JP7417369B2 - dicing die bond film - Google Patents

Description

The present invention relates to a dicing tape used, for example, when manufacturing semiconductor integrated circuits, and a dicing die bond film provided with the dicing tape.

BACKGROUND ART Conventionally, dicing die bond films used in the manufacture of semiconductor integrated circuits have been known. This type of dicing die bond film includes, for example, a dicing tape and a die bond layer laminated on the dicing tape and bonded to the wafer. The dicing tape has a base layer and an adhesive layer in contact with the die bond layer. This type of dicing die bond film is used, for example, in the following manner in the manufacture of semiconductor integrated circuits.

The method for manufacturing semiconductor integrated circuits generally involves a pre-process of forming a circuit surface on one side of a silicon wafer using highly integrated electronic circuits, and a post-process of cutting chips from the wafer on which the circuit surface has been formed and assembling them. and a process.
Post-processes include, for example, a mounting process in which the side opposite to the circuit side of the wafer is attached to a die bond layer and the wafer is fixed to a dicing tape, and a semiconductor wafer attached to the dicing tape via the die bond layer. The dicing process involves cutting into small chips (dies), the expanding process which widens the distance between the semiconductor chips that have been processed into small pieces, and the state where the die bond layer is stuck due to separation between the die bond layer and the adhesive layer. The method includes a pick-up process for taking out a semiconductor chip (die), and a die-bonding process for bonding the semiconductor chip (die) with a die-bonding layer attached to an adherend. A semiconductor integrated circuit is manufactured through these steps.
In the above manufacturing method, floating may occur in the semiconductor chip (die) between the dicing process and the pickup process. Specifically, the small pieces (dies) may no longer be fixed by the adhesive layer of the dicing tape, and the small pieces (dies) may float. This phenomenon tends to occur when many circuits are stacked in the thickness direction of the wafer. Such floating may cause damage to the semiconductor chip during the pick-up process. Therefore, there is a need for a dicing die bond film that can suppress the above-mentioned lifting.

By the way, in conventional dicing tapes, for example, the adhesive layer overlapping the base material layer contains a base polymer, a polyester plasticizer, and a surfactant, and the solubility parameters of the plasticizer and surfactant ( It is known that the SP value) satisfies the following formula (Patent Document 1).
0.9≦[SP value of plasticizer]/[SP value of surfactant]≦1.0

Japanese Patent Application Publication No. 2011-228502

However, dicing die-bonding films and dicing tapes that can suppress the floating of semiconductor chips as described above have not yet been sufficiently studied.

SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide a dicing tape and a dicing die bond film that can suppress floating of semiconductor chips during the manufacture of semiconductor integrated circuits.

In order to solve the above problems, the dicing tape according to the present invention includes:
A dicing tape comprising a base layer and an adhesive layer overlapping the base layer,
The adhesive layer is characterized in that it includes an adhesive and a tackifier.

According to the dicing tape having the above configuration, floating of semiconductor chips can be suppressed.

In the dicing tape according to the present invention, the adhesive layer preferably contains 5 parts by mass or more and 25 parts by mass or less of the tackifier based on 100 parts by mass of the adhesive. As a result, floating of the semiconductor chip can be further suppressed, and good pick-up performance can also be exhibited.
In addition, good pick-up property means that in the pick-up process of manufacturing semiconductor integrated circuits, when the adhesive layer and die bond layer are separated and the die bond layer is pulled up, the adhesive layer is slightly pushed up and the semiconductor chip is This is a performance that can suppress the phenomenon of damage.

In the dicing tape according to the present invention, the tackifier preferably contains a compound having a phenol group in the molecule. Thereby, floating of the semiconductor chip can be further suppressed.

In the dicing tape according to the present invention, the adhesive layer preferably contains the tackifier having a softening point of 70°C or more and 170°C or less. Thereby, floating of the semiconductor chip can be further suppressed.

The dicing die-bonding film according to the present invention includes the above-mentioned dicing tape and a die-bonding layer laminated on the adhesive layer of the dicing tape.

In the dicing die bond film according to the present invention, the T-peel strength between the adhesive layer and the die bond layer is preferably 1.0 (N/20 mm) or more and 3.4 (N/20 mm) or less. . Thereby, floating of the semiconductor chip can be further suppressed.

In the dicing die bond film according to the present invention,
It is preferable that the T-peel strength between the adhesive layer and the die-bonding layer satisfies the following formula (1).
0.04≦T-type peel strength after active energy ray irradiation/T-type peel strength before active energy ray irradiation≦0.10 (1)
Thereby, floating of the semiconductor chip can be further suppressed.

The dicing tape and dicing die bond film according to the present invention have the effect of suppressing floating of semiconductor chips.

FIG. 2 is a cross-sectional view of the dicing die-bonding film of the present embodiment cut in the thickness direction. FIG. 3 is a cross-sectional view schematically showing a half-cut process in a method for manufacturing a semiconductor integrated circuit. FIG. 3 is a cross-sectional view schematically showing a half-cut process in a method for manufacturing a semiconductor integrated circuit. FIG. 3 is a cross-sectional view schematically showing a half-cut process in a method for manufacturing a semiconductor integrated circuit. FIG. 3 is a cross-sectional view schematically showing a half-cut process in a method for manufacturing a semiconductor integrated circuit. FIG. 3 is a cross-sectional view schematically showing a mounting process in a method for manufacturing a semiconductor integrated circuit. FIG. 3 is a cross-sectional view schematically showing a mounting process in a method for manufacturing a semiconductor integrated circuit. FIG. 2 is a cross-sectional view schematically showing a low-temperature expansion process in a method for manufacturing a semiconductor integrated circuit. FIG. 2 is a cross-sectional view schematically showing a low-temperature expansion process in a method for manufacturing a semiconductor integrated circuit. FIG. 2 is a cross-sectional view schematically showing a low-temperature expansion process in a method for manufacturing a semiconductor integrated circuit. FIG. 2 is a cross-sectional view schematically showing an expansion process at room temperature in a method for manufacturing a semiconductor integrated circuit. FIG. 2 is a cross-sectional view schematically showing an expansion process at room temperature in a method for manufacturing a semiconductor integrated circuit. FIG. 3 is a cross-sectional view schematically showing a pickup step in a method for manufacturing a semiconductor integrated circuit.

EMBODIMENT OF THE INVENTION Hereinafter, one embodiment of the dicing die-bonding film and dicing tape according to the present invention will be described with reference to the drawings.

The dicing die bond film 1 of this embodiment includes a dicing tape 20 and a die bond layer 10 that is laminated on the adhesive layer 22 of the dicing tape 20 and adhered to a semiconductor wafer.

The dicing tape 20 of this embodiment is usually a long sheet, and is stored in a wound state until it is used. The dicing die-bonding film 1 of this embodiment is stretched around a ring-shaped frame having an inner diameter one size larger than the silicon wafer to be cut, and is used after being cut.

The dicing tape 20 of this embodiment includes a base layer 21 and an adhesive layer 22 overlapping the base layer 21. The adhesive layer 22 includes at least an adhesive and a tackifier.

Examples of the adhesive include polymer components having adhesive properties. Examples of the polymer component include acrylic polymers, olefin polymers, and silicone polymers. Among these, acrylic polymers are preferred.

An acrylic polymer is a polymer obtained by polymerizing (meth)acrylate monomers ((meth)acrylic acid ester monomers).
In the present embodiment, the acrylic polymer used as the adhesive has at least a C6 to C11 alkyl (meth)acrylate structural unit and a hydroxyl group-containing (meth)acrylate structural unit in the molecule.
In addition, in this specification, the notation "(meth)acrylate" represents at least one of methacrylate (methacrylic acid ester) and acrylate (acrylic acid ester). Similarly, the expression "(meth)acrylic acid" represents at least one of methacrylic acid and acrylic acid.

In this embodiment, the adhesive layer 22 includes, for example, the above-mentioned acrylic polymer (adhesive), an isocyanate compound, and a polymerization initiator.

The adhesive layer 22 has a thickness of, for example, 3 μm or more and 20 μm or less. The shape and size of the adhesive layer 22 are usually the same as the shape and size of the base material layer 21.

In this embodiment, the above acrylic polymer is composed of a C6 to C11 alkyl (meth)acrylate constitutional unit, a hydroxyl group-containing (meth)acrylate constitutional unit, and a polymerizable group-containing (meth)acrylate constitutional unit. ing. Note that the structural unit is a unit that constitutes the main chain of the acrylic polymer. Each side chain in the above acrylic polymer is included in each structural unit constituting the main chain.

In the acrylic polymer contained in the adhesive layer 22, the above-mentioned structural units can be confirmed by NMR analysis such as ¹ H-NMR and ¹³ C-NMR, pyrolysis GC/MS analysis, and infrared spectroscopy. Note that the molar ratio of the above-mentioned structural units in the acrylic polymer is usually calculated from the amount blended (charged amount) when polymerizing the acrylic polymer.

The C6-C11 alkyl (meth)acrylate structural unit is derived from a C6-C11 alkyl (meth)acrylate monomer. In other words, the molecular structure after the C6-C11 alkyl (meth)acrylate monomer undergoes a polymerization reaction is the structural unit of the C6-C11 alkyl (meth)acrylate. Specifically, the bond generated by the polymerization reaction of the C6 to C11 alkyl (meth)acrylate monomer constitutes a part of the main chain of the acrylic polymer. The expression "C6-C11 alkyl" indicates the number of carbon atoms in the hydrocarbon moiety bonded to (meth)acrylic acid with an ester bond. In other words, the C6-C11 alkyl (meth)acrylate monomer is a monomer in which (meth)acrylic acid and an alcohol having 9 to 11 carbon atoms (usually a monohydric alcohol) are ester-bonded.
The C6-C11 alkyl hydrocarbon moiety may be a saturated hydrocarbon or an unsaturated hydrocarbon. For example, the C6-C11 alkyl hydrocarbon moiety is a linear saturated hydrocarbon, a branched saturated hydrocarbon, an alicyclic hydrocarbon, or an aromatic hydrocarbon. The hydrocarbon portion is preferably a linear saturated hydrocarbon or a branched saturated hydrocarbon, more preferably a branched saturated hydrocarbon.
Note that the C6 to C11 alkyl hydrocarbon moiety preferably does not contain a polar group containing oxygen (O), nitrogen (N), or the like.

Examples of the structural units of C6 to C11 alkyl (meth)acrylate include hexyl (meth)acrylate, heptyl (meth)acrylate, n-octyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, isooctyl (meth)acrylate, n-nonyl (meth)acrylate, iso(sec)-nonyl(meth)acrylate, tert-nonyl(meth)acrylate, isobornyl(meth)acrylate, n-decyl(meth)acrylate, iso(sec)-decyl(meth) Examples include various structural units such as acrylate, tert-decyl (meth)acrylate, n-undecyl (meth)acrylate, iso(sec)-undecyl (meth)acrylate, and tert-undecyl (meth)acrylate.
As the C6 to C11 alkyl (meth)acrylate structural unit, at least one of a nonyl (meth)acrylate structural unit and an octyl (meth)acrylate structural unit is preferable, and an isononyl (meth)acrylate structural unit and a 2- At least one of the structural units of ethylhexyl (meth)acrylate is more preferred.
Since the alkyl moiety in the C6 to C11 alkyl (meth)acrylate structural unit is branched, the die-bonding layer 10 can be more easily peeled off from the adhesive layer 22 in the pick-up process described in detail later. . Further, since the number of carbon atoms in the alkyl portion is 9, the die bond layer 10 can be easily peeled off from the adhesive layer 22 in the same way.

The above acrylic polymer preferably contains 50 mol% or more and 90 mol% or less of a C6 to C11 alkyl (meth)acrylate structural unit in the molecule.
When the above acrylic polymer contains a C6 to C11 alkyl (meth)acrylate structural unit in an amount of 50 mol% or more and 90 mol% or less, lifting of the semiconductor chip can be further suppressed and better pick-up properties can be exhibited.
It is more preferable that the above acrylic polymer contains 55 mol% or more of a C6 to C11 alkyl (meth)acrylate structural unit. Moreover, it is more preferable to contain 85 mol% or less.

The above mol% is a value based on the monomer that will constitute the main chain of the acrylic polymer. Specifically, the polymerization initiator and chain transfer agent incorporated into the main chain during polymerization of the acrylic polymer are not taken into account in the above mol%. The same applies hereinafter in the specification.
In other words, the above-mentioned acrylic polymer has a main chain in which unsaturated double bond moieties of (meth)acryloyl groups in the (meth)acrylate monomer before polymerization are linked by polymerization. The above mol% is a molar percentage with respect to the total number of moles of (meth)acrylate monomers that constitute the main chain through polymerization. Note that the molecular structure of the side chain of the acrylic polymer is not considered in the above mol%.

Acrylic polymers have hydroxyl group-containing (meth)acrylate structural units, and the hydroxyl groups of these structural units easily react with isocyanate groups.
By allowing an acrylic polymer having a hydroxyl group-containing (meth)acrylate structural unit and an isocyanate compound to coexist in the adhesive layer 22, the adhesive layer can be appropriately cured.

The structural unit of the hydroxyl group-containing (meth)acrylate is derived from a hydroxyl group-containing (meth)acrylate monomer. In other words, the molecular structure after the hydroxyl group-containing (meth)acrylate monomer undergoes a polymerization reaction is the structural unit of the hydroxyl group-containing (meth)acrylate. Specifically, the bond generated by the polymerization reaction of the hydroxyl group-containing (meth)acrylate monomer constitutes a part of the main chain of the acrylic polymer.

The structural unit of the hydroxyl group-containing (meth)acrylate is preferably a structural unit of a hydroxyl group-containing C2 to C4 alkyl (meth)acrylate. The expression "C2-C4 alkyl" indicates the number of carbon atoms in the hydrocarbon moiety bonded to (meth)acrylic acid with an ester bond. In other words, the hydroxyl group-containing C2-C4 alkyl (meth)acrylate monomer is a monomer in which (meth)acrylic acid and an alcohol having 2 to 4 carbon atoms (usually a dihydric alcohol) are ester-bonded.
The C2-C4 alkyl hydrocarbon portion is typically a saturated hydrocarbon. For example, the C2-C4 alkyl hydrocarbon moiety is a linear saturated hydrocarbon or a branched saturated hydrocarbon. The C2-C4 alkyl hydrocarbon moiety preferably does not contain a polar group containing oxygen (O), nitrogen (N), or the like.
In the structural unit of the hydroxyl group-containing (meth)acrylate, the hydroxyl group (-OH group) may be bonded to any carbon (C) of the hydrocarbon moiety. The hydroxyl group (-OH group) is preferably bonded to the terminal carbon (C) of the hydrocarbon moiety.

Examples of the structural unit of the hydroxyl group-containing C2-C4 alkyl (meth)acrylate include hydroxyethyl (meth)acrylate, hydroxypropyl (meth)acrylate, hydroxy n-butyl (meth)acrylate, or hydroxyiso-butyl (meth)acrylate. Examples include each structural unit of hydroxybutyl (meth)acrylate such as acrylate. In addition, in the structural unit of hydroxybutyl (meth)acrylate, the hydroxyl group (-OH group) may be bonded to the terminal carbon (C) of the hydrocarbon moiety, and the hydroxyl group (-OH group) may be bonded to the carbon (C) at the end of the hydrocarbon moiety. may be combined with

As the structural unit of the hydroxyl group-containing C2-C4 alkyl (meth)acrylate, a structural unit of hydroxyethyl (meth)acrylate is preferable, and a structural unit of 2-hydroxyethyl (meth)acrylate is more preferable.
This has the advantage that floating of the semiconductor chip can be further suppressed.

The acrylic polymer preferably contains 1 mol% or more and 20 mol% or less of a hydroxyl group-containing (meth)acrylate structural unit in the molecule.
By including 1 mol % or more of the hydroxyl group-containing (meth)acrylate structural unit, there is an advantage that the adhesive force (before the pick-up process) of the adhesive layer 22 can be further increased. Further, by including 20 mol % or less of the hydroxyl group-containing (meth)acrylate structural unit, there is an advantage that lifting of the semiconductor chip can be further suppressed and better pick-up properties can be exhibited.
The acrylic polymer preferably contains 2 mol% or more, and more preferably 10 mol% or less, of a hydroxyl group-containing (meth)acrylate structural unit.

In this embodiment, the acrylic polymer further includes a polymerizable group-containing (meth)acrylate structural unit, as described above. In other words, the above acrylic polymer contains a polymerizable group-containing (meth)acrylate structural unit having a polymerizable unsaturated double bond in the side chain.
Since the above acrylic polymer contains a polymerizable group-containing (meth)acrylate structural unit, the adhesive layer 22 can be cured by irradiation with active energy rays (ultraviolet rays, etc.) before the pickup step. Specifically, radicals are generated from the photopolymerization initiator by irradiation with active energy rays such as ultraviolet rays, and the action of these radicals allows acrylic polymers to undergo a crosslinking reaction with each other. Thereby, the adhesive force of the adhesive layer 22 before irradiation can be reduced by irradiation. Further, there is an advantage that the die-bonding layer 10 can be peeled off well from the adhesive layer 22, and better pick-up properties can be exhibited.
Note that ultraviolet rays, radiation, and electron beams are employed as active energy rays.

The structural unit of the polymerizable group-containing (meth)acrylate can be formed by bonding a monomer having a functional group capable of bonding with a hydroxyl group and a polymerizable group in the molecule to the structural unit of the hydroxyl group-containing (meth)acrylate. . The above functional group may be an isocyanate group that is highly reactive with hydroxyl groups. In other words, the above monomer may have an isocyanate group and a vinyl group at both ends of the molecule. The vinyl group may be part of a (meth)acryloyl group, for example.
Specifically, the structural unit of the polymerizable group-containing (meth)acrylate has a molecular structure in which the isocyanate group of the isocyanate group-containing (meth)acrylate monomer is bonded with urethane to the hydroxyl group in the above-mentioned hydroxyl group-containing (meth)acrylate structural unit. It may have. In other words, the structural unit of the polymerizable group-containing (meth)acrylate has a molecular structure derived from the structural unit of the hydroxyl group-containing (meth)acrylate, and the polymerizable group ((meth)acryloyl group ) may have a molecular structure in which they are bonded.

The structural unit of the polymerizable group-containing (meth)acrylate having a polymerizable group can be prepared after polymerization of the acrylic polymer. For example, after copolymerizing a C6 to C11 alkyl (meth)acrylate monomer and a hydroxyl group-containing (meth)acrylate monomer, the hydroxyl groups in some of the constituent units of the hydroxyl group-containing (meth)acrylate and the isocyanate group-containing polymerizable monomer are copolymerized. The above-mentioned structural unit of the polymerizable group-containing (meth)acrylate can be obtained by subjecting the isocyanate group to a urethanization reaction.

The above-mentioned isocyanate group-containing (meth)acrylate monomer preferably has one isocyanate group and one (meth)acryloyl group in the molecule. Such monomers include, for example, 2-isocyanatoethyl (meth)acrylate.

The above acrylic polymer preferably contains 10 mol% or more and 25 mol% or less of a polymerizable group-containing (meth)acrylate structural unit in the molecule.

The above acrylic polymer preferably contains 10 mol% or more and 30 mol% or less of a hydroxyl group-containing (meth)acrylate constitutional unit and a polymerizable group-containing (meth)acrylate constitutional unit in the molecule.

The above acrylic polymer has a C6 to C11 alkyl (meth)acrylate structural unit for the hydroxyl group-containing (meth)acrylate structural unit (B) and the polymerizable group-containing (meth)acrylate structural unit (C). It is preferable that (A) be contained in a molar ratio [A/(B+C)] of 0.5 or more and 8.0 or less.
The above ratio [A/(B+C)] is more preferably 0.6 or more, and even more preferably 0.7 or more.
The ratio [A/(B+C)] is more preferably 7.0 or less, and even more preferably 6.0 or less.

The above acrylic polymer has a hydroxyl group-containing (meth)acrylate structural unit (B) and a polymerizable group-containing (meth)acrylate structural unit (C), a polymerizable group-containing (meth)acrylate structural unit. It is preferable that (C) be contained in a molar ratio [C/(B+C)] of 0.50 or more and 0.95 or less.
When the ratio [C/(B+C)] is 0.50 or more, there is an advantage that the pickup property becomes better. Further, by setting the above ratio [C/(B+C)] to 0.95 or less, the adhesive layer 22 can be prevented from losing its adhesive properties after being cured by irradiation with active energy rays (ultraviolet rays, etc.). .
The above ratio [C/(B+C)] is more preferably 0.60 or more, and even more preferably 0.80 or more.
The above ratio [C/(B+C)] is more preferably 0.94 or less, and even more preferably 0.93 or less.

In a preferred embodiment, the above acrylic polymer comprises a C6-C11 alkyl (meth)acrylate structural unit, a hydroxyl group-containing C2-C4 alkyl (meth)acrylate structural unit, and a polymerizable group-containing (meth)acrylate structural unit. The structural unit of the hydroxyl group-containing C2-C4 alkyl (meth)acrylate is the structural unit of hydroxyethyl (meth)acrylate.
In a further preferred embodiment, the structural unit of the polymerizable group-containing (meth)acrylate has a urethane bond in which some of the hydroxyl groups of the structural unit of the hydroxyl group-containing (meth)acrylate undergo a urethanization reaction, and the structural unit of the polymerizable group-containing (meth)acrylate is incorporated via this urethane bond. It further has a (meth)acryloyl group as a polymerizable group.

Examples of the tackifier included in the adhesive layer 22 include rosin-based tackifiers, terpene-based tackifiers, hydrocarbon-based tackifiers, and the like. Note that commercially available products can be used as these tackifiers.

Examples of the rosin-based tackifier include esters of rosin acid, mainly consisting of abietic acid found in pine tar and pine oil, and glycerin or pentaerythritol, as well as hydrogenated products and disproportionated products thereof.
More specifically, examples of the rosin-based tackifier include gum rosin, tall oil rosin, wood rosin, hydrogenated rosin, disproportionated rosin, polymerized rosin, modified rosin, and rosin ester (rosin diol).

Examples of terpene-based tackifiers include those obtained by polymerizing terpene oil contained in pine trees and natural terpenes contained in orange peels.
More specifically, the terpene-based tackifier includes at least one of terpene resins, aromatic modified terpene resins, terpene phenol resins, and hydrogenated terpene resins.
Terpene phenol resin is a copolymer of terpene monomer and phenol.

Examples of the hydrocarbon-based tackifier include resins of aliphatic hydrocarbons, alicyclic hydrocarbons, and aromatic hydrocarbons made from petroleum.
More specifically, examples of the hydrocarbon tackifier include C5 petroleum resins, C9 petroleum resins, copolymer petroleum resins, alicyclic saturated hydrocarbon resins, and styrene petroleum resins.
Further examples of the tackifier include styrene resins having α-methylstyrene as a constituent unit.

The adhesive layer 22 preferably contains 5 parts by mass or more and 25 parts by mass or less of a tackifier based on 100 parts by mass of the adhesive. By including 5 parts by mass or more of the tackifier, lifting of the semiconductor chip can be further suppressed. By containing 25 parts by mass or less of the tackifier, better pick-up properties can be exhibited.

It is preferable that the adhesive layer 22 contains a tackifier having a softening point of 70°C or more and 170°C or less.
When the softening point of the tackifier is 70° C. or higher and 170° C. or lower, the function as a tackifier is more fully exhibited. Thereby, better adhesiveness can be imparted to the adhesive layer 22.
The above softening point is measured by the following method. Specifically, it is measured according to JIS K2207-1996 softening point test method (ring and ball method).
The above measurement can be performed using, for example, an automatic softening point tester "ASP-6" (manufactured by Tanaka Scientific Instruments Manufacturing Co., Ltd.). Details of the measurement method are as follows.
Fill the specified ring with the sample for measurement and support it horizontally in the glycerin bath. A sphere of a specified mass is placed in the center of the measurement sample, and the temperature of the glycerin bath is raised at a specified rate. The softening point is defined as the temperature at which the ball sinks into the softened measurement sample and touches the bottom plate of the ring stand.
・Measurement conditions Ball: Steel ball (diameter 9.53 mm, mass 3.5 g)
Distance between the ball and the bottom plate of the ring stand: 25mm
Glycerin bath heating rate: 5℃/min 2 ring and ball type Glycerin bath + stirring mode Magnetic stirrer 80-300 rpm

As the tackifier, a terpene-based tackifier is preferred. Moreover, a compound having a phenol group in the molecule is preferable. As the tackifier, terpene phenol resin among terpene-based tackifiers is more preferable. When the tackifier has a phenol group in its molecule, lifting of the semiconductor chip can be further suppressed.

The dicing tape 20 of this embodiment includes an adhesive layer 22 containing the above-mentioned acrylic polymer. The adhesive layer 22 further contains an isocyanate compound. A part of the isocyanate compound may be in a state after being reacted by urethanization reaction or the like.
Isocyanate compounds have multiple isocyanate groups in their molecules. When the isocyanate compound has a plurality of isocyanate groups in the molecule, the crosslinking reaction between the acrylic polymers in the adhesive layer 22 can proceed. Specifically, by reacting one isocyanate group of the isocyanate compound with the hydroxyl group of an acrylic polymer and reacting the other isocyanate group with the hydroxyl group of another acrylic polymer, the crosslinking reaction via the isocyanate compound can proceed.

Examples of the isocyanate compound include diisocyanates such as aliphatic diisocyanates, alicyclic diisocyanates, and araliphatic diisocyanates.

Examples of the aliphatic diisocyanate include ethylene diisocyanate, tetramethylene diisocyanate, hexamethylene diisocyanate, 2,4,4- or 2,2,4-trimethylhexamethylene diisocyanate, and methyl 2,6-diisocyanatocaproate. It will be done.
Examples of the alicyclic diisocyanate include 3-isocyanatomethyl-3,5,5-trimethylcyclohexane, 1,3- or 1,4-bis(isocyanatomethyl)cyclohexane, methylcyclohexane-2,4- or 2 , 6-diisocyanate, dicyclohexylmethane-4,4'-diisocyanate, 1,3- or 1,4-diisocyanatocyclohexane, and the like.
Examples of aromatic diisocyanates include m- or p-phenylene diisocyanate, diphenylmethane-4,4'-diisocyanate, 2,4- or 2,6-tolylene diisocyanate, 1,3'- or 1,4-bis( Examples include isocyanatomethyl)benzene, 1,3- or 1,4-bis(α-isocyanatoisopropyl)benzene, and the like.

Moreover, triisocyanate is mentioned as an isocyanate compound. Examples of the triisocyanate include triphenylmethane-4,4',4''-triisocyanate, 1,3,5-triisocyanatobenzene, 1,3,5-tris(isocyanatomethyl)cyclohexane, 1,3 , 5-tris(isocyanatomethyl)benzene, 2-isocyanatoethyl 2,6-diisocyanatocaproate, and the like.
Furthermore, examples of the isocyanate compound include polymerized polyisocyanates such as diisocyanate dimers and trimers, and polymethylene polyphenylene polyisocyanates.

In addition, examples of the isocyanate compound include polyisocyanate obtained by reacting an excess amount of the above-mentioned isocyanate compound with an active hydrogen-containing compound. Examples of the active hydrogen-containing compound include active hydrogen-containing low molecular weight compounds, active hydrogen-containing high molecular weight compounds, and the like.
Examples of active hydrogen-containing low molecular weight compounds include ethylene glycol, propylene glycol, dipropylene glycol, diethylene glycol, triethylene glycol, 2,2,4-trimethyl-1,3-pentanediol, neopentyl glycol, hexanediol, and cyclohexane. Dimethanol, cyclohexanediol, hydrogenated bisphenol A, xylylene glycol, glycerin, trimethylolethane, trimethylolpropane, hexanetriol, pentaerythritol, sorbitol, sorbitol, sucrose, castor oil, ethylenediamine, hexamethylenediamine, diethanolamine, Examples include ethanolamine, water, ammonia, urea, etc., and examples of the active hydrogen-containing high molecular weight compound include various polyether polyols, polyester polyols, polyurethane polyols, acrylic polyols, epoxy polyols, and the like.

Further, as the isocyanate compound, allophanated polyisocyanate, biuretted polyisocyanate, etc. can also be used.
The above isocyanate compounds can be used alone or in combination of two or more.

The above-mentioned isocyanate compound is preferably a reaction product of an aromatic diisocyanate and an active hydrogen-containing low molecular weight compound. Since the reaction rate of isocyanate groups in the reactant reacted with the aromatic diisocyanate is relatively slow, the pressure-sensitive adhesive layer 22 containing such a reactant is prevented from being excessively cured. The above-mentioned isocyanate compound preferably has three or more isocyanate groups in the molecule.

The polymerization initiator contained in the adhesive layer 22 is a compound that can initiate a polymerization reaction by applied heat or light energy. Since the adhesive layer 22 contains a polymerization initiator, when heat energy or light energy is applied to the adhesive layer 22, a crosslinking reaction between the acrylic polymers can proceed. Specifically, the adhesive layer 22 can be cured by starting a polymerization reaction between the polymerizable groups between the acrylic polymers having structural units of polymerizable group-containing (meth)acrylate. Thereby, as described above, better pick-up performance can be exhibited.
As the polymerization initiator, for example, a photopolymerization initiator or a thermal polymerization initiator is employed. As the polymerization initiator, common commercially available products can be used.

The adhesive layer 22 may further contain components other than those described above. Other ingredients include, for example, plasticizers, fillers, anti-aging agents, antioxidants, ultraviolet absorbers, light stabilizers, heat stabilizers, antistatic agents, surfactants, light release agents, etc. . The types and amounts of other components to be used can be appropriately selected depending on the purpose.

The dicing tape 20 of this embodiment includes a base material layer 21 bonded to the above-described adhesive layer 22. The base material layer 21 is, for example, a metal foil, a fiber sheet such as paper or cloth, a rubber sheet, a resin film, or the like. The base material layer 21 may have a laminated structure.
Examples of the fiber sheet constituting the base layer 21 include paper, woven fabric, and nonwoven fabric.
Materials for the resin film include, for example, polyolefins such as polyethylene (PE), polypropylene (PP), and ethylene-propylene copolymers; ethylene-vinyl acetate copolymers (EVA), ionomer resins, and ethylene-(meth)acrylic acid. Copolymers of ethylene such as copolymers, ethylene-(meth)acrylate (random, alternating) copolymers; polyesters such as polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polybutylene terephthalate (PBT), etc. polyacrylate; polyvinyl chloride (PVC); polyurethane; polycarbonate; polyphenylene sulfide (PPS); polyamide such as aliphatic polyamide and wholly aromatic polyamide (aramid); polyetheretherketone (PEEK); polyimide; polyetherimide; Examples include polyvinylidene chloride; ABS (acrylonitrile-butadiene-styrene copolymer); cellulose or cellulose derivatives; silicone-containing polymers; fluorine-containing polymers. These may be used alone or in combination of two or more.

When the base material layer 21 includes a resin film, the resin film may be subjected to a stretching treatment or the like to control deformability such as elongation rate.
The surface of the base material layer 21 may be subjected to surface treatment in order to improve its adhesion to the adhesive layer 22. As the surface treatment, for example, oxidation treatment by a chemical method or physical method such as chromic acid treatment, ozone exposure, flame exposure, high voltage electric shock treatment, ionizing radiation treatment, etc. may be employed. Further, a coating treatment using a coating agent such as an anchor coating agent, a primer, or an adhesive may be applied.

The back side of the base material layer 21 (the side on which the adhesive layer 22 does not overlap) is coated with a release agent (release agent) such as silicone resin or fluorine resin in order to impart releasability. It may be processed.
The base layer 21 is preferably a light-transmissive (ultraviolet-transparent) resin film or the like, since it is possible to apply active energy rays such as ultraviolet rays to the adhesive layer 22 from the back side.

The dicing tape 20 of this embodiment may include a release sheet that covers one surface of the adhesive layer 22 (the surface where the adhesive layer 22 does not overlap the base material layer 21) before being used. . When the die-bonding layer 10 having a smaller area than the adhesive layer 22 is arranged so as to fit within the adhesive layer 22, the release sheet is arranged so as to cover both the adhesive layer 22 and the die-bonding layer 10. The release sheet is used to protect the adhesive layer 22 and is peeled off before attaching the die bond layer 10 to the adhesive layer 22.

As the release sheet, for example, a plastic film or paper whose surface has been treated with a release agent such as silicone, long-chain alkyl, fluorine, or molybdenum sulfide can be used.
In addition, examples of release sheets include polytetrafluoroethylene, polychlorotrifluoroethylene, polyvinyl fluoride, polyvinylidene fluoride, tetrafluoroethylene/hexafluoropropylene copolymer, chlorofluoroethylene/vinylidene fluoride copolymer, etc. A film made of a fluorine-based polymer; a film made of polyolefin such as polyethylene or polypropylene; a film made of polyester such as polyethylene terephthalate (PET), etc. can be used.
Further, as the release sheet, for example, a plastic film or paper whose surface is coated with a release agent such as a fluorine-based release agent or a long-chain alkyl acrylate-based release agent can be used.
Note that the release sheet can be used as a support material for supporting the adhesive layer 22. In particular, the release sheet is preferably used when layering the adhesive layer 22 on the base layer 21. Specifically, the adhesive layer 22 is stacked on the base material layer 21 in a state in which the release sheet and the adhesive layer 22 are laminated, and the release sheet is peeled off (transferred) after being stacked, so that the adhesive layer 22 is layered onto the base material layer 21. Adhesive layer 22 can be stacked.

Next, the dicing die bond film 1 of this embodiment will be explained in detail.

The dicing die bond film 1 of this embodiment includes the above-described dicing tape 20 and the die bond layer 10 laminated on the adhesive layer 22 of the dicing tape 20. The die bond layer 10 will be bonded to a semiconductor wafer in the manufacture of semiconductor integrated circuits.

The die bond layer 10 may contain at least one of a thermosetting resin and a thermoplastic resin. It is preferable that the die bond layer 10 contains a thermosetting resin and a thermoplastic resin.

Examples of thermosetting resins include epoxy resins, phenol resins, amino resins, unsaturated polyester resins, polyurethane resins, silicone resins, and thermosetting polyimide resins. As the above-mentioned thermosetting resin, only one type or two or more types may be employed. Epoxy resin is preferable as the thermosetting resin because it contains less ionic impurities and the like that can cause corrosion of the semiconductor chip to be die-bonded. As a curing agent for epoxy resin, phenol resin is preferable.

Examples of the above epoxy resin include bisphenol A type, bisphenol F type, bisphenol S type, brominated bisphenol A type, hydrogenated bisphenol A type, bisphenol AF type, biphenyl type, naphthalene type, fluorene type, phenol novolak type, ortho Examples include cresol novolac type, trishydroxyphenylmethane type, tetraphenylolethane type, hydantoin type, trisglycidyl isocyanurate type, and glycidylamine type epoxy resins.
As the epoxy resin, naphthalene type epoxy resin is preferred.

Phenolic resins can act as hardeners for epoxy resins. Examples of the phenol resin include novolak type phenol resin, resol type phenol resin, and polyoxystyrene such as polyparaoxystyrene.
Examples of the novolak type phenolic resin include phenol novolak resin, phenol aralkyl resin, cresol novolak resin, tert-butylphenol novolak resin, and nonylphenol novolak resin.
As the phenol resin, a phenol novolak resin is preferred. These phenol resins can further improve the adhesiveness of the epoxy resin as an adhesive when acting as a curing agent for the epoxy resin (die bonding adhesive).
As the above-mentioned phenol resin, only one type or two or more types may be employed.

In the die-bonding layer 10, the hydroxyl group of the phenol resin is preferably 0.5 equivalent or more and 2.0 equivalent or less, more preferably 0.7 equivalent or more and 1.5 equivalent or less, per equivalent of the epoxy group of the epoxy resin. This allows the curing reaction between the epoxy resin and the phenol resin to proceed sufficiently.

When the die-bonding layer 10 contains a thermosetting resin, the content ratio of the thermosetting resin in the die-bonding layer 10 is preferably 5% by mass or more and 60% by mass or less, and 10% by mass or less, based on the total mass of the die-bonding layer 10. % or more and 50% by mass or less is more preferable. This allows the die bond layer 10 to appropriately function as a thermosetting adhesive.

Examples of thermoplastic resins that can be included in the die bonding layer 10 include natural rubber, butyl rubber, isoprene rubber, chloroprene rubber, ethylene-vinyl acetate copolymer, ethylene-acrylic acid copolymer, and ethylene-acrylic acid ester copolymer. , polybutadiene resin, polycarbonate resin, thermoplastic polyimide resin, polyamide resin such as 6-nylon and 6,6-nylon (trade name), phenoxy resin, acrylic resin, saturated polyester resin such as PET and PBT, polyamide-imide resin, fluorine Examples include resin.
As the thermoplastic resin, an acrylic resin is preferable because it contains less ionic impurities and has high heat resistance, so that the adhesiveness of the die bond layer 10 can be more ensured.
As the above-mentioned thermoplastic resin, only one type or two or more types may be employed.

It is preferable that the acrylic resin is a polymer having the largest proportion of alkyl (meth)acrylate structural units among the structural units in the molecule. Examples of the alkyl (meth)acrylate include C2 to C4 alkyl (meth)acrylate.
The acrylic resin may contain structural units derived from other monomer components copolymerizable with the alkyl (meth)acrylate monomer.
Examples of the other monomer components include carboxy group-containing monomers, acid anhydride monomers, hydroxy group-containing monomers, glycidyl group-containing monomers, sulfonic acid group-containing monomers, phosphoric acid group-containing monomers, and functional group-containing monomers such as acrylamide and acrylonitrile. monomers, and various other polyfunctional monomers.
The acrylic resin preferably contains an alkyl (meth)acrylate (particularly an alkyl (meth)acrylate whose alkyl moiety has 4 or less carbon atoms) and a carboxy group, since it can exhibit higher cohesive force in the die-bonding layer 10. It is a copolymer of a containing monomer, a nitrogen atom-containing monomer, and a polyfunctional monomer (especially a polyglycidyl-based polyfunctional monomer), and more preferably ethyl acrylate, butyl acrylate, acrylic acid, and acrylonitrile. and polyglycidyl (meth)acrylate.

The glass transition temperature (Tg) of the above-mentioned acrylic resin is preferably 5°C or more and 35°C or less, and 10°C or more and 30°C or less, in that it is easy to set the elasticity and viscosity of the die-bonding layer 10 within a desired range. It is more preferable that

When the die-bonding layer 10 contains a thermosetting resin and a thermoplastic resin, the content ratio of the thermoplastic resin in the die-bonding layer 10 is based on organic components excluding fillers (e.g., thermosetting resin, thermoplastic resin, curing catalyst, etc.). , silane coupling agent, dye), preferably 20% by mass or more and 60% by mass or less, more preferably 30% by mass or more and 50% by mass or less, even more preferably 35% by mass or more and 45% by mass or less. mass% or less. Note that the elasticity and viscosity of the die-bonding layer 10 can be adjusted by changing the content ratio of the thermosetting resin.

When the thermoplastic resin of the die-bonding layer 10 has a thermosetting functional group, for example, an acrylic resin containing a thermosetting functional group can be employed as the thermoplastic resin. This thermosetting functional group-containing acrylic resin preferably contains the highest mass proportion of structural units derived from alkyl (meth)acrylate in the molecule. Examples of the alkyl (meth)acrylate include the (meth)alkyl (meth)acrylates listed above.
On the other hand, examples of the thermosetting functional group in the thermosetting functional group-containing acrylic resin include a glycidyl group, a carboxy group, a hydroxy group, and an isocyanate group. Among these, a glycidyl group, a hydroxy group, and a carboxy group are preferred. In other words, as the thermosetting functional group-containing acrylic resin, an acrylic resin containing a hydroxy group and a carboxy group is preferable.
The die-bonding layer 10 preferably contains a thermosetting functional group-containing acrylic resin and a curing agent. Examples of the curing agent include those exemplified as curing agents that can be included in the adhesive layer 22. When the thermosetting functional group in the thermosetting functional group-containing acrylic resin is a glycidyl group, it is preferable to use a compound having a plurality of phenol structures as the curing agent. For example, the various phenolic resins mentioned above can be used as the curing agent.

Die bond layer 10 preferably contains filler. By changing the amount of filler in the die bond layer 10, the elasticity and viscosity of the die bond layer 10 can be adjusted more easily. Furthermore, physical properties such as electrical conductivity, thermal conductivity, and elastic modulus of the die-bonding layer 10 can be adjusted.
Examples of fillers include inorganic fillers and organic fillers. As the filler, inorganic fillers are preferred.
Examples of inorganic fillers include aluminum hydroxide, magnesium hydroxide, calcium carbonate, magnesium carbonate, calcium silicate, magnesium silicate, calcium oxide, magnesium oxide, aluminum oxide, aluminum nitride, boron nitride, crystalline silica, and amorphous silica. Examples include fillers containing silica such as silica. Further, examples of the material of the inorganic filler include metals such as aluminum, gold, silver, copper, and nickel, and alloys. Fillers such as aluminum borate whiskers, amorphous carbon black, and graphite may also be used. The shape of the filler may be various shapes such as spherical, acicular, and flaky. As the filler, only one type or two or more of the above types may be employed.

The average particle diameter of the filler is preferably 0.005 μm or more and 10 μm or less, more preferably 0.005 μm or more and 1 μm or less. When the average particle size is 0.005 μm or more, wettability and adhesion to adherends such as semiconductor wafers are further improved. When the average particle size is 10 μm or less, the properties of the added filler can be more fully exhibited, and the heat resistance of the die-bonding layer 10 can be more fully exhibited. The average particle size of the filler can be determined using, for example, a photometric particle size distribution analyzer (eg, product name "LA-910", manufactured by Horiba, Ltd.).

When the die-bonding layer 10 contains a filler, the content ratio of the filler is preferably 30% by mass or more and 70% by mass or less, more preferably 40% by mass or more and 60% by mass or less, based on the total mass of the die-bonding layer 10. and more preferably 42% by mass or more and 55% by mass or less.

The die bond layer 10 may contain other components as necessary. Examples of the other components include a curing catalyst, a flame retardant, a silane coupling agent, an ion trapping agent, and a dye.
Examples of the flame retardant include antimony trioxide, antimony pentoxide, and brominated epoxy resin.
Examples of the silane coupling agent include β-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, γ-glycidoxypropyltrimethoxysilane, and γ-glycidoxypropylmethyldiethoxysilane.
Examples of the ion trapping agent include hydrotalcites, bismuth hydroxide, benzotriazole, and the like.
As the other additives mentioned above, only one type or two or more types may be employed.

The die-bonding layer 10 preferably contains a thermoplastic resin (particularly an acrylic resin), a thermosetting resin, and a filler since elasticity and viscosity can be easily adjusted.
In the die-bonding layer 10, the content ratio of thermoplastic resin such as acrylic resin to the total mass of organic components excluding fillers is preferably 30% by mass or more and 70% by mass or less, and 40% by mass or more and 60% by mass or less. It is more preferable that the amount is 45% by mass or more and 55% by mass or less.
With respect to the total mass of the die-bonding layer 10, the content ratio of the filler is preferably 30% by mass or more and 70% by mass or less, more preferably 40% by mass or more and 60% by mass or less, and 42% by mass or more and 55% by mass or less. It is more preferable that it is less than % by mass.

The thickness of the die-bonding layer 10 is not particularly limited, but is, for example, 1 μm or more and 200 μm or less. The upper limit of such thickness is preferably 100 μm, more preferably 80 μm. The lower limit of such thickness is preferably 3 μm, more preferably 5 μm. In addition, when the die-bonding layer 10 is a laminate, the above thickness is the total thickness of the laminate.

The glass transition temperature (Tg) of the die-bonding layer 10 is preferably 0°C or higher, more preferably 10°C or higher. When the glass transition temperature is 0° C. or higher, the die bond layer 10 can be easily cut by cool expansion. The upper limit of the glass transition temperature of the die-bonding layer 10 is, for example, 100°C.

The die-bonding layer 10 may have a single-layer structure, as shown in FIG. 1, for example. In this specification, a single layer refers to having only layers formed of the same composition. A structure in which multiple layers made of the same composition are laminated is also a single layer.
On the other hand, the die bond layer 10 may have, for example, a multilayer structure in which layers each formed of two or more different compositions are laminated.

In the dicing die-bonding film 1 of this embodiment, when used, the adhesive layer 22 is cured by, for example, being irradiated with ultraviolet rays. Specifically, in a state in which a die-bonding layer 10 with a semiconductor wafer adhered to one surface and an adhesive layer 22 bonded to the other surface of the die-bonding layer 10 are laminated, ultraviolet rays or the like are applied to at least the adhesive layer 22. irradiated. For example, ultraviolet rays or the like are irradiated from the side where the base material layer 21 is disposed, and the ultraviolet rays or the like pass through the base material layer 21 and reach the adhesive layer 22 . The adhesive layer 22 is cured by irradiation with ultraviolet light or the like.
By curing the adhesive layer 22 after irradiation, the adhesive strength of the adhesive layer 22 can be lowered, so the die bond layer 10 (with the semiconductor wafer attached) can be relatively easily peeled off from the adhesive layer 22 after irradiation. can be done. Thereby, good pick-up performance can be exhibited.

The irradiation energy amount of active energy rays (ultraviolet rays, etc.) is at least 50 mJ/cm ² or more. The amount of irradiation energy is, for example, 50 mJ/cm ² or more and 500 mJ/cm ² or less, preferably 100 mJ/cm ² or more and 300 mJ/cm ² or less. Usually, active energy rays are irradiated except for the periphery of the area where the adhesive layer 12 and the die bond layer 10 are bonded together. In the case of partial irradiation, an area that is not irradiated can be provided by irradiating through a patterned photomask. Further, it is possible to form an irradiation area by irradiating in spots.
The device for irradiating ultraviolet rays is not particularly limited, but for example, Nitto Seiki Co., Ltd. product name "UM810" can be used.

Before irradiation with active energy rays, the T-peel strength (α) between the adhesive layer 22 and the die-bonding layer 10 is 1.0 (N/20 mm) or more and 3.4 (N/20 mm) or less. is preferred. When the T-peel strength (α) is 1.0 (N/20 mm) or more, lifting of the semiconductor chip can be further suppressed. Furthermore, when the T-peel strength (α) is 3.4 (N/20 mm) or less, better pick-up properties can be exhibited.
On the other hand, after irradiation with active energy rays, the T-peel strength (β) between the adhesive layer 22 and the die-bonding layer 10 is preferably 0.12 (N/20 mm) or less. Such peel strength (β) may be 0.05 (N/20 mm) or more.
The above T-peel strength (α or β) value can be increased by, for example, increasing the amount of tackifier contained in the adhesive layer 22, whether before or after irradiation. can.

The ratio of T-peel strength (β/α) between the adhesive layer 22 and the die-bonding layer 10 before (α) and after (β) irradiation with active energy rays is 0.04 or more. It is preferably 0.10 or less. In other words, it is preferable that the following formula (1) is satisfied.
0.04 ≦ T-type peel strength after active energy ray irradiation/T-type peel strength before active energy ray irradiation (β/α) ≦ 0.10 (1)
Thereby, it is possible to further suppress floating of the semiconductor chip, and it is possible to exhibit better pick-up performance.
Note that the above-mentioned irradiation with active energy rays is performed under the conditions described in Examples. Further, the numerical value related to the above-mentioned T-peel strength is measured according to the test conditions described in the Examples.

The dicing die-bonding film 1 of this embodiment may include a release sheet that covers one surface of the die-bonding layer 10 (the surface on which the die-bonding layer 10 does not overlap the adhesive layer 22) before being used. The release sheet is used to protect the die bond layer 10, and is peeled off immediately before attaching an adherend (for example, a semiconductor wafer) to the die bond layer 10.
As this release sheet, a release sheet similar to the above-mentioned release sheet can be adopted. This release sheet can be used as a support material for supporting the die-bonding layer 10. A release sheet is suitably used when stacking the die-bonding layer 10 on the adhesive layer 22. Specifically, the die bond layer 10 is stacked on the adhesive layer 22 in a state where the release sheet and the die bond layer 10 are laminated, and the die bond layer 10 is layered on the adhesive layer 22 by peeling off (transferring) the release sheet after stacking. You can stack 10.

Since the dicing die-bonding film 1 of this embodiment is configured as described above, it is possible to suppress floating of the semiconductor chip and exhibit good pick-up performance.

Next, a method for manufacturing the dicing tape 20 and the dicing die bond film 1 of this embodiment will be described.

The method for manufacturing the dicing die bond film 1 of this embodiment is as follows:
The method includes a step of manufacturing a dicing tape 20 (method for manufacturing a dicing tape) and a step of overlapping the die bond layer 10 on the manufactured dicing tape 20 to manufacture the dicing die bond film 1.

The manufacturing method of dicing tape (the process of manufacturing dicing tape) is as follows:
A synthesis process for synthesizing an acrylic polymer;
The adhesive layer 22 is prepared by evaporating the solvent from an adhesive composition containing the above-mentioned acrylic polymer, an isocyanate compound, a polymerization initiator, a solvent, and other components added as appropriate depending on the purpose. agent layer preparation step;
The method includes a lamination step of laminating the base material layer 21 and the adhesive layer 22 by bonding the adhesive layer 22 and the base material layer 21 together.

In the synthesis step, an acrylic polymer intermediate is synthesized, for example, by radical polymerizing a C6 to C11 alkyl (meth)acrylate monomer and a hydroxyl group-containing (meth)acrylate monomer.
Radical polymerization can be performed by a common method. For example, an acrylic polymer intermediate can be synthesized by dissolving each of the above monomers in a solvent, stirring while heating, and adding a polymerization initiator. In order to adjust the molecular weight of the acrylic polymer, polymerization may be carried out in the presence of a chain transfer agent.
Next, some hydroxyl groups of the constituent units of the hydroxyl group-containing (meth)acrylate contained in the acrylic polymer intermediate are bonded to the isocyanate groups of the isocyanate group-containing polymerizable monomer by a urethanization reaction. As a result, some of the constituent units of the hydroxyl group-containing (meth)acrylate become constituent units of the polymerizable group-containing (meth)acrylate.
The urethanization reaction can be performed by a common method. For example, the acrylic polymer intermediate and the isocyanate group-containing polymerizable monomer are stirred while being heated in the presence of a solvent and a urethanization catalyst. Thereby, the isocyanate group of the isocyanate group-containing polymerizable monomer can be bonded with urethane to some of the hydroxyl groups of the acrylic polymer intermediate.
In addition, in order to make the urethanization reaction proceed efficiently, the urethanization reaction may be carried out in the presence of a Sn catalyst or the like.

In the adhesive layer preparation step, for example, an acrylic polymer, an isocyanate compound, and a polymerization initiator are dissolved in a solvent to prepare an adhesive composition. By varying the amount of solvent, the viscosity of the composition can be adjusted. Next, the adhesive composition is applied to a release sheet. As the coating method, for example, general coating methods such as roll coating, screen coating, and gravure coating are employed. The applied adhesive composition is solidified by subjecting the applied composition to solvent removal treatment, solidification treatment, etc., thereby producing the adhesive layer 22 .
The solvent removal treatment is performed, for example, under conditions of 80° C. or higher and 150° C. or lower and 0.5 minutes or more and 5 minutes or less.

In the lamination step, the adhesive layer 22 and the base material layer 21, which overlap the release sheet, are laminated together. Note that the release sheet may be in a state overlapping the adhesive layer 22 until it is used.
In addition, in order to promote the reaction between the crosslinking agent and the acrylic polymer, as well as the reaction between the crosslinking agent and the surface portion of the base material layer 21, after the lamination step, it was heated for 48 hours in a 50°C environment. An aging treatment step may also be performed.
Note that the base material layer 21 may be produced using a commercially available film or the like, or may be produced by forming a film by a general method. Examples of the film forming method include a calendar film forming method, a casting method in an organic solvent, a closed system inflation extrusion method, a T-die extrusion method, a coextrusion method, and a dry lamination method.

Through these steps, the dicing tape 20 can be manufactured.

The manufacturing method of dicing die bond film (process of manufacturing dicing die bond film) is as follows:
A die bonding composition preparation step of preparing a die bonding composition for forming the die bonding layer 10;
A die bond layer production step of producing a die bond layer 10 from a die bond composition;
The method includes a pasting step of pasting the die bond layer 10 onto the adhesive layer 22 of the dicing tape 20 manufactured as described above.

In the die bonding composition preparation step, a die bonding composition is prepared by, for example, mixing a resin, a filler, a curing catalyst, a solvent, and the like. By varying the amount of solvent, the viscosity of the composition can be adjusted.

In the die bond layer production step, for example, the resin composition prepared as described above is applied to a release sheet. The coating method is not particularly limited, and common coating methods such as roll coating, screen coating, and gravure coating may be employed. Next, if necessary, the applied composition is solidified by solvent removal treatment, curing treatment, etc., and the die bond layer 10 is produced.
The solvent removal treatment is performed, for example, under conditions of 70° C. or higher and 160° C. or lower for 1 minute or more and 5 minutes or less.

In the pasting process, release sheets are peeled off from the adhesive layer 22 of the dicing tape 20 and the die-bonding layer 10, respectively, and the die-bonding layer 10 and the adhesive layer 12 are pasted together so that they are in direct contact with each other. For example, they can be bonded together by pressure bonding. The temperature during bonding is not particularly limited, and is, for example, 30°C or higher and 50°C or lower, preferably 35°C or higher and 45°C or lower. The linear pressure during bonding is not particularly limited, but is preferably 0.1 kgf/cm or more and 20 kgf/cm or less, more preferably 1 kgf/cm or more and 10 kgf/cm or less.

Through these steps, the dicing die bond film 1 can be manufactured.

The dicing die bond film 1 manufactured as described above is used, for example, as an auxiliary tool for manufacturing semiconductor integrated circuits. Specific examples of use will be described below.

A method for manufacturing a semiconductor integrated circuit generally includes a step of cutting out chips from a semiconductor wafer on which a circuit surface is formed and assembling them.
This process includes, for example, a half-cut process in which grooves are formed in the semiconductor wafer to be processed into chips (dies) by cutting the semiconductor wafer, and then the semiconductor wafer is ground to reduce its thickness. A mounting process in which one side of the semiconductor wafer (for example, the side opposite to the circuit side) is attached to the die bond layer 10 and the semiconductor wafer is fixed to the dicing tape 20, and the interval between half-cut semiconductor chips is widened. An expanding process, a pickup process in which the die bond layer 10 and the adhesive layer 22 are peeled off to take out a semiconductor chip (die) with the die bond layer 10 attached, and the semiconductor chip with the die bond layer 10 attached. and a die bonding step of bonding the die to the adherend. When carrying out these steps, the dicing tape (dicing die bond film) of this embodiment is used as a manufacturing aid.
In the half-cut process, as shown in FIGS. 2A to 2D, a half-cut process is performed to cut the semiconductor integrated circuit into small pieces (dies). Specifically, a wafer processing tape T is attached to the surface of the semiconductor wafer opposite to the circuit surface. Further, a dicing ring R is attached to the wafer processing tape T. With the wafer processing tape T attached, grooves for dividing are formed. While attaching the back grinding tape G to the grooved surface, the wafer processing tape T attached initially is peeled off. With the backgrind tape G attached, the semiconductor wafer is ground until it reaches a predetermined thickness.
In the mounting process, as shown in FIGS. 3A and 3B, after attaching the dicing ring R to the adhesive layer 22 of the dicing tape 20, a half-cut semiconductor wafer is attached to the exposed surface of the die bond layer 10. . After that, the back grind tape G is peeled off from the semiconductor wafer.
In the expanding step, as shown in FIGS. 4A to 4C, the dicing ring R is fixed to a holder H of an expanding device. The dicing die-bond film 1 is stretched so as to be spread in the plane direction by pushing up the pushing-up member U included in the expanding device from the lower side of the dicing die-bond film 1. As a result, the half-cut semiconductor wafer is cut under specific temperature conditions. The above temperature conditions are, for example, -20 to 5°C, preferably -15 to 0°C, more preferably -10 to -5°C. By lowering the push-up member U, the expanded state is released. Furthermore, in the expanding step, as shown in FIGS. 5A and 5B, the dicing tape 20 is stretched to increase its area under higher temperature conditions. This separates the cut adjacent semiconductor chips in the direction of the film surface, further increasing the distance between them.
In the pick-up process, as shown in FIG. 6, the semiconductor chip to which the die bond layer 10 is attached is peeled off from the adhesive layer of the dicing tape 20. Specifically, the pin member P is raised to push up the semiconductor chip to be picked up through the dicing tape 20. The pushed up semiconductor chip is held by a suction jig J.
In the die-bonding process, the semiconductor chip with the die-bonding layer 10 attached thereon is bonded to an adherend.

Although the dicing tape and dicing die bond film of this embodiment are as illustrated above, the present invention is not limited to the dicing tape and dicing die bond film exemplified above.
That is, various forms used in general dicing tapes and dicing die-bonding films can be employed as long as the effects of the present invention are not impaired.

Next, the present invention will be explained in more detail with reference to experimental examples, but the present invention is not limited thereto.

A dicing tape was manufactured as follows. Further, a dicing die bond film was manufactured using this dicing tape.

<Raw material of acrylic polymer>
"First synthesis stage"
・C6-C11 alkyl (meth)acrylate:
Isononyl acrylate (INA)
2-ethylhexyl acrylate (2EHA)
・Hydroxyl group-containing (meth)acrylate: 2-hydroxyethyl acrylate (HEA)
・Polymerization initiator: azobisisobutyronitrile (AIBN)
・Polymerization solvent: Ethyl acetate "Second synthesis stage": Preparation of structural units of polymerizable group-containing (meth)acrylate ・Isocyanate group-containing (meth)acrylate monomer: 2-isocyanatoethyl methacrylate (product name "Karens MOI" Showa Manufactured by Denkosha)
・Urethanization reaction catalyst: dibutyltin dilaurate <raw material for dicing tape>
・Adhesive layer "Adhesive"
Acrylic polymer (each synthesized)
"Tackifier"
Terpene phenol resin Product name: Yspolyster (YS polyster series) manufactured by Yasuhara Chemical Co., Ltd. S145 (softening point 145°C),
T80 (softening point 80℃),
T145 (softening point 145°C),
T160 (softening point 160°C),
"Isocyanate compound"
Ethyl acetate solution of trimethylolpropane adduct of tolylene diisocyanate (product name "Coronate L" manufactured by Tosoh Corporation)
"Photopolymerization initiator" (product name "Omnirad127" manufactured by IGM Resins)
・Base layer: EVA film (corona treated on one side)
Product name: "Evaflex V1010" Resin (manufactured by DuPont Mitsui Chemicals) is formed into a film with a thickness of 125 μm without stretching, and the surface in contact with the adhesive layer is corona treated.・Organic solvent (to create the adhesive layer) (used when
Ethyl acetate

(Example 1)
After synthesizing an acrylic polymer intermediate, an acrylic polymer was synthesized from the acrylic polymer intermediate in the following manner. A dicing tape was manufactured by creating an adhesive layer using the synthesized acrylic polymer.
"First synthesis step: Synthesis of acrylic polymer intermediate"
A mixture was prepared by mixing the above raw materials in the amounts (parts by mass) shown in Table 1. The above mixture was placed in a polymerization experimental apparatus equipped with a 1L round-bottom separable flask equipped with a separable cover, a separating funnel, a thermometer, a nitrogen introduction tube, a Liebig condenser, a vacuum seal, a stirring rod, and a stirring blade. was introduced. While stirring, the mixture was purged with nitrogen at room temperature for 6 hours. Thereafter, the temperature was maintained at 62° C. for 3 hours while stirring while nitrogen was being introduced, and then at 75° C. for 2 hours. Thereby, a polymerization reaction was performed, and the mixture was cooled to room temperature to obtain a polymer solution (a solution containing a polymer intermediate of each acrylic polymer).
"Second synthesis stage: Synthesis of each acrylic polymer"
To the obtained polymer solution (acrylic polymer intermediate-containing solution), 2-isocyanatoethyl methacrylate (product name "Karens MOI", manufactured by Showa Denko K.K.) and dibutyltin dilaurate IV ( (manufactured by Wako Pure Chemical Industries, Ltd.) in the amounts shown in Table 1 were added, and the mixture was stirred at 50° C. for 24 hours in an air atmosphere.
"Preparation of composition for adhesive layer"
A tackifier, an isocyanate compound [Coronate L], and a photopolymerization initiator (Omnirad 127) in the amounts shown in Table 2 were mixed with 100 parts by mass of the solid content of the acrylic polymer (adhesive). A composition for an adhesive layer was prepared by adding ethyl acetate as a diluting solvent so that the solid content was 20% by mass.
"Preparation of adhesive layer"
A PET film (product name: "Diafoil MRF38" manufactured by Mitsubishi Chemical Corporation) was prepared as a release sheet. One side of this film is subjected to mold release treatment. The pressure-sensitive adhesive layer composition prepared as described above was applied to the surface of the release sheet that had been subjected to the release treatment. The applied composition was dried on a release sheet at 120° C. for 3 minutes to produce an adhesive layer with a thickness of 10 μm.
"Manufacture of dicing tape"
With the adhesive layer and release sheet overlapping, the adhesive layer was bonded to the corona-treated surface of the base layer (EVA film) to prevent air bubbles from entering. A dicing tape was produced by drying at 50° C. for 48 hours.

<Manufacture of dicing die bond film>
・Preparation of die bond layer A die bond layer was produced as follows using the following raw materials (the same material was used in the examples and comparative examples)
Acrylic resin: 100 parts by mass (Product name: "Teisan Resin SG-P3", manufactured by Nagase ChemteX)
Glass transition temperature 12℃ (contains epoxy group), epoxy value 0.21eq/kg
Epoxy resin: 79 parts by mass (product name "EPICLON HP-4700", manufactured by DIC) Naphthalene type epoxy resin, epoxy equivalent 155-170 (g/eq)
Phenol resin: 93 parts by mass (product name "H-4", manufactured by Showa Kagaku Co., Ltd.) Phenol novolak resin Spherical silica: 189 parts by mass (product name "SO-25R", manufactured by Admatex Corporation),
Curing catalyst: 0.6 parts by mass (product name "Cure Sol 2PHZ", manufactured by Shikoku Kasei Kogyo Co., Ltd.)
The above raw materials and methyl ethyl ketone were mixed to prepare a resin composition having a solid content concentration of 20% by mass. This resin composition was applied to one side of a release sheet (PET). The solvent was evaporated by heating at 150° C. for 2 minutes to produce a die bond layer with a thickness of 25 μm.

- Attaching the die-bonding layer and dicing tape The die-bonding layer that overlapped the release sheet and the adhesive layer after the release sheet of the dicing tape had been peeled off were attached to each other so that no air bubbles were introduced. The die-bonding layer was placed at the position where the wafers were to be bonded, and had a diameter 5 mm larger than the wafer size. A dicing die bond film was produced in which the adhesive layer and the die bond layer, which were bonded to each other, were placed between the base layer and the release sheet by bonding using a roller.
In this state, the sample was left for 24 hours at a temperature of 18 to 25° C., humidity of 40 to 60%, and shielded from light, and used as a test sample.

(Examples 2 to 6 , Reference Example 7)
A dicing tape and a dicing die bond film were produced in the same manner as in Example 1 using the formulations shown in Tables 1 to 3.

(Comparative example 1)
A dicing tape and a dicing die bond film were manufactured in the same manner as in Example 1 using the formulation shown in Table 3.

Tables 1 to 3 show the compounding compositions for producing dicing tapes and dicing die bond films of Examples and Comparative Examples.

<T-shaped peel strength measurement between die bond layer and adhesive layer before irradiation with active energy rays (ultraviolet rays)>
The portion where the die bond layer (DAF) and the adhesive layer were bonded was cut out to a size of 100 mm x 20 mm. After removing the release sheet, the die bond layer was attached to BT-315 using a hand roller. At the time of pasting, air bubbles were prevented from entering between the die bond layer and BT-315.
Thereafter, it was left for 30 minutes in an environment with a temperature of 23° C. and a humidity of 50% to stabilize the temperature. Peel strength (strength when the adhesive layer was peeled off from the die bond layer) was measured using a Tensilon tensile tester (AGS-J, manufactured by Shimadzu Corporation). Before measurement, one end of the test sample was slightly peeled off at the interface between the die-bond layer and the adhesive layer, and the end of the die-bond layer and the end of the adhesive layer were each held in the chuck of a tensile testing machine. . The peeling conditions were a peeling speed of 300 mm/min, a peeling angle of 180 degrees, a temperature of 23° C., and a humidity of 50%. The measurement was carried out three times, and the average value was taken as the value of T-peel strength.

<T-shaped peel strength measurement between die bond layer and adhesive layer after irradiation with active energy rays (ultraviolet rays)>
The portion where the die bond layer (DAF) and the adhesive layer were bonded together was cut out to a size of 100 mm x 30 mm. Ultraviolet rays were irradiated from the base layer side (back side of the film) under the following ultraviolet irradiation conditions. After removing the release sheet, the die bond layer was attached to BT-315 using a hand roller. At the time of pasting, air bubbles were prevented from entering between the die bond layer and BT-315.
Thereafter, it was left for 30 minutes in an environment with a temperature of 23° C. and a humidity of 50% to stabilize the temperature. Peel strength (strength when the adhesive layer was peeled off from the die bond layer) was measured using a Tensilon tensile tester (AGS-J, manufactured by Shimadzu Corporation). Before measurement, one end of the test sample was slightly peeled off at the interface between the die-bond layer and the adhesive layer, and the end of the die-bond layer and the end of the adhesive layer were each held in the chuck of a tensile testing machine. . The peeling conditions were a peeling speed of 300 mm/min, a peeling angle of 180 degrees, a temperature of 23° C., and a humidity of 50%. The measurement was carried out three times, and the average value was taken as the value of T-peel strength.

"Ultraviolet irradiation conditions"
Ultraviolet irradiation device: Product name - UM810 (manufactured by Nitto Seiki Co., Ltd.)
Light source: High-pressure mercury lamp Irradiation intensity: 50mW/cm ² (Measuring equipment: Ushio's "Ultraviolet illuminometer UT-101")
Irradiation time: 6 seconds Cumulative light intensity: 300mJ/ ^cm2

<Evaluation of floating over time>
The 25 μm thick die bond layer prepared as described above was bonded to a 12-inch bare wafer at a temperature of 60° C., a pressure of 0.3 MPa, and a speed of 10 mm/sec. Then, heat curing treatment was performed at 75° C. for 1 hour.
Next, a dicing tape was attached, and half-cut dicing was performed to a size of 10 mm x 10 mm using a dicing saw device DFD6361 (manufactured by DISCO).
Subsequently, a backgrind tape was attached and ground to a thickness of 50 μm using a grinder polisher DGP8760 (manufactured by DISCO) to obtain a warped wafer.
A sample was obtained by bonding a warped wafer and a dicing ring to a dicing die bond film, and then cutting the wafer and thermally shrinking the dicing tape using a die separator DDS2300 manufactured by DISCO.
Specifically, first, a semiconductor wafer was cut using a cool expander unit under conditions of an expansion temperature of −15° C., an expansion speed of 200 mm/sec, and an expansion amount of 12 mm. Thereafter, room temperature expansion was performed under the conditions of room temperature, expansion speed of 1 mm/sec, and expansion amount of 7 mm. Then, while maintaining the expanded state, the dicing tape on the outer periphery of the semiconductor chip was thermally shrunk at a heat temperature of 200° C., an air flow rate of 40 L/min, a heat distance of 20 mm, and a rotation speed of 5°/sec. After storing the sample in an environment of 23°C and 50% RH for 7 days, the area of the part where the die bond layer is floating from the dicing tape (semiconductor with a floating die bond layer when the area of the entire die bond layer is taken as 100%) The chip area ratio) was observed with a microscope, and the case where the area not floating was 98% or more was evaluated as ○, and the case where it was less than 98% was evaluated as ×.

<Pickup test method>
A dicing tape and a dicing ring were attached to a 12-inch bare wafer, and half-cut dicing was performed to a size of 10 mm x 10 mm using a dicing saw device DFD6361 (manufactured by DISCO). After half-cut dicing, ultraviolet rays were irradiated from the back side of the dicing tape, and the wafers with grooves formed thereon were collected.
Thereafter, a backgrind tape was attached to the surface of the wafer in which the grooves were formed, and the wafer was ground to a thickness of 30 μm using a grinder polisher DGP8760 (manufactured by DISCO) to obtain thin wafers cut into small pieces.
A thin wafer cut into small pieces and a dicing ring were attached to a dicing die-bonding film, the back grind tape was irradiated with ultraviolet rays from the back side to harden the adhesive, and the back grind tape was peeled off from the wafer and removed. Next, a cut sample was obtained by cutting the wafer and thermally shrinking the dicing tape using a die separator DDS2300 (manufactured by DISCO). Specifically, first, a semiconductor wafer was cut using a cool expander unit under conditions of an expansion temperature of −15° C., an expansion speed of 200 mm/sec, and an expansion amount of 12 mm.
Thereafter, room temperature expansion was performed at room temperature under the conditions of an expansion speed of 1 mm/sec and an expansion amount of 7 mm. Then, while maintaining the expanded state, the dicing tape on the outer periphery of the semiconductor chip was thermally shrunk under the conditions of a heat temperature of 200° C., an air flow rate of 40 L/min, a heat distance of 20 mm, and a rotation speed of 5°/sec.
Pick-up was performed using a die bonder SPA-300 (manufactured by Shinkawasha) under the following conditions. The evaluation was made with a case where the pick-up success rate was 90% or more at a pick-up height of 400 μm or less, and a x when the pick-up success rate was less than 90%.
"Pickup conditions"
Number of pins: 5
Push-up speed: 1mm/sec Pickup height: 200-1000μm
Number of pick up ratings: 50

The evaluation results are shown in Tables 4 and 5.

As understood from the above evaluation results, the dicing die bond film of the example was able to suppress the lifting of semiconductor chips during the manufacture of semiconductor integrated circuits, compared to the dicing die bond film of the comparative example. It also exhibited good pick-up properties.
On the other hand, the dicing die bond film of the comparative example in which no tackifier was blended in the adhesive layer was unable to suppress the lifting of semiconductor chips during the manufacture of semiconductor integrated circuits, and did not have good pick-up properties.
Moreover, when the amount of the tackifier in the adhesive layer was 30 parts by mass or more based on 100 parts by mass of the acrylic polymer, the pick-up properties tended to deteriorate.
It has also been shown that lifting over time can be suppressed by using a terpene phenol-based tackifier.

The dicing tape and dicing die bond film of the present invention are suitably used, for example, as auxiliary tools when manufacturing semiconductor integrated circuits.

1: Dicing die bond film,
10: die bond layer,
20: dicing tape,
21: Base material layer, 22: Adhesive layer.

Claims (4)

A dicing die bond film comprising a dicing tape having a base material layer and an adhesive layer overlapping the base material layer, and a die bond layer laminated on the adhesive layer of the dicing tape,
The adhesive layer includes an adhesive and a tackifier having a softening point of 70°C or more and 170°C or less,
The adhesive layer contains 5 parts by mass or more and 25 parts by mass or less of the tackifier based on 100 parts by mass of the adhesive,
The T-peel strength between the adhesive layer and the die-bonding layer is 1.0 (N/20 mm) or more and 3.4 (N/20 mm) or less,
The adhesive layer includes at least an acrylic polymer as the adhesive, an isocyanate compound, and a photopolymerization initiator,
The T-peel strength between the adhesive layer and the die-bonding layer satisfies the following formula (1),
0.04≦T-type peel strength after active energy ray irradiation/T-type peel strength before active energy ray irradiation≦0.10 (1)
The acrylic polymer is composed of a C6 to C11 alkyl (meth)acrylate constitutional unit, a hydroxyl group-containing (meth)acrylate constitutional unit, and a polymerizable group-containing (meth)acrylate constitutional unit. film. The acrylic polymer contains at least one of isononyl (meth)acrylate structural units and 2-ethylhexyl (meth)acrylate structural units as the C6 to C11 alkyl (meth)acrylate structural units. The dicing die bond film described. The dicing die bond film according to claim 1 or 2 , wherein the die bond layer contains at least one of a thermosetting resin and a thermoplastic resin, and a filler. The dicing die bond film according to any one of claims 1 to 3 , wherein the adhesive layer contains a terpene phenol resin as the tackifier.