KR102466267B1 - Tape for electronic device packaging - Google Patents

Abstract

A tape for electronic device packaging capable of favorably recognizing the separation of the metal layer with an adhesive layer to be picked up by a pick-up device when picking up a metal layer with an adhesive layer from an adhesive tape. The tape 1 for electronic device packaging of the present invention is an adhesive tape 5 having a base film 51 and a pressure-sensitive adhesive layer 52, and an adhesive installed by laminating the pressure-sensitive adhesive layer 52 on the opposite side of the base film 51. It has a layer (4) and a metal layer (3) laminated on the opposite side of the adhesive layer (52) of the adhesive layer (4), and the metal layer (3) has a surface roughness RzJIS of less than 5.0 μm by 10-point average roughness. to be

Description

Tape for electronic device packaging

The present invention relates to a tape for electronic device packaging, and more particularly, to a tape for electronic device packaging having a metal layer.

BACKGROUND ART In recent years, further thinning and miniaturization of electronic devices such as mobile phones and notebook PCs have been demanded. Then, in order to reduce the thickness and size of electronic device packages such as semiconductor packages mounted on electronic equipment, the number of electrodes of electronic devices and circuit boards is increased, and pitches are also narrowed. Such an electronic device package includes, for example, a flip chip (FC) mounting package.

As described above, in the flip chip mounting package, since the number of electrodes is increased or the pitch is narrowed, an increase in the amount of heat generated has become a problem. Then, as a heat dissipation structure of a flip-chip mounting package, it is proposed to form a metal layer on the back surface of an electronic device via an adhesive layer (see Patent Document 1, for example).

In addition, in a flip-chip mounting package, the linear expansion coefficient of an electronic device and the linear expansion coefficient of a circuit board may differ greatly. In this case, in the manufacturing process of the electronic device package, when the intermediate product is heated and cooled, a difference in expansion and contraction occurs between the electronic device and the circuit board. Due to this difference, warpage occurs in the electronic device package. Also as a structure for suppressing such warpage, forming a metal layer on the back surface of an electronic device via an adhesive layer has been proposed (see Patent Document 2, for example).

It is also proposed to provide a metal layer on the back surface of an electronic device via an adhesive layer in a flip chip packaging package, and to use this metal layer as a protective layer for laser marking (see Patent Document 3, for example).

Moreover, in recent years, another semiconductor chip of the same size may be further stacked on a semiconductor chip to perform three-dimensional mounting. Here, in order to be able to stack another semiconductor chip of the same size on a semiconductor chip, it is necessary to stack spacers between them. This is because other semiconductor chips are also laminated on the electrode pad portion of the semiconductor chip. As the spacer described above, it has been proposed to use a metal layer with an adhesive layer (see Patent Document 4, for example). In Patent Document 4, the spacer is formed by bonding an adhesive sheet for spacers having a metal layer having an adhesive layer on at least one surface to a dicing sheet using the adhesive layer as a bonding surface, and dicing the adhesive sheet for spacers. , a step of forming a chip-shaped spacer with an adhesive layer, a pin pushing up the spacer, and a pick-up device used when peeling the semiconductor chip along with the adhesive layer from the dicing sheet, It is described that it is installed by a step of peeling from the dicing sheet together with the adhesive layer and a step of fixing the spacer to the adherend via the adhesive layer.

Japanese Unexamined Patent Publication No. 2007-235022 Japanese Patent No. 5487847 Japanese Patent No. 5419226 Japanese Patent No. 4954569

As described above, the metal layer with an adhesive layer is useful for various electronic device packages, but from the viewpoint of productivity, as disclosed in Patent Document 4, pick-up or fixation to an adherend using an existing device is not possible. It is required to do

In an existing pick-up device, pick-up is performed by vacuum adsorbing a semiconductor chip with a collet. At this time, since it is necessary to pick up the semiconductor chip reliably, the position of the semiconductor chip is recognized, the displacement of the semiconductor chip is detected, the position of the collet is corrected, and the semiconductor chip is picked up.

As a method for recognizing semiconductor chips, pattern recognition is mainly used. A method using pattern recognition is that a circuit, alignment mark, or chip outline of a semiconductor chip is registered in advance as a template, and the position of the semiconductor chip is recognized by matching the template with an image of the semiconductor chip captured by an imaging device. . When a circuit or alignment mark is not formed, such as a bare chip, a template including a chip outline and a uniform chip surface is registered.

When trying to pick up a metal layer to which an adhesive layer is attached from an adhesive tape using such an existing pick-up device, since no circuit exists in the metal layer, a template having the outer shape of the metal layer and a uniform surface of the metal layer is used as in the case of a bare chip. will do However, when the surface roughness of the metal layer is large, the image pickup device detects irregularities on the surface, and as a result of determining that the imaged metal layer surface is different from the template, there is a problem that the metal layer separation cannot be recognized.

Then, the present invention provides a tape for electronic device packaging capable of favorably recognizing the separation of the metal layer with an adhesive layer to be picked up by a pick-up device when picking up a metal layer with an adhesive layer from an adhesive tape. aims to do

In order to solve the above problems, a tape for electronic device packaging according to the present invention is an adhesive tape having a base film and an adhesive layer, an adhesive layer laminated on the side opposite to the base film of the pressure-sensitive adhesive layer, and the adhesive layer. It has a metal layer laminated and provided on the side opposite to the pressure-sensitive adhesive layer, and the metal layer has a surface roughness RzJIS of less than 5.0 μm by 10-point average roughness on a surface on the opposite side to the adhesive layer.

The tape for electronic device packaging preferably has a specular gloss of less than 100% at an incident angle of 60 degrees on the metal layer.

It is preferable that the thickness of the metal layer of the said tape for electronic device packaging is 5 micrometers or more and less than 200 micrometers.

It is preferable that the adhesive force of the adhesive tape and the adhesive layer in the state in which the adhesive layer and the metal layer are picked up from the adhesive tape of the electronic device packaging tape is 0.03 to 0.5 N/25 mm.

In the tape for electronic device packaging, it is preferable that the metal layer contains copper or aluminum.

Further, in the tape for electronic device packaging, the adhesive layer preferably contains (A) an epoxy resin, (B) a curing agent, (C) an acrylic resin or a phenoxy resin, and (D) a surface-treated inorganic filler. do.

Further, in the tape for electronic device packaging, the pressure-sensitive adhesive layer contains an acrylic acid ester represented by CH ₂ =CHCOOR (wherein R is an alkyl group having 4 to 18 carbon atoms), a hydroxyl group-containing monomer, and in a molecule It is preferable to contain an acrylic polymer composed of an isocyanate compound having a radical reactive carbon-carbon double bond.

According to the present invention, when the metal layer with an adhesive layer is picked up from the adhesive tape, the separation of the metal layer with an adhesive layer to be picked up can be favorably recognized by the pick-up device.

1 is a cross-sectional view schematically showing the structure of a tape for an electronic device package according to an embodiment of the present invention.
Fig. 2 (a) is a plan view schematically showing the structure of a tape for an electronic device package according to an embodiment of the present invention, and (b) is a cross-sectional view thereof.
3 is a perspective view schematically showing the structure of a tape for electronic device packaging according to an embodiment of the present invention.
4 is an explanatory view schematically showing a manufacturing method of a tape for an electronic device package according to an embodiment of the present invention, (A) is a longitudinal cross-sectional view showing a bonding step of a metal layer, and (B) is an adhesive It is a longitudinal cross-sectional view showing a layer bonding process, (C) is a short-side cross-sectional view showing a precut process, and (D) is a perspective view showing an unnecessary portion removal process.
5 is an explanatory view schematically showing a manufacturing method of a tape for an electronic device package according to an embodiment of the present invention, (A) is a cross-sectional view in a short side direction showing a bonding step of an adhesive tape, and (B) is It is a short side cross-sectional view showing a precut process, and (C) is a short side direction cross-sectional view showing the removal process of an unnecessary part.
6 is a cross-sectional view schematically illustrating a method of using the tape for electronic device packaging according to the embodiment of the present invention.
7 is a cross-sectional view schematically illustrating a method of using a tape for electronic device packaging according to an embodiment of the present invention.
8 is a cross-sectional view schematically showing the structure of an electronic device package using a tape for an electronic device package according to an embodiment of the present invention.

EMBODIMENT OF THE INVENTION Below, embodiment of this invention is described in detail.

1 is a cross-sectional view showing a tape 1 for electronic device packaging according to an embodiment of the present invention. This tape 1 for electronic device packaging has an adhesive tape 5 comprising a base film 51 and an adhesive layer 52 provided on the base film 51, and on the adhesive layer 52, an adhesive layer. (4) and the metal layer 3 laminated and provided on the adhesive layer 4 are provided. The metal layer 3 may be provided on the adhesive layer 4 indirectly via a primer layer or the like for improving the adhesion of the adhesive layer 4 .

As shown in FIGS. 2 and 3, in the tape 1 for electronic device packaging of the present invention, the adhesive tape 5 is cut into a shape corresponding to the ring frame R (see FIG. 7), and the metal layer ( 3) and the adhesive layer 4 are also preferably cut into a predetermined shape (pre-cut processing) corresponding to this, and in this embodiment, the pre-cut processing is performed.

As shown in FIGS. 2 and 3, the tape 1 for electronic device packaging of the present invention is an adhesive tape 5 cut into a shape corresponding to the metal layer 3, the adhesive layer 4, and the ring frame R. ) (label portion 5a) is preferably a form in which a plurality of laminated bodies are formed and wound in a roll shape, and in this embodiment, it is wound in a roll shape, but is attached to the base tape 2 The form in which the laminated body was cut one by one may be sufficient.

When pre-cut and wound into a roll shape, as shown in Figs. 2 and 3, the electronic device package tape 1 has a base tape 2, and on the base tape 2, a predetermined plane A metal layer 3 having a shape, an adhesive layer 4 having a predetermined planar shape, which is provided by laminating the metal layer 3 on the side opposite to the base tape 2 side of the metal layer 3, and an adhesive layer ( 4) and a predetermined planar label portion 5a provided so as to come into contact with the base material tape 2 around the adhesive layer 4 and a peripheral portion 5b surrounding the outside of the label portion 5a An adhesive tape 5 having is provided.

The label portion 5a has a shape corresponding to the ring frame R for dicing. It is preferable that the shape corresponding to the shape of the ring frame R for dicing is substantially the same shape as the inner side of the ring frame R and is a similar shape larger than the size of the inner side of the ring frame R. Moreover, although it does not necessarily have to be circular, a shape close to a circular shape is preferable, and a circular shape is more preferable. The peripheral portion 5b includes a shape that completely surrounds the outside of the label portion 5a and a shape that does not completely surround it as shown. Further, the peripheral portion 5b does not have to be provided, but if it is provided, the tension of winding on the label portion 5a can be dispersed in the form wound into a roll shape.

The adhesive layer 4 has a predetermined planar shape, and this planar shape is obtained by bonding the ring frame R to the periphery of the label portion 5a of the adhesive tape 5 and pushing it with a lifting member of the pick-up device. It has a smaller shape than the label part 5a so that it can be lifted (refer to Fig. 7(C)). It is preferable that the adhesive layer 4 has a shape similar to that of the label portion 5a and smaller than the size of the label portion 5a. Although the adhesive layer 4 does not necessarily have to be circular, a shape close to circular is preferable, and a circular shape is more preferable.

The metal layer 3 has the same shape as the adhesive layer 4, and the adhesive layer 4 is laminated on the metal layer 3. In the lamination here, the main parts need only be laminated, and the metal layer 3 and the adhesive layer 4 do not necessarily have to have the same size, but from the viewpoint of manufacturing convenience, it is preferable that they have substantially the same shape. Below, each component is demonstrated.

<Base tape (2)>

Although the base tape 2 can also be comprised with a well-known separator, the base tape used for the precut process of the tape for electronic device packages can also be used as it is. When using the base tape used for the pre-cutting process of the electronic device package tape as it is, since the base tape 2 needs to adhesively hold the metal layer 3 at the time of a pre-cutting process, for example, resin A tape having a pressure-sensitive adhesive layer for a base tape provided on one side of a film and a resin film can be suitably used.

Known materials can be used for the material of the resin film constituting the base tape 2, but examples include polyester (PET, PBT, PEN, PBN, PTT)-based, polyolefin (PP, PE)-based, and copolymers. (EVA, EEA, EBA) systems, and films in which these materials are partially substituted to improve adhesion and mechanical strength. Moreover, a laminated body of these films may be sufficient. From the viewpoints of heat resistance, smoothness, and availability, it is preferably selected from polyethylene terephthalate, polypropylene, and polyethylene.

The thickness of the resin film constituting the base tape 2 is not particularly limited and may be set appropriately, but is preferably 10 to 150 µm.

As the resin used in the pressure-sensitive adhesive layer for base tape, known chlorinated polypropylene resins, acrylic resins, polyester resins, polyurethane resins, epoxy resins, etc. used for pressure-sensitive adhesives can be used. is preferable

Examples of the acrylic polymer include (meth)acrylic acid alkyl esters (eg, methyl ester, ethyl ester, propyl ester, isopropyl ester, butyl ester, isobutyl ester, s-butyl ester, t-butyl ester, pentyl Esters, isopentyl esters, hexyl esters, heptyl esters, octyl esters, 2-ethylhexyl esters, isooctyl esters, nonyl esters, decyl esters, isodecyl esters, undecyl esters, dodecyl esters, tridecyl esters, tetradecyl esters , hexadecyl esters, octadecyl esters, eicosyl esters, etc. having 1 to 30 carbon atoms, particularly linear or branched chain alkyl esters having 4 to 18 carbon atoms, etc.) and (meth)acrylic acid cycloalkyl esters (for example, cyclopentyl ester, cyclohexyl ester, etc.), acrylic polymers using one or two or more of them as monomer components; and the like. Incidentally, (meth)acrylic acid ester refers to acrylic acid ester and/or methacrylic acid ester, and (meth) in the present invention has the same meaning.

The acrylic polymer may contain units corresponding to other monomer components copolymerizable with the above-mentioned (meth)acrylic acid alkyl ester or cycloalkyl ester for the purpose of modification such as cohesive force and heat resistance, as necessary. Examples of such a monomer component include carboxyl group-containing monomers such as acrylic acid, methacrylic acid, carboxyethyl (meth)acrylate, carboxypentyl (meth)acrylate, itaconic acid, maleic acid, fumaric acid, and crotonic acid; acid anhydride monomers such as maleic anhydride and itaconic anhydride; (meth)acrylate 2-hydroxyethyl, (meth)acrylate 2-hydroxypropyl, (meth)acrylate 4-hydroxybutyl, (meth)acrylate 6-hydroxyhexyl, (meth)acrylate 8-hydroxyoctyl, hydroxyl group-containing monomers such as 10-hydroxydecyl (meth)acrylate, 12-hydroxylauryl (meth)acrylate, and (4-hydroxymethylcyclohexyl)methyl (meth)acrylate; Sulfonic acid groups such as styrenesulfonic acid, allylsulfonic acid, 2-(meth)acrylamide-2-methylpropanesulfonic acid, (meth)acrylamidopropanesulfonic acid, sulfopropyl(meth)acrylate, and (meth)acryloyloxynaphthalenesulfonic acid containing monomers; phosphoric acid group-containing monomers such as 2-hydroxyethyl acryloyl phosphate; Acrylamide, acrylonitrile, etc. are mentioned. These copolymerizable monomer components can be used singly or in combination of two or more. As for the usage-amount of these copolymerizable monomers, 40 weight% or less of all monomer components is preferable.

In addition, since the acrylic polymer is crosslinked, a polyfunctional monomer or the like can also be included as a monomer component for copolymerization as needed. As such a polyfunctional monomer, for example, hexanediol di(meth)acrylate, (poly)ethylene glycol di(meth)acrylate, (poly)propylene glycol di(meth)acrylate, neopentyl glycol di(meth)acrylate, )Acrylate, pentaerythritol di(meth)acrylate, trimethylolpropane tri(meth)acrylate, pentaerythritol tri(meth)acrylate, dipentaerythritol hexa(meth)acrylate, epoxy(meth)acrylate rate, polyester (meth)acrylate, urethane (meth)acrylate, and the like. These polyfunctional monomers can also be used singly or in combination of two or more. The amount of the polyfunctional monomer used is preferably 30% by weight or less of all monomer components in terms of adhesive properties and the like.

The preparation of the acrylic polymer can be performed by, for example, applying an appropriate method such as solution polymerization method, emulsion polymerization method, bulk polymerization method or suspension polymerization method to a mixture of one type or two or more types of component monomers. The pressure-sensitive adhesive layer for base tape is preferably a composition in which the content of low-molecular-weight substances is suppressed from the viewpoint of preventing contamination of wafers, etc., and from this point, an acrylic polymer having a weight average molecular weight of 300,000 or more, particularly 400,000 to 3,000,000 as the main component Since it is preferable to do so, the pressure-sensitive adhesive may be of an appropriate crosslinking type such as an internal crosslinking method or an external crosslinking method.

In addition, in order to control the crosslinking density of the pressure-sensitive adhesive layer for base tape and improve the peelability with the pressure-sensitive adhesive tape 5, for example, polyfunctional isocyanate-based compounds, polyfunctional epoxy-based compounds, melamine-based compounds, metal salt-based compounds, metals A method of crosslinking using an appropriate external crosslinking agent such as a chelate compound, an amino resin compound, or a peroxide, or a method of crosslinking by irradiating energy rays by mixing a low molecular weight compound having two or more carbon-carbon double bonds, etc. An appropriate method can be employed. When an external crosslinking agent is used, its usage amount is appropriately determined depending on the balance with the base polymer to be crosslinked and furthermore depending on the intended use as an adhesive. Generally, about 20 parts by weight or less, preferably 0.1 to 20 parts by weight, is blended with respect to 100 parts by weight of the base polymer.

The thickness of the pressure-sensitive adhesive layer for base tape is not particularly limited and can be determined appropriately, but is generally about 3 to 200 µm. In addition, the adhesive layer for base material tapes may be comprised from a single layer, and may be comprised from multiple layers.

<Adhesive tape (5)>

As the adhesive tape 5, there is no restriction|limiting in particular, A conventional dicing tape can be used. As the adhesive tape 5, what provided the adhesive layer 52 to the base film 51 can be used suitably, for example.

The base film 51 can be used without particular limitation as long as it is a conventionally known one, but when a radiation curable material is used as the pressure-sensitive adhesive layer 52 described later, it is preferable to use a material having radiation transparency.

For example, as the material, polyethylene, polypropylene, ethylene-propylene copolymer, polybutene-1, poly-4-methylpentene-1, ethylene-vinyl acetate copolymer, ethylene-ethyl acrylate copolymer, ethylene-acrylic acid Homopolymers or copolymers of α-olefins such as methyl copolymers, ethylene-acrylic acid copolymers, and ionomers, or mixtures thereof, polyurethanes, styrene-ethylene-butene or pentene copolymers, polyamide-polyol copolymers, etc. thermoplastic elastomers, and mixtures thereof. In addition, the base film may be a mixture of two or more materials selected from these groups, or may be a single layer or a multi-layered one.

The thickness of the base film 51 is not particularly limited and may be set appropriately, but is preferably 50 to 200 µm in consideration of the expand process at the time of pick-up.

In order to improve adhesion between the base film 51 and the pressure-sensitive adhesive layer 52, the surface of the base film 51 is subjected to chemical or physical surface treatment such as chromic acid treatment, ozone exposure, flame exposure, high-voltage electric shock exposure, and ionizing radiation treatment. may be carried out.

In this embodiment, although the pressure-sensitive adhesive layer 52 is directly provided on the base film 51, a primer layer for enhancing adhesion, an anchor layer for improving cutability at the time of dicing, a stress relieving layer, and electrostatic You may install indirectly through a prevention layer etc.

The resin used for the pressure-sensitive adhesive layer 52 of the pressure-sensitive adhesive tape 5 is not particularly limited, and known chlorinated polypropylene resins, acrylic resins, polyester resins, polyurethane resins, epoxy resins, etc. used for pressure-sensitive adhesives can be used. However, an acrylic pressure-sensitive adhesive having an acrylic polymer as a base polymer is preferred.

Examples of the acrylic polymer include (meth)acrylic acid alkyl esters (eg, methyl ester, ethyl ester, propyl ester, isopropyl ester, butyl ester, isobutyl ester, s-butyl ester, t-butyl ester, pentyl Esters, isopentyl esters, hexyl esters, heptyl esters, octyl esters, 2-ethylhexyl esters, isooctyl esters, nonyl esters, decyl esters, isodecyl esters, undecyl esters, dodecyl esters, tridecyl esters, tetradecyl esters , hexadecyl esters, octadecyl esters, eicosyl esters, etc. having 1 to 30 carbon atoms, particularly linear or branched chain alkyl esters having 4 to 18 carbon atoms, etc.) and (meth)acrylic acid cycloalkyl esters (for example, cyclopentyl ester, cyclohexyl ester, etc.), acrylic polymers using one or two or more of them as monomer components; and the like. Incidentally, (meth)acrylic acid ester refers to acrylic acid ester and/or methacrylic acid ester, and (meth) in the present invention has the same meaning.

The acrylic polymer is aimed at modifying cohesive force, heat resistance, crosslinkability, etc., and may contain units corresponding to other monomer components copolymerizable with the above-mentioned (meth)acrylic acid alkyl ester or cycloalkyl ester, if necessary. Examples of such a monomer component include carboxyl group-containing monomers such as acrylic acid, methacrylic acid, carboxyethyl (meth)acrylate, carboxypentyl (meth)acrylate, itaconic acid, maleic acid, fumaric acid, and crotonic acid; acid anhydride monomers such as maleic anhydride and itaconic anhydride; (meth)acrylate 2-hydroxyethyl, (meth)acrylate 2-hydroxypropyl, (meth)acrylate 4-hydroxybutyl, (meth)acrylate 6-hydroxyhexyl, (meth)acrylate 8-hydroxyoctyl, hydroxyl group-containing monomers such as 10-hydroxydecyl (meth)acrylate, 12-hydroxylauryl (meth)acrylate, and (4-hydroxymethylcyclohexyl)methyl (meth)acrylate; Sulfonic acid groups such as styrenesulfonic acid, allylsulfonic acid, 2-(meth)acrylamide-2-methylpropanesulfonic acid, (meth)acrylamidopropanesulfonic acid, sulfopropyl(meth)acrylate, and (meth)acryloyloxynaphthalenesulfonic acid containing monomers; phosphoric acid group-containing monomers such as 2-hydroxyethyl acryloyl phosphate; Acrylamide, acrylonitrile, etc. are mentioned. These copolymerizable monomer components can be used singly or in combination of two or more. As for the usage-amount of these copolymerizable monomers, 40 weight% or less of all monomer components is preferable.

In addition, since the acrylic polymer is crosslinked, a polyfunctional monomer or the like can also be included as a monomer component for copolymerization as needed. As such a polyfunctional monomer, for example, hexanediol di(meth)acrylate, (poly)ethylene glycol di(meth)acrylate, (poly)propylene glycol di(meth)acrylate, neopentyl glycol di(meth)acrylate, )Acrylate, pentaerythritol di(meth)acrylate, trimethylolpropane tri(meth)acrylate, pentaerythritol tri(meth)acrylate, dipentaerythritol hexa(meth)acrylate, epoxy(meth)acrylate rate, polyester (meth)acrylate, urethane (meth)acrylate, and the like. These polyfunctional monomers can also be used singly or in combination of two or more. The amount of the polyfunctional monomer used is preferably 30% by weight or less of all monomer components in terms of adhesive properties and the like.

The preparation of the acrylic polymer can be performed by, for example, applying an appropriate method such as solution polymerization method, emulsion polymerization method, bulk polymerization method or suspension polymerization method to a mixture of one type or two or more types of component monomers. The pressure-sensitive adhesive layer 52 preferably has a composition in which the content of low-molecular-weight substances is suppressed, and from this point, it is preferable that the main component is an acrylic polymer having a weight average molecular weight of 300,000 or more, particularly 400,000 to 3,000,000. It is also possible to set it as an appropriate crosslinking type by a crosslinking method or an external crosslinking method.

In addition, in order to control the crosslinking density of the pressure-sensitive adhesive layer 52 to improve pickup properties, for example, polyfunctional isocyanate-based compounds, polyfunctional epoxy-based compounds, melamine-based compounds, metal salt-based compounds, metal chelate-based compounds, amino resin-based compounds An appropriate method such as crosslinking using a compound or an appropriate external crosslinking agent such as peroxide or mixing a low molecular weight compound having two or more carbon-carbon double bonds and crosslinking by irradiation with energy rays, etc. can be employed. have. When an external crosslinking agent is used, its usage amount is appropriately determined depending on the balance with the base polymer to be crosslinked and furthermore depending on the intended use as an adhesive. Generally, about 20 parts by weight or less, preferably 0.1 to 20 parts by weight, is blended with respect to 100 parts by weight of the base polymer. Moreover, you may use additives, such as various tackifiers and antioxidants other than the said component, as needed from a viewpoint of deterioration prevention etc. for an adhesive.

As the pressure-sensitive adhesive constituting the pressure-sensitive adhesive layer 52, a radiation curable pressure-sensitive adhesive is preferable. Examples of the radiation-curable pressure-sensitive adhesive include additive-type radiation-curable pressure-sensitive adhesives in which a radiation-curable monomer component or a radiation-curable oligomer component is blended with the above-described pressure-sensitive adhesive.

As a radiation curable monomer component to be blended, for example, urethane (meth)acrylate, trimethylolpropane tri(meth)acrylate, tetramethylolmethane tetra(meth)acrylate, pentaerythritol tri(meth)acrylate , pentaerythritol tetra(meth)acrylate, dipentaerythritol monohydroxypenta(meth)acrylate, dipentaerythritol hexa(meth)acrylate, 1,4-butanediol di(meth)acrylate, etc. can These monomer components can be used singly or in combination of two or more.

In addition, the radiation curable oligomer component includes various oligomers such as urethane, polyether, polyester, polycarbonate, and polybutadiene, and those having a molecular weight in the range of about 100 to 30,000 are suitable. The blending amount of the radiation-curable monomer component or oligomer component can be appropriately determined according to the type of the pressure-sensitive adhesive layer 52 to reduce the adhesive force of the pressure-sensitive adhesive layer 52 . Generally, it is, for example, 5 parts by weight to 500 parts by weight, preferably about 70 parts by weight to 150 parts by weight, based on 100 parts by weight of a base polymer such as an acrylic polymer constituting the pressure-sensitive adhesive.

Further, as the radiation curable pressure sensitive adhesive, in addition to the above addition type radiation curable pressure sensitive adhesive, an intrinsic type radiation curable pressure sensitive adhesive using a base polymer having a carbon-carbon double bond in the side or main chain of the polymer or at the main chain terminal may also be mentioned. Intrinsic radiation-curable pressure-sensitive adhesive does not need to contain or does not contain a low molecular weight oligomer component or the like, so the oligomer component or the like does not migrate in the pressure-sensitive adhesive over time, and the pressure-sensitive adhesive layer 52 has a stable layer structure. It is preferable because it can form.

As the base polymer having a carbon-carbon double bond, those having a carbon-carbon double bond and having adhesiveness can be used without particular limitation. As such a base polymer, it is preferable to use an acrylic polymer as a basic skeleton. As a basic frame|skeleton of an acrylic polymer, the acrylic polymer illustrated above is mentioned.

The method for introducing the carbon-carbon double bond into the acrylic polymer is not particularly limited, and various methods can be employed. However, it is easy in terms of molecular design to introduce the carbon-carbon double bond into the side chain of the polymer. For example, after copolymerizing a monomer having a functional group with an acrylic polymer in advance, a compound having a functional group capable of reacting with the functional group and a carbon-carbon double bond is condensed while maintaining the radiation curability of the carbon-carbon double bond. Or the method of making an addition reaction is mentioned.

Examples of combinations of these functional groups include a carboxylic acid group and an epoxy group, a carboxylic acid group and an aziridyl group, a hydroxyl group and an isocyanate group. Among the combinations of these functional groups, a combination of a hydroxyl group and an isocyanate group is preferable because of the ease of tracking the reaction. In addition, the functional group may be present on either side of the acrylic polymer and the compound as long as the combination of these functional groups produces the acrylic polymer having the carbon-carbon double bond. It has a oxyl group, and the case where the said compound has an isocyanate group is preferable. In this case, examples of the isocyanate compound having a carbon-carbon double bond include methacryloyl isocyanate, 2-methacryloyloxyethyl isocyanate, m-isopropenyl-α,α-dimethylbenzyl isocyanate, and the like. can In addition, as an acrylic polymer, what copolymerized the hydroxyl group containing monomer mentioned above, 2-hydroxyethyl vinyl ether, 4-hydroxybutyl vinyl ether, diethylene glycol monovinyl ether, etc. ether type compounds etc. are used.

In the intrinsic type radiation-curable pressure-sensitive adhesive, the base polymer (particularly, an acrylic polymer) having a carbon-carbon double bond can be used alone, but a photopolymerizable compound such as the radiation-curable monomer component or oligomer component to the extent that the properties are not deteriorated. can also be combined. The compounding amount of the photopolymerizable compound is usually in the range of 30 parts by weight or less, preferably in the range of 0 to 10 parts by weight, based on 100 parts by weight of the base polymer.

It is preferable to incorporate a photopolymerization initiator into the radiation-curable pressure-sensitive adhesive when it is cured by ultraviolet rays or the like.

Among the above-mentioned acrylic polymers, in particular, an acrylic acid ester represented by CH ₂ =CHCOOR (wherein R is an alkyl group having 4 to 18 carbon atoms), a hydroxyl group-containing monomer, and a radical reactive carbon-carbon double bond in the molecule An acrylic polymer A comprising an isocyanate compound having

When the number of carbon atoms in the alkyl group of the alkyl acrylate ester is less than 4, the polarity is high, and the peeling force becomes too large, and pick-up properties may decrease. On the other hand, when the carbon number of the alkyl group of the alkyl acrylate ester exceeds 18, the glass transition temperature of the pressure-sensitive adhesive layer 52 is too high, and the adhesive properties at room temperature are lowered. As a result, during dicing, the adhesive layer 4 and Peeling of the metal layer 3 may occur.

The said acrylic polymer A may contain the unit corresponding to another monomer component as needed.

In the acrylic polymer A, an isocyanate compound having a radical reactive carbon-carbon double bond is used. That is, it is preferable that the acrylic polymer has a structure in which an isocyanate compound having a double bond is added to a polymer by a monomer composition such as the above-mentioned acrylic acid ester or hydroxyl group-containing monomer. Therefore, it is preferable that the acrylic polymer has a radical reactive carbon-carbon double bond in its molecular structure. As a result, an active energy ray-curable pressure-sensitive adhesive layer (ultraviolet ray-curable pressure-sensitive adhesive layer, etc.) that is cured by irradiation with active energy rays (ultraviolet rays, etc.) can be obtained, and the peeling force between the metal layer 3 and the pressure-sensitive adhesive layer 52 can be reduced. can

Examples of the double bond-containing isocyanate compound include methacryloyl isocyanate, acryloyl isocyanate, 2-methacryloyloxyethyl isocyanate, 2-acryloyloxyethyl isocyanate, m-isopropenyl-α,α -Dimethylbenzyl isocyanate etc. are mentioned. A double bond containing isocyanate compound can be used individually or in combination of 2 or more types.

Moreover, in order to adjust the adhesive force before active energy ray irradiation and the adhesive force after active energy ray irradiation, an external crosslinking agent can also be used suitably for an active energy ray-curable adhesive. As a specific means of the external crosslinking method, a method in which a so-called crosslinking agent such as a polyisocyanate compound, an epoxy compound, an aziridine compound, or a melamine-based crosslinking agent is added and reacted is exemplified.

Examples of the polyisocyanate compound include lower aliphatic polyisocyanates such as 1,2-ethylene diisocyanate, 1,4-butylene diisocyanate, and 1,6-hexamethylene diisocyanate; alicyclic polyisocyanates such as cyclopentylene diisocyanate, cyclohexylene diisocyanate, isophorone diisocyanate, hydrogenated tolylene diisocyanate, and hydrogenated xylene diisocyanate; aromatic polyisocyanates such as 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate, 4,4'-diphenylmethane diisocyanate, and xylylene diisocyanate; A rendiisocyanate trimer adduct [manufactured by Tosoh Corporation, trade name "Coronate L"], a trimethylolpropane/hexamethylene diisocyanate trimer adduct [manufactured by Tosoh Corporation, trade name "Coronate HL"], etc. are also used. . Moreover, as said epoxy compound, N,N,N',N'-tetraglycidyl-m-xylenediamine, diglycidylaniline, 1,3-bis (N,N-glycidyl), for example Aminomethyl)cyclohexane, 1,6-hexanediol diglycidyl ether, neopentyl glycol diglycidyl ether, ethylene glycol diglycidyl ether, propylene glycol diglycidyl ether, polyethylene glycol diglycidyl ether , polypropylene glycol diglycidyl ether, sorbitol polyglycidyl ether, glycerol polyglycidyl ether, pentaerythritol polyglycidyl ether, polyglycerol polyglycidyl ether, sorbitan polyglycidyl ether, trimethyl All-propane polyglycidyl ether, adipic acid diglycidyl ester, o-phthalic acid diglycidyl ester, triglycidyl-tris (2-hydroxyethyl) isocyanurate, resorcin diglycidyl ether, In addition to bisphenol-S-diglycidyl ether, epoxy-based resins having two or more epoxy groups in the molecule may be used.

When an external crosslinking agent is used, its usage amount is appropriately determined depending on the balance with the base polymer to be crosslinked and furthermore depending on the intended use as an adhesive. The amount of external crosslinking agent used is generally 20 parts by weight or less (preferably 0.1 to 10 parts by weight) based on 100 parts by weight of the base polymer. In addition, additives such as conventionally known various tackifiers, anti-aging agents, and foaming agents may be blended with the active energy ray-curable pressure-sensitive adhesive, in addition to the above components, as needed.

In the present invention, instead of using a crosslinking agent or while using a crosslinking agent, it is also possible to perform a crosslinking treatment by irradiation with electron beams, ultraviolet rays, or the like.

The thickness of the pressure-sensitive adhesive layer 52 is not particularly limited and can be determined appropriately, but is generally about 5 to 200 μm. In addition, the pressure-sensitive adhesive layer 52 may be composed of a single layer or may be composed of a plurality of layers.

<Metal layer (3)>

The metal constituting the metal layer 3 is not particularly limited, and for example, one containing at least one selected from the group consisting of stainless steel, aluminum, iron, titanium, tin, nickel, and copper has heat dissipation properties, and an electronic device package (8). ) is preferable from the viewpoint of preventing warping. Among these, it is particularly preferable to include copper from the viewpoint of having high thermal conductivity and obtaining the effect of heat dissipation. Further, from the viewpoint of preventing warpage of the electronic device package 8, it is particularly preferable to include aluminum.

It is preferable that the thickness of the metal layer 3 is 5 micrometers or more and less than 200 micrometers. By setting it to 5 μm or more, even if the amount of expand is increased, bending of the metal layer or peeling off from the adhesive tape can be suppressed, so that the interval between adjacent metal layers can be increased, and the boundary can be easily identified. In addition, if it is less than 200 μm, processing is easy, and when it is necessary to bend along the core or bonding roll in winding or bonding, the waist of the metal layer is too strong and creases are generated, resulting in a recognition error in the pickup device phenomenon can be suppressed.

The surface roughness RzJIS by the 10-point average roughness of the surface of the metal layer 3 opposite to the adhesive layer 4 is less than 5.0 micrometer. By setting the surface roughness RzJIS of the 10-point average roughness of the metal layer 3 to less than 5.0 μm, it is possible to suppress the problem that the imaged metal layer 3 is judged to be different from the template due to surface irregularities being detected. Therefore, matching between the registered template and the image of the reorganization of the metal layer 3 captured for pickup is taken, and the reorganization is recognized as a pickup target. In addition, the surface roughness RzJIS in this specification is a 10-point average roughness prescribed|regulated by Annex JA of JIS B 0601:2013.

As such a metal layer 3, metal foil can be used, and as long as the surface roughness RzJIS of the surface used as the surface on the opposite side to the adhesive layer 4 is less than 5.0 micrometers, the metal foil may be electrolytic foil or a rolled foil. In the case of an electrolytic foil, the surface roughness RzJIS can be adjusted by the electrolytic conditions (liquid composition, liquid temperature, current, additives, etc.).

It is preferable that the specular gloss of the metal layer 3 at an incident angle of 60 degrees is less than 100%. If the mirror gloss is too high, depending on the angle and amount of illumination of the pick-up device, reflections from the separation of the metal layer 3 to be picked up or from adjacent separations become glare, which causes the reflection of the metal layer 3 to be picked up. The appearance of the reorganization becomes difficult to recognize. If the glossiness of the metal layer 3 is less than 100%, reflection (glare) is suppressed, and the external appearance of the individual structure of the metal layer 3 is recognized favorably. Glossiness is a value measured based on JIS Z 8741. The gloss can be measured with a commercially available gloss meter, and for example, a gloss meter, Handy Gloss Meter PG-1 manufactured by Nippon Denshoku Co., Ltd. can be used.

In the case of adjusting the specular gloss, known surface treatments may be performed alone or in combination. For example, what is necessary is just to perform size reduction of a roughened particle, increase in the number of roughened particles, and smoothing of the surface of a roughened particle by PR pulse electrolysis etc. after performing a roughening process, such as Cu plating. Further, if necessary, an alkali immersion treatment may be performed for the purpose of removing residues of surface contaminants such as additives for foil making or smoothing the surface of the roughened particles.

<Adhesive layer (4)>

The adhesive layer 4 is obtained by forming an adhesive into a film in advance.

The adhesive layer 4 is formed of at least a thermosetting resin, and it is preferable that it is formed of at least a thermosetting resin and a thermoplastic resin.

Examples of the thermoplastic resin include natural rubber, butyl rubber, isoprene rubber, chloroprene rubber, ethylene-vinyl acetate copolymer, ethylene-acrylic acid copolymer, ethylene-acrylic acid ester copolymer, polybutadiene resin, polycarbonate resin, Thermoplastic polyimide resins, polyamide resins such as 6-nylon and 6,6-nylon, phenoxy resins, acrylic resins, saturated polyester resins such as PET (polyethylene terephthalate) and PBT (polybutylene terephthalate), poly Amidimide resin or a fluororesin, etc. are mentioned. A thermoplastic resin can be used individually or in combination of 2 or more types. Among these thermoplastic resins, acrylic resins have low ionic impurities and excellent stress relaxation properties, and phenoxy resins have both flexibility and strength and high toughness. Because there is, it is particularly preferable.

The acrylic resin is not particularly limited, and polymers containing one or two or more esters of acrylic acid or methacrylic acid having a straight-chain or branched alkyl group having 30 or less carbon atoms (preferably 1 to 18 carbon atoms) are used as components. can be heard That is, in the present invention, an acrylic resin is a broad meaning including a methacrylic resin. Examples of the alkyl group include methyl, ethyl, propyl, isopropyl, n-butyl, t-butyl, isobutyl, pentyl, isopentyl, hexyl, heptyl, and 2-ethylhex. Sil group, octyl group, isooctyl group, nonyl group, isononyl group, decyl group, isodecyl group, undecyl group, dodecyl group (lauryl group), tridecyl group, tetradecyl group, stearyl group, octadecyl group, etc. can be heard

In addition, the other monomers for forming the acrylic resin (monomers other than alkyl esters of acrylic acid or methacrylic acid having 30 or less carbon atoms in the alkyl group) are not particularly limited, and examples thereof include acrylic acid, methacrylic acid, and carboxyethyl acryl. Carboxyl group-containing monomers such as late, carboxypentyl acrylate, itaconic acid, maleic acid, fumaric acid or crotonic acid, acid anhydride monomers such as maleic anhydride or itaconic anhydride, (meth)acrylic acid 2-hydroxyethyl, (meth)acrylic acid 2-Hydroxypropyl, (meth)acrylate 4-hydroxybutyl, (meth)acrylate 6-hydroxyhexyl, (meth)acrylate 8-hydroxyoctyl, (meth)acrylate 10-hydroxydecyl, (meth)acrylic acid hydroxyl group-containing monomers such as 12-hydroxylauryl or (4-hydroxymethylcyclohexyl)-methylacrylate, styrenesulfonic acid, allylsulfonic acid, 2-(meth)acrylamide-2-methylpropanesulfonic acid, (meth) ) A sulfonic acid group-containing monomer such as acrylamidopropanesulfonic acid, sulfopropyl (meth)acrylate or (meth)acryloyloxynaphthalenesulfonic acid, a phosphoric acid group-containing monomer such as 2-hydroxyethylacryloylphosphate, or acrylonitrile, etc. can be heard Incidentally, (meth)acrylic acid refers to acrylic acid and/or methacrylic acid, and (meth) in the present invention has the same meaning.

Moreover, as a thermosetting resin, an amino resin, an unsaturated polyester resin, a polyurethane resin, a silicone resin, a thermosetting polyimide resin etc. other than an epoxy resin and a phenol resin are mentioned. A thermosetting resin can be used individually or in combination of 2 or more types. As the thermosetting resin, an epoxy resin containing less ionic impurities or the like that corrodes semiconductor elements is particularly preferable. Moreover, as a curing agent for an epoxy resin, a phenol resin can be suitably used.

The epoxy resin is not particularly limited, and examples thereof include bisphenol A type epoxy resins, bisphenol F type epoxy resins, bisphenol S type epoxy resins, brominated bisphenol A type epoxy resins, hydrogenated bisphenol A type epoxy resins, and bisphenol AF type epoxy resins. Resins, biphenyl type epoxy resins, naphthalene type epoxy resins, fluorene type epoxy resins, phenol novolac type epoxy resins, orthocresol novolac type epoxy resins, trishydroxyphenylmethane type epoxy resins, tetraphenylolethane type epoxy resins Epoxy resins such as bifunctional epoxy resins and polyfunctional epoxy resins such as the like, or hydantoin type epoxy resins, trisglycidyl isocyanurate type epoxy resins, and glycidylamine type epoxy resins can be used.

As the epoxy resin, among the examples, a novolac type epoxy resin, a biphenyl type epoxy resin, a trishydroxyphenylmethane type epoxy resin, and a tetraphenylolethane type epoxy resin are particularly preferable. This is because these epoxy resins are highly reactive with a phenol resin as a curing agent and have excellent heat resistance and the like.

Further, the phenol resin acts as a curing agent for an epoxy resin, and includes, for example, furnaces such as phenol novolak resins, phenol aralkyl resins, cresol novolac resins, tert-butyl phenol novolac resins, and nonyl phenol novolak resins. and polyoxystyrenes such as rockfish-type phenolic resins, resol-type phenolic resins, and polyparaoxystyrene. A phenol resin can be used individually or in combination of 2 or more types. Among these phenol resins, phenol novolak resins and phenol aralkyl resins are particularly preferred. It is because connection reliability of a semiconductor device can be improved.

It is preferable to mix|blend so that the compounding ratio of an epoxy resin and a phenol resin may become 0.5 equivalent - 2.0 equivalent of the hydroxyl group in a phenol resin per 1 equivalent of epoxy groups in an epoxy resin component, for example. More preferably, it is 0.8 equivalent - 1.2 equivalent. That is, if the mixing ratio of both is out of the above range, sufficient curing reaction does not proceed, and the properties of the cured epoxy resin material deteriorate easily.

In addition, a catalyst for accelerating thermal curing of an epoxy resin and a phenol resin may be used. The catalyst for accelerating thermal curing is not particularly limited, and can be appropriately selected and used from known thermal curing accelerating catalysts. A thermosetting acceleration catalyst can be used individually or in combination of 2 or more types. As the thermal curing accelerator, amine-based curing accelerators, phosphorus-based curing accelerators, imidazole-based curing accelerators, boron-based curing accelerators, phosphorus-boron-based curing accelerators, and the like can be used, for example.

As the curing agent for the epoxy resin, it is preferable to use a phenol resin as described above, but known curing agents such as imidazoles, amines, and acid anhydrides can also be used.

It is important that the adhesive layer 4 has adhesiveness (adhesiveness) with respect to the adherend 9 such as an electronic device. Therefore, in order to crosslink the adhesive layer 4 to some extent in advance, a polyfunctional compound that reacts with a functional group at the end of the molecular chain of the polymer may be added as a crosslinking agent. Thereby, adhesive properties under high temperature can be improved and heat resistance can be improved.

The crosslinking agent is not particularly limited, and a known crosslinking agent can be used. Specifically, for example, isocyanate crosslinking agent, epoxy crosslinking agent, melamine crosslinking agent, peroxide crosslinking agent, urea crosslinking agent, metal alkoxide crosslinking agent, metal chelate crosslinking agent, metal salt crosslinking agent, carbodiimide crosslinking agent, oxa A zoline-type crosslinking agent, an aziridine-type crosslinking agent, an amine-type crosslinking agent, etc. are mentioned. As a crosslinking agent, an isocyanate type crosslinking agent and an epoxy type crosslinking agent are preferable. In addition, the above crosslinking agents may be used alone or in combination of two or more.

In the present invention, instead of using a crosslinking agent or while using a crosslinking agent, it is also possible to perform a crosslinking treatment by irradiation with electron beams, ultraviolet rays, or the like.

In the adhesive layer 4, other additives can be suitably blended as needed. Examples of other additives include fillers (fillers), flame retardants, silane coupling agents, and ion trapping agents, as well as extenders, antioxidants, antioxidants, and surfactants.

As a filler, either an inorganic filler or an organic filler may be sufficient, but an inorganic filler is preferable. By blending fillers such as inorganic fillers, the adhesive layer 4 can be improved in thermal conductivity and modulus of elasticity can be adjusted. Examples of the inorganic filler include ceramics such as silica, clay, gypsum, calcium carbonate, barium sulfate, alumina, beryllium oxide, silicon carbide, aluminum nitride, and silicon nitride; aluminum, copper, silver, gold, nickel, chromium, and lead; , metals such as tin, zinc, palladium, and solder, or alloys, various inorganic powders containing other carbon, and the like. A filler can be used individually or in combination of 2 or more types. As a filler, among these, silica or an alumina is preferable, and as a silica, fused silica is especially preferable. In addition, the average particle diameter of the inorganic filler is preferably in the range of 0.001 μm to 80 μm. The average particle diameter of the inorganic filler can be measured, for example, with a laser diffraction type particle size distribution analyzer, and in the present application, the particle diameter when the cumulative volume in the particle size distribution is 50% is referred to as the average particle diameter.

The compounding amount of the filler (especially inorganic filler) is preferably 98% by weight or less (0% by weight to 98% by weight) with respect to the organic resin component, and particularly in the case of silica, 0% by weight to 70% by weight, heat conduction or conductivity, etc. In the case of a functional inorganic filler of , it is preferably 10% by weight to 98% by weight.

Moreover, as a flame retardant, antimony trioxide, antimony pentoxide, a brominated epoxy resin etc. are mentioned, for example. A flame retardant can be used individually or in combination of 2 or more types. Examples of the silane coupling agent include β-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, γ-glycidoxypropyltrimethoxysilane, and γ-glycidoxypropylmethyldiethoxysilane. can A silane coupling agent can be used individually or in combination of 2 or more types. As an ion trapping agent, hydrotalcites, bismuth hydroxide, etc. are mentioned, for example. Ion trap agents can be used individually or in combination of 2 or more types.

The adhesive layer 4 preferably contains (A) an epoxy resin, (B) a curing agent, (C) an acrylic resin or a phenoxy resin, and (D) a surface-treated inorganic filler, especially from the viewpoint of adhesion and reliability. .

(A) By using an epoxy resin, high adhesiveness, water resistance, and heat resistance can be obtained. As an epoxy resin, the above-mentioned well-known epoxy resin can be used. (B) As the curing agent, the aforementioned known curing agents may be used.

(C) An acrylic resin has both flexibility and strength and high toughness. A preferable acrylic resin has a Tg (glass transition temperature) of -50°C to 50°C, and contains a crosslinkable functional group obtained by polymerizing a monomer having an epoxy group, a glycidyl group, an alcoholic hydroxyl group, a phenolic hydroxyl group, or a carboxyl group as a crosslinkable functional group ( It is a meth)acrylic copolymer. In addition, higher toughness is obtained when rubber properties are exhibited by containing acrylonitrile or the like.

In addition, (C) phenoxy resin has a long molecular chain and is similar in structure to an epoxy resin, acts as a flexible material in a composition having a high crosslinking density, and imparts high toughness, so that a composition having high strength and toughness is obtained. Preferred phenoxy resins have a main skeleton of bisphenol A type. In addition, commercially available phenoxy resins such as bisphenol F type phenoxy resins, bisphenol A/F mixed type phenoxy resins, and brominated phenoxy resins are mentioned as preferable ones.

(D) As an inorganic filler surface-treated, the inorganic filler surface-treated with the coupling agent is mentioned. As an inorganic filler, it is a silica and an alumina which can use the above-mentioned well-known inorganic filler, for example. By surface treatment with a coupling agent, dispersibility of the inorganic filler becomes good. For this reason, since the adhesive layer excellent in fluidity is obtained, the adhesive force with the metal layer 3 can be improved. In addition, since the inorganic filler can be highly filled, the water absorption rate can be lowered and the moisture resistance can be improved.

For example, the surface treatment of the inorganic filler with a silane coupling agent is performed by dispersing the inorganic filler in a silane coupling agent solution by a known method, thereby dispersing the hydroxyl groups present on the surface of the inorganic filler and the alkoxy groups of the silane coupling agent. This is done by allowing the decomposition group to react with hydrolyzed silanol groups to form Si-O-Si bonds on the surface of the inorganic filler.

The thickness of the adhesive layer 4 is not particularly limited, but is preferably 3 μm or more, and more preferably 5 μm or more, from the viewpoint of sufficiently bonding the metal layer and the adherend, and to contribute to thinning the semiconductor package, 150 A micrometer or less is preferable, and 100 micrometers or less are more preferable. The adhesive layer 4 may be composed of a single layer or may be composed of a plurality of layers.

In addition, it is preferable that the loss tangent tanδ of the adhesive layer 4 is 0.4 or more at 25°C and 50% RH. Moreover, it is preferable that the loss tangent tan-delta of the adhesive bond layer 4 in 25 degreeC and 50%RH is 3 or less.

The loss tangent tan δ is a value when the temperature is raised from 0°C at a heating rate of 5°C/min using a dynamic viscoelasticity measuring device, measured at a measurement frequency of 1 Hz, and reaches 25°C.

If the loss tangent tan δ of the adhesive layer 4 at 25° C. and 50% RH is 0.4 or more, the adhesive layer 4 can relieve the stress due to the push-up of the pin of the pick-up device. Therefore, even if the pushing up amount of the pin increases, it is possible to suppress the generation of traces of the pin in the metal layer 3 . If the loss tangent tan δ is 3 or less, the pickup can be performed satisfactorily without impairing the responsiveness due to lifting of the pin.

In order to increase the loss tangent tan δ, low molecular weight components such as epoxy resins and phenol resins may be increased, and high molecular weight components such as acrylic resins may be decreased. In addition, when mix|blending a filler, you may reduce the filler compounding quantity.

In addition, the adhesive layer 4 has an adhesive force (23 ° C., a peel angle of 180 degrees, a linear speed of 300 mm/min) with the metal layer 3 in the B stage (uncured state or semi-cured state) of 0.3 N/25 mm or more. Preferably, it is more preferably 0.5 N/25 mm or more, and even more preferably 1.0 N/25 mm or more. If the adhesive force is less than 0.3 N/25 mm, there is a possibility that peeling may occur between the adhesive layer 4 and the metal layer 3 when the sample separated into pieces is expanded.

The water absorption of the adhesive layer 4 is preferably 1.5 vol% or less. The method for measuring water absorption is as follows. That is, the adhesive layer 4 (film adhesive) having a size of 50 × 50 mm is taken as a sample, the sample is dried in a vacuum dryer at 120 ° C. for 3 hours, cooled in a desiccator, and then the dry mass is measured and M1 do it with The sample is taken out after being immersed in distilled water at room temperature for 24 hours, the sample surface is wiped with a filter paper, and it is quickly weighed and set as M2. A water absorption rate is computed by following Formula (1).

where d is the density of the film.

When the water absorption rate exceeds 1.5 vol%, there is a risk that package cracks may occur during solder reflow due to absorbed moisture.

The saturated moisture absorption rate of the adhesive layer 4 is preferably 1.0 vol% or less. The method for measuring the saturated moisture absorptivity is as follows. That is, a circular adhesive layer 4 (film adhesive) with a diameter of 100 mm is taken as a sample, the sample is dried in a vacuum dryer at 120 ° C. for 3 hours, cooled in a desiccator, and then the dry mass is measured and set as M1. . A sample is taken out after absorbing moisture for 168 hours in a constant temperature and humidity chamber at 85° C. and 85% RH, and is quickly weighed and set as M2. A saturated moisture absorptivity is computed by following Formula (2).

where d is the density of the film.

If the saturated moisture absorptivity exceeds 1.0 vol%, the value of the vapor pressure increases due to moisture absorption during reflow, and there is a risk that good reflow characteristics may not be obtained.

It is preferable that the remaining volatile content of the adhesive layer 4 is 3.0 wt% or less. The method for measuring the remaining volatile components is as follows. That is, the adhesive layer 4 (film adhesive) having a size of 50 × 50 mm is taken as a sample, the initial mass of the sample is measured and set as M1, the sample is heated in a hot air circulation thermostat at 200 ° C. for 2 hours, and then weighed to obtain M2 do it with Residual volatile matter is calculated by the following formula (3).

When the remaining volatile content exceeds 3.0 wt%, the solvent volatilizes due to heating during packaging, and voids are generated inside the adhesive layer 4, which may cause package cracks.

Moreover, the adhesive force of the adhesive tape 5 and the adhesive layer 4 in the state in which the adhesive layer 4 and the metal layer 3 are picked up from the adhesive tape 5 is 0.03-0.5 N/25 mm. Since the adhesive strength of the adhesive tape 5 and the adhesive layer 4 in the state in which the adhesive layer 4 and the metal layer 3 are picked up from the adhesive tape 5, the adhesive layer 52 of the adhesive tape 5 In the case of picking up the adhesive layer 4 and the metal layer 3 after reducing the adhesive force by irradiating the adhesive tape 5 with radiation, including this radiation-curing pressure-sensitive adhesive, it is referred to as the adhesive force after irradiation with radiation.

The adhesive strength was determined by bonding the adhesive tape 5 cut to a size of 25 mm in width and the adhesive layer 4 in an environment of 23° C. and 50% RH in accordance with JIS Z0237, and using a universal tensile tester at a peel angle of 180 degrees. °, measured at a peeling speed of 300 mm/min.

In order to make the adhesive force within the above range, the viscoelasticity or surface energy of the pressure-sensitive adhesive layer 52 or the adhesive layer 4 of the pressure-sensitive adhesive tape 5 may be adjusted, or a combination thereof may be adjusted.

When the adhesive force between the adhesive tape 5 and the adhesive layer 4 is 0.5 N/25 mm or less, when picking up the adhesive layer and the metal layer 3 from the adhesive tape 5, the pushing speed and the amount of pushing up of the pin are reduced. Since pick-up can be performed even if the force applied to the metal layer is reduced, generation of traces of pins in the metal layer 3 can be suppressed. When the adhesive force between the adhesive tape 5 and the adhesive layer 4 is 0.03 N/25 mm or more, when the metal layer 3 and the adhesive layer 4 are expanded, the metal layer 3 and the adhesive layer 4 are attached to the adhesive tape ( It does not peel from 5) and is held well.

Next, an example of the manufacturing method of the tape 1 for electronic device packages concerning this embodiment is demonstrated. First, the long metal layer 3 is prepared. As the metal layer 3, a commercially available metal foil may be used. Then, as shown in FIG. 4(A), the metal layer 3 is bonded to the adhesive face of the long substrate tape 2 using a bonding roller r or the like.

Separately, a long film-like adhesive layer 4 is formed. The adhesive layer 4 can be formed using a conventional method of preparing a resin composition and forming it on a film-like layer. Specifically, for example, the resin composition is applied onto an appropriate separator (release paper, etc.) and dried (if heat curing is required, heat treatment is applied as necessary and dried), and the adhesive layer (4) ) and the like. The resin composition may be a solution or a dispersion.

Next, as shown in FIG. 4(B), the adhesive layer 4 peeled from the separator is bonded on the metal layer 3 bonded to the substrate tape 2 using a bonding roller r or the like.

In addition, in the above, after bonding the metal layer 3 to the base material tape 2, it was made to bond the adhesive layer 4 on the metal layer 3, but after bonding the metal layer 3 and the adhesive layer 4 , You may bond the surface on the side of the metal layer 3 to the base material tape 2.

Next, as shown in FIG. 4(C), the adhesive layer 4 and the metal layer 3 are precut into a predetermined shape (circular shape here) using a pressure cutting blade or the like, and FIG. 4(D) As shown, the peripheral unnecessary portion 6 is peeled off from the base tape 2 and removed. In addition, the pre-cut is not limited to the above, and the outer edge is circular and the adhesive layer 4 and the metal layer 3 are cut to a predetermined size corresponding to the semiconductor chip C using lattice-shaped pressure cutting teeth. It may be individualized in advance to the size of .

In addition, as a method of forming the metal layer 3 and the adhesive layer 4 of a predetermined shape on the base tape 2, it is not limited to the above, and the elongated metal layer 3 is bonded to the elongated base tape 2, After punching into a predetermined shape and removing unnecessary portions 6, the adhesive layer 4 formed into a predetermined shape may be bonded onto the metal layer 3 of a predetermined shape, and the metal layer 3 formed into a predetermined shape in advance Although the adhesive bond layer 4 may be bonded to the base material tape 2, it is preferable to manufacture by the process shown to the above-mentioned FIG. 4 (A) - (D) from the point of the simplicity of a manufacturing process.

Furthermore, the adhesive tape 5 is produced separately. The base film can be formed into a film by a conventionally known film forming method. Examples of the film forming method include a calender film forming method, a casting method in an organic solvent, an inflation extrusion method in a closed system, a T-die extrusion method, a coextrusion method, and a dry lamination method. Next, the pressure-sensitive adhesive layer composition is applied on the base film 51 and dried (heating and crosslinking as necessary) to form the pressure-sensitive adhesive layer 52 . Examples of the application method include roll application, screen application, and gravure application. In addition, the pressure-sensitive adhesive layer composition may be directly applied to the base film to form the pressure-sensitive adhesive layer 52 on the base film 51, or the pressure-sensitive adhesive layer composition may be applied to a release paper or the like subjected to a peeling treatment on the surface of the pressure-sensitive adhesive layer ( 52), the pressure-sensitive adhesive layer may be transferred to the base film 51. Thereby, the adhesive tape 5 in which the adhesive layer 52 was formed on the base film 51 is produced.

Then, as shown in FIG. 5(A), the adhesive tape ( 5) The adhesive tape 5 is laminated so that the surface on the side of the adhesive layer 52 may contact.

Next, as shown in FIG. 5(B), the adhesive tape 5 is precut into a predetermined shape using a pressure cutting blade or the like, and as shown in FIG. 5(C), the unnecessary parts around the By peeling and removing (7) from base tape 2, tape 1 for electronic device packaging is made. In addition, after that, the base material tape 2 used for the precut process may be peeled off, and a known separator may be bonded to the pressure-sensitive adhesive layer 52 of the adhesive tape 5.

<How to use>

Next, the method of manufacturing the electronic device package 8 using the tape 1 for electronic device packages of this embodiment is demonstrated, referring FIGS. 6-8. In addition, in this embodiment, as the electronic device package 8, the semiconductor chip C flip-chip-connected on the adherend 9 is demonstrated as an example.

[Mount process of semiconductor wafer (W)]

First, a separate dicing tape D identical to the adhesive tape 5 of the electronic device package tape 1 of the present invention is prepared, and a center portion on the dicing tape D is provided in FIG. 6(A) As shown in , the ring frame R is attached to the periphery of the dicing tape D while adhering the semiconductor wafer W and holding and fixing it (mounting process of the semiconductor wafer W). join At this time, the dicing tape D is adhered to the back surface of the semiconductor wafer W. The back surface of the semiconductor wafer W means a surface (also referred to as a non-circuit surface, a non-electrode formation surface, etc.) opposite to the circuit surface. The bonding method is not particularly limited, but a method by heat pressing is preferable. The crimping is usually performed while pressing with a crimping means such as a crimping roll.

[Dicing process of semiconductor wafer W]

Next, as shown in FIG. 6(B), dicing of the semiconductor wafer W is performed. In this way, the semiconductor wafer W is cut into a predetermined size and separated into pieces (small pieces) to manufacture the semiconductor chip C. Dicing is performed according to a conventional method on the circuit surface side of the semiconductor wafer W, for example. In addition, in this process, the cutting method called full-cut etc. which perform incision up to the dicing tape D are employable, for example. The dicing device used in this process is not particularly limited, and conventionally known ones can be used. In the case of expanding the dicing tape D, the expansion can be performed using a conventionally known expander.

[Pick-up process of semiconductor chip (C)]

As shown in FIG. 6(C), the semiconductor chip C is picked up and the semiconductor chip C is separated from the dicing tape D. The pick-up method is not particularly limited, and conventionally known various methods can be employed. For example, the dicing tape D to which the semiconductor chip C and the ring frame R are bonded is placed with the base film side down on the stage S of the pick-up device, and the ring frame R ) is fixed, the hollow columnar pushing member T is raised to expand the dicing tape D. In this state, a method of pushing up each semiconductor chip C from the base film side of the dicing tape D with a pin N and picking up the pushed semiconductor chip C by a pick-up device, etc. can be heard

[Flip chip connection process]

As shown in FIG. 6(D), the picked-up semiconductor chip C is fixed to an adherend 9 such as a substrate by a flip chip bonding method (flip chip mounting method). Specifically, the semiconductor chip C is formed so that the circuit surface (also referred to as the surface, circuit pattern formation surface, electrode formation surface, etc.) of the semiconductor chip C faces the adherend 9, and the adherend (9) is fixed according to the usual method. For example, first, flux is applied to the bump 10 as a connecting portion formed on the circuit surface side of the semiconductor chip C. Next, the bump 10 of the semiconductor chip C is brought into contact with the conductive material 11 (solder, etc.) for bonding adhered to the connection pad of the adherend 9, and the bump 10 and the conductive material 11 are pressed. ) is melted, electrical conduction between the semiconductor chip C and the adherend 9 can be ensured, and the semiconductor chip C can be fixed to the adherend 9 (flip chip bonding process). At this time, a gap is formed between the semiconductor chip C and the adherend 9, and the distance between the gaps is generally about 30 μm to 300 μm. Flux remaining on the opposite surface or gap between the semiconductor chip C and the adherend 9 is washed and removed.

As the adherend 9, various substrates such as lead frames and circuit boards (such as wiring circuit boards) can be used. The material of such a substrate is not particularly limited, but includes ceramic substrates and plastic substrates. As a plastic board|substrate, an epoxy board|substrate, a bismaleimide triazine board|substrate, a polyimide board|substrate etc. are mentioned, for example. Further, a chip-on-chip structure can be obtained by flip-chip connecting the semiconductor chip C with another semiconductor chip serving as the adherend 9 .

Subsequently, as shown in FIG. 7(A), the base tape 2 of the electronic device package tape 1 according to the present embodiment is peeled off, and the metal layer 3 and the pressure-sensitive adhesive layer of the adhesive tape 5 are peeled off. 52 is exposed, and the periphery of the pressure-sensitive adhesive layer 52 is fixed to the ring frame R.

Subsequently, as shown in FIG. 7(B), the metal layer 3 and the adhesive layer 4 are cut into a size corresponding to the semiconductor chip C and separated into individual pieces. Cutting can be performed in the same process as the dicing process of the semiconductor wafer W described above. In addition, this process is not performed when the precut process which separates the metal layer 3 and the adhesive bond layer 4 previously is performed.

Subsequently, as shown in FIG. 7(C), the metal layer 3 and the adhesive layer 4 separated into pieces are picked up and peeled from the adhesive tape 5. Pickup can be performed in the same process as the process of picking up the semiconductor chip C described above.

Then, as shown in FIG. 8, the metal layer 3 and the adhesive layer 4 side of the adhesive layer 4 picked up are bonded to the back surface of the flip-chip connected semiconductor chip C. Thereafter, a sealing material (sealing resin or the like) is filled in the periphery of the semiconductor chip C with the metal layer 3 and in the gap between the semiconductor chip C and the adherend 9 to seal it. Sealing is performed according to a conventional method. At this time, since the metal layer 3 is provided on the back surface of the semiconductor chip C, warpage caused by a difference in thermal expansion coefficient between the semiconductor chip C and the adherend 9 in the flip chip bonding process is ) and the thermal expansion coefficient of the metal layer 3. In addition, since the metal layer 3 is provided on the back surface of the semiconductor chip C, heat generated during use as an electronic device is dissipated by the metal layer 3 .

In the above description, the package structure in which the metal layer 3 is directly installed on the back surface of the semiconductor chip C via the adhesive layer 4 and the metal layer 3 is also sealed together with the semiconductor chip C has been described. After sealing the semiconductor chip C, you may make it provide the metal layer 3 via the adhesive bond layer 4 on the upper surface of the sealing body. Since the electronic device package 8 warps even when sealed, the warp during sealing can be offset by providing the metal layer 3 on the upper surface of the sealing body.

In the above description, as the electronic device package 8, the semiconductor chip C flip-chip connected on the adherend 9 has been described as an example, but it is not limited to this, and for example, on the semiconductor chip In an electronic device package structure in which different semiconductor chips of the same size are stacked, in order to use the metal layer 3 of the tape 1 for electronic device packaging of the present invention as a spacer between both chips, through the adhesive layer 4 You may make it provide the metal layer 3 on the lower side semiconductor chip.

<Example>

Next, in order to further clarify the effects of the present invention, Examples and Comparative Examples will be described in detail, but the present invention is not limited to these Examples.

(1) Production of adhesive tape

<Adhesive layer composition (1)>

As an acrylic copolymer (A1) which has a functional group, it contains 2-ethylhexyl acrylate, 2-hydroxyethyl acrylate, and acrylic acid, and the ratio of 2-ethylhexyl acrylate is 80 mol% and the air of a mass average molecular weight of 700,000 A composite was prepared. Next, 2-isocyanatoethyl methacrylate was added so that the iodine value was 15 to prepare an acrylic copolymer (a-1) having a glass transition temperature of -70°C, a hydroxyl value of 20 mgKOH/g, and an acid value of 5 mgKOH/g did

10 parts by mass of Coronate L (manufactured by Tosoh Corporation) was added as a polyisocyanate based on 100 parts by mass of the acrylic copolymer (a-1), and 3 parts by mass of Irgacure-184 (manufactured by BASF) was added as a photopolymerization initiator The mixture was dissolved in ethyl acetate and stirred to obtain the pressure-sensitive adhesive layer composition (1).

<Adhesive layer composition (2)>

As the acrylic copolymer (A1) having a functional group, butyl acrylate, 2-ethylhexyl acrylate, 2-hydroxyethyl acrylate and acrylic acid are included, the ratio of 2-ethylhexyl acrylate is 50 mol%, and the mass An acrylic copolymer (a-2) having an average molecular weight of 650,000, a glass transition temperature of -60°C, a hydroxyl value of 25 mgKOH/g, and an acid value of 6 mgKOH/g was prepared.

A mixture obtained by adding 10 parts by mass of Coronate L (manufactured by Tosoh Corporation) as a polyisocyanate based on 100 parts by mass of the acrylic copolymer (a-2) was dissolved in ethyl acetate and stirred to obtain an adhesive layer composition (2) got it

<Adhesive layer composition (3)>

A mixture obtained by adding 8 parts by mass of Coronate L (manufactured by Tosoh Corporation) as a polyisocyanate based on 100 parts by mass of the acrylic copolymer (a-2) was dissolved in ethyl acetate and stirred to obtain an adhesive layer composition (3) got it

As a base film, the following were produced.

<Base film (1)>

Resin beads of a mixture of polypropylene PP and thermoplastic elastomer HSBR (PP: HSBR = 80: 20) were melted at 200 ° C and formed into a long film with a thickness of 80 μm using an extruder to prepare a base film (1). . As the polypropylene PP, F-300SP (trade name) manufactured by Idemitsu Sekiyu Chemical Co., Ltd. was used, and Dynaron 1320P (trade name) manufactured by JSR Corporation was used as the thermoplastic elastomer HSBR.

<Adhesive tape (1)>

On a release liner made of a polyethylene-terephthalate film subjected to release treatment, the pressure-sensitive adhesive layer composition (1) was coated so that the thickness after drying was 10 μm, dried at 110° C. for 3 minutes to form a pressure-sensitive adhesive layer, and then the substrate It bonded together with the film (1), and produced the adhesive tape (1).

<Adhesive tape (2)>

The adhesive tape (2) was produced similarly to the adhesive tape (1) except having used the adhesive layer composition (2).

<Adhesive tape (3)>

The adhesive tape (3) was produced similarly to the adhesive tape (1) except having used the adhesive layer composition (3).

(2) Production of adhesive layer

<Adhesive layer (1)>

Acrylic resin (manufactured by Nagase Chemtex Co., Ltd., trade name "Teisan Resin SG-P3", Mw 850,000, Tg 12 ° C.) 80 parts by mass, and a naphthalene type epoxy resin (manufactured by DIC Co., Ltd., trade name "HP-4700 ]) 10 parts by mass, 10 parts by mass of a phenol resin (manufactured by Maywa Kasei Co., Ltd., trade name "MEH7851") as a curing agent was dissolved in methyl ethyl ketone to prepare an adhesive layer composition solution. This adhesive layer composition solution was coated on a release treatment film (release liner) made of a polyethylene terephthalate film having a thickness of 50 μm subjected to silicone release treatment, and then dried at 130° C. for 5 minutes. In this way, an adhesive layer 1 having a thickness of 20 µm was produced.

<Adhesive layer (2)>

100 parts by mass of bisphenol A-type phenoxy resin (manufactured by Nippon-Sumikin Chemical Co., Ltd., trade name "YP-50S", Mw 60,000, Tg 84 ° C.), and a cresol novolak-type epoxy resin (Nippon Kayaku Co., Ltd. Kaisha product, trade name "EOCN-1020", epoxy equivalent 198, softening point 64 ° C.) 40 parts by mass, liquid bisphenol A type epoxy resin (Nittetsu Sumikin Chemical Co., Ltd., trade name "YD-128", Mw 400, epoxy Equivalent 190) 100 parts by mass, imidazole as a curing agent (manufactured by Shikoku Kasei Kogyo Co., Ltd., trade name "2PHZ-PW") 1.5 parts by mass, silica filler (manufactured by Admatex Co., Ltd., trade name "SO-C2", An adhesive layer composition solution was prepared by dissolving or dispersing 20 parts by mass (average particle size: 0.5 µm) in methyl ethyl ketone. Using this adhesive layer composition solution, an adhesive layer (2) having a thickness of 20 µm was produced in the same manner as in the adhesive layer (1).

As the metal layer, the following were prepared.

<Metal layer (1)>

F3-WS (Furukawa Denki Kogyo, copper foil, thickness 12㎛, surface roughness RzJIS 2.8㎛)

<Metal layer (2)>

GTS (Furukawa Denki Kogyo, copper foil, thickness 9㎛, surface roughness RzJIS 6.0㎛)

<Metal layer (3)>

1085 (UACJ, aluminum foil, thickness 20㎛, surface roughness RzJIS 1.9㎛)

<Metal layer (4)>

1085 (UACJ, aluminum foil, thickness 20㎛, surface roughness RzJIS 4.9㎛)

<Metal layer (5)>

SUS304 (Nittetsu Sumikin Materials, stainless steel foil, thickness 20㎛, surface roughness RzJIS2.1um)

<Metal layers (6) to (11)>

After degreasing and pickling an electrolytic copper foil with a thickness of 35 μm and an M-surface gloss of 230% and an S-surface glossiness of 100%, roughening treatment under the conditions shown in Tables 1 and 2 below, PR pulse electrolysis, alkali Immersion treatment was performed to prepare metal layers (6) to (11).

In addition, in metal layers (1)-(11), surface roughness RzJIS is the surface roughness RzJIS by the 10-point average roughness of the surface which is not bonded to the adhesive bond layer of a metal layer. In addition, the glossiness of the metal layers (6) to (11) was measured using a gloss meter handy gloss meter PG-1 manufactured by Nippon Denshoku Co., Ltd. in accordance with JIS Z 8741, and the metal layer was not bonded to the adhesive layer. It is the specular gloss at an angle of incidence of 60 degrees on the non-polished surface.

(5) Production of tape for electronic device packaging

<Example 1>

The adhesive layer (1) and the metal layer (1) formed on the release liner were bonded under conditions of a bonding angle of 120°, a pressure of 0.2 MPa, and a speed of 10 mm/s to prepare a single-sided adhesive film. The adhesive tape (1) was precut into a circular shape so that it could be bonded to the ring frame, and the single-sided adhesive film was precut into a circular shape smaller than the adhesive tape (1). The adhesive layer (1) side exposed by peeling off the release treatment film of the single-sided adhesive film and the pressure-sensitive adhesive layer of the pressure-sensitive adhesive tape (1) are bonded so that the pressure-sensitive adhesive layer is exposed around the single-sided adhesive film, as shown in FIG. A tape for an electronic device package according to Example 1 was prepared.

<Examples 2 to 12, Comparative Example 1>

Tapes for electronic device packaging of Examples 2 to 12 and Comparative Example 1 were prepared in the same manner as in Example 1, except that the combination of the adhesive tape, the adhesive layer composition, and the metal layer was set to the combination described in Tables 3 and 4.

The following measurement and evaluation were performed about the tape for electronic device packages concerning Examples 1-12 and Comparative Example 1. The results are shown in Tables 3 and 4.

(adhesive strength of adhesive tape and adhesive layer)

The adhesive layer according to each Example and Comparative Example was peeled off from the release liner, and a shape-retaining tape (manufactured by Sekisui Chemical Kogyo Co., Ltd., trade name "forte") was bonded to the surface of the adhesive layer with a 2 kg roller, It was cut out into a rectangle with a width of 25 mm, and a test piece was prepared in which a base film, an adhesive layer, an adhesive layer, and a shape-retaining tape were laminated in this order. Among the prepared test pieces, Examples 1, 3, 4, and 7 to 12 were irradiated with ultraviolet rays of 200 mJ/cm 2 by an air-cooled high-pressure mercury lamp (80 W/cm, irradiation distance 100 mm). After that, it is divided into a laminate of "substrate film and adhesive layer" and a laminate of "adhesive layer and shape-retaining tape" by a strograph (trade name "VE10") manufactured by Toyo Seiki Seisakusho Co., Ltd., and held, The adhesive strength between the pressure-sensitive adhesive layer and the adhesive layer was measured at a linear speed of 300 mm/min. In addition, the unit of adhesive force is [N/25mm]. The measurement was based on the 180° peeling method, the measurement temperature was 23°C, and the measurement humidity was 50%. In addition, it is divided into a laminate of "base film and pressure-sensitive adhesive layer" and a laminate of "adhesive layer and shape-retaining tape", and peeling of "adhesive layer and shape-retaining tape" from "base film and pressure-sensitive adhesive layer" is only for the adhesive layer. This is because there is a possibility that the adhesive layer may increase when the adhesive layer is gripped and peeled off.

(loss tangent tanδ of adhesive layer)

The adhesive layer according to each Example and Comparative Example was cut out to a size of 5.0 cm x 5.0 cm, laminated, and bonded with a hand roller on a hot plate at 70 ° C. to obtain a test piece having a thickness of about 1.0 mm. The test piece was heated at a temperature range of 10 to 150°C and a temperature increase rate of 5°C/min using a rheometer manufactured by Haake (trade name "RS6000"), and the loss tangent tan δ at 25°C was determined. The measurement was performed at 50% RH and a measurement frequency of 1 Hz.

(recognition)

The metal layer and the adhesive layer of the tape for electronic device packaging of each sample of the above Examples and Comparative Examples were singulated into samples having a size of 5 mm x 5 mm. Then, 200 mJ/cm<2> of ultraviolet rays were irradiated to the adhesive layer from the base film side by the air-cooled high-pressure mercury-vapor lamp (80 W/cm, irradiation distance 10 cm). For 100 shredded samples in the central portion of the tape for electronic device packaging, using a dice picker (trade name "CAP-300II") manufactured by Canon Machinery Co., Ltd., recognition of the shredded sample is obtained in the same way as for silicon wafer chips. confirmed. A product that obtained the same recognition as the chip was evaluated as a good product, ○, a product that obtained the same recognition as that of the chip by changing the irradiation angle or amount of light was regarded as an acceptable product, and a product that did not obtain recognition was evaluated as × as a defective product. The results are shown in Tables 3 and 4.

(pickup)

After the recognizable test, a pick-up test was conducted on the 250 pieces of the shredded samples under the following pick-up conditions, and the pin height (pin height) at which 200 or more samples could be picked up was calculated. In addition, the upper limit of the pin height was 400 μm. The results are shown in Tables 3 and 4. In the tape for electronic device packaging according to Example 6, the adhesive strength between the adhesive tape and the adhesive layer was too high, and the individual sample could not be picked up under this test condition, so the pin height could not be calculated. However, there is no problem because the singularized sample can be recognized and picked up if the pin height is set higher than 400 μm. In addition, there is a possibility that pin marks may occur in the metal layer when the pin height is increased. In the case where pin marks are generated, the metal layer may be pressed to flatten the pin marks when bonding the metal layer and the adhesive layer to the back surface of the semiconductor chip. Further, in the tape for child device package according to Comparative Example 1, the pin height could not be calculated because the individual sample could not be recognized and could not be picked up.

<Pick-up conditions>

Pickup device: CAP-300II manufactured by Canon Machinery Co., Ltd.

Push-up pin shape: radius 0.7mm, tip curvature radius R=0.25mm, tip θ=15

Pin push-up speed: 50 mm/sec

As shown in Tables 3 and 4, since the tapes for electronic device packaging according to Examples 1 to 12 have a surface roughness RzJIS of less than 5.0 μm by 10-point average roughness on the surface of the metal layer opposite to the adhesive layer, In the evaluation, it became a good result. In addition, as shown in Table 4, since the tape for electronic device packaging according to Example 8 had a specular gloss of 117% at an incident angle of 60 degrees on the metal layer, it was necessary to change the light irradiation angle and irradiation amount. After adjusting the angle and amount, it was possible to recognize the segmentation sample, so it is an acceptable range.

On the other hand, since the tape for electronic device packaging according to Comparative Example 1 had a surface roughness RzJIS of 6.0 µm based on the 10-point average roughness of the surface opposite to the adhesive layer of the metal layer, it was inferior in recognition evaluation.

1: tape for electronic device packaging
2: base tape
3: metal layer
4: adhesive layer
5: adhesive tape
5a: label part
5b: periphery

Claims (7)

An adhesive tape having a base film and an adhesive layer;
An adhesive layer laminated and installed on the opposite side of the base film of the pressure-sensitive adhesive layer;
A metal layer laminated and installed on the opposite side of the adhesive layer to the pressure-sensitive adhesive layer,
The metal layer has a surface roughness RzJIS of less than 5.0 μm by 10-point average roughness of a surface opposite to the adhesive layer. The tape for electronic device packaging according to claim 1, wherein the metal layer has a specular gloss of less than 100% at an incident angle of 60 degrees. The tape for electronic device packaging according to claim 1 or 2, wherein the metal layer has a thickness of 5 μm or more and less than 200 μm. The electronic device according to claim 1 or 2, wherein the adhesive force between the adhesive tape and the adhesive layer in a state in which the adhesive layer and the metal layer are picked up from the adhesive tape is 0.03 to 0.5 N/25 mm. Tape for packaging. The tape for electronic device packaging according to claim 1 or 2, wherein the metal layer contains copper or aluminum. The method according to claim 1 or 2, wherein the adhesive layer contains (A) an epoxy resin, (B) a curing agent, (C) an acrylic resin or a phenoxy resin, and (D) a surface-treated inorganic filler. A tape for electronic device packaging. The method according to claim 1 or 2, wherein the pressure-sensitive adhesive layer is composed of an acrylic acid ester represented by CH ₂ =CHCOOR (wherein R is an alkyl group having 4 to 18 carbon atoms), a hydroxyl group-containing monomer, and a molecule An electronic device packaging tape characterized by containing an acrylic polymer comprising an isocyanate compound having a radical reactive carbon-carbon double bond therein.

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