JP2020098918A - Film glue, adhesive sheet and manufacturing method for semiconductor device - Google Patents

Abstract

To provide a film glue and adhesive sheet suitable for a division method by heating gas.SOLUTION: Film glue contains a polymer component and a thermal curable component and has a melt viscosity of less than 1.0×10Pa*s at 80°C under a state before heat hardening. The film glue is used to discharge heating gas toward the film glue for melting by bonding itself to a chip group comprised of a plurality of chip bodies.SELECTED DRAWING: None

Description

The present invention relates to a film adhesive and an adhesive sheet that are particularly suitable for use in a process of die-bonding a semiconductor element (semiconductor chip) to an organic substrate, a lead frame, another semiconductor chip, or the like. The present invention also relates to a method for manufacturing a semiconductor device using the film adhesive and the adhesive sheet.

Along with the rapid progress of thinning, downsizing, and multi-functionality of information terminal equipment, semiconductor devices mounted therein are also required to be thin and high-density. Particularly in the case of memory chips, the capacity is increased by processing the silicon wafer as thin as possible and stacking it in multiple layers.

In response to such a trend of semiconductor devices, an extremely thin wafer processing method is a key point in the semiconductor processing process, and various thin processing methods have been devised and evaluated. As such a thin processing method, a method of manufacturing a semiconductor chip by forming a groove having a predetermined depth from the front surface side of a wafer and then grinding from the rear surface side thereof is disclosed. Such a process is also called a “pre-dicing method”.

According to the first dicing method, it is possible to manufacture a chip while minimizing damage to the thinned wafer. The chip thus manufactured is transferred onto a die attach film (DAF) from a back grind tape which is usually attached to the circuit surface side of the wafer during grinding.

Usually, DAF is attached to a wafer and then diced together with the wafer to be separated into individual pieces. However, in the above-mentioned first dicing method, since the wafer divided into chips is transferred onto the DAF, it is necessary to divide only the DAF into the same size as the chips.

Conventionally, laser dicing with a laser beam has been suitable as a method of dividing a DAF. However, the laser dicing device is expensive, and as a result, the manufacturing cost of the semiconductor device increases.

Patent Document 1 (JP 2012-164953 A) describes a method of dividing DAF with high-pressure air. However, the DAF dividing method described in Patent Document 1 has difficulty in dividing the DAF depending on the conditions and the composition of the DAF.

JP 2012-164953 A

The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a film-like adhesive and an adhesive sheet suitable for a dividing method using heated gas. Another object of the present invention is to provide a method for manufacturing a semiconductor device using the film adhesive and the adhesive sheet.

The present invention which solves the above problems includes the following points.
[1] A film adhesive containing a polymer component (A) and a thermosetting component (B1),
The content of the polymer component (A) in the film adhesive is 1 to 30% by mass, and the content of the thermosetting component (B1) is 40 to 70% by mass.
A film-like adhesive used for melting and cutting the film-like adhesive by adhering the film-like adhesive to a chip group composed of a plurality of chip bodies and releasing heated gas toward the film-like adhesive.

[2] The film adhesive according to [1], which has a melt viscosity at 80° C. of less than 1.0×10 ⁵ Pa·s in a state before heat curing.

[3] The chip group including the plurality of chip bodies is provided with a groove in a region on the surface of the work, which is a region other than the region that remains as the chip body after the work is singulated, and the groove is formed from the back surface side of the work. The film adhesive according to [1] or [2], which is obtained by subjecting a work to a thinning treatment to the bottom.

[4] An adhesive sheet in which the film-like adhesive according to any of [1] to [3] above is used as an adhesive layer, and the adhesive layer is releasably laminated on a support.

[5] A method of manufacturing a semiconductor device including the following steps (a) and (b):
(A) The polymer component (A) and the thermosetting component (B1) are contained, the content of the polymer component (A) is 1 to 30% by mass, and the content of the thermosetting component (B1) is 40 to 70. Attaching a mass% of film adhesive to a chip group composed of a plurality of chip bodies, and (b) releasing the heated gas toward the film adhesive to melt and cut the film adhesive. ..

[6] The method for manufacturing a semiconductor device according to [5], wherein the film adhesive in a state before being heat-cured has a melt viscosity at 80° C. of less than 1.0×10 ⁵ Pa·s.

[7] The method for manufacturing a semiconductor device according to [5] or [6], further including the following step (c) before performing the step (a):
(C) A groove is provided in a region on the front surface of the work other than a region that remains as a chip body after the work is singulated, and the work is thinned from the back surface side of the work to the bottom of the groove. Performing a step of obtaining a chip group including the plurality of chip bodies.

According to the present invention, it is easy to divide the DAF by the heated gas. Therefore, the initial investment cost and maintenance cost of the laser dicing apparatus can be suppressed, and the cost can be reduced as compared with the DAF dividing method by laser dicing.

The film adhesive, the adhesive sheet, and the method for manufacturing a semiconductor device according to the present invention will be described more specifically below.

(Film adhesive)
At least the functions required for the film adhesive according to the present invention are (1) sheet shape retention, (2) initial adhesiveness, and (3) curability.

By adding a binder component containing a polymer component (A) and a thermosetting component (B1) to the film adhesive, (1) sheet shape maintaining property and (3) curability can be imparted.
The function of temporarily adhering to the adherend (chip group consisting of a plurality of chip bodies) until the film adhesive is cured (2) The initial adhesiveness is pressure-sensitive adhesiveness. It may be present, or may have a property of being softened by heat and being bonded. (2) The initial adhesiveness is usually controlled by adjusting various properties of the binder component, adjusting the compounding amount of the inorganic filler (D) described later, and the like.

(A) Polymer Component The polymer component (A) is added to the film adhesive mainly for the purpose of imparting sheet shape maintainability to the film adhesive.
In order to achieve the above object, the weight average molecular weight (Mw) of the polymer component (A) is usually 20,000 or more, and preferably 20,000 to 3,000,000. The value of the weight average molecular weight (Mw) is the value measured by the gel permeation chromatography (GPC) method (polystyrene standard). The measurement by such a method is carried out, for example, on a high-speed GPC device “HLC-8120GPC” manufactured by Tosoh Corporation, on a high-speed column “TSK gourd column H _XL- H”, “TSK Gel GMH _XL ”, “TSK Gel G2000H _XL ” ( As described above, all those manufactured by Tosoh Corporation are used in this order, and the detector is used as a differential refractometer under the conditions of column temperature: 40° C. and liquid transfer rate: 1.0 mL/min.

As the polymer component (A), an acrylic polymer, polyester, phenoxy resin, polycarbonate, polyether, polyurethane, polysiloxane, rubber polymer or the like can be used. Further, it is a compound obtained by combining two or more of these, for example, an acrylic urethane resin obtained by reacting an acrylic polyol, which is an acrylic polymer having a hydroxyl group, with a urethane prepolymer having an isocyanate group at the molecular end. May be. Further, two or more kinds of these may be used in combination, including a polymer in which two or more kinds are bonded.

The content of the polymer component (A) in the film adhesive is 1 to 30% by mass, preferably 4 to 15% by mass. By setting the content rate of the polymer component (A) within the above range, the film adhesive can be easily fused by the heated gas.

(A1) As the acrylic polymer polymer component (A), acrylic polymer (A1) is preferably used. The acrylic polymer (A1) is a polymer containing a structural unit formed by polymerizing a (meth)acrylic acid ester described below. The proportion of structural units formed by polymerizing the (meth)acrylic acid ester in the acrylic polymer (A1) is usually 40% by mass or more, preferably 50% by mass or more, more preferably 60% by mass or more, particularly preferably Is 70% by mass or more. The proportion of structural units contained in the acrylic polymer (A1) is usually the proportion of monomers capable of forming each structural unit (in all monomers used for polymerization of the acrylic polymer (A1) ( (Preparation ratio).

The glass transition temperature (Tg) of the acrylic polymer (A1) is preferably in the range of -60 to 50°C, more preferably -50 to 40°C, and further preferably -40 to 30°C. When the glass transition temperature of the acrylic polymer (A1) is too low, the peeling force between the film adhesive and the support becomes large when the film adhesive is formed on the support, as described later. Transfer failure of the film adhesive may occur, and if it is too high, the adhesiveness of the film adhesive decreases and it becomes impossible to transfer to the adherend, or the film adhesive peels from the adherend after transfer, etc. The problem of may occur.

The weight average molecular weight of the acrylic polymer (A1) is more preferably 100,000 to 1,500,000. If the weight average molecular weight of the acrylic polymer (A1) is too low, the adhesion between the film adhesive and the support will be high, and transfer failure of the film adhesive may occur. The adhesiveness of the agent may be deteriorated and transfer to the adherend may become impossible, or the film-like adhesive may be peeled off from the adherend after the transfer.

The acrylic polymer (A1) contains a (meth)acrylic acid ester as at least a constituent monomer.
As the (meth)acrylic acid ester, an alkyl(meth)acrylate whose alkyl group has 1 to 18 carbon atoms, specifically, methyl(meth)acrylate, ethyl(meth)acrylate, propyl(meth)acrylate, butyl( (Meth)acrylate, 2-ethylhexyl (meth)acrylate, etc.; (meth)acrylate having a cyclic skeleton, specifically, cycloalkyl (meth)acrylate, benzyl (meth)acrylate, isobornyl (meth)acrylate, dicyclopentanyl ( Examples thereof include (meth)acrylate, dicyclopentenyl (meth)acrylate, dicyclopentenyloxyethyl (meth)acrylate, and imide (meth)acrylate. Further, among the monomers exemplified as the monomer having a hydroxyl group, the monomer having a carboxyl group, and the monomer having an amino group, which will be described later, a (meth)acrylic acid ester can be exemplified.

In the present specification, (meth)acrylic may be used to include both acrylic and methacrylic.

As the monomer forming the acrylic polymer (A1), a monomer having a hydroxyl group may be used. By using such a monomer, a hydroxyl group is introduced into the acrylic polymer (A1), and when the film adhesive further contains the energy ray-curable component (B2), the acrylic polymer (A1) and the acrylic polymer Compatibility with (A1) is improved. Examples of the monomer having a hydroxyl group include (meth)acrylic acid ester having a hydroxyl group such as 2-hydroxyl ethyl (meth)acrylate and 2-hydroxypropyl (meth)acrylate; and N-methylol (meth)acrylamide.

A monomer having a carboxyl group may be used as the monomer constituting the acrylic polymer (A1). When such a monomer is used, a carboxyl group is introduced into the acrylic polymer (A1), and when the film adhesive further contains the energy ray-curable component (B2), the acrylic group and the acrylic polymer Compatibility with the polymer (A1) is improved. Examples of the monomer having a carboxyl group include (meth)acrylic acid, maleic acid, fumaric acid and itaconic acid. When an epoxy thermosetting component is used as the thermosetting component (B1) described below, a carboxyl group and an epoxy group in the epoxy thermosetting component react with each other, and thus a monomer having a carboxyl group. It is preferable that the used amount of is small.

A monomer having an amino group may be used as the monomer constituting the acrylic polymer (A1). Examples of such a monomer include (meth)acrylic acid ester having an amino group such as monoethylamino(meth)acrylate.

As the monomer constituting the acrylic polymer (A1), vinyl acetate, styrene, ethylene, α-olefin and the like may be used in addition to the above.

The acrylic polymer (A1) may be crosslinked. The cross-linking is performed by adding the cross-linking agent to the composition for forming the film adhesive, in which the acrylic polymer (A1) before cross-linking has a cross-linkable functional group such as a hydroxyl group. It is carried out by reacting the functional group with the functional group of the crosslinking agent. By crosslinking the acrylic polymer (A1), it becomes possible to adjust the initial adhesive force and cohesive force of the film adhesive.

Examples of the cross-linking agent include organic polyvalent isocyanate compounds and organic polyvalent imine compounds.

As the organic polyvalent isocyanate compound, an aromatic polyvalent isocyanate compound, an aliphatic polyvalent isocyanate compound, an alicyclic polyvalent isocyanate compound and a trimer of these organic polyvalent isocyanate compounds, and these organic polyvalent isocyanate compounds Examples thereof include a terminal isocyanate urethane prepolymer obtained by reacting with a polyol compound.

As the organic polyvalent isocyanate compound, specifically, 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate, 1,3-xylylene diisocyanate, 1,4-xylene diisocyanate, diphenylmethane-4,4'- Diisocyanate, diphenylmethane-2,4'-diisocyanate, 3-methyldiphenylmethane diisocyanate, hexamethylene diisocyanate, isophorone diisocyanate, dicyclohexylmethane-4,4'-diisocyanate, dicyclohexylmethane-2,4'-diisocyanate, lysine isocyanate, and these Examples thereof include polyhydric alcohol adducts.

Specific examples of the organic polyvalent imine compound include N,N′-diphenylmethane-4,4′-bis(1-aziridinecarboxamide), trimethylolpropane-tri-β-aziridinylpropionate, and tetramethylol. Examples thereof include methane-tri-β-aziridinyl propionate and N,N′-toluene-2,4-bis(1-aziridinecarboxamide)triethylenemelamine.

The crosslinking agent is usually 0.01 to 20 parts by mass, preferably 0.1 to 10 parts by mass, and more preferably 0.5 to 5 parts by mass with respect to 100 parts by mass of the acrylic polymer (A1) before being crosslinked. Used in ratio.

In the present invention, when the content of the component constituting the film adhesive is determined based on the content of the polymer component (A), the polymer component (A) is a crosslinked acrylic polymer. In this case, the standard content is the content of the acrylic polymer before being crosslinked.

(A2) Non-acrylic resin Also, as the polymer component (A), a non-acrylic resin selected from polyester, phenoxy resin, polycarbonate, polyether, polyurethane, polysiloxane, rubber-based polymer or a combination of two or more of these is used. The acrylic resin (A2) may be used alone or in combination of two or more. As such a resin, those having a weight average molecular weight of 20,000 to 100,000 are preferable, and those having a weight average molecular weight of 20,000 to 80,000 are more preferable.

The glass transition temperature of the non-acrylic resin (A2) is preferably -30 to 150°C, more preferably -20 to 120°C. If the glass transition temperature of the non-acrylic resin is too low, the peeling force between the film adhesive and the support may be large and transfer failure of the film adhesive may occur. Adhesion to the body may be insufficient.

When the non-acrylic resin (A2) is used in combination with the above-mentioned acrylic polymer (A1), delamination between the film adhesive and the support during transfer of the film adhesive to the adherend. Can be easily performed, and further, the film-like adhesive can follow the transfer surface to suppress the occurrence of voids and the like.

When the non-acrylic resin (A2) is used in combination with the above-mentioned acrylic polymer (A1), the content of the non-acrylic resin (A2) is the same as the non-acrylic resin (A2) and the acrylic polymer (A2). The mass ratio (A2:A1) to A1) is usually 1:99 to 60:40, preferably 1:99 to 30:70. When the content of the non-acrylic resin (A2) is within this range, the above effect can be obtained.

(AB) Curable Polymer Component A curable polymer component (AB) may be used as the polymer component (A). The curable polymer component is a polymer having a curing functional group. The curing functional group is a functional group capable of reacting with each other to form a three-dimensional network structure, and examples thereof include a functional group that reacts by heating and a functional group that reacts by energy rays. The curable polymer component (AB) has curability, but in the present invention, it is a matter summarized by the concept of the polymer component (A), that is, the thermosetting component (B1) or the energy ray. It is a matter that is not summarized depending on the concept of the curable component (B2).
The curable functional group may be added to the unit of the continuous structure which is the skeleton of the curable polymer (AB), or may be added to the terminal. When the curable functional group is added to the unit of the continuous structure which is the skeleton of the curable polymer component (AB), the curable functional group may be added to the side chain or directly added to the main chain. You may have. The weight average molecular weight (Mw) of the curable polymer component (AB) is usually 20,000 or more from the viewpoint of achieving the purpose of imparting the sheet adhesiveness to the film adhesive.

An epoxy group is mentioned as a functional group which reacts by heating. Examples of the curable polymer component (AB) having an epoxy group include a high molecular weight epoxy group-containing compound and a phenoxy resin having an epoxy group. The high molecular weight epoxy group-containing compound is disclosed in, for example, JP 2001-261789 A.
Further, it is a polymer similar to the above-mentioned acrylic polymer (A1), which is polymerized by using a monomer having an epoxy group as a monomer (epoxy group-containing acrylic polymer), Good. Examples of such a monomer include (meth)acrylic acid ester having a glycidyl group such as glycidyl (meth)acrylate.
When the epoxy group-containing acrylic polymer is used, its preferred embodiment is the same as that of the acrylic polymer (A1).

When the curable polymer component (AB) having an epoxy group is used, the thermosetting agent (B12) or the curing accelerator ((B12)) is used as in the case of using the epoxy thermosetting component as the thermosetting component (B1). B13) may be used in combination.

A (meth)acryloyl group is mentioned as a functional group which reacts with an energy ray. As the curable polymer component (AB) having a functional group that reacts with energy rays, an acrylate compound having a polymerized structure such as polyether acrylate and the like, which has a high molecular weight, can be used.
Further, for example, in a raw material polymer having a functional group X such as a hydroxyl group in a side chain, a functional group Y capable of reacting with the functional group X (for example, an isocyanate group when the functional group X is a hydroxyl group) and energy ray irradiation. A polymer prepared by reacting a low molecular weight compound having a functional group that reacts with may be used.
In this case, when the raw material polymer corresponds to the above-mentioned acrylic polymer (A1), the preferable embodiment of the raw material polymer is the same as that of the acrylic polymer (A1).

When the curable polymer component (AB) having a functional group that reacts with energy rays is used, a photopolymerization initiator (B22) may be used in combination as in the case of using the energy ray curable component (B2). ..

(B1) Thermosetting Component The thermosetting component (B1) is added to the film adhesive mainly for the purpose of imparting curability to the film adhesive. The thermosetting component (B1) contains at least a compound having a functional group that reacts when heated. The functional groups contained in the thermosetting component (B1) react with each other to form a three-dimensional network structure, whereby curing is realized. Since the thermosetting component (B1) is used in combination with the polymer component (A), from the viewpoint of suppressing the viscosity of the adhesive composition for forming the film adhesive and improving the handleability, Usually, its weight average molecular weight (Mw) is 10,000 or less, preferably 100 to 10,000.

The content of the thermosetting component (B1) in the film adhesive is 40 to 70% by mass, preferably 50 to 65% by mass, more preferably 50 to 60% by mass. By setting the content of the thermosetting component (B1) in the above range, the film adhesive can be easily fused by the heated gas.

As the thermosetting component (B1), for example, an epoxy thermosetting component is preferable. As the epoxy thermosetting component, it is preferable to use a compound containing an epoxy group-containing compound (B11) and a combination of an epoxy group-containing compound (B11) and a thermosetting agent (B12). Moreover, the epoxy thermosetting component may contain a curing accelerator (B13).

(B11) Compound Having Epoxy Group As the compound (B11) having an epoxy group (hereinafter, may be referred to as “epoxy compound (B11)”), a conventionally known compound can be used. Specifically, polyfunctional epoxy resin, bisphenol A diglycidyl ether and hydrogenated product thereof, orthocresol novolac epoxy resin, dicyclopentadiene type epoxy resin, biphenyl type epoxy resin, bisphenol A type epoxy resin, bisphenol F type Examples thereof include epoxy compounds having two or more functional groups in the molecule, such as epoxy resins and phenylene skeleton type epoxy resins. These can be used alone or in combination of two or more.

When the epoxy compound (B11) is used, the film adhesive preferably contains the epoxy compound (B11) in an amount of 120 to 1500 parts by mass, more preferably 100 parts by mass of the polymer component (A). Is contained in an amount of 200 to 1200 parts by mass. When the epoxy compound (B11) is less than 120 parts by mass, sufficient adhesiveness may not be obtained, and when it exceeds 1500 parts by mass, the peeling force between the film adhesive and the support becomes high, and the film adhesive Transfer failure may occur.

(B12) Thermosetting agent The thermosetting agent (B12) functions as a curing agent for the epoxy compound (B11). Preferred thermosetting agents include compounds having two or more functional groups capable of reacting with an epoxy group in one molecule. Examples of the functional group include phenolic hydroxyl group, alcoholic hydroxyl group, amino group, carboxyl group and acid anhydride. Of these, a phenolic hydroxyl group, an amino group and an acid anhydride are preferred, and a phenolic hydroxyl group and an amino group are more preferred.

Specific examples of the phenol-based curing agent include polyfunctional phenol resins, biphenols, novolac type phenol resins, dicyclopentadiene type phenol resins, zilock type phenol resins, and aralkylphenol resins. A specific example of the amine-based curing agent is DICY (dicyandiamide). These may be used alone or in combination of two or more.

The content of the thermosetting agent (B12) is preferably 0.1 to 500 parts by mass, and more preferably 1 to 200 parts by mass with respect to 100 parts by mass of the epoxy compound (B11). When the content of the thermosetting agent is small, the adhesiveness may not be obtained due to insufficient curing, and when the content is excessive, the moisture absorption rate of the film adhesive may increase and the reliability of the semiconductor device may decrease.

(B13) Curing accelerator The curing accelerator (B13) may be used to adjust the rate of heat curing of the film adhesive. The curing accelerator (B13) is particularly preferably used when an epoxy thermosetting component is used as the thermosetting component (B1).

Preferred curing accelerators include tertiary amines such as triethylenediamine, benzyldimethylamine, triethanolamine, dimethylaminoethanol and tris(dimethylaminomethyl)phenol; 2-methylimidazole, 2-phenylimidazole, 2-phenyl- Imidazoles such as 4-methylimidazole, 2-phenyl-4,5-dihydroxymethylimidazole and 2-phenyl-4-methyl-5-hydroxymethylimidazole; organic phosphines such as tributylphosphine, diphenylphosphine and triphenylphosphine; Examples thereof include tetraphenylboron salts such as tetraphenylphosphonium tetraphenylborate and triphenylphosphine tetraphenylborate. These may be used alone or in combination of two or more.

The curing accelerator (B13) is preferably 0.01 to 10 parts by mass, more preferably 0.1 to 1 part by mass, based on 100 parts by mass of the total amount of the epoxy compound (B11) and the thermosetting agent (B12). Included in the amount of. By containing the curing accelerator (B13) in an amount within the above range, it has excellent adhesiveness even when exposed to high temperature and high humidity, and high reliability even when exposed to severe reflow conditions. Can be achieved. When the content of the curing accelerator (B13) is small, sufficient curing cannot be obtained due to insufficient curing, and when it is excessive, the curing accelerator having high polarity will form an adhesive interface in the film adhesive under high temperature and high humidity. However, the reliability of the semiconductor device is reduced by moving to the side and segregating.

(B2) Energy ray-curable component The film adhesive may contain the energy ray-curable component (B2). The energy ray-curable component (B2) contains a compound (B21) having a functional group that reacts upon irradiation with energy rays, and is polymerized and cured when irradiated with energy rays such as ultraviolet rays and electron rays. When the film adhesive contains both the thermosetting component (B1) and the energy ray-curable component (B2), the film adhesive can be pre-cured by irradiation with energy rays before the thermosetting step. Thereby, the adhesiveness of the interface between the film adhesive for die bonding and the support is controlled, and the process suitability of the film adhesive in a process performed before the thermosetting process such as a wire bonding process is improved. It becomes possible.
As the energy ray-curable component (B2), a compound (B21) having a functional group which reacts with energy ray irradiation may be used alone, but it is photopolymerized with a compound (B21) having a functional group which reacts with energy ray irradiation. It is preferable to use a combination of the initiators (B22).

(B21) Compound having a functional group that reacts by irradiation with energy rays A compound (B21) having a functional group that reacts by irradiation with energy rays (hereinafter, may be referred to as "energy ray reactive compound (B21)") is specifically described. Specifically, dicyclopentanyl dimethylene diacrylate, trimethylolpropane triacrylate, pentaerythritol triacrylate, pentaerythritol tetraacrylate, dipentaerythritol monohydroxypentaacrylate, dipentaerythritol hexaacrylate or 1,4-butylene glycol diacrylate. Acrylate compounds having a polymerized structure such as acrylate compounds such as oligoester acrylates, urethane acrylate oligomers, epoxy acrylates, polyether acrylates and itaconic acid oligomers, and acrylate compounds such as 1,6-hexanediol diacrylate , Those having a relatively low molecular weight; Such a compound has at least one polymerizable double bond in the molecule.

When the energy ray-reactive compound (B21) is used, the film adhesive preferably contains the energy ray-reactive compound (B21) in an amount of 1 to 1500 parts by weight with respect to 100 parts by weight of the polymer component (A). And more preferably 3 to 1200 parts by mass.

(B22) Photopolymerization Initiator By combining the energy ray reactive compound (B21) with the photopolymerization initiator (B22), the polymerization and curing time can be shortened and the light irradiation dose can be reduced.

Specific examples of the photopolymerization initiator (B22) include benzophenone, acetophenone, benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin isobutyl ether, benzoin benzoic acid, methyl benzoin benzoate, and benzoin dimethyl ketal. , 2,4-diethylthioxanthone, 1-hydroxycyclohexyl phenyl ketone, benzyl diphenyl sulfide, tetramethyl thiuram monosulfide, azobisisobutyronitrile, benzyl, dibenzyl, diacetyl, 1,2-diphenylmethane, 2-hydroxy- 2-methyl-1-[4-(1-methylvinyl)phenyl]propanone, 2,4,6-trimethylbenzoyldiphenylphosphine oxide, β-chloranthraquinone and the like can be mentioned. The photopolymerization initiator (B22) may be used alone or in combination of two or more.

The mixing ratio of the photopolymerization initiator (B22) is preferably 0.1 to 10 parts by mass, and 0.5 to 5 parts by mass with respect to 100 parts by mass of the energy ray reactive compound (B21). More preferable.
If the blending ratio of the photopolymerization initiator (B22) is less than 0.1 parts by mass, satisfactory curability may not be obtained due to insufficient photopolymerization, and if it exceeds 10 parts by mass, the residue does not contribute to photopolymerization. May be generated, which may cause a malfunction.

The film adhesive may contain the following components in addition to the binder component.

(C) Coupling Agent A coupling agent (C) having a functional group that reacts with an inorganic substance and a functional group that reacts with an organic functional group is added to a film-like adhesive to adherend to an adherend, adhesion and/or film-like form. It may be used to improve the cohesiveness of the adhesive. Further, by using the coupling agent (C), the water resistance can be improved without impairing the heat resistance of the cured film adhesive. Examples of such coupling agents include titanate coupling agents, aluminate coupling agents, silane coupling agents and the like. Among these, the silane coupling agent is preferable.

As the silane coupling agent, a silane coupling agent whose functional group that reacts with the organic functional group is a group that reacts with a functional group contained in the polymer component (A) or the thermosetting component (B1) is preferably used. To be done.
As such a silane coupling agent, γ-glycidoxypropyltrimethoxysilane, γ-glycidoxypropyltriethoxysilane, γ-glycidoxypropylmethyldiethoxysilane, β-(3,4-epoxycyclohexyl) Ethyltrimethoxysilane, γ-(methacryloxypropyl)trimethoxysilane, γ-aminopropyltrimethoxysilane, N-6-(aminoethyl)-γ-aminopropyltrimethoxysilane, N-6-(aminoethyl)- γ-aminopropylmethyldiethoxysilane, N-phenyl-γ-aminopropyltrimethoxysilane, γ-ureidopropyltriethoxysilane, γ-mercaptopropyltrimethoxysilane, γ-mercaptopropylmethyldimethoxysilane, bis(3-tri) Examples include ethoxysilylpropyl)tetrasulfane, methyltrimethoxysilane, methyltriethoxysilane, vinyltrimethoxysilane, vinyltriacetoxysilane, and imidazolesilane. These may be used alone or in combination of two or more.

The silane coupling agent is usually 0.1 to 20 parts by mass, preferably 0.2 to 10 parts by mass, and more preferably 100 parts by mass of the polymer component (A) and the thermosetting component (B1). Is included in a proportion of 0.3 to 5 parts by mass. If the content of the silane coupling agent is less than 0.1 parts by mass, the above effect may not be obtained, and if it exceeds 20 parts by mass, outgas may be caused.

(D) Inorganic filler film-like adhesive may contain an inorganic filler (D). By blending the inorganic filler (D) into the film adhesive, the coefficient of thermal expansion of the film adhesive after curing can be adjusted, and the heat of the film adhesive after curing can be applied to the adherend. The reliability of the semiconductor device can be improved by optimizing the expansion coefficient. It is also possible to reduce the moisture absorption rate of the film adhesive after curing.

Examples of preferable inorganic fillers include powders of silica, alumina, talc, calcium carbonate, titanium oxide, iron oxide, silicon carbide, boron nitride, and the like, spherical beads, single crystal fibers, glass fibers, and the like. Among these, silica filler and alumina filler are preferable. The said inorganic filler (D) can be used individually or in mixture of 2 or more types. The content of the inorganic filler (D) in the film-like adhesive is preferably 1 to 80% by mass, more preferably 5 as the content range of the inorganic filler (D) in order to more reliably obtain the above effects. ˜65% by mass, particularly preferably 10 to 50% by mass.

(E) General-purpose Additives In addition to the above, various additives may be added to the film adhesive, if necessary. Examples of various additives include a leveling agent, a plasticizer, an antistatic agent, an antioxidant, an ion scavenger, a gettering agent, and a chain transfer agent.

The film-like adhesive composed of each component as described above has initial adhesiveness and thermosetting property, and in an uncured state, lightly pressed to various adherends at room temperature, or heated to soften and adhered. can do. In addition, by setting the content ratio of the polymer component (A) and the thermosetting component (B1) in the film adhesive within a predetermined range, the use described later (the film adhesive for a chip group composed of a plurality of chip bodies can be used. In application (attaching and melting the film adhesive by releasing the heated gas to the film adhesive), the film adhesive can be fused to the chip size by releasing the heated gas.

In the state before heat curing, the melt viscosity of the film adhesive at 80° C. is preferably less than 1.0×10 ⁵ Pa·s, more preferably 1.0×10 ^{2 to} 7×10 ⁴ Pa·s, Particularly preferably, it is 5.0×10 ^{2 to} 5×10 ⁴ Pa·s. By setting the melt viscosity of the film adhesive within the above range, the film adhesive can be easily melted by heating gas.
When the film adhesive contains the energy ray-curable component (B2), the melt viscosity of the film adhesive at 80° C. in the state before heating and curing is within the above range, in the state before heating and curing. It means that the melt viscosity of the film adhesive at 80° C. is in the above range either before or after curing by irradiation with energy rays.
In this case, the melt viscosity of the film adhesive at 80° C. in the state before heat curing is preferably at least in the above range before curing by irradiation with energy rays, and both before and after curing by irradiation with energy rays. It is more preferable to be in the above range.

The film adhesive is obtained by forming an adhesive composition obtained by mixing the above components in appropriate proportions. When mixing the above components, each component may be diluted with a solvent in advance, or a solvent may be added during mixing. Further, when the adhesive composition is used, it may be diluted with a solvent.
Examples of such a solvent include ethyl acetate, methyl acetate, diethyl ether, dimethyl ether, acetone, methyl ethyl ketone, acetonitrile, hexane, cyclohexane, toluene, heptane and the like.

The thickness of the film adhesive is not particularly limited, but is preferably 3 to 300 μm, more preferably 5 to 250 μm, and particularly preferably 7 to 200 μm.

The film adhesive according to the present invention is attached to a chip group including a plurality of chip bodies. By sticking the film adhesive to a chip group consisting of multiple chips and dividing (melting) the film adhesive into chip sizes using heated gas, chips with an adhesive layer can be obtained and bonded. It is fixed to a predetermined position (a mounting portion such as a substrate or another chip) via the agent layer.

A chip group including a plurality of chip bodies is obtained by dividing an object to be cut (hereinafter referred to as “work”) into individual pieces. The method of dividing the work into individual pieces is not particularly limited, and examples thereof include a blade dicing method, a laser dicing method, a stealth dicing method, and a region on the surface of the work, other than a region that remains as a chip body after the work is divided into individual pieces. There is a so-called pre-dicing method in which a groove is provided in the area and the work is thinned from the back surface side of the work to the bottom of the groove. The material of the work is not limited, and various articles such as a semiconductor wafer, a glass substrate, a ceramic substrate, an organic material substrate such as an FPC, or a metal material such as a precision component can be used. The thickness of the chip body is not particularly limited, and is preferably 10 to 500 μm, and more preferably 10 to 100 μm when the chip body is further laminated in multiple stages on another chip body.

In addition, the film adhesive may be used as an adhesive layer that is peelably formed on the support. Hereinafter, an adhesive sheet having an adhesive layer formed on a support will be described.

(Adhesive sheet)
In use of the adhesive sheet, the adhesive layer is adhered to the adherend, the support is peeled off, and the adhesive layer is transferred to the adherend. The adhesive sheet according to the present invention may have any shape such as a tape shape and a label shape. The support may be a resin film having no tack on the surface, or may be a so-called dicing sheet (adhesive sheet having an adhesive layer).

Examples of the resin film used as the support of the adhesive sheet include polyethylene film, polypropylene film, polybutene film, polybutadiene film, polymethylpentene film, polyvinyl chloride film, vinyl chloride copolymer film, polyethylene terephthalate film, polyethylene na Phthalate film, polybutylene terephthalate film, polyurethane film, ethylene vinyl acetate copolymer film, ionomer resin film, ethylene/(meth)acrylic acid copolymer film, ethylene/(meth)acrylic acid ester copolymer film, polystyrene film Films such as a polycarbonate film, a polyimide film, and a fluororesin film are used. Further, these crosslinked films are also used. Furthermore, these laminated films may be used. Further, it is possible to use a film obtained by coloring these. When the adhesive layer has energy ray curability, it is preferable that it has energy ray permeability. In addition, when it is necessary to visually recognize the surface of the adherend to which the adhesive sheet is attached while the adhesive sheet is being attached, it is preferable that the visible light is transmissive (transparent or translucent).

The adhesive sheet according to the present invention is attached to various adherends, and the adhesive layer is peeled off from the support in a state where the adhesive layer remains adhered to the adherend. That is, it is used in a process including a step of transferring an adhesive layer from a support to an adherend. Therefore, the surface tension of the surface of the support (resin film) in contact with the adhesive layer is preferably 40 mN/m or less, more preferably 37 mN/m or less, and particularly preferably 35 mN/m or less. The lower limit value is usually about 25 mN/m. Such a resin film having a low surface tension can be obtained by appropriately selecting the material, or can be obtained by applying a release agent to the surface of the resin film and subjecting it to a release treatment.

As the release agent used for the release treatment of the resin film, alkyd-based, silicone-based, fluorine-based, unsaturated polyester-based, polyolefin-based, wax-based, etc. are used, but particularly alkyd-based, silicone-based and fluorine-based release agents. Is preferable because it has heat resistance.

In order to perform the release treatment on the surface of the resin film using the above release agent, the release agent may be used as it is without a solvent, or may be diluted or emulsified with a solvent, and then applied with a gravure coater, a Meyer bar coater, an air knife coater, a roll coater, or the like. Then, the release sheet coated with the release agent may be provided at room temperature or under heating, or may be cured by an electron beam to form the release agent layer.

Further, the surface tension of the resin film may be adjusted by laminating the films by wet lamination, dry lamination, hot melt lamination, melt extrusion lamination, coextrusion processing, or the like. That is, a film having a surface tension of at least one surface within a preferred range as a surface of the resin film in contact with the adhesive layer is formed so that the surface becomes a surface in contact with the adhesive layer. It may be used as a support by producing a laminate in which

Further, the support may be a pressure sensitive adhesive sheet having a pressure sensitive adhesive layer. The pressure-sensitive adhesive sheet has a pressure-sensitive adhesive layer on the resin film as described above, and the adhesive layer is releasably laminated on the pressure-sensitive adhesive layer. Therefore, the pressure-sensitive adhesive layer of the pressure-sensitive adhesive sheet can be composed of a known pressure-sensitive adhesive having removability, and by selecting a pressure-sensitive adhesive such as an ultraviolet curable type, a heat-foaming type, a water-swelling type, or a weak viscous type The peeling of the adhesive layer can be facilitated.

Further, the adhesive sheet may have a shape in which the support and the adhesive layer are preliminarily stamped into the same shape as the adherend. In particular, it is preferable that the laminate composed of the support and the adhesive layer is held on a long support.

The thickness of the support is usually 10 to 500 μm, preferably 15 to 300 μm, and particularly preferably 20 to 250 μm. When the support is a pressure-sensitive adhesive sheet, the pressure-sensitive adhesive layer usually occupies a thickness of about 1 to 50 μm in the thickness of the support.

The adhesive sheet is laminated with a release film on the upper surface of the adhesive layer or the like in order to protect the adhesive layer or the adhesive of the adhesive sheet before use, and the adhesive layer for fixing to the jig described below. You can leave it. For the release film, a plastic material such as a polyethylene terephthalate film or a polypropylene film coated with a release agent such as a silicone resin is used. Further, a pressure-sensitive adhesive layer or a pressure-sensitive adhesive tape may be separately provided on the outer peripheral surface of the adhesive sheet to fix other jigs such as a ring frame.

The method for producing the adhesive sheet is not particularly limited, and when the support is a resin film, the adhesive composition may be applied and dried on the resin film to produce an adhesive layer. Good. Alternatively, the adhesive layer may be provided on a release film and transferred to the resin film or the dicing sheet to produce the adhesive film. At any stage of the manufacturing process, the adhesive layer may be cut by punching or the like so as to have the same shape as the wafer to be attached or a concentric circle shape larger than the wafer.

(Method of manufacturing semiconductor device)
Next, a method of manufacturing a semiconductor device according to the present invention will be described.
The method for producing a semiconductor device according to the present invention includes a polymer component (A) and a thermosetting component (B1), the content of the polymer component (A) is 1 to 30% by mass, and the thermosetting component (B1). A step of adhering a film adhesive having a content of 40) to 40% to 70% by mass to a chip group composed of a plurality of chip bodies (step (a)), and releasing heated gas toward the film adhesive. Accordingly, a step ((b) step) of fusing the film adhesive is included. An example will be described below.

In the first example of the method for manufacturing a semiconductor device according to the present invention, first, as a work, a semiconductor wafer having a circuit formed on the front surface and the back surface ground is prepared.

The semiconductor wafer may be a silicon wafer or a compound semiconductor wafer such as gallium arsenide. The circuit can be formed on the surface of the wafer by various methods including conventionally used methods such as an etching method and a lift-off method.

Next, a groove is provided in a region on the front surface of the semiconductor wafer other than a region that remains as a chip after the semiconductor wafer is divided into individual pieces, and the semiconductor wafer is thinned from the back surface side of the semiconductor wafer to the bottom of the groove. It is preferable to perform the step (step (c)) of obtaining a chip group including a plurality of semiconductor chips by performing the treatment.

Specifically, a groove having a cut depth smaller than the wafer thickness is formed in the surface of a semiconductor wafer on which a circuit is formed, and an adhesive sheet called a surface protection sheet is attached to the circuit formation surface. The method for forming the groove is not particularly limited. The method of attaching the surface protection sheet is not particularly limited. Thereafter, the back surface of the semiconductor wafer is ground to reduce the thickness of the wafer, and the semiconductor wafer is diced into individual chips, and a chip group including a plurality of semiconductor chips is obtained.

Next, the film adhesive according to the present invention is attached to a chip group composed of a plurality of semiconductor chips (step (a)). The attaching method is not particularly limited. Prior to applying the film adhesive according to the present invention, a chip group composed of a plurality of semiconductor chips may be transferred to another pressure-sensitive adhesive sheet, and then the film adhesive may be applied. When a chip group including a plurality of semiconductor chips is transferred to another adhesive sheet, a film adhesive can be attached to the circuit surface of the semiconductor chip.

Hereinafter, a film adhesive is used as an adhesive layer, and an adhesive sheet in which the adhesive layer is releasably laminated on a support is attached to a chip group consisting of a plurality of semiconductor chips held on a surface protection sheet. The case will be described.

First, the support of the adhesive sheet is peeled off from the laminate of the adhesive sheet and the chip group composed of the plurality of semiconductor chips held on the surface protection sheet. The peeling method is not particularly limited.

Then, the heated gas is discharged toward the adhesive layer (film adhesive) from the side of the film adhesive that is not attached to the chip group (step (b)). The heated gas is discharged from the nozzle of the heated gas generator toward the film adhesive and is sprayed onto the film adhesive existing in the same region as between the semiconductor chips in a plan view. Since the heated gas is at a high temperature, the film adhesive existing in the same area as the semiconductor chips in plan view is melted or softened, and the film adhesive is fused to the chip size to obtain the chip with the adhesive layer. ..

The heating gas may be sprayed on the entire surface of the film adhesive, or may be sprayed along the film adhesive existing in the same region as between the semiconductor chips in a plan view. Further, when spraying along a film adhesive existing in the same region as the semiconductor chips in a plan view, spraying in a range narrower than the width of the film adhesive existing in the same region as between the semiconductor chips in a plan view Alternatively, it may be sprayed over a wider range than the width.

The temperature of the heated gas may be at least a temperature at which the film adhesive softens, and is usually 50 to 200°C, preferably 60 to 120°C. The pressure of the heated gas is preferably 0.15 MPa or higher, more preferably 0.3 MPa or higher. If the pressure of the heated gas is less than 0.15 MPa, the film adhesive may not melt. Further, the flow rate of the heated gas is preferably at 0.0005 m ³ / sec or more, more preferably 0.0008m ³ / sec or more. Here, the temperature of the heated gas is not the temperature of the outlet of the nozzle, but the temperature when the heated gas reaches the film adhesive, that is, the surface temperature of the film adhesive.

In addition, in the method for manufacturing a semiconductor device according to the present invention, the film adhesive is melted or softened by heating gas to melt it, but other heating means other than the heating gas can be used in combination. Other heating means includes a heating stage, and the heating gas may be released toward the film adhesive on the heating stage.

Then, if necessary, the adhesive layer-provided chip group may be transferred from the surface protective sheet to another pressure-sensitive adhesive sheet to expand the other pressure-sensitive adhesive sheet. By expanding, the interval between the chips with the adhesive layer is expanded, and the chips with the adhesive layer can be picked up more easily.

The chip with the adhesive layer can be picked up by a known method. Then, the semiconductor chip is mounted on the die pad of the lead frame, which is the chip mounting portion, or on the surface of another semiconductor chip (lower chip) via the adhesive layer. The chip mounting portion is heated before mounting the semiconductor chip or immediately after mounting it in order to improve the adhesiveness of the adhesive layer. The heating temperature is usually 80 to 200° C., preferably 100 to 180° C., and the heating time is usually 0.1 seconds to 5 minutes, preferably 0.5 seconds to 3 minutes. In addition, the pressure applied during placement is usually 1 kPa to 200 MPa.

After the semiconductor chip is mounted on the chip mounting part, the adhesive layer is heated by heating it before resin sealing, instead of waiting for the adhesive layer to be fully cured by using heating in resin sealing as described below. It may be cured. The heating conditions at this time are in the above-mentioned heating temperature range, and the heating time is usually 1 to 180 minutes, preferably 10 to 120 minutes.

Alternatively, the adhesive layer may be permanently cured by using the heating in the resin encapsulation which is usually performed in the package manufacturing, without performing the heat treatment after the placement and performing the temporary adhesion state. Through these steps, the adhesive layer is cured, and a semiconductor device in which the semiconductor chip and the chip mounting portion and the like are firmly bonded can be obtained. Since the adhesive layer is softened under the die-bonding condition, it is sufficiently embedded in the unevenness of the chip mounting portion, the occurrence of voids can be prevented, and the package reliability is improved.

In the first example, individual chips are obtained at the end of the thinning process. Therefore, there is no risk of wafer damage due to handling thinned and undivided wafers. Therefore, it is suitable for a case where there is a high risk of wafer damage due to handling a thinned wafer that has not been divided into individual pieces, such as a case where the chip is thinned to about 10 to 100 μm.

In the second example of the method for manufacturing a semiconductor device according to the present invention, the surface (back surface) opposite to the circuit surface of the prepared semiconductor wafer is ground. The grinding method is not particularly limited and may be ground by a known means using a grinder or the like. When grinding the back surface, an adhesive sheet called a surface protection sheet is attached to the circuit surface in order to protect the circuit on the front surface. In the back surface grinding, the circuit surface side (that is, the surface protection sheet side) of the wafer is fixed by a chuck table or the like, and the back surface side where no circuit is formed is ground by a grinder. The thickness of the wafer after grinding is not particularly limited, but is usually about 20 to 500 μm.

Next, the back surface side of the semiconductor wafer and the ring frame are fixed to the adhesive layer of a known dicing sheet. Then, the semiconductor wafer is cut using a cutting means such as a dicing saw to obtain a chip group including a plurality of semiconductor chips. The cutting depth at this time is a depth that takes into consideration the thickness of the semiconductor wafer and the wear of the dicing saw.

Next, a chip group including a plurality of semiconductor chips is transferred to a known adhesive tape, and the dicing sheet is peeled off. The method for peeling the dicing sheet is not particularly limited. After that, the step (a) and the above step (b) are performed. For example, a film adhesive is used as an adhesive layer, and an adhesive sheet having the adhesive layer releasably laminated on a support is attached to the back surface of a semiconductor wafer (step (a)). Then, the support of the adhesive sheet is peeled off. After that, the step (b) and the subsequent steps can be performed in the same manner as that described in the first example.

Hereinafter, the present invention will be described with reference to examples, but the present invention is not limited to these examples. In addition, in the following Examples and Comparative Examples, <melt viscosity at 80° C.> and <hot air cut test> were performed as follows.

<Melt viscosity at 80°C>
Samples were obtained by laminating the adhesive layers obtained in the examples and comparative examples to a minimum thickness of more than 1.5 mm. The melt viscosity of the film adhesive before curing was measured using a capillary rheometer (CFT-100D manufactured by Shimadzu Corporation) at a test start temperature of 50° C., a temperature rising rate of 10° C./min, a test force of 50 kgf, and a die hole diameter of 0. The measurement was performed under the conditions of 0.5 mmφ and a die length of 1.0 mm.

<Hot air cutting test>
(1) Preparation of pre-diced chip A mirror-polished silicon wafer having a diameter of 300 mm and a thickness of 775 μm should be cut with a dicing device (DFD-6361, manufactured by Disco Corporation) to a depth of 70 μm and a chip size of 10 mm×10 mm. A groove was formed.
Then, a surface protection sheet (Adwill E-3125KL, manufactured by Lintec Co., Ltd.) was attached to the grooved surface, and a backside grinding machine (DGP-8760, manufactured by Disco Co.) was used until the thickness of the wafer became 30 μm. The back surface was ground and divided into chips.
The surface of the surface protection sheet was irradiated with ultraviolet rays using an ultraviolet ray irradiation device (RAD-2000m/12, manufactured by Lintec Co., Ltd.) (illuminance 220 mW/cm ² , light amount 380 mJ/cm ² ).
(2) Adhesion of Adhesive Sheet and Peeling of Surface Protective Sheet The adhesive sheet produced in the examples or comparative examples from which the release film was removed was attached so that the adhesive layer was in contact with the chip. At this time, the chip was heated to 60°C.
After that, the adhesive sheet was cut according to the shape of the wafer before the chip group was singulated, and the support of the adhesive sheet attached to the chip was peeled off.
Subsequently, the adhesive layer was melt-cut (hot air cut) by releasing heated gas toward the adhesive layer exposed by peeling the support. Specifically, a nozzle that discharges a heated gas with a gas temperature of 70° C. at a flow rate of 50 L/min is moved at a moving speed of 50 mm/sec along the line between chips on the adhesive layer heated to 60° C. Was cut with hot air.
Next, using a tape mounter (RAD2700F/12, manufactured by Lintec Co., Ltd.), a dicing sheet (G-18 manufactured by Lintec Co., Ltd.) was attached to the hot air-cut adhesive layer, which was then conveyed to a peeling unit to provide a surface protection sheet. Peeled off.
The evaluation of the hot air cut test was carried out by visual confirmation with a microscope, and in one line of the film adhesive that released hot air, the case where there was no unblown portion was “good”, and the case where there were unblown portions "Poor"

<Adhesive composition>
The respective components constituting the adhesive layer (film adhesive) are shown below.
(AB-1) An acrylic polymer obtained by copolymerizing 55 parts by mass of n-butyl acrylate, 10 parts by mass of methyl acrylate, 20 parts by mass of glycidyl methacrylate and 15 parts by mass of 2-hydroxyethyl acrylate (weight average molecular weight: 900,000). , Glass transition temperature: -29°C)
(A1) Acrylic polymer obtained by copolymerizing 85 parts by mass of methyl acrylate and 15 parts by mass of 2-hydroxyethyl acrylate (weight average molecular weight: 450,000, glass transition temperature: 9° C.)
(AB-2) Acrylic polymer obtained by copolymerizing 35 parts by mass of n-butyl acrylate, 32 parts by mass of ethyl acrylate, 3 parts by mass of glycidyl methacrylate and 30 parts by mass of acrylonitrile (weight average molecular weight: 700,000, glass transition temperature : -5°C)
(B11-1) Bisphenol A type epoxy resin (BPA328 manufactured by Nippon Shokubai Co., epoxy equivalent: 235 g/eq)
(B11-2) Phenylene skeleton type epoxy resin (EPPN-502H manufactured by Nippon Kayaku Co., epoxy equivalent: 167 g/eq)
(B11-3) Phenylene skeleton type epoxy resin (Nippon Kayaku Co., Ltd. EPPN-501H, epoxy equivalent: 165 g/eq)
(B12-1) Novolac type phenolic resin (Showa High Polymer BRG-556, phenolic hydroxyl group equivalent: 103 g/eq)
(B12-2) Novolak type phenol resin (H-4 manufactured by Meiwa Kasei Co., phenolic hydroxyl group equivalent: 104 g/eq)
(B13) 2-Phenyl-4,5-dihydroxymethylimidazole (CUREZOL 2PHZ-PW manufactured by Shikoku Chemicals Co., Ltd.)
(B21) Dicyclopentanyl dimethylene diacrylate (KAYARAD R-684 manufactured by Nippon Kayaku Co., Ltd.)
(B22) 1-Hydroxycyclohexyl phenyl ketone (Ciba Specialty Chemicals Irgacure 184)
(C) γ-glycidoxypropyltriethoxysilane (KBE-403 manufactured by Shin-Etsu Chemical Co., Ltd.)
(D) Spherical silica (SC2050MA manufactured by Admatex)

(Examples and comparative examples)
The above components were blended in the amounts shown in Table 1 to obtain an adhesive composition. A solution of the obtained composition in methyl ethyl ketone (solid concentration: 61% by weight) was applied to the release-treated surface of a release film (SP-PET381031 manufactured by Lintec Co., Ltd.) release-treated with silicone so as to have a thickness of 20 μm after drying. , Drying (drying condition: 100° C. for 1 minute in an oven) to form an adhesive layer (film adhesive) on the release film, and transferring the adhesive layer to a support (polyolefin substrate). To obtain an adhesive sheet.

Each evaluation was performed on the adhesive layer (film-like adhesive) of the obtained adhesive sheet. The results are shown in Table 2.

Claims (5)

A film adhesive containing a polymer component (A) and a thermosetting component (B1),
In the state before heat curing, the melt viscosity at 80° C. is less than 1.0×10 ⁵ Pa·s,
A film-like adhesive used for melting and cutting the film-like adhesive by adhering the film-like adhesive to a chip group composed of a plurality of chip bodies and releasing heated gas toward the film-like adhesive. A chip group including the plurality of chip bodies is a region on the front surface of the work, and a groove is provided in a region other than a region that remains as a chip body after the work is singulated, and reaches the bottom of the groove from the back surface side of the work. The film-like adhesive according to claim 1, which is obtained by subjecting a work to a thinning treatment. An adhesive sheet in which the film-like adhesive according to claim 1 or 2 is used as an adhesive layer, and the adhesive layer is releasably laminated on a support. A method for manufacturing a semiconductor device, which includes the following steps (a) and (b):
(A) A film adhesive containing the polymer component (A) and the thermosetting component (B1) and having a melt viscosity at 80° C. of less than 1.0×10 ⁵ Pa·s in a state before heat curing. A step of sticking to a chip group composed of a plurality of chip bodies, and (b) a step of melting the film adhesive by releasing heated gas toward the film adhesive. The method for manufacturing a semiconductor device according to claim 4, further comprising the following step (c) before performing step (a):
(C) A groove is provided in a region on the front surface of the work other than a region that remains as a chip body after the work is singulated, and the work is thinned from the back surface side of the work to the bottom of the groove. Performing a step of obtaining a chip group including the plurality of chip bodies.