MY186142A - Removable adhesive sheet for semiconductor processing - Google Patents

Removable adhesive sheet for semiconductor processing

Info

Publication number
MY186142A
MY186142A MYPI2018700842A MYPI2018700842A MY186142A MY 186142 A MY186142 A MY 186142A MY PI2018700842 A MYPI2018700842 A MY PI2018700842A MY PI2018700842 A MYPI2018700842 A MY PI2018700842A MY 186142 A MY186142 A MY 186142A
Authority
MY
Malaysia
Prior art keywords
styrene
block copolymer
removable adhesive
adhesive sheet
semiconductor processing
Prior art date
Application number
MYPI2018700842A
Inventor
Kawata Satoru
Original Assignee
Furukawa Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Furukawa Electric Co Ltd filed Critical Furukawa Electric Co Ltd
Publication of MY186142A publication Critical patent/MY186142A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/24—Plastics; Metallised plastics based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/241—Polyolefin, e.g.rubber
    • C09J7/243—Ethylene or propylene polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors

Abstract

A removable adhesive sheet for semiconductor processing, containing a removable adhesive layer provided on a base material film, in which a 5 percent modulus of the base material film is 7.0 to 20.0 MPa; the base material film is single-layered, and contains 5 to 39 mass parts of a styrene-based block copolymer with respect to 100 mass parts of a base resin; the styrene-based block copolymer is at least one kind of resin selected from the group consisting of a styrene-hydrogenated isoprene-styrene block copolymer, a styrene-isoprene- styrene block copolymer, a styrene-hydrogenated butadiene-styrene block copolymer, and a styrene-hydrogenated isoprene/butadiene-styrene block copolymer; and the base resin is at least one kind of resin selected from specific resins such as a polypropylene, a polyethylene, and the like.(Figure 1)
MYPI2018700842A 2016-03-31 2017-03-27 Removable adhesive sheet for semiconductor processing MY186142A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016073264 2016-03-31
PCT/JP2017/012456 WO2017170437A1 (en) 2016-03-31 2017-03-27 Adhesive sheet for semiconductor processing

Publications (1)

Publication Number Publication Date
MY186142A true MY186142A (en) 2021-06-25

Family

ID=59965578

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2018700842A MY186142A (en) 2016-03-31 2017-03-27 Removable adhesive sheet for semiconductor processing

Country Status (7)

Country Link
JP (1) JP6606191B2 (en)
KR (1) KR102350744B1 (en)
CN (1) CN107995997B (en)
MY (1) MY186142A (en)
SG (1) SG11201800287UA (en)
TW (1) TWI654234B (en)
WO (1) WO2017170437A1 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7112205B2 (en) * 2018-02-13 2022-08-03 株式会社ディスコ splitter
CN109536068B (en) * 2018-11-16 2021-08-17 宁波激智科技股份有限公司 High-viscosity protective film and preparation method thereof
CN109880551A (en) * 2019-03-05 2019-06-14 广东聚益新材有限公司 Without aldehyde fire-resistant binder and its preparation method and application, board-like material
JP7458374B2 (en) * 2019-03-26 2024-03-29 リンテック株式会社 release sheet
CN111995812B (en) * 2020-08-19 2022-06-14 中裕软管科技股份有限公司 High-air-tightness material for repairing gas pipeline and preparation method thereof

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5140910B2 (en) * 2005-08-30 2013-02-13 住友ベークライト株式会社 Film base and adhesive tape for semiconductor wafer processing
JP2007100064A (en) 2005-09-07 2007-04-19 Furukawa Electric Co Ltd:The Pressure-sensitive adhesive tape for dicing
JP5143352B2 (en) * 2005-11-14 2013-02-13 電気化学工業株式会社 Film base and adhesive tape
JP5448430B2 (en) * 2007-12-18 2014-03-19 古河電気工業株式会社 Wafer sticking sheet and wafer processing method
MY154860A (en) * 2009-07-08 2015-08-14 Furukawa Electric Co Ltd Adhesive sheet for wafer bonding and method of processing a wafer by using the same
JP2011216704A (en) * 2010-03-31 2011-10-27 Furukawa Electric Co Ltd:The Adhesive tape for semiconductor wafer processing
JP2013098443A (en) * 2011-11-02 2013-05-20 Furukawa Electric Co Ltd:The Semiconductor adhesive sheet
JP5993255B2 (en) 2012-09-11 2016-09-14 三菱樹脂株式会社 Acrylic resin film and dicing adhesive sheet
JP6107230B2 (en) * 2013-02-28 2017-04-05 住友ベークライト株式会社 Dicing film
JP6264126B2 (en) * 2014-03-20 2018-01-24 日立化成株式会社 Wafer processing tape
JP6330468B2 (en) 2014-05-13 2018-05-30 住友ベークライト株式会社 Dicing film base film and dicing film
EP3165567B1 (en) * 2014-07-01 2020-07-22 Asahi Kasei Kabushiki Kaisha Polyolefin-based resin composition, film, medical bag, and tube

Also Published As

Publication number Publication date
WO2017170437A1 (en) 2017-10-05
CN107995997B (en) 2023-11-14
TW201800463A (en) 2018-01-01
TWI654234B (en) 2019-03-21
JPWO2017170437A1 (en) 2019-02-07
SG11201800287UA (en) 2018-02-27
KR20180127300A (en) 2018-11-28
JP6606191B2 (en) 2019-11-13
CN107995997A (en) 2018-05-04
KR102350744B1 (en) 2022-01-14

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