JP2007100064A - Pressure-sensitive adhesive tape for dicing - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a pressure-sensitive adhesive tape for dicing, being less prone to cause chipping and having sufficient adhesion force to hold a tip when dicing a semiconductor wafer, and capable of lowering the sticking of an adhesive to the side faces of a package without causing package fly when being applied to a dicing process of a package collectively sealed with a resin. <P>SOLUTION: The pressure-sensitive adhesive tape for dicing is obtained by forming an adhesive layer onto at least either face of a base film. Where the base resin of the adhesive is a copolymer composed essentially of an alkyl (meth)acrylate as a monomer component, having an alicyclic hydrocarbon group as the alkyl group. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a dicing adhesive tape suitable for fixing and holding a wafer when dicing a semiconductor wafer into chips, and a dicing adhesive tape used for semiconductor package processing.

Conventionally, when performing a so-called dicing process for separating a wafer on which a circuit pattern is formed into chips, a pickup system using a wafer processing tape for fixing the wafer has been proposed. In this system, a large-diameter wafer is diced into chips in a state of being bonded and fixed to a wafer processing tape, and after washing, drying, picking up, and packaging by resin sealing.
In the dicing process, a semiconductor wafer on which a predetermined circuit pattern such as an IC is formed is bonded to a back surface of a semiconductor fixing adhesive tape, and then a rotating blade such as rotating a metal particle dispersing blade at high speed is used. A dicing process is performed to a predetermined chip size. In this process, a method of cutting the wafer to a part (5 to 40 μm) of the adhesive tape for fixing a semiconductor and fully cutting the wafer is generally employed.
However, the conventional adhesive tape for fixing a semiconductor has a problem of causing chipping (chipping) of several μm to several hundred μm on the formed chip cut surface due to impact or vibration during dicing. Such chipping is larger in a compound semiconductor such as gallium arsenide.

In order to solve this problem, a technique is disclosed in which chipping reduction is obtained by limiting the storage elastic modulus of the pressure-sensitive adhesive to a relatively high range. However, in controlling the storage elastic modulus, there is a problem that it is very difficult to achieve both reduction of chipping and sufficient adhesive force required for holding the tape. In other words, if the storage elastic modulus is designed to be high for reducing chipping, the adhesive force required for holding the chip cannot be obtained, and the semiconductor chip that has been reduced in size during the dicing process will be peeled off from the tape. On the other hand, when the adhesive strength is designed to be high in order to prevent this problem, there is a problem that a sufficient effect for reducing chipping cannot be obtained.
Further, a technique is disclosed in which chipping is reduced by using a copolymer derived from a vinyl acetate monomer or a mixed composition of the vinyl acetate copolymer and an acrylic copolymer in the pressure-sensitive adhesive layer. However, since vinyl acetate monomer has low reactivity with acrylic monomer and the polymerization reaction does not proceed uniformly, it is difficult to supply a stable material and is not suitable for practical use.

In contrast to such conventional manufacturing methods, flip chip type packages having electrodes on the pattern circuit side have been developed in recent years as one form of miniaturization of semiconductor elements. Among these flip chip type packages, the wafer level chip size package (WLCSP) is a polyimide-coated, Cu rearranged wiring formation, Cu post formation, resin sealing, resin polishing, terminal formation, After sequentially performing the package processing, the chip is finally cut into individual chips.

In the dicing process of the package collectively sealed with the resin in this way, the load at the time of cutting is large, and the package resin contains a release agent and the resin surface also has a structure with minute irregularities. The adhesive used for semiconductor processing tape can hold the package firmly and is flexible so that it does not hold the package during dicing and scatters (hereinafter referred to as “package fly”). Adhesive is used.
However, the use of such a flexible pressure-sensitive adhesive causes problems such as adhesion of the pressure-sensitive adhesive to the side surface of the package due to dicing and peeling of the laser mark imprinted on the package. Improvement of this point has been desired. .

On the other hand, as an adhesive tape for fixing a semiconductor wafer to be used when a semiconductor wafer is attached, dicing, expanding, etc., and then picking up the semiconductor wafer and mounting it, it is permeable to ultraviolet rays and / or electron beams. Using a pressure-sensitive adhesive tape in which a pressure-sensitive adhesive layer that undergoes a polymerization and curing reaction with ultraviolet rays and / or electron beams is applied onto a substrate having the substrate, the pressure-sensitive adhesive layer is irradiated with ultraviolet rays and / or electron beams after dicing, and the pressure-sensitive adhesive layer is polymerized. A method is known in which a semiconductor chip is picked up by causing a curing reaction to reduce the adhesive force. However, even a semiconductor wafer processing tape capable of reducing the adhesive force by irradiating with ultraviolet rays after dicing is completed is not sufficient to solve the above problems.
Japanese Patent Laid-Open No. 10-242086 JP 2005-281418 A JP 2005-281419 A JP 2005-281420 A JP 2001-354930 A JP 2003-201451 A

An object of the present invention is to provide a pressure-sensitive adhesive tape for dicing that hardly causes chipping when dicing a semiconductor wafer and has sufficient adhesive force for holding a chip.
A further object of the present invention is to provide an adhesive tape for dicing capable of reducing the adhesion of adhesive to the side surface of the package without generating package fly in the dicing process of the package encapsulated with resin. It is.

As a result of intensive studies to solve the above problems, the present inventors have found that at least one of the monomer components is a (meth) acrylic acid alkyl ester and the alkyl group is an alicyclic hydrocarbon group. When dicing a semiconductor wafer without reducing adhesive strength sufficient for chip holding by using a dicing adhesive tape in which a polymer-based adhesive is formed on at least one side of a base film. It has been found that chipping hardly occurs.
In addition, when the adhesive tape for dicing is used in the dicing process of a package that is encapsulated with resin, the adhesive adheres to the side surface of the package without reducing the adhesiveness between the tape and the package during dicing. It was found that it can be suitably used. The present invention has been made based on this finding.
That is, the dicing adhesive tape in the present invention is not only an adhesive tape used when separating a wafer on which a circuit pattern is formed into chips, but also when individually cutting a package collectively sealed with a resin. In addition, the adhesive tape used in the above is also included, and unless otherwise specified, the adhesive tape used in both is meant.

That is, the present invention
(1) In a pressure-sensitive adhesive tape having a pressure-sensitive adhesive layer formed on at least one surface of a base film, the base resin of the pressure-sensitive adhesive is a (meth) acrylic acid alkyl ester and at least one alkyl group. A pressure-sensitive adhesive tape for dicing, characterized in that is a copolymer of alicyclic hydrocarbon group,
(2) The adhesive tape for dicing according to (1), wherein the alicyclic hydrocarbon group is an isobornyl group,
(3) The pressure-sensitive adhesive tape for dicing according to (1) or (2), wherein the content of the (meth) acrylic acid isobornyl ester is 5 to 50% by mass of the base resin,
(4) The pressure-sensitive adhesive layer used in the pressure-sensitive adhesive tape for dicing is composed of a radiation-curable pressure-sensitive adhesive, and the pressure-sensitive adhesive tape for dicing according to any one of (1) to (3) ,
(5) The dicing adhesive tape according to (4), wherein the base resin of the radiation curable adhesive has a radiation polymerizable carbon-carbon double bond in a side chain,
Is to provide.

According to the present invention, chipping is unlikely to occur when a semiconductor wafer is diced, and the chip can be sufficiently held, and a package fly is generated in a dicing process of a package that is collectively sealed with a resin. In addition, adhesion of the adhesive to the side surface of the package can be reduced.

The pressure-sensitive adhesive tape for dicing of the present invention is provided with a pressure-sensitive adhesive layer applied to at least one surface of a base film, and the base resin of the pressure-sensitive adhesive is composed of (meth) acrylic acid alkyl ester as at least one monomer component. And a copolymer in which the alkyl group is an alicyclic hydrocarbon group.
In the present invention, the (meth) acrylic acid alkyl ester refers to both an acrylic acid alkyl ester and a methacrylic acid alkyl ester. This will be described in more detail below.

(Base film)
The substrate film in the present invention is not particularly limited as long as it is usually used for a semiconductor processing tape, and plastics, rubbers and the like can be preferably used. A radiation curable material is used as an adhesive described later. When used, it is necessary to select a material in consideration of the radiation transparency so that the adhesive layer is cured when irradiated with radiation from the base film side so that the adhesive force is reduced. . In the present invention, radiation refers to light rays such as ultraviolet rays or ionizing radiations such as electron beams, but when ultraviolet rays are selected from the radiations and the radiation-curable resin composition is cured by the irradiation. Therefore, it is necessary to select a substrate having a good ultraviolet transmittance as the base material.

  Examples of materials that can be selected as such a base film include, for example, polyethylene, polypropylene, ethylene-propylene copolymer, polybutene-1, poly-4-methylpentene-1, ethylene-vinyl acetate copolymer, and ethylene. -Ethyl acrylate copolymer, ethylene-methyl acrylate copolymer, ethylene-acrylic acid copolymer, α-olefin homopolymer or copolymer such as ionomer, or a mixture thereof, polyethylene terephthalate, polycarbonate, poly Engineering plastics such as methyl methacrylate, thermoplastic elastomers such as polyurethane, styrene-ethylene-butene or pentene copolymers, polyamide-polyol copolymers, and mixtures thereof can be listed.

Polymers such as halogen-containing polyvinyl chloride, vinyl chloride-ethylene copolymer, FEP, and PFA are not preferable because free halogen or free halogen acid adversely affects the semiconductor chip. Is preferred.
In order to make the gap easy to pick up after cutting into a semiconductor chip, the semiconductor processing tape is stretched (expanding process). In that case, necking (when the base film is stretched radially) (Partial elongation due to poor transmission of force) is preferable, and examples thereof include polyurethane and styrene-ethylene-butene or pentene copolymers with limited molecular weight and styrene content. In order to prevent elongation or deflection during dicing, it is effective to use a cross-linked base film. The thickness of the base film is usually preferably from 50 to 200 μm from the viewpoints of high elongation properties and radiation transparency.
In addition, when the surface opposite to the side of the base film where the adhesive layer is applied is textured or coated with a lubricant, in addition to preventing blocking during storage of the dicing adhesive tape, This is preferable because there is an effect such as prevention of necking of the base film.

(Adhesive layer)
The pressure-sensitive adhesive used in the present invention contains, as a base resin, a copolymer in which at least one monomer component is a (meth) acrylic acid alkyl ester and the alkyl group is an alicyclic hydrocarbon group. Features. For example, at least one of the monomer components is an acrylic acid alkyl ester, the alkyl group is an alicyclic hydrocarbon group, and the other monomer component is a poly (meth) acrylic acid alkyl ester as a main constituent unit. The polymer can be arbitrarily selected from a copolymer, a copolymer with another unsaturated monomer capable of copolymerization, or a mixture of these polymers. Examples of the (meth) acrylic acid ester having an alicyclic hydrocarbon group include isobornyl (meth) acrylate, dicyclopentanyl (meth) acrylate, dicyclopentenyl (meth) acrylate, cyclohexyl (meth) acrylate, butylhexyl ( (Meth) acrylate, tetrahydrofurfuryl (meth) acrylate, and the like. Examples of alkyl esters of acrylic acid and methacrylic acid include methyl (meth) acrylate, butyl (meth) acrylate, glycidyl (meth) acrylate, and 2-ethylhexyl (meta). ) Acrylate, (meth) acrylic acid, ethyl (meth) acrylate, lauryl (meth) acrylate, stearyl (meth) acrylate, etc., acrylic acid alkyl ester, methacrylic acid alkyl ester The other copolymerizable unsaturated monomers, and vinyl acetate.
When isobornyl (meth) acrylate is used, its content can be selected as appropriate, but in order to reduce wafer scattering and package fly during dicing, the content is 5-50 mass of the base resin. % Is preferable.

In order to use the above-mentioned pressure-sensitive adhesive as a radiation-curable pressure-sensitive adhesive, the above-mentioned acrylic copolymer has a radiation-curable functional group and can be added to the side chain of the above-mentioned acrylic copolymer. In addition to the addition reaction of compounds with various functional groups, it can be used as a radiation curable adhesive, and radiation curable compounds containing radiation curable monomer components and oligomer components in general adhesives. An adhesive can be illustrated.
As a compound having a radiation curable functional group and having a functional group capable of addition reaction on the side chain of the acrylic copolymer, when the side chain to be subjected to the addition reaction is a carboxyl group, Examples include glycidyl methacrylate and allyl glycidyl ether. When the side chain to be added is an epoxy group, acrylic acid is used. When the side chain to be added is a hydroxyl group, , 2-isocyanatoethyl methacrylate and the like.

  The ultraviolet curable resin blended in the pressure-sensitive adhesive layer is not particularly limited as long as it provides a property that facilitates the separation of the dicing tape and the semiconductor wafer during the pick-up process. Examples thereof include oligomers having a functional group such as a hydroxyl group or a carboxyl group such as acrylate, epoxy acrylate, polyester acrylate, polyether acrylate, (meth) acrylic acid oligomer and itaconic acid oligomer. The addition amount of the ultraviolet curable resin is preferably 30 to 200 parts by mass with respect to 100 parts by mass of the acrylic copolymer described above, and if the amount of the ultraviolet curable resin is too small, the element fixing adhesive force is sufficient during the pickup process. If the amount of the ultraviolet resin is too large, chipping increases in the dicing process.

When the adhesive tape of the present invention is cured by ultraviolet irradiation, a photopolymerization initiator such as isopropyl benzoin ether, isobutyl benzoin ether, benzophenone, Michler ketone, chlorothioxanthone, dodecylthioxanthone, dimethylthioxanthone, diethylthioxanthone, benzyldimethylketanol, Examples thereof include α-hydroxycyclohexyl phenyl ketone and 2-hydroxymethyl phenyl propane. By adding at least one of them into the radiation-polymerizable pressure-sensitive adhesive, the curing reaction of the pressure-sensitive adhesive layer can be efficiently advanced, and thereby the element fixing adhesive force can be appropriately reduced.
The addition amount of the photopolymerization initiator is preferably 0.5 to 10 parts by mass with respect to 100 parts by mass of the radiation polymerizable compound.

Furthermore, the radiation-curable pressure-sensitive adhesive used in the present invention can be blended with a tackifier, a pressure-adjusting agent, a surfactant, or other modifiers as necessary. Moreover, you may add an inorganic compound filler suitably.
The control of the tape retention in the present invention can be appropriately performed by controlling the crosslinking density of the pressure-sensitive adhesive layer. Control of the crosslinking density of the pressure-sensitive adhesive layer can be achieved, for example, by using an appropriate crosslinking agent such as a polyfunctional isocyanate compound, an epoxy compound, a melamine compound, a metal salt compound, a metal chelate compound, an amino resin compound, or a peroxide. It is possible to carry out by an appropriate method such as a method of crosslinking through a method of mixing a compound having two or more carbon / carbon double bonds, and a method of crosslinking by irradiation with energy rays.
The thickness of the pressure-sensitive adhesive layer is preferably at least 3 μm, more preferably 5 μm or more from the viewpoint of holding the wafer during dicing. Also, as the pressure-sensitive adhesive thickness increases, the chipping of the wafer and the adhesive residue on the side of the package increase. Therefore, 30 μm or less is preferable.

(Example)
EXAMPLES Next, although this invention is demonstrated further in detail based on an Example, this invention is not limited to a following example.
(Production of copolymer)
(Copolymer A1)
Polymerization was performed using 2-ethylhexyl acrylate, 2-hydroxyethyl acrylate, and acrylic acid as raw materials at the blending ratio shown in Table 1 below, and then 2-isocyanatoethyl methacrylate was added and reacted at the blending ratio shown in Table 1 below to obtain a copolymer. A1 was obtained.

(Copolymers B1 to E1)
Polymerization was performed with isobornyl acrylate, 2-ethylhexyl acrylate, 2-hydroxyethyl acrylate and acrylic acid as raw materials at the mixing ratio shown in Table 1 below, and 2-isocyanatoethyl methacrylate was further added at the mixing ratio shown in Table 1 below. To obtain copolymers B1 to E1.

(Copolymer F1)
After polymerization using dicyclopentanyl acrylate, 2-ethylhexyl acrylate, 2-hydroxyethyl acrylate, and acrylic acid as raw materials at the mixing ratio shown in Table 1 below, 2-isocyanatoethyl methacrylate was further added at the mixing ratio shown in Table 1 below. By addition reaction, a copolymer F1 was obtained.

(Copolymer A2)
Polymerization was performed using 2-ethylhexyl acrylate, 2-hydroxyethyl acrylate, and acrylic acid as raw materials at the blending ratio shown in Table 2 below, and then 2-isocyanatoethyl methacrylate was further added and reacted at the blending ratio shown in Table 2 below. A2 was obtained.

(Copolymers B2 to E2)
Polymerization was carried out using isobornyl acrylate, 2-ethylhexyl acrylate, 2-hydroxyethyl acrylate and acrylic acid as raw materials at the mixing ratio shown in Table 2 below, followed by addition reaction of 2-isocyanatoethyl methacrylate at the mixing ratio shown in Table 2 below. To obtain copolymers B2 to E2.

(Copolymer F2)
After polymerization using dicyclopentanyl acrylate, 2-ethylhexyl acrylate, 2-hydroxyethyl acrylate, and acrylic acid as raw materials at the mixing ratio shown in Table 2 below, 2-isocyanatoethyl methacrylate was further added at the mixing ratio shown in Table 2 below. By addition reaction, a copolymer F2 was obtained.
(Copolymer G)
Copolymer G was obtained by polymerization using dicyclopentanyl acrylate, 2-ethylhexyl acrylate, 2-hydroxyethyl acrylate, and acrylic acid at the blending ratios in Table 2 below.

(Adhesive adjustment)
Among the copolymers obtained by the synthesis of the above composition, 100 parts by mass of each of A1 to F1 and A2 to F2 excluding the copolymer G, a polyisocyanate compound (trade name, manufactured by Nippon Polyurethane Co., Ltd.) 1 part by weight of coronate L) and α-hydroxycyclohexyl phenyl ketone as a photoinitiator were mixed at a blending ratio of 1 part by weight to obtain adhesives A1 to F1 and A2 to F2.

  Further, the copolymer G is made of Negami Kogyo Co., Ltd .: UN-9000H as a radiation-curable oligomer, 50 parts by mass with respect to 100 parts by mass of the copolymer, and a polyisocyanate compound (trade name, manufactured by Nippon Polyurethane Co., Ltd.). 1 part by weight of Coronate L) and α-hydroxycyclohexyl phenyl ketone (manufactured by Ciba Geigy Japan, Inc., Irgacure 184) as a photoinitiator were mixed at a mixing ratio of 1 part by weight to obtain an adhesive G.

(Preparation of adhesive tape for dicing)
About the adhesives A1 to F1, on the film of 150 μm thick ethylene-methacrylic acid copolymer (trade name Nucrel N0200H, manufactured by Mitsui DuPont Polychemical Co., Ltd.) so that the thickness of the adhesive after drying is 20 μm. Coating was performed to prepare dicing adhesive tapes A1 to F1.

  About adhesive A2-F2, G, it apply | coated on the 150-micrometer-thick polyester film so that the adhesive thickness after drying might be 10 micrometers, and adhesive tape A2-F2, G for dicing was produced.

(Evaluation 1)
The above-mentioned dicing adhesive tape was diced into a 2 mm square after dicing a package resin-sealed package 30 mm square under the following (1) dicing test conditions. Next, after irradiating with ultraviolet rays under the condition of (2) UV irradiation, the package is made from the dicing adhesive tape using a pickup die bonder (a dedicated device that picks up the fragmented package material from the adhesive tape). Was picked up and used as an evaluation sample.

(Measurement condition)
(1) Dicing test conditions Dicing apparatus: DAD-340 manufactured by DISCO
Blade: NBC-ZB-1120S3 manufactured by DISCO
Blade rotation speed: 40000 rpm
Cutting speed: 50 mm / sec
Uncut thickness: 60 μm
Cutting water volume: 1.5 liter / min
Cutting water temperature: 20 ° C
Package size sealed with resin: 30 mm square

(2) UV irradiation UV lamp: high pressure mercury lamp UV illuminance: 35 mW
UV irradiation amount: 500 mJ

(Each evaluation item)
(1) Adhesion of adhesive Any 20 packages (2 mm square) diced into small pieces under the above conditions were selected and used as evaluation samples.
Package structure: BGA
Package size (after dicing): 2 mm square The adhesion of an adhesive of 20 μm or more adhering to the side surfaces of one cut 4 package side was measured visually using a microscope.
The result was the total number of packages n = 20.
Adhesion judgment of side adhesive Adhesion quantity: Less than 20: ◎
21 or more, less than 40: ○
41 or more: ×

(2) Package fly during dicing Package size (after dicing): 2mm square
Package fly number 0: ◎
Number of package fly 1-5: ○
Package fly number 6 or more: ×
Package fly evaluation
No problem: ◎
Limited use: ○
Unusable: ×

(3) Comprehensive judgment
No problem in use: ◎
Limited use: ○
Unusable: ×
The above results are shown in Table 3.

(Evaluation 2)
(Dicing)
Adhesive tapes A2 to F2 and G are bonded to the ground surface of a 6-inch silicon wafer ground with a # 2000 grindstone, and then fixed to the ring frame. Using a dicer, the chips are singulated into 5mm x 5mm chips under the following dicing conditions. did.

(Dicing test conditions)
Dicing machine: DAD-340 manufactured by DISCO
Blade: 27HEDD made by DISCO
Blade rotation speed: 40000 rpm
Cutting speed: 100 mm / sec
Tape cut depth: 30 μm
Cutting water volume: 1.5 liter / min
Cutting water temperature: 22 ° C
Chip size: 5mm square

(Chip scattering)
During the dicing operation described above, the number of chips peeled off from the pressure-sensitive adhesive layer during dicing was counted, and the ratio of the total chips was regarded as chip scattering. Further, incomplete chips that do not have a 5 mm × 5 mm shape on the outer periphery of the wafer were used as peripheral chips, and the number of scattered chips was counted in the same manner, and the ratio to the total number of peripheral chips was determined as peripheral chip scattering.

(Chipping)
After sticking the adhesive tape for transfer on the surface opposite to the surface where the adhesive tape for dicing of the semiconductor chip separated by the dicing operation is pasted, the adhesive tape for dicing is peeled off at random. The selected 100 semiconductor chips were visually observed, and those having a maximum length in the depth direction toward the center of the chip on the four sides were ◯, those having 30-50 μm were △, those having 50 μm or more were × It was.

  Table 4 shows the results of evaluating chip scattering and chipping of the obtained adhesive tape.

  As can be seen from the results of Table 3, as a base resin of the radiation curable pressure-sensitive adhesive, at least one monomer component is an acrylic acid alkyl ester, but the alkyl group has no alicyclic hydrocarbon group. In Comparative Example 1, which is a dicing adhesive tape using a coalescence, the package fly was good, but the adhesive adhered to the side surface of the package, causing a problem.

On the other hand, as a base resin of a radiation curable pressure-sensitive adhesive, a copolymer in which at least one of the monomer components is an alkyl acrylate ester and the alkyl group is an alicyclic hydrocarbon group, has a side chain. In Examples 1 to 5, which are adhesive tapes for dicing using a material having a radiation curable carbon-carbon double bond, adhesion of the adhesive to the side surface of the package is small, and the package fly can be used at a good value. I understand that.
In particular, in the case of Examples 1 to 3 in which the content of isobornyl acrylate is 5 to 45% by mass of the base resin of the adhesive, the adhesion of the adhesive to the package side surface and the package fly are satisfactory without problems. showed that.

  As can be seen from Table 4, Examples 6 to 10 in which at least one of the monomer components is a (meth) acrylic acid alkyl ester and a copolymer in which the alkyl group is an alicyclic hydrocarbon group are used as a base resin. In both cases, chipping was at a satisfactory level while preventing chip scattering during dicing.

In particular, Example 2 in which the alicyclic hydrocarbon group is an isobornyl group, and the content of isobornyl acrylate in the base resin is 20%, and Example 3 in which 40% is also 40% are very good results in chipping. showed that.
On the other hand, Comparative Example 2 in which at least one of the monomer components is a (meth) acrylic acid alkyl ester and the copolymer in which the alkyl group is an alicyclic hydrocarbon group is not used as a base resin has extremely poor chipping. Caused problems in use.

Claims (5)

In a pressure-sensitive adhesive tape having a pressure-sensitive adhesive layer formed on at least one surface of a base film, the base resin of the pressure-sensitive adhesive is such that at least one monomer component is a (meth) acrylic acid alkyl ester and the alkyl group is an alicyclic ring. A pressure-sensitive adhesive tape for dicing, wherein the adhesive tape is a copolymer that is a hydrocarbon group. The pressure-sensitive adhesive tape for dicing according to claim 1, wherein the alicyclic hydrocarbon group is an isobornyl group. 3. The pressure-sensitive adhesive tape for dicing according to claim 1, wherein the content of the isobornyl ester (meth) acrylate is 5 to 50% by mass of the base resin. The pressure-sensitive adhesive layer used in the pressure-sensitive adhesive tape for dicing is composed of a radiation-curable pressure-sensitive adhesive. The pressure-sensitive adhesive tape for dicing according to any one of claims 1 to 3. The dicing pressure-sensitive adhesive tape according to claim 4, wherein the base resin of the radiation-curable pressure-sensitive adhesive has a radiation-polymerizable carbon-carbon double bond in a side chain.