KR20220116184A - Manufacturing method of adhesive tape for dicing and semiconductor chip - Google Patents

Abstract

The pressure-sensitive adhesive tape for dicing includes a base material and an pressure-sensitive adhesive layer, and the pressure-sensitive adhesive layer is a silicone resin in which a silicone gum (G) and a silicone resin (R) are mixed, and at least two silicon atom-bonded hydrogen atoms in one molecule as a crosslinking agent. The branch consists of an organopolysiloxane and a pressure-sensitive adhesive composition containing a photosensitive platinum (Pt) catalyst, and the mixing ratio of the silicone gum (G) and the silicone resin (R) is in the range of 35.0/65.0 to 50.0/50.0, and the silicone gum ( G) contains a silicone gum (G _alk ) composed of an organopolysiloxane containing a silicon atom-bonded alkenyl group, wherein the silicon atom-bonded alkenyl group content is 1.8×10 ^-6 mol/g or more and 1.0×10 ^-5 mol/g g or less.

Description

Manufacturing method of adhesive tape for dicing and semiconductor chip

The present invention relates to an adhesive tape for dicing used for dicing a semiconductor material used as a material for a semiconductor chip, and a method for manufacturing a semiconductor chip using the adhesive tape for dicing.

DESCRIPTION OF RELATED ART Conventionally, as an adhesive tape for dicing used in order to produce the semiconductor chip which has LED(Light Emitting Diode) etc., the adhesive tape which has an adhesive bond layer which consists of an acrylic resin is known (refer patent document 1).

Moreover, as an adhesive tape for dicing used in order to produce the semiconductor chip which has LED etc., the adhesive tape which has the adhesive layer which consists of a silicone resin is known (refer patent document 2, patent document 3).

In addition, as a method of manufacturing a semiconductor chip using the adhesive tape for dicing, the adhesive tape is affixed to the substrate side of a semiconductor element substrate in which a plurality of semiconductor elements are formed on the substrate, and the semiconductor element substrate is removed by a dicer. The method of cutting|disconnecting is known (refer patent document 4).

Japanese Patent Laid-Open No. 2013-38408 Japanese Patent Laid-Open No. 2015-050216 Japanese Patent Laid-Open No. 2016-122812 Japanese Patent Laid-Open No. 2005-93503

However, in recent years, as a method of manufacturing a semiconductor chip divided into pieces by dicing, dicing is performed by attaching an adhesive tape to a semiconductor material in which a plurality of semiconductor elements are coated with a covering material such as a sealing resin or a phosphor. There has been proposed a technique to be performed, a technique corresponding to a so-called wafer-level CSP (chip scale package) process.

In this way, when the adhesive tape is affixed to the semiconductor material in which the semiconductor element is coated with the covering material, the adhesive strength is insufficient depending on the configuration of the pressure-sensitive adhesive layer in the adhesive tape, the material of the covering material, etc., and the semiconductor separated by dicing Chips may scatter. In addition, if the ball tack and adhesive force of the pressure-sensitive adhesive layer are designed to be high in order to suppress the scattering of the semiconductor chip, the so-called glue that remains attached to the semiconductor chip when the obtained semiconductor chip is peeled from the adhesive tape. ) may be left behind.

The present invention has good adhesion and tackiness to a semiconductor material having a plurality of semiconductor elements covered with a covering material, and the glue residue on the semiconductor chip is suppressed when the semiconductor chip divided into pieces by dicing is peeled off. It aims at providing the adhesive tape for dicing, and the manufacturing method of the semiconductor chip using the same.

The present inventors, as a result of earnestly examining the pressure-sensitive adhesive layer of the pressure-sensitive adhesive tape for dicing for this purpose, the pressure-sensitive adhesive layer, at least (1) a silicone-based resin containing a silicone gum comprising an organopolysiloxane containing a silicon atom-bonded alkenyl group; , (2) with respect to a specific resin composition containing a crosslinking agent having a silicon atom-bonded hydrogen atom (SiH group), further comprising (3) a pressure-sensitive adhesive composition to which a photosensitive platinum (Pt) catalyst is added, and in the silicone resin When the mixing ratio of the silicon gum and the silicone resin of Together, when the semiconductor chip separated into pieces by dicing was peeled off, it discovered that the glue residual to a semiconductor chip was suppressed, and came to achieve this invention.

That is, in the pressure-sensitive adhesive layer of the adhesive tape for dicing, silicone gum and silicone resin are mixed in a predetermined ratio, and a crosslinking agent and a photosensitive platinum (Pt) catalyst are mixed with a silicone resin having a predetermined amount of silicon atom-bonded alkenyl groups. It discovered that it had the following effects by comprising with the added adhesive composition. First, when a semiconductor material having a plurality of semiconductor elements covered with a covering material is divided into a plurality of semiconductor chips, the pressure-sensitive adhesive layer is composed of a pressure-sensitive adhesive composition comprising a silicone resin in which a silicone gum and a silicone resin are mixed in an appropriate ratio, It discovered that it was suppressed that the semiconductor chip fragmented into pieces at the time of dicing was suppressed by the favorable tack and adhesive force which the said ratio brought. On the other hand, when peeling the semiconductor chip into pieces by dicing from the adhesive tape for dicing, by irradiating the adhesive layer with light such as ultraviolet rays, the photosensitive platinum (Pt) catalyst in the pressure-sensitive adhesive composition is activated, and the silicon-based The crosslinking reaction (addition reaction) between the silicon atom-bonded alkenyl group of the silicone gum in the resin and the silicon atom-bonded hydrogen atom (SiH group) of the crosslinking agent is accelerated, and the crosslinking density is increased, so that the cohesive force of the pressure-sensitive adhesive composition is reduced by light irradiation. larger than before. As a result, the tackiness of an adhesive layer falls suitably, and also becomes a thing which "does not fall" in the fracture mode in a holding force test in "interface peeling" or a holding force test. Thereby, it discovered that the pick-up property from the adhesive tape for dicing of a semiconductor chip became favorable, and also the glue residue with respect to a semiconductor chip was suppressed.

The adhesive tape for dicing of the present invention is provided with a base material and an adhesive layer laminated on the base material, and is used when dividing a semiconductor material having a plurality of semiconductor elements covered with the coating material into a plurality of semiconductor chips. An adhesive tape for dicing, wherein the pressure-sensitive adhesive layer is a silicone resin in which a silicone gum (G) and a silicone resin (R) are mixed, and as a crosslinking agent for the silicone resin, at least two silicon atom-bonded hydrogen atoms (SiH group) in one molecule ) comprising an organopolysiloxane having a, and a photosensitive platinum (Pt) catalyst, the mixing ratio of the silicone gum (G) and the silicone resin (R) in the entire silicone resin ((G) /(R)) is in the range of 35.0/65.0 to 50.0/50.0 in mass ratio, and the silicone gum (G) includes a silicone gum (G _alk ) composed of an organopolysiloxane containing a silicon atom-bonded alkenyl group, , The content of the silicon atom-bonded alkenyl group in the entire silicone-based resin is in the range of 1.8×10 ^-6 mol/g or more and 1.0×10 ^-5 mol/g or less.

Here, with respect to the said semiconductor material sealed by the said covering material which consists of a silicone resin, a plurality of the said semiconductor elements are stuck and used from the said covering material side, It can be characterized by the above-mentioned.

In addition, the pressure-sensitive adhesive layer may be characterized in that the content of the silicon atom-bonded alkenyl group in the entire silicone-based resin is in the range of 3.0×10 ^-6 mol/g or more and 1.0×10 ^-5 mol/g or less. have.

In addition, the pressure-sensitive adhesive layer, the silicon atom-bonded hydrogen atom of the crosslinking agent contained in the pressure-sensitive adhesive composition with respect to the content (total amount) of the silicon atom-bonded alkenyl group in the entire silicone-based resin contained in the pressure-sensitive adhesive composition ( It can be characterized in that the molar ratio (SiH group/silicon atom bonding alkenyl group) of the content (total amount) of SiH group) is in the range of 2.0 or more and 10.0 or less.

In addition, in the pressure-sensitive adhesive layer, the content of the photosensitive platinum (Pt) catalyst in the pressure-sensitive adhesive composition is in the range of 0.10 parts by mass or more and 3.00 parts by mass or less by solid content with respect to 100 parts by mass of solid content of the entire silicone-based resin. can be characterized as

Moreover, it can be characterized by satisfying|fulfilling all of the following conditions (a)-(c) in the adhesive characteristic based on JISZ0237 (2009).

(a) The adhesive force before light irradiation with respect to the BA-SUS test plate is the range of 2.7 N/10 mm or more and 4.1 N/10 mm or less.

(b) The value of the ball number in the inclined volt test (inclination angle of 30°, temperature 23°C, relative humidity 50%RH) is BN0 as the value of the ball number before light irradiation, and BN1 as the value of the ball number after light irradiation In the case where BN0>BN1 is

(c) in the holding force test after light irradiation (temperature of 40 ° C., relative humidity of 33% RH, leaving time of 2880 minutes), the breaking phenomenon at the time of falling is the peeling of the interface between the pressure-sensitive adhesive layer and the BA-SUS test plate, or , it does not fall in the said holding force test.

Further, when grasped from another point of view, in the method for manufacturing a semiconductor chip to which the present invention is applied, the above-mentioned adhesive tape for dicing is sealed with a sealing resin made of a silicone resin, and a plurality of the semiconductor elements are formed on a semiconductor element substrate. With respect to the above, a pasting step of pasting from the sealing resin side, a cutting step of cutting the semiconductor element substrate to which the dicing adhesive tape is affixed into a plurality of semiconductor chips, and a dicing adhesive tape of the semiconductor element substrate It is a manufacturing method of a semiconductor chip including the irradiation process of irradiating light, and the peeling process of peeling the said adhesive tape for dicing from the said some semiconductor chip.

According to the present invention, with respect to a semiconductor material in which a plurality of semiconductor elements are coated with a covering material, in the stage before light irradiation, it has good adhesion and tackiness, and after light irradiation, a semiconductor chip divided into pieces by dicing is peeled. In this case, it is possible to provide an adhesive tape for dicing in which the glue residue to the semiconductor chip is suppressed while having good pickup properties of the semiconductor chip, and a method for manufacturing a semiconductor chip using the same.

BRIEF DESCRIPTION OF THE DRAWINGS It is a figure which showed an example of the structure of the adhesive tape for dicing to which this embodiment is applied.
2A to 2E are diagrams showing a method for manufacturing a semiconductor chip using the adhesive tape of the present embodiment.
3 : is a schematic diagram which showed the relationship between the crosslinking density of the silicone resin in an adhesive layer, and the result (fall time) of the holding force test of the adhesive tape 1 .

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[Composition of adhesive tape]

1 : is a figure which shows an example of the structure of the adhesive tape 1 for dicing (henceforth simply referred to as adhesive tape 1) to which this embodiment is applied. The adhesive tape 1 of this embodiment, for example, in the manufacturing process of a semiconductor chip which has semiconductor elements, such as LED (Light Emitting Diode) and a power semiconductor, WHEREIN: used

As shown in FIG. 1, the adhesive tape 1 has the structure in which the adhesive layer 3 was laminated|stacked on the base material 2.

In addition, although not shown in figure, the adhesive tape 1 is between the base material 2 and the adhesive layer 3, and if necessary, the anchor coat layer for improving the adhesiveness of the base material 2 and the adhesive layer 3 is provided. You may be prepared. Moreover, the surface (surface on the opposite side to the surface which opposes the adhesive layer 3) of the base material 2 may be surface-treated. Moreover, you may equip the surface (surface on the opposite side to the surface which opposes the base material 2) of the adhesive layer 3 with a release liner.

<Reference>

The base material 2 of this embodiment is comprised by the material which transmits light, such as an ultraviolet-ray. It will not specifically limit as a material of the base material 2 as long as light, such as an ultraviolet-ray, can permeate|transmit, For example, the plastic etc. which can transmit light, such as an ultraviolet-ray, can be used. In addition, here, being able to transmit light such as ultraviolet light does not mean that the transmittance of light such as ultraviolet light is 100%, but at least a photosensitive platinum (Pt) catalyst contained in the pressure-sensitive adhesive layer 3 to be described later by a silicone resin. What is necessary is just to be able to permeate|transmit the light enough to accelerate|stimulate the addition reaction of a crosslinking agent.

Specific examples of the material of the substrate 2 include polyethylene terephthalate, polyethylene naphthalate, polyphenylene sulfide, biaxially stretched polypropylene, aliphatic polyimide (transparent polyimide), polycycloolefin, fluorine-based resin, polyolefin resin, and the like. A resin film can be used. In addition, depending on the application, the base material 2 may include, for example, a composite film in which polyethylene terephthalate and a polyolefin resin film are laminated, a composite film in which this composite film is further laminated with a resin film, and a resin obtained by co-extrusion into multiple layers. You may use a film etc.

Among these, as the base material 2, it is preferable to use the material which has polyethylene terephthalate as a main component.

<Adhesive layer>

The pressure-sensitive adhesive layer 3 of the present embodiment is a silicone-based resin in which a silicone gum (G) and a silicone resin (R) are mixed, and a silicone-based resin having at least two or more silicon atom-bonded hydrogen atoms (SiH groups) in one molecule. It is constituted by a pressure-sensitive adhesive composition comprising a crosslinking agent and a photosensitive platinum (Pt) catalyst.

As for the silicone resin, "silicone gum (G) comprising a silicone gum (G _alk ) consisting of organopolysiloxane containing a silicon atom-bonded alkenyl group (G)" and "silicone resin consisting of organopolysiloxane (R)" are prescribed It consists of a mixed resin blended in proportions. Hereinafter, each component contained in the adhesive composition which comprises the adhesive layer 3 is demonstrated in order.

(Silicone-based resin)

The silicone-based resin of the present embodiment is a "silicone gum (G) containing a silicone gum (G _alk ) consisting of an organopolysiloxane containing a silicon atom-bonded alkenyl group" and "a silicone resin consisting of an organopolysiloxane (R)"' consists of a mixed resin blended so as to be in the range of 35.0/65.0 to 50.0/50.0. That is, it consists of mixed resin mix|blended so that the mixing ratio ((G)/(R)) of silicone gum (G) and silicone resin (R) may become the range of 35.0/65.0-50.0/50.0 by mass ratio.

Further, the silicone-based resin is configured such that the content of silicon atom-bonded alkenyl groups in the entire silicone-based resin is in the range of 1.8×10 ^-6 mol/g or more and 1.0×10 ^-5 mol/g or less, more preferably, It is constituted so as to be in the range of 3.0×10 ^-6 mol/g or more and 1.0×10 ^-5 mol/g or less. Here, "mol/g" means "amount of substance per 1g of solid content of the whole silicone resin".

When the content of the silicon atom-bonded alkenyl group in the entire silicone-based resin is less than 1.8×10 ^-6 mol/g, when the adhesive tape 1 is irradiated with light such as ultraviolet rays, the silicon atom-bonded alkenyl group The improvement of the crosslinking density by the crosslinking reaction (addition reaction) between the silicon atom-bonded hydrogen atoms (SiH groups) which a crosslinking agent has becomes inadequate, it becomes difficult to harden|cure an adhesive, and it becomes difficult to improve cohesion force. In this case, the desired reduction in tack or failure mode in the holding force test is not obtained, and after the adhesive tape 1 is used for dicing a semiconductor element substrate or the like, the obtained semiconductor chip or the like is peeled from the adhesive tape 1 . At this time, there is a fear that the pick-up property of the separated semiconductor chip may deteriorate, or there is a fear that glue residue is likely to occur on the semiconductor chip or the like.

On the other hand, when the content of silicon atom-bonded alkenyl groups in the entire silicone-based resin exceeds 1.0×10 ^-5 mol/g, in the adhesive tape 1, for example, a release liner subjected to release treatment with a fluoroalkyl-modified silicone When provided, there exists a possibility that the peeling force of the peeling liner with respect to the adhesive layer 3 may become large. Moreover, there exists a possibility that the storage stability with respect to the light of the adhesive tape 1 may worsen.

The content of the silicon atom-bonded alkenyl group in the whole silicone resin is determined by performing ¹ H-NMR (nuclear magnetic resonance) spectrum measurement for a nonvolatile component of the silicone resin to determine the resonance signal area (integral value) of the alkenyl group. can be calculated by Details will be described later.

In addition, as for the silicone resin of this embodiment, if the "mixing ratio of silicone gum (G) and silicone resin (R) ((G)/(R))" and "content of silicon atom-bonded alkenyl groups" are the above ranges, , may contain a silicone gum (G ₀ ) composed of an organopolysiloxane not containing a silicon atom-bonded alkenyl group. That is, the silicone gum (G) may be a single substance or a mixture of two or more of “silicone gum consisting of organopolysiloxane containing a silicon atom-bonded alkenyl group (G _alk )”, or “containing a silicon atom-bonded alkenyl group” A mixture of "silicone gum (G _alk ) consisting of an organopolysiloxane that does not contain a silicon atom-bonded alkenyl group (G ₀ )" or a mixture of two or more thereof may be used.

Hereinafter, "silicone gum consisting of organopolysiloxane containing a silicon atom-bonded alkenyl group (G _alk )" and "silicone gum consisting of organopolysiloxane containing no silicon atom-bonded alkenyl group (G ₀ )")" and "silicone resin (R) comprising organopolysiloxane not containing a silicon atom-bonded alkenyl group" will be described in more detail.

In addition, in the following description, a silicone gum (G _alk ) consisting of an organopolysiloxane containing a silicon atom-bonded alkenyl group is referred to as a silicone gum (G _alk ) containing a silicon atom-bonded alkenyl group, or simply a silicone gum ( G _alk ) in some cases. Similarly, a silicone gum (G ₀ ) consisting of an organopolysiloxane that does not contain a silicon-bonded alkenyl group is referred to as a silicone gum (G 0 ) not containing a silicon-bonded alkenyl group (G ₀ ), or simply a silicone gum (G ₀ ). Sometimes it is indicated. In addition, the silicone resin (R) which consists of organopolysiloxane may be simply described as a silicone resin (R).

(Silicone gum (G _alk ) composed of organopolysiloxane containing silicon atom-bonded alkenyl group)

The silicone gum (G _alk ) composed of an organopolysiloxane containing a silicon atom-bonded alkenyl group in the present embodiment is generally used as an addition-reaction type silicone-based resin, that is, on average, at least two silicon atoms per molecule. What is necessary is just to contain an atom-bonded alkenyl group, and it is not specifically limited.

Specifically, as the silicone gum (G _alk ), a silicon-atom-bonded alkenyl group content in the range of 1.0×10 ^-6 mol/g or more and 1.0×10 ^-1 mol/g or less can be used. In the present embodiment, the content of silicon atom-bonded alkenyl groups is 1.7×10 ^-6 mol/g or more and 1.0×10 from the viewpoint of control of the pressure-sensitive adhesive properties of the pressure-sensitive adhesive layer 3 or the ease of availability when using a commercial item. It is preferable to use a range of ^-2 mol/g or less. This silicone gum (G _alk ) has an alkenyl group content of 1.8×10 ^-6 mol/g or more and 1.0×10 ^-5 in the whole silicone-based resin in which the above-described silicone gum (G) and silicone resin (R) are mixed. One type may be used individually and 2 or more types may be used together so that it may become the range of mol/g or less.

As the molecular structure of the organopolysiloxane containing a silicon atom-bonded alkenyl group constituting the silicone gum (G _alk ), for example, a linear structure in which the main chain portion consists of repeating diorganosiloxane units, a part of the molecular structure and a structure including a branched chain, a branched-chain structure, or a cyclic structure. Especially, from points, such as the mechanical strength of the adhesive after irradiation of light, such as an ultraviolet-ray, and a physical property, organopolysiloxane of a linear structure is preferable.

The silicone gum (G _alk ) composed of an organopolysiloxane containing a silicon atom-bonded alkenyl group may be in an oil state or a raw rubber state, but is preferably in a raw rubber state. In the case of an oil state, the viscosity of the silicone gum (G _alk ) made of organopolysiloxane is preferably 1,000 mPa·s or more at 25°C. If the viscosity is less than 1,000 mPa·s, there is a fear that the pressure-sensitive adhesive before and after light irradiation such as ultraviolet light cannot express desired adhesive properties, and there is a fear that the adhesiveness between the pressure-sensitive adhesive layer 3 and the base material 2 is poor. In the case of a raw rubber state, the viscosity at the time of melt|dissolving the silicone gum ( _Galk ) which consists of organopolysiloxane in toluene so that it may become a density|concentration of 30 mass % is 100,000 mPa*s or less in 25 degreeC, and is preferable. When a viscosity exceeds 100,000 mPa*s, there exists a possibility that stirring at the time of preparing an adhesive composition may become difficult. In addition, the viscosity of the silicone gum ( _Galk ) which consists of organopolysiloxane can be measured using a B-type rotational viscometer (using a BM-type rotor, the same hereinafter).

Silicone gums (G _alk ) composed of organopolysiloxane containing a silicon atom-bonded alkenyl group include, for example, those represented by the following general formula (1) or general formula (2), but are not limited thereto. .

[Formula 1]

[Formula 2]

Here, in the said General formula (1) and General formula (2), R< ¹ > is mutually independently a monovalent hydrocarbon group which does not have an aliphatic unsaturated bond, and X is an alkenyl group containing organic group. a is an integer of 0 to 3, m is an integer of 0 or more, n is an integer of 100 or more, provided that a and m are not equal to 0 at the same time, and only when a is 0, m is an integer of 2 or more. m+n is a value from which the viscosity in 25 degreeC of the silicone gum ( _Galk ) which consists of the said organopolysiloxane becomes 1,000 mPa*s or more.

As R ¹ , a monovalent hydrocarbon group having 1 to 10 carbon atoms, preferably 1 to 7 carbon atoms, which does not have an aliphatic unsaturated bond is preferable. For example, alkyl groups, such as a methyl group, an ethyl group, a propyl group, and a butyl group; Cycloalkyl groups, such as a cyclohexyl group; and aryl groups, such as a phenyl group and a tolyl group, etc. are mentioned, Especially, a methyl group or a phenyl group is preferable.

As X, a C2-C10 alkenyl group containing organic group is preferable. For example, vinyl group, allyl group, hexenyl group, octenyl group, acryloylpropyl group, acryloylmethyl group, methacryloylpropyl group, acryloxypropyl group, acryloxymethyl group, methacryloxypropyl group, A methacryloxymethyl group, a cyclohexenylethyl group, a vinyloxypropyl group, etc. are mentioned. Especially, lower alkenyl groups, such as a vinyl group and an allyl group, are preferable, and a vinyl group is especially preferable from an industrial viewpoint. The bonding position of the alkenyl group is not particularly limited, and may be a molecular chain terminal, a molecular chain side chain, or both a molecular chain terminal and a molecular chain side chain.

The number of alkenyl groups varies according to the content of the silicone resin (R) composed of organopolysiloxane contained in the silicone pressure sensitive adhesive, the type and amount of the crosslinking agent added, the balance with other additives, etc. For example, it is preferable that it is the range of 0.1 or more and 3.0 or less normally with respect to 100 organo groups of organopolysiloxane. And it is preferable to adjust molecular weight so that it may become the range of the viscosity mentioned above in this ratio range, and to adjust so that the number of the said alkenyl groups in 1 molecule of organopolysiloxane may be at least two on average. When the number of alkenyl groups is less than 0.1 with respect to 100 organo groups of the organopolysiloxane, when the adhesive tape 1 is irradiated with light such as ultraviolet rays, the silicon atom-bonded alkenyl group and the silicone-based resin of the silicone gum (G _alk ) The improvement of the crosslinking density by the crosslinking reaction (addition reaction) between the silicon atom-bonded hydrogen atoms (SiH groups) which the crosslinking agent has becomes insufficient, the adhesive becomes hard to harden|cure, and it becomes difficult to improve cohesion force. In this case, the desired reduction in tack or failure mode in the holding force test is not obtained, and after the adhesive tape 1 is used for dicing a semiconductor element substrate or the like, the obtained semiconductor chip or the like is peeled from the adhesive tape 1 . At this time, there is a fear that the pick-up property of the separated semiconductor chip may deteriorate, or there is a fear that glue residue is likely to occur on the semiconductor chip or the like. On the other hand, when the number of alkenyl groups exceeds 3.0 with respect to 100 organo groups of the organopolysiloxane, in the pressure-sensitive adhesive tape 1, for example, when a release liner subjected to release treatment with a fluoroalkyl-modified silicone is provided, the pressure-sensitive adhesive layer There exists a possibility that the peeling force of the peeling liner with respect to (3) may become large.

Specific examples of the silicone gum (G _alk ) containing such silicon atom-bonded alkenyl groups include dimethylpolysiloxane capped with dimethylvinylsiloxy groups at both ends of the molecular chain, dimethylsiloxane/methylvinylsiloxane copolymers capped with dimethylvinylsiloxy groups at both ends of the molecular chain, Dimethylsiloxane/methylphenylsiloxane copolymer blocking both ends of the molecular chain, dimethylvinylsiloxane blocking both ends of the molecular chain Methylphenylpolysiloxane, blocking of trimethylsiloxy groups at both ends of the molecular chain Dimethylsiloxane/methylvinylsiloxane copolymer, blocking both ends of the molecular chain Dimethylsiloxane/methylvinylsiloxane/methylphenylsiloxane copolymer blocked with trimethylsiloxy groups, dimethylsiloxane/methylhexenylsiloxane copolymer blocked with trimethylsiloxy groups at both ends of the molecular chain, dimethylsiloxane/methylhexenylsiloxane blocked with dimethylvinylsiloxy groups at both ends of the molecular chain A copolymer and a dimethyl hexenyl siloxy group-blocked dimethyl siloxane/methyl hexenyl siloxane copolymer at both ends of the molecular chain are exemplified.

(Silicone gum (G ₀ ) consisting of an organopolysiloxane that does not contain a silicon atom-bonded alkenyl group)

The silicone gum (G ₀ ) composed of an organopolysiloxane not containing a silicon atom-bonded alkenyl group in the present embodiment is generally used as a peroxide-curable silicone-based resin, that is, does not contain a silicon atom-bonded alkenyl group. What is necessary is just that it is not, and it is not specifically limited.

As the molecular structure of the organopolysiloxane constituting such silicone gum (G ₀ ), for example, a linear structure in which the main chain portion consists of repeating diorganosiloxane units, a structure including a branched chain in a part of the molecular structure, a branched-chain structure or a cyclic structure.

The silicone gum (G ₀ ) composed of an organopolysiloxane not containing a silicon atom-bonded alkenyl group may be in either an oil state or a raw rubber state, but is preferably in a raw rubber state. In the case of an oil state, the viscosity of the silicone gum (G ₀ ) composed of organopolysiloxane is preferably 1,000 mPa·s or more at 25°C. If the viscosity is less than 1,000 mPa·s, there is a fear that the pressure-sensitive adhesive before and after light irradiation such as ultraviolet light cannot express desired adhesive properties, and there is a fear that the adhesiveness between the pressure-sensitive adhesive layer 3 and the base material 2 is poor. In the case of raw rubber, the viscosity when silicone gum (G ₀ ) composed of organopolysiloxane is dissolved in toluene to a concentration of 30% by mass is preferably 100,000 mPa·s or less at 25°C. When a viscosity exceeds 100,000 mPa*s, there exists a possibility that stirring at the time of preparing an adhesive composition may become difficult. In addition, the viscosity of the silicone gum (G0 ₎ which consists of organopolysiloxane can be measured using a B-type rotational viscometer.

Silicone gums (G ₀ ) composed of organopolysiloxane not containing a silicon atom-bonded alkenyl group include, for example, those represented by the following general formula (3) or general formula (4), but are limited to these not.

[Formula 3]

[Formula 4]

Here, in the general formulas (3) and (4), R ⁴ is, independently of each other, a monovalent hydrocarbon group having no aliphatic unsaturated bond, t is an integer of 100 or more, and the diorganopolysiloxane The viscosity at 25°C of the formed silicone gum (G ₀ ) is a value of 1,000 mPa·s or more.

As R ⁴ , a monovalent hydrocarbon group having 1 to 10 carbon atoms, preferably 1 to 7 carbon atoms and not having an aliphatic unsaturated bond is preferable. For example, alkyl groups, such as a methyl group, an ethyl group, a propyl group, and a butyl group; Cycloalkyl groups, such as a cyclohexyl group; and aryl groups, such as a phenyl group and a tolyl group, etc. are mentioned, Especially, a methyl group is preferable.

(Silicone resin (R) composed of organopolysiloxane)

The silicone resin (R) composed of organopolysiloxane in the present embodiment is an organopolysiloxane having R ² ₃ SiO _0.5 units (M units) and SiO ₂ units (Q units), and is generally used for silicone pressure-sensitive adhesives. This is the so-called MQ resin. The silicone resin (R) composed of this organopolysiloxane basically does not have an alkenyl group in the molecule, and a conventionally known one can be used. R ² is a monovalent hydrocarbon group having 1 to 10 carbon atoms, and those exemplified as R ¹ described above are exemplified. The organopolysiloxane constituting the silicone resin (R) preferably contains R ² ₃ SiO _0.5 units and SiO ₂ units in a molar ratio of R ² ₃ SiO _0.5 units/SiO ₂ units in a range of 0.5 or more and 1.7 or less. do. When molar ratio of R ² ₃ SiO _0.5 unit/SiO ₂ unit is less than 0.5, the adhesive force and tackiness of the adhesive layer 3 obtained may fall. On the other hand, when molar ratio of R ² ₃ SiO _0.5 unit/SiO ₂ unit exceeds 1.7, the adhesive force and retention force of the adhesive layer 3 obtained may fall. In addition, the organopolysiloxane which comprises silicone resin (R) may have an OH group. In that case, it is preferable that content of OH group is 4.0 mass % or less with respect to the total mass of organopolysiloxane. When content of OH group exceeds 4.0 mass %, there exists a possibility that sclerosis|hardenability of an adhesive may fall.

The said organopolysiloxane may use 2 or more types together. Further, the organopolysiloxane may have R ² SiO _1.5 units (T units) and/or R ² ₂ SiO units (D units) within a range that does not impair the properties of the present invention.

"Silicone gum consisting of an organopolysiloxane containing a silicon atom-bonded alkenyl group (G _alk )" and "Silicone gum consisting of an organopolysiloxane not containing a silicon atom-bonded alkenyl group (G ₀ )" and "Organopolysiloxane The formed silicone resin (R)" may be used by simply mixing it normally. In addition, as a silicone gum (G _alk ) consisting of an organopolysiloxane containing a silicon atom-bonded alkenyl group, the organopolysiloxane represented by the general formula (2) is contained, or does not contain a silicon atom-bonded alkenyl group. When the silicone gum (G ₀ ) composed of organopolysiloxane contains the organopolysiloxane represented by the general formula (4), as long as the properties of the present invention are not impaired, the silicone gum (G _alk ) and You may use silicone resin (R) or silicone gum (G0 ₎ and silicone resin (R) as a (partial) condensation reaction product obtained by making it react beforehand.

(Mixing ratio of silicone gum (G) and silicone resin (R) in the whole silicone resin ((G)/(R)))

The whole silicone resin contained in the adhesive layer 3 of this embodiment WHEREIN: The mixing ratio ((G)/(R)) of silicone gum (G) and silicone resin (R) is 35.0/65.0-50.0 by mass ratio It is in the range of /50.0. Here, when using 2 or more types of silicone gums (G) together, the total amount of each silicone gum (G) is regarded as the mass of silicone gum (G) in the whole silicone resin. For example, as silicone gum (G), when silicone gum ( _Galk ) and silicone gum ( _{G0) are used together, the mass of silicone gum (G) in the whole silicone resin is silicone gum (Galk )} It is the sum of the mass of and the mass of silicon gum (G ₀ ). Similarly, also when using together 2 or more types of silicone resin (R), the total amount of each silicone resin is considered as the mass of silicone resin (R) in the whole silicone resin.

In the entire silicone-based resin contained in the pressure-sensitive adhesive layer 3 of the present embodiment, when the mixing ratio ((G)/(R)) of the silicone gum (G) and the silicone resin (R) is less than the lower limit of the above range, the adhesion When the tape 1 is irradiated with light such as ultraviolet light, a crosslinking reaction (addition) between the silicon atom-bonded alkenyl group of the silicone gum (G) and the silicon atom-bonded hydrogen atom (SiH group) of the crosslinking agent to the silicone-based resin The contribution of the improvement of the crosslinking density by reaction) becomes inadequate, an adhesive becomes hard to harden|cure, and it becomes difficult to improve cohesion force. In this case, the desired reduction in tack or failure mode in the holding force test is not obtained, and after the adhesive tape 1 is used for dicing a semiconductor element substrate or the like, the obtained semiconductor chip or the like is peeled from the adhesive tape 1 . At this time, there is a fear that the pick-up property of the separated semiconductor chip may deteriorate, or there is a fear that glue residue is likely to occur on the semiconductor chip or the like.

On the other hand, in the entire silicone-based resin contained in the pressure-sensitive adhesive layer 3 of the present embodiment, when the mixing ratio ((G)/(R)) of the silicone gum (G) and the silicone resin (R) exceeds the upper limit of the range , in a state in which the pressure-sensitive adhesive before irradiation with light such as ultraviolet light is not cured, and when dicing a semiconductor element substrate, etc., the vibration of dicing is easily transmitted to the pressure-sensitive adhesive layer 3 and the vibration width becomes large, e.g. For example, there is a possibility that the semiconductor element substrate is shifted from the reference position. In addition, there is a fear that cracks (chipping) may occur in the individualized semiconductor chips, and a difference in size may occur for each semiconductor chip. Moreover, there exists a possibility that the adhesive force and tack|tack force of the adhesive layer 3 may fall. In this case, when the adhesive tape 1 is used for the dicing of a semiconductor element substrate, a fluorescent substrate, etc. which are mentioned later, there exists a possibility that the semiconductor chip etc. which are cut pieces may scatter.

On the other hand, in the entire silicone-based resin contained in the pressure-sensitive adhesive layer 3 of the present embodiment, the mixing ratio ((G)/(R)) of the silicone gum (G) and the silicone resin (R) is within the range described above. Thereby, the following effects are realizable. That is, in the stage before irradiation of light such as ultraviolet rays, to the pressure-sensitive adhesive layer 3 in an uncured state, it is necessary to impart an appropriate adhesive force and tack force that does not cause scattering of semiconductor chips, which are cut pieces, during dicing. becomes possible On the other hand, after irradiation with light such as ultraviolet rays, the silicone-based resin of the pressure-sensitive adhesive layer 3 has a content of silicon atom-bonded alkenyl groups in the entire silicone-based resin of 1.8×10 ^-6 mol/g or more and 1.0×10 as described above. Since it is configured to be in the range of ^-5 mol/g or less, a crosslinking reaction (addition) between the silicon atom-bonded alkenyl group of the silicone gum (G) and the silicon atom-bonded hydrogen atom (SiH group) of the crosslinking agent for the silicone-based resin reaction) proceeds sufficiently. Thereby, when hardening of the adhesive layer 3 advances, since a crosslinking density becomes high and cohesive force improves, the fall of the desired tack|tack force and the failure mode in a holding force test are acquired. As a result, after the adhesive tape 1 is used for dicing of a semiconductor element substrate, etc., while being able to implement|achieve favorable pick-up property at the time of peeling the obtained semiconductor chip etc. from the adhesive tape 1, the glue for a semiconductor chip etc. It becomes possible to suppress the residual.

In addition, as the silicone resin in which the silicone gum (G) and silicone resin (R) of the present invention are mixed, commercially available materials exemplified below may be appropriately combined and mixed and prepared may be used. Here, "what was mixed and prepared in suitable combination" means "the content of the silicon atom-bonded alkenyl group in the whole silicone resin of the pressure-sensitive adhesive layer 3 is 1.8×10 ^-6 mol/g or more and 1.0×10 ^-5 mol/g A mixture prepared by appropriately combining each material so that the mixing ratio ((G)/(R)) of the silicone gum (G) and the silicone resin (R) is in the range of 35.0/65.0 to 50.0/50.0 in the following range.” means As each commercially available material for mixing and preparing suitably combining, the following materials (1)-(4) etc. are mentioned, for example.

Examples of the silicone-based resin containing a silicon atom-bonded alkenyl group include: (1) a commercially available addition-reaction type silicone pressure-sensitive adhesive in which a silicone gum ( _Galk ) and a silicone resin (R) are mixed in a predetermined ratio; (2) a silicone gum (G) _alk ) as a main component, and a commercially available addition-reaction silicone-based mold release agent, and the like. In addition, as a silicone resin that does not contain a silicon atom-bonded alkenyl group, (3) a commercially available peroxide-curable silicone pressure-sensitive adhesive in which a silicone gum (G ₀ ) and a silicone resin (R) are mixed in a predetermined ratio, or (4) a commercially available A single substance of silicone resin (R), etc. are mentioned. In the present invention, in the case of mixing and preparing each of these commercially available materials as appropriate, it is preferable to contain at least the addition-reaction silicone-based mold release agent of (2), and in addition to this, the addition-reaction silicone-based adhesive of (1). It is more preferable to include

As described above, as the silicone resin containing a silicon atom-bonded alkenyl group, (1) a commercially available addition reaction type silicone pressure-sensitive adhesive in which a silicone gum ( _Galk ) and a silicone resin (R) are mixed in a predetermined ratio, (2) ) A commercially available addition-reacting silicone-based mold release agent containing silicone gum ( _Galk ) as a main component may be used. Hereinafter, specific commercially available materials will be exemplified.

(1) Addition-reactive silicone pressure-sensitive adhesive

The above-mentioned commercially available addition-reaction silicone pressure-sensitive adhesive is not particularly limited as long as it is generally used as a silicone pressure-sensitive adhesive for silicone pressure-sensitive adhesive tapes. Specifically, for example, Shin-Etsu Chemical Co., Ltd. KR-3700, KR-3701, X-40-3237-1, X-40-3240, X-40-3291-1, X-40-3229, X-40-3270, X-40-3306 (all brand names), Momentive Performance Materials TSR1512, TSR1516, XR37-B9204 (all brand names), Dow Toray Corporation SD4580, SD4584, SD4585, SD4560 , SD4564, SD4565, SD4570, SD4574, SD4575, SD4600PFC, SD4593, DC7651 In model numbers such as ADHESIVE (all trade names), a platinum (Pt)-based catalyst and a crosslinking agent described later are not internally added. can be used In addition, although the type in which the crosslinking agent is internally added can also be used, when the content of silicon atom-bonded hydrogen atoms (SiH groups) of the internally added crosslinking agent is unclear, the content is ¹ H-NMR (nuclear magnetic resonance), which will be described later. It can be calculated|required by analysis of a spectrum measurement, etc.

(2) addition-reaction silicone-based mold release agent

As said commercially available addition-reaction silicone type release agent, if it is generally used as a release agent for the silicone type release film for adhesive tapes, it will not specifically limit. Specifically, for example, LTC750A, LTC310, LTC300B (all are brand names) made by Dow Toray Corporation, KS3600, KS778 (all are brand names) manufactured by Shin-Etsu Chemical Industries, Ltd., TPR6710, TPR6700 by Momentive Performance Materials (all trade names), etc. can be used. Also in this case, either the type in which the crosslinking agent is not internally added and the type in which the crosslinking agent is internally added may be used, and the content of silicon atom-bonded hydrogen atoms (SiH groups) in the internally added crosslinking agent is ¹ H-NMR (nuclear magnetic resonance) can be obtained by analysis of a spectrum measurement or the like.

When the mixing ratio of silicone gum (G) and silicone resin (R) in the commercially available addition reaction type silicone pressure-sensitive adhesive is unclear, the mixing ratio is determined by ²⁹ Si-NMR (nuclear magnetic resonance) spectrum measurement, It can be calculated|required from the peak area ratio of D unit and Q unit (silicone gum : silicone resin = D unit : Q unit). Moreover, it can calculate|require also from the ratio of each peak area measured by gel permeation chromatography (GPC).

In addition, as a silicone resin that does not contain a silicon atom-bonded alkenyl group, a commercially available peroxide-curable silicone pressure-sensitive adhesive in which a silicone gum (G ₀ ) and a silicone resin (R) are mixed in a predetermined ratio, or a commercially available silicone resin (R) A single product or the like can be used. Hereinafter, specific commercially available materials will be exemplified.

(3) Peroxide-curable silicone adhesive

The above-mentioned commercially available peroxide-curable silicone pressure-sensitive adhesive is not particularly limited as long as it is generally used as a silicone pressure-sensitive adhesive for silicone pressure-sensitive adhesive tapes. Specifically, for example, Shin-Etsu Chemical Co., Ltd. KR-100, KR-101-10 (all are brand names), Momentive Performance Materials Corporation YR3340, YR3286, PSA610-SM, XR37-B6722, YF3897 (all are brand names), SH4280, SH4282, SE4200, BY24-717, BY24-715, Q2-7735 (all are brand names) made from Dow Toray Co., Ltd. (all are brand names), etc. are mentioned.

(4) silicone resin

As a single product of the commercially available silicone resin (R), specifically, for example, YF3800, XF3905, YF3057, YF3807, YF3802, YF3897, XC96-723, 2D SILANOL FLUID (all of them manufactured by Momentive Performance Materials) brand name) and the like.

When the mixing ratio of the silicone gum (G) and the silicone resin (R) in the above-mentioned commercially available peroxide-curable silicone pressure-sensitive adhesive is unclear, the mixing ratio is similar to the above, ²⁹ Si-NMR (nuclear magnetic resonance) spectrum measurement By , it can be obtained from the peak area ratio of the D unit and the Q unit (silicone gum: silicone resin = D unit: Q unit). Moreover, it can calculate|require also from the ratio of each peak area measured by gel permeation chromatography (GPC).

As described above, in such commercially available silicone-based resins, the content of silicon atom-bonded alkenyl groups in the entire silicone-based resin of the pressure-sensitive adhesive layer 3 is 1.8×10 ^-6 mol/g or more and 1.0×10 ^-5 mol/g or less. What is necessary is just to use it in a mixed and prepared state so that the mixing ratio ((G)/(R)) of the silicone gum (G) and the silicone resin (R) is in the range of 35.0/65.0 to 50.0/50.0. As a preferred embodiment in the case of using such a commercially available silicone-based resin, specifically, for example, (a) a silicone-based resin obtained by adding an addition-reacting silicone-based release agent to an addition-reacting silicone-based pressure-sensitive adhesive, and (b) a peroxide in addition to these What is necessary is just to use the silicone resin which added the curable silicone adhesive and/or silicone resin (R) as a main component of the adhesive composition which comprises the adhesive layer 3 .

In addition, in description of this embodiment, "as a main component" means that it occupies 75 mass parts or more, when solid content of an adhesive composition is 100 mass parts, Preferably it is 90 mass parts or more, More preferably, 95 more than parts by mass.

(crosslinking agent)

The crosslinking agent in this embodiment expresses the function as a crosslinking agent with respect to a silicone adhesive when light, such as an ultraviolet-ray, is irradiated to the adhesive layer 3 . That is, the crosslinking agent in this embodiment irradiates the adhesive layer 3 with light, such as an ultraviolet-ray, when the photosensitive platinum (Pt) catalyst in a silicone adhesive is activated, silicone gum contained in a silicone resin ( _Galk ). ) is used for crosslinking the pressure-sensitive adhesive layer 3 by addition reaction with respect to the silicon atom-bonded alkenyl group of the Since the silicone-based resin is crosslinked by the crosslinking agent, the pressure-sensitive adhesive layer 3 is cured, and the crosslinking density is increased, the cohesive force of the pressure-sensitive adhesive layer 3 is increased compared to before irradiation with light such as ultraviolet rays.

As the crosslinking agent, an organopolysiloxane (organohydrogenpolysiloxane) having at least two, preferably three or more silicon atom-bonded hydrogen atoms (SiH groups) in one molecule is used. In the following description, the organopolysiloxane having a silicon atom-bonded hydrogen atom (SiH group) is sometimes simply referred to as organohydrogenpolysiloxane.

Examples of the molecular structure of the organohydrogenpolysiloxane used as the crosslinking agent include linear, partially branched, linear, branched, and network. It is preferable that the viscosity in 25 degreeC of organohydrogenpolysiloxane is the range of 1 mPa*s or more and 5,000 mPa*s or less. In addition, the said viscosity can be measured using a B-type rotational viscometer.

As the organohydrogenpolysiloxane used as a crosslinking agent, a conventionally well-known thing can be used. For example, although what is represented by the following general formula (5) or general formula (6) as this organohydrogen polysiloxane is mentioned, it is not limited to these.

[Formula 5]

[Formula 6]

Here, in the general formulas (5) and (6), R ³ is a monovalent hydrocarbon group having 1 to 10 carbon atoms, b is 0 or 1, p and q are integers, and organohydrogenpolysiloxane is a value at which the viscosity at 25°C is 1 mPa·s or more and 5,000 mPa·s or less. r is an integer of 2 or more, s is an integer of 0 or more, and r+s≧3, preferably 8≧r+s≧3. The organohydrogenpolysiloxane may be a mixture of 2 or more types.

R ³ is a monovalent hydrocarbon group having 1 to 10 carbon atoms, preferably 1 to 7 carbon atoms. For example, alkyl groups, such as a methyl group, an ethyl group, a propyl group, and a butyl group; Cycloalkyl groups, such as a cyclohexyl group; and aryl groups, such as a phenyl group and a tolyl group, and an alkenyl group, such as a vinyl group and an allyl group, especially, a methyl group or a phenyl group is preferable.

Content of the organohydrogenpolysiloxane used as a crosslinking agent in the adhesive layer 3 of this embodiment, content of the silicon atom bond alkenyl group of a silicone gum ( _Galk ), and the silicon atom bond which the organohydrogenpolysiloxane has Since the appropriate range changes in balance with the content of hydrogen atoms, it cannot be said uniformly, but usually, for example, the silicon atom-bonded alkenyl group of the silicone resin contained in the pressure-sensitive adhesive composition constituting the pressure-sensitive adhesive layer 3 . The amount in which the molar ratio of the content (total amount) of silicon atom-bonded hydrogen atoms (SiH groups) of the crosslinking agent contained in the pressure-sensitive adhesive composition to the content (total amount) falls within the range of 2.0 or more and 10.0 or less is preferable.

When the content of the organohydrogenpolysiloxane is less than the lower limit, when the adhesive tape 1 is irradiated with light such as ultraviolet rays, silicon atom-bonded alkenyl groups in the silicone gum and silicon atom-bonded hydrogen atoms (SiH groups) in the crosslinking agent The improvement of the crosslinking density by the crosslinking reaction (addition reaction) between becomes insufficient, it becomes difficult to harden|cure an adhesive, and it becomes difficult to improve cohesion force. In this case, the desired reduction in tack or failure mode in the holding force test is not obtained, and after the adhesive tape 1 is used for dicing a semiconductor element substrate or the like, the obtained semiconductor chip or the like is peeled from the adhesive tape 1 . At this time, there is a fear that the pick-up property of the separated semiconductor chip may deteriorate, or there is a fear that glue residue is likely to occur on the semiconductor chip or the like.

On the other hand, when content of organohydrogenpolysiloxane exceeds the said upper limit, there exists a possibility that unreacted organohydrogenpolysiloxane may contaminate a semiconductor chip. In addition, silicon atom-bonded hydrogen atoms (SiH groups) in the unreacted organohydrogenpolysiloxane react with oxygen and moisture in the air to change to SiOH, and the adhesive force of the pressure-sensitive adhesive layer 3 to the adherend increases, resulting in fragmentation There is a fear that the pick-up property of the used semiconductor chip may deteriorate.

As mentioned above, content of the crosslinking agent in the adhesive layer 3 of this embodiment is silicon of the whole crosslinking agent with respect to content (total amount) of the silicon atom bonding alkenyl groups in the whole silicone resin in the adhesive layer 3 What is necessary is just to adjust so that the molar ratio of content (total amount) of atom-bonded hydrogen atoms (SiH group) may become in the above-mentioned range. The content of the crosslinking agent satisfying this range also varies depending on the number of silicon atom-bonded hydrogen atoms (SiH groups) that the crosslinking agent has, for example, the entire silicone-based resin contained in the pressure-sensitive adhesive composition constituting the pressure-sensitive adhesive layer 3 . What is necessary is just to add a crosslinking agent so that it may become the range of 0.20 mass part or more and 20.00 mass part or less by solid content with respect to 100 mass parts of solid content of .

By making content of the crosslinking agent with respect to the silicone resin in the adhesive layer 3 into the above-mentioned range, when peeling a semiconductor chip from the adhesive tape for dicing, by irradiating light, such as an ultraviolet-ray, to the adhesive layer 3, the light in a silicone adhesive The sensitized platinum (Pt) catalyst is activated, and a crosslinking reaction between the silicon atom-bonded alkenyl group of the silicone gum (G _alk ) in the silicone-based resin and the silicon-bonded hydrogen atom (SiH group) of the crosslinking agent for the silicone-based resin ( addition reaction) is accelerated, the crosslinking density is increased, and the cohesive force of the pressure-sensitive adhesive is increased compared with before irradiation with ultraviolet rays or the like. As a result, the tackiness of the adhesive layer 3 falls appropriately, and while being able to implement|achieve the favorable pick-up property at the time of peeling a semiconductor chip etc. from the adhesive tape 1, it is possible to suppress the glue residue with respect to a semiconductor chip etc. becomes

As the crosslinking agent, it may be one generally used as a crosslinking agent for addition-reaction silicone pressure-sensitive adhesives, that is, an organopolysiloxane (organohydrogenpolysiloxane) having at least two silicon atom-bonded hydrogen atoms (SiH groups) in one molecule. It is not limited. Specific examples thereof include X-92-122 (trade name) manufactured by Shin-Etsu Chemical Co., Ltd., BY24-741 (trade name) manufactured by Dow-Toray Corporation, and the like. In addition, when content of the silicon atom-bonded hydrogen atom (SiH group) which these crosslinking agents have is unclear, the said content can be calculated|required by the analysis etc. of < ¹ >H-NMR (nuclear magnetic resonance) spectrum measurement mentioned later.

(Photosensitive Platinum (Pt) Catalyst)

The photosensitive platinum (Pt) catalyst is used to promote curing by addition reaction (hydrosilylation) of the silicone resin constituting the pressure-sensitive adhesive layer 3 and the crosslinking agent by irradiation of light such as ultraviolet light. The wavelength of light that can be used to accelerate curing by the addition reaction of the silicon atom-bonded alkenyl group of the silicone gum (G _alk ) in the silicone pressure-sensitive adhesive and the silicon atom-bonded hydrogen atom (SiH group) of the crosslinking agent is 240 nm or more and 400 It is preferably in the range of nm or less.

As the photosensitive platinum (Pt) catalyst, it is preferable to use a photoactive cyclopentadienyl platinum (IV) compound from the viewpoint of good photosensitivity and reaction rate.

Although it does not specifically limit as this photoactive cyclopentadienyl platinum (IV) compound, For example, (cyclopentadienyl) dimethyl trimethylsilyl methyl platinum, (cyclopentadienyl) diethyl trimethylsilyl methyl platinum, (cyclopentadienyl) Pentadienyl)dipropyltrimethylsilylmethylplatinum, (cyclopentadienyl)diisopropyltrimethylsilylmethylplatinum, (cyclopentadienyl)diallyltrimethylsilylmethylplatinum, (cyclopentadienyl)dibenzyltrimethylsilylmethylplatinum , (Cyclopentadienyl)dimethyltriethylsilylmethylplatinum, (cyclopentadienyl)dimethyltripropylsilylmethylplatinum, (cyclopentadienyl)dimethyltriisopropylsilylmethylplatinum, (cyclopentadienyl)dimethyltriphenyl Silylmethylplatinum, (cyclopentadienyl)dimethyldimethylphenylsilylmethylplatinum, (cyclopentadienyl)dimethylmethyldiphenylsilylmethylplatinum, (cyclopentadienyl)dimethyldimethyl(trimethylsiloxy)silylmethylplatinum, (cyclopentadienyl) Pentadienyl)dimethyldimethyl (dimethylvinylsiloxy)silylmethylplatinum, [(1'-naphthyl)cyclopentadienyl]trimethylsilylmethylplatinum, [(2'-naphthyl)cyclopentadienyl]trimethylsilylmethyl Platinum, [1-methyl-3-(1'-naphthyl)cyclopentadienyl]trimethylsilylmethylplatinum, [1-methyl-3-(2'-naphthyl)cyclopentadienyl]trimethylsilylmethylplatinum, [(4'-biphenyl)cyclopentadienyl]trimethylsilylmethylplatinum, [1-(4'-biphenyl)-3-methylcyclopentadienyl]trimethylsilylmethylplatinum, [(9'-phenanthryl) Cyclopentadienyl]trimethylsilylmethylplatinum, [1-methyl-3-(9'-phenanthryl)cyclopentadienyl]trimethylsilylmethylplatinum, [1-(2'-anthracenyl)-3-methylcyclopenta dienyl]trimethylsilylmethylplatinum, [(2'-anthracenyl)cyclopentadienyl]trimethylsilylmethylplatinum, [(1'-pyrenyl)cyclopentadienyl]trimethylsilylmethylplatinum, [1-methyl-3 -(1'-pyrenyl)cyclopentadienyl]trimethylsilylmethylplatinum etc. are mentioned.

The cyclopentadienyl ring in the above compounds is methyl, chloro, fluoro, trimethylsilyl, triethylsilyl, dimethylphenylsilyl, methyldiphenylsilyl, triphenylsilyl, phenyl, fluorophenyl, chlorophenyl, methoxy, naph tyl, biphenyl, anthracenyl, pyrenyl, 2-benzoyl naphthalene, thioxanthone, 2-chlorothioxanthone, 2-isopropylthioxanthone, anthraquinone, 1-chloroanthraquinone, acetophenone, benzophenone, It may be substituted with 9,10-dimethylanthracene, 9,10-dichloroanthracene, and a cyclopentadienyl ring substituted with one or more groups selected from these.

Moreover, in the compound mentioned above, the cyclopentadienyl ring may be substituted by (eta)5-fluorenyl group.

Examples of the cyclopentadienyl ring in the compound described above include unsubstituted ones, ones substituted with one or more aromatic organic groups, ones substituted with one or more aliphatic organic groups, and those substituted with one or more aromatic organic groups and one or more aliphatic organic groups. desirable. Moreover, as an organic group substituted by the cyclopentadienyl ring, naphthyl, biphenyl, anthracenyl, phenanthryl and pyrenyl are preferable.

The content of the photosensitive platinum (Pt) catalyst in the pressure-sensitive adhesive layer 3 of the present embodiment is determined by irradiation with light such as ultraviolet rays, the silicon atom-bonded alkenyl group and the crosslinking agent of the silicone gum ( _Galk ) in the silicone pressure-sensitive adhesive. It will not specifically limit, as long as the addition reaction of a silicon-atom-bonded hydrogen atom (SiH group) can be accelerated|stimulated. Content of the photosensitive platinum (Pt) catalyst in the adhesive layer 3 of this embodiment is solid with respect to 100 mass parts of solid content of the whole silicone resin in the adhesive composition which comprises the adhesive layer 3, for example. It is preferable to set it as 0.10 mass part or more and 3.00 mass part or less. When the content of the photosensitive platinum (Pt) catalyst is less than 0.10 parts by mass, when the adhesive tape 1 is irradiated with light such as ultraviolet light, the silicon atom-bonded alkenyl group of the silicone gum and the silicon atom-bonded hydrogen atom ( The crosslinking reaction (addition reaction) between SiH groups) does not fully advance, the improvement of a crosslinking density becomes inadequate, an adhesive becomes hard to harden|cure, and it becomes difficult to improve cohesion force. In this case, the desired reduction in tack or failure mode in the holding force test is not obtained, and after the adhesive tape 1 is used for dicing a semiconductor element substrate or the like, the obtained semiconductor chip or the like is peeled from the adhesive tape 1 . At this time, there is a fear that the pick-up property of the separated semiconductor chip may deteriorate, or there is a fear that glue residue is likely to occur on the semiconductor chip or the like. On the other hand, when the content of the photosensitive platinum (Pt) catalyst exceeds 3.00 parts by mass, the above crosslinking reaction (addition reaction) proceeds sufficiently. Although there is no problem, it is not preferable from a viewpoint of economical efficiency.

(other ingredients)

The silicone pressure-sensitive adhesive layer of the present embodiment is a silicone resin in which a silicone gum (G) and a silicone resin (R) are mixed as main components, and at least two silicon atom-bonded hydrogen atoms (SiH group) in one molecule as a crosslinking agent for the silicone resin. Although it consists of an organopolysiloxane which has and the adhesive composition containing a photosensitive platinum (Pt) catalyst, you may contain another component within the range which does not impair the effect of this invention. As other components, a cohesive force improving agent, a reinforcing filler, a peeling control agent, etc. are mentioned.

(cohesion enhancer)

The cohesive force improving agent is used as needed in order to improve the cohesive force of the adhesive layer 3 . Although it does not specifically limit as a cohesive force improving agent, For example, polyfunctional thiol is used. As a cohesive force improving agent which consists of polyfunctional thiol, Karenz (trademark) MT-PE1 by Showa Denko Co., Ltd., Karenz MT-NR1, etc. are mentioned, for example.

However, since the polyfunctional thiol is not compatible with the silicone-based resin in the pressure-sensitive adhesive composition constituting the pressure-sensitive adhesive layer 3, in order to use the polyfunctional thiol as a cohesive strength improving agent, a compatibilizer of the silicone-based resin and the polyfunctional thiol is used. need to use Although it does not specifically limit as a compatibilizer, For example, Shin-Etsu Chemical Industry Co., Ltd. KBM-802, KBM-803 (all are brand names), Dow-Toray Co., Ltd. SH6062 (brand name) which are silane coupling agents which have a mercapto group. ) and the like.

When using a cohesive force improver for the adhesive layer 3, as for the addition amount of a cohesive force improver, the range of 6 mass parts or less is preferable in solid content with respect to 100 mass parts of solid content of the whole silicone resin. When the amount of the cohesive enhancer added exceeds 6 parts by mass in terms of solid content relative to 100 parts by mass of the total solid content of the silicone-based resin, even if the compatibilizer is added, the silicone-based resin and the polyfunctional thiol as the cohesive improver may be phase-separated.

(reinforcing filler)

A reinforcing filler is used as needed in order to improve the intensity|strength of the adhesive layer 3 . Although it does not specifically limit as a reinforcing filler, For example, Nippon Aerosil Co., Ltd. Aerosil (trademark) 130, Aerosil 200, Aerosil 300, Tokuyama Corporation Leorosil (registered trademark) QS- 102, Leorosil QS-30, DSL. Japan Co., Ltd. Caprex (trademark) 80, PPG Hi-Sil (registered trademark)-233-D, etc. are mentioned.

(Peeling Control Agent)

A peeling control agent is used as needed in order to reduce the adhesive force of the adhesive layer 3 after light irradiation, such as an ultraviolet-ray, more. Although it does not specifically limit as a peeling control agent, For example, light peeling additives, such as silicone oil, are mentioned. However, if there is a large amount of the peeling control agent added, there is a risk of contamination of the surface of the adherend due to bleed-out.

<Thickness of adhesive layer>

The range of 10 micrometers or more and 100 micrometers or less is preferable, and, as for the thickness of the adhesive layer 3, the range of 20 micrometers or more and 40 micrometers or less is more preferable. Since the thickness of the silicone adhesive contained in the adhesive layer 3 becomes thin when the thickness of the adhesive layer 3 is less than 10 micrometers, the adhesive force of the adhesive tape 1 falls easily. On the other hand, when the thickness of the adhesive layer 3 is thicker than 100 micrometers, there exists a possibility that the cohesive failure of the adhesive layer 3 may become easy to generate|occur|produce. And after using the adhesive tape 1 for dicing of a semiconductor element board|substrate etc., when peeling the obtained semiconductor chip etc. from the adhesive tape 1, there exists a possibility that it may become easy to produce a glue residue on a semiconductor chip etc. Moreover, at the time of dicing a semiconductor element substrate etc., the vibration of dicing is transmitted easily to the adhesive layer 3, and a vibration amplitude becomes large, for example, there exists a possibility that a semiconductor element substrate may shift|deviate from a reference position. And with this, there is a fear that cracks (chipping) may occur in the individualized semiconductor chips, and there is a fear that a difference in size may occur for each semiconductor chip.

<Anchor coat layer>

As described above, in the pressure-sensitive adhesive tape 1 of the present embodiment, between the base material 2 and the pressure-sensitive adhesive layer 3 depending on the production conditions of the pressure-sensitive adhesive tape 1 or the conditions of use of the pressure-sensitive adhesive tape 1 after production. Then, an anchor coat layer according to the type of the base material 2 may be provided, or a surface treatment such as corona treatment may be performed. Thereby, it becomes possible to improve the adhesive force of the base material 2 and the adhesive layer 3 .

<Surface treatment>

The surface (surface opposite to the surface facing the adhesive layer 3) of the base material 2 may be surface-treated, such as a peelability improvement process. Although it does not specifically limit as a processing agent used for surface treatment of the base material 2, For example, Non-silicone type, such as a long-chain alkylvinyl monomer polymer, an alkylvinyl fluoride monomer polymer, polyvinyl alcohol carbamate, an aminoalkyd type resin, of a peeling treatment agent or the like can be used. As such a non-silicone-type peeling agent, the Lion Specialty Chemicals Co., Ltd. Piroyl (trademark) 1050, Piroyl 1200, etc. are mentioned, for example.

<Releasable Liner>

In addition, you may provide a peeling liner on the surface (surface on the opposite side to the surface which opposes the base material 2) of the adhesive layer 3 as needed. As a release liner, what gave the peeling process for improving releasability with the silicone adhesive contained in the adhesive layer 3 to films, such as paper, polyethylene, a polypropylene, a polyethylene terephthalate, can be used. Although it does not specifically limit as a material used for the peeling process of a release liner, For example, materials, such as a fluoroalkyl modified silicone, a long-chain alkylvinyl monomer polymer, and an aminoalkyd type resin, can be used.

<Thickness of adhesive tape>

As for the thickness as the whole of the adhesive tape 1 which has the structure as demonstrated above, the range of 20 micrometers or more and 200 micrometers or less is preferable.

When the thickness of the adhesive tape 1 is less than 20 µm and the adhesive tape 1 is used for dicing a semiconductor element substrate, it may be difficult to peel off the formed semiconductor chip or the like from the adhesive tape 1 . .

On the other hand, when the thickness of the adhesive tape 1 exceeds 200 µm and the adhesive tape 1 is affixed to the semiconductor element substrate, it becomes difficult for the adhesive tape 1 to follow the unevenness formed on the affixing surface of the semiconductor element substrate. . In this case, the adhesion area between the adhesive tape 1 and the semiconductor element substrate or the like becomes small, and there is a fear that the semiconductor chip or the like is likely to be scattered during dicing.

[Method for producing adhesive tape]

Then, the manufacturing method of the adhesive tape 1 of this embodiment is demonstrated. In addition, the manufacturing method of the adhesive tape 1 demonstrated below is an example, and the manufacturing method of the adhesive tape 1 is not limited to this.

When manufacturing the adhesive tape 1, first, components, such as a silicone adhesive, a crosslinking agent, a photosensitive platinum (Pt) catalyst, are dissolved in general-purpose organic solvents, such as toluene and ethyl acetate, to obtain an adhesive solution. Then, this adhesive solution is apply|coated so that it may become predetermined thickness using a comma coater etc. on the surface of the base material 2 which surface-treated and the formation of an anchor-coat layer as needed.

Next, by heating the base material 2 to which the adhesive solution was apply|coated with the drying furnace, the adhesive solution is dried and the adhesive layer 3 is formed. As conditions for heating and drying, the conditions disclosed in Unexamined-Japanese-Patent No. 2012-107125 etc. can be referred, for example. Specifically, for example, the pressure-sensitive adhesive solution for the pressure-sensitive adhesive layer 3 is applied to the base material 2, and the temperature is raised stepwise at a temperature of 40 to 90° C. in the total residual portion of the drying furnace, and after initial drying, the drying furnace What is necessary is to perform heat-drying for 1 to 5 minutes in the temperature range of 120-200 degreeC in the latter part of presence part, and to wind up as a roll-shaped master.

By the above process, as shown in FIG. 1, the adhesive tape 1 in which the adhesive layer 3 was laminated|stacked on the base material 2 is obtained.

[How to use the adhesive tape]

The adhesive tape 1 of this embodiment is used for the dicing of the semiconductor material used as the basis of a semiconductor chip in the manufacturing process of semiconductor chips which have semiconductor elements, such as an LED (Light Emitting Diode) and a power semiconductor.

Specifically, the adhesive tape 1 is used for dicing a semiconductor element substrate in which a plurality of semiconductor elements such as an LED element and a power semiconductor element are formed on a substrate made of resin, ceramic, or the like to obtain individualized semiconductor chips. do. Here, in a semiconductor element substrate in which a plurality of semiconductor elements are formed on the substrate, a sealing resin as an example of a covering material is usually provided so as to cover the semiconductor element in order to protect the semiconductor element from external environments such as temperature and humidity. .

The adhesive tape 1 of this embodiment can be used suitably especially by dicing of the semiconductor element board|substrate in which the sealing resin was provided.

As a method for cutting the semiconductor element substrate provided with the sealing resin and obtaining a some semiconductor chip, the following method is known conventionally, for example.

First, while sticking the adhesive tape for dicing from the board|substrate side of a semiconductor element board|substrate, a dicer etc. cut|disconnect a semiconductor element board|substrate from the side in which a semiconductor element is formed. And a some semiconductor chip is obtained by peeling each semiconductor chip formed by cutting|disconnection from an adhesive tape.

However, when the semiconductor element substrate is cut by attaching the adhesive tape for dicing from the substrate side of the semiconductor element substrate in this way, so-called sagging occurs in the cut surface (the substrate side of the semiconductor chip), or the cut surface is rough. There are tasks such as

Therefore, in recent years, in order to solve such a problem, an adhesive tape for dicing is affixed to the semiconductor element substrate not only from the substrate side but also from the side on which the semiconductor element is formed, that is, from the sealing resin side for sealing the semiconductor element, A method for cutting a semiconductor element substrate has been proposed.

Here, as a sealing resin for semiconductor elements such as LEDs and power semiconductors, conventionally, epoxy resins having excellent electrical properties and heat resistance have been used. However, when used for high-output LEDs and power semiconductors, epoxy resins are used for short-wavelength LEDs. There is a problem in that it is easy to discolor depending on the case or the usage environment of the semiconductor chip.

On the other hand, in recent years, silicone resin is often used as a sealing resin for semiconductor elements, such as an LED and a power semiconductor, because it is difficult to produce discoloration by heat or light compared with an epoxy resin. More specifically, a silicone resin containing both or one of a methyl group and a phenyl group as a functional group, that is, a silicone resin containing a methyl group, a silicone resin containing a phenyl group, and a silicone resin containing both a methyl group and a phenyl group are used. many.

By using a silicone resin as sealing resin of a semiconductor element, discoloration of the sealing resin by a heat|fever or light can be suppressed. Moreover, the light transmittance of a silicone resin is as high as 88% or more (wavelength 400-800 nm), and a refractive index can be adjusted in the range of 1.41 or more and 1.57 or less. For this reason, when the semiconductor element is an LED, by using a silicone resin with a higher refractive index as a sealing resin, the radiated light from the LED can be efficiently taken out to the outside of a package. Among the above-mentioned silicone resins, by using a silicone resin containing a phenyl group, compared with the case of using a silicone resin containing a methyl group, the refractive index of the sealing material can be made higher, so that the efficiency of emitted light can be further improved.

Although it does not specifically limit as a silicone resin containing a methyl group, For example, Shin-Etsu Chemical Co., Ltd. KER-2300, KER-2460, KER-2500N, KER-2600, KER-2700, KER-2900, X- 32-2528 (all brand names), Momentive Performance Materials Corporation IVS4312, IVS4312, XE14-C2042, IVS4542, IVS4546, IVS4622, IVS4632, IVS4742, IVS4752, IVSG3445, IVSG0810, IVSG5778, XE13-C2479 (all, IVSM4500 brand name), OE-6351, OE-6336, OE-6301 (all are brand names) by Dow Toray Corporation, etc. are mentioned.

Although it does not specifically limit as a silicone resin containing a methyl group and a phenyl group, For example, Shin-Etsu Chemical Co., Ltd. KER-6075, KER-6150, KER-6020 (all are brand names) etc. are mentioned.

Although it does not specifically limit as a silicone resin containing a phenyl group, For example, Shin-Etsu Chemical Co., Ltd. KER-6110, KER-6000, KER-6200, ASP-1111, ASP-1060, ASP-1120, ASP-1050P (all brand names), XE14-C2508 (trade name) manufactured by Momentive Performance Materials, OE-6520, OE-6550, OE-6631, OE-6636, OE-6635, OE-6630, manufactured by Dow Toray Corporation (all are brand names) etc. are mentioned.

By the way, conventionally, as an adhesive tape for dicing used in order to cut|disconnect a semiconductor element, the adhesive tape which consists of an adhesive layer of an acrylic resin type adhesive is used, for example.

However, when the semiconductor element substrate is diced by pasting such a conventional adhesive tape from the side where the semiconductor element is formed (sealing resin side) of the semiconductor element substrate, for example, the adhesive force between the sealing resin and the adhesive tape is insufficient. In one case, there is a fear that a problem such as scattering of the semiconductor chip during dicing may occur.

In particular, the above-mentioned silicone resin has a property with high releasability compared with the epoxy resin etc. which are conventionally used as sealing resin, for example. Therefore, when the adhesive tape which consists of an acrylic resin adhesive is affixed with respect to the semiconductor element board|substrate using a silicone resin as sealing resin, for example, the adhesive force of the silicone resin which is sealing resin and an adhesive tape becomes small easily. As a result, problems such as scattering of semiconductor chips are more likely to occur during dicing of the semiconductor element substrate.

In contrast, the pressure-sensitive adhesive tape 1 of the present embodiment, as described above, the pressure-sensitive adhesive layer 3 is a pressure-sensitive adhesive composition containing a silicone resin in which the silicone gum (G) and the silicone resin (R) are mixed in an appropriate ratio. In the case of performing dicing of a semiconductor element board|substrate by being comprised by it, even when it sticks and uses from the sealing resin side which consists of a silicone resin, the adhesive force and tack|tack force with respect to the sealing resin of a semiconductor element board|substrate can be hold|maintained favorably. And compared with the conventional adhesive tape, when dicing a semiconductor element board|substrate, generation|occurrence|production, such as scattering of a semiconductor chip, can be suppressed.

On the other hand, since the pressure-sensitive adhesive composition constituting the pressure-sensitive adhesive layer 3 contains a photosensitive platinum (Pt) catalyst and a crosslinking agent together with the above-described silicone resin, photosensitive platinum (Pt) in the silicone resin by irradiating light such as ultraviolet rays The catalyst is activated, and the crosslinking reaction (addition reaction) between the silicon atom-bonded alkenyl group of the silicone gum ( _Galk ) in the silicone-based resin and the silicon-bonded hydrogen atom (SiH group) of the crosslinking agent to the silicone-based resin is promoted. This increases the crosslinking density, so that the cohesive force of the pressure-sensitive adhesive becomes larger than before irradiation with ultraviolet rays or the like. As a result, the tackiness of the adhesive layer 3 falls suitably, and the fracture mode in a holding force test becomes "interface peeling" or a thing which "does not fall" in a holding force test. Thereby, while being able to implement|achieve favorable pick-up property at the time of peeling a semiconductor chip etc. from the adhesive tape 1, it becomes possible to suppress the glue residue to a semiconductor chip etc.

Hereinafter, the usage method of the adhesive tape 1 of this embodiment, and the manufacturing method of the semiconductor chip using the adhesive tape 1 of this embodiment are demonstrated in detail. 2A to 2E are diagrams showing a method for manufacturing a semiconductor chip using the adhesive tape 1 of the present embodiment.

In addition, the case where the semiconductor chip which has an LED element as a semiconductor element is manufactured using the adhesive tape 1 is mentioned as an example here, and it demonstrates. In addition, the method demonstrated below is an example of the usage method of the adhesive tape 1, and the manufacturing method of the semiconductor chip using the adhesive tape 1, It is not limited to the following methods.

In the present embodiment, first, a plurality of semiconductor elements 102 are mounted on a substrate 101 made of, for example, a resin material or ceramic, and the semiconductor element substrate 100 is produced. In addition, the semiconductor element 102 is, for example, an LED element, and although not shown in figure, for example, a plurality of semiconductor layers including a light-emitting layer that emits light by energization are stacked and constituted, and an electrode is formed on the top. have.

Next, the plurality of semiconductor elements formed on the substrate 101 of the semiconductor element substrate 100 are sealed with a sealing resin 103 made of a silicone-based resin (sealing step). In this example, the plurality of semiconductor elements 102 are sealed together with the sealing resin 103 , but each semiconductor element 102 may be individually sealed with the sealing resin 103 .

Then, as shown to Fig.2 (a), the adhesive tape 1 and a semiconductor element so that the adhesive layer 3 of the adhesive tape 1 may oppose the sealing resin 103 of the semiconductor element board|substrate 100, The board|substrate 100 is pasted together (pasting process).

Next, as shown to (b) and (c) of FIG. 2, in the state which bonded the adhesive tape 1 and the semiconductor element substrate 100 together, along the line X to be cut, the semiconductor element substrate 100 is cut by a dicer or the like (cutting process). In this example, the semiconductor element substrate 100 to which the adhesive tape 1 was affixed is cut|disconnected from the board|substrate 101 side. In addition, as shown in FIG.2(c), in this example, the so-called full cut which cuts all the semiconductor element substrate 100 in the thickness direction is performed.

Then, as shown in FIG.2(d), with respect to the adhesive tape 1 affixed on the semiconductor element board|substrate 100, the light of an ultraviolet-ray is irradiated from the base material 2 side (irradiation process). As mentioned above, the base material 2 is comprised by the material which transmits light, such as an ultraviolet-ray. Therefore, by irradiating light, such as an ultraviolet-ray, to the adhesive tape 1 from the base material 2 side, light, such as an ultraviolet-ray, is irradiated to the adhesive layer 3 through the base material 2 .

In the adhesive tape 1 of this embodiment, since the adhesive layer 3 has a photosensitive platinum (Pt) catalyst, when light, such as an ultraviolet-ray, is irradiated to the adhesive layer 3, a photosensitive platinum (Pt) catalyst is activated, and the addition reaction of the silicone-based resin containing the silicon atom-bonded alkenyl group in the pressure-sensitive adhesive layer 3 and the crosslinking agent is accelerated. Thereby, compared with before irradiation of light, such as an ultraviolet-ray, the crosslinking density in the adhesive layer 3, ie, cohesive force, rises, and the tackiness of the adhesive layer 3 falls.

Then, the semiconductor chip 200 formed by cutting the semiconductor element substrate 100 is peeled off (picked up) from the adhesive tape 1, as shown in Fig. 2(e), into pieces. A semiconductor chip 200 can be obtained (a peeling process).

As described above, in the pressure-sensitive adhesive tape 1 of the present embodiment, the pressure-sensitive adhesive layer 3 contains a silicone-based resin in which a silicone gum (G) and a silicone resin (R) are mixed in an appropriate ratio. Thereby, when using the adhesive tape 1 for dicing, the adhesive force and tack|tack force of the adhesive tape 1 with respect to the semiconductor element board|substrate 100 can be hold|maintained favorably.

In particular, in recent years, as the sealing resin 103 for sealing the semiconductor element 102, a silicone resin with high releasability is used in many cases. On the other hand, the adhesive tape 1 of this embodiment has favorable adhesive force and tackiness also to the sealing resin 103 which consists of a silicone resin by having the structure mentioned above.

As a result, when the adhesive tape 1 of this embodiment is used for the dicing of the semiconductor element substrate 100, scattering of the semiconductor chip 200 can be suppressed.

Further, the pressure-sensitive adhesive composition comprising the silicone-based resin constituting the pressure-sensitive adhesive layer 3 of the pressure-sensitive adhesive tape 1 of the present embodiment has good adhesion to the sealing resin 103 as described above, but has high releasability. has a character

That is, the adhesive tape 1 of this embodiment is photosensitive platinum which accelerates|stimulates the addition reaction of the silicone type resin containing a silicon atom-bonded alkenyl group in the adhesive layer 3, and a crosslinking agent by irradiation of light, such as an ultraviolet-ray, for example. (Pt) contains a catalyst. And by irradiating light, such as an ultraviolet-ray, to the adhesive layer 3 via the base material 2 before a peeling process after a cutting process, the photosensitive platinum (Pt) catalyst is activated, and a silicon atom in the adhesive layer 3 By promoting the addition reaction of the silicone-based resin containing a bonding alkenyl group and the crosslinking agent, the crosslinking density in the pressure-sensitive adhesive layer 3 is increased compared to before irradiation with light such as ultraviolet rays, that is, the cohesive force is increased, and the pressure-sensitive adhesive layer 3 ) may decrease the tackiness of Accordingly, in the peeling step, when the semiconductor chip 200 obtained by dicing the semiconductor element substrate 100 is peeled off (picked up) from the adhesive tape 1 , the adhesive is attached to the semiconductor chip 200 . Generation of so-called grass residues can be suppressed. In addition, good pickup properties at the time of peeling the semiconductor chip 200 from the adhesive tape 1 can be realized.

In addition, in the above, with respect to the semiconductor element board|substrate in which the some semiconductor element was formed on the board|substrate, the adhesive tape 1 was stuck from the sealing resin side, it diced, and demonstrated the method of obtaining the separated semiconductor chip. However, the use of the adhesive tape 1 of this embodiment is not limited to this.

The adhesive tape 1 of this embodiment is, for example, in the manufacture of a chip scale package LED, a plurality of LED elements are divided into pieces by dicing a semiconductor material coated with a phosphor as an example of a covering material. may be used to obtain In addition, the fluorescent substance is a member in which the fluorescent material is disperse|distributed to the resin material, ceramic, etc..

In recent years, with the miniaturization of chip scale package LEDs, the chip scale package LEDs divided into pieces during dicing tend to be scattered easily. On the other hand, by using the adhesive tape 1 of this embodiment which has the structure mentioned above, it becomes possible to hold|maintain favorable the adhesive force of a fluorescent substance and the adhesive layer 3, and scattering of the chip-scale package LED divided into pieces is suppressed. can do.

Furthermore, after dicing, by irradiating light, such as an ultraviolet-ray, to the adhesive layer 3 and reducing a tack force, while it becomes easy to peel the chip scale package LED separated into pieces from the adhesive tape 1, the peeled chip scale package Generation|occurrence|production of the pool residual with respect to an LED can be suppressed.

Example

Subsequently, the present invention will be more specifically described using Examples and Comparative Examples. In addition, this invention is not limited to a following example.

In order to adjust the various pressure-sensitive adhesive compositions used in Examples and Comparative Examples, the following silicone-based resins (a) to (h) as a main component of the pressure-sensitive adhesive composition, and an organo having the following silicon atom-bonded hydrogen atoms (SiH) as a crosslinking agent Polysiloxanes (organohydrogenpolysiloxanes) (m) and (n) were used.

The silicone resins (a) to (c) are a mixture of a silicone gum (G _alk ) containing a silicon atom-bonded alkenyl group and a silicone resin (R), and the mixing ratio and silicon atom-bonded alkenyl group content are different from each other. . A weight average molecular weight (Mw) of about 500,000 is used for the silicone gum ( _Galk ), a dimethylsiloxane/methylvinylsiloxane copolymer blocked with dimethylvinylsiloxy groups at both ends of the molecular chain, and for the silicone resin (R), a weight average An organopolysiloxane (MQ resin) having a molecular weight (Mw) of about 5,000 R ² ₃ SiO _0.5 units (M units) and SiO ₂ units (Q units) was used.

In addition, silicone-based resins (d) and (e) are both a single silicone gum (G _alk ) containing a silicon atom-bonded alkenyl group, and the silicon-atom-bonded alkenyl group content is different from each other. As the silicone gum (G _alk ) of the silicone resin (d), a dimethylsiloxane/methylhexenylsiloxane copolymer having a weight average molecular weight (Mw) of about 300,000 molecular chains capped with dimethylhexenylsiloxy groups at both ends is used, and a silicone resin ( For the silicone gum (G _alk ) of e), a dimethylsiloxane polymer having a weight average molecular weight (Mw) of about 200,000 in which dimethylvinylsiloxy groups are blocked at both ends of the molecular chain was used.

In addition, silicone resins (f) and (g) are mixtures of silicone gum (G ₀ ) and silicone resin (R) which do not both contain a silicon atom-bonded alkenyl group, and the mixing ratios are different from each other. A dimethylsiloxane polymer having a weight average molecular weight (Mw) of about 500,000 is used for the silicone gum (G ₀ ), and _0.5 units of R ² ₃ SiO having a weight average molecular weight (Mw) of about 5,000 for the silicone resin (R). Organopolysiloxane (MQ resin) having (M units) and SiO ₂ units (Q units) was used.

In addition, the silicone resin (h) is a single product of the silicone resin (R), and the silicone resin (R) has a weight average molecular weight (Mw) of about 5,000 R ² ₃ SiO _0.5 units (M units) and SiO ₂ Organopolysiloxane (MQ resin) having units (Q units) was used.

· Silicone-based resin (a)

Mixture of silicone gum (G _alk ) and silicone resin (R)

(G _alk )/(R)=40.0% by mass/60.0% by mass

Alkenyl group (vinyl group) content: 2.0×10 ^-6 mol/g

· Silicone-based resin (b)

Mixture of silicone gum (G _alk ) and silicone resin (R)

(G _alk )/(R) = 35.0 mass %/65.0 mass %

Alkenyl group (vinyl group) content: 1.8×10 ^-6 mol/g

· Silicone-based resin (c)

Mixture of silicone gum (G _alk ) and silicone resin (R)

(G _alk )/(R)=50.0% by mass/50.0% by mass

Alkenyl group (vinyl group) content: 2.5×10 ^-6 mol/g

· Silicone-based resin (d)

Silicon Gum ( _Galk ) Simplex

Alkenyl group (hexenyl group) content: 2.0×10 ^-4 mol/g

・Silicone-based resin (e)

Silicon Gum (G _alk ) Simplex

Alkenyl group (vinyl group) content: 2.7×10 ^-3 mol/g

· Silicone-based resin (f)

Mixture of silicone gum (G ₀ ) and silicone resin (R)

(G ₀ )/(R)=40.0% by mass/60.0% by mass

Alkenyl group free

· Silicone resin (g)

Mixture of silicone gum (G ₀ ) and silicone resin (R)

(G ₀ )/(R) = 60.0 mass %/40.0 mass %

Alkenyl group free

· Silicone-based resin (h)

Silicon resin (R) simple substance

Alkenyl group free

· Crosslinking agent (m)

Organohydrogenpolysiloxane

SiH group content: 2.0×10 ^-2 mol/g

・Crosslinking agent (n)

Organohydrogenpolysiloxane

SiH group content: 2.4×10 ^-3 mol/g

In addition, the alkenyl group content of the silicone resin used above and the SiH group content of the crosslinking agent were quantified by measuring a ¹ H-NMR (nuclear magnetic resonance) spectrum at 500 MHz. Specifically, the non-volatile component of the silicone resin is sufficiently dissolved in deuterated chloroform containing dimethyl sulfoxide as an internal standard sample, and ¹ H- NMR (nuclear magnetic resonance) spectra were measured. Next, the resonance signal area (integrated value) of dimethyl sulfoxide, which is an internal standard sample, and the resonance signal area (integrated value) of the alkenyl group in the measurement spectrum are obtained, and from the ratio, the alkenyl group per 1 g (solid content) of the silicone resin is obtained. content was calculated. In addition, regarding the SiH group content of the crosslinking agent, the ¹ H-NMR spectrum is measured in the same way, and the resonance signal area (integral value) of dimethyl sulfoxide, which is an internal standard sample, and the resonance signal area of the SiH group in the measurement spectrum ( integral value) was calculated|required, and content of SiH group per 1 g (solid content) of a crosslinking agent was computed from the ratio. In addition, when a crosslinking agent is internally added to a silicone resin from the beginning, what is necessary is just to calculate content of an alkenyl group and SiH group simultaneously from the 1H ^- NMR spectrum.

1. Preparation of adhesive tape

(Example 1)

<Preparation of silicone resin solution>

The silicone-based resin (S1) in which the silicone-based resin (a) and the silicone-based resin (d) are mixed so that the mass ratio (a)/(d) is 96.85/3.15 is diluted and stirred with toluene, and the silicone-based resin (S1) solution (solid content concentration) 30 mass %) was prepared. In this silicone resin (S1), the mixing ratio ((G)/(R)) of the silicone gum (G) and the silicone resin (R) was 41.9/58.1, and the alkenyl group content was 8.2×10 ^-6 mol/g. . Here, the total mass of silicone gum (G) is the total amount of "silicone gum ( _Galk ) of silicone-based resin (a)" and "silicone gum ( _Galk ) of silicone-based resin (d)." In addition, the total mass of the silicone resin (R) is the quantity of the silicone resin (R) of a silicone resin (a).

<Preparation of crosslinking agent solution>

Next, the crosslinking agent (C1) in which the crosslinking agent (m) and the crosslinking agent (n) are mixed so that the mass ratio (m)/(n) is 8.82/91.18 is diluted and stirred with toluene, and the crosslinking agent (C1) solution (solid content concentration 20) mass %) was prepared. This crosslinking agent (C1) had a SiH group content of 4.0x10 ^-3 mol/g.

<Preparation of adhesive solution>

Then, with respect to 333.00 parts by mass of the silicone-based resin (S1) solution (100 parts by mass in terms of solid content), 3.50 parts by mass of the crosslinking agent (C1) solution (0.70 parts by mass in terms of solid content, molar ratio of SiH groups/alkenyl groups = 3.4) was dissipated. It was blended with a fur, and stirred and mixed uniformly. Next, 5.13 parts by mass of a solution obtained by diluting a photosensitive platinum (Pt) catalyst "trimethyl (methylcyclopentadienyl) platinum (IV)" manufactured by Sigma-Aldrich Japan Co., Ltd. to a solid content concentration of 15 mass % with toluene (0.77 mass parts in terms of solid content) ) was mix|blended with a disper, stirred and mixed uniformly, and the adhesive solution for coating was produced.

Then, this adhesive solution was apply|coated on the base material 2 which consists of a 38-micrometer-thick polyethylene terephthalate (PET) film. Then, in the first half of the drying furnace, the pressure-sensitive adhesive solution applied on the substrate 2 is dried in stages at a temperature of 40 to 90° C., and further, a zone in which the maximum temperature of the heat treatment provided in the second half of the drying furnace is 120° C. It dried by heating for 3 minutes, and the thickness after drying formed the adhesive layer 3 of 20 micrometers. Next, the release liner subjected to a release treatment with a fluoroalkyl-modified silicone was bonded to the pressure-sensitive adhesive layer 3 . Thereby, the adhesive tape 1 whose total thickness after drying is 58 micrometers was obtained.

(Example 2)

<Preparation of silicone resin solution>

The silicone-based resin (S2) in which the silicone-based resin (b), the silicone-based resin (d), and the silicone-based resin (h) is mixed so that the mass ratio (b)/(d)/(h) is 97.30/0.95/1.75 is diluted with toluene It stirred to prepare a silicone-type resin (S2) solution (solid content concentration of 30 mass %). This silicone resin (S2) had a mixing ratio ((G)/(R)) of silicone gum (G) and silicone resin (R) of 35.0/65.0, and an alkenyl group content of 3.6×10 ^-6 mol/g. . Here, the total mass of silicone gum (G) is the total amount of "silicone gum ( _Galk ) of silicone-based resin (b)" and "silicone gum ( _Galk ) of silicone-based resin (d)." In addition, the total mass of silicone resin (R) is a total amount of "silicone resin (R) of silicone resin (b)" and "silicone resin (R) of silicone resin (h)."

<Preparation of crosslinking agent solution>

Next, the crosslinking agent (C2) in which the crosslinking agent (m) and the crosslinking agent (n) are mixed so that the mass ratio (m)/(n) is 2.83/97.17 is diluted and stirred with toluene, and the crosslinking agent (C2) solution (solid content concentration 20) mass %) was prepared. This crosslinking agent (C2) had a SiH group content of 2.9 x 10 ^-3 mol/g.

<Preparation of adhesive solution>

Then, with respect to 333.00 parts by mass of the silicone-based resin (S2) solution (100 parts by mass in terms of solid content), 3.30 parts by mass of the crosslinking agent (C2) solution (0.66 parts by mass in terms of solid content, molar ratio of SiH group/alkenyl group = 5.3) is dissipated It was blended with a fur, and stirred and mixed uniformly. Next, 5.20 parts by mass of a solution obtained by diluting a photosensitive platinum (Pt) catalyst "trimethyl (methylcyclopentadienyl) platinum (IV)" manufactured by Sigma-Aldrich Japan Co., Ltd. to a solid content concentration of 15 mass % with toluene (0.78 mass parts in terms of solid content) ) was mix|blended with a disper, stirred and mixed uniformly, and the adhesive solution for coating was produced.

Then, this adhesive solution was apply|coated on the base material 2 which consists of a 12-micrometer-thick polyethylene terephthalate (PET) film. Then, in the first half of the drying furnace, the pressure-sensitive adhesive solution applied on the substrate 2 is dried in stages at a temperature of 40 to 90° C., and further, a zone in which the maximum temperature of the heat treatment provided in the second half of the drying furnace is 120° C. It dried by heating for 3 minutes, and the thickness after drying formed the adhesive layer 3 of 10 micrometers. Next, the release liner subjected to a release treatment with a fluoroalkyl-modified silicone was bonded to the pressure-sensitive adhesive layer 3 . Thereby, the adhesive tape 1 whose total thickness after drying is 22 micrometers was obtained.

(Example 3)

<Preparation of silicone resin solution>

Silicone-based resin (S3), which is a mixture of silicone-based resin (c), silicone-based resin (d), and silicone-based resin (h), in a mass ratio (c)/(d)/(h) of 92.66/3.63/3.71, is diluted with toluene It stirred to prepare a silicone-type resin (S3) solution (solid content concentration of 30 mass %). In this silicone resin (S3), the mixing ratio ((G)/(R)) of the silicone gum (G) and the silicone resin (R) was 50.0/50.0, and the alkenyl group content was 9.6×10 ^-6 mol/g. . Here, the total mass of silicone gum (G) is the total amount of "silicone gum ( _Galk ) of silicone-based resin (c)" and "silicone gum ( _Galk ) of silicone-based resin (d)." Incidentally, the total mass of the silicone resin (R) is the total amount of the silicone resin (R) of the silicone-based resin (c) and the silicone resin (R) of the silicone-based resin (h).

<Preparation of crosslinking agent solution>

Next, the crosslinking agent (C3) in which the crosslinking agent (m) and the crosslinking agent (n) are mixed so that the mass ratio (m)/(n) is 10.43/89.57 is diluted and stirred with toluene, and the crosslinking agent (C3) solution (solid content concentration 20) mass %) was prepared. This crosslinking agent (C3) had a SiH group content of 4.2x10 ^-3 mol/g.

<Preparation of adhesive solution>

Then, with respect to 333.00 parts by mass of the silicone-based resin (S3) solution (100 parts by mass in terms of solid content), 3.45 parts by mass of the crosslinking agent (C3) solution (0.69 parts by mass in terms of solid content, molar ratio of SiH group/alkenyl group = 3.0) is dissipated. It was blended with a fur, and stirred and mixed uniformly. Next, 4.93 parts by mass of a solution obtained by diluting a photosensitive platinum (Pt) catalyst "trimethyl (methylcyclopentadienyl) platinum (IV)" manufactured by Sigma-Aldrich Japan Co., Ltd. to a solid content concentration of 15 mass % with toluene (0.74 mass parts in terms of solid content) ) was mix|blended with a disper, stirred and mixed uniformly, and the adhesive solution for coating was produced.

Then, this adhesive solution was apply|coated on the base material 2 which consists of a 50-micrometer-thick polyethylene terephthalate (PET) film. Then, in the first half of the drying furnace, the pressure-sensitive adhesive solution applied on the substrate 2 is dried in stages at a temperature of 40 to 90° C., and further, a zone in which the maximum temperature of the heat treatment provided in the second half of the drying furnace is 120° C. It dried by heating for 3 minutes, and the thickness after drying formed the adhesive layer 3 of 40 micrometers. Next, the release liner subjected to a release treatment with a fluoroalkyl-modified silicone was bonded to the pressure-sensitive adhesive layer 3 . Thereby, the adhesive tape 1 whose total thickness after drying is 90 micrometers was obtained.

(Example 4)

<Preparation of silicone resin solution>

The silicone-based resin (S4) in which the silicone-based resin (a) and the silicone-based resin (d) are mixed so that the mass ratio (a)/(d) is 98.08/1.92 is diluted and stirred with toluene, and the silicone-based resin (S4) solution (solid content concentration) 30 mass %) was prepared. In this silicone resin (S4), the mixing ratio ((G)/(R)) of the silicone gum (G) and the silicone resin (R) was 41.2/58.8, and the alkenyl group content was 5.8×10 ^-6 mol/g. . Here, the total mass of silicone gum (G) is the total amount of "silicone gum ( _Galk ) of silicone-based resin (a)" and "silicone gum ( _Galk ) of silicone-based resin (d)." In addition, the total mass of the silicone resin (R) is the quantity of the silicone resin (R) of a silicone resin (a).

<Preparation of crosslinking agent solution>

Next, the crosslinking agent (C4) in which the crosslinking agent (m) and the crosslinking agent (n) are mixed so that the mass ratio (m)/(n) is 10.43/89.57 is diluted and stirred with toluene, and the crosslinking agent (C4) solution (solid content concentration 20) mass %) was prepared. This crosslinking agent (C4) had a SiH group content of 4.2 x 10 ^-3 mol/g.

<Preparation of adhesive solution>

Then, with respect to 333.00 parts by mass of the silicone resin (S4) solution (100 parts by mass in terms of solid content), 1.80 parts by mass of the crosslinking agent (C4) solution (0.36 parts by mass in terms of solid content, the molar ratio of SiH groups/alkenyl groups = 2.6) was dissipated. It was blended with a fur, and stirred and mixed uniformly. Next, 5.20 parts by mass of a solution obtained by diluting a photosensitive platinum (Pt) catalyst "trimethyl (methylcyclopentadienyl) platinum (IV)" manufactured by Sigma-Aldrich Japan Co., Ltd. to a solid content concentration of 15 mass % with toluene (0.78 mass parts in terms of solid content) ) was mix|blended with a disper, stirred and mixed uniformly, and the adhesive solution for coating was produced.

Then, this adhesive solution was apply|coated on the base material 2 which consists of a 38-micrometer-thick polyethylene terephthalate (PET) film. Then, in the first half of the drying furnace, the pressure-sensitive adhesive solution applied on the substrate 2 is dried in stages at a temperature of 40 to 90° C., and further, a zone in which the maximum temperature of the heat treatment provided in the second half of the drying furnace is 120° C. It dried by heating for 3 minutes, and the thickness after drying formed the adhesive layer 3 of 20 micrometers. Next, the release liner subjected to a release treatment with a fluoroalkyl-modified silicone was bonded to the pressure-sensitive adhesive layer 3 . Thereby, the adhesive tape 1 whose total thickness after drying is 58 micrometers was obtained.

(Example 5)

A crosslinking agent (C5) solution is prepared as follows, and in preparation of an adhesive solution, the crosslinking agent is changed from a crosslinking agent (C4) solution to a crosslinking agent (C5) solution, and the compounding quantity of a crosslinking agent (C5) solution is 8.30 mass parts (solid content conversion). Except having changed into 1.66 mass parts and molar ratio =8.0 of SiH group/alkenyl group), it carried out similarly to Example 4, and obtained the adhesive tape 1 whose total thickness after drying is 58 micrometers.

<Preparation of crosslinking agent solution>

The crosslinking agent (C5) in which the crosslinking agent (m) and the crosslinking agent (n) were mixed so that the mass ratio (m)/(n) was 2.28/97.72 was diluted and stirred with toluene, and the crosslinking agent (C5) solution (solid content concentration 20% by mass) was prepared This crosslinking agent (C5) had a SiH group content of 2.8x10 ^-3 mol/g.

(Example 6)

The crosslinking agent (C6) solution is prepared as follows, and in the preparation of the pressure-sensitive adhesive solution, the crosslinking agent is changed from the crosslinking agent (C4) solution to the crosslinking agent (C6) solution, and the blending amount of the crosslinking agent (C6) solution is 3.45 parts by mass (in terms of solid content) 0.69 mass part, SiH group/alkenyl group molar ratio = 4.0), except having changed the compounding quantity of the solution of a photosensitive platinum (Pt) catalyst to 1.93 mass part (0.29 mass part in terms of solid content), it carried out similarly to Example 4 The adhesive tape (1) whose total thickness after drying is 58 micrometers was obtained.

<Preparation of crosslinking agent solution>

The crosslinking agent (C6) in which the crosslinking agent (m) and the crosslinking agent (n) were mixed so that the mass ratio (m)/(n) was 5.50/94.50 was diluted and stirred with toluene, and the crosslinking agent (C6) solution (solid content concentration 20% by mass) was prepared This crosslinking agent (C6) had a SiH group content of 3.4x10 ^-3 mol/g.

(Example 7)

In the preparation of the pressure-sensitive adhesive solution, the total thickness after drying was 58 µm in the same manner as in Example 6 except that the blending amount of the photosensitive platinum (Pt) catalyst solution was changed to 19.60 parts by mass (2.94 parts by mass in terms of solid content). Tape (1) was obtained.

(Example 8)

A silicone-based resin (S5) solution is prepared as follows, and in the preparation of the pressure-sensitive adhesive solution, the mixing amount of the crosslinking agent (C6) solution is 2.85 parts by mass (0.57 parts by mass in terms of solid content, molar ratio of SiH group/alkenyl group = 3.7), light It carried out similarly to Example 6 except having changed the compounding quantity of the solution of the sensitized platinum (Pt) catalyst to 4.40 mass parts (0.66 mass parts in terms of solid content), and having changed the thickness after drying of the adhesive layer 3 to 30 micrometers, The adhesive tape (1) whose total thickness after drying is 68 micrometers was obtained.

<Preparation of silicone resin solution>

Silicone-based resin (S5) obtained by mixing silicone-based resin (a), silicone-based resin (d), and silicone-based resin (f) so that the mass ratio (a)/(d)/(f) is 81.99/1.61/16.40 is diluted with toluene It stirred to prepare a silicone-type resin (S5) solution (solid content concentration of 30 mass %). In this silicone resin (S5), the mixing ratio ((G)/(R)) of the silicone gum (G) and the silicone resin (R) was 49.2/50.8, and the alkenyl group content was 5.3×10 ^-6 mol/g. . Here, the total mass of the silicone gum (G) is "silicone gum (G _alk ) of silicone resin (a)" and "silicone gum (G _alk ) of silicone resin (d)" and "silicone of silicone resin (f)" It is the total amount of "gum (G ₀ )". In addition, the total mass of silicone resin (R) is a total amount of "silicone resin (R) of silicone resin (a)" and "silicone resin (R) of silicone resin (f)."

(Example 9)

<Preparation of silicone resin solution>

The mass ratio (a)/(d)/(f)/(h) of silicone-based resin (a) and silicone-based resin (d), silicone-based resin (f) and silicone-based resin (h) is 66.49/0.26/26.60/6.65 The mixed silicone resin (S6) was diluted and stirred with toluene to prepare a silicone resin (S6) solution (solid content concentration of 30% by mass). This silicone resin (S6) had a mixing ratio ((G)/(R)) of silicone gum (G) and silicone resin (R) of 37.5/62.5 and an alkenyl group content of 1.9×10 ^-6 mol/g. . Here, the total mass of the silicone gum (G) is "silicone gum (G _alk ) of silicone resin (a)" and "silicone gum (G _alk ) of silicone resin (d)" and "silicone of silicone resin (f)" It is the total amount of "gum (G ₀ )". In addition, the total mass of the silicone resin (R) is "silicone resin (R) of silicone resin (a)" and "silicone resin (R) of silicone resin (f)" and "silicone resin (h) of silicone resin (h)"R)".

<Preparation of crosslinking agent solution>

Next, the crosslinking agent (C7) in which the crosslinking agent (m) and the crosslinking agent (n) are mixed so that the mass ratio (m)/(n) is 1.15/98.85 is diluted and stirred with toluene, and the crosslinking agent (C7) solution (solid content concentration 20) mass %) was prepared. This crosslinking agent (C7) had a SiH group content of 2.6x10 ^-3 mol/g.

<Preparation of adhesive solution>

Then, with respect to 333.00 parts by mass of the silicone-based resin (S6) solution (100 parts by mass in terms of solid content), 2.20 parts by mass of the crosslinking agent (C7) solution (0.44 parts by mass in terms of solid content, molar ratio of SiH group/alkenyl group = 6.2) was dissipated. It was blended with a fur, and stirred and mixed uniformly. Next, 3.53 parts by mass of a solution obtained by diluting a photosensitive platinum (Pt) catalyst "trimethyl(methylcyclopentadienyl)platinum (IV)" manufactured by Sigma-Aldrich Japan Co., Ltd. to a solid content concentration of 15 mass% with toluene (0.53 mass parts in terms of solid content) ) was mix|blended with a disper, stirred and mixed uniformly, and the adhesive solution for coating was produced.

Then, this adhesive solution was apply|coated on the base material 2 which consists of a 38-micrometer-thick polyethylene terephthalate (PET) film. Then, in the first half of the drying furnace, the pressure-sensitive adhesive solution applied on the substrate 2 is dried in stages at a temperature of 40 to 90° C., and further, a zone in which the maximum temperature of the heat treatment provided in the second half of the drying furnace is 120° C. It dried by heating for 3 minutes, and the 30-micrometer-thick adhesive layer 3 after drying was formed. Next, the release liner subjected to a release treatment with a fluoroalkyl-modified silicone was bonded to the pressure-sensitive adhesive layer 3 . Thereby, the adhesive tape 1 whose total thickness after drying is 68 micrometers was obtained.

(Example 10)

<Preparation of silicone resin solution>

Silicone-based resin (S7) obtained by mixing silicone-based resin (c), silicone-based resin (d) and silicone-based resin (f) so that the mass ratio (c)/(d)/(f) is 71.18/0.35/28.47 is diluted with toluene It stirred to prepare a silicone-type resin (S7) solution (solid content concentration of 30 mass %). In this silicone resin (S7), the mixing ratio ((G)/(R)) of the silicone gum (G) and the silicone resin (R) was 47.3/52.7, and the alkenyl group content was 2.5×10 ^-6 mol/g. . Here, the total mass of silicone gum (G) is the total amount of "silicone gum ( _Galk ) of silicone-based resin (c)" and "silicone gum ( _Galk ) of silicone-based resin (d)." In addition, the total mass of silicone resin (R) is a total amount of "silicone resin (R) of silicone-based resin (c)" and "silicone resin (R) of silicone-based resin (f)."

<Preparation of crosslinking agent solution>

Next, the crosslinking agent (C8) in which the crosslinking agent (m) and the crosslinking agent (n) are mixed so that the mass ratio (m)/(n) is 1.44/98.56 is diluted and stirred with toluene, and the crosslinking agent (C8) solution (solid content concentration 20) mass %) was prepared. This crosslinking agent (C8) had a SiH group content of 2.7 x 10 ^-3 mol/g.

<Preparation of adhesive solution>

Then, with respect to 333.00 parts by mass of the silicone-based resin (S7) solution (100 parts by mass in terms of solid content), 2.35 parts by mass of the crosslinking agent (C8) solution (0.47 parts by mass in terms of solid content, molar ratio of SiH group/alkenyl group = 5.1) is dissipated It was blended with a fur, and stirred and mixed uniformly. Next, 3.80 parts by mass of a solution obtained by diluting a photosensitive platinum (Pt) catalyst "trimethyl(methylcyclopentadienyl)platinum (IV)" manufactured by Sigma-Aldrich Japan Co., Ltd. to a solid content concentration of 15 mass % with toluene (0.57 mass parts in terms of solid content) ) was mix|blended with a disper, stirred and mixed uniformly, and the adhesive solution for coating was produced.

Then, this adhesive solution was apply|coated on the base material 2 which consists of a 38-micrometer-thick polyethylene terephthalate (PET) film. Then, in the first half of the drying furnace, the pressure-sensitive adhesive solution applied on the substrate 2 is dried in stages at a temperature of 40 to 90° C., and further, a zone in which the maximum temperature of the heat treatment provided in the second half of the drying furnace is 120° C. It dried by heating for 3 minutes, and the 30-micrometer-thick adhesive layer 3 after drying was formed. Next, the release liner subjected to a release treatment with a fluoroalkyl-modified silicone was bonded to the pressure-sensitive adhesive layer 3 . Thereby, the adhesive tape 1 whose total thickness after drying is 68 micrometers was obtained.

(Comparative Example 1)

The silicone-based resin (S8) solution is prepared as follows, and in the preparation of the adhesive solution, the silicone-based resin is changed from the silicone-based resin (S4) solution to the silicone-based resin (S8) solution, without adding a crosslinking agent, the pressure-sensitive adhesive layer (3) ) except having set the thickness after drying to 35 micrometers, it carried out similarly to Example 4, and obtained the adhesive tape 1 whose total thickness after drying is 73 micrometers.

<Preparation of silicone resin solution>

The silicone-based resin (S8) in which the silicone-based resin (a) and the silicone-based resin (e) are mixed so that the mass ratio (a)/(e) becomes 99.75/0.25 is diluted and stirred with toluene, and the silicone-based resin (S8) solution (solid concentration) 30 mass %) was prepared. In this silicone resin (S8), the mixing ratio ((G)/(R)) of the silicone gum (G) and the silicone resin (R) was 40.1/59.9, and the alkenyl group content was 8.7×10 ^-6 mol/g. . Here, the total mass of silicone gum (G) is the total amount of "silicone gum ( _Galk ) of silicone-based resin (a)" and "silicone gum ( _Galk ) of silicone-based resin (e)." In addition, the total mass of the silicone resin (R) is the quantity of the silicone resin (R) of a silicone resin (a).

(Comparative Example 2)

In the preparation of the pressure-sensitive adhesive solution, instead of 1.93 parts by mass of a solution of a photosensitive platinum (Pt) catalyst "trimethyl (methylcyclopentadienyl) platinum (IV)" manufactured by Sigma-Aldrich Japan Co., Ltd., platinum (Pt) manufactured by Dow-Toray Corporation ) Using 5.88 parts by mass (1.47 parts by mass in terms of solid content) of a solution of metal-based catalyst "NC-25" (brand name, solid content concentration of 25 mass %), except that the thickness after drying of the pressure-sensitive adhesive layer 3 was 20 µm , It carried out similarly to Example 6, and obtained the adhesive tape 1 whose total thickness after drying is 58 micrometers.

(Comparative Example 3)

<Preparation of silicone resin solution>

Silicone-based resin (S9), in which a silicone-based resin (d), a silicone-based resin (f), and a silicone-based resin (h) are mixed so that the mass ratio (d)/(f)/(h) is 0.18/90.75/9.07, is diluted with toluene It stirred to prepare a silicone-type resin (S9) solution (solid content concentration of 30 mass %). In this silicone resin (S9), the mixing ratio ((G)/(R)) of the silicone gum (G) and the silicone resin (R) was 36.5/63.5, and the alkenyl group content was 3.6×10 ^-7 mol/g. . Here, the total mass of the silicone gum (G) is the total amount of "silicone gum (G _alk ) of silicone resin (d)" and "silicone gum (G ₀ ) of silicone resin (f)". In addition, the total mass of silicone resin (R) is the total amount of "silicone resin (R) of silicone-type resin (f)" and "silicone resin (R) of silicone-based resin (h)."

<Preparation of crosslinking agent solution>

Next, the crosslinking agent (C9) in which the crosslinking agent (m) and the crosslinking agent (n) are mixed so that the mass ratio (m)/(n) is 0.58/99.42 is diluted and stirred with toluene, and the crosslinking agent solution (solid content concentration 20% by mass) was prepared This crosslinking agent (C9) had a SiH group content of 2.5 x 10 ^-3 mol/g.

<Preparation of adhesive solution>

Then, with respect to 333.00 parts by mass of the silicone resin (S9) solution (100 parts by mass in terms of solid content), 3.00 parts by mass of the crosslinking agent (C9) solution (0.60 parts by mass in terms of solid content, molar ratio of SiH group/alkenyl group = 42.4) is dissipated. It was blended with a fur, and stirred and mixed uniformly. Next, 4.87 parts by mass of a solution obtained by diluting a photosensitive platinum (Pt) catalyst "trimethyl(methylcyclopentadienyl)platinum (IV)" manufactured by Sigma-Aldrich Japan Co., Ltd. to a solid content concentration of 15 mass % with toluene (0.73 mass parts in terms of solid content) ) was mix|blended with a disper, stirred and mixed uniformly, and the adhesive solution for coating was produced.

Then, this adhesive solution was apply|coated on the base material 2 which consists of a 38-micrometer-thick polyethylene terephthalate (PET) film. Then, in the first half of the drying furnace, the pressure-sensitive adhesive solution applied on the substrate 2 is dried in stages at a temperature of 40 to 90° C., and further, a zone in which the maximum temperature of the heat treatment provided in the second half of the drying furnace is 120° C. It dried by heating for 3 minutes, and the 30-micrometer-thick adhesive layer 3 after drying was formed. Next, the release liner subjected to a release treatment with a fluoroalkyl-modified silicone was bonded to the pressure-sensitive adhesive layer 3 . Thereby, the adhesive tape 1 whose total thickness after drying is 68 micrometers was obtained.

(Comparative Example 4)

<Preparation of silicone resin solution>

The silicone-based resin (S10) in which the silicone-based resin (d) and the silicone-based resin (g) are mixed so that the mass ratio (d)/(g) is 5.56/94.44 is diluted and stirred with toluene, and the silicone-based resin (S10) solution (solid content concentration) 30 mass %) was prepared. This silicone resin (S10) had a mixing ratio ((G)/(R)) of silicone gum (G) and silicone resin (R) of 62.2/37.8, and an alkenyl group content of 1.1×10 ⁻⁵ mol/g. . Here, the total mass of silicone gum (G) is the total amount of "silicone gum (G _alk ) of silicone resin (d)" and "silicone gum (G ₀ ) of silicone resin (g)." In addition, the total mass of the silicone resin (R) is the quantity of the silicone resin (R) of a silicone resin (g).

<Preparation of crosslinking agent solution>

Next, the crosslinking agent (C10) in which the crosslinking agent (m) and the crosslinking agent (n) are mixed so that the mass ratio (m)/(n) is 14.88/85.12 is diluted and stirred with toluene, and the crosslinking agent (C10) solution (solid content concentration 20) mass %) was prepared. This crosslinking agent (C10) had a SiH group content of 5.0 x 10 ^-3 mol/g.

<Preparation of adhesive solution>

Then, with respect to 333.00 parts by mass of the silicone-based resin (S10) solution (100 parts by mass in terms of solid content), 3.65 parts by mass of the crosslinking agent (C10) solution (0.73 parts by mass in terms of solid content, molar ratio of SiH group/alkenyl group = 3.3) is dissipated It was blended with a fur, and stirred and mixed uniformly. Then, 5.07 parts by mass of a solution obtained by diluting a photosensitive platinum (Pt) catalyst "trimethyl(methylcyclopentadienyl)platinum (IV)" manufactured by Sigma-Aldrich Japan Co., Ltd. to a solid concentration of 15% by mass with toluene (0.76 parts by mass in terms of solid content) ) was mix|blended with a disper, stirred and mixed uniformly, and the adhesive solution for coating was produced.

Then, this adhesive solution was apply|coated on the base material 2 which consists of a 38-micrometer-thick polyethylene terephthalate (PET) film. Then, in the first half of the drying furnace, the pressure-sensitive adhesive solution applied on the substrate 2 is dried in stages at a temperature of 40 to 90° C., and further, a zone in which the maximum temperature of the heat treatment provided in the second half of the drying furnace is 120° C. It dried by heating for 3 minutes, and the thickness after drying formed the adhesive layer 3 of 40 micrometers. Next, the release liner subjected to a release treatment with a fluoroalkyl-modified silicone was bonded to the pressure-sensitive adhesive layer 3 . Thereby, the adhesive tape 1 whose total thickness after drying is 78 micrometers was obtained.

(Comparative Example 5)

A silicone-based resin (S11) solution is prepared as follows, and in the preparation of the pressure-sensitive adhesive solution, the blending amount of the photosensitive platinum (Pt) catalyst solution is changed to 5.07 parts by mass (0.76 parts by mass in terms of solid content), and the pressure-sensitive adhesive layer 3 ) except having changed the thickness after drying into 20 micrometers, it carried out similarly to Example 2, and obtained the adhesive tape 1 whose total thickness after drying is 58 micrometers.

<Preparation of silicone resin solution>

Silicone-based resin (S11) in which the silicone-based resin (b), silicone-based resin (d), and silicone-based resin (h) are mixed so that the mass ratio (b)/(d)/(h) is 91.76/0.90/7.34 is diluted with toluene It stirred to prepare a silicone-type resin (S11) solution (solid content concentration of 30 mass %). In this silicone resin (S11), the mixing ratio ((G)/(R)) of the silicone gum (G) and the silicone resin (R) was 33.0/67.0, and the alkenyl group content was 3.4×10 ^-6 mol/g. . Here, the total mass of silicone gum (G) is the total amount of "silicone gum ( _Galk ) of silicone-based resin (b)" and "silicone gum ( _Galk ) of silicone-based resin (d)." In addition, the total mass of silicone resin (R) is a total amount of "silicone resin (R) of silicone resin (b)" and "silicone resin (R) of silicone resin (h)."

The composition of the laminated constitution and the adhesive layer 3 in the adhesive tape 1 produced in Examples 1-10 and Comparative Examples 1-5 is shown to Tables 1-3.

[Table 1]

[Table 2]

[Table 3]

2. Evaluation method

Then, the evaluation method of the adhesive tape 1 is demonstrated.

(1) Adhesion test (before UV irradiation)

Regarding the adhesive tapes (1) produced in Examples 1 to 10 and Comparative Examples 1 to 5, based on the method described in the adhesive tape/adhesive sheet test method (JIS Z 0237 (2009)) vs. BA-SUS adhesive strength test (peel-off adhesive force test) was performed.

Specifically, the adhesive tape 1 from which the release liner has been removed is affixed to a stainless steel plate (SUS304) having a bright annealing (BA)-treated surface roughness (Ra) of 50±25 nm, and a roller having a mass of 2000 g is applied to 5 mm/ It was made one reciprocating at the speed of s, and was crimped|bonded. Then, after leaving it to stand for 20-40 minutes, it peeled at the speed|rate of 5 mm/s with respect to the 180 degree direction with respect to the stainless steel plate using the tensile tester, and the adhesive force with respect to the grinding|polishing SUS plate was measured.

In addition, the adhesive force test was performed about the adhesive tape 1 before irradiating an ultraviolet-ray (UV). In addition, as a result of an adhesive force test, when the fixing force in the case of using the adhesive tape 1 for dicing of a semiconductor material is considered, it is preferable that it is 2.4 N/10 mm or more, and it is pick-up of semiconductor chips etc. which were divided into pieces by dicing. It is preferable that it is 5.5 N/10 mm or less from a viewpoint of property. More preferably, they are 2.7 N/10 mm or more and 4.1 N/10 mm or less.

(2) Voltack test

(2-1) Measurement of initial (before UV irradiation) vortex

Regarding the adhesive tape (1) before UV irradiation produced in Examples 1 to 10 and Comparative Examples 1 to 5, according to the method described in the test method for adhesive tapes and adhesive sheets (JIS Z 0237 (2009)), The test was done.

(2-2) Measurement of Voltack after UV irradiation

After irradiating UV from the base material side of each adhesive tape produced in Examples 1-10 and Comparative Examples 1-5, and leaving it to stand for 20-40 minutes under the conditions of temperature 23 degreeC and humidity 50±5%RH, each The release liner of the adhesive tape 1 was peeled off, and based on the method described in the adhesive tape/adhesive sheet test method (JISZ0237(2009)), it carried out similarly to the initial stage tack|tack, and performed the tack test.

UV irradiation was irradiated using a high-pressure mercury lamp, adjusting and irradiating so that the ultraviolet-ray with a wavelength of 365 nm might be 1200 mJ/cm<2> in accumulated light quantity. In addition, the convexity when the integrated light amount was 3000 mJ/cm 2 was also measured similarly, but no difference was seen from the case where the integrated light amount was 1200 mJ/cm 2 , so here, the integrated light amount was 1200 mJ/cm 2 , and evaluation was performed.

As a result of the convex test, it is preferable that the convexity (ball No.) after UV irradiation is lower than that of the initial vortex (ball No.) in consideration of the pick-up properties of semiconductor chips separated by dicing or the like. That is, when the value of the ball number before UV irradiation is BN0 and the value of the ball number after UV irradiation is BN1, it is preferable that the relationship is BN0>BN1. This relationship means that the crosslinking reaction of the adhesive layer 3 was accelerated|stimulated by UV irradiation, and the cohesive force increased than before UV irradiation.

(3) Holding force test

(3-1) Initial (before UV irradiation) retention force measurement

Regarding the adhesive tape (1) before UV irradiation produced in Examples 1-10 and Comparative Examples 1-5, based on the method described in the adhesive tape and adhesive sheet test method (JIS Z 0237 (2009)), hold|maintenance force test was performed.

Specifically, the release liner of each adhesive tape 1 is removed, the pressure-sensitive adhesive layer 3 is affixed to a stainless steel plate (SUS304) polished with water-resistant abrasive paper, and the temperature is 40° C. with a predetermined weight attached. , was held under the conditions of a humidity of 33%RH, and the elapsed time (falling time (minutes)) until the adhesive tape 1 peels off from the stainless plate and falls was measured. In addition, the failure mode (whether the failure mode between the pressure-sensitive adhesive layer 3 and the stainless steel plate is interfacial peeling or cohesive failure) when the adhesive tape 1 was peeled from the stainless plate was observed. In addition, the measurement of the fall time in a holding force test was performed until 2880 minutes. In addition, as a result of the holding force test shown to Tables 4-6 mentioned later, the fall time (minute) and the breaking mode of the adhesive tape 1 are shown.

(3-2) Measurement of retention force after UV irradiation

After carrying out similarly to the conditions described in the measurement of the convexity after UV irradiation mentioned above, UV irradiating to the adhesive tape 1 and leaving it to stand, it carried out similarly to the initial stage holding force, and performed the holding force test.

(3-3) Relation between retention force and failure mode

Here, the relationship between the holding force of the adhesive tape 1 and the breaking mode is demonstrated. 3 : is a schematic diagram which showed the relationship between the crosslinking density of the silicone resin in the adhesive layer 3, and the result (fall time) of the holding force test of the adhesive tape 1 .

As shown in FIG. 3 , in the pressure-sensitive adhesive tape 1 , as the crosslinking density of the silicone resin in the pressure-sensitive adhesive layer 3 increases, the failure mode of the pressure-sensitive adhesive tape 1 to the stainless steel plate by the holding force test is , [cohesive failure (falling) of the pressure-sensitive adhesive layer 3] → [holding (not falling)] → [interfacial peeling (falling) of the pressure-sensitive adhesive layer 3 and the stainless plate)].

Moreover, as shown in FIG. 3, in the area|region where the failure mode of the adhesive tape 1 is cohesive failure, the holding force (fall time) of the adhesive tape 1 is crosslinking of the silicone resin in the adhesive layer 3 It increases as the density increases.

On the other hand, as shown in FIG. 3, in the area|region where the fracture mode of the adhesive tape 1 is interfacial peeling, the holding force (fall time) of the adhesive tape 1 is bridge|crosslinking of the silicone resin in the adhesive layer 3 It decreases as the density increases. It is assumed that this is because the cohesive force of the pressure-sensitive adhesive layer 3 increases as the crosslinking density of the silicone resin increases, the adhesive force of the adhesive tape 1 decreases, and as a result, the adhesive tape peels from the stainless plate and falls easily. do.

As a result of the retention test, it is preferable that at least the failure mode after UV irradiation is retention or interfacial peeling, at least it is more preferable that the failure mode after UV irradiation is interfacial peeling, and the failure mode in the initial stage (before UV irradiation) and after UV irradiation It is more preferable that all are interfacial peeling. In addition, when both the fracture modes after the initial stage (before UV irradiation) and after UV irradiation are interfacial peeling, the drop time is, in the initial stage (before UV irradiation), when the adhesive tape 1 is used for dicing the semiconductor material. From the viewpoint of fixing force, it is preferable to be as long as possible or not to fall, and after UV irradiation, it is preferable that it is shorter than the initial stage (before UV irradiation) from the viewpoint of pick-up properties of semiconductor chips divided into pieces by dicing. do.

In this case, after using the adhesive tape 1 for dicing of a semiconductor element substrate, etc., when peeling the obtained semiconductor chip etc. from the adhesive tape 1, UV irradiating to the adhesive tape 1 makes a semiconductor chip etc. It becomes difficult to produce a grass residue.

(4) vs. silicone resin paste residual test

About the adhesive tape 1 produced in Examples 1-10 and Comparative Examples 1-5, the glue residual test with respect to a silicone resin was done.

First, agent A and agent B of a silicone resin containing a methyl group, which is a silicone resin for LED devices (KER-2500N (trade name) manufactured by Shin-Etsu Chemical Industry Co., Ltd.), were mixed at a mixing ratio of 1:1 to prepare a mixed solution. This liquid mixture was apply|coated to a stainless steel plate, and it heated and hardened under the conditions of 100 degreeC x 1 hour, and 150 degreeC x 2 hours, and produced the silicone test piece A.

Similarly, agent A and agent B of a silicone resin containing a phenyl group, which is a silicone resin for LED devices (KER-6110 (trade name) manufactured by Shin-Etsu Chemical Industry Co., Ltd.), were mixed at a mixing ratio of 3:7 to prepare a mixed solution. This liquid mixture was apply|coated to a stainless steel plate, and it heated and hardened under the conditions of 100 degreeC x 2 hours, and also 150 degreeC x 5 hours, and the silicone test piece B was produced.

Then, the release liner of the adhesive tape 1 was removed, the adhesive layer 3 was affixed to silicone test pieces A and B, respectively, and a roller of mass 2000g was made one reciprocating at a speed of 5 mm/s, and it was crimped|bonded. . Then, after UV irradiation from the base material 2 side of the adhesive tape 1 in the same manner as the conditions described in the measurement of convexity after UV irradiation, it was left to stand in an environment of a temperature of 40°C and a humidity of 90%RH for 120 hours. Thereafter, at room temperature, the adhesive tape 1 is peeled off at a speed of 800 mm/s to 1200 mm/s in the 90° direction with respect to the silicone test pieces A and B to remove the glue residue on the silicone test pieces A and B. confirmed visually.

(5) Versus Epoxy Resin Paste Residue Test

About the adhesive tape 1 produced in Examples 1-10 and Comparative Examples 1-5, the glue residual test with respect to an epoxy resin was done.

With respect to an epoxy test piece made of an epoxy resin plate (Nikko Chemical Co., Ltd. NL-EG-23 (trade name)) impregnated with an epoxy resin in a glass cloth substrate, the adhesive layer 3 of the adhesive tape 1 from which the release liner was removed. It affixed, the roller of mass 2000g was made to reciprocate once at a speed|rate of 5 mm/s, and it was crimped|bonded. Then, after UV irradiation from the base material 2 side of the adhesive tape 1 in the same manner as the conditions described in the measurement of convexity after UV irradiation, it was left to stand in an environment of a temperature of 40° C. and a humidity of 90% RH for 120 hours. Then, it was set to room temperature, the adhesive tape 1 was peeled off at the speed|rate of 800 mm/s - 1200 mm/s in a 90 degree direction with respect to an epoxy test piece, and the glue residue with respect to an epoxy test piece was visually confirmed.

The silicone resin glue residual test and the epoxy resin glue residual test were evaluated according to the following criteria. In addition, evaluation of A or B was made into pass.

A: No glue residue in the range of 100% per unit area of the test piece

B: Residual glue is seen in the range of less than 2% per unit area of the test piece

C: Residual glue is seen in the range of 2% or more and less than 5% per unit area of the test piece

D: Residual glue is seen in the range of 5% or more per unit area of the test piece, or glue residue is seen at the edge of the test piece

(6) Dicing test

The dicing test was done about the adhesive tape 1 produced in Examples 1-10 and Comparative Examples 1-5.

Specifically, first, an epoxy resin for a mold (CEL-400ZHF40-W75G (trade name) manufactured by Hitachi Sei Co., Ltd.) is put into a mold, a sealing pressure of 50 kgf/cm 2 (491 N/cm 2 ), a thickness of the sealing material 0.3 mm, a heating temperature of 150 It was heat-hardened on the conditions of °C x 300 second, and the dicing test piece of the disk shape (diameter 200mm (8 inches)) was produced.

Next, the adhesive layer 3 of the adhesive tape 1 from which the release liner was removed was affixed to the ring for dicing, and the part protruding from the ring was cut out, and then a fluorine-based release film (SS1A manufactured by Nipper Corporation (trade name)) , 75 µm in thickness). Then, the roller of mass 2000g was made to reciprocate, and the adhesive tape 1 and the ring part were crimped|bonded. Then, the fluorine-type peeling film was peeled off, the dicing test piece was pasted together to the adhesive layer 3 of the ring center part, and it crimped|bonded it.

Further, using a dicing apparatus manufactured by Tokyo Precision Co., Ltd. (A-WD-100A (trade name)), with a dicing blade manufactured by Disco Co., Ltd., the dicing test piece was placed together with the adhesive tape 1 into a 10 mm x 10 mm chip. cut with At this time, the number of scattered chips was measured and the fixing force in the dicing test was evaluated.

Then, about the adhesive tape 1 affixed to the chip|tip segmented into 10 mm x 10 mm, it carried out similarly to the conditions described in the measurement of the volt|bolt after UV irradiation, and irradiated UV. Then, the chip|tip separated into pieces was picked up from the adhesive tape 1, the presence or absence of the glue residual to a chip|tip was visually confirmed, and the glue residual in a dicing test was evaluated. Moreover, when a chip|tip was picked up, the number of objects which the pick-up failed was measured, and the pick-up property in a dicing test was evaluated.

The fixing force in the dicing test evaluated the following judgment criteria. In addition, evaluation of A or B was made into pass.

A: The number of scattered chips is 0 out of 100, and cracks are not seen.

B: The number of scattered chips is 1 out of 100, and cracks are not seen.

C: The number of scattered chips is 2 out of 100, and cracks are not seen.

D: The number of scattered chips is 3 or more out of 100, or chip cracks are seen

The glue residual in a dicing test evaluated the following judgment criteria. In addition, evaluation of A was made into pass.

A: No glue residue visible on the chip

D: Residual glue is seen on the chip, or the side of the chip is seen to hang like a thread of adhesive.

The pick-up property in the dicing test evaluated the following judgment criteria. In addition, evaluation of A or B was made into pass.

A : The number of chips that failed to pick up is 0 out of 100

B: The number of chips that failed to pick up is 1 out of 100

C: The number of chips that failed to pick up is 2 out of 100

D: The number of chips that failed to pick up is 3 or more out of 100

3. Test results

About the evaluation result about Examples 1-10 and the adhesive tape 1 of Comparative Examples 1-5, Tables 4-6 are shown.

[Table 4]

[Table 5]

[Table 6]

As shown in Tables 4 and 5, in the adhesive tapes 1 of Examples 1 to 10, in which the pressure-sensitive adhesive layer satisfies the requirements of the present invention, the adhesive force test, the convexity test, the holding force test, the silicone resin glue residual test, It was confirmed that favorable results were obtained in any of the epoxy resin glue residual test and the dicing test (fixing force, glue residual and pick-up property).

Especially, the content of the silicon atom-bonded alkenyl group in the whole silicone resin is the range of 3.0x10 ^-6 mol/g or more and ^1.0x10-5 mol/g or less The adhesive tape of Examples 1-8 (1) In comparison with the adhesive tapes (1) of Examples 9 and 10, the content of silicon atom-bonded alkenyl groups in the entire silicone-based resin is 1.9 × 10 ^-6 mol/g and 2.5 × 10 ^-6 mol/g, respectively. , the evaluation results were generally good in the silicone resin glue residual test and the epoxy resin glue residual test.

Thereby, the adhesive tapes 1 of Examples 1-10 are useful as an adhesive tape for dicing of a semiconductor material, more specifically, as an adhesive tape for dicing used for dicing by sticking from the sealing resin side of a semiconductor element board|substrate. that has been confirmed

On the other hand, as shown in Table 6, the adhesive tapes 1 of Comparative Examples 1 to 5 in which the pressure-sensitive adhesive layer 3 does not meet the requirements of the present invention were subjected to a silicone resin paste residual test and an epoxy resin paste residual test. , and the dicing test (fixing force, glue retention, and pick-up property) WHEREIN: It was confirmed that the test result of either is a result inferior to Examples 1-10.

Specifically, in the pressure-sensitive adhesive tape 1 of Comparative Example 1 in which the pressure-sensitive adhesive layer 3 does not contain a crosslinking agent, crosslinking of the silicone resin does not occur even after UV irradiation. A change was not seen in the result of a test, and increase in the cohesive force of the adhesive layer 3 by UV irradiation was not recognized. Therefore, in the silicone resin glue residual test and the epoxy resin glue residual test for practicability confirmation, a lot of glue residual was observed. Moreover, also in the dicing test, the pick-up property of the chip|tip of the dicing test piece was inferior, and the glue residue was seen in the chip|tip.

In addition, in the adhesive tape 1 of Comparative Example 2 in which the pressure-sensitive adhesive layer 3 does not contain a photosensitive platinum (Pt) catalyst and contains a conventional platinum (Pt) catalyst, the step before UV irradiation, that is, the pressure-sensitive adhesive layer In the heating/drying step for coating (3) on the substrate 2, an addition reaction between the silicon atom-bonded alkenyl group of the silicone resin in the pressure-sensitive adhesive layer 3 and the SiH group of the crosslinking agent is already carried out by the platinum (Pt) catalyst. Since it became too hard by crosslinking and hardening, in the dicing test, the fixing force of the dicing test piece was slightly low, and the scattering of the chip|tip was seen a little at the time of dicing. Since the pressure-sensitive adhesive layer 3 does not contain a photosensitive platinum (Pt) catalyst, the cohesive force does not increase even when subjected to UV irradiation. However, since the cohesive force of the pressure-sensitive adhesive layer 3 was high, no glue residue was seen in the silicone resin glue residual test and the epoxy resin glue residual test. Moreover, also in the dicing test, regarding the chip|tip which did not scatter, no glue residue was seen.

Moreover, in the adhesive tape 1 of Comparative Example 3 in which the content of silicon atom-bonded alkenyl groups in the silicone resin in the pressure-sensitive adhesive layer 3 is less than the lower limit of the requirements of the present invention, before and after UV irradiation, a volt test and retention force A change was not seen in the result of a test, the increase effect of the cohesion force of the adhesive layer 3 by UV irradiation was inadequate, and cohesion force itself was also small. Therefore, in the silicone resin glue residual test and the epoxy resin glue residual test, a lot of glue residual was observed. Moreover, also in the dicing test, the pick-up property of the chip|tip of the dicing test piece was inferior, and the glue residue was seen in the chip|tip.

Moreover, the mixing ratio ((G)/(R)) of the silicone gum (G) and the silicone resin (R) in the silicone resin in the adhesive layer 3 exceeds the upper limit of the requirements of the present invention of Comparative Example 4 In the adhesive tape 1, there are many ratios of the silicone gum G in the adhesive layer 3, and in a dicing test, the vibration of dicing becomes easy to transmit to the adhesive layer 3, and a vibration amplitude becomes large, and it is divided into pieces. A crack was seen in the old semiconductor chip. Moreover, since the adhesive force was also low, the fixing force of the dicing test piece was low, and the scattering of the chip|tip was seen much at the time of dicing. Moreover, since content of the silicon atom-bonded alkenyl group in the silicone resin in the adhesive layer 3 exceeds the upper limit of this embodiment, when using the adhesive tape 1 for a test, another adhesive tape 1 On the other hand, it was difficult for the release liner to peel from the pressure-sensitive adhesive layer 3, and the workability was poor. In addition, since the effect of increasing the cohesive force of the pressure-sensitive adhesive layer 3 by UV irradiation was sufficient, no glue residue was observed in the silicone resin glue residual test and the epoxy resin glue residual test. Moreover, also in the dicing test, regarding the chip|tip which did not scatter, no glue residue was seen.

Further, in the adhesive tape 1 of Comparative Example 5 in which the mixing ratio ((G)/(R)) of the silicone gum (G) and the silicone resin (R) is less than the lower limit of the requirements of the present invention, in the adhesive layer 3 Since the proportion of the silicone resin (R) not having a silicon atom-bonded alkenyl group is large, the effect of increasing the cohesive force of the pressure-sensitive adhesive layer 3 by UV irradiation cannot be said to be sufficient, and the silicone resin glue residue test and the epoxy resin In the glue residual test, there was slightly much glue residual which can be attributed to the uncrosslinked component of the silicone resin (R). Moreover, also in the dicing test, the pick-up property of the chip|tip of the dicing test piece was inferior, and the paste|paste residue was seen many in a chip|tip.

1: adhesive tape
2: description
3: adhesive layer
100: semiconductor device substrate
101: substrate
102: semiconductor element
103: sealing resin
200: semiconductor chip

Claims (7)

An adhesive tape for dicing, comprising a substrate and an adhesive layer laminated on the substrate, and used when dividing a semiconductor material having a plurality of semiconductor elements covered with a coating material into a plurality of semiconductor chips,
The pressure-sensitive adhesive layer,
A silicone resin in which a silicone gum (G) and a silicone resin (R) are mixed, an organopolysiloxane having at least two silicon atom-bonded hydrogen atoms (SiH group) in one molecule as a crosslinking agent for the silicone resin, and a photosensitizer Consists of a pressure-sensitive adhesive composition comprising a platinum (Pt) catalyst,
The mixing ratio ((G)/(R)) of the silicone gum (G) and the silicone resin (R) in the whole silicone resin is in the range of 35.0/65.0 to 50.0/50.0 in mass ratio,
The silicone gum (G) contains a silicone gum (G _alk ) composed of an organopolysiloxane containing a silicon atom-bonded alkenyl group,
The content of the silicon atom-bonded alkenyl group in the whole silicone-based resin is in the range of 1.8×10 ^-6 mol/g or more and 1.0×10 ^-5 mol/g or less. The method of claim 1,
An adhesive tape for dicing, wherein a plurality of the semiconductor elements are affixed and used from the covering material side to the semiconductor material sealed by the covering material made of a silicone resin. 3. The method according to claim 1 or 2,
In the pressure-sensitive adhesive layer, the content of the silicon atom-bonded alkenyl group in the entire silicone-based resin is in the range of 3.0×10 ^-6 mol/g or more and 1.0×10 ^-5 mol/g or less. Adhesive for dicing tape. 4. The method according to any one of claims 1 to 3,
In the pressure-sensitive adhesive layer, the silicon atom-bonded hydrogen atom (SiH group) of the crosslinking agent contained in the pressure-sensitive adhesive composition relative to the content (total amount) of the silicon atom-bonded alkenyl group in the entire silicone-based resin contained in the pressure-sensitive adhesive composition. ) content (total amount) molar ratio (SiH group/silicon atom bonding alkenyl group) is in the range of 2.0 or more and 10.0 or less, The adhesive tape for dicing. 5. The method according to any one of claims 1 to 4,
The pressure-sensitive adhesive layer is characterized in that the content of the photosensitive platinum (Pt) catalyst in the pressure-sensitive adhesive composition is 0.10 parts by mass or more and 3.00 parts by mass or less by solid content with respect to 100 parts by mass of the total solid content of the silicone-based resin. Adhesive tape for dicing. 6. The method according to any one of claims 1 to 5,
All of the following conditions (a)-(c) are satisfied in the adhesive characteristic based on JISZ0237 (2009), The adhesive tape for dicing characterized by the above-mentioned.
(a) The adhesive force before light irradiation to a BA-SUS test plate is the range of 2.7 N/10 mm or more and 4.1 N/10 mm or less.
(b) The value of the ball number in the inclined volt test (inclination angle 30°, temperature 23°C, relative humidity 50%RH) is BN0 as the value of the ball number before light irradiation, and BN1 as the value of the ball number after light irradiation In the case where BN0>BN1 is
(c) in the holding force test after light irradiation (temperature of 40 ° C., relative humidity of 33% RH, leaving time of 2880 minutes), the breaking phenomenon at the time of falling is the peeling of the interface between the pressure-sensitive adhesive layer and the BA-SUS test plate, or , which do not fall in the said holding force test. The adhesive tape for dicing in any one of Claims 1-6 is affixed from the said sealing resin side with respect to the semiconductor element board|substrate in which the some said semiconductor element sealed with the sealing resin which consists of a silicone resin was formed on the board|substrate. The pasting process to do,
a cutting step of cutting the semiconductor element substrate to which the adhesive tape for dicing has been affixed into a plurality of semiconductor chips;
an irradiation step of irradiating light to the adhesive tape for dicing of the semiconductor element substrate;
Peeling step of peeling the adhesive tape for dicing from the plurality of semiconductor chips
A method of manufacturing a semiconductor chip comprising a.

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