can also be used.

It is important that the adhesive layer 4 has adhesiveness (adhesiveness) to an adherend 9 such as an electronic device. Therefore, in order to cross-link the adhesive layer 4 to some extent in advance, a polyfunctional compound that reacts with a functional group at the end of the molecular chain of the polymer may be added as a cross-linking agent. This makes it possible to improve the adhesive properties at high temperatures and improve the heat resistance.

The cross-linking agent is not particularly limited, and a known cross-linking agent can be used. Specifically, for example, an isocyanate-based cross-linking agent, an epoxy-based cross-linking agent, a melamine-based cross-linking agent, a peroxide-based cross-linking agent, a urea-based cross-linking agent, a metal alkoxide-based cross-linking agent, a metal chelate-based cross-linking agent, and a metal salt. Examples thereof include a system-based cross-linking agent, a carbodiimide-based cross-linking agent, an oxazoline-based cross-linking agent, an aziridine-based cross-linking agent, and an amine-based cross-linking agent. As the cross-linking agent, an isocyanate-based cross-linking agent or an epoxy-based cross-linking agent is suitable. In addition, the cross-linking agent can be used alone or in combination of two or more.

In the present invention, instead of using the cross-linking agent, or while using the cross-linking agent, it is also possible to perform the cross-linking treatment by irradiation with an electron beam, ultraviolet rays, or the like.

Other additives can be appropriately added to the adhesive layer 4 as needed. Examples of other additives include fillers, flame retardants, silane coupling agents, ion trapping agents, bulking agents, antioxidants, antioxidants, surfactants and the like.

The filler may be either an inorganic filler or an organic filler, but the inorganic filler is preferable. By blending a filler such as an inorganic filler, the adhesive layer 4 can be improved in thermal conductivity, the elastic modulus can be adjusted, and the like. Examples of the inorganic filler include ceramics such as silica, clay, gypsum, calcium carbonate, barium sulfate, alumina, beryllium oxide, silicon carbide, aluminum nitride, silicon nitride, aluminum, copper, silver, gold, nickel, and chromium. Examples thereof include metals such as lead, tin, zinc, palladium and solder, alloys, and various inorganic powders made of carbon and the like. The filler can be used alone or in combination of two or more. Among them, silica or alumina is preferable as the filler, and molten silica is particularly preferable as the silica. The average particle size of the inorganic filler is preferably in the range of 0.001 μm to 80 μm. The average particle size of the inorganic filler can be measured by, for example, a laser diffraction type particle size distribution measuring device, and in the present application, the particle size when the cumulative volume in the particle size distribution is 50% is referred to as an average particle size.

The blending amount of the filler (particularly the inorganic filler) is preferably 98% by weight or less (0% by weight to 98% by weight) with respect to the organic resin component, and particularly in the case of silica, 0% by weight to 70% by weight. In the case of a functional inorganic filler such as heat conduction or conductivity, it is preferably 10% by weight to 98% by weight.

Examples of the flame retardant include antimony trioxide, antimony pentoxide, and brominated epoxy resin. The flame retardant can be used alone or in combination of two or more. Examples of the silane coupling agent include β- (3,4-epoxycyclohexyl) ethyltrimethoxysilane, γ-glycidoxypropyltrimethoxysilane, γ-glycidoxypropylmethyldiethoxysilane and the like. The silane coupling agent can be used alone or in combination of two or more. Examples of the ion trapping agent include hydrotalcites, bismuth hydroxide and the like. The ion trap agent can be used alone or in combination of two or more.

The adhesive layer 4 contains (A) an epoxy resin, (B) a curing agent, (C) an acrylic resin or a phenoxy resin, and (D) a surface-treated inorganic filler, in particular from the viewpoint of adhesiveness and reliability. It is preferable to do so.

(A) By using the epoxy resin, high adhesiveness, water resistance and heat resistance can be obtained. As the epoxy resin, the above-mentioned known epoxy resin can be used. (B) As the curing agent, the above-mentioned known curing agent can be used.

(C) Acrylic resin has both flexibility and strength and high toughness. A preferable acrylic resin is obtained by polymerizing a monomer having a Tg (glass transition temperature) of −50 ° C. to 50 ° C. and having an epoxy group, a glycidyl group, an alcoholic hydroxyl group, a phenolic hydroxyl group or a carboxyl group as a crosslinkable functional group. It is a crosslinkable functional group-containing (meth) acrylic copolymer. Further, if it contains acrylonitrile or the like and exhibits rubber properties, higher toughness can be obtained.
Further, in the phenoxy resin (C), the phenoxy resin has a long molecular chain and is similar in structure to the epoxy resin, acts as a flexible material in a composition having a viaduct density, and imparts high toughness, so that it has high strength. However, a toughness composition can be obtained. The preferred phenoxy resin has a main skeleton of bisphenol A type, and other commercially available phenoxy resins such as bisphenol F type phenoxy resin, bisphenol A / F mixed phenoxy resin and brominated phenoxy resin are preferable.

(D) Examples of the surface-treated inorganic filler include an inorganic filler surface-treated with a coupling agent. As the inorganic filler, the above-mentioned known inorganic filler can be used, and for example, silica and alumina. The surface treatment with the coupling agent improves the dispersibility of the inorganic filler. Therefore, since an adhesive layer having excellent fluidity can be obtained, the adhesive force with the metal layer 3 can be improved. Further, since the inorganic filler can be highly filled, the water absorption rate can be lowered and the moisture resistance can be improved.

For example, in the surface treatment of the inorganic filler with a silane coupling agent, the hydroxyl group existing on the surface of the inorganic filler and the silane coupling agent are treated by dispersing the inorganic filler in the silane coupling agent solution by a known method. This is done by reacting a hydrolyzed group such as an alkoxy group with a hydrolyzed silanol group to form a Si—O—Si bond on the surface of the inorganic filler.

The thickness of the adhesive layer 4 is not particularly limited, but from the viewpoint of sufficiently adhering the metal layer to the adherend, 3 μm or more is preferable, 5 μm or more is more preferable, and the thickness of the semiconductor package can be reduced. In order to contribute, it is preferably 150 μm or less, and more preferably 100 μm or less. The adhesive layer 4 may be composed of a single layer or a plurality of layers.

Further, the adhesive layer 4 preferably has a loss tangent tan δ of 0.4 or more at 25 ° C. and 50% RH. Further, the loss tangent tan δ of the adhesive layer 4 at 25 ° C. and 50% RH is preferably 3 or less.

The loss tangent tan δ is a value when the temperature is raised from 0 ° C. at a temperature rising rate of 5 ° C./min, measured at a measurement frequency of 1 Hz, and reaches 25 ° C. using a dynamic viscoelasticity measuring device.

When the loss tangent tan δ of the adhesive layer 4 at 25 ° C. and 50% RH is 0.4 or more, the adhesive layer 4 can relieve the stress caused by pushing up the pins of the pickup device. Therefore, even if the amount of push-up of the pin is large, it is possible to suppress the occurrence of pin marks on the metal layer 3. When the loss tangent tan δ is 3 or less, it is possible to pick up well without impairing the responsiveness due to the pin pushing up.

In order to increase the loss tangent tan δ, it is preferable to increase the low molecular weight components such as epoxy resin and phenol resin and decrease the high molecular weight components such as acrylic resin. Further, when the filler is blended, the filler blending amount may be reduced.

Further, the adhesive layer 4 has a peeling force (23 ° C., peeling angle 180 degrees, linear speed 300 mm / min) of 0.3 N / 25 mm or more from the metal layer 3 in the B stage (uncured or semi-cured state). It is preferably 0.5 N / 25 mm or more, more preferably 1.0 N / 25 mm or more. When the peeling force is less than 0.3 N / 25 mm, when the tape for electronic device packaging in which the adhesive layer 4 and the metal layer 3 are separated is expanded, the adhesive layer 4 and the metal layer 3 are separated from each other. There is a risk of peeling.

The water absorption rate of the adhesive layer 4 is preferably 1.5 vol% or less. The method for measuring the water absorption rate is as follows. That is, using an adhesive layer 4 (film-like adhesive) having a size of 50 × 50 mm as a sample, the sample is dried at 120 ° C. for 3 hours in a vacuum dryer, allowed to cool in a desiccator, and then the dry mass is measured. Let's call it M1. The sample is soaked in distilled water at room temperature for 24 hours, then taken out, the surface of the sample is wiped off with a filter paper, and the sample is quickly weighed to obtain M2. The water absorption rate is calculated by the following equation (1).
Water absorption rate (vol%) = [(M2-M1) / (M1 / d)] × 100 (1)
Here, d is the density of the film.
If the water absorption rate exceeds 1.5 vol%, the moisture absorbed may cause package cracks during solder reflow.

The saturated hygroscopicity of the adhesive layer 4 is preferably 1.0 vol% or less. The method for measuring the saturated hygroscopicity is as follows. That is, using a circular adhesive layer 4 (film-like adhesive) having a diameter of 100 mm as a sample, the sample was dried in a vacuum dryer at 120 ° C. for 3 hours, allowed to cool in a desiccator, and then the dry mass was measured to obtain M1. do. The sample is absorbed in a constant temperature and humidity chamber at 85 ° C. and 85% RH for 168 hours, then taken out and quickly weighed to obtain M2. The saturated hygroscopicity is calculated by the following equation (2).
Saturated moisture absorption rate (vol%) = [(M2-M1) / (M1 / d)] × 100 (2)
Here, d is the density of the film.
If the saturated moisture absorption rate exceeds 1.0 vol%, the value of the vapor pressure becomes high due to the moisture absorption during reflow, and good reflow characteristics may not be obtained.

The residual volatile content of the adhesive layer 4 is preferably 3.0 wt% or less. The method for measuring the residual volatile components is as follows. That is, an adhesive layer 4 (film-like adhesive) having a size of 50 × 50 mm was used as a sample, the initial mass of the sample was measured and used as M1, and the sample was heated at 200 ° C. for 2 hours in a hot air circulation constant temperature bath. Weigh it to M2. The residual volatile content is calculated by the following equation (3).
Residual volatile content (wt%) = [(M2-M1) / M1] x 100 (3)
If the residual volatile content exceeds 3.0 wt%, the solvent may be volatilized by heating during packaging, voids may be generated inside the adhesive layer 4, and package cracks may occur.

Further, the adhesive strength between the adhesive tape 5 and the adhesive layer 4 in a state where the adhesive layer 4 and the metal layer 3 are picked up from the adhesive tape 5 is 0.03 to 0.5 N / 25 mm. Since the adhesive strength between the adhesive tape 5 and the adhesive layer 4 in a state where the adhesive layer 4 and the metal layer 3 are picked up from the adhesive tape 5, the adhesive layer 52 of the adhesive tape 5 is a radiation-curable adhesive. When the adhesive layer 4 and the metal layer 3 are picked up after the adhesive tape 5 is irradiated with radiation to reduce the adhesive strength, the adhesive strength is the adhesive strength after the irradiation.

The adhesive strength conforms to JIS Z0237, and the adhesive tape 5 cut to a width of 25 mm and the adhesive layer 4 are bonded together in an environment of 23 ° C. and 50% RH, and peeled off using a universal tensile tester. Measure at an angle of 180 ° and a peeling speed of 300 mm / min.

In order to keep the adhesive strength within the above range, the viscoelasticity and surface energy of each of the adhesive layer 52 and the adhesive layer 4 of the adhesive tape 5 may be adjusted, or the combination thereof may be adjusted.

When the adhesive strength between the adhesive tape 5 and the adhesive layer 4 is 0.5 N / 25 mm or less, the push-up speed and the push-up amount of the pin are reduced when the adhesive layer and the metal layer 3 are picked up from the adhesive tape. Since it can be picked up even if the force applied to the metal layer is small, it is possible to suppress the formation of pin marks on the metal layer 3. When the adhesive strength between the adhesive tape 5 and the adhesive layer 4 is 0.03 N / 25 mm or more, the metal layer 3 and the adhesive layer 4 are peeled off from the adhesive tape when the metal layer 3 and the adhesive layer 4 are expanded. It is held well without any problems.

Next, an example of a method for manufacturing the tape 1 for an electronic device package according to the present embodiment will be described. First, a long metal layer 3 is prepared. As the metal layer 3, a commercially available metal foil may be used.

Further, separately, a long film-shaped adhesive layer 4 is formed. The adhesive layer 4 can be formed by using a conventional method of preparing a resin composition and forming it into a film-like layer. Specifically, for example, the resin composition is applied onto an appropriate separator S (release paper or the like) and dried (if heat curing is required, heat treatment is applied as necessary and dried). , A method of forming the adhesive layer 4 and the like. The resin composition may be a solution or a dispersion.

Next, as shown in FIG. 4A, the metal layer 3 and the adhesive layer 4 are heat-bonded at 80 ° C. using a bonding roller r or the like. Next, as shown in FIG. 4B, the adhesive layer 4 peeled off from the separator S is bonded to the base tape 2 using a bonding roller r or the like.

In the above description, after the metal layer 3 and the adhesive layer 4 are bonded together, the base material tape 2 is bonded to the surface on the adhesive layer 4 side, but the adhesive layer 4 is bonded to the base material tape 2. The metal layer 3 may be bonded on the adhesive layer 4 after the bonding is performed.

Next, as shown in FIG. 4C, the adhesive layer 4 and the metal layer 3 are preliminarily made into a predetermined size by using a lattice-shaped push-cut tooth having a predetermined label shape (here, a square shape) on the outer edge. While being separated, the entire surface on which the individual pieces are arranged is pre-cut so as to have a predetermined label shape, and as shown in FIG. 4D, the peripheral unnecessary portion 6 is peeled off from the base tape 2 and removed. ..

Here, after the metal layer 3 and the adhesive layer 4 are individualized using the push-cut teeth, the outer edge portion of the individualized metal layer 3 is pushed toward the adhesive layer 4. Warpage (not shown) has occurred. Therefore, as shown in FIG. 5 (A), the protective tape 20 is attached to the surface of the metal layer 3 and the adhesive layer 4 opposite to the base tape 2 side, and as shown in FIG. 5 (B). , The protective tape 20, the metal layer 3, the adhesive layer 4, and the base tape 2 are pressure-processed using a pair of pressure rollers R to correct the warp. At this time, since the maximum value of the total length of the individual base tapes 2 constituting the row L in the lateral direction is within 160% of the minimum value, the pressure roller R is moved while moving in the longitudinal direction. Even if pressure is applied at a constant pressure, there is little variation in the pressure applied to each piece, so that the warp of the metal layer 3 is corrected with high accuracy.
As the protective tape 20, the same one as the base tape 2 or a known separator can be used.

Further, the method for forming the metal layer 3 and the adhesive layer 4 having a predetermined shape on the base material tape 2 is not limited to the above, and the long metal layer 3 is formed into the long base material tape 2. After bonding, punching into a predetermined shape and removing unnecessary portions 6, the adhesive layer 4 formed in the predetermined shape may be bonded onto the metal layer 3 having the predetermined shape, or each of them may have a predetermined shape in advance. The metal layer 3 and the adhesive layer 4 formed in 1 may be bonded to the base material tape 2, but due to the simplicity of the manufacturing process, the metal layer 3 and the adhesive layer 4 are manufactured by the above-mentioned steps shown in FIGS. 4 (A) to 4 (D). Is preferable. When the metal layer 3 and the adhesive layer 4 are punched into individual shapes, the individualized metal layer 3 is subjected to roll press processing.

Separately, the adhesive tape 5 is produced. The base film 51 can be formed by a conventionally known film forming method. Examples of the film-forming method include a calendar film-forming method, a casting method in an organic solvent, an inflation extrusion method in a closed system, a T-die extrusion method, a co-extrusion method, and a dry laminating method. Next, the pressure-sensitive adhesive composition is applied onto the base film 51 and dried (by heat-crosslinking if necessary) to form the pressure-sensitive adhesive layer 52. Examples of the coating method include roll coating, screen coating, and gravure coating. The pressure-sensitive adhesive composition may be directly applied to the base film 51 to form the pressure-sensitive adhesive layer 52 on the base film 51, or the release paper obtained by peeling the surface of the pressure-sensitive adhesive composition. After forming the pressure-sensitive adhesive layer 52 by applying to the like, the pressure-sensitive adhesive layer may be transferred to the base film 51. As a result, the pressure-sensitive adhesive tape 5 in which the pressure-sensitive adhesive layer 52 is formed on the base film 51 is produced.

After that, the base material tape 2 was peeled off and removed from the laminated body of the protective tape 20, the metal layer 3, the adhesive layer 4, and the base material tape 2 which had been subjected to pressure processing, and protected as shown in FIG. 6 (A). The adhesive tape 5 is laminated so that the surface of the adhesive tape 5 on the adhesive layer 52 side of the adhesive layer 3 and the adhesive layer 4 of the predetermined shape provided on the tape 20 is in contact with the surface of the adhesive layer 4.

Next, as shown in FIG. 6 (B), the adhesive tape 5 is pre-cut into a predetermined shape using a push-cutting blade or the like, and as shown in FIG. 6 (C), the peripheral unnecessary portion 7 is peeled off from the protective tape 20. And the tape 1 for an electronic device package is made by removing the tape. When the same protective tape 20 as the base tape 2 is used, the protective tape 20 functions as the base tape 2 in FIGS. 2 and 3. When the protective tape 20 is made of a different material, the protective tape 20 used for the precut processing may be peeled off and the base tape 2 or a known separator may be attached to the adhesive layer 52 of the adhesive tape 5. ..

<How to use>
Next, a method of manufacturing the electronic device package 8 using the electronic device package tape 1 of the present embodiment will be described with reference to FIGS. 8 to 10. In the present embodiment, the semiconductor chip C flip-chip-connected on the adherend 9 will be described as an example of the electronic device package 8.

[Semiconductor wafer W mounting process]
First, a separate dicing tape D similar to the adhesive tape 5 of the tape 1 for electronic device packaging of the present invention is prepared, and a semiconductor is provided at the center of the dicing tape D as shown in FIG. 8 (A). The wafer W is attached, and the wafer W is adhesively held and fixed (mounting step of the semiconductor wafer W), and the ring frame R is attached to the peripheral edge of the dicing tape D. At this time, the dicing tape D is attached to the back surface of the semiconductor wafer W. The back surface of the semiconductor wafer W means a surface opposite to the circuit surface (also referred to as a non-circuit surface, a non-electrode forming surface, or the like). The bonding method is not particularly limited, but a heat-bonding method is preferable. The crimping is usually performed while pressing with a pressing means such as a crimping roll.

[Dicing process of semiconductor wafer W]
Next, as shown in FIG. 8B, dicing of the semiconductor wafer W is performed. As a result, the semiconductor wafer W is cut into a predetermined size and fragmented (small pieces) to manufacture the semiconductor chip C. Dicing is performed, for example, from the circuit surface side of the semiconductor wafer W according to a conventional method. Further, in this step, for example, a cutting method called full cut in which the dicing tape D is cut can be adopted. The dicing apparatus used in this step is not particularly limited, and conventionally known dicing apparatus can be used. When expanding the dicing tape D, the expansion can be performed using a conventionally known expanding device.

[Semiconductor chip C pickup process]
As shown in FIG. 8C, the semiconductor chip C is picked up and the semiconductor chip C is peeled off from the dicing tape D. The pickup method is not particularly limited, and various conventionally known methods can be adopted. For example, the dicing tape D to which the semiconductor chip C and the ring frame R are bonded is placed on the stage S of the pickup device with the base film side facing down, and the ring frame R is fixed in a hollow cylindrical shape. The push-up member T is raised to expand the dicing tape D. In this state, a method of pushing up each semiconductor chip C from the base film side of the dicing tape D by a pin N and picking up the pushed up semiconductor chip C by a pickup device and the like can be mentioned.

[Flip chip connection process]
As shown in FIG. 8D, the picked up semiconductor chip C is fixed to an adherend 9 such as a substrate by a flip chip bonding method (flip chip mounting method). Specifically, the semiconductor chip C is normally attached to the adherend 9 in a form in which the circuit surface (also referred to as a surface, a circuit pattern forming surface, an electrode forming surface, etc.) of the semiconductor chip C faces the adherend 9. Fix according to the law. For example, first, flux is attached to the bump 10 as a connection portion formed on the circuit surface side of the semiconductor chip C. Next, the bump 10 of the semiconductor chip C is brought into contact with the conductive material 11 (solder or the like) for bonding attached to the connection pad of the adherend 9, and the bump 10 and the conductive material 11 are melted while being pressed. Electrical conduction between the semiconductor chip C and the adherend 9 can be ensured, and the semiconductor chip C can be fixed to the adherend 9 (flip chip bonding step). At this time, a gap is formed between the semiconductor chip C and the adherend 9, and the gap distance thereof is generally about 30 μm to 300 μm. The flux remaining on the facing surface and the gap between the semiconductor chip C and the adherend 9 is washed and removed.

As the adherend 9, various substrates such as a lead frame and a circuit board (wiring circuit board, etc.) can be used. The material of such a substrate is not particularly limited, and examples thereof include a ceramic substrate and a plastic substrate. Examples of the plastic substrate include an epoxy substrate, a bismaleimide triazine substrate, a polyimide substrate and the like. Further, a chip-on-chip structure can be obtained by using another semiconductor chip as an adherend 9 and connecting the semiconductor chip C by flip-chip.

Next, as shown in FIG. 9A, the base material tape 2 of the electronic device package tape 1 according to the present embodiment is peeled off to expose the metal layer 3 and the adhesive layer 52 of the adhesive tape 5. The peripheral edge of the pressure-sensitive adhesive layer 52 is fixed to the ring frame R.

Next, as shown in FIG. 9B, the individualized metal layer 3 and the adhesive layer 4 are picked up and peeled off from the adhesive tape 5. The pickup can be performed in the same process as the pickup process of the semiconductor chip 10C described above.

Next, the adhesive layer 4 side of the picked up metal layer 3 and the adhesive layer 4 is bonded to the back surface of the semiconductor chip C connected by flip-chip as shown in FIG. At this time, since the warp of the metal layer 3 is corrected, it is bonded to the semiconductor chip C without involving voids, so that it is possible to reduce the peeling of the adhesive layer 4 from the semiconductor chip C. .. After that, the adhesive layer 4 is cured, and a sealing material (sealing resin or the like) is filled in the periphery of the semiconductor chip C with the metal layer 3 and the gap between the semiconductor chip C and the adherend 9 to seal the adhesive layer 4. Sealing is performed according to a conventional method.

Further, in the above description, the semiconductor chip C flip-chip connected on the adherend 9 has been described as an example of the electronic device package 8, but the present invention is not limited to this, and for example, the same size is applied on the semiconductor chip. In an electronic device package structure in which other semiconductor chips are laminated, a lower semiconductor chip is interposed via an adhesive layer 4 in order to use the metal layer 3 of the electronic device package tape 1 of the present invention as a spacer between the two chips. A metal layer 3 may be provided on the metal layer 3.

Further, in the present embodiment, the pressure-sensitive adhesive layer 52, the adhesive layer 4, and the metal layer 3 are provided in this order, but the pressure-sensitive adhesive layer 52, the metal layer 3, and the adhesive layer 4 are provided in this order. May be good.

Further, in the above-described embodiment, the example in which the size and the number of individual pieces in the column L are the same and the total value of the length l of the individual pieces in all the columns L is constant has been described. If the total value of the length l of the individual pieces of the column L is within 160% of the minimum value among the total values of the plurality of columns L in the aggregate 30, the value in the column L is as shown in FIG. The number of pieces may be different. In the modification shown in FIG. 7, the total value of the length l of the pieces of the column L1 is the minimum value in the aggregate 30, and the total value of the length l of the pieces of the column L2 is in the aggregate 30. Is the maximum value. The total value of the individual pieces length l of the column L2 is within 160% of the total value of the individual pieces length l of the column L1, and the lengths of the individual pieces of all the columns in the aggregate 30 are within 160%. The total value of l is within 160% of the total value of the length l of the pieces in column L1. Therefore, after the metal layer 3 and the adhesive layer 4 are separated into individual pieces, the metal layer 3 and the adhesive layer 4 are applied to the aggregate 30 of the metal layer 3 and the adhesive layer 4 at a constant pressure by the pressure roller R while being moved in the longitudinal direction. Even if pressure is applied, there is little variation in the pressure applied to each piece, so that the warp of the metal layer 3 is corrected with high accuracy.

<Experimental example>
Next, in order to further clarify the effect of the present invention, experimental examples will be described in detail, but the present invention is not limited to these experimental examples.

(1) Preparation of Adhesive Tape <Adhesive Composition (1)>
As an acrylic copolymer (A1) having a functional group, a copolymer composed of 2-ethylhexyl acrylate, 2-hydroxyethyl acrylate and acrylic acid, having a ratio of 2-ethylhexyl acrylate of 80 mol% and a mass average molecular weight of 700,000. Was prepared. Next, 2-isocyanatoethyl methacrylate was added so that the iodine value was 15, and an acrylic copolymer (a-) having a glass transition temperature of −70 ° C., a hydroxyl value of 20 mgKOH / g, and an acid value of 5 mgKOH / g was added. 1) was prepared.

To 100 parts by mass of the acrylic copolymer (a-1), 10 parts by mass of Coronate L (manufactured by Toso Co., Ltd.) was added as a polyisocyanate, and 3 parts by mass of Irgacure 184 (manufactured by BASF) as a photopolymerization initiator. The partially added mixture was dissolved in ethyl acetate and stirred to obtain the pressure-sensitive adhesive composition (1).

The following was prepared as a base film.
<Base film (1)>
The resin beads of the ethylene-methacrylic acid copolymer were melted at 200 ° C. and molded into a long film having a thickness of 150 μm using an extruder to prepare a base film (1). As the ethylene-methacrylic acid copolymer, Nuclel NO35C (trade name) manufactured by Mitsui DuPont Polychemical Co., Ltd. was used.

<Adhesive tape (1)>
The pressure-sensitive adhesive composition (1) is applied to a release liner made of a release-treated polyethylene-terephthalate film so that the thickness after drying is 10 μm, and the pressure-sensitive adhesive layer is dried at 110 ° C. for 3 minutes. Then, it was bonded to the base film (2) to prepare an adhesive tape (1).

(2) Preparation of adhesive layer

<Adhesive layer (1)>
80 parts by mass of acrylic resin (manufactured by Nagase Chemtex Co., Ltd., trade name "Teisan Resin SG-P3", Mw 850,000, Tg 12 ° C) and naphthalene type epoxy resin (manufactured by DIC Corporation, trade name "HP-4700") 10 An adhesive composition solution was prepared by dissolving 10 parts by mass of a phenol resin (manufactured by Meiwa Kasei Co., Ltd., trade name "MEH7851") as a curing agent in methyl ethyl ketone. This adhesive composition solution was applied on a mold release-treated film (release liner) made of a polyethylene terephthalate film having a thickness of 50 μm treated with a silicone mold release treatment, and then dried at 130 ° C. for 5 minutes. As a result, an adhesive layer (1) having a thickness of 20 μm was produced.
(3) Preparation of metal layer <Metal layer (1)>
C1100 (Quality O) (Product name, manufactured by Furukawa Electric Co., Ltd., copper strip, thickness 100 μm)

(4) Preparation of base material tape

The following materials were prepared as base material tapes.
(Resin film d-1)
Styrene-hydrogenated isoprene-styrene block copolymer (SEPS) (manufactured by Kuraray Co., Ltd., trade name "Septon KF-2104") and homopropylene (PP) (manufactured by Ube Kosan Co., Ltd., trade name "J-105G" ) Was mixed at a compounding ratio of 40:60, and the resin beads were melted at 200 ° C. and molded into a long film having a thickness of 90 μm using an extruder to prepare a resin film d-1.

(Adhesive layer composition for base tape e-1)
The acrylic copolymer (A2) having a functional group is composed of 2-ethylhexyl acrylate, 2-hydroxyethyl acrylate and methacrylic acid, and the ratio of 2-ethylhexyl acrylate is 70 mol%, the mass average molecular weight is 500,000, and the glass transition temperature. An acrylic copolymer (a2) having a hydroxyl value of 30 gKOH / g and an acid value of 5 mgKOH / g at −50 ° C. was prepared. To 100 parts by mass of the acrylic copolymer (a2), 8 parts by mass of a polyisocyanate compound (trade name "Coronate L", manufactured by Tosoh Corporation) is added, dissolved in ethyl acetate, stirred, and the substrate is stirred. A pressure-sensitive adhesive layer composition e-1 for tape was obtained.
<Base tape (1)>

The prepared pressure-sensitive adhesive layer composition e-1 for a base material tape is applied to a release liner made of a release-treated polyethylene-terephthalate film so that the thickness after drying is 10 μm, and the temperature is 110 ° C. for 3 minutes. After drying, it was bonded to the resin film d-1 to prepare a base material tape (1) having an adhesive layer for a base material tape formed on the resin film.

(5) Preparation of tape for electronic device package <Reference sample>
The metal layer (1) obtained as described above and the adhesive layer (1) side of the adhesive layer with separator (1) are bonded together at an angle of 120 °, a pressure of 0.2 MPa, a temperature of 80 ° C., and a speed of 1 m /. After bonding under the condition of min, the separator is peeled off and the base material tape (1) is bonded on the adhesive layer (1) under the conditions of a bonding angle of 120 °, a pressure of 0.2 MPa, and a speed of 10 mm / s. rice field. The adhesive layer (1) and the metal layer (1) are cut into 10.6 × 10.6 mm square pieces using push-cut teeth, and 10 pieces are arranged in the lateral direction with an interval of 5 mm. Pre-cut like. After that, another base material tape (1) is attached to the metal layer (1) side as a protective tape, and a pressure roller (400 mm width) is used under the conditions of a linear pressure of 50 kgf / cm and a speed of 1 m / min. The laminated body of the base material tape (1), the metal layer (1), the adhesive layer (1) and the base material tape (1) as the protective tape was pressure-processed. The heating and pressurizing conditions were determined by performing roll pressing at a speed of 1 m / min and changing the pressure, and the maximum pressure when the warp amount was 0.03 mm was defined as the linear pressure. After that, the base material tape (1) is peeled off from the adhesive layer, and the exposed adhesive layer side and the adhesive layer of the adhesive tape (1) are separated from each other by forming an adhesive layer around the metal layer and the adhesive layer. It was used as a reference sample by adhering it so as to be in contact with the base material tape (1) as a protective tape.

<Sample 1>
After bonding the metal layer (1) and the adhesive layer (1) side of the adhesive layer with separator (1) under the conditions of a bonding angle of 120 °, a pressure of 0.2 MPa, a temperature of 80 ° C., and a speed of 1 m / min. The separator was peeled off and removed, and the base material tape (1) was bonded onto the adhesive layer (1) under the conditions of a bonding angle of 120 °, a pressure of 0.2 MPa, and a speed of 10 mm / s. The adhesive layer (1) and the metal layer (1) are cut into 10.6 × 10.6 mm square pieces using push-cut teeth, and 13 pieces are arranged in the lateral direction with an interval of 5 mm. Pre-cut like. After that, another base material tape (1) is attached to the adhesive layer (1) side as a protective tape, and a pressure roller (400 mm width) is used under the conditions of a linear pressure of 50 kgf / cm and a speed of 1 m / min. , The laminated body of the base material tape (1), the metal layer (1), the adhesive layer (1) and the base material tape (1) as the protective tape was subjected to pressure processing. After that, the base material tape (1) is peeled off from the adhesive layer, and the exposed adhesive layer side and the adhesive layer of the adhesive tape (1) are separated from each other by forming an adhesive layer around the metal layer and the adhesive layer. The sample 1 was prepared by adhering them so as to be in contact with the base material tape (1).

<Sample 2>
After bonding the metal layer (1) and the adhesive layer (1) side of the adhesive layer with separator (1) under the conditions of a bonding angle of 120 °, a pressure of 0.2 MPa, a temperature of 80 ° C., and a speed of 1 m / min. The separator was peeled off and removed, and the base material tape (1) was bonded onto the adhesive layer (1) under the conditions of a bonding angle of 120 °, a pressure of 0.2 MPa, and a speed of 10 mm / s. The adhesive layer (1) and the metal layer (1) are cut into 10.6 × 10.6 mm square pieces using push-cut teeth, and 16 pieces are arranged in the lateral direction with an interval of 5 mm. Pre-cut like. After that, another base material tape (1) is attached to the adhesive layer (1) side as a protective tape, and using a pressure roller and (400 mm width), the linear pressure is 50 kgf / cm and the speed is 1 m /. Under the condition of min, the laminate of the base material tape (1), the metal layer (1), the adhesive layer (1), and the base material tape (1) as the protective tape was subjected to pressure processing. After that, the base material tape (1) is peeled off from the adhesive layer, and the exposed adhesive layer side and the adhesive layer of the adhesive tape (1) are separated from each other by forming an adhesive layer around the metal layer and the adhesive layer. The sample 2 was prepared by adhering them so as to be in contact with the base material tape (1).

<Sample 3>
After bonding the metal layer (1) and the adhesive layer (1) side of the adhesive layer with separator (1) under the conditions of a bonding angle of 120 °, a pressure of 0.2 MPa, a temperature of 80 ° C., and a speed of 1 m / min. The separator was peeled off and removed, and the base material tape (1) was bonded onto the adhesive layer (1) under the conditions of a bonding angle of 120 °, a pressure of 0.2 MPa, and a speed of 10 mm / s. The adhesive layer (1) and the metal layer (1) are cut into 10.6 × 10.6 mm square pieces using push-cut teeth, and seven pieces are arranged in the lateral direction with an interval of 5 mm. Pre-cut like. After that, another base material tape (1) is attached to the adhesive layer (1) side as a protective tape, and a pressure roller (400 mm width) is used under the conditions of a linear pressure of 50 kgf / cm and a speed of 1 m / min. , The laminated body of the base material tape (1), the metal layer (1), the adhesive layer (1) and the base material tape (1) as the protective tape was subjected to pressure processing. After that, the base material tape (1) is peeled off from the adhesive layer, and the exposed adhesive layer side and the adhesive layer of the adhesive tape (1) are separated from each other by forming an adhesive layer around the metal layer and the adhesive layer. The sample 3 was prepared by adhering them so as to be in contact with the base material tape (1).

<Sample 4>
After bonding the metal layer (1) and the adhesive layer (1) side of the adhesive layer with separator (1) under the conditions of a bonding angle of 120 °, a pressure of 0.2 MPa, a temperature of 80 ° C., and a speed of 1 m / min. The separator was peeled off and removed, and the base material tape (1) was bonded onto the adhesive layer (1) under the conditions of a bonding angle of 120 °, a pressure of 0.2 MPa, and a speed of 10 mm / s. The adhesive layer (1) and the metal layer (1) are cut into 10.6 × 10.6 mm square pieces using push-cut teeth, and 19 pieces are arranged in the lateral direction with an interval of 5 mm. Pre-cut like. After that, another base material tape (1) is attached to the adhesive layer (1) side as a protective tape, and a pressure roller (400 mm width) is used under the conditions of a linear pressure of 50 kgf / cm and a speed of 1 m / min. , The laminated body of the base material tape (1), the metal layer (1), the adhesive layer (1) and the base material tape (1) as the protective tape was subjected to pressure processing. After that, the base material tape (1) is peeled off from the adhesive layer, and the exposed adhesive layer side and the adhesive layer of the adhesive tape (1) are separated from each other by forming an adhesive layer around the metal layer and the adhesive layer. The sample 4 was freshly bonded so as to be in contact with the base material tape (1).

(Amount of warpage)
The above sample was observed from the metal layer side with a measuring microscope MF-J4020D manufactured by Mitutoyo Co., Ltd., and the height (thickness) of one end of the individualized metal layer and the part inside 500 μm from the end. The difference from the height (thickness) was measured and used as the amount of warpage of the metal layer. The results are shown in Table 1.

(Removability)
Ten chips of 10.6 × 10.6 mm square were prepared, and the metal layer in the above-mentioned sample row was bonded onto the chips via an adhesive layer. Then, the adhesive layer was heated at 150 ° C. for 1 hour to cure, and 10 samples were prepared. Then, the presence or absence of peeling of the adhesive layer from the chip was observed with an optical microscope. Those having no peeled sample or having 1 to 3 peeled samples were evaluated as good products, and those having 4 or more peeled samples were evaluated as defective products.

As shown in Table 1, in Samples 1 and 2, the total length of the individual base tapes constituting the row in the lateral direction is within 160% of the total value of the reference samples. Good results were obtained in the evaluation of peelability.

On the other hand, in the sample 3, the total value of the maximum lengths of the individual base tapes constituting the row in the lateral direction is less than 100% of the total value of the reference sample. The pressure applied to one piece is too large, the adhesive layer is deformed, appropriate pressure is not applied to the metal layer, the warp of the metal layer is not corrected, and the result is inferior in the evaluation of peelability. became. In sample 4, the total length of the base tapes of the individual pieces constituting the row in the lateral direction is more than 160% of the total value of the reference sample. The pressure was too small to correct the warp of the metal layer, resulting in inferior evaluation of releasability.

From the above, the total value of the lengths of the individual base tapes constituting the row in the lateral direction is the total value of the lengths of the individual substrate tapes constituting the reference row in the lateral direction. It was found that good results were obtained in the evaluation of peelability when the content was within 160%.

1: Electronic device package tape 2: Base material tape 3: Metal layer 4: Adhesive layer 5: Adhesive tape 5a: Label part 5b: Peripheral part

Claims (5)

With a long base tape and
An aggregate of a plurality of individual pieces made of a laminated body of an adhesive layer and a metal layer provided on the base material tape, and an aggregate.
It has an adhesive tape that covers the aggregate and has a label portion having a predetermined planar shape provided so as to be in contact with the base tape around the aggregate.
A plurality of the individual pieces in the aggregate are arranged along the lateral direction of the substrate tape to form a row, and the rows are arranged in a plurality of rows in the longitudinal direction of the substrate tape in the aggregate. Ori,
A tape for an electronic device package, wherein the maximum value of the total length of the individual pieces constituting the row in the lateral direction is within 160% of the minimum value of the total value. The tape for electronic device packaging according to claim 1, wherein the adhesive layer has a loss tangent of 0.4 or more at 25 ° C. and 50% RH. The tape for an electronic device package according to claim 1 or 2, wherein the metal layer contains copper or aluminum. From claim 1, wherein the adhesive layer contains (A) an epoxy resin, (B) a curing agent, (C) an acrylic resin or a phenoxy resin, and (D) a surface-treated inorganic filler. The tape for an electronic device package according to any one of claims 3. The adhesive tape has an adhesive layer, and the adhesive layer is an acrylic acid ester represented by CH ₂ = CHCOOR (in the formula, R is an alkyl group having 4 to 18 carbon atoms). 1 to 4, which comprises an acrylic polymer composed of a hydroxyl group-containing monomer and an isocyanate compound having a radically reactive carbon-carbon double bond in the molecule. The tape for electronic device packaging described in any one of the items.

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