KR20200136824A - Dicing tape and dicing die-bonding film - Google Patents

Abstract

The present invention relates to a dicing tape capable of improving pick-up properties and, more specifically, to a dicing tape comprising: a substrate layer; and an adhesive layer overlapping the substrate layer, wherein the adhesive layer includes an acrylic polymer, the acrylic polymer includes a constitutional unit of C9 to C11 alkyl (meth)acrylate and a constitutional unit of a hydroxyl group-containing (meth)acrylate, and the acrylic polymer contains 40 mol% or more and 85 mol% or less of the constitutional unit of the C9 to C11 alkyl (meth)acrylate.

Description

A dicing tape and a dicing die-bonding film TECHNICAL FIELD [DICING TAPE AND DICING DIE-BONDING FILM]

The present invention relates to, for example, a dicing tape used when manufacturing a semiconductor integrated circuit, and a dicing die-bonding film provided with the dicing tape.

Conventionally, a dicing die bonding film used in the manufacture of a semiconductor integrated circuit is known. This kind of dicing die-bonding film includes, for example, a dicing tape and a die-bonding layer laminated on the dicing tape and adhered to the wafer. The dicing tape has a base material layer and an adhesive layer in contact with the die bonding layer. This kind of dicing die-bonding film is used, for example, in the following manner in the manufacture of a semiconductor integrated circuit.

A method of manufacturing a semiconductor integrated circuit generally includes a pre-process of forming a circuit surface on one side of a silicon wafer with a highly integrated electronic circuit, and a post-process of assembling by cutting a chip from a wafer having a circuit surface formed thereon. .

Post-processes include, for example, a mounting process in which the side opposite to the circuit surface of the wafer is affixed to the die-bonding layer to fix the wafer to the dicing tape, and the semiconductor wafer affixed to the dicing tape through the die-bonding layer. A dicing process in which small chips (die) are processed by a cutting process, an expand process in which the gap between small-processed semiconductor chips is widened, and a die-bonding layer is affixed by peeling between the die-bonding layer and the pressure-sensitive adhesive layer A pick-up step of taking out a semiconductor chip (die) from the device and a die bonding step of adhering the semiconductor chip (die) in a state in which the die bonding layer is affixed to the adherend are provided. The semiconductor integrated circuit is manufactured through these processes.

In the pickup step of the above manufacturing method, the cut semiconductor chip is pushed up from the lower side of the dicing tape by a pin member of the pickup mechanism together with a die-bonding layer having a chip equivalent size in close contact therewith, and dicing. Picked up from the tape.

By the way, in recent years, as semiconductor products become thinner and more integrated, the thickness of semiconductor wafers has become thinner than before. When such a semiconductor wafer is used, the problem that the semiconductor wafer is deformed and damaged due to the pushing in the pickup step is more likely to occur. In order to prevent such breakage, the dicing tape is required to have a performance capable of good peeling from the die-bonding film even with a small push-up amount after being cut, that is, good pick-up properties.

On the other hand, as a conventional dicing die-bonding film, it is known that, for example, a pressure-sensitive adhesive layer formed of a pressure-sensitive adhesive composition containing a base polymer and a thermal crosslinking agent is provided (Patent Document 1).

In the dicing die-bonding film described in Patent Document 1, the pressure-sensitive adhesive layer is a layer in which the gel fraction before heating is less than 90% by mass, and the gel fraction after heating is changed to 90% by mass or more. The pressure-sensitive adhesive layer having a gel fraction of 90% by mass or more by heating can be easily peeled off from the die-bonding layer.

Japanese Patent Laid-Open No. 2010-278427

However, it cannot be said that a dicing die-bonding film and a dicing tape capable of improving the above-described pickup properties have been sufficiently studied.

Therefore, it is an object of the present invention to provide a dicing tape capable of improving pickup properties and a dicing die-bonding film capable of improving pickup properties.

In order to solve the above problems, the dicing tape according to the present invention,

It is a dicing tape provided with a base material layer and an adhesive layer superimposed on the base material layer,

The pressure-sensitive adhesive layer contains an acrylic polymer,

The acrylic polymer includes a constitutional unit of C9 to C11 alkyl (meth)acrylate and a constitutional unit of a hydroxyl group-containing (meth)acrylate,

The acrylic polymer is characterized in that it contains 40 mol% or more and 85 mol% or less of the constitutional unit of the C9 to C11 alkyl (meth)acrylate,

According to the dicing tape of the above structure, good pick-up properties can be exhibited.

In the dicing tape according to the present invention, it is preferable that the acrylic polymer contains 1 mol% or more and 30 mol% or less of the structural unit of the hydroxyl group-containing (meth)acrylate. Thereby, more favorable pick-up properties can be exhibited.

In the dicing tape according to the present invention, the constitutional unit of the hydroxyl group-containing (meth)acrylate is preferably a constitutional unit of a hydroxyl group-containing C2 to C4 alkyl (meth)acrylate. Thereby, more favorable pick-up properties can be exhibited.

In the dicing tape according to the present invention, it is preferable that the acrylic polymer further has a structural unit of a polymerizable group-containing (meth)acrylate. Thereby, more favorable pick-up properties can be exhibited.

In the dicing tape according to the present invention, the acrylic polymer comprises the polymerizable group with respect to the structural unit (B) of the hydroxyl group-containing (meth)acrylate and the structural unit (C) of the polymerizable group-containing (meth)acrylate. It is preferable to contain the structural unit (C) of the containing (meth)acrylate in a molar ratio [C/(B+C)], 0.50 or more and 0.95 or less. Thereby, more favorable pick-up properties can be exhibited.

A dicing die-bonding film according to the present invention includes the dicing tape and a die-bonding layer laminated on the pressure-sensitive adhesive layer of the dicing tape.

The dicing tape and the dicing die-bonding film according to the present invention exhibit an effect that the pick-up property can be improved.

1 is a cross-sectional view taken along a thickness direction of a dicing die-bonding film of this embodiment.
Fig. 2A is a cross-sectional view schematically showing a state of half-cut processing in a method for manufacturing a semiconductor integrated circuit.
2B is a cross-sectional view schematically showing a state of half-cut processing in a method for manufacturing a semiconductor integrated circuit.
Fig. 2C is a cross-sectional view schematically showing a state of half-cut processing in a method for manufacturing a semiconductor integrated circuit.
2D is a cross-sectional view schematically showing a state of half-cut processing in a method for manufacturing a semiconductor integrated circuit.
3A is a cross-sectional view schematically showing a state of a mounting step in a method for manufacturing a semiconductor integrated circuit.
3B is a cross-sectional view schematically showing a state of a mounting process in a method for manufacturing a semiconductor integrated circuit.
4A is a cross-sectional view schematically showing a state of an expand process at a low temperature in a method for manufacturing a semiconductor integrated circuit.
4B is a cross-sectional view schematically showing a state of an expand process at a low temperature in a method for manufacturing a semiconductor integrated circuit.
4C is a cross-sectional view schematically showing a state of an expand process at a low temperature in a method for manufacturing a semiconductor integrated circuit.
5A is a cross-sectional view schematically showing a state of an expand process at room temperature in a method for manufacturing a semiconductor integrated circuit.
5B is a cross-sectional view schematically showing a state of an expand process at room temperature in a method for manufacturing a semiconductor integrated circuit.
Fig. 6 is a cross-sectional view schematically showing a state of a pickup step in a method for manufacturing a semiconductor integrated circuit.

Hereinafter, an embodiment of a dicing die-bonding film and a dicing tape according to the present invention will be described with reference to the drawings.

The dicing die-bonding film 1 of this embodiment is laminated on the dicing tape 20 and the pressure-sensitive adhesive layer 22 of the dicing tape 20 as shown in FIG. It has a die bond layer 10 to be bonded.

The dicing tape 20 of this embodiment is usually a long sheet, and is stored in a wound state until use. The dicing die-bonding film 1 of the present embodiment is attached to an annular frame having an inner diameter that is one dimension larger than that of a silicon wafer to be cut, and then used.

The dicing tape 20 of the present embodiment includes a base layer 21 and a pressure-sensitive adhesive layer 22 overlaid on the base layer 21. The pressure-sensitive adhesive layer 22 contains at least an acrylic polymer.

The acrylic polymer has at least a structural unit of a C9 to C11 alkyl (meth)acrylate and a structural unit of a hydroxyl group-containing (meth)acrylate in a molecule.

In addition, in this specification, the notation "(meth)acrylate" represents at least one of methacrylate (methacrylic acid ester) and acrylate (acrylic acid ester). Similarly, the notation "(meth)acrylic acid" represents at least one of methacrylic acid and acrylic acid.

In this embodiment, the pressure-sensitive adhesive layer 22 contains, for example, the acrylic polymer, an isocyanate compound (crosslinking agent), and a polymerization initiator.

The pressure-sensitive adhesive layer 22 preferably has a thickness of 3 μm or more and 200 μm or less. When the thickness of the pressure-sensitive adhesive layer 22 is 3 μm or more, the adhesive strength to the die-bonding layer 10 can be improved. When the thickness of the pressure-sensitive adhesive layer 22 is 200 µm or less, the handling property of the dicing tape 20 becomes better. The shape and size of the pressure-sensitive adhesive layer 22 are usually the same as the shape and size of the base layer 21.

In the present embodiment, the acrylic polymer is composed of a structural unit of a C9 to C11 alkyl (meth)acrylate, a structural unit of a hydroxyl group-containing (meth)acrylate, and a structural unit of a polymerizable group-containing (meth)acrylate. Consists of. In addition, the structural unit is a unit constituting the main chain of the acrylic polymer. Each side chain in the said acrylic polymer is contained in each structural unit which comprises a main chain.

In the acrylic polymer contained in the pressure-sensitive adhesive layer 22, the structural unit can be confirmed by NMR analysis such as ¹ H-NMR and ¹³ C-NMR, thermal decomposition GC/MS analysis, and infrared spectroscopy. In addition, the molar ratio of the structural units in the acrylic polymer is usually calculated from the blending amount (input amount) when the acrylic polymer is polymerized.

The constituent unit of C9 to C11 alkyl (meth)acrylate is derived from a C9 to C11 alkyl (meth)acrylate monomer. In other words, the molecular structure after the polymerization reaction of the C9 to C11 alkyl (meth)acrylate monomer is a constitutional unit of the C9 to C11 alkyl (meth)acrylate. Specifically, the bond generated by the polymerization reaction of the C9 to C11 alkyl (meth)acrylate monomer constitutes a part of the main chain of the acrylic polymer. The notation "C9 to C11 alkyl" represents the number of carbon atoms in the hydrocarbon portion ester bonded to (meth)acrylic acid. In other words, the C9 to C11 alkyl (meth)acrylate monomer represents a monomer obtained by ester bonding of (meth)acrylic acid and an alcohol having 9 to 11 carbon atoms (usually a monohydric alcohol).

The hydrocarbon moiety of C9 to C11 alkyl may be a saturated hydrocarbon or an unsaturated hydrocarbon. For example, the hydrocarbon moiety of C9 to C11 alkyl is a linear saturated hydrocarbon, a branched saturated hydrocarbon, an alicyclic hydrocarbon, or an aromatic hydrocarbon. Such a hydrocarbon moiety is preferably a linear saturated hydrocarbon or a branched saturated hydrocarbon, and more preferably a branched saturated hydrocarbon.

In addition, it is preferable that the hydrocarbon moiety of C9 to C11 alkyl does not contain a polar group containing oxygen (O) or nitrogen (N). Thereby, it is possible to suppress an extremely high polarity of the alkyl polymer. Therefore, it is suppressed that the pressure-sensitive adhesive layer 22 has excessive affinity for the die-bonding layer 10. Therefore, the dicing tape 20 can be peeled more favorably from the die bonding layer 10.

As a structural unit of C9 to C11 alkyl (meth)acrylate, for example, n-nonyl (meth)acrylate, iso(sec)-nonyl (meth)acrylate, tert-nonyl (meth)acrylate, isobornyl (Meth)acrylate, n-decyl(meth)acrylate, iso(sec)-decyl(meth)acrylate, tert-decyl(meth)acrylate, n-undecyl(meth)acrylate, iso(sec) -Each structural unit, such as undecyl (meth)acrylate and tert-undecyl (meth)acrylate, is mentioned.

As the structural unit of C9 to C11 alkyl (meth)acrylate, at least one of the structural units of nonyl (meth)acrylate and the structural units of decyl acrylate is preferable, and the structural units of isononyl (meth)acrylate and isodecyl At least one of the structural units of (meth)acrylate is more preferable.

In the alkyl (meth)acrylate constituent unit, when the number of carbon atoms in the hydrocarbon portion is 8 or less, the affinity between the pressure-sensitive adhesive layer 22 and the die-bonding layer 10 becomes excessively high, and thus the dicing tape 20 is die-bonded. There is a fear that it becomes difficult to peel off from the layer 10. In addition, if the number of carbon atoms in the hydrocarbon portion is 12 or more, the affinity between the pressure-sensitive adhesive layer 22 and the die-bonding layer 10 is excessively deteriorated, so that in the method for manufacturing a semiconductor integrated circuit (described in detail later), the dicing tape 20 ) May unintentionally peel off from the die-bonding layer 10. In particular, the number of carbon atoms in the hydrocarbon moiety is preferably 9 or 10.

The acrylic polymer contains 40 mol% or more and 85 mol% or less of a structural unit of C9 to C11 alkyl (meth)acrylate (hereinafter, simply referred to as component A) in a molecule.

Since the said acrylic polymer contains 40 mol% or more and 85 mol% or less of structural units of C9-C11 alkyl (meth)acrylate, favorable pick-up property can be exhibited.

It is more preferable that the said acrylic polymer contains 45 mol% or more of structural units of C9-C11 alkyl (meth)acrylate. Moreover, it is more preferable to contain 80 mol% or less.

The mol% is a value based on a monomer constituting the main chain of the acrylic polymer. Specifically, at the time of polymerization of the acrylic polymer, the polymerization initiator or chain transfer agent incorporated in the main chain is not considered in the above mol%. Hereinafter, it is the same in the specification.

In other words, the acrylic polymer has a main chain in which the unsaturated double bond portion of the (meth)acryloyl group in the (meth)acrylate monomer before polymerization is linked by polymerization. The mol% is a molar percentage with respect to the total number of moles of (meth)acrylate monomers constituting the main chain by polymerization. In addition, the molecular structure in the side chain of the acrylic polymer is not considered in the mol%.

The acrylic polymer has a structural unit of a hydroxyl group-containing (meth)acrylate, and the hydroxyl group of such a structural unit reacts easily with an isocyanate group.

An acrylic polymer having a structural unit of a hydroxyl-containing (meth)acrylate and an isocyanate compound are allowed to coexist in the pressure-sensitive adhesive layer 22, whereby the pressure-sensitive adhesive layer can be appropriately polymerized. Therefore, the acrylic polymer can sufficiently gel. Therefore, the adhesive layer 22 can exhibit adhesive performance while maintaining the shape.

The structural unit of a hydroxyl-containing (meth)acrylate is derived from a hydroxyl-containing (meth)acrylate monomer. In other words, the molecular structure after the polymerization reaction of the hydroxyl group-containing (meth)acrylate monomer is a structural unit of the hydroxyl group-containing (meth)acrylate. Specifically, the bond generated by the polymerization reaction of the hydroxyl group-containing (meth)acrylate monomer constitutes a part of the main chain of the acrylic polymer.

It is preferable that the structural unit of a hydroxyl-containing (meth)acrylate is a structural unit of a hydroxyl-containing C2-C4 alkyl (meth)acrylate. The notation "C2 to C4 alkyl" represents the number of carbon atoms in the hydrocarbon portion ester bonded to (meth)acrylic acid. In other words, the hydroxyl group-containing C2 to C4 alkyl (meth)acrylate monomer represents a monomer obtained by ester bonding of (meth)acrylic acid and an alcohol having 2 to 4 carbon atoms (usually a dihydric alcohol).

The hydrocarbon moiety of C2 to C4 alkyl is usually a saturated hydrocarbon. For example, the hydrocarbon moiety of C2 to C4 alkyl is a straight chain saturated hydrocarbon or a branched chain saturated hydrocarbon. It is preferable that the hydrocarbon moiety of C2 to C4 alkyl does not contain a polar group containing oxygen (O) or nitrogen (N).

In addition, in the structural unit of the hydroxyl group-containing (meth)acrylate, the hydroxyl group (-OH group) may be bonded to any carbon (C) of the hydrocarbon moiety. It is preferable that the hydroxyl group (-OH group) is bonded to the terminal carbon (C) of the hydrocarbon moiety.

As a structural unit of a hydroxyl-containing C2 to C4 alkyl (meth)acrylate, for example, hydroxyethyl (meth)acrylate, hydroxypropyl (meth)acrylate, hydroxy n-butyl (meth)acrylate, or hydroxy Each structural unit of hydroxybutyl (meth)acrylate such as oxy iso-butyl (meth)acrylate can be mentioned. In addition, in the constituent unit of hydroxybutyl (meth)acrylate, the hydroxyl group (-OH group) may be bonded to the terminal carbon (C) of the hydrocarbon portion, or bonded to carbon (C) other than the terminal of the hydrocarbon portion. It may be.

The structural unit of the hydroxyl group-containing C2 to C4 alkyl (meth)acrylate is not particularly limited, but may be, for example, at least one of hydroxyethyl (meth)acrylate and hydroxybutyl (meth)acrylate. , More specifically, it may be a structural unit of at least any one of 2-hydroxyethyl (meth)acrylate and 4-hydroxybutyl (meth)acrylate.

It is preferable that the acrylic polymer contains 1 mol% or more and 30 mol% or less of a structural unit of a hydroxyl group-containing (meth)acrylate (hereinafter, simply referred to as component B) in a molecule.

By containing 1 mol% or more of the structural unit of a hydroxyl-containing (meth)acrylate, the hydroxyl group which can crosslink reaction with an isocyanate compound (crosslinking agent) is comparatively large. Therefore, the acrylic polymer can sufficiently gel by crosslinking. As a result, the fluidity of the pressure-sensitive adhesive layer 22 is suppressed. Therefore, the adhesive layer 22 can exhibit adhesive performance while maintaining the shape. Therefore, the adhesive force (before the pickup process) of the pressure-sensitive adhesive layer 22 before irradiation with active energy rays (such as ultraviolet rays) can be exhibited satisfactorily.

It is more preferable that an acrylic polymer contains 1.5 mol% or more of structural units of a hydroxyl group-containing (meth)acrylate, and it is still more preferable to contain 2.0 mol% or more.

Further, by containing 30 mol% or less of the structural unit of the hydroxyl group-containing (meth)acrylate, the polarity of the pressure-sensitive adhesive layer 22 is suppressed to be relatively low. Therefore, the polar interaction between the pressure-sensitive adhesive layer 22 and the die-bonding layer 10 is suppressed, and the dicing tape 20 can be peeled more favorably from the die-bonding layer 10. Therefore, after irradiating an active energy ray (ultraviolet ray, etc.), it is possible to exhibit better pick-up properties.

The acrylic polymer more preferably contains 20 mol% or less of the structural unit of a hydroxyl group-containing (meth)acrylate, still more preferably 17.5 mol% or less, and particularly preferably 10 mol% or less.

In the present embodiment, the acrylic polymer further includes a structural unit of a polymerizable group-containing (meth)acrylate, as described above. In other words, the acrylic polymer contains a structural unit of a polymerizable group-containing (meth)acrylate having a polymerizable unsaturated double bond in the side chain.

Since the acrylic polymer contains a structural unit of a polymerizable group-containing (meth)acrylate, the pressure-sensitive adhesive layer 22 can be cured by irradiation with active energy rays (ultraviolet rays or the like) before the pickup step. Specifically, radicals are generated from the photopolymerization initiator by irradiation with active energy rays such as ultraviolet rays, and the acrylic polymers can be crosslinked by the action of the radicals. Thereby, the adhesive force of the pressure-sensitive adhesive layer 22 can be reduced after irradiation rather than before irradiation. In addition, there is an advantage that the die-bonding layer 10 can be removed from the pressure-sensitive adhesive layer 22 satisfactorily, and a better pick-up property can be exhibited.

In addition, ultraviolet rays, radiation, and electron beams are employed as active energy rays.

The structural unit of the polymerizable group-containing (meth)acrylate can be formed by bonding a monomer having a functional group capable of binding to a hydroxyl group and a polymerizable group in a molecule to the structural unit of the hydroxyl group-containing (meth)acrylate. The functional group may be an isocyanate group having high reactivity with a hydroxyl group. In other words, the monomer may have an isocyanate group and a vinyl group at both ends of the molecule, respectively. The vinyl group may be a part of the (meth)acryloyl group, for example.

Specifically, the structural unit of the polymerizable group-containing (meth)acrylate is a molecule in which the isocyanate group of the isocyanate group-containing (meth)acrylate monomer is urethane-bonded to the hydroxyl group in the structural unit of the hydroxyl group-containing (meth)acrylate described above. You may have a structure. In other words, the structural unit of the polymerizable group-containing (meth)acrylate is a molecular structure derived from the structural unit of the hydroxyl-containing (meth)acrylate, and the polymerizable group ((meth)acryloyl group) is formed through a urethane bond derived from a hydroxyl group. It may have a bonded molecular structure.

The structural unit of the polymerizable group-containing (meth)acrylate having a polymerizable group can be prepared after polymerization of the acrylic polymer. For example, after copolymerization of a C9 to C11 alkyl (meth)acrylate monomer with a hydroxyl group-containing (meth)acrylate monomer, a hydroxyl group in a part of the constituent unit of a hydroxyl group-containing (meth)acrylate and an isocyanate group are contained. By urethanizing the isocyanate group of the polymerizable monomer, the structural unit of the polymerizable group-containing (meth)acrylate can be obtained.

It is preferable that the said isocyanate group-containing (meth)acrylate monomer has 1 isocyanate group in a molecule|numerator, and also has 1 (meth)acryloyl group. As such a monomer, 2-isocyanatoethyl (meth)acrylate is mentioned, for example.

The acrylic polymer preferably contains 7.0 mol% or more of the constituent unit of the polymerizable group-containing (meth)acrylate (hereinafter, simply referred to as C component) in the molecule, more preferably 7.5 mol% or more. It is preferable, and it is more preferable to contain 13.5 mol% or more. Moreover, it is preferable to contain C component 60 mol% or less, it is more preferable to contain 54 mol% or less, and it is still more preferable to contain 52 mol% or less.

It is preferable that the said acrylic polymer contains 15 mol% or more and 60 mol% or less of structural units of a hydroxyl group-containing (meth)acrylate and a polymerizable group-containing (meth)acrylate in a molecule|numerator.

The acrylic polymer is a structural unit (A) of a C9 to C11 alkyl (meth)acrylate with respect to the structural unit (B) of a hydroxyl group-containing (meth)acrylate and a structural unit (C) of a polymerizable group-containing (meth)acrylate. ), as a molar ratio [A/(B+C)], is preferably 0.5 or more and 6.0 or less.

When the ratio [A/(B+C)] is 0.5 or more, it is possible to suppress excessive curing of the pressure-sensitive adhesive layer 22 after irradiation with an active energy ray (described in detail later). Accordingly, when the chipped semiconductor chip and the die-bonding layer 10 having a chip equivalent size in close contact with the chipped semiconductor chip are peeled from the dicing tape 20, the pressure-sensitive adhesive layer 22 is relatively easily deformed. Thereby, the peeling angle becomes more sufficient, and as a result, it can peel more favorably. Further, since the ratio [A/(B+C)] is 6.0 or less, the pressure-sensitive adhesive layer 22 is cured and contracted more favorably after irradiation with active energy rays. Therefore, the peeling force of the pressure-sensitive adhesive layer 22 with respect to the die-bonding layer 10 decreases more favorably after irradiation.

The ratio [A/(B+C)] is more preferably 0.6 or more, further preferably 0.67 or more, and particularly preferably 0.7 or more.

The ratio [A/(B+C)] is more preferably 5.67 or less, still more preferably 5.5 or less, and particularly preferably 5.0 or less.

The acrylic polymer is a structural unit of a hydroxyl group-containing (meth)acrylate, (B) and a structural unit (C) of a polymerizable group-containing (meth)acrylate, a structural unit of a hydroxyl-containing (meth)acrylate (B) It is preferable to include 0.05 or more and 0.50 or less as a molar ratio [B/(B+C)].

The ratio [B/(B+C)] is more preferably 0.06 or more, and even more preferably 0.07 or more.

The ratio [B/(B+C)] is more preferably 0.40 or less, and still more preferably 0.20 or less.

The acrylic polymer is a structural unit (C) of a polymerizable group-containing (meth)acrylate with respect to the structural unit (B) and the structural unit (C) of a polymerizable group-containing (meth)acrylate. ), as a molar ratio [C/(B+C)], is preferably 0.50 or more and 0.95 or less.

When the ratio [C/(B+C)] is 0.50 or more, the pressure-sensitive adhesive layer 22 can be more sufficiently cured and contracted by a polymerization reaction accompanying irradiation such as ultraviolet rays. Therefore, the peeling force when peeling the die-bonding layer 10 from the pressure-sensitive adhesive layer 22 can be more sufficiently reduced. Further, when the ratio [C/(B+C)] is 0.95 or less, the hydroxyl groups that can react with the isocyanate compound (crosslinking agent) are relatively large. Therefore, acrylic polymers can crosslink and gelatinize more sufficiently. As a result, the fluidity of the pressure-sensitive adhesive layer 22 is suppressed, and the pressure-sensitive adhesive layer 22 can exhibit adhesive performance while maintaining its shape.

The ratio [C/(B+C)] is more preferably 0.60 or more, and even more preferably 0.80 or more.

The ratio [C/(B+C)] is more preferably 0.95 or less, still more preferably 0.94 or less, and particularly preferably 0.93 or less.

The acrylic polymer has a molar ratio (B/A) of 0.01 or more and 0.80 or less in terms of the constituent unit (B) of a hydroxyl group-containing (meth)acrylate with respect to the constitutional unit (A) of a C9 to C11 alkyl (meth)acrylate. It is preferable to include.

When the ratio (B/A) is 0.01 or more, the hydroxyl groups that can react with the isocyanate compound (crosslinking agent) are relatively large. Therefore, acrylic polymers can crosslink and gelatinize more sufficiently. As a result, the fluidity of the pressure-sensitive adhesive layer 22 is suppressed, and the pressure-sensitive adhesive layer 22 can exhibit adhesive performance while maintaining its shape.

When the ratio (B/A) is 0.08 or less, the polarity of the pressure-sensitive adhesive layer 22 is suppressed to be relatively low. Therefore, the polar interaction between the pressure-sensitive adhesive layer 22 and the die-bonding layer 10 is suppressed, and the dicing tape 20 can be peeled more favorably from the die-bonding layer 10.

The ratio (B/A) is more preferably 0.02 or more, and even more preferably 0.03 or more.

The ratio (B/A) is more preferably 0.75 or less, and still more preferably 0.70 or less.

In the acrylic polymer, the constituent unit (C) of the polymerizable group-containing (meth)acrylate with respect to the constituent unit (A) of C9 to C11 alkyl (meth)acrylate, in a molar ratio (C/A), of 0.08 or more and 1.40 It is preferable to include below.

When the ratio (C/A) is 0.08 or more, the pressure-sensitive adhesive layer 22 can be more sufficiently cured and contracted by irradiation with ultraviolet rays, and the die-bonding layer can be more preferably peeled off from the dicing tape 20. have. In addition, when the ratio (C/A) is 1.40 or less, it is possible to suppress excessive curing and shrinking of the pressure-sensitive adhesive layer 22 by irradiation such as ultraviolet rays. In addition, when the pressure-sensitive adhesive layer 22 suppresses excessive curing shrinkage, when the cut semiconductor chip and the die-bonding layer having a chip equivalent size in close contact with it are peeled from the dicing tape 20, the pressure-sensitive adhesive layer 22 ) Can be transformed relatively easily. Thereby, the peeling angle becomes more sufficient, and as a result, it can peel more favorably.

The ratio (C/A) is more preferably 0.09 or more, still more preferably 0.10 or more, and particularly preferably 0.20 or more.

The ratio (C/A) is more preferably 1.35 or less, still more preferably 1.30 or less, and particularly preferably 1.20 or less.

The acrylic polymer contains 0.9 or more and 18.0 or less in a molar ratio (C/B) of the structural unit (C) of the polymerizable group-containing (meth) acrylate with respect to the structural unit (B) of the hydroxyl group-containing (meth)acrylate. It is desirable to do.

When the ratio (C/B) is 0.9 or more, the pressure-sensitive adhesive layer 22 can be more sufficiently cured and contracted by irradiation such as ultraviolet rays, and the adhesive strength after irradiation of the pressure-sensitive adhesive layer 22 can be more sufficiently reduced. . Therefore, the die bonding layer can be peeled off from the dicing tape 20 more favorably.

When the ratio (C/B) is 18.0 or less, the hydroxyl groups capable of crosslinking reaction with the isocyanate compound (crosslinking agent) relatively increase. Therefore, the acrylic polymer can sufficiently gel by crosslinking. As a result, the fluidity of the pressure-sensitive adhesive layer 22 is suppressed. Therefore, the adhesive layer 22 can exhibit adhesive performance while maintaining the shape.

The ratio (C/B) is more preferably 0.95 or more, and still more preferably 1.0 or more.

The ratio (C/B) is more preferably 17.5 or less, still more preferably 17.33 or less, and particularly preferably 17.0 or less.

In a preferred embodiment, the acrylic polymer includes a structural unit of isononyl (meth)acrylate, a structural unit of a hydroxyl group-containing (meth)acrylate, and a structural unit of a polymerizable group-containing (meth)acrylate, The structural unit of the containing (meth)acrylate is at least one of a structural unit of hydroxyethyl (meth)acrylate or a structural unit of hydroxybutyl (meth)acrylate.

In a more preferred form, the constituent unit of the polymerizable group-containing (meth)acrylate has a urethane bond in which a hydroxyl group of a portion of the constituent unit of the hydroxyl group-containing (meth)acrylate has a urethanization reaction, and is embedded through the urethane bond. It further has a (meth)acryloyl group as a polymerizable group.

The dicing tape 20 of this embodiment is provided with the adhesive layer 22 containing the said acrylic polymer. The pressure-sensitive adhesive layer 22 further contains an isocyanate compound (crosslinking agent). Some of the isocyanate compounds may be in a state after reacting by a urethanization reaction or the like.

An isocyanate compound has a plurality of isocyanate groups in a molecule. When the isocyanate compound has a plurality of isocyanate groups in the molecule, the crosslinking reaction between the acrylic polymers in the pressure-sensitive adhesive layer 22 can be advanced. Specifically, by making one isocyanate group of an isocyanate compound react with the hydroxyl group of an acrylic polymer, and making the other isocyanate group react with the hydroxyl group of another acrylic polymer, the crosslinking reaction through an isocyanate compound can be advanced.

As an isocyanate compound, diisocyanate, such as an aliphatic diisocyanate, an alicyclic diisocyanate, or an aromatic aliphatic diisocyanate, is mentioned, for example.

Examples of aliphatic diisocyanates include ethylene diisocyanate, tetramethylene diisocyanate, hexamethylene diisocyanate, 2,4,4- or 2,2,4-trimethylhexamethylene diisocyanate, and 2,6-diisocyanate diisocyanate. Methyl, etc. are mentioned.

As alicyclic diisocyanate, for example, 3-isocyanatomethyl-3,5,5-trimethylcyclohexane, 1,3-or 1,4-bis(isocyanatomethyl)cyclohexane, methylcyclohexane-2 ,4-or 2,6-diisocyanate, dicyclohexylmethane-4,4'-diisocyanate, 1,3-or 1,4-diisocyanatocyclohexane, etc. are mentioned.

As aromatic diisocyanate, for example, m- or p-phenylene diisocyanate, diphenylmethane-4,4'-diisocyanate, 2,4- or 2,6-tolylene diisocyanate, 1,3'-or 1, 4-bis(isocyanatomethyl)benzene, 1,3-or 1,4-bis(α-isocyanato isopropyl)benzene, etc. are mentioned.

Moreover, as an isocyanate compound, triisocyanate is mentioned. As triisocyanate, for example, triphenylmethane-4,4',4"-triisocyanate, 1,3,5-triisocyanatobenzene, 1,3,5-tris(isocyanatomethyl)cyclohexane, 1 , 3,5-tris(isocyanatomethyl)benzene, 2,6-diisocyanatocaproic acid-2-isocyanatoethyl, etc. are mentioned.

Further, examples of the isocyanate compound include polymerized polyisocyanates such as dimers and trimers of diisocyanates, and polymethylene polyphenylene polyisocyanates.

Moreover, as an isocyanate compound, the polyisocyanate which made the excess amount of the above-mentioned isocyanate compound and an active hydrogen-containing compound react is mentioned, for example. Examples of the active hydrogen-containing compound include active hydrogen-containing low molecular weight compounds and active hydrogen-containing high molecular weight compounds.

Examples of active hydrogen-containing low molecular weight compounds include ethylene glycol, propylene glycol, dipropylene glycol, diethylene glycol, triethylene glycol, 2,2,4-trimethyl-1,3-pentanediol, neopentyl glycol, and hexanediol. , Cyclohexanedimethanol, cyclohexanediol, hydrogenated bisphenol A, xylylene glycol, glycerin, trimethylolethane, trimethylolpropane, hexanetriol, pentaerythritol, sorbitol, sorbit, sucrose, castor oil, ethylene Diamine, hexamethylenediamine, diethanolamine, triethanolamine, water, ammonia, urea, and the like. Examples of the active hydrogen-containing high molecular weight compound include various polyether polyols, polyester polyols, polyurethane polyols, acrylic polyols, and epoxy polyols. And the like.

Moreover, as an isocyanate compound, allophanated polyisocyanate, biuret-type polyisocyanate, etc. can also be used.

These isocyanate compounds can be used alone or in combination of two or more.

As the isocyanate compound, a reaction product of an aromatic diisocyanate and a low molecular weight compound containing active hydrogen is preferable. Since the reaction rate of the reaction product of the aromatic diisocyanate group is relatively slow, the pressure-sensitive adhesive layer 22 containing such a reaction product is suppressed from excessively curing. As the isocyanate compound, it is preferable to have 3 or more isocyanate groups in the molecule.

The polymerization initiator contained in the pressure-sensitive adhesive layer 22 is a compound capable of initiating a polymerization reaction by applied heat or energy of light. When the pressure-sensitive adhesive layer 22 contains a polymerization initiator, when heat energy or light energy is applied to the pressure-sensitive adhesive layer 22, a crosslinking reaction between acrylic polymers can be promoted. Specifically, between acrylic polymers having a structural unit of a polymerizable group-containing (meth)acrylate, the polymerization reaction between polymerizable groups can be initiated to cure the pressure-sensitive adhesive layer 22. Thereby, as described above, better pickup properties can be exhibited.

As a polymerization initiator, a photoinitiator, a thermal polymerization initiator, etc. are adopted, for example. As the polymerization initiator, a general commercial product can be used.

The pressure-sensitive adhesive layer 22 may further contain other components other than the above-described components. Examples of other components include tackifiers, plasticizers, fillers, anti-aging agents, antioxidants, ultraviolet absorbers, light stabilizers, heat stabilizers, antistatic agents, surfactants, light peeling agents, and the like. The type and amount of other ingredients may be appropriately selected depending on the purpose.

The dicing tape 20 of this embodiment is provided with the adhesive layer 22 and the base material layer 21 bonded together. The base material layer 21 is, for example, a metal foil, a fiber sheet such as paper or cloth, a rubber sheet, or a resin film. The base material layer 21 may have a laminated structure.

Paper, woven fabric, nonwoven fabric, etc. are mentioned as a fiber sheet which comprises the base material layer 21.

Examples of the material of the resin film include polyolefins such as polyethylene (PE), polypropylene (PP), and ethylene-propylene copolymer; Ethylene copolymers such as ethylene-vinyl acetate copolymer (EVA), ionomer resin, ethylene-(meth)acrylic acid copolymer, and ethylene-(meth)acrylic acid ester (random, alternating) copolymer; Polyesters such as polyethylene terephthalate (PET), polyethylene naphthalate (PEN), and polybutylene terephthalate (PBT); Polyacrylate; Polyvinyl chloride (PVC); Polyurethane; Polycarbonate; Polyphenylene sulfide (PPS); Polyamides such as aliphatic polyamide and wholly aromatic polyamide (aramid); Polyetheretherketone (PEEK); Polyimide; Polyetherimide; Polyvinylidene chloride; ABS (acrylonitrile-butadiene-styrene copolymer); Cellulose or cellulose derivatives; Silicone-containing polymer; And fluorine-containing polymers. These may be used alone or in combination of two or more.

When the base material layer 21 has a resin film, the resin film may be subjected to stretching treatment or the like, and deformability such as elongation may be controlled.

The surface of the substrate layer 21 may be subjected to a surface treatment in order to increase the adhesion to the pressure-sensitive adhesive layer 22. As the surface treatment, for example, a chemical method such as chromic acid treatment, ozone exposure, flame exposure, high-pressure electric shock exposure, ionizing radiation treatment, or an oxidation treatment by a physical method may be employed. Further, coating treatment with a coating agent such as an anchor coating agent, a primer, or an adhesive may be performed.

On the back side of the base layer 21 (the side where the adhesive layer 22 does not overlap), in order to impart releasability, a coating treatment is performed with, for example, a release agent (release agent) such as a silicone resin or a fluorine resin. You may have it.

The base material layer 21 is preferably a light-transmitting (ultraviolet ray transmissive) resin film or the like from the viewpoint of being able to provide active energy rays such as ultraviolet rays to the pressure-sensitive adhesive layer 22 from the back side.

The dicing tape 20 of this embodiment is provided with a release sheet covering one side of the pressure-sensitive adhesive layer 22 (the side where the pressure-sensitive adhesive layer 22 does not overlap the base layer 21) in a state before being used. You can do it. When the die-bonding layer 10 with an area smaller than the pressure-sensitive adhesive layer 22 is disposed so as to enter the pressure-sensitive adhesive layer 22, the release sheet covers both the pressure-sensitive adhesive layer 22 and the die-bonding layer 10. Are arranged to be The release sheet is used in order to protect the pressure-sensitive adhesive layer 22, and is peeled before attaching the die-bonding layer 10 to the pressure-sensitive adhesive layer 22.

As the release sheet, for example, a plastic film or paper, which has been surface-treated with a release agent such as silicone-based, long-chain alkyl-based, fluorine-based, or molybdenum sulfide, can be used.

In addition, as a release sheet, for example, polytetrafluoroethylene, polychlorotrifluoroethylene, polyvinyl fluoride, polyvinylidene fluoride, tetrafluoroethylene/hexafluoropropylene copolymer, chlorofluoroethylene/vinyl fluoride Films made of fluorine-based polymers such as a leadene copolymer; Films made of polyolefins such as polyethylene and polypropylene; Polyester films, such as polyethylene terephthalate (PET), can be used.

In addition, as the release sheet, for example, a plastic film or paper, which has been surface-coated with a release agent such as a fluorine-based release agent or a long-chain alkyl acrylate-based release agent, can be used.

In addition, the release sheet can be used as a support material for supporting the pressure-sensitive adhesive layer 22. In particular, the release sheet is suitably used when the pressure-sensitive adhesive layer 22 is overlaid on the base layer 21. Specifically, in a state in which the release sheet and the pressure-sensitive adhesive layer 22 are stacked, the pressure-sensitive adhesive layer 22 is overlaid on the base layer 21, and then the release sheet is peeled off (transferred). The pressure-sensitive adhesive layer 22 may be overlaid.

Next, the dicing die-bonding film 1 of the present embodiment will be described in detail.

The dicing die-bonding film 1 of the present embodiment includes the above-described dicing tape 20 and the die-bonding layer 10 laminated on the pressure-sensitive adhesive layer 22 of the dicing tape 20. The die bond layer 10 is adhered to a semiconductor wafer in the manufacture of a semiconductor integrated circuit.

The die bonding layer 10 may contain at least one of a thermosetting resin and a thermoplastic resin. It is preferable that the die bonding layer 10 contains a thermosetting resin and a thermoplastic resin.

As a thermosetting resin, an epoxy resin, a phenol resin, an amino resin, an unsaturated polyester resin, a polyurethane resin, a silicone resin, a thermosetting polyimide resin, etc. are mentioned, for example. As the thermosetting resin, only one type or two or more types are employed. Epoxy resin is preferable as the thermosetting resin from the viewpoint of containing less ionic impurities and the like that may cause corrosion of the semiconductor chip to be die-bonded. A phenol resin is preferable as a curing agent for the epoxy resin.

Examples of the epoxy resin include bisphenol A type, bisphenol F type, bisphenol S type, brominated bisphenol A type, hydrogenated bisphenol A type, bisphenol AF type, biphenyl type, naphthalene type, fluorene type, phenol novolak type , Orthocresol novolak type, trishydroxyphenylmethane type, tetraphenylolethane type, hydantoin type, trisglycidyl isocyanurate type, or glycidylamine type epoxy resin.

As the epoxy resin, a bisphenol A type epoxy resin is preferred from the viewpoint of rich reactivity with a phenol resin as a curing agent and excellent heat resistance.

The phenol resin can function as a curing agent for an epoxy resin. As a phenol resin, polyoxystyrene, such as a novolak type phenol resin, a resol type phenol resin, and polyparaoxystyrene, etc. are mentioned, for example.

As a novolak type phenol resin, a phenol novolak resin, a phenol aralkyl resin, a cresol novolak resin, a tert-butylphenol novolak resin, a nonylphenol novolak resin, etc. are mentioned, for example.

As the phenol resin, a phenol novolak resin is preferable, and a biphenyl novolak resin is more preferable. When these phenolic resins act as a curing agent for an epoxy resin (die bonding adhesive), the adhesiveness of the epoxy resin as an adhesive can be further improved.

As the phenol resin, only one type or two or more types are employed.

In the die-bonding layer 10, the hydroxyl group of the phenol resin is per 1 equivalent of the epoxy group of the epoxy resin, preferably 0.5 equivalents or more and 2.0 equivalents or less, and more preferably 0.7 equivalents or more and 1.5 equivalents or less. Thereby, the curing reaction of the epoxy resin and the phenol resin can be sufficiently advanced.

When the die bonding layer 10 contains a thermosetting resin, the content ratio of the thermosetting resin in the die bonding layer 10 is 5% by mass or more and 60% by mass with respect to the total mass of the die bonding layer 10 The following are preferable, and 10 mass% or more and 50 mass% or less are more preferable. Thereby, in the die-bonding layer 10, the function as a thermosetting adhesive can be appropriately expressed.

As a thermoplastic resin that can be included in the die bonding layer 10, for example, natural rubber, butyl rubber, isoprene rubber, chloroprene rubber, ethylene-vinyl acetate copolymer, ethylene-acrylic acid copolymer, ethylene-acrylic acid ester copolymer, poly Butadiene resin, polycarbonate resin, thermoplastic polyimide resin, polyamide resin such as 6-nylon (product name) or 6, 6-nylon (product name), phenoxy resin, acrylic resin, saturated polyester such as PET or PBT Resin, polyamide-imide resin, fluororesin, and the like.

As the thermoplastic resin, since there are few ionic impurities and high heat resistance, the adhesiveness of the die-bonding layer 10 can be more secured, and an acrylic resin is preferable.

As the thermoplastic resin, only one type or two or more types are employed.

It is preferable that the said acrylic resin is a polymer in which the structural unit of an alkyl (meth)acrylate is the largest among structural units in a molecule|numerator by mass ratio. As said alkyl (meth)acrylate, a C2-C4 alkyl (meth)acrylate is mentioned, for example.

The acrylic resin may contain a structural unit derived from another monomer component copolymerizable with an alkyl (meth)acrylate monomer.

Examples of the other monomer component include a carboxyl group-containing monomer, an acid anhydride monomer, a hydroxy group-containing monomer, a glycidyl group-containing monomer, a sulfonic acid group-containing monomer, a phosphoric acid group-containing monomer, acrylamide, acrylonitrile, or other functional group-containing monomer, And various other polyfunctional monomers.

The acrylic resin is preferably an alkyl (meth) acrylate (particularly, an alkyl (meth) acrylate having 4 or less carbon atoms in the alkyl moiety), in that it can exhibit a higher cohesive force in the die-bonding layer 10. And, a carboxyl group-containing monomer, a nitrogen atom-containing monomer, and a polyfunctional monomer (especially a polyglycidyl polyfunctional monomer), and more preferably ethyl acrylate, butyl acrylate, acrylic acid, and acrylonitrile. And, it is a copolymer of polyglycidyl (meth)acrylate.

The glass transition temperature (Tg) of the acrylic resin is preferably 5° C. or more and 35° C. or less, and 10° C. or more and 30° C. or less, since it is easy to set the elasticity and viscosity of the die-bonding layer 10 within a desired range. More preferable.

When the die-bonding layer 10 contains a thermosetting resin and a thermoplastic resin, the content ratio of the thermoplastic resin in the die-bonding layer 10 is an organic component excluding a filler (for example, a thermosetting resin, a thermoplastic resin, With respect to the total mass of a silane coupling agent, dye), such as a curing catalyst, Preferably it is 30 mass% or more and 70 mass% or less, More preferably, it is 40 mass% or more and 60 mass% or less, More preferably 45 mass% It is more than 55 mass %. Further, by changing the content ratio of the thermosetting resin, the elasticity and viscosity of the die-bonding layer 10 can be adjusted.

When the thermoplastic resin of the die bonding layer 10 has a thermosetting functional group, as the thermoplastic resin, for example, an acrylic resin containing a thermosetting functional group can be employed. This thermosetting functional group-containing acrylic resin preferably contains the structural unit derived from an alkyl (meth)acrylate in the molecule in the largest mass ratio. As said alkyl (meth)acrylate, the (meth)alkyl (meth)acrylate illustrated above is mentioned, for example.

On the other hand, as a thermosetting functional group in the thermosetting functional group-containing acrylic resin, a glycidyl group, a carboxyl group, a hydroxy group, an isocyanate group, etc. are mentioned, for example. Among them, a glycidyl group is preferable. In other words, as the thermosetting functional group-containing acrylic resin, a glycidyl group-containing acrylic resin is preferable.

It is preferable that the die-bonding layer 10 contains a thermosetting functional group-containing acrylic resin and a curing agent. Examples of the curing agent include those exemplified as curing agents that can be included in the pressure-sensitive adhesive layer 22. When the thermosetting functional group in the thermosetting functional group-containing acrylic resin is a glycidyl group, it is preferable to use a compound having a plurality of phenol structures as a curing agent. For example, various phenol resins described above can be used as a curing agent.

The die bonding layer 10 preferably contains a filler. By changing the amount of the filler in the die-bonding layer 10, the elasticity and viscosity of the die-bonding layer 10 can be adjusted more easily. In addition, physical properties such as conductivity, thermal conductivity, and elastic modulus of the die-bonding layer 10 can be adjusted.

Examples of the filler include inorganic fillers and organic fillers. As a filler, an inorganic filler is preferable.

Examples of the inorganic filler include silica such as aluminum hydroxide, magnesium hydroxide, calcium carbonate, magnesium carbonate, calcium silicate, magnesium silicate, calcium oxide, magnesium oxide, aluminum oxide, aluminum nitride, boron nitride, crystalline silica or amorphous silica. The filler to contain is mentioned. Further, examples of the material of the inorganic filler include metal elements such as aluminum, gold, silver, copper, nickel, and alloys. A filler, such as aluminum borate whisker, amorphous carbon black, and graphite, may be sufficient. The shape of the filler may be various shapes such as a spherical shape, a needle shape, and a flake shape. As the filler, only one of the above or two or more types is employed.

The average particle diameter of the filler is preferably 0.005 µm or more and 10 µm or less, and more preferably 0.005 µm or more and 1 µm or less. When the average particle diameter is 0.005 µm or more, the wettability and adhesion to an adherend such as a semiconductor wafer are further improved. When the said average particle diameter is 10 micrometers or less, the characteristic by the added filler can be demonstrated more fully, and the heat resistance of the die bonding layer 10 can be demonstrated more. The average particle diameter of the filler can be obtained using, for example, a photometric particle size distribution meter (for example, the product name "LA-910", manufactured by Horiba Seisakusho).

When the die-bonding layer 10 contains a filler, the content ratio of the filler is preferably 30% by mass or more and 70% by mass or less, more preferably 40% by mass with respect to the total mass of the die-bonding layer 10. It is mass% or more and 60 mass% or less, More preferably, it is 42 mass% or more and 55 mass% or less.

The die-bonding layer 10 may contain other components as necessary. As said other component, a curing catalyst, a flame retardant, a silane coupling agent, an ion trap agent, a dye, etc. are mentioned, for example.

As a flame retardant, antimony trioxide, antimony pentoxide, a brominated epoxy resin, etc. are mentioned, for example.

Examples of the silane coupling agent include β-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, γ-glycidoxypropyltrimethoxysilane, and γ-glycidoxypropylmethyldiethoxysilane. have.

As an ion trapping agent, hydrotalcite, bismuth hydroxide, benzotriazole, etc. are mentioned, for example.

As said other additive, only 1 type or 2 or more types are employed.

The die-bonding layer 10 preferably contains a thermoplastic resin (particularly, an acrylic resin), a thermosetting resin, and a filler from the viewpoint of easy adjustment of elasticity and viscosity.

In the die-bonding layer 10, the content ratio of the thermoplastic resin such as acrylic resin to the total mass of the organic components excluding the filler is preferably 30% by mass or more and 70% by mass or less, and 40% by mass or more and 60% by mass It is more preferable that it is below, and it is still more preferable that it is 45 mass% or more and 55 mass% or less.

With respect to the total mass of the die-bonding layer 10, the content ratio of the filler is preferably 30% by mass or more and 70% by mass or less, more preferably 40% by mass or more and 60% by mass or less, and 42% by mass or more and 55% by mass It is more preferable that it is the following.

The thickness of the die bonding layer 10 is not particularly limited, but is, for example, 1 µm or more and 200 µm or less. The upper limit of this thickness is preferably 100 µm, more preferably 80 µm. The lower limit of the thickness is preferably 3 µm, more preferably 5 µm. In addition, when the die-bonding layer 10 is a laminated body, the thickness is the total thickness of the laminated body.

The glass transition temperature (Tg) of the die bonding layer 10 is preferably 0°C or higher, and more preferably 10°C or higher. When the glass transition temperature is 0° C. or higher, the die bond layer 10 can be easily cleaved by cool expansion. The upper limit of the glass transition temperature of the die bonding layer 10 is, for example, 100°C.

The die-bonding layer 10 may have a single layer structure, for example, as shown in FIG. 1. In this specification, a single layer has only a layer formed of the same composition. The form in which multiple layers formed of the same composition are stacked is also a single layer.

Meanwhile, the die bonding layer 10 may have a multilayer structure in which layers each formed of two or more different compositions are stacked, for example.

In the dicing die-bonding film 1 of this embodiment, when used, the pressure-sensitive adhesive layer 22 is cured by, for example, irradiation with ultraviolet rays. Specifically, in a state in which the die bond layer 10 to which the semiconductor wafer is adhered to one side and the pressure-sensitive adhesive layer 22 bonded to the other side of the die bond layer 10 are stacked, ultraviolet rays or the like are at least The layer 22 is irradiated. For example, an ultraviolet ray or the like is irradiated from the side on which the base layer 21 is disposed, and the ultraviolet ray or the like that has passed through the base layer 21 reaches the pressure-sensitive adhesive layer 22. The pressure-sensitive adhesive layer 22 is cured by irradiation such as ultraviolet rays.

Since the adhesive strength of the pressure-sensitive adhesive layer 22 can be reduced by curing the pressure-sensitive adhesive layer 22 after irradiation, the die-bonding layer 10 (a state in which the semiconductor wafer is adhered) from the pressure-sensitive adhesive layer 22 after irradiation is relatively easy. Can be peeled off. Thereby, good pickup property can be exhibited.

The amount of irradiation energy of active energy rays (such as ultraviolet rays) is at least 50 mJ/cm 2 or more. The amount of irradiation energy is, for example, 50 mJ/cm 2 or more and 500 mJ/cm 2 or less, and preferably 100 mJ/cm 2 or more and 300 mJ/cm 2 or less. Usually, the active energy ray is irradiated except for the peripheral part of the area|region where the adhesive layer 22 and the die-bonding layer 10 are bonded. In the case of partial irradiation, an unirradiated area can be provided by irradiating through a photomask having a pattern formed thereon. Further, it is possible to form an irradiation area by irradiating in a spot manner.

Although the device for irradiating ultraviolet rays is not particularly limited, for example, the product name "UM810" manufactured by Nitto Seiki can be used.

Before irradiation of active energy rays, the peel strength α between the pressure-sensitive adhesive layer 22 and the die-bonding layer 10 is preferably 0.4 (N/20 mm) or more and 4.0 (N/20 mm) or less.

On the other hand, after irradiation of active energy rays, the peel strength (β) between the pressure-sensitive adhesive layer 22 and the die-bonding layer 10 is preferably 0.1 (N/20 mm) or less. Such peeling strength (β) may be 0.03 (N/20 mm) or more.

It is preferable that the ratio (α/β) of the peel strength between the pressure-sensitive adhesive layer 22 and the die-bonding layer 10 before (α) and after (β) irradiation of active energy rays is 4.0 or more and 40.5 or less. Do.

In addition, irradiation of the active energy ray is performed under the conditions described in Examples. In addition, the numerical value related to the peel strength is measured according to the test conditions described in Examples.

In the dicing die-bonding film 1, the maximum strength when the peel strength between the pressure-sensitive adhesive layer 22 and the die-bonding layer 10 is measured by an edge peel test after irradiation with an active energy ray is 0.10 (N /10 mm) or more and 0.50 (N/10 mm) or less.

In addition, the numerical value regarding the maximum strength of the edge peel test is measured according to the test conditions described in Examples.

The peel strength (α or β) and the maximum strength can be increased, for example, by reducing the amount of fillers included in the die bonding layer 10.

The dicing die-bonding film 1 of this embodiment covers one side of the die-bonding layer 10 (the side where the die-bonding layer 10 does not overlap the pressure-sensitive adhesive layer 22) in a state before being used. You may provide a release sheet. The release sheet is used to protect the die-bonding layer 10, and is peeled immediately before affixing an adherend (eg, a semiconductor wafer) to the die-bonding layer 10.

As this release sheet, the same thing as the release sheet mentioned above can be adopted. This release sheet can be used as a support material for supporting the die bonding layer 10. The release sheet is suitably used when overlapping the die-bonding layer 10 on the pressure-sensitive adhesive layer 22. Specifically, the die-bonding layer 10 is overlaid on the pressure-sensitive adhesive layer 22 in a state in which the release sheet and the die-bonding layer 10 are stacked, and then the release sheet is peeled (transferred) to the pressure-sensitive adhesive layer 22. ) On the die bond layer 10 may be overlapped.

Since the dicing die-bonding film 1 of the present embodiment is configured as described above, it can exhibit good pick-up properties.

Next, the dicing tape 20 of this embodiment and the manufacturing method of the dicing die-bonding film 1 are demonstrated.

The manufacturing method of the dicing die-bonding film 1 of this embodiment,

The process of manufacturing the dicing tape 20 (the manufacturing method of the dicing tape) and the process of manufacturing the dicing die-bonding film 1 by overlapping the die bonding layer 10 on the manufactured dicing tape 20 Equipped.

The manufacturing method (process of manufacturing a dicing tape) of a dicing tape,

Synthesis process of synthesizing acrylic polymer,

A pressure-sensitive adhesive layer production step of producing the pressure-sensitive adhesive layer 22 by volatilizing a solvent from the pressure-sensitive adhesive composition containing the above-described acrylic polymer, an isocyanate compound, a polymerization initiator, a solvent, and other components appropriately added according to the purpose;

A lamination step of laminating the substrate layer 21 and the pressure-sensitive adhesive layer 22 is provided by bonding the pressure-sensitive adhesive layer 22 and the substrate layer 21.

In the synthesis process, an acrylic polymer intermediate is synthesized by radical polymerization of a C9 to C11 alkyl (meth)acrylate monomer and a hydroxyl group-containing (meth)acrylate monomer.

Radical polymerization can be carried out by a general method. For example, the acrylic polymer intermediate can be synthesized by dissolving each of the above monomers in a solvent, stirring while heating, and adding a polymerization initiator. In order to adjust the molecular weight of the acrylic polymer, polymerization may be performed in the presence of a chain transfer agent.

Next, the hydroxyl group of a part of the structural unit of the hydroxyl group-containing (meth)acrylate contained in the acrylic polymer intermediate and the isocyanate group of the isocyanate group-containing polymerizable monomer are bonded to each other by a urethanization reaction. Thereby, some of the structural units of the hydroxyl group-containing (meth)acrylate become the structural units of the polymerizable group-containing (meth)acrylate.

The urethanization reaction can be carried out by a general method. For example, in the presence of a solvent and a urethanization catalyst, the acrylic polymer intermediate and the isocyanate group-containing polymerizable monomer are stirred while heating. Thereby, it is possible to urethane bond the isocyanate group of the isocyanate group-containing polymerizable monomer to a part of the hydroxyl groups of the acrylic polymer intermediate.

Further, in order to efficiently advance the urethanization reaction, a urethanization reaction may be performed in the presence of a Sn catalyst or the like.

In the pressure-sensitive adhesive layer production process, for example, an acrylic polymer, an isocyanate compound, and a polymerization initiator are dissolved in a solvent to prepare a pressure-sensitive adhesive composition. By varying the amount of solvent, the viscosity of the composition can be adjusted. Next, the pressure-sensitive adhesive composition is applied to the release sheet. As the coating method, for example, a general coating method such as roll coating, screen coating, and gravure coating is adopted. By subjecting the applied composition to a solvent removal treatment, a solidification treatment, or the like, the applied pressure-sensitive adhesive composition is solidified to produce the pressure-sensitive adhesive layer 22.

The solvent removal treatment is performed under conditions of, for example, 80°C or more and 150°C or less and 0.5 minutes or more and 5 minutes or less.

In the lamination process, the pressure-sensitive adhesive layer 22 and the base material layer 21 in the state of being superposed on the release sheet are stacked and laminated. Further, the release sheet may be in a state of being overlaid on the pressure-sensitive adhesive layer 22 before use.

In addition, in order to accelerate the reaction between the crosslinking agent and the acrylic polymer, and in order to accelerate the reaction between the crosslinking agent and the surface portion of the substrate layer 21, after the lamination process, an aging treatment process for 48 hours in an environment at 50°C may be performed. do.

In addition, the base material layer 21 may use a commercially available film or the like, or may be formed by forming a film by a general method. As a method of forming a film, a calender film forming method, a casting method in an organic solvent, an inflation extrusion method in a closed system, a T-die extrusion method, a coextrusion method, a dry lamination method, and the like can be mentioned.

The dicing tape 20 can be manufactured by these processes.

The manufacturing method (process of manufacturing a dicing die bonding film) of a dicing die-bonding film,

A resin composition preparation step of preparing a resin composition for forming the die-bonding layer 10, and

A die-bonding layer production process for producing the die-bonding layer 10 from the resin composition,

An attaching step of attaching the die bonding layer 10 to the pressure-sensitive adhesive layer 22 of the dicing tape 20 manufactured as described above is provided.

In the resin composition preparation step, for example, an epoxy resin, a curing catalyst of an epoxy resin, an acrylic resin, a phenol resin, a solvent, and the like are mixed, and each resin is dissolved in a solvent to prepare a resin composition. By varying the amount of solvent, the viscosity of the composition can be adjusted. In addition, as these resins, commercially available products can be used.

In the die-bonding layer production process, for example, the resin composition prepared as described above is applied to a release sheet. The coating method is not particularly limited, and for example, a general coating method such as roll coating, screen coating, and gravure coating is employed. Subsequently, if necessary, the applied composition is solidified by a solvent removal treatment, a curing treatment, or the like, and the die bonding layer 10 is produced.

The solvent removal treatment is performed under conditions of, for example, 70°C or more and 160°C or less and 1 minute or more and 5 minutes or less.

In the affixing process, the peeling sheet is peeled from the pressure-sensitive adhesive layer 22 and the die-bonding layer 10 of the dicing tape 20, respectively, so that the die-bonding layer 10 and the pressure-sensitive adhesive layer 22 directly contact each other. Join. For example, it can be bonded by pressing. The temperature at the time of bonding is not particularly limited, and is, for example, 30°C or more and 50°C or less, and preferably 35°C or more and 45°C or less. The line pressure at the time of bonding is not particularly limited, but is preferably 0.1 kgf/cm or more and 20 kgf/cm or less, and more preferably 1 kgf/cm or more and 10 kgf/cm or less.

The dicing die-bonding film 1 manufactured as described above is used, for example, as an auxiliary tool for manufacturing a semiconductor integrated circuit. Hereinafter, specific examples in use will be described.

A method of manufacturing a semiconductor integrated circuit generally includes a step of cutting out a chip from a semiconductor wafer on which a circuit surface is formed and performing assembly.

This process includes, for example, a half-cut process in which grooves are formed in a semiconductor wafer to process a semiconductor wafer into chips (die) by a cutting process, and the semiconductor wafer is ground to reduce the thickness, and a half-cut processed semiconductor wafer A mounting process of fixing the semiconductor wafer to the dicing tape 20 by affixing one side (for example, the side opposite to the circuit side) to the die bonding layer 10, and the half-cut processed semiconductor chips An expanding process to increase the gap, a pick-up process in which a semiconductor chip (die) is taken out while the die bond layer 10 is affixed by peeling between the die bond layer 10 and the pressure-sensitive adhesive layer 22, and a die bond layer (10) It further has a die bonding process of adhering the semiconductor chip (die) in the affixed state to the adherend. When performing these processes, the dicing tape (dicing die-bonding film) of this embodiment is used as a manufacturing auxiliary tool.

In the half-cut process, as shown in Figs. 2A to 2D, half-cut processing is performed to cut the semiconductor integrated circuit into small pieces (die). Specifically, the wafer processing tape T is affixed to the surface of the semiconductor wafer on the opposite side to the circuit surface. Further, a dicing ring R is provided on the wafer processing tape T. In the state where the wafer processing tape T is affixed, a dividing groove is formed. While the backgrind tape G is affixed to the grooved surface, the wafer processing tape T that was first affixed is peeled off. With the backgrind tape G affixed, grinding is performed until the semiconductor wafer has a predetermined thickness.

In the mounting process, as shown in Figs. 3A to 3B, after installing the dicing ring R on the pressure-sensitive adhesive layer 22 of the dicing tape 20, the surface of the exposed die-bonding layer 10 is The cut-processed semiconductor wafer is affixed. After that, the backgrind tape G is peeled from the semiconductor wafer.

In the expand process, as shown in Figs. 4A to 4C, the dicing ring R is fixed to the holder H of the expander. The dicing die-bonding film 1 is stretched so as to expand in the plane direction by pushing up the pushing member U provided in the expander from the lower side of the dicing die-bonding film 1. Thereby, under a specific temperature condition, a half-cut-processed semiconductor wafer is cut. The temperature conditions are, for example, -20 to 5°C, preferably -15 to 0°C, and more preferably -10 to -5°C. The expanded state is released by lowering the pushing member U. In addition, in the expand process, as shown in Figs. 5A to 5B, under a higher temperature condition, the dicing tape 20 is stretched to increase the area. Thereby, the divided adjacent semiconductor chips are separated in the plane direction of the film surface, and the gap is further widened.

In the pick-up process, as shown in FIG. 6, the semiconductor chip in a state in which the die bonding layer 10 is affixed is peeled from the adhesive layer of the dicing tape 20. Specifically, the pin member P is raised, and the semiconductor chip to be picked up is pushed up through the dicing tape 20. The pushed-up semiconductor chip is held by the suction jig J.

In the die bonding process, the semiconductor chip in the state in which the die bonding layer 10 is affixed is adhered to the adherend.

Matters disclosed by this specification include the following.

(One)

It is a dicing tape provided with a base material layer and an adhesive layer superimposed on the base material layer,

The pressure-sensitive adhesive layer contains an acrylic polymer,

The acrylic polymer includes a constitutional unit of C9 to C11 alkyl (meth)acrylate and a constitutional unit of a hydroxyl group-containing (meth)acrylate,

The dicing tape, wherein the acrylic polymer contains 40 mol% or more and 85 mol% or less of the constitutional unit of the C9 to C11 alkyl (meth)acrylate.

(2)

The dicing tape according to (1), wherein the acrylic polymer contains 1 mol% or more and 30 mol% or less of the structural unit of the hydroxyl group-containing (meth)acrylate.

(3)

The dicing tape according to (2) above, wherein the structural unit of the hydroxyl group-containing (meth)acrylate is a structural unit of a hydroxyl group-containing C2 to C4 alkyl (meth)acrylate.

(4)

The structural unit of the C9 to C11 alkyl (meth)acrylate is at least one of a structural unit of nonyl (meth)acrylate and a structural unit of decyl acrylate, described in any one of (1) to (3) above. Dicing tape.

(5)

In the acrylic polymer, the structural unit (B) of the hydroxyl group-containing (meth)acrylate, in a molar ratio (B/A), of 0.01 or more with respect to the structural unit (A) of the C9 to C11 alkyl (meth)acrylate. The dicing tape according to any one of (1) to (4), containing 0.80 or less.

(6)

The dicing tape according to any one of (1) to (5), wherein the acrylic polymer further has a structural unit of a polymerizable group-containing (meth)acrylate.

(7)

The structural unit of the polymerizable group-containing (meth)acrylate has a molecular structure in which the isocyanate group of the isocyanate group-containing (meth)acrylate monomer is urethane-bonded to the hydroxyl group in the structural unit of the hydroxyl group-containing (meth)acrylate, The dicing tape according to (6) above.

(8)

The above (6) or (7), wherein the acrylic polymer contains 15 mol% or more and 60 mol% or less of the structural unit of the hydroxyl group-containing (meth)acrylate and the polymerizable group-containing (meth)acrylate in a molecule. The dicing tape described in.

(9)

The dicing tape according to any one of (6) to (8), wherein the acrylic polymer contains 7.0 mol% or more and 60 mol% or less of the structural unit of the polymerizable group-containing (meth)acrylate in its molecule.

(10)

In the acrylic polymer, the constituent unit (C) of the polymerizable group-containing (meth)acrylate with respect to the constitutional unit (A) of the C9 to C11 alkyl (meth)acrylate, in a molar ratio (C/A), of 0.08 The dicing tape according to any one of (6) to (9), containing more than or equal to 1.40.

(11)

In the acrylic polymer, the constituent unit (C) of the polymerizable group-containing (meth)acrylate with respect to the structural unit (B) of the hydroxyl group-containing (meth)acrylate, in a molar ratio (C/B), of 0.9 or more and 18.0 The dicing tape according to any one of (6) to (10), which is included below.

(12)

The acrylic polymer is composed of the C9 to C11 alkyl (meth)acrylate with respect to the structural unit (B) of the hydroxyl group-containing (meth)acrylate and the structural unit (C) of the polymerizable group-containing (meth)acrylate The dicing tape according to any one of the above (6) to (11), wherein the unit (A) is contained in a molar ratio [A/(B+C)] of 0.5 or more and 6.0 or less.

(13)

The acrylic polymer is a structural unit of the polymerizable group-containing (meth)acrylate with respect to the structural unit (B) of the hydroxyl group-containing (meth)acrylate and the structural unit (C) of the polymerizable group-containing (meth)acrylate The dicing tape according to any one of (6) to (12), containing (C) in a molar ratio [C/(B+C)] of 0.50 or more and 0.95 or less.

(14)

The dicing tape according to any one of (1) to (13), wherein the pressure-sensitive adhesive layer contains the acrylic polymer, an isocyanate compound, and a polymerization initiator.

(15)

A dicing die-bonding film comprising the dicing tape according to any one of the above (1) to (14), and a die bonding layer laminated on the pressure-sensitive adhesive layer of the dicing tape.

(16)

The dicing die-bonding film according to (15), wherein the die-bonding layer contains at least one of a thermosetting resin and a thermoplastic resin, and a filler.

The dicing tape and dicing die-bonding film of the present embodiment are as exemplified above, but the present invention is not limited to the dicing tape and dicing die-bonding film exemplified above.

That is, various forms used in general dicing tapes and dicing die-bonding films can be adopted within a range that does not impair the effects of the present invention.

Example

Next, the present invention will be described in more detail by experimental examples, but the present invention is not limited thereto.

A dicing tape was manufactured in the following manner. Further, a dicing die bonding film was produced using this dicing tape.

<raw material of acrylic polymer>

"First synthesis step"

C9 to C11 alkyl (meth)acrylate: isodecylacrylate (IDA)

C9 to C11 alkyl (meth)acrylate: isononyl acrylate (INA)

Hydroxyl-containing (meth)acrylate: 2-hydroxyethyl acrylate (HEA)

Hydroxyl-containing (meth)acrylate: 4-hydroxybutyl acrylate (4HBA)

Polymerization initiator: azobisisobutyronitrile (AIBN)

Polymerization solvent: ethyl acetate

"Second synthesis step": Preparation of constituent units of polymerizable group-containing (meth)acrylate

-Isocyanate group-containing (meth)acrylate monomer: 2-isocyanatoethyl methacrylate (product name "Carenz MOI" manufactured by Showa Denko)

Urethane reaction catalyst: dibutyl tin dilaurate

<Material for dicing tape>

·Adhesive layer

Acrylic polymers (each synthesized)

Isocyanate compounds

Ethyl acetate solution of trimethylolpropane adduct of tolylene diisocyanate

(Product name "Coronate L" manufactured by Tosoh Corporation)

Photopolymerization initiator (product name "Omnirad 127" made by IGM Resins)

·Base layer

EVA film (corona treatment after film formation)

Product name "Evaflex V1010" resin (manufactured by Mitsui DuPont Chemical) was formed into a 125㎛ thick film and subjected to corona treatment on the surface in contact with the adhesive layer

・Organic solvent (used when making an adhesive layer)

Ethyl acetate

(Example 1)

After the acrylic polymer intermediate was synthesized in the following manner, an acrylic polymer was synthesized from the acrylic polymer intermediate. A pressure-sensitive adhesive layer was prepared using the synthesized acrylic polymer to prepare a dicing tape.

「First Synthesis Step: Synthesis of Acrylic Polymer Intermediate」

The raw materials were mixed in the amount (parts by mass) shown in Table 1 to prepare a mixture. A separable cover, a separating funnel, a thermometer, a nitrogen inlet tube, a Liebig cooler, a vacuum seal, a stir bar, a stirring blade, and a 1 L round bottom separable flask were equipped with the above mixture into an experimental apparatus for polymerization. While stirring, nitrogen substitution was performed at room temperature for 6 hours. Thereafter, while nitrogen was introduced and stirred, the temperature was kept at 62°C for 3 hours, and then maintained at 75°C for 2 hours. Thereby, a polymerization reaction was performed, and it cooled to room temperature, and the polymer solution (a solution containing the base polymer of each acrylic polymer) was obtained.

「2nd Synthesis Step: Synthesis of Each Acrylic Polymer」

To the obtained polymer solution (solution containing an acrylic polymer intermediate), as a polymerizable (meth)acrylate monomer, 2-isocyanatoethyl methacrylate (product name "Carenz MOI" manufactured by Showa Denko), and dibutyl dilaurate Tin IV (manufactured by Wako Junyaku Kogyo Co., Ltd.) was added in the amount shown in Table 1, and stirred at 50°C for 24 hours in an air atmosphere.

"Preparation of composition for adhesive layer"

An isocyanate compound [Coronate L] and a photoinitiator (Omnirad 127) in the amounts shown in Table 5 were mixed with respect to 100 parts by mass of the solid content of the acrylic polymer. Ethyl acetate as a diluting solvent was added, and the composition for an adhesive layer was prepared so that the content rate of solid content might become 20 mass %.

"Production of adhesive layer"

As a release sheet, a PET film (product name "Diafoil MRF38" manufactured by Mitsubishi Chemical Corporation) was prepared. One side of this film is subjected to a mold release treatment. The composition for a pressure-sensitive adhesive layer prepared as described above was applied to the surface of the release sheet subjected to the release treatment. The applied composition was dried on a release sheet at 120° C. for 3 minutes to prepare a pressure-sensitive adhesive layer having a thickness of 10 μm.

"Manufacture of dicing tape"

In the state where the pressure-sensitive adhesive layer and the release sheet overlapped, the pressure-sensitive adhesive layer was bonded to the corona-treated surface of the base layer (EVA film) so that no air bubbles would enter. It dried at 50 degreeC for 48 hours, and the dicing tape was manufactured.

<Production of dicing die bond film>

・Production of die bond layer

A die-bonding layer was prepared as follows using the following raw materials (the same ones were used in Examples and Comparative Examples)

Acrylic resin: 100 parts by mass

(Product name "Teisan Resin SG-P3", manufactured by Nagase Chemtex) Glass transition temperature 12°C containing epoxy group),

Epoxy resin: 46 parts by mass

(Product name "JER1001", manufactured by Mitsubishi Chemical Corporation) Bisphenol A type epoxy resin,

Phenolic resin: 51 parts by mass

(Product name "MEH-7851ss", manufactured by Meiwa Kasei) Biphenyl novolac resin,

Spherical silica: 191 parts by mass

(Product name ``SO-25R'', manufactured by Admatex),

Curing catalyst: 0.6 parts by mass

(Product name "Curesol 2PHZ", manufactured by Kasei Shikoku High School)

The above raw materials and methyl ethyl ketone were mixed to prepare a resin composition having a solid content concentration of 20% by mass. This resin composition was applied to one side of a release sheet (PET thickness of 50 µm). Further, the coated surface was previously subjected to silicone treatment. The solvent was volatilized by heating at 130° C. for 2 minutes, and a die-bonding layer having a thickness of 10 μm was prepared.

Bonding of die-bonding layer and dicing tape

The die-bonding layer in the state of being superposed on the release sheet and the pressure-sensitive adhesive layer after the release sheet of the dicing tape was peeled were bonded to each other so that air bubbles did not enter. The die-bonding layer was disposed at a position where the wafer was to be bonded, and had a diameter 5 mm larger than the wafer size. Bonding was performed using a laminator, and a dicing die-bonding film in a state in which the adhesive layer and the die-bonding layer bonded to each other were disposed between the base layer and the release sheet was produced.

In such a state, what was left for 24 hours under conditions of temperature 18 to 25°C, humidity 40 to 60%, and light-shielding was used as a test sample.

(Examples 2 to 15)

A dicing tape and a dicing die-bonding film were produced in the same manner as in Example 1 by the compounding composition shown in Tables 1 to 3 and Table 5.

(Comparative Examples 1 to 8)

Dicing tapes and dicing die-bonding films were produced in the same manner as in Example 1 by the blending compositions shown in Tables 4 and 5.

Formulation compositions for producing the dicing tapes and dicing die-bonding films of Examples and Comparative Examples are shown in Tables 1 to 5.

<Measurement of peel strength between die bond layer and adhesive layer before irradiation with active energy ray (ultraviolet)>

The portion where the die-bonding layer (DAF) and the pressure-sensitive adhesive layer were bonded was cut out to a size of 150 mm x 20 mm. The die bond layer after taking the release sheet was affixed to the SUS304BA plate using a hand roller. At this time, the SUS304BA plate was placed on a hot plate heated to 80°C. At the time of affixing, air bubbles were not allowed to enter between the die-bonding layer and the SUS plate.

After that, it was allowed to stand for 3 hours in an environment at a temperature of 23°C and a humidity of 50%, and the temperature was kept constant. Peel strength (strength when the die-bonding layer was peeled from the adhesive layer) was measured with a Tensilon type tensile tester (manufactured by Shimadzu Corporation, AGS-J). Peeling conditions were a peeling rate of 30 mm/min, a peeling angle of 90 degrees, a temperature of 23°C, and a humidity of 50%. The measurement was performed three times, and the average value was taken as the value of the peel strength.

<Measurement of peel strength between die bond layer and adhesive layer after irradiation with active energy ray (ultraviolet)>

In the same manner as described above, after allowing to stand for 3 hours in an environment at a temperature of 23°C and a humidity of 50%, UV was irradiated from the substrate layer side (the back side of the film) under the following "ultraviolet irradiation conditions". Further, it was allowed to stand for 3 hours in an environment at a temperature of 23°C and a humidity of 50%, and the temperature was kept constant.

Peel strength (strength when the die-bonding layer was peeled from the adhesive layer) was measured with a Tensilon type tensile tester (manufactured by Shimadzu Corporation, AGS-J). Peeling conditions were 100 mm/min of peeling rate, 90 degree|time of peeling angle, 23 degreeC of temperature, and 50% of humidity. The measurement was performed three times, and the average value was taken as the value of the peel strength.

<Measurement of the tensile modulus of the pressure-sensitive adhesive layer after irradiation with ultraviolet rays>

A pressure-sensitive adhesive layer (20 µm in thickness) was produced between a pair of PET release sheets. In the following "ultraviolet irradiation conditions", the pressure-sensitive adhesive layer was irradiated with ultraviolet rays. The pressure-sensitive adhesive layer after ultraviolet irradiation was cut to a size of 10 mm x 30 mm, and this was used as an evaluation sample.

Using a tensile tester (manufactured by ORIENTEC, product name "RTC-1150A"), the tensile modulus of the evaluation sample was measured. Specifically, under conditions of a measurement temperature of 22°C, a chuck distance of 10 mm, and a speed of 10 mm/min, the SS curve was measured, and the initial elastic modulus was obtained from the rise of the SS curve. This value was taken as the tensile modulus of the pressure-sensitive adhesive layer after UV irradiation. The measurement was performed 5 times, and the average value was taken as the tensile modulus of the pressure-sensitive adhesive layer after UV irradiation.

"Ultraviolet irradiation conditions"

Ultraviolet irradiation device: Product name-UM810 (manufactured by Nitto Seiki)

Light source: high pressure mercury lamp

Irradiation intensity: 50mW/cm2 (Measurement device: "Ultraviolet irradiance meter UT-101" manufactured by Ushio)

Irradiation time: 6 seconds

Accumulated light quantity: 300mJ/㎠

<Pickup test method>

A dicing tape (Erepmount DU-300 manufactured by Nitto Denko Corporation) and a dicing ring are bonded to a 12-inch bare wafer (740 μm in thickness), and a dicing saw device DFD6361 (manufactured by DISCO) is used to reduce the depth from the surface. Half-cut dicing was performed in a size of 10 mm x 10 mm so as to form a groove having a width of 100 µm and a width of 30 µm. After half-cut dicing, ultraviolet rays were irradiated from the back side of the dicing tape, and the wafer with grooves was recovered.

Thereafter, a backgrind tape (surface protection adhesive film Nitto Denko Erepmount UB-3083D) was bonded to the grooved wafer surface, and a grinder polisher DGP8760 (manufactured by DISCO) was used to obtain a thickness of 30 μm. By grinding, a thin wafer into small pieces was obtained.

A thin wafer and a dicing ring were bonded to a dicing die-bonding film, irradiated with ultraviolet rays from the back side of the backgrind tape to cure the adhesive, and the backgrind tape was peeled off from the wafer and removed. Subsequently, a cut sample was obtained by performing slicing of the wafer and the die-bonding layer and thermal contraction of the dicing tape using a die separator DDS2300 (manufactured by DISCO). Specifically, first, a semiconductor wafer was cut with a cool expander unit under conditions of an expand temperature: -15°C, an expand speed: 200 mm/sec, and an expand amount: 12 mm.

Then, under room temperature, room temperature expansion was performed under conditions of an expand speed of 1 mm/sec and an expand amount of 7 mm. Then, while maintaining the expanded state, the dicing tape in the outer peripheral portion of the semiconductor chip was heat-shrunk under conditions of a heat temperature of 200°C, an air volume of 40 L/min, a heat distance of 20 mm, and a rotation speed of 5°/sec.

Pickup was performed under the following conditions using die bonder SPA-300 (manufactured by Shinkawa). When the pickup success rate was 90% or more at a pickup height of 400 µm or less, evaluation was performed by setting it as ◯, and a case where the pickup success rate is less than 90% as x.

「Pick-up conditions」

Pin Count: 5

Pushing speed: 1mm/sec

Pickup height: 200 to 1000 μm

Pickup Ratings: 50

<Edge peel test (between die bond layer and adhesive layer)>

A dicing tape (Erepmount DU-300 manufactured by Nitto Denko Corporation) and a dicing ring are bonded to a 12-inch bare wafer (740 μm in thickness), and a dicing saw device DFD6361 (manufactured by DISCO) is used to reduce the depth from the surface. Half-cut dicing was performed in a size of 12 mm x 12 mm so as to form a groove having a width of 100 µm and a width of 30 µm.

Thereafter, a backgrind tape (surface protection adhesive film Nitto Denko Erepmount UB-3083D) was bonded to the grooved wafer surface, and a grinder polisher DGP8760 (manufactured by DISCO) was used to obtain a thickness of 30 μm. A thin wafer was obtained by grinding.

A thin wafer and a dicing ring were bonded to the dicing die-bonding film, irradiated with ultraviolet rays from the back side of the backgrind tape to cure the adhesive, and the backgrind tape was peeled off from the wafer and removed. Subsequently, a cut sample was obtained by performing slicing of the wafer and the die-bonding layer and thermal contraction of the dicing tape using a die separator DDS2300 (manufactured by DISCO). Specifically, first, a semiconductor wafer was cut with a cool expander unit under conditions of an expand temperature: -15°C, an expand speed: 200 mm/sec, and an expand amount: 12 mm.

Then, under room temperature, room temperature expansion was performed under conditions of an expand speed of 1 mm/sec and an expand amount of 7 mm. Then, while maintaining the expanded state, the dicing tape in the outer peripheral portion of the semiconductor chip was heat-shrunk under conditions of a heat temperature of 200°C, an air volume of 40 L/min, a heat distance of 20 mm, and a rotation speed of 5°/sec.

In the measurement, in order to use 5 consecutive chips (with die-bonding layer [DAF]), 12 chips (with DAF) adjacent to the consecutive 5 chips (with DAF) to be used at the time of measurement were taken as a dicing die-bonding film. Removed by hand from above. Then, the blade was put in the area from which the chips (with DAF) were removed with a cutter knife, and a dicing die-bonding film sample having 5 consecutive chips (with DAF) having a size of 22 mm x 70 mm was obtained.

A double-sided tape (product No. 5000NS manufactured by Nitto Denko Corporation) was affixed to the surface of the five consecutive chips (the surface without DAF). At this time, the affixing was performed from the 1st chip|tip to the 5th chip|tip of 5 consecutive chips with a width of 10 mm by a hand roller. In addition, the double-sided tape was made to fit within the chip surface area. That is, it was set as the situation where the double-sided tape adhered without protruding from the chip surface.

The separator attached to the double-sided tape was peeled off from the state where the double-sided tape was affixed to the five consecutive chips. Using a hand roller, the peeled surface was affixed to the SUS304BA plate. After that, ultraviolet rays were irradiated from the substrate layer side of the dicing die-bonding film. The irradiation conditions are the same as those described above.

After ultraviolet irradiation, the SUS plate, tape, and chip (with DAF) were left to stand for 3 hours in an environment at a temperature of 23°C and a humidity of 50%.

Peel strength (strength when the die-bonding layer was peeled from the adhesive layer) was measured with a Tensilon type tensile tester (manufactured by Shimadzu Corporation, AGS-J). Peeling conditions were 50 mm/min of peeling speed, 90 degree|time of peeling angle, 23 degreeC temperature, and 50% of humidity. The measurement was performed three times, and the average value of the maximum strength obtained at each measurement was taken as the measured value in the edge peel test.

The evaluation results are shown in Tables 6 to 9.

As understood from the above evaluation results, the dicing die-bonding film of the example exhibited better pick-up properties than the dicing die-bonding film of the comparative example.

The dicing tape and dicing die-bonding film of the present invention are suitably used, for example, as auxiliary tools when manufacturing a semiconductor integrated circuit.

1: dicing die bond film
10: die bond layer
20: dicing tape
21: base layer
22: adhesive layer

Claims (6)

It is a dicing tape provided with a base material layer and an adhesive layer superimposed on the base material layer,
The pressure-sensitive adhesive layer contains an acrylic polymer,
The acrylic polymer includes a structural unit of C9 to C11 alkyl (meth)acrylate and a structural unit of a hydroxyl group-containing (meth)acrylate,
The dicing tape, wherein the acrylic polymer contains 40 mol% or more and 85 mol% or less of the constitutional unit of the C9 to C11 alkyl (meth)acrylate. The method of claim 1,
The dicing tape, wherein the acrylic polymer contains 1 mol% or more and 30 mol% or less of the structural unit of the hydroxyl group-containing (meth)acrylate. The method of claim 2,
A dicing tape, wherein the structural unit of the hydroxyl group-containing (meth)acrylate is a structural unit of a hydroxyl group-containing C2 to C4 alkyl (meth)acrylate. The method according to any one of claims 1 to 3,
The dicing tape, wherein the acrylic polymer further has a structural unit of a polymerizable group-containing (meth)acrylate. The method of claim 4,
The acrylic polymer is a structural unit of the polymerizable group-containing (meth)acrylate with respect to the structural unit (B) of the hydroxyl group-containing (meth)acrylate and the structural unit (C) of the polymerizable group-containing (meth)acrylate A dicing tape containing (C) in a molar ratio [C/(B+C)] of 0.50 or more and 0.95 or less. A dicing die-bonding film comprising the dicing tape according to any one of claims 1 to 3, and a die bonding layer laminated on the pressure-sensitive adhesive layer of the dicing tape.

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