JP2012119395A - Adhesive tape for semiconductor device dicing and manufacturing method of semiconductor device chip - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an adhesive tape for semiconductor device dicing in which attachment of fibrous cut wastes during a dicing process is reduced and adherence of an adhesive is also reduced in a part around a semiconductor device laser mark, and a manufacturing method of a semiconductor device chip using the adhesive tape.SOLUTION: The present invention relates to an adhesive tape 100 for semiconductor device dicing in which an adhesive layer 20 is formed on a base material resin film 10. Resin composition constituting the base material resin film 10 contacting the adhesive layer 20 has a base resin component of an ethylene vinyl acetate copolymer which has melt flow rate of 1 to 20 as well as weight average molecular weight of 150000 to 600000.

Description

  The present invention relates to a semiconductor device dicing pressure-sensitive adhesive tape used in a semiconductor device dicing step for cutting and separating a semiconductor device into small pieces and a method for manufacturing a semiconductor device chip using the same. In this specification, a semiconductor device includes both a semiconductor device wafer and a semiconductor device collective mold sealing package.

  In performing so-called wafer dicing, in which a semiconductor device wafer on which a circuit pattern is formed is separated into chips, a method of fixing a semiconductor device wafer on a dicing adhesive tape and picking it up has been proposed. In this method, the semiconductor device wafer is diced into a chip shape in a state of being stuck and fixed to a wafer dicing adhesive tape before being transferred to the mounting process. Thereafter, the obtained semiconductor device wafer chip is washed and dried, and then picked up and packaged by sealing with a cured resin to obtain a semiconductor device package.

  Conventionally, a method of sealing separately after manufacturing a semiconductor device wafer chip in the above process has been used. 2. Description of the Related Art In recent years, collective mold sealing package dicing has been performed in which a plurality of semiconductor device wafer chips bonded on a single substrate are collectively sealed with a curable resin to obtain individual semiconductor devices by package dicing.

The sealing resin layer made of a cured resin in the batch sealing method is subjected to a laser beam to perform a marking process such as a product lot number or a manufacturer's logo mark. In this method, a slight groove is formed on the surface of the sealing resin layer by a laser beam, and a small amount of ash or debris made of a sealing resin modified and colored by the energy of the laser beam is further deposited on the surface of the groove. This is a method of laser marking. However, the conventional adhesive tape for package dicing is stuck on the resin surface, and when the semiconductor device is picked up after package dicing, the adhesive of the adhesive tape adheres to the stamped portion, which reduces the yield of the semiconductor device. There was a thing.
Thus, an adhesive tape for semiconductor package dicing has been proposed in which an energy ray curable adhesive is used for the adhesive layer and the storage elastic modulus of the adhesive layer before energy ray curing is a specific value or more (for example, a patent) Reference 1). However, the pressure-sensitive adhesive tape described in Patent Document 1 is not sufficient for reducing the adhesion of the pressure-sensitive adhesive.

On the other hand, in the dicing process, a dicing blade (hereinafter referred to as a blade) that is a rotary blade is cut into a part of the base resin film of the adhesive tape for semiconductor device wafer dicing or the adhesive tape for semiconductor device package dicing. For this reason, in addition to the semiconductor device wafer or semiconductor device package cutting waste, thread-like beard-like cutting waste is generated by melting and stretching the base resin film of the adhesive tape during cutting, and this cutting waste is generated on the surface of the semiconductor device. Often remains on the uneven surface. In particular, when dicing a package that is collectively sealed, a dicing blade with a thickness of about 0.1 to 0.5 mm is used, so that the dicing blade has a thickness of about 0.02 to 0.1 mm. Compared with the case of dicing a semiconductor device wafer that uses swarf, particularly bearded chips are likely to be generated.
In recent years, there has been an increasing demand for downsizing semiconductor device packages. For this reason, it is necessary to narrow the dicing cutting scheduled line and thin the dicing blade. In this case, the dicing blade is hardened to prevent blade breakage due to excessive cutting load on the dicing blade in the dicing process. For this reason, the self-blade function by the self-abrasion of a dicing blade falls, and there exists a tendency for a beard-like cutting waste to increase. In general, since the dicing blade activates the self-blade function by self-wearing to produce cutting performance, conversely, if the self-wearing is made too active, the life of the blade is shortened. For this reason, blades with reduced machinability and increased wear resistance are also on the market. In this case, beard-like cutting waste is more likely to be generated.

  In Patent Document 2, as a base film resin on the pressure-sensitive adhesive side, a terpolymer having ethylene, (meth) acrylic acid, and (meth) acrylic acid alkyl ester as a polymer component is cross-linked with a metal ion. An adhesive tape for semiconductor wafer dicing using an ionomer resin has been proposed. In the pressure-sensitive adhesive tape described in Patent Document 2, the carboxyl group is consumed for metal cross-linking by ionomerization, whereby the adhesion between the base resin film and the pressure-sensitive adhesive layer is reduced, and the pressure-sensitive adhesive adheres to the semiconductor device laser mark portion. However, this is not sufficient for use in semiconductor device package dicing.

JP 2005-277297 A Japanese Patent No. 3845129

  The present invention relates to a pressure-sensitive adhesive tape for semiconductor device package dicing in which adhesion of bearded cutting waste in a dicing process is reduced, and adhesion of adhesive is reduced in a portion centering on a semiconductor device laser mark, and a semiconductor device package chip using the same It is an object to provide a manufacturing method.

The present inventors use, as a base resin component, an ethylene-vinyl acetate copolymer having a weight average molecular weight and a melt flow rate of a base resin film in contact with an adhesive layer of an adhesive tape for semiconductor device dicing within a specific range. Thus, it has been found that the adhesion of the adhesive can be remarkably reduced in the portion centering on the semiconductor device laser mark.
Furthermore, the present inventors use the ethylene-vinyl acetate copolymer having a weight average molecular weight and a melt flow rate of the base resin film in contact with the pressure-sensitive adhesive layer within a specific range as a base resin component, thereby attaching the pressure-sensitive adhesive. In addition to reducing the amount of heat generated, it is possible to reduce the generation of molten material due to cutting resistance heat between the blade and the workpiece in the dicing process. It has been found that beard-like cutting scraps are difficult to adhere to.
The present invention has been made based on this finding.

That is, the present invention provides the following semiconductor device dicing pressure-sensitive adhesive tape and a method for producing a semiconductor device chip using the same.
<1> A semiconductor device dicing pressure-sensitive adhesive tape having a pressure-sensitive adhesive layer formed on a base resin film, wherein the resin composition constituting the base resin film in contact with the pressure-sensitive adhesive layer has a melt flow rate of 1 to 1. A pressure-sensitive adhesive tape for semiconductor device dicing, comprising an ethylene-vinyl acetate copolymer having a weight average molecular weight of 150,000 to 600,000 as a base resin component.
<2> The adhesive tape for dicing a semiconductor device according to <1>, wherein the ethylene-vinyl acetate copolymer has a vinyl acetate content of 5 to 50%.
<3> The base resin film is composed of at least three resin films, and the bending elastic modulus of the layer sandwiched between the outermost layer of the resin film and the resin film in contact with the adhesive layer is a group in contact with the adhesive layer. The adhesive tape for semiconductor device dicing according to <1> or <2>, wherein the adhesive tape has a flexural modulus greater than that of the material resin film layer.
<4> The resin composition constituting the layer sandwiched between the outermost layer of the resin film and the resin film in contact with the pressure-sensitive adhesive layer is selected from the group consisting of polypropylene, high-density polyethylene, low-density polyethylene, and olefin-based thermoplastic elastomer. The pressure-sensitive adhesive tape for dicing a semiconductor device according to <3>, comprising at least one selected.
<5> The adhesive tape for semiconductor device dicing according to any one of <1> to <4>, wherein the adhesive constituting the adhesive layer is radiation curable.
<6> A semiconductor device dicing pressure-sensitive adhesive tape having a pressure-sensitive adhesive layer formed on a base resin film, wherein the resin composition constituting the base resin film in contact with the pressure-sensitive adhesive layer has a melt flow rate of 1 to 1. A semiconductor device dicing adhesive tape having an ethylene-vinyl acetate copolymer having a weight average molecular weight of 150,000 to 600,000 as a base resin component is affixed to a semiconductor device wafer or a semiconductor device batch mold sealing package mold resin surface. A method of manufacturing a semiconductor device chip, comprising manufacturing a semiconductor device chip by a method including a step of performing dicing.

By using the pressure-sensitive adhesive tape for semiconductor device dicing according to the present invention, it is possible to reduce the adhesion of the shavings in the dicing process, to reduce the pressure-sensitive adhesive adhesion to the semiconductor device chip, and to greatly improve the appearance yield of the product. Can be made.
In addition, the semiconductor device dicing method may include a step of dicing the adhesive tape for semiconductor device dicing of the present invention to a semiconductor device wafer encapsulated with a resin composition or a semiconductor device encapsulated mold sealing package mold resin surface. By the method for manufacturing the chip, the adhesion of the beard-like cutting waste can be reduced, and the adhesion of the adhesive to the semiconductor device chip can be reduced.

It is sectional drawing which shows typically one Embodiment of the adhesive tape for semiconductor device dicing of this invention. It is sectional drawing which shows typically other one Embodiment of the adhesive tape for semiconductor device dicing of this invention. It is sectional drawing which shows typically another one Embodiment of the adhesive tape for semiconductor device dicing of this invention.

The present invention will be described with reference to the drawings. FIG. 1 schematically shows a preferred embodiment of the pressure-sensitive adhesive tape for semiconductor device dicing according to the present invention. In the adhesive tape 100 for semiconductor device dicing, a base resin film 10 and an adhesive layer 20 are formed on the base resin film 10.
FIG. 2 schematically shows another preferred embodiment of the pressure-sensitive adhesive tape for semiconductor device dicing of the present invention. In the adhesive tape 100 for semiconductor device dicing, the base resin film 10 is composed of the outermost resin film layer 1 and the resin film layer 2 in contact with the adhesive layer, and the adhesive layer 20 is formed on the base resin film 10. ing.
Further, FIG. 3 schematically shows another preferred embodiment of the pressure-sensitive adhesive tape for semiconductor device dicing of the present invention. In the semiconductor device dicing adhesive tape 100, the base resin film 10 is in contact with the outermost resin film layer 1, the resin film layer 2 sandwiched between the outermost resin film and the resin film in contact with the adhesive layer, and the adhesive layer. The pressure-sensitive adhesive layer 20 is formed on the base resin film 10.

1. Base resin film The resin composition constituting the base resin film in contact with the adhesive layer of the adhesive tape for semiconductor device dicing of the present invention has a melt flow rate of 1 to 20 and a weight average molecular weight of 150,000 to 600,000. An ethylene-vinyl acetate copolymer is used as a base resin component. In the present invention, the melt flow rate (hereinafter also referred to as MFR) refers to a value defined by JIS K 7210 under a 190 ° C., 2.16 kg load condition. Moreover, the weight average molecular weight of the resin composition which comprises the base resin film which touches the adhesive layer in this invention shall say the value calculated | required with the following method.
(Device used)
Measuring device: Gel permeation chromatograph (Waters 150-C type)
Analysis device: System controller (SC-8010 manufactured by Tosoh Corporation)
Detector: differential refractometer (measurement conditions)
Column: TSKgel GMH6-HT × 1 + TSKgel GMH6-HTL × 1 (7.8 mm ID × 60 mmL, manufactured by Tosoh Corporation)
Mobile phase: o-dichlorobenzene (hereinafter abbreviated as ODCB)
Mobile phase stabilizer: 2,6-di-tert-butyl-p-cresol (5 g / 20 kg-ODCB)
Column temperature: 140 ° C
Flow rate: 1.0 ml / min
Injection volume: 500 μl
Measurement sample concentration: 30 mg / 20 ml-ODCB
Standard sample concentration: 15 mg / 20 ml-ODCB
Molecular weight calibration: 16 types of monodisperse polystyrene (manufactured by Tosoh Corporation)
By using an ethylene-vinyl acetate copolymer having a melt flow rate and a weight average molecular weight of the resin composition constituting the base resin film in contact with the pressure-sensitive adhesive layer as the base resin component, adhesion of the pressure-sensitive adhesive is achieved. It can be remarkably reduced, and whisker-like cutting waste can be reduced, and even if cutting waste is generated, the cutting waste can be easily cut.

The base resin film uses the above-described melt flow rate and ethylene-vinyl acetate copolymer having a weight average molecular weight within the above range as a base resin component, and has a heat resistance against cutting of a batch mold sealed package with a blade in a dicing process. If it is excellent in property, there is no restriction | limiting in particular, What can be shape | molded in sheet form, such as other resin and rubber | gum, may be used together. For example, polypropylene, low density polyethylene (LDPE), linear low density polyethylene (LLDPE), ethylene / propylene copolymer, propylene copolymer, ethylene-propylene-diene copolymer vulcanizate, polybutene, polybutadiene, polymethyl Pentene, ethylene- (meth) acrylic acid copolymer, ethylene- (meth) methyl acrylate copolymer, ethylene- (meth) ethyl acrylate copolymer, ethylene- (meth) butyl acrylate copolymer, poly Vinyl chloride, vinyl chloride-vinyl acetate copolymer, ethylene-vinyl chloride-vinyl acetate copolymer, polyurethane, polyamide, ionomer, nitrile rubber, butyl rubber, styrene isoprene rubber, styrene butadiene rubber, natural rubber and its water additive or Denatured products etc. It may be a resin composition in combination with vinyl acetate copolymer - Len.
However, the adhesion of the adhesive to the laser mark portion requires a high level that cannot be compared with conventional adhesive tapes for semiconductor wafer dicing, so the ethylene-vinyl acetate copolymer has a resin composition. Of these, it is preferable to use only an ethylene-vinyl acetate copolymer having a melt flow rate and a weight average molecular weight within the above ranges, preferably 50 to 100% by mass.

As a resin composition that constitutes the base resin film in contact with the adhesive layer, the adhesion between the base resin film and the adhesive is increased, and the peeling of the adhesive to the laser mark portion formed on the semiconductor device chip is reduced. Therefore, a resin composition having an ethylene-vinyl acetate copolymer as a base resin component is used.
When an ethylene- (meth) acrylic acid alkyl ester copolymer is used as the base resin component of the resin composition constituting the base resin film in contact with the pressure-sensitive adhesive layer, the resin composition has a melt flow rate of 1. Even when a material having a weight average molecular weight of 150,000 to 600,000 is used, the adhesive strength with the pressure-sensitive adhesive layer is not sufficient, and the problem of adhesion of the pressure-sensitive adhesive to the laser mark portion arises. Even if it can be used for the adhesive tape for wafer dicing, it cannot be used for the adhesive tape for semiconductor device dicing of the present invention. This is because the adhesiveness to the laser mark portion is required to have high peelability that cannot be compared with the conventional adhesive tape for semiconductor wafer dicing.
In contrast, by using an ethylene-vinyl acetate copolymer as the base resin component of the resin composition constituting the base resin film in contact with the pressure-sensitive adhesive layer, the adhesion with the pressure-sensitive adhesive layer is further improved, and laser An excellent pressure-sensitive adhesive tape for semiconductor device dicing in which no adhesive is attached to the mark portion can be provided. Furthermore, since ethylene-vinyl acetate copolymers of various varieties can be easily obtained and have excellent adhesiveness with adhesives, they can be suitably used for adhesive tapes for semiconductor device dicing.
As shown in FIG. 3 to be described later, the base resin film 10 is composed of at least three resin films, and the resin composition constituting the resin film layer 2 contains polypropylene, high-density polyethylene, low-density polyethylene, or the like. In this case, when the above-mentioned ethylene-vinyl acetate copolymer is used as the layer 3 in contact with the pressure-sensitive adhesive layer, the adhesion to the pressure-sensitive adhesive layer is particularly excellent, and the adhesion of the pressure-sensitive adhesive to the laser mark portion is significantly reduced. can do.

  When an ethylene-vinyl acetate copolymer is used as the resin composition constituting the base resin film in contact with the pressure-sensitive adhesive layer, it is preferable to use one having a vinyl acetate content of 5 to 50%. By using an ethylene-vinyl acetate copolymer having a vinyl acetate content within this range, the adhesiveness to the adhesive layer can be particularly improved, and the adhesive to the laser mark portion formed on the semiconductor device package chip Can be particularly reduced. The vinyl acetate content when the resin composition constituting the base resin film is an ethylene-vinyl acetate copolymer can be determined according to JIS K 6730.

The base resin film may be a single layer as shown in FIG. 1, or may be a multilayer (two or more layers) as shown in FIGS. When the base resin film is composed of a single layer as shown in FIG. 1, the base resin component is made of the ethylene-vinyl acetate copolymer having the above melt flow rate and the weight average molecular weight. It shall be used as
When the base resin film is composed of multiple layers as shown in FIG. 2, at least the resin film layer 2 of the base resin film 10 is ethylene-acetic acid having the above melt flow rate and weight average molecular weight. A vinyl copolymer is used as the base resin component. Moreover, as shown in FIG. 3, the adhesive tape for semiconductor device dicing of the present invention comprises an outermost resin film layer 1, a resin film layer 2 sandwiched between an outermost resin film and a resin film in contact with the adhesive layer, and The adhesive layer 20 may be formed on the base resin film 10 on which the resin film layer 3 in contact with the adhesive layer is laminated. Further, the base resin film may be a laminate of four or more layers. When the base resin film is composed of two or more layers, it is necessary to use an ethylene-vinyl acetate copolymer having the above melt flow rate and weight average molecular weight as the base resin component for the resin film in contact with the pressure-sensitive adhesive layer. In this case, a film having a melt flow rate and a weight average molecular weight other than the layer in contact with the pressure-sensitive adhesive layer may be used. When the base resin film is composed of two or more layers, it is preferable to combine those having good interlayer adhesion between the base resin films.

  As shown in FIG. 3, when the base resin film 10 is composed of at least three resin films, the bending elastic modulus of the layer 2 sandwiched between the outermost layer 1 of the resin film and the resin film 3 in contact with the adhesive layer Is preferably larger than the flexural modulus of the resin film layer 3 in contact with the pressure-sensitive adhesive layer. Accordingly, the rotating round blade can easily enter from the back surface of the tape, and the cutting property of the roll tape can be improved when the semiconductor device dicing tape is bonded to the semiconductor device. Among these, it is preferable that the resin composition which comprises the resin film layer 2 contains at least 1 sort (s) chosen from the group which consists of a polypropylene, a high density polyethylene, a low density polyethylene, and an olefin type thermoplastic elastomer. Thereby, it can withstand the heat of cutting during dicing, and when a radiation curable resin composition is used as the pressure-sensitive adhesive layer, it generates heat in the process of curing the pressure-sensitive adhesive layer by irradiating radiation, for example, ultraviolet rays. It can be a tolerable tape.

In order to further improve the adhesion, the layer constituting the base resin film in contact with the pressure-sensitive adhesive layer may be subjected to a corona treatment or a treatment such as a primer.
Since the blade outer peripheral section used at the time of dicing has an R shape, a dicing tape is used more smoothly when a blade having a thicker blade is used to smooth the cutting surface of the dicing blade, which is the side of the semiconductor device. It is necessary to cut deeply. For this reason, it is necessary to increase the thickness of the base resin film as the blade blade thickness is increased. Therefore, the thickness of the base resin film is preferably at least 30% of the thickness of the blade used for dicing. On the other hand, if the base resin film becomes too thick, the rigidity of the pressure-sensitive adhesive tape for semiconductor device package dicing increases, and workability may deteriorate.
Since a blade with a blade thickness of about 50 to 400 μm is used as the blade for mold resin batch sealing package dicing, the thickness of the base resin film of the adhesive tape for semiconductor device package dicing of the present invention is preferably 30 to It is 300 micrometers, More preferably, it is 50-250 micrometers.

  Various pressure-sensitive adhesives can be used for the pressure-sensitive adhesive layer. The pressure-sensitive adhesive is not limited at all. For example, as the base resin, a material using rubber, acrylic, silicone, polyvinyl ether or the like is used as the adhesive.

  In order to add cohesive force to these base resins, a crosslinking agent can be blended. Examples of the crosslinking agent include an isocyanate-based crosslinking agent, an epoxy-based crosslinking agent, a metal chelate-based crosslinking agent, an aziridine-based crosslinking agent, and an amine resin corresponding to the base resin. Further, the pressure-sensitive adhesive can contain various additive components as desired within the range in which the object of the present invention is not impaired.

As the pressure-sensitive adhesive, a radiation curable or heat-foamed pressure-sensitive adhesive can be used. As the radiation curable adhesive, it is possible to use an adhesive that is cured by ultraviolet rays, electron beams, etc., and easily peels off at the time of peeling. An adhesive that easily peels can be used. As the radiation curable pressure-sensitive adhesive, for example, those described in JP-A-7-135189 are preferably used, but are not limited thereto. In the present invention, it is preferable to use an ultraviolet curable adhesive. In that case, it only needs to have a property of being cured by radiation to form a three-dimensional network, and as a base resin component, a functional group having a main chain, a radiation-curable carbon-carbon double bond-containing group and a functional group. Those having as a main component the polymer (a) in which the functional group part of the monomer having both is bonded can be used. In the present invention, the polymer (a) as a main component means that the content in the base resin is 50 to 100% by mass. In the present invention, the (meth) acrylic monomer includes both an acrylic monomer and a methacrylic monomer.
The polymer (a) may be produced by any method. For example, an acrylic copolymer and / or a methacrylic copolymer having a functional group is defined as (a1), and a functional group that has a radiation-curable carbon-carbon double bond and can react with the functional group of (a1) The compound having (a2) can be reacted to give a polymer (a).
The acrylic copolymer and / or methacrylic copolymer (a1) having the above functional group is, for example, a monomer such as an alkyl acrylate and / or an alkyl methacrylate having a carbon-carbon double bond. It can be obtained by copolymerizing (a1-1) and a monomer (a1-2) having a functional group and a carbon-carbon double bond.

  Examples of the monomer (a1-1) include (meth) acrylic acid alkyl esters having 6 to 12 carbon atoms in the alkyl ester alkyl group (for example, hexyl acrylate, n-octyl acrylate, isooctyl acrylate, 2- Ethyl hexyl acrylate, dodecyl acrylate, decyl acrylate). Examples of the monomer (a1-1) include (meth) acrylic acid alkyl esters having 5 or less carbon atoms in the alkyl ester alkyl group (for example, pentyl acrylate, n-butyl acrylate, isobutyl acrylate, ethyl acrylate). , Methyl acrylate, or methacrylates similar to these).

A polymer (a) having a desired glass transition point can be obtained by appropriately selecting an alkyl ester as the monomer (a1-1).
In addition to the glass transition point, a low molecular compound having a carbon-carbon double bond such as vinyl acetate, styrene or acrylonitrile is added to (a1-1) for the purpose of improving compatibility with other components and various performances. A polymer (a) can be obtained. The blending amount of these low molecular compounds is preferably 5% by mass or less of the monomer (a1-1).

  Examples of the functional group that the monomer (a1-2) has include a carboxyl group, a hydroxyl group, an amino group, a cyclic acid anhydride group, an epoxy group, and an isocyanate group. Specific examples of the monomer (a1-2) include, for example, acrylic acid, methacrylic acid, cinnamic acid, itaconic acid, fumaric acid, phthalic acid, 2-hydroxyalkyl acrylates, 2-hydroxyalkyl methacrylates, 4-hydroxyalkyl acrylates, 4-hydroxyalkyl methacrylates, glycol monoacrylates, glycol monomethacrylates, N-methylolacrylamide, N-methylolmethacrylamide, allyl alcohol, N-alkylaminoethyl acrylates, N-alkylamino Ethyl methacrylates, acrylamides, methacrylamides, maleic anhydride, itaconic anhydride, fumaric anhydride, phthalic anhydride, glycidyl acrylate, glycidyl methacrylate, allyl glycidyl ether The portion of the isocyanate groups of the polyisocyanate compound a hydroxyl group or a carboxyl group and a radiation-curable carbon - can enumerate such as those urethanization a monomer having a carbon-carbon double bond.

When the functional group (a2) is a carboxyl group or a cyclic acid anhydride group, examples of the functional group (a1) include a hydroxyl group, an epoxy group, and an isocyanate group. When the functional group (a2) is a hydroxyl group, examples of the functional group (a1) include a cyclic acid anhydride group and an isocyanate group. When the functional group (a2) is an amino group, examples of the functional group (a1) include an epoxy group and an isocyanate group. When the functional group of (a2) is an epoxy group, examples of the functional group of (a1) include a carboxyl group, a cyclic acid anhydride group, and an amino group.
As specific examples, those similar to those listed in the specific examples of the monomer (a1-2) can be listed.

In the reaction of (a1) and (a2), by leaving an unreacted functional group, the acid value or the hydroxyl value can be suitably set within a range as described later.
The polymer (a) containing as a constituent unit a (meth) acrylic monomer having one or more radiation-curable carbon-carbon double bond-containing groups with respect to the main chain should be solution-polymerized in various solvents. Can be obtained. As the organic solvent in the case of solution polymerization, a ketone, ester, alcohol, or aromatic solvent can be used. In general, it is preferable to use a solvent having a boiling point of 60 to 120 ° C. as a good solvent for an acrylic polymer. For example, toluene, ethyl acetate, isopropyl alcohol, benzene, methyl cellosolve, ethyl cellosolve, acetone, methyl ethyl ketone, and the like can be used. As the polymerization initiator, radical generators such as azobis compounds such as α, α′-azobisisobutylnitrile and organic peroxide compounds such as benzoyl peroxide can be used. At this time, if necessary, a catalyst and a polymerization inhibitor can be used in combination, and the polymer (a) having a desired molecular weight can be obtained by adjusting the polymerization temperature and the polymerization time. In terms of adjusting the molecular weight, it is preferable to use a mercaptan or carbon tetrachloride solvent. The synthesis of the polymer (a) is not limited to solution polymerization, and other methods such as bulk polymerization and suspension polymerization may be used.

  In the present invention, the polymer (a) in which a residue having a (meth) acrylic monomer portion having one or more radiation-curable carbon-carbon double bond-containing groups to the repeating unit of the main chain is bonded. The weight average molecular weight is preferably about 100,000 to 1,000,000. If the weight average molecular weight is too small, the cohesive force is reduced, and when the wafer is diced, the device is likely to be displaced, and image recognition may be difficult. In order to prevent this element shift as much as possible, the molecular weight is preferably 200,000 or more. If the weight average molecular weight is too large, gelation may occur during synthesis.

When the hydroxyl value of the polymer (a) is 5 to 100, it is preferable because the risk of pick-up mistakes can be further reduced by reducing the adhesive strength after radiation irradiation. Moreover, it is preferable that the acid value of a polymer (a) will be 0.5-30. Here, the hydroxyl value refers to the value measured by the pyridine-acetyl chloride method described in JIS K 0070, and the acid value refers to the value measured by the neutralization titration method described in JIS K 0070. By setting the hydroxyl value of the polymer (a) within an appropriate range, the fluidity of the pressure-sensitive adhesive layer after irradiation can be set within an appropriate range, and the adhesive strength after irradiation is sufficiently reduced. be able to. By setting the acid value of the polymer (a) within an appropriate range, the fluidity of the pressure-sensitive adhesive layer after irradiation can be set within an appropriate range, and the tape recoverability can be satisfied.
The base resin component used in the radiation curable resin composition constituting the pressure-sensitive adhesive layer of the present invention may be blended with conventional ones as long as the gist of the present invention is not impaired. For example, natural rubber, rubber-based polymers such as various synthetic rubbers, or poly (meth) acrylic acid alkyl ester, (meth) acrylic acid alkyl ester, (meth) acrylic acid alkyl ester and other non-polymerizable copolymers thereof. Acrylic copolymers such as copolymers with saturated monomers can be used.

In addition, a resin composition constituting the pressure-sensitive adhesive layer by blending a compound having at least two photopolymerizable carbon-carbon double bonds in the molecule with an ordinary rubber-based or acrylic pressure-sensitive base resin The object can be made radiation curable. The compound having at least two photopolymerizable carbon-carbon double bonds in the molecule of the present invention can be used without particular limitation as long as it is cured by irradiation with radiation to form a three-dimensional network. The molecular weight of the compound is preferably a weight average molecular weight of 10,000 or less. The molecular weight is 5,000 or less and the number of radiation-polymerizable carbon-carbon double bonds in the molecule is 2 to 6 so that the three-dimensional network of the pressure-sensitive adhesive layer can be efficiently formed by radiation irradiation. Those are preferred.
Examples of radiation-polymerizable compounds include trimethylolpropane triacrylate, tetramethylolmethane tetraacrylate, pentaerythritol triacrylate, pentaerythritol tetraacrylate, dipentaerythritol monohydroxypentaacrylate, dipentaerythritol hexaacrylate, 1,4-butylene. Examples include glycol diacrylate, 1,6-hexanediol diacrylate, polyethylene glycol diacrylate, organopolysiloxane composition, commercially available oligoester acrylate, and urethane acrylate.

  The low molecular weight compound having at least two photopolymerizable carbon-carbon double bonds in the molecule may be used alone or in combination of two or more. A compounding quantity is 1-300 mass parts with respect to 100 mass parts of base resins. Preferably, it is 30-200 mass parts with respect to 100 mass parts of base resin, More preferably, it is 50-150 mass parts. If the amount is too small, three-dimensional reticulation of the pressure-sensitive adhesive layer by irradiation with radiation becomes insufficient, and it becomes difficult to peel the pressure-sensitive adhesive tape for semiconductor device package dicing from the semiconductor device package, which may contaminate the package. If this amount is too large, the polymerization reaction due to radiation proceeds excessively and curing shrinkage due to radiation irradiation occurs. As a result, the pressure-sensitive adhesive layer follows the surface of the adherend and becomes difficult to pick up when picking up the semiconductor chip after dicing. Moreover, when there is too much quantity of a radiation polymerizable compound, there exists a problem that it becomes difficult to hold | maintain the shape of an adhesive layer and thickness accuracy worsens.

  The initial adhesive force can be set to an arbitrary value by mixing an isocyanate curing agent with the resin composition constituting the pressure-sensitive adhesive. Specific examples of such a curing agent include polyvalent isocyanate compounds such as 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate, 1,3-xylylene diisocyanate, 1,4-xylene diisocyanate, diphenylmethane. -4,4'-diisocyanate, diphenylmethane-2,4'-diisocyanate, 3-methyldiphenylmethane diisocyanate, hexamethylene diisocyanate, isophorone diisocyanate, dicyclohexylmethane-4,4'-diisocyanate, dicyclohexylmethane-2,4'-diisocyanate, Lysine isocyanate and the like are used.

In the case of a radiation curable pressure-sensitive adhesive, by mixing a photopolymerization initiator in the pressure-sensitive adhesive, it is possible to reduce the polymerization curing time and the amount of radiation irradiation by radiation irradiation.
Specific examples of such a photopolymerization initiator include benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzyl diphenyl sulfide, tetramethyl thiuram monosulfide, azobisisobutyronitrile, dibenzyl, diacetyl, β-chloranthraquinone and the like can be mentioned.

  Although the thickness in particular of an adhesive layer is not restrict | limited, Preferably it is 4-100 micrometers, Most preferably, it is 5-40 micrometers. Although the thickness of the pressure-sensitive adhesive layer depends on the composition, if the thickness is too thin, the adhesiveness to the semiconductor device package will be insufficient, the yield will decrease due to die fly during dicing, and the scattered die will hit the blade. Blade damage may occur. If the thickness of the pressure-sensitive adhesive layer is too thin, the pressure-sensitive adhesive layer is lifted up by rotating the blade during dicing, and peeling failure from the semiconductor device may occur in the pickup process.

  A semiconductor chip can be manufactured by bonding the package surface of the batch mold sealing package to the adhesive tape for semiconductor device package dicing of the present invention and performing dicing.

  EXAMPLES Hereinafter, although this invention is demonstrated further in detail based on an Example, this invention is not limited to these Examples. In addition, the adhesive composition and base-material-constituting resin used in Examples and Comparative Examples are as follows.

(Resin composition A constituting the adhesive)
A compound having a photopolymerizable carbon-carbon double bond and a functional group on an acrylic copolymer comprising butyl acrylate (79% by mass), methacrylic acid (1% by mass), and 2-hydroxyethyl acrylate (20% by mass) As an acrylic monomer having a radiation-curable carbon-carbon double bond-containing group with respect to a repeating unit of the main chain by reacting 2-methacryloyloxyethyl isocyanate (Karenz MOI (trade name) manufactured by Showa Denko) The polymer which couple | bonded the residue which has a part was obtained. The weight average molecular weight of the polymer (a) was 600,000. The weight average molecular weight was calculated by converting a 1% solution obtained by dissolving in tetrahydrofuran by gel permeation chromatography (trade name: 150-C ALC / GPC, manufactured by Waters) in terms of polystyrene. It is. The iodine value calculated by the Wijs method was 1.0. 0.5 parts by weight of Coronate L (trade name) manufactured by Nippon Polyurentane Co., Ltd. as a polyisocyanate, and Irgacure 184 (trade name) manufactured by Ciba Geigy Co., Ltd. as a photopolymerization initiator with respect to 100 parts by weight of the polymer (a) Was added and mixed to prepare a radiation-curable pressure-sensitive adhesive resin composition A.

(Resin composition B constituting the adhesive)
A photopolymerizable carbon-carbon double bond is added to 100 parts by mass of an acrylic copolymer composed of butyl acrylate (89% by mass), methacrylic acid (1% by mass), and 2-hydroxyethyl acrylate (10% by mass). 50 parts by mass of pentaerythritol tetraacrylate as the compound having, 0.5 parts by mass of Coronate L (trade name) manufactured by Nippon Polyurethane as the polyisocyanate, and Irgacure 184 (trade name) manufactured by Ciba Geigy Japan as the photopolymerization initiator 0.5 parts by mass was added and mixed to prepare a radiation curable pressure-sensitive adhesive resin composition B.

(Resin composition constituting base resin film)
The following A1 to A8, B1, B2, C1, C2, and D1 to D4 were used as the resin composition constituting the base resin film.
In addition, the melt flow rate of the resin composition which comprises a base resin film was measured on 190 degreeC and a 2.16kg load condition prescribed | regulated by JISK7210. Moreover, the vinyl acetate content in case the resin composition which comprises a base resin film is an ethylene-vinyl acetate copolymer was calculated | required by JISK6730. Further, the weight average molecular weight was determined by the following method.
(Device used)
Measuring device: Gel permeation chromatograph (Waters 150-C type)
Analysis device: System controller (SC-8010 manufactured by Tosoh Corporation)
Detector: differential refractometer (measurement conditions)
Column: TSKgel GMH6-HT × 1 + TSKgel GMH6-HTL × 1 (7.8 mm ID × 60 mmL, manufactured by Tosoh Corporation)
Mobile phase: o-dichlorobenzene (hereinafter abbreviated as ODCB)
Mobile phase stabilizer: 2,6-di-tert-butyl-p-cresol (5 g / 20 kg-ODCB)
Column temperature: 140 ° C
Flow rate: 1.0 ml / min
Injection volume: 500 μl
Measurement sample concentration: 30 mg / 20 ml-ODCB
Standard sample concentration: 15 mg / 20 ml-ODCB
Molecular weight calibration: 16 types of monodisperse polystyrene (manufactured by Tosoh Corporation)

(Resin A1)
An ethylene-vinyl acetate copolymer (melt flow rate 2.5, weight average molecular weight 373,000, flexural modulus 38 MPa) A1 having a vinyl acetate content of 19% by mass was used.
(Resin A2)
An ethylene-vinyl acetate copolymer A2 having a vinyl acetate content of 9% by mass, a melt flow rate of 1.7, a weight average molecular weight of 259,000, and a flexural modulus of 73 MPa was used.
(Resin A3)
An ethylene-vinyl acetate copolymer A3 having a vinyl acetate content of 10% by mass, a melt flow rate of 9, a weight average molecular weight of 189,000, and a flexural modulus of 72 MPa was used.
(Resin A4)
An ethylene-vinyl acetate copolymer A4 having a vinyl acetate content of 28% by mass, a melt flow rate of 15, a weight average molecular weight of 143,000, and a flexural modulus of 14 MPa was used.
(Resin A5)
An ethylene-vinyl acetate copolymer A5 having a vinyl acetate content of 7% by mass, a melt flow rate of 1.5, a weight average molecular weight of 595,000, and a flexural modulus of 91 MPa was used.
(Resin A6)
An ethylene-vinyl acetate copolymer A6 having a vinyl acetate content of 19% by mass, a melt flow rate of 1.5, a weight average molecular weight of 158,000, and a flexural modulus of 39 MPa was used.
(Resin A7)
An ethylene-vinyl acetate copolymer A7 having a vinyl acetate content of 35% by mass, a melt flow rate of 15, a weight average molecular weight of 573,000, and a flexural modulus of 10 MPa was used.
(Resin A8)
An ethylene-vinyl acetate copolymer A8 having a vinyl acetate content of 9% by mass, a melt flow rate of 16, a weight average molecular weight of 186,000, and a flexural modulus of 74 MPa was used.
(Resin B1)
An ethylene-vinyl acetate copolymer B1 having a vinyl acetate content of 10% by mass, a melt flow rate of 3, a weight average molecular weight of 120,000, and a flexural modulus of 80 MPa was used.
(Resin B2)
An ethylene vinyl acetate copolymer B2 having a vinyl acetate content of 19% by mass, a melt flow rate of 2.5, a weight average molecular weight of 88,000, and a flexural modulus of 40 MPa was used.
(Resin C1)
A Zn ionomer resin manufactured by Mitsui DuPont Polychemical Co., Ltd., trade name “HIMILAN 1706” (flexural modulus of 310 MPa) was used.
(Resin C2)
As the resin C2, Zn ionomer resin manufactured by Mitsui DuPont Polychemical Co., Ltd., trade name “Himiran AM7316” (flexural modulus 38 MPa) was used.
(Resin D1)
As the resin D1, polypropylene manufactured by Nippon Polypro Co., Ltd., trade name “Novatech PP FX4E” (flexural modulus 650 MPa) was used.
(Resin D2)
As the resin D2, high-density polyethylene manufactured by Nippon Polyethylene Co., Ltd., trade name “Novatec HD HF560” (flexural modulus 1,050 MPa) was used.
(Resin D3)
As the resin D3, low density polyethylene manufactured by Nippon Polyethylene Co., Ltd., trade name “Novatech LD LF640MA” (flexural modulus 160 MPa) was used.
(Resin D4)
As resin D4, 70% by mass of polypropylene manufactured by Nippon Polypro Co., Ltd., trade name “Novatech PP FX4E”, styrene-hydrogenated isoprene-styrene block copolymer manufactured by Kuraray Co., Ltd., 30% by mass of trade name “Septon KF-2104”, A dry-blended, melt-kneaded resin composition (flexural modulus 240 MPa) was used.

(Examples 1-13, Comparative Examples 1-4)
As shown in Table 2, the thickness of the base resin film of the layer in contact with the adhesive layer is 45 μm, the thickness of the outermost layer of the base resin film is 45 μm, and the thickness of the layers sandwiched between these base resin films Each base resin film of Examples 1 to 13 and Comparative Examples 1 to 4 having a total thickness of 150 μm was produced by extruding the film at about 200 ° C. with a twin-screw kneader so as to be 60 μm.
Apply the above-mentioned pressure-sensitive adhesive to the layer in contact with the pressure-sensitive adhesive layer of each base resin film so that the thickness after drying is 20 μm as shown in the combination of Table 2 to form a pressure-sensitive adhesive layer. And the adhesive tape for package dicing process of Examples 1-13 and Comparative Examples 1-4 was manufactured.

  The adhesive tape for package dicing processing of Examples 1 to 13 and Comparative Examples 1 to 4 is bonded to the ring frame, and a batch sealed package having a width of 50 mm, a length of 150 mm, and a thickness of 500 μm is provided at the center of the ring frame. Fixed. Then, using a dicing apparatus (DISCO, DAD-340 (trade name)), a dicing blade (resin bond blade SDC230-R100IP05 (trade name), 60, manufactured by Mitsubishi Materials Corporation) so that the chip size is 6 mm square. Package dicing was performed by × 0.32 × 40). The dicing conditions were a rotating round blade rotation speed: 30000 rpm, a cutting speed: 100 mm / s, and a cutting water flow rate: blade cooler: 2 L / min, shower: 1 L / min, spray: 1 L / min. Further, dicing was performed so that the depth of the dicing blade cut into the package dicing tape was 100 μm.

The following tests were conducted to evaluate the performance. The results are shown in Table 2.
(Bearded cutting scrap remaining rate)
In Examples 1 to 13 and Comparative Examples 1 to 4, 100 chips were observed after package dicing, and the presence or absence of bearded cutting waste was observed. Table 1 shows the residual ratio of the beard-like cutting waste in which at least one mustache-like cutting waste of 50 μm or more remains per chip. When the residual ratio of the shaving-like cutting waste was 10% or less, it was accepted, and when it exceeded 10%, it was rejected.

(Adhesive adhesion rate)
In Examples 1 to 13 and Comparative Examples 1 to 4, after package dicing, a black light with an illuminance of 4 mW / cm 2 was irradiated with ultraviolet rays with an integrated irradiation amount of 200 mJ / cm 2 to perform pickup. The pickup conditions were CAP-300II manufactured by Canon Machinery Co., Ltd., the tip diameter R was 150 μm, the push-up speed was 50 mm / sec, and the pin push-up height was 1 mm. The 100 chips that were picked up were observed, and the state of adhesion of the adhesive at the laser mark portion was observed. An adhesive adhesion rate was defined as one having at least 10 μm or more of an adhesive adhered to the laser mark portion per chip. Those having an adhesive adhesion rate of 1% or less were accepted and those exceeding 1% were rejected.

As shown in Table 2, in Comparative Examples 1 and 2 in which the weight average molecular weight of the layer in contact with the pressure-sensitive adhesive layer is small, the pressure-sensitive adhesive adhesion rate was an acceptable level of 0%, but the beard-like cutting waste was large. It was not usable as an adhesive tape for semiconductor device dicing. Moreover, in Comparative Examples 3 and 4, although the beard-like cutting waste was at an acceptable level, the adhesive adhesion rate was extremely high. In Comparative Examples 3 and 4, delamination between the base resin film layer and the pressure-sensitive adhesive layer was observed, and the pressure-sensitive adhesive layer adhered to the device and could not be used as a pressure-sensitive adhesive tape for semiconductor device dicing.
On the other hand, the adhesive tapes for semiconductor device package dicing of Examples 1 to 13 exhibited excellent effects with both the residual rate of bearded cutting waste and the adhesive adhesion rate being acceptable levels.

DESCRIPTION OF SYMBOLS 1 Outermost resin film layer 2 Resin film layer pinched | interposed into resin film in contact with outermost resin film and adhesive layer 3 Resin film resin film layer in contact with adhesive layer 10 Base resin film 20 Adhesive layer 100 Semiconductor Device dicing adhesive tape

Claims (6)

  A pressure-sensitive adhesive tape for semiconductor device dicing having a pressure-sensitive adhesive layer formed on a base resin film, wherein the resin composition constituting the base resin film in contact with the pressure-sensitive adhesive layer has a melt flow rate of 1 to 20 and a weight A pressure-sensitive adhesive tape for semiconductor device dicing, comprising an ethylene-vinyl acetate copolymer having an average molecular weight of 150,000 to 600,000 as a base resin component.   The pressure-sensitive adhesive tape for semiconductor device dicing according to claim 1, wherein the ethylene-vinyl acetate copolymer has a vinyl acetate content of 5 to 50%.   The base resin film is composed of at least three resin films, and the flexural modulus of the layer sandwiched between the resin film in contact with the outermost layer and the adhesive layer of the resin film is in contact with the adhesive layer. 3. The pressure-sensitive adhesive tape for semiconductor device dicing according to claim 1, wherein the pressure-sensitive adhesive tape is larger than the bending elastic modulus of the layer.   The resin composition constituting the layer sandwiched between the outermost layer of the resin film and the resin film in contact with the pressure-sensitive adhesive layer was selected from the group consisting of polypropylene, high-density polyethylene, low-density polyethylene, and olefin-based thermoplastic elastomer. The adhesive tape for semiconductor device dicing according to claim 3, comprising at least one kind.   The pressure-sensitive adhesive constituting the pressure-sensitive adhesive layer is radiation curable, and the pressure-sensitive adhesive tape for semiconductor device dicing according to any one of claims 1 to 4.   A pressure-sensitive adhesive tape for semiconductor device dicing in which a pressure-sensitive adhesive layer is formed on a base resin film, wherein the resin composition constituting the base resin film in contact with the pressure-sensitive adhesive layer has a melt flow rate of 1 to 20 and A semiconductor device dicing adhesive tape having an ethylene-vinyl acetate copolymer having a weight average molecular weight of 150,000 to 600,000 as a base resin component is bonded to a semiconductor device wafer or a semiconductor device batch mold sealing package mold resin surface. A method of manufacturing a semiconductor device chip, comprising manufacturing a semiconductor device chip by a method including a step of dicing.

Images