CN105733462A - Adhesive tape for dicing and method of manufacturing semiconductor chip - Google Patents
Adhesive tape for dicing and method of manufacturing semiconductor chip Download PDFInfo
- Publication number
- CN105733462A CN105733462A CN201510977427.1A CN201510977427A CN105733462A CN 105733462 A CN105733462 A CN 105733462A CN 201510977427 A CN201510977427 A CN 201510977427A CN 105733462 A CN105733462 A CN 105733462A
- Authority
- CN
- China
- Prior art keywords
- adhesive tape
- semiconductor element
- sticker
- weight portion
- semiconductor chip
- Prior art date
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 183
- 239000002390 adhesive tape Substances 0.000 title claims abstract description 164
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 28
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 110
- 239000000758 substrate Substances 0.000 claims abstract description 89
- 239000000463 material Substances 0.000 claims abstract description 81
- 238000000034 method Methods 0.000 claims abstract description 66
- 229920005989 resin Polymers 0.000 claims abstract description 58
- 239000011347 resin Substances 0.000 claims abstract description 58
- 238000007789 sealing Methods 0.000 claims abstract description 53
- 238000005520 cutting process Methods 0.000 claims description 64
- 229920001296 polysiloxane Polymers 0.000 claims description 60
- 238000006757 chemical reactions by type Methods 0.000 claims description 39
- 150000002978 peroxides Chemical class 0.000 claims description 38
- 239000003431 cross linking reagent Substances 0.000 claims description 21
- 239000003999 initiator Substances 0.000 claims description 20
- 239000003054 catalyst Substances 0.000 claims description 17
- 239000011248 coating agent Substances 0.000 claims description 11
- 238000000576 coating method Methods 0.000 claims description 11
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 10
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 10
- 125000000524 functional group Chemical group 0.000 claims description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract description 5
- 239000000853 adhesive Substances 0.000 abstract description 5
- 229910052710 silicon Inorganic materials 0.000 abstract description 5
- 230000001070 adhesive effect Effects 0.000 abstract description 3
- 239000010703 silicon Substances 0.000 abstract description 3
- -1 polyethylene terephthalate Polymers 0.000 description 19
- 239000000654 additive Substances 0.000 description 16
- 230000000996 additive effect Effects 0.000 description 16
- 238000012360 testing method Methods 0.000 description 16
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical group [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 15
- 238000006243 chemical reaction Methods 0.000 description 13
- ORQBXQOJMQIAOY-UHFFFAOYSA-N nobelium Chemical compound [No] ORQBXQOJMQIAOY-UHFFFAOYSA-N 0.000 description 13
- 230000000052 comparative effect Effects 0.000 description 11
- 239000000203 mixture Substances 0.000 description 10
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 9
- 238000002156 mixing Methods 0.000 description 9
- 239000000243 solution Substances 0.000 description 9
- 238000000227 grinding Methods 0.000 description 7
- 238000005260 corrosion Methods 0.000 description 6
- 230000007797 corrosion Effects 0.000 description 6
- 229910052697 platinum Inorganic materials 0.000 description 6
- 238000004381 surface treatment Methods 0.000 description 6
- 229920002554 vinyl polymer Polymers 0.000 description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 5
- 239000004205 dimethyl polysiloxane Substances 0.000 description 5
- 238000000465 moulding Methods 0.000 description 5
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 5
- 229920000139 polyethylene terephthalate Polymers 0.000 description 5
- 239000005020 polyethylene terephthalate Substances 0.000 description 5
- NIXOWILDQLNWCW-UHFFFAOYSA-N Acrylic acid Chemical class OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 4
- 239000002131 composite material Substances 0.000 description 4
- 238000011156 evaluation Methods 0.000 description 4
- 238000000605 extraction Methods 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 239000012528 membrane Substances 0.000 description 4
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 4
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 4
- 239000004925 Acrylic resin Substances 0.000 description 3
- 229920000178 Acrylic resin Polymers 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- 230000015271 coagulation Effects 0.000 description 3
- 238000005345 coagulation Methods 0.000 description 3
- 238000004132 cross linking Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 239000003921 oil Substances 0.000 description 3
- 150000001451 organic peroxides Chemical class 0.000 description 3
- 239000000123 paper Substances 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- 239000000377 silicon dioxide Substances 0.000 description 3
- 229910001220 stainless steel Inorganic materials 0.000 description 3
- 239000010935 stainless steel Substances 0.000 description 3
- 238000011282 treatment Methods 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 229920000180 alkyd Polymers 0.000 description 2
- 125000000217 alkyl group Chemical group 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000006459 hydrosilylation reaction Methods 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000000178 monomer Substances 0.000 description 2
- 229920001707 polybutylene terephthalate Polymers 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 230000011218 segmentation Effects 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- CIHOLLKRGTVIJN-UHFFFAOYSA-N tert-Butyl hydroperoxide Substances CC(C)(C)OO CIHOLLKRGTVIJN-UHFFFAOYSA-N 0.000 description 2
- 125000002769 thiazolinyl group Chemical group 0.000 description 2
- 238000012795 verification Methods 0.000 description 2
- XMNIXWIUMCBBBL-UHFFFAOYSA-N 2-(2-phenylpropan-2-ylperoxy)propan-2-ylbenzene Chemical compound C=1C=CC=CC=1C(C)(C)OOC(C)(C)C1=CC=CC=C1 XMNIXWIUMCBBBL-UHFFFAOYSA-N 0.000 description 1
- 239000004342 Benzoyl peroxide Substances 0.000 description 1
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 1
- 229920002799 BoPET Polymers 0.000 description 1
- KXDHJXZQYSOELW-UHFFFAOYSA-M Carbamate Chemical compound NC([O-])=O KXDHJXZQYSOELW-UHFFFAOYSA-M 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004734 Polyphenylene sulfide Substances 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 230000001476 alcoholic effect Effects 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000005030 aluminium foil Substances 0.000 description 1
- 239000004760 aramid Substances 0.000 description 1
- 229920003235 aromatic polyamide Polymers 0.000 description 1
- 230000003143 atherosclerotic effect Effects 0.000 description 1
- 235000019400 benzoyl peroxide Nutrition 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000003851 corona treatment Methods 0.000 description 1
- 125000001047 cyclobutenyl group Chemical group C1(=CCC1)* 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 238000005755 formation reaction Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 125000006038 hexenyl group Chemical group 0.000 description 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 238000004020 luminiscence type Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- IZYBEMGNIUSSAX-UHFFFAOYSA-N methyl benzenecarboperoxoate Chemical compound COOC(=O)C1=CC=CC=C1 IZYBEMGNIUSSAX-UHFFFAOYSA-N 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 150000002940 palladium Chemical class 0.000 description 1
- 125000002255 pentenyl group Chemical group C(=CCCC)* 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 239000011112 polyethylene naphthalate Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 150000003283 rhodium Chemical class 0.000 description 1
- 238000007788 roughening Methods 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Dicing (AREA)
Abstract
The invention relates to an adhesive tape for dicing and a method for manufacturing a semiconductor chip, aiming at providing an adhesive tape for dicing which has excellent adhesiveness for an element substrate which is formed with a plurality of semiconductor elements and a method for manufacturing a semiconductor chip using the adhesive tape for dicing. As a technical solution, the adhesive tape (1) is characterized in that: the adhesive tape is used for dicing when an element substrate, which is formed with a plurality of semiconductor elements of which each semiconductor element is sealed by a sealing resin or of which each semiconductor element is formed with a lens material thereon, is divided into a plurality of semiconductor chips, and the adhesive tap is provided with a base material (2) and an adhesive agent layer (3) which is laminated on the base material (2) and contains a curing organic silicon adhesive agent and a curing agent.
Description
Technical field
The present invention relates to the cutting adhesive tape used in the cutting of device substrate and employ the manufacture method of semiconductor chip of cutting adhesive tape.
Background technology
In the past, as the cutting adhesive tape of the semiconductor chip for making with LED (light emitting diode) etc., it is known that have the adhesive tape (with reference to patent documentation 1) of the bond layer being made up of acrylic resin.
In addition, as the method using cutting adhesive tape to make semiconductor chip, known following method: by adhesive tape joining in the substrate-side of the semiconductor element substrate being formed with multiple semiconductor element, by the method (with reference to patent documentation 2) that semiconductor element substrate is cut off by cutting machine.
Prior art literature
Patent documentation
Patent documentation 1: Japanese Unexamined Patent Publication 2013-38408 publication
Patent documentation 2: Japanese Unexamined Patent Publication 2005-93503 publication
Summary of the invention
Invent problem to be solved
Additionally, in recent years, propose following technology: when making semiconductor chip by cut-out semiconductor element substrate, adhesive tape is attached at the substrate-side of the sealing resin being formed with sealing semiconductor element, the side of the lens material being arranged on semiconductor element rather than semiconductor element substrate, thus cutting.
So, when semiconductor element substrate is attached adhesive tape from the side of formation sealing resin, lens material, sometimes because adhesion strength is not enough, the splashing etc. of semiconductor chip can be produced.
It is an object of the invention to, it is provided that the device substrate for being formed with multiple semiconductor element has good adhesive cutting adhesive tape and uses its manufacture method of semiconductor chip.
For the method solving problem
Based on such purpose, the cutting adhesive tape of the present invention is characterised by, being the cutting adhesive tape used when will be formed with multiple semiconductor element and device substrate that each semiconductor element is sealed by sealing resin or the device substrate that is formed with lens material on each semiconductor element are divided into multiple semiconductor chip, possessing: base material and be laminated on described base material and comprise the adhering agent layer of curing type silicone system sticker and firming agent.
At this, it is possible to make it is characterized in that, to described device substrate, attach use from by one or both the described sealing resin side formed as the organic siliconresin of functional group having methyl and phenyl or described lens material side.Furthermore, it is possible to make it is characterized in that, described adhering agent layer comprises peroxide curing type silicone sticker, the initiator being made up of peroxide.And then, it is possible to making it is characterized in that, relative to described peroxide curing type silicone system sticker 100 weight portion, the content of described initiator is the scope of 0.01 weight portion～15 weight portion.Further, it is possible to make it is characterized in that, described adhering agent layer comprises addition reaction-type silicon-type sticker, cross-linking agent and catalyst.Additionally, relative to described addition reaction-type silicon-type sticker 100 weight portion, the content of described cross-linking agent is the scope of 0.05 weight portion～10 weight portion.
And then, if the manufacture method as semiconductor chip grasps the present invention, the manufacture method of the semiconductor chip of the present invention comprises: coating operation, covers the plurality of semiconductor element of the device substrate being formed with multiple semiconductor element on substrate with organic siliconresin；Attach operation, to described device substrate, attach the adhesive tape of the adhering agent layer possessing base material and comprise curing type silicone system sticker and firming agent from described organic siliconresin side；Cut off operation, the described device substrate being pasted with described adhesive tape is cut into multiple semiconductor chip；Stripping process, peels described adhesive tape off from the plurality of semiconductor chip.
Invention effect
In accordance with the invention it is possible to provide device substrate for being formed with the multiple semiconductor elements sealed by sealing resin have good adhesive cutting adhesive tape and use its manufacture method of semiconductor chip.
Accompanying drawing explanation
Fig. 1 is the figure of an example of the composition of the adhesive tape representing application present embodiment.
Fig. 2 (a)～(d) is the represent the semiconductor chip of the adhesive tape employing present embodiment first figure manufacturing example.
Fig. 3 (a)～(d) is the represent the semiconductor chip of the adhesive tape employing present embodiment second figure manufacturing example.
Symbol description
1 ... adhesive tape, 2 ... base material, 3 ... adhering agent layer
Detailed description of the invention
Hereinafter, embodiments of the present invention are described.
[composition of adhesive tape]
Fig. 1 is the figure of an example of the composition of the adhesive tape 1 representing application present embodiment.The adhesive tape 1 of present embodiment be formed the multiple semiconductor elements sealed by sealing resin semiconductor element substrate or be formed on each semiconductor element lens material semiconductor element substrate cutting purposes in use.Specifically, the adhesive tape 1 of present embodiment is by attaching for cutting from the sealing resin side formed by organic siliconresin or the lens material side that formed by organic siliconresin semiconductor element substrate.It is explained, about the using method of adhesive tape 1, explains at back segment.
As it is shown in figure 1, the adhesive tape 1 of present embodiment has the structure that base material 2 is laminated with adhering agent layer 3.
What be explained is, although omit diagram, but adhesive tape 1, as required, can possess sticky end coating (anchorcoatlayer) between base material 2 and adhering agent layer 3.In addition it is also possible to the surface (face with the opposition side, face being opposite to adhering agent layer 3) of base material 2 is applied surface treatment.And then, it is possible to so that the surface of adhering agent layer 3 (face with the opposition side, face being opposite to base material 2) possesses release liner.
< base material >
The material of the base material 2 used in the adhesive tape 1 of present embodiment, it does not have be particularly limited to, such as metal system, plastics etc. can be used.Specifically, as base material 2, the resin moldings such as the such as metal forming such as rustless steel, soft aluminum, polyethylene terephthalate, polybutylene terephthalate (PBT), polyethylene naphthalate, polyphenylene sulfide, biaxial stretch-formed polypropylene, polyimides, aromatic polyamides, polycyclic alkene, fluorine resin can be used.In addition, according to purposes, base material 2 can be used the composite membrane such as by aluminium foil and resin molding lamination, the surface of resin molding is formed the composite membrane of the metal-oxide film such as aluminium oxide, silicon dioxide, and by these composite membranes further with the composite membrane etc. of resin molding lamination.
Wherein, as base material 2, it is preferred to use the material being main constituent with polyethylene terephthalate.
< adhering agent layer >
The adhering agent layer 3 of present embodiment comprises curing type silicone system sticker and constitutes for solidifying the firming agent of this silicon-type sticker.Additionally, adhering agent layer 3 can also comprise coloring agent etc. as required.
The thickness of adhering agent layer 3 is preferably the scope of 5 μm～50 μm, more preferably the scope of 20 μm～40 μm.When the thickness of adhering agent layer 3 is less than 5 μm, the silicon-type sticker that adhering agent layer 3 comprises is thinning, thus the adhesion strength of adhesive tape 1 is easily reduced.On the other hand, when the thickness of adhering agent layer 3 is thicker than 50 μm, it is easy to the coagulation producing adhering agent layer 3 destroys, and when using such adhesive tape 1, when peeling adhesive tape 1 off, it is easy to produce the cull that sticker remains when being attached to adherend.
At this, in the adhering agent layer 3 of present embodiment, as curing type silicone system sticker, peroxide cure type silicon-type sticker or addition reaction-type silicon-type sticker can be used.
Hereinafter, using the situation using peroxide curing type silicone system sticker as the first method of adhering agent layer 3, using to using the situation of addition reaction-type silicon-type sticker as the second method of adhering agent layer 3, be sequentially carried out explanation.
(first method)
The adhering agent layer 3 of first method comprises peroxide curing type silicone system sticker and the initiator (firming agent) that is made up of peroxide and constitutes.
Peroxide curing type silicone system sticker
Peroxide curing type silicone system sticker is such as the sticker that the organopolysiloxane mixture so that the organopolysiloxanes such as polydimethylsiloxane and organopolysiloxane copolymers resin are carried out be obtained by mixing is host.
As peroxide curing type silicone system sticker, it is not particularly limited, the SH4280 etc. of YR3340, YR3286, PSA610-SM, XR37-B6722, Dong Li DOW CORNING Co., Ltd. of the KR-100 of such as Shin-Etsu Chemial Co., Ltd, KR-101-10, KR-130, MomentivePerformanceMaterials can be used.
Additive (modifying agent)
Peroxide curing type silicone system sticker can comprise modifying agent as additive.As for the additive (modifying agent) in peroxide curing type silicone system sticker, use such as with organopolysiloxane, the organopolysiloxane copolymers resin such as above-mentioned different types of polydimethylsiloxane or organopolysiloxane mixture etc. that these are obtained by mixing.As such additive (modifying agent), it is not particularly limited, X-92-128, X-41-3003 etc. of the such as SD-7292 of Dong Li DOW CORNING Co., Ltd., BY15-701A, SD-7226, SE-1886A/B, Shin-Etsu Chemial Co., Ltd can be used.
In addition, for peroxide curing type silicone system sticker, even if mixing addition reaction-type silicon-type sticker described later as additive, it is also possible to modified effect same when obtaining with use above-mentioned additive (modifying agent).As addition reaction-type silicon-type sticker, it is not particularly limited, SD4580, SD4584, SD4585, SD4586, SD4587, SD4560, SD4570, SD4600PFC, SD4593, DC7651ADHESIVE etc. of TSR1512, TSR1516, XR37-B9204, Dong Li DOW CORNING Co., Ltd. of KR-3700, KR-3701, X-40-3237-1, X-40-3240, X-40-3291-1, X-40-3229, X-40-3270, X-40-3306, Mai Tu new high-tech material society of such as Shin-Etsu Chemial Co., Ltd can be used.
Initiator
As the initiator being made up of peroxide, use organic peroxide.To the organic peroxide used as initiator, it is not particularly limited, such as benzoyl peroxide, cumyl peroxide, 2,5-dimethyl-2 can be enumerated, 5-bis-(tert-butyl hydroperoxide) hexane, 1,1 '-di-t-butyl peroxidating-3,3,5-trimethylene hexanes, 1,3-bis--(tert-butyl hydroperoxide)-diisopropyl benzene etc., as commercially available prod, the NYPERK40 etc. of such as Japan Oil Co can be enumerated.
Content
At this, the content of the initiator (organic peroxide) in the adhering agent layer 3 of first method, relative to peroxide curing type silicone system sticker 100 weight portion, it is preferably the scope of 0.01 weight portion～15 weight portion, it is more preferably the scope of 0.05 weight portion～10 weight portion, more preferably the scope of 0.05 weight portion～3.5 weight portion.In addition, the content of the additive (modifying agent) in the adhering agent layer 3 of first method, relative to peroxide curing type silicone system sticker 100 weight portion, it is preferred to the scope of 0 weight portion～50 weight portion, more preferably the scope of 0 weight portion～30 weight portion.
By the content of initiator and modifying agent is set to above-mentioned scope relative to peroxide curing type silicone system sticker, it is possible to the adhesion strength of adhering agent layer 3 and retentivity to be set to the preferred scope as cutting adhesive tape 1.
On the other hand, when too small relative to the content of the initiator of peroxide curing type silicone system sticker, in adhering agent layer 3, peroxide curing type silicone system sticker solidifies insufficient sometimes, it is impossible to obtain desired adhesion strength.Additionally, when peroxide curing type silicone system sticker does not fully solidify, it is easy in adhering agent layer 3, produce coagulation destroy.As a result of which it is, after the cutting that adhesive tape 1 is used for semiconductor element substrate, from obtained semiconductor chip peel adhesive tape 1 off time, it is easy to produce cull.
When excessive relative to the content of the initiator of peroxide curing type silicone system sticker, owing to the curing reaction of peroxide curing type silicone system sticker exceedingly carries out, thus adhering agent layer 3 is hardening, the adhesion strength of adhesive tape 1 is easily reduced.Further, when being used for cutting by this adhesive tape 1, when cutting off semiconductor element substrate, the semiconductor chip as cut off machine easily peels off from adhesive tape 1 and splashes.
(second method)
Then, the adhering agent layer 3 of second method comprises addition reaction-type silicon-type sticker and as silicon-type sticker and comprises cross-linking agent and catalyst is constituted as firming agent.Constitute additionally, the adhering agent layer 3 of second method also can comprise for suppressing addition reaction-type silicon-type sticker to carry out the reaction controlling material of additive reaction sharply.
Addition reaction-type silicon-type sticker
Addition reaction-type silicon-type sticker is the sticker that the organopolysiloxanes such as the polydimethylsiloxane at least to contain 2 thiazolinyls being combined with silicon atom in 1 polydimethylsiloxane molecule are host.It is explained, as the molecular structure of the organopolysiloxane contained by addition reaction-type silicon-type sticker, such as straight-chain can be illustrated, there is the straight-chain of a part of branch, branched, netted.
Additionally, as thiazolinyl contained in the organopolysiloxane that addition reaction-type silicon-type sticker comprises, it is possible to illustrate such as vinyl, pi-allyl, cyclobutenyl, pentenyl, hexenyl, it is particularly preferred to for vinyl.
As addition reaction-type silicon-type sticker, it is not particularly limited, SD4580, SD4584, SD4585, SD4586, SD4587, SD4560, SD4570, SD4600PFC, SD4593, DC7651ADHESIVE etc. of TSR1512, TSR1516, XR37-B9204, Dong Li DOW CORNING Co., Ltd. of the KR3700 of such as Shin-Etsu Chemial Co., Ltd, KR3701, X-40-3237-1, X-40-3240, X-40-3291-1, X-40-3229, X-40-3270, X-40-3306, MomentivePerformanceMaterials can be enumerated.
Additive (modifying agent)
Addition reaction-type silicon-type sticker can comprise modifying agent as additive.As the additive (modifying agent) for addition reaction-type silicon-type sticker, use such as with organopolysiloxane, the organopolysiloxane copolymers resin such as above-mentioned different types of polydimethylsiloxane or organopolysiloxane mixture etc. that these are obtained by mixing.As such additive (modifying agent), it is not particularly limited, X-92-128, X-41-3003 etc. of the such as SD-7292 of Dong Li DOW CORNING Co., Ltd., BY15-701A, SD7226, SE1886A/B, Shin-Etsu Chemial Co., Ltd can be used.
In addition, for addition reaction-type silicon-type sticker, even if mixing aforesaid peroxide curing type silicone system sticker as additive, it is also possible to modified effect same when obtaining with use above-mentioned additive (modifying agent).As peroxide curing type silicone system sticker, it is not particularly limited, the SH4280 etc. of YR3340, YR3286, PSA610-SM, XR37-B6722, Dong Li DOW CORNING Co., Ltd. of the KR-100 of such as Shin-Etsu Chemial Co., Ltd, KR-101-10, KR-130, MomentivePerformanceMaterials can be used.
Cross-linking agent
In the reaction of addition reaction-type silicon-type sticker, using organopolysiloxane as cross-linking agent, described organopolysiloxane at least has 2 hydrogen atoms being combined with silicon atom in 1 organopolysiloxane molecules.
As the molecular structure of the organopolysiloxane as cross-linking agent, such as straight-chain can be illustrated, there is the straight-chain of a part, branched, ring-type, netted.
Cross-linking agent as the reaction for addition reaction-type silicon-type sticker, it does not have be particularly limited to, can enumerate the BY24-741 etc. of X-92-122, Dong Li DOW CORNING Co., Ltd. of such as KCC of SHIN-ETSU HANTOTAI.
Catalyst
Reaction for addition reaction-type silicon-type sticker uses catalyst, and described catalyst is for promoting the solidification caused by the additive reaction (hydrosilylation) of addition reaction-type silicon-type sticker and cross-linking agent.
As catalyst, use the known hydrosilylation reactions catalyst such as platinum group catalyst, rhodium series catalysts, palladium series catalyst.In these catalyst, particularly the platinum group catalyst response speed such as platinum micropowder, platinum black, platinum holds fine silica powder end, platinum holds activated carbon, the alkenyl siloxane complex of the alkene complex of the alcoholic solution of chloroplatinic acid, chloroplatinic acid, platinum, platinum is good, it is thus preferred to.
As the catalyst used in the reaction of addition reaction-type silicon-type sticker, it does not have be particularly limited to, SRX-212Cat, NC-25 etc. of CAT-PL-50T, Dong Li DOW CORNING Co., Ltd. of such as Shin-Etsu Chemial Co., Ltd can be enumerated.
Reaction controlling agent
As the reaction controlling agent used as required in the adhering agent layer 3 of second method, it does not have be particularly limited to, the BY24-808 etc. of CAT-PLR-2, Dong Li DOW CORNING Co., Ltd. of such as Shin-Etsu Chemial Co., Ltd can be enumerated.
Content
At this, relative to addition reaction-type silicon-type sticker 100 weight portion, the content of the cross-linking agent in the adhering agent layer 3 of second method is preferably the scope of 0.05 weight portion～10 weight portion, it is more preferably the scope of 0.1 weight portion～7 weight portion, more preferably the scope of 0.1 weight portion～2 weight portion.
Additionally, relative to addition reaction-type silicon-type sticker 100 weight portion, the content of the additive (modifying agent) in the adhering agent layer 3 of second method is preferably the scope of 0 weight portion～50 weight portion, more preferably the scope of 0 weight portion～30 weight portion.
By the content relative to addition reaction-type silicon-type sticker of cross-linking agent and modifying agent is set to above-mentioned scope, it is possible to the adhesion strength of adhering agent layer 3 and retentivity to be set to the preferred scope as cutting adhesive tape 1.
On the other hand, when cross-linking agent is too small relative to the content of addition reaction-type silicon-type sticker, the cross-linking reaction in adhering agent layer 3 carries out insufficient sometimes, it is impossible to obtain desired adhesion strength.Additionally, when the cross-linking reaction of addition reaction-type silicon-type sticker does not have sufficiently conducted, it is easy in adhering agent layer 3, produce coagulation destroy.As a result of which it is, after adhesive tape 1 is used for the cutting of semiconductor element substrate, from obtained semiconductor chip peel adhesive tape 1 off time, it is easy to produce cull.
And then, when cross-linking agent is excessive relative to the content of addition reaction-type silicon-type sticker, owing to the cross-linking reaction of addition reaction-type silicon-type sticker exceedingly carries out, thus adhering agent layer 3 is hardening, the adhesion strength of adhesive tape 1 is easily reduced.Further, when being used for cutting by this adhesive tape 1, when cutting off semiconductor element substrate, the semiconductor chip as cut off machine easily peels off from adhesive tape 1 and splashes.
Additionally, the catalyst content in the adhering agent layer 3 of second method is not particularly limited, for instance relative to wanting addition reaction-type silicon-type sticker 100 weight portion, can be set to about 0.01 weight portion～5 weight portion.
< sticky end coating >
As mentioned above, in the adhesive tape 1 of present embodiment, according to the use condition etc. of the adhesive tape 1 after the manufacturing condition of adhesive tape 1, manufacture, the sticky end coating mated with base material kind can be set between base material 2 with adhering agent layer 3, or apply the surface treatments such as sided corona treatment.Thereby, it is possible to improve the closing force of base material 2 and adhering agent layer 3.
< surface treatment >
Surface (face with the opposition side, face being opposite to adhering agent layer 3) to base material 2, can apply the surface treatments such as fissility improved treatment.Inorganic agent for the surface treatment of base material 2, it is not particularly limited, the stripping treatment agent etc. of the non-organic silicon systems such as such as chain alkyl polymers of vinyl monomers, fluorinated alkyl vinyl monomer-polymer, polyvinyl alcohol carbamate, alkyd amino system resin can be used.As the stripping treatment agent of such non-organic silicon system, PEELOIL1050, PEELOIL1200 etc. of such as Ipposha Oil Ind Co., Ltd. can be enumerated.
< release liner >
Additionally, the surface (face with the opposition side, face being opposite to base material 2) to adhering agent layer 3, release liner can be arranged as required to.As release liner, following release liner can be used: on the films such as paper, polyethylene, polypropylene, polyethylene terephthalate, apply for improving and the lift-off processing of the release property of silicon-type sticker that comprises in adhering agent layer 3.As the material used in the lift-off processing of release liner, it does not have be particularly limited to, the such as material such as fluorosilicone, chain alkyl polymers of vinyl monomers, alkyd amino system resin can be used.
The thickness G reatT.GreaT.GT of < adhesive tape
There is the adhesive tape 1 of composition as described above, as its integral thickness, it is preferred to the scope of 20 μm～200 μm.
When the thickness of adhesive tape 1 is thinner than 20 μm, when adhesive tape 1 is used for the cutting of semiconductor element substrate, sometimes it is difficult to strip, from adhesive tape 1, the semiconductor chip formed.
Additionally, when the thickness of adhesive tape 1 is thicker than 200 μm, when attaching adhesive tape 1 from the sealing resin side of semiconductor element substrate, adhesive tape 1 is difficult to follow the concavo-convex of sealing resin.As a result of which it is, the bond area of adhesive tape 1 and sealing resin diminishes, it is possible to during cutting, semiconductor chip easily splashes.
[manufacture method of adhesive tape]
Then, the manufacture method of the adhesive tape 1 of present embodiment is illustrated.
What be explained is, the adhesive tape 1 of the adhesive tape 1 with the adhering agent layer 3 of the peroxide curing type silicone system sticker comprising above-mentioned first method and the adhering agent layer 3 with the addition reaction-type silicon-type sticker comprising second method, it is possible to by same manufacture method manufacture.
When manufacturing adhesive tape 1, first, in the organic solvent that toluene, ethyl acetate etc. are general, dissolving cured type silicon-type sticker and firming agent, obtain sticker solution.Then, use unfilled corner wheel coating machine etc. this sticker solution is coated carried out surface treatment as required, on the surface of base material 2 that sticky end coating is formed, to become predetermined thickness.
Then, at the temperature of 60 DEG C～160 DEG C, the base material 2 being coated with sticker solution heats several points～about tens of points, so that sticker is solution cured, forms adhering agent layer 3.
By above operation, it is possible to obtain the adhesive tape 1 being laminated with adhering agent layer 3 on base material 2 as shown in Figure 1.
[using method of adhesive tape]
As it has been described above, the adhesive tape 1 of present embodiment is for the cutting of semiconductor element substrate.At this, semiconductor element substrate refers to the material being formed with the semiconductor elements such as multiple LED (light emitting diode) on the substrates such as resin.It is explained, in such semiconductor element substrate, generally, in order to protect semiconductor element not by the impact of the change of the external environment condition such as temperature, humidity, sealing resin is set to cover semiconductor element.Additionally, in such semiconductor element substrate, in order to efficiently extract by the light of the semiconductor element injections such as LED, sometimes arrange lens material on each semiconductor element.
As cutting off the method that semiconductor element substrate obtains multiple semiconductor chip, known such as following method in the past.
First, attach cutting adhesive tape from the substrate-side of semiconductor element substrate, and utilize cutting machine etc. from the side contrary with the side having attached adhesive tape, be namely formed with the side of semiconductor element, cut off semiconductor element substrate.Then, each semiconductor chip formed by cutting off is stripped from adhesive tape, thus obtaining multiple semiconductor chip.
But, so attaching cutting adhesive tape from the substrate-side of semiconductor element substrate and cut off semiconductor element substrate, exist and produce, at section (substrate side surfaces of semiconductor chip), the generation of so-called turned-down edge (ダ レ) that comes off, or the problem such as section is roughening.
Then, in recent years, in order to solve such problem, propose following method: to semiconductor element substrate, from the side forming semiconductor element, namely cutting adhesive tape is formed the sealing resin of sealing semiconductor element, the side of lens material attaches, rather than attach from substrate-side, and cut off semiconductor element substrate.
At this, in the past, as being used for cutting off the cutting adhesive tape of semiconductor element substrate, the material such as with the adhering agent layer being made up of acrylic resin was used.
But, if such conventional adhesive tape is attached, from the side (sealing resin side, lens material side) forming semiconductor element of semiconductor element substrate, the cutting carrying out semiconductor element substrate, then when such as sealing resin and the adhesion strength of adhesive tape, lens material are insufficient with the adhesion strength of adhesive tape, it is possible to produce the problem such as semiconductor chip splashing when cutting.
In the past, utilize electrical characteristics, excellent heat resistance epoxy resin as semiconductor element sealing resin, but epoxy resin exist when for the LED of short wavelength, high output LED time the problem such as easy variable color.
Accordingly, as the sealing resin of the semiconductor elements such as LED, in recent years, the situation using organic siliconresin is many.
As the organic siliconresin as semiconductor element sealing resin, the both sides containing methyl and phenyl or the side organic siliconresin as functional group can be enumerated, that is, containing methyl as the organic siliconresin of functional group, the organic siliconresin containing methyl and phenyl both sides and the organic siliconresin containing phenyl.Both sides containing methyl and phenyl or a side are as the organic siliconresin of functional group, and the light transmission rate to the light of wavelength 400nm～800nm is more than 88%, and refractive index is more than 1.41, and both of which is high.Therefore, when used as semiconductor element sealing resins such as LED, it is possible to the outside effectively extremely encapsulated by the light extraction penetrated by semiconductor element, light extraction efficiency is improved.
In these organic siliconresins, by using containing phenyl as the organic siliconresin of functional group, compared with when using the organic siliconresin containing only methyl, more improve by the light extraction efficiency of semiconductor element.
nullAs the organic siliconresin containing methyl，It is not particularly limited，The KER-2300 of such as Shin-Etsu Chemial Co., Ltd can be enumerated、KER-2460、KER-2500N、KER-2600、KER-2700、KER-2900、X-32-2528、The IVS4312 of MomentivePerformanceMaterials、IVS4312、XE14-C2042、IVS4542、IVS4546、IVS4622、IVS4632、IVS4742、IVS4752、IVSG3445、IVSG0810、IVSG5778、XE13-C2479、IVSM4500、The OE-6351 of Dong Li DOW CORNING Co., Ltd.、OE-6336、OE-6301 etc..
Organic siliconresin as the both sides containing methyl and phenyl, it does not have be particularly limited to, can enumerate KER-6075, KER-6150, KER-6020 etc. of such as Shin-Etsu Chemial Co., Ltd.
As the organic siliconresin containing phenyl, it is not particularly limited, OE-6520, OE-6550, OE-6631, OE-6636, OE-6635, OE-6630 etc. of XE14-C2508, Dong Li DOW CORNING Co., Ltd. of the KER-6110 of such as Shin-Etsu Chemial Co., Ltd, KER-6000, KER-6200, ASP-1111, ASP-1060, ASP-1120, ASP-1050P, MomentivePerformanceMaterials can be enumerated.
Additionally, as it has been described above, in semiconductor element substrate, sometimes for the purpose of the extraction efficiency that improves the light penetrated by semiconductor element etc., each semiconductor element arranges the lens material formed by above-mentioned organic siliconresin.As the method arranging lens material on semiconductor element, following method can be enumerated: such as, the sealing resin being formed and being covered each semiconductor element by above-mentioned organic siliconresin is shaped to lens shape, or the sealing resin that the lens material formed by above-mentioned organic siliconresin is further installed at sealing each semiconductor element is first-class.
It addition, organic siliconresin has the character that such as release property is high compared with epoxy resin etc..Therefore, to using the organic siliconresin semiconductor element substrate as sealing resin, being formed with the semiconductor element substrate of the lens material formed by organic siliconresin, such as, when attaching the adhesive tape of acrylic resin from the side being formed with sealing resin or lens material, easily diminish as the organic siliconresin of sealing resin or lens material and the adhesion strength of adhesive tape.As a result of which it is, when the cut-out of semiconductor element substrate, it is easier to the problem such as splashing producing above-mentioned semiconductor chip.
Relative to this, in the adhesive tape 1 of present embodiment, as mentioned above, adhering agent layer 3 comprises curing type silicone system sticker and firming agent and constitutes, thus when carrying out the cutting of semiconductor element substrate, even if when by using from the side attaching being formed with sealing resin or lens material, it is also possible to the bonding force of the sealing resin of maintenance and semiconductor element substrate well.Further, compared with conventional adhesive tape, when carrying out the cutting of semiconductor element substrate, it is possible to suppress the generation of the splashing etc. of semiconductor chip.
Hereinafter, the manufacture method to the using method of the adhesive tape 1 of present embodiment and the semiconductor chip of the adhesive tape 1 employing present embodiment, it is described in detail.
At this, first, manufacturing example to first and illustrate, wherein, manufacturing semiconductor chip by the semiconductor element substrate sealing multiple semiconductor element with sealing resin in the lump being carried out segmentation.Fig. 2 (a)～(d) is the represent the semiconductor chip of the adhesive tape employing present embodiment first figure manufacturing example.
In present embodiment, first, on the substrate 101 such as formed by resin material etc., the multiple semiconductor element 102 of stowage, prepare semiconductor element substrate 100.Being explained, semiconductor element 102 is such as LED element, though the diagram of omission, but such as comprise by energising multiple semiconductor layer stackings such as the luminescent layer of luminescence and constitute, it is formed with electrode on top.
Secondly, will be formed in the multiple semiconductor elements 102 on the substrate 101 of semiconductor element substrate 100 with the sealing resin 103 formed by organic siliconresin and seal (sealing process) in the lump.It is explained, in this example embodiment, by sealing resin 103, seals multiple semiconductor element 102 in the lump but it also may seal each semiconductor element 102 respectively by sealing resin 103.Being explained, in this example embodiment, sealing process corresponding to covering the coating operation of semiconductor element 102 with organic siliconresin.
Then, as shown in Fig. 2 (a), in the way of the sealing resin 103 of adhering agent layer 3 with semiconductor element substrate 100 to make adhesive tape 1 is opposed, adhesive tape 1 and semiconductor element substrate 100 are fitted (attaching operation).
Secondly, as shown in Fig. 2 (b), (c), when adhesive tape 1 is with sealing resin 103 laminating of semiconductor element substrate 100, utilize cutting machine etc. that along cutting off preset lines X, semiconductor element substrate 100 is cut off (cut-out operation).In this example embodiment, the semiconductor element substrate 100 being pasted with adhesive tape 1 is cut off from substrate 101 side.Additionally, as shown in Fig. 2 (c), in this example embodiment, what carried out all cutting semiconductor element substrate 100 so-called cuts (fullcut) entirely.
Then, the semiconductor chip 200 formed by cutting off semiconductor element substrate 100 is stripped (pickup (pickup)) from adhesive tape 1, thus the semiconductor chip 200 (stripping process) through singualtion can be obtained as shown in Fig. 2 (d).
Then, manufacture example to second and illustrate, wherein, manufacture semiconductor chip by the semiconductor element substrate forming lens material on respective at multiple semiconductor elements is carried out segmentation.Fig. 3 (a)～(d) is the represent the semiconductor chip of the adhesive tape employing present embodiment second figure manufacturing example.It is explained, manufactures, about with first shown in Fig. 2 (a)～(d), the operation that example is same, in this description will be omitted.
The second of semiconductor chip manufactures in example, as shown in Fig. 3 (a), multiple semiconductor elements 102 on the substrate 101 being formed at semiconductor element substrate 100 respective on, form the lens material 104 (lens forming operation) that formed by organic siliconresin.Being explained, in this example embodiment, lens forming operation corresponding to covering the covering process of semiconductor element 102 with organic siliconresin.
As the method forming lens material 104, following method can be enumerated: the sealing resin being formed and covering each semiconductor element 102 by organic siliconresin is shaped to lens shape, make the method for lens material 104, the method etc. of the lens material 104 formed by organic siliconresin is installed on the sealing resin covering each semiconductor element 102.
At this, the sealing resin covering semiconductor element 102 is shaped to the lens shape method to make lens material 104, it does not have be particularly limited to, such as compression forming, ejection formation, transfer molding, printing molding etc. can be enumerated.
Additionally, as the method for mounted lens material 104 on the sealing resin covering respective semiconductor element 102, it does not have it is particularly limited to, can enumerate and such as put glue (dispense) method etc..
Then, as shown in Fig. 3 (a), in the way of the adhering agent layer 3 of adhesive tape 1 is opposed with each lens material 104 being formed at semiconductor element substrate 100, adhesive tape 1 and semiconductor element substrate 100 are fitted (attaching operation).
Then, as shown in Fig. 3 (b), (c), when adhesive tape 1 is with lens material 104 laminating of semiconductor element substrate 100, utilize cutting machine etc. that along cutting off preset lines X, semiconductor element substrate 100 is cut off (cut-out operation).In this example embodiment, preset lines X lens material 104 region each other being set on adjacent semiconductor element 102 to be formed will be cut off.
Then, the semiconductor chip 200 formed by cutting off semiconductor element substrate 100 is stripped (pickup) from adhesive tape 1, thus as shown in Fig. 3 (d), it is possible to obtain through singualtion and the semiconductor chip 200 (stripping process) being formed with lens material 104 on each.
As it has been described above, in the adhesive tape 1 of present embodiment, adhering agent layer 3 comprises curing type silicone system sticker and firming agent and constitutes.Thus, when being used for cutting by adhesive tape 1, even if when attaching from the side being formed with sealing resin 103 or lens material 104 of semiconductor element substrate 100, it is also possible to keep the bonding force of semiconductor element substrate 100 and adhesive tape 1 well.
Particularly, in recent years, as the sealing resin 103 of sealing semiconductor element 102, the lens material 104 that arranges on semiconductor element 102, the situation using the high organic siliconresin of release property is many.To this, in the adhesive tape 1 of present embodiment, owing to having above-mentioned composition, thus the sealing resin 103 formed by organic siliconresin, lens material 104 are also had good bonding force.
As a result of which it is, the adhesive tape 1 of present embodiment is when for the cutting of semiconductor element substrate 100, it is possible to suppress the splashing of semiconductor chip 200.
Particularly, as shown in Fig. 3 (a)～(d), generally, the outer surface of lens material 104 is formed by sphere, aspheric surface etc., and attaching adhesive tape 1 from lens material 104 side, the sticky surface of adhesive tape 1 is in curved surface.Generally, when the sticky surface of adhesive tape 1 is in curved surface, with sticky surface be plane situation compared with, the easy step-down of bonding force of adhesive tape 1 and sticky surface.Relative to this, the organic siliconresin constituting lens material 104 is had good bonding force by the adhesive tape 1 of present embodiment, even if therefore when attaching adhesive tape 1 from lens material 104 side in curved surface, it is also possible to suppress the splashing of semiconductor chip 200.
And then, the curing type silicone system sticker that the adhering agent layer 3 of the adhesive tape 1 of present embodiment comprises, described above and sealing resin 103, lens material 104 have good adhesion strength, on the other hand, have the character that release property is high.Thus, in present embodiment, when the semiconductor chip 200 obtained by cutting semiconductor device substrate 100 is peeled off from adhesive tape 1, it is possible to suppression sticker is attached to the generation of the so-called cull of semiconductor chip 200.
Generally, such as, when the adhesive tape being made up of adhering agent layer the sticker of acrylic acid series is used for semiconductor element substrate cutting, when semiconductor chip after stripping cut-out from adhesive tape, it is necessary in advance to adhesive tape irradiation ultraviolet radiation, make adhering agent layer lose cohesiveness.But, when adhesive tape 1 of present embodiment, it is possible to be not irradiated ultraviolet operation and peel semiconductor chip 200 off from adhesive tape 1.
Therefore, by the adhesive tape 1 of present embodiment being used for the cutting of semiconductor element substrate 100, it is possible to make manufacturing process's summary of semiconductor chip 200.
What be explained is, method illustrated in Fig. 2 (a)～(d) and Fig. 3 (a)～(d) is an example of the manufacture method of the semiconductor chip using adhesive tape 1, and the using method of adhesive tape 1 is not limited to said method.Namely, the adhesive tape 1 of present embodiment, as long as when cutting, the semiconductor element substrate with the multiple semiconductor elements sealed with sealing resin can be attached at or be formed with the semiconductor element substrate of multiple semiconductor elements of lens material on each, it is possible to being not limited to said method and use.
Embodiment
Then, embodiment and comparative example is used to specifically describe the present invention further.It is explained, the invention is not restricted to following example.
The present inventor, respectively to using peroxide curing type silicone system sticker as the first method of adhering agent layer 3 and to use addition reaction-type silicon-type sticker as the second method of adhering agent layer 3, make adhesive tape 1 with the addition of different firming agent (initiator, cross-linking agent), made adhesive tape 1 is evaluated.
Hereinafter, each embodiment and each comparative example are described in detail.
1. the making of adhesive tape 1
(embodiment 1～embodiment 4)
In toluene, dissolve the peroxide curing type silicone system sticker (Shin-Etsu Chemial Co., Ltd KR101-1) formed by organopolysiloxane and the initiator (Japan Oil Co NYPERK40) being made up of methyl benzoyl peroxide, regulate sticker solution.Being explained, the content of peroxide atherosclerotic type silicon-type sticker and initiator regulates as shown in table 1.
Then, this sticker solution is coated on the base material 2 formed by polyethylene terephthalate (PET) film of thickness 75 μm, then with the heating temperatures 3 minutes of 160 degree, thus forming the adhering agent layer 3 of thickness 30 μm, the adhesive tape 1 of gross thickness 105 μm is obtained.
(embodiment 5～8)
In toluene, dissolve is formed by the organopolysiloxane in molecule with vinyl silica-based (PVC ニ Le シ リ Le base) addition reaction-type silicon-type sticker (Shin-Etsu Chemial Co., Ltd X-40-3237-1), platinum family catalyst (Shin-Etsu Chemial Co., Ltd CAT-PL-50T), the cross-linking agent (Shin-Etsu Chemial Co., Ltd X-92-122) that is made up of the organopolysiloxane in molecule with hydrosilyl groups (ヒ De ロ シ リ Le base), adjustment sticker solution.Being explained, the content of addition reaction-type silicon-type sticker, catalyst and cross-linking agent regulates as shown in table 1.
Then, this sticker solution being coated on the base material 2 formed by PET film of thickness 75 μm, then with the heating temperatures 3 minutes of 120 degree, thus forming the adhering agent layer 3 of thickness 30 μm, obtaining the adhesive tape 1 of gross thickness 105 μm.
(comparative example 1)
Except the content of the initiator in adhering agent layer 3 is set to except 0, operate in the same manner as embodiment 1～embodiment 4, obtain adhesive tape 1.
(comparative example 2)
Except the content of the cross-linking agent in adhering agent layer 3 is set to except 0, operate in the same manner as embodiment 5～embodiment 8, obtain adhesive tape 1.
(comparative example 3)
Except with the sticker of acrylic acid series as, beyond adhering agent layer 3, operating in the same manner as embodiment 1～8, obtain adhesive tape 1.
2. evaluation methodology
Then, the evaluation methodology of adhesive tape 1 is illustrated.
(1) to the adhesion test grinding SUS
By the adhesive tape 1 that said method makes, according to method described in JISZ0237 (2000), carry out the adhesion test (being pulled away from adhesion test) grinding SUS.
Specifically, adhesive tape 1 is attached at the corrosion resistant plate (SUS304) ground through water-fast pouncing paper, makes the roller of quality 2000g with reciprocal 1 time of the speed of 5mm/s, crimp.Then, after placing 20～40 minutes, use cupping machine, with the speed of 5mm/s towards being pulled away from the direction that corrosion resistant plate is 180 °, measure the adhesion strength grinding SUS plate.
(2) retentivity test
To made adhesive tape 1, carry out retentivity test.
Specifically, adhesive tape 1 is attached at the corrosion resistant plate (SUS304) ground through water-fast pouncing paper, when being provided with predetermined weight, measures the 24 little offsetting amounts (mm) constantly that keep when 40 DEG C.At this, as cutting adhesive tape, the offsetting amount measured in retentivity test is preferably below 25mm.
Additionally, adhesive tape 1 dropped from stainless steel sheet peeling off before arriving 24 hours, measure from measuring the elapsed time (dividing) started peeling off to adhesive tape 1.Be explained, in table 1 retentivity test " ↓ " sign, refer to that adhesive tape 1 offsets from corrosion resistant plate before 24 hours and drops arriving.
(3) adhesion test to organic siliconresin
To made adhesive tape 1, according to the method for above-mentioned adhesion test, carry out organic siliconresin adhesion test.
Specifically, adhesive tape 1 is attached on the plate (test film) being coated with organic siliconresin, makes the roller of quality 2000g with reciprocal 1 time of the speed of 5mm/s, crimp.Then, after placing 20～40 minutes, use cupping machine, with the speed of 5mm/s by organic siliconresin towards being pulled away from the direction that coated plate is 180 °, measure the adhesion strength to organic siliconresin.
It is explained, in this test, as the organic siliconresin of coating on the plate attaching adhesive tape 1, uses the organic siliconresin of LED sealant.
Specifically, as organic siliconresin A, use organic siliconresin (KER-2500N of SHIN-ETSU HANTOTAI's chemical industry) as LED device organosilicon material, containing methyl.
Test film makes as follows.That is, with the A agent of mixing ratio 1:1 mixing KER-2500N and B agent, mixed liquor is prepared.Then, to corrosion resistant plate (SUS304) coating mixture, after heating 1 hour at 100 DEG C, heat 2 hours at 150 DEG C, thus solidifying.Thus, the test film of organic siliconresin A it is formed with on stainless steel.
Additionally, as organic siliconresin B, use organic siliconresin (KER-6110 of SHIN-ETSU HANTOTAI's chemical industry) as LED device organosilicon material, containing phenyl.
Test film makes as follows.That is, with the A agent of mixing ratio 3:7 mixing KER-6110 and B agent, mixed liquor is prepared.Then, to corrosion resistant plate (SUS304) coating mixture, after heating 2 hours at 100 DEG C, heat 5 hours at 150 DEG C, thus solidifying.Thus, the test film of organic siliconresin B it is formed with on stainless steel.
3. evaluation result
About the evaluation result of the adhesive tape 1 to embodiment 1～embodiment 8 and comparative example 1～comparative example 3, illustrate in Table 1.
Table 1
*, in comparative example 3, adhering agent layer is employed acrylic acid series sticker.
As shown in table 1, confirming when making adhering agent layer 3 comprise curing type silicone system sticker and firming agent and to constitute (embodiment 1～embodiment 8), adhesive tape 1 is to grinding the adhesion strength of SUS plate, retentivity, the adhesion strength to organic siliconresin A and the adhesion strength to organic siliconresin B all in preferred scope.
Thus, confirm the adhesive tape 1 comprising curing type silicone system sticker and firming agent to constitute adhering agent layer 3, as attaching from the side being formed with sealing resin or lens material of semiconductor element substrate and cutting adhesive tape for cutting is useful.
Then, in embodiment 1～embodiment 8, compare using the peroxide curing type silicone system sticker situation (embodiment 1～embodiment 4) as silicon-type sticker, results verification is relative to peroxide curing type silicone system sticker 100 weight portion, when the content of the initiator being made up of peroxide is 0.05 weight portion～10 weight portion (embodiment 1～embodiment 3), the retentivity of adhesive tape 1 is better.
And then, relative to peroxide curing type silicone system sticker 100 weight portion, when the content of initiator is 0.05 weight portion～3.5 weight portion (embodiment 1, embodiment 2), adhesive tape 1 is to the adhesion strength of organic siliconresin A and the adhesion strength of organic siliconresin B is better.
Therefore, when using peroxide curing type silicone system sticker as silicon-type sticker, relative to peroxide curing type silicone system sticker 100 weight portion, the content of the initiator being made up of peroxide is preferably the scope of 0.05 weight portion～10 weight portion, it is preferred that the scope of 0.05 weight portion～3.5 weight portion.
And then, in embodiment 1～embodiment 8, compare using the addition reaction-type silicon-type sticker situation (embodiment 5～embodiment 8) as silicon-type sticker, results verification is relative to addition reaction-type silicon-type sticker 100 weight portion, when the content of cross-linking agent is 0.1 weight portion～7 weight portion (embodiment 5～embodiment 7), the adhesive tape 1 adhesion strength to grinding SUS plate, to the adhesion strength of organic siliconresin A and the adhesion strength of organic siliconresin B is higher, (embodiment 5 when 0.1 weight portion～2 weight portion, embodiment 6), the adhesive tape 1 adhesion strength to grinding SUS plate, adhesion strength to organic siliconresin A and the adhesion strength to organic siliconresin B are high further.
Therefore, when confirming to use addition reaction-type silicon-type sticker as silicon-type sticker, relative to addition reaction-type silicon-type sticker 100 weight portion, the content of cross-linking agent is more preferably the scope of 0.1 weight portion～7 weight portion, more preferably the scope of 0.1 weight portion～2 weight portion.
In contrast, confirm when adhering agent layer 3 is without firming agent (initiator or cross-linking agent) (comparative example 1, comparative example 2), the retentivity of adhesive tape 1 is significantly low.It is believed that this is because when adhering agent layer 3 is without firming agent, silicon-type sticker does not solidify.
Further, measurable when such adhesive tape 1 is used as cutting adhesive tape, after using adhesive tape 1 in the cutting of semiconductor element substrate, when peeling adhesive tape 1 off from obtained semiconductor chip, it is easy to produce cull.
In addition, when confirming the sticker using acrylic acid series as adhering agent layer 3 (comparative example 3), although adhesive tape 1 is good to the adhesion strength and retentivity of grinding SUS plate, but the adhesion strength to the organic siliconresin A used as sealing resin of semiconductor element and the adhesion strength to organic siliconresin B are significantly low.
It is measurable when such adhesive tape 1 is used as cutting adhesive tape attaching from the sealing resin side of semiconductor element substrate, when cutting, semiconductor element substrate, semiconductor chip become easily to peel off from adhesive tape 1, become easily to produce the splashing of semiconductor chip.
Claims (7)
1. a cutting adhesive tape, it is characterised in that
It is the cutting adhesive tape used when will be formed with multiple semiconductor element and device substrate that each semiconductor element is sealed by sealing resin or the device substrate that is formed with lens material on each semiconductor element are divided into multiple semiconductor chip, possesses:
Base material,
It is laminated on described base material and comprises the adhering agent layer of curing type silicone system sticker and firming agent.
2. cutting adhesive tape as claimed in claim 1, it is characterised in that
Described device substrate is attached from by one or both the described sealing resin side formed as the organic siliconresin of functional group having methyl and phenyl or described lens material side and uses.
3. cutting adhesive tape as claimed in claim 1 or 2, it is characterised in that
Described adhering agent layer comprises peroxide curing type silicone system sticker and the initiator being made up of peroxide.
4. cutting adhesive tape as claimed in claim 3, it is characterised in that
Relative to described peroxide curing type silicone system sticker 100 weight portion, the content of described initiator is the scope of 0.01 weight portion～15 weight portion.
5. cutting adhesive tape as claimed in claim 1 or 2, it is characterised in that
Described adhering agent layer comprises addition reaction-type silicon-type sticker, cross-linking agent and catalyst.
6. cutting adhesive tape as claimed in claim 5, it is characterised in that
Relative to described addition reaction-type silicon-type sticker 100 weight portion, the content of described cross-linking agent is the scope of 0.05 weight portion～10 weight portion.
7. a manufacture method for semiconductor chip, comprises:
Coating operation, covers the plurality of semiconductor element of the device substrate being formed with multiple semiconductor element on substrate with organic siliconresin；
Attach operation, from described organic siliconresin side, described device substrate is attached the adhesive tape of the adhering agent layer possessing base material and comprise curing type silicone system sticker and firming agent；
Cut off operation, the described device substrate being pasted with described adhesive tape is cut into multiple semiconductor chip；And
Stripping process, peels described adhesive tape off from the plurality of semiconductor chip.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014-263574 | 2014-12-25 | ||
| JP2014263574A JP6395597B2 (en) | 2014-12-25 | 2014-12-25 | Dicing adhesive tape and semiconductor chip manufacturing method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105733462A true CN105733462A (en) | 2016-07-06 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510977427.1A Withdrawn CN105733462A (en) | 2014-12-25 | 2015-12-23 | Adhesive tape for dicing and method of manufacturing semiconductor chip |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP6395597B2 (en) |
| KR (1) | KR102440961B1 (en) |
| CN (1) | CN105733462A (en) |
| TW (1) | TWI655682B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112602172A (en) * | 2018-09-03 | 2021-04-02 | 麦克赛尔控股株式会社 | Adhesive tape for dicing and method for manufacturing semiconductor chip |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20220116184A (en) | 2019-12-19 | 2022-08-22 | 맥셀 주식회사 | Manufacturing method of adhesive tape for dicing and semiconductor chip |
| CN114868229A (en) * | 2019-12-20 | 2022-08-05 | 麦克赛尔株式会社 | Adhesive tape for dicing and method for manufacturing semiconductor chip |
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| CN103421433A (en) * | 2012-05-14 | 2013-12-04 | 日立麦克赛尔株式会社 | Adhesive tape used in plastic lens forming, and plastic lens forming method |
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| JP5718005B2 (en) * | 2010-09-14 | 2015-05-13 | 日東電工株式会社 | A heat-resistant adhesive tape for manufacturing a semiconductor device and a method for manufacturing a semiconductor device using the tape. |
| JP2012119395A (en) * | 2010-11-29 | 2012-06-21 | Furukawa Electric Co Ltd:The | Adhesive tape for semiconductor device dicing and manufacturing method of semiconductor device chip |
| JP2012151761A (en) * | 2011-01-20 | 2012-08-09 | Nitto Denko Corp | Surface protection adhesive tape for solid-state imaging device |
| JP2012169573A (en) * | 2011-02-17 | 2012-09-06 | Furukawa Electric Co Ltd:The | Dicing die bond sheet and processing method of sapphire substrate for led |
| JP2013038408A (en) | 2011-07-14 | 2013-02-21 | Nitto Denko Corp | Adhesive tape for fixing semiconductor wafer, method for manufacturing semiconductor chip and adhesive tape with adhesive film |
| JP6150415B2 (en) * | 2011-09-27 | 2017-06-21 | 日本化薬株式会社 | Curable resin composition and cured product thereof |
| JP6222941B2 (en) * | 2013-02-21 | 2017-11-01 | 日東電工株式会社 | Underfill sheet, back-grinding tape-integrated underfill sheet, dicing tape-integrated underfill sheet, and semiconductor device manufacturing method |
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2014
- 2014-12-25 JP JP2014263574A patent/JP6395597B2/en active Active
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2015
- 2015-11-25 TW TW104139182A patent/TWI655682B/en active
- 2015-12-23 CN CN201510977427.1A patent/CN105733462A/en not_active Withdrawn
- 2015-12-23 KR KR1020150184810A patent/KR102440961B1/en active IP Right Grant
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|---|---|---|---|---|
| CN101821350A (en) * | 2007-08-27 | 2010-09-01 | 琳得科株式会社 | Restripping-type adhesive sheet and method of protecting incomplete cured coating |
| CN103421433A (en) * | 2012-05-14 | 2013-12-04 | 日立麦克赛尔株式会社 | Adhesive tape used in plastic lens forming, and plastic lens forming method |
| JP2014129508A (en) * | 2012-11-30 | 2014-07-10 | Hitachi Maxell Ltd | Tacky tape for molding a plastic lens and method for molding a plastic lens molding |
| CN104419341A (en) * | 2013-08-30 | 2015-03-18 | 日立麦克赛尔株式会社 | Adhesive tape for dicing and method for manufacturing semiconductor chips |
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| CN112602172A (en) * | 2018-09-03 | 2021-04-02 | 麦克赛尔控股株式会社 | Adhesive tape for dicing and method for manufacturing semiconductor chip |
Also Published As
| Publication number | Publication date |
|---|---|
| KR102440961B1 (en) | 2022-09-07 |
| JP2016122812A (en) | 2016-07-07 |
| JP6395597B2 (en) | 2018-09-26 |
| TWI655682B (en) | 2019-04-01 |
| TW201635356A (en) | 2016-10-01 |
| KR20160078908A (en) | 2016-07-05 |
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Address after: Kyoto Japan Applicant after: Mike SEIR Holdings Co., Ltd. Address before: Osaka Japan Applicant before: Hitachi Maxell, Ltd. |
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Application publication date: 20160706 |