CN104419341A - Adhesive tape for dicing and method for manufacturing semiconductor chips - Google Patents
Adhesive tape for dicing and method for manufacturing semiconductor chips Download PDFInfo
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- CN104419341A CN104419341A CN201410437583.4A CN201410437583A CN104419341A CN 104419341 A CN104419341 A CN 104419341A CN 201410437583 A CN201410437583 A CN 201410437583A CN 104419341 A CN104419341 A CN 104419341A
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- adhesive tape
- tackiness agent
- agent
- silicone
- weight part
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/04—Polysiloxanes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/561—Batch processing
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
Abstract
The invention provides an adhesive tape for dicing and a method for manufacturing semiconductor chips. The adhesive tape for dicing provides excellent adhesion for an element substrate with a plurality of semiconductor elements sealed by sealing resin. The method for manufacturing the semiconductor chips uses the adhesive tape for dicing. The adhesive tape (1) is the adhesive tape (1) for dicing used when the element substrate with a plurality of semiconductor elements sealed by sealing resin is divided into a plurality of semiconductor chips. The adhesive tape (1) for dicing comprises a base material (2) and an adhesive layer (3) placed on the based material (2) and containing a cured silicone adhesive and a curing agent.
Description
Technical field
The present invention relates to the manufacture method of the cutting adhesive tape used in the cutting of device substrate and the semi-conductor chip employing cutting adhesive tape.
Background technology
In the past, as in order to make the semi-conductor chip with LED (photodiode) etc. and the cutting adhesive tape used, the known adhesive tape (with reference to patent documentation 1) with the bond layer be made up of acrylic resin.
In addition, as the method using cutting adhesive tape to make semi-conductor chip, known following method, by adhesive tape joining in the substrate-side of semiconductor element substrate being formed with multiple semiconductor element, the method utilizing cutting machine semiconductor element substrate to be cut off (with reference to patent documentation 2).
Prior art document
Patent documentation
Patent documentation 1: Japanese Unexamined Patent Publication 2013-38408 publication
Patent documentation 2: Japanese Unexamined Patent Publication 2005-93503 publication
Summary of the invention
The problem that invention will solve
Incidentally, proposing following technology in recent years, when namely making semi-conductor chip when semiconductor element substrate being cut off, adhesive tape joining being carried out the technology of cutting in the substrate-side of sealing resin side instead of semiconductor element substrate.
Like this, when to paste adhesive tape from sealing resin side for semiconductor element substrate, clinging power is not enough sometimes, thus produces the splashing etc. of semi-conductor chip.
The object of the invention is to, the manufacture method of the semi-conductor chip having good adhesive cutting adhesive tape for the device substrate being formed with the multiple semiconductor elements sealed by sealing resin and employ this cutting adhesive tape is provided.
For solving the method for problem
Based on above-mentioned purpose, cutting adhesive tape of the present invention, it is characterized in that, for the cutting adhesive tape used when the device substrate being formed with the multiple semiconductor elements sealed by sealing resin is divided into multiple semi-conductor chip, the adhering agent layer comprising curing silicone-based tackiness agent and solidifying agent that described cutting adhesive tape possesses base material and folds at above-mentioned layers on substrates.
At this, can make it is characterized in that, for said elements substrate, paste from the above-mentioned sealing resin side be made up of silicone resin and use.In addition, can make it is characterized in that, the initiator that above-mentioned adhering agent layer comprises peroxide curing type silicone tackiness agent and is made up of superoxide.And then can make it is characterized in that, relative to above-mentioned peroxide curing type silicone tackiness agent 100 weight part, the content of above-mentioned initiator is the scope of 0.01 weight part ~ 15 weight part.And then can make it is characterized in that, above-mentioned adhering agent layer comprises addition reaction-type silicone tackiness agent, linking agent and catalyzer.In addition, can make it is characterized in that, relative to above-mentioned addition reaction-type silicone tackiness agent 100 weight part, the content of above-mentioned linking agent is the scope of 0.05 weight part ~ 10 weight part.
And then, if grasp words of the present invention with the manufacture method of semi-conductor chip, then the manufacture method of semi-conductor chip of the present invention comprises: utilize the sealing resin be made up of silicone resin will to be formed with the sealing process of the plurality of semiconductor element encapsulation of the device substrate of multiple semiconductor element on substrate; For said elements substrate, paste the adhering processes of the adhesive tape of the adhering agent layer possessing base material and comprise curing silicone-based tackiness agent and solidifying agent from above-mentioned sealing resin side; The said elements substrate cutting being pasted with above-mentioned adhesive tape is become the cut-out operation of multiple semi-conductor chip; And the stripping process of above-mentioned adhesive tape is peeled off from above-mentioned multiple semi-conductor chip.
Invention effect
According to the present invention, the manufacture method of the semi-conductor chip that for the device substrate being formed with the multiple semiconductor elements sealed by sealing resin, there is good adhesive cutting adhesive tape and employ this cutting adhesive tape can be provided.
Accompanying drawing explanation
Fig. 1 is the figure of an example of the formation of the adhesive tape representing application present embodiment.
Fig. 2 (a) ~ Fig. 2 (d) is the figure of the manufacture method of the semi-conductor chip representing the adhesive tape employing application present embodiment.
Nomenclature
1: adhesive tape
2: base material
3: adhering agent layer
Embodiment
Below, embodiments of the present invention are described.
The formation of adhesive tape
Fig. 1 is the figure of an example of the formation of the adhesive tape 1 representing application present embodiment.The adhesive tape 1 of present embodiment uses in the cutting purposes of semiconductor element substrate being formed with the multiple semiconductor elements sealed by sealing resin.Specifically, the adhesive tape 1 of present embodiment, by for semiconductor element substrate, is pasted from the sealing resin side be made up of silicone-based resin, thus is used in cutting.In addition, the using method of adhesive tape 1 is described in detail later.
As shown in Figure 1, the adhesive tape 1 of present embodiment has base material 2 structure stacked with adhering agent layer 3.
Be explained, although the diagram of eliminating, adhesive tape 1 can have tackifier coating (anchor coat layer) as required between base material 2 and adhering agent layer 3.In addition, surface treatment can be implemented in the surface of base material 2 (with the face of opposition side, face being opposite to adhering agent layer 3).And then, release liner can be possessed in the surface of adhering agent layer 3 (with the face of opposition side, face being opposite to base material 2).
Base material
The material of the base material 2 used in the adhesive tape 1 of present embodiment is not particularly limited, such as, can use metal, plastics etc.Specifically, as base material 2, such as can use the tinsel such as stainless steel, soft aluminium, the resin moldings such as polyethylene terephthalate, polybutylene terephthalate, polyethylene naphthalate, polyphenylene sulfide, biaxial stretch-formed polypropylene, polyimide, aromatic poly amide, polycyclic alkene, fluorine resin.In addition, can according to purposes, base material 2 uses the composite membrane such as by aluminium foil and resin molding lamination, and the surface of resin molding defines the composite membrane of the metal oxide film such as aluminum oxide, silicon-dioxide, and by these composite membranes further with the composite membrane etc. of resin molding lamination.
Wherein, as base material 2, preferably use take polyethylene terephthalate as the material of principal constituent.
Adhering agent layer
The adhering agent layer 3 of present embodiment comprises curing silicone-based tackiness agent and forms for the solidifying agent solidifying this silicone-based tackiness agent.In addition, adhering agent layer 3 can contain toner etc. as required.
The thickness of adhering agent layer 3 is preferably the scope of 5 μm ~ 50 μm, is more preferably the scope of 20 μm ~ 40 μm.When the thickness of adhering agent layer 3 is less than 5 μm, silicone-based tackiness agent contained in adhering agent layer 3 is thinning, and therefore the clinging power of adhesive tape 1 is easy to reduce.On the other hand, when the Thickness Ratio 50 μm of adhering agent layer 3 is thick, the cohesion easily producing adhering agent layer 3 destroys, when employing such adhesive tape 1, when adhesive tape 1 is peeled off, the cull that the state that easy generation is attached to adherend with tackiness agent remains.
At this, in the adhering agent layer 3 of present embodiment, as curing silicone-based tackiness agent, peroxide curing type silicone-based tackiness agent or addition reaction-type silicone-based tackiness agent can be used.
Below, will the first method of situation as adhering agent layer 3 of peroxide curing type silicone-based tackiness agent be used, using using the situation of addition reaction-type silicone-based tackiness agent as the second method of adhering agent layer 3, be described successively.
First method
The adhering agent layer 3 of first method comprises peroxide curing type silicone-based tackiness agent and the initiator (solidifying agent) that is made up of superoxide and forming.
Peroxide curing type silicone-based tackiness agent
The tackiness agent that peroxide curing type silicone-based tackiness agent is such as is host with the organopolysiloxane mixture of the organopolysiloxanes such as polydimethylsiloxane and organopolysiloxane copolymers resin.
As peroxide curing type silicone-based tackiness agent, be not particularly limited, such as can use KR100, KR101-10 of Shin-Etsu Chemial Co., Ltd, YR3340, YR3286, PSA610-SM, XR37-B6722 of MomentivePerformanceMaterials, the SH4280 etc. of Dong Li DOW CORNING Co., Ltd..
Initiator
As the initiator be made up of superoxide, organo-peroxide can be used.As the organo-peroxide being used as initiator, be not particularly limited, such as can enumerate benzoyl peroxide, dicumyl peroxide, 2,5-dimethyl-2,5-bis-(tert-butyl hydroperoxide) hexane, 1,1 '-two-tert-butyl hydroperoxide-3,3,5-trimethylene hexanaphthene, 1,3-bis--(tert-butyl hydroperoxide)-diisopropyl benzene etc.As commercially available prod, such as, can enumerate the NYPER K40 etc. of Japan Oil Co.
Content
At this, the content of the initiator (organo-peroxide) in the adhering agent layer 3 of first method, relative to peroxide curing type silicone-based tackiness agent 100 weight part, be preferably the scope of 0.01 weight part ~ 15 weight part, be more preferably the scope of 0.05 weight part ~ 10 weight part, more preferably the scope of 0.05 weight part ~ 3.5 weight part.
By the content of the initiator relative to peroxide curing type silicone-based tackiness agent is set to above-mentioned scope, the clinging power of adhering agent layer 3 and confining force can be set to as the preferred scope of cutting adhesive tape 1.
On the other hand, when the content of the initiator relative to peroxide curing type silicone-based tackiness agent is too small, the insufficient solidification of peroxide curing type silicone-based tackiness agent in adhering agent layer 3 sometimes, cannot obtain desired clinging power.In addition, when peroxide curing type silicone-based tackiness agent does not fully solidify, in adhering agent layer 3, easily produce cohesion destroy.Consequently, after cutting adhesive tape 1 being used in semiconductor element substrate, when peeling off adhesive tape 1 from obtained semi-conductor chip, easily produce cull.
When the content of the initiator relative to peroxide curing type silicone-based tackiness agent is excessive, the curing reaction of peroxide curing type silicone-based tackiness agent excessively carries out, and therefore adhering agent layer 3 is hardening, and the clinging power of adhesive tape 1 is easy to reduce.Further, when this adhesive tape 1 is used in cutting, when semiconductor element substrate being cut off, the semi-conductor chip as cut off machine is easily peeled off from adhesive tape 1 and splashes.
Second method
Then, the adhering agent layer 3 of second method comprises addition reaction-type silicone-based tackiness agent as silicone-based tackiness agent and comprises linking agent and catalyzer is formed as solidifying agent.In addition, can comprise for suppressing the reaction controlling material of the carrying out of the sharply addition reaction of addition reaction-type silicone-based tackiness agent in the adhering agent layer 3 of second method and form.
Addition reaction-type silicone-based tackiness agent
Addition reaction-type silicone-based tackiness agent is to be at least combined with containing 2 the tackiness agent that the organopolysiloxanes such as the polydimethylsiloxane of the thiazolinyl of Siliciumatom are host in 1 molecule.In addition, as the molecular structure of organopolysiloxane contained in addition reaction-type silicone-based tackiness agent, such as, can illustrate straight-chain, the straight-chain with a part of branch, branched, netted.
In addition, as the thiazolinyl that organopolysiloxane contained in addition reaction-type silicone-based tackiness agent contains, such as, can illustrate vinyl, allyl group, butenyl, pentenyl, hexenyl, be particularly preferably vinyl.
As addition reaction-type silicone-based tackiness agent, be not particularly limited, such as can enumerate KR3700, KR3701, X-40-3237-1, X-40-3240, X-40-3291-1, X-40-3229, X-40-3270, X-40-3306 of Shin-Etsu Chemial Co., Ltd, TSR1512, TSR1516, XR37-B9204 of MomentivePerformanceMaterials, SD4580, SD4584, SD4585, SD4586, SD4587, SD4560, SD4570, SD4600PFC, SD4593, DC7651ADHESIVE etc. of Dong Li DOW CORNING Co., Ltd..
Linking agent
In the reaction of addition reaction-type silicone-based tackiness agent, as linking agent, can be used in 1 molecule and at least there is the organopolysiloxane that 2 are combined with the hydrogen atom of Siliciumatom.
As the molecular structure of organopolysiloxane being used as linking agent, such as, can illustrate straight-chain, there is the straight-chain of a part of branch, branched, ring-type, netted.
The linking agent used in reaction as addition reaction-type silicone-based tackiness agent, is not particularly limited, such as, can enumerate the BY24-741 etc. of X-92-122, Dong Li DOW CORNING Co., Ltd. of KCC of SHIN-ETSU HANTOTAI.
Catalyzer
In the reaction of addition reaction-type silicone-based tackiness agent, the catalyzer of the solidification of the addition reaction (hydrosilylation) for promoting to utilize addition reaction-type silicone-based tackiness agent and linking agent can be used.
As catalyzer, the known hydrosilylation reactions catalyzer such as platinum group catalyst, rhodium series catalysts, palladium series catalyst can be used.In these catalyzer, particularly, the platinum group catalyst speed of response such as alcoholic solution, the alkene complex of platinum, the alkenyl siloxane complex compound of platinum of the fine silica powder end of platinum micropowder, platinum black, Supported Pt Nanoparticles, the gac of Supported Pt Nanoparticles, Platinic chloride, Platinic chloride is good, therefore preferably.
The catalyzer used in reaction as addition reaction-type silicone-based tackiness agent, is not particularly limited, such as, can enumerate the CAT-PL-50T of Shin-Etsu Chemial Co., Ltd, SRX-212Cat, NC-25 etc. of Dong Li DOW CORNING Co., Ltd..
Reaction controlling agent
As the reaction controlling agent used as required in the adhering agent layer 3 of second method, be not particularly limited, such as, can enumerate the BY24-808 etc. of CAT-PLR-2, Dong Li DOW CORNING Co., Ltd. of Shin-Etsu Chemial Co., Ltd.
Content
At this, the content of the linking agent in the adhering agent layer 3 of second method, relative to addition reaction-type silicone-based tackiness agent 100 weight part, be preferably the scope of 0.05 weight part ~ 10 weight part, be more preferably the scope of 0.1 weight part ~ 7 weight part, more preferably the scope of 0.1 weight part ~ 2 weight part.
By the content of the linking agent relative to addition reaction-type silicone-based tackiness agent is set to above-mentioned scope, the clinging power of adhering agent layer 3 and confining force can be set to as the preferred scope of cutting adhesive tape 1.
On the other hand, when the content of the linking agent relative to addition reaction-type silicone-based tackiness agent is too small, in adhering agent layer 3, crosslinking reaction is insufficient sometimes carries out, and cannot obtain desired clinging power.In addition, when the crosslinking reaction of addition reaction-type silicone-based tackiness agent is not fully carried out, in adhering agent layer 3, easily produce cohesion destroy.Consequently, after cutting adhesive tape 1 being used in semiconductor element substrate, when peeling off adhesive tape 1 from obtained semi-conductor chip, easily produce cull.
And then when the content of the linking agent relative to addition reaction-type silicone-based tackiness agent is excessive, the crosslinking reaction of addition reaction-type silicone-based tackiness agent is excessively carried out, and therefore adhering agent layer 3 is hardening, the clinging power of adhesive tape 1 is easy to reduce.Further, when this adhesive tape 1 is used in cutting, when semiconductor element substrate being cut off, the semi-conductor chip as cut off machine is easily peeled off from adhesive tape 1 and splashes.
In addition, the content of the catalyzer in the adhering agent layer 3 of second method is not particularly limited, such as can relative to addition reaction-type silicone-based tackiness agent 100 weight part, about being set to 0.01 weight part ~ 5 weight part.
Tackifier coating
As mentioned above, in the adhesive tape 1 of present embodiment, can according to the manufacturing condition of adhesive tape 1, manufacture after the working conditions etc. of adhesive tape 1, between base material 2 and adhering agent layer 3, the tackifier coating that coordinates is set or implements the surface treatments such as corona treatment with the kind of base material.Thereby, it is possible to improve the closing force of base material 2 and adhering agent layer 3.
Surface treatment
On the surface (with the face of opposition side, face being opposite to adhering agent layer 3) of base material 2, the surface treatments such as separability improved treatment can be implemented.The treatment agent used in surface treatment as base material 2, be not particularly limited, such as, can use the non-silicone-based stripping treatment agent etc. such as chain alkyl polymers of vinyl monomers, fluorinated alkyl vinyl monomer-polymer, polyvinyl alcohol carbamate, alkyd amino system resin.As so non-silicone-based stripping treatment agent, such as, can enumerate PEELOIL1050, PEELOIL 1200 etc. of Ipposha Oil Ind Co., Ltd..
Release liner
In addition, in the surface of adhering agent layer 3 (with the face of opposition side, face being opposite to base material 2), release liner can be set as required.As release liner, following release liner can be used, namely, on the films such as paper, polyethylene, polypropylene, polyethylene terephthalate, implement for improving the release liner with the lift-off processing of the release property of contained silicone-based tackiness agent in adhering agent layer 3.As the material used in the lift-off processing of release liner, be not particularly limited, such as, can use the material such as fluorosilicone, chain alkyl polymers of vinyl monomers, alkyd amino system resin.
The thickness of adhesive tape
The integral thickness with the adhesive tape 1 formed as described above is preferably the scope of 20 μm ~ 200 μm.
When the Thickness Ratio 20 μm of adhesive tape 1 is thin, when adhesive tape 1 is used in the cutting of semiconductor element substrate, be sometimes difficult to peel formed semi-conductor chip from adhesive tape 1.
In addition, when the Thickness Ratio 200 μm of adhesive tape 1 is thick, when being pasted from the sealing resin side of semiconductor element substrate by adhesive tape 1, adhesive tape 1 is difficult to follow the concavo-convex of sealing resin.Consequently, adhesive tape 1 diminishes with the bond area of sealing resin, and likely when cutting, semi-conductor chip is easy to splash.
The manufacture method of adhesive tape
Then, the manufacture method of the adhesive tape 1 of present embodiment is described.
Be explained, the above-mentioned adhesive tape 1 comprising the adhering agent layer 3 of peroxide curing type silicone-based tackiness agent with first method and the adhesive tape 1 comprising the adhering agent layer 3 of addition reaction-type silicone-based tackiness agent with second method can utilize same manufacture method to manufacture.
When manufacturing adhesive tape 1, first, in the organic solvent that toluene, ethyl acetate etc. are general, dissolving cured type silicone-based tackiness agent and solidifying agent, obtain tackiness agent solution.Then, use comma coater etc. by this tackiness agent solution coat in carried out as required surface treatment, tackifier coating formation base material 2 surface on, with the thickness making it reach regulation.
Then, at the temperature of 60 DEG C ~ 160 DEG C, about the base material 2 being coated with tackiness agent solution is heated several minutes ~ several tens minutes, thus make tackiness agent solution cured, form adhering agent layer 3.
By above operation, as shown in Figure 1, the adhesive tape 1 being laminated with adhering agent layer 3 on base material 2 can be obtained.
The using method of adhesive tape
As mentioned above, the adhesive tape 1 of present embodiment is used in the cutting of semiconductor element substrate.At this, so-called semiconductor element substrate, refers to the material being formed with the semiconductor elements such as multiple LED (light emitting diode) on the substrates such as resin.Be explained, in such semiconductor element substrate, generally for protection semiconductor element not by the impact of the change of the outside atmosphere such as temperature, humidity, sealing resin is set to cover semiconductor element.
The method of multiple semi-conductor chip is obtained, known such as following method in the past as semiconductor element substrate being cut off.
First, paste cutting adhesive tape from the substrate-side of semiconductor element substrate, and utilize cutting machine etc. to cut off semiconductor element substrate from the side being formed with semiconductor element.Then, peel by cutting off each semi-conductor chip formed from adhesive tape, thus obtain multiple semi-conductor chip.
But, cutting adhesive tape is pasted in the substrate-side from semiconductor element substrate like this, when having carried out the cut-out of semiconductor element substrate, have and the problems such as the so-called turned-down edge (ダ レ) that comes off or cut surface roughen occur to produce cut surface (substrate side surfaces of semi-conductor chip) is upper.
So, in recent years, in order to solve such problem, propose following method, namely for semiconductor element substrate, not from substrate-side, but from forming the side of semiconductor element, the sealing resin side stickup cutting adhesive tape by semiconductor element encapsulation, and by the method for semiconductor element substrate cut-out.
At this, in the past, as in order to cut off the cutting adhesive tape that semiconductor element substrate uses, such as, the adhesive tape with the adhering agent layer be made up of acrylic resin was used.
But, if the side (sealing resin side) of such adhesive tape in the past from the semiconductor element forming semiconductor element substrate is pasted and is carried out the cutting of semiconductor element substrate, then such as when the clinging power of sealing resin and adhesive tape is insufficient, the problem such as semi-conductor chip splashing when likely producing cutting.
But, as semiconductor element sealing resins such as LED, in recent years, mostly use silicone resin.Namely this is because, in the past, as semiconductor element sealing resin, utilize the epoxy resin of electrical characteristic, excellent heat resistance, but there is following problem in epoxy resin: when be used in short wavelength LED, high export LED easily variable color etc.On the other hand, silicone resin not easily occurs because of heat, light and the variable color that causes compared with epoxy resin.
But silicone resin has the character that such as release property is high compared with epoxy resin etc.Therefore, for employing the semiconductor element substrate of silicone resin as sealing resin, such as, acrylic resin adhesive tape being pasted from sealing resin side, be easy to diminish as the silicone resin of sealing resin and the bonding force of adhesive tape.Consequently, when cutting off semiconductor element substrate, the problems such as the splashing of above-mentioned semi-conductor chip are more easily produced.
On the other hand, the adhesive tape 1 of present embodiment is formed because adhering agent layer 3 comprises curing silicone-based tackiness agent and solidifying agent as mentioned above, even if when therefore using from the stickup of sealing resin side when carrying out the cutting of semiconductor element substrate, also the bonding force with the sealing resin of semiconductor element substrate can be kept well.Further, compared with adhesive tape in the past, the splashing etc. producing semi-conductor chip when carrying out the cutting of semiconductor element substrate can be suppressed.
Below, the manufacture method of semi-conductor chip of the using method of the adhesive tape 1 of present embodiment and the adhesive tape 1 that employs present embodiment is described in detail.Fig. 2 (a) ~ Fig. 2 (d) is the figure of the manufacture method of the semi-conductor chip representing the adhesive tape employing present embodiment.
Be explained, the method below illustrated is the use of an example of the manufacture method of the semi-conductor chip of adhesive tape 1, and the using method of adhesive tape 1 is not limited to following method.That is, as long as the adhesive tape 1 of present embodiment can be pasted on the semiconductor element substrate with the multiple semiconductor elements sealed by sealing resin when cutting, use with just can being not limited to following methods.
In the present embodiment, first, on the substrate 101 be such as made up of resin material etc., load multiple semiconductor element 102, make semiconductor element substrate 100.Be explained, semiconductor element 102 is such as LED element, although the diagram of eliminating, the multiple semiconductor layers such as comprising the luminescent layer of the luminescence by energising etc. are stacked and form, and are formed with electrode on top.
Next, the sealing resin 103 be made up of silicone-based resin is utilized to be sealed (sealing process) by the multiple semiconductor elements 102 formed on the substrate 101 of semiconductor element substrate 100.Be explained, in this example embodiment, utilize sealing resin 103 to be sealed in the lump by multiple semiconductor element 102, but sealing resin 103 also can be utilized to be sealed respectively by each semiconductor element 102.
Then, as shown in Fig. 2 (a), in the mode that the adhering agent layer 3 of adhesive tape 1 is opposed with the sealing resin 103 of semiconductor element substrate 100, adhesive tape 1 and semiconductor element substrate 100 are fitted (adhering processes).
Then, as shown in Fig. 2 (b), (c), under the state of adhesive tape 1 and semiconductor element substrate 100 being fitted, utilizing cutting machine etc., along cutting off preset lines X, semiconductor element substrate 100 being cut off (cut-out operation).In this example embodiment, the semiconductor element substrate 100 being pasted with adhesive tape 1 is cut off from substrate 101 side.In addition, as shown in Fig. 2 (c), in this example embodiment, carried out whole for semiconductor element substrate 100 the so-called of incision entirely to cut (full cut).
Then, the semi-conductor chip 200 formed by cutting off semiconductor element substrate 100 is peeled (pickup (pick up)) from adhesive tape 1, thus as shown in Fig. 2 (d), the semi-conductor chip 200 (stripping process) of singualtion can be obtained.
As mentioned above, in the adhesive tape 1 of present embodiment, adhering agent layer 3 comprises curing silicone-based tackiness agent and solidifying agent and forms.Thus, when adhesive tape 1 is used in cutting, even if when pasting from sealing resin 103 side of semiconductor element substrate 100, the bonding force of semiconductor element substrate 100 and adhesive tape 1 also can be kept well.
Particularly, in recent years, the high silicone resin of most use release property is as the sealing resin 103 sealed by semiconductor element 102, but the adhesive tape 1 of present embodiment is by having above-mentioned formation, thus also has good bonding force to the sealing resin 103 be made up of silicone resin.
Consequently, the adhesive tape 1 of present embodiment, when being used in the cutting of semiconductor element substrate 100, can suppress the splashing of semi-conductor chip 200.
And then curing silicone-based tackiness agent contained in the adhering agent layer 3 of the adhesive tape 1 of present embodiment has good clinging power with sealing resin 103 as described above, and has the high character of release property.Thus, in the present embodiment, when the semi-conductor chip 200 cutting by semiconductor element substrate 100 obtained is peeled off from adhesive tape 1, tackiness agent can be suppressed to be attached to the generation of the so-called cull of semi-conductor chip 200.
What be explained is, usually when such as the adhesive tape that adhering agent layer is made up of acrylic acid series tackiness agent being used in the cutting of semiconductor element substrate, when semi-conductor chip after cut-out is peeled from adhesive tape, need in advance to adhesive tape irradiation ultraviolet radiation, the tackiness of adhering agent layer is disappeared.And when adhesive tape 1 of present embodiment, do not carry out the operation of irradiation ultraviolet radiation, just semi-conductor chip 200 can be peeled off from adhesive tape 1.
Therefore, by the adhesive tape 1 of present embodiment being used in the cutting of semiconductor element substrate 100, the manufacturing process of semi-conductor chip 200 can be made to simplify.
Embodiment
Then, use embodiment and comparative example, further illustrate the present invention.Be explained, the present invention is not limited to following embodiment.
The present inventor is respectively to employing peroxide curing type silicone-based tackiness agent as the first method of adhering agent layer 3 and employ the second method of addition reaction-type silicone-based tackiness agent as adhering agent layer 3, change the addition of solidifying agent (initiator, linking agent), carry out the making of adhesive tape 1, and carry out the evaluation of made adhesive tape 1.
Below, each embodiment and each comparative example are described in detail.
1. the making of adhesive tape 1
(embodiment 1 ~ embodiment 4)
In toluene, dissolve the peroxide curing type silicone-based tackiness agent (Shin-Etsu Chemial Co., Ltd KR101-1) be made up of organopolysiloxane and the initiator (Japan Oil Co NYPER K40) be made up of methyl benzoyl peroxide, have adjusted tackiness agent solution.In addition, the content of peroxide curing type silicone-based tackiness agent and initiator is adjusted to as shown in table 1.
Then, after this tackiness agent solution coat is on the base material 2 be made up of polyethylene terephthalate (PET) film of thickness 75 μm, at the heating temperatures 3 minutes of 160 degree, thus form the adhering agent layer 3 of thickness 30 μm, obtain the adhesive tape 1 of total thickness 105 μm.
(embodiment 5 ~ 8)
In toluene, the addition reaction-type silicone-based tackiness agent (Shin-Etsu Chemial Co., Ltd X-40-3237-1) that dissolving is made up of the organopolysiloxane in molecule with vinyl silyl groups, platinum family catalyzer (Shin-Etsu Chemial Co., Ltd CAT-PL-50T) and the linking agent (Shin-Etsu Chemial Co., Ltd X-92-122) be made up of the organopolysiloxane in molecule with hydrosilane groups (hydrosilyl), have adjusted tackiness agent solution.In addition, the content of addition reaction-type silicone-based tackiness agent, catalyzer and linking agent is adjusted to as shown in table 1.
Then, after this tackiness agent solution coat is on the base material 2 be made up of PET film of thickness 75 μm, at the heating temperatures 3 minutes of 120 degree, thus form the adhering agent layer 3 of thickness 30 μm, obtain the adhesive tape 1 of total thickness 105 μm.
(comparative example 1)
The content of the initiator in adhering agent layer 3 is set to 0, in addition, operates in the same manner as embodiment 1 ~ embodiment 4, obtain adhesive tape 1.
(comparative example 2)
The content of the linking agent in adhering agent layer 3 is set to 0, in addition, operates in the same manner as embodiment 5 ~ embodiment 8, obtain adhesive tape 1.
(comparative example 3)
Employ the tackiness agent of acrylic acid series as adhering agent layer 3, in addition, operate in the same manner as embodiment 1 ~ 8, obtain adhesive tape 1.
2. evaluation method
Then, the evaluation method of adhesive tape 1 is described.
(1) to grinding SUS adhesion test
The adhesive tape 1 made for utilizing aforesaid method, according to the method recorded in JIS Z 0237 (2000), has carried out grinding SUS adhesion test (peel adhesion test).
Specifically, adhesive tape 1 is pasted on the stainless steel plate (SUS304) ground by water-fast pouncing paper, the roller of quality 2000g is crimped for reciprocal 1 time with the speed of 5mm/s.Then, place after 20 ~ 40 minutes, using tensile testing machine, to being 180 ° of directions relative to stainless steel plate, peeling off with the speed of 5mm/s, thus determine the clinging power to grinding SUS plate.
(2) confining force test
Confining force test has been carried out to made adhesive tape 1.
Specifically, adhesive tape 1 is pasted on the stainless steel plate (SUS304) ground by water-fast pouncing paper, the state determining to have installed regulation weight maintains 24 little deviates (mm) constantly under the condition of 40 DEG C.At this, as cutting adhesive tape, the deviate preferably measured in confining force test is below 25mm.
In addition, when adhesive tape 1 drops from stainless steel sheet peeling off before 24 hours, the elapsed time (minute) to adhesive tape 1 is peeled off from measuring is determined.Be explained, " ↓ " expression of confining force test in Table 1 refers to staggers from stainless steel plate at adhesive tape 1 before 24 hours and drops.
(3) to silicone resin adhesion test
To made adhesive tape 1, according to the method for above-mentioned adhesion test, carry out silicone resin adhesion test.
Specifically, adhesive tape 1 is pasted on the plate being coated with silicone resin, the roller of quality 2000g is crimped for reciprocal 1 time with the speed of 5mm/s.Then, place after 20 ~ 40 minutes, use tensile testing machine, to being 180 ° of directions relative to the plate being coated with silicone resin, peeling off with the speed of 5mm/s, thus determining the clinging power for silicone resin.
In addition, in this test, as the silicone resin coated on the plate pasted by adhesive tape 1, employ LED sealing agent silicone resin.
3. evaluation result
About the evaluation result of the adhesive tape 1 to embodiment 1 ~ embodiment 8 and comparative example 1 ~ comparative example 3, be shown in table 1.
Table 1
As shown in table 1, comprise curing silicone-based tackiness agent and solidifying agent and in the situation (embodiment 1 ~ embodiment 8) formed at adhering agent layer 3, confirm the clinging power of adhesive tape 1, confining force and to silicone resin clinging power all in preferred scope.
Confirm thus, it is useful that the adhesive tape 1 that adhering agent layer 3 comprises curing silicone-based tackiness agent and solidifying agent and forms pastes as the sealing resin side from semiconductor element substrate the cutting adhesive tape being used in cutting.
Then, in embodiment 1 ~ embodiment 8, using employ the situation of peroxide curing type silicone-based tackiness agent as silicone-based tackiness agent (embodiment 1 ~ embodiment 4) compare time, confirm relative to peroxide curing type silicone-based tackiness agent 100 weight part, when the content of the initiator be made up of superoxide is 0.05 weight part ~ 10 weight part (embodiment 1 ~ embodiment 3), the confining force of adhesive tape 1 is better.
And then confirm, relative to peroxide curing type silicone-based tackiness agent 100 weight part, when the content of initiator is 0.05 weight part ~ 3.5 weight part (embodiment 1, embodiment 2), adhesive tape 1 better to silicone resin clinging power.
Therefore, when employing peroxide curing type silicone-based tackiness agent as silicone-based tackiness agent, confirm relative to peroxide curing type silicone-based tackiness agent 100 weight part, the content of the initiator be made up of superoxide is more preferably the scope of 0.05 weight part ~ 10 weight part, more preferably the scope of 0.05 weight part ~ 3.5 weight part.
And then, in embodiment 1 ~ embodiment 8, using employ the situation of addition reaction-type silicone-based tackiness agent as silicone-based tackiness agent (embodiment 5 ~ embodiment 8) compare time, confirm relative to addition reaction-type silicone-based tackiness agent 100 weight part, when the content of linking agent is 0.1 weight part ~ 7 weight part (embodiment 5 ~ embodiment 7), the clinging power of adhesive tape 1 and higher to silicone resin clinging power, during 0.1 weight part ~ 2 weight part (embodiment 5, embodiment 6), the clinging power of adhesive tape 1 and higher to silicone resin clinging power.
Therefore, when employing addition reaction-type silicone-based tackiness agent as silicone-based tackiness agent, confirm relative to addition reaction-type silicone-based tackiness agent 100 weight part, the content of linking agent is more preferably the scope of 0.1 weight part ~ 7 weight part, more preferably the scope of 0.1 weight part ~ 2 weight part.
On the other hand, at adhering agent layer 3 not containing (comparative example 1, comparative example 2) solidifying agent (initiator or linking agent), the confining force confirming adhesive tape 1 is significantly low.This reason is considered to, and when adhering agent layer 3 is not containing solidifying agent, silicone-based tackiness agent is uncured.
And measurablely arriving, when employing such adhesive tape 1 as cutting adhesive tape, after adhesive tape 1 being used in the cutting of semiconductor element substrate, when peeling off adhesive tape 1 from obtained semi-conductor chip, easily producing cull.
In addition confirm, when employ acrylic acid series tackiness agent as adhering agent layer 3 (comparative example 3), although the clinging power of adhesive tape 1 and confining force are well, the clinging power for the silicone resin of the sealing resin as semiconductor element is significantly low.
When the sealing resin side stickup of such adhesive tape 1 as cutting adhesive tape from semiconductor element substrate is used, measurable to when cutting, semiconductor element substrate, semi-conductor chip are easily peeled off from adhesive tape 1, easily produce the splashing of semi-conductor chip.
Claims (6)
1. a cutting adhesive tape, it is characterized in that, for the cutting adhesive tape used when the device substrate being formed with the multiple semiconductor elements sealed by sealing resin is divided into multiple semi-conductor chip, described cutting adhesive tape possesses base material and the adhering agent layer comprising curing silicone-based tackiness agent and solidifying agent stacked on the substrate, for described device substrate, paste from the described sealing resin side be made up of silicone resin and use.
2. cutting adhesive tape according to claim 1, is characterized in that, the initiator that described adhering agent layer comprises peroxide curing type silicone tackiness agent and is made up of superoxide.
3. cutting adhesive tape according to claim 2, is characterized in that, relative to described peroxide curing type silicone tackiness agent 100 weight part, the content of described initiator is the scope of 0.01 weight part ~ 15 weight part.
4. cutting adhesive tape according to claim 1, is characterized in that, described adhering agent layer comprises addition reaction-type silicone tackiness agent, linking agent and catalyzer.
5. cutting adhesive tape according to claim 4, is characterized in that, relative to described addition reaction-type silicone tackiness agent 100 weight part, the content of described linking agent is the scope of 0.05 weight part ~ 10 weight part.
6. a manufacture method for semi-conductor chip, it comprises:
Utilize the sealing resin be made up of silicone resin will to be formed with the sealing process of the plurality of semiconductor element encapsulation of the device substrate of multiple semiconductor element on substrate;
For described device substrate, paste the adhering processes of the adhesive tape of the adhering agent layer possessing base material and comprise curing silicone-based tackiness agent and solidifying agent from described sealing resin side;
The described device substrate being pasted with described adhesive tape is cut into the cut-out operation of multiple semi-conductor chip; And
The stripping process of described adhesive tape is peeled off from described multiple semi-conductor chip.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013179008A JP6168553B2 (en) | 2013-08-30 | 2013-08-30 | Dicing adhesive tape and semiconductor chip manufacturing method |
| JP2013-179008 | 2013-08-30 |
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| CN104419341A true CN104419341A (en) | 2015-03-18 |
| CN104419341B CN104419341B (en) | 2019-07-19 |
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| CN201410437583.4A Active CN104419341B (en) | 2013-08-30 | 2014-08-29 | The manufacturing method of cutting adhesive tape and semiconductor chip |
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| JP (1) | JP6168553B2 (en) |
| KR (2) | KR102226881B1 (en) |
| CN (1) | CN104419341B (en) |
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| CN105733462A (en) * | 2014-12-25 | 2016-07-06 | 日立麦克赛尔株式会社 | Adhesive tape for dicing and method of manufacturing semiconductor chip |
| CN111433307A (en) * | 2017-12-20 | 2020-07-17 | 陶氏东丽株式会社 | Silicone adhesive sheet, laminate containing the same, and method for manufacturing semiconductor device |
| CN112602172A (en) * | 2018-09-03 | 2021-04-02 | 麦克赛尔控股株式会社 | Adhesive tape for dicing and method for manufacturing semiconductor chip |
| CN113429930A (en) * | 2021-07-13 | 2021-09-24 | 深圳市新泰盈电子材料有限公司 | Addition type bi-component organic silicon pouring sealant and preparation method thereof |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| KR20190013128A (en) * | 2017-07-31 | 2019-02-11 | 다우 실리콘즈 코포레이션 | Silicone composition for temporary bonding adhesive, electronic article comprising cured body of the same, and manufacturing method thereof |
| WO2021124725A1 (en) | 2019-12-19 | 2021-06-24 | マクセルホールディングス株式会社 | Adhesive tape for dicing, and method for producing semiconductor chip |
| WO2021124724A1 (en) | 2019-12-20 | 2021-06-24 | マクセルホールディングス株式会社 | Adhesive tape for dicing and method for producing semiconductor chip |
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Also Published As
| Publication number | Publication date |
|---|---|
| TWI631202B (en) | 2018-08-01 |
| TW201520295A (en) | 2015-06-01 |
| JP2015050216A (en) | 2015-03-16 |
| CN104419341B (en) | 2019-07-19 |
| KR20210031439A (en) | 2021-03-19 |
| KR102226881B1 (en) | 2021-03-12 |
| KR20150026844A (en) | 2015-03-11 |
| JP6168553B2 (en) | 2017-07-26 |
| KR102331226B1 (en) | 2021-12-01 |
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