JP2020053452A - Electronic device packaging tape - Google Patents

Abstract

To provide an electronic device packaging tape capable of reducing peel-off of an adhesive layer from an electronic device when a metal layer is bonded to the electronic device via the adhesive layer and the adhesive layer is cured.SOLUTION: An electronic device packaging tape of the present invention includes a long base tape 2, an aggregate 30 formed by assembling a plurality of individual pieces made of a laminate of an adhesive layer 4 and a metal layer 3 provided on the base tape 2, and a pressure-sensitive adhesive tape 5 having a label portion 5a having a predetermined planar shape and provided so as to cover the aggregate 30 and contact the base tape 2 around the aggregate 30. A plurality of individual pieces of the aggregate 30 are disposed along the lateral direction of the base tape 2 to form a column L. A plurality of columns L are disposed in the longitudinal direction of the base tape 2 in the aggregate 30. The total value of length in the lateral direction of the base tape 2 of the individual pieces forming the column L is 160% or less of the minimum value of the total value.SELECTED DRAWING: Figure 2

Description

  The present invention relates to an electronic device packaging tape, and more particularly, to an electronic device packaging tape having a metal layer.

  In recent years, electronic devices such as mobile phones and notebook PCs have been required to be thinner and smaller. Therefore, in order to reduce the thickness and size of an electronic device package such as a semiconductor package mounted on an electronic device, the number of electrodes of an electronic device or a circuit board is increased, and the pitch is further reduced. Such electronic device packages include, for example, flip chip (FC) mounting packages.

  In the flip-chip mounting package, as described above, since the number of electrodes is increased or the pitch is reduced, an increase in the amount of heat generated is a problem. Therefore, it has been proposed to provide a metal layer on the back surface of the electronic device via an adhesive layer as a heat dissipation structure of the flip chip mounting package (for example, see Patent Document 1).

  Further, in a flip-chip mounting package, the linear expansion coefficient of an electronic device and the linear expansion coefficient of a circuit board may be significantly different. In this case, in the process of manufacturing the electronic device package, when the intermediate product is heated and cooled, a difference occurs in the amount of expansion and contraction between the electronic device and the circuit board. This difference causes the electronic device package to be warped. Providing a metal layer on the back surface of an electronic device via an adhesive layer has also been proposed as a structure for suppressing such warpage (see, for example, Patent Document 2).

  Further, in a flip-chip mounting package, it has been proposed to provide a metal layer on the back surface of an electronic device via an adhesive layer, and to use this metal layer as a protective layer for laser marking (for example, see Patent Document 3). . Patent Literature 3 discloses an electronic device package in which the plane size of the electronic device is the same as the plane size of the metal layer and the adhesive layer.

  In recent years, there is a case where another semiconductor chip of the same size is further stacked on the semiconductor chip to perform three-dimensional mounting. Here, in order to be able to stack another semiconductor chip of the same size on the semiconductor chip, it is necessary to stack a spacer between them. This is because another semiconductor chip is also stacked on the electrode pad portion of the semiconductor chip. It has been proposed to use a metal layer with an adhesive layer as the spacer (for example, see Patent Document 4). Patent Literature 4 discloses a process of bonding a spacer adhesive sheet having a metal layer having an adhesive layer on at least one surface to a dicing sheet using the adhesive layer as a bonding surface; Forming a chip-shaped spacer having an adhesive layer, and pushing up the spacer with a pin, and using the pushed-up spacer to peel the semiconductor chip together with the adhesive layer from the dicing sheet. It is described that the apparatus is provided by a step of peeling off a dicing sheet together with an adhesive layer by an apparatus and a step of fixing a spacer to an adherend via the adhesive layer.

JP 2007-235022 A Japanese Patent No. 5487847 Japanese Patent No. 5419226 Japanese Patent No. 4954569

  Patent Document 4 discloses that an adhesive sheet for a spacer having a metal layer provided with an adhesive layer is bonded to a dicing sheet with the adhesive layer as a bonding surface, and the adhesive sheet for a spacer is diced to form an adhesive layer. It is described that after forming the chip-shaped spacer provided, the chip-shaped spacer is peeled off from the dicing sheet together with the adhesive layer.However, if the adhesive layer and the metal layer are cut in advance and separated into individual pieces. It is convenient.

  When the adhesive layer and the metal layer are cut in advance into individual pieces, it is considered that cutting is usually performed using a cutting tooth. When cutting is performed using the incised teeth, the metal layer may be warped. When the metal layer is warped, it is conceivable to correct the warp by using a pressure roller. However, when pressure is applied to the adhesive layers and the metal layers that are singulated and arranged in a plurality of rows and columns using a pressure roller, the warpage is not forced unless the individual metal layers are uniformly pressed, and the metal layer is not pressed. When the layer is bonded to an electronic device such as a semiconductor chip via an adhesive layer and the adhesive layer is cured, there is a problem that the adhesive layer may be peeled off from the electronic device.

  Therefore, the present invention is to correct the warpage of the metal layer appropriately, the metal layer is bonded to an electronic device such as a semiconductor chip via an adhesive layer, and when the adhesive layer is cured, the adhesive layer It is an object of the present invention to provide an electronic device package tape capable of reducing the peeling of an electronic device from an electronic device.

  In order to solve the above problems, an electronic device package tape according to the present invention is an individual piece comprising a long base tape and a laminate of an adhesive layer and a metal layer provided on the base tape. And an adhesive tape having a label portion having a predetermined planar shape provided so as to cover the aggregate and contact the base tape around the aggregate, and The plurality of pieces in the assembly are arranged in a row along the short direction of the base tape to form a row, and the row is a plurality of pieces in the assembly in the longitudinal direction of the base tape. It is arranged in a row, and the maximum value of the total value of the lengths of the individual pieces constituting the row in the width direction of the base tape is within 160% of the minimum value of the total value. .

  The electronic device package tape preferably has a loss tangent of 0.4 or more at 25 ° C. and 50% RH of the adhesive layer.

  In the electronic device package tape, it is preferable that the metal layer contains copper or aluminum.

  In the above electronic device package tape, the adhesive layer contains (A) an epoxy resin, (B) a curing agent, (C) an acrylic resin or a phenoxy resin, and (D) a surface-treated inorganic filler. Is preferred.

In the electronic device package tape, the pressure-sensitive adhesive layer may be formed of an acrylic acid ester represented by CH ₂ ＣＨCHCOOR (where R is an alkyl group having 4 to 18 carbon atoms); It is preferable to contain an acryl-based polymer comprising a monomer contained and an isocyanate compound having a radical-reactive carbon-carbon double bond in the molecule.

  According to the present invention, the metal layer is appropriately corrected for warpage, the metal layer is bonded to an electronic device such as a semiconductor chip via an adhesive layer, and the adhesive layer is cured when the adhesive layer is cured. Can be prevented from being separated from the electronic device.

1 is a cross-sectional view schematically illustrating a structure of an electronic device package tape according to an embodiment of the present invention. (A) is a top view which shows typically the structure of the tape for electronic device packages which concerns on embodiment of this invention, (b) is the same sectional view. It is a perspective view showing typically the structure of the tape for electronic device packages concerning the embodiment of the present invention. It is explanatory drawing which shows typically the manufacturing method of the tape for electronic device packages which concerns on embodiment of this invention, (A) is a longitudinal cross-sectional view which shows the bonding process of a metal layer, (B) is an adhesive agent. It is a longitudinal direction sectional view showing a lamination process of a layer, (C) is a transverse direction sectional view showing a precut process, and (D) is a perspective view showing a removal process of an unnecessary part. It is explanatory drawing which shows typically the manufacturing method of the tape for electronic device packages which concerns on embodiment of this invention, (A) is a longitudinal cross-sectional view which shows the bonding process of the protective tape 20, (B) Pressing It is a longitudinal direction sectional view showing a processing process. BRIEF DESCRIPTION OF THE DRAWINGS It is explanatory drawing which shows typically the manufacturing method of the tape for electronic device packages which concerns on embodiment of this invention, (A) is a cross-sectional view which shows the lamination process of an adhesive tape, (B) is a precut. It is a lateral direction sectional view showing a process, and (C) is a lateral direction sectional view showing a removal process of an unnecessary part. (A) is a top view which shows typically the modification of the structure of the tape for electronic device packages which concerns on embodiment of this invention, (b) is the same sectional view. It is sectional drawing which illustrates typically the usage method of the tape for electronic device packages which concerns on embodiment of this invention. It is sectional drawing which illustrates typically the usage method of the tape for electronic device packages which concerns on embodiment of this invention. BRIEF DESCRIPTION OF THE DRAWINGS It is sectional drawing which shows typically the structure of the electronic device package using the tape for electronic device packages which concerns on embodiment of this invention.

  Hereinafter, embodiments of the present invention will be described in detail.

  FIG. 1 is a sectional view showing an electronic device package tape 1 according to an embodiment of the present invention. This electronic device package tape 1 has an adhesive tape 5 composed of a base film 51 and an adhesive layer 52 provided on the base film 51, and an adhesive layer is provided on the adhesive layer 52. 4 and a metal layer 3 laminated on the adhesive layer 4. The metal layer 3 may be provided indirectly on the adhesive layer 4 via a primer layer or the like for improving the adhesion to the adhesive layer 4.

  In the electronic device package tape 1 of the present invention, as shown in FIGS. 2 and 3, the adhesive tape 5 is cut into a shape corresponding to the ring frame R (see FIG. 9), and the metal layer 3 and the adhesive layer 4 is also cut (pre-cut) into a predetermined shape corresponding to this.

  As shown in FIGS. 2 and 3, the adhesive tape 5 (label portion 5 a) cut into a shape corresponding to the metal layer 3, the adhesive layer 4, and the ring frame R is provided in the electronic device package tape 1 of the present invention. It is preferable that the long base tape 2 on which a plurality of laminated bodies are formed is wound in a roll shape. In the present embodiment, the long base tape 2 is wound in a roll shape.

  The electronic device package tape 1 of the present invention has a base tape 2 as shown in FIGS. 2 and 3, and a metal layer 3 and a base material of the metal layer 3 are provided on the base tape 2. An adhesive layer 4 laminated on the metal layer 3 on the side opposite to the tape 2 side, and provided so as to cover the adhesive layer 4 and come into contact with the base tape 2 around the adhesive layer 4. An adhesive tape 5 having a label portion 5a having a predetermined planar shape and a peripheral portion 5b surrounding the outside of the label portion 5a is provided.

  The label portion 5a has a shape corresponding to the ring frame R for dicing. The shape corresponding to the shape of the ring frame R for dicing is preferably substantially the same as the inside of the ring frame R, and is a similar shape larger than the size inside the ring frame R. Further, the shape is not necessarily circular, but a shape close to a circle is preferable, and a circular shape is more preferable. The peripheral part 5b includes a form that completely surrounds the outside of the label part 5a and a form that does not completely surround as shown in the figure. Note that the peripheral portion 5b may not be provided.

  The metal layer 3 and the adhesive layer 4 are cut and singulated in advance into a size corresponding to the plane of the electronic device on which the metal layer 3 and the adhesive layer 4 are to be bonded. A plurality of pieces formed of the laminated body of the cut adhesive layer 4 and the metal layer 3 are aggregated to form an aggregate 30. As shown in FIG. 2 are provided in the longitudinal direction. In addition, as shown in FIGS. 1 and 2, one label 30 is stacked so as to cover one assembly 30.

  A plurality of pieces in the aggregate 30 are arranged along the lateral direction of the base tape to form a row L, and the rows L are arranged in the aggregate 30 in a plurality of rows in the longitudinal direction of the base tape 2. I have. The maximum value of the total value of the lengths l in the short direction of the individual base tapes 2 constituting the row L is within 160% of the minimum value of the total value. In the present embodiment, since the size and the number of pieces in all the rows L are the same, the total value of the lengths l of the pieces in all the rows L is 100% of the minimum value. I have.

  The adhesive layer 4 and the metal layer 3 have a predetermined label shape in an aggregate 30 in which pieces are arranged, and the label shape is obtained by attaching a ring frame R to a peripheral portion of a label portion 5 a of the adhesive tape 5. In this case, the shape is smaller than that of the label portion 5a so that it can be pushed up by the pushing-up member T of the pickup device (see FIG. 9B).

  An adhesive layer 4 is laminated on the metal layer 3. The lamination here may be such that the main part is laminated, and the metal layer 3 and the adhesive layer 4 do not necessarily have to be the same size. However, from the convenience of manufacture, they may have substantially the same shape. preferable.

  Hereinafter, each component will be described.

<Base tape 2>
The base tape 2 can be composed of a known separator, but the base tape used for pre-cutting the electronic device package tape can also be used as it is. When the base tape used for the pre-cut processing of the electronic device package tape is used as it is, the base tape 2 needs to adhesively hold the metal layer 3 at the time of the pre-cut processing. A tape having the provided pressure-sensitive adhesive layer for a base tape can be suitably used.

  Known materials can be used as the material of the resin film constituting the base tape 2. For example, polyester (PET, PBT, PEN, PBN, PTT), polyolefin (PP, PE) are exemplified. And a film in which the adhesiveness and mechanical strength are further improved by partially substituting these materials and copolymers (EVA, EEA, EBA). Further, a laminate of these films may be used. It is preferable to select from polyethylene terephthalate, polypropylene, and polyethylene in terms of heat resistance, smoothness, and availability.

  The thickness of the resin film constituting the base tape 2 is not particularly limited and may be set appropriately, but is preferably from 10 to 150 μm.

  As the resin used for the pressure-sensitive adhesive layer for the base tape, known chlorinated polypropylene resins used for the pressure-sensitive adhesive, acrylic resins, polyester resins, polyurethane resins, epoxy resins and the like can be used. Acrylic adhesives based on polymers are preferred.

  Examples of the acrylic polymer include alkyl (meth) acrylates (eg, methyl ester, ethyl ester, propyl ester, isopropyl ester, butyl ester, isobutyl ester, s-butyl ester, t-butyl ester, pentyl ester, Pentyl ester, hexyl ester, heptyl ester, octyl ester, 2-ethylhexyl ester, isooctyl ester, nonyl ester, decyl ester, isodecyl ester, undecyl ester, dodecyl ester, tridecyl ester, tetradecyl ester, hexadecyl ester, Alkyl groups such as octadecyl esters and eicosyl esters having 1 to 30 carbon atoms, especially linear or branched alkyl esters having 4 to 18 carbon atoms, and the like. ) Acrylic acid cycloalkyl esters (e.g., cyclopentyl ester, acrylic polymer or the like using one or more of the monomer component cyclohexyl ester etc.). In addition, (meth) acrylic acid ester means acrylic acid ester and / or methacrylic acid ester, and (meth) in the present invention has the same meaning.

  The acrylic polymer contains a unit corresponding to another monomer component copolymerizable with the alkyl (meth) acrylate or the cycloalkyl ester, if necessary, for the purpose of improving the cohesive strength, heat resistance, and the like. May be. Examples of such monomer components include carboxyl group-containing monomers such as acrylic acid, methacrylic acid, carboxyethyl (meth) acrylate, carboxypentyl (meth) acrylate, itaconic acid, maleic acid, fumaric acid, crotonic acid; and maleic anhydride. , Acid anhydride monomers such as itaconic anhydride; 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate, 6-hydroxyhexyl (meth) acrylate Hydroxyl-containing monomers such as 8-hydroxyoctyl (meth) acrylate, 10-hydroxydecyl (meth) acrylate, 12-hydroxylauryl (meth) acrylate, (4-hydroxymethylcyclohexyl) methyl (meth) acrylate; Styrene Contains sulfonic acid groups such as sulfonic acid, allylsulfonic acid, 2- (meth) acrylamido-2-methylpropanesulfonic acid, (meth) acrylamidopropanesulfonic acid, sulfopropyl (meth) acrylate, and (meth) acryloyloxynaphthalenesulfonic acid. Monomer; Phosphoric acid group-containing monomer such as 2-hydroxyethyl acryloyl phosphate; acrylamide, acrylonitrile and the like. One or two or more of these copolymerizable monomer components can be used. The use amount of these copolymerizable monomers is preferably 40% by weight or less of all monomer components.

  Further, since the acrylic polymer is crosslinked, a polyfunctional monomer or the like can be included as a monomer component for copolymerization, if necessary. Such polyfunctional monomers include, for example, hexanediol di (meth) acrylate, (poly) ethylene glycol di (meth) acrylate, (poly) propylene glycol di (meth) acrylate, neopentyl glycol di (meth) acrylate, Pentaerythritol di (meth) acrylate, trimethylolpropane tri (meth) acrylate, pentaerythritol tri (meth) acrylate, dipentaerythritol hexa (meth) acrylate, epoxy (meth) acrylate, polyester (meth) acrylate, urethane (meth) Acrylate and the like. One or more of these polyfunctional monomers can be used. The amount of the polyfunctional monomer to be used is preferably 30% by weight or less of the total monomer components from the viewpoint of adhesive properties and the like.

  The acrylic polymer can be prepared, for example, by applying an appropriate system such as a solution polymerization system, an emulsion polymerization system, a bulk polymerization system, or a suspension polymerization system to one or a mixture of two or more component monomers. The pressure-sensitive adhesive layer for the base tape preferably has a composition in which the content of a low-molecular-weight substance is suppressed, and from this point, it is preferable that the weight-average molecular weight is 300,000 or more, and in particular, the main component is an acrylic polymer of 400,000 to 3,000,000 Accordingly, the pressure-sensitive adhesive can be of an appropriate cross-linking type such as an internal cross-linking method or an external cross-linking method.

  Further, in order to control the crosslinking density of the pressure-sensitive adhesive layer for the base tape and to improve the releasability from the pressure-sensitive adhesive tape 5, for example, a polyfunctional isocyanate compound, a polyfunctional epoxy compound, a melamine compound, a metal salt compound, A method of performing a cross-linking treatment using an appropriate external cross-linking agent such as a metal chelate-based compound, an amino resin-based compound, or a peroxide, or a method of mixing a low-molecular compound having two or more carbon-carbon double bonds to form an energy ray An appropriate method such as a method of performing a crosslinking treatment by irradiation or the like can be adopted. When an external cross-linking agent is used, the amount used is appropriately determined depending on the balance with the base polymer to be cross-linked and further on the intended use as an adhesive. In general, it is preferable to add about 20 parts by weight or less, more preferably 0.1 to 20 parts by weight, based on 100 parts by weight of the base polymer.

  The thickness of the pressure-sensitive adhesive layer for a base tape can be appropriately determined without any particular limitation, but is generally about 5 to 200 μm. The pressure-sensitive adhesive layer for a base tape may be composed of a single layer or a plurality of layers.

<Adhesive tape 5>
There is no particular limitation on the adhesive tape 5, and a conventional dicing tape can be used. As the adhesive tape 5, for example, a tape in which an adhesive layer 52 is provided on a base film 51 can be suitably used.

  As the base film 51, any conventionally known one can be used without any particular limitation. However, when a radiation-curable material is used as the pressure-sensitive adhesive layer 52 described below, it has radiation transparency. Preferably, one is used.

  For example, as the material, polyethylene, polypropylene, ethylene-propylene copolymer, polybutene-1, poly-4-methylpentene-1, ethylene-vinyl acetate copolymer, ethylene-ethyl acrylate copolymer, ethylene-acryl Homopolymer or copolymer of α-olefin such as methyl acid copolymer, ethylene-acrylic acid copolymer, ionomer or a mixture thereof, polyurethane, styrene-ethylene-butene or pentene copolymer, polyamide-polyol Thermoplastic elastomers such as copolymers and mixtures thereof can be listed. Further, the base film may be a mixture of two or more materials selected from these groups, or may be a single or multiple layer of these.

  The thickness of the base film 51 is not particularly limited and may be set as appropriate, but is preferably 50 to 200 μm in consideration of an expanding step at the time of pickup.

  In order to improve the adhesion between the base film 51 and the adhesive layer 52, the surface of the base film 51 is subjected to chemical or physical treatment such as chromic acid treatment, ozone exposure, flame exposure, high piezoelectric shock exposure, or ionizing radiation treatment. Target surface treatment.

  Further, in the present embodiment, the pressure-sensitive adhesive layer 52 is provided directly on the base film 51, but a primer layer for improving adhesion, an anchor layer, a stress relaxation layer, an antistatic layer, and the like. May be provided indirectly via a.

  The resin used for the pressure-sensitive adhesive layer 52 of the pressure-sensitive adhesive tape 5 is not particularly limited, and may be a known chlorinated polypropylene resin, acrylic resin, polyester resin, polyurethane resin, epoxy resin, or the like used for the pressure-sensitive adhesive. Although it can be used, an acrylic adhesive having an acrylic polymer as a base polymer is preferable in order to control the adhesive strength to be suitable for suppressing the formation of pin marks on the metal layer.

  Examples of the acrylic polymer include alkyl (meth) acrylates (eg, methyl ester, ethyl ester, propyl ester, isopropyl ester, butyl ester, isobutyl ester, s-butyl ester, t-butyl ester, pentyl ester, Pentyl ester, hexyl ester, heptyl ester, octyl ester, 2-ethylhexyl ester, isooctyl ester, nonyl ester, decyl ester, isodecyl ester, undecyl ester, dodecyl ester, tridecyl ester, tetradecyl ester, hexadecyl ester, Alkyl groups such as octadecyl esters and eicosyl esters having 1 to 30 carbon atoms, especially linear or branched alkyl esters having 4 to 18 carbon atoms, and the like. ) Acrylic acid cycloalkyl esters (e.g., cyclopentyl ester, acrylic polymer or the like using one or more of the monomer component cyclohexyl ester etc.). In addition, (meth) acrylic acid ester means acrylic acid ester and / or methacrylic acid ester, and (meth) in the present invention has the same meaning.

  The acrylic polymer is a unit corresponding to another monomer component copolymerizable with the alkyl (meth) acrylate or the cycloalkyl ester, if necessary, for the purpose of modifying cohesive strength, heat resistance, crosslinkability, and the like. May be included. Examples of such monomer components include carboxyl group-containing monomers such as acrylic acid, methacrylic acid, carboxyethyl (meth) acrylate, carboxypentyl (meth) acrylate, itaconic acid, maleic acid, fumaric acid, crotonic acid; and maleic anhydride. , Acid anhydride monomers such as itaconic anhydride; 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate, 6-hydroxyhexyl (meth) acrylate Hydroxyl-containing monomers such as 8-hydroxyoctyl (meth) acrylate, 10-hydroxydecyl (meth) acrylate, 12-hydroxylauryl (meth) acrylate, (4-hydroxymethylcyclohexyl) methyl (meth) acrylate; Styrene Contains sulfonic acid groups such as sulfonic acid, allylsulfonic acid, 2- (meth) acrylamido-2-methylpropanesulfonic acid, (meth) acrylamidopropanesulfonic acid, sulfopropyl (meth) acrylate, and (meth) acryloyloxynaphthalenesulfonic acid. Monomer; Phosphoric acid group-containing monomer such as 2-hydroxyethyl acryloyl phosphate; acrylamide, acrylonitrile and the like. One or two or more of these copolymerizable monomer components can be used. The use amount of these copolymerizable monomers is preferably 40% by weight or less of all monomer components.

  Further, since the acrylic polymer is crosslinked, a polyfunctional monomer or the like can be included as a monomer component for copolymerization, if necessary. Such polyfunctional monomers include, for example, hexanediol di (meth) acrylate, (poly) ethylene glycol di (meth) acrylate, (poly) propylene glycol di (meth) acrylate, neopentyl glycol di (meth) acrylate, Pentaerythritol di (meth) acrylate, trimethylolpropane tri (meth) acrylate, pentaerythritol tri (meth) acrylate, dipentaerythritol hexa (meth) acrylate, epoxy (meth) acrylate, polyester (meth) acrylate, urethane (meth) Acrylate and the like. One or more of these polyfunctional monomers can be used. The amount of the polyfunctional monomer to be used is preferably 30% by weight or less of the total monomer components from the viewpoint of adhesive properties and the like.

  The acrylic polymer can be prepared, for example, by applying an appropriate system such as a solution polymerization system, an emulsion polymerization system, a bulk polymerization system, or a suspension polymerization system to one or a mixture of two or more component monomers. The pressure-sensitive adhesive layer 52 preferably has a composition in which the content of low-molecular-weight substances is suppressed. From this point, it is preferable that the weight-average molecular weight is 300,000 or more, and in particular, that the main component is an acrylic polymer of 400,000 to 3,000,000. The agent may be of an appropriate crosslinking type such as an internal crosslinking method or an external crosslinking method.

  Further, in order to control the crosslinking density of the pressure-sensitive adhesive layer 52 to improve the pickup property, for example, a polyfunctional isocyanate compound, a polyfunctional epoxy compound, a melamine compound, a metal salt compound, a metal chelate compound, an amino resin compound A method of performing a cross-linking treatment using an appropriate external cross-linking agent such as a compound or a peroxide, or a method of mixing a low-molecular compound having two or more carbon-carbon double bonds and performing a cross-linking treatment by irradiation with energy rays or the like. , Etc. can be adopted. When an external cross-linking agent is used, the amount used is appropriately determined depending on the balance with the base polymer to be cross-linked and further on the intended use as an adhesive. In general, it is preferable to add about 20 parts by weight or less, more preferably 0.1 to 20 parts by weight, based on 100 parts by weight of the base polymer. In addition, in addition to the above-mentioned components, additives such as various tackifiers and antioxidants may be used in the pressure-sensitive adhesive, if necessary, from the viewpoint of preventing deterioration.

  As the pressure-sensitive adhesive constituting the pressure-sensitive adhesive layer 52, a radiation-curable pressure-sensitive adhesive is suitable. Examples of the radiation-curable pressure-sensitive adhesive include an addition-type radiation-curable pressure-sensitive adhesive in which a radiation-curable monomer component or a radiation-curable oligomer component is blended with the above-described pressure-sensitive adhesive.

  Examples of the radiation-curable monomer component to be blended include urethane (meth) acrylate, trimethylolpropane tri (meth) acrylate, tetramethylolmethanetetra (meth) acrylate, pentaerythritol tri (meth) acrylate, and pentaerythritol tetra ( (Meth) acrylate, dipentaerythritol monohydroxypenta (meth) acrylate, dipentaerythritol hexa (meth) acrylate, 1,4-butanediol di (meth) acrylate and the like. These monomer components can be used alone or in combination of two or more.

  The radiation-curable oligomer component includes various oligomers such as urethane-based, polyether-based, polyester-based, polycarbonate-based, and polybutadiene-based oligomers, and those having a molecular weight in the range of about 100 to 30,000 are suitable. The amount of the radiation-curable monomer component or oligomer component can be appropriately determined according to the type of the pressure-sensitive adhesive layer 52 so that the adhesive force of the pressure-sensitive adhesive layer 52 can be reduced. Generally, the amount is, for example, about 5 parts by weight to 500 parts by weight, preferably about 70 parts by weight to 150 parts by weight, based on 100 parts by weight of a base polymer such as an acrylic polymer constituting the adhesive.

  As the radiation-curable pressure-sensitive adhesive, in addition to the addition-type radiation-curable pressure-sensitive adhesive, one having a carbon-carbon double bond as a base polymer in a polymer side chain or in a main chain or at a main chain terminal was used. An intrinsic radiation-curable pressure-sensitive adhesive is also included. The intrinsic radiation-curable pressure-sensitive adhesive does not need to contain low molecular components such as oligomer components or the like, and does not contain much, so that the oligomer components etc. do not move in the pressure-sensitive adhesive over time and are stable. This is preferable because the pressure-sensitive adhesive layer 52 having a layered structure can be formed.

  As the base polymer having a carbon-carbon double bond, a polymer having a carbon-carbon double bond and having adhesiveness can be used without particular limitation. As such a base polymer, a polymer having an acrylic polymer as a basic skeleton is preferable. Examples of the basic skeleton of the acrylic polymer include the acrylic polymers exemplified above.

  The method of introducing a carbon-carbon double bond into an acrylic polymer is not particularly limited, and various methods can be adopted. However, it is easy to introduce a carbon-carbon double bond into a polymer side chain in terms of molecular design. is there. For example, after a monomer having a functional group is copolymerized in advance with an acrylic polymer, a compound having a functional group capable of reacting with the functional group and a carbon-carbon double bond is converted into a radiation-curable compound having a carbon-carbon double bond. And a method of performing a condensation or addition reaction while maintaining the above.

  Examples of combinations of these functional groups include carboxylic acid groups and epoxy groups, carboxylic acid groups and aziridyl groups, and hydroxyl groups and isocyanate groups. Among these combinations of functional groups, a combination of a hydroxyl group and an isocyanate group is preferable because of easy tracing of the reaction. In addition, as long as the combination of these functional groups produces an acrylic polymer having the carbon-carbon double bond, the functional group may be on either side of the acrylic polymer and the compound. In the above preferred combination, it is preferable that the acrylic polymer has a hydroxyl group and the compound has an isocyanate group. In this case, examples of the isocyanate compound having a carbon-carbon double bond include methacryloyl isocyanate, 2-methacryloyloxyethyl isocyanate, and m-isopropenyl-α, α-dimethylbenzyl isocyanate. In addition, as the acrylic polymer, those obtained by copolymerizing the above-described hydroxy group-containing monomer, ether compounds of 2-hydroxyethyl vinyl ether, 4-hydroxybutyl vinyl ether, diethylene glycol monovinyl ether, and the like are used.

  The intrinsic radiation-curable pressure-sensitive adhesive can use the above-mentioned base polymer having a carbon-carbon double bond (especially an acrylic polymer) alone, but the radiation-curable monomer component is not degraded in its properties. A photopolymerizable compound such as an oligomer component or the like can also be blended. The compounding amount of the photopolymerizable compound is usually in the range of 30 parts by weight or less, preferably in the range of 0 to 10 parts by weight based on 100 parts by weight of the base polymer.

  When the radiation-curable pressure-sensitive adhesive is cured by ultraviolet light or the like, it is preferable to include a photopolymerization initiator.

Among the above-mentioned acrylic polymers, an acrylate ester represented by CH ₂ 2CHCOOR (where R is an alkyl group having 4 to 18 carbon atoms), a hydroxyl group-containing monomer, and An acrylic polymer A comprising a radical-reactive carbon-carbon double bond and an isocyanate compound is preferred.

  When the number of carbon atoms of the alkyl group of the acrylic acid alkyl ester is less than 4, the polarity is so high that the peeling force becomes too large, and the pick-up property may be reduced. On the other hand, when the number of carbon atoms in the alkyl group of the acrylic acid alkyl ester exceeds 18, the glass transition temperature of the pressure-sensitive adhesive layer 52 becomes too high, and the adhesive properties at room temperature are reduced. 3 may occur.

  The acrylic polymer A may include a unit corresponding to another monomer component, if necessary.

  In the acrylic polymer A, an isocyanate compound having a radical-reactive carbon-carbon double bond is used. That is, the acrylic polymer preferably has a configuration in which a double bond-containing isocyanate compound is added to a polymer of a monomer composition such as the acrylate or the hydroxyl group-containing monomer. Therefore, the acrylic polymer preferably has a radically reactive carbon-carbon double bond in its molecular structure. Thus, an active energy ray-curable pressure-sensitive adhesive layer (such as an ultraviolet-curable pressure-sensitive adhesive layer) that is cured by irradiation with active energy rays (such as ultraviolet rays) can be obtained, and the peeling force between the metal layer 3 and the pressure-sensitive adhesive layer 52 can be obtained. Can be reduced.

  Examples of the double bond-containing isocyanate compound include methacryloyl isocyanate, acryloyl isocyanate, 2-methacryloyloxyethyl isocyanate, 2-acryloyloxyethyl isocyanate, and m-isopropenyl-α, α-dimethylbenzyl isocyanate. The double bond-containing isocyanate compound can be used alone or in combination of two or more.

  In addition, in order to adjust the adhesive strength before irradiation with active energy rays and the adhesive strength after irradiation with active energy rays, an external cross-linking agent can be appropriately used for the active energy ray-curable adhesive. As a specific means of the external cross-linking method, a method of adding a so-called cross-linking agent such as a polyisocyanate compound, an epoxy compound, an aziridine compound, and a melamine-based cross-linking agent to cause a reaction is used.

  Examples of the polyisocyanate compound include lower aliphatic polyisocyanates such as 1,2-ethylene diisocyanate, 1,4-butylene diisocyanate, and 1,6-hexamethylene diisocyanate; cyclopentylene diisocyanate, cyclohexylene diisocyanate, and isophorone. Alicyclic polyisocyanates such as diisocyanate, hydrogenated tolylene diisocyanate, hydrogenated xylene diisocyanate; 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate, 4,4'-diphenylmethane And aromatic polyisocyanates such as diisocyanate and xylylene diisocyanate. Others include trimethylolpropane / tolylene diisocyanate trimer adduct [trade name, manufactured by Tosoh Corporation] Coronate L "], a trimethylolpropane / hexamethylene diisocyanate trimer adduct [manufactured by Tosoh Corporation, trade name" Coronate HL "], and the like are also used. Examples of the epoxy compound include N, N, N ′, N′-tetraglycidyl-m-xylenediamine, diglycidylaniline, 1,3-bis (N, N-glycidylaminomethyl) cyclohexane, 6-hexanediol diglycidyl ether, neopentyl glycol diglycidyl ether, ethylene glycol diglycidyl ether, propylene glycol diglycidyl ether, polyethylene glycol diglycidyl ether, polypropylene glycol diglycidyl ether, sorbitol polyglycidyl ether, glycerol polyglycidyl ether, penta Erythritol polyglycidyl ether, polyglycerol polyglycidyl ether, sorbitan polyglycidyl ether, trimethylolpropane polyg In addition to sidyl ether, adipic acid diglycidyl ester, o-phthalic acid diglycidyl ester, triglycidyl-tris (2-hydroxyethyl) isocyanurate, resorcin diglycidyl ether, bisphenol-S-diglycidyl ether, and an epoxy group in the molecule And an epoxy resin having two or more of these.

  When an external cross-linking agent is used, the amount used is appropriately determined depending on the balance with the base polymer to be cross-linked and further on the intended use as an adhesive. The amount of the external crosslinking agent used is generally 20 parts by weight or less (preferably 0.1 part by weight to 10 parts by weight) based on 100 parts by weight of the base polymer. Further, the active energy ray-curable pressure-sensitive adhesive may optionally contain, in addition to the above-described components, various conventionally known additives such as tackifiers, antioxidants, and foaming agents.

  In the present invention, instead of using a cross-linking agent, or in addition to using a cross-linking agent, a cross-linking treatment can be performed by irradiation with an electron beam, ultraviolet light, or the like.

  The thickness of the pressure-sensitive adhesive layer 52 is not particularly limited and can be appropriately determined, but is generally about 5 to 200 μm. The pressure-sensitive adhesive layer 52 may be composed of a single layer or a plurality of layers.

<Metal layer 3>
The metal constituting the metal layer 3 is not particularly limited. For example, it is preferable that the metal layer 3 contains at least one selected from the group consisting of stainless steel, aluminum, iron, titanium, tin, nickel, and copper, and has heat dissipation properties and an electronic device package 8. This is preferable from the viewpoint of preventing warpage. Among them, it is particularly preferable to include copper from the viewpoint of high heat conductivity and a heat radiation effect. From the viewpoint of preventing warpage of the electronic device package 8, it is particularly preferable to include aluminum.

  The thickness of the metal layer 3 is not less than 5 μm and less than 200 μm. By setting the thickness to 5 μm or more, it is possible to prevent the metal layer from being deformed due to the push-up of the pins of the pickup device and the pin marks from being generated. In addition, if it is less than 200 μm, processing is easy, and when it is necessary to bend along the core or the bonding roll in winding or bonding, the metal layer is too strong and folds are formed. The phenomenon can be suppressed.

  As such a metal layer 3, a metal foil can be used, and the metal foil may be an electrolytic foil or a rolled foil.

<Adhesive layer 4>
The adhesive layer 4 is obtained by forming an adhesive into a film in advance.

  The adhesive layer 4 is formed of at least a thermosetting resin, and is preferably formed of at least a thermosetting resin and a thermoplastic resin.

  As the thermoplastic resin, for example, natural rubber, butyl rubber, isoprene rubber, chloroprene rubber, ethylene-vinyl acetate copolymer, ethylene-acrylic acid copolymer, ethylene-acrylate copolymer, polybutadiene resin, polycarbonate resin, Thermoplastic polyimide resin, polyamide resin such as 6-nylon and 6,6-nylon, phenoxy resin, acrylic resin, saturated polyester resin such as PET (polyethylene terephthalate) and PBT (polybutylene terephthalate), polyamide imide resin, or fluororesin And the like. The thermoplastic resins can be used alone or in combination of two or more. Among these thermoplastic resins, acrylic resin in terms of low ionic impurities and excellent stress relaxation property, phenoxy resin in terms of high toughness while achieving both flexibility and strength, and semiconductor element from each viewpoint It is particularly preferable because reliability can be easily ensured.

  The acrylic resin is not particularly limited, and is one or two or more esters of acrylic acid or methacrylic acid having a linear or branched alkyl group having 30 or less carbon atoms (preferably having 1 to 18 carbon atoms). And the like. That is, in the present invention, the acrylic resin has a broad meaning including methacrylic resin. Examples of the alkyl group include a methyl group, an ethyl group, a propyl group, an isopropyl group, an n-butyl group, a t-butyl group, an isobutyl group, a pentyl group, an isopentyl group, a hexyl group, a heptyl group, and a 2-ethylhexyl group. Octyl, isooctyl, nonyl, isononyl, decyl, isodecyl, undecyl, dodecyl (lauryl), tridecyl, tetradecyl, stearyl, octadecyl and the like.

  The other monomer for forming the acrylic resin (a monomer other than an alkyl ester of acrylic acid or methacrylic acid having 30 or less carbon atoms in the alkyl group) is not particularly limited. For example, acrylic acid, Carboxyl group-containing monomers such as methacrylic acid, carboxyethyl acrylate, carboxypentyl acrylate, itaconic acid, maleic acid, fumaric acid or crotonic acid; acid anhydride monomers such as maleic anhydride or itaconic anhydride; (meth) 2-hydroxyethyl acrylate, 2-hydroxypropyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate, 6-hydroxyhexyl (meth) acrylate, 8-hydroxyoctyl (meth) acrylate, (meth) 10-hydroxydecyl acrylate Hydroxyl group-containing monomers such as 12-hydroxylauryl (meth) acrylate or (4-hydroxymethylcyclohexyl) -methyl acrylate, styrenesulfonic acid, allylsulfonic acid, 2- (meth) acrylamide-2-methylpropanesulfonic acid Sulfonic acid group-containing monomers such as, (meth) acrylamidopropanesulfonic acid, sulfopropyl (meth) acrylate or (meth) acryloyloxynaphthalenesulfonic acid, and phosphoric group-containing monomers such as 2-hydroxyethylacryloyl phosphate, or acrylonitrile And the like. In addition, (meth) acrylic acid means acrylic acid and / or methacrylic acid, and (meth) in the present invention has the same meaning.

  Examples of the thermosetting resin include an epoxy resin, a phenol resin, an amino resin, an unsaturated polyester resin, a polyurethane resin, a silicone resin, and a thermosetting polyimide resin. The thermosetting resins can be used alone or in combination of two or more. As the thermosetting resin, an epoxy resin containing a small amount of ionic impurities that corrode the semiconductor element is particularly preferable. In addition, a phenol resin can be suitably used as a curing agent for the epoxy resin.

  The epoxy resin is not particularly limited. For example, bisphenol A epoxy resin, bisphenol F epoxy resin, bisphenol S epoxy resin, brominated bisphenol A epoxy resin, hydrogenated bisphenol A epoxy resin, bisphenol AF epoxy Bifunctional epoxy such as resin, biphenyl type epoxy resin, naphthalene type epoxy resin, fluorene type epoxy resin, phenol novolak type epoxy resin, orthocresol novolak type epoxy resin, trishydroxyphenylmethane type epoxy resin, and tetraphenylolethane type epoxy resin Epoxy resin such as resin or polyfunctional epoxy resin, or hydantoin type epoxy resin, trisglycidyl isocyanurate type epoxy resin or glycidylamine type epoxy resin It can be used.

  As the epoxy resin, a novolak type epoxy resin, a biphenyl type epoxy resin, a trishydroxyphenylmethane type epoxy resin, and a tetraphenylolethane type epoxy resin are particularly preferable. This is because these epoxy resins have high reactivity with a phenol resin as a curing agent and are excellent in heat resistance and the like.

  Further, the phenol resin acts as a curing agent for the epoxy resin, for example, a novolak phenol resin such as a phenol novolak resin, a phenol aralkyl resin, a cresol novolak resin, a tert-butylphenol novolak resin, a nonylphenol novolak resin, a resol type Examples thereof include phenol resins and polyoxystyrenes such as polyparaoxystyrene. The phenol resins can be used alone or in combination of two or more. Of these phenolic resins, phenol novolak resins and phenol aralkyl resins are particularly preferred. This is because the connection reliability of the semiconductor device can be improved.

  The mixing ratio of the epoxy resin and the phenol resin is preferably, for example, such that the hydroxyl group in the phenol resin is 0.5 equivalent to 2.0 equivalent per 1 equivalent of the epoxy group in the epoxy resin component. More preferred is 0.8 to 1.2 equivalents. That is, if the mixing ratio of the two is out of the above range, a sufficient curing reaction does not proceed, and the properties of the cured epoxy resin are likely to deteriorate.

  Further, a catalyst for accelerating thermosetting of an epoxy resin and a phenol resin may be used. The thermosetting catalyst is not particularly limited, and may be appropriately selected from known thermosetting catalysts. The thermosetting catalysts can be used alone or in combination of two or more. Examples of the heat-curing acceleration catalyst include an amine-based curing accelerator, a phosphorus-based curing accelerator, an imidazole-based curing accelerator, a boron-based curing accelerator, and a phosphorus-boron-based curing accelerator.

  As the curing agent for the epoxy resin, it is preferable to use a phenol resin as described above, but known curing agents such as imidazoles, amines, and acid anhydrides can also be used.

  It is important that the adhesive layer 4 has adhesiveness (adhesion) to an adherend 9 such as an electronic device. Therefore, in order to crosslink the adhesive layer 4 to some extent in advance, a polyfunctional compound that reacts with a functional group at the molecular chain end of the polymer may be added as a crosslinking agent. Thereby, the adhesive properties at high temperatures can be improved, and the heat resistance can be improved.

  The crosslinking agent is not particularly limited, and a known crosslinking agent can be used. Specifically, for example, in addition to isocyanate crosslinking agents, epoxy crosslinking agents, melamine crosslinking agents, peroxide crosslinking agents, urea crosslinking agents, metal alkoxide crosslinking agents, metal chelating crosslinking agents, metal salts Crosslinking agents, carbodiimide crosslinking agents, oxazoline crosslinking agents, aziridine crosslinking agents, amine crosslinking agents, and the like. As the crosslinking agent, an isocyanate-based crosslinking agent and an epoxy-based crosslinking agent are preferable. Further, the crosslinking agents can be used alone or in combination of two or more.

  In the present invention, instead of using a cross-linking agent, or in addition to using a cross-linking agent, a cross-linking treatment can be performed by irradiation with an electron beam, ultraviolet light, or the like.

  In the adhesive layer 4, other additives can be appropriately compounded as needed. Other additives include, for example, fillers, flame retardants, silane coupling agents, ion trapping agents, extenders, antioxidants, antioxidants, surfactants, and the like.

  As the filler, any of an inorganic filler and an organic filler may be used, but an inorganic filler is preferable. By blending a filler such as an inorganic filler, the heat conductivity of the adhesive layer 4 can be improved, the elastic modulus can be adjusted, and the like. As the inorganic filler, for example, silica, clay, gypsum, calcium carbonate, barium sulfate, alumina, beryllium oxide, silicon carbide, aluminum nitride, ceramics such as silicon nitride, aluminum, copper, silver, gold, nickel, chromium, Examples thereof include metals such as lead, tin, zinc, palladium, and solder, alloys, and various inorganic powders made of carbon and the like. The fillers can be used alone or in combination of two or more. Among them, silica or alumina is preferable as the filler, and fused silica is particularly preferable as the silica. The average particle diameter of the inorganic filler is preferably in the range of 0.001 μm to 80 μm. The average particle size of the inorganic filler can be measured by, for example, a laser diffraction type particle size distribution analyzer. In the present application, the particle size when the cumulative volume in the particle size distribution is 50% is referred to as the average particle size.

  The amount of the filler (particularly, inorganic filler) is preferably 98% by weight or less (0% to 98% by weight) based on the organic resin component, and particularly preferably 0% to 70% by weight in the case of silica. In the case of a functional inorganic filler such as heat conduction and conductivity, the content is preferably 10% by weight to 98% by weight.

  Examples of the flame retardant include antimony trioxide, antimony pentoxide, and a brominated epoxy resin. The flame retardants can be used alone or in combination of two or more. Examples of the silane coupling agent include β- (3,4-epoxycyclohexyl) ethyltrimethoxysilane, γ-glycidoxypropyltrimethoxysilane, γ-glycidoxypropylmethyldiethoxysilane, and the like. The silane coupling agents can be used alone or in combination of two or more. Examples of the ion trapping agent include hydrotalcites and bismuth hydroxide. The ion trapping agents can be used alone or in combination of two or more.

  The adhesive layer 4 contains (A) an epoxy resin, (B) a curing agent, (C) an acrylic resin or a phenoxy resin, and (D) a surface-treated inorganic filler, from the viewpoint of adhesiveness and reliability. Is preferred.

  (A) High adhesiveness, water resistance and heat resistance can be obtained by using an epoxy resin. As the epoxy resin, the above-mentioned known epoxy resin can be used. As the curing agent (B), the above-mentioned known curing agents can be used.

(C) The acrylic resin has both flexibility and strength and has high toughness. A preferred acrylic resin has a Tg (glass transition temperature) of -50 ° C to 50 ° C and is obtained by polymerizing a monomer having an epoxy group, a glycidyl group, an alcoholic hydroxyl group, a phenolic hydroxyl group or a carboxyl group as a crosslinkable functional group. (Meth) acrylic copolymer containing a crosslinkable functional group. Further, when acrylonitrile or the like is contained to exhibit rubber properties, higher toughness can be obtained.
(C) The phenoxy resin has a high molecular strength because the phenoxy resin has a long molecular chain and a similar structure to an epoxy resin, acts as a flexible material in a composition having a high crosslinking density, and imparts high toughness. However, a tough composition is obtained. Preferred phenoxy resins are those having a main skeleton of bisphenol A, but commercially available phenoxy resins such as bisphenol F phenoxy resin, bisphenol A / F mixed phenoxy resin and brominated phenoxy resin are also preferable.

 (D) Examples of the inorganic filler subjected to the surface treatment include an inorganic filler surface-treated with a coupling agent. As the inorganic filler, the above-mentioned known inorganic fillers can be used, and examples thereof include silica and alumina. The surface treatment with the coupling agent improves the dispersibility of the inorganic filler. Therefore, an adhesive layer having excellent fluidity can be obtained, so that the adhesive strength with the metal layer 3 can be improved. Further, since the inorganic filler can be highly filled, the water absorption can be reduced and the moisture resistance can be improved.

  For example, the surface treatment of the inorganic filler with a silane coupling agent, by a known method, by dispersing the inorganic filler in the silane coupling agent solution, the hydroxyl group present on the surface of the inorganic filler and the silane coupling agent This is performed by reacting a hydrolyzable group such as an alkoxy group with a hydrolyzed silanol group to form a Si—O—Si bond on the surface of the inorganic filler.

  The thickness of the adhesive layer 4 is not particularly limited, but is preferably 3 μm or more, more preferably 5 μm or more, from the viewpoint of sufficiently bonding the metal layer and the adherend. In order to contribute, it is preferably 150 μm or less, more preferably 100 μm or less. The adhesive layer 4 may be composed of a single layer or a plurality of layers.

  The adhesive layer 4 preferably has a loss tangent tan δ at 25 ° C. and 50% RH of 0.4 or more. The loss tangent tan δ of the adhesive layer 4 at 25 ° C. and 50% RH is preferably 3 or less.

  The loss tangent tan δ is a value when the temperature is increased from 0 ° C. at a rate of 5 ° C./min using a dynamic viscoelasticity measuring apparatus, measured at a measurement frequency of 1 Hz, and reaches 25 ° C.

  If the loss tangent tan δ of the adhesive layer 4 at 25 ° C. and 50% RH is 0.4 or more, the adhesive layer 4 can alleviate the stress caused by pushing up the pins of the pickup device. Therefore, even if the push-up amount of the pin is increased, it is possible to suppress the occurrence of the pin mark on the metal layer 3. If the loss tangent tan δ is 3 or less, it is possible to pick up satisfactorily without impairing the responsiveness caused by pushing up the pin.

  In order to increase the loss tangent tan δ, it is advisable to increase the amount of low molecular weight components such as epoxy resin and phenol resin and to decrease the amount of high molecular weight components such as acrylic resin. When a filler is blended, the filler blending amount may be reduced.

  The adhesive layer 4 has a peel force (23 ° C., a peel angle of 180 °, and a linear velocity of 300 mm / min) of 0.3 N / 25 mm or more in the B stage (uncured or semi-cured state). It is preferably at least 0.5 N / 25 mm, and more preferably at least 1.0 N / 25 mm. When the peeling force is less than 0.3 N / 25 mm, when the adhesive tape 4 for an electronic device package in which the adhesive layer 4 and the metal layer 3 are singulated is expanded, the gap between the adhesive layer 4 and the metal layer 3 is increased. Peeling may occur.

The water absorption of the adhesive layer 4 is preferably 1.5 vol% or less. The method of measuring the water absorption is as follows. That is, an adhesive layer 4 (film-like adhesive) having a size of 50 × 50 mm is used as a sample, the sample is dried in a vacuum dryer at 120 ° C. for 3 hours, and after being cooled in a desiccator, the dry mass is measured. And M1. The sample is immersed in distilled water at room temperature for 24 hours and then taken out. The surface of the sample is wiped off with a filter paper and weighed quickly to obtain M2. The water absorption is calculated by the following equation (1).
Water absorption (vol%) = [(M2−M1) / (M1 / d)] × 100 (1)
Here, d is the density of the film.
If the water absorption exceeds 1.5 vol%, there is a possibility that package cracks may occur during solder reflow due to the water absorbed.

The saturated moisture absorption of the adhesive layer 4 is preferably 1.0 vol% or less. The measuring method of the saturated moisture absorption is as follows. That is, a circular adhesive layer 4 (film adhesive) having a diameter of 100 mm was used as a sample, and the sample was dried in a vacuum dryer at 120 ° C. for 3 hours, allowed to cool in a desiccator, measured for dry mass, and measured as M1. I do. The sample was taken out in a thermo-hygrostat at 85 ° C. and 85% RH for 168 hours, then taken out, and immediately weighed to obtain M2. The saturated moisture absorption is calculated by the following equation (2).
Saturated moisture absorption (vol%) = [(M2−M1) / (M1 / d)] × 100 (2)
Here, d is the density of the film.
If the saturated moisture absorption exceeds 1.0 vol%, the value of the vapor pressure will increase due to moisture absorption during reflow, and good reflow characteristics may not be obtained.

It is preferable that the residual volatile matter of the adhesive layer 4 be 3.0 wt% or less. The measuring method of the remaining volatile components is as follows. That is, an adhesive layer 4 (film adhesive) having a size of 50 × 50 mm was used as a sample, and the initial mass of the sample was measured to be M1, and the sample was heated at 200 ° C. for 2 hours in a hot air circulating thermostat. Weigh to M2. The remaining volatile content is calculated by the following equation (3).
Residual volatile content (wt%) = [(M2−M1) / M1] × 100 (3)
When the residual volatile content exceeds 3.0 wt%, the solvent is volatilized by heating during packaging, voids are generated inside the adhesive layer 4, and a package crack may be generated.

  In the state where the adhesive layer 4 and the metal layer 3 are picked up from the adhesive tape 5, the adhesive strength between the adhesive tape 5 and the adhesive layer 4 is 0.03 to 0.5 N / 25 mm. Since the adhesive strength between the adhesive tape 5 and the adhesive layer 4 in a state where the adhesive layer 4 and the metal layer 3 are picked up from the adhesive tape 5, the adhesive layer 52 of the adhesive tape 5 is made of a radiation-curable adhesive. In the case where the adhesive layer 4 and the metal layer 3 are picked up after irradiating the adhesive tape 5 with radiation to reduce the adhesive strength, the adhesive strength after the radiation is applied.

  The adhesive strength is based on JIS Z0237, and the adhesive tape 5 cut to a width of 25 mm and the adhesive layer 4 are bonded together under an environment of 23 ° C. and 50% RH, and peeled off using a universal tensile tester. It is measured at an angle of 180 ° and a peeling speed of 300 mm / min.

  In order to make the adhesive strength fall within the above range, it is preferable to adjust the viscoelasticity and surface energy of each of the adhesive layer 52 and the adhesive layer 4 of the adhesive tape 5, or to adjust the combination thereof.

  If the adhesive force between the adhesive tape 5 and the adhesive layer 4 is 0.5 N / 25 mm or less, the pushing speed and the pushing amount of the pin are reduced when the adhesive layer and the metal layer 3 are picked up from the adhesive tape. Since pickup can be performed even when the force applied to the metal layer is small, it is possible to suppress the occurrence of pin marks on the metal layer 3. If the adhesive force between the adhesive tape 5 and the adhesive layer 4 is 0.03 N / 25 mm or more, the metal layer 3 and the adhesive layer 4 are separated from the adhesive tape when the metal layer 3 and the adhesive layer 4 are expanded. It is kept well without doing.

  Next, an example of a method for manufacturing the electronic device package tape 1 according to the present embodiment will be described. First, a long metal layer 3 is prepared. As the metal layer 3, a commercially available metal foil may be used.

  Further, a long film-shaped adhesive layer 4 is separately formed. The adhesive layer 4 can be formed by using a conventional method of preparing a resin composition and forming a film-like layer. Specifically, for example, the resin composition is applied onto a suitable separator S (such as release paper) and dried (in the case where thermosetting is required, heat treatment is applied as necessary and dried). And a method of forming the adhesive layer 4. The resin composition may be a solution or a dispersion.

  Next, as shown in FIG. 4A, the metal layer 3 and the adhesive layer 4 are heated and bonded at 80 ° C. using a bonding roller r or the like. Next, as shown in FIG. 4B, the adhesive layer 4 separated from the separator S is bonded to the base tape 2 using a bonding roller r or the like.

  In the above description, after bonding the metal layer 3 and the adhesive layer 4, the base tape 2 is bonded to the surface on the side of the adhesive layer 4. After bonding, the metal layer 3 may be bonded on the adhesive layer 4.

  Next, as shown in FIG. 4 (C), the adhesive layer 4 and the metal layer 3 are previously formed into a predetermined size by using a grid-shaped indentation tooth having an outer edge having a predetermined label shape (here, a square shape). 4A, the entire surface on which the individual pieces are arranged is pre-cut so as to have a predetermined label shape, and as shown in FIG. .

Here, after the metal layer 3 and the adhesive layer 4 are singulated using the cutting teeth, the outer edges of the singulated metal layer 3 are pressed into the adhesive layer 4 side. Warpage (not shown) has occurred. Then, as shown in FIG. 5A, the protective tape 20 is bonded to the surface of the metal layer 3 and the adhesive layer 4 on the side opposite to the base tape 2 side, and as shown in FIG. The laminate of the protective tape 20, the metal layer 3, the adhesive layer 4, and the base tape 2 is subjected to pressure processing using a pair of pressure rollers R to correct warpage. At this time, since the maximum value of the total length in the short direction of the individual base tapes 2 constituting the row L is within 160% of the minimum value, the pressing roller R is moved while moving in the long direction. Even if the pressure is applied at a constant pressure, the variation in the pressure applied to one piece is small, so that the warpage of the metal layer 3 is accurately corrected.
As the protective tape 20, the same as the base tape 2 or a known separator can be used.

  The method of forming the metal layer 3 and the adhesive layer 4 having a predetermined shape on the base tape 2 is not limited to the above, and the long metal layer 3 may be formed on the long base tape 2. After bonding and punching into a predetermined shape and removing unnecessary portions 6, the adhesive layer 4 formed into a predetermined shape may be bonded onto the metal layer 3 having a predetermined shape, or may be bonded in advance to a predetermined shape. The metal layer 3 and the adhesive layer 4 formed on the substrate tape 2 may be bonded to the base tape 2, but are manufactured by the steps shown in FIGS. Is preferred. When the metal layer 3 and the adhesive layer 4 are punched into a predetermined shape to singulate, the singulated metal layer 3 is subjected to roll pressing.

  Separately, an adhesive tape 5 is produced. The base film 51 can be formed by a conventionally known film forming method. Examples of the film forming method include a calendar film forming method, a casting method in an organic solvent, an inflation extrusion method in a closed system, a T-die extrusion method, a co-extrusion method, and a dry lamination method. Next, the pressure-sensitive adhesive composition is applied on the base film 51 and dried (heat-crosslinked if necessary) to form a pressure-sensitive adhesive layer 52. Examples of the coating method include roll coating, screen coating, and gravure coating. The pressure-sensitive adhesive composition may be directly applied to the base film 51 to form the pressure-sensitive adhesive layer 52 on the base film 51, or a release paper obtained by subjecting the surface of the pressure-sensitive adhesive composition to a release treatment. After forming the pressure-sensitive adhesive layer 52 by applying the pressure-sensitive adhesive layer to the base film 51, the pressure-sensitive adhesive layer 52 may be transferred to the base film 51. Thereby, the pressure-sensitive adhesive tape 5 in which the pressure-sensitive adhesive layer 52 is formed on the base film 51 is manufactured.

  Thereafter, the base tape 2 is peeled off from the laminated body of the protective tape 20, the metal layer 3, the adhesive layer 4, and the base tape 2 which has been subjected to the pressure processing, and the protection tape is removed as shown in FIG. The pressure-sensitive adhesive tape 5 is laminated so that the surface of the pressure-sensitive adhesive tape 5 on the side of the adhesive layer 52 contacts the surface of the adhesive layer 4 on the metal layer 3 and the adhesive layer 4 having a predetermined shape provided on the tape 20.

  Next, as shown in FIG. 6B, the pressure-sensitive adhesive tape 5 is pre-cut into a predetermined shape using a pressing blade or the like, and as shown in FIG. Then, the electronic device package tape 1 is produced. When the same protective tape 20 as the base tape 2 is used, it functions as the base tape 2 in FIGS. When the protective tape 20 is made of a different material, the protective tape 20 used for the pre-cut processing may be peeled off, and the base tape 2 or a known separator may be attached to the adhesive layer 52 of the adhesive tape 5. .

<How to use>
Next, a method of manufacturing the electronic device package 8 using the electronic device package tape 1 of the present embodiment will be described with reference to FIGS. In this embodiment, a semiconductor chip C flip-chip connected to an adherend 9 will be described as an example of the electronic device package 8.

[Semiconductor wafer W mounting process]
First, a separate dicing tape D similar to the adhesive tape 5 of the electronic device package tape 1 of the present invention is prepared, and a semiconductor is provided at the center of the dicing tape D as shown in FIG. The wafer W is adhered, held and adhered and fixed (semiconductor wafer W mounting step), and the ring frame R is adhered to the periphery of the dicing tape D. At this time, the dicing tape D is stuck on the back surface of the semiconductor wafer W. The back surface of the semiconductor wafer W means a surface opposite to the circuit surface (also referred to as a non-circuit surface, a non-electrode formation surface, or the like). The method of sticking is not particularly limited, but a method by thermocompression bonding is preferable. The press bonding is usually performed while pressing by pressing means such as a press roll.

[Dicing process of semiconductor wafer W]
Next, as shown in FIG. 8B, dicing of the semiconductor wafer W is performed. As a result, the semiconductor wafer W is cut into a predetermined size and cut into individual pieces (small pieces) to manufacture the semiconductor chips C. The dicing is performed, for example, from the circuit surface side of the semiconductor wafer W according to an ordinary method. Further, in this step, for example, a cutting method called full cut for cutting into the dicing tape D can be adopted. The dicing apparatus used in this step is not particularly limited, and a conventionally known apparatus can be used. When the dicing tape D is expanded, the expanding can be performed using a conventionally known expanding apparatus.

[Pickup process of semiconductor chip C]
As shown in FIG. 8C, the semiconductor chip C is picked up and the semiconductor chip C is separated from the dicing tape D. The pickup method is not particularly limited, and various conventionally known methods can be employed. For example, the dicing tape D to which the semiconductor chip C and the ring frame R are bonded is placed on the stage S of the pickup device with the base film side facing down, and the ring frame R is fixed to form a hollow cylindrical shape. Is raised, and the dicing tape D is expanded. In this state, there is a method in which the individual semiconductor chips C are pushed up from the base film side of the dicing tape D by the pins N, and the pushed up semiconductor chips C are picked up by a pickup device.

[Flip chip connection process]
As shown in FIG. 8D, the picked-up semiconductor chip C is fixed to an adherend 9 such as a substrate by a flip-chip bonding method (flip-chip mounting method). Specifically, the semiconductor chip C is always attached to the adherend 9 in such a manner that the circuit surface (also referred to as a surface, a circuit pattern formation surface, an electrode formation surface, etc.) of the semiconductor chip C faces the adherend 9. Fix according to law. For example, first, a flux is attached to the bump 10 as a connection portion formed on the circuit surface side of the semiconductor chip C. Next, the bump 10 and the conductive material 11 are melted while the bump 10 of the semiconductor chip C is brought into contact with and pressed by the bonding conductive material 11 (such as solder) attached to the connection pad of the adherend 9. Electrical conduction between the semiconductor chip C and the adherend 9 is ensured, and the semiconductor chip C can be fixed to the adherend 9 (flip chip bonding step). At this time, a gap is formed between the semiconductor chip C and the adherend 9, and the gap distance is generally about 30 μm to 300 μm. The flux remaining on the opposing surface or gap between the semiconductor chip C and the adherend 9 is removed by washing.

  Various substrates such as a lead frame and a circuit board (such as a wiring circuit board) can be used as the adherend 9. The material of such a substrate is not particularly limited, and examples thereof include a ceramic substrate and a plastic substrate. Examples of the plastic substrate include an epoxy substrate, a bismaleimide triazine substrate, and a polyimide substrate. Alternatively, a chip-on-chip structure can be obtained by using another semiconductor chip as the adherend 9 and flip-chip connecting the semiconductor chip C.

  Next, as shown in FIG. 9A, the base tape 2 of the electronic device package tape 1 according to the present embodiment is peeled off to expose the metal layer 3 and the adhesive layer 52 of the adhesive tape 5, The periphery of the adhesive layer 52 is fixed to the ring frame R.

  Next, as shown in FIG. 9B, the metal layer 3 and the adhesive layer 4 which have been separated are picked up and peeled off from the adhesive tape 5. The pickup can be performed in the same step as the above-described pickup step of the semiconductor chip 10C.

  Next, as shown in FIG. 10, the picked-up metal layer 3 and the adhesive layer 4 side of the adhesive layer 4 are bonded to the back surface of the flip-chip connected semiconductor chip C. At this time, since the warpage of the metal layer 3 is corrected, the metal layer 3 is bonded to the semiconductor chip C without involving a void, so that the adhesive layer 4 can be prevented from peeling off from the semiconductor chip C. . After that, the adhesive layer 4 is cured, and the periphery of the semiconductor chip C with the metal layer 3 and the gap between the semiconductor chip C and the adherend 9 are filled with a sealing material (such as a sealing resin) and sealed. Sealing is performed according to a conventional method.

  Further, in the above description, the semiconductor chip C flip-chip connected on the adherend 9 has been described as an example of the electronic device package 8, but the present invention is not limited to this. In the electronic device package structure in which another semiconductor chip is stacked, the metal layer 3 of the electronic device package tape 1 of the present invention is used as a spacer between the two chips. The metal layer 3 may be provided thereon.

  In the present embodiment, the pressure-sensitive adhesive layer 52, the adhesive layer 4, and the metal layer 3 are provided in this order, but the pressure-sensitive adhesive layer 52, the metal layer 3, and the adhesive layer 4 are provided in this order. Is also good.

  Further, in the above-described embodiment, an example has been described in which the size and the number of the pieces in the row L are the same, and the total value of the lengths l of the pieces in all the rows L is constant. If the total value of the lengths l of the individual pieces of the column L is within 160% of the minimum value among the total values of the plurality of columns L in the aggregate 30, as shown in FIG. The number of pieces may be different. In the modification shown in FIG. 7, the total value of the lengths l of the individual pieces of the row L1 is the minimum value in the aggregate 30 and the total value of the lengths l of the individual pieces of the row L2 is Has the maximum value. The total value of the length l of the individual pieces of the row L2 is within 160% of the total value of the length l of the individual pieces of the row L1. The total value of the lengths l is within 160% of the total value of the lengths l of the individual pieces of the row L1. For this reason, after the metal layer 3 and the adhesive layer 4 are separated into individual pieces, the pressure roller R applies a constant pressure to the aggregate 30 of the metal layer 3 and the adhesive layer 4 while moving the assembly 30 in the longitudinal direction. Even if the pressure is applied, the variation in the pressure applied to one piece is small, so that the warpage of the metal layer 3 is accurately corrected.

<Example of experiment>
Next, in order to further clarify the effects of the present invention, experimental examples will be described in detail, but the present invention is not limited to these experimental examples.

(1) Preparation of adhesive tape <Adhesive composition (1)>
As the acrylic copolymer (A1) having a functional group, a copolymer composed of 2-ethylhexyl acrylate, 2-hydroxyethyl acrylate and acrylic acid, having a ratio of 2-ethylhexyl acrylate of 80 mol% and a weight average molecular weight of 700,000 Was prepared. Next, 2-isocyanatoethyl methacrylate was added so that the iodine value became 15, and an acrylic copolymer (a- having a glass transition temperature of -70 ° C, a hydroxyl value of 20 mgKOH / g, and an acid value of 5 mgKOH / g) was added. 1) was prepared.

  10 parts by mass of Coronate L (manufactured by Tosoh Corporation) as a polyisocyanate and 3 parts by mass of Irgacure 184 (manufactured by BASF) as a photopolymerization initiator are added to 100 parts by mass of the acrylic copolymer (a-1). The mixture thus added was dissolved in ethyl acetate and stirred to obtain a pressure-sensitive adhesive composition (1).

The following were produced as base film.
<Base film (1)>
The resin beads of the ethylene-methacrylic acid copolymer were melted at 200 ° C., and formed into a long film having a thickness of 150 μm using an extruder to prepare a base film (1). As the ethylene-methacrylic acid copolymer, Nuclell NO35C (trade name) manufactured by Du Pont-Mitsui Polychemicals, Inc. was used.

<Adhesive tape (1)>
The pressure-sensitive adhesive composition (1) is applied to a release liner made of a polyethylene-terephthalate film subjected to a release treatment so that the thickness after drying becomes 10 μm, and dried at 110 ° C. for 3 minutes to form a pressure-sensitive adhesive layer. After that, it was bonded to the base film (2) to prepare an adhesive tape (1).

(2) Preparation of adhesive layer

<Adhesive layer (1)>
80 parts by mass of an acrylic resin (manufactured by Nagase ChemteX Corporation, trade name “Teisan Resin SG-P3”, Mw 850,000, Tg 12 ° C.), and a naphthalene type epoxy resin (trade name “HP-4700” manufactured by DIC Corporation) 10 10 parts by mass of a phenol resin (trade name “MEH7851” manufactured by Meiwa Kasei Co., Ltd.) as a curing agent was dissolved in methyl ethyl ketone to prepare an adhesive composition solution. This adhesive composition solution was applied onto a release film (release liner) composed of a 50 μm-thick polyethylene terephthalate film subjected to a silicone release treatment, and then dried at 130 ° C. for 5 minutes. Thus, an adhesive layer (1) having a thickness of 20 μm was produced.
(3) Preparation of metal layer <metal layer (1)>
C1100 (Temperature O) (trade name, manufactured by Furukawa Electric Co., Ltd., copper strip, thickness 100 μm)

(4) Production of base tape

The following were produced as base tapes.
(Resin film d-1)
Styrene-hydrogenated isoprene-styrene block copolymer (SEPS) (Kuraray Co., Ltd., trade name “Septon KF-2104”) and homopropylene (PP) (Ube Industries, Ltd., trade name “J-105G”) ) Were mixed at a mixing ratio of 40:60 at 200 ° C., and formed into a long film having a thickness of 90 μm using an extruder to prepare a resin film d-1.

(Adhesive layer composition e-1 for base tape)
The acrylic copolymer (A2) having a functional group is composed of 2-ethylhexyl acrylate, 2-hydroxyethyl acrylate and methacrylic acid, the ratio of 2-ethylhexyl acrylate is 70 mol%, the weight average molecular weight is 500,000, and the glass transition temperature An acrylic copolymer (a2) having a hydroxyl value of 30 gKOH / g and an acid value of 5 mgKOH / g was prepared at -50 ° C. To 100 parts by mass of the acrylic copolymer (a2), 8 parts by mass of a polyisocyanate-based compound (trade name: “Coronate L”, manufactured by Tosoh Corporation) was added, dissolved in ethyl acetate, and stirred to obtain a base material. An adhesive layer composition e-1 for tape was obtained.
<Base tape (1)>

  The prepared pressure-sensitive adhesive layer composition for base tape e-1 was applied to a release liner composed of a polyethylene-terephthalate film subjected to a release treatment so that the thickness after drying became 10 μm, and was heated at 110 ° C. for 3 minutes. After drying, it was bonded to the resin film d-1 to prepare a base tape (1) in which a base tape pressure-sensitive adhesive layer was formed on the resin film.

(5) Fabrication of tape for electronic device package <Reference sample>
The metal layer (1) obtained as described above and the adhesive layer (1) side of the adhesive layer with separator (1) are bonded at an angle of 120 °, a pressure of 0.2 MPa, a temperature of 80 ° C, and a speed of 1 m / m. After laminating under the conditions of min, the separator was peeled off and the base tape (1) was laminated on the adhesive layer (1) under the conditions of a laminating angle of 120 °, a pressure of 0.2 MPa, and a speed of 10 mm / s. Was. The adhesive layer (1) and the metal layer (1) are cut into 10.6 x 10.6 mm squares by using a cutting tooth, and 10 pieces are arranged in the transverse direction at 5 mm intervals. Precut as follows. Then, another base tape (1) is adhered to the metal layer (1) side as a protective tape, and a pressure roller (400 mm width) is used at a linear pressure of 50 kgf / cm and a speed of 1 m / min. The laminate of the base tape (1), the metal layer (1), the adhesive layer (1), and the base tape (1) as a protective tape was subjected to pressure processing. The heating and pressing conditions were such that the roll pressing was performed while changing the pressure at a speed of 1 m / min, and the maximum pressure when the warpage was 0.03 mm was determined as the linear pressure. Thereafter, the base tape (1) is peeled off from the adhesive layer, and the exposed adhesive layer side and the adhesive layer of the adhesive tape (1) are separated by an adhesive layer around the metal layer and the adhesive layer. The sample was stuck so as to be in contact with the base tape (1) as a protective tape to obtain a reference sample.

<Sample 1>
After bonding the metal layer (1) and the adhesive layer (1) side of the adhesive layer with separator (1) on an adhesive angle of 120 °, a pressure of 0.2 MPa, a temperature of 80 ° C, and a speed of 1 m / min. Then, the separator was peeled off and the base tape (1) was bonded on the adhesive layer (1) under the conditions of a bonding angle of 120 °, a pressure of 0.2 MPa, and a speed of 10 mm / s. The adhesive layer (1) and the metal layer (1) are cut into 10.6 x 10.6 mm squares using push teeth, and 13 pieces are arranged in the transverse direction at 5 mm intervals. Precut as follows. Then, another base tape (1) is adhered to the adhesive layer (1) side as a protective tape, and a pressure roller (400 mm width) is used at a linear pressure of 50 kgf / cm and a speed of 1 m / min. The laminate of the base tape (1) as a protective tape, the metal layer (1), the adhesive layer (1) and the base tape (1) was subjected to pressure processing. Thereafter, the base tape (1) is peeled off from the adhesive layer, and the exposed adhesive layer side and the adhesive layer of the adhesive tape (1) are separated by an adhesive layer around the metal layer and the adhesive layer. Sample 1 was obtained by being attached so as to be in contact with the base tape (1).

<Sample 2>
After bonding the metal layer (1) and the adhesive layer (1) side of the adhesive layer with separator (1) on an adhesive angle of 120 °, a pressure of 0.2 MPa, a temperature of 80 ° C, and a speed of 1 m / min. Then, the separator was peeled off and the base tape (1) was bonded on the adhesive layer (1) under the conditions of a bonding angle of 120 °, a pressure of 0.2 MPa, and a speed of 10 mm / s. Adhesive layer (1) and metal layer (1) are cut into 10.6 x 10.6 mm squares using push teeth, and 16 pieces are arranged in the transverse direction at 5 mm intervals. Precut as follows. Then, another base tape (1) is adhered to the adhesive layer (1) side as a protective tape, and a linear pressure of 50 kgf / cm and a speed of 1 m / m are applied using a (400 mm width) pressure roller. Under the conditions of min, the laminate of the base tape (1), the metal layer (1), the adhesive layer (1) and the base tape (1) as the protective tape was subjected to pressure processing. Thereafter, the base tape (1) is peeled off from the adhesive layer, and the exposed adhesive layer side and the adhesive layer of the adhesive tape (1) are bonded to each other around the metal layer and the adhesive layer. Sample 2 was obtained by being attached so as to be in contact with the base tape (1).

<Sample 3>
After bonding the metal layer (1) and the adhesive layer (1) side of the adhesive layer with separator (1) on an adhesive angle of 120 °, a pressure of 0.2 MPa, a temperature of 80 ° C, and a speed of 1 m / min. Then, the separator was peeled off and the base tape (1) was bonded on the adhesive layer (1) under the conditions of a bonding angle of 120 °, a pressure of 0.2 MPa, and a speed of 10 mm / s. The adhesive layer (1) and the metal layer (1) are cut into 10.6 x 10.6 mm squares using push-tooth teeth, and seven pieces are arranged in the transverse direction at 5 mm intervals. Precut as follows. Then, another base tape (1) is adhered to the adhesive layer (1) side as a protective tape, and using a pressure roller (400 mm width) under the conditions of a linear pressure of 50 kgf / cm and a speed of 1 m / min. The laminate of the base tape (1) as a protective tape, the metal layer (1), the adhesive layer (1) and the base tape (1) was subjected to pressure processing. Thereafter, the base tape (1) is peeled off from the adhesive layer, and the exposed adhesive layer side and the adhesive layer of the adhesive tape (1) are bonded to each other around the metal layer and the adhesive layer. Sample 3 was obtained by being attached so as to be in contact with the base tape (1).

<Sample 4>
After bonding the metal layer (1) and the adhesive layer (1) side of the adhesive layer with separator (1) on an adhesive angle of 120 °, a pressure of 0.2 MPa, a temperature of 80 ° C, and a speed of 1 m / min. Then, the separator was peeled off and the base tape (1) was bonded on the adhesive layer (1) under the conditions of a bonding angle of 120 °, a pressure of 0.2 MPa, and a speed of 10 mm / s. Adhesive layer (1) and metal layer (1) are cut into 10.6 x 10.6 mm squares using push teeth, and 19 pieces are arranged in the transverse direction at 5 mm intervals. Precut as follows. Then, another base tape (1) is adhered to the adhesive layer (1) side as a protective tape, and using a pressure roller (400 mm width) under the conditions of a linear pressure of 50 kgf / cm and a speed of 1 m / min. The laminate of the base tape (1) as a protective tape, the metal layer (1), the adhesive layer (1) and the base tape (1) was subjected to pressure processing. Thereafter, the base tape (1) is peeled off from the adhesive layer, and the exposed adhesive layer side and the adhesive layer of the adhesive tape (1) are bonded to each other around the metal layer and the adhesive layer. Sample 4 was obtained by being bonded so as to be in contact with the base tape (1).

(Warpage)
The sample was observed from the metal layer side with a measurement microscope MF-J4020D manufactured by Mitutoyo Corporation, and the height (thickness) of one end of the singulated metal layer and the height of 500 μm inside from the end were measured. The difference from the height (thickness) was measured and defined as the amount of warpage of the metal layer. Table 1 shows the results.

(Releasability)
Ten chips of 10.6 × 10.6 mm square were prepared, and the metal layer in the above-mentioned sample row was bonded onto the chips via an adhesive layer. Thereafter, the adhesive layer was heated and cured at 150 ° C. for 1 hour to prepare 10 samples. Then, the presence or absence of peeling of the adhesive layer from the chip was observed with an optical microscope. A sample having no peeled sample or 1 to 3 peeled samples was evaluated as "good", and a sample having 4 or more peeled samples was evaluated as "poor".

  As shown in Table 1, in Samples 1 and 2, since the total value of the lengths of the individual base tapes constituting the rows in the lateral direction is within 160% of the total value of the reference sample, Good results were obtained in the evaluation of the peelability.

  On the other hand, in sample 3, since the total value of the maximum lengths in the short direction of the base tapes of the individual pieces constituting the row is less than 100% of the total value of the reference sample, Is that the pressure applied to one piece is too large, the adhesive layer is deformed, the metal layer is not properly pressured, the warpage of the metal layer is not corrected, and the evaluation of the peelability is poor. became. In Sample 4, since the total value of the lengths of the base tapes in the short direction of the individual pieces constituting the row is more than 160% with respect to the total value of the reference sample, in the sample, one piece is used. Such pressure was too small, the warpage of the metal layer was not corrected, and the result of the evaluation of the releasability was poor.

  From the above, the total value of the length in the short direction of the base tape of the individual pieces constituting the row is the total value of the length in the short direction of the base tape of the individual piece forming the reference row. It was found that good results were obtained in the evaluation of the releasability if it was within 160%.

1: Tape for electronic device package 2: Base tape 3: Metal layer 4: Adhesive layer 5: Adhesive tape 5a: Label portion 5b: Peripheral portion

Claims (5)

A long base tape,
Provided on the base tape, an aggregate of a plurality of individual pieces composed of a laminate of an adhesive layer and a metal layer,
An adhesive tape covering the assembly, and having a label portion having a predetermined planar shape provided to be in contact with the base tape around the assembly,
The individual pieces in the assembly are arranged in a plurality of rows along the short direction of the base tape to form a row, and the rows are arranged in the assembly in a plurality of rows in the longitudinal direction of the base tape. Yes,
A tape for an electronic device package, wherein the maximum value of the total value of the lengths of the pieces of the base tape in the width direction in the row is within 160% of the minimum value of the total value.   The electronic device package tape according to claim 1, wherein the adhesive layer has a loss tangent at 25 ° C. and 50% RH of 0.4 or more.   3. The tape for an electronic device package according to claim 1, wherein the metal layer includes copper or aluminum.   2. The adhesive layer according to claim 1, wherein the adhesive layer contains (A) an epoxy resin, (B) a curing agent, (C) an acrylic resin or a phenoxy resin, and (D) a surface-treated inorganic filler. 3. The electronic device package tape according to claim 3. The pressure-sensitive adhesive layer comprises an acrylic acid ester represented by CH ₂ ＣＨCHCOOR (wherein R is an alkyl group having 4 to 18 carbon atoms), a hydroxyl group-containing monomer, and radical reactivity in the molecule. The electronic device packaging tape according to any one of claims 1 to 4, further comprising an acrylic polymer containing an isocyanate compound having a carbon-carbon double bond.