TWI643931B - Tape for electronic device packaging - Google Patents

Abstract

An object of the present invention is to provide a single-piece electronic device packaging tape which can be used to recognize a metal layer of an adhesive layer to be picked up by a pick-up device when the metal layer of the adhesive layer is picked up by an adhesive tape.

The solution is the tape (1) for electronic device packaging of the present invention, which is characterized in that it has an adhesive tape (5) having a base film (51) and an adhesive layer (52), and is laminated on the adhesive layer ( 52) an adhesive layer (4) provided on the opposite side of the substrate film (51); and a metal layer (3) laminated on the opposite side of the adhesive layer (52) from the adhesive layer (4) And the metal layer (3) has a surface roughness RzJIS of less than 5.0 μm obtained from a ten-point average roughness.

Description

Tape for electronic device packaging

The present invention relates to an adhesive tape for electronic device packaging, and more particularly to an electronic device packaging tape having a metal layer.

In recent years, electronic devices such as mobile phones and notebook PCs have been required to be thinner and smaller. Therefore, in order to reduce the thickness and size of an electronic device package such as a semiconductor package mounted on an electronic device, the number of electrodes of the electronic device or the circuit board is increased, and the pitch is further narrowed. In such an electronic device package, for example, a flip chip (FC) package is provided.

In the flip chip package, as described above, the number of electrodes is increased or the pitch is narrowed, so that an increase in heat generation is a problem. Therefore, as a heat dissipation structure of the flip chip package, it is proposed to provide a metal layer on the back surface of the electronic device via the adhesive layer (see, for example, Patent Document 1).

Further, in the flip chip package, there is a possibility that the linear expansion ratio of the electronic device greatly differs from the linear expansion ratio of the circuit board. At this time, in the manufacturing process of the electronic device package, when the intermediate product is heated and cooled, the difference between the expansion amount and the shrinkage amount between the electronic device and the circuit substrate occurs. different. Because of this difference, warpage occurs in the electronic device package. As a structure for suppressing such warpage, it is also proposed to provide a metal layer on the back surface of the electronic device via the adhesive layer (see, for example, Patent Document 2).

Further, in the flip chip package, it is also proposed to provide a metal layer on the back surface of the electronic device via the adhesive layer, and use the metal layer as a protective layer for laser marking (see, for example, Patent Document 3).

Further, in recent years, other semiconductor wafers of the same size are further laminated on a semiconductor wafer, and a three-dimensional assembly is performed. Here, in order to laminate other semiconductor wafers of the same size on the semiconductor wafer, the spacers must be laminated in advance between the two. This is due to the fact that other semiconductor wafers are also laminated on the electrode pad portion of the semiconductor wafer. As the spacer, a metal layer using an adhesive layer has been proposed (for example, see Patent Document 4). Patent Document 4 discloses that the spacer is provided by the step of bonding a spacer having a metal layer having at least one surface of the adhesive layer to the dicing sheet with the adhesive layer as a bonding surface; Cutting the spacer with a sheet to form a wafer-like spacer having an adhesive layer; lifting the spacer with the spigot, and staking the spacer, and peeling the semiconductor wafer from the dicing sheet together with the adhesive layer The pick-up device used at the time, the step of peeling off the cut sheet together with the adhesive layer; and the step of fixing the spacer to the adherend via the adhesive layer.

[Previous Technical Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open Publication No. 2007-235022

[Patent Document 2] Japanese Patent No. 5487847

[Patent Document 3] Japanese Patent No. 5419226

[Patent Document 4] Japanese Patent No. 4954569

As described above, the metal layer of the adhesive layer is used for various electronic device packages, and from the viewpoint of productivity, as disclosed in Patent Document 4, it is required to use an existing device for picking up or fixing the adherend.

In the conventional pick-up device, the semiconductor wafer is vacuum-adsorbed by a colette for pick-up. At this time, it is necessary to surely pick up the semiconductor wafer. Therefore, the position of the semiconductor wafer is recognized, the offset of the semiconductor wafer is detected, the position of the adsorber is corrected, and the semiconductor wafer is picked up.

The identification method of the semiconductor wafer mainly uses pattern recognition. Using the pattern recognition method, a circuit of a semiconductor wafer, a calibration mark, or a wafer shape is preliminarily registered as a template, and the position of the semiconductor wafer is identified by an image of the template and the semiconductor wafer imaged by the photographing device. As with a bare wafer, when no circuit or calibration mark is formed, a pattern consisting of the wafer shape and a uniform wafer surface is registered.

In order to use such a conventional pick-up device, when the metal layer of the adhesive layer is picked up by the adhesive tape, since the circuit does not exist on the metal layer, the appearance and uniformity of the metal layer are used similarly to the bare wafer. A model of a metal layer. However, when the surface roughness of the metal layer is large, the photographing device detects the unevenness of the surface, and judges that the surface of the photographed metal layer is different from the template, and as a result, there is a problem that the metal layer is not recognized.

Accordingly, it is an object of the present invention to provide a single-piece electronic device packaging tape which can be used to pick up a metal layer of an adhesive layer to be picked up by a pick-up device when the metal layer of the adhesive layer is picked up by an adhesive tape. .

In order to solve the above problems, an adhesive tape for an electronic device according to the present invention has an adhesive tape having a base film and an adhesive layer, and is laminated on the opposite side of the adhesive film from the base film. a layer of a metal layer disposed on a side opposite to the adhesive layer of the adhesive layer, and a surface roughness obtained by a ten-point average roughness of the surface of the metal layer opposite to the adhesive layer RzJIS is less than 5.0 μm .

In the above-mentioned tape for electronic device packaging, the specular gloss of the metal layer at an incident angle of 60 degrees is preferably less than 100%.

In the above-mentioned tape for electronic device packaging, the thickness of the metal layer is preferably 5 μm or more and less than 200 μm.

In the above-described adhesive tape for electronic device packaging, in the state in which the adhesive layer and the metal layer are picked up from the adhesive tape, the adhesive force between the adhesive tape and the adhesive layer is preferably 0.03 to 0.5 N/25 mm.

The above-mentioned electronic device packaging tape, the metal layer is preferably It contains copper or aluminum.

Further, in the above-described tape for electronic device packaging, the adhesive layer preferably contains (A) an epoxy resin, (B) a curing agent, (C) an acrylic resin or a phenoxy resin, and (D) a surface-treated inorganic filler. .

Further, in the tape for electronic device packaging, the adhesive layer preferably contains an acrylate represented by CH ₂ =CHCOOR (wherein R is an alkyl group having 4 to 18 carbon atoms), a hydroxyl group-containing monomer, and an intramolecular component. An acrylic polymer composed of an isocyanate compound having a radical-reactive carbon-carbon double bond.

According to the present invention, when the metal layer of the adhesive layer is picked up by the adhesive tape, a single piece of the metal layer of the adhesive layer to be picked up can be well recognized by the pick-up device.

1‧‧‧Electronic device packaging tape

2‧‧‧Substrate tape

3‧‧‧metal layer

4‧‧‧ adhesive layer

5‧‧‧Adhesive tape

5a‧‧‧Label

5b‧‧‧ peripherals

Fig. 1 is a cross-sectional view schematically showing the structure of an adhesive tape for electronic device according to an embodiment of the present invention.

Fig. 2 (a) is a plan view schematically showing a structure of an adhesive tape for electronic device packaging according to an embodiment of the present invention, and (b) is a cross-sectional view.

Fig. 3 is a perspective view schematically showing the structure of an adhesive tape for electronic device according to an embodiment of the present invention.

FIG. 4 is a view schematically showing an electronic device package according to an embodiment of the present invention; (A) is a longitudinal cross-sectional view showing a bonding step of a metal layer, (B) is a longitudinal cross-sectional view showing a bonding step of an adhesive layer, and (C) is a display. A short-side cross-sectional view of the precut step, and (D) is a perspective view showing a removal step of the unnecessary portion.

FIG. 5 is an explanatory view showing a method of manufacturing an adhesive tape for electronic device according to an embodiment of the present invention, wherein (A) is a cross-sectional view showing a step of bonding the adhesive tape, and (B) is a step of displaying a pre-cut. The cross-sectional view in the short side direction and (C) are cross-sectional views in the short side direction showing the removal step of the unnecessary portion.

Fig. 6 is a cross-sectional view schematically showing a method of using an adhesive tape for electronic device according to an embodiment of the present invention.

Fig. 7 is a cross-sectional view schematically showing a method of using an adhesive tape for electronic device according to an embodiment of the present invention.

Fig. 8 is a cross-sectional view schematically showing a structure of an electronic device package using a tape for electronic device packaging according to an embodiment of the present invention.

Hereinafter, embodiments of the present invention will be described in detail.

Fig. 1 is a cross-sectional view showing an adhesive tape 1 for an electronic device according to an embodiment of the present invention. The electronic device encapsulating tape 1 has an adhesive tape 5 formed of a base film 51 and an adhesive layer 52 provided on the base film 51, and an adhesive layer 4 and a layer are provided on the adhesive layer 52. The metal layer 3 is provided in combination with the adhesive layer 4. Metal layer 3, can also be separated The undercoat layer or the like for making the adhesion to the adhesive layer 4 excellent is provided indirectly on the adhesive layer 4.

As shown in FIGS. 2 and 3, the adhesive tape 1 for electronic device packaging of the present invention preferably has the adhesive tape 5 cut into a shape corresponding to the annular frame R (refer to FIG. 7), and the metal layer 3 and the adhesive The layer 4 is also cut (precut) into a specific shape in accordance with this, and in the present embodiment, it is pre-cut.

As shown in FIG. 2 and FIG. 3, the tape 1 for electronic device packaging of the present invention preferably has a shape in which a long substrate tape 2 in which a plurality of laminates are formed is wound into a roll shape, and the laminated system layer is formed. The metal layer 3 and the adhesive layer 4 are bonded to the adhesive tape 5 (label portion 5a) which is cut into a shape corresponding to the annular frame R. In the present embodiment, the film is wound into a roll shape, but may be provided in a roll shape. The laminate of the base tape 2 is cut one by one.

When it is pre-cut and wound into a roll shape, as shown in FIGS. 2 and 3, the electronic device packaging tape 1 has a base tape 2, and a metal layer having a specific planar shape is provided on the base tape 2. 3; an adhesive layer 4 provided on the opposite side of the metal layer 3 from the side of the substrate tape 2 and laminated with the metal layer 3, and having a specific planar shape; and having the adhesive layer 4 and disposed on the adhesive layer 4 A label portion 5a having a specific planar shape in contact with the substrate tape 2 and an adhesive tape 5 surrounding the peripheral portion 5b on the outer side of the label portion 5a.

The label portion 5a has a shape corresponding to the annular frame R for dicing. The shape corresponding to the shape of the annular frame R for cutting is preferably substantially the same shape as the inner side of the annular frame R and larger than the annular frame R. Similar shape of the size of the inside. Further, it is not necessarily required to be circular, but it is preferably a shape close to a circle, and more preferably a circle. The peripheral portion 5b includes a form that completely surrounds the outer side of the label portion 5a and a form that is not completely surrounded as shown. Further, the peripheral portion 5b may not be provided. However, when it is installed, when it is wound into a roll shape, the tension of the curl of the label portion 5a can be dispersed.

The adhesive layer 4 has a specific planar shape in which the annular frame R is bonded to the peripheral edge portion of the label portion 5a of the adhesive tape 5, and can be lifted up by the lifting member of the pickup device (refer to the drawing). 7(C)), which is smaller than the shape of the label portion 5a. The subsequent layer 4 is preferably substantially the same shape as the label portion 5a and is similar to the size of the label portion 5a. The subsequent agent layer 4 does not necessarily have to be circular, but is preferably close to a circular shape, more preferably circular.

The metal layer 3 has the same shape as the adhesive layer 4, and the adhesive layer 4 is laminated on the metal layer 3. The lamination referred to herein is not necessarily required to be the same size as long as the main portion is laminated, but it is preferably substantially the same shape in terms of convenience in production. Each component will be described below.

<Substrate tape 2>

The base tape 2 may be composed of a known separator, but the base tape used for pre-cutting of the tape for electronic device packaging may be directly used. When the base tape used for the pre-cut processing of the tape for electronic device packaging is used as it is, the base tape 2 must adhere to the metal layer 3 during the pre-cut processing, and therefore, for example, a resin film and a resin film can be suitably used. single The adhesive tape of the adhesive tape layer on the surface of the substrate.

A known material can be used as the material of the resin film constituting the base tape 2, and examples thereof include polyester (PET, PBT, PEN, PBN, PTT), polyolefin (PP, PE), and copolymer. (EVA, EEA, EBA), and a film in which some of these materials are substituted to further improve adhesion or mechanical strength. Further, a laminate of the film may be used for this purpose. From the viewpoints of heat resistance, smoothness, and ease of availability, it is preferably selected from polyethylene terephthalate, polypropylene, and polyethylene.

The thickness of the resin film constituting the base tape 2 is not particularly limited and may be appropriately set, and is preferably 10 to 150 μm.

As the resin used for the adhesive layer for a base tape, a known chlorinated polypropylene resin, an acrylic resin, a polyester resin, a polyurethane resin, an epoxy resin or the like which is used for the adhesive can be used, and preferably The acrylic polymer is an acrylic adhesive of a base polymer.

Examples of the acrylic polymer include alkyl (meth)acrylate (for example, methyl ester, ethyl ester, propyl ester, isopropyl ester, butyl ester, isobutyl ester, s-butyl ester). , t-butyl ester, amyl ester, isoamyl ester, hexyl ester, heptyl ester, octyl ester, 2-ethylhexyl ester, isooctyl ester, decyl ester, decyl ester, isodecyl Carbon number of alkyl groups such as ester, undecyl ester, dodecyl ester, tridecyl ester, myristyl ester, cetyl ester, octadecyl ester, eicosyl ester, etc. 1 to 30, particularly a linear or branched alkyl ester having 4 to 18 carbon atoms, and a cycloalkyl (meth)acrylate (for example, cyclopentyl ester or cyclohexyl ester) Or two or more types of acrylic polymers and the like as a monomer component. Furthermore, (methyl) Acrylate means acrylate and/or methacrylate, and the (meth) of the present invention has the same meaning.

The acrylic polymer may also have a unit corresponding to other monomer components copolymerizable with the alkyl (meth)acrylate or the cycloalkyl ester as needed for the purpose of reforming such as cohesive force and heat resistance. . Examples of such a monomer component include carboxyl groups such as acrylic acid, methacrylic acid, carboxyethyl (meth)acrylate, carboxypentyl (meth)acrylate, isaconic acid, maleic acid, fumaric acid, and crotonic acid. Monomer; anhydride monomer such as maleic anhydride or isaconic anhydride; 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 4-hydroxybutyl (meth)acrylate, 6-hydroxyhexyl (meth)acrylate, 8-hydroxyoctyl (meth)acrylate, 10-hydroxydecyl (meth)acrylate, 12-hydroxylauryl (meth)acrylate, (meth)acrylic acid ( a hydroxyl group-containing monomer such as 4-hydroxymethylcyclohexyl)methyl ester; styrenesulfonic acid, allylsulfonic acid, 2-(methyl)propenylamine-2-methylpropanesulfonic acid, (methyl a sulfonic acid group-containing monomer such as acrylamide propane sulfonic acid, sulfopropyl (meth) acrylate or (meth) propylene phthaloxy naphthalene sulfonic acid; 2-hydroxyethyl acrylonitrile phosphate; a monomer containing a phosphate group; acrylamide, acrylonitrile, or the like. These monomer components which can be copolymerized may be used alone or in combination of two or more. The amount of these copolymerizable monomers to be used is preferably 40% by weight or less based on the entire monomer components.

Further, since the acrylic polymer is crosslinked, a polyfunctional monomer or the like may be contained as a monomer component for copolymerization as needed. Examples of such a polyfunctional monomer include hexanediol di(meth)acrylate, (poly)ethylene glycol di(meth)acrylate, and (poly)propyl. Diol (meth) acrylate, neopentyl glycol di (meth) acrylate, pentaerythritol di (meth) acrylate, trimethylolpropane tri (meth) acrylate, pentaerythritol tri (methyl) Acrylate, dipentaerythritol hexa(meth) acrylate, (meth) acrylate epoxy ester, polyester (meth) acrylate, urethane (meth) acrylate, and the like. These polyfunctional monomers may be used alone or in combination of two or more. The amount of the polyfunctional monomer used is preferably 30% by weight or less based on the total of the monomer components from the viewpoint of adhesion characteristics and the like.

The preparation of the acrylic polymer can be carried out, for example, by a suitable method such as a solution polymerization method, an emulsion polymerization method, a bulk polymerization method or a suspension polymerization method, for a mixture of one or two or more kinds of component monomers. The adhesive layer for a base tape is preferably a composition for suppressing the inclusion of a low molecular weight substance from the viewpoint of preventing contamination of the wafer. From this viewpoint, the weight average molecular weight is 300,000 or more, particularly 400,000 to 3,000,000. The acrylic polymer is preferred as a main component, and thus the adhesive can be appropriately crosslinked by an internal crosslinking method or an external crosslinking method.

Further, in order to control the crosslink density of the adhesive layer for a base tape, the peeling property with the adhesive tape 5 is improved, and for example, a polyfunctional isocyanate compound, a polyfunctional epoxy compound, a melamine compound, or a metal salt compound can be used. a method of crosslinking treatment by a suitable external crosslinking agent such as a metal nip compound, an amine resin compound, or a peroxide; or mixing a low molecular compound having two or more carbon-carbon double bonds and borrowing An appropriate method such as a method of performing crosslinking treatment by irradiation with an energy ray or the like. When an external crosslinking agent is used, the amount of the crosslinking agent is based on the matrix to be crosslinked. The balance of the compound and the use of the adhesive are appropriately determined depending on the use of the adhesive. In general, it is preferably blended in an amount of about 20 parts by weight or less, more preferably from 0.1 part by weight to 20 parts by weight, based on 100 parts by weight of the base polymer.

The thickness of the adhesive layer for the base tape is not particularly limited and can be appropriately determined, and is generally about 3 to 200 μm. Further, the adhesive layer for the base tape may be composed of a single layer or a plurality of layers.

<Adhesive tape 5>

The adhesive tape 5 is not particularly limited, and a conventional cutting tape can be used. As the adhesive tape 5, for example, an adhesive layer 52 may be suitably used for the base film 51.

The base film 51 is not particularly limited as long as it is conventionally known. However, when a radiation curable material is used as the adhesive layer 52 to be described later, it is preferable to use a radiation-transmitting property.

For example, examples of the material thereof include polyethylene, polypropylene, ethylene-propylene copolymer, polybutene-1, poly-4-methylpentene-1, ethylene-vinyl acetate copolymer, and ethylene-ethyl acrylate. a homopolymer or copolymer of an α-olefin of a copolymer, an ethylene-methyl acrylate copolymer, an ethylene-acrylic acid copolymer, an ionic polymer, or the like, a mixture thereof, a polyurethane, a styrene-ethylene- A thermoplastic elastomer such as a butene or pentene copolymer, a polyamine-polyol copolymer, or the like, and a mixture thereof. Further, the base film may be a mixture of two or more selected from the group, and the like may be a single layer or a stratified layer.

The thickness of the base film 51 is not particularly limited and may be appropriately set. However, in consideration of the expansion step at the time of picking up, it is preferably 50 to 200 μm.

In order to improve the adhesion between the base film 51 and the adhesive layer 52, the surface of the base film 51 may be subjected to chemistry such as chromic acid treatment, ozone exposure, flame exposure, high-voltage electric discharge, ionizing radiation treatment, or the like. Sexual surface treatment.

Further, in the present embodiment, the adhesive layer 52 is directly provided on the base film 51, but an undercoat layer for improving adhesion or an anchor layer for improving machinability at the time of cutting may be interposed therebetween. Indirectly provided by a stress relaxation layer, an antistatic layer, or the like.

The resin used for the adhesive layer 52 of the adhesive tape 5 is not particularly limited, and a known chlorinated polypropylene resin, an acrylic resin, a polyester resin, a polyurethane resin, or an epoxy used in the adhesive can be used. The resin or the like is preferably an acrylic adhesive having an acrylic polymer as a base polymer.

Examples of the acrylic polymer include alkyl (meth)acrylate (for example, methyl ester, ethyl ester, propyl ester, isopropyl ester, butyl ester, isobutyl ester, s-butyl ester). , t-butyl ester, amyl ester, isoamyl ester, hexyl ester, heptyl ester, octyl ester, 2-ethylhexyl ester, isooctyl ester, decyl ester, decyl ester, isodecyl Carbon number of alkyl groups such as ester, undecyl ester, dodecyl ester, tridecyl ester, myristyl ester, cetyl ester, octadecyl ester, eicosyl ester, etc. 1 to 30, particularly a linear or branched alkyl ester having 4 to 18 carbon atoms, and a cycloalkyl (meth)acrylate (for example, cyclopentyl ester or cyclohexyl ester) Or 2 The acrylic polymer or the like as a monomer component. Further, (meth) acrylate means acrylate and/or methacrylate, and (meth) of the present invention has the same meaning.

The acrylic polymer can be modified by agglomeration, heat resistance, crosslinkability, etc., and optionally contains other monomer components copolymerizable with the alkyl (meth)acrylate or cycloalkyl ester. Corresponding unit. Examples of such a monomer component include carboxyl groups such as acrylic acid, methacrylic acid, carboxyethyl (meth)acrylate, carboxypentyl (meth)acrylate, isaconic acid, maleic acid, fumaric acid, and crotonic acid. Monomer; anhydride monomer such as maleic anhydride or isaconic anhydride; 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 4-hydroxybutyl (meth)acrylate, 6-hydroxyhexyl (meth)acrylate, 8-hydroxyoctyl (meth)acrylate, 10-hydroxydecyl (meth)acrylate, 12-hydroxylauryl (meth)acrylate, (meth)acrylic acid ( a hydroxyl group-containing monomer such as 4-hydroxymethylcyclohexyl)methyl ester; styrenesulfonic acid, allylsulfonic acid, 2-(methyl)propenylamine-2-methylpropanesulfonic acid, (methyl a sulfonic acid group-containing monomer such as acrylamide propane sulfonic acid, sulfopropyl (meth) acrylate or (meth) propylene phthaloxy naphthalene sulfonic acid; 2-hydroxyethyl acrylonitrile phosphate; a monomer containing a phosphate group; acrylamide, acrylonitrile, or the like. These monomer components which can be copolymerized may be used alone or in combination of two or more. The amount of these copolymerizable monomers to be used is preferably 40% by weight or less based on the entire monomer components.

Further, since the acrylic polymer is crosslinked, a polyfunctional monomer or the like may be contained as a monomer component for copolymerization as needed. Such a polyfunctional monomer may, for example, be hexanediol di(methyl) Acrylate, (poly)ethylene glycol di(meth)acrylate, (poly)propylene glycol di(meth)acrylate, neopentyl glycol di(meth)acrylate, pentaerythritol di(meth)acrylate, Trimethylolpropane tri(meth)acrylate, pentaerythritol tri(meth)acrylate, dipentaerythritol hexa(meth)acrylate, (meth)acrylic acid epoxy ester, polyester (meth) acrylate, A urethane (meth) acrylate or the like. These polyfunctional monomers may be used alone or in combination of two or more. The amount of the polyfunctional monomer used is preferably 30% by weight or less based on the total of the monomer components from the viewpoint of adhesion characteristics and the like.

The preparation of the acrylic polymer can be carried out, for example, by a suitable method such as a solution polymerization method, an emulsion polymerization method, a bulk polymerization method or a suspension polymerization method, for a mixture of one or two or more kinds of component monomers. The adhesive layer 52 preferably has a composition for suppressing the content of the low molecular weight substance. From this viewpoint, it is preferable that the acrylic polymer having a weight average molecular weight of 300,000 or more, particularly 400,000 to 3,000,000, is mainly composed of Therefore, the adhesive can also be in an appropriate crosslinked form by internal crosslinking or external crosslinking.

Further, in order to control the crosslinking density of the adhesive layer 52 and improve the pick-up property, for example, a polyfunctional isocyanate compound, a polyfunctional epoxy compound, a melamine compound, a metal salt compound, a metal chelating compound, or an amine can be used. A method of crosslinking treatment by a suitable external crosslinking agent such as a base resin compound or a peroxide; or mixing a low molecular compound having two or more carbon-carbon double bonds, and performing the irradiation by energy rays or the like The appropriate way of coordinating the way. Use external crosslinker In the case of the use of the base polymer to be crosslinked, it is appropriately determined depending on the use as the adhesive. In general, it is preferably blended in an amount of about 20 parts by weight or less, more preferably from 0.1 part by weight to 20 parts by weight, based on 100 parts by weight of the base polymer. Further, from the viewpoint of preventing deterioration or the like, an additive such as various tackifiers or aging inhibitors may be used in the adhesive other than the above-mentioned components.

As the adhesive constituting the adhesive layer 52, a radiation hardening type adhesive is suitable. In the above-mentioned adhesive, the radiation-curable adhesive may be an additive type radiation-curable adhesive in which a radiation curable monomer component or a radiation curable oligomer component is blended.

Examples of the radiation curable monomer component to be blended include, for example, urethane (meth) acrylate, trimethylolpropane tri(meth) acrylate, and tetramethylol methane tetra(methyl). Acrylate, pentaerythritol tri(meth)acrylate, pentaerythritol tetra(meth)acrylate, dipentaerythritol monohydroxypenta(meth)acrylate, dipentaerythritol hexa(meth)acrylate, 1,4-butanediol Di(meth)acrylate and the like. These monomer components can be used alone or in combination of two or more.

Further, examples of the radiation curable oligomer component include various oligomers such as a urethane type, a polyether type, a polyester type, a polycarbonate type, and a polybutadiene type, and the molecular weight thereof is about 100 to 30,000. The scope is appropriate. The blending amount of the radiation hardening monomer component or the oligomer component can appropriately determine the amount by which the adhesive force of the adhesive layer 52 can be lowered depending on the type of the adhesive layer 52. In general, for example, 5 parts by weight based on 100 parts by weight of the base polymer of the acrylic polymer or the like constituting the adhesive. It is about 500 parts by weight, preferably about 70 parts by weight to 150 parts by weight.

Further, the radiation-curable pressure-sensitive adhesive may be used as a base polymer in a side chain or a main chain of a polymer or a carbon-carbon double bond at a terminal end of the main chain, in addition to the radiation-type adhesive of the above-mentioned addition type. An intrinsic type of radiation-curing adhesive. The intrinsic type radiation curable adhesive does not need to contain a low molecular component oligomer component or the like, or has a small content. Therefore, the oligomer component does not move in the adhesive over time, and can form a stable phase. The adhesive layer 52 of the layer structure is preferred.

The base polymer having a carbon-carbon double bond can be used without any particular limitation, and has a carbon-carbon double bond and has adhesiveness. Such a base polymer is preferably an acrylic polymer as a basic skeleton. The basic skeleton of the acrylic polymer may, for example, be an acrylic polymer exemplified above.

The introduction method of the carbon-carbon double bond to the acrylic polymer is not particularly limited, and various methods can be employed. However, it is easy to introduce a carbon-carbon double bond into the polymer side chain in molecular design. For example, a compound having a functional group and an acrylic polymer are copolymerized in advance, and a compound having a functional group capable of reacting with the functional group and a carbon-carbon double bond is maintained, and radiation of a carbon-carbon double bond is maintained. A method of performing a condensation or addition reaction under hardening.

Examples of combinations of such functional groups include a carboxylic acid group and an epoxy group, a carboxylic acid group and an aziridine group, a hydroxyl group and an isocyanate group. In view of the ease of reaction tracking, a combination of a hydroxyl group and an isocyanate group is particularly preferable among the combinations of such functional groups. Further, by the combination of such functional groups, as long as the combination of the acrylic polymer having the carbon-carbon double bond is formed, the functional group is located regardless of the acrylic polymer and the aforementioned compound. In the above preferred combination, it is preferable that the acrylic polymer has a hydroxyl group and the compound has an isocyanate group. In this case, examples of the isocyanate compound having a carbon-carbon double bond include methacryl oxime isocyanate, 2-methacryloxyethyl isocyanate, m-isopropenyl-α, α-dimethylbenzyl. Isocyanate, etc. Further, as the acrylic polymer, an ether compound such as the above-exemplified hydroxyl group-containing monomer or 2-hydroxyethyl vinyl ether, 4-hydroxybutyl vinyl ether or diethylene glycol monovinyl ether can be used. Co-aggregators.

The intrinsic type radiation-curable adhesive may be a base polymer (especially an acrylic polymer) having a carbon-carbon double bond, or may be blended with the radiation curable monomer component or oligomer component. The photopolymerizable compound is such that it does not deteriorate the properties. The blending amount of the photopolymerizable compound is usually in the range of 30 parts by weight or less, preferably 0 to 10 parts by weight based on 100 parts by weight of the base polymer.

When hardened by ultraviolet rays or the like, it is preferred that the radiation-curable adhesive contains a photopolymerization initiator.

In the above acrylic polymer, particularly, an acrylate having a CH ₂ =CHCOOR (wherein R is an alkyl group having 4 to 18 carbon atoms), a hydroxyl group-containing monomer, and a radical reaction in the molecule are contained. The acrylic polymer A composed of an isocyanate compound of a carbon-carbon double bond is preferred.

When the carbon number of the alkyl group of the alkyl acrylate is less than 4, the polarity may be high, the peeling force may become too large, and the pick-up property may fall. another On the other hand, when the alkyl carbon number of the alkyl acrylate exceeds 18, the glass transition temperature of the adhesive layer 52 becomes too high, and the subsequent characteristics at normal temperature are lowered, and as a result, the adhesive layer 4 and the metal layer may be formed during dicing. 3 stripping situation.

The acrylic polymer A may contain units corresponding to other monomer components as needed.

In the acrylic polymer A, an isocyanate compound having a radically reactive carbon-carbon double bond can be used. In other words, the acrylic polymer preferably has a structure in which an isocyanate compound containing a double bond is subjected to an addition reaction with a polymer composed of a monomer composition such as the above acrylate or a hydroxyl group-containing monomer. Therefore, the acrylic polymer preferably has a radical-reactive carbon-carbon double bond in its molecular structure. Thereby, the active energy ray-curable adhesive layer (such as an ultraviolet curable adhesive layer) which is cured by irradiation with an active energy ray (such as ultraviolet rays) can be used, and the peeling of the metal layer 3 and the adhesive layer 52 can be reduced. force.

Examples of the isocyanate compound containing a double bond include methacryl oxime isocyanate, propylene decyl isocyanate, 2-methacryloxyethyl isocyanate, 2-propenyl methoxyethyl isocyanate, and m-isopropenyl group. α,α-dimethylbenzyl isocyanate or the like. The isocyanate compound containing a double bond can be used individually or in combination of 2 or more types.

Further, in the active energy ray-curable adhesive, an external crosslinking agent may be appropriately used in order to adjust the adhesion before the active energy ray irradiation or the adhesion after the active energy ray irradiation. Specific examples of the external crosslinking method include addition of a polyisocyanate compound, an epoxy compound, and nitrogen. A method of reacting a so-called cross-linking agent such as a propidium compound or a melamine-based crosslinking agent.

Examples of the polyisocyanate compound include lower aliphatic polyisocyanates such as 1,2-ethylene diisocyanate, 1,4-butylene diisocyanate, and 1,6-hexamethylene diisocyanate; and cyclopentaisoisocyanate; An alicyclic polyisocyanate such as cyclohexyl diisocyanate, isophorone diisocyanate, hydrogenated toluene diisocyanate, hydrogenated xylene diisocyanate; 2,4-toluene diisocyanate, 2,6-toluene diisocyanate, 4,4 An aromatic polyisocyanate such as -diphenylmethane diisocyanate or xylene diisocyanate, or a trimethylolpropane/toluene diisocyanate trimer adduct (also manufactured by Tosoh Corporation) The product name "CORONATE L"], a trimethylolpropane/hexamethylene diisocyanate trimer [manufactured by Tosoh Corporation, trade name "CORONATE HL"], and the like. Further, examples of the epoxy compound include N,N,N',N'-tetraglycidyl-m-xylylenediamine, diglycidylaniline, and 1,3-bis(N,N-glycidol). Aminomethyl)cyclohexane, 1,6-hexanediol diglycidyl ether, neopentyl glycol diglycidyl ether, ethylene glycol diglycidyl ether, propylene glycol diglycidyl ether, polyethylene glycol diminish Glycerol ether, polypropylene glycol diglycidyl ether, sorbitol polyglycidyl ether, glycerol polyglycidyl ether, pentaerythritol polyglycidyl ether, polyglycerol polyglycidyl ether, sorbitan polyglycidyl ether, trimethylolpropane poly Glycidyl ether, diglycidyl adipate, diglycidyl phthalate, triglycidyl- cis (2-hydroxyethyl) trimeric isocyanate, resorcinol diglycidyl ether, bisphenol- S-diglycidyl ether, in addition, there are two or more molecules in the molecule An epoxy resin such as an epoxy group.

When an external crosslinking agent is used, the amount of the crosslinking agent is appropriately determined depending on the balance of the base polymer to be crosslinked and the use of the adhesive. The amount of the external crosslinking agent used is generally 20 parts by weight or less (preferably 0.1 parts by weight to 10 parts by weight) based on 100 parts by weight of the base polymer. Further, an active energy ray-curable adhesive may be blended with an additive such as various conventionally known tackifiers, aging inhibitors, and foaming agents, in addition to the above-mentioned components, as needed.

Further, in the present invention, the crosslinking treatment may be carried out by using an electron beam or an ultraviolet ray instead of using a crosslinking agent or a crosslinking agent.

The thickness of the adhesive layer 52 is not particularly limited and can be appropriately determined, and is generally about 5 to 200 μm. Further, the adhesive layer 52 may be composed of a single layer or a plurality of layers.

<metal layer 3>

The metal constituting the metal layer 3 is not particularly limited. For example, it contains at least one selected from the group consisting of stainless steel, aluminum, iron, titanium, tin, nickel, and copper, and heat dissipation and warpage prevention of the electronic device package 8 are prevented. The point of view is preferred. Among these, in terms of heat conductivity and heat dissipation, it is particularly preferable to contain copper. Further, from the viewpoint of preventing warpage of the electronic device package 8, it is particularly preferable to contain aluminum.

The thickness of the metal layer 3 is preferably 5 μm or more and less than 200 μm. By becoming 5 μm or more, even if the amount of expansion is increased, it can be suppressed. Since the metal layer is warped or peeled off by the adhesive tape, the interval between the adjacent metal layers can be made large, and the boundary can be easily recognized. Moreover, if it is less than 200 μm, processing is easy, and when it is necessary to bend along the core or the bonding roll during winding or bonding, it is possible to suppress the metal layer from being excessively strong and crease, and the pickup device becomes misidentified. phenomenon.

The surface roughness RzJIS obtained by the ten-point average roughness of the surface of the metal layer 3 on the opposite side to the adhesive layer 4 was less than 5.0 μm. By making the surface roughness RzJIS of the metal layer 3 from the ten-point average roughness less than 5.0 μm, it is possible to suppress the problem that the photographed metal layer 3 is determined to be different from the template by detecting the unevenness of the surface. Therefore, an alignment between the registered template and a single image for picking up the photographed metal layer 3 can be obtained, and the single sheet is recognized as a pickup target. In addition, the surface roughness RzJIS in this specification is the ten-point average roughness prescribed by the JA of JIS B 0601:2013.

As the metal layer 3, a metal foil can be used. The surface roughness RzJIS of the surface of the metal foil which is the surface opposite to the adhesive layer 4 may be an electrolytic foil or a rolled foil as long as it is less than 5.0 μm. In the case of an electrolytic foil, the surface roughness RzJIS can be adjusted by electrolysis conditions (liquid composition/liquid temperature/current/additive, etc.).

The specular gloss of the metal layer 3 at an incident angle of 60 degrees is preferably less than 100%. When the specular gloss is too high, depending on the illumination angle or amount of the pickup device, the reflected light from a single piece or a nearby single piece of the metal layer 3 to be picked up may become glare, and it becomes difficult to recognize the metal layer to be picked up. 3's monolithic shape. If the gloss of the metal layer 3 is less than 100%, then The glare is suppressed, and the shape of the single piece of the metal layer 3 is well recognized. The gloss is a value measured in accordance with JIS Z 8741. The measurement of the gloss can be measured by a commercially available gloss meter, and for example, a gloss meter Handy glossmeter PG-1 manufactured by Nippon Denshoku Co., Ltd., or the like can be used.

When the specular gloss is adjusted, a known surface treatment can be carried out singly or in combination. For example, after roughening treatment such as Cu plating, the roughening particles are miniaturized, the number of roughened particles is increased, and the surface of the roughened particles is smoothed by PR pulse electrolysis or the like. Further, if necessary, alkali immersion treatment may be performed for the purpose of removing the residue of surface contaminants such as a foil-forming additive or smoothing the surface of the roughened particles.

<Binder layer 4>

Next, the agent layer 4 is a film which is previously thinned by an adhesive.

The subsequent agent layer 4 is formed of at least a thermosetting resin, and is preferably formed of at least a thermosetting resin and a thermoplastic resin.

Examples of the thermoplastic resin include natural rubber, butyl rubber, isoprene rubber, chloroprene rubber, ethylene-vinyl acetate copolymer, ethylene-acrylic acid copolymer, ethylene-acrylate copolymer, and polybutylene. Polyene resin, polycarbonate resin, thermoplastic polyimide resin, polyamide resin such as 6-nene or 6,6-nylon, phenoxy resin, acrylic resin, PET (polyethylene terephthalate) A saturated polyester resin such as ester) or PBT (polybutylene terephthalate), a polyamidoximine resin, or a fluororesin. The thermoplastic resin may be used alone or in combination of two or more. Among these thermoplastic resins, there are few ionic impurities and excellent stress relaxation properties. In view of the fact that the acrylic resin has both flexibility and strength and high toughness, the phenoxy resin is particularly preferable because it can easily ensure the reliability of the semiconductor element from various viewpoints.

The acrylic resin is not particularly limited, and one or two or more kinds of esters of acrylic acid or methacrylic acid having a linear or branched alkyl group having a carbon number of 30 or less (preferably having 1 to 18 carbon atoms) may be mentioned. a polymer such as a component. That is, in the present invention, the acrylic resin has a broad meaning including methacrylic resin. The aforementioned alkyl group may, for example, be methyl, ethyl, propyl, isopropyl, n-butyl, t-butyl, isobutyl, pentyl, isopentyl, hexyl, heptyl or 2-ethylhexyl. , octyl, isooctyl, decyl, isodecyl, decyl, isodecyl, undecyl, dodecyl (lauryl), tridecyl, tetradecyl, stearyl, Octadecyl and the like.

Further, the other monomer for forming the acrylic resin (a monomer other than the alkyl ester of acrylic acid or methacrylic acid having an alkyl group having 30 or less carbon atoms) is not particularly limited, and examples thereof include acrylic acid and methacrylic acid. a carboxyl group-containing monomer such as carboxyethyl acrylate, carboxy amyl acrylate, isaconic acid, maleic acid, fumaric acid or crotonic acid; an anhydride monomer such as maleic anhydride or isocanic anhydride; (meth)acrylic acid 2-hydroxyethyl ester, 2-hydroxypropyl (meth)acrylate, 4-hydroxybutyl (meth)acrylate, 6-hydroxyhexyl (meth)acrylate, 8-hydroxyoctyl (meth)acrylate, a hydroxyl group-containing monomer such as 10-hydroxydecyl (meth)acrylate, 12-hydroxylauryl (meth)acrylate or (4-hydroxymethylcyclohexyl)-methyl acrylate; styrenesulfonic acid, allylic Sulfonic acid, 2-(methyl) propylene decylamine-2-methylpropane sulfonic acid, (meth) acrylamide propylene sulfonic acid, a sulfonic acid group-containing monomer such as sulfopropyl (meth)acrylate or (meth)acryloxynaphthalenesulfonic acid; a phosphate group-containing monomer such as 2-hydroxyethyl acryloylphosphoryl phosphate or propylene Nitrile and the like. Further, (meth)acrylic means acrylic acid and/or methacrylic acid, and (meth) of the present invention has the same meaning.

Further, examples of the thermosetting resin include an epoxy resin and a phenol resin, and examples thereof include an amine resin, an unsaturated polyester resin, a polyurethane resin, a polyoxyl resin, and a thermosetting polyimide resin. Wait. The thermosetting resin may be used alone or in combination of two or more. As the thermosetting resin, an epoxy resin having a small content such as ionic impurities which corrode the semiconductor element is particularly preferable. Further, as the curing agent for the epoxy resin, a phenol resin can be suitably used.

The epoxy resin is not particularly limited, and for example, a bisphenol A type epoxy resin, a bisphenol F type epoxy resin, a bisphenol S type epoxy resin, a brominated bisphenol A type epoxy resin, or a hydrogenated bisphenol A type can be used. Epoxy resin, bisphenol AF type epoxy resin, biphenyl type epoxy resin, naphthalene type epoxy resin, bismuth type epoxy resin, phenol novolak type epoxy resin, o-cresol novolac type epoxy resin, ginseng a difunctional epoxy resin or a polyfunctional epoxy resin such as a hydroxyphenylmethane type epoxy resin or a tetraphenol ethane type epoxy resin; or an intramethylene urea type epoxy resin or a diglycidyl isocyanurate type Epoxy resin such as epoxy resin or glycidylamine epoxy resin.

As the epoxy resin, in particular, a novolac type epoxy resin, a biphenyl type epoxy resin, a parahydroxyphenylmethane type epoxy resin, or a tetraphenol ethane type epoxy resin is preferable. Therefore, the epoxy resin is rich in reactivity with a phenol resin as a curing agent, and is excellent in heat resistance and the like.

Further, the phenol resin acts as a curing agent for the epoxy resin, and examples thereof include a phenol novolak resin, a phenol aralkyl resin, a cresol novolak resin, a tert-butyl phenol novolak resin, and a nonylphenol phenol aldehyde. A novolac type phenol resin such as a varnish resin; a polyoxystyrene such as a novolac type phenol resin or a polyoxypoxy styrene. The phenol resin may be used alone or in combination of two or more. Among these phenol resins, a phenol novolak resin and a phenol aralkyl resin are particularly preferred. This is because the connection reliability of the semiconductor device can be improved.

The blending ratio of the epoxy resin and the phenol resin is, for example, suitably blended in such a manner that the hydroxyl group in the phenol resin is from 0.5 equivalent to 2.0 equivalents per equivalent of the epoxy group in the epoxy resin component. More preferably, it is 0.8 equivalents to 1.2 equivalents. In other words, when the blending ratio of the two is outside the above range, a sufficient hardening reaction is not performed, and the properties of the cured epoxy resin are likely to deteriorate.

Further, it is also possible to use a thermosetting epoxy resin and a phenol resin to promote the catalyst. The thermosetting-promoting catalyst is not particularly limited and can be used by appropriately selecting a known thermal hardening-promoting catalyst. The thermosetting-suppressing catalyst can be used singly or in combination of two or more. As the thermosetting-promoting catalyst, for example, an amine-based curing accelerator, a phosphorus-based curing accelerator, an imidazole-based curing accelerator, a boron-based curing accelerator, a phosphorus-boron-based curing accelerator, or the like can be used.

As the curing agent for the epoxy resin, as described above, a phenol resin is preferably used, but a known curing agent such as an imidazole, an amine or an acid anhydride may be used.

The agent layer 4 has an adherend 9 for an electronic device or the like. Subsequent (adhesion) is important. Therefore, in order to crosslink the adhesive layer 4 to some extent in advance, a polyfunctional compound that reacts with a functional group at the end of the molecular chain of the polymer or the like may be added in advance as a crosslinking agent. Thereby, the subsequent characteristics at a high temperature can be improved, and the heat resistance can be improved.

The crosslinking agent is not particularly limited, and a known crosslinking agent can be used. Specifically, examples thereof include an isocyanate crosslinking agent, an epoxy crosslinking agent, a melamine crosslinking agent, and a peroxide crosslinking agent, and a urea crosslinking agent and a metal alkoxide system are also mentioned. Cross-linking agent, metal-clamping crosslinking agent, metal salt-based crosslinking agent, carbodiimide crosslinking agent, oxazoline crosslinking agent, aziridine crosslinking agent, amine crosslinking agent Wait. As the crosslinking agent, an isocyanate crosslinking agent or an epoxy crosslinking agent is suitable. Further, the above-mentioned crosslinking agents may be used alone or in combination of two or more.

Further, in the present invention, the crosslinking treatment may be carried out by using an electron beam or an ultraviolet ray instead of using a crosslinking agent or a crosslinking agent.

In the subsequent agent layer 4, other additives may be appropriately blended as needed. Examples of the other additives include a filler (filler), a flame retardant, a decane coupling agent, and an ion scavenger, and examples thereof include an extender, an aging preventive, an antioxidant, and a surfactant.

As the filler, an inorganic filler or an organic filler may be used, and an inorganic filler is preferred. The adhesion of the filler such as an inorganic filler can improve the thermal conductivity, adjust the elastic modulus, and the like in the adhesive layer 4. Examples of the inorganic filler include ceramics such as cerium oxide, clay, gypsum, calcium carbonate, barium sulfate, aluminum oxide, cerium oxide, cerium carbide, aluminum nitride, and cerium nitride; aluminum, copper, silver, gold, and nickel. Various kinds of inorganic powders such as metals such as chromium, lead, tin, zinc, palladium, and solder, or alloys and other carbons. The filler may be used alone or in combination of two or more. As the filler, cerium oxide or aluminum oxide is particularly preferable, and cerium oxide is particularly preferred as molten cerium oxide. Further, the average particle diameter of the inorganic filler is preferably in the range of 0.001 μm to 80 μm . The average particle diameter of the inorganic filler can be measured, for example, by a laser diffraction type particle size distribution measuring apparatus. In the present invention, the average particle diameter means a particle diameter when the cumulative volume in the particle size distribution is 50%.

The blending amount of the filler (especially the inorganic filler) is preferably 98% by weight or less (0% by weight to 98% by weight) based on the organic resin component, and particularly preferably 0 in the case of cerium oxide. The functional inorganic filler such as weight% to 70% by weight, heat conduction or electric conductivity is preferably 10% by weight to 98% by weight.

Further, examples of the flame retardant include antimony trioxide, antimony pentoxide, and brominated epoxy resin. The flame retardant may be used alone or in combination of two or more. The decane coupling agent may, for example, be β-(3,4-epoxycyclohexyl)ethyltrimethoxydecane, γ-glycidoxypropyltrimethoxydecane, γ-glycidoxypropylmethyldi Ethoxy decane and the like. The decane coupling agent may be used alone or in combination of two or more. Examples of the ion scavenger include hydrotalcites, barium hydroxide, and the like. The ion scavenger may be used alone or in combination of two or more.

The adhesive layer 4 is particularly preferably composed of (A) epoxy resin, (B) hardener, (C) acrylic resin or phenoxy resin, and (D) surface-treated from the viewpoint of adhesion and reliability. Inorganic filler.

By using (A) an epoxy resin, high adhesiveness, water resistance, and heat resistance can be obtained. As the epoxy resin, the above-mentioned known epoxy resin can be used. (B) A hardener can be used as the above-mentioned known hardener.

(C) The acrylic resin has high flexibility as well as flexibility and strength. A preferred acrylic resin is a Tg (glass transition temperature) of -50 ° C to 50 ° C, and a monomer having an epoxy group, a glycidyl group, an alcoholic hydroxyl group, a phenolic hydroxyl group or a carboxyl group as a crosslinkable functional group. The resulting (meth)acrylic copolymer containing a crosslinkable functional group. Further, when acrylonitrile or the like is contained to exhibit rubber properties, higher toughness can be obtained.

Further, the (C) phenoxy resin has a molecular chain length similar to that of an epoxy resin, and acts as a flexible material in a composition having a high crosslinking density, thereby imparting high toughness. High strength but strong composition. A preferred phenoxy resin is a bisphenol A type as a main skeleton, and other commercially available phenoxy resins such as bisphenol F type phenoxy resin, bisphenol A/F mixed phenoxy resin or brominated phenoxy resin may be mentioned. As a better.

(D) The surface-treated inorganic filler may, for example, be an inorganic filler surface-treated with a coupling agent. As the inorganic filler, the above-mentioned known inorganic fillers such as cerium oxide or aluminum oxide can be used. The dispersibility of the inorganic filler is good by surface treatment with a coupling agent. Therefore, an adhesive layer having excellent fluidity can be obtained, so that the adhesion to the metal layer 3 can be improved. Further, since the inorganic filler can be made highly filled, the water absorption rate can be lowered and the moisture resistance can be improved.

For example, the surface treatment of the inorganic filler by the decane coupling agent is carried out by dispersing the inorganic filler in the decane coupling by a known method. In the solution, a sterol group obtained by hydrolyzing a hydroxyl group present on the surface of the inorganic filler with an alkoxy group such as a decane coupling agent is reacted to form a Si-O-Si bond on the surface of the inorganic filler. Come on.

The thickness of the adhesive layer 4 is not particularly limited, but is preferably 3 μm or more, and more preferably 5 μm or more from the viewpoint of sufficiently adhering the metal layer to the adherend, and in order to contribute to thinning of the semiconductor package, It is preferably 150 μm or less, more preferably 100 μm or less. The subsequent agent layer 4 may be composed of a single layer or a plurality of layers.

Further, the adhesive layer 4 preferably has a loss tangent tan δ of 0.4 or more at 25 ° C and 50% RH. Further, the loss tangent tan δ of the adhesive layer 4 at 25 ° C and 50% RH is preferably 3 or less.

The loss tangent tan δ was measured by a dynamic viscoelasticity measuring device, which was heated at a temperature rising rate of 5 ° C/min at 0 ° C, and measured at a measurement frequency of 1 Hz, and reached a value at 25 ° C.

When the loss tangent tan δ of the adhesive layer 4 at 25 ° C and 50% RH is 0.4 or more, the adhesive layer 4 can alleviate the stress caused by the tipping of the pick-up device. Therefore, even if the amount of jacking of the plug is increased, it is possible to suppress the occurrence of the tip of the metal layer 3. When the loss tangent tan δ is 3 or less, the responsiveness of the insertion tip is not impaired, and it can be picked up satisfactorily.

When the loss tangent tan δ is high, a low molecular weight component such as an epoxy resin or a phenol resin can be obtained, and a high molecular weight component such as an acrylic resin can be made small. Further, when the filler is blended, the filler blending amount may be small.

Further, the adhesion layer 4 adheres to the metal layer 3 in the B-stage (unhardened state or semi-hardened state) (23 ° C, peeling angle) 180 degrees, line speed 300 mm/min) is preferably 0.3 N/25 mm or more, more preferably 0.5 N/25 mm or more, and still more preferably 1.0 N/25 mm or more. When the adhesion is less than 0.3 N/25 mm, when the singulated sample is expanded, peeling occurs between the adhesive layer 4 and the metal layer 3.

The water absorption rate of the layer 4 is preferably 1.5 vol% or less. The method of measuring the water absorption rate is as follows. That is, a 50×50 mm adhesive layer 4 (film-like adhesive) was used as a sample, and the sample was dried in a vacuum dryer at 120° C. for 3 hours, and then allowed to cool in a desiccator, and the dry mass was measured as M1. The sample was immersed in distilled water at room temperature for 24 hours, and then taken out, and the surface of the sample was wiped with a filter paper and quickly weighed to obtain M2. The water absorption rate is calculated by the following formula (1).

Water absorption rate (vol%) = [(M2-M1) / (M1/d)] × 100 (1) Here, d is the density of the film.

When the water absorption rate exceeds 1.5 vol%, there is a problem that a package crack occurs during solder reflow due to moisture absorption.

The saturated moisture absorption rate of the layer 4 is preferably 1.0 vol% or less. The method for measuring the saturated moisture absorption rate is as follows. That is, a circular adhesive layer 4 (film-like adhesive) having a diameter of 100 mm was used as a sample, and the sample was dried in a vacuum dryer at 120 ° C for 3 hours, and after cooling in a desiccator, the dry mass was measured. As M1. The sample was absorbed for 168 hours in a constant temperature and humidity chamber at 85 ° C and 85% RH, and then taken out and quickly weighed as M2. The saturated moisture absorption rate is calculated by the following formula (2).

Saturated moisture absorption rate (vol%) = [(M2-M1) / (M1/d)] × 100 (2) Here, d is the density of the film.

When the saturated moisture absorption rate exceeds 1.0 vol%, the value of the vapor pressure is increased due to moisture absorption during reflow, and good reflow characteristics cannot be obtained.

The residual volatile component of the layer 4 is preferably 3.0% by weight or less. The method for measuring the residual volatile component is as follows. That is, a 50×50 mm adhesive layer 4 (film adhesive) is used as a sample, and the initial mass of the sample is measured. As M1, the sample is heated in a hot air circulation thermostat at 200° C. for 2 hours, and then weighed and As M2. The residual volatile component is calculated by the following formula (3).

Residual volatile components (wt%) = [(M2-M1)/M1] × 100 (3)

When the residual volatile component exceeds 3.0% by weight, the solvent is volatilized by heating during the encapsulation, and pores are formed inside the adhesive layer 4 to cause cracking of the package.

Further, when the adhesive layer 5 and the metal layer 3 are picked up by the adhesive tape 5, the adhesive force between the adhesive tape 5 and the adhesive layer 4 is 0.03 to 0.5 N/25 mm. Since the adhesion between the adhesive tape 5 and the adhesive layer 4 in the state in which the adhesive layer 4 and the metal layer 3 are picked up by the adhesive tape 5, the adhesive layer 52 of the adhesive tape 5 is formed of a radiation-curable adhesive. When the adhesive tape 5 is irradiated with radiation to lower the adhesive force, and the adhesive layer 4 and the metal layer 3 are picked up, the adhesive force after radiation irradiation is obtained.

Adhesive force is adhered to the adhesive tape 5 cut into a width of 25 mm in an environment of 23 ° C and 50% RH according to JIS Z0237, and the peeling angle is 180° and peeled off using a universal tensile tester. The speed was measured at 300 mm/min.

To make the adhesion force into the above range, the adhesive tape can be adjusted 5 The adhesive or surface energy of each of the adhesive layer 52 or the adhesive layer 4, or a combination thereof.

When the adhesive force of the adhesive tape 5 and the adhesive layer 4 is 0.5 N/25 mm or less, when the adhesive layer 5 and the metal layer 3 are picked up by the adhesive tape 5, even if the jacking speed or the jacking amount of the plug is lowered, the metal layer is The force imparted is small and can be picked up, so that it is possible to suppress the occurrence of the tip of the metal layer 3. When the adhesive force between the adhesive tape 5 and the adhesive layer 4 is 0.03 N/25 mm or more, when the metal layer 3 and the adhesive layer 4 are expanded, the metal layer 3 and the adhesive layer 4 are not peeled off by the adhesive tape 5, and the system is good. The ground is kept.

Next, an example of a method of manufacturing the tape 1 for electronic device packaging of the present embodiment will be described. First, an elongated metal layer 3 is prepared. As long as the metal layer 3 is a commercially available metal foil. Next, as shown in FIG. 4(A), the metal layer 3 is bonded to the adhesive surface of the elongated base tape 2 by using a bonding roll r or the like.

Further, an adhesive film layer 4 having an elongated film shape is formed. The subsequent agent layer 4 can be formed by a conventional method of forming a film-like layer by formulating a resin composition. Specifically, for example, the resin composition is applied to a suitable separator (release paper or the like) and dried (heat curing is necessary, and the like, if necessary, dried by heat treatment) to form an adhesive. The method of layer 4 and the like. The resin composition may be a solution or a dispersion.

Next, as shown in FIG. 4(B), the adhesive layer 4 peeled off by the separator is bonded to the metal layer 3 bonded to the base tape 2 by using a bonding roll r or the like.

Furthermore, the above-mentioned substrate tape 2 is attached to the metal layer 3 Thereafter, the adhesive layer 4 is bonded to the metal layer 3, but the metal layer 3 and the adhesive layer 4 may be bonded to each other, and then the surface of the metal layer 3 may be bonded to the base tape 2.

Next, as shown in FIG. 4(C), the adhesive layer 4 and the metal layer 3 are pre-cut into a specific shape (here, a circular shape) using a press cutter or the like, as shown in FIG. 4(D), The peripheral portion 6 is removed by peeling off the substrate tape 2. Further, the pre-cutting is not limited to the above, and the bonding layer 4 and the metal layer 3 may be preliminarily formed into a specific size corresponding to the size of the semiconductor wafer C or the like using a lattice-shaped cutting tooth having a circular outer shape. .

Further, the method of forming the metal layer 3 and the adhesive layer 4 having a specific shape on the base tape 2 is not limited to the above, and the elongated metal layer 3 can be bonded to the elongated base tape 2 and punched. After the unnecessary portion 6 is removed for a specific shape, the adhesive layer 4 formed into a specific shape is attached to the metal layer 3 of a specific shape, and the metal layer 3 and the adhesive layer 4 which are each formed into a specific shape in advance may be used. It is bonded to the base tape 2, but it is preferable to manufacture by the procedure shown in the above-mentioned FIG. 4 (A) - (D) from the simplicity of a manufacturing process.

Further, an adhesive tape 5 was separately prepared. The base film can be formed by a conventionally known film forming method. The film forming method may, for example, be a calendering film forming method, a casting method in an organic solvent, an inflation extrusion method in a closed system, a T-die extrusion method, a co-extrusion method, a dry lamination method, or the like. Next, an adhesive layer composition is applied onto the base film 51 and dried (heat-crosslinking as needed) to form an adhesive layer 52. Coating methods include roll coating, screen coating, Gravure coating, etc. Further, the adhesive layer composition may be directly applied to the base film, the adhesive layer 52 may be formed on the base film 51, or the adhesive layer composition may be applied to the surface and peeled off. After the adhesive layer 52 is formed by paper or the like, the adhesive layer is transferred to the base film 51. Thereby, the adhesive tape 5 in which the adhesive layer 52 was formed on the base film 51 was produced.

Thereafter, as shown in FIG. 5(A), the adhesive layer layer side of the adhesive tape 5 is applied to the surface of the metal layer 3 of the specific shape provided on the base tape 2 and the adhesive layer 4 side of the adhesive layer 4. The adhesive tape 5 is laminated in a manner of face contact of 52.

Next, as shown in FIG. 5(B), the adhesive tape 5 is pre-cut into a specific shape using a press cutter or the like, and as shown in FIG. 5(C), the peripheral unnecessary portion 7 is peeled off from the base tape 2 The tape 1 for electronic device packaging is removed. Further, after that, the base tape 2 used for the pre-cut processing may be peeled off, and the known separator may be bonded to the adhesive layer 52 of the adhesive tape 5.

<How to use>

Next, a method of manufacturing the electronic device package 8 using the tape 1 for electronic device packaging of the present embodiment will be described with reference to FIGS. 6 to 8. Further, in the present embodiment, the electronic device package 8 will be described by taking a semiconductor wafer C which is flip-chip bonded to the adherend 9 as an example.

[Assembly Step of Semiconductor Wafer W]

First, a separate dicing tape D similar to the adhesive tape 5 of the tape 1 for electronic device packaging of the present invention is prepared, and a semiconductor wafer W is attached to the central portion of the dicing tape D as shown in FIG. 6(A). The adhesive tape is held and fixed (the assembly step of the semiconductor wafer W), and the annular frame R is bonded to the peripheral edge portion of the dicing tape D. At this time, the dicing tape D is attached to the back surface of the semiconductor wafer W. The back surface of the semiconductor wafer W means a surface opposite to the circuit surface (also referred to as a non-circuit surface, a non-electrode forming surface, etc.). The attachment method is not particularly limited, and is preferably a method of heating and crimping. The pressure bonding is usually performed by pressing by a pressing means such as a pressure roller.

[Cutting step of semiconductor wafer W]

Next, as shown in FIG. 6(B), the semiconductor wafer W is cut. Thereby, the semiconductor wafer W is cut into a specific size and diced (small-sized) to manufacture the semiconductor wafer C. The dicing is performed, for example, from the circuit surface side of the semiconductor wafer W in accordance with a general method. Moreover, in this step, for example, a cutting method called full cut that cuts into the dicing tape D can be used. The cutting device used in this step is not particularly limited, and a conventionally known one can be used. Further, when the expansion of the dicing tape D is performed, the expansion can be performed using a conventionally known expansion device.

[Pickup Step of Semiconductor Chip C]

As shown in FIG. 6(C), the semiconductor wafer C is picked up, and the semiconductor wafer C is peeled off from the dicing tape D. The method of picking up is not particularly limited, and various methods known in the art can be employed. For example, a semiconductor will be bonded The dicing tape D of the wafer C and the annular frame R is placed on the stage S of the pick-up device with the substrate film side facing downward, and the hollow cylindrical shape ejector member is fixed in the state of fixing the annular frame R. T rises and expands the cutting tape D. In this state, a method in which the individual semiconductor wafers C are lifted up from the base film side of the dicing tape D by the nip N, and the semiconductor wafer C that is lifted up is picked up by the pickup device can be cited.

[Crystalline connection step]

As shown in FIG. 6(D), the semiconductor wafer C that has been picked up is fixed to the adherend 9 such as a substrate by a flip chip bonding method (flip-chip bonding method). Specifically, the semiconductor wafer C is fixed to the adhered film in accordance with a general method in a form in which the circuit surface (also referred to as a surface, a circuit pattern forming surface, an electrode forming surface, and the like) of the semiconductor wafer C is opposed to the adherend 9 . Body 9. For example, first, the flux is attached to the bump 10 as a connection portion formed on the circuit surface side of the semiconductor wafer C. Then, the bumps 10 of the semiconductor wafer C are brought into contact with the bonding conductive material 11 (such as solder) bonded to the connection pads of the adherend 9, and the bumps 10 and the conductive material 11 are melted while being pressed. The semiconductor wafer C is electrically connected to the adherend 9 to fix the semiconductor wafer C to the adherend 9 (the flip chip bonding step). At this time, a gap is formed between the semiconductor wafer C and the adherend 9, and the distance between the gaps is generally about 30 μm to 300 μm . The flux remaining in the opposite surface or gap of the semiconductor wafer C and the adherend 9 is washed and removed.

As the adherend 9, a lead frame or a circuit substrate can be used Various substrates such as (wiring circuit board, etc.). The material of such a substrate is not particularly limited, and examples thereof include a ceramic substrate or a plastic substrate. Examples of the plastic substrate include an epoxy resin substrate, a bismaleimide triazine substrate, and a polyimide substrate. Further, by using another semiconductor wafer as the adherend 9 and flip-chip bonding the semiconductor wafer C, it is possible to form a chip on chip.

Next, as shown in FIG. 7(A), the base tape 2 of the tape 1 for electronic device packaging of the present embodiment is peeled off, and the adhesive layer 52 of the metal layer 3 and the adhesive tape 5 is exposed, and the adhesive layer 52 is exposed. The peripheral portion is fixed to the annular frame R.

Next, as shown in FIG. 7(B), the metal layer 3 and the adhesive layer 4 are cut into pieces corresponding to the size of the semiconductor wafer C. The cutting can be performed by the same steps as the cutting step of the semiconductor wafer W described above. In the case where the pre-cut processing for pre-single the metal layer 3 and the adhesive layer 4 is performed, this step is not performed.

Next, as shown in FIG. 7(C), the singulated metal layer 3 and the adhesive layer 4 are picked up and peeled off by the adhesive tape 5. The pickup can be performed by the same steps as the pickup step of the above-described semiconductor wafer C.

Next, the side of the adhesive layer 4 of the picked-up metal layer 3 and the adhesive layer 4 is bonded to the back surface of the flip-chip bonded semiconductor wafer C as shown in FIG. Thereafter, a sealing material (a sealing resin or the like) is filled in the periphery of the semiconductor wafer C with the metal layer 3 and the gap between the semiconductor wafer C and the adherend 9 to be sealed. The sealing system is carried out in accordance with a general method. At this time, since the metal layer 3 is provided on the back surface of the semiconductor wafer C, it is overcoated. The warpage caused by the difference in thermal expansion coefficient between the semiconductor wafer C and the adherend 9 in the crystal bonding step is offset by the difference in thermal expansion coefficient between the semiconductor wafer C and the metal layer 3. Further, since the metal layer 3 is provided on the back surface of the semiconductor wafer C, heat generated during use as an electronic device is radiated by the metal layer 3.

In the above description, the metal layer 3 is directly provided on the back surface of the semiconductor wafer C via the adhesive layer 4, and the metal layer 3 is also sealed together with the semiconductor wafer C. However, after the semiconductor wafer C is sealed, The metal layer 3 is provided on the upper surface of the sealing body via the adhesive layer 4. Since the electronic device package 8 is warped even when it is sealed, the warpage at the time of sealing can be offset by providing the metal layer 3 on the upper side surface of the sealing body.

In addition, the semiconductor wafer C which is flip-chip bonded to the adherend 9 is described as an example of the electronic device package 8. However, the present invention is not limited thereto. For example, other semiconductor wafers of the same size are laminated on the semiconductor wafer. In the electronic device package structure, in order to use the metal layer 3 of the tape 1 for electronic device packaging of the present invention as a spacer between the two wafers, the metal layer 3 may be provided on the semiconductor wafer on the lower side via the adhesive layer 4.

<Example>

Next, in order to clarify the effects of the present invention, the examples and comparative examples will be described in detail, but the present invention is not limited to the examples.

(1) Production of adhesive tape <Adhesive layer composition (1)>

The acrylic copolymer (A1) having a functional group is prepared by 2-ethylhexyl acrylate, 2-hydroxyethyl acrylate and acrylic acid, and the ratio of 2-ethylhexyl acrylate is 80 mol%. A copolymer having a mass average molecular weight of 700,000. Next, 2-isocyanatoethyl methacrylate was added so that the iodine value became 15 to prepare an acrylic copolymer having a glass transition temperature of -70 ° C, a hydroxyl group of 20 mgKOH/g, and an acid value of 5 mgKOH/g (a- 1).

To 100 parts by mass of the acrylic copolymer (a-1), 10 parts by mass of CORONATE L (manufactured by Tosoh Corporation) as a polyisocyanate was added, and Irgacure 184 (BASF) as a photopolymerization initiator was added. A mixture of 3 parts by mass of the company was dissolved in ethyl acetate and stirred to obtain an adhesive layer composition (1).

<Adhesive layer composition (2)>

The acrylic copolymer (A1) having a functional group is prepared from butyl acrylate, 2-ethylhexyl acrylate, 2-hydroxyethyl acrylate and acrylic acid, and the ratio of 2-ethylhexyl acrylate is 50 mol%, an acrylic copolymer (a-2) having a mass average molecular weight of 650,000, a glass transition temperature of -60 ° C, a hydroxyl value of 25 mgKOH/g, and an acid value of 6 mgKOH/g.

To 100 parts by mass of the acrylic copolymer (a-2), a mixture of 10 parts by mass of CORONATE L (manufactured by Tosoh Corp.) as a polyisocyanate was added, dissolved in ethyl acetate, and stirred to obtain an adhesive. Layer composition (2).

<Adhesive layer composition (3)>

To 100 parts by mass of the acrylic copolymer (a-2), a mixture of 8 parts by mass of CORONATE L (manufactured by Tosoh Corp.) as a polyisocyanate was added, dissolved in ethyl acetate, and stirred to obtain an adhesive. Layer composition (3).

As the base film, the following were produced.

<Substrate film (1)>

A resin bead of a mixture of polypropylene PP and thermoplastic elastomer HSBR (PP: HSBR = 80: 20) was melted at 200 ° C, and formed into an elongated film having a thickness of 80 μm using an extruder to prepare a base film ( 1). For the polypropylene PP, F-300SP (trade name) manufactured by Idemitsu Petrochemical Co., Ltd. and thermoplastic elastomer HSBR manufactured by JSR Co., Ltd. were used as DYNARON 1320P (trade name) manufactured by JSR Co., Ltd.

<Adhesive tape (1)>

The adhesive layer composition (1) was applied to a release liner formed of a release-treated polyethylene terephthalate film so as to have a thickness of 10 μm after drying. After drying at 110 ° C for 3 minutes to form an adhesive layer, it was bonded to the base film (1) to prepare an adhesive tape (1).

<Adhesive tape (2)>

In addition to the use of the adhesive layer composition (2), the adhesive tape (1) Adhesive tape (2) was produced in the same manner.

<Adhesive tape (3)>

An adhesive tape (3) was produced in the same manner as the adhesive tape (1) except that the adhesive layer composition (3) was used.

(2) Fabrication of the adhesive layer <Binder layer (1)>

80 parts by mass of an acrylic resin (manufactured by Nagase ChemteX Co., Ltd., trade name "Teisanresin SG-P3", Mw 850,000, Tg 12 ° C), and a naphthalene type epoxy resin (manufactured by DIC Corporation, trade name "HP-4700") 10 parts by mass of 10 parts by mass of a phenol resin (manufactured by Megumi Kasei Co., Ltd., trade name "MEH7851") as a curing agent, dissolved in methyl ethyl ketone, and a solution of an adhesive layer composition was prepared. The adhesive layer composition solution was applied onto a release-treated film (release liner) made of a polyethylene terephthalate film having a thickness of 50 μm which was subjected to polyfluorene oxygen stripping treatment, and then dried at 130 ° C. Dry for 5 minutes. Thereby, an adhesive layer (1) having a thickness of 20 μm was produced.

<Binder layer (2)>

100 parts by mass of bisphenol A type phenoxy resin (manufactured by Nippon Steel & Sumitomo Chemical Co., Ltd., trade name "YP-50S", Mw 60,000, Tg84 ° C), and cresol novolak type epoxy resin (Japanese chemical) Co., Ltd., product name "EOCN-1020", epoxy equivalent 198, softening point 64 °C) 40 parts by mass, liquid bisphenol A type epoxy resin (Nippon Steel & Sumitomo Chemical Co., Ltd., trade name "YD- 128", Mw400, epoxy equivalent 190) 100 parts by mass, imidazole as a curing agent (manufactured by Shikoku Chemicals Co., Ltd., trade name "2PHZ-PW") 1.5 parts by mass, ruthenium dioxide filler (Admatechs Co., Ltd.) 20 parts by mass of a product name "SO-C2" and an average particle diameter of 0.5 μm) was dissolved or dispersed in methyl ethyl ketone to prepare a solution of a binder layer composition. Using the adhesive layer composition solution, an adhesive layer (2) having a thickness of 20 μm was produced in the same manner as the adhesive layer (1).

As the metal layer, the following are prepared.

<metal layer (1)>

F3-WS (Furukawa Electric Industry, copper foil, thickness 12μm, surface roughness RzJIS2.8μm)

<metal layer (2)>

GTS (Furukawa Electric Industry, copper foil, thickness 9μm, surface roughness RzJIS6.0μm)

<metal layer (3)>

1085 (UACJ, aluminum foil, thickness 20μm, surface roughness RzJIS1.9μm)

<metal layer (4)>

1085 (UACJ, aluminum foil, thickness 20μm, surface roughness RzJIS4.9μm)

<metal layer (5)>

SUS304 (Nippon Steel Living Materials, stainless steel foil, thickness 20μm, surface roughness RzJIS2.1um)

<metal layer (6)~(11)>

The electrolytic copper foil having a thickness of 35 μm, a gloss of 230% on the M surface, and a gloss of 100% on the S surface was degreased/acid washed, and then subjected to roughening treatment, PR pulse electrolysis, and alkali under the conditions shown in Tables 1 and 2 below. The metal layer (6) to (11) are prepared by immersion treatment.

Further, in the metal layers (1) to (11), the surface roughness RzJIS is the surface roughness RzJIS obtained from the ten-point average roughness of the surface of the metal layer which is not bonded to the adhesive layer. Further, in the metal layers (6) to (11), the glossiness is not adhered to the adhesive layer in accordance with JIS Z 8741, and the metal layer measured by the gloss meter Handy glossmeter PG-1 manufactured by Nippon Denshoku Co., Ltd. is used. The specular gloss at 60 degrees of incidence.

(5) Fabrication of tape for electronic device packaging <Example 1>

The adhesive layer (1) formed on the release liner and the metal layer (1) were bonded together under the conditions of a bonding angle of 120°, a pressure of 0.2 MPa, and a speed of 10 mm/s to prepare a single-sided film. The adhesive tape (1) is pre-cut into a circular shape so as to be conformable to the annular frame, and the single-sided adhesive film is pre-cut into a circular shape smaller than the adhesive tape (1). Adhesive layer (1) exposed on the release-treated film of the single-sided adhesive film and the adhesive layer of the adhesive tape (1) are adhered to each other so as to expose the adhesive layer around the single-sided film. A tape for packaging an electronic device of Example 1 as shown in FIG. 1 was produced.

<Examples 2 to 12, Comparative Example 1>

The electronic device packages of Examples 2 to 12 and Comparative Example 1 were produced by the same method as in Example 1 except that the combination of the adhesive tape, the adhesive layer composition, and the metal layer was the combination described in Tables 3 and 4. Glue band.

The following measurement and evaluation were performed on the tapes for electronic device packaging of Examples 1 to 12 and Comparative Example 1. The results are shown in Tables 3 and 4.

(adhesion of adhesive tape to adhesive layer)

The adhesive layer of each of the examples and the comparative examples was peeled off from the release liner, and a shape-retaining tape (manufactured by Sekisui Chemical Co., Ltd., trade name "Forte") was attached to the surface of the adhesive layer by a roll of 2 kg. A strip having a width of 25 mm was cut out, and a test piece in which a base film, an adhesive layer, an adhesive layer, and a shape-retaining tape were laminated in this order was prepared. Among the test pieces produced, Examples 1, 3, 4, and 7 to 12 were irradiated with ultraviolet rays of 200 mJ/cm ² by an air-cooled high-pressure mercury lamp (80 W/cm, irradiation distance of 100 mm). After that, Strograph (trade name "VE10" manufactured by Toyo Seiki Co., Ltd.) is divided into a laminate of "base film and adhesive layer" and a laminate of "adhesive layer and shape-retaining tape". The adhesion between the adhesive layer and the adhesive layer was measured at a line speed of 300 mm/min. Furthermore, the unit of adhesion is [N/25mm]. The measurement was carried out by a 180° peeling method, and the measurement temperature was 23° C., and the measurement humidity was 50%. Further, the laminate of the "base film and the adhesive layer" and the laminate of the "adhesive layer and the shape-retaining tape" are peeled off from the "base film and the adhesive layer". "Adhesive layer and shape-retaining tape" Therefore, if the adhesive layer is only peeled off, the adhesive layer may be stretched.

(loss of tantalum layer tangent tan δ)

The adhesive layers of the respective examples and comparative examples were cut into a size of 5.0 cm × 5.0 cm, laminated, and bonded on a hot plate at 70 ° C on a loading table with a hand roller to obtain a test piece having a thickness of about 1.0 mm. The test piece was subjected to a temperature range of 10 to 150 ° C and a temperature increase rate of 5 ° C / min using a Leometer (trade name "RS6000" manufactured by Haake Co., Ltd., and the loss tangent tan δ at 25 ° C was obtained. The measurement was carried out at 50% RH and a measurement frequency of 1 Hz.

(identification)

The metal layer and the adhesive layer of the tape for electronic device packaging of each of the samples of the above examples and comparative examples were singulated into a sample having a size of 5 mm × 5 mm. Thereafter, the adhesive layer was irradiated with ultraviolet rays of 200 mJ/cm ² from the base film side by means of an air-cooled high-pressure mercury lamp (80 W/cm, irradiation distance: 10 cm). For 100 pieces of a single sample in the center of the tape for electronic device packaging, a Dice Picker device (trade name "CAP-300II") manufactured by Canon Machinery Co., Ltd. was used to confirm whether the singulation can be recognized in the same manner as the wafer wafer. sample. The same identifiable as the wafer is evaluated as ○; the illuminating angle or the amount of irradiation can be changed to the same as the wafer, and the identifiable product is evaluated as Δ; ×. The results are shown in Tables 3 and 4.

(pickup)

After the above-described identification test, 250 pieces of the above-mentioned single-piece samples were subjected to a pick-up test under the following pick-up conditions, and the height of the plug which can pick up 200 or more samples was calculated. Furthermore, the upper limit of the insertion height is set to 400 μm. The results are shown in Tables 3 and 4. In the tape for electronic device packaging of Example 6, the adhesion between the adhesive tape and the adhesive layer was too high, and the single-piece sample could not be picked up under the test conditions, so that the insertion height could not be calculated. However, the singulated sample can be identified, and if the insertion height is set to be higher than 400 μm, it can be picked up, so that there is no problem. Moreover, when the insertion height is too high, there is a flaw in the metal layer, but when the tip is formed, the metal layer and the adhesive layer can be pressed against the back surface of the semiconductor wafer, and the metal layer is pressed. Flat stitch marks. Further, in the tape for electronic device packaging of Comparative Example 1, the single-piece sample could not be recognized, and the pickup could not be performed, so that the insertion height could not be calculated.

<Picking conditions>

Pickup device: CAP-300II manufactured by Canon Machinery Co., Ltd.

Jacking tip shape: radius 0.7mm, front end radius of curvature R=0.25mm, front end θ=15

Inserting jacking speed: 50mm/sec

As shown in Tables 3 and 4, the tape for electronic device packaging of Examples 1 to 12, the surface roughness RzJIS obtained by the ten-point average roughness of the surface of the metal layer opposite to the adhesive layer was less than 5.0 μm. Therefore, it becomes a good result in the identification evaluation. Further, as shown in Table 4, in the tape for electronic device packaging of the eighth embodiment, the specular gloss of the metal layer at an incident angle of 60 degrees is 117%, so it is necessary to change the irradiation angle and the irradiation amount of the light, but the irradiation angle. The uniform sample can be identified after adjustment with the amount, and is therefore an allowable range.

On the other hand, in the tape for electronic device packaging of Comparative Example 1, the surface roughness RzJIS obtained by the ten-point average roughness of the surface of the metal layer opposite to the adhesive layer was 6.0 μm, which was bad in the visibility evaluation. the result of.

Claims (7)

An adhesive tape for electronic device packaging, comprising: an adhesive tape having a base film and an adhesive layer; an adhesive layer laminated on the opposite side of the adhesive film from the adhesive film; and laminated The metal layer provided on the side opposite to the adhesive layer of the adhesive layer, and the surface roughness RzJIS obtained by the ten-point average roughness of the surface of the metal layer opposite to the adhesive layer is less than 5.0 μm. The tape for electronic device packaging of claim 1, wherein the metal layer has a specular gloss of less than 100% at an incident angle of 60 degrees. The tape for electronic device encapsulation of claim 1 or claim 2, wherein the metal layer has a thickness of 5 μm or more and less than 200 μm. The tape for electronic device encapsulation of claim 1 or claim 2, wherein the adhesive tape and the adhesive layer have an adhesive force of 0.03 to 0.5 N in a state in which the adhesive layer and the metal layer are picked up from the adhesive tape. /25mm. The tape for electronic device packaging of claim 1 or claim 2, wherein the metal layer contains copper or aluminum. The tape for electronic device encapsulation of claim 1 or claim 2, wherein the adhesive layer comprises (A) an epoxy resin, (B) a hardener, (C) an acrylic resin or a phenoxy resin, and (D) a surface. Processed inorganic filler. The tape for electronic device encapsulation of claim 1 or claim 2, wherein the adhesive layer contains an acrylate or a hydroxyl group containing CH ₂ =CHCOOR (wherein R is an alkyl group having 4 to 18 carbon atoms) An acrylic polymer composed of an isocyanate compound having a radical-reactive carbon-carbon double bond in the molecule.