JPWO2016136774A1 - Film adhesive, adhesive sheet, and method for manufacturing semiconductor device - Google Patents

Abstract

A film-like adhesive and an adhesive sheet suitable for a dividing method using heated gas are provided. A film adhesive according to the present invention includes a polymer component (A) and a thermosetting component (B1), and the content of the polymer component (A) in the film adhesive is 1 to 30. The content of the thermosetting component (B1) is 40% to 70% by mass, the film adhesive is applied to a chip group composed of a plurality of chip bodies, and the heated gas is directed to the film adhesive. It is used to melt the film adhesive by releasing it. [Selection figure] None

Description

  The present invention relates to a film-like adhesive and an adhesive sheet particularly suitable for use in a step of die-bonding a semiconductor element (semiconductor chip) to an organic substrate, a lead frame, and other semiconductor chips. The present invention also relates to a method for manufacturing a semiconductor device using the film adhesive and the adhesive sheet.

  As information terminal devices are rapidly becoming thinner, smaller, and multifunctional, semiconductor devices mounted on them are also required to be thinner and denser. In particular, in memory chips, silicon wafers are processed as thin as possible and multi-layered to increase the capacity.

  Corresponding to the trend of semiconductor devices, the semiconductor processing process is based on the ultra-thin wafer processing method, and various thin processing methods have been devised and evaluated. As such a thin processing method, a method of manufacturing a semiconductor chip by forming a groove having a predetermined depth from the front side of the wafer and then grinding from the back side is disclosed. Such a process is also called “first dicing method”.

  According to the first dicing method, it is possible to manufacture a chip while minimizing damage to the thinned wafer. The chip manufactured in this way is transferred onto a die attach film (DAF) from a back grind tape that is usually attached to the circuit surface side of the wafer during grinding.

  Usually, after the DAF is attached to the wafer, it is diced together with the wafer and separated into individual pieces. However, in the above-described prior dicing method, since the wafer separated into chips is transferred onto the DAF, it is necessary to divide only the DAF into the same size as the chip.

  Conventionally, laser dicing with laser light is suitable as a DAF dividing method. However, the laser dicing apparatus is expensive, and as a result, the manufacturing cost of the semiconductor device increases.

  Patent Document 1 (Japanese Patent Application Laid-Open No. 2012-164953) describes a DAF dividing method using high-pressure air. However, the DAF dividing method described in Patent Document 1 is difficult to divide DAF depending on the conditions and the composition of DAF.

JP 2012-164953 A

  This invention is made | formed in view of the above situations, Comprising: It aims at providing the film adhesive suitable for the division | segmentation method by heated gas, and an adhesive sheet. Another object of the present invention is to provide a method for manufacturing a semiconductor device using the film adhesive and the adhesive sheet.

The present invention for solving the above problems includes the following gist.
[1] A film adhesive comprising a polymer component (A) and a thermosetting component (B1),
The content of the polymer component (A) in the film adhesive is 1 to 30% by mass, the content of the thermosetting component (B1) is 40 to 70% by mass,
A film adhesive used for fusing the film adhesive by sticking the film adhesive to a chip group composed of a plurality of chip bodies and releasing a heated gas toward the film adhesive.

[2] The film adhesive according to [1], wherein the melt viscosity at 80 ° C. is less than 1.0 × 10 ⁵ Pa · s in a state before heat curing.

[3] The chip group composed of the plurality of chip bodies is an area on the surface of the work, and a groove is provided in an area other than the area remaining as the chip body after the work is separated into pieces. The film adhesive according to [1] or [2], which is obtained by subjecting the workpiece to a thinning process until reaching the bottom.

[4] An adhesive sheet in which the film-like adhesive according to any one of [1] to [3] is used as an adhesive layer, and the adhesive layer is detachably laminated on a support.

[5] A method of manufacturing a semiconductor device including the following steps (a) and (b):
(A) The polymer component (A) and the thermosetting component (B1) are included, the content of the polymer component (A) is 1 to 30% by mass, and the content of the thermosetting component (B1) is 40 to 70. A step of affixing a film-like adhesive of mass% to a chip group comprising a plurality of chip bodies, and (b) a step of fusing the film-like adhesive by releasing a heated gas toward the film-like adhesive. .

[6] The method for manufacturing a semiconductor device according to [5], wherein the film-like adhesive in a state before heat curing has a melt viscosity at 80 ° C. of less than 1.0 × 10 ⁵ Pa · s.

[7] The method for manufacturing a semiconductor device according to [5] or [6], further including the following step (c) before performing the step (a):
(C) A groove is provided in an area on the surface of the work other than the area remaining as a chip body after the work is separated into pieces, and the work thinning process is performed from the back side of the work to the bottom of the groove. A step of obtaining a chip group composed of the plurality of chip bodies by performing.

  According to the present invention, it is easy to divide DAF with heated gas. Therefore, the initial investment cost and maintenance cost of the laser dicing apparatus can be suppressed, and the cost can be reduced as compared with the DAF dividing method by laser dicing.

  Hereinafter, the film adhesive, the adhesive sheet, and the method for manufacturing the semiconductor device according to the present invention will be described more specifically.

(Film adhesive)
The functions required at least for the film adhesive according to the present invention are (1) sheet shape maintenance, (2) initial adhesion, and (3) curability.

By adding a binder component containing the polymer component (A) and the thermosetting component (B1), (1) sheet shape maintaining property and (3) curability can be imparted to the film adhesive.
In addition, it is a function for making it adhere temporarily to a to-be-adhered body (chip group which consists of a some chip body) until a film adhesive hardens | cures (2) Initial adhesiveness is pressure sensitive adhesiveness. It may be a property of being softened and bonded by heat. (2) The initial adhesiveness is usually controlled by adjusting various properties of the binder component and adjusting the blending amount of the inorganic filler (D) described later.

(A) Polymer component The polymer component (A) is added to the film adhesive mainly for the purpose of imparting sheet shape maintainability to the film adhesive.
In order to achieve the above object, the polymer component (A) has a weight average molecular weight (Mw) of usually 20,000 or more, preferably 20,000 to 3,000,000. The value of the weight average molecular weight (Mw) is a value when measured by a gel permeation chromatography (GPC) method (polystyrene standard). The measurement by such a method is carried out, for example, by using a high-speed column “TSK gel column H _XL- H”, “TSK Gel GMH _XL ”, “TSK Gel G2000H _XL ” (“Tosoh Corporation”, “HLC-8120GPC”). As described above, the detector is used as a differential refractometer under the conditions of column temperature: 40 ° C. and liquid feed rate: 1.0 mL / min.

  As the polymer component (A), an acrylic polymer, polyester, phenoxy resin, polycarbonate, polyether, polyurethane, polysiloxane, rubber polymer, and the like can be used. Further, it is an acrylic urethane resin obtained by reacting a urethane prepolymer having an isocyanate group at a molecular terminal with an acrylic polyol which is an acrylic polymer having a hydroxyl group, which is a combination of two or more of these. May be. Furthermore, two or more of these may be used in combination, including a polymer in which two or more are bonded.

  The content rate of the polymer component (A) in a film adhesive is 1-30 mass%, Preferably it is 4-15 mass%. By making the content rate of a polymer component (A) into the said range, fusing of the film adhesive by heating gas becomes easy.

(A1) As the acrylic polymer polymer component (A), acrylic polymer (A1) is preferably used. The acrylic polymer (A1) is a polymer containing a structural unit formed by polymerizing a (meth) acrylic acid ester described later. The proportion of the structural unit formed by polymerizing the (meth) acrylic acid ester in the acrylic polymer (A1) is usually 40% by mass or more, preferably 50% by mass or more, more preferably 60% by mass or more, and particularly preferably. Is 70% by mass or more. In addition, the ratio of the structural unit contained in the acrylic polymer (A1) is usually the ratio of monomers that can form each structural unit in all monomers used for the polymerization of the acrylic polymer (A1) ( It matches the charging ratio).

  The glass transition temperature (Tg) of the acrylic polymer (A1) is preferably in the range of −60 to 50 ° C., more preferably −50 to 40 ° C., and further preferably −40 to 30 ° C. When the glass transition temperature of the acrylic polymer (A1) is too low, as described later, when the film adhesive is formed on the support, the peeling force between the film adhesive and the support becomes large. Transfer failure of the film adhesive may occur, and if it is too high, the adhesive property of the film adhesive will decrease, and transfer to the adherend will not be possible, or the film adhesive will peel off from the adherend after transfer, etc. May occur.

  The weight average molecular weight of the acrylic polymer (A1) is more preferably 100,000 to 1,500,000. If the weight average molecular weight of the acrylic polymer (A1) is too low, the adhesion between the film adhesive and the support becomes high, and transfer failure of the film adhesive may occur. Adhesiveness of the adhesive may be reduced, and transfer to the adherend may not be possible, or defects such as peeling of the film adhesive from the adherend after transfer may occur.

The acrylic polymer (A1) contains (meth) acrylic acid ester in at least a constituent monomer.
As the (meth) acrylic acid ester, an alkyl (meth) acrylate having an alkyl group having 1 to 18 carbon atoms, specifically, methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, butyl ( (Meth) acrylate, 2-ethylhexyl (meth) acrylate, etc .; (meth) acrylate having a cyclic skeleton, specifically cycloalkyl (meth) acrylate, benzyl (meth) acrylate, isobornyl (meth) acrylate, dicyclopentanyl ( Examples include meth) acrylate, dicyclopentenyl (meth) acrylate, dicyclopentenyloxyethyl (meth) acrylate, and imide (meth) acrylate. Moreover, what is (meth) acrylic acid ester can be illustrated among what is illustrated as a monomer which has a hydroxyl group mentioned later, a monomer which has a carboxyl group, and a monomer which has an amino group.

  In the present specification, (meth) acryl may be used to include both acrylic and methacryl.

  A monomer having a hydroxyl group may be used as the monomer constituting the acrylic polymer (A1). By using such a monomer, when the hydroxyl group is introduced into the acrylic polymer (A1) and the film adhesive contains an energy ray curable component (B2) separately, this and the acrylic polymer. Compatibility with (A1) is improved. Examples of the monomer having a hydroxyl group include (meth) acrylic acid ester having a hydroxyl group such as 2-hydroxylethyl (meth) acrylate and 2-hydroxypropyl (meth) acrylate; N-methylol (meth) acrylamide and the like.

  As the monomer constituting the acrylic polymer (A1), a monomer having a carboxyl group may be used. By using such a monomer, when a carboxyl group is introduced into the acrylic polymer (A1) and the film adhesive contains an energy ray curable component (B2) separately, this and the acrylic polymer (A1). Compatibility with the polymer (A1) is improved. Examples of the monomer having a carboxyl group include (meth) acrylic acid, maleic acid, fumaric acid, and itaconic acid. When using an epoxy thermosetting component as the thermosetting component (B1) described later, the carboxyl group and the epoxy group in the epoxy thermosetting component react with each other. The amount used is preferably small.

  As a monomer constituting the acrylic polymer (A1), a monomer having an amino group may be used. Examples of such a monomer include (meth) acrylic acid esters having an amino group such as monoethylamino (meth) acrylate.

  In addition, vinyl acetate, styrene, ethylene, α-olefin, or the like may be used as a monomer constituting the acrylic polymer (A1).

  The acrylic polymer (A1) may be cross-linked. Crosslinking is performed by adding a crosslinking agent to the composition for forming a film adhesive, in which the acrylic polymer (A1) before crosslinking has a crosslinkable functional group such as a hydroxyl group. This is carried out by the reaction of the functional group with the functional group of the crosslinking agent. By crosslinking the acrylic polymer (A1), it is possible to adjust the initial adhesive force and cohesive force of the film adhesive.

  Examples of the crosslinking agent include organic polyvalent isocyanate compounds and organic polyvalent imine compounds.

  Examples of organic polyvalent isocyanate compounds include aromatic polyvalent isocyanate compounds, aliphatic polyvalent isocyanate compounds, alicyclic polyvalent isocyanate compounds, trimers of these organic polyvalent isocyanate compounds, and these organic polyvalent isocyanate compounds. Examples thereof include terminal isocyanate urethane prepolymers obtained by reacting with a polyol compound.

  Specifically, as the organic polyvalent isocyanate compound, 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate, 1,3-xylylene diisocyanate, 1,4-xylene diisocyanate, diphenylmethane-4,4′- Diisocyanate, diphenylmethane-2,4′-diisocyanate, 3-methyldiphenylmethane diisocyanate, hexamethylene diisocyanate, isophorone diisocyanate, dicyclohexylmethane-4,4′-diisocyanate, dicyclohexylmethane-2,4′-diisocyanate, and lysine isocyanates thereof Examples thereof include polyhydric alcohol adducts.

  Specific examples of organic polyvalent imine compounds include N, N′-diphenylmethane-4,4′-bis (1-aziridinecarboxamide), trimethylolpropane-tri-β-aziridinylpropionate, tetramethylol. Mention may be made of methane-tri-β-aziridinylpropionate and N, N′-toluene-2,4-bis (1-aziridinecarboxamide) triethylenemelamine.

  A crosslinking agent is 0.01-20 mass parts normally with respect to 100 mass parts of acrylic polymers (A1) before bridge | crosslinking, Preferably it is 0.1-10 mass parts, More preferably, it is 0.5-5 mass parts. Used in ratio.

  In the present invention, when the content of the component constituting the film adhesive is determined on the basis of the content of the polymer component (A), the polymer component (A) is a crosslinked acrylic polymer. In some cases, the reference content is the content of the acrylic polymer before being crosslinked.

(A2) Non-acrylic resin Further , the polymer component (A) is selected from polyester, phenoxy resin, polycarbonate, polyether, polyurethane, polysiloxane, rubber polymer, or a combination of two or more thereof. One kind of acrylic resin (A2) or a combination of two or more kinds may be used. Such a resin preferably has a weight average molecular weight of 20,000 to 100,000, and more preferably 20,000 to 80,000.

  The glass transition temperature of the non-acrylic resin (A2) is preferably -30 to 150 ° C, more preferably -20 to 120 ° C. If the glass transition temperature of the non-acrylic resin is too low, the peeling force between the film adhesive and the support may be increased, resulting in poor transfer of the film adhesive. There is a risk of insufficient adhesion to the body.

  When the non-acrylic resin (A2) is used in combination with the above-mentioned acrylic polymer (A1), delamination between the film-like adhesive and the support during transfer of the film-like adhesive to the adherend The film adhesive can follow the transfer surface and the generation of voids can be suppressed.

  When the non-acrylic resin (A2) is used in combination with the above-mentioned acrylic polymer (A1), the content of the non-acrylic resin (A2) is such that the non-acrylic resin (A2) and the acrylic polymer ( The mass ratio (A2: A1) to A1) is usually in the range of 1:99 to 60:40, preferably 1:99 to 30:70. When the content of the non-acrylic resin (A2) is in this range, the above effect can be obtained.

(AB) Curable polymer component Moreover, you may use a curable polymer component (AB) as a polymer component (A). The curable polymer component is a polymer having a curing functional group. The curing functional group is a functional group that can react with each other to form a three-dimensional network structure, and examples thereof include a functional group that reacts by heating and a functional group that reacts by energy rays. In addition, although curable polymer component (AB) has sclerosis | hardenability, in this invention, it is a matter summarized by the concept of polymer component (A), a thermosetting component (B1) or an energy ray. This matter is not summarized depending on the concept of the curable component (B2).
The functional functional group may be added to the unit of a continuous structure that becomes the skeleton of the curable polymer (AB) or may be added to the terminal. When the functional functional group is added in the unit of the continuous structure that becomes the skeleton of the curable polymer component (AB), the functional functional group may be added to the side chain or directly to the main chain. You may do it. The weight average molecular weight (Mw) of the curable polymer component (AB) is usually 20,000 or more from the viewpoint of achieving the purpose of imparting sheet shape maintainability to the film adhesive.

An example of a functional group that reacts by heating is an epoxy group. Examples of the curable polymer component (AB) having an epoxy group include a high molecular weight epoxy group-containing compound and a phenoxy resin having an epoxy group. High molecular weight epoxy group-containing compounds are disclosed, for example, in JP-A-2001-261789.
Moreover, it is a polymer similar to the above-mentioned acrylic polymer (A1), which is polymerized using a monomer having an epoxy group as a monomer (epoxy group-containing acrylic polymer). Also good. Examples of such monomers include (meth) acrylic acid esters having a glycidyl group such as glycidyl (meth) acrylate.
When an epoxy group-containing acrylic polymer is used, the preferred embodiment is the same as that of the acrylic polymer (A1).

  In the case of using an epoxy group-containing curable polymer component (AB), as in the case of using an epoxy thermosetting component as the thermosetting component (B1), a thermosetting agent (B12) or a curing accelerator ( B13) may be used in combination.

Examples of the functional group that reacts with energy rays include a (meth) acryloyl group. As the curable polymer component (AB) having a functional group that reacts with energy rays, an acrylate compound having a polymer structure such as polyether acrylate, and the like having a high molecular weight can be used.
In addition, for example, a raw material polymer having a functional group X such as a hydroxyl group in a side chain, a functional group Y that can react with the functional group X (for example, an isocyanate group when the functional group X is a hydroxyl group) and energy beam irradiation Alternatively, a polymer prepared by reacting a low molecular compound having a functional group that reacts with the above may be used.
In this case, when the raw material polymer corresponds to the above-mentioned acrylic polymer (A1), the preferred mode of the raw material polymer is the same as that of the acrylic polymer (A1).

  When the curable polymer component (AB) having a functional group that reacts with energy rays is used, the photopolymerization initiator (B22) may be used in the same manner as when the energy ray curable component (B2) is used. .

(B1) Thermosetting component The thermosetting component (B1) is added to the film adhesive mainly for the purpose of imparting curability to the film adhesive. The thermosetting component (B1) contains at least a compound having a functional group that reacts by heating. Curing is realized by the functional groups of the thermosetting component (B1) reacting to form a three-dimensional network structure. Since the thermosetting component (B1) is used in combination with the polymer component (A), from the viewpoint of suppressing the viscosity of the adhesive composition for forming the film adhesive and improving the handleability, etc. Usually, the weight average molecular weight (Mw) is 10,000 or less, and preferably 100 to 10,000.

  The content rate of the thermosetting component (B1) in a film adhesive is 40-70 mass%, Preferably it is 50-65 mass%, More preferably, it is 50-60 mass%. By making the content rate of a thermosetting component (B1) into the said range, fusing of the film adhesive by heating gas becomes easy.

  As the thermosetting component (B1), for example, an epoxy thermosetting component is preferable. The epoxy thermosetting component preferably contains a compound (B11) having an epoxy group and a combination of a compound (B11) having an epoxy group and a thermosetting agent (B12). Moreover, an epoxy-type thermosetting component may contain a hardening accelerator (B13).

(B11) Compound having an epoxy group As the compound (B11) having an epoxy group (hereinafter sometimes referred to as “epoxy compound (B11)”), a conventionally known compound can be used. Specifically, polyfunctional epoxy resin, bisphenol A diglycidyl ether and its hydrogenated product, orthocresol novolac epoxy resin, dicyclopentadiene type epoxy resin, biphenyl type epoxy resin, bisphenol A type epoxy resin, bisphenol F type Examples thereof include epoxy compounds having two or more functional groups in the molecule, such as epoxy resins and phenylene skeleton type epoxy resins. These can be used individually by 1 type or in combination of 2 or more types.

  When using the epoxy compound (B11), the film-like adhesive preferably contains 120 to 1500 parts by mass of the epoxy compound (B11), more preferably 100 parts by mass of the polymer component (A). Is included in an amount of 200 to 1200 parts by mass. If the epoxy compound (B11) is less than 120 parts by mass, sufficient adhesion may not be obtained, and if it exceeds 1500 parts by mass, the peel strength between the film adhesive and the support increases, and the film adhesive Transfer defects may occur.

(B12) Thermosetting agent The thermosetting agent (B12) functions as a curing agent for the epoxy compound (B11). A preferable thermosetting agent includes a compound having two or more functional groups capable of reacting with an epoxy group in one molecule. Examples of the functional group include a phenolic hydroxyl group, an alcoholic hydroxyl group, an amino group, a carboxyl group, and an acid anhydride. Of these, phenolic hydroxyl groups, amino groups, acid anhydrides and the like are preferable, and phenolic hydroxyl groups and amino groups are more preferable.

  Specific examples of the phenolic curing agent include polyfunctional phenolic resin, biphenol, novolac type phenolic resin, dicyclopentadiene type phenolic resin, zylock type phenolic resin, and aralkylphenolic resin. A specific example of the amine curing agent is DICY (dicyandiamide). These can be used individually by 1 type or in mixture of 2 or more types.

  It is preferable that it is 0.1-500 mass parts with respect to 100 mass parts of epoxy compounds (B11), and, as for content of a thermosetting agent (B12), it is more preferable that it is 1-200 mass parts. If the content of the thermosetting agent is small, the adhesiveness may not be obtained due to insufficient curing, and if it is excessive, the moisture absorption rate of the film adhesive may increase and the reliability of the semiconductor device may be reduced.

(B13) Curing accelerator The curing accelerator (B13) may be used to adjust the rate of thermal curing of the film adhesive. The curing accelerator (B13) is particularly preferably used when an epoxy thermosetting component is used as the thermosetting component (B1).

  Preferred curing accelerators include tertiary amines such as triethylenediamine, benzyldimethylamine, triethanolamine, dimethylaminoethanol, tris (dimethylaminomethyl) phenol; 2-methylimidazole, 2-phenylimidazole, 2-phenyl- Imidazoles such as 4-methylimidazole, 2-phenyl-4,5-dihydroxymethylimidazole, 2-phenyl-4-methyl-5-hydroxymethylimidazole; Organic phosphines such as tributylphosphine, diphenylphosphine, triphenylphosphine; And tetraphenylboron salts such as tetraphenylphosphonium tetraphenylborate and triphenylphosphinetetraphenylborate. These can be used individually by 1 type or in mixture of 2 or more types.

  The curing accelerator (B13) is preferably 0.01 to 10 parts by mass, more preferably 0.1 to 1 part by mass with respect to 100 parts by mass of the total amount of the epoxy compound (B11) and the thermosetting agent (B12). Included in the amount of. By containing the curing accelerator (B13) in an amount within the above range, it has excellent adhesiveness even when exposed to high temperatures and high humidity, and has high reliability even when exposed to severe reflow conditions. Can be achieved. When the content of the curing accelerator (B13) is small, sufficient adhesion cannot be obtained due to insufficient curing, and when it is excessive, the curing accelerator having high polarity is bonded to the film adhesive under high temperature and high humidity. The reliability of the semiconductor device is lowered by moving to the side and segregating.

(B2) Energy beam curable component The film adhesive may contain an energy beam curable component (B2). The energy ray-curable component (B2) contains a compound (B21) having a functional group that reacts upon irradiation with energy rays, and is polymerized and cured when irradiated with energy rays such as ultraviolet rays and electron beams. When the film adhesive contains both the thermosetting component (B1) and the energy ray curable component (B2), the film adhesive can be precured by energy ray irradiation before the thermosetting step. As a result, the adhesiveness at the interface between the die-bonding film adhesive and the support is controlled, and the process suitability of the film adhesive is improved in processes performed before the thermosetting process, such as the wire bonding process. It becomes possible to do.
As the energy ray-curable component (B2), a compound (B21) having a functional group that reacts by irradiation with energy rays may be used alone, but photopolymerization with a compound (B21) having a functional group that reacts by irradiation with energy rays. It is preferable to use a combination of initiators (B22).

(B21) Compound having a functional group that reacts upon irradiation with energy rays Compound (B21) having a functional group that reacts upon irradiation with energy rays (hereinafter sometimes referred to as “energy ray-reactive compound (B21)”) Specifically, dicyclopentanyl dimethylene diacrylate, trimethylolpropane triacrylate, pentaerythritol triacrylate, pentaerythritol tetraacrylate, dipentaerythritol monohydroxypentaacrylate, dipentaerythritol hexaacrylate or 1,4-butylene glycol diacrylate Acrylate compounds such as 1,6-hexanediol diacrylate; oligoester acrylate, urethane acrylate oligomer, epoxy acrylate, poly A acrylate compound having a polymerizable structure acrylate compounds such as chromatography ether acrylate and itaconic acid oligomer, those having a relatively low molecular weight; and the like. Such a compound has at least one polymerizable double bond in the molecule.

  When the energy ray reactive compound (B21) is used, the film adhesive preferably contains 1 to 1500 parts by mass of the energy ray reactive compound (B21) with respect to 100 parts by mass of the polymer component (A). More preferably, it is contained in 3 to 1200 parts by mass.

(B22) By combining the photopolymerization initiator energy beam reactive compound (B21) with the photopolymerization initiator (B22), the polymerization curing time can be shortened and the amount of light irradiation can be reduced.

  Specific examples of such a photopolymerization initiator (B22) include benzophenone, acetophenone, benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin isobutyl ether, benzoin benzoic acid, benzoin methyl benzoate, and benzoin dimethyl ketal. 2,4-diethylthioxanthone, 1-hydroxycyclohexyl phenyl ketone, benzyldiphenyl sulfide, tetramethylthiuram monosulfide, azobisisobutyronitrile, benzyl, dibenzyl, diacetyl, 1,2-diphenylmethane, 2-hydroxy- 2-methyl-1- [4- (1-methylvinyl) phenyl] propanone, 2,4,6-trimethylbenzoyldiphenylphosphine oxide and - such as crawl anthraquinone, and the like. A photoinitiator (B22) can be used individually by 1 type or in combination of 2 or more types.

It is preferable that 0.1-10 mass parts is contained with respect to 100 mass parts of energy-beam reactive compounds (B21), and the mixture ratio of a photoinitiator (B22) is contained 0.5-5 mass parts. More preferred.
If the blending ratio of the photopolymerization initiator (B22) is less than 0.1 parts by mass, sufficient curability may not be obtained due to insufficient photopolymerization, and if it exceeds 10 parts by mass, the residue does not contribute to photopolymerization. May cause a malfunction.

  The film adhesive may contain the following components in addition to the binder component.

(C) Coupling agent A coupling agent (C) having a functional group that reacts with an inorganic substance and a functional group that reacts with an organic functional group is used as an adhesive, adhesiveness and / or film-like adhesive to an adherend. You may use in order to improve the cohesiveness of an adhesive agent. Moreover, the water resistance can be improved by using a coupling agent (C), without impairing the heat resistance of the film adhesive after hardening. Examples of such coupling agents include titanate coupling agents, aluminate coupling agents, silane coupling agents, and the like. Of these, silane coupling agents are preferred.

As the silane coupling agent, a silane coupling agent in which the functional group that reacts with the organic functional group is a group that reacts with the functional group of the polymer component (A), the thermosetting component (B1), or the like is preferably used. Is done.
Examples of such silane coupling agents include γ-glycidoxypropyltrimethoxysilane, γ-glycidoxypropyltriethoxysilane, γ-glycidoxypropylmethyldiethoxysilane, β- (3,4-epoxycyclohexyl). Ethyltrimethoxysilane, γ- (methacryloxypropyl) trimethoxysilane, γ-aminopropyltrimethoxysilane, N-6- (aminoethyl) -γ-aminopropyltrimethoxysilane, N-6- (aminoethyl)- γ-aminopropylmethyldiethoxysilane, N-phenyl-γ-aminopropyltrimethoxysilane, γ-ureidopropyltriethoxysilane, γ-mercaptopropyltrimethoxysilane, γ-mercaptopropylmethyldimethoxysilane, bis (3-tri Ethoxysilylpropyl Tetrasulfane, methyltrimethoxysilane, methyltriethoxysilane, vinyltrimethoxysilane, vinyltriacetoxysilane, etc. imidazole silane. These can be used individually by 1 type or in mixture of 2 or more types.

  A silane coupling agent is 0.1-20 mass parts normally with respect to a total of 100 mass parts of a polymer component (A) and a thermosetting component (B1), Preferably it is 0.2-10 mass parts, More preferably. Is contained at a ratio of 0.3 to 5 parts by mass. If the content of the silane coupling agent is less than 0.1 parts by mass, the above effect may not be obtained, and if it exceeds 20 parts by mass, it may cause outgassing.

(D) The inorganic filler film adhesive may contain the inorganic filler (D). By blending the inorganic filler (D) in the film adhesive, it becomes possible to adjust the thermal expansion coefficient in the cured film adhesive, and the heat of the cured film adhesive on the adherend. The reliability of the semiconductor device can be improved by optimizing the expansion coefficient. It is also possible to reduce the moisture absorption rate of the cured film adhesive.

  Preferred inorganic fillers include powders of silica, alumina, talc, calcium carbonate, titanium oxide, iron oxide, silicon carbide, boron nitride, and the like, beads formed by spheroidizing these, single crystal fibers, glass fibers, and the like. Among these, silica filler and alumina filler are preferable. The said inorganic filler (D) can be used individually or in mixture of 2 or more types. The content of the inorganic filler (D) in the film adhesive is preferably 1 to 80% by mass, more preferably 5 as the range of the content of the inorganic filler (D) for obtaining the above-described effects more reliably. It is -65 mass%, Most preferably, it is 10-50 mass%.

(E) In addition to the above, various additives may be added to the general-purpose additive film adhesive as necessary. Examples of various additives include leveling agents, plasticizers, antistatic agents, antioxidants, ion scavengers, gettering agents, chain transfer agents, and the like.

  The film-like adhesive comprising the above components has initial adhesiveness and heat-curing properties, and in an uncured state, it is lightly pressed on various adherends at room temperature or softened by heating and pasted. can do. In addition, by setting the content ratio of the polymer component (A) and the thermosetting component (B1) in the film adhesive to a predetermined range, the film adhesive is applied to a later-described use (a chip group including a plurality of chip bodies). It is possible to melt the film adhesive into the chip size by releasing the heated gas in the application of applying and fusing the film gas adhesive by releasing the heated gas to the film adhesive.

In the state before heat curing, the melt viscosity of the film adhesive at 80 ° C. is preferably less than 1.0 × 10 ⁵ Pa · s, more preferably 1.0 × 10 ^{2 to} 7 × 10 ⁴ Pa · s, Most preferably, it is 5.0 * 10 < ² > -5 * 10 < ⁴ > Pa * s. By making the melt viscosity of a film adhesive into the said range, melt | fusion cutting of the film adhesive by heating gas becomes easy.
When the film adhesive contains the energy ray curable component (B2), the melt viscosity of the film adhesive at 80 ° C. in the state before heat curing is in the above range in the state before heat curing. , It means that the melt viscosity of the film adhesive at 80 ° C. is in the above range either before or after curing by irradiation with energy rays.
In this case, the melt viscosity of the film adhesive at 80 ° C. in the state before heat curing is preferably at least in the above range before curing by energy beam irradiation, and before and after curing by energy beam irradiation. It is more preferable to be in the above range.

The film-like adhesive is obtained by forming an adhesive composition obtained by mixing the above-described components at an appropriate ratio. When mixing the above components, each component may be diluted with a solvent in advance, or a solvent may be added during mixing. Moreover, you may dilute with a solvent at the time of use of an adhesive composition.
Examples of such a solvent include ethyl acetate, methyl acetate, diethyl ether, dimethyl ether, acetone, methyl ethyl ketone, acetonitrile, hexane, cyclohexane, toluene, heptane and the like.

  Although the thickness of a film adhesive is not specifically limited, Preferably it is 3-300 micrometers, More preferably, it is 5-250 micrometers, Most preferably, it is 7-200 micrometers.

  The film adhesive according to the present invention is attached to a chip group composed of a plurality of chip bodies. A film-like adhesive is affixed to a chip group consisting of a plurality of chip bodies, and a chip with an adhesive layer is obtained by dividing (melting) the film-like adhesive into chip sizes using heated gas. It adheres to a predetermined position (mounting part such as a substrate or other chip) through the agent layer.

  A chip group composed of a plurality of chip bodies is obtained by dividing a workpiece (hereinafter referred to as “work”) into individual pieces. The method of dividing the workpiece into individual pieces is not particularly limited. For example, a blade dicing method, a laser dicing method, a stealth dicing method, or a region on the surface of the workpiece that is left as a chip body after the workpiece is separated into pieces. There is a so-called tip dicing method in which a groove is provided in this area and the workpiece is thinned from the back side of the workpiece to the bottom of the groove. The workpiece is not limited in its material, and examples thereof include various articles such as semiconductor wafers, glass substrates, ceramic substrates, organic material substrates such as FPC, and metal materials such as precision parts. The thickness of the chip body is not particularly limited, and is preferably 10 to 500 μm, and more preferably 10 to 100 μm when the chip body is further stacked on another chip body.

  Moreover, a film adhesive may be used as an adhesive layer formed so that peeling is possible on a support body. Hereinafter, an adhesive sheet in which an adhesive layer is formed on a support will be described.

(Adhesive sheet)
When the adhesive sheet is used, the adhesive layer is adhered to the adherend, the support is peeled off, and the adhesive layer is transferred to the adherend. The shape of the adhesive sheet according to the present invention can be any shape such as a tape shape or a label shape. The support may be a resin film having no tack on the surface, or may be a so-called dicing sheet (adhesive sheet having an adhesive layer).

  Examples of the resin film used as the support for the adhesive sheet include polyethylene film, polypropylene film, polybutene film, polybutadiene film, polymethylpentene film, polyvinyl chloride film, vinyl chloride copolymer film, polyethylene terephthalate film, polyethylene naphthalate. Phthalate film, polybutylene terephthalate film, polyurethane film, ethylene vinyl acetate copolymer film, ionomer resin film, ethylene / (meth) acrylic acid copolymer film, ethylene / (meth) acrylic acid ester copolymer film, polystyrene film Films such as polycarbonate film, polyimide film, and fluororesin film are used. These crosslinked films are also used. Furthermore, these laminated films may be sufficient. Moreover, the film etc. which colored these can be used. In the case where the adhesive layer has energy ray curability, those having energy ray permeability are preferable. Moreover, when it is necessary to visually recognize the surface of the adhered adherend while the adhesive sheet is being adhered, it is preferable that it has visible light transparency (transparent or translucent).

  The adhesive sheet according to the present invention is affixed to various adherends, and the adhesive layer is peeled off from the support in a state in which the adhesive layer remains adhered to the adherend. That is, it is used for a process including a step of transferring an adhesive layer from a support to an adherend. For this reason, the surface tension of the surface in contact with the adhesive layer of the support (resin film) is preferably 40 mN / m or less, more preferably 37 mN / m or less, and particularly preferably 35 mN / m or less. The lower limit is usually about 25 mN / m. Such a resin film having a low surface tension can be obtained by appropriately selecting the material, and can also be obtained by applying a release agent to the surface of the resin film and performing a release treatment.

  As the release agent used for the release treatment of the resin film, alkyd, silicone, fluorine, unsaturated polyester, polyolefin, wax, etc. are used, and in particular, alkyd, silicone, and fluorine release agents. Is preferable because it has heat resistance.

  In order to release the surface of the resin film using the release agent described above, the release agent can be applied as it is without solvent, or diluted or emulsified with a solvent, using a gravure coater, Mayer bar coater, air knife coater, roll coater, etc. Then, the release sheet on which the release agent is applied may be provided at room temperature or under heating, or may be cured with an electron beam to form a release agent layer.

  Further, the surface tension of the resin film may be adjusted by laminating the films by wet lamination, dry lamination, hot melt lamination, melt extrusion lamination, coextrusion processing, or the like. That is, a film in which the surface tension of at least one surface is in a preferable range as a surface in contact with the adhesive layer of the resin film described above is set so that the other surface is a surface in contact with the adhesive layer. It is good also as a support body.

  The support may be a pressure-sensitive adhesive sheet including a pressure-sensitive adhesive layer. The pressure-sensitive adhesive sheet has a pressure-sensitive adhesive layer on the resin film as described above, and the adhesive layer is laminated on the pressure-sensitive adhesive layer in a peelable manner. Therefore, the pressure-sensitive adhesive layer of the pressure-sensitive adhesive sheet can be composed of a known pressure-sensitive adhesive having removability, and by selecting a pressure-sensitive adhesive such as an ultraviolet curable type, a heat-foaming type, a water swelling type, or a weakly viscous type. The adhesive layer can be easily peeled off.

  Further, the adhesive sheet may have a shape in which the support and the adhesive layer are previously punched in the same shape as the adherend. In particular, the laminate composed of the support and the adhesive layer is preferably in a form held on a long support.

  The thickness of the support is usually 10 to 500 μm, preferably 15 to 300 μm, particularly preferably about 20 to 250 μm. When the support is an adhesive sheet, the layer made of the adhesive usually occupies a thickness of about 1 to 50 μm in the thickness of the support.

  In order to protect the adhesive layer and the adhesive of the adhesive sheet before use, the adhesive layer for fixing to the jig described below, a release film is laminated on the upper surface of the adhesive layer etc. It may be left. As the release film, one in which a release agent such as a silicone resin is applied to a plastic material such as a polyethylene terephthalate film or a polypropylene film is used. In addition, an adhesive layer or an adhesive tape may be separately provided on the outer peripheral portion of the surface of the adhesive sheet in order to fix other jigs such as a ring frame.

  The production method of the adhesive sheet is not particularly limited. When the support is a resin film, the adhesive composition may be applied and dried on the resin film to form an adhesive layer. Good. Moreover, you may manufacture by providing an adhesive bond layer on a peeling film and transferring this to the said resin film or a dicing sheet. In any stage of the manufacturing process, the adhesive layer may be cut by punching or the like so as to have the same shape as the shape of the wafer to be attached or a concentric shape larger than the wafer.

(Method for manufacturing semiconductor device)
Next, a method for manufacturing a semiconductor device according to the present invention will be described.
The manufacturing method of the semiconductor device which concerns on this invention contains a polymer component (A) and a thermosetting component (B1), the content rate of a polymer component (A) is 1-30 mass%, a thermosetting component (B1). ) Content rate of 40-70% by mass is applied to a chip group consisting of a plurality of chip bodies (step (a)), and the heated gas is released toward the film adhesive. This includes a step of fusing the film adhesive (step (b)). Hereinafter, an example will be described.

  In the first example of the method for manufacturing a semiconductor device according to the present invention, first, a semiconductor wafer having a circuit formed on the front surface and ground on the back surface is prepared as a workpiece.

  The semiconductor wafer may be a silicon wafer or a compound semiconductor wafer such as gallium / arsenic. Formation of a circuit on the wafer surface can be performed by various methods including conventionally used methods such as an etching method and a lift-off method.

  Next, a groove is provided in an area on the surface of the semiconductor wafer, other than the area remaining as a chip after the semiconductor wafer is singulated, and the semiconductor wafer is thinned from the back side of the semiconductor wafer to the bottom of the groove. It is preferable to perform a step ((c) step) of obtaining a chip group composed of a plurality of semiconductor chips by performing the processing.

  Specifically, a groove having a depth of cut shallower than the wafer thickness is formed from the surface of the semiconductor wafer on which the circuit is formed, and an adhesive sheet called a surface protection sheet is attached to the circuit forming surface. The method for forming the groove is not particularly limited. Further, the method for attaching the surface protective sheet is not particularly limited. Thereafter, by grinding the back surface of the semiconductor wafer, the thickness of the wafer is reduced, and the semiconductor wafer is separated into pieces, thereby obtaining a chip group composed of a plurality of semiconductor chips.

  Subsequently, the film adhesive which concerns on this invention is stuck on the chip group which consists of a several semiconductor chip ((a) process). A sticking method is not particularly limited. Prior to application of the film adhesive according to the present invention, a chip group composed of a plurality of semiconductor chips may be transferred to another pressure-sensitive adhesive sheet, and then the film adhesive may be applied. When a chip group composed of a plurality of semiconductor chips is transferred to another pressure-sensitive adhesive sheet, a film adhesive can be applied to the circuit surface of the semiconductor chip.

  Hereinafter, a film adhesive is used as an adhesive layer, and an adhesive sheet in which the adhesive layer is releasably laminated is attached to a chip group composed of a plurality of semiconductor chips held on a surface protective sheet. The case will be described.

  First, the support body of an adhesive sheet is peeled from the laminated body of the chip group consisting of a plurality of semiconductor chips held on the surface protection sheet and the adhesive sheet. The peeling method is not particularly limited.

  Thereafter, the heated gas is discharged toward the adhesive layer (film adhesive) from the side not attached to the film adhesive chip group (step (b)). The heated gas is discharged from the nozzle of the heated gas generator toward the film adhesive, and is sprayed onto the film adhesive present in the same region as between the semiconductor chips in plan view. Since the heated gas is a high temperature, the film-like adhesive existing in the same region as between the semiconductor chips in a plan view is melted or softened, and the film-like adhesive is melted to the chip size to obtain a chip with an adhesive layer. .

  The heating gas may be sprayed over the entire surface of the film adhesive, or may be sprayed along the film adhesive existing in the same region as between the semiconductor chips in plan view. Also, when spraying along a film adhesive that exists in the same area as between the semiconductor chips in plan view, spray to a range narrower than the width of the film adhesive that exists in the same area as between the semiconductor chips in plan view. You may spray on the range wider than this width.

Moreover, the temperature of heated gas should just be the temperature which a film adhesive softens at least, and is 50-200 degreeC normally, Preferably it is 60-120 degreeC. Further, the pressure of the heated gas is preferably 0.15 MPa or more, and more preferably 0.3 MPa or more. If the pressure of the heated gas is less than 0.15 MPa, the film adhesive may not be fused. Further, the flow rate of the heated gas is preferably at 0.0005 m ³ / sec or more, more preferably 0.0008m ³ / sec or more. Here, the temperature of the heated gas is not the temperature of the nozzle outlet, but the temperature when the heated gas reaches the film adhesive, that is, the surface temperature of the film adhesive.

  In the method for manufacturing a semiconductor device according to the present invention, the film adhesive is melted or softened with a heated gas and melted, but other heating means other than the heated gas can be used in combination. Another heating means includes a heating stage, and the heated gas may be released toward the film adhesive on the heating stage.

  Next, if necessary, the chip group with an adhesive layer may be transferred from the surface protective sheet to another pressure-sensitive adhesive sheet, and the other pressure-sensitive adhesive sheet may be expanded. By expanding the gap between the chips with the adhesive layer, the pickup of the chip with the adhesive layer can be more easily performed.

  Pickup of the chip with the adhesive layer can be performed by a known method. Next, the semiconductor chip is placed on the die pad of the lead frame which is the chip mounting portion or on the surface of another semiconductor chip (lower chip) through the adhesive layer. In order to improve the adhesiveness of the adhesive layer, the chip mounting portion is heated before mounting the semiconductor chip or heated immediately after mounting. The heating temperature is usually 80 to 200 ° C, preferably 100 to 180 ° C, and the heating time is usually 0.1 seconds to 5 minutes, preferably 0.5 seconds to 3 minutes. Moreover, the pressure of pressurization at the time of mounting is usually 1 kPa to 200 MPa.

  After the semiconductor chip is placed on the chip mounting portion, the adhesive layer is removed by heating before resin sealing without waiting for the main curing of the adhesive layer using heating in resin sealing as described later. It may be cured. The heating conditions at this time are in the above heating temperature range, and the heating time is usually 1 to 180 minutes, preferably 10 to 120 minutes.

  Alternatively, the adhesive layer may be fully cured by using heat in resin sealing that is normally performed in package manufacturing, without temporarily performing the heat treatment after placement. Through such steps, the adhesive layer is cured, and a semiconductor device in which the semiconductor chip and the chip mounting portion are firmly bonded can be obtained. Since the adhesive layer is softened under die-bonding conditions, the adhesive layer is sufficiently embedded in the unevenness of the chip mounting portion, so that voids can be prevented and the reliability of the package is improved.

  In such a first example, a chip that has been singulated with the end of the thinning process is obtained. Therefore, there is no risk of wafer breakage due to handling a thinned and undivided wafer. Therefore, it is suitable when the risk of damage to the wafer due to handling a wafer that has been thinned and not separated into individual pieces is high, such as when the chip is thinned to about 10 to 100 μm.

  In the second example of the method for manufacturing a semiconductor device according to the present invention, the surface (back surface) opposite to the circuit surface of the prepared semiconductor wafer is ground. The grinding method is not particularly limited, and grinding may be performed by a known means using a grinder or the like. At the time of back surface grinding, an adhesive sheet called a surface protective sheet is attached to the circuit surface to protect the circuit on the surface. In the back surface grinding, the circuit surface side (that is, the surface protection sheet side) of the wafer is fixed by a chuck table or the like, and the back surface side on which no circuit is formed is ground by a grinder. The thickness of the wafer after grinding is not particularly limited, but is usually about 20 to 500 μm.

  Next, the back surface side of the semiconductor wafer and the ring frame are fixed to a pressure-sensitive adhesive layer of a known dicing sheet. Then, the semiconductor wafer is cut using a cutting means such as a dicing saw to obtain a chip group composed of a plurality of semiconductor chips. The cutting depth at this time is a depth that takes into account the thickness of the semiconductor wafer and the wear of the dicing saw.

  Next, a chip group composed of a plurality of semiconductor chips is transferred to a known adhesive tape, and the dicing sheet is peeled off. The method for peeling the dicing sheet is not particularly limited. Thereafter, the step (a) and the step (b) are performed. For example, a film-like adhesive is used as an adhesive layer, and an adhesive sheet in which the adhesive layer is releasably laminated on a support is attached to the back surface of the semiconductor wafer (step (a)). Next, the support of the adhesive sheet is peeled off. Thereafter, the step (b) and the subsequent steps can be performed in the same manner as described in the first example.

  EXAMPLES Hereinafter, although an Example demonstrates this invention, this invention is not limited to these Examples. In the following examples and comparative examples, <melt viscosity at 80 ° C.> and <hot air cut test> were performed as follows.

<Melt viscosity at 80 ° C.>
Samples were obtained by laminating the adhesive layers obtained in Examples and Comparative Examples to a minimum thickness exceeding 1.5 mm. The melt viscosity of the film-like adhesive before curing was measured using a capillary rheometer (CFT-100D manufactured by Shimadzu Corporation) at a test start temperature of 50 ° C., a heating rate of 10 ° C./min, a test force of 50 kgf, and a die hole diameter of 0. Measured under the conditions of 0.5 mmφ and 1.0 mm die length.

<Hot air cut test>
(1) Creation of tip-diced chip Using a dicing machine (DFD-6361, manufactured by Disco Corporation) on a mirror-polished silicon wafer having a diameter of 300 mm and a thickness of 775 μm, the wafer should have a cutting depth of 70 μm and a chip size of 10 mm × 10 mm. A groove was formed.
Next, a surface protective sheet (Adwill E-3125KL, manufactured by Lintec Corporation) is attached to the grooved surface, and the wafer surface is polished to a thickness of 30 μm using a back surface grinding device (DGP-8760, manufactured by Disco Corporation). Back grinding was performed and divided into chips.
The surface protective sheet surface was irradiated with ultraviolet rays using an ultraviolet irradiation device (RAD-2000 m / 12, manufactured by Lintec Corporation) (illuminance 220 mW / cm ² , light amount 380 mJ / cm ² ).
(2) Adhesion of adhesive sheet and peeling of surface protective sheet The adhesive sheet prepared in Example or Comparative Example, from which the release film was removed, was stuck so that the adhesive layer was in contact with the chip. At this time, the chip was heated to 60 ° C.
Thereafter, the adhesive sheet was cut according to the shape of the wafer before the chip group was separated into pieces, and the support of the adhesive sheet attached to the chip was peeled off.
Subsequently, the adhesive layer was blown (hot air cut) by releasing heated gas toward the adhesive layer exposed by peeling the support. Specifically, a nozzle that discharges a heated gas having a gas temperature of 70 ° C. at a flow rate of 50 L / min is moved at a moving speed of 50 mm / sec along the line between the chips on the adhesive layer heated to 60 ° C. Was used to cut hot air.
Next, using a tape mounter (RAD2700F / 12, manufactured by Lintec Corporation), a dicing sheet (G-18, manufactured by Lintec Corporation) is attached to the adhesive layer cut with hot air, and then conveyed to a peeling unit, and a surface protective sheet. Peeled off.
The evaluation of the hot air cut test is carried out by visual confirmation with a microscope. In one line of the film-like adhesive that has released hot air, the case where there is no unfused part is “good”, and the case where there is an unfused part. “Bad”.

<Adhesive composition>
Each component which comprises an adhesive bond layer (film adhesive) is shown below.
(AB-1) An acrylic polymer obtained by copolymerizing 55 parts by mass of n-butyl acrylate, 10 parts by mass of methyl acrylate, 20 parts by mass of glycidyl methacrylate and 15 parts by mass of 2-hydroxyethyl acrylate (weight average molecular weight: 900,000) Glass transition temperature: -29 ° C)
(A1) Acrylic polymer obtained by copolymerizing 85 parts by mass of methyl acrylate and 15 parts by mass of 2-hydroxyethyl acrylate (weight average molecular weight: 450,000, glass transition temperature: 9 ° C.)
(AB-2) An acrylic polymer obtained by copolymerizing 35 parts by mass of n-butyl acrylate, 32 parts by mass of ethyl acrylate, 3 parts by mass of glycidyl methacrylate and 30 parts by mass of acrylonitrile (weight average molecular weight: 700,000, glass transition temperature) : -5 ° C)
(B11-1) Bisphenol A type epoxy resin (Nippon Shokubai BPA328, epoxy equivalent: 235 g / eq)
(B11-2) Phenylene skeleton type epoxy resin (Nippon Kayaku Co., Ltd. EPPN-502H, epoxy equivalent: 167 g / eq)
(B11-3) Phenylene skeleton epoxy resin (EPPN-501H, Nippon Kayaku Co., Ltd., epoxy equivalent: 165 g / eq)
(B12-1) novolac type phenol resin (BRG-556, Showa High Polymer, phenolic hydroxyl group equivalent: 103 g / eq)
(B12-2) novolak type phenol resin (M-4, manufactured by Meiwa Kasei Co., phenolic hydroxyl group equivalent: 104 g / eq)
(B13) 2-Phenyl-4,5-dihydroxymethylimidazole (Curesol 2PHZ-PW, manufactured by Shikoku Chemicals)
(B21) Dicyclopentanyl dimethylene diacrylate (KAYARAD R-684, manufactured by Nippon Kayaku)
(B22) 1-hydroxycyclohexyl phenyl ketone (Irgacure 184, manufactured by Ciba Specialty Chemicals)
(C) γ-glycidoxypropyltriethoxysilane (KBE-403 manufactured by Shin-Etsu Chemical Co., Ltd.)
(D) Spherical silica (SC2050MA manufactured by Admatechs)

(Examples and Comparative Examples)
Each said component was mix | blended in the quantity of Table 1, and the adhesive composition was obtained. A methyl ethyl ketone solution (solid concentration 61% by weight) of the obtained composition was applied on the release-treated surface of a release film (SP-PET 381031 manufactured by Lintec Corporation) that had been subjected to a release treatment with silicone so that the thickness was 20 μm after drying. , Drying (drying conditions: 100 ° C. for 1 minute in an oven) to form an adhesive layer (film adhesive) on the release film, and transferring the adhesive layer to the support (polyolefin substrate) An adhesive sheet was obtained.

  Each evaluation was performed about the adhesive bond layer (film adhesive) of the obtained adhesive sheet. The results are shown in Table 2.

Claims (7)

A film-like adhesive comprising a polymer component (A) and a thermosetting component (B1),
The content of the polymer component (A) in the film adhesive is 1 to 30% by mass, the content of the thermosetting component (B1) is 40 to 70% by mass,
A film adhesive used for fusing the film adhesive by sticking the film adhesive to a chip group composed of a plurality of chip bodies and releasing a heated gas toward the film adhesive. The film adhesive according to claim 1, wherein the melt viscosity at 80 ° C. is less than 1.0 × 10 ⁵ Pa · s in a state before heat curing.   The chip group consisting of the plurality of chip bodies is an area on the surface of the work, and a groove is provided in an area other than the area remaining as the chip body after the work is separated into pieces, and reaches the bottom of the groove from the back side of the work. The film adhesive according to claim 1 or 2, wherein the film adhesive is obtained by subjecting a workpiece to a thinning process.   The adhesive sheet by which the film adhesive in any one of Claims 1-3 is used as an adhesive layer, and this adhesive layer is laminated | stacked on the support body so that peeling is possible. A semiconductor device manufacturing method including the following steps (a) and (b):
(A) The polymer component (A) and the thermosetting component (B1) are included, the content of the polymer component (A) is 1 to 30% by mass, and the content of the thermosetting component (B1) is 40 to 70. A step of affixing a film-like adhesive of mass% to a chip group comprising a plurality of chip bodies, and (b) a step of fusing the film-like adhesive by releasing a heated gas toward the film-like adhesive. . The method for manufacturing a semiconductor device according to claim 5, wherein the film-like adhesive in a state before heat curing has a melt viscosity at 80 ° C. of less than 1.0 × 10 ⁵ Pa · s. Furthermore, before performing said (a) process, The manufacturing method of the semiconductor device of Claim 5 or 6 including the following (c) processes;
(C) A groove is provided in an area on the surface of the work other than the area remaining as a chip body after the work is separated into pieces, and the work thinning process is performed from the back side of the work to the bottom of the groove. A step of obtaining a chip group composed of the plurality of chip bodies by performing.