KR102401234B1 - Adhesion having energy ray curable compounds and method for manufacturing semiconductor chip using the same - Google Patents

Abstract

The present invention relates to a preparation method of an adhesive sheet and a semiconductor chip which comprises an energy ray-curable compound. According to the preparation method of the present invention, an adhesive layer comprising an adhesive component and a compound containing siloxane is laminated not to be peeled on a substrate so that the surface tension on a back side of a wafer is lowered and the shape of a small semiconductor chip during dicing is maintained well. In addition, when cured by an energy ray, the adhesive force is sufficiently lost so that the semiconductor chip can be easily picked up.

Description

Adhesion having energy ray curable compounds and method for manufacturing semiconductor chip using the same}

The present invention relates to a pressure-sensitive adhesive sheet used for a semiconductor chip, and more particularly, by lowering the surface energy between the pressure-sensitive adhesive sheet formed of an adhesive layer with a compound having a siloxane and the wafer surface, filling between the bonded wafer and the substrate It relates to a pressure-sensitive adhesive sheet containing an energy ray-curable compound to prevent contamination of the back surface of the semiconductor chip by the used filler, and to a method for manufacturing a semiconductor chip.

Recently, a method of forming a protrusion called a bump on the surface of a wafer on which a pattern is formed and connecting to a substrate has been widely used. At this time, the bump serves not only as an electrical connection but also as a mechanical connection, and since stress cannot be controlled only with the bump due to the difference in thermal expansion coefficient between the chip and the substrate, an underfill process that fills the space between the bump and the bump with a polymer must be performed in parallel. .

In this way, the underfill process filling the gap between the bump and the substrate is performed by injecting the underfill material from the side of the chip into the capillary so that it flows and fills the gap. In this case, contamination occurs on the back surface of the semiconductor chip by the underfill material, and the semiconductor chip with the contaminated back surface is recognized as a chip crack in the visual inspection equipment, thereby reducing the semiconductor production yield.

Accordingly, there is a need for a method capable of preventing contamination of the back surface of the semiconductor chip by the filler in a simpler manner in the process of underfilling.

In addition, a number of prior documents are searched for a method of dicing, separating, and picking up a semiconductor wafer with respect to the conventional pressure-sensitive adhesive sheet for dicing. It was difficult to find literature on the technology used.

Accordingly, there is a demand for a new technology and a new process for reducing the surface tension of the back surface of the separated chip while preventing contamination of the filler on the back surface of the semiconductor in the underfill process.

Republic of Korea Patent Registration No. 10-1368171 (published on February 27, 2014) Republic of Korea Patent Publication No. 10-2018-0048811 (published on May 10, 2018)

An object of the present invention devised to solve the above needs is to maintain the shape of the fragmented semiconductor chip well during dicing, and after curing by irradiating an energy ray, the adhesive force is sufficiently lost to easily pick up the chip. Provided is an adhesive sheet containing an energy ray-curable compound to prevent contamination on the back side of the semiconductor chip when the fragmented semiconductor chip is attached to the substrate and then underfilled with a filler using a polymer and a method for manufacturing a semiconductor chip. is in

In order to achieve the above object, in the pressure-sensitive adhesive sheet containing the energy ray-curable compound according to the present invention, the pressure-sensitive adhesive layer including the pressure-sensitive adhesive component and the compound containing the siloxane may be non-peelably laminated on the substrate.

Here, the surface tension of the adhesive layer may be 30 mN/m or less.

And the adhesive component may be energy ray curable.

On the other hand, in the method of manufacturing a semiconductor chip according to a preferred embodiment of the present invention, the step of grinding the back surface of the semiconductor wafer including bumps on the surface; adhering the pressure-sensitive adhesive sheet to the back surface of the wafer and dicing to form a semiconductor chip; The method may include: an irradiation process of lowering adhesive strength by irradiating an energy ray to the adhesive sheet to which the semiconductor chip is attached; and a pick-up process of removing the semiconductor chip from the adhesive sheet.

As described above, according to the present invention, by producing and using an adhesive sheet containing a compound containing siloxane, the surface tension of the back surface of the wafer is lowered, and the shape of the fragmented semiconductor chip is well maintained during dicing, and the energy ray When cured by , the adhesive force is sufficiently lost, there is an effect that the semiconductor chip can be easily picked up.

In addition, when the filler is filled using the capillary after the wafer is adhered to the substrate, it is possible to prevent the phenomenon that the excessively filled filler contaminates the back surface of the semiconductor chip.

In addition, the siloxane group-containing compound contained in the adhesive layer forms an oil film on the grinding surface of the wafer, which lowers the interaction between the grinding surface of the wafer and the adhesive to prevent excessive adhesion, and provides adequate peelability to improve chip pickup. There is an effect that can be significantly improved.

Hereinafter, preferred embodiments will be described in detail with reference to the accompanying drawings so that those of ordinary skill in the art can easily practice the present invention. In addition, among the components mentioned in the various embodiments, mutually similar components and related components in each embodiment may be replaced, replaced, or added. However, when it is determined that a detailed description of a related well-known function or configuration may unnecessarily obscure the gist of the present invention in describing the operating principle of the preferred embodiment of the present invention in detail, the detailed description thereof will be omitted.

<Adhesive sheet>

Hereinafter, the pressure-sensitive adhesive sheet containing the energy ray-curable compound according to a preferred embodiment of the present invention will be described in detail.

In the adhesive sheet according to a preferred embodiment of the present invention, an adhesive layer is formed on a substrate. Even if the adhesive sheet is adhered or peeled off the adherend, the adhesive layer is not transferred to the adherend and may be separated from the adherend together with the substrate.

Here, the substrate is not particularly limited, but those having excellent water resistance and heat resistance are suitable, and the types include polyethylene terephthalate, polyethylene naphthalate, low density polyethylene (LDPE), linear low density polyethylene (LLDPE), ethylene/propylene copolymer, polypropylene , polybutene, polybutadiene, ethylene/vinyl acetate copolymer (EVA), ethylene/(meth)acrylic acid copolymer, ethylene/(meth)acrylic acid ethyl copolymer, polyvinyl chloride, vinyl chloride/vinyl acetate copolymer, ethylene/ A synthetic resin film made of a vinyl chloride/vinyl acetate copolymer, polyurethane, polyimide, ionomer, or the like may be used. In addition, two or more types of synthetic resin films made of these materials may be laminated or used in combination. And the process of coloring or printing these synthetic resin films may be possible in a range that does not impede the transmission of energy rays.

The thickness of such a substrate is not particularly limited, but is usually 30 to 300 μm, and preferably 40 to 250 μm. And in order to improve the adhesion of the substrate in contact with the adhesive layer of the substrate, corona treatment may be performed or a primer coating treatment may be performed.

For example, when the pressure-sensitive adhesive sheet is used in a method of manufacturing a semiconductor chip, the distance between the semiconductor chips may be increased by increasing the pressure-sensitive adhesive sheet when the semiconductor chip is picked up. In this case, the substrate is low-density polyethylene (LDPE) with excellent stretchability, linear low-density polyethylene (LLDPE), linear low-density polyethylene (LLDPE), ethylene/propylene copolymer, polypropylene, polybutene, polybutadiene, ethylene/vinyl acetate copolymer (EVA), ethylene/(meth)acrylic acid copolymer, ethylene/(meth)acrylic acid ethyl copolymer, polyvinyl chloride, vinyl chloride/vinyl acetate copolymer, ethylene/vinyl chloride/vinyl acetate copolymer, polyurethane film, etc. this can be used (Delete later sentences)

In this case, when the adhesive component of the pressure-sensitive adhesive sheet implements an adhesive layer in which the adhesive component is cured by an energy beam, such as ultraviolet rays, a material through which an energy beam is transmitted may be used.

At this time, the type of the adhesive component of the adhesive sheet is not specified as long as it has suitable re-peelability, and for example, it may be made of general-purpose adhesives such as rubber, acrylic, silicone, urethane, and vinyl ether. Among these, it may be preferable to use an acrylic pressure-sensitive adhesive in particular.

Here, the acrylic pressure-sensitive adhesive may contain, for example, a (meth)acrylic acid ester monomer and a (meth)acrylic acid ester copolymer obtained by using a functional group-containing monomer as main ingredients.

In addition, the (meth)acrylic acid ester monomer is, for example, (meth) methyl acrylate, (meth) acrylate, (meth) acrylic acid propyl, (meth) butyl acrylate, (meth) acrylic acid hexyl, (meth) acrylate octyl, ( 2-ethylhexyl meth)acrylate and isooctyl (meth)acrylate may be used.

And the (meth)acrylic acid ester copolymer as a material of the adhesive layer preferably has a molecular weight of 100,000 or more, and particularly preferably 150,000 to 1,000,000. And the glass transition temperature of the acrylic pressure-sensitive adhesive is usually less than or equal to 20 ℃, preferably about -70 ~ 0 ℃, it may have adhesiveness at room temperature of about 23 ℃.

On the other hand, the pressure-sensitive adhesive layer of the pressure-sensitive adhesive sheet may be preferably made of a composition including an energy ray-curable pressure-sensitive adhesive that is cured by irradiation of energy rays such as ultraviolet rays and peeled again. In this case, the energy ray-curable pressure-sensitive adhesive can be generally made from a (meth)acrylic acid ester copolymer and an energy ray-polymerizable compound as main components.

Here, the energy ray polymerizable compound may be, for example, a low molecular weight compound having at least two or more photopolymerizable carbon-carbon double bonds in a molecule capable of forming a three-dimensional network by irradiation with light. Specifically, trimethylolpropane triacrylate, tetramethylolmethane tetraacrylate, pentaerythritol triacrylate, pentaerythritol tetraacrylate, dipentaerythritol monohydroxypentaacrylate, dipentaerythritol hexaacrylate or 1; 4-butylene glycol diacrylate, 1,6-hexanediol diacrylate, polyethylene glycol diacrylate, oligoester acrylate, and urethane acrylate may be used.

And in the energy ray-curable adhesive layer, the mixing ratio of the (meth)acrylic acid ester copolymer and the energy ray polymerizable compound is 10 to 1000 parts by weight of the energy ray polymerizable compound with respect to 100 parts by weight of the (meth)acrylic acid ester copolymer, preferably may be 20 to 500 parts by weight, particularly preferably 50 to 200 parts by weight. In this case, the adhesive sheet obtained has a large initial adhesive force, and the adhesive force after energy ray irradiation may be greatly reduced. Therefore, this pressure-sensitive adhesive sheet securely grips a wafer or a chip during dicing, and the adhesive force is greatly reduced by energy ray irradiation during pickup, so that the pickup of the chip can be reliably performed.

Moreover, the energy-beam-curable adhesive may be formed from the energy-beam curable copolymer which has an energy-beam polymeric group in a side chain. Such an energy-ray-curable copolymer has a property of having both adhesiveness and energy-beam curability. In addition, the energy ray-curable copolymer may be one in which a side chain having an energy ray polymerizable carbon-carbon double bond is installed in the (meth)acrylic acid ester copolymer as described above. For example, it can be obtained by reacting a compound containing an energy ray polymerizable carbon-carbon double bond with a substituent capable of reacting with the functional group of the (meth)acrylic acid ester copolymer with the (meth)acrylic acid ester copolymer.

Here, when using ultraviolet light as an energy ray, it may be preferable to mix a photoinitiator with the adhesive layer. The photopolymerization initiator is specifically, benzophenone, acetophenone, benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin isobutyl ether, benzoin benzoic acid, methyl benzoin benzoate, benzoin dimethyl ketal. , 2,4-diethylthioxanthone, α-hydroxycyclohexylphenylketone, benzyldiphenylsulfide, tetramethylthiurammonosulfide, azobisisobutyronitrile, benzyl, dibenzyl, diacetyl, β-chloro Anthraquinone or 2,4,6-trimethylbenzoyldiphenylphosphine oxide may be used. These photoinitiators can be used individually or in combination of 2 or more types.

In this case, the blending amount of the photopolymerization initiator may be appropriately selected from the range of 0.5 to 30 parts by weight, preferably 0.5 to 10 parts by weight, based on 100 parts by weight of the energy ray-curable pressure-sensitive adhesive (energy ray-curable copolymer).

On the other hand, the pressure-sensitive adhesive layer may be formulated with a siloxane group-containing compound.

The siloxane group-containing compound may have a weight average molecular weight in the range of 1,000 to 200,000, and may be an ester copolymer comprising a backbone and polysiloxane-containing side chains attached to the backbone.

In addition, the molecular weight of the siloxane-containing compound is preferably relatively low, the molecular weight may be 1,000 to 200,000, preferably 2,000 to 50,000. If the molecular weight is within this range, the siloxane group-containing compound present at the interface between the semiconductor chip and the pressure-sensitive adhesive after attachment is easily transferred to the chip.

In addition, the compound containing siloxane having a molecular weight in this range has good compatibility with the acrylic adhesive and can realize the property of lowering the surface energy well, and the compound with a large molecular weight beyond this range is incompatible with the acrylic adhesive due to incompatibility with the acrylic adhesive. It can cause cratering phenomena such as the Hammaton effect.

Here, the polysiloxane-containing side chains attached to the backbone of the copolymer, independently of each other, are represented by partial structure (a).

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Here, the parameter a may be in the range of 1 to 200, and the parameter b may be in the range of 1 or 100.

Also, R ^c , R ^d , ^Re , R ^f , R ^g and R ^h is independently of each other a linear, saturated, halogenated or non-halogenated alkyl group having 1 to 30 carbon atoms, a branched, saturated, halogenated or non-halogenated alkyl group having 3 to 30 carbon atoms, 6 to 30 carbon atoms an aryl group having carbon atoms, in each case an alkylaryl group or arylalkyl group having 7 to 30 carbon atoms, or an alkoxyalkyleneoxide residue or an alcoholcypolyalkyleneoside residue.

In addition, the compound A to be copolymerized with the siloxane compound may be an aralkyl compound, an acrylic compound, a polyether compound, or a carboxyl compound. In addition, since it is preferable that the reactivity with the (meth)acrylic acid ester copolymer is inactive, it may be preferable that the compound is not reactive with the functional group of the ester copolymer such as an isocyanate group, an amine group, or an epoxy group.

The mixing ratio of the siloxane group-containing compound cannot be uniformly determined depending on the type of the siloxane group-containing compound, but generally 0.01 to 10 parts by weight, preferably 0.02 to 5 parts by weight, to 100 parts by weight of the acrylic pressure-sensitive adhesive component. can

As such, the pressure-sensitive adhesive layer may be substantially composed of a conventional pressure-sensitive adhesive component or an energy-ray-curable pressure-sensitive adhesive component, an energy-polymerizable compound having at least two double bonds, a photoinitiator that reacts during energy-beam polymerization, and a siloxane group-containing compound. Here, the conventional adhesive component may be an energy ray-curable adhesive component as described above.

In addition, the pressure-sensitive adhesive layer may contain other components in addition to the pressure-sensitive adhesive component and the siloxane group-containing compound within a range that does not impair the spirit of the present invention. The other component may be at least one of a crosslinking agent, a tackifier, an inorganic filler, a plasticizer, an antistatic agent, an antioxidant, an anti-aging agent, a pigment, and a dye in addition to the above-described photopolymerization initiator.

The crosslinking agent may be a conventional one such as a polyvalent isocyanate compound, a polyvalent aziridine compound, and a chelate compound. Here, the polyhydric isocyanate compound may be toluylene diisocyanate, diphenylmethane diisocyanate, hexamethylene diisocyanate, isophorone diisocyanate, and an adduct of polyhydric isocyanate thereof and polyhydric alcohol. In addition to the crosslinking agent, a crosslinking agent other than polyisocyanate may be used in combination. For example, the other cross-linking agent may be at least one of an epoxy-based cross-linking agent, an aziridine-based cross-linking agent, a melamine resin-based cross-linking agent, a urea resin-based cross-linking agent, an acid anhydride-based cross-linking agent, a polyamine-based cross-linking agent, and a carboxyl group-containing polymer-based cross-linking agent.

Such a crosslinking agent may be in an amount of usually 0.01 to 10 parts by weight, preferably 0.1 to 5 parts by weight, and more preferably 0.5 to 3 parts by weight based on 100 parts by weight of the adhesive component.

On the other hand, the thickness of the pressure-sensitive adhesive layer is not particularly limited, but is usually 1 to 100 μm, preferably 5 to 40 μm.

In addition, when an adherend such as a semiconductor wafer is adhered to an adhesive layer containing a siloxane group-containing compound, particularly, an unreacted siloxane group-containing compound, the siloxane group-containing compound in the adhesive layer oozes out, and this state is at the interface with the adherend. It can be in the same state as an oil film is formed on the As a result, an oil film is formed on the back surface of the silicon wafer in close contact, and the surface energy is lowered, and it is possible to prevent the chip surface from being contaminated by the epoxy compound when underfill using the capillary is performed.

In addition, since the above-formed oil film prevents the adhesive layer from excessively adhering to the adherend, proper peelability can be obtained even when the back surface of the wafer is activated immediately after grinding. Therefore, there is an effect that the pickup failure of the chip after dicing is also reduced.

<Method for producing adhesive sheet>

The method for manufacturing the pressure-sensitive adhesive sheet according to a preferred embodiment of the present invention is not particularly limited, and a composition obtained by dissolving or dispersing each component constituting the pressure-sensitive adhesive layer in an appropriate solvent may be prepared by coating and drying the composition on a substrate. As another example, it may be produced by molding the pressure-sensitive adhesive layer on a release film and transferring it to a substrate. In addition, in order to protect the adhesive layer before use of the adhesive sheet, a release film may be laminated on the upper surface of the adhesive layer.

<Method for manufacturing semiconductor device>

Hereinafter, a method of manufacturing a semiconductor device using an adhesive sheet according to a preferred embodiment of the present invention will be described.

In the method of manufacturing a semiconductor device according to a preferred embodiment of the present invention, first, the back surface of a semiconductor wafer (hereinafter, referred to as 'wafer') having a circuit formed thereon is ground.

In this case, the wafer may be a silicon wafer, or a compound semiconductor wafer such as gallium or arsenic.

Although the thickness of this wafer before grinding is not specifically limited, Usually, it may be about 650-750 micrometers.

In addition, a surface protection sheet may be adhered to the circuit surface of the wafer in order to protect the circuit on the surface during back grinding.

In this case, the surface protection sheet may be used without any particular limitation on various re-peelable pressure-sensitive adhesive sheets used for this type of use.

In addition, the back surface grinding can be performed by a well-known method using a grinder, a suction table for fixing a wafer, etc. After the backside grinding step, a treatment for removing the crushed layer generated by the grinding may be performed.

The wafer finishing thickness after the backside grinding process is not particularly limited, but may be about 20 to 100 μm because it can be used for in-line processing suitable for ultra-thin processing. In addition, since it can be applied to a normal process, it may be a normal finishing thickness of about 100 to 400 μm.

Next, an adhesive sheet is adhered to the back surface of the wafer. The adhesion of the pressure-sensitive adhesive sheet is generally performed by a mounter having a roller, but is not particularly limited.

Here, the adhesive sheet may be particularly preferably a UV-curable adhesive sheet capable of reducing the height of the pin during pickup by improving pickup properties. In addition, in the pressure-sensitive adhesive sheet, since the siloxane group-containing compound included in the pressure-sensitive adhesive layer forms an oil film on the ground surface of the wafer, the interaction between the pressure-sensitive adhesive and the ground surface of the wafer due to the adhesive force may be reduced. For this reason, for example, even on a wafer in which the grinding surface immediately after grinding is in an activated state, the case where the wafer and the adhesive layer are not excessively adhered is eliminated, and appropriate peelability is achieved. can be

Finally, the sectioned integrated circuit (IC) flip chip or die is attached to the bump and the printed wiring board (PWB) and goes through a reflow process to melt the bump and solder the chip to the substrate. Here, the solder ball (bump) may form a direct electrical connection between the conductive trace on the packaging substrate or the motherboard and the bump-type chip. In this process, there may be a problem in that the adhesion reliability between the solder ball and the pad is weakened.

In order to improve this problem and reinforce the adhesive force of the solder balls, an underfill of applying an epoxy resin or the like to the space between the solder balls and the pad may be performed.

In order to avoid a shortage of underfill material filling the portion between the chip and the substrate, i.e. voids, the underfill material can generally be used in somewhat excess. This may cause the underfill material to flow out due to heating of the underfill material.

However, when the present invention is applied, since the pressure-sensitive adhesive sheet lowers the surface energy of the back surface of the semiconductor chip in the dicing process, contamination due to excess of the underfill material can be prevented.

<Example>

Hereinafter, although an Example demonstrates this invention, this invention is not limited to these Examples.

In addition, in the following Examples and Comparative Examples, the evaluation of 'pickup success height' and 'contamination by underfill' was performed as follows.

First, a silicon dummy wafer (diameter 200mm, thickness 0.75mm) is ground to a thickness of 250 μm with a grinder. The adhesive sheet is adhered to the grinding surface of the wafer within 1 hour after the grinding process by the grinder is finished.

Next, the wafer is diced to a semiconductor chip size of 5 mm x 5 mm within 1 hour after grinding. In addition, after dicing, the adhesive sheet is irradiated with ultraviolet rays from the surface of the substrate with energy rays within 30 minutes.

At this time, after dicing, it was confirmed whether there were scattered semiconductor chips on the wafer, and the number of scattered chips including the edge part of the wafer was visually confirmed and described in [Table 1] below.

In addition, the pick-up property is evaluated by picking up the semiconductor chip within 6 hours after UV irradiation and measuring the pick-up success height (the minimum height that can be picked up by lowering the height of the lifting pin).

Next, after pickup, it is fixed to the substrate using a die attach device, and 100 mg of the underfill composition is discharged at a temperature of 25° C. through a syringe distribution from the side of the chip mounted on the substrate through reflow It is filled between the subdivided wafer chips.

In this case, the underfill composition is used to fill the space between the substrate and the chip, and the underfill composition is cured. Curing may be performed at a temperature of 135° C. for 10 minutes.

Finally, after underfilling, the degree of contamination on the back surface of the chip is observed using a microscope, and contamination by underfilling is evaluated.

In addition, for comparison, the surface energy of the adhesive layer of the adhesive sheet according to the content of the additive containing siloxane was indicated, and the wafer was attached to the adhesive sheet using a 2 kg roller. The surface of the wafer when it was removed after stopping for about 20 minutes Energy and contamination by underfill at this time were evaluated in Comparative Examples and Examples.

Compounds containing siloxane used in Examples and Comparative Examples are, based on 100 parts by weight of the acrylic compound, A: not included, B: 0.001 to 0.01 parts by weight, C: 0.02 to 0.1 parts by weight, D: 0.2 to 3 parts by weight, E : 3.1 to 5 parts by weight, F: Evaluation was carried out by applying one content in the range of 6 to 10 parts by weight.

The conditions of each process are as follows.

(Grinding process)

Grinder device: DFP8761 made by Disco

(Adhesive sheet mounting process)

Mounter: Disco DFM2800

(dicing process)

Dicing equipment: DFD640 made by Disco

Blade: Disco ZH05-SD3500-N1-50 CC

(Ultraviolet irradiation process)

Ultraviolet irradiation equipment: FE400 manufactured by Phoseon

Illuminance : 3,896 mW/cm2

Light intensity: 5,477 mJ/㎠

Measuring equipment: LED CURE L395 / 40W manufactured by EIT

(pickup process)

Die-attach equipment: Shinkawa SPA-210

Number of pins: 4 pins

Lifting height of pins: 20 each based on 500㎛, if even one fails, it is raised by 50㎛ increments until all are successful The lift height was evaluated and recorded.

(Underfill process)

Underfill equipment: TCP-435A manufactured by SEC

(Example 1)

In this Example, the following adhesive liquid was used as an energy ray-curable adhesive component.

Butyl acrylate, methyl methacrylate, and hydroxyethyl acrylate were copolymerized in ethyl acetate at a mass ratio of 7:2:1 by a conventional method to obtain a solution containing an acrylic polymer having a hydroxyl group bonded to the main chain.

Then, with respect to 100 parts by weight of this acrylic copolymer, 30 parts by weight of trade name “Miramer PU610” (manufactured by Miwon Special Chemical Co., Ltd.) as an energy ray curing material, and 2.5 parts by weight of trade name “Omnirad 184” (manufactured by IGM Resins Co., Ltd.) as a photopolymerization initiator , UV-curable acrylic adhesive solution by adding 1 part by weight of “BYK-307” (manufactured by BYK Corporation) as a siloxane-containing additive and 1 part by weight of polyisocyanate compound “AK75” (manufactured by Aekyung Chemical Corporation) as a crosslinking agent in the C range above got

This pressure-sensitive adhesive composition was applied to a release film “SG31” (manufactured by SK C Co., Ltd., 36㎛ thick), and crosslinked by heating at 100°C for 3 minutes. Through this, the radiation-curing adhesive layer was converted into an UV-curable adhesive layer with a thickness of 10㎛. formed.

As the base film, a polyvinyl chloride film having a thickness of 80 μm, which was subjected to corona discharge treatment on one side, was used, and an ultraviolet curable adhesive layer was laminated on the corona treated side to obtain an adhesive sheet.

Using the obtained adhesive sheet, “pickup success height”, “contamination by underfill”, “surface energy of the adhesive surface of the adhesive sheet” and “surface energy of the wafer after the adhesive sheet was attached” were evaluated by the above evaluation method. The evaluation results are described in [Table 1] below.

(Example 2)

A pressure-sensitive adhesive sheet was obtained in the same manner as in Example 1, except that the compounding amount of the siloxane-containing compound was set to a part by weight in the range D mentioned above. The evaluation results are described in [Table 1] below.

(Example 3)

A pressure-sensitive adhesive sheet was obtained in the same manner as in Example 1, except that the compounding amount of the siloxane-containing compound was set to parts by weight within the range E mentioned above. The evaluation results are described in [Table 1] below.

(Comparative Example 1)

A pressure-sensitive adhesive sheet was obtained in the same manner as in Example 1, except that the above-mentioned part by weight A not using the siloxane-containing compound was used. The evaluation results are described in [Table 1] below.

(Comparative Example 2)

A pressure-sensitive adhesive sheet was obtained in the same manner as in Example 1 except that the compounding amount of the siloxane-containing compound was set to a part by weight in the range B mentioned above. The evaluation results are described in [Table 1] below.

(Comparative Example 3)

A pressure-sensitive adhesive sheet was obtained in the same manner as in Example 1 except that the compounding amount of the siloxane-containing compound was set to parts by weight in the above-mentioned F range. The evaluation results are described in [Table 1] below.

Comparative Example 1 Comparative Example 2 Comparative Example 3 Example 1 Example 2 Example 3 Siloxane containing compounds A B F C D E Pickup process Pick-up available
Height (㎛) 700 650 300 350 350 300 Dicing process Chip scatter (pcs) 0 0 17 0 0 3 Surface energy wlmN/cm ²⁾ adhesive sheet
adhesive side 35 33 19 21 22 21 wafer
attachment side 57 53 47 49 48 47 Underfill Contamination X X ◎ △ ◎ ◎

Referring to [Table 1] above, the pick-up properties and underfill contamination of Examples 1, 2, and 3 were compared to Comparative Example 1 in which the siloxane-containing compound was not used, but the amount of the siloxane-containing compound was lower than that of Examples 1, 2, and 3 was added. It shows superior results than that of Comparative Example 2. In Comparative Example 3, in which the siloxane-containing compound was applied in excess, it was confirmed that the contamination by the underfill was improved, but the power to hold the wafer was not sufficient due to the excessive decrease in adhesive force, so fragmented chips scatter in the dicing process. it can be confirmed that

In particular, if the content of the siloxane-containing compound is higher than the content of the siloxane-containing compound presented in Example 1, it can be confirmed that the pickup performance is improved even in the current semiconductor equipment system in which the wafer is mounted within a few minutes after backgrinding. It was confirmed that pickup performance and contamination by underfill were improved when the content of the siloxane-containing compound was used as specified in this paper.

As described above, those skilled in the art to which the present invention pertains will be able to understand that the present invention may be embodied in other specific forms without changing the technical spirit or essential features thereof. Therefore, it should be understood that the above-described embodiments are illustrative in all respects and not restrictive. The scope of the present invention is indicated by the claims described later rather than the detailed description, and all changes or modifications derived from the meaning and scope of the claims and equivalent concepts should be interpreted as being included in the scope of the present invention. do.

Claims (4)

A copolymer in which butyl acrylate, methyl methacrylate and hydroxyethyl acrylate are copolymerized;
an energy ray-curable compound, and
As an adhesive sheet in which an adhesive layer comprising a compound containing siloxane is non-peelably laminated on a substrate,
The surface tension of the adhesive layer is 30 mN / m or less,
The pressure-sensitive adhesive sheet comprising 0.2 to 3 parts by weight of the compound containing siloxane based on 100 parts by weight of the copolymer.
delete delete grinding the back surface of a semiconductor wafer having a pattern circuit on its surface;
adhering the adhesive sheet of claim 1 to the back surface of the wafer and dicing to form a semiconductor chip;
an irradiation process of reducing adhesive strength by irradiating an energy beam to the adhesive sheet to which the semiconductor chip is attached;
a pick-up process of removing the semiconductor chip from the adhesive sheet;
A method of manufacturing a semiconductor chip using an adhesive sheet containing an energy ray-curable compound, comprising the step of attaching the fragmented semiconductor chip to the substrate using an underfill.