JP2020194879A - Dicing tape and dicing die bond film - Google Patents

Abstract

To provide a dicing tape capable of improving pick-up properties.SOLUTION: In a dicing die bond film 1, a dicing tape 20 includes a base material layer 21 and an adhesive layer 22 overlapping the base material layer. The adhesive layer contains an acrylic polymer. The acrylic polymer contains a constituent unit of C9 to C11 alkyl (meth) acrylate and a constituent unit of a hydroxyl group-containing (meth) acrylate and contains 40 mol% or more and 85 mol% or less of the constituent unit of C9 to C11 alkyl (meth) acrylate.SELECTED DRAWING: Figure 1

Description

The present invention relates to, for example, a dicing tape used when manufacturing a semiconductor integrated circuit, and a dicing die bond film provided with the dicing tape.

Conventionally, a dicing die bond film used in the manufacture of semiconductor integrated circuits is known. This type of dicing die bond film includes, for example, a dicing tape and a die bond layer laminated on the dicing tape and adhered to a wafer. The dicing tape has a base material layer and an adhesive layer in contact with the dicing bond layer. This type of dicing die bond film is used in the manufacture of semiconductor integrated circuits, for example, as follows.

The method of manufacturing a semiconductor integrated circuit is generally a pre-step of forming a circuit surface on one side of a silicon wafer by a highly integrated electronic circuit, and a post-assembly by cutting out a chip from the wafer on which the circuit surface is formed. It has a process.
The post-process includes, for example, a mounting process in which the surface of the wafer opposite to the circuit surface is attached to the dicing tape to fix the wafer to the dicing tape, and a semiconductor wafer attached to the dicing tape via the dicing layer. A dicing process that processes small chips (dies) by cutting, an expanding process that widens the distance between the small processed semiconductor chips, and a state in which the die bond layer is attached by peeling between the die bond layer and the adhesive layer. It has a pickup step of taking out the semiconductor chip (die) and a dicing step of adhering the semiconductor chip (die) with the die bond layer attached to the adherend. The semiconductor integrated circuit is manufactured through these steps.
In the pickup process of the above manufacturing method, the cut semiconductor chip is pushed up from the lower side of the dicing tape by the pin member of the pickup mechanism together with the die bond layer of the size equivalent to the chip that is in close contact with the chip, and is picked up from the dicing tape. Will be done.
By the way, in recent years, as semiconductor products have become lighter and more integrated, the thickness of semiconductor wafers has become thinner than before. When such a semiconductor wafer is used, the problem that the semiconductor wafer is deformed and damaged due to the above-mentioned push-up in the pickup process is more likely to occur. In order to prevent such damage, the dicing tape is required to have a performance that allows it to be satisfactorily peeled from the die bond film even with a small amount of push-up after being cut, that is, a good pick-up property.

On the other hand, as a conventional dicing die bond film, for example, one having a pressure-sensitive adhesive layer formed by a pressure-sensitive adhesive composition containing a base polymer and a heat-crosslinking agent is known (Patent Document 1).
In the dicing die bond film described in Patent Document 1, the pressure-sensitive adhesive layer is a layer in which the gel fraction before heating is less than 90% by mass and the gel fraction after heating changes to 90% by mass or more. The pressure-sensitive adhesive layer having a gel fraction of 90% by mass or more by heating can be easily peeled off from the die bond layer.

Japanese Unexamined Patent Publication No. 2010-278427

However, it cannot be said that a dicing die bond film or a dicing tape capable of improving the pick-up property as described above has not been sufficiently studied.

Therefore, it is an object of the present invention to provide a dicing tape capable of improving pick-up property and a dicing die bond film capable of improving pick-up property.

In order to solve the above problems, the dicing tape according to the present invention is used.
A dicing tape provided with a base material layer and an adhesive layer overlapping the base material layer.
The pressure-sensitive adhesive layer contains an acrylic polymer and contains
The acrylic polymer contains a structural unit of C9 to C11 alkyl (meth) acrylate and a structural unit of a hydroxyl group-containing (meth) acrylate.
According to the dicing tape having the above structure, the acrylic polymer contains 40 mol% or more and 85 mol% or less of the constituent units of the C9 to C11 alkyl (meth) acrylate, and good pick-up property can be exhibited.

In the dicing tape according to the present invention, the acrylic polymer preferably contains 1 mol% or more and 30 mol% or less of the structural unit of the hydroxyl group-containing (meth) acrylate. As a result, better pick-up performance can be exhibited.

In the dicing tape according to the present invention, the structural unit of the hydroxyl group-containing (meth) acrylate is preferably the structural unit of the hydroxyl group-containing C2-C4 alkyl (meth) acrylate. As a result, better pick-up performance can be exhibited.

In the dicing tape according to the present invention, it is preferable that the acrylic polymer further has a structural unit of a polymerizable group-containing (meth) acrylate. As a result, better pick-up performance can be exhibited.

In the dicing tape according to the present invention, the acrylic polymer has the polymerizable group with respect to the structural unit (B) of the hydroxyl group-containing (meth) acrylate and the structural unit (C) of the polymerizable group-containing (meth) acrylate. The structural unit (C) of the contained (meth) acrylate is preferably contained in a molar ratio [C / (B + C)] of 0.50 or more and 0.95 or less. As a result, better pick-up performance can be exhibited.

The dicing die bond film according to the present invention includes the above dicing tape and a dicing layer laminated on the adhesive layer of the dicing tape.

The dicing tape and the dicing die bond film according to the present invention have an effect that the pick-up property can be improved.

The cross-sectional view of the dicing die bond film of this embodiment cut in the thickness direction. The cross-sectional view which shows the state of the half-cut processing in the manufacturing method of a semiconductor integrated circuit schematically. The cross-sectional view which shows the state of the half-cut processing in the manufacturing method of a semiconductor integrated circuit schematically. The cross-sectional view which shows the state of the half-cut processing in the manufacturing method of a semiconductor integrated circuit schematically. The cross-sectional view which shows the state of the half-cut processing in the manufacturing method of a semiconductor integrated circuit schematically. The cross-sectional view which shows the state of the mounting process in the manufacturing method of a semiconductor integrated circuit schematically. The cross-sectional view which shows the state of the mounting process in the manufacturing method of a semiconductor integrated circuit schematically. A cross-sectional view schematically showing a state of an expanding process at a low temperature in a method for manufacturing a semiconductor integrated circuit. A cross-sectional view schematically showing a state of an expanding process at a low temperature in a method for manufacturing a semiconductor integrated circuit. A cross-sectional view schematically showing a state of an expanding process at a low temperature in a method for manufacturing a semiconductor integrated circuit. The cross-sectional view which shows the state of the expanding process at room temperature in the manufacturing method of a semiconductor integrated circuit schematically. The cross-sectional view which shows the state of the expanding process at room temperature in the manufacturing method of a semiconductor integrated circuit schematically. The cross-sectional view which shows the state of the pickup process in the manufacturing method of a semiconductor integrated circuit schematically.

Hereinafter, an embodiment of the dicing die bond film and the dicing tape according to the present invention will be described with reference to the drawings.

As shown in FIG. 1, the dicing die bond film 1 of the present embodiment includes a dicing tape 20 and a die bond layer 10 laminated on the pressure-sensitive adhesive layer 22 of the dicing tape 20 and adhered to a semiconductor wafer.

The dicing tape 20 of the present embodiment is usually a long sheet and is stored in a wound state until it is used. The dicing die bond film 1 of the present embodiment is stretched, cut and used in an annular frame having an inner diameter slightly larger than that of the silicon wafer to be cut.

The dicing tape 20 of the present embodiment includes a base material layer 21 and an adhesive layer 22 that overlaps the base material layer 21. The pressure-sensitive adhesive layer 22 contains at least an acrylic polymer.
The acrylic polymer has at least a constituent unit of C9 to C11 alkyl (meth) acrylate and a constituent unit of a hydroxyl group-containing (meth) acrylate in the molecule.
In addition, in this specification, the notation "(meth) acrylate" represents at least one of methacrylate (methacrylic acid ester) and acrylate (acrylic acid ester). Similarly, the notation "(meth) acrylic acid" represents at least one of methacrylic acid and acrylic acid.

In the present embodiment, the pressure-sensitive adhesive layer 22 contains, for example, the above acrylic polymer, an isocyanate compound (crosslinking agent), and a polymerization initiator.

The pressure-sensitive adhesive layer 22 preferably has a thickness of 3 μm or more and 200 μm or less. When the thickness of the pressure-sensitive adhesive layer 22 is 3 μm or more, the adhesive strength to the die bond layer 10 can be improved. When the thickness of the pressure-sensitive adhesive layer 22 is 200 μm or less, the handleability of the dicing tape 20 becomes better. The shape and size of the pressure-sensitive adhesive layer 22 are usually the same as the shape and size of the base material layer 21.

In the present embodiment, the acrylic polymer is composed of a constituent unit of C9 to C11 alkyl (meth) acrylate, a constituent unit of a hydroxyl group-containing (meth) acrylate, and a constituent unit of a polymerizable group-containing (meth) acrylate. ing. The structural unit is a unit that constitutes the main chain of the acrylic polymer. Each side chain in the above acrylic polymer is included in each structural unit constituting the main chain.

In the acrylic polymer contained in the pressure-sensitive adhesive layer 22, the above-mentioned structural units can be confirmed by NMR analysis such as ¹ H-NMR and ¹³ C-NMR, thermal decomposition GC / MS analysis, infrared spectroscopy and the like. The molar ratio of the above-mentioned structural units in the acrylic polymer is usually calculated from the blending amount (charged amount) when the acrylic polymer is polymerized.

The structural unit of the C9 to C11 alkyl (meth) acrylate is derived from the C9 to C11 alkyl (meth) acrylate monomer. In other words, the molecular structure after the polymerization reaction of the C9 to C11 alkyl (meth) acrylate monomers is the structural unit of the C9 to C11 alkyl (meth) acrylate. Specifically, the bonds formed by the polymerization reaction of the C9 to C11 alkyl (meth) acrylate monomers form a part of the main chain of the acrylic polymer. The notation "C9 to C11 alkyl" represents the number of carbon atoms of the hydrocarbon moiety ester-bonded to (meth) acrylic acid. In other words, the C9 to C11 alkyl (meth) acrylate monomer represents a monomer in which (meth) acrylic acid and an alcohol having 9 to 11 carbon atoms (usually a monohydric alcohol) are ester-bonded.
The hydrocarbon moiety of the C9 to C11 alkyl may be a saturated hydrocarbon or an unsaturated hydrocarbon. For example, the hydrocarbon moiety of C9 to C11 alkyl is a linear saturated hydrocarbon, a branched chain saturated hydrocarbon, an alicyclic hydrocarbon, or an aromatic hydrocarbon. Such a hydrocarbon moiety is preferably a linear saturated hydrocarbon or a branched chain saturated hydrocarbon, and more preferably a branched chain saturated hydrocarbon.
The hydrocarbon moiety of C9 to C11 alkyl preferably does not contain a polar group containing oxygen (O), nitrogen (N), or the like. As a result, it is possible to prevent the polarity of the alkyl polymer from becoming extremely high. Therefore, it is possible to prevent the pressure-sensitive adhesive layer 22 from having an excessive affinity for the die-bond layer 10. Therefore, the dicing tape 20 can be better peeled from the die bond layer 10.

Examples of the constituent units of the C9 to C11 alkyl (meth) acrylates include n-nonyl (meth) acrylate, iso (sec) -nonyl (meth) acrylate, tert-nonyl (meth) acrylate, isobornyl (meth) acrylate, and n. -Decil (meth) acrylate, iso (sec) -decyl (meth) acrylate, tert-decyl (meth) acrylate, n-undecyl (meth) acrylate, iso (sec) -undecyl (meth) acrylate, tert-undecyl (meth) ) Each structural unit such as acrylate can be mentioned.
As the constitutional unit of C9 to C11 alkyl (meth) acrylate, at least one of the constitutional unit of nonyl (meth) acrylate and the constitutional unit of decyl acrylate is preferable, and the constitutional unit of isononyl (meth) acrylate and isodecyl (meth) acrylate At least one of the constituent units of is more preferable.
When the number of carbon atoms in the hydrocarbon portion is 8 or less in the alkyl (meth) acrylate constituent unit, the affinity between the pressure-sensitive adhesive layer 22 and the die bond layer 10 becomes too high, so that the dicing tape 20 is peeled off from the die bond layer 10. There is it that makes it difficult. Further, when the number of carbon atoms in the hydrocarbon portion is 12 or more, the affinity between the pressure-sensitive adhesive layer 22 and the die bond layer 10 is excessively lowered, so that the dicing tape 20 is used in the method for manufacturing a semiconductor integrated circuit (detailed later). May unintentionally peel off from the die bond layer 10. In particular, the number of carbon atoms in the hydrocarbon moiety is preferably 9 or 10.

The acrylic polymer contains 40 mol% or more and 85 mol% or less of a constituent unit of C9 to C11 alkyl (meth) acrylate (hereinafter, may be simply referred to as component A) in the molecule.
Since the acrylic polymer contains the constituent units of C9 to C11 alkyl (meth) acrylate in an amount of 40 mol% or more and 85 mol% or less, good pick-up property can be exhibited.
It is more preferable that the acrylic polymer contains 45 mol% or more of the structural units of C9 to C11 alkyl (meth) acrylate. Further, it is more preferable to contain 80 mol% or less.

The above mol% is a value based on the monomer that constitutes the main chain of the acrylic polymer. Specifically, the polymerization initiator and chain transfer agent incorporated in the main chain during the polymerization of the acrylic polymer are not considered in the above mol%. Hereinafter, the same applies in the specification.
In other words, the acrylic polymer described above has a main chain in which the unsaturated double bond portion of the (meth) acryloyl group in the (meth) acrylate monomer before polymerization is connected by polymerization. The above mol% is the molar percentage with respect to the total number of moles of the (meth) acrylate monomer which constitutes the main chain by polymerization. The molecular structure in the side chain of the acrylic polymer is not considered in the above mol%.

The acrylic polymer has a constituent unit of a hydroxyl group-containing (meth) acrylate, and the hydroxyl group of such a constituent unit easily reacts with an isocyanate group.
By allowing the acrylic polymer having a constituent unit of the hydroxyl group-containing (meth) acrylate and the isocyanate compound to coexist in the pressure-sensitive adhesive layer 22, the pressure-sensitive adhesive layer can be appropriately polymerized. Therefore, the acrylic polymer can be sufficiently gelled. Therefore, the pressure-sensitive adhesive layer 22 can exhibit adhesive performance while maintaining its shape.

The structural unit of the hydroxyl group-containing (meth) acrylate is derived from the hydroxyl group-containing (meth) acrylate monomer. In other words, the molecular structure of the hydroxyl group-containing (meth) acrylate monomer after the polymerization reaction is the constituent unit of the hydroxyl group-containing (meth) acrylate. Specifically, the bond generated by the polymerization reaction of the hydroxyl group-containing (meth) acrylate monomer constitutes a part of the main chain of the acrylic polymer.

The structural unit of the hydroxyl group-containing (meth) acrylate is preferably the structural unit of the hydroxyl group-containing C2-C4 alkyl (meth) acrylate. The notation "C2-C4 alkyl" represents the number of carbon atoms in the hydrocarbon moiety ester-bonded to (meth) acrylic acid. In other words, the hydroxyl group-containing C2-C4 alkyl (meth) acrylate monomer represents a monomer in which (meth) acrylic acid and an alcohol having 2 to 4 carbon atoms (usually a divalent alcohol) are ester-bonded.
The hydrocarbon moiety of the C2-C4 alkyl is usually a saturated hydrocarbon. For example, the hydrocarbon moiety of C2-C4 alkyl is a linear saturated hydrocarbon or a branched chain saturated hydrocarbon. The hydrocarbon moiety of the C2-C4 alkyl preferably does not contain a polar group containing oxygen (O), nitrogen (N) or the like.
In the structural unit of the hydroxyl group-containing (meth) acrylate, the hydroxyl group (−OH group) may be bonded to any carbon (C) of the hydrocarbon moiety. The hydroxyl group (−OH group) is preferably bonded to the carbon (C) at the end of the hydrocarbon moiety.

Examples of the constituent unit of the hydroxyl group-containing C2-C4 alkyl (meth) acrylate include hydroxyethyl (meth) acrylate, hydroxypropyl (meth) acrylate, hydroxyn-butyl (meth) acrylate, or hydroxyiso-butyl (meth). Examples thereof include each structural unit of hydroxybutyl (meth) acrylate such as acrylate. In the structural unit of hydroxybutyl (meth) acrylate, the hydroxyl group (-OH group) may be bonded to the carbon (C) at the terminal of the hydrocarbon portion, and the carbon (C) other than the terminal of the hydrocarbon portion may be bonded. May be combined with.

The structural unit of the hydroxyl group-containing C2-C4 alkyl (meth) acrylate is not particularly limited, but may be, for example, at least one of hydroxyethyl (meth) acrylate and hydroxybutyl (meth) acrylate. More specifically, it may be a structural unit of at least one of 2-hydroxyethyl (meth) acrylate and 4-hydroxybutyl (meth) acrylate.

The acrylic polymer preferably contains 1 mol% or more and 30 mol% or less of a constituent unit of the hydroxyl group-containing (meth) acrylate (hereinafter, may be simply referred to as component B) in the molecule.
By containing 1 mol% or more of the constituent units of the hydroxyl group-containing (meth) acrylate, the number of hydroxyl groups capable of cross-linking with the isocyanate compound (crosslinking agent) becomes relatively large. Therefore, the acrylic polymer can be sufficiently gelled by cross-linking. As a result, the fluidity of the pressure-sensitive adhesive layer 22 is suppressed. Therefore, the pressure-sensitive adhesive layer 22 can exhibit adhesive performance while maintaining its shape. Therefore, the adhesive strength (before the pickup process) of the pressure-sensitive adhesive layer 22 before irradiation with active energy rays (ultraviolet rays, etc.) can be satisfactorily exhibited.
The acrylic polymer more preferably contains 1.5 mol% or more of the constituent units of the hydroxyl group-containing (meth) acrylate, and further preferably 2.0 mol% or more.
Further, the polarity of the pressure-sensitive adhesive layer 22 can be suppressed to be relatively low by containing 30 mol% or less of the structural unit of the hydroxyl group-containing (meth) acrylate. Therefore, the polar interaction between the pressure-sensitive adhesive layer 22 and the die bond layer 10 is suppressed, and the dicing tape 20 can be better peeled from the die bond layer 10. Therefore, better pick-up property can be exhibited after irradiation with active energy rays (ultraviolet rays, etc.).
The acrylic polymer preferably contains 20 mol% or less of the constituent units of the hydroxyl group-containing (meth) acrylate, more preferably 17.5 mol% or less, and particularly preferably 10 mol% or less.

In this embodiment, the acrylic polymer further comprises a building block of a polymerizable group-containing (meth) acrylate, as described above. In other words, the acrylic polymer described above contains a building block of a polymerizable group-containing (meth) acrylate having a polymerizable unsaturated double bond in the side chain.
By including the structural unit of the polymerizable group-containing (meth) acrylate in the acrylic polymer, the pressure-sensitive adhesive layer 22 can be cured by irradiation with active energy rays (ultraviolet rays or the like) before the pickup step. Specifically, radicals can be generated from the photopolymerization initiator by irradiation with active energy rays such as ultraviolet rays, and the acrylic polymers can be crosslinked with each other by the action of the radicals. As a result, the adhesive strength of the pressure-sensitive adhesive layer 22 can be reduced after irradiation rather than before irradiation. Then, the die bond layer 10 can be satisfactorily peeled off from the pressure-sensitive adhesive layer 22, and there is an advantage that better pick-up property can be exhibited.
As the active energy beam, ultraviolet rays, radiation, and an electron beam are adopted.

The structural unit of the polymerizable group-containing (meth) acrylate can be formed by binding a monomer having a functional group capable of binding to a hydroxyl group and a polymerizable group in the molecule to the structural unit of the hydroxyl group-containing (meth) acrylate. .. The above-mentioned functional group may be an isocyanate group having high reactivity with a hydroxyl group. In other words, the above-mentioned monomer may have an isocyanate group and a vinyl group at both ends of the molecule, respectively. The vinyl group may be, for example, part of a (meth) acryloyl group.
Specifically, the structural unit of the polymerizable group-containing (meth) acrylate is a molecular structure in which the isocyanate group of the isocyanate group-containing (meth) acrylate monomer is urethane-bonded to the hydroxyl group in the above-mentioned structural unit of the hydroxyl group-containing (meth) acrylate. May have. In other words, the structural unit of the polymerizable group-containing (meth) acrylate is a molecular structure derived from the structural unit of the hydroxyl group-containing (meth) acrylate, and is a polymerizable group ((meth) acryloyl group) via a urethane bond derived from the hydroxyl group. ) May have a bonded molecular structure.

The building blocks of a polymerizable group-containing (meth) acrylate having a polymerizable group can be prepared after the polymerization of the acrylic polymer. For example, after copolymerization of a C9 to C11 alkyl (meth) acrylate monomer and a hydroxyl group-containing (meth) acrylate monomer, a hydroxyl group in a part of the constituent units of the hydroxyl group-containing (meth) acrylate and an isocyanate group-containing polymerizable monomer The structural unit of the above-mentioned polymerizable group-containing (meth) acrylate can be obtained by subjecting the isocyanate group to a urethanization reaction.

The isocyanate group-containing (meth) acrylate monomer preferably has one isocyanate group and one (meth) acryloyl group in the molecule. Examples of such a monomer include 2-isocyanatoethyl (meth) acrylate.

The above acrylic polymer preferably contains 7.0 mol% or more of a constituent unit of a polymerizable group-containing (meth) acrylate (hereinafter, may be simply referred to as component C) in the molecule, and 7.5 mol% or more. It is more preferable, and it is further preferable to contain 13.5 mol% or more. Further, the C component is preferably contained in an amount of 60 mol% or less, more preferably 54 mol% or less, and further preferably 52 mol% or less.

The acrylic polymer preferably contains a hydroxyl group-containing (meth) acrylate constituent unit and a polymerizable group-containing (meth) acrylate constituent unit in an amount of 15 mol% or more and 60 mol% or less in the molecule.

The above acrylic polymer is a structural unit of C9 to C11 alkyl (meth) acrylate with respect to the structural unit (B) of the hydroxyl group-containing (meth) acrylate and the structural unit (C) of the polymerizable group-containing (meth) acrylate. (A) is preferably contained in a molar ratio [A / (B + C)] of 0.5 or more and 6.0 or less.
When the above ratio [A / (B + C)] is 0.5 or more, it is possible to prevent the pressure-sensitive adhesive layer 22 from being excessively cured after irradiation with active energy rays (detailed later). Therefore, when the cut semiconductor chip and the die bond layer 10 having a size equivalent to the chip that is in close contact with the chip are peeled off from the dicing tape 20, the adhesive layer 22 can be deformed relatively easily. As a result, the peeling angle becomes more sufficient, and as a result, the peeling can be performed better. Further, when the above ratio [A / (B + C)] is 6.0 or less, the pressure-sensitive adhesive layer 22 can be cured and shrunk more satisfactorily after irradiation with active energy rays. Therefore, the peeling force of the pressure-sensitive adhesive layer 22 against the die-bond layer 10 is better reduced after irradiation.
The above ratio [A / (B + C)] is more preferably 0.6 or more, further preferably 0.67 or more, and particularly preferably 0.7 or more.
The above ratio [A / (B + C)] is more preferably 5.67 or less, further preferably 5.5 or less, and particularly preferably 5.0 or less.

The above acrylic polymer has a hydroxyl group-containing (meth) acrylate constituent unit (B) with respect to a hydroxyl group-containing (meth) acrylate constituent unit (B) and a polymerizable group-containing (meth) acrylate constituent unit (C). ) Is preferably included in a molar ratio [B / (B + C)] of 0.05 or more and 0.50 or less.
The above ratio [B / (B + C)] is more preferably 0.06 or more, and further preferably 0.07 or more.
The above ratio [B / (B + C)] is more preferably 0.40 or less, and further preferably 0.20 or less.

The above acrylic polymer is a constituent unit of a polymerizable group-containing (meth) acrylate with respect to a constituent unit (B) of a hydroxyl group-containing (meth) acrylate and a constituent unit (C) of a polymerizable group-containing (meth) acrylate. (C) is preferably contained in a molar ratio [C / (B + C)] of 0.50 or more and 0.95 or less.
When the above ratio [C / (B + C)] is 0.50 or more, the pressure-sensitive adhesive layer 22 can be more sufficiently cured and shrunk by the polymerization reaction accompanying irradiation with ultraviolet rays or the like. Therefore, the peeling force when the die bond layer 10 is peeled from the pressure-sensitive adhesive layer 22 can be more sufficiently reduced. Further, when the above ratio [C / (B + C)] is 0.95 or less, the number of hydroxyl groups capable of reacting with the isocyanate compound (crosslinking agent) is relatively large. Therefore, the acrylic polymers can be crosslinked with each other and gelled more sufficiently. As a result, the fluidity of the pressure-sensitive adhesive layer 22 is suppressed, and the pressure-sensitive adhesive layer 22 can exhibit adhesive performance while maintaining its shape.
The above ratio [C / (B + C)] is more preferably 0.60 or more, and further preferably 0.80 or more.
The above ratio [C / (B + C)] is more preferably 0.95 or less, further preferably 0.94 or less, and particularly preferably 0.93 or less.

In the above acrylic polymer, the structural unit (B) of the hydroxyl group-containing (meth) acrylate is 0.01 in terms of molar ratio (B / A) with respect to the structural unit (A) of the C9 to C11 alkyl (meth) acrylate. It is preferable that the content is 0.80 or less.
When the above ratio (B / A) is 0.01 or more, the number of hydroxyl groups capable of reacting with the isocyanate compound (crosslinking agent) is relatively large. Therefore, the acrylic polymers can be crosslinked with each other and gelled more sufficiently. As a result, the fluidity of the pressure-sensitive adhesive layer 22 is suppressed, and the pressure-sensitive adhesive layer 22 can exhibit adhesive performance while maintaining its shape.
When the above ratio (B / A) is 0.08 or less, the polarity of the pressure-sensitive adhesive layer 22 can be suppressed to be relatively low. Therefore, the polar interaction between the pressure-sensitive adhesive layer 22 and the die bond layer 10 is suppressed, and the dicing tape 20 can be better peeled from the die bond layer 10.
The above ratio (B / A) is more preferably 0.02 or more, and further preferably 0.03 or more.
The above ratio (B / A) is more preferably 0.75 or less, and further preferably 0.70 or less.

In the above acrylic polymer, the structural unit (C) of the polymerizable group-containing (meth) acrylate is 0 in the molar ratio (C / A) with respect to the structural unit (A) of the C9 to C11 alkyl (meth) acrylate. It is preferable to include .08 or more and 1.40 or less.
When the above ratio (C / A) is 0.08 or more, the adhesive layer 22 can be more sufficiently cured and shrunk by irradiation with ultraviolet rays or the like, and the die bond layer can be better peeled from the dicing tape 20. can do. Further, when the above ratio (C / A) is 1.40 or less, it is possible to prevent the pressure-sensitive adhesive layer 22 from being excessively cured and shrunk by irradiation with ultraviolet rays or the like. When the excessive curing shrinkage of the pressure-sensitive adhesive layer 22 is suppressed, the pressure-sensitive adhesive layer 22 is released when the cut semiconductor chip and the die bond layer having a size equivalent to the chip that is in close contact with the semiconductor chip are peeled off from the dicing tape 20. It can be deformed relatively easily. As a result, the peeling angle becomes more sufficient, and as a result, the peeling can be performed better.
The above ratio (C / A) is more preferably 0.09 or more, further preferably 0.10 or more, and particularly preferably 0.20 or more.
The above ratio (C / A) is more preferably 1.35 or less, further preferably 1.30 or less, and particularly preferably 1.20 or less.

In the above acrylic polymer, the structural unit (C) of the polymerizable group-containing (meth) acrylate is 0.9 in terms of molar ratio (C / B) with respect to the structural unit (B) of the hydroxyl group-containing (meth) acrylate. It is preferable to include more than 18.0 or less.
When the above ratio (C / B) is 0.9 or more, the pressure-sensitive adhesive layer 22 can be more sufficiently cured and shrunk by irradiation with ultraviolet rays or the like, and the adhesive strength of the pressure-sensitive adhesive layer 22 after irradiation can be increased. It can be lowered more sufficiently. Therefore, the die bond layer can be better peeled off from the dicing tape 20.
When the above ratio (C / B) is 18.0 or less, the number of hydroxyl groups capable of cross-linking with the isocyanate compound (cross-linking agent) is relatively large. Therefore, the acrylic polymer can be sufficiently gelled by cross-linking. As a result, the fluidity of the pressure-sensitive adhesive layer 22 is suppressed. Therefore, the pressure-sensitive adhesive layer 22 can exhibit adhesive performance while maintaining its shape.
The above ratio (C / B) is more preferably 0.95 or more, and further preferably 1.0 or more.
The above ratio (C / B) is more preferably 17.5 or less, further preferably 17.33 or less, and particularly preferably 17.0 or less.

In a preferred embodiment, the acrylic polymer comprises a building block of an isononyl (meth) acrylate, a building block of a hydroxyl group-containing (meth) acrylate, and a building block of a polymerizable group-containing (meth) acrylate, and contains a hydroxyl group (meth). ) The structural unit of the acrylate is at least one of the structural unit of hydroxyethyl (meth) acrylate or the structural unit of hydroxybutyl (meth) acrylate.
In a more preferable form, the structural unit of the polymerizable group-containing (meth) acrylate has a urethane bond in which some hydroxyl groups of the structural unit of the hydroxyl group-containing (meth) acrylate have undergone a urethanization reaction, and is incorporated via the urethane bond. It further has the obtained (meth) acryloyl group as a polymerizable group.

The dicing tape 20 of the present embodiment includes the pressure-sensitive adhesive layer 22 containing the acrylic polymer described above. The pressure-sensitive adhesive layer 22 further contains an isocyanate compound (crosslinking agent). A part of the isocyanate compound may be in a state after the reaction by a urethanization reaction or the like.
The isocyanate compound has a plurality of isocyanate groups in the molecule. When the isocyanate compound has a plurality of isocyanate groups in the molecule, the cross-linking reaction between the acrylic polymers in the pressure-sensitive adhesive layer 22 can proceed. Specifically, by reacting one isocyanate group of the isocyanate compound with the hydroxyl group of the acrylic polymer and reacting the other isocyanate group with the hydroxyl group of another acrylic polymer, the cross-linking reaction via the isocyanate compound can proceed.

Examples of the isocyanate compound include diisocyanates such as aliphatic diisocyanates, alicyclic diisocyanates, and aromatic aliphatic diisocyanates.

Examples of the aliphatic diisocyanate include ethylene diisocyanate, tetramethylene diisocyanate, hexamethylene diisocyanate, 2,4,4- or 2,2,4-trimethylhexamethylene diisocyanate, methyl 2,6-diisocyanatocaproate and the like. Be done.
Examples of the alicyclic diisocyanate include 3-isocyanatomethyl-3,5,5-trimethylcyclohexane, 1,3- or 1,4-bis (isocyanatomethyl) cyclohexane, and methylcyclohexane-2,4- or 2. , 6-Diisocyanate, dicyclohexylmethane-4,4'-diisocyanate, 1,3- or 1,4-diisocyanatocyclohexane and the like.
Examples of the aromatic diisocyanate include m- or p-phenylenediocyanate, diphenylmethane-4,4'-diisocyanate, 2,4- or 2,6-tolylene diisocyanate, 1,3'-or 1,4-bis ( Isocyanatomethyl) benzene, 1,3- or 1,4-bis (α-isocyanatoisopropyl) benzene and the like can be mentioned.

Moreover, triisocyanate is mentioned as an isocyanate compound. Examples of the triisocyanate include triphenylmethane-4,4', 4 "-triisocyanate, 1,3,5-triisocyanatobenzene, 1,3,5-tris (isocyanatomethyl) cyclohexane, and 1,3. , 5-Tris (isocyanatomethyl) benzene, 2,6-diisocyanatocaproate-2-isocyanatoethyl and the like.
Further, examples of the isocyanate compound include polymerized polyisocyanates such as dimers and trimers of diisocyanates and polymethylene polyphenylene polyisocyanates.

In addition, examples of the isocyanate compound include polyisocyanate obtained by reacting an excess amount of the above-mentioned isocyanate compound with an active hydrogen-containing compound. Examples of the active hydrogen-containing compound include an active hydrogen-containing low molecular weight compound and an active hydrogen-containing high molecular weight compound.
Examples of the active hydrogen-containing low molecular weight compound include ethylene glycol, propylene glycol, dipropylene glycol, diethylene glycol, triethylene glycol, 2,2,4-trimethyl-1,3-pentanediol, neopentyl glycol, hexanediol, and cyclohexane. Dimethanol, cyclohexanediol, hydrogenated bisphenol A, xylylene glycol, glycerin, trimethylolethane, trimethylolpropane, hexanetriol, pentaerythritol, sorbitol, sorbit, sucrose, castor oil, ethylenediamine, hexamethylenediamine, diethanolamine, tri Examples thereof include ethanolamine, water, ammonia, urea and the like, and examples of the active hydrogen-containing high molecular weight compound include various polyether polyols, polyester polyols, polyurethane polyols, acrylic polyols, epoxy polyols and the like.

Further, as the isocyanate compound, allophanated polyisocyanate, biuretized polyisocyanate and the like can also be used.
The above-mentioned isocyanate compounds may be used alone or in combination of two or more.

As the above-mentioned isocyanate compound, a reaction product of an aromatic diisocyanate and an active hydrogen-containing low molecular weight compound is preferable. Since the reaction product of the aromatic diisocyanate has a relatively slow reaction rate of the isocyanate group, it is suppressed that the pressure-sensitive adhesive layer 22 containing such the reaction product is excessively cured. As the above-mentioned isocyanate compound, those having three or more isocyanate groups in the molecule are preferable.

The polymerization initiator contained in the pressure-sensitive adhesive layer 22 is a compound capable of initiating a polymerization reaction by the energy of applied heat or light. When the pressure-sensitive adhesive layer 22 contains a polymerization initiator, the cross-linking reaction between the acrylic polymers can proceed when the pressure-sensitive adhesive layer 22 is subjected to thermal energy or light energy. Specifically, the pressure-sensitive adhesive layer 22 can be cured by initiating a polymerization reaction between the polymerizable groups between acrylic polymers having a constituent unit of a polymerizable group-containing (meth) acrylate. As a result, as described above, better pick-up performance can be exhibited.
As the polymerization initiator, for example, a photopolymerization initiator or a thermal polymerization initiator is adopted. As the polymerization initiator, a general commercially available product can be used.

The pressure-sensitive adhesive layer 22 may further contain other components other than those described above. Other components include, for example, tackifiers, plasticizers, fillers, antioxidants, antioxidants, UV absorbers, light stabilizers, heat stabilizers, antistatic agents, surfactants, light release agents. And so on. The types and amounts of other ingredients can be appropriately selected depending on the intended purpose.

The dicing tape 20 of the present embodiment includes a base material layer 21 bonded to the pressure-sensitive adhesive layer 22. The base material layer 21 is, for example, a metal foil, a fiber sheet such as paper or cloth, a rubber sheet, a resin film, or the like. The base material layer 21 may have a laminated structure.
Examples of the fiber sheet constituting the base material layer 21 include paper, woven fabric, and non-woven fabric.
Examples of the material of the resin film include polyolefins such as polyethylene (PE), polypropylene (PP), and ethylene-propylene copolymer; ethylene-vinyl acetate copolymer (EVA), ionomer resin, and ethylene- (meth) acrylic acid. Ethylene copolymers such as copolymers, ethylene- (meth) acrylic acid ester (random, alternating) copolymers; polyesters such as polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polybutylene terephthalate (PBT) Polyacrylate; Polyvinyl chloride (PVC); Polyurethane; Polycarbonate; Polyphenylene sulfide (PPS); Polyamides such as aliphatic polyamides and total aromatic polyamides (aramids); Polyether ether ketones (PEEK); Polyethylene; Polyetherimide; Polyvinylidene chloride; ABS (acrylonitrile-butadiene-styrene copolymer); cellulose or cellulose derivative; silicone-containing polymer; fluorine-containing polymer and the like can be mentioned. These may be used alone or in combination of two or more.

When the base material layer 21 has a resin film, the resin film may be subjected to a stretching treatment or the like to control deformability such as elongation.
The surface of the base material layer 21 may be surface-treated in order to improve the adhesion to the pressure-sensitive adhesive layer 22. As the surface treatment, for example, chromic acid treatment, ozone exposure, flame exposure, high piezoelectric exposure, oxidation treatment by a chemical method such as ionizing radiation treatment, or oxidation treatment by a physical method can be adopted. Further, a coating treatment with a coating agent such as an anchor coating agent, a primer or an adhesive may be applied.

The back surface side of the base material layer 21 (the side where the adhesive layer 22 does not overlap) is coated with, for example, a release agent (release agent) such as a silicone resin or a fluorine resin in order to impart peelability. It may be treated.
The base material layer 21 is preferably a light-transmitting (ultraviolet-transmitting) resin film or the like in that active energy rays such as ultraviolet rays can be given to the pressure-sensitive adhesive layer 22 from the back surface side.

The dicing tape 20 of the present embodiment may include a release sheet that covers one surface of the pressure-sensitive adhesive layer 22 (the surface where the pressure-sensitive adhesive layer 22 does not overlap with the base material layer 21) in a state before being used. .. When the die bond layer 10 having an area smaller than that of the pressure-sensitive adhesive layer 22 is arranged so as to fit in the pressure-sensitive adhesive layer 22, the release sheet is arranged so as to cover both the pressure-sensitive adhesive layer 22 and the die-bond layer 10. The release sheet is used to protect the pressure-sensitive adhesive layer 22, and is peeled off before the die bond layer 10 is attached to the pressure-sensitive adhesive layer 22.

As the release sheet, for example, a plastic film or paper surface-treated with a release agent such as silicone-based, long-chain alkyl-based, fluorine-based, or molybdenum sulfide can be used.
Examples of the release sheet include polytetrafluoroethylene, polychlorotrifluoroethylene, polyvinylidene fluoride, polyvinylidene fluoride, tetrafluoroethylene / hexafluoropropylene copolymer, chlorofluoroethylene / vinylidene fluoride copolymer and the like. A film made of a fluoropolymer; a film made of polyolefin such as polyethylene and polypropylene; a film made of polyester such as polyethylene terephthalate (PET) and the like can be used.
Further, as the release sheet, for example, a plastic film or paper surface-coated with a release agent such as a fluorine-based release agent or a long-chain alkyl acrylate-based release agent can be used.
The release sheet can be used as a support material for supporting the pressure-sensitive adhesive layer 22. In particular, the release sheet is preferably used when the pressure-sensitive adhesive layer 22 is overlaid on the base material layer 21. Specifically, the pressure-sensitive adhesive layer 22 is laminated on the base material layer 21 in a state where the release sheet and the pressure-sensitive adhesive layer 22 are laminated, and then the release sheet is peeled off (transferred) on the base material layer 21. The pressure-sensitive adhesive layer 22 can be stacked.

Next, the dicing die bond film 1 of the present embodiment will be described in detail.

The dicing die bond film 1 of the present embodiment includes the dicing tape 20 described above and a dicing layer 10 laminated on the adhesive layer 22 of the dicing tape 20. The die bond layer 10 is adhered to a semiconductor wafer in the manufacture of a semiconductor integrated circuit.

The die bond layer 10 may contain at least one of a thermosetting resin and a thermoplastic resin. The die bond layer 10 preferably contains a thermosetting resin and a thermoplastic resin.

Examples of the thermosetting resin include epoxy resin, phenol resin, amino resin, unsaturated polyester resin, polyurethane resin, silicone resin, thermosetting polyimide resin and the like. As the thermosetting resin, only one type or two or more types are adopted. An epoxy resin is preferable as the thermosetting resin in that it contains less ionic impurities and the like that can cause corrosion of the semiconductor chip to be die-bonded. As the curing agent for the epoxy resin, a phenol resin is preferable.

Examples of the epoxy resin include bisphenol A type, bisphenol F type, bisphenol S type, brominated bisphenol A type, hydrogenated bisphenol A type, bisphenol AF type, biphenyl type, naphthalene type, fluorene type, phenol novolac type and ortho. Examples thereof include cresol novolac type, trishydroxyphenylmethane type, tetraphenylol ethane type, hydantin type, trisglycidyl isocyanurate type, and glycidylamine type epoxy resins.
As the epoxy resin, a bisphenol A type epoxy resin is preferable because it is highly reactive with a phenol resin as a curing agent and has excellent heat resistance.

The phenolic resin can act as a curing agent for the epoxy resin. Examples of the phenol resin include novolak type phenol resin, resol type phenol resin, polyoxystyrene such as polyparaoxystyrene, and the like.
Examples of the novolak type phenol resin include phenol novolac resin, phenol aralkyl resin, cresol novolak resin, tert-butylphenol novolak resin, nonylphenol novolak resin and the like.
As the phenol resin, a phenol novolac resin is preferable, and a biphenyl novolac resin is more preferable. When these phenol resins act as a curing agent for an epoxy resin (adhesive for die bonding), the adhesiveness of the epoxy resin as an adhesive can be further improved.
As the phenol resin, only one type or two or more types are adopted.

In the die bond layer 10, the hydroxyl group of the phenol resin is preferably 0.5 equivalent or more and 2.0 equivalent or less, and more preferably 0.7 equivalent or more and 1.5 equivalent or less, per 1 equivalent of the epoxy group of the epoxy resin. As a result, the curing reaction between the epoxy resin and the phenol resin can be sufficiently advanced.

When the die bond layer 10 contains a thermosetting resin, the content ratio of the thermosetting resin in the die bond layer 10 is preferably 5% by mass or more and 60% by mass or less with respect to the total mass of the die bond layer 10 by 10 mass. % Or more and 50% by mass or less are more preferable. Thereby, the function as a thermosetting adhesive can be appropriately exhibited in the die bond layer 10.

Examples of the thermoplastic resin that can be contained in the die bond layer 10 include natural rubber, butyl rubber, isoprene rubber, chloroprene rubber, ethylene-vinyl acetate copolymer, ethylene-acrylic acid copolymer, and ethylene-acrylic acid ester copolymer. , Polybutadiene resin, polycarbonate resin, thermoplastic polyimide resin, polyamide resin such as 6-nylon (product name) and 6,6-nylon (product name), phenoxy resin, acrylic resin, saturated polyester resin such as PET and PBT, polyamide Examples thereof include imide resin and fluororesin.
As the thermoplastic resin, an acrylic resin is preferable in that the adhesiveness of the die bond layer 10 can be further secured because there are few ionic impurities and high heat resistance.
As the thermoplastic resin, only one type or two or more types are adopted.

The acrylic resin is preferably a polymer in which the structural unit of alkyl (meth) acrylate is the largest in terms of mass ratio among the structural units in the molecule. Examples of the alkyl (meth) acrylate include C2-C4 alkyl (meth) acrylate.
The acrylic resin may contain a structural unit derived from another monomer component copolymerizable with the alkyl (meth) acrylate monomer.
Examples of the other monomer components include functional groups such as a carboxy group-containing monomer, an acid anhydride monomer, a hydroxy group-containing monomer, a glycidyl group-containing monomer, a sulfonic acid group-containing monomer, a phosphoric acid group-containing monomer, acrylamide, and acrylonitrile. Examples thereof include monomers and various other polyfunctional monomers.
The acrylic resin is preferably an alkyl (meth) acrylate (particularly, an alkyl (meth) acrylate having 4 or less carbon atoms in the alkyl moiety) and a carboxy group in that it can exert a higher cohesive force in the die bond layer 10. It is a copolymer of a containing monomer, a nitrogen atom-containing monomer, and a polyfunctional monomer (particularly a polyglycidyl-based polyfunctional monomer), and more preferably ethyl acrylate, butyl acrylate, acrylate, and acrylonitrile. And a copolymer of polyglycidyl (meth) acrylate.

The glass transition temperature (Tg) of the acrylic resin is preferably 5 ° C. or higher and 35 ° C. or lower, preferably 10 ° C. or higher and 30 ° C. or lower, because the elasticity and viscosity of the die bond layer 10 can be easily set within a desired range. Is more preferable.

When the die bond layer 10 contains a thermosetting resin and a thermoplastic resin, the content ratio of the thermoplastic resin in the die bond layer 10 is an organic component excluding the filler (for example, a thermosetting resin, a thermoplastic resin, a curing catalyst, etc.). , Silane coupling agent, dye), preferably 30% by mass or more and 70% by mass or less, more preferably 40% by mass or more and 60% by mass or less, and further preferably 45% by mass or more and 55% by mass or less. It is mass% or less. The elasticity and viscosity of the die bond layer 10 can be adjusted by changing the content ratio of the thermosetting resin.

When the thermoplastic resin of the die bond layer 10 has a thermosetting functional group, for example, a thermosetting functional group-containing acrylic resin can be adopted as the thermoplastic resin. The thermosetting functional group-containing acrylic resin preferably contains a structural unit derived from an alkyl (meth) acrylate in the molecule in the largest mass ratio. Examples of the alkyl (meth) acrylate include the above-exemplified (meth) alkyl (meth) acrylate.
On the other hand, examples of the thermosetting functional group in the thermosetting functional group-containing acrylic resin include a glycidyl group, a carboxy group, a hydroxy group, and an isocyanate group. Of these, a glycidyl group is preferable. In other words, the thermosetting functional group-containing acrylic resin is preferably a glycidyl group-containing acrylic resin.
The die bond layer 10 preferably contains a thermosetting functional group-containing acrylic resin and a curing agent. Examples of the curing agent include those exemplified as the curing agent that can be contained in the pressure-sensitive adhesive layer 22. When the thermosetting functional group in the thermosetting functional group-containing acrylic resin is a glycidyl group, it is preferable to use a compound having a plurality of phenolic structures as a curing agent. For example, the above-mentioned various phenolic resins can be used as a curing agent.

The die bond layer 10 preferably contains a filler. By changing the amount of filler in the die bond layer 10, the elasticity and viscosity of the die bond layer 10 can be adjusted more easily. Further, physical properties such as conductivity, thermal conductivity, and elastic modulus of the die bond layer 10 can be adjusted.
Examples of the filler include an inorganic filler and an organic filler. As the filler, an inorganic filler is preferable.
Examples of the inorganic filler include aluminum hydroxide, magnesium hydroxide, calcium carbonate, magnesium carbonate, calcium silicate, magnesium silicate, calcium oxide, magnesium oxide, aluminum oxide, aluminum nitride, boron nitride, crystalline silica and amorphous. Examples thereof include fillers containing silica such as quality silica. Examples of the material of the inorganic filler include simple metals such as aluminum, gold, silver, copper and nickel, and alloys. It may be a filler such as aluminum borate whiskers, amorphous carbon black, and graphite. The shape of the filler may be various shapes such as spherical, needle-shaped, and flake-shaped. As the filler, only one of the above types or two or more types are adopted.

The average particle size of the filler is preferably 0.005 μm or more and 10 μm or less, and more preferably 0.005 μm or more and 1 μm or less. When the average particle size is 0.005 μm or more, the wettability and adhesiveness to an adherend such as a semiconductor wafer are further improved. When the average particle size is 10 μm or less, the characteristics of the added filler can be more sufficiently exhibited, and the heat resistance of the die bond layer 10 can be more exhibited. The average particle size of the filler can be determined using, for example, a luminous intensity type particle size distribution meter (for example, product name “LA-910”, manufactured by HORIBA, Ltd.).

When the die bond layer 10 contains a filler, the content ratio of the filler is preferably 30% by mass or more and 70% by mass or less, and more preferably 40% by mass or more and 60% by mass or less, based on the total mass of the die bond layer 10. It is more preferably 42% by mass or more and 55% by mass or less.

The die bond layer 10 may contain other components if necessary. Examples of the other components include a curing catalyst, a flame retardant, a silane coupling agent, an ion trapping agent, a dye, and the like.
Examples of the flame retardant include antimony trioxide, antimony pentoxide, brominated epoxy resin and the like.
Examples of the silane coupling agent include β- (3,4-epoxycyclohexyl) ethyltrimethoxysilane, γ-glycidoxypropyltrimethoxysilane, γ-glycidoxypropylmethyldiethoxysilane and the like.
Examples of the ion trap agent include hydrotalcites, bismuth hydroxide, benzotriazole and the like.
As the above-mentioned other additives, only one kind or two or more kinds are adopted.

The die bond layer 10 preferably contains a thermoplastic resin (particularly an acrylic resin), a thermosetting resin, and a filler in that the elasticity and viscosity can be easily adjusted.
In the die bond layer 10, the content ratio of the thermoplastic resin such as acrylic resin to the total mass of the organic components excluding the filler is preferably 30% by mass or more and 70% by mass or less, and is 40% by mass or more and 60% by mass or less. It is more preferable that the amount is 45% by mass or more and 55% by mass or less.
The content ratio of the filler with respect to the total mass of the die bond layer 10 is preferably 30% by mass or more and 70% by mass or less, more preferably 40% by mass or more and 60% by mass or less, and 42% by mass or more and 55. It is more preferably mass% or less.

The thickness of the die bond layer 10 is not particularly limited, but is, for example, 1 μm or more and 200 μm or less. The upper limit of such thickness is preferably 100 μm, more preferably 80 μm. The lower limit of such thickness is preferably 3 μm, more preferably 5 μm. When the die bond layer 10 is a laminated body, the above thickness is the total thickness of the laminated body.

The glass transition temperature (Tg) of the die bond layer 10 is preferably 0 ° C. or higher, more preferably 10 ° C. or higher. When the glass transition temperature is 0 ° C. or higher, the die bond layer 10 can be easily cut by cool expanding. The upper limit of the glass transition temperature of the die bond layer 10 is, for example, 100 ° C.

The die bond layer 10 may have a single layer structure, for example, as shown in FIG. As used herein, a single layer means having only a layer formed of the same composition. A single layer is also a form in which a plurality of layers formed of the same composition are laminated.
On the other hand, the die bond layer 10 may have, for example, a multilayer structure in which layers formed of two or more different compositions are laminated.

In the dicing die bond film 1 of the present embodiment, when used, the pressure-sensitive adhesive layer 22 is cured, for example, by irradiation with ultraviolet rays. Specifically, in a state where the die bond layer 10 having the semiconductor wafer bonded to one surface and the pressure-sensitive adhesive layer 22 bonded to the other surface of the die bond layer 10 are laminated, ultraviolet rays or the like are applied to at least the pressure-sensitive adhesive layer 22. Be irradiated. For example, ultraviolet rays or the like are irradiated from the side on which the base material layer 21 is arranged, and the ultraviolet rays or the like that have passed through the base material layer 21 reach the adhesive layer 22. The pressure-sensitive adhesive layer 22 is cured by irradiation with ultraviolet rays or the like.
Since the pressure-sensitive adhesive layer 22 is cured after irradiation, the adhesive strength of the pressure-sensitive adhesive layer 22 can be reduced, so that the die bond layer 10 (the state in which the semiconductor wafer is adhered) is relatively easily peeled off from the pressure-sensitive adhesive layer 22 after irradiation. Can be made to. As a result, good pick-up performance can be exhibited.

The amount of irradiation energy of the active energy rays (ultraviolet rays, etc.) is at least 50 mJ / cm ² or more. The amount of irradiation energy is, for example, 50 mJ / cm ² or more and 500 mJ / cm ² or less, preferably 100 mJ / cm ² or more and 300 mJ / cm ² or less. Usually, the active energy rays are irradiated except for the peripheral portion of the region where the pressure-sensitive adhesive layer 12 and the die bond layer 10 are bonded. In the case of partial irradiation, a non-irradiated region can be provided by irradiating through a patterned photomask. Moreover, the irradiation region can be formed by irradiating in a spot manner.
The device for irradiating the ultraviolet rays is not particularly limited, but for example, the product name "UM810" manufactured by Nitto Seiki Co., Ltd. can be used.

Before irradiation with active energy rays, the peel strength (α) between the pressure-sensitive adhesive layer 22 and the die bond layer 10 is preferably 0.4 (N / 20 mm) or more and 4.0 (N / 20 mm) or less. ..
On the other hand, after irradiation with active energy rays, the peel strength (β) between the pressure-sensitive adhesive layer 22 and the die bond layer 10 is preferably 0.1 (N / 20 mm) or less. Such peel strength (β) may be 0.03 (N / 20 mm) or more.
The ratio (α / β) of the peel strength between the pressure-sensitive adhesive layer 22 and the die bond layer 10 before (α) and after irradiation (β) of the active energy rays is 4.0 or more and 40.5 or less. Is preferable.
The irradiation of the above active energy rays is performed under the conditions described in the examples. In addition, the numerical value related to the peel strength is measured according to the test conditions described in the examples.

In the dicing die bond film 1, the maximum strength when the peel strength between the pressure-sensitive adhesive layer 22 and the die bond layer 10 is measured by an edge peel test after irradiation with active energy rays is 0.10 (N / 10 mm) or more and 0. It is preferably .50 (N / 10 mm) or less.
The numerical value related to the maximum strength of the edge peel test is measured according to the test conditions described in the examples.

The peel strength (α or β) and the maximum strength can be increased, for example, by reducing the amount of the filler contained in the die bond layer 10.

The dicing die bond film 1 of the present embodiment may include a release sheet that covers one surface of the dicing layer 10 (the surface where the dicing layer 10 does not overlap with the pressure-sensitive adhesive layer 22) before being used. The release sheet is used to protect the die bond layer 10, and is peeled off immediately before the adherend (for example, a semiconductor wafer) is attached to the die bond layer 10.
As the release sheet, the same release sheet as described above can be adopted. This release sheet can be used as a support material for supporting the die bond layer 10. The release sheet is preferably used when the die bond layer 10 is overlaid on the pressure-sensitive adhesive layer 22. Specifically, the die bond layer 10 is laminated on the pressure-sensitive adhesive layer 22 in a state where the release sheet and the die bond layer 10 are laminated, and after the release sheet is peeled off (transferred), the die bond layer is placed on the pressure-sensitive adhesive layer 22. 10 can be stacked.

Since the dicing die bond film 1 of the present embodiment is configured as described above, good pick-up performance can be exhibited.

Next, a method for manufacturing the dicing tape 20 and the dicing die bond film 1 of the present embodiment will be described.

The method for producing the dicing die bond film 1 of the present embodiment is as follows.
The process includes a step of manufacturing the dicing tape 20 (a method of manufacturing the dicing tape) and a step of superimposing the dicing layer 10 on the manufactured dicing tape 20 to manufacture the dicing die bond film 1.

The dicing tape manufacturing method (process for manufacturing the dicing tape) is as follows.
The synthetic process of synthesizing acrylic polymer and
Adhesive to prepare a pressure-sensitive adhesive layer 22 by volatilizing a solvent from a pressure-sensitive adhesive composition containing the above-mentioned acrylic polymer, isocyanate compound, polymerization initiator, solvent, and other components appropriately added depending on the purpose. The process of preparing the agent layer and
A laminating step of laminating the base material layer 21 and the pressure-sensitive adhesive layer 22 by adhering the pressure-sensitive adhesive layer 22 and the base material layer 21 is provided.

In the synthesis step, for example, an acrylic polymer intermediate is synthesized by radical polymerization of a C9 to C11 alkyl (meth) acrylate monomer and a hydroxyl group-containing (meth) acrylate monomer.
Radical polymerization can be carried out by a general method. For example, an acrylic polymer intermediate can be synthesized by dissolving each of the above monomers in a solvent, stirring while heating, and adding a polymerization initiator. In order to adjust the molecular weight of the acrylic polymer, the polymerization may be carried out in the presence of a chain transfer agent.
Next, a part of the hydroxyl groups of the constituent units of the hydroxyl group-containing (meth) acrylate contained in the acrylic polymer intermediate and the isocyanate groups of the isocyanate group-containing polymerizable monomer are bonded by a urethanization reaction. As a result, a part of the structural unit of the hydroxyl group-containing (meth) acrylate becomes the structural unit of the polymerizable group-containing (meth) acrylate.
The urethanization reaction can be carried out by a general method. For example, in the presence of a solvent and a urethanization catalyst, the acrylic polymer intermediate and the isocyanate group-containing polymerizable monomer are stirred while heating. As a result, the isocyanate group of the isocyanate group-containing polymerizable monomer can be urethane-bonded to a part of the hydroxyl groups of the acrylic polymer intermediate.
In addition, in order to allow the urethanization reaction to proceed efficiently, the urethanization reaction may be carried out in the presence of a Sn catalyst or the like.

In the pressure-sensitive adhesive layer preparation step, for example, an acrylic polymer, an isocyanate compound, and a polymerization initiator are dissolved in a solvent to prepare a pressure-sensitive adhesive composition. The viscosity of the composition can be adjusted by varying the amount of solvent. Next, the pressure-sensitive adhesive composition is applied to the release sheet. As the coating method, for example, a general coating method such as roll coating, screen coating, or gravure coating is adopted. The applied pressure-sensitive adhesive composition is solidified by subjecting the applied composition to a desolvation treatment, a solidification treatment, or the like to prepare a pressure-sensitive adhesive layer 22.
The desolvation treatment is performed under the conditions of, for example, 80 ° C. or higher and 150 ° C. or lower, 0.5 minutes or longer and 5 minutes or lower.

In the laminating step, the pressure-sensitive adhesive layer 22 and the base material layer 21 that are overlapped with the release sheet are laminated. The release sheet may be in a state of being overlapped with the adhesive layer 22 until before use.
In order to promote the reaction between the cross-linking agent and the acrylic polymer and to promote the reaction between the cross-linking agent and the surface portion of the base material layer 21, after the laminating step, 48 hours in an environment of 50 ° C. An aging treatment step may be carried out.
The base material layer 21 may be made by using a commercially available film or the like, or by forming a film by a general method. Examples of the film forming method include a calendar film forming method, a casting method in an organic solvent, an inflation extrusion method in a closed system, a T die extrusion method, a coextrusion method, a dry laminating method and the like.

By these steps, the dicing tape 20 can be manufactured.

The manufacturing method of the dicing die bond film (process of manufacturing the dicing die bond film) is as follows.
A resin composition preparation step for preparing a resin composition for forming the die bond layer 10 and a process for preparing the resin composition.
A die bond layer preparation step for producing the die bond layer 10 from the resin composition, and
A sticking step of sticking the die bond layer 10 to the pressure-sensitive adhesive layer 22 of the dicing tape 20 manufactured as described above is provided.

In the resin composition preparation step, for example, an epoxy resin, a curing catalyst for an epoxy resin, an acrylic resin, a phenol resin, a solvent, or the like is mixed, and each resin is dissolved in the solvent to prepare a resin composition. The viscosity of the composition can be adjusted by varying the amount of solvent. As these resins, commercially available products can be used.

In the die bond layer manufacturing step, for example, the resin composition prepared as described above is applied to the release sheet. The coating method is not particularly limited, and for example, a general coating method such as roll coating, screen coating, or gravure coating is adopted. Next, if necessary, the applied composition is solidified by a solvent removal treatment, a curing treatment, or the like to prepare a die bond layer 10.
The desolvation treatment is performed under the conditions of, for example, 70 ° C. or higher and 160 ° C. or lower, 1 minute or longer and 5 minutes or lower.

In the sticking step, the release sheets are peeled from the pressure-sensitive adhesive layer 22 and the die-bond layer 10 of the dicing tape 20, and the two are stuck together so that the die-bond layer 10 and the pressure-sensitive adhesive layer 12 are in direct contact with each other. For example, they can be bonded by crimping. The temperature at the time of bonding is not particularly limited, and is, for example, 30 ° C. or higher and 50 ° C. or lower, preferably 35 ° C. or higher and 45 ° C. or lower. The linear pressure at the time of bonding is not particularly limited, but is preferably 0.1 kgf / cm or more and 20 kgf / cm or less, and more preferably 1 kgf / cm or more and 10 kgf / cm or less.

The dicing die bond film 1 manufactured as described above is used, for example, as an auxiliary tool for manufacturing a semiconductor integrated circuit. Hereinafter, specific examples in use will be described.

A method for manufacturing a semiconductor integrated circuit generally includes a step of cutting out a chip from a semiconductor wafer on which a circuit surface is formed and assembling the chip.
In this step, for example, a half-cut step of forming a groove in the semiconductor wafer so as to process the semiconductor wafer into a chip (die) by a cutting process, and further grinding the semiconductor wafer to reduce the thickness, and a half-cut process are performed. One surface of the semiconductor wafer (for example, the surface opposite to the circuit surface) is attached to the die bond layer 10, and the mounting process of fixing the semiconductor wafer to the dicing tape 20 and the distance between the half-cut semiconductor chips are widened. The expanding step, the pick-up step of peeling between the die bond layer 10 and the pressure-sensitive adhesive layer 22 and taking out the semiconductor chip (die) with the die bond layer 10 attached, and the semiconductor chip with the die bond layer 10 attached. It has a dicing step of adhering (die) to an adherend. When carrying out these steps, the dicing tape (dicing die bond film) of the present embodiment is used as a manufacturing auxiliary tool.
In the half-cut step, as shown in FIGS. 2A to 2D, a half-cut process is performed to cut the semiconductor integrated circuit into small pieces (dies). Specifically, the wafer processing tape T is attached to the surface of the semiconductor wafer opposite to the circuit surface. Further, the dicing ring R is attached to the wafer processing tape T. With the wafer processing tape T attached, a groove for division is formed. While the back grind tape G is attached to the grooved surface, the wafer processing tape T attached first is peeled off. With the back grind tape G attached, grinding is performed until the semiconductor wafer has a predetermined thickness.
In the mounting step, as shown in FIGS. 3A to 3B, the dicing ring R is attached to the adhesive layer 22 of the dicing tape 20, and then the half-cut semiconductor wafer is attached to the surface of the exposed die bond layer 10. .. Then, the back grind tape G is peeled off from the semiconductor wafer.
In the expanding step, as shown in FIGS. 4A to 4C, the dicing ring R is fixed to the holder H of the expanding device. By pushing up the push-up member U included in the expanding device from the lower side of the dicing die-bond film 1, the dicing die-bond film 1 is stretched so as to spread in the plane direction. As a result, the half-cut semiconductor wafer is cut under a specific temperature condition. The above temperature conditions are, for example, -20 to 5 ° C, preferably -15 to 0 ° C, and more preferably -10 to -5 ° C. The expanded state is released by lowering the push-up member U. Further, in the expanding step, as shown in FIGS. 5A to 5B, the dicing tape 20 is stretched so as to increase the area under higher temperature conditions. As a result, the cut adjacent semiconductor chips are pulled apart in the plane direction of the film surface, and the distance is further increased.
In the pick-up step, as shown in FIG. 6, the semiconductor chip with the die bond layer 10 attached is peeled from the adhesive layer of the dicing tape 20. Specifically, the pin member P is raised to push up the semiconductor chip to be picked up via the dicing tape 20. The pushed-up semiconductor chip is held by the suction jig J.
In the die bond step, the semiconductor chip with the die bond layer 10 attached is adhered to the adherend.

The dicing tape and dicing die bond film of the present embodiment are as illustrated above, but the present invention is not limited to the dicing tape and dicing die bond film illustrated above.
That is, various forms used in a general dicing tape and a dicing die bond film can be adopted as long as the effects of the present invention are not impaired.

Next, the present invention will be described in more detail by means of experimental examples, but the present invention is not limited thereto.

The dicing tape was manufactured as follows. In addition, a dicing die bond film was manufactured using this dicing tape.

<Raw material for acrylic polymer>
"First synthesis stage"
C9 to C11 alkyl (meth) acrylate: isodecyl acrylate (IDA)
C9 to C11 alkyl (meth) acrylate: isononyl acrylate (INA)
Hydroxylate-containing (meth) acrylate: 2-hydroxyethyl acrylate (HEA)
-Hydroxy group-containing (meth) acrylate: 4-hydroxybutyl acrylate (4HBA)
-Polymer initiator: Azobisisobutyronitrile (AIBN)
-Polymerization solvent: Ethyl acetate "Second synthesis stage": Preparation of structural units of polymerizable group-containing (meth) acrylate-Isocyanate group-containing (meth) acrylate monomer: 2-Isocyanatoethyl methacrylate (Product name "Karenzu MOI" Showa Made by Denkosha)
-Urethane reaction catalyst: Dibutyltin dilaurate <raw material for dicing tape>
・ Adhesive layer Acrylic polymer (synthesized respectively)
Isocyanate compound Ethyl acetate solution of trimethylolpropane adduct of tolylene diisocyanate (product name "Coronate L" manufactured by Tosoh Corporation)
Photopolymerization Initiator (Product Name "Omnirad 127", manufactured by IGM Resins)
-Base layer EVA film (corona treatment after film formation)
Product name "Evaflex V1010" resin (manufactured by Mitsui DuPont Chemical Co., Ltd.) is formed into a film with a thickness of 125 μm without stretching, and the surface in contact with the pressure-sensitive adhesive layer is corona-treated. ・ Organic solvent (prepared pressure-sensitive adhesive layer) Used when
Ethyl acetate

(Example 1)
After synthesizing the acrylic polymer intermediate as follows, the acrylic polymer was synthesized from the acrylic polymer intermediate. A pressure-sensitive adhesive layer was prepared using the synthesized acrylic polymer to produce a dicing tape.
"First synthesis stage: Synthesis of acrylic polymer intermediate"
The above raw materials were mixed in the amounts (parts by mass) shown in Table 1 to prepare a mixture. The above mixture is placed in an experimental device for polymerization in which a separable cover, a separating funnel, a thermometer, a nitrogen introduction tube, a Liebig condenser, a vacuum seal, a stirring rod, and a stirring blade are mounted on a 1 L round bottom separable flask. Was put in. Nitrogen was substituted at room temperature for 6 hours with stirring. Then, while stirring with nitrogen flowing in, the temperature was maintained at 62 ° C. for 3 hours, and then at 75 ° C. for 2 hours. As a result, a polymerization reaction was carried out and the mixture was cooled to room temperature to obtain a polymer solution (a solution containing the base polymer of each acrylic polymer).
"Second synthesis stage: synthesis of each acrylic polymer"
In the obtained polymer solution (acrylic polymer intermediate-containing solution), 2-isocyanatoethyl methacrylate (product name "Karenzu MOI" manufactured by Showa Denko Co., Ltd.) and dibutyltin dilaurate IV (manufactured by Showa Denko) as polymerizable (meth) acrylate monomers Wako Pure Chemical Industries, Ltd.) was added in the amounts shown in Table 1, and the mixture was stirred at 50 ° C. for 24 hours in an air atmosphere.
"Preparation of composition for adhesive layer"
The isocyanate compound [Coronate L] and the photopolymerization initiator (Omnirad 127) in the amounts shown in Table 5 were mixed with respect to 100 parts by mass of the solid content of the acrylic polymer. Ethyl acetate as a diluting solvent was added to prepare a composition for the pressure-sensitive adhesive layer so that the solid content was 20% by mass.
"Preparation of adhesive layer"
As a release sheet, a PET film (product name "Diamond Foil MRF38" manufactured by Mitsubishi Chemical Corporation) was prepared. One side of this film is mold-released. The composition for the pressure-sensitive adhesive layer prepared as described above was applied to the surface of the release sheet that had been subjected to the mold release treatment. The applied composition was dried on a release sheet at 120 ° C. for 3 minutes to prepare an adhesive layer having a thickness of 10 μm.
"Manufacturing of dicing tape"
With the pressure-sensitive adhesive layer and the release sheet overlapping, the pressure-sensitive adhesive layer was bonded to the corona-treated surface of the base material layer (EVA film) so as not to allow air bubbles to enter. A dicing tape was produced by drying at 50 ° C. for 48 hours.

<Manufacturing of dicing die bond film>
-Preparation of die bond layer A die bond layer was prepared as follows using the following raw materials (the same one was used in Examples and Comparative Examples).
Acrylic resin: 100 parts by mass (product name "Taisan Resin SG-P3", manufactured by Nagase ChemteX Corporation) glass transition temperature 12 ° C containing epoxy group),
Epoxy resin: 46 parts by mass (Product name "JER1001", manufactured by Mitsubishi Chemical Corporation) Bisphenol A type epoxy resin,
Phenolic resin: 51 parts by mass (Product name "MEH-7851ss", manufactured by Meiwa Kasei Co., Ltd.) Biphenyl novolak resin,
Spherical silica: 191 parts by mass (product name "SO-25R", manufactured by Admatex),
Curing catalyst: 0.6 parts by mass (Product name "Curesol 2PHZ", manufactured by Shikoku Chemicals Corporation)
The above raw materials and methyl ethyl ketone were mixed to prepare a resin composition having a solid content concentration of 20% by mass. This resin composition was applied to one surface of a release sheet (PET thickness 50 μm). The coated surface was previously treated with silicone. The solvent was volatilized by heating at 130 ° C. for 2 minutes to prepare a die bond layer having a thickness of 10 μm.

-Adhesion of the die bond layer and the dicing tape The die bond layer in a state of being overlapped with the release sheet and the adhesive layer after the release sheet of the dicing tape was peeled off were bonded so as not to contain air bubbles. The die bond layer was arranged at the position where the wafers were to be bonded, and had a diameter 5 mm larger than the wafer size. A dicing die bond film was produced in which the pressure-sensitive adhesive layer and the die bond layer bonded to each other were arranged between the base material layer and the release sheet by bonding using a laminator.
In such a state, a sample left for 24 hours under a temperature of 18 to 25 ° C., a humidity of 40 to 60%, and a light-shielding condition was used as a test sample.

(Examples 2 to 15)
A dicing tape and a dicing die bond film were produced in the same manner as in Example 1 according to the compounding compositions shown in Tables 1 to 3 and Table 5.

(Comparative Examples 1 to 8)
A dicing tape and a dicing die bond film were produced in the same manner as in Example 1 using the compounding compositions shown in Tables 4 and 5.

Tables 1 to 5 show the compounding compositions for producing the dicing tape and the dicing die bond film of Examples and Comparative Examples.

<Measurement of peel strength between die bond layer and adhesive layer before irradiation with active energy rays (ultraviolet rays)>
A portion where the die bond layer (DAF) and the pressure-sensitive adhesive layer were bonded was cut out in a size of 150 mm × 20 mm. The die bond layer after removing the release sheet was attached to the SUS304BA plate using a hand roller. At this time, the SUS304BA plate was placed on a hot plate heated to 80 ° C. At the time of pasting, air bubbles did not enter between the die bond layer and the SUS plate.
Then, it was left for 3 hours in an environment of a temperature of 23 ° C. and a humidity of 50% to stabilize the temperature. The peel strength (strength when the die bond layer was peeled from the adhesive layer) was measured by a Tencilon type tensile tester (manufactured by Shimadzu Corporation, AGS-J). The peeling conditions were a peeling speed of 30 mm / min, a peeling angle of 90 degrees, a temperature of 23 ° C., and a humidity of 50%. The measurement was carried out three times, and the average value was taken as the value of the peel strength.

<Measurement of peel strength between die bond layer and adhesive layer after irradiation with active energy rays (ultraviolet rays)>
In the same manner as above, after being left in an environment of a temperature of 23 ° C. and a humidity of 50% for 3 hours, UV was irradiated from the base material layer side (back side of the film) under the following "ultraviolet irradiation conditions". Further, it was left to stand for 3 hours in an environment of a temperature of 23 ° C. and a humidity of 50% to stabilize the temperature.
The peel strength (strength when the die bond layer was peeled from the adhesive layer) was measured by a Tencilon type tensile tester (manufactured by Shimadzu Corporation, AGS-J). The peeling conditions were a peeling speed of 100 mm / min, a peeling angle of 90 degrees, a temperature of 23 ° C., and a humidity of 50%. The measurement was carried out three times, and the average value was taken as the value of the peel strength.

<Measurement of tensile elastic modulus of adhesive layer after UV irradiation>
An adhesive layer (thickness 20 μm) was prepared between the pair of PET release sheets. The pressure-sensitive adhesive layer was irradiated with ultraviolet rays under the following "ultraviolet irradiation conditions". The adhesive layer after UV irradiation was cut into a size of 10 mm × 30 mm, and this was used as an evaluation sample.
The tensile elastic modulus of the evaluation sample was measured using a tensile tester (manufactured by ORIENTEC, product name "RTC-1150A"). Specifically, the SS curve was measured under the conditions of a measurement temperature of 22 ° C., a distance between chucks of 10 mm, and a speed of 10 mm / min, and the initial elastic modulus was obtained from the rise of the SS curve. This value was taken as the tensile elastic modulus of the pressure-sensitive adhesive layer after irradiation with ultraviolet rays. The measurement was carried out 5 times, and the average value was taken as the tensile elastic modulus of the pressure-sensitive adhesive layer after irradiation with ultraviolet rays.
"Ultraviolet irradiation conditions"
Ultraviolet irradiation device: Product name-UM810 (manufactured by Nitto Seiki Co., Ltd.)
Light source: High-pressure mercury lamp Irradiation intensity: 50 mW / cm ² (Measuring equipment: "Ultraviolet illuminance meter UT-101" manufactured by Ushio)
Irradiation time: 6 seconds Integrated light intensity: 300 mJ / cm ²

<Pickup test method>
A dicing tape (Elep mount DU-300 manufactured by Nitto Denko Corporation) and a dicing ring are attached to a 12-inch bare wafer (thickness 740 μm), and the depth from the surface is reduced using the dicing saw device DFD6361 (manufactured by DISCO). Half-cut dicing was performed to a size of 10 mm × 10 mm so as to form a groove having a width of 100 μm and a width of 30 μm. After the half-cut dicing, ultraviolet rays were irradiated from the back side of the dicing tape to recover the grooved wafer.
After that, a back grind tape (adhesive film for surface protection, Elep Mount UB-3083D manufactured by Nitto Denko Co., Ltd.) was attached to the surface of the wafer on which the groove was formed, and the thickness was increased to 30 μm using the grinder polisher device DGP8760 (manufactured by DISCO Corporation). Grinding so as to obtain a thin wafer in small pieces.
A thin wafer and a dicing ring were attached to the dicing die bond film, and ultraviolet rays were irradiated from the back side of the back grind tape to cure the adhesive, and the back grind tape was peeled off from the wafer and removed. Next, a cut sample was obtained by cutting the wafer and the die bond layer and heat-shrinking the dicing tape using a die separator DDS2300 (manufactured by DISCO). Specifically, first, the semiconductor wafer was cut with a cool expander unit under the conditions of an expanding temperature: −15 ° C., an expanding speed: 200 mm / sec, and an expanding amount: 12 mm.
Then, at room temperature, room temperature expansion was performed under the conditions of an expanding speed of 1 mm / sec and an expanding amount of 7 mm. Then, while maintaining the expanded state, the dicing tape on the outer peripheral portion of the semiconductor chip was heat-shrinked under the conditions of a heat temperature of 200 ° C., an air volume of 40 L / min, a heat distance of 20 mm, and a rotation speed of 5 ° / sec.
A Die bonder SPA-300 (manufactured by Shinkawa Co., Ltd.) was used for pickup under the following conditions. A pickup success rate of 90% or more at a pickup height of 400 μm or less was evaluated as ◯, and a pickup success rate of less than 90% was evaluated as ×.
"Pickup conditions"
Number of pins: 5
Push-up speed: 1 mm / sec Pickup height: 200-1000 μm
Pickup rating: 50

<Edge peel test (die bond layer-adhesive layer)>
A dicing tape (Elep mount DU-300 manufactured by Nitto Denko Corporation) and a dicing ring are attached to a 12-inch bare wafer (thickness 740 μm), and the depth from the surface is reduced using the dicing saw device DFD6361 (manufactured by DISCO). Half-cut dicing was performed to a size of 12 mm × 12 mm so as to form a groove having a width of 100 μm and a width of 30 μm.
After that, a back grind tape (adhesive film for surface protection, Elep Mount UB-3083D manufactured by Nitto Denko Co., Ltd.) was attached to the surface of the wafer on which the groove was formed, and the thickness was increased to 30 μm using the grinder polisher device DGP8760 (manufactured by DISCO Corporation). A thin wafer was obtained by grinding so as to become.
A thin wafer and a dicing ring were attached to the dicing die bond film, and ultraviolet rays were irradiated from the back side of the back grind tape to cure the adhesive, and the back grind tape was peeled off from the wafer and removed. Next, a cut sample was obtained by cutting the wafer and the die bond layer and heat-shrinking the dicing tape using a die separator DDS2300 (manufactured by DISCO). Specifically, first, the semiconductor wafer was cut with a cool expander unit under the conditions of an expanding temperature: −15 ° C., an expanding speed: 200 mm / sec, and an expanding amount: 12 mm.
Then, at room temperature, room temperature expansion was performed under the conditions of an expanding speed of 1 mm / sec and an expanding amount of 7 mm. Then, while maintaining the expanded state, the dicing tape on the outer peripheral portion of the semiconductor chip was heat-shrinked under the conditions of a heat temperature of 200 ° C., an air volume of 40 L / min, a heat distance of 20 mm, and a rotation speed of 5 ° / sec.
Since 5 continuous chips (with DAF) are used in the measurement, 12 chips (with DAF) adjacent to the 5 continuous chips (with DAF) to be used at the time of measurement are manually pressed from the dicing die bond film. Removed. Then, a blade was inserted into the area from which the chips (with DAF) were removed with a cutter knife to obtain a dicing die bond film sample on which 5 continuous chips (with DAF) having a size of 22 mm × 70 mm were mounted.
Double-sided tape (Product No. 5000NS, manufactured by Nitto Denko KK) was attached to the surface of five consecutive chips (the surface without DAF). At this time, a hand roller was used to attach the five continuous chips with a width of 10 mm from the end of the first chip to the end of the fifth chip. In addition, the double-sided tape was made to fit in the surface area of the chip. That is, the double-sided tape was attached without protruding from the chip surface.
5 The separator attached to the double-sided tape was peeled off from the state where the double-sided tape was attached to the continuous chip. The peeled surface was attached to the SUS304BA plate using a hand roller. Then, ultraviolet rays were irradiated from the base material layer side of the dicing die bond film. The irradiation conditions are the same as the above-mentioned conditions.
After irradiation with ultraviolet rays, the SUS plate, tape, and chips (with DAF) were left for 3 hours in an environment of a temperature of 23 ° C. and a humidity of 50%.
The peel strength (strength when the die bond layer was peeled from the adhesive layer) was measured by a Tencilon type tensile tester (manufactured by Shimadzu Corporation, AGS-J). The peeling conditions were a peeling speed of 50 mm / min, a peeling angle of 90 degrees, a temperature of 23 ° C., and a humidity of 50%. The measurement was carried out three times, and the average value of the maximum intensities obtained at each measurement was used as the measured value in the edge peel test.

The above evaluation results are shown in Tables 6 to 9.

As can be seen from the above evaluation results, the dicing die bond film of the example exhibited better pick-up property than the dicing die bond film of the comparative example.

The dicing tape and dicing die bond film of the present invention are suitably used as, for example, an auxiliary tool when manufacturing a semiconductor integrated circuit.

1: Dicing die bond film,
10: Die bond layer,
20: Dicing tape,
21: Base material layer, 22: Adhesive layer.

Claims (6)

A dicing tape provided with a base material layer and an adhesive layer overlapping the base material layer.
The pressure-sensitive adhesive layer contains an acrylic polymer and contains
The acrylic polymer contains a structural unit of C9 to C11 alkyl (meth) acrylate and a structural unit of a hydroxyl group-containing (meth) acrylate.
The acrylic polymer is a dicing tape containing 40 mol% or more and 85 mol% or less of the constituent units of the C9 to C11 alkyl (meth) acrylate. The dicing tape according to claim 1, wherein the acrylic polymer contains 1 mol% or more and 30 mol% or less of the structural unit of the hydroxyl group-containing (meth) acrylate. The dicing tape according to claim 2, wherein the structural unit of the hydroxyl group-containing (meth) acrylate is a structural unit of the hydroxyl group-containing C2-C4 alkyl (meth) acrylate. The dicing tape according to any one of claims 1 to 3, wherein the acrylic polymer further has a structural unit of a polymerizable group-containing (meth) acrylate. The acrylic polymer is a structural unit of the polymerizable group-containing (meth) acrylate with respect to the structural unit (B) of the hydroxyl group-containing (meth) acrylate and the structural unit (C) of the polymerizable group-containing (meth) acrylate. The dicing tape according to claim 4, wherein (C) is contained in a molar ratio [C / (B + C)] of 0.50 or more and 0.95 or less. A dicing die bond film comprising the dicing tape according to any one of claims 1 to 5 and a dicing bond layer laminated on the adhesive layer of the dicing tape.