TW200933723A - Dicing sheet, manufacturing process thereof and process for manufacturing electronic element - Google Patents

Dicing sheet, manufacturing process thereof and process for manufacturing electronic element

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Publication number
TW200933723A
TW200933723A TW097143324A TW97143324A TW200933723A TW 200933723 A TW200933723 A TW 200933723A TW 097143324 A TW097143324 A TW 097143324A TW 97143324 A TW97143324 A TW 97143324A TW 200933723 A TW200933723 A TW 200933723A
Authority
TW
Taiwan
Prior art keywords
adhesive layer
adhesive
ring frame
wafer
dicing sheet
Prior art date
Application number
TW097143324A
Other languages
Chinese (zh)
Inventor
Tomomichi Takatsu
Takeshi Saito
Original Assignee
Denki Kagaku Kogyo Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denki Kagaku Kogyo Kk filed Critical Denki Kagaku Kogyo Kk
Publication of TW200933723A publication Critical patent/TW200933723A/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/20—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself
    • C09J2301/204—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself the adhesive coating being discontinuous

Abstract

This invention relates to a dicing sheet, its manufacturing process and an electronic element manufacturing process. The said dicing sheet is characterized by comprising a substrate sheet, an adhesive layer laminated on the said substrate sheet, and a ring frame adhesive layer laminated on the said adhesive layer in the area for the ring frame to be mounted, while the adhesion of the ring frame adhesive layer is highter than that of the said adhesive layer. This invention enables an easy peeling between dicing sheets and die attach films during picking up, and improves the adhesion characteristics between dicing sheets and ring frames.

Description

200933723 九、發明說明： 【發明所屬之技術領域】 元件的製造方 鎵、砷等之半 成電路圖案， 藉黏著劑層等 匕方法（參考非 晶片於導線架 膜（die attach 型切割片係切 ，較之以往製 晶粒黏著膜一 疊封裝、系統 至3及非專利 狀熱硬化性黏 ，加熱使其半 著劑半硬化層 硬化層之晶片 本發明涉及切割片、其製造方法及電子 法。 【先前技術】 1C等電子元件的製造方法已知有以矽、 導體晶圓、絕緣物基板爲母材，於母材上形 以格子狀切斷（切割）製造晶片，拾取晶片， 固定於導線架等，以樹脂等封裝成電子元件； 專利文獻1等）。 已有使用兼具切割用之切割片/與固定 等之黏著劑的機能之多層切割片（晶粒黏著 film)—體型切割片）之提議。晶粒黏著膜一體 割片與晶粒黏著膜經一體化之多層切割片 程，黏著劑部分之厚度、滲出更易於控制。 體型切割片已多見利用於晶片尺寸封裝、堆 封裝等半導體封裝體之製造（參考專利文獻1 文獻1等）。 受採用者尙有，取代晶粒黏著膜，將糊 著劑全面塗布於矽晶圓之電路形成面與反面 硬化至呈固態，得黏著劑半硬化層，將該黏 貼合於切割片，切割成小片，拾取而得附半 的製程。 伴隨電子元件之高度積體化，晶片尺寸變大變薄，切 200933723 割後晶片之拾取作業常有困難。因此，用於這些用途之切 割片被期待爲對於切割後之晶片具微黏著性。然而，使切 割片微黏著化，則於環架之黏著性亦弱，切割之際切割片 與環架有時會剝離。200933723 IX. Description of the invention: [Technical field to which the invention pertains] A half-circuit pattern of gallium, arsenic, etc. in the fabrication of components, by means of an adhesive layer or the like (refer to a non-wafer on a lead frame film (die attach type cutting sheet system) The invention relates to a dicing sheet, a manufacturing method thereof and an electronic method, compared with a conventional die-bonding film stack, a system to 3 and a non-patented thermosetting adhesive, and a wafer which heats a semi-hardened layer of a semi-hardened layer. [Prior Art] A method for manufacturing an electronic component such as 1C is to use a crucible, a conductor wafer, or an insulator substrate as a base material, and to cut (cut) a wafer on a base material in a lattice shape, pick up the wafer, and fix it on the substrate. A lead frame or the like is encapsulated into an electronic component by a resin or the like; Patent Document 1, etc.) A multilayer cutting sheet (die bonding film) having a function of cutting a cutting piece/fixing adhesive or the like is used. The proposal of the film). The die-adhesive film is integrated into the multilayer cutting film in which the die and the die attach film are integrated, and the thickness and exudation of the adhesive portion are more easily controlled. The bulk type dicing sheet has been widely used for the manufacture of a semiconductor package such as a wafer size package or a bulk package (refer to Patent Document 1, Document 1, etc.). The adhesive is applied to the circuit forming surface and the reverse surface of the germanium wafer to be solidified to obtain a semi-hardened layer of the adhesive, which is bonded to the cutting piece and cut into a mask. Small pieces, picking up half of the process. With the high integration of electronic components, the size of the wafer becomes larger and thinner, and it is often difficult to cut the wafer after the cutting of the 200933723. Therefore, the cut sheets used for these purposes are expected to be slightly adhesive to the wafer after the cutting. However, if the cut piece is slightly adhered, the adhesion to the ring frame is weak, and the cut piece and the ring frame sometimes peel off at the time of cutting.

爲克服如此問題，專利文獻4及專利文獻5提議，支 持基材上有紫外線硬化型黏著劑層，該黏著劑層上有晶片 黏著用黏著劑層的切割•晶粒接合膜，僅於貼合晶圓的對 應部分照射紫外線，降低黏著力之方法。 專利文獻1 特開平02-248064號公報 專利文獻2 特開平08-053655號公報 專利文獻3 特開2004-186429號公報 專利文獻4 特開2004-134689號公報 專利文獻5 特開2005-268434號公報 非專利文獻1 小澤等，“古河電工時報”，第1 06號， P31’古河電氣工業（股），（2000年7月） 【發明内容】 發明所欲解決之課題 然而’僅於特定部分照射紫外線，降低該部分之黏著 力的習知方法’難以僅於所欲部分高精度照射紫外線，有 時難以製得切割時晶圓、環架之保持力與其後的晶片剝離 性恰當均衡之黏著劑層。因此，對於切割後之晶片保持微 黏著性，另一方面對於環架具有安定的黏著特性之切割片 依然受到期待。 本發明係鑑於上述實情而作，其目的在提供，拾取時 200933723 晶粒黏著膜及切割片之易剝離性保持不變，改善切割時之 環架黏著特性的切割片。 用以解決課題之手段 本發明人等就解決上述課題之方法作了精心探討結果 發現’於黏著劑層上設環架用黏著劑層，介著該環架用黏 著劑層貼合切割片與環架’即可不受制於切割片的微黏著 化之要求’改善切割片對於環架之黏著特性，而完成本發 明。 亦即本發明涉及製造電子元件之際，用以貼合於環 架’將晶圓固定’予以切割之切割片，其特徵爲具有基材 0 片、積層於該基材片之黏著劑層及積層在該黏著劑層的預 定貼合環架之區域的環架用黏著劑層，而環架用黏著劑層 的黏著力高於該黏著劑層之黏著力。 利用此切割片，因環架用黏著劑層係與黏著劑層個別 設置，可不受制於晶粒黏著膜對於切割片之黏著力，自由 調節環架對於切割片之黏著力。並且，使環架用黏著劑層 之黏著力高於黏著劑層之黏著力，可無損於切割片與晶粒 黏著膜間所要求的易剝離性，降低切割時切割片自環架剝 離之危險性。 該切割片係本發明之一樣態：由本發明之切割片的製 造方法製造之切割片，使用本發明之切割片的電子元件之 製造方法等，亦皆具有同樣的技術特徵，可得同樣之作用 效果。 發明效果In order to overcome such a problem, Patent Document 4 and Patent Document 5 propose that a UV-curable adhesive layer is provided on a support substrate, and a die-bonding film of an adhesive layer for wafer adhesion is provided on the adhesive layer, which is only suitable for bonding. The method in which the corresponding portion of the wafer is irradiated with ultraviolet rays to lower the adhesion. Japanese Laid-Open Patent Publication No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. Non-Patent Document 1 Ozawa et al., "Furukawa Electric Times", No. 1 06, P31 'Furukawa Electric Industry Co., Ltd., (July 2000) [Summary of the Invention] The problem to be solved by the invention However, 'only a specific part of the illumination Ultraviolet rays, a conventional method for lowering the adhesion of the portion, is difficult to irradiate ultraviolet rays with high precision only at a desired portion, and it is sometimes difficult to obtain an adhesive having a proper balance between the holding force of the wafer and the ring holder and the subsequent wafer peeling property at the time of cutting. Floor. Therefore, it is still desired to maintain a micro-adhesiveness to the wafer after the dicing, and on the other hand, a dicing sheet having a stable adhesive property to the ring frame. The present invention has been made in view of the above circumstances, and an object thereof is to provide a dicing sheet in which the easy adhesion of the die attach film and the dicing sheet at the time of picking up at the time of picking up 200933723, and the ring frame adhesion property at the time of cutting is improved. Means for Solving the Problems The present inventors have intensively studied the method for solving the above problems, and found that 'the adhesive layer for the ring frame is provided on the adhesive layer, and the dicing sheet is bonded to the adhesive layer for the ring frame and The ring frame 'is free from the requirement for micro-adhesion of the dicing sheet' to improve the adhesive properties of the dicing sheet to the ring frame, and the present invention has been completed. That is, the present invention relates to a dicing sheet for affixing a 'fixed wafer' to a ring frame for manufacturing an electronic component, which is characterized in that it has a substrate 0, an adhesive layer laminated on the substrate sheet, and An adhesive layer laminated on the ring of the adhesive layer in the region of the predetermined conforming ring frame, and the adhesive force of the adhesive layer of the ring is higher than the adhesive force of the adhesive layer. By using the dicing sheet, since the adhesive layer of the ring frame and the adhesive layer are separately provided, the adhesion of the die attach film to the dicing sheet can be prevented, and the adhesion of the ring frame to the dicing sheet can be freely adjusted. Moreover, the adhesive force of the adhesive layer of the ring frame is higher than the adhesive force of the adhesive layer, which can not damage the required peeling property between the dicing sheet and the die attach film, and reduces the risk of peeling off the cutting piece from the ring frame during cutting. Sex. The dicing sheet is in the same state as the present invention: the dicing sheet produced by the method for producing the dicing sheet of the present invention, the method for producing an electronic component using the dicing sheet of the present invention, and the like all have the same technical features, and the same effect can be obtained. effect. Effect of the invention

Ο 200933723 依本發明，可獨立調節切割片對於晶粒黏著膜之 力與切割片對於環架之黏著力。因而，適當調節環架 著劑層之黏著力，即可無損於切割片與晶粒黏著膜間 求之易剝離性，降低切割時切割片自環架剝離之危險 【實施方式】 以下利用圖式說明本發明之實施形態。而所有 中，同樣構成要素係附以同樣符號，其說明予以適當ΐ 第1圖係說明本實施形態之切割片的使用樣態之 圖。 本實施形態之切割片100如第1圖，具備基材片 積層於基材片102之黏著劑層103，及積層在黏著劑層 的預定貼合環架之區域的環架用黏著劑層104。 使用本實施形態之切割片1 00切割晶圓之際，如 圖，將切割片100與晶粒黏著膜106於切割片100的 用黏著劑層1 04之內側區域貼合，其次將切割片1 00 架105介著切割片100的環架用黏著劑層104貼合， 晶圓107貼合於該晶粒黏著膜106之表面。 使用如此之具有基材片102、積層於基材片102 著劑層103及積層在黏著劑層103的預定貼合環架之 的環架用黏著劑層104之切割片100，即可不受制 黏著膜106對於切割片100之黏著力，藉由調節環架 著劑層104之黏著力，自由調節環架105對於切割片 之黏著力。因而例如使環架用黏著劑層104之黏著力 黏著劑層1 03之黏著力，即可無損於切割片1 〇〇與晶 黏著 用黏 所要 性》 圖式 ί略。 示意 102、 } 103 第1 環架 與環 再將 之黏 區域 晶粒 用黏 * 100 高於 粒黏 200933723 著膜106間之易剝離性，降低切割時切割片100自環架i〇5 剝離之危險性。 又，因可介著環架用黏著劑層104貼合切割片100或 黏著劑層103及環架105，可使用之切割片100或黏著劑 層103及環架105之組合幅度得以擴大。 <環架用黏著劑層> 用以形成環架用黏著劑層1 04之黏著劑無特殊限制， ^ 有例如丙烯酸系黏著劑、橡膠系黏著劑、胺基甲酸酯系黏 著劑、聚矽氧系黏著劑、聚酯系黏著劑等習知黏著劑。這 些黏著劑可單獨或組合2種以上使用。 適用之黏著劑有例如丙烯酸系黏著劑。丙烯酸系黏著 劑無特殊限制，可由（甲基）丙烯酸酯單體與含有官能基的 單體之共聚合製得。又，丙烯酸系黏著劑亦可係（甲基）丙 烯酸酯單體以含有官能基之單體以外的衍生自乙烯系化合 物之單體共聚合而得者。 ❹ (甲基）丙烯酸酯單體無特殊限制，有例如（甲基）丙烯酸 甲酯、（甲基）丙烯酸乙酯、（甲基）丙烯酸丙酯、（甲基）丙烯 酸丁酯、（甲基）丙烯酸戊酯、（甲基）丙烯酸己酯、（甲基）丙 嫌酸庚酯、（甲基）丙烯酸辛酯、（甲基）丙烯酸壬酯、（甲基） 丙嫌酸癸酯、（甲基）丙烯酸月桂酯、（甲基）丙烯酸十三酯、 (甲基）丙烯酸肉豆蔻酯、（甲基）丙烯酸鯨蠟酯、（甲基）丙烯 酸硬脂酯、（甲基）丙烯酸環己酯及（甲基）丙烯酸苯甲酯等 (甲基）丙烯酸烷基酯。（甲基）丙烯酸烷基酯之烷基可具直鏈 構造’亦可具有分枝構造、雙鍵、醚結合等。 200933723 烷基具分枝構造之（甲基）丙烯酸烷基酯單體有例如（甲 基）丙烯酸異丙酯、（甲基）丙烯酸異丁酯、（甲基）丙烯酸第 三丁酯、及（甲基）丙烯酸2-乙己酯。 含官能基之單體有例如含羧基之單體、含羥基之單 體、含環氧基之單體、含醯胺基之單體、含胺基之單體、 含羥甲基之單體、含磺酸基之單體、含胺磺酸基之單體、 含（亞）磷酸酯基之單體等。 含羧基之單體若係具有羧基之乙烯系化合物即無特殊 限制，有例如（甲基）丙烯酸、巴豆酸、順丁烯二酸、伊康 酸、延胡索酸、丙烯醯胺N-二醇酸及桂皮酸等不飽和羧酸。 (甲基）丙烯酸尤佳。 ’ 含羥基之單體若係具有羥基之乙烯系化合物即無特殊 限制’有例如（甲基）丙烯酸2 -羥乙酯、（甲基）丙烯酸2 -羥 丙酯、（甲基）丙烯酸2-羥丁酯及聚乙烯醇等。（甲基）丙烯酸 2-羥乙酯尤佳。 具環氧基之含官能基的單體有例如烯丙基環氧丙醚及 (甲基）丙烯酸環氧丙酯等。 具醯胺基之含官能基的單體有例如（甲基）丙烯醯胺 具胺基之含官能基的單體有例如（甲基）丙烯酸N，N_: 甲基胺乙酯等。 具羥甲基之含官能基的單體有例如N —羥甲基丙烯醯胺 等。 丙烯酸系黏著劑中，該含官能基之單體可單獨或組合 -10- 200933723 2種以上使用。 丙烯酸系黏著劑亦可共聚合有上述以外之乙烯系單 體，有例如具有乙烯、苯乙烯、乙烯甲苯、乙酸烯丙酯、 丙酸乙烯酯、丁酸乙烯酯、三級殘酸乙烯酯' 乙烯基乙醚、 乙烯基丙醚、（甲基）丙烯腈、或乙嫌基異丁醚等乙烯系化 合物等所衍生之單體者。 適用的黏著劑有例如橡膠系黏著劑。橡膠系黏著劑有 _ 以天然橡膠、苯乙烯-異戊二烯-苯乙嫌嵌段共聚物（SIS嵌 段共聚物）、苯乙烯-丁二烯-苯乙烯嵌段共聚物（SBS嵌段共 聚物）、苯乙烯-乙烯.苯乙烯-苯乙烯-嵌段共聚物（SEBS嵌 段共聚物）、苯乙烯-丁二烯橡膠、聚丁二烯、聚異平、聚 異丁烯、丁基橡膠、氯丁二烯橡膠、聚矽氧橡膠、丙烯腈· 丁二烯橡膠、乙烯-丙烯三共聚物等橡膠成分爲基底聚合物 之橡膠系黏著劑等。 適用的黏著劑有例如胺基甲酸酯系黏著劑。胺基甲酸 p 酯系黏著劑係使異氰酸酯成分與多元醇成分反應而得者， 異氰酸酯成分有例如甲苯二異氰酸酯、亞甲二異氰酸酯' 六亞甲二異氰酸酯、異佛酮二異氰酸酯等；多元醇成分有 例如，聚醚多元醇、聚酯多元醇等。又，必要時亦可使用 胺化合物、多元醇等作爲鏈延長劑，並以異氰酸酯化合物、 吖環丙烷化合物、環氧化合物等用作硬化劑。 適用的黏著劑有例如聚矽氧系黏著劑。聚矽氧系黏著 劑分爲過氧化物硬化型與加成型，必要時可添加聚矽氧樹 脂。 -11- 200933723 必要時可於黏著劑添加各種添加劑，例如黏著賦予 劑、硬化劑、塑化劑、光聚合性化合物、光引發劑、發泡 劑、聚合抑制劑、老化防止劑、塡料等。 環架用黏著劑層104之黏著力可依習知方法適當調 節。 調節環架用黏著劑層104之黏著力的方法無特殊限 制，有例如黏著劑係由2種以上之黏著劑構成時，調節其 配合比率；黏著劑係2種以上單體構成之共聚物時，調節 其單體共聚合比；調節黏著劑中所含之硬化劑、黏著賦予 劑等添加劑之配合量；添加光聚合性化合物、塑化劑等低 分子量物質等。 j 尤佳之黏著力調節方法可係調節塑化劑之配合量。硬 化劑可依黏著劑之主劑適當選擇，例如，以丙烯酸系共聚 物用作黏著劑之基底樹脂時，可適當使用市售之異氰酸酯 系硬化劑、環氧系硬化劑、吖環丙烷系硬化劑、三聚氰胺 系硬化劑等。一般，降低硬化劑的配合量可得更強之黏著 力。 強化黏著力之尤佳方法係添加黏著賦予樹脂。黏著賦 予樹脂無特殊限制，有例如松脂樹脂、松脂酯樹脂、ig稀 樹脂、萜烯酚樹脂、酚樹脂、二甲苯樹脂、苯并呋喃樹脂、 苯并呋喃茚樹脂、苯乙烯樹脂、脂族石油樹脂、芳族石油 樹脂、脂族芳族共聚合石油樹脂、脂環烴樹脂及這些之改 質品、衍生物、加氫物等。 爲發揮本發明之效果至最大極限，環架用黏著劑層1〇4 -12- 200933723 之黏著力係以不同於後敘的黏著劑層103之黏著力爲佳。 因此，構成環架用黏著劑層104之黏著劑的主劑，與構成 黏著劑層103之黏著劑的主劑當然可係不同類型，兩者之 主劑即使相同，仍可依上述習知方法適當調節黏著力。 例如，使環架用黏著劑層1 04對於環架之黏著力以剝 離角度180°，拉伸速度3 00 mm/分鐘之條件來測定時達 0.6N/2〇mra以上，即可降低切割時環架1〇5自切割片100 剝離之危險性。 環架用黏著劑層104之厚度無特殊限制，乾燥後之厚 度係以例如〇. 5 // m以上爲佳，1 ν m以上尤佳。又，環架 0 用黏著劑層104之厚度係以10#m以下爲佳，5/zm以下尤 佳。環架用黏著劑層104之厚度若係〇.5；am以上，即可更 安定確保與環架105之黏著力而較佳。又，環架用黏著劑 層104之厚度若係10/zm以上，即可更安定保存及輸送切 割片100而較佳。 <黏著劑層> 構成黏著劑層103之黏著劑可係一般使用之黏著劑， 有例如橡膠系黏著劑、丙烯酸系黏著劑、聚矽氧系黏著劑、 胺基甲酸酯系黏著劑等。又，爲使這些黏著劑具要求性能， 亦可於黏著劑添加例如硬化劑、聚合引發劑、軟化劑、老 化防止劑、塡料、紫外線吸收劑及光安定劑等各種添加劑。 黏著劑層103之黏著力如同環架用黏著劑層ι〇4，可 藉習知方法適當調節。 黏著劑層1 03之厚度係以1以m以上爲佳，2 a m以上 -13- 200933723 尤佳。又，黏著劑層iO3之厚度係以100# m以下爲佳’ 40 从m以下尤佳。黏著劑層1 0 3之厚度若係1从m以上’切割 時即可更安定確保晶粒黏著膜1〇6與切割片1〇〇間之黏著 力而較佳。又’黏著劑層之厚度若係以下’可 更減低晶片的拾取不良、與糊殘留於經剝離之晶粒黏著膜 1 06的發生。 <基材片> 基材片102之材質無特殊限制，有例如聚氯乙烯、聚 對酞酸乙二酯、乙烯-乙酸乙烯酯共聚物、乙烯-丙烯酸-丙 烯酸酯膜、乙烯-丙烯酸乙酯共聚物、聚乙烯、聚丙烯、乙 烯-丙烯酸共聚物，及，乙烯-(甲基）丙烯酸酯共聚物、乙烯 -(甲基）丙烯酸-(甲基）丙烯酸酯共聚物等以金屬離子交聯 之多離子聚合物樹脂。基材片102可用這些樹脂的混合 物、共聚物或多層膜等。 基材片102之材質以多離子聚合物樹脂爲尤佳。多離 子聚合物樹脂之中，因可抑制鬚狀切削屑之產生，以使用 具有乙烯單元、（甲基）丙烯酸單元及（甲基）丙烯酸烷基酯單 元之共聚物以Na+、K+、Zn2 +等金屬離子交聯之多離子聚 合物樹脂爲合適。多離子聚合物樹脂之中，因可顯著抑制 鬚狀切削屑之產生，以使用MFR(熔融流動率）値1以上3 以下之樹脂爲佳。 基材片1 02之成形方法無特殊限制，有例如壓延成形 法、T模擠壓法、吹塑法、及澆鑄法等。 爲於剝離晶粒黏著膜106時抗靜電，亦可於基材片102 -14- 200933723 之黏著劑層103接觸面及/或非接觸施以抗靜電處理。抗靜 電劑可予混練入樹脂中。抗靜電處理可使用四級銨鹽單體 等抗靜電劑。又，爲提升切割後之擴展性，可於基材片102 之黏著劑層1 的非接觸面施以滑劑，或以滑劑混練於基 材片102。 又，可使與貼合黏著劑層103之面爲相反面之面形成 平均表面粗度（Ra)〇.3/zm以上、1.5#m以下之壓紋面。設 置如此的壓紋面即可在切割後之擴展步驟中易於擴展基材 片 102。 基材片102之厚度無特殊限制，可適當決定，一般係 30"m以上，60ym以上更佳，並係300^111以下，200;/ m以下更佳。基材片102之厚度若係30/zm以上，則可更 充分確保作爲基材片強度母體之機能而較佳。基材片102 之厚度若係3 ΟΟ/zm以下則於製造成本、輸送效率等更佳。 <切割片之製造方法> 本實施形態中切割片100之製造方法無特殊限制，可 係如下。以下參照第2圖作說明。 第2圖（左）係本實施形態之切割片1〇〇自黏著劑層1〇3 及環架用黏著劑層104形成面觀察之槪略前視圖。而第2 圖（右）呈示未形成環架用黏著劑層104之狀態。 第2圖中，於切割片1〇〇之黏著劑層103及環架用 黏著劑層104形成面，更貼合有剝離襯墊108。剝離襯墊 108在實際供用之前具有作爲保護黏著劑層1〇3及環架用 黏著劑層104的保護材之機能，並在本實施形態的製造方 -15-Ο 200933723 According to the invention, the force of the cutting piece for the die attach film and the adhesion of the cutting piece to the ring frame can be independently adjusted. Therefore, by properly adjusting the adhesion of the ring-stacking layer, the peeling property between the dicing sheet and the die-adhesive film can be impaired, and the risk of peeling off the dicing piece from the ring frame during cutting is reduced. [Embodiment] An embodiment of the present invention will be described. In the same manner, the same components are denoted by the same reference numerals, and the description thereof will be appropriately described. Fig. 1 is a view showing the use form of the dicing sheet of the present embodiment. As shown in Fig. 1, the dicing sheet 100 of the present embodiment includes an adhesive layer 103 having a base sheet laminated on the base sheet 102, and a ring-shaped adhesive layer 104 laminated on a region of the adhesive layer which is intended to be bonded to the ring frame. . When the wafer is cut by the dicing sheet 100 of the present embodiment, as shown in the figure, the dicing sheet 100 and the die attach film 106 are bonded to the inner region of the adhesive layer 104 of the dicing sheet 100, and the dicing sheet 1 is next. The frame 105 is bonded to the ring of the dicing sheet 100 by the adhesive layer 104, and the wafer 107 is bonded to the surface of the die attach film 106. By using the dicing sheet 100 having the substrate sheet 102, the primer layer 103 laminated on the base sheet 102, and the adhesive layer 104 for the ring for laminating the predetermined bonding ring of the adhesive layer 103, the dicing sheet 100 can be prevented from being adhered. The adhesion of the film 106 to the dicing sheet 100 freely adjusts the adhesion of the ring frame 105 to the dicing sheet by adjusting the adhesion of the ring binder layer 104. Therefore, for example, the adhesive force of the adhesive layer 104 of the ring holder can be adhered to the adhesion of the dicing sheet 1 晶 and the adhesion of the crystal. Illustrated 102, } 103 The first ring frame and the ring are further detached from the ring frame i〇5 when the viscous region of the viscous region is adhered to the film 106 by the adhesive layer 100. Dangerous. Further, since the dicing sheet 100 or the adhesive layer 103 and the ring frame 105 can be bonded via the adhesive layer 104 for a ring, the combination of the dicing sheet 100 or the adhesive layer 103 and the ring frame 105 which can be used can be expanded. <Adhesive layer for ring frame> The adhesive for forming the adhesive layer for ring frame 104 is not particularly limited, and there are, for example, an acrylic adhesive, a rubber adhesive, a urethane adhesive, A conventional adhesive such as a polyoxygen adhesive or a polyester adhesive. These adhesives can be used alone or in combination of two or more. Suitable adhesives are, for example, acrylic adhesives. The acrylic adhesive is not particularly limited and can be obtained by copolymerization of a (meth) acrylate monomer and a functional group-containing monomer. Further, the acrylic pressure-sensitive adhesive may be obtained by copolymerizing a monomer derived from a vinyl compound other than a monomer having a functional group (meth) acrylate monomer. The hydrazine (meth) acrylate monomer is not particularly limited, and examples thereof include methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, butyl (meth) acrylate, and (methyl). Ethyl acrylate, hexyl (meth) acrylate, heptyl (meth) propyl hexanoate, octyl (meth) acrylate, decyl (meth) acrylate, decyl methacrylate Lauryl methyl methacrylate, tridecyl (meth) acrylate, myristyl (meth) acrylate, cetyl (meth) acrylate, stearyl (meth) acrylate, cyclomethacrylate An alkyl (meth)acrylate such as an ester or benzyl (meth)acrylate. The alkyl group of the alkyl (meth)acrylate may have a linear structure and may have a branched structure, a double bond, an ether bond or the like. 200933723 The alkyl (meth) acrylate monomer having a branched structure is, for example, isopropyl (meth)acrylate, isobutyl (meth)acrylate, tert-butyl (meth)acrylate, and 2-ethylhexyl methacrylate. The functional group-containing monomer is, for example, a carboxyl group-containing monomer, a hydroxyl group-containing monomer, an epoxy group-containing monomer, a mercapto group-containing monomer, an amine group-containing monomer, a methylol group-containing monomer. a sulfonic acid group-containing monomer, an amine sulfonic acid group-containing monomer, a (phosphite) group-containing monomer, and the like. The carboxyl group-containing monomer is not particularly limited as long as it is a vinyl compound having a carboxyl group, and examples thereof include (meth)acrylic acid, crotonic acid, maleic acid, itaconic acid, fumaric acid, acrylamide N-glycolic acid, and An unsaturated carboxylic acid such as cinnamic acid. (Meth)acrylic acid is especially preferred. The hydroxyl group-containing monomer is a vinyl compound having a hydroxyl group, that is, without particular limitation, and is, for example, 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, or 2-(meth)acrylate. Hydroxybutyl ester and polyvinyl alcohol. (Meth)acrylic acid 2-hydroxyethyl ester is particularly preferred. The functional group-containing monomer having an epoxy group is, for example, allyl epoxidized ether, glycidyl (meth) acrylate or the like. The functional group-containing monomer having a mercapto group is, for example, a (meth)acrylamide. The functional group-containing monomer having an amine group is, for example, N,N-:methylaminoethyl (meth)acrylate or the like. The functional group-containing monomer having a methylol group is, for example, N-methylol acrylamide or the like. In the acrylic adhesive, the functional group-containing monomer may be used singly or in combination of two or more kinds. The acrylic adhesive may be copolymerized with a vinyl monomer other than the above, and may have, for example, ethylene, styrene, vinyl toluene, allyl acetate, vinyl propionate, vinyl butyrate, and tertiary residual vinyl ester. A monomer derived from a vinyl compound such as vinyl ethyl ether, vinyl propyl ether, (meth) acrylonitrile or ethyl isopropyl isobutyl ether. Suitable adhesives are, for example, rubber-based adhesives. Rubber-based adhesives are _ natural rubber, styrene-isoprene-phenethyl block copolymer (SIS block copolymer), styrene-butadiene-styrene block copolymer (SBS block) Copolymer), styrene-ethylene. styrene-styrene-block copolymer (SEBS block copolymer), styrene-butadiene rubber, polybutadiene, polyisoprene, polyisobutylene, butyl rubber A rubber component such as a chloroprene rubber, a polyoxyxene rubber, an acrylonitrile-butadiene rubber or an ethylene-propylene triene copolymer is a rubber-based adhesive of a base polymer. Suitable adhesives are, for example, urethane-based adhesives. The urethane p-ester adhesive is obtained by reacting an isocyanate component with a polyol component, and the isocyanate component is, for example, toluene diisocyanate, methylene diisocyanate hexamethylene diisocyanate or isophorone diisocyanate; and a polyol component; For example, polyether polyols, polyester polyols, and the like. Further, an amine compound, a polyhydric alcohol or the like may be used as a chain extender if necessary, and an isocyanate compound, an anthranilium compound, an epoxy compound or the like may be used as the curing agent. Suitable adhesives are, for example, polyoxygenated adhesives. The polyoxygenated adhesive is classified into a peroxide hardening type and addition molding, and if necessary, a polyoxygenated resin can be added. -11- 200933723 Add various additives such as adhesion-imparting agents, hardeners, plasticizers, photopolymerizable compounds, photoinitiators, foaming agents, polymerization inhibitors, aging inhibitors, tanning materials, etc., if necessary. . The adhesive force of the adhesive layer 104 for the ring can be appropriately adjusted by a conventional method. The method of adjusting the adhesive force of the adhesive layer 104 for a ring frame is not particularly limited. For example, when the adhesive is composed of two or more kinds of adhesives, the mixing ratio thereof is adjusted; when the adhesive is a copolymer of two or more kinds of monomers The monomer copolymerization ratio is adjusted, the amount of the additive such as the hardener and the adhesion-imparting agent contained in the adhesive is adjusted, and a low molecular weight substance such as a photopolymerizable compound or a plasticizer is added. j Youjia's adhesion adjustment method can adjust the amount of plasticizer. The curing agent can be appropriately selected depending on the main component of the adhesive. For example, when an acrylic copolymer is used as the base resin of the adhesive, a commercially available isocyanate curing agent, epoxy curing agent, or anthracycline-based curing can be suitably used. Agent, melamine-based hardener, and the like. In general, a lower adhesion of the hardener can be obtained to obtain a stronger adhesive force. A particularly preferred method of strengthening adhesion is to add an adhesion-imparting resin. The adhesive imparting resin is not particularly limited, and examples thereof include rosin resin, rosin ester resin, ig thin resin, terpene phenol resin, phenol resin, xylene resin, benzofuran resin, benzofuran resin, styrene resin, aliphatic petroleum. Resins, aromatic petroleum resins, aliphatic aromatic copolymerized petroleum resins, alicyclic hydrocarbon resins, and modified products, derivatives, hydrogenated products thereof and the like. In order to exert the effect of the present invention to the maximum limit, the adhesive force of the adhesive layer for the ring frame 1 〇 4 -12 to 200933723 is preferably different from the adhesive force of the adhesive layer 103 which will be described later. Therefore, the main agent of the adhesive constituting the adhesive layer 104 for the ring frame can be of a different type from the main agent of the adhesive constituting the adhesive layer 103, and even if the main components of the two are the same, the conventional method can be used. Adjust the adhesion properly. For example, when the adhesion force of the adhesive layer for the ring frame 104 to the ring frame is measured at a peeling angle of 180° and a tensile speed of 300 mm/min, it is 0.6 N/2 〇mra or more, thereby reducing the cutting time. The risk of the ring frame 1〇5 being peeled off from the cutting piece 100. The thickness of the adhesive layer 104 for a ring frame is not particularly limited, and the thickness after drying is preferably, for example, //. 5 // m or more, and more preferably 1 ν m or more. Further, the thickness of the adhesive layer 104 for the ring frame 0 is preferably 10 or less, and preferably 5 or less. If the thickness of the adhesive layer 104 for the ring frame is 〇.5 or more, it is better to ensure the adhesion to the ring frame 105. Further, if the thickness of the adhesive layer 104 for the ring frame is 10/zm or more, it is preferable to store and transport the cut sheet 100 more stably. <Adhesive Layer> The adhesive constituting the adhesive layer 103 may be a commonly used adhesive, such as a rubber-based adhesive, an acrylic adhesive, a polyoxygen-based adhesive, or a urethane-based adhesive. Wait. Further, in order to impart performance to these adhesives, various additives such as a curing agent, a polymerization initiator, a softener, an aging inhibitor, a sputum, an ultraviolet absorber, and a light stabilizer may be added to the adhesive. The adhesive force of the adhesive layer 103 is the same as that of the adhesive layer ι〇4 for the ring frame, and can be appropriately adjusted by a conventional method. The thickness of the adhesive layer 103 is preferably 1 or more, and more preferably 2 m or more -13 to 200933723. Further, the thickness of the adhesive layer iO3 is preferably 100# m or less, and particularly preferably 40 or less. It is preferable that the thickness of the adhesive layer 110 is more stable if it is cut from m or more, and it is preferable to ensure the adhesion between the die attach film 1〇6 and the cut piece 1〇〇. Further, if the thickness of the adhesive layer is below, the pickup failure of the wafer and the occurrence of the paste remaining on the peeled die attach film 106 can be further reduced. <Substrate Sheet> The material of the substrate sheet 102 is not particularly limited, and examples thereof include polyvinyl chloride, polyethylene terephthalate, ethylene-vinyl acetate copolymer, ethylene-acrylic acid-acrylate film, and ethylene-acrylic acid. Ethyl ester copolymer, polyethylene, polypropylene, ethylene-acrylic acid copolymer, and ethylene-(meth)acrylate copolymer, ethylene-(meth)acrylic acid-(meth)acrylate copolymer, etc. Crosslinked polyionic polymer resin. As the base material sheet 102, a mixture of these resins, a copolymer or a multilayer film or the like can be used. The material of the substrate sheet 102 is preferably a polyionic polymer resin. Among the polyionic polymer resins, a copolymer having an ethylene unit, a (meth)acrylic acid unit, and an alkyl (meth)acrylic acid unit is used for Na+, K+, and Zn2+ because the generation of whiskers can be suppressed. A multiionic polymer resin such as a metal ion crosslinked is suitable. Among the polyionic polymer resins, it is preferable to use a resin having an MFR (melt flow rate) of 値1 or more and 3 or less because the generation of whiskers can be remarkably suppressed. The molding method of the base material sheet 102 is not particularly limited, and examples thereof include a calender molding method, a T-die extrusion method, a blow molding method, and a casting method. In order to resist antistatic when the die attach film 106 is peeled off, an antistatic treatment may be applied to the contact surface of the adhesive layer 103 of the substrate sheet 102-14-200933723 and/or non-contact. The antistatic agent can be compounded into the resin. As the antistatic treatment, an antistatic agent such as a quaternary ammonium salt monomer can be used. Further, in order to improve the expandability after cutting, a non-contact surface of the adhesive layer 1 of the base material sheet 102 may be applied with a lubricant or a lubricant may be kneaded to the base material sheet 102. Further, an embossed surface having an average surface roughness (Ra) 〇.3/zm or more and 1.5#m or less can be formed on the surface opposite to the surface on which the pressure-sensitive adhesive layer 103 is bonded. By providing such an embossed surface, the substrate sheet 102 can be easily expanded in the expanding step after the cutting. The thickness of the base material sheet 102 is not particularly limited and may be appropriately determined, and is generally 30 " m or more, more preferably 60 μm or more, and is preferably 300^111 or less, and more preferably 200; / m or less. When the thickness of the base material sheet 102 is 30/zm or more, the function as the base material strength mother body can be more sufficiently ensured. When the thickness of the base material sheet 102 is 3 ΟΟ/zm or less, the manufacturing cost, the conveying efficiency, and the like are more preferable. <Manufacturing Method of Cleaved Sheet> The method for producing the dicing sheet 100 in the present embodiment is not particularly limited, and may be as follows. This will be described below with reference to Fig. 2. Fig. 2 (left) is a schematic front view showing the dicing sheet 1 of the present embodiment as viewed from the surface of the adhesive layer 1〇3 and the adhesive layer 104 for the ring frame. On the other hand, the second figure (right) shows the state in which the adhesive layer 104 for a ring frame is not formed. In Fig. 2, the adhesive layer 103 of the dicing sheet 1 and the adhesive layer 104 for the ring are formed into a surface, and the release liner 108 is further bonded. The release liner 108 has a function as a protective material for protecting the adhesive layer 1〇3 and the adhesive layer 104 for the ring frame before being actually used, and is manufactured in the embodiment -15-

200933723 法中，於形成黏著劑層103及環架用黏著劑層i〇4之 有作爲支持基材的機能。 本實施形態之切割片1 0 0的製造方法包括以下步 (1)於剝離襯墊108上塗布構成環架用黏著劑層 之黏著劑使其可爲對應於環架105之形狀，乾燥或以 線照射使其硬化，形成環架用黏著劑層104。 (2) 更於剝離襯墊1〇8之環架用黏著劑層1〇4形 塗布構成黏著劑層1 0 3之黏著劑，乾燥或以放射線厢 其硬化，形成黏著劑層1 0 3。 (3) 貼合基材片102於黏著劑層103» 剝離襯墊108可係聚對酞酸乙二酯（PET)系、靠 系、聚丙烯系等之習知合成樹脂膜。爲提高剝離性， 時可施以聚矽氧處理、長鏈烷基處理、氟處理等。 環架用黏著劑層1 04及黏著劑層1 03之形成方g 殊限制，有例如於剝離襯墊上塗布黏著劑，必要時使 或硬化之方法。塗布黏著劑之際，可使用慣用之塗布 例如凹輥塗布機、逆輥塗布機、觸接輥塗布機、浸沿 布機、棒塗機、刀塗機、噴塗機等。亦可藉凸版印® 版印刷、平版印刷、活版印刷、套版印刷、或網版3 印刷黏著劑。 於此實施形態係形成環架用黏著劑層1 04與黏毫 103之積層體後，與基材片102貼合，而亦可先形场 入貼合基材片102與黏著劑層103之切割片1〇〇，並 切割片1 00之黏著劑層1 03側以對應於環架之形狀， 際具 驟。 104 放射 成面 射使 乙烯 必要 無特 乾燥 纖 機， 輥塗 、凹 刷等 劑層 或購 於該 塗布 -16- 200933723 構成環架用黏著劑層104之黏著劑，必要時使乾燥或硬化 形成環架用黏著劑層104。 <電子元件之製造方法> 使用本實施形態之切割片100的電子元件之製造方法 無特殊限制，可係如下。以下參照第1圖作說明。 (1) 貼合晶粒黏著膜106於切割片100之環架用黏著 劑層104的內側區域。 (2) 貼合環架105於切割片100之環架用黏著劑層 104 ° (3) 貼合晶圓107於晶粒黏著膜106之表面。 (4) 以貼合在切割片1〇〇之狀態進行晶圓1〇7之切割。 (5) 切割後剝離晶粒黏著膜106與切割片1〇〇,—倂 拾取晶圓107與附著在晶圓107背面之晶粒黏著膜1〇6。 其次，搭載附著有晶粒黏著膜106之晶圓1〇7於導線 架或電路基板（沒有圖示）上，加熱晶粒黏著膜106，將晶圓 107與導線架或電路基板加熱黏著。最後，以樹脂（沒有圖 示）模塑封裝搭載在導線架或電路基板之晶粒。 環架105其材質及形狀等無特殊限制，可使用適當之 市售品。又’晶粒黏著膜106係將黏著劑成形爲膜狀之薄 片，可使用適當之市售品。 該實施形態中係以晶圓1 07與切割片i 00之間介在有 晶粒黏著膜106之狀態作說明’而亦可取代晶粒黏著膜ι〇6 改用糊狀黏著劑。 使用糊狀黏著劑時，代表的係在晶圓107之背面，亦 -17- 200933723 面塗 半硬 粒黏 晶圓 ，使 第1 行切 架或 酸乙 物、 酚、 種的 Γ 100 102、 103 之黏 1 04 切割 即用以與導線架或電路基板黏著之非電路形成面’全 布糊狀黏著劑，將之加熱半硬化成片狀，形成黏著劑 化層。形成於此之黏著劑半硬化層具有如同上述的晶 著膜106之機能。因此，將形成有黏著劑半硬化層之 107，與黏著劑層103及基材片102構成之切割片1〇〇 黏著劑半硬化層與黏著劑層103接觸而貼合，即成如 圖之構造。然後，可如同使用晶粒黏著膜106者，進 φ 割，拾取附著有黏著劑半硬化層之晶圓，裝載於導線 電路基板，加熱黏著。 糊狀黏著劑者無特殊限制，有例如丙烯酸酯、乙 烯酯、乙烯•乙酸乙烯酯共聚物、乙烯•丙烯酸酯共聚 聚醯胺、聚乙烯、聚楓、環氧、聚醯胺酸、聚矽氧、 橡膠聚合物、氟橡膠聚合物及氟樹脂等之一種或複數 混合物。 <作用效果> Φ 以下參照第1圖及第2圖說明本實施形態之切割片 的作用效果。 本實施形態之切割片100如第1圖，具有基材片 積層於基材片102之黏著劑層103及積層在黏著劑層 的預定貼合環架105之區域的環架用黏著劑層1〇4。 以該切割片100，由於用以貼合晶粒黏著膜106 著劑層103’與用以貼合環架105之環架用黏著劑層 係各予獨立設置’故晶粒黏著膜106及環架1〇5對於 片1〇〇之黏著力可各予獨立調節。 -18- 200933723 因而’使環架用黏著劑層104之黏著力高 103之黏著力，即可無損於切割片1〇〇與晶粒 間之易剝離性’在切割時降低切割片丨〇 〇自環; 之危險性。 又因係介著環架用黏著劑層104貼合切割 著劑層103及環架105,可用之切割片1〇〇或黏 及環架1 05之組合的幅度得以擴大。 尤佳者係環架用黏著劑層104之黏著力亦 層103之黏著力，且環架用黏著劑層104對於 黏著力以剝離角度180。，拉伸速度3 00mm/分鐘 定時達〇.6N/20mm以上。 如此，即可降低切割時環架1 〇 5自切割片 危險性。 而較佳者該切割片100之製造方法包括： 108上以對應於環架105之形狀塗布構成環架 1 04之黏著劑，藉乾燥或放射線照射使其硬化 用黏著劑層104之步驟；更於剝離襯墊108之 劑層104形成面，塗布構成黏著劑層1〇3之黏 燥或放射線照射使其硬化，形成黏著劑層103 及，貼合基材片102於黏著劑層103之步驟。 此時，因先形成環架用黏著劑層104與黏 之積層體於剝離襯墊108上，利用市售之基材 於製造本發明之切割片1〇〇。又，環架用黏著i 於環架105之貼合面，及黏著劑層103對於晶粒 於黏著劑層 黏著膜106 架1 0 5剝離 片1 00或黏 著劑層1 〇 3 高於黏著劑 環架105之 之條件來測 1 〇 〇剝離之 於剝離襯墊 用黏著劑層 ，形成環架 環架用黏著 著劑，藉乾 之步驟；以 著劑層1 〇 3 片102即易 剞層1 0 4對 :黏著膜106 -19- 200933723 之貼合面，從製造當初起即受剝離襯墊108保護，可防黏 著力下降。 又，該切割片100並適用於包括：貼合晶粒黏著膜106 於環架用黏著劑層104內側區域之步驟；貼合環架105於 切割片1〇〇之環架用黏著劑層104之步驟；貼合晶圓107 於晶粒黏著膜106的表面之步驟；切割貼合在切割片1〇〇 之狀態下的晶圓107之步驟；以及切割後剝離晶粒黏著膜 106與切割片100,連同附著在晶圓107背面之晶粒黏著膜 106拾取晶圓107的步驟之電子元件的製造方法。 藉此方法，因使環架用黏著劑層104之黏著力高於黏 著劑層103之黏著力，即可無損於切割片100與晶短黏著 膜106間之易剝離性，在切割時降低切割片100自環架105 剝離之危險性。因而，可對於種種大小的晶片保持良好之 拾取特性而無切割不良。 又，該電子元件之製造方法中，可取代晶粒黏著膜106 g 改用糊狀黏著劑。此時，與使用晶粒黏著膜者同，因能與 環架用黏著劑層104之黏著力獨立調節糊狀黏著劑之黏著 力，可無損於切割片1 〇〇與糊狀黏著劑間之易剝離性，降 低切割時切割片100自環架105剝離之危險性。 以上已參照圖式說明本發明之實施形態，這些僅用以 例示本發明，尙可採用上述以外之種種構造。 例如，該實施形態中，環架用黏著劑層1 0 4係以塗布 糊狀黏著劑，將之乾燥或硬化而形成者作說明，但亦可以 具有對應於環架之環狀形狀的雙面膠帶用作環架用黏著劑 -20- 200933723 層1 〇4 °不論環架用黏著劑層i 〇4係採用何種形態者，皆 司同該實施形態’與黏著劑層103獨立調節環架用黏著 劑層104之黏著力，故可得同樣之作用效果。 實施例 以下舉實施例進一步說明本發明，但本發明不限於這 些 0 <材料之調製> Q 實施例之切割片的基材片、黏著劑層、環架用黏著劑 層等各種實驗材料係依下述配方製造或準備。 1 -切割片 準備以下作爲環架用黏著劑層之材料。 丙稀酸共聚物：使丙烯酸2-乙己酯（東亞合成公司 製）95質量％、丙烯酸2-羥乙酯（共榮社化學公司製 LIGHT_ESTER Η0Α)5質量％配合成之原料組成物共聚合。 丙烯酸共聚物之玻璃轉移點係-67.8Τ：。 φ 多官能異氰酸酯硬化劑：使用2,4-甲伸苯二異氰酸酯 與三羥甲丙烷的加成物構成之市售品（日本聚胺基甲酸酯 公司製，產品名CORONATE L-45)。 相對於該丙烯酸共聚物〗00質量份，配合該多官能異 氰酸酯硬化劑0.5質量份，得構成環架用黏著劑層之黏著 劑A。 準備以下作爲黏著劑層之材料。 丙烯酸共聚物：使丙烯酸2 -乙己酯（東亞合成公司 製）95質量％、丙烯酸 2-羥乙酯（共榮社化學公司製 -21- 200933723 LIGHT-ESTER HO A)5質量％配合成之原料組成物共聚合。 丙烯酸共聚物之玻璃轉移點係-67.8°C。 多官能異氰酸酯硬化劑：使用2,4-甲伸苯二異氰酸酯 與三羥甲丙烷的加成物構成之市售品（日本聚胺基甲酸酯 公司製，產品名CORONATE L-45)。 相對於該丙烯酸共聚物100質量份，配合該多官能異 氰酸酯硬化劑3質量份，得構成黏著劑層之黏著劑B。 基材膜係用乙烯-甲基丙烯酸-甲基丙烯酸烷基酯共聚 物之Ζη鹽爲主體的多離子聚合物樹脂構成之，熔融流動率 (MFR)1.5g/10分鐘（JISK7210,210°C)，熔點96°C，含Zn2 + 離子之膜（DU PONT-MITSUI POLYCHEMICALS 公司製，產 品名 HIMILAN 1650)。 使用該材料，如下製造切割片》 首先，於PET剝離襯墊上，以凹輥塗布黏著劑Α使成 爲對應於環架之環狀，經乾燥形成環架用黏著劑層。此時 係塗布至乾燥後環架用黏著劑層之厚度可達lym。其次， 於剝離襯墊之環架用黏著劑層形成面塗布黏著劑B，經乾 燥形成黏著劑層。此時係塗布至乾燥後環架用黏著劑層之 厚度可達10#m。最後，積層剝離襯墊之環架用黏著劑層 及黏著劑層形成面於厚度1 00 // m之基材片，得切割片。 而作爲比較例，製造不具備環架用黏著劑層之切割 片。此比較用切割片除環架用黏著劑層之相關材料及形成 方法以外，係使用同上之材料及方法。 2 .晶粒黏著膜 -22- 200933723 晶粒黏著膜係使用，將聚醯亞胺爲主劑之厚度30ym 的市售晶粒黏著膜，切成直徑6吋之圓形者。 3. 晶圓 晶圓係用形成有仿真電路圖案之直徑6吋X厚度0.4 mm 之砂晶圓。 4. 環架 環架係用，8 吋之馬丁體（martensite)系不錄鋼 SUS420J2製環（DISCO(股）出品）者。 切割片之黏著力及剝離特性係藉如下實驗評估。 <黏著力之評估> 0 切割片與晶粒黏著膜之黏著力，切割片與環架之黏著 力係如下評估。 1. 與晶粒黏著膜之黏著力：先將晶粒黏著膜加溫至 8〇°C貼合於矽晶圓上，以2kg輥1往返壓合，於23 °C放置 1曰後剝離切割片與晶粒黏著膜之界面。 剝離方法：1 8 0 °剝離 拉伸速度：300mm/分鐘 2. 與晶粒黏著膜之黏著力：貼合切割片於SUS420J2 製之環架上，以2kg輥1往返壓合，於231放置1日後剝 離切割片與SUS420J2製環架之界面。 剝離方法：1 8 0 °剝離 拉伸速度：3 00mm/分鐘 <環架的保持特性之評估> 將切割片於其環架用黏著劑層與環架貼合，其次，於 -23- 200933723 其黏著劑層上貼合晶粒黏著膜’更貼合晶圓於該晶粒黏著 膜上，依以下條件切割’評估環架之保持特性。 於切割片之切入量爲30#m。切割成10mmxl0mm大小 之晶片。切割裝置係用DISCO公司製之DAD341。切割刀 係用DISCO公司製之NBC-ZH2 05O-2 7HEEE。切割後切割 片不自環架剝落者爲〇，剝落者爲x。 切割刀形狀：外徑55.56mm’刃寬35弘m’內徑19.05mm 切割刀轉數：40,〇〇〇rpm 切割刀前進速度：80mm/秒 切削水之溫度：2 5 °C 切削水之量：1 · 〇 L /分鐘 <評估結果> 表1In the method of 200933723, the adhesive layer 103 and the adhesive layer for the ring frame i4 are formed as a supporting substrate. The manufacturing method of the dicing sheet 100 of the present embodiment includes the following steps (1) of applying an adhesive constituting the adhesive layer for a ring to the release liner 108 so as to correspond to the shape of the ring frame 105, drying or The wire irradiation hardens to form the adhesive layer 104 for the ring frame. (2) The adhesive for forming the adhesive layer 1 0 3 is applied to the ring frame of the release liner 1 to 8 in an adhesive layer, and dried or cured by a radiation chamber to form an adhesive layer 103. (3) The bonded base sheet 102 to the adhesive layer 103» The release liner 108 can be a conventional synthetic resin film such as a polyethylene terephthalate (PET) system, a polyamide or the like. In order to improve the releasability, polyfluorene treatment, long-chain alkyl treatment, fluorine treatment, or the like may be applied. The ring-shaped adhesive layer 104 and the adhesive layer 103 are particularly limited in form, and for example, a method of applying an adhesive to a release liner and, if necessary, hardening or hardening. When the adhesive is applied, a conventional coating such as a concave roll coater, a reverse roll coater, a contact roll coater, a dipping machine, a bar coater, a knife coater, a spray coater or the like can be used. It can also be printed by letterpress printing, lithography, typography, pattern printing, or screen printing. In this embodiment, after forming the laminated body of the adhesive layer 104 and the adhesive 103 for the ring frame, the substrate sheet 102 is bonded to the substrate sheet 102, and the substrate sheet 102 and the adhesive layer 103 may be applied to the substrate substrate 102 and the adhesive layer 103. The dicing sheet was cut 1 〇〇, and the adhesive layer 103 side of the sheet 100 was cut to correspond to the shape of the ring frame. 104 Radiation into a surface, the ethylene is not required to have a special drying machine, a coating such as a roll coating or a concave brush, or an adhesive which is used in the coating of the adhesive layer 104 for the ring frame of the coating-16-200933723, and if necessary, is dried or hardened. The adhesive layer 104 is used for the ring frame. <Manufacturing Method of Electronic Component> The method of manufacturing the electronic component using the dicing sheet 100 of the present embodiment is not particularly limited, and may be as follows. This will be described below with reference to Fig. 1. (1) The die attach film 106 is bonded to the inner region of the ring-shaped adhesive layer 104 of the dicing sheet 100. (2) The bonding ring 105 is bonded to the wafer 107 on the surface of the die attach film 106 by the adhesive layer 104 ° (3) of the ring of the dicing sheet 100. (4) The wafer 1〇7 is cut in a state of being bonded to the dicing sheet 1〇〇. (5) After the dicing, the die attach film 106 and the dicing sheet 1 are peeled off, and the wafer 107 and the die attach film 1 〇 6 attached to the back surface of the wafer 107 are picked up. Next, the wafer 1 to 7 on which the die attach film 106 is attached is mounted on a lead frame or a circuit board (not shown), and the die attach film 106 is heated to heat the wafer 107 to the lead frame or the circuit board. Finally, the die mounted on the lead frame or the circuit substrate is molded by a resin (not shown). The material and shape of the ring frame 105 are not particularly limited, and a commercially available product can be used. Further, the die-adhesive film 106 is a film in which an adhesive is formed into a film shape, and a commercially available product can be used. In this embodiment, the state in which the die attach film 106 is interposed between the wafer 107 and the dicing sheet i 00 is described as a description, and instead of the die attach film ι 〇 6 , a paste-like adhesive may be used instead. When a paste adhesive is used, the representative is on the back side of the wafer 107, and the semi-rigid adhesive wafer is also coated on the surface of -17-200933723, so that the first row of cuts or acid, phenol, and cockroaches 100 102, The adhesive of 103 is cut into a non-circuit forming surface which is adhered to the lead frame or the circuit substrate, and is heated and semi-hardened into a sheet to form an adhesive layer. The semi-hardened layer of the adhesive formed thereon has a function as the above-described crystal film 106. Therefore, the adhesive semi-hardened layer 107 is formed, and the adhesive sheet 103 and the base sheet 102 are formed by the dicing sheet 1 〇〇 the adhesive semi-hardened layer and the adhesive layer 103 are brought into contact with each other, and are formed as shown in the figure. structure. Then, as in the case of using the die attach film 106, the wafer to which the adhesive semi-hardened layer is attached is picked up, loaded on the wire circuit substrate, and heat-adhered. The paste adhesive is not particularly limited, and there are, for example, acrylate, vinyl ester, ethylene vinyl acetate copolymer, ethylene acrylate copolymer polyamine, polyethylene, poly maple, epoxy, polyglycolic acid, polyfluorene. One or a mixture of oxygen, a rubber polymer, a fluororubber polymer, and a fluororesin. <Operation Effect> Φ The effects of the dicing sheet of the present embodiment will be described below with reference to Figs. 1 and 2 . As shown in Fig. 1, the dicing sheet 100 of the present embodiment has a pressure-sensitive adhesive layer 1 in which a base material is laminated on a base material sheet 102, and a pressure-sensitive adhesive layer 1 for a ring frame which is laminated in a region of a predetermined bonding ring frame 105 of an adhesive layer. 〇 4. In the dicing sheet 100, since the adhesive layer 103' for bonding the die attach film 106 and the adhesive layer for attaching the ring frame 105 are independently disposed, the die attach film 106 and the ring are provided. The adhesion of the frame 1〇5 to the sheet 1 can be independently adjusted. -18- 200933723 Thus, the adhesive force of the adhesive layer 104 for the ring frame is high, and the adhesion between the dicing sheet and the crystal grains can be impaired. Self-loop; the danger. Further, since the sealant layer 103 and the ring frame 105 are bonded to each other via the adhesive layer 104 for the ring frame, the combination of the cut piece 1 〇〇 or the combination of the ring and the ring frame 105 can be enlarged. The adhesive force of the adhesive layer 104 for the ring frame is also the adhesive force of the layer 103, and the adhesive layer 104 for the ring is peeled at an angle of 180 for the adhesive force. , the stretching speed of 3 00mm / min, the timing reaches 6.6N/20mm or more. In this way, it is possible to reduce the risk of the ring frame 1 〇 5 self-cutting when cutting. Preferably, the manufacturing method of the dicing sheet 100 comprises the steps of: coating the adhesive constituting the ring frame 104 in a shape corresponding to the ring frame 105, and curing the adhesive layer 104 by drying or radiation; The surface of the agent layer 104 of the release liner 108 is formed, and the adhesive layer 103 is coated with the adhesive layer or the radiation to harden it to form the adhesive layer 103 and the step of bonding the substrate sheet 102 to the adhesive layer 103. . At this time, the adhesive sheet layer 104 for the ring frame and the adhesive laminated body are formed on the release liner 108, and a commercially available substrate is used to manufacture the cut sheet 1 of the present invention. Moreover, the ring frame is adhered to the bonding surface of the ring frame 105, and the adhesive layer 103 is applied to the adhesive layer of the adhesive layer 106. The film is peeled from the sheet 100 or the adhesive layer 1 〇3 is higher than the adhesive. The condition of the ring frame 105 is to measure 1 〇〇 peeling off the adhesive layer for the release liner to form an adhesive for the ring frame ring, and to dry it; the agent layer 1 〇 3 piece 102 is the easy layer 1 0 4 pairs: The bonding surface of the adhesive film 106 -19- 200933723 is protected by the release liner 108 from the beginning of manufacture, and the adhesion resistance can be reduced. Moreover, the dicing sheet 100 is further adapted to include: a step of bonding the die attach film 106 to the inner region of the adhesive layer 104 for the ring frame; and an adhesive layer 104 for attaching the ring frame 105 to the ring of the dicing sheet 1 a step of laminating the wafer 107 on the surface of the die attach film 106; a step of cutting the wafer 107 attached to the dicing sheet 1; and peeling off the die attach film 106 and the dicing sheet after dicing 100, a method of manufacturing an electronic component in the step of picking up the wafer 107 together with the die attach film 106 attached to the back side of the wafer 107. By this method, since the adhesive force of the adhesive layer 104 for the ring frame is higher than the adhesive force of the adhesive layer 103, the peeling property between the dicing sheet 100 and the short film 101 can be impaired, and the cutting can be reduced during cutting. The risk of peeling of the sheet 100 from the ring frame 105. Thus, it is possible to maintain good pick-up characteristics for wafers of various sizes without poor cutting. Further, in the method of manufacturing the electronic component, the paste adhesive 10g can be used instead of the die attach film 106g. At this time, as with the use of the die attach film, since the adhesive force of the paste adhesive can be independently adjusted with the adhesive force of the adhesive layer 104 for the ring frame, the adhesive between the dicing sheet 1 and the paste adhesive can be not impaired. It is easy to peel off and reduces the risk of peeling of the cutting piece 100 from the ring frame 105 during cutting. The embodiments of the present invention have been described above with reference to the drawings, and these are merely illustrative of the present invention, and other configurations than those described above may be employed. For example, in this embodiment, the adhesive layer for the ring frame 104 is formed by applying a paste-like adhesive and drying or hardening it. However, it may have a double-sided shape corresponding to the annular shape of the ring frame. Adhesive tape used as adhesive for ring frame-20- 200933723 Layer 1 〇4 ° Regardless of the shape of the adhesive layer of the ring frame i 〇4, it is the same as the embodiment of the adhesive layer 103. With the adhesive force of the adhesive layer 104, the same effect can be obtained. EXAMPLES Hereinafter, the present invention will be further described by way of examples, but the present invention is not limited to the preparation of the materials of the materials of the dicing sheet, the adhesive layer, and the adhesive layer for the ring frame of the dicing sheet of the Q embodiment. Made or prepared according to the following formula. 1 - Cutting piece The following materials are prepared as the adhesive layer for the ring frame. Acrylic acid copolymer: A raw material composition in which 95% by mass of 2-ethylhexyl acrylate (manufactured by Toagosei Co., Ltd.) and 5-hydroxyethyl acrylate (LIGHT_ESTER® manufactured by Kyoeisha Chemical Co., Ltd.) were mixed and synthesized. The glass transition point of the acrylic copolymer is -67.8 Τ:. φ Polyfunctional isocyanate curing agent: A commercially available product of an adduct of 2,4-methylphenylene diisocyanate and trimethylolpropane (manufactured by Nippon Polyurethane Co., Ltd., product name: CORONATE L-45). To the 00 parts by mass of the acrylic copolymer, 0.5 parts by mass of the polyfunctional isocyanate curing agent was added to obtain an adhesive A constituting the adhesive layer for a ring. The following materials were prepared as the adhesive layer. Acrylic acid copolymer: 95% by mass of 2-ethylhexyl acrylate (manufactured by Toagosei Co., Ltd.) and 2-hydroxyethyl acrylate (-21-200933723 LIGHT-ESTER HO A, manufactured by Kyoeisha Chemical Co., Ltd.) The composition is copolymerized. The glass transition point of the acrylic copolymer is -67.8 °C. Polyfunctional isocyanate hardener: A commercially available product of an adduct of 2,4-methylphenylene diisocyanate and trimethylolpropane (manufactured by Nippon Polyurethane Co., Ltd., product name: CORONATE L-45). To 100 parts by mass of the acrylic copolymer, 3 parts by mass of the polyfunctional isocyanate curing agent is blended to obtain an adhesive B constituting the adhesive layer. The base film is composed of a multi-ionic polymer resin mainly composed of a -η salt of an ethylene-methacrylic acid-alkyl methacrylate copolymer, and has a melt flow rate (MFR) of 1.5 g/10 min (JISK7210, 210 ° C). ), a film having a melting point of 96 ° C and containing Zn 2 + ions (manufactured by DU PONT-MITSUI POLYCHEMICALS, product name HIMILAN 1650). Using this material, a dicing sheet was produced as follows. First, an adhesive was applied to a PET release liner by a concave roller so as to form a ring corresponding to the ring frame, and dried to form an adhesive layer for a ring frame. At this time, the thickness of the adhesive layer for the ring frame after application to drying is up to lym. Next, the adhesive agent B is applied to the surface of the release liner of the release liner with an adhesive layer, and dried to form an adhesive layer. At this time, the thickness of the adhesive layer for the ring frame after application to drying is up to 10 #m. Finally, the ring of the laminated release liner was formed into a substrate sheet having a thickness of 100 m/m with an adhesive layer and an adhesive layer to obtain a dicing sheet. As a comparative example, a cut piece which does not have an adhesive layer for a ring frame was produced. The comparative use of the dicing sheet in addition to the material and method of forming the adhesive layer for the ring frame uses the same materials and methods as above. 2. Die-adhesive film -22- 200933723 The die-adhesive film is used, and a commercially available die-adhesive film having a thickness of 30 μm as a main component of polyimine is cut into a circle having a diameter of 6 。. 3. Wafer The wafer is a sand wafer with a diameter of 6吋X and a thickness of 0.4 mm formed with a dummy circuit pattern. 4. Ring frame Ring frame system, 8 inch martinsite (martensite) is not recorded steel SUS420J2 ring (DISCO (share) produced). The adhesion and peeling characteristics of the dicing sheet were evaluated by the following experiment. <Evaluation of adhesion> 0 The adhesion of the dicing sheet to the die attach film, and the adhesion of the dicing sheet to the ring frame were evaluated as follows. 1. Adhesion to the die attach film: firstly heat the die attach film to 8 〇 ° C and attach it to the 矽 wafer, press it back and forth with 2kg roll 1 , place it at 23 ° C for 1 曰 and then peel and cut. The interface between the sheet and the die attach film. Peeling method: 1 80° peeling and stretching speed: 300 mm/min 2. Adhesion to the die attach film: The cut piece is bonded to a ring frame made of SUS420J2, and is pressed back and forth with a 2 kg roll 1 and placed at 231. The interface between the cut piece and the SUS420J2 ring frame is peeled off later. Peeling method: 180° peeling stretching speed: 300 mm/min<Evaluation of retention characteristics of the ring frame> The dicing sheet was attached to the ring frame with the adhesive layer of the ring frame, and secondly, at -23- 200933723 The adhesion of the die attach film on the adhesive layer is more conformable to the wafer on the die attach film, and is cut according to the following conditions to evaluate the retention characteristics of the ring frame. The cut amount of the cut piece was 30 #m. The wafer was cut into a size of 10 mm x 10 mm. The cutting device was a DAD341 manufactured by DISCO Corporation. The cutting blade is NBC-ZH2 05O-2 7HEEE manufactured by DISCO. After cutting, the cut piece is not peeled off from the ring frame, and the peeling is x. Cutting blade shape: outer diameter 55.56mm 'blade width 35 hong m' inner diameter 19.05mm cutting knife revolutions: 40, 〇〇〇 rpm cutting knife forward speed: 80mm / sec cutting water temperature: 2 5 °C cutting water Quantity: 1 · 〇L / minute <evaluation result> Table 1

實施例 比較例 與晶粒黏著膜之黏著力 1 .5N/20mm 1 .5N/20mm 與環架之黏著力 2.5N/20mm 0.5N/20mm 保持特性 〇 X <實驗之討論> 不具備環架用黏著劑層之比較例中，環架對於切割片 之黏著力顯著低於晶粒黏著膜對於切割片之黏著力，結果 導致切割後環架與切割片剝離。 而設有環架用黏著劑層之實施例中’可保持晶粒黏著 膜對於切割片之黏著力，同時環架對於切割片之黏著力約 -24- 200933723 可達比較例者之5倍。結果’切割後環架不與切割片剝離。 由這些試驗結果可知’本發明之切割片切割後可不於 晶粒黏著膜之剝離特性造成影響，顯著改善與環架之黏著 性。 以上已基於實施例說明本發明。此實施例不過係例示 而已，業界當知可有種種變化例，而如此的變化例亦屬於 本發明之範圍。Example Comparative Example and Adhesion of Die Adhesive Film 1. 5N/20mm 1. 5N/20mm Adhesion to Ring Frame 2.5N/20mm 0.5N/20mm Retention Characteristics &X <Experimental Discussion> No Ring In the comparative example in which the adhesive layer was used, the adhesion of the ring frame to the dicing sheet was significantly lower than that of the die attach film to the dicing sheet, and as a result, the ring frame and the dicing sheet were peeled off after cutting. In the embodiment in which the adhesive layer for the ring frame is provided, the adhesion of the die attach film to the dicing sheet can be maintained, and the adhesion of the ring frame to the dicing sheet is about 5 times that of the comparative example. As a result, the ring frame was not peeled off from the cut piece after cutting. From these test results, it is understood that the cut piece of the present invention can be affected by the peeling property of the die attach film after cutting, and the adhesion to the ring frame can be remarkably improved. The invention has been described above based on the examples. This embodiment is merely illustrative, and various variations are known in the art, and such variations are also within the scope of the invention.

❹ 【圖式簡單說明】 第1圖實施形態之切割片的剖視圖。 第2圖實施形態之切割片（左）與比較用的切割片（右） 自黏著劑層形成面觀察之槪略前視圖。 【主要元件符號說明】 100 切割片 102 基材片 103 黏著劑層 104 環架用黏著劑層 105 環架 1〇6 晶粒黏著膜 1〇7 晶圓 -25-❹ [Simplified description of the drawings] Fig. 1 is a cross-sectional view of a dicing sheet according to the embodiment of the present invention. Fig. 2 is a schematic front view of the dicing sheet (left) and the dicing sheet for comparison (right) viewed from the surface on which the adhesive layer is formed. [Main component symbol description] 100 dicing sheet 102 base material sheet 103 adhesive layer 104 adhesive layer for ring frame 105 ring frame 1〇6 die attach film 1〇7 wafer -25-

Claims (1)

200933723 十、申請專利範圍： 1. 一種切割片’係用以在製造電子元件之際貼合於環架， 將晶圓固定’以作切割之切割片，其特徵爲具有基材 片、積層於該基材片之黏著劑層、及積層在該黏著劑層 的預定貼合環架之區域的環架用黏著劑層，而環架用黏 著劑層之黏著力高於上述黏著劑層之黏著力。 2. 如申請專利範圍第丨項之切割片，其中該環架用黏著劑 © 層對於環架之黏著力以剝離角度180。，拉伸速度300mm/ 分鐘之條件來測定時達0.6N/20mm以上。 3. —種切割片之製造方法，係如申請專利範圍第1或2項 之切割片的製造方法，其特徵爲包括：在剝離襯墊上以 可爲對應於環架之形狀塗布構成環架用黏著劑層之黏 著劑’乾燥或以放射線照射使其硬化，形成環架用黏著 劑層之步驟；更於該剝離襯墊之該環架用黏著劑層形成 面塗布構成黏著劑層之黏著劑，乾燥或以放射線照射使 ^ 其硬化，形成黏著劑層之步驟；以及，貼合基材片於該 黏著劑層之步驟。 4. 一種電子元件之製造方法，係切割晶圓而得電子元件的 製造方法，其特徵爲包括：貼合晶粒黏著膜（die attach film)於如申請專利範圍第1或2項之切割片的環架用黏 著劑層內側區域之步驟；貼合環架於環架用黏著劑層之 步驟；貼合晶圓於該晶粒黏著膜表面之步驟；以貼合在 該切割片之狀態進行該晶圓的切割之步驟，切割後剝離 該晶粒黏著膜與該切割片，連同附著在該晶圓背面的晶 -26- 200933723 粒黏著膜來拾取該晶圓之步驟。 5.—種電子元件之製造方法，係切割晶圓而得電子元件的 製造方法’其特徵爲包栝：貼合環架於如申請專利範圍 第1或2項之切割片的環架用黏著劑層之步驟；於晶圓 背面全面塗布糊狀黏著劑之步驟；加熱該糊狀黏著劑使 半硬化成片狀以形成黏著劑半硬化層之步驟；貼合該晶 圓之黏著劑半硬化層與該切割片於該切割片之環架所 圍繞的內側區域之步驟；以貼合在該切割片之狀態進行 該晶圓的切割之步驟；以及，切割後剝離黏著劑半硬化 層與該切割片，連同附著在該晶圓背面的黏著劑半硬化 層來拾取該晶圓之步驟。 ° ❹ -27-200933723 X. Patent Application Range: 1. A dicing sheet is used to attach a wafer to a ring when manufacturing electronic components, and to fix the wafer for cutting. It is characterized by having a substrate sheet and laminating The adhesive layer of the substrate sheet and the adhesive layer for the ring frame laminated in the region of the adhesive layer which is intended to be attached to the ring frame, and the adhesive force of the adhesive layer for the ring frame is higher than the adhesion of the adhesive layer force. 2. The dicing sheet of the scope of claim 2, wherein the ferrule is adhered to the ring by an adhesive. The conditions of the tensile speed of 300 mm/min were measured to be 0.6 N/20 mm or more. 3. A method of manufacturing a dicing sheet, which is a method of manufacturing a dicing sheet according to claim 1 or 2, characterized in that it comprises: coating a ring frame on the release liner in a shape corresponding to the ring frame The adhesive layer of the adhesive layer is dried or hardened by radiation to form a pressure-sensitive adhesive layer for the ring frame; and the ring frame of the release liner is coated with an adhesive layer to form an adhesive layer to form an adhesive layer. a step of drying or irradiating with radiation to form an adhesive layer; and laminating a substrate sheet to the adhesive layer. 4. A method of manufacturing an electronic component, which is a method of manufacturing an electronic component by dicing a wafer, comprising: bonding a die attach film to a dicing sheet according to claim 1 or 2; And the step of bonding the ring to the adhesive layer of the ring frame; the step of bonding the wafer to the surface of the die attach film; The step of cutting the wafer, after the dicing, peeling off the die attach film and the dicing sheet, and picking up the wafer together with the granules of the -26-200933723 adhered to the back surface of the wafer. 5. A method of manufacturing an electronic component, which is a method of manufacturing an electronic component by cutting a wafer, which is characterized in that it is bonded to a ring frame of a dicing sheet as claimed in claim 1 or 2 of the patent application. a step of coating a layer; a step of uniformly coating a paste-like adhesive on the back side of the wafer; a step of heating the paste-like adhesive to semi-harden into a sheet to form an adhesive semi-hardened layer; and semi-curing the adhesive to the wafer a step of laminating the layer and the dicing sheet on an inner region surrounded by the ring frame of the dicing sheet; a step of cutting the wafer in a state of being attached to the dicing sheet; and, after cutting, peeling off the semi-hardened layer of the adhesive and the The dicing sheet, along with the semi-hardened layer of adhesive attached to the back side of the wafer, is used to pick up the wafer. ° ❹ -27-
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