JP2010129865A - Adhesive tape for dicing - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an adhesive tape which has sufficient adhesive strength for holding a chip in dicing a semiconductor wafer, and can prevent paste from remaining on a package resin face and a dicing ring frame after pickup even after a heat treatment process when using the tape for dicing a semiconductor package. <P>SOLUTION: The adhesive tape for dicing has a sticky agent layer formed on at least one face of a base material film, and a base polymer of a sticky agent forming the sticky agent layer is characterized in that at least one kind of a monomer component is (meth)acrylic acid alkyl ester, and a glass transition temperature of the base polymer is -60 to -10°C. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a dicing adhesive tape suitable for fixing and holding a wafer when dicing a semiconductor wafer into chips, and more particularly to a dicing adhesive tape suitable for processing a high-density mounting semiconductor package.

  Conventionally, when performing a so-called dicing process for separating a wafer on which a circuit pattern is formed into chips, a pickup system using a wafer processing tape for fixing the wafer has been proposed. In this system, a large-diameter wafer is diced into chips in a state of being bonded and fixed to a wafer processing tape, and after washing, drying, picking up, and packaging by resin sealing.

  In recent years, flip chip type packages having electrodes on the pattern circuit side have been developed by various companies as one form of miniaturization of semiconductor elements. Among these flip chip type packages, the wafer level chip size package (WLCSP) is a polyimide-coated, Cu rearranged wiring formation, Cu post formation, resin sealing, resin polishing, terminal formation, These are manufactured by sequentially performing package processing and then cutting into individual chips, and the package has the same size as the chip size.

  WLCSP encapsulated with resin in this way is generally bonded to a dicing tape by bonding a semiconductor chip to a glass epoxy substrate or a lead frame, molding it in a package mold resin, and then curing it. Dicing with a blade. In the package dicing process, the load at the time of cutting is large, and since the package resin contains a release agent and the resin surface has a structure with minute irregularities, the adhesive used in the tape for semiconductor processing A flexible adhesive is used for the agent so that the package can be firmly held and the package is not held during dicing and is not scattered.

  However, by using such a flexible adhesive, the dicing blade cuts up to the tape, so that the tape adhesive layer rolls up, and the fine glue balls that have been wound up remain on the side of the separated package There is. There is a case where the fine glue balls remaining on the side surface of the package adhere to the tray after the package is picked up and the package cannot be peeled off from the tray. As measures against these, an adhesive having a base polymer of a copolymer in which at least one of the monomer components is a (meth) acrylic acid alkyl ester and the alkyl group is an alicyclic hydrocarbon group is used as a base film. A dicing adhesive tape formed on at least one surface is known (see Patent Document 1). This pressure-sensitive adhesive tape is a pressure-sensitive adhesive tape that is extremely excellent in preventing the adhesion of side pressure-sensitive adhesive. However, the thicker the pressure-sensitive adhesive layer is, the better from the viewpoint of holding the wafer during dicing, but if the pressure-sensitive adhesive is too thick, adhesive residue may be generated on the side of the package, further improvement. Was desired.

On the other hand, in order to eliminate the stickiness of the fine glue balls remaining on the side surface of the package, a process of curing the fine glue balls by putting the tape and the substrate together with the ring frame into a heating furnace after dicing may be performed. At this time, if the heat resistance of the tape base material and the tape adhesive is low, the package laser mark portion of the package resin surface (the back surface of the package) pasted to the adhesive layer when picking up the package after the heating process In some cases, a large amount of adhesive remains on the surface of the ring frame, and when the tape is peeled off from the ring frame, glue remains on the ring frame. When glue remains on the bottom of the package, there is a problem that the laser mark printed on the package becomes unclear. Further, when adhesive residue is left on the ring frame, there is a problem in reusing the ring frame that is repeatedly used.
JP 2007-100064 A

  Adhesive strength is sufficient to hold the wafer and the chips from which it has been cut in the process of dicing a semiconductor wafer, and softening of the adhesive is suppressed even in the process of heat treatment after dicing, and after picking up in package dicing An adhesive tape capable of preventing adhesive residue on the package resin surface and the dicing ring frame is provided.

  As a result of intensive studies in order to solve the above-mentioned problems, the present inventors have found that at least one monomer component is a (meth) acrylic acid alkyl ester and a base polymer having a specific glass transition temperature. It has been found that by using a dicing adhesive tape in which the agent is formed on at least one side of the base film, it has sufficient adhesive force for holding the chip and can have high heat resistance. The present invention has been made based on this finding.

That is, the present invention
(1) A pressure-sensitive adhesive tape having a pressure-sensitive adhesive layer formed on at least one surface of a base film, and the base polymer of the pressure-sensitive adhesive forming the pressure-sensitive adhesive layer has at least one monomer component alkyl (meth) acrylate An adhesive tape for dicing, which is an ester and has a glass transition temperature of -60 to -10 ° C of the base polymer;
(2) The base polymer of the pressure-sensitive adhesive is a copolymer obtained by polymerizing a monomer mixture containing 5 to 25 mass% of isobornyl acrylate with respect to the total amount of monomer components (1) The dicing adhesive tape according to the item,
(3) The pressure-sensitive adhesive tape for dicing according to (1) or (2), wherein the base polymer of the pressure-sensitive adhesive has a weight average molecular weight of 200,000 to 1,000,000.
(4) A pressure-sensitive adhesive layer is formed on one surface of the base film, and at least the surface of the base film opposite to the surface on which the pressure-sensitive adhesive layer is formed with respect to the total thickness of the base film The adhesive tape for dicing according to any one of (1) to (3), wherein the layer containing 5% thickness is composed of a composition containing 70 mass% or more of a resin having a melting point of 130 ° C. or higher. ,
(5) The pressure-sensitive adhesive layer according to any one of (1) to (4), wherein the pressure-sensitive adhesive layer comprises a radiation-curable pressure-sensitive adhesive,
(6) The dicing adhesive tape according to (5), wherein the base polymer of the radiation-curable adhesive has a radiation-polymerizable carbon-carbon double bond in a side chain,
(7) The pressure-sensitive adhesive tape for dicing according to any one of (1) to (6), wherein the pressure-sensitive adhesive tape is used for semiconductor processing involving a heat treatment step after dicing.
(8) The adhesive tape for dicing according to any one of (1) to (7), which is used in a step of dicing a semiconductor package.
The adhesive tape for dicing in the present invention is not only used for separating a wafer on which a circuit pattern is formed into chips, but also used for individually cutting packages that are collectively sealed with resin. In addition, unless otherwise specified, the adhesive tape used for both is meant.

  In the dicing process, the adhesive tape for dancing according to the present invention can hold the wafer and the package with sufficient adhesive force, and can prevent softening of the adhesive even when the heat treatment process is performed after dicing. Therefore, when the adhesive tape for dancing of the present invention is used for semiconductor package processing, it can prevent adhesive glue residue on the package resin surface of the package picked up through the heat treatment after dicing and the dicing frame, and the semiconductor. It is suitable as a dicing tape for package processing.

The pressure-sensitive adhesive tape for dicing according to the present invention is a pressure-sensitive adhesive tape having a pressure-sensitive adhesive layer formed on at least one surface of a base film, and the base polymer of the pressure-sensitive adhesive forming the pressure-sensitive adhesive layer has at least one monomer component. It is a (meth) acrylic acid alkyl ester and has a glass transition temperature (Tg) of −60 to −10 ° C.
If the Tg of the base polymer of the adhesive is too low, the heat resistance of the adhesive will be low, and as a result, adhesive residue will be generated in the package laser mark part and ring frame in processes that involve heat treatment after package dicing. It becomes easy. On the other hand, if the Tg of the base polymer is too high, the holding force of the wafer in the dicing process will be insufficient, causing wafer scattering and package jumping, which tends to deteriorate the product yield. Tg of the base polymer of the pressure-sensitive adhesive is −60 ° C. to −10 ° C. because the holding power of the wafer or package during dicing is insufficient at −10 ° C. or higher, and heat resistance is insufficient at −60 ° C. or lower, preferably Is −55 to −20 ° C.

  Examples of the alkyl group of the above (meth) acrylic acid alkyl ester include linear, branched or alicyclic hydrocarbon groups having 1 to 14 carbon atoms, more preferably 1 to 12 carbon atoms. Is an alicyclic hydrocarbon group having 4 to 12 carbon atoms. Examples of the (meth) acrylic acid ester having an alicyclic hydrocarbon group include isobornyl (meth) acrylate, dicyclopentanyl (meth) acrylate, dicyclopentenyl (meth) acrylate, cyclohexyl (meth) acrylate, butylhexyl ( (Meth) acrylate, tetrahydrofurfuryl (meth) acrylate, etc. are mentioned, and isobornyl acrylate is preferred.

  Examples of the monomer component used together with the (meth) acrylic acid alkyl ester include vinyl acetate.

As the base polymer of the pressure-sensitive adhesive of a preferred embodiment in the present invention, the acrylic acid isobornyl ester is preferably 1 to 40 mass%, more preferably 5 to 25 mass%, particularly with respect to the total amount of monomer components for preparing the base polymer. A copolymer obtained by polymerizing a monomer mixture containing 5 to 20 mass% is preferable.
When the content of the isobornyl acrylate is too low, the heat resistance is low, and when it is too high, the holding power in the dicing process may be insufficient and polymerization may be difficult. As the isobornyl acrylate ester, for example, isobornyl acrylate sold by Nippon Shokubai Co., Ltd. can be used.

The weight average molecular weight of the base polymer is preferably 200,000 to 1,000,000, more preferably 250,000 to 950,000, and particularly preferably 300,000 to 900,000.
If the molecular weight of the base polymer is too low, the occurrence of adhesive residue increases, the viscosity becomes low, and it may be difficult to apply the adhesive. On the other hand, if the molecular weight is too high, the holding force during dicing may be insufficient, and the polymerization of the polymer may be difficult.

  In order to use the above-mentioned pressure-sensitive adhesive as a radiation-curable pressure-sensitive adhesive, for example, an acrylic copolymer containing a (meth) acrylic acid alkyl ester component has a radiation-curable functional group and an acrylic copolymer. By adding a compound having a functional group capable of addition reaction to the side chain of the coalescence, it can be used as a base polymer of a radiation curable pressure sensitive adhesive. A radiation curable pressure-sensitive adhesive containing a monomer component or an oligomer component can be exemplified. Preferably, the base polymer has a radiation-polymerizable carbon-carbon double bond in the side chain.

  As a method of introducing a radiation-polymerizable carbon-carbon double bond into the above acrylic copolymer, the acrylic copolymer has a functional group in the side chain, and a functional group capable of addition reaction with this functional group and radiation. The method of adding the compound which has a polymerizable carbon-carbon double bond is mentioned. Examples of the compound having a functional group capable of addition reaction on the side chain of the acrylic copolymer include glycidyl methacrylate and allyl glycidyl ether when the side chain to be subjected to the addition reaction is a carboxyl group. In the case where the side chain to be subjected to the addition reaction is an epoxy group, acrylic acid and the like can be mentioned. In the case where the side chain to be subjected to the addition reaction is a hydroxyl group, 2-isocyanatoethyl methacrylate and the like can be mentioned. It is done.

  The ultraviolet curable resin blended in the pressure-sensitive adhesive layer is not particularly limited as long as it provides a property that facilitates the separation of the dicing tape and the semiconductor wafer during the pick-up process. Examples thereof include oligomers having a functional group such as a hydroxyl group or a carboxyl group such as acrylate, epoxy acrylate, polyester acrylate, polyether acrylate, (meth) acrylic acid oligomer and itaconic acid oligomer. The addition amount of the ultraviolet curable resin is preferably 30 to 200 parts by mass with respect to 100 parts by mass of the acrylic copolymer. If the amount of the ultraviolet curable resin is too small, the element fixing adhesive force is sufficiently obtained during the pickup process. If the amount of ultraviolet resin is too large, chipping increases in the dicing process.

When the adhesive tape of the present invention is cured by ultraviolet irradiation, a photopolymerization initiator such as isopropyl benzoin ether, isobutyl benzoin ether, benzophenone, Michler ketone, chlorothioxanthone, dodecylthioxanthone, dimethylthioxanthone, diethylthioxanthone, benzyldimethylketanol, Examples thereof include α-hydroxycyclohexyl phenyl ketone and 2-hydroxymethyl phenyl propane. By adding at least one of them into the radiation-polymerizable pressure-sensitive adhesive, the curing reaction of the pressure-sensitive adhesive layer can be efficiently advanced, and thereby the element fixing adhesive force can be appropriately reduced.
The addition amount of the photopolymerization initiator is preferably 0.5 to 10 parts by mass with respect to 100 parts by mass of the radiation polymerizable compound.

In addition, for the adhesive layer, for example, an appropriate crosslinking agent such as a polyfunctional isocyanate compound, an epoxy compound, a melamine compound, a metal salt compound, a metal chelate compound, an amino resin compound, or a peroxide is used as a curing agent. Can be included. The curing agent crosslinks the pressure-sensitive adhesive layer through them, and the crosslink density of the pressure-sensitive adhesive layer can be controlled by adjusting the content of the curing agent, thereby controlling the tape retention. The content of the curing agent is preferably 0.1 to 10 parts by mass with respect to 100 parts by mass of the base polymer.
Furthermore, the radiation-curable pressure-sensitive adhesive used in the present invention can be blended with a tackifier, a pressure-adjusting agent, a surfactant, or other modifiers, if necessary. Moreover, you may add an inorganic compound filler suitably.

  The thickness of the pressure-sensitive adhesive layer is preferably at least 3 μm, more preferably 5 μm or more from the viewpoint of holding the wafer during dicing. Also, as the pressure-sensitive adhesive thickness increases, the chipping of the wafer and the adhesive residue on the side of the package increase. Therefore, 30 μm or less is preferable.

  The substrate film in the present invention is not particularly limited as long as it is usually used for a semiconductor processing tape, and plastics, rubbers and the like can be preferably used. A radiation curable material is used as an adhesive described later. When used, it is necessary to select a material in consideration of the radiation transparency so that the adhesive layer is cured when irradiated with radiation from the base film side so that the adhesive force is reduced. . In the present invention, radiation refers to light rays such as ultraviolet rays or ionizing radiations such as electron beams, but when ultraviolet rays are selected from the radiations and the radiation-curable resin composition is cured by the irradiation. Therefore, it is necessary to select a substrate having a good ultraviolet transmittance as the base material.

  Examples of materials that can be selected as such a base film include, for example, polyethylene, polypropylene, ethylene-propylene copolymer, polybutene-1, poly-4-methylpentene-1, ethylene-vinyl acetate copolymer, and ethylene. -Ethyl acrylate copolymer, ethylene-methyl acrylate copolymer, ethylene-acrylic acid copolymer, α-olefin homopolymer or copolymer such as ionomer, or a mixture thereof, polyethylene terephthalate, polycarbonate, poly Engineering plastics such as methyl methacrylate, thermoplastic elastomers such as polyurethane, styrene-ethylene-butene or pentene copolymers, polyamide-polyol copolymers, and mixtures thereof can be listed.

In this invention, it is preferable to use the base film which has the heat resistance with respect to the semiconductor processing accompanied with the process heat-processed as the whole tape. As such a base film having heat resistance, at least 5 with respect to the total thickness of the base film from the surface (back surface) opposite to the surface on which the pressure-sensitive adhesive layer of the base film is formed. Examples thereof include a film which is a heat-resistant layer formed of a composition containing a resin containing 70% by mass of a resin having a melting point of 130 ° C. or higher.
Thus, by making the layer having a thickness of at least 5% on the back side of the tape into a heat-resistant layer, combined with the heat-resistant pressure-sensitive adhesive layer, the heat treatment can be performed at a high temperature for a long time. Also, the tape as a whole can have heat resistance.

  Examples of the resin having a melting point of 130 ° C. or higher used in the present invention include polyethylene terephthalate, polybutylene terephthalate, polypropylene, high density polyethylene, polystyrene, polyvinyl chloride, polyvinylidene chloride, and the like. Polypropylene and polybutylene terephthalate are preferred. These may be used alone or in combination of two or more.

The resin composition for forming the heat-resistant layer on the back side of the base film is more preferably 70% by mass or higher for resins having a melting point of 135 ° C. or higher, and more preferably 80% by mass or higher for resins having 140 ° C. or higher. .
Further, the thickness of the heat-resistant layer on the back side is more preferably 10% or more, particularly preferably 15% or more with respect to the total thickness of the base film.
Examples of the resin that can be mixed with a resin having a melting point of 130 ° C. or higher include hydrogenated styrene butadiene rubber, styrene butadiene rubber, butadiene rubber, and isobrene rubber.

The pressure-sensitive adhesive tape for dicing in the present invention has excellent holding power, and can be used for dicing in the same manner as the pressure-sensitive adhesive tape used when separating a wafer having a conventional circuit pattern formed into chips, In particular, because of its excellent heat resistance, it can be suitably used for semiconductor processing involving a step of heat treatment after dicing.
In particular, after dicing, the tape and substrate together with the ring frame are placed in a heating furnace and used for dicing semiconductor packages where the process of curing fine glue balls is performed. It is suitable as a pressure-sensitive adhesive tape for package dicing because it can prevent the occurrence of adhesive residue on the mating surface and can prevent the adhesive residue from remaining on the ring frame even when the tape is peeled off from the ring frame.

  EXAMPLES Next, although this invention is demonstrated further in detail based on an Example, this invention is not limited to a following example.

(Production of copolymer)
・ Copolymers A to C
After polymerization with isobornyl acrylate, 2-ethylhexyl acrylate, 2-hydroxyethyl acrylate and methacrylic acid as raw materials at the blending ratio (parts by mass) shown in Table 1 below, 2-isocyanatoethyl methacrylate is further blended in Table 1 below. Addition reaction was performed at a ratio to obtain copolymers A to C. Table 1 shows the glass transition temperature and the weight average molecular weight of each polymer obtained.

・ Copolymer D
Polymerization was carried out at the blending ratio shown in Table 1 below using methyl methacrylate, 2-ethylhexyl acrylate, 2-hydroxyethyl acrylate and methacrylic acid as raw materials, and then 2-isocyanatoethyl methacrylate was further added and reacted at the blending ratio shown in Table 1 below. Copolymer D was obtained. Table 1 shows the glass transition temperature and the weight average molecular weight of the obtained polymer.

・ Copolymer E
Polymerization was performed using 2-ethylhexyl acrylate, 2-hydroxyethyl acrylate, and methacrylic acid as raw materials at the blending ratio shown in Table 1 below, and then 2-isocyanatoethyl methacrylate was further added and reacted at the blending ratio shown in Table 1 below. Polymer E was obtained. Table 1 shows the glass transition temperature and the weight average molecular weight of the obtained polymer.

Example 1
1 part by mass of a polyisocyanate compound (manufactured by Nippon Polyurethane Co., Ltd., trade name Coronate L) as a curing agent and α-hydroxycyclohexyl phenyl ketone (manufactured by Ciba Geigy Japan) as a photoinitiator with respect to 100 parts by mass of the copolymer A of the base polymer. , Trade name: Irgacure 184) was mixed at a blending ratio of 5 parts by mass to obtain an adhesive. 150 μm thick polypropylene (PP, MFR 8 g / 10 min 230 ° C., load 21.18 N, conforming to JIS 7210) and hydrogenated styrene butadiene rubber (based on JIS 7210) so that the thickness of the pressure sensitive adhesive after drying is 20 μm. HSBR, manufactured by JSR Corporation, trade name: Dynalon 1320P) is mixed on a base film formed of a composition (PP: HSBR = 70: 30 (mass ratio)) and mixed for dicing An adhesive tape was obtained.

Example 2
A dicing adhesive tape was obtained in the same manner as in Example 1 except that the base polymer of the adhesive was changed to the copolymer B.

Example 2
A dicing adhesive tape was obtained in the same manner as in Example 1 except that the base polymer of the adhesive was changed to the copolymer B.

Comparative Example 1
A dicing adhesive tape was obtained in the same manner as in Example 1 except that the base polymer of the adhesive was changed to the copolymer C.

Comparative Example 2
A dicing pressure-sensitive adhesive tape was obtained in the same manner as in Example 1 except that the base polymer of the pressure-sensitive adhesive was changed to the copolymer D.

Comparative Example 3
A dicing pressure-sensitive adhesive tape was obtained in the same manner as in Example 1 except that the base polymer of the pressure-sensitive adhesive was changed to the copolymer E.

Example 3
As the base film to be used, a ternary copolymer containing ethylene, (meth) acrylic acid and (meth) acrylic acid acrylic ester having a thickness of 135 μm on the side where the pressure-sensitive adhesive layer is provided as a polymer component is sodium ion. A layer composed of a crosslinked ionomer resin (melting point: 86 ° C.), PP having a thickness of 15 μm on the back side (MFR 8 g / 10 min 230 ° C., load 21.18 N, conforming to JIS7210) and HSBR (manufactured by JSR Corporation, trade name) : Dynalon 1320P) is the same as Example 1 except that the film is changed to a film having a two-layer structure (total thickness 150 μm) made of a composition (PP: HSBR = 70: 30 (mass ratio)). Thus, an adhesive tape for dicing was obtained.

Example 4
The base film to be used is an ionomer resin (melting point 86) in which a terpolymer having 150 μm thick ethylene, (meth) acrylic acid and (meth) acrylic acid acrylic ester as a polymer component is crosslinked with sodium ions. A dicing pressure-sensitive adhesive tape was obtained in the same manner as in Example 1 except that the film was changed to a film composed of [deg.

Test example 1
Retention (DC) test A 0.5 mm thick, 191 mm × 51 mm copper lead frame substrate package was bonded to the dicing adhesive tape of the above examples and comparative examples under the conditions of 23 ° C. and 50% RH. 1 hour after tape bonding, it cut | disconnected to 3 mm x 3 mm □ on the following dicing conditions.

・ Dicing conditions Dicing machine: DAD-340 manufactured by DISCO
Blade: DISCO Corporation metal bond blade: B1A801 SD320N100M42, inner diameter 40 mm, outer diameter 58 mm, thickness 0.2 mm
Blade rotation speed: 30000 rpm
Cutting speed: 50 mm / sec
Tape cutting depth: 0.08mm
Cutting water amount: Flow rate: 2 L / min
Cutting water temperature: 23 ° C

  After dicing, check the ring frame visually. If there are 5 or more singulated packages, “X” is indicated. If one or more and 4 or less is lost, “△” is indicated. Was rated as “◯”. The results are shown in Table 2.

Test example 2
Retentivity (during heating) test After dicing in Test Example 1, ultraviolet irradiation was performed at 200 mJ / cm ² with a high-pressure mercury lamp, and then the entire ring frame was heated in a heating furnace at 125 ° C. for 5 hours.
Immediately after the heating, it was visually confirmed that the tape base film fixed to the ring frame was melted and the tape was not broken or dropped. When both conditions were satisfied, “◯” was evaluated, and when neither was satisfied, “×” was evaluated. The results are shown in Table 2.

Test example 3
Back surface adhesive residue test after heating After the heat treatment of Test Example 2, an individual package was picked up under the following pickup conditions.

Pickup conditions Pickup device: CAP-300II manufactured by Canon Machinery
Push-up pin shape: radius 0.7 mm, tip curvature radius R = 0.25 mm, tip θ = 15
Pin push-up height: 1mm
Pin push-up speed: 50mm / sec
Collet shape: Suction hole 0.89mmφ
Ring frame: manufactured by Disco Corporation: Model DTF-2-6-1 Made by SUS420J2

  After performing the above pick-up, it was visually confirmed that there was no adhesive residue on the back of the package (tape bonding surface) and that the tape was peeled off the ring frame and there was no adhesive residue on the ring frame. When both conditions were satisfied, “◯” was evaluated, and when neither was satisfied, “×” was evaluated. The results are shown in Table 2.

  As shown in Table 2, the adhesive tapes of Comparative Examples 1 and 2 are inferior in package retention in dicing, and the adhesive tape of Comparative Example 3 causes adhesive residue on the picked-up package back surface after heating. I was sorry. On the other hand, the adhesive tapes of Examples 1 to 5 had an adhesive force that sufficiently retained the package during dicing, and had no adhesive residue after heating. Furthermore, in Examples 1 to 3 in which the layer containing at least 5% of the thickness of the back surface of the base film contains 70 mass% or more of a resin having a melting point of 130 ° C. or higher, Even when heated, it had sufficient retention.

Claims (8)

  A pressure-sensitive adhesive tape having a pressure-sensitive adhesive layer formed on at least one side of a base film, and the base polymer of the pressure-sensitive adhesive forming the pressure-sensitive adhesive layer is such that at least one monomer component is a (meth) acrylic acid alkyl ester A glass transition temperature of the base polymer is −60 to −10 ° C.   2. The dicing according to claim 1, wherein the base polymer of the pressure-sensitive adhesive is a copolymer obtained by polymerizing a monomer mixture containing 5 to 25 mass% of isobornyl acrylate with respect to the total amount of monomer components. Adhesive tape.   The pressure-sensitive adhesive tape for dicing according to claim 1 or 2, wherein the base polymer of the pressure-sensitive adhesive has a weight average molecular weight of 200,000 to 1,000,000.   A pressure-sensitive adhesive layer is formed on one side of the base film, and at least 5% of the total thickness of the base film from the surface of the base film opposite to the surface on which the pressure-sensitive adhesive layer is formed. The pressure-sensitive adhesive tape for dicing according to any one of claims 1 to 3, wherein the layer including the thickness is composed of a composition containing 70 mass% or more of a resin having a melting point of 130 ° C or higher.   The pressure-sensitive adhesive layer according to any one of claims 1 to 4, wherein the pressure-sensitive adhesive layer is made of a radiation-curable pressure-sensitive adhesive.   6. The dicing pressure-sensitive adhesive tape according to claim 5, wherein the base polymer of the radiation-curable pressure-sensitive adhesive has a radiation-polymerizable carbon-carbon double bond in a side chain.   The adhesive tape for dicing according to any one of claims 1 to 6, wherein the adhesive tape is used for semiconductor processing involving a heat treatment step after dicing.   It is used for the process of dicing a semiconductor package, The adhesive tape for dicing of any one of Claims 1-7 characterized by the above-mentioned.