JP2018065948A - Laminate sheet, manufacturing method of laminate sheet and manufacturing method of semiconductor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a laminate sheet capable of enhancing producibility of electronic components or the like using a laminate sheet and making detachability of a carrier film good.SOLUTION: A laminate sheet has a carrier film, a metal material, an adhesive layer and an adhesive tape in this order, the carrier film and the adhesive tape have an area extruding in a side more than an outer peripheral side face of the metal material and the adhesive layer respectively, in the area, the carrier film and the adhesive tape are laminated, peeling adhesive strength between the carrier film and the adhesive tape is 300 mN/25 mm or less, peeling adhesive strength between the carrier film and the metal material is 2 mN/25 mm or more and the peeling adhesive strength between the carrier film and the metal material is smaller than the peeling adhesive strength between the adhesive layer and the adhesive tape.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a laminated sheet comprising a carrier film, a metal material, an adhesive layer, and an adhesive tape, and a method for producing the laminated sheet. Moreover, this invention relates to the manufacturing method of the semiconductor device using the said lamination sheet.

  A laminate in which a metal material such as a metal foil and a metal plate is laminated on one side or both sides of an insulating layer is known. Such a laminate is used, for example, in a heat generating device such as a light emitting diode (LED) device or a power semiconductor, a module including the heat generating device, and the like in order to suppress a temperature rise during use.

  Examples of a method for obtaining the laminate include a method in which a laminated sheet having a metal material cut into a size of a semiconductor chip and an adhesive layer is attached to the surface of the semiconductor chip.

  Patent Document 1 below discloses a laminate including a release layer, an adhesive layer, a conductive layer (metal material), and a protective layer on a base material. On the substrate, a plurality of members composed of the adhesive layer, the conductive layer, and the protective layer are arranged in a pattern by cutting using a rotary die or the like. Moreover, in the laminate, the member composed of the adhesive layer, the conductive layer, and the protective layer is peeled off from the release layer and attached to another substrate.

  In a general die bonding process, a dicing die bonding film having an adhesive is used. Specifically, a semiconductor wafer is laminated on a dicing die bonding film, and the film on which the semiconductor wafer is laminated is fixed to a ring frame. The fixed semiconductor wafer and the film are processed by dicing or the like and separated into semiconductor chips with a die bonding film. Next, the separated semiconductor chip with the die bonding film is picked up and mounted on the substrate.

  In Patent Document 1, it is not assumed that a semiconductor device is obtained by stacking the above-described members on the surface of a semiconductor chip using the above-described die bonding process.

JP 2005-346696 A

  In Patent Document 1, it is not assumed that a semiconductor device is obtained by stacking the above-described members on the surface of a semiconductor chip using the above-described die bonding process.

  Further, if the above-described die bonding process is applied to the laminate described in Patent Document 1 (however, such application is not assumed in Patent Document 1), it is fixed to the ring frame. When the adhesive tape for carrying out is laminated | stacked on the said laminated body, it is difficult to peel the said base material and the said adhesive tape, and to pick up the said member from the said adhesive tape.

  An object of the present invention is to provide a laminated sheet that can increase the production efficiency of an electronic component or the like using the laminated sheet and can improve the peelability of the carrier film. Moreover, this invention is providing the manufacturing method of the said laminated sheet, and the manufacturing method of a semiconductor device using the said laminated sheet.

  In a wide aspect of the present invention, a carrier film, a metal material, an adhesive layer, and an adhesive tape are provided, and the carrier film, the metal material, the adhesive layer, and the adhesive tape are laminated in this order, and the carrier film And the adhesive tape has a region projecting laterally from the outer peripheral side surface of the metal material and the adhesive layer, respectively, and from the outer peripheral side surface of the metal material and the adhesive layer of the carrier film and the adhesive tape. In the region projecting laterally, the carrier film and the adhesive tape are laminated, and the peel adhesion strength between the carrier film and the adhesive tape is 300 mN / 25 mm or less, and the carrier film and the metal The peel adhesion strength with the material is 2 mN / 25 mm or more, and the carrier film and the metal material Peel bond strength, the smaller than peel strength between the adhesive layer and the pressure-sensitive adhesive tape, the laminated sheet is provided.

  On the specific situation with the lamination sheet which concerns on this invention, the said carrier film has a base material and the adhesion layer, and the said adhesion layer is a silicone type adhesion layer or a urethane type adhesion layer.

  On the specific situation with the lamination sheet which concerns on this invention, the thickness of the said metal material is 200 micrometers or less, and the thickness of the said contact bonding layer is 40 micrometers or less.

  On the specific situation with the lamination sheet which concerns on this invention, the material of the said metal material is copper or aluminum.

  On the specific situation with the lamination sheet which concerns on this invention, it is a lamination sheet used by being laminated | stacked on a semiconductor element.

  In a specific aspect of the laminated sheet according to the present invention, the semiconductor element is a semiconductor chip, and in the laminated sheet, the metal material and the adhesive layer have a size corresponding to the size of the semiconductor chip. .

  In a specific aspect of the laminated sheet according to the present invention, a plurality of laminated bodies of the metal material and the adhesive layer are arranged side by side inside a portion where the carrier film and the adhesive tape are laminated.

  In a wide aspect of the present invention, there is provided a method for producing the above-described laminated sheet, the step of laminating a laminate of a metal material and an adhesive layer on the surface of the carrier film from the metal material side, Cutting the laminate on the surface into a size corresponding to the size of a semiconductor chip, and laminating the adhesive tape on the adhesive layer side of the laminate after cutting the laminate. The carrier film, the metal material, the adhesive layer, and the adhesive tape are laminated in this order, and the carrier film and the adhesive tape are respectively on the side of the outer peripheral side surface of the metal material and the adhesive layer. A region projecting sideways, and in a region projecting laterally from the outer peripheral side surface of the metal material and the adhesive layer of the carrier film and the adhesive tape, The carrier film and the pressure-sensitive adhesive tape are laminated, the peel adhesion strength between the carrier film and the pressure-sensitive adhesive tape is 300 mN / 25 mm or less, and the peel adhesion strength between the carrier film and the metal material is 2 mN. / 25 mm or more, the peel adhesive strength between the carrier film and the metal material is smaller than the peel adhesive strength between the adhesive layer and the adhesive tape, and the carrier film and the adhesive tape are laminated. Provided is a method for producing a laminated sheet, which obtains a laminated sheet in which a plurality of laminated bodies of the metal material and the adhesive layer are arranged side by side.

  In a broad aspect of the present invention, there is provided a method for manufacturing a semiconductor device using the above-described laminated sheet, the step of peeling the carrier film of the laminated sheet, and the laminate of the metal material and the adhesive layer, the adhesive tape. A method of manufacturing a semiconductor device, comprising: a step of picking up a semiconductor device, and a step of stacking the picked-up laminate on the surface of a semiconductor chip mounted on a substrate from the adhesive layer side to obtain a semiconductor device Is provided.

  The laminated sheet according to the present invention includes a carrier film, a metal material, an adhesive layer, and an adhesive tape, and the carrier film, the metal material, the adhesive layer, and the adhesive tape are laminated in this order, and the carrier The film and the pressure-sensitive adhesive tape each have a region projecting laterally from the outer peripheral side surface of the metal material and the adhesive layer, and from the outer peripheral side surface of the metal material and the adhesive layer of the carrier film and the adhesive tape, respectively. The carrier film and the pressure-sensitive adhesive tape are laminated in a region protruding sideways, and the peel adhesion strength between the carrier film and the pressure-sensitive adhesive tape is 300 mN / 25 mm or less, and the carrier film and the above-mentioned The peel adhesion strength with the metal material is 2 mN / 25 mm or more, and the carrier film and the metal The peel adhesion strength between the adhesive layer and the pressure-sensitive adhesive tape is smaller than the peel adhesion strength between the adhesive layer and the pressure-sensitive adhesive tape, so that the production efficiency of electronic parts using a laminated sheet can be increased and the peelability of the carrier film can be increased. Can be good.

FIG. 1A and FIG. 1B are a partially cutaway plan view and a partially cutaway front sectional view schematically showing a laminated sheet according to an embodiment of the present invention. FIGS. 2A to 2C are partial cutaway front cross-sectional views for explaining an example of each process for obtaining a laminated sheet according to an embodiment of the present invention. 3 (a) and 3 (b) are partially cutaway front cross-sectional views for explaining an example of each process for obtaining a semiconductor device according to an embodiment of the present invention using the laminated sheet shown in FIG. 1 (b). FIG. 4 (a) to 4 (c) are partially cutaway front cross-sectional views for explaining an example of each process for obtaining a semiconductor device according to an embodiment of the present invention using the laminated sheet shown in FIG. 1 (b). It is.

  Hereinafter, the present invention will be described in detail.

  The laminated sheet according to the present invention includes a carrier film, a metal material, an adhesive layer, and an adhesive tape. In the laminated sheet according to the present invention, the carrier film, the metal material, the adhesive layer, and the adhesive tape are laminated in this order. Specifically, in the laminated sheet according to the present invention, the laminated sheet is in the thickness direction from the first main surface side to the second main surface side of the laminated sheet, the carrier film, the metal material, the adhesive layer, And the said adhesive tape is laminated | stacked in this order. In the laminated sheet according to the present invention, the pressure-sensitive adhesive tape has a region projecting laterally from the outer peripheral side surfaces of the metal material and the adhesive layer. In the laminated sheet according to the present invention, the carrier film and the pressure-sensitive adhesive tape are laminated in a region projecting laterally from the outer peripheral side surfaces of the metal film and the adhesive layer of the pressure-sensitive adhesive tape. . In the laminated sheet according to the present invention, the peel adhesive strength between the carrier film and the adhesive tape is 300 mN / 25 mm or less. In the laminated sheet according to the present invention, the peel adhesion strength between the carrier film and the metal material is 2 mN / 25 mm or more. In the laminated sheet according to the present invention, the peel adhesion strength between the carrier film and the metal material is smaller than the peel adhesion strength between the adhesive layer and the adhesive tape.

  Since the laminated sheet according to the present invention has the above-described configuration, it is possible to increase the production efficiency of an electronic component or the like using the laminated sheet and to improve the peelability of the carrier film.

  The method for producing a laminated sheet according to the present invention includes a step of laminating a laminate of a metal material and an adhesive layer on the surface of the carrier film from the metal material side, and the laminate on the surface of the carrier film. A step of cutting to a size corresponding to the size of the semiconductor chip, and a step of laminating the pressure-sensitive adhesive tape on the adhesive layer side of the laminate after the laminate is cut. In the method for producing a laminated sheet according to the present invention, the carrier film, the metal material, the adhesive layer, and the pressure-sensitive adhesive tape are laminated in this order, and the carrier film and the pressure-sensitive adhesive tape are respectively the metal material and The carrier has a region projecting laterally from the outer peripheral side surface of the adhesive layer, and the carrier film and the adhesive tape in the region projecting laterally from the outer peripheral side surface of the metal material and the adhesive layer. The film and the adhesive tape are laminated, the peel adhesion strength between the carrier film and the adhesive tape is 300 mN / 25 mm or less, and the peel adhesion strength between the carrier film and the metal material is 2 mN / The peel adhesion strength between the carrier film and the metal material is 25 mm or more, and the adhesive layer and the adhesive A laminated sheet in which a plurality of laminates of the metal material and the adhesive layer are arranged side by side inside the portion where the carrier film and the adhesive tape are laminated, which is smaller than the peel adhesive strength with the tape Get.

  A method of manufacturing a semiconductor device according to the present invention was mounted on a substrate, a step of peeling the carrier film of the laminated sheet, a step of picking up a laminate of the metal material and the adhesive layer from the adhesive tape, and And laminating the picked-up laminate on the surface of the semiconductor chip from the adhesive layer side to obtain a semiconductor device.

  In the method for producing a laminated sheet according to the present invention and the method for producing a semiconductor device according to the present invention, since the above-described configuration is provided, the production efficiency of electronic components using the laminated sheet can be increased, and The peelability of the carrier film can be improved. Moreover, in the manufacturing method of the lamination sheet which concerns on this invention, and the manufacturing method of the semiconductor device which concerns on this invention, a general die-bonding process can be utilized.

  Hereinafter, specific embodiments of the present invention will be described with reference to the drawings. In the following drawings, the size, thickness, shape, and the like may differ from the actual size, thickness, shape, and the like for convenience of illustration.

  FIG. 1A and FIG. 1B are a partially cutaway plan view and a partially cutaway front sectional view schematically showing a laminated sheet according to an embodiment of the present invention. Fig.1 (a) is a partial notch top view, FIG.1 (b) is a partial notch front sectional drawing which follows the II line | wire in Fig.1 (a). In FIG. 1 and the drawings to be described later, for the convenience of illustration, dimensions and sizes are appropriately changed from actual dimensions and sizes.

  As shown in FIGS. 1A and 1B, a laminated sheet 1 according to this embodiment has a long carrier film 2. On the upper surface 2a of the carrier film 2, a metal material 3, an adhesive layer 4, and an adhesive tape 5 are laminated in this order. An adhesive layer 4 is disposed on one surface 3 a (first surface) side of the metal material 3. The carrier film 2 is disposed on the other surface 3b (second surface) side of the metal material 3. An adhesive tape 5 is disposed on one surface 4 a (first surface) side of the adhesive layer 4. The metal material 3 is disposed on the other surface 4b (second surface) side of the adhesive layer 4. An adhesive layer 4 is disposed between the metal material 3 and the adhesive tape 5. A metal material 3 is disposed between the carrier film 2 and the adhesive layer 4.

  In the laminated sheet 1 according to this embodiment, the carrier film 2 has a long shape. A plurality of composites of the metal material 3, the adhesive layer 4, and the pressure-sensitive adhesive tape 5 are arranged on the surface of the carrier film 2 side by side in the length direction of the long carrier film 2. On the surface of the long carrier film 2, the composites are arranged at equal intervals. A protective sheet may be provided on the upper surface 2a of the carrier film 2 on the side of the composite. The carrier film 2 preferably has a base material and an adhesive layer. The product form of the laminated sheet 1 is preferably a roll.

  The laminated sheet 1 is preferably transported in a direction (flow direction) indicated by an arrow X in FIG. 1A and used for manufacturing a semiconductor device. The laminated sheet may be continuously used in a state where a plurality of the laminated sheets are arranged on the surface of the elongated carrier film, and the elongated carrier film is divided into a size of one laminated sheet. May be used.

  In the laminated sheet 1 according to the present embodiment, the planar shape of the metal material 3 and the adhesive layer 4 is substantially circular. The diameter of the metal material 3 may be the same as or different from the diameter of the adhesive layer 4. The diameter of the adhesive layer 4 may be the same as or different from the diameter of the metal material 3. The diameter of the adhesive layer is preferably larger than the diameter of the metal material. The planar shape of the metal material and the adhesive layer is not particularly limited, and may be a substantially circular shape or a shape different from a substantially circular shape.

  In the laminated sheet 1 according to the present embodiment, the metal material 3 and the adhesive layer 4 have a size corresponding to the size of a semiconductor chip that is a semiconductor element. The metal material and the adhesive layer are preferably cut so as to be the size of the semiconductor chip. The laminated sheet is preferably used by being laminated on a semiconductor element. The metal material and the adhesive layer are preferably used by being stacked on a semiconductor chip which is a semiconductor element.

  In the laminated sheet 1 according to this embodiment, the planar shape of the adhesive tape 5 is substantially circular. The diameter of the adhesive tape 5 is larger than the diameters of the metal material 3 and the adhesive layer 4. The planar shape of the pressure-sensitive adhesive tape is not particularly limited, and may be a substantially circular shape or a shape different from a substantially circular shape. The pressure-sensitive adhesive tape is preferably cut so as to have the planar shape described above. The said adhesive tape does not need to be cut | disconnected so that it may become the planar shape mentioned above.

  The outer peripheral side surface of the carrier film 2 projects outward from the outer peripheral side surfaces of the metal material 3 and the adhesive layer 4. The carrier film 2 has a region 2 </ b> X projecting laterally from the outer peripheral side surfaces of the metal material 3 and the adhesive layer 4. The outer peripheral side surface of the adhesive tape 5 projects outward from the outer peripheral side surfaces of the metal material 3 and the adhesive layer 4. The adhesive tape 5 has a region 5 </ b> X that protrudes laterally from the outer peripheral side surfaces of the metal material 3 and the adhesive layer 4. In the region 2X of the carrier film 2 and the region 5X of the adhesive tape 5, the carrier film 2 and the adhesive tape 5 are laminated. The region 5X of the adhesive tape 5 is laminated on the upper surface 2a of the carrier film 2 in the region 2X of the carrier film 2. That is, the adhesive tape 5 is laminated on the upper surface 2 a of the carrier film 2 in a region outside the outer peripheral side surfaces of the metal material 3 and the adhesive layer 4.

  In the laminated sheet 1 according to the present embodiment, a plurality of laminated bodies of the metal material 3 and the adhesive layer 4 are arranged side by side inside the region 5X of the adhesive tape 5. It is preferable that a plurality of laminated bodies of the metal material and the adhesive layer are arranged side by side inside a portion where the carrier film and the adhesive tape are laminated.

  The region 5X of the adhesive tape 5 is a portion that is attached to the ring frame. By sticking the region 5X of the adhesive tape 5 to the ring frame, the metal material 3, the adhesive layer 4, and the adhesive tape 5 can be fixed when the laminate of the metal material 3 and the adhesive layer 4 is picked up from the adhesive tape 5. .

  Moreover, it is preferable that the said adhesive tape has a release liner. When the pressure-sensitive adhesive tape has the release liner, the pickup property of the laminate of the metal material and the adhesive layer is further improved. The release liner is preferably located at a portion of the pressure-sensitive adhesive tape that is laminated on the adhesive layer and the carrier film.

  Next, an example of the manufacturing method of the lamination sheet which concerns on this invention is demonstrated. FIGS. 2A to 2C are partial cutaway front cross-sectional views for explaining an example of each process for obtaining a laminated sheet according to an embodiment of the present invention.

  First, a carrier film 2 and a laminate of the metal material 3 and the adhesive layer 4 are prepared.

  As shown in FIG. 2A, a laminate of the metal material 3 and the adhesive layer 4 is laminated on the surface of the carrier film 2 from the metal material 3 side. The laminate has a configuration in which the metal material 3 and the adhesive layer 4 are laminated. The laminate has a configuration in which the other surface 4 b of the adhesive layer 4 is laminated on one surface 3 a of the metal material 3. The metal material 3 of the laminate and the carrier film 2 are laminated. On the upper surface 2a of the carrier film 2, the other surface 3b of the metal material 3 of the laminate is laminated.

  The planar shape of the laminate of the metal material 3 and the adhesive layer 4 is substantially circular. The laminate may be cut into a substantially circular shape in advance, and the laminate may be cut into a substantially circular shape after being laminated on the carrier film. The carrier film and the laminate previously cut into a substantially circular shape may be laminated, or only the laminate may be cut into a substantially circular shape after the carrier film and the laminate are laminated. Further, when the laminate is cut into a plurality of pieces, the laminate may be cut into a substantially circular shape.

  As shown in FIG. 2B, the laminate of the metal material 3 and the adhesive layer 4 is cut into a size corresponding to the size of the semiconductor chip from the adhesive layer 4 side of the laminate. The laminate of the metal material 3 and the adhesive layer 4 is cut into a size corresponding to the size of the semiconductor chip. The said laminated body is divided | segmented into plurality. The carrier film 2 is not cut. The method of cutting the laminate to a size corresponding to the size of the semiconductor chip is not particularly limited, and examples thereof include a method of cutting using a rotary die or the like.

  As shown in FIG.2 (c), the adhesive tape 5 is laminated | stacked on the contact bonding layer 4 side of the said laminated body. An adhesive tape 5 is laminated on one surface 4 a of the adhesive layer 4. The adhesive tape 5 is laminated so as to cover the laminated body of the metal material 3 and the adhesive layer 4 cut to a size corresponding to the size of the semiconductor chip. The outer peripheral side surface of the adhesive tape 5 projects outward from the outer peripheral side surface of the laminate of the metal material 3 and the adhesive layer 4. The pressure-sensitive adhesive tape 5 has a region 5 </ b> X that protrudes laterally from the outer peripheral side surface of the laminate of the metal material 3 and the adhesive layer 4. In the region 5X of the adhesive tape 5, the carrier film 2 and the adhesive tape 5 are laminated. In this way, the laminated sheet 1 according to the present invention can be obtained.

  Next, an example of a method for manufacturing a semiconductor device according to the present invention will be described. 3 (a) and 3 (b) are partially cutaway front cross-sectional views for explaining an example of each process for obtaining a semiconductor device according to an embodiment of the present invention using the laminated sheet 1 shown in FIG. 1 (b). It is a figure and a top view. 4 (a) to 4 (c) are partially cutaway front cross-sectional views for explaining an example of each process for obtaining a semiconductor device according to an embodiment of the present invention using the laminated sheet shown in FIG. 1 (b). It is. FIG. 3A is a partially cutaway front sectional view of a state where the carrier film 2 of the laminated sheet 1 is peeled off and the adhesive tape 5 is attached to the ring frame 22, and FIG. 3B is an adhesive tape. 5 is a plan view of a state after 5 is attached to the ring frame 22. FIG.

  As shown to Fig.3 (a), the carrier film 2 of the lamination sheet 1 is peeled. When peeling the carrier film 2 of the laminated sheet 1, it is preferable to peel the carrier film 2 from the metal material 3 and the adhesive tape 5 using the peeling edge 32. As shown in FIGS. 3A and 3B, when the carrier film 2 of the laminated sheet 1 is peeled off, the metal material 3 of the pressure-sensitive adhesive tape 5 and the outer peripheral side surface of the laminated body of the adhesive layer 4 are located laterally. It is preferable to stick the protruding region 5X to the ring frame 22. When affixing the region 5X of the adhesive tape 5 to the ring frame 22, the metal material 3 and the adhesive layer 4 are used by the roll 31 so that the metal material 3, the adhesive layer 4, and the adhesive tape 5 do not wrinkle. It is preferable that the region 5X of the adhesive tape 5 is attached to the ring frame 22 while the adhesive tape 5 is stretched.

  After affixing the region 5X of the adhesive tape 5 to the ring frame 22, as shown in FIG. 4A, the ring frame 22 and the metal material 3 are turned upside down and placed on the stage 21. Examples of the stage 21 include a stage of a device such as a die bonder.

  As shown in FIG. 4B, a laminate of the metal material 3 and the adhesive layer 4 cut to a size corresponding to the size of the semiconductor chip is picked up from the adhesive tape 5. A method for picking up the laminate of the metal material 3 and the adhesive layer 4 is not particularly limited, and examples thereof include a needle pickup and a sliding pickup.

  A substrate 41 on which the semiconductor chip 33 is mounted is prepared. As shown in FIG. 4C, the picked-up metal material 3 and the adhesive layer are formed on the surface of the semiconductor chip 33 opposite to the substrate 41 side. 4 is laminated from the adhesive layer 4 side. In this way, the semiconductor device according to the present invention can be obtained. The semiconductor chip 33 has an electrode (not shown) on the surface opposite to the adhesive layer 4 side.

  In the laminated sheet, the metal material and the adhesive layer are preferably integrated.

  From the viewpoint of further improving the peelability of the carrier film, the peel adhesion strength between the carrier film and the adhesive tape is preferably 300 mN / 25 mm or less, more preferably 200 mN / 25 mm or less. The lower limit of the peel adhesion strength between the carrier film and the adhesive tape is not particularly limited. The peel adhesion strength between the carrier film and the adhesive tape is preferably 1 mN / 25 mm or more, more preferably 5 mN / 25 mm or more.

  From the viewpoint of further improving the production efficiency of electronic components using a laminated sheet, and from the viewpoint of further improving the peelability of the carrier film, the peel adhesion strength between the carrier film and the metal material is preferably It is 2 mN / 25 mm or more, more preferably 5 mN / 25 mm or more, preferably 200 mN / 25 mm or less, more preferably 100 mN / 25 mm or less. When the peeling adhesion strength between the carrier film and the metal material is equal to or greater than the lower limit, the metal material and the laminate of the adhesive layer are cut when the laminate of the metal material and the adhesive layer is cut. It is possible to further suppress peeling from the carrier film.

  In the laminated sheet according to the present invention, the peel adhesive strength between the carrier film and the metal material is smaller than the peel adhesive strength between the adhesive layer and the adhesive tape. From the viewpoint of further improving the production efficiency of electronic parts using a laminated sheet, and from the viewpoint of further improving the peelability of the carrier film, the peel adhesion strength between the carrier film and the metal material, and the adhesive layer The absolute value of the difference between the peel adhesive strength and the adhesive tape is preferably 5 mN / 25 mm or more, more preferably 10 N / 25 mm or more. From the viewpoint of further increasing the production efficiency of electronic components using a laminated sheet, the peel adhesion strength between the adhesive layer and the adhesive tape is preferably 10 mN / 25 mm or more, more preferably 20 N / 25 mm or more. , Preferably 5000 mN / 25 mm or less, more preferably 4000 mN / 25 mm or less.

  When peeling the carrier film of the laminated sheet, the peel adhesion strength between the carrier film and the metal material and the peel adhesion strength between the adhesive layer and the adhesive tape satisfy the above-described relationship. It can suppress further that the laminated body of the said metal material and the said contact bonding layer adheres to a carrier film. Moreover, the pick-up property of the laminate of the metal material and the adhesive layer can be further improved. As a result, the manufacturing efficiency of the semiconductor device can be further improved.

  From the viewpoint of further improving the production efficiency of electronic components using a laminated sheet, the peel adhesion strength between the metal material and the adhesive layer is preferably 4000 mN / 25 mm or more, more preferably 6000 N / 25 mm or more. . When the peel adhesion strength between the metal material and the adhesive layer is not less than the above lower limit and not more than the above upper limit, when peeling the carrier film or picking up a laminate of the metal material and the adhesive layer, the above Peeling between the metal material and the adhesive layer can be further suppressed. As a result, the manufacturing efficiency of the semiconductor device can be further improved.

  The peel adhesion strength can be measured at 25 ° C. according to JIS K 6854-3.

  Examples of the method for adjusting the peel adhesion strength include a method for adjusting the composition of the adhesive layer, a method for adjusting the pressure-sensitive adhesive layer of the carrier film, and a method for changing the type of the metal material.

  As a method for adjusting the composition of the adhesive layer, adjustment of the molecular weight of the resin component and the number of blended parts, adjustment of the number of blended parts of the solid resin and liquid resin, adjustment of the number of blended parts of the solid curing agent and the liquid curing agent, solid curing accelerator And adjustment of the number of parts of the liquid curing accelerator, adjustment of the number of parts of the inorganic filler, adjustment of the number of parts of the additive, and the like.

  Examples of the method for adjusting the pressure-sensitive adhesive layer of the carrier film include adjustment of the molecular weight of the resin component and the number of blended parts, adjustment of the number of blended parts of each component, and change of the resin type used for the pressure-sensitive adhesive layer.

  From the viewpoint of effectively reducing thermal resistance and effectively increasing adhesiveness, the thickness of the metal material is preferably 200 μm or less, more preferably 150 μm or less, and even more preferably 110 μm or less. From the viewpoint of enhancing heat dissipation and further suppressing the warpage of the semiconductor chip, the thickness of the metal material is preferably 10 μm or more, more preferably 15 μm or more.

  From the viewpoint of effectively reducing the thermal resistance and further suppressing the generation of voids after curing of the adhesive layer, the thickness of the adhesive layer is preferably 40 μm or less, more preferably 35 μm or less, even more preferably 30 μm or less, Particularly preferably, it is 20 μm or less. From the viewpoint of effectively increasing the adhesiveness, the thickness of the adhesive layer is preferably 1 μm or more, more preferably 3 μm or more.

  From the viewpoint of further improving the peelability of the carrier film, the thickness of the carrier film is preferably 100 μm or less, more preferably 75 μm or less, preferably 10 μm or more, more preferably 20 μm or more.

  From the viewpoint of further improving the handleability and pick-up property of the laminated sheet, the thickness of the pressure-sensitive adhesive tape is preferably 300 μm or less, more preferably 250 μm or less, preferably 5 μm or more, more preferably 10 μm or more.

  When the pressure-sensitive adhesive tape has a release liner, the thickness of the release liner is preferably 100 μm or less, more preferably 70 μm or less, and more preferably 5 μm or more, more preferably, from the viewpoint of further improving pickup properties. Is 10 μm or more.

  Hereinafter, other details of the laminated sheet will be described.

(Metal material)
The metal material is preferably a metal foil or a metal plate, and more preferably a metal foil.

  Examples of the material of the metal material include aluminum, copper, gold, and a graphite sheet. From the viewpoint of further improving the thermal conductivity and further improving the adhesion reliability after curing, the metal material is preferably gold, copper or aluminum, and preferably copper or aluminum. More preferred. From the viewpoint of further improving the thermal conductivity and further reducing the warpage of the semiconductor chip, the metal material is more preferably copper.

(Adhesive layer)
The material for the adhesive layer preferably contains a curable compound (A), a curing agent (B), a curing accelerator (C), and an inorganic filler (D).

  The curable compound (A) may be a curable compound (A1) having a molecular weight of less than 10,000, a curable compound (A2) having a molecular weight of 10,000 or more, and a molecular weight of less than 10,000. Both a certain curable compound (A1) and a curable compound (A2) having a molecular weight of 10,000 or more may be used. As for a sclerosing | hardenable compound (A), only 1 type may be used and 2 or more types may be used together.

Curable compound (A1):
Examples of the curable compound (A1) having a molecular weight of less than 10,000 include curable compounds having a cyclic ether group. Examples of the cyclic ether group include a cyclic ether group having 3 or less carbon atoms, such as an epoxy group and an oxetanyl group. The curable compound having a cyclic ether group is preferably a curable compound having an epoxy group or an oxetanyl group. As for a sclerosing | hardenable compound (A1), only 1 type may be used and 2 or more types may be used together.

  The curable compound (A1) may contain an epoxy compound (A1a) having an epoxy group, or may contain an oxetane compound (A1b) having an oxetanyl group.

  From the viewpoint of further improving the heat resistance and voltage resistance of the cured product, the curable compound (A1) preferably has an aromatic skeleton.

  The aromatic skeleton is not particularly limited, and examples thereof include naphthalene skeleton, fluorene skeleton, biphenyl skeleton, anthracene skeleton, pyrene skeleton, xanthene skeleton, adamantane skeleton, and bisphenol A skeleton. From the viewpoint of further improving the cold heat cycle characteristics and heat resistance of the cured product, a biphenyl skeleton or a fluorene skeleton is preferable.

  Specific examples of the epoxy compound (A1a) having an epoxy group include an epoxy monomer having a bisphenol skeleton, an epoxy monomer having a dicyclopentadiene skeleton, an epoxy monomer having a naphthalene skeleton, an epoxy monomer having an adamantane skeleton, and an epoxy having a fluorene skeleton. Examples of the monomer include an epoxy monomer having a biphenyl skeleton, an epoxy monomer having a bi (glycidyloxyphenyl) methane skeleton, an epoxy monomer having a xanthene skeleton, an epoxy monomer having an anthracene skeleton, and an epoxy monomer having a pyrene skeleton. These hydrogenated products or modified products may be used. As for an epoxy compound (A1a), only 1 type may be used and 2 or more types may be used together.

  Examples of the epoxy monomer having a bisphenol skeleton include an epoxy monomer having a bisphenol A type, bisphenol F type, or bisphenol S type bisphenol skeleton.

  Examples of the epoxy monomer having a dicyclopentadiene skeleton include dicyclopentadiene dioxide and a phenol novolac epoxy monomer having a dicyclopentadiene skeleton.

  Examples of the epoxy monomer having a naphthalene skeleton include 1-glycidylnaphthalene, 2-glycidylnaphthalene, 1,2-diglycidylnaphthalene, 1,5-diglycidylnaphthalene, 1,6-diglycidylnaphthalene, 1,7-diglycidyl. Naphthalene, 2,7-diglycidylnaphthalene, triglycidylnaphthalene, 1,2,5,6-tetraglycidylnaphthalene and the like can be mentioned.

  Examples of the epoxy monomer having an adamantane skeleton include 1,3-bis (4-glycidyloxyphenyl) adamantane and 2,2-bis (4-glycidyloxyphenyl) adamantane.

  Examples of the epoxy monomer having a fluorene skeleton include 9,9-bis (4-glycidyloxyphenyl) fluorene, 9,9-bis (4-glycidyloxy-3-methylphenyl) fluorene, and 9,9-bis (4- Glycidyloxy-3-chlorophenyl) fluorene, 9,9-bis (4-glycidyloxy-3-bromophenyl) fluorene, 9,9-bis (4-glycidyloxy-3-fluorophenyl) fluorene, 9,9-bis (4-Glycidyloxy-3-methoxyphenyl) fluorene, 9,9-bis (4-glycidyloxy-3,5-dimethylphenyl) fluorene, 9,9-bis (4-glycidyloxy-3,5-dichlorophenyl) Fluorene and 9,9-bis (4-glycidyloxy-3,5-dibromophenyl) Fluorene, and the like.

  Examples of the epoxy monomer having a biphenyl skeleton include 4,4'-diglycidylbiphenyl and 4,4'-diglycidyl-3,3 ', 5,5'-tetramethylbiphenyl.

  Examples of the epoxy monomer having a bi (glycidyloxyphenyl) methane skeleton include 1,1′-bi (2,7-glycidyloxynaphthyl) methane, 1,8′-bi (2,7-glycidyloxynaphthyl) methane, 1,1′-bi (3,7-glycidyloxynaphthyl) methane, 1,8′-bi (3,7-glycidyloxynaphthyl) methane, 1,1′-bi (3,5-glycidyloxynaphthyl) methane 1,8'-bi (3,5-glycidyloxynaphthyl) methane, 1,2'-bi (2,7-glycidyloxynaphthyl) methane, 1,2'-bi (3,7-glycidyloxynaphthyl) Examples include methane and 1,2′-bi (3,5-glycidyloxynaphthyl) methane.

  Examples of the epoxy monomer having a xanthene skeleton include 1,3,4,5,6,8-hexamethyl-2,7-bis-oxiranylmethoxy-9-phenyl-9H-xanthene.

  Specific examples of the oxetane compound (A1b) having an oxetanyl group include, for example, 4,4′-bis [(3-ethyl-3-oxetanyl) methoxymethyl] biphenyl, 1,4-benzenedicarboxylate bis [(3- Ethyl-3-oxetanyl) methyl] ester, 1,4-bis [(3-ethyl-3-oxetanyl) methoxymethyl] benzene, and oxetane-modified phenol novolac. As for an oxetane compound (A1b), only 1 type may be used and 2 or more types may be used together.

  From the viewpoint of further improving the heat resistance of the cured product, the curable compound (A1) preferably has two or more cyclic ether groups.

  From the viewpoint of further improving the heat resistance of the cured product, the content of the curable compound having two or more cyclic ether groups in 100% by weight of the curable compound (A1) is preferably 70% by weight or more. Preferably it is 80 weight% or more, Preferably it is 100 weight% or less. In a total of 100% by weight of the curable compound (A1), the content of the curable compound having two or more cyclic ether groups may be 10% by weight or more, or 100% by weight or less. Further, the entire curable compound (A1) may be a curable compound having two or more cyclic ether groups.

  The molecular weight of the curable compound (A1) is less than 10,000. The molecular weight of the curable compound (A1) is preferably 200 or more, preferably 1200 or less, more preferably 600 or less, and further preferably 550 or less. When the molecular weight of the curable compound (A1) is not less than the above lower limit, the adhesiveness of the surface of the cured product is lowered, and the handleability of the curable composition is further enhanced. When the molecular weight of the curable compound (A1) is not more than the above upper limit, the adhesiveness of the cured product is further enhanced. Furthermore, the cured product is hard and hard to be brittle, and the adhesiveness of the cured product is further enhanced.

  In the present specification, the molecular weight in the curable compound (A1) means a molecular weight that can be calculated from the structural formula when it is not a polymer and when the structural formula can be specified. Means weight average molecular weight.

  From the viewpoint of further suppressing generation of voids after curing of the adhesive layer, the adhesive layer contains an epoxy monomer having a naphthalene skeleton or an epoxy monomer having a dicyclopentadiene skeleton as the curable compound (A1). Is preferred.

  Of the material of the adhesive layer, in 100% by weight of the material excluding the inorganic filler (when the material of the adhesive layer contains the inorganic filler, the material of the adhesive layer does not contain the inorganic filler in 100% by weight of the material excluding the inorganic filler. In this case, the content of the curable compound (A1) is preferably 10% by weight or more, more preferably 20% by weight or more, and preferably 90% by weight or less, more preferably 80%. % By weight or less, more preferably 70% by weight or less, particularly preferably 60% by weight or less, and most preferably 50% by weight or less. When the content of the curable compound (A1) is not less than the above lower limit, the adhesiveness and heat resistance of the cured product are further enhanced. When the content of the curable compound (A1) is not more than the above upper limit, the coating property at the time of producing the adhesive layer is further enhanced.

Curable compound (A2):
The curable compound (A2) is a curable compound having a molecular weight of 10,000 or more. The curable compound (A2) having a molecular weight of 10,000 or more is generally a polymer, and the molecular weight generally means a weight average molecular weight.

  The curable compound (A2) may have an aromatic skeleton. In this case, the heat resistance of the cured product increases and the moisture resistance of the cured product also increases. In the case where the curable compound (A2) has an aromatic skeleton, the curable compound (A2) may have an aromatic skeleton in any part of the entire polymer, and has in the main chain skeleton. Or may be present in the side chain. From the viewpoint of further increasing the heat resistance of the cured product and further increasing the moisture resistance of the cured product, the curable compound (A2) preferably has an aromatic skeleton in the main chain skeleton. As for a sclerosing | hardenable compound (A2), only 1 type may be used and 2 or more types may be used together.

  The aromatic skeleton is not particularly limited, and examples thereof include naphthalene skeleton, fluorene skeleton, biphenyl skeleton, anthracene skeleton, pyrene skeleton, xanthene skeleton, adamantane skeleton, and bisphenol A skeleton. From the viewpoint of further improving the cold heat cycle characteristics and heat resistance of the cured product, a biphenyl skeleton or a fluorene skeleton is preferable.

  As the curable compound (A2), a curable resin such as a thermoplastic resin and a thermosetting resin can be used. The curable compound (A2) is preferably a thermoplastic resin or a thermosetting resin. The curable compound (A2) is preferably a curable resin. The curable compound (A2) is preferably a thermoplastic resin, and is preferably a thermosetting resin.

  The thermoplastic resin and thermosetting resin are not particularly limited. The thermoplastic resin is not particularly limited, and examples thereof include styrene resin, phenoxy resin, phthalate resin, thermoplastic urethane resin, polyamide resin, thermoplastic polyimide resin, ketone resin, and norbornene resin. The thermosetting resin is not particularly limited, and examples thereof include acrylic resins, amino resins, phenol resins, thermosetting urethane resins, epoxy resins, thermosetting polyimide resins, and amino alkyd resins. Examples of the amino resin include urea resin and melamine resin.

  From the viewpoint of further suppressing the oxidative deterioration of the cured product, further improving the heat cycle resistance and heat resistance of the cured product, and further reducing the water absorption of the cured product, the curable compound (A2) is an acrylic resin. A styrene resin, a phenoxy resin, or an epoxy resin is preferable, an acrylic resin, a phenoxy resin, or an epoxy resin is more preferable, and an acrylic resin or a phenoxy resin is further preferable. The acrylic resin is preferably an acrylic resin having an epoxy group in the side chain. In particular, by using a phenoxy resin or an acrylic resin having an epoxy group in the side chain as the curable compound (A2), the heat resistance of the cured product is further enhanced, and the cold-heat cycle characteristics of the cured product are further improved. Get higher. In addition, the curable compound (A2) may not have a cyclic ether group such as an epoxy group.

  As the styrene resin, specifically, a homopolymer of a styrene monomer, a copolymer of a styrene monomer and an acrylic monomer, or the like can be used. Styrene polymers having a styrene-glycidyl methacrylate structure are preferred.

  Examples of the styrene monomer include styrene, o-methylstyrene, m-methylstyrene, p-methylstyrene, p-methoxystyrene, p-phenylstyrene, p-chlorostyrene, p-ethylstyrene, and pn-. Butyl styrene, p-tert-butyl styrene, pn-hexyl styrene, pn-octyl styrene, pn-nonyl styrene, pn-decyl styrene, pn-dodecyl styrene, 2,4-dimethyl Examples include styrene and 3,4-dichlorostyrene.

  Specifically, the phenoxy resin is, for example, a resin obtained by reacting an epihalohydrin with a divalent phenol compound, or a resin obtained by reacting a divalent epoxy compound with a divalent phenol compound.

  The phenoxy resin has a bisphenol A skeleton, bisphenol F skeleton, bisphenol A / F mixed skeleton, naphthalene skeleton, fluorene skeleton, biphenyl skeleton, anthracene skeleton, pyrene skeleton, xanthene skeleton, adamantane skeleton or dicyclopentadiene skeleton. It is preferable. More preferably, the phenoxy resin has a bisphenol A skeleton, a bisphenol F skeleton, a bisphenol A / F mixed skeleton, a naphthalene skeleton, a fluorene skeleton, or a biphenyl skeleton, and at least one of the fluorene skeleton and the biphenyl skeleton. More preferably, it has a skeleton. By using the phenoxy resin having these preferable skeletons, the heat resistance of the cured product is further increased.

  The epoxy resin is an epoxy resin other than the phenoxy resin. Examples of the epoxy resins include styrene skeleton-containing epoxy resins, bisphenol A type epoxy resins, bisphenol F type epoxy resins, bisphenol S type epoxy resins, phenol novolac type epoxy resins, biphenol type epoxy resins, naphthalene type epoxy resins, and fluorene type epoxy resins. , Phenol aralkyl type epoxy resins, naphthol aralkyl type epoxy resins, dicyclopentadiene type epoxy resins, anthracene type epoxy resins, epoxy resins having an adamantane skeleton, epoxy resins having a tricyclodecane skeleton, and epoxy resins having a triazine ring in the skeleton Etc.

  Examples of commercially available acrylic resins having an epoxy group on the side chain include Marproof G-0105SA, G-0130SP, G-0150M, G-0250SP, G-1005S, G-1005SA, G-1010S, G-2050M. , G-01100, and G-017581 (all of which are manufactured by NOF Corporation).

  The molecular weight of the curable compound (A2) is 10,000 or more. The molecular weight of the curable compound (A2) is preferably 30000 or more, more preferably 40000 or more, preferably 1000000 or less, more preferably 250,000 or less. When the molecular weight of the curable compound (A2) is not less than the above lower limit, the cured product is more unlikely to be thermally deteriorated. When the molecular weight of the curable compound (A2) is not more than the above upper limit, the compatibility between the curable compound (A2) and other components is further enhanced. As a result, the heat resistance of the cured product is further increased.

  Of the material of the adhesive layer, the content of the curable compound (A2) is preferably 20% by weight or more, more preferably 30% by weight or more, preferably 70% by weight or less, in 100% by weight of the material excluding the inorganic filler. More preferably, it is 60% by weight or less. When the content of the curable compound (A2) is not less than the above lower limit, the handleability of the curable composition is further improved. When the content of the curable compound (A2) is not more than the above upper limit, the dispersion of the inorganic filler (D) is further facilitated.

Curing agent (B):
The material of the adhesive layer preferably contains a curing agent (B). As for a hardening | curing agent (B), only 1 type may be used and 2 or more types may be used together.

  From the viewpoint of further improving the heat resistance of the cured product, the curing agent (B) preferably has an aromatic skeleton or an alicyclic skeleton. The curing agent (B) preferably includes an amine curing agent (amine compound), an imidazole curing agent, a phenol curing agent (phenol compound) or an acid anhydride curing agent (acid anhydride), and includes an amine curing agent. More preferred. The acid anhydride curing agent includes an acid anhydride having an aromatic skeleton, a hydrogenated product of the acid anhydride or a modified product of the acid anhydride, or an acid anhydride having an alicyclic skeleton, It is preferable to contain a hydrogenated acid anhydride or a modified product of the acid anhydride.

  Examples of the amine curing agent include dicyandiamide, diaminodiphenylmethane, and diaminodiphenylsulfone. From the viewpoint of further improving the adhesion between the cured product and the metal material, the amine curing agent is preferably dicyandiamide. From the viewpoint of further improving the storage stability of the curable composition, the curing agent (B) preferably includes a curing agent having a melting point of 180 ° C. or higher, and includes an amine curing agent having a melting point of 180 ° C. or higher. It is more preferable.

  Examples of the phenol curing agent include phenol novolak, o-cresol novolak, p-cresol novolak, t-butylphenol novolak, dicyclopentadiene cresol, polyparavinylphenol, bisphenol A type novolak, xylylene modified novolak, decalin modified novolak, poly ( And di-o-hydroxyphenyl) methane, poly (di-m-hydroxyphenyl) methane, and poly (di-p-hydroxyphenyl) methane. From the viewpoint of further enhancing the flexibility of the cured product and the flame retardancy of the cured product, a phenol resin having a melamine skeleton, a phenol resin having a triazine skeleton, or a phenol resin having an allyl group is preferable.

  Commercially available products of the above phenol curing agents include MEH-8005, MEH-8010 and MEH-8015 (all of which are made by Meiwa Kasei Co., Ltd.), YLH-903 (Mitsubishi Chemical Corporation), LA-7052, LA-7054, LA -7751, LA-1356 and LA-3018-50P (all of which are manufactured by DIC), PS6313 and PS6492 (all of which are manufactured by Gunei Chemical Co., Ltd.) and the like.

  Examples of the acid anhydride having an aromatic skeleton, a hydrogenated product of the acid anhydride, or a modified product of the acid anhydride include, for example, a styrene / maleic anhydride copolymer, a benzophenone tetracarboxylic acid anhydride, and a pyromellitic acid anhydride. , Trimellitic anhydride, 4,4'-oxydiphthalic anhydride, phenylethynyl phthalic anhydride, glycerol bis (anhydrotrimellitate) monoacetate, ethylene glycol bis (anhydrotrimellitate), methyltetrahydroanhydride Examples include phthalic acid, methylhexahydrophthalic anhydride, and trialkyltetrahydrophthalic anhydride.

  Examples of commercially available acid anhydrides having an aromatic skeleton, hydrogenated products of the acid anhydrides or modified products of the acid anhydrides include SMA Resin EF30, SMA Resin EF40, SMA Resin EF60, and SMA Resin EF80 (any of the above Also manufactured by Sartomer Japan), ODPA-M and PEPA (all manufactured by Manac), Ricacid MTA-10, Ricacid MTA-15, Ricacid TMTA, Ricacid TMEG-100, Ricacid TMEG-200, Ricacid TMEG-300, Ricacid TMEG-500, Ricacid TMEG-S, Ricacid TH, Ricacid HT-1A, Ricacid HH, Ricacid MH-700, Ricacid MT-500, Ricacid DSDA and Ricacid TDA-100 (all manufactured by Shin Nippon Rika Co., Ltd.), EPICLON B4400, EPICLON B650, and EPICLON B570 (all manufactured by both DIC Corporation).

  The acid anhydride having the alicyclic skeleton, the hydrogenated product of the acid anhydride, or the modified product of the acid anhydride is an acid anhydride having a polyalicyclic skeleton, a hydrogenated product of the acid anhydride, or the A modified product of an acid anhydride, or an acid anhydride having an alicyclic skeleton obtained by an addition reaction between a terpene compound and maleic anhydride, a hydrogenated product of the acid anhydride, or a modified product of the acid anhydride It is preferable. By using these curing agents, the flexibility of the cured product and the moisture resistance and adhesion of the cured product are further increased.

  Examples of the acid anhydride having an alicyclic skeleton, a hydrogenated product of the acid anhydride, or a modified product of the acid anhydride include a methyl nadic acid anhydride, an acid anhydride having a dicyclopentadiene skeleton, and the acid anhydride. And the like.

  Examples of commercially available acid anhydrides having the alicyclic skeleton, hydrogenated products of the acid anhydrides, or modified products of the acid anhydrides include Ricacid HNA and Ricacid HNA-100 (all manufactured by Shin Nippon Rika Co., Ltd.) , And EpiCure YH306, EpiCure YH307, EpiCure YH308H, EpiCure YH309 (all of which are manufactured by Mitsubishi Chemical Corporation) and the like.

  The curing agent (B) is preferably methyl nadic acid anhydride or trialkyltetrahydrophthalic anhydride. The use of methyl nadic acid anhydride or trialkyltetrahydrophthalic anhydride further increases the water resistance of the cured product.

  Of the material of the adhesive layer, the content of the curing agent (B) is preferably 0.1% by weight or more, more preferably 1% by weight or more, preferably 60% by weight, in 100% by weight of the material excluding the inorganic filler. Hereinafter, it is more preferably 40% by weight or less. It is easy to fully harden a curable composition as content of a hardening | curing agent (B) is more than the said minimum. When the content of the curing agent (B) is not more than the above upper limit, it is difficult to generate an excessive curing agent (B) that does not participate in curing. For this reason, the heat resistance and adhesiveness of hardened | cured material become still higher.

Curing accelerator (C):
The material for the adhesive layer preferably contains a curing accelerator (C). It is preferable that a hardening accelerator (C) contains both an imidazole compound and a phosphorous acid compound.

  Examples of the imidazole compound include 2-undecylimidazole, 2-heptadecylimidazole, 2-methylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, 1-benzyl- 2-methylimidazole, 1-benzyl-2-phenylimidazole, 1,2-dimethylimidazole, 1-cyanoethyl-2-methylimidazole, 1-cyanoethyl-2-ethyl-4-methylimidazole, 1-cyanoethyl-2-un Decylimidazole, 1-cyanoethyl-2-phenylimidazole, 1-cyanoethyl-2-undecylimidazolium trimellitate, 1-cyanoethyl-2-phenylimidazolium trimellitate, 2,4-diamino-6- [2 ′ -Methyl Midazolyl- (1 ′)]-ethyl-s-triazine, 2,4-diamino-6- [2′-undecylimidazolyl- (1 ′)]-ethyl-s-triazine, 2,4-diamino-6 [2′-Ethyl-4′-methylimidazolyl- (1 ′)]-ethyl-s-triazine, 2,4-diamino-6- [2′-methylimidazolyl- (1 ′)]-ethyl-s-triazine Isocyanuric acid adduct, 2-phenylimidazole isocyanuric acid adduct, 2-methylimidazole isocyanuric acid adduct, 2-phenyl-4,5-dihydroxymethylimidazole and 2-phenyl-4-methyl-5-dihydroxymethylimidazole Can be mentioned. As for the said imidazole compound, only 1 type may be used and 2 or more types may be used together.

  Examples of the phosphorous acid compound include phosphorous acid, phosphorous acid monoester, and phosphorous acid diester. As for the said phosphorous acid compound, only 1 type may be used and 2 or more types may be used together.

  Examples of the phosphorous acid monoester include monomethyl phosphite, monoethyl phosphite, monobutyl phosphite, monolauryl phosphite, monooleyl phosphite, monophenyl phosphite, and mononaphthyl phosphite. Can be mentioned. Examples of the phosphite diester include, for example, dimethyl phosphite, diethyl phosphite, dibutyl phosphite, dilauryl phosphite, dioleyl phosphite, diphenyl phosphite, dinaphthyl phosphite, di-phosphite di- o-tolyl, di-m-tolyl phosphite, di-p-tolyl phosphite, di-p-chlorophenyl phosphite, di-p-bromophenyl phosphite, and di-p-fluorophosphite And phenyl.

  Among the materials of the adhesive layer, the total content of the imidazole compound and the phosphorous acid compound is preferably 0.1% by weight or more, more preferably 0.3% by weight, in 100% by weight of the material excluding the inorganic filler. It is above, Preferably it is 10 weight% or less, More preferably, it is 5 weight% or less. When the total content of the imidazole compound and the phosphorous acid compound is not less than the above lower limit, it is easy to sufficiently cure the curable composition, and further, generation of voids is further suppressed, and pick-up property is improved. Can be further increased. When the total content of the imidazole compound and the phosphorous acid compound is not more than the above upper limit, an excessive curing accelerator (C) that does not participate in curing is hardly generated. For this reason, the heat resistance and adhesiveness of hardened | cured material become still higher.

  The curing accelerator (C) is preferably liquid. When the curing accelerator is liquid, it becomes easier to be compatible with other materials of the adhesive layer, the adhesive layer is uniformly cured, and generation of voids and peeling can be further suppressed. When the curing accelerator is solid, the adhesive layer is not uniformly cured, and the effect of suppressing the occurrence of voids and peeling tends to be reduced.

  The mixing ratio of the imidazole compound and the phosphorous acid compound is not particularly limited, but the molar ratio of the hydroxyl group in the phosphorous acid compound to the imidazole group in the imidazole compound has a preferable lower limit of 0.05, which is preferable. The upper limit is 3.3. When the molar ratio is 0.05 or more, it becomes even easier to stabilize the imidazole group with the hydroxyl group in the phosphorous acid compound. When the molar ratio is 3.3 or less, the curability as a curing accelerator is further enhanced. The more preferable lower limit of the molar ratio of the hydroxyl group in the phosphorous acid compound to the imidazole group in the imidazole compound is 0.07, and the more preferable upper limit is 3.2. The phosphorous acid compound is generally known to exhibit tautomerism between the phosphorous acid type (trihydroxy type) and the phosphonic acid type (dihydroxy type). The number of hydroxyl groups therein is calculated on the assumption that all of the phosphorous acid compound is of the phosphorous acid type (trihydroxy type).

  As a commercial item of the composition containing the said imidazole compound and a phosphorous acid compound, Fujicure 7000 (made by T & K TOKA) etc. are mentioned, for example.

Inorganic filler (D):
The material for the adhesive layer preferably contains an inorganic filler (D). By using the inorganic filler (D), the thermal conductivity, melt viscosity and the like of the cured product can be adjusted. As for an inorganic filler (D), only 1 type may be used and 2 or more types may be used together.

  The inorganic filler (D) is preferably silica, alumina, synthetic magnesite, boron nitride, aluminum nitride, silicon nitride, silicon carbide, zinc oxide or magnesium oxide. Silica, alumina, boron nitride, aluminum nitride, silicon nitride Or silicon carbide. Use of these preferable inorganic fillers makes it easier to adjust the thermal conductivity, melt viscosity, etc. of the cured product.

  The inorganic filler (D) is more preferably spherical silica, crushed silica, spherical alumina, crushed alumina or boron nitride, and more preferably spherical silica, spherical alumina or boron nitride. Use of these preferable inorganic fillers makes it easier to adjust thermal conductivity, melt viscosity, and the like.

  The new Mohs hardness of the inorganic filler (D) is preferably 12 or less, more preferably 9 or less. When the new Mohs hardness of the inorganic filler (D) is 9 or less, the workability of the cured product is further enhanced.

  The inorganic filler (D) may contain a spherical filler (spherical filler), may contain a crushed filler (crushed filler), or may contain a plate-like filler (plate-like filler). Good. It is particularly preferable that the inorganic filler (D) includes a spherical filler. Since the spherical filler can be filled at a high density, the use of the spherical filler makes it easier to adjust the thermal conductivity and melt viscosity of the cured product.

  Examples of the crushed filler include crushed alumina and crushed silica. The crushing filler is obtained, for example, by crushing a lump-like inorganic substance using a uniaxial crusher, a biaxial crusher, a hammer crusher, a ball mill, or the like. By using the crushed filler, the filler in the cured product tends to be bridged or effectively brought into a close structure. Therefore, the thermal conductivity of the cured product is further increased. Moreover, generally the crushing filler is cheap compared with a normal filler. For this reason, the cost of a curable composition becomes low by use of a crushing filler.

  The silica is preferably crushed silica (crushed silica). By using the crushed silica, the moisture resistance of the cured product is further increased.

  The average particle size of the crushed filler is preferably 10 μm or less, more preferably 5 μm or less, and preferably 0.1 μm or more. When the average particle size of the crushed filler is not more than the above upper limit, the crushed filler can be dispersed with high density in the curable composition, and the withstand voltage of the cured product is further enhanced. When the average particle size of the crushed filler is not less than the above lower limit, it becomes even easier to fill the crushed filler with high density.

  The aspect ratio of the crushing filler is not particularly limited. The aspect ratio of the crushed filler is preferably 1.5 or more, and preferably 20 or less. Fillers with an aspect ratio of less than 1.5 are relatively expensive and increase the cost of the curable composition. When the aspect ratio is 20 or less, the crushing filler can be more easily filled.

  The aspect ratio of the crushed filler can be determined, for example, by measuring the crushed surface of the filler using a digital image analysis particle size distribution measuring apparatus (“FPA” manufactured by Nippon Luft).

  The average particle diameter of the inorganic filler (D) is not particularly limited, but is preferably less than the thickness of the adhesive layer, more preferably less than 1/2 of the thickness of the adhesive layer, and still more preferably less than 1/4 of the thickness of the adhesive layer. .

  The “average particle diameter” is an average particle diameter obtained from a volume average particle size distribution measurement result measured by a laser diffraction particle size distribution measuring apparatus.

  In 100% by weight of the material of the adhesive layer, the content of the inorganic filler (D) is preferably 10% by weight or more, more preferably 20% by weight or more, preferably 97% by weight or less, more preferably 95% by weight or less. is there. When the content of the inorganic filler (D) is not less than the above lower limit and not more than the above upper limit, the thermal conductivity of the cured product is further increased. If it is less than the above lower limit and exceeds the above upper limit, it tends to be difficult to adjust the thermal conductivity and melt viscosity of the cured product.

Other ingredients:
The material for the adhesive layer may contain other components generally used for the adhesive layer such as a solvent, a coupling agent, a dispersant, a chelating agent, and an antioxidant in addition to the components described above.

(Carrier film)
The carrier film can be formed of an appropriate material. The carrier film may contain any of a thermosetting component, a thermoplastic component, and a photocurable component. The carrier film may be a cured product or a crosslinked product. The thermosetting component preferably contains a thermosetting compound and a thermosetting agent. The thermoplastic component generally includes a thermoplastic resin. It is preferable that the said photocurable component contains a photocurable compound and a photoinitiator. The carrier film may have thermosetting properties or photo-curing properties. The carrier film may not have thermosetting properties and may not have photosetting properties.

  The carrier film preferably has a base material and an adhesive layer. The adhesive layer is preferably a silicone adhesive layer or a urethane adhesive layer. When the pressure-sensitive adhesive layer is a silicone-based pressure-sensitive adhesive layer or a urethane-based pressure-sensitive adhesive layer, peeling from the pressure-sensitive adhesive tape can be further improved. Examples of the substrate include polyester-based substrates such as polyethylene terephthalate and polyethylene naphthalate, and polyolefin-based substrates such as polyethylene and polypropylene. As a commercial item of the carrier film which has the said silicone type adhesion layer, "SI50-10" by a Nichiei Kako Co., Ltd., "HG-50EX" by Fuji Copian, etc. are mentioned. Examples of commercially available carrier films having the urethane adhesive layer include “PET50-UT180” manufactured by Nichiei Kako Co., Ltd. and “ZUPF-5002” manufactured by Fujimori Kogyo Co., Ltd.

(Adhesive tape)
The pressure-sensitive adhesive tape can be formed from an appropriate material. The pressure-sensitive adhesive tape may contain any of a thermosetting component, a thermoplastic component, and a photocurable component. The thermosetting component preferably contains a thermosetting compound and a thermosetting agent. The thermoplastic component generally includes a thermoplastic resin. It is preferable that the said photocurable component contains a photocurable compound and a photoinitiator. The said adhesive tape may have thermosetting property and may have photocurability.

  The pressure-sensitive adhesive tape may be a pressure-sensitive adhesive tape including a base material and a pressure-sensitive adhesive layer disposed on the surface of the base material. As a commercial item of the said adhesive tape, Denka "UHP-110BZ", Denka "T-80HW", etc. are mentioned.

  Moreover, the said adhesive tape may have a release liner. When the adhesive tape has a release liner, the pickup property of the laminate of the metal material and the adhesive layer can be further enhanced. It is preferable that the release liner is located at a portion where the adhesive layer of the pressure-sensitive adhesive tape is laminated.

Release liner:
The release liner can be formed of an appropriate material. The release liner may be a single layer or a multilayer of two or more layers.

  From the viewpoint of further improving the pickup property, the release liner preferably contains polyolefin, and more preferably contains polypropylene. It is preferable that the surface of the release liner in contact with the adhesive layer contains a polyolefin. When the release liner is a multilayer of two or more layers, the layer in contact with the adhesive layer in the release liner preferably contains a polyolefin.

  Although it does not specifically limit as said polyolefin, For example, polyethylene, a polypropylene, etc. are mentioned. As said polyethylene, the homopolymer of ethylene, the copolymer of the monomer containing ethylene, etc. are mentioned. It is preferable that 50% by weight or more (preferably 80% by weight or more, more preferably 90% by weight or more) of the monomer constituting the polyethylene is ethylene. As said polypropylene, the homopolymer of propylene, the copolymer of the monomer containing propylene, etc. are mentioned. It is preferable that 50% by weight or more (preferably 80% by weight or more, more preferably 90% by weight or more) of the monomer constituting the polypropylene is propylene.

  Hereinafter, the present invention will be clarified by giving specific examples and comparative examples of the present invention. The present invention is not limited to the following examples.

  The following materials were prepared as metal materials.

  (1) Copper foil (Cu), thickness: 18 μm

  The following materials were prepared as the material for the adhesive layer.

Curable compound (A1):
(1) Bisphenol A liquid epoxy resin (“Epicoat 828US” manufactured by Mitsubishi Chemical Corporation)

Curable compound (A2):
(1) Epoxy group-containing acrylic resin (“Marproof G-2050M” manufactured by NOF Corporation, Mw = 250,000)

Curing agent (B):
(1) Alicyclic skeleton acid anhydride (“Rikacid MH-700” manufactured by Shin Nippon Chemical Co., Ltd.)

Curing accelerator (C):
(1) Compound containing imidazole and phosphorous acid compound ("Fujicure 7000" manufactured by T & K TOKA)

Inorganic filler (D):
(1) 250 nm silica (spherical silica, “SO-C1” manufactured by Admatechs, average particle diameter of 250 nm)

solvent:
(1) Methyl ethyl ketone (MEK)

  The following carrier films were prepared.

  (1) Carrier film 1: “SI50-10” (carrier film having a silicone-based adhesive layer) manufactured by Nichiei Kako Co., Ltd.

  (2) Carrier film 2: “HG5-50EX” (carrier film having a silicone-based adhesive layer) manufactured by Fujikopian

  (3) Carrier film 3: “PET50-UT180” (carrier film having a urethane-based adhesive layer) manufactured by Nichiei Kako Co., Ltd.

  (4) Carrier film 4: “ZUPF-5002” (carrier film having a urethane-based adhesive layer) manufactured by Fujimori Kogyo Co., Ltd.

  (5) Carrier film 5: “PC-751” manufactured by Fujimori Kogyo Co., Ltd. (carrier film having an acrylic adhesive layer)

  (6) Carrier film 6: “PET50-H109” (carrier film having an acrylic adhesive layer) manufactured by Niei Kaiko Co., Ltd.

  (7) Carrier film 7: “SP1008” (release film) manufactured by Toyo Cloth

  The following adhesive tapes were prepared.

  (1) Adhesive tape 1: Denka's “UHP-110BZ”

  (2) Adhesive tape 2: Denka's “T-80HW”

  The following release liners were prepared.

  (1) Release liner 1: “FSA-020M” (polyolefin film) manufactured by Futamura Chemical Co., Ltd.

  (2) Release liner 2: “GF-3” (polyolefin film) manufactured by Tamapoli

Example 1
(1) Production of Laminate Using a homodisper-type stirrer, the components shown in Table 1 below are added to the amounts shown in Table 1 below, and methyl ethyl ketone as a solvent is added as appropriate, and stirred to prepare an adhesive composition. did.

  A sheet having the copper foil and the adhesive layer formed by applying the adhesive composition to a target thickness on the copper foil, drying in an oven at 90 ° C. for 30 minutes, volatilizing the solvent, and forming an adhesive layer. A laminate was produced.

(2) Production of composite body The obtained sheet-like laminate was processed into a predetermined shape, placed on the surface of the carrier film shown in Table 2 below from the copper foil side, and bonded at room temperature with a laminator. To obtain a composite. A laminate of the obtained composite metal material and adhesive layer was processed into a predetermined size by punching.

(3) Production of Laminated Sheet The adhesive tape shown in Table 2 below was laminated on the adhesive layer side of the obtained composite to obtain a laminated sheet.

(Example 2)
Except that the release liner shown in Table 2 below was disposed between the adhesive layer and the pressure-sensitive adhesive tape and between the carrier film and the pressure-sensitive adhesive tape of the obtained composite when the laminated sheet was produced. In the same manner as in Example 1, laminates, composites, and laminate sheets were produced.

(Example 3)
A laminate, a composite, and a laminate sheet were produced in the same manner as in Example 2 except that the pressure-sensitive adhesive tape shown in Table 2 was changed to the production of the laminate sheet.

Example 4
A laminate, a composite, and a laminate sheet were produced in the same manner as in Example 2 except that the release liner shown in Table 2 below was changed during the production of the laminate sheet.

(Example 5)
A laminate, a composite, and a laminated sheet were produced in the same manner as in Example 1 except that the carrier film shown in Table 2 below was changed when the composite was produced.

(Example 6)
A laminate, a composite, and a laminated sheet were produced in the same manner as in Example 1 except that the carrier film shown in Table 2 below was changed when the composite was produced.

(Example 7)
A laminate, a composite, and a laminated sheet were produced in the same manner as in Example 3 except that the carrier film shown in Table 2 below was changed when the composite was produced.

(Comparative Example 1)
A laminate, a composite, and a laminated sheet were produced in the same manner as in Example 1 except that the carrier film shown in Table 2 below was changed when the composite was produced.

(Comparative Example 2)
A laminate, a composite, and a laminated sheet were produced in the same manner as in Example 3 except that the carrier film shown in Table 2 below was changed when the composite was produced.

(Comparative Example 3)
A laminate, a composite, and a laminated sheet were produced in the same manner as in Example 2 except that the carrier film shown in Table 2 below was changed when the composite was produced.

(Comparative Example 4)
A laminate, a composite, and a laminated sheet were produced in the same manner as in Example 1 except that the carrier film shown in Table 2 below was changed when the composite was produced.

(Evaluation)
(1) Peeling adhesive strength (i) Peeling adhesive strength between carrier film and metal material From the copper foil side of the obtained sheet-like laminate on the surface of the carrier film used for producing the composite It arrange | positioned and it bonded together at room temperature with the laminator, and produced the measurement sample. With respect to the obtained measurement sample, peeling adhesive strength due to T-peeling between the carrier film and the copper foil was measured according to JIS K 6854-3.

(Ii) Peeling adhesive strength between carrier film and pressure-sensitive adhesive tape A measurement sample was produced by laminating the pressure-sensitive adhesive tape used for the production of the laminated sheet on the carrier film used for the production of the composite. With respect to the obtained measurement sample, peel adhesion strength due to T-peel separation between the carrier film and the adhesive tape was measured according to JIS K 6854-3.

(Iii) Peeling adhesive strength between adhesive layer and adhesive tape The adhesive tape used for preparation of the laminated sheet was laminated on the adhesive layer side of the obtained sheet-like laminate to prepare a measurement sample. The peeled adhesive strength due to T-peel separation between the adhesive layer and the adhesive tape was measured for the obtained measurement sample according to JIS K 6854-3.

(2) Peelability of carrier film (i) Peelability between carrier film and adhesive tape The adhesive tape used for the production of the laminated sheet was cut into a circle and laminated on the carrier film used for the production of the composite. Thus, a measurement sample was prepared. The following carrier film peeling test was implemented using the obtained measurement sample. The peelability between the carrier film and the adhesive tape was determined according to the following criteria.

Carrier film peel test:
The operation of attaching the adhesive tape of the measurement sample to the ring frame was performed using “DAM-812M” manufactured by Takatori, and the peelability of the adhesive tape from the carrier film at that time was evaluated.

[Criteria for peelability between carrier film and adhesive tape]
○: The adhesive tape can be peeled off from the carrier film without any adhesive residue. Δ: The adhesive tape can be peeled off from the carrier film although the glue remains slightly.

(Ii) Peelability between carrier film and metal material The obtained sheet-like laminate was cut into a size of 10 mm × 10 mm, and the copper foil side was formed on the surface of the carrier film used for producing the composite And bonded together at room temperature with a laminator to prepare a composite. The pressure-sensitive adhesive tape used for the production of the laminated sheet was cut into a circle and laminated on the resulting composite to produce a measurement sample. The following carrier film peeling test was implemented using the obtained measurement sample. The peelability between the carrier film and the metal material was determined according to the following criteria.

Carrier film peel test:
The operation of attaching the adhesive tape of the measurement sample to the ring frame was performed using “DAM-812M” manufactured by Takatori, and the peelability of the laminate from the carrier film was evaluated. Of the 20 test pieces, the number of pieces that could be peeled off from the carrier film was counted.

[Criteria for peelability between carrier film and metal]
○: Number of peelable from the carrier film is 16 or more Δ: Number of peelable from the carrier film is 10 or more, 15 or less ×: Number of peelable from the carrier film is 9 or less

(3) Delamination preventing property of laminate of metal material and adhesive layer The obtained sheet-like laminate was placed on the surface of the carrier film used for producing the composite from the copper foil side and room temperature was obtained using a laminator. And a test sample was prepared. Using the "rotary die cutter SRD W-500" manufactured by Soltec Kogyo Co., Ltd., the obtained test sample is cut into 500 pieces of 10 mm x 10 mm to prevent the laminate of the metal material and the adhesive layer from peeling off. Sex was evaluated. The peeling prevention property of the laminate of the metal material and the adhesive layer was determined according to the following criteria.

[Judgment criteria for peeling prevention of laminate of metal material and adhesive layer]
○: The number of peeled metal materials and adhesive layer laminates is 9 or less. Δ: The number of peeled metal materials and adhesive layer laminates is 10 or more and 49 or less. More than 50 laminates

(4) Pickup property As a laminated sheet, a laminated sheet in which a laminate of a metal material and an adhesive layer was cut into a size of 10 mm × 10 mm was prepared. The carrier film was peeled off from the obtained laminated sheet, and an adhesive tape was attached to the ring frame to prepare a measurement sample. The following pick-up property test was implemented using the obtained measurement sample. The pick-up property was determined according to the following criteria.

Pickup test:
Pickup evaluation was performed at room temperature by a sliding pickup method using “Die Bonder BESTTEM” manufactured by Canon Machinery. Of 20 test pieces, the number of pick-ups was counted.

[Pickup criteria]
○: Number of picked up 20 pieces ○: Number of picked up pieces of 16 or more and 19 or less ×: Number of picked up pieces of 15 or less −: Lamination of carrier film or laminate of metal material and adhesive layer The sample has not been obtained due to poor peeling prevention, and evaluation has not been performed.

  The composition of the adhesive layer is shown in Table 1 below. Table 2 below shows the configuration of the metal material, the adhesive layer, the carrier film, the pressure-sensitive adhesive tape, and the release liner, and the evaluation results. In addition, although methyl ethyl ketone was used at the time of preparation of an adhesive layer, methyl ethyl ketone was removed by volatilization in the adhesive layer.

DESCRIPTION OF SYMBOLS 1 ... Laminated sheet 2 ... Carrier film 2X ... Overhang | projection area | region 2a ... Upper surface 3 ... Metal material 3a ... One surface 3b ... Other surface 4 ... Adhesive layer 4a ... One surface 4b ... Other surface 5 ... Adhesive tape 5X ... Overhanging area 21 ... Stage 22 ... Ring frame 31 ... Roll 32 ... Stripping edge 33 ... Semiconductor chip 41 ... Substrate

Claims (9)

Provided with carrier film, metal material, adhesive layer, and adhesive tape,
The carrier film, the metal material, the adhesive layer, and the adhesive tape are laminated in this order,
The carrier film and the pressure-sensitive adhesive tape each have a region projecting laterally from the outer peripheral side surface of the metal material and the adhesive layer,
In the region of the carrier film and the adhesive tape that protrudes laterally from the outer peripheral side surface of the metal material and the adhesive layer, the carrier film and the adhesive tape are laminated,
The peel adhesion strength between the carrier film and the adhesive tape is 300 mN / 25 mm or less,
The peel adhesion strength between the carrier film and the metal material is 2 mN / 25 mm or more,
A laminate sheet in which a peel adhesion strength between the carrier film and the metal material is smaller than a peel adhesion strength between the adhesive layer and the adhesive tape. The carrier film has a base material and an adhesive layer,
The laminated sheet according to claim 1, wherein the adhesive layer is a silicone-based adhesive layer or a urethane-based adhesive layer. The metal material has a thickness of 200 μm or less,
The laminated sheet according to claim 1 or 2, wherein the adhesive layer has a thickness of 40 µm or less.   The laminated sheet according to any one of claims 1 to 3, wherein a material of the metal material is copper or aluminum.   The laminated sheet according to any one of claims 1 to 4, which is a laminated sheet used by being laminated on a semiconductor element. The semiconductor element is a semiconductor chip;
The laminated sheet according to claim 5, wherein the metal material and the adhesive layer have a size corresponding to a size of the semiconductor chip.   The lamination according to any one of claims 1 to 6, wherein a plurality of laminated bodies of the metal material and the adhesive layer are arranged side by side inside a portion where the carrier film and the adhesive tape are laminated. Sheet. A method for producing the laminated sheet according to claim 7,
Laminating a laminate of a metal material and an adhesive layer from the metal material side on the surface of the carrier film;
Cutting the laminate on the surface of the carrier film into a size corresponding to the size of the semiconductor chip;
A step of laminating the pressure-sensitive adhesive tape on the adhesive layer side of the laminate after cutting the laminate,
The carrier film, the metal material, the adhesive layer, and the pressure-sensitive adhesive tape are laminated in this order, and the carrier film and the pressure-sensitive adhesive tape are respectively lateral to the outer peripheral side surfaces of the metal material and the adhesive layer. The carrier film and the pressure-sensitive adhesive tape are laminated in a region that has a stretched area, and the metal film of the carrier film and the pressure-sensitive adhesive tape and a region that projects to the side of the outer peripheral side surface of the adhesive layer, The peel adhesion strength between the carrier film and the adhesive tape is 300 mN / 25 mm or less, the peel adhesion strength between the carrier film and the metal material is 2 mN / 25 mm or more, and the carrier film and the metal The peel adhesion strength with the material is smaller than the peel adhesion strength between the adhesive layer and the adhesive tape, One, the inside of the portion carrier film and the adhesive tape are laminated to obtain a laminated sheet stack of the metallic material and the adhesive layer are arranged side by side several method for manufacturing a laminated sheet. A method for manufacturing a semiconductor device using the laminated sheet according to claim 7,
Peeling the carrier film of the laminated sheet;
Picking up the laminate of the metal material and the adhesive layer from the adhesive tape;
A method of manufacturing a semiconductor device, comprising: stacking the picked-up laminate on the surface of a semiconductor chip mounted on a substrate from the adhesive layer side to obtain a semiconductor device.

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