SG11201708735SA - Tape for semiconductor processing - Google Patents

Tape for semiconductor processing

Info

Publication number
SG11201708735SA
SG11201708735SA SG11201708735SA SG11201708735SA SG11201708735SA SG 11201708735S A SG11201708735S A SG 11201708735SA SG 11201708735S A SG11201708735S A SG 11201708735SA SG 11201708735S A SG11201708735S A SG 11201708735SA SG 11201708735S A SG11201708735S A SG 11201708735SA
Authority
SG
Singapore
Prior art keywords
tape
semiconductor processing
metal layer
semiconductor
adhesive layer
Prior art date
Application number
SG11201708735SA
Inventor
Masami Aoyama
Toru Sano
Original Assignee
Furukawa Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Furukawa Electric Co Ltd filed Critical Furukawa Electric Co Ltd
Publication of SG11201708735SA publication Critical patent/SG11201708735SA/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/28—Metal sheet
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature

Abstract

TAPE FOR SEMICONDUCTOR PROCESSING A tape for semiconductor processing that can prevent the generation of wrinkles in the metal layer at the time of sticking to a semiconductor wafer is provided. The tape for semiconductor processing 10 of the invention includes a dicing tape 13 having a base film 11 and a pressure-sensitive adhesive layer 12; a metal layer 14 provided on the pressure-sensitive adhesive layer 12 for protecting the back surface of a semiconductor chip; and an adhesive layer 15 provided on the metal layer 14 for adhering the metal layer 14 to the back surface of a semiconductor chip, in which the loop stiffness of the dicing tape 13 is 20 mN or more and less than 200 mN.
SG11201708735SA 2015-12-25 2016-10-05 Tape for semiconductor processing SG11201708735SA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015255313 2015-12-25
PCT/JP2016/079627 WO2017110203A1 (en) 2015-12-25 2016-10-05 Tape for semiconductor processing

Publications (1)

Publication Number Publication Date
SG11201708735SA true SG11201708735SA (en) 2018-07-30

Family

ID=59089994

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201708735SA SG11201708735SA (en) 2015-12-25 2016-10-05 Tape for semiconductor processing

Country Status (7)

Country Link
JP (1) JP6800167B2 (en)
KR (1) KR102513252B1 (en)
CN (1) CN107960133B (en)
MY (1) MY192250A (en)
SG (1) SG11201708735SA (en)
TW (1) TWI696683B (en)
WO (1) WO2017110203A1 (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI649398B (en) * 2017-09-11 2019-02-01 達邁科技股份有限公司 Thermal-curable adhesive composition and adhesive sheet
US10947417B2 (en) 2017-09-29 2021-03-16 Taimide Tech. Inc. Thermal-curable adhesive composition and adhesive sheet
JP7154809B2 (en) * 2018-04-20 2022-10-18 株式会社ディスコ Wafer processing method
JP7111562B2 (en) * 2018-08-31 2022-08-02 株式会社ディスコ Processing method
US11541691B2 (en) 2018-12-19 2023-01-03 The Goodyear Tire & Rubber Company Composite tread with targeted stiffness gradient and method of making
US20200198414A1 (en) * 2018-12-19 2020-06-25 The Goodyear Tire & Rubber Company Method and apparatus for forming a composite tread with microchimneys
JP7321639B2 (en) * 2019-02-15 2023-08-07 株式会社ディスコ Wafer processing method
JP7258421B2 (en) * 2019-02-15 2023-04-17 株式会社ディスコ Wafer processing method
JP7379829B2 (en) * 2019-02-21 2023-11-15 味の素株式会社 Manufacturing method of printed wiring board
TWI710288B (en) 2020-01-22 2020-11-11 頎邦科技股份有限公司 Method and device for adhering heat sinks to a circuit board tape

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1167699A (en) * 1997-08-13 1999-03-09 Texas Instr Japan Ltd Manufacture of semiconductor device
JP4865312B2 (en) 2005-12-05 2012-02-01 古河電気工業株式会社 Chip protection film forming sheet
JP2007235022A (en) 2006-03-03 2007-09-13 Mitsui Chemicals Inc Adhesive film
JP4849993B2 (en) * 2006-08-14 2012-01-11 日東電工株式会社 Adhesive sheet, method for producing the same, and method for cutting laminated ceramic sheet
JP5026832B2 (en) * 2007-03-22 2012-09-19 古河電気工業株式会社 Adhesive tape for semiconductor device processing
JP5534690B2 (en) * 2009-03-23 2014-07-02 古河電気工業株式会社 Dicing tape
JP5681374B2 (en) * 2010-04-19 2015-03-04 日東電工株式会社 Dicing tape integrated semiconductor backside film
JP5419226B2 (en) * 2010-07-29 2014-02-19 日東電工株式会社 Flip chip type film for semiconductor back surface and use thereof

Also Published As

Publication number Publication date
KR20180098125A (en) 2018-09-03
TWI696683B (en) 2020-06-21
KR102513252B1 (en) 2023-03-24
JP6800167B2 (en) 2020-12-16
CN107960133B (en) 2021-10-26
JPWO2017110203A1 (en) 2018-10-18
TW201722711A (en) 2017-07-01
CN107960133A (en) 2018-04-24
WO2017110203A1 (en) 2017-06-29
MY192250A (en) 2022-08-11

Similar Documents

Publication Publication Date Title
SG11201708735SA (en) Tape for semiconductor processing
MY191396A (en) Method of reducing residual contamination in singulated semiconductor die
SG11201902922WA (en) Adhesive tape for semiconductor processing, and semiconductor device manufacturing method
MY190282A (en) Tape for electronic device packaging
MY191606A (en) Sheet for semiconductor processing
PH12018502253B1 (en) Pressure-sensitive adhesive tape for semiconductor substrate fabrication
MY189136A (en) Tape for electronic device packaging
TW201613431A (en) Systems and methods for implementing display drivers
MY187016A (en) First protective film-forming sheet, method for forming first protective film, and method for manufacturing semiconductor chip
MY162761A (en) Adhesive tape for processing semiconductor wafer
WO2018002035A3 (en) Method of processing wafer having protrusions on the back side
MY183013A (en) Sheet for semiconductor processing
SG11201902647VA (en) Thin film affixing device
SG11201910104UA (en) Temporary protective film for semiconductor sealing molding
SG11201900617YA (en) Method for manufacturing semiconductor device
PH12017500374B1 (en) Adhesive film and semiconductor package using adhesive film
MY184452A (en) Tape for electronic device packaging
SG11201808291YA (en) Semiconductor processing sheet
MY172339A (en) Semiconductor die back layer separation method
PH12018500851B1 (en) First protective film forming sheet
TW201612010A (en) Surface-protective film and optical component attached with the same
PH12019500576A1 (en) Adhesive sheet for semiconductor processing
SG10201804761PA (en) Dicing tape-combined adhesive sheet
PH12016501670A1 (en) Protective-film-forming film and method of manufacturing semiconductor chip with protective film
EP3214643A3 (en) Overmolded chip scale package