PH12019500576A1 - Adhesive sheet for semiconductor processing - Google Patents

Adhesive sheet for semiconductor processing

Info

Publication number
PH12019500576A1
PH12019500576A1 PH12019500576A PH12019500576A PH12019500576A1 PH 12019500576 A1 PH12019500576 A1 PH 12019500576A1 PH 12019500576 A PH12019500576 A PH 12019500576A PH 12019500576 A PH12019500576 A PH 12019500576A PH 12019500576 A1 PH12019500576 A1 PH 12019500576A1
Authority
PH
Philippines
Prior art keywords
functional group
adhesive sheet
semiconductor processing
reactive functional
adhesive
Prior art date
Application number
PH12019500576A
Inventor
Tomotaka Morishita
Yuichiro Komasu
Original Assignee
Lintec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lintec Corp filed Critical Lintec Corp
Publication of PH12019500576A1 publication Critical patent/PH12019500576A1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/385—Acrylic polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/08—Homopolymers or copolymers of acrylic acid esters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors

Abstract

The present invention relates to an adhesive sheet for semiconductor processing, the adhesive sheet being provided with: a base material; and an adhesive layer which is disposed on the base material and is formed of an adhesive composition. The adhesive composition includes: a polymer (A) that contains a reactive functional group (A1); a polymer (B) that contains a reactive functional group (B1) which is different from the functional group (A1), and that contains an actinic ray-polymerizable group (B2); a crosslinking agent (C) that reacts with the reactive functional group (A1); and a crosslinking agent (D) that reacts with the reactive functional group (B1).
PH12019500576A 2016-09-20 2019-03-18 Adhesive sheet for semiconductor processing PH12019500576A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016182892 2016-09-20
PCT/JP2017/022969 WO2018055859A1 (en) 2016-09-20 2017-06-22 Adhesive sheet for semiconductor processing

Publications (1)

Publication Number Publication Date
PH12019500576A1 true PH12019500576A1 (en) 2019-12-11

Family

ID=61690229

Family Applications (1)

Application Number Title Priority Date Filing Date
PH12019500576A PH12019500576A1 (en) 2016-09-20 2019-03-18 Adhesive sheet for semiconductor processing

Country Status (7)

Country Link
JP (1) JP6875011B2 (en)
KR (1) KR102326621B1 (en)
CN (1) CN109312199B (en)
PH (1) PH12019500576A1 (en)
SG (1) SG11201807656WA (en)
TW (1) TWI732895B (en)
WO (1) WO2018055859A1 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG11202106337WA (en) 2018-12-28 2021-07-29 Showa Denko Materials Co Ltd Evaluation method for light-curing adhesive, integrated dicing and die-bonding film and manufacturing method for same, and manufacturing method for semiconductor device
CN116783259A (en) * 2021-01-18 2023-09-19 Ａｇｃ株式会社 Film and method for manufacturing semiconductor package
JPWO2022186120A1 (en) * 2021-03-03 2022-09-09
CN115975553A (en) * 2022-12-28 2023-04-18 佛山市顺德区凌晖实业有限公司 Acrylic ester ionic pressure-sensitive adhesive and preparation method thereof

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04367769A (en) 1991-06-12 1992-12-21 Shikoku Seisakusho:Kk Control of sorting rate of grain sorter
JP4947564B2 (en) * 2000-01-21 2012-06-06 日東電工株式会社 Adhesive sheet for semiconductor wafer processing
WO2010106849A1 (en) * 2009-03-16 2010-09-23 電気化学工業株式会社 Pressure-sensitive adhesive and pressure-sensitive adhesive sheet
JP4851613B2 (en) * 2009-12-22 2012-01-11 古河電気工業株式会社 Adhesive tape for semiconductor wafer surface protection
JP5144634B2 (en) * 2009-12-22 2013-02-13 日東電工株式会社 Heat-resistant adhesive sheet for substrate-less semiconductor package manufacturing, and substrate-less semiconductor package manufacturing method using the adhesive sheet
JP5583098B2 (en) 2011-09-28 2014-09-03 古河電気工業株式会社 Adhesive tape for brittle wafer processing and brittle wafer processing method using the same
MY186486A (en) * 2012-05-25 2021-07-22 Lintec Corp Dicing sheet
JP6116368B2 (en) * 2013-05-24 2017-04-19 ニッタ株式会社 Temperature sensitive adhesive
US10192768B2 (en) * 2013-08-30 2019-01-29 Lintec Corporation Sheet for semiconductor processing
WO2016010140A1 (en) * 2014-07-18 2016-01-21 日本合成化学工業株式会社 Adhesive composition and adhesive using same, and adhesive for polarizing plate
TWI642717B (en) * 2014-11-19 2018-12-01 Sumitomo Bakelite Co., Ltd. Dicing film

Also Published As

Publication number Publication date
CN109312199B (en) 2021-11-02
SG11201807656WA (en) 2019-04-29
WO2018055859A1 (en) 2018-03-29
KR102326621B1 (en) 2021-11-15
JPWO2018055859A1 (en) 2019-07-04
TWI732895B (en) 2021-07-11
TW201829698A (en) 2018-08-16
JP6875011B2 (en) 2021-05-19
CN109312199A (en) 2019-02-05
KR20190053135A (en) 2019-05-17

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